KR20250088420A - 전자 부품의 제조 방법 및 전자 부품 - Google Patents

전자 부품의 제조 방법 및 전자 부품 Download PDF

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Publication number
KR20250088420A
KR20250088420A KR1020247042489A KR20247042489A KR20250088420A KR 20250088420 A KR20250088420 A KR 20250088420A KR 1020247042489 A KR1020247042489 A KR 1020247042489A KR 20247042489 A KR20247042489 A KR 20247042489A KR 20250088420 A KR20250088420 A KR 20250088420A
Authority
KR
South Korea
Prior art keywords
curable composition
electronic component
electronic
composition layer
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247042489A
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English (en)
Korean (ko)
Inventor
요시후미 스기사와
다카시 와타나베
미츠루 다니카와
쇼 나가노
Original Assignee
세키스이가가쿠 고교가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 세키스이가가쿠 고교가부시키가이샤 filed Critical 세키스이가가쿠 고교가부시키가이샤
Publication of KR20250088420A publication Critical patent/KR20250088420A/ko
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/25—Constructional features of resonators using surface acoustic waves

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Acoustics & Sound (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
KR1020247042489A 2022-10-13 2023-10-12 전자 부품의 제조 방법 및 전자 부품 Pending KR20250088420A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022164725 2022-10-13
JPJP-P-2022-164725 2022-10-13
PCT/JP2023/037079 WO2024080335A1 (ja) 2022-10-13 2023-10-12 電子部品の製造方法、及び電子部品

Publications (1)

Publication Number Publication Date
KR20250088420A true KR20250088420A (ko) 2025-06-17

Family

ID=90669765

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247042489A Pending KR20250088420A (ko) 2022-10-13 2023-10-12 전자 부품의 제조 방법 및 전자 부품

Country Status (6)

Country Link
JP (1) JPWO2024080335A1 (enrdf_load_stackoverflow)
KR (1) KR20250088420A (enrdf_load_stackoverflow)
CN (1) CN119452470A (enrdf_load_stackoverflow)
MX (1) MX2025003192A (enrdf_load_stackoverflow)
TW (1) TW202437475A (enrdf_load_stackoverflow)
WO (1) WO2024080335A1 (enrdf_load_stackoverflow)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278971A (ja) 2009-06-01 2010-12-09 Murata Mfg Co Ltd 弾性波装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4179038B2 (ja) * 2002-06-03 2008-11-12 株式会社村田製作所 表面弾性波装置
EP2902455B1 (en) * 2012-09-27 2019-09-11 Sekisui Chemical Co., Ltd. Curable composition for inkjet, and method for producing electronic part
US10333493B2 (en) * 2016-08-25 2019-06-25 General Electric Company Embedded RF filter package structure and method of manufacturing thereof
TW202248379A (zh) * 2021-03-26 2022-12-16 日商積水化學工業股份有限公司 噴墨用接著劑、電子零件之製造方法及電子零件

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010278971A (ja) 2009-06-01 2010-12-09 Murata Mfg Co Ltd 弾性波装置

Also Published As

Publication number Publication date
CN119452470A (zh) 2025-02-14
TW202437475A (zh) 2024-09-16
WO2024080335A1 (ja) 2024-04-18
JPWO2024080335A1 (enrdf_load_stackoverflow) 2024-04-18
MX2025003192A (es) 2025-05-02

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20241223

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application