CN119452470A - 电子部件的制造方法和电子部件 - Google Patents
电子部件的制造方法和电子部件 Download PDFInfo
- Publication number
- CN119452470A CN119452470A CN202380053289.0A CN202380053289A CN119452470A CN 119452470 A CN119452470 A CN 119452470A CN 202380053289 A CN202380053289 A CN 202380053289A CN 119452470 A CN119452470 A CN 119452470A
- Authority
- CN
- China
- Prior art keywords
- electronic component
- curable composition
- adhesive portion
- composition layer
- compound
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Acoustics & Sound (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022164725 | 2022-10-13 | ||
| JP2022-164725 | 2022-10-13 | ||
| PCT/JP2023/037079 WO2024080335A1 (ja) | 2022-10-13 | 2023-10-12 | 電子部品の製造方法、及び電子部品 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN119452470A true CN119452470A (zh) | 2025-02-14 |
Family
ID=90669765
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380053289.0A Pending CN119452470A (zh) | 2022-10-13 | 2023-10-12 | 电子部件的制造方法和电子部件 |
Country Status (6)
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4179038B2 (ja) * | 2002-06-03 | 2008-11-12 | 株式会社村田製作所 | 表面弾性波装置 |
| JP2010278971A (ja) | 2009-06-01 | 2010-12-09 | Murata Mfg Co Ltd | 弾性波装置 |
| US10100218B2 (en) * | 2012-09-27 | 2018-10-16 | Sekisui Chemical Co., Ltd. | Curable composition for inkjet, and method for producing electronic part |
| US10333493B2 (en) * | 2016-08-25 | 2019-06-25 | General Electric Company | Embedded RF filter package structure and method of manufacturing thereof |
| MX2023009977A (es) * | 2021-03-26 | 2023-09-06 | Sekisui Chemical Co Ltd | Adhesivo de inyeccion de tinta, metodo para producir un componente electronico y componente electronico. |
-
2023
- 2023-10-12 JP JP2024551752A patent/JPWO2024080335A1/ja active Pending
- 2023-10-12 CN CN202380053289.0A patent/CN119452470A/zh active Pending
- 2023-10-12 WO PCT/JP2023/037079 patent/WO2024080335A1/ja active Application Filing
- 2023-10-12 KR KR1020247042489A patent/KR20250088420A/ko active Pending
- 2023-10-13 TW TW112139123A patent/TW202437475A/zh unknown
-
2025
- 2025-03-19 MX MX2025003192A patent/MX2025003192A/es unknown
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024080335A1 (enrdf_load_stackoverflow) | 2024-04-18 |
| WO2024080335A1 (ja) | 2024-04-18 |
| TW202437475A (zh) | 2024-09-16 |
| MX2025003192A (es) | 2025-05-02 |
| KR20250088420A (ko) | 2025-06-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |