KR20250079202A - 프로브 및 전기적 접속 장치 - Google Patents
프로브 및 전기적 접속 장치 Download PDFInfo
- Publication number
- KR20250079202A KR20250079202A KR1020257014537A KR20257014537A KR20250079202A KR 20250079202 A KR20250079202 A KR 20250079202A KR 1020257014537 A KR1020257014537 A KR 1020257014537A KR 20257014537 A KR20257014537 A KR 20257014537A KR 20250079202 A KR20250079202 A KR 20250079202A
- Authority
- KR
- South Korea
- Prior art keywords
- probe
- contact film
- guide plate
- contact
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2022-180871 | 2022-11-11 | ||
| JP2022180871A JP2024070404A (ja) | 2022-11-11 | 2022-11-11 | プローブおよび電気的接続装置 |
| PCT/JP2023/039278 WO2024101224A1 (ja) | 2022-11-11 | 2023-10-31 | プローブおよび電気的接続装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20250079202A true KR20250079202A (ko) | 2025-06-04 |
Family
ID=91032905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020257014537A Pending KR20250079202A (ko) | 2022-11-11 | 2023-10-31 | 프로브 및 전기적 접속 장치 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4617675A1 (https=) |
| JP (1) | JP2024070404A (https=) |
| KR (1) | KR20250079202A (https=) |
| CN (1) | CN120153265A (https=) |
| WO (1) | WO2024101224A1 (https=) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015118064A (ja) | 2013-12-20 | 2015-06-25 | 東京特殊電線株式会社 | コンタクトプローブユニット |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7462800B2 (en) * | 2004-12-03 | 2008-12-09 | Sv Probe Pte Ltd. | Method of shaping lithographically-produced probe elements |
| JP2009276145A (ja) * | 2008-05-13 | 2009-11-26 | Japan Electronic Materials Corp | プローブ |
| WO2014087906A1 (ja) * | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | 電気的接触子 |
| SG11201704433TA (en) * | 2014-12-30 | 2017-07-28 | Technoprobe Spa | Contact probe for testing head |
| CN116183986A (zh) * | 2014-12-30 | 2023-05-30 | 泰克诺探头公司 | 用于测试头的接触探针的制造方法 |
| CN107667295A (zh) * | 2014-12-30 | 2018-02-06 | 泰克诺探头公司 | 包括用于测试头的多个接触探针的半成品及相关制造方法 |
| IT201700021400A1 (it) * | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura a sonde verticali con migliorate proprietà in frequenza |
| JP7633766B2 (ja) * | 2019-11-11 | 2025-02-20 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP7658768B2 (ja) * | 2021-03-19 | 2025-04-08 | 株式会社日本マイクロニクス | 電気的接続装置 |
-
2022
- 2022-11-11 JP JP2022180871A patent/JP2024070404A/ja active Pending
-
2023
- 2023-10-31 KR KR1020257014537A patent/KR20250079202A/ko active Pending
- 2023-10-31 WO PCT/JP2023/039278 patent/WO2024101224A1/ja not_active Ceased
- 2023-10-31 EP EP23888572.7A patent/EP4617675A1/en active Pending
- 2023-10-31 CN CN202380077062.XA patent/CN120153265A/zh active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2015118064A (ja) | 2013-12-20 | 2015-06-25 | 東京特殊電線株式会社 | コンタクトプローブユニット |
Also Published As
| Publication number | Publication date |
|---|---|
| CN120153265A (zh) | 2025-06-13 |
| TW202431461A (zh) | 2024-08-01 |
| JP2024070404A (ja) | 2024-05-23 |
| WO2024101224A1 (ja) | 2024-05-16 |
| EP4617675A1 (en) | 2025-09-17 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR102366546B1 (ko) | 전기적 접촉자 및 전기적 접속장치 | |
| KR102919226B1 (ko) | 프로브 카드 | |
| EP4632392A1 (en) | Probe | |
| KR20250079202A (ko) | 프로브 및 전기적 접속 장치 | |
| TWI919138B (zh) | 探針及電性連接裝置 | |
| US20260104437A1 (en) | Probe for probe card | |
| TWI920536B (zh) | 探針及電性連接裝置 | |
| TWI885400B (zh) | 探針裝置 | |
| US20260056233A1 (en) | Probe and electrical connection device | |
| JPH02206765A (ja) | プローブカード | |
| JP2024064692A (ja) | コンタクトピンおよび電気的接続装置 | |
| WO2025126800A1 (ja) | 電気的接続装置 | |
| KR101044118B1 (ko) | 다층 캔틸레버를 갖는 프로브 카드 | |
| JP2025117043A (ja) | プローブおよび電気的接続装置 | |
| KR20260028081A (ko) | 프로브 | |
| JP2025093586A (ja) | プローブ | |
| KR20260028096A (ko) | 프로브 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| D21 | Rejection of application intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| E13 | Pre-grant limitation requested |
Free format text: ST27 STATUS EVENT CODE: A-2-3-E10-E13-LIM-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| E13-X000 | Pre-grant limitation requested |
St.27 status event code: A-2-3-E10-E13-lim-X000 |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |