CN120153265A - 探针和电连接装置 - Google Patents
探针和电连接装置 Download PDFInfo
- Publication number
- CN120153265A CN120153265A CN202380077062.XA CN202380077062A CN120153265A CN 120153265 A CN120153265 A CN 120153265A CN 202380077062 A CN202380077062 A CN 202380077062A CN 120153265 A CN120153265 A CN 120153265A
- Authority
- CN
- China
- Prior art keywords
- probe
- end portion
- contact
- contact film
- base material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/06738—Geometry aspects related to tip portion
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
- G01R1/0675—Needle-like
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
- G01R1/06761—Material aspects related to layers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07314—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2853—Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Geometry (AREA)
- Measuring Leads Or Probes (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022-180871 | 2022-11-11 | ||
| JP2022180871A JP2024070404A (ja) | 2022-11-11 | 2022-11-11 | プローブおよび電気的接続装置 |
| PCT/JP2023/039278 WO2024101224A1 (ja) | 2022-11-11 | 2023-10-31 | プローブおよび電気的接続装置 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120153265A true CN120153265A (zh) | 2025-06-13 |
Family
ID=91032905
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202380077062.XA Pending CN120153265A (zh) | 2022-11-11 | 2023-10-31 | 探针和电连接装置 |
Country Status (5)
| Country | Link |
|---|---|
| EP (1) | EP4617675A1 (https=) |
| JP (1) | JP2024070404A (https=) |
| KR (1) | KR20250079202A (https=) |
| CN (1) | CN120153265A (https=) |
| WO (1) | WO2024101224A1 (https=) |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7462800B2 (en) * | 2004-12-03 | 2008-12-09 | Sv Probe Pte Ltd. | Method of shaping lithographically-produced probe elements |
| JP2009276145A (ja) * | 2008-05-13 | 2009-11-26 | Japan Electronic Materials Corp | プローブ |
| WO2014087906A1 (ja) * | 2012-12-04 | 2014-06-12 | 日本電子材料株式会社 | 電気的接触子 |
| JP6305754B2 (ja) | 2013-12-20 | 2018-04-04 | 東京特殊電線株式会社 | コンタクトプローブユニット |
| SG11201704433TA (en) * | 2014-12-30 | 2017-07-28 | Technoprobe Spa | Contact probe for testing head |
| CN116183986A (zh) * | 2014-12-30 | 2023-05-30 | 泰克诺探头公司 | 用于测试头的接触探针的制造方法 |
| CN107667295A (zh) * | 2014-12-30 | 2018-02-06 | 泰克诺探头公司 | 包括用于测试头的多个接触探针的半成品及相关制造方法 |
| IT201700021400A1 (it) * | 2017-02-24 | 2018-08-24 | Technoprobe Spa | Testa di misura a sonde verticali con migliorate proprietà in frequenza |
| JP7633766B2 (ja) * | 2019-11-11 | 2025-02-20 | 株式会社日本マイクロニクス | 電気的接続装置 |
| JP7658768B2 (ja) * | 2021-03-19 | 2025-04-08 | 株式会社日本マイクロニクス | 電気的接続装置 |
-
2022
- 2022-11-11 JP JP2022180871A patent/JP2024070404A/ja active Pending
-
2023
- 2023-10-31 KR KR1020257014537A patent/KR20250079202A/ko active Pending
- 2023-10-31 WO PCT/JP2023/039278 patent/WO2024101224A1/ja not_active Ceased
- 2023-10-31 EP EP23888572.7A patent/EP4617675A1/en active Pending
- 2023-10-31 CN CN202380077062.XA patent/CN120153265A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| KR20250079202A (ko) | 2025-06-04 |
| TW202431461A (zh) | 2024-08-01 |
| JP2024070404A (ja) | 2024-05-23 |
| WO2024101224A1 (ja) | 2024-05-16 |
| EP4617675A1 (en) | 2025-09-17 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |