JP2024070404A - プローブおよび電気的接続装置 - Google Patents

プローブおよび電気的接続装置 Download PDF

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Publication number
JP2024070404A
JP2024070404A JP2022180871A JP2022180871A JP2024070404A JP 2024070404 A JP2024070404 A JP 2024070404A JP 2022180871 A JP2022180871 A JP 2022180871A JP 2022180871 A JP2022180871 A JP 2022180871A JP 2024070404 A JP2024070404 A JP 2024070404A
Authority
JP
Japan
Prior art keywords
probe
contact film
contact
guide plate
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2022180871A
Other languages
English (en)
Japanese (ja)
Other versions
JP2024070404A5 (https=
Inventor
美佳 那須
Mika Nasu
美岬 豊田
Misaki TOYODA
孝幸 林▲崎▼
Takayuki Hayashizaki
美菜子 高瀬
Minako Takase
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micronics Japan Co Ltd
Original Assignee
Micronics Japan Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micronics Japan Co Ltd filed Critical Micronics Japan Co Ltd
Priority to JP2022180871A priority Critical patent/JP2024070404A/ja
Priority to KR1020257014537A priority patent/KR20250079202A/ko
Priority to CN202380077062.XA priority patent/CN120153265A/zh
Priority to PCT/JP2023/039278 priority patent/WO2024101224A1/ja
Priority to EP23888572.7A priority patent/EP4617675A1/en
Priority to TW112142902A priority patent/TWI919138B/zh
Publication of JP2024070404A publication Critical patent/JP2024070404A/ja
Publication of JP2024070404A5 publication Critical patent/JP2024070404A5/ja
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/06738Geometry aspects related to tip portion
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733Geometry aspects
    • G01R1/0675Needle-like
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/06711Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755Material aspects
    • G01R1/06761Material aspects related to layers
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02General constructional details
    • G01R1/06Measuring leads; Measuring probes
    • G01R1/067Measuring probes
    • G01R1/073Multiple probes
    • G01R1/07307Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07314Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851Testing of integrated circuits [IC]
    • G01R31/2853Electrical testing of internal connections or -isolation, e.g. latch-up or chip-to-lead connections

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Geometry (AREA)
  • Measuring Leads Or Probes (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
JP2022180871A 2022-11-11 2022-11-11 プローブおよび電気的接続装置 Pending JP2024070404A (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2022180871A JP2024070404A (ja) 2022-11-11 2022-11-11 プローブおよび電気的接続装置
KR1020257014537A KR20250079202A (ko) 2022-11-11 2023-10-31 프로브 및 전기적 접속 장치
CN202380077062.XA CN120153265A (zh) 2022-11-11 2023-10-31 探针和电连接装置
PCT/JP2023/039278 WO2024101224A1 (ja) 2022-11-11 2023-10-31 プローブおよび電気的接続装置
EP23888572.7A EP4617675A1 (en) 2022-11-11 2023-10-31 Probe and electrical connecting device
TW112142902A TWI919138B (zh) 2022-11-11 2023-11-07 探針及電性連接裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2022180871A JP2024070404A (ja) 2022-11-11 2022-11-11 プローブおよび電気的接続装置

Publications (2)

Publication Number Publication Date
JP2024070404A true JP2024070404A (ja) 2024-05-23
JP2024070404A5 JP2024070404A5 (https=) 2025-04-25

Family

ID=91032905

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022180871A Pending JP2024070404A (ja) 2022-11-11 2022-11-11 プローブおよび電気的接続装置

Country Status (5)

Country Link
EP (1) EP4617675A1 (https=)
JP (1) JP2024070404A (https=)
KR (1) KR20250079202A (https=)
CN (1) CN120153265A (https=)
WO (1) WO2024101224A1 (https=)

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7462800B2 (en) * 2004-12-03 2008-12-09 Sv Probe Pte Ltd. Method of shaping lithographically-produced probe elements
JP2009276145A (ja) * 2008-05-13 2009-11-26 Japan Electronic Materials Corp プローブ
WO2014087906A1 (ja) * 2012-12-04 2014-06-12 日本電子材料株式会社 電気的接触子
JP6305754B2 (ja) 2013-12-20 2018-04-04 東京特殊電線株式会社 コンタクトプローブユニット
SG11201704433TA (en) * 2014-12-30 2017-07-28 Technoprobe Spa Contact probe for testing head
CN116183986A (zh) * 2014-12-30 2023-05-30 泰克诺探头公司 用于测试头的接触探针的制造方法
CN107667295A (zh) * 2014-12-30 2018-02-06 泰克诺探头公司 包括用于测试头的多个接触探针的半成品及相关制造方法
IT201700021400A1 (it) * 2017-02-24 2018-08-24 Technoprobe Spa Testa di misura a sonde verticali con migliorate proprietà in frequenza
JP7633766B2 (ja) * 2019-11-11 2025-02-20 株式会社日本マイクロニクス 電気的接続装置
JP7658768B2 (ja) * 2021-03-19 2025-04-08 株式会社日本マイクロニクス 電気的接続装置

Also Published As

Publication number Publication date
KR20250079202A (ko) 2025-06-04
CN120153265A (zh) 2025-06-13
TW202431461A (zh) 2024-08-01
WO2024101224A1 (ja) 2024-05-16
EP4617675A1 (en) 2025-09-17

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Effective date: 20250417

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Effective date: 20250829