KR20240155858A - 반도체 장치, 기억 장치, 및 전자 기기 - Google Patents

반도체 장치, 기억 장치, 및 전자 기기 Download PDF

Info

Publication number
KR20240155858A
KR20240155858A KR1020247026531A KR20247026531A KR20240155858A KR 20240155858 A KR20240155858 A KR 20240155858A KR 1020247026531 A KR1020247026531 A KR 1020247026531A KR 20247026531 A KR20247026531 A KR 20247026531A KR 20240155858 A KR20240155858 A KR 20240155858A
Authority
KR
South Korea
Prior art keywords
insulator
conductor
oxide
addition
memory
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247026531A
Other languages
English (en)
Korean (ko)
Inventor
하지메 키무라
순페이 야마자키
Original Assignee
가부시키가이샤 한도오따이 에네루기 켄큐쇼
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시키가이샤 한도오따이 에네루기 켄큐쇼 filed Critical 가부시키가이샤 한도오따이 에네루기 켄큐쇼
Publication of KR20240155858A publication Critical patent/KR20240155858A/ko
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H10B12/48Data lines or contacts therefor
    • H10B12/482Bit lines
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • H10B12/30DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
    • H01L27/105
    • H01L28/75
    • H01L29/24
    • H01L29/7869
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B12/00Dynamic random access memory [DRAM] devices
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B41/00Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/70Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10BELECTRONIC MEMORY DEVICES
    • H10B99/00Subject matter not provided for in other groups of this subclass
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D1/00Resistors, capacitors or inductors
    • H10D1/60Capacitors
    • H10D1/68Capacitors having no potential barriers
    • H10D1/692Electrodes
    • H10D1/696Electrodes comprising multiple layers, e.g. comprising a barrier layer and a metal layer
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/80Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/80Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs

Landscapes

  • Thin Film Transistor (AREA)
KR1020247026531A 2022-02-25 2023-02-10 반도체 장치, 기억 장치, 및 전자 기기 Pending KR20240155858A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2022-028096 2022-02-25
JP2022028096 2022-02-25
PCT/IB2023/051188 WO2023161754A1 (ja) 2022-02-25 2023-02-10 半導体装置、記憶装置、及び電子機器

Publications (1)

Publication Number Publication Date
KR20240155858A true KR20240155858A (ko) 2024-10-29

Family

ID=87764914

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247026531A Pending KR20240155858A (ko) 2022-02-25 2023-02-10 반도체 장치, 기억 장치, 및 전자 기기

Country Status (5)

Country Link
US (1) US20250159869A1 (https=)
JP (1) JPWO2023161754A1 (https=)
KR (1) KR20240155858A (https=)
CN (1) CN118696617A (https=)
WO (1) WO2023161754A1 (https=)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110065270A1 (en) 2009-09-15 2011-03-17 Sunil Shim Three-dimensional semiconductor memory device and a method of fabricating the same
US20130069052A1 (en) 2011-09-16 2013-03-21 Micron Technology, Inc. Memory cells, semiconductor devices, systems including such cells, and methods of fabrication
US20160149004A1 (en) 2014-11-25 2016-05-26 Sandisk Technologies Inc. 3D NAND With Oxide Semiconductor Channel

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201901971A (zh) * 2017-05-12 2019-01-01 日商半導體能源研究所股份有限公司 半導體裝置及半導體裝置的製造方法
WO2019021098A1 (en) * 2017-07-26 2019-01-31 Semiconductor Energy Laboratory Co., Ltd. SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE
US12289878B2 (en) * 2019-07-12 2025-04-29 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing semiconductor device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20110065270A1 (en) 2009-09-15 2011-03-17 Sunil Shim Three-dimensional semiconductor memory device and a method of fabricating the same
US20130069052A1 (en) 2011-09-16 2013-03-21 Micron Technology, Inc. Memory cells, semiconductor devices, systems including such cells, and methods of fabrication
US20160149004A1 (en) 2014-11-25 2016-05-26 Sandisk Technologies Inc. 3D NAND With Oxide Semiconductor Channel

Also Published As

Publication number Publication date
CN118696617A (zh) 2024-09-24
JPWO2023161754A1 (https=) 2023-08-31
US20250159869A1 (en) 2025-05-15
WO2023161754A1 (ja) 2023-08-31

Similar Documents

Publication Publication Date Title
KR102926648B1 (ko) 반도체 장치 및 반도체 장치의 제작 방법
JP2025013398A (ja) 半導体装置
KR20210052196A (ko) 반도체 장치 및 전자 기기
JP7483606B2 (ja) 半導体装置
JP7442997B2 (ja) 半導体装置
US11568944B2 (en) Semiconductor device comprising memory cells
KR20240052666A (ko) 반도체 장치
US20260122891A1 (en) Semiconductor device and electronic device
JP2025067950A (ja) 半導体装置
US20260045302A1 (en) Computer system and method for operating data processing device
JP2025185071A (ja) 半導体装置
KR20240056760A (ko) 반도체 장치, 기억 장치
JP2026032141A (ja) 半導体装置
JP7711280B2 (ja) 情報処理装置の動作方法
US20250126843A1 (en) Semiconductor device and method for manufacturing the semiconductor device
US20250151254A1 (en) Semiconductor device and method for manufacturing the semiconductor device
KR20250083490A (ko) 반도체 장치, 기억 장치, 및 전자 기기
KR20240155858A (ko) 반도체 장치, 기억 장치, 및 전자 기기
KR20240163678A (ko) 반도체 장치 및 반도체 장치의 제작 방법
KR20240165976A (ko) 반도체 장치, 기억 장치, 및 전자 기기
US20250151261A1 (en) Semiconductor device, memory device, and electronic device
US20250185340A1 (en) Semiconductor device
US20250120182A1 (en) Semiconductor device
US20240423096A1 (en) Semiconductor device, storage device, and electronic device
KR20250004235A (ko) 적층체의 제작 방법 및 반도체 장치의 제작 방법

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D18 Deferred examination requested

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D18-EXM-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

D18-X000 Deferred examination requested

St.27 status event code: A-1-2-D10-D18-exm-X000