KR20240155858A - 반도체 장치, 기억 장치, 및 전자 기기 - Google Patents
반도체 장치, 기억 장치, 및 전자 기기 Download PDFInfo
- Publication number
- KR20240155858A KR20240155858A KR1020247026531A KR20247026531A KR20240155858A KR 20240155858 A KR20240155858 A KR 20240155858A KR 1020247026531 A KR1020247026531 A KR 1020247026531A KR 20247026531 A KR20247026531 A KR 20247026531A KR 20240155858 A KR20240155858 A KR 20240155858A
- Authority
- KR
- South Korea
- Prior art keywords
- insulator
- conductor
- oxide
- addition
- memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
- H10B12/48—Data lines or contacts therefor
- H10B12/482—Bit lines
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
-
- H01L27/105—
-
- H01L28/75—
-
- H01L29/24—
-
- H01L29/7869—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
- H10B41/70—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates the floating gate being an electrode shared by two or more components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B99/00—Subject matter not provided for in other groups of this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D1/00—Resistors, capacitors or inductors
- H10D1/60—Capacitors
- H10D1/68—Capacitors having no potential barriers
- H10D1/692—Electrodes
- H10D1/696—Electrodes comprising multiple layers, e.g. comprising a barrier layer and a metal layer
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D30/00—Field-effect transistors [FET]
- H10D30/60—Insulated-gate field-effect transistors [IGFET]
- H10D30/67—Thin-film transistors [TFT]
- H10D30/674—Thin-film transistors [TFT] characterised by the active materials
- H10D30/6755—Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D62/00—Semiconductor bodies, or regions thereof, of devices having potential barriers
- H10D62/80—Semiconductor bodies, or regions thereof, of devices having potential barriers characterised by the materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
Landscapes
- Thin Film Transistor (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2022-028096 | 2022-02-25 | ||
| JP2022028096 | 2022-02-25 | ||
| PCT/IB2023/051188 WO2023161754A1 (ja) | 2022-02-25 | 2023-02-10 | 半導体装置、記憶装置、及び電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240155858A true KR20240155858A (ko) | 2024-10-29 |
Family
ID=87764914
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247026531A Pending KR20240155858A (ko) | 2022-02-25 | 2023-02-10 | 반도체 장치, 기억 장치, 및 전자 기기 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20250159869A1 (https=) |
| JP (1) | JPWO2023161754A1 (https=) |
| KR (1) | KR20240155858A (https=) |
| CN (1) | CN118696617A (https=) |
| WO (1) | WO2023161754A1 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110065270A1 (en) | 2009-09-15 | 2011-03-17 | Sunil Shim | Three-dimensional semiconductor memory device and a method of fabricating the same |
| US20130069052A1 (en) | 2011-09-16 | 2013-03-21 | Micron Technology, Inc. | Memory cells, semiconductor devices, systems including such cells, and methods of fabrication |
| US20160149004A1 (en) | 2014-11-25 | 2016-05-26 | Sandisk Technologies Inc. | 3D NAND With Oxide Semiconductor Channel |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201901971A (zh) * | 2017-05-12 | 2019-01-01 | 日商半導體能源研究所股份有限公司 | 半導體裝置及半導體裝置的製造方法 |
| WO2019021098A1 (en) * | 2017-07-26 | 2019-01-31 | Semiconductor Energy Laboratory Co., Ltd. | SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| US12289878B2 (en) * | 2019-07-12 | 2025-04-29 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and method of manufacturing semiconductor device |
-
2023
- 2023-02-10 JP JP2024502576A patent/JPWO2023161754A1/ja active Pending
- 2023-02-10 KR KR1020247026531A patent/KR20240155858A/ko active Pending
- 2023-02-10 WO PCT/IB2023/051188 patent/WO2023161754A1/ja not_active Ceased
- 2023-02-10 US US18/838,504 patent/US20250159869A1/en active Pending
- 2023-02-10 CN CN202380021311.3A patent/CN118696617A/zh active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110065270A1 (en) | 2009-09-15 | 2011-03-17 | Sunil Shim | Three-dimensional semiconductor memory device and a method of fabricating the same |
| US20130069052A1 (en) | 2011-09-16 | 2013-03-21 | Micron Technology, Inc. | Memory cells, semiconductor devices, systems including such cells, and methods of fabrication |
| US20160149004A1 (en) | 2014-11-25 | 2016-05-26 | Sandisk Technologies Inc. | 3D NAND With Oxide Semiconductor Channel |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118696617A (zh) | 2024-09-24 |
| JPWO2023161754A1 (https=) | 2023-08-31 |
| US20250159869A1 (en) | 2025-05-15 |
| WO2023161754A1 (ja) | 2023-08-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| D18 | Deferred examination requested |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D18-EXM-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| D18-X000 | Deferred examination requested |
St.27 status event code: A-1-2-D10-D18-exm-X000 |