KR20240153332A - 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품 - Google Patents

수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품 Download PDF

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Publication number
KR20240153332A
KR20240153332A KR1020247027992A KR20247027992A KR20240153332A KR 20240153332 A KR20240153332 A KR 20240153332A KR 1020247027992 A KR1020247027992 A KR 1020247027992A KR 20247027992 A KR20247027992 A KR 20247027992A KR 20240153332 A KR20240153332 A KR 20240153332A
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KR
South Korea
Prior art keywords
resin composition
compound
component
curing
thiol
Prior art date
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Pending
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KR1020247027992A
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English (en)
Korean (ko)
Inventor
코다이 오츠보
후미야 스즈키
Original Assignee
나믹스 가부시끼가이샤
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Publication of KR20240153332A publication Critical patent/KR20240153332A/ko
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/102—Esters of polyhydric alcohols or polyhydric phenols of dialcohols, e.g. ethylene glycol di(meth)acrylate or 1,4-butanediol dimethacrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/226—Mixtures of di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22—Di-epoxy compounds
    • C08G59/24—Di-epoxy compounds carbocyclic
    • C08G59/245—Di-epoxy compounds carbocyclic aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G75/00—Macromolecular compounds obtained by reactions forming a linkage containing sulfur with or without nitrogen, oxygen, or carbon in the main chain of the macromolecule
    • C08G75/02—Polythioethers
    • C08G75/04—Polythioethers from mercapto compounds or metallic derivatives thereof
    • C08G75/045—Polythioethers from mercapto compounds or metallic derivatives thereof from mercapto compounds and unsaturated compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/06—Non-macromolecular additives organic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04—Homopolymers or copolymers of esters
    • C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/08—Homopolymers or copolymers of acrylic acid esters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
    • H01L23/293—
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F222/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a carboxyl radical and containing at least one other carboxyl radical in the molecule; Salts, anhydrides, esters, amides, imides, or nitriles thereof
    • C08F222/10—Esters
    • C08F222/1006—Esters of polyhydric alcohols or polyhydric phenols
    • C08F222/104—Esters of polyhydric alcohols or polyhydric phenols of tetraalcohols, e.g. pentaerythritol tetra(meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/66—Mercaptans
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
    • C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
KR1020247027992A 2022-03-01 2023-02-17 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품 Pending KR20240153332A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022030685 2022-03-01
JPJP-P-2022-030685 2022-03-01
PCT/JP2023/005708 WO2023167014A1 (ja) 2022-03-01 2023-02-17 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品

Publications (1)

Publication Number Publication Date
KR20240153332A true KR20240153332A (ko) 2024-10-22

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KR1020247027992A Pending KR20240153332A (ko) 2022-03-01 2023-02-17 수지 조성물, 접착제, 봉지재, 경화물, 반도체 장치 및 전자 부품

Country Status (6)

Country Link
EP (1) EP4488316A4 (https=)
JP (1) JPWO2023167014A1 (https=)
KR (1) KR20240153332A (https=)
CN (1) CN118786165A (https=)
TW (1) TW202344571A (https=)
WO (1) WO2023167014A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025126839A1 (ja) * 2023-12-15 2025-06-19 ナミックス株式会社 樹脂組成物、接着剤、封止材、硬化物、半導体装置及び電子部品
CN118909254A (zh) * 2024-08-21 2024-11-08 广东省大湾区华南理工大学聚集诱导发光高等研究院 一种有机光学材料用组合物和有机光学玻璃

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005052021A1 (ja) 2003-11-26 2005-06-09 Mitsui Chemicals, Inc. １液型の光及び熱併用硬化性樹脂組成物及びその用途
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
WO2018047849A1 (ja) 2016-09-12 2018-03-15 ナミックス株式会社 樹脂組成物、接着剤、封止材、ダム剤、および半導体装置

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JP5037616B2 (ja) * 2007-07-26 2012-10-03 新日鐵化学株式会社 体積位相型ホログラム記録材料及びそれを用いた光情報記録媒体
JP5076076B2 (ja) * 2008-09-27 2012-11-21 サンノプコ株式会社 紫外線硬化型組成物
JP2012153794A (ja) 2011-01-26 2012-08-16 Sakai Chem Ind Co Ltd 樹脂組成物、樹脂硬化物および樹脂成形体
JP5989469B2 (ja) * 2011-09-06 2016-09-07 三洋化成工業株式会社 感光性組成物
WO2013089100A1 (ja) * 2011-12-16 2013-06-20 株式会社スリーボンド 硬化性樹脂組成物
EP2847245B1 (en) * 2012-05-07 2019-01-02 Mercene Labs AB Method for the manufacture of coated articles and coated articles
JP2014133875A (ja) * 2012-12-13 2014-07-24 Three Bond Co Ltd 硬化性組成物
WO2014100238A2 (en) * 2012-12-21 2014-06-26 Dow Global Technologies Llc Phase-segmented non-isocyanate elastomers
BR112017013742A2 (pt) * 2014-12-23 2018-03-13 3M Innovative Properties Co politioéter de cura dupla
CN107109068A (zh) * 2015-01-22 2017-08-29 道康宁东丽株式会社 可固化的有机聚硅氧烷组合物、其固化产物、以及形成固化膜的方法
WO2017140489A1 (en) * 2016-02-16 2017-08-24 Henkel IP & Holding GmbH Nanocrystal epoxy thiol (meth)acrylate composite material and nanocrystal epoxy thiol (methacrylate) composite film
WO2020209268A1 (ja) * 2019-04-11 2020-10-15 日立化成株式会社 光軟化性樹脂組成物、光軟化性樹脂組成物の軟化物の製造方法、硬化性樹脂組成物及びその硬化物、並びにパターン膜及びその製造方法
EP3848179A1 (de) * 2020-01-10 2021-07-14 Carl Zeiss Vision International GmbH Inkjet-verfahren zur herstellung eines brillenglases
JP2022030685A (ja) 2020-08-07 2022-02-18 サラックス製造株式会社 身体洗浄用具及びその製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005052021A1 (ja) 2003-11-26 2005-06-09 Mitsui Chemicals, Inc. １液型の光及び熱併用硬化性樹脂組成物及びその用途
JP2009051954A (ja) 2007-08-28 2009-03-12 Three Bond Co Ltd 光および加熱硬化性組成物とその硬化物
WO2018047849A1 (ja) 2016-09-12 2018-03-15 ナミックス株式会社 樹脂組成物、接着剤、封止材、ダム剤、および半導体装置

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Publication number Publication date
CN118786165A (zh) 2024-10-15
EP4488316A4 (en) 2026-03-11
TW202344571A (zh) 2023-11-16
JPWO2023167014A1 (https=) 2023-09-07
EP4488316A1 (en) 2025-01-08
WO2023167014A1 (ja) 2023-09-07

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