KR20240100243A - 임프린트 장치, 임프린트 방법, 및 물품 제조 방법 - Google Patents

임프린트 장치, 임프린트 방법, 및 물품 제조 방법 Download PDF

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Publication number
KR20240100243A
KR20240100243A KR1020230179273A KR20230179273A KR20240100243A KR 20240100243 A KR20240100243 A KR 20240100243A KR 1020230179273 A KR1020230179273 A KR 1020230179273A KR 20230179273 A KR20230179273 A KR 20230179273A KR 20240100243 A KR20240100243 A KR 20240100243A
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KR
South Korea
Prior art keywords
imprint
processing
processing time
substrate
shot area
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020230179273A
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English (en)
Korean (ko)
Inventor
소우시 야마구치
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20240100243A publication Critical patent/KR20240100243A/ko
Pending legal-status Critical Current

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28—Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283—Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0436—Apparatus for thermal treatment mainly by radiation
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0448—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/06—Apparatus for monitoring, sorting, marking, testing or measuring
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P76/00—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography
    • H10P76/20—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials
    • H10P76/204—Manufacture or treatment of masks on semiconductor bodies, e.g. by lithography or photolithography of masks comprising organic materials of organic photoresist masks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices
    • H10P50/73—Etching of wafers, substrates or parts of devices using masks for insulating materials

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
KR1020230179273A 2022-12-22 2023-12-12 임프린트 장치, 임프린트 방법, 및 물품 제조 방법 Pending KR20240100243A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022205989A JP2024090239A (ja) 2022-12-22 2022-12-22 インプリント装置、インプリント方法および物品製造方法
JPJP-P-2022-205989 2022-12-22

Publications (1)

Publication Number Publication Date
KR20240100243A true KR20240100243A (ko) 2024-07-01

Family

ID=91584508

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020230179273A Pending KR20240100243A (ko) 2022-12-22 2023-12-12 임프린트 장치, 임프린트 방법, 및 물품 제조 방법

Country Status (3)

Country Link
US (1) US20240210818A1 (OSRAM)
JP (1) JP2024090239A (OSRAM)
KR (1) KR20240100243A (OSRAM)

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5960198B2 (ja) * 2013-07-02 2016-08-02 キヤノン株式会社 パターン形成方法、リソグラフィ装置、リソグラフィシステムおよび物品製造方法
JP6080813B2 (ja) * 2013-08-30 2017-02-15 キヤノン株式会社 光インプリント用組成物、これを用いた、膜の製造方法、光学部品の製造方法、回路基板の製造方法、電子部品の製造方法
JP6748461B2 (ja) * 2016-03-22 2020-09-02 キヤノン株式会社 インプリント装置、インプリント装置の動作方法および物品製造方法
JP6761329B2 (ja) * 2016-11-22 2020-09-23 キヤノン株式会社 インプリント装置、インプリント方法および物品製造方法
US11366400B2 (en) * 2017-05-15 2022-06-21 Canon Kabushiki Kaisha Method of determining drop recipe, imprint apparatus, and article manufacturing method
JP7361615B2 (ja) * 2019-01-30 2023-10-16 キヤノン株式会社 シミュレーション方法、シミュレーション装置およびプログラム
JP7149870B2 (ja) * 2019-02-08 2022-10-07 キヤノン株式会社 インプリント装置および物品製造方法
JP7292949B2 (ja) * 2019-04-24 2023-06-19 キヤノン株式会社 インプリント用モールド及びその製造方法、及びインプリント方法
US12079551B2 (en) * 2019-06-11 2024-09-03 Canon Kabushiki Kaisha Simulation method, simulation apparatus, storage medium, film forming method, and method of producing cured product
JP7395307B2 (ja) * 2019-10-01 2023-12-11 キヤノン株式会社 インプリント方法、インプリント装置および物品の製造方法
JP7515293B2 (ja) * 2020-04-30 2024-07-12 キヤノン株式会社 インプリント装置、および物品製造方法

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Publication number Publication date
US20240210818A1 (en) 2024-06-27
JP2024090239A (ja) 2024-07-04

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