KR20240078322A - Electrical connecting apparatus - Google Patents

Abstract

[Problem] There is a demand for an electrical connection device that allows placement of more electronic components while providing good power characteristics.
[Solution] The present invention provides an electrical connection device for electrically connecting a test device and a plurality of electrode terminals of an object to be inspected, comprising: a wiring board having a wiring circuit connected to the test device; and a plurality of electrode terminals of the object to be inspected. For each of the above, a probe board having a plurality of electrical contacts brought into electrical contact is provided between the wiring board and the probe board, and is electrically connected between the wiring circuit of the wiring board and the plurality of electrical contacts of the probe board. A connection board for connection is provided, and one or more step portions are provided on at least a surface of the connection board, and an electronic portion is disposed on each surface of the one or more step portions.

Description

{ELECTRICAL CONNECTING APPARATUS}

The present invention relates to an electrical connection device, and can be applied to, for example, electrical connection devices such as probe cards used for energization testing of semiconductor integrated circuits.

In the semiconductor manufacturing process, the electrical properties of a plurality of semiconductor integrated circuits formed on a semiconductor wafer are each inspected to determine whether they have the expected electrical properties before dicing.

For electrical inspection of each semiconductor integrated circuit as an object to be inspected, a probe card mounted on an inspection device that inspects each semiconductor integrated circuit is used. The probe card has a plurality of probes, and during an inspection, each of the probes is pushed into the electrode terminal of the object to be inspected to make electrical contact, and the inspection device tests the electrical characteristics of each object to be inspected.

Conventionally, in testing the electrical characteristics of an object to be inspected, an electric signal is applied between the test device and the object to be inspected through a probe card, so the conductive path between the test device and the object to be inspected becomes a transmission path for noise. It reduces inspection precision. Therefore, a condenser for noise removal is placed to reduce noise (see Patent Document 1).

Conventionally, capacitors for noise removal are placed on the upper surface of the wiring board (PCB) 12 or on the support member (stiffener) 11 as shown in FIG. 2, and when many capacitors are placed, the connection It is disposed on the lower surface of the substrate 15.

[Patent Document 1] Japanese Patent Application Publication No. 2016-75636

However, as the density of the object to be inspected increases, the number of electronic components such as condensers placed on the connection board of the probe card also increases, and the space for placing electronic components is narrowing. On the other hand, there is a possibility that the demand for increasing the number of electronic components placed will increase in the future, and efficient arrangement of electronic components is desirable.

Additionally, in order to efficiently remove noise from the power supply line, it is desirable from the viewpoint of power supply characteristics to place the condenser in a position close to the probe position on the probe card.

Therefore, there is a demand for an electrical connection device that allows more electronic components to be placed while providing good power supply characteristics.

In order to solve this problem, an electrical connection device for electrically connecting a plurality of electrode terminals of an inspection device and an inspection object includes (1) a wiring board having a wiring circuit for connection to the inspection device, and (2) an inspection object. a probe board having a plurality of electrical contacts for electrical contact with each of the plurality of electrode terminals, and (3) a probe board provided between the wiring board and the probe board, and a wiring circuit of the wiring board and a plurality of electrical contacts of the probe board. A connection board is provided for electrically connecting each of the contactors, one or a plurality of step portions are provided on at least a surface of the connection board, and an electronic portion is disposed on each surface of the one or more step portions. It is characterized by

According to the present invention, more electronic components can be placed while improving power supply characteristics.

[FIG. 1] FIG. 1(A) is a configuration diagram showing the configuration of an electrical connection device according to an embodiment, and FIG. 1(B) is an enlarged view showing the configuration of a step portion provided on the connection board of FIG. 1(A). am.
[FIG. 2] FIG. 2(A) is a configuration diagram showing the configuration of a conventional electrical connection device, and FIG. 2(B) is an enlarged view showing the configuration of the connection board in FIG. 2(A).
[FIG. 3] is a configuration diagram showing the configuration of a modified example of a step portion installed on a connection board of the electrical connection device of the embodiment.
[FIG. 4] FIG. 4(A) is a configuration diagram showing the configuration of an electrical connection device according to an embodiment, and FIG. 4(B) is an enlarged view showing the configuration of a step portion of the connection board in FIG. 4(A). .
[FIG. 5] FIG. 5(A) is an enlarged view showing the configuration of a step portion installed on the connection board of the electrical connection device according to the embodiment, and FIG. 5(B) focuses attention on the upper surface of the step portion in FIG. 5(A). It is a floor plan.
[FIG. 6] FIG. 6(A) is an enlarged view showing the configuration of a step portion installed on the connection board of the electrical connection device according to the embodiment, and FIG. 6(B) is a perspective view of the step portion in FIG. 6(A); FIG. 6(C) is a plan view focusing on the upper surface of the step portion in FIG. 6(A).
[FIG. 7] is an enlarged view showing the configuration of a step portion provided on the connection board of the electrical connection device according to the embodiment.

(A) Embodiment

Below, embodiments of the electrical connection device according to the present invention will be described in detail with reference to the drawings.

(A-1) Configuration of embodiment

FIG. 1(A) is a configuration diagram showing the configuration of an electrical connection device according to an embodiment, and FIG. 1(B) is an enlarged view showing the configuration of a step portion provided on the connection board of FIG. 1(A).

In FIG. 1(A), the electrical connection device 1 according to the embodiment includes a support member (stiffener) 11, a wiring board 12, a spacer 13, a connection body 14, and a connection board 15. ), and has a probe substrate (probe head) 16.

Note that each figure according to this application, including Figure 1, shows only the main components, but the actual electrical connection device also includes components not shown. In addition, the size of each component of the electrical connection device 1, that is, the thickness in the Z-axis direction, the length in the X-axis direction, etc., are examples and are not limited to those shown in the drawings. Furthermore, in this embodiment, when referring to “top,” “bottom,” “left,” “right,” “inside,” and “front,” explanation is made based on the direction shown in Fig. 1(A).

The electrical connection device 1 can be applied to a probe card for inspecting the electrical characteristics of each of a plurality of semiconductor integrated circuits (referred to as “test object”) formed on a semiconductor wafer.

For example, in FIG. 1(A), an electrical connection device 1 is mounted on the test head of an inspection device (tester) 10, and at the time of inspection, a probe (electrical contactor) of the electrical connection device 1 is used. ) (3) is brought into contact with the electrode terminal 51 of the object 50 to be inspected. Then, the test device 10 supplies an electric signal to the test object 50 through the probe 3, or the test object 50 outputs an electric signal to the test device 10 through the probe 3. . Thereby, the inspection device (tester) 10 can inspect whether the object to be inspected 50 has the electrical characteristics according to specifications.

The object to be inspected 50 can be a semiconductor integrated circuit formed on a semiconductor wafer. As illustrated in FIG. 1(A), the semiconductor wafer is placed on the upper surface of the wafer chuck 4 and held in the wafer chuck 4, and during inspection, for example, the wafer chuck is driven by driving the inspection stage of the multi-axis stage. (4) moves, the semiconductor wafer approaches the lower surface of the electrical connection device 1, and the object 50 is positioned so that the electrode terminal 51 of the object 50 is in contact with the tip of the probe 3. is adjusted.

[Wiring board 12] The wiring board 12 is a board that is connected to the test head of the inspection device (tester) 10 and is used to transfer electric signals to and from the inspection device 10. For example, the wiring board 12 can use a printed circuit board (PCB), and the external shape of the wiring board 12 when viewed from above can be approximately circular or approximately polygonal. .

A large number of electronic components (condensers, resistors, etc.) are arranged on the upper surface of the wiring board 12, and a large number of terminals for connection to the test head are arranged. Meanwhile, on the lower surface of the wiring board 12, a wiring pattern for connection to the connection board 15 described later is formed. Inside the wiring board 12, a wiring path is formed to connect a terminal connected to the test head on the upper surface and a terminal on the wiring pattern on the lower surface. This provides a structure in which the terminals on the upper surface and the terminals on the wiring pattern on the lower surface can be electrically connected through the wiring path inside the wiring board 12.

Additionally, on the upper surface of the wiring board 12, the condenser 2 for removing noise from the power line may be placed, but placing the condenser 2 close to the probe 3 effectively removes noise. can do. Therefore, in this embodiment, the case where a large number of condensers 2 are disposed on the connection board 15 as described later will be described, but the condensers 2 may be disposed on the wiring board 12. In addition, on the upper surface of the wiring board 12, a support member 11 or the like is arranged and fixed with a fixing member such as a screw to suppress deformation of the wiring board 12.

[Support member (11)]

The support member 11 is a member for suppressing deformation such as bending of the wiring board 12, and is also called a stiffener. The support member 11 is a member with a thickness in the Z direction and can be of various shapes, for example, comprising an annular portion and a plurality of radial portions extending radially from the center of the annular portion toward the annular portion. You can apply what you have. Of course, the shape of the support member 11 is not limited to this, as long as it is possible to suppress deformation of the wiring board 12. Additionally, a conductive pattern may be formed on the surface of the support member 11 and a condenser for noise removal may be disposed.

A member such as a spacer 13 is disposed on the support member 11 and the probe head 16, and the support member 11 and the probe head 16 are maintained in parallel.

[Connect body (14)]

The connection body 14 is disposed on the lower surface of the wiring board 12 and is for electrically connecting the connection board 15 and the wiring board 12. The connection body 14 electrically connects the wiring pattern formed on the lower surface of the wiring board 12 and the terminal provided on the upper surface of the connection board 15. The connection body 14 is connected to the connection board 15 with screws, solder balls, etc., and also serves as a member to suppress deformation such as bending of the connection board 15.

[Connection board (15)]

The connection board 15 is electrically connected to one end (i.e., upper end) of the plurality of probes 3, and transmits an electric signal from the inspection device 10 side to each probe 3, or The electrical signal from the device is transmitted to the inspection device 10.

The connection board 15 can be a multilayer wiring board (space transformer (ST) board) and can be a rectangular board. For example, on the lower surface of the connection board 15, a connection terminal (for example, a probe pad area) and a wiring pattern for connection to the probe 3 are formed in accordance with the electrode terminal 51 of the object 50. It is done. On the other hand, terminals for electrical connection with the connection body 14 are formed on the upper surface of the connection board 15, and wiring paths formed inside the connection board 15 are connected to the connection terminals on the lower surface, etc. on the upper surface. The terminal is connected.

In addition, the connection wiring between the connection terminals on the lower surface of the connection board 15 and the terminals on the upper surface is not limited to the wiring path inside the connection board 15, and if electrically connected is possible, for example, a connection board ( Other wiring methods, such as forming a wiring pattern on the surface of 15), may be used.

Additionally, a condenser 2 for removing noise from the power supply line is disposed on the connection board 15. A detailed description of the arrangement method of the condenser 2 will be described later.

[Probe head (16)]

The probe head 16 mounts a plurality of probes 3. The probe head 16 is provided with a first guide plate 16a as a top guide plate and a second guide plate 16b as a bottom guide plate. The first guide plate 16a and the second guide plate 16b are provided with a number of through holes corresponding to the number of probes, and the corresponding through holes of the first guide plate 16a and the second guide plate 16b are provided. By inserting the probe 3, the first guide plate 16a supports the upper part of the probe 3, the second guide plate 16b supports the lower part of the probe 3, and the probe 3 is set. When the probe 3 is set, the upper end of the probe 3 is in contact with the connection terminal (for example, probe pad area) on the lower surface of the connection board 15, and the probe 3 is in contact with the object 50 to be inspected. To enable electrical contact with the electrode terminal 51, the lower end of the probe 3 protrudes from the lower surface of the second guide plate 16b. During inspection, the lower end of the probe 3 is in electrical contact with the electrode terminal 51 of the object 50 to be inspected.

The probe 3 may be a vertical probe, and may be made of a conductive material such as tungsten, copper alloy, palladium alloy, nickel alloy, or tungsten alloy.

In this embodiment, the case where the probe 3 is made of wire supported by the first guide plate 16a and the second guide plate 16b is exemplified is used. In order to ensure that the probe 3 has elasticity in the vertical direction upon contact, in the hollow area 17 provided between the first guide plate 16a and the second guide plate 16b, when contact is made, The probe (3) that receives the load bends and elastically deforms.

(A-2) Example of arrangement of condenser (2)

Next, the arrangement of the condenser 2 for eliminating noise in the power line will be explained in detail with reference to the drawings.

Here, in order to remove noise from the power line, it is assumed that, for example, thousands to tens of thousands of capacitors 2 can be placed on the connection board 15. Below, a plurality of arrangement examples of the condenser 2 will be mentioned, but it is not limited to adopting any one of the plurality of arrangement examples, and a plurality of arrangement examples may be combined.

In addition, in order to increase the number of arrangement of the condensers 2, for example, by stacking three condensers 2 in three stages in the height direction, a plurality of condensers 2 are stacked in multiple stages in the height direction of the condensers 2. It is okay to place them on top of each other. In this case, the number (single number) of condensers 2 stacked can be two or more.

In addition, in the following, the condenser 2 is illustrated as an example of an electronic component, but the electronic component is not limited to the condenser 2, and can also be applied to the arrangement of other electronic components such as resistors.

[Example 1]

As illustrated in FIGS. 1(A) and 1(B), the condenser 2 is disposed on the side portion 151 of the connection substrate 15. Additionally, a step portion 20 is provided on the upper surface of the connection board 15 connected to the connection body 14, and a condenser 2 is placed on the upper surface 22 of the step portion 20.

In this way, the condenser 2 is installed not only on the lower surface of the connection substrate 15, but also on either or both the side surface 151 of the connection substrate 15 and the upper surface 22 of the step portion 20. The number of batches can be increased by placing them.

For example, of the four sides of the connection board 15, which is rectangular in plan view, the condenser 2 may be placed on the side surfaces 151 of all sides, or the condenser 2 may be placed on the side surfaces 151 of some of the sides. It is okay to do so. The step portion 20 installed on the connection substrate 15 is similarly provided on all four sides of the rectangular connection substrate 15, and the upper surfaces of the four step portions 20 ( 22), the condenser 2 may be disposed, or a step portion 20 may be installed on some of the sides, and the condenser 2 may be disposed on the upper surface 22 of the installed step portion 20. do.

Also, for example, when the condenser 2 is disposed on the side portion 151 of the connection substrate 15, in the longitudinal direction of each side of the side portion 151, which is a rectangular connection substrate 15 in plan view, Each of the plurality of condensers 2 may be arranged. That is, on the side portion 151 of the connection board 15, the condenser 2 may be disposed in the longitudinal direction of each side. Similarly, on the upper surface 22 of the step portion 20 of the connection substrate 15, each of the plurality of condensers 2 may be arranged in the longitudinal direction of each side of the connection substrate 15.

Here, an example of wiring connection will be described. As shown in FIG. 1(B), the wiring 30 allows connection to the wiring pattern on the lower surface of the connecting body 14, and connects the lower surface of the connecting body 14 and the step portion 20 of the connecting substrate 15. The wall surface 21, the upper surface 22, the side portion 151 of the connection substrate 15, the lower surface of the connection substrate 15, and the probe 3 on the lower surface of the connection substrate 15 are continuously formed. Let's do it. In addition, among the wirings 30, the wiring formed on the side portion 151 of the connecting substrate 15 via the upper surface 22 of the step portion 20 of the connecting substrate 15 is also called a “first wiring.” In addition, the first wiring passes through the wall surface 21 and the top surface 22 of the step portion 20 of the connection board 15, the side surface 151 of the connection board 15, and the bottom surface of the connection board 15. Includes a second wiring.

Regarding the step portion 20 of the connection substrate 15, Figures 1(A) and 1(B) illustrate a case where the step portion 20 is provided near the end of the connection substrate 15. . In this way, by providing the step portion 20 near the end of the connection substrate 15, the side portion 151 of the connection substrate 15 is separated from the step portion 20 of the connection substrate 15 as described above. Since the wiring 30 connected to the lower surface of the connection board 15 can be formed via a space-saving wiring formation even in high-density packaging.

FIG. 3 is a configuration diagram showing a configuration of a modified example of the step portion 20 installed on the connection substrate 15 of the electrical connection device 1 of the embodiment.

The examples of FIGS. 1 (A) and 1 (B) described above illustrate the case where the step portion 20 is disposed at the end of the connection substrate 15, but the position of the step portion 20 is located at the end of the connection substrate 15. ) is not limited to the end of.

Figure 3 shows an example. For example, FIG. 3 illustrates a case where the step portion 20 is installed near the center of the connection substrate 15 or at a location away from the side portion 151 of the connection substrate 15.

In FIG. 3, since the step portion 20 does not contact the end of the connection substrate 15, a concave portion, such as a spot facing, is formed on the upper surface of the connection substrate 15, and the concave portion is The part is made into a step part (20). Therefore, the method of forming the wiring connection is different from the example in FIG. 1.

For example, as illustrated in FIG. 3, when the condenser 2 is disposed on the upper surface 22 (i.e., the bottom surface of the concave part) of the step portion 20, the connection substrate 15, as shown in FIG. The wiring 30 is formed on the wall surface 21 and the top surface 22 of the step portion 20 as a concave portion with respect to the upper surface, or a wiring path is formed inside the connection board 15 from the top surface 22 of the step portion 20. may be formed, and connection wiring may be formed through the wiring path.

In this way, a concave portion may be formed on the surface of the connection substrate 15, and the condenser 2 to which wiring is connected may be placed in the concave portion.

[Example 2]

FIG. 4(A) is a configuration diagram showing the configuration of the electrical connection device 1 according to the embodiment, and FIG. 4(B) is a diagram showing the step portion 20 of the connection substrate 15 in FIG. 4(A). This is an enlarged view showing the composition.

4(A) and 4(B), the condenser 2 is disposed on the wall surface 21 of the step portion 20 provided on the connection substrate 15.

In this example as well, step portions 20 are provided on all or part of the four sides of the rectangular connection board 15 in plan view, and condensers 2 are placed on the wall surface 21 of the provided step portions 20. do. The wiring connection described in Fig. 1(A) and Fig. 1(B) can be applied to the wiring connection at this time. That is, in order to form wiring in a space-saving manner even in high-density packaging, wiring ( 30) can be formed.

4(A) and 4(B), from the viewpoint of increasing the number of condensers 2, the upper surface 22 of the step portion 20 of the connection board 15 or the connection board 15 Although the condenser 2 is also disposed on the side portion 151, the condenser 2 may be disposed only on the wall surface 21 of the step portion 20. That is, it is not a prerequisite to place the condenser 2 on the upper surface 22 of the step portion 20 or the side portion 151 of the connection board 15, but rather the condenser (2) on the wall surface 21 of the step portion 20. It is okay to perform the arrangement of 2) independently.

Also, for example, when the condenser 2 is disposed on the wall surface 21 of the stepped portion 20 of the connection board 15, in the longitudinal direction of each side of the rectangular connection board 15 in plan view, a plurality of Each of the condensers 2 may be arranged. That is, on the wall surface 21 of the step portion 20, a plurality of condensers 2 may be arranged side by side in the longitudinal direction of the side.

Here, as illustrated in FIG. 4(B), the condenser 2 installed on the wall surface 21 of the step portion 20 and the condenser 2 installed on the upper surface 22 of the step portion 20 interfere with each other. Arrange so that it does not happen. Therefore, to prevent the two condensers 2 from colliding with each other, the length of the depth of the upper surface 22 of the step portion 20 (that is, the length in the inner direction from the end in the step portion 20) is The size of the condenser 2 disposed at (22) (particularly, the length disposed in the depth direction of the upper surface 22) and the size of the condenser 2 disposed on the wall 21 (particularly, the length disposed on the wall 21). Make the length of the protruding condenser (2) larger than the added value.

In addition, the wall surface 21 of the step portion 20 is a surface perpendicular to the upper surface 22, but it may be an inclined surface, and the condenser 2 may be arranged on the wall surface 21 that is an inclined surface. . By making the wall surface 21 an inclined surface, the condenser 2 can be placed in a stable position.

[Example 3]

FIG. 5(A) is an enlarged view showing the configuration of the step portion 20 provided on the connection board 15 of the electrical connection device 1 according to the embodiment, and FIG. 5(B) is an enlarged view of FIG. 5(A). This is a plan view focusing on the upper surface 22 of the step portion 20.

In Fig. 5(A), the condenser 2 is disposed on the upper surface 22 of the step portion 20 of the connection substrate 15. Here, as illustrated in FIG. 5(B), when placing a plurality of condensers 2 on the upper surface 22 of the stepped portion 20, in the depth direction of the upper surface 22 of the stepped portion 20, The condensers 2 are aligned by changing the position of the centroid of the adjacent condensers 2, and the condensers 2 are arranged in a zigzag shape.

In this way, by arranging the condenser 2 in a zigzag shape, interference with the pattern of the adjacent wiring 30 or the adjacent condenser 2 can be avoided on the upper surface 22 of the step portion 20. , space saving can be realized.

FIG. 5(C) is a plan view focusing on the upper surface 22 of the step portion 20 in FIG. 5(A), and is a diagram showing a modified example of the arrangement of the condenser 2. As shown in Fig. 5(C), the condenser 2 is arranged in a zigzag shape, but among the wiring pads 30a to which the condenser 2 is connected, the protruding portion of the wiring pad 30a is wider than the width of the condenser 2. The position of (30b) intersects the position of the protrusion 30b of the wiring pad 30a of the adjacent condenser 2 and the arrangement direction of the condenser 2 (Y-axis direction in Fig. 5(C)). By setting the positions to overlap (for example, in the As a result, the distance between the condensers 2 can be further shortened, and more condensers 2 can be placed. In addition, “width” in this embodiment refers to the length of each member and/or each part in the arrangement direction of the condenser 2.

[Example 4]

FIG. 6(A) is an enlarged view showing the configuration of the step portion 20 provided on the connection board 15 of the electrical connection device 1 according to the embodiment, and FIG. 6(B) is an enlarged view of FIG. 6(A). is a perspective view of the step portion 20, and FIG. 6(C) is a plan view focusing on the upper surface 22 of the step portion 20 in FIG. 6(A).

In Fig. 6(A), the condenser 2 is disposed on both the wall surface 21 and the top surface 22 of the stepped portion 20 of the connection substrate 15.

In this example, as illustrated in FIGS. 6 (B) and 6 (C), the arrangement of the condenser on the upper surface 22 of the step portion 20 and the arrangement of the condenser on the wall surface 21 are alternately repeated. , place the condenser (2). In addition, the condenser 2 is placed lying down on the upper surface 22 of the step portion 20 (for example, the large surface of the condenser 2 is placed in contact with the “upper surface 22”), and the wall surface ( Space saving can be achieved by placing the condenser 2 upright in 21 (for example, placing the large surface of the condenser 2 in contact with the “wall surface 21”).

Additionally, in this example, it becomes possible to reduce the length of the upper surface 22 of the step portion 20 in the depth direction.

FIG. 6(D) is a plan view focusing on the upper surface 22 of the step portion 20 in FIG. 6(A), and is a diagram showing a modified example of the arrangement of the condenser 2. In Fig. 6(D), as in Fig. 6(C), the condenser 2 is arranged lying down on the upper surface 22 of the step portion 20, and the condenser 2 is arranged standing up on the wall surface 21. Here, the wiring connection of the condenser 2 standing on the wall 21 is different from that in the case of FIG. 6(C). In Fig. 6(D), the condenser 2 on the wall surface 21 is arranged so as to share the wiring 30 of the condenser 2 lying on the adjacent upper surface 22. That is, the wiring 30 formed on the upper surface 22 is shared with the condenser 2 on the wall surface 21 and the condenser 2 on the adjacent upper surface 22. By doing this, the distance between adjacent condensers 2 can be further shortened, and more condensers 2 can be placed.

[Example 5]

FIG. 7 is an enlarged view showing the configuration of the step portion 20 provided on the connection board 15 of the electrical connection device 1 according to the embodiment.

In FIG. 7, the step portion 20 forms a two-stage difference, the upper end has a wall surface 21a and a top surface 22a, and the lower end has a wall surface 21b and a top surface 22b. .

In the example of FIG. 7, the condenser 2 is disposed on the upper surface 22a at the upper end of the two-stage difference, and the condenser 2 is disposed on both the wall surface 21b and the upper surface 22b at the lower end. Indicates a case. In this way, by using the step portion 20 having multiple stages, the condenser 2 can be placed on the wall surface 21 and the top surface 22 of each stage, so the number of condensers 2 can be increased. there is.

Additionally, the method of arranging the condenser 2 at the upper and lower ends of the step portion 20 is not particularly limited. For example, the condenser 2 may also be placed on the upper wall 21a. In addition, when the condenser 2 is arranged on the wall surface 21 and the top surface 22, the wall arrangement and the top arrangement illustrated in FIGS. 6(B) and 6(C) of [Example 4] are alternated. It is safe to say that it is a repetitive arrangement method.

In addition, in FIG. 7, the case where the step portion 20 is made up of two stages is illustrated, but the number of steps of the step portion 20 may be three or more steps. In the case of three or more steps of the step portion 20, various methods can be applied to arrange the condenser 2 on the wall surface 21 and the top surface 22 of each step.

(A-3) Effect of embodiment

As described above, according to this embodiment, the space for arranging capacitors is likely to be insufficient due to the increased density of the interconnection substrate. However, by disposing the condenser on the side surface of the interconnection substrate, more condensers can be disposed.

Additionally, since many capacitors can be placed on a connection board relatively close to the position of the probe, the power supply characteristics can be improved.

According to this embodiment, more capacitors can be placed by providing a step portion on the connection board and by disposing capacitors on the wall surface or top surface of the step portion.

Additionally, according to this embodiment, when providing a step portion on a connection substrate, more capacitors can be placed by increasing the number of stages of the step portion.

(B) Other embodiments

Although various modification examples of the present disclosure have been mentioned in the above-described first embodiment, the present disclosure can also be applied to the following modification embodiments.

(B-1) In Examples 1 to 5 of the above-described embodiment, the method of arranging the condenser 2 is exemplified, but it is not limited to this arrangement method, and arrangement methods can be combined as appropriate.

(B-2) In the above-described embodiment, for convenience of explanation, the case where one condenser 2 is disposed on the side surface 151 or the top surface 22 of the connection board 15 is exemplified, but the height of the condenser 2 In each direction, a plurality of condensers (e.g., two, three, etc.) may be placed one on top of the other. This allows more condensers to be placed to save space.

Additionally, it is possible to provide a recess, such as a groove, in the connection board 15, and place the condenser 2 in the recess. In other words, a recess may be provided at the position where the condenser 2 is placed (on the substrate of the connection board 15), and the condenser 2 may be placed so that the condenser 2 fits into the recess. At that time, regarding the condenser 2 contained in the concave portion, a plurality of condensers 2 may be placed one on top of the other in the height direction of the condenser 2.

In addition, it is possible to provide a concave portion such as a bead on the side surface 151 of the connection board 15 and place the condenser 2 in the concave portion of the side surface 151.

One … Electrical connection device, 2... Condenser, 3... Probe, 4... Wafer chuck, 10... Inspection device, 11... Support member, 12... Wiring board, 13... Spacer, 14... Conjunction, 15... Connection board, 16... Probe head, 16a... First guide plate, 16b... Second guide edition, 17... Hollow area, 20... Step part, 21, 21a, 21b... Wall, 22, 22a, 22b... Top surface, 30... Wiring, 50 … Test subject, 51... Electrode terminal, 151... Side part.

Claims (7)

In an electrical connection device that electrically connects a test device and a plurality of electrode terminals of an object to be inspected,
a wiring board having a wiring circuit connected to the inspection device;
a probe substrate having a plurality of electrical contactors electrically contacted with each of the plurality of electrode terminals of the object to be inspected;
A connection board provided between the wiring board and the probe board, and electrically connecting the wiring circuit of the wiring board and each of the plurality of electrical contacts of the probe board.
Equipped with
One or more step portions are provided on at least a surface of the connection substrate, and an electronic part is disposed on each surface of the one or more step portions.
An electrical connection device characterized in that. According to paragraph 1,
All or part of the one or more step portions are provided at an end of the connection board,
At least one first wiring among the wiring circuit and a plurality of wirings connecting respective connection terminals of the plurality of electrical contactors is formed via a surface of the step portion provided at an end of the connection board, Electronic components are connected to the first wiring.
An electrical connection device characterized in that. According to paragraph 1,
An electrical connection device, wherein a plurality of electronic components are disposed on a surface of the step portion, and the plurality of electronic components are arranged in a zigzag shape in an arrangement direction of the plurality of electronic components. According to paragraph 1,
An electrical connection device, wherein the electronic component is disposed on an upper surface of the step portion and/or a wall surface. According to clause 4,
A plurality of the electronic components are disposed on both the upper surface and the wall surface of the stepped portion, and in the arrangement direction of the plurality of electronic components, the electronic components disposed on the upper surface of the stepped portion are disposed on the wall surface of the stepped portion. An electrical connection device characterized in that the electronic components are alternately present. According to paragraph 1,
An electrical connection device, wherein the step portion has a plurality of stages, and the electronic component is disposed on an upper surface of each step of the step portion and/or a wall surface. According to paragraph 2,
An electrical connection device, wherein the first wiring includes a second wiring passing through the top surface of the connection board, the surface of the step portion, the side surface, and the bottom surface.

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