KR20240067051A - 열 경화성 조성물, 수지 필름, 프리프레그, 금속 피복 적층판, 및 프린트 배선판 - Google Patents
열 경화성 조성물, 수지 필름, 프리프레그, 금속 피복 적층판, 및 프린트 배선판 Download PDFInfo
- Publication number
- KR20240067051A KR20240067051A KR1020237039903A KR20237039903A KR20240067051A KR 20240067051 A KR20240067051 A KR 20240067051A KR 1020237039903 A KR1020237039903 A KR 1020237039903A KR 20237039903 A KR20237039903 A KR 20237039903A KR 20240067051 A KR20240067051 A KR 20240067051A
- Authority
- KR
- South Korea
- Prior art keywords
- polyphenylene ether
- mass
- thermosetting composition
- parts
- peroxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/14—Peroxides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F212/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
- C08F212/34—Monomers containing two or more unsaturated aliphatic radicals
- C08F212/36—Divinylbenzene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F226/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
- C08F226/06—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F290/00—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
- C08F290/02—Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
- C08F290/06—Polymers provided for in subclass C08G
- C08F290/062—Polyethers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
- C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
- C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
- C08L71/12—Polyphenylene oxides
- C08L71/126—Polyphenylene oxides modified by chemical after-treatment
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Chemical & Material Sciences (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Reinforced Plastic Materials (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JPJP-P-2021-149023 | 2021-09-14 | ||
| JP2021149023 | 2021-09-14 | ||
| PCT/JP2022/034019 WO2023042780A1 (ja) | 2021-09-14 | 2022-09-12 | 熱硬化性組成物、樹脂フィルム、プリプレグ、金属張積層板、及びプリント配線板 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240067051A true KR20240067051A (ko) | 2024-05-16 |
Family
ID=85602865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237039903A Pending KR20240067051A (ko) | 2021-09-14 | 2022-09-12 | 열 경화성 조성물, 수지 필름, 프리프레그, 금속 피복 적층판, 및 프린트 배선판 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2023042780A1 (https=) |
| KR (1) | KR20240067051A (https=) |
| CN (1) | CN117242108A (https=) |
| TW (1) | TW202323434A (https=) |
| WO (1) | WO2023042780A1 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117362979B (zh) * | 2023-10-31 | 2024-06-07 | 创合新材料科技江苏有限公司 | 一种无卤阻燃ppo复合材料及其制备方法 |
| WO2025205423A1 (ja) * | 2024-03-29 | 2025-10-02 | 日油株式会社 | 硬化剤、熱硬化性組成物、樹脂フィルム、プリプレグ、金属張積層板及び硬化剤の製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008033612A1 (en) | 2006-09-15 | 2008-03-20 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether) composition, method and article |
| JP2019172725A (ja) | 2018-03-27 | 2019-10-10 | 旭化成株式会社 | 樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板 |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA2209525A1 (en) * | 1996-07-12 | 1998-01-12 | Frederic Freeman Nelson | Peroxides |
| JP2003221409A (ja) * | 2002-01-30 | 2003-08-05 | Kayaku Akzo Corp | アクリル樹脂の製造方法 |
| CN112724640B (zh) * | 2020-12-25 | 2022-09-16 | 广东生益科技股份有限公司 | 一种热固性树脂组合物、使用其的半固化片与覆铜箔层压板 |
-
2022
- 2022-09-12 TW TW111134352A patent/TW202323434A/zh unknown
- 2022-09-12 JP JP2023548453A patent/JPWO2023042780A1/ja active Pending
- 2022-09-12 KR KR1020237039903A patent/KR20240067051A/ko active Pending
- 2022-09-12 WO PCT/JP2022/034019 patent/WO2023042780A1/ja not_active Ceased
- 2022-09-12 CN CN202280029049.2A patent/CN117242108A/zh active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008033612A1 (en) | 2006-09-15 | 2008-03-20 | Sabic Innovative Plastics Ip B.V. | Poly(arylene ether) composition, method and article |
| JP2019172725A (ja) | 2018-03-27 | 2019-10-10 | 旭化成株式会社 | 樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN117242108A (zh) | 2023-12-15 |
| TW202323434A (zh) | 2023-06-16 |
| JPWO2023042780A1 (https=) | 2023-03-23 |
| WO2023042780A1 (ja) | 2023-03-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| A201 | Request for examination | ||
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |