KR20240067051A - 열 경화성 조성물, 수지 필름, 프리프레그, 금속 피복 적층판, 및 프린트 배선판 - Google Patents

열 경화성 조성물, 수지 필름, 프리프레그, 금속 피복 적층판, 및 프린트 배선판 Download PDF

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Publication number
KR20240067051A
KR20240067051A KR1020237039903A KR20237039903A KR20240067051A KR 20240067051 A KR20240067051 A KR 20240067051A KR 1020237039903 A KR1020237039903 A KR 1020237039903A KR 20237039903 A KR20237039903 A KR 20237039903A KR 20240067051 A KR20240067051 A KR 20240067051A
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KR
South Korea
Prior art keywords
polyphenylene ether
mass
thermosetting composition
parts
peroxide
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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KR1020237039903A
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English (en)
Korean (ko)
Inventor
가나코 다쿠마
마사키 하야시
Original Assignee
니치유 가부시키가이샤
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Application filed by 니치유 가부시키가이샤 filed Critical 니치유 가부시키가이샤
Publication of KR20240067051A publication Critical patent/KR20240067051A/ko
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/14Peroxides
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00Layered products comprising a layer of metal
    • B32B15/04Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F212/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C08F212/34Monomers containing two or more unsaturated aliphatic radicals
    • C08F212/36Divinylbenzene
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F226/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen
    • C08F226/06Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a single or double bond to nitrogen or by a heterocyclic ring containing nitrogen by a heterocyclic ring containing nitrogen
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F290/00Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups
    • C08F290/02Macromolecular compounds obtained by polymerising monomers on to polymers modified by introduction of aliphatic unsaturated end or side groups on to polymers modified by introduction of unsaturated end groups
    • C08F290/06Polymers provided for in subclass C08G
    • C08F290/062Polyethers
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08LCOMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12Polyphenylene oxides
    • C08L71/126Polyphenylene oxides modified by chemical after-treatment
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/03Use of materials for the substrate
    • H05K1/0313Organic insulating material
    • H05K1/0353Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • General Chemical & Material Sciences (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Reinforced Plastic Materials (AREA)
KR1020237039903A 2021-09-14 2022-09-12 열 경화성 조성물, 수지 필름, 프리프레그, 금속 피복 적층판, 및 프린트 배선판 Pending KR20240067051A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-149023 2021-09-14
JP2021149023 2021-09-14
PCT/JP2022/034019 WO2023042780A1 (ja) 2021-09-14 2022-09-12 熱硬化性組成物、樹脂フィルム、プリプレグ、金属張積層板、及びプリント配線板

Publications (1)

Publication Number Publication Date
KR20240067051A true KR20240067051A (ko) 2024-05-16

Family

ID=85602865

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237039903A Pending KR20240067051A (ko) 2021-09-14 2022-09-12 열 경화성 조성물, 수지 필름, 프리프레그, 금속 피복 적층판, 및 프린트 배선판

Country Status (5)

Country Link
JP (1) JPWO2023042780A1 (https=)
KR (1) KR20240067051A (https=)
CN (1) CN117242108A (https=)
TW (1) TW202323434A (https=)
WO (1) WO2023042780A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117362979B (zh) * 2023-10-31 2024-06-07 创合新材料科技江苏有限公司 一种无卤阻燃ppo复合材料及其制备方法
WO2025205423A1 (ja) * 2024-03-29 2025-10-02 日油株式会社 硬化剤、熱硬化性組成物、樹脂フィルム、プリプレグ、金属張積層板及び硬化剤の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008033612A1 (en) 2006-09-15 2008-03-20 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) composition, method and article
JP2019172725A (ja) 2018-03-27 2019-10-10 旭化成株式会社 樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2209525A1 (en) * 1996-07-12 1998-01-12 Frederic Freeman Nelson Peroxides
JP2003221409A (ja) * 2002-01-30 2003-08-05 Kayaku Akzo Corp アクリル樹脂の製造方法
CN112724640B (zh) * 2020-12-25 2022-09-16 广东生益科技股份有限公司 一种热固性树脂组合物、使用其的半固化片与覆铜箔层压板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008033612A1 (en) 2006-09-15 2008-03-20 Sabic Innovative Plastics Ip B.V. Poly(arylene ether) composition, method and article
JP2019172725A (ja) 2018-03-27 2019-10-10 旭化成株式会社 樹脂組成物、プリプレグ、金属張積層板、及びプリント配線板

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Publication number Publication date
CN117242108A (zh) 2023-12-15
TW202323434A (zh) 2023-06-16
JPWO2023042780A1 (https=) 2023-03-23
WO2023042780A1 (ja) 2023-03-23

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