KR20240060666A - 전자파 차폐 재료, 피복재 또는 외장재 및 전기ㆍ전자 기기 - Google Patents
전자파 차폐 재료, 피복재 또는 외장재 및 전기ㆍ전자 기기 Download PDFInfo
- Publication number
- KR20240060666A KR20240060666A KR1020247012692A KR20247012692A KR20240060666A KR 20240060666 A KR20240060666 A KR 20240060666A KR 1020247012692 A KR1020247012692 A KR 1020247012692A KR 20247012692 A KR20247012692 A KR 20247012692A KR 20240060666 A KR20240060666 A KR 20240060666A
- Authority
- KR
- South Korea
- Prior art keywords
- film
- electromagnetic wave
- plating
- nickel
- wave shielding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
- B32B15/013—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium
- B32B15/015—Layered products comprising a layer of metal all layers being exclusively metallic one layer being formed of an iron alloy or steel, another layer being formed of a metal other than iron or aluminium the said other metal being copper or nickel or an alloy thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0088—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a plurality of shielding layers; combining different shielding material structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
- H01F1/14708—Fe-Ni based alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F1/00—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties
- H01F1/01—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials
- H01F1/03—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity
- H01F1/12—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials
- H01F1/14—Magnets or magnetic bodies characterised by the magnetic materials therefor; Selection of materials for their magnetic properties of inorganic materials characterised by their coercivity of soft-magnetic materials metals or alloys
- H01F1/147—Alloys characterised by their composition
- H01F1/153—Amorphous metallic alloys, e.g. glassy metals
- H01F1/15316—Amorphous metallic alloys, e.g. glassy metals based on Co
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0075—Magnetic shielding materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0073—Shielding materials
- H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
- H05K9/0084—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising a single continuous metallic layer on an electrically insulating supporting structure, e.g. metal foil, film, plating coating, electro-deposition, vapour-deposition
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Power Engineering (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022032141 | 2022-03-02 | ||
| JPJP-P-2022-032141 | 2022-03-02 | ||
| PCT/JP2022/039178 WO2023166783A1 (ja) | 2022-03-02 | 2022-10-20 | 電磁波遮蔽材料、被覆材又は外装材及び電気・電子機器 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240060666A true KR20240060666A (ko) | 2024-05-08 |
Family
ID=87883654
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247012692A Ceased KR20240060666A (ko) | 2022-03-02 | 2022-10-20 | 전자파 차폐 재료, 피복재 또는 외장재 및 전기ㆍ전자 기기 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20250185225A1 (https=) |
| EP (1) | EP4489540A4 (https=) |
| JP (1) | JP7697133B2 (https=) |
| KR (1) | KR20240060666A (https=) |
| CN (1) | CN118077322A (https=) |
| TW (2) | TW202543362A (https=) |
| WO (1) | WO2023166783A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025076205A (ja) * | 2023-11-01 | 2025-05-15 | 株式会社プロテリアル | シールド材 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021028940A (ja) | 2019-08-09 | 2021-02-25 | 東洋インキScホールディングス株式会社 | ノイズ抑制シートおよび積層体 |
Family Cites Families (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62256498A (ja) * | 1986-04-30 | 1987-11-09 | 川崎製鉄株式会社 | 電磁波シ−ルド効果に優れた複合金属薄帯 |
| JP2007332408A (ja) | 2006-06-13 | 2007-12-27 | Sumitomo Metal Mining Co Ltd | 成型体およびその製造方法 |
| JP2007335619A (ja) | 2006-06-15 | 2007-12-27 | Sumitomo Metal Mining Co Ltd | 電磁波シールド成形体の製造方法 |
| JP2010206182A (ja) | 2009-02-05 | 2010-09-16 | Toshiba Corp | 電磁シールドシート |
| JP5581163B2 (ja) * | 2010-09-30 | 2014-08-27 | 日東電工株式会社 | ワイヤレス電力伝送用電磁波シールドシート |
| JP6379071B2 (ja) * | 2015-06-15 | 2018-08-22 | Jx金属株式会社 | 電磁波シールド材 |
| JP6058182B1 (ja) * | 2015-07-27 | 2017-01-11 | Jx金属株式会社 | キャリア付銅箔、積層体、プリント配線板の製造方法及び電子機器の製造方法 |
| JP6706897B2 (ja) | 2015-10-16 | 2020-06-10 | 日東電工株式会社 | 導電性フィルム及びその製造方法 |
| CN105307465B (zh) * | 2015-11-17 | 2018-06-22 | 华东师范大学 | 一种电磁防干扰复合层结构及其装置 |
| WO2018145780A1 (de) * | 2017-02-09 | 2018-08-16 | Wickeder Westfalenstahl Gmbh | Verwendung eines werkstoffs, gebrauchsgegenstand, vorzugsweise elektrotechnisches gerät, sowie verbundwerkstoff |
-
2022
- 2022-10-20 EP EP22929927.6A patent/EP4489540A4/en active Pending
- 2022-10-20 WO PCT/JP2022/039178 patent/WO2023166783A1/ja not_active Ceased
- 2022-10-20 KR KR1020247012692A patent/KR20240060666A/ko not_active Ceased
- 2022-10-20 US US18/840,130 patent/US20250185225A1/en active Pending
- 2022-10-20 JP JP2024504359A patent/JP7697133B2/ja active Active
- 2022-10-20 CN CN202280067860.XA patent/CN118077322A/zh active Pending
- 2022-11-14 TW TW114109078A patent/TW202543362A/zh unknown
- 2022-11-14 TW TW111143384A patent/TWI910391B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021028940A (ja) | 2019-08-09 | 2021-02-25 | 東洋インキScホールディングス株式会社 | ノイズ抑制シートおよび積層体 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4489540A1 (en) | 2025-01-08 |
| EP4489540A4 (en) | 2025-06-25 |
| CN118077322A (zh) | 2024-05-24 |
| TWI910391B (zh) | 2026-01-01 |
| TW202337297A (zh) | 2023-09-16 |
| US20250185225A1 (en) | 2025-06-05 |
| JPWO2023166783A1 (https=) | 2023-09-07 |
| JP7697133B2 (ja) | 2025-06-23 |
| TW202543362A (zh) | 2025-11-01 |
| WO2023166783A1 (ja) | 2023-09-07 |
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| KR20240060666A (ko) | 전자파 차폐 재료, 피복재 또는 외장재 및 전기ㆍ전자 기기 | |
| JP7833481B2 (ja) | 金属樹脂複合電磁波シールド材料 | |
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| JP2016076664A (ja) | 電磁波シールド材 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| P13-X000 | Application amended |
St.27 status event code: A-2-2-P10-P13-nap-X000 |
|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| PN2301 | Change of applicant |
St.27 status event code: A-3-3-R10-R13-asn-PN2301 St.27 status event code: A-3-3-R10-R11-asn-PN2301 |
|
| E902 | Notification of reason for refusal | ||
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |
|
| P11 | Amendment of application requested |
Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| P11-X000 | Amendment of application requested |
St.27 status event code: A-2-2-P10-P11-nap-X000 |
|
| B15 | Application refused following examination |
Free format text: ST27 STATUS EVENT CODE: N-2-6-B10-B15-EXM-PE0601 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PE0601 | Decision on rejection of patent |
St.27 status event code: N-2-6-B10-B15-exm-PE0601 |