KR20240046214A - 메인터넌스 방법 및 전자 부품의 제조 방법 - Google Patents

메인터넌스 방법 및 전자 부품의 제조 방법 Download PDF

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Publication number
KR20240046214A
KR20240046214A KR1020247007600A KR20247007600A KR20240046214A KR 20240046214 A KR20240046214 A KR 20240046214A KR 1020247007600 A KR1020247007600 A KR 1020247007600A KR 20247007600 A KR20247007600 A KR 20247007600A KR 20240046214 A KR20240046214 A KR 20240046214A
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KR
South Korea
Prior art keywords
camera
optical inspection
inspection
electronic component
cutting device
Prior art date
Application number
KR1020247007600A
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English (en)
Korean (ko)
Inventor
카즈미 나카무라
다카토시 오제키
고키 사카타
나오미 후지와라
하지메 와타나베
Original Assignee
토와 가부시기가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 토와 가부시기가이샤 filed Critical 토와 가부시기가이샤
Publication of KR20240046214A publication Critical patent/KR20240046214A/ko

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
    • H01L22/24—Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Dicing (AREA)
KR1020247007600A 2021-09-09 2022-05-30 메인터넌스 방법 및 전자 부품의 제조 방법 KR20240046214A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021147030A JP2023039754A (ja) 2021-09-09 2021-09-09 メンテナンス方法、及び電子部品の製造方法
JPJP-P-2021-147030 2021-09-09
PCT/JP2022/021903 WO2023037671A1 (ja) 2021-09-09 2022-05-30 メンテナンス方法、及び電子部品の製造方法

Publications (1)

Publication Number Publication Date
KR20240046214A true KR20240046214A (ko) 2024-04-08

Family

ID=85506393

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247007600A KR20240046214A (ko) 2021-09-09 2022-05-30 메인터넌스 방법 및 전자 부품의 제조 방법

Country Status (5)

Country Link
JP (1) JP2023039754A (ja)
KR (1) KR20240046214A (ja)
CN (1) CN117730399A (ja)
TW (1) TWI835241B (ja)
WO (1) WO2023037671A1 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019201143A (ja) 2018-05-17 2019-11-21 株式会社ディスコ 検査治具及び検査方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101438397B (zh) * 2006-05-09 2011-03-30 东京毅力科创株式会社 拍摄位置校正方法、拍摄方法及基板拍摄装置
KR101281454B1 (ko) * 2010-10-13 2013-07-03 주식회사 고영테크놀러지 측정장치 및 이의 보정방법
JP5222430B1 (ja) * 2012-10-19 2013-06-26 株式会社イノテック 寸法計測装置、寸法計測方法及び寸法計測装置用のプログラム
US20190122388A1 (en) * 2017-04-17 2019-04-25 Cognex Corporation High-accuracy calibration system and method
JP6961394B2 (ja) * 2017-05-31 2021-11-05 株式会社キーエンス 画像検査装置、画像検査方法、画像検査装置の設定方法、画像検査プログラム、画像装置の設定検査プログラム及びコンピュータで読み取り可能な記録媒体並びに記録した機器
JP6968762B2 (ja) * 2018-07-23 2021-11-17 Ｔｏｗａ株式会社 搬送機構、電子部品製造装置、搬送方法および電子部品の製造方法
JP7181028B2 (ja) * 2018-09-03 2022-11-30 株式会社ディスコ 加工装置のメンテナンス方法および加工装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019201143A (ja) 2018-05-17 2019-11-21 株式会社ディスコ 検査治具及び検査方法

Also Published As

Publication number Publication date
CN117730399A (zh) 2024-03-19
TWI835241B (zh) 2024-03-11
WO2023037671A1 (ja) 2023-03-16
TW202312307A (zh) 2023-03-16
JP2023039754A (ja) 2023-03-22

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