KR20240038988A - Wafer vacuum pick-up device - Google Patents

Wafer vacuum pick-up device Download PDF

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Publication number
KR20240038988A
KR20240038988A KR1020247005238A KR20247005238A KR20240038988A KR 20240038988 A KR20240038988 A KR 20240038988A KR 1020247005238 A KR1020247005238 A KR 1020247005238A KR 20247005238 A KR20247005238 A KR 20247005238A KR 20240038988 A KR20240038988 A KR 20240038988A
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South Korea
Prior art keywords
wafer
vacuum
container
control valve
vacuum suction
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KR1020247005238A
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Korean (ko)
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박종익
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주식회사 세정로봇
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J11/00—Manipulators not otherwise provided for
    • B25J11/0095—Manipulators transporting wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/0033—Gripping heads and other end effectors with gripping surfaces having special shapes
    • B25J15/0038—Cylindrical gripping surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
    • B25J—MANIPULATORS; CHAMBERS PROVIDED WITH MANIPULATION DEVICES
    • B25J15/00—Gripping heads and other end effectors
    • B25J15/06—Gripping heads and other end effectors with vacuum or magnetic holding means
    • B25J15/0616—Gripping heads and other end effectors with vacuum or magnetic holding means with vacuum
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

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  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

본 발명은 웨이퍼 진공 픽업장치에 관한 것으로, 보다 상세하게는 수조에 담겨진 웨이퍼를 픽업할 때, 진공 흡착에 의한 흡착자국이 생기는 것을 방지하기 위한 웨이퍼 진공 픽업장치에 관한 것이다.The present invention relates to a wafer vacuum pickup device, and more specifically, to a wafer vacuum pickup device for preventing adsorption marks from occurring due to vacuum adsorption when picking up a wafer contained in a water tank.

Description

웨이퍼 진공 픽업장치Wafer vacuum pick-up device

본 발명은 웨이퍼 진공 픽업장치에 관한 것으로, 보다 상세하게는 수조에 담겨진 웨이퍼를 픽업할 때, 웨이퍼에 진공 흡착에 의한 흡착자국이 생기는 것을 방지하기 위한 웨이퍼 진공 픽업장치에 관한 것이다.The present invention relates to a wafer vacuum pickup device, and more specifically, to a wafer vacuum pickup device for preventing adsorption marks due to vacuum adsorption on the wafer when picking up a wafer contained in a water tank.

일반적으로 웨이퍼는 절단공정, 연마공정, 세정공정 등 다수의 세부 공정을 거쳐서 제조된다.In general, wafers are manufactured through a number of detailed processes, including cutting, polishing, and cleaning processes.

각 공정 사이에는 웨이퍼를 픽업하여 이송시키기 위한 픽업장치가 배치되며, 일반적으로 물리적인 파지동작에 의한 픽업장치보다는 진공 흡착을 이용한 픽업장치가 더 많이 이용되고 있다.A pick-up device is placed between each process to pick up and transport the wafer, and generally, a pick-up device using vacuum adsorption is used more than a pick-up device using a physical gripping operation.

웨이퍼를 보다 빠르고, 안정적으로 픽업하기 위해서 한국등록특허 제10-0912432호 "웨이퍼 이송장치 및 그 이송방법"과 같이 다양한 기술이 개발되고 있으며, 구조적으로 간단하고 웨이퍼의 손상을 방지하기 위해서 흡착 패드를 통해 진공 흡입하여 픽업하는 방법이 가장 많이 이용되고 있다.In order to pick up wafers more quickly and stably, various technologies are being developed, such as Korean Patent No. 10-0912432 "Wafer transfer device and method for transferring the same," and a suction pad is used to keep the structure simple and prevent damage to the wafer. The most commonly used method is to pick up by vacuum suction.

하지만, 종래의 흡착 패드는 진공 흡착 후 진공 흡착 자국이 형성되는 문제점이 있었다.However, the conventional suction pad had a problem in that vacuum suction marks were formed after vacuum suction.

특히, 웨이퍼의 면은 가공이 이루어지는 면이므로 미세한 자국에 의해서 제조 품질이 달라지는 문제점이 있었다.In particular, since the surface of the wafer is the surface on which processing takes place, there was a problem in that manufacturing quality varied due to fine marks.

이에 따라, 면의 손상을 최소화하면서 웨이퍼를 픽업하기 위한 기술개발의 필요성이 제기되고 있다.Accordingly, there is a need to develop technology to pick up wafers while minimizing surface damage.

본 발명의 목적은 상술한 바와 같은 문제점을 해결하기 위해 안출된 것으로서, 수조에 담긴 웨이퍼를 픽업할 때, 웨이퍼에 진공 흡착자국이 형성되는 것을 방지하기 위한 웨이퍼 진공 픽업장치를 제공하는 것이다.The purpose of the present invention is to solve the problems described above, and to provide a wafer vacuum pickup device to prevent vacuum adsorption marks from being formed on the wafer when picking up a wafer contained in a water tank.

상기 목적을 달성하기 위해 본 발명에 따른 웨이퍼 진공 픽업장치는 이송 로봇에 결합되는 핸드 몸체와 핸드 몸체의 하부에 배치되어 하면이 호 형태를 가지는 픽업부와 상기 픽업부의 하면에 일측으로 단차가 형성되어 픽업할 웨이퍼의 일측 가장자리가 밀착되는 거치부와 상기 픽업부의 하면에 형성되어 픽업할 웨이퍼의 측면을 진공 흡착시키는 진공흡입부를 포함하는 것을 특징으로 한다.In order to achieve the above object, the wafer vacuum pick-up device according to the present invention is disposed on the hand body coupled to the transfer robot and the lower part of the hand body, and has a pickup part whose lower surface has an arc shape and a step is formed on one side on the lower surface of the pickup part. It is characterized in that it includes a mounting part in close contact with one edge of the wafer to be picked up, and a vacuum suction part formed on the lower surface of the pickup part to vacuum suction the side of the wafer to be picked up.

또한, 상기 거치부는 거치부의 하면에서부터 거치부의 타면을따라 진공흡입부로 연장되는 소정의 깊이를 가지는 흡입 유로를 더 포함하는 것을 특징으로 한다.In addition, the mounting portion is characterized in that it further includes a suction passage having a predetermined depth extending from the lower surface of the mounting portion to the vacuum suction portion along the other surface of the mounting portion.

또한, 상기 진공흡입부를 통해 흡입되는 유체를 복수 개의 용기 중 어느 하나로 선택적으로 보내기 위한 제어밸브와 상기 제어밸브에 의해 연결된 용기에 진공압을 형성시켜주기 위해 각 용기에 연결되는 진공펌프를 더 포함하는 것을 특징으로 한다.In addition, it further includes a control valve for selectively sending the fluid sucked through the vacuum suction unit to one of the plurality of containers, and a vacuum pump connected to each container to generate vacuum pressure in the container connected by the control valve. It is characterized by

또한, 상기 진공흡입부를 통해 흡입되는 유체를 복수 개의 용기 중 어느 하나로 선택적으로 보내기 위한 제어밸브와 상기 제어밸브에 의해 연결된 용기에 진공압을 형성시켜주기 위해 각 용기에 연결되는 진공펌프와 상기 제어밸브에 의해 선택되지 않은 다른 용기에 수용된 유체를 배출시켜주기 위해 각 용기에 연결되는 배출펌프를 더 포함하는 것을 특징으로 한다.In addition, a control valve for selectively sending the fluid sucked through the vacuum suction unit to one of a plurality of containers, a vacuum pump connected to each container to create vacuum pressure in the container connected by the control valve, and the control valve It further comprises a discharge pump connected to each container to discharge fluid contained in another container not selected by.

상술한 바와 같이, 본 발명에 따른 웨이퍼 진공 픽업장치에 의하면, 웨이퍼의 측면 가장자리를 따라 진공흡착함으로써, 웨이퍼에 진공 흡착자국이 형성되는 것을 최소화할 수 있는 효과가 있다.As described above, according to the wafer vacuum pickup device according to the present invention, there is an effect of minimizing the formation of vacuum adsorption marks on the wafer by vacuum adsorption along the side edge of the wafer.

도 1은 본 발명에 따른 웨이퍼 진공 픽업장치와 수조에 담긴 웨이퍼를 도시한 도면.
도 2는 본 발명에 따른 웨이퍼 진공 픽업장치를 통해 웨이퍼를 픽업하는 동작을 도시한 도면.
도 3은 본 발명에 따른 웨이퍼 진공 픽업장치를 통해 픽업된 웨이퍼를 도시한 도면.
도 4는 본 발명에 따른 웨이퍼 진공 픽업장치를 도시한 도면.
도 5는 본 발명에 따른 웨이퍼 진공 픽업장치의 종단면을 도시한 도면.
도 6은 본 발명에 따른 웨이퍼 진공 픽업장치를 간략하게 도시한 개념도.
1 : 핸드 몸체
2 : 픽업부
3 : 거치부
4 : 흡입 유로
11 : 진공흡입부
12 : 제어밸브
13a, 13b : 용기
14a, 14b : 진공펌프
100 : 웨이퍼 1 is a view showing a wafer vacuum pickup device and a wafer contained in a water tank according to the present invention.
Figure 2 is a diagram showing the operation of picking up a wafer through a wafer vacuum pick-up device according to the present invention.
Figure 3 is a diagram showing a wafer picked up through a wafer vacuum pick-up device according to the present invention.
Figure 4 is a diagram showing a wafer vacuum pickup device according to the present invention.
Figure 5 is a diagram showing a longitudinal cross-section of the wafer vacuum pickup device according to the present invention.
Figure 6 is a conceptual diagram briefly showing a wafer vacuum pickup device according to the present invention.
1: Hand body
2: pickup unit
3: Holder
4: suction flow path
11: Vacuum suction part
12: Control valve
13a, 13b: container
14a, 14b: Vacuum pump
100: wafer

본 명세서에 개시되어 있는 본 발명의 개념에 따른 실시 예들에 대해서 특정한 구조적 또는 기능적 설명은 단지 본 발명의 개념에 따른 실시 예들을 설명하기 위한 목적으로 예시된 것으로서, 본 발명의 개념에 따른 실시 예들은 다양한 형태들로 실시될 수 있으며 본 명세서에 설명된 실시 예들에 한정되지 않는다.Specific structural or functional descriptions of the embodiments according to the concept of the present invention disclosed in this specification are merely illustrative for the purpose of explaining the embodiments according to the concept of the present invention, and the embodiments according to the concept of the present invention are It may be implemented in various forms and is not limited to the embodiments described herein.

본 발명의 개념에 따른 실시 예들은 다양한 변경들을 가할 수 있고 여러 가지 형태들을 가질 수 있으므로 실시 예들을 도면에 예시하고 본 명세서에서 상세하게 설명하고자 한다. 그러나, 이는 본 발명의 개념에 따른 실시 예들을 특정한 개시 형태들에 대해 한정하려는 것이 아니며, 본 발명의 사상 및 기술 범위에 포함되는 모든 변경, 균등물, 또는 대체물을 포함한다.Since the embodiments according to the concept of the present invention can make various changes and have various forms, the embodiments will be illustrated in the drawings and described in detail in this specification. However, this is not intended to limit the embodiments according to the concept of the present invention to specific disclosed forms, and includes all changes, equivalents, or substitutes included in the spirit and technical scope of the present invention.

이하, 본 발명의 바람직한 실시예를 첨부된 도면을 참조하여 설명하면 다음과 같다.Hereinafter, preferred embodiments of the present invention will be described with reference to the attached drawings.

도 1은 본 발명에 따른 웨이퍼 진공 픽업장치와 수조에 담긴 웨이퍼를 도시한 도면이며, 도 2는 본 발명에 따른 웨이퍼 진공 픽업장치를 통해 웨이퍼를 픽업하는 동작을 도시한 도면이고, 도 3은 본 발명에 따른 웨이퍼 진공 픽업장치를 통해 픽업된 웨이퍼를 도시한 도면이며, 도 4는 본 발명에 따른 웨이퍼 진공 픽업장치를 도시한 도면이고, 도 5는 본 발명에 따른 웨이퍼 진공 픽업장치의 종단면을 도시한 도면이며, 도 6은 본 발명에 따른 웨이퍼 진공 픽업장치를 간략하게 도시한 개념도이다.Figure 1 is a diagram showing a wafer vacuum pickup device according to the present invention and a wafer contained in a water tank, Figure 2 is a diagram showing the operation of picking up a wafer through the wafer vacuum pickup device according to the present invention, and Figure 3 is a diagram showing the operation of picking up a wafer through the wafer vacuum pickup device according to the present invention. It is a diagram showing a wafer picked up through a wafer vacuum pickup device according to the present invention, Figure 4 is a diagram showing a wafer vacuum pickup device according to the present invention, and Figure 5 is a longitudinal cross-section of the wafer vacuum pickup device according to the present invention. It is a drawing, and FIG. 6 is a conceptual diagram briefly showing the wafer vacuum pickup device according to the present invention.

도 1에 도시된 바와 같이, 본 발명에 따른 웨이퍼 진공 픽업장치는 DI워터 또는 세정액 등의 물(W)이 담긴 수조(101)에 잠겨진 웨이퍼(100)를 진공 흡입을 통해 픽업할 때, 웨이퍼(100)의 양면에 진공 흡착에 의한 자국이 형성되는 것을 방지하기 위한 것으로써, 이송 로봇에 결합되는 핸드 몸체(1)와 핸드 몸체(1)의 하부에 배치되어 하면이 호 형태를 가지는 픽업부(2)와 상기 픽업부(2)의 하면에 일측으로 단차가 형성되어 픽업할 웨이퍼(100)의 일측 가장자리가 밀착되는 거치부(3)를 포함하여 구성된다.As shown in FIG. 1, when the wafer vacuum pickup device according to the present invention picks up the wafer 100 immersed in the water tank 101 containing water (W) such as DI water or cleaning solution through vacuum suction, the wafer ( In order to prevent marks from being formed on both sides of the 100) by vacuum adsorption, the hand body 1 coupled to the transfer robot and the pickup part disposed at the lower part of the hand body 1 and having an arc shape on the lower surface ( 2) and a mounting portion 3 in which a step is formed on one side of the lower surface of the pickup portion 2 and one edge of the wafer 100 to be picked up is brought into close contact with it.

상기 거치부(3)는 도 2 또는 도 3에 도시된 바와 같이, 극히 일부만 웨이퍼(100)의 가장자리를 따라 접하여 픽업된 웨이퍼(100)가 흔들리는 것을 방지하게 되며, 웨이퍼(100)는 픽업부(2)의 하면을 따라 형성되는 진공 흡입 압력에 의해 웨이퍼(100)의 측면이 픽업부(2)의 하면에 밀착되어 픽업된다.As shown in Figure 2 or 3, only a small part of the mounting part 3 is in contact with the edge of the wafer 100 to prevent the picked up wafer 100 from shaking, and the wafer 100 is a pickup part ( The side of the wafer 100 is picked up in close contact with the lower surface of the pickup unit 2 by the vacuum suction pressure formed along the lower surface of the wafer 100.

즉, 도 4 또는 도 5에 도시된 바와 같이, 상기 픽업부(2)는 하면에 픽업할 웨이퍼(100)의 측면을 진공 흡착시키는 진공흡입부(4)가 형성되어 웨이퍼(100)의 측면이 진공흡입부(4)의 진공 흡입에 의해 밀착되는 것이다.That is, as shown in FIG. 4 or FIG. 5, the pickup unit 2 has a vacuum suction unit 4 formed on its lower surface to vacuum suction the side of the wafer 100 to be picked up, so that the side of the wafer 100 is It comes into close contact with the vacuum suction of the vacuum suction part (4).

또한, 상기 거치부(3)는 거치부(3)의 하면에서부터 거치부(3)의 타면을따라 진공흡입부(11)로 연장되는 소정의 깊이를 가지는 흡입 유로(4)를 더 포함하도록 구성될 수 있다.In addition, the mounting portion 3 is configured to further include a suction passage 4 having a predetermined depth extending from the lower surface of the mounting portion 3 to the vacuum suction portion 11 along the other surface of the mounting portion 3. It can be.

이를 통해, 상기 진공흡입부(4)의 진공 흡입에 의해 픽업부(2)의 하면에 밀착된 웨이퍼(100)의 일면이 진공흡입부(4)에서부터 흡입 유로(4)를 따라 형성되는 진공압에 의해 거치부(3)에 밀착되면서 웨이퍼(100)가 이송중에 흔들리는 것을 효과적으로 방지하게 된다.Through this, one side of the wafer 100, which is in close contact with the lower surface of the pickup unit 2 due to the vacuum suction of the vacuum suction unit 4, forms a vacuum pressure along the suction passage 4 from the vacuum suction unit 4. This effectively prevents the wafer 100 from shaking during transportation while being in close contact with the mounting portion 3.

또한, 도 6에 도시된 바와 같이, 상기 진공흡입부(11)를 통해 흡입되는 물(W)과 공기를 유체를 복수 개의 용기 중 어느 하나로 선택적으로 보내기 위한 제어밸브(12)와 상기 제어밸브(12)에 의해 연결된 용기(13a, 13b)에 진공압을 형성시켜주기 위해 각 용기에 연결되는 진공펌프(14a, 14b)를 더 포함하도록 구성될 수 있다.In addition, as shown in FIG. 6, a control valve 12 for selectively sending the water (W) and air sucked through the vacuum suction unit 11 to one of a plurality of containers and the control valve ( It may be configured to further include vacuum pumps 14a and 14b connected to each container to generate vacuum pressure in the containers 13a and 13b connected by 12).

보다 상세하게는, 수조에 담긴 웨이퍼의 측면을 진공 흡착하여 이송하는 과정에서 수조에 담긴 물이 공기와 함께 진공 흡입되며, 이를 분리 배출하기 위해서는 진공 흡입된 물을 용기에 저장하게 된다.More specifically, in the process of vacuum adsorbing and transporting the side of a wafer contained in a water tank, the water contained in the water tank is vacuum-sucked along with air, and in order to separate and discharge it, the vacuum-sucked water is stored in a container.

또한, 각 용기는 수용할 수 있는 공간이 한정적이므로, 제어밸브(12)가 복수 개의 용기중 어느 하나를 선택적으로 연결하여 각 용기에 물을 저장하게 되는 것이다.Additionally, since the space that each container can accommodate is limited, the control valve 12 stores water in each container by selectively connecting one of the plurality of containers.

또한, 상기 진공흡입부(11)를 통해 흡입되어 용기(13a, 14b)에 저장된 유체를 배출하거나, 다시 수조로 순환시키기 위해 각 용기에 연결되는 배출펌프를 더 포함하도록 구성될 수도 있다.In addition, it may be configured to further include a discharge pump connected to each container to discharge the fluid sucked through the vacuum suction part 11 and stored in the containers 13a and 14b, or to circulate it back to the water tank.

즉, 상기 제어밸브(12)에 의해 선택되지 않은 다른 용기에 수용된 유체는 배출펌프에 의해 배출되거나, 다시 수조로 순환되는 형태로 반복된다.That is, the fluid contained in another container that is not selected by the control valve 12 is discharged by the discharge pump or circulated back to the water tank.

이상과 같이 본 발명은 첨부된 도면을 참조하여 바람직한 실시예를 중심으로 기술되었지만 당업자라면 이러한 기재로부터 본 발명의 범주를 벗어남이 없이 많은 다양한 자명한 변형이 가능하다는 것은 명백하다. 따라서 본 발명의 범주는 이러한 많은 변형의 예들을 포함하도록 기술된 청구범위에 의해서 해석되어져야 한다.As described above, the present invention has been described focusing on preferred embodiments with reference to the accompanying drawings, but it is clear to those skilled in the art that many obvious modifications can be made without departing from the scope of the present invention from this description. Accordingly, the scope of the present invention should be construed by the appended claims to include examples of many such modifications.

Claims (4)

이송 로봇에 결합되는 핸드 몸체와;
핸드 몸체의 하부에 배치되어 하면이 호 형태를 가지는 픽업부와;
상기 픽업부의 하면에 일측으로 단차가 형성되어 픽업할 웨이퍼의 일측 가장자리가 밀착되는 거치부와;
상기 픽업부의 하면에 형성되어 픽업할 웨이퍼의 측면을 진공 흡착시키는 진공흡입부를 포함하는 것을 특징으로 하는
웨이퍼 진공 픽업장치.A hand body coupled to the transfer robot;
a pickup unit disposed at the lower part of the hand body and having an arc-shaped lower surface;
a mounting portion with a step formed on one side of the lower surface of the pickup portion so that one edge of the wafer to be picked up comes into close contact with it;
Characterized in that it includes a vacuum suction part formed on the lower surface of the pickup unit to vacuum suction the side of the wafer to be picked up.
Wafer vacuum pick-up device. 제 1항에 있어서,
상기 거치부는
거치부의 하면에서부터 거치부의 타면을따라 진공흡입부로 연장되는 소정의 깊이를 가지는 흡입 유로를 더 포함하는 것을 특징으로 하는
웨이퍼 진공 픽업장치.According to clause 1,
The holder is
Characterized in that it further includes a suction passage having a predetermined depth extending from the lower surface of the mounting portion to the vacuum suction portion along the other side of the mounting portion.
Wafer vacuum pick-up device. 제 1항에 있어서,
상기 진공흡입부를 통해 흡입되는 유체를 복수 개의 용기 중 어느 하나로 선택적으로 보내기 위한 제어밸브와;
상기 제어밸브에 의해 연결된 용기에 진공압을 형성시켜주기 위해 각 용기에 연결되는 진공펌프를 더 포함하는 것을 특징으로 하는
웨이퍼 진공 픽업장치.According to clause 1,
a control valve for selectively directing the fluid sucked through the vacuum suction unit to one of a plurality of containers;
Characterized in that it further comprises a vacuum pump connected to each container to generate vacuum pressure in the container connected by the control valve.
Wafer vacuum pick-up device. 제 1항에 있어서,
상기 진공흡입부를 통해 흡입되는 유체를 복수 개의 용기 중 어느 하나로 선택적으로 보내기 위한 제어밸브와;
상기 제어밸브에 의해 연결된 용기에 진공압을 형성시켜주기 위해 각 용기에 연결되는 진공펌프와;
상기 제어밸브에 의해 선택되지 않은 다른 용기에 수용된 유체를 배출시켜주기 위해 각 용기에 연결되는 배출펌프를 더 포함하는 것을 특징으로 하는
웨이퍼 진공 픽업장치.According to clause 1,
a control valve for selectively directing the fluid sucked through the vacuum suction unit to one of a plurality of containers;
a vacuum pump connected to each container to generate vacuum pressure in the container connected by the control valve;
Characterized in that it further comprises a discharge pump connected to each container to discharge fluid contained in another container not selected by the control valve.
Wafer vacuum pick-up device.
KR1020247005238A 2021-10-27 2021-10-27 Wafer vacuum pick-up device KR20240038988A (en)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0693449B2 (en) * 1989-12-25 1994-11-16 佳英 柴野 Drying device for hot water pull-up system
DE69120068T2 (en) * 1990-05-22 1996-11-28 Glasstech Inc VACUUM BENDING OF HEATED GLASS DISCS
JPH07164365A (en) * 1993-12-10 1995-06-27 Fuji Electric Co Ltd Vacuum chuck for conveyer robot
JP3220332B2 (en) * 1994-07-25 2001-10-22 日立電子エンジニアリング株式会社 Air suction holding mechanism for magnetic disk
KR101258404B1 (en) * 2012-01-19 2013-04-26 로체 시스템즈(주) Apparatus for conveyance of glass disk

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