KR20240038743A - 폴리이미드 수지, 당해 폴리이미드 수지를 함유하는 수지 조성물 및 그의 경화물 - Google Patents

폴리이미드 수지, 당해 폴리이미드 수지를 함유하는 수지 조성물 및 그의 경화물 Download PDF

Info

Publication number
KR20240038743A
KR20240038743A KR1020247005154A KR20247005154A KR20240038743A KR 20240038743 A KR20240038743 A KR 20240038743A KR 1020247005154 A KR1020247005154 A KR 1020247005154A KR 20247005154 A KR20247005154 A KR 20247005154A KR 20240038743 A KR20240038743 A KR 20240038743A
Authority
KR
South Korea
Prior art keywords
group
resin
component
compound
polyimide resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020247005154A
Other languages
English (en)
Korean (ko)
Inventor
켄고 니시무라
치에 사사키
류타로 다나카
노리유키 나가시마
Original Assignee
닛뽄 가야쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 닛뽄 가야쿠 가부시키가이샤 filed Critical 닛뽄 가야쿠 가부시키가이샤
Publication of KR20240038743A publication Critical patent/KR20240038743A/ko
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10—Esters
    • C08F220/34—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate
    • C08F220/36—Esters containing nitrogen, e.g. N,N-dimethylaminoethyl (meth)acrylate containing oxygen in addition to the carboxy oxygen, e.g. 2-N-morpholinoethyl (meth)acrylate or 2-isocyanatoethyl (meth)acrylate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1003—Preparatory processes
    • C08G73/1007—Preparatory processes from tetracarboxylic acids or derivatives and diamines
    • C08G73/1021—Preparatory processes from tetracarboxylic acids or derivatives and diamines characterised by the catalyst used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1039—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors comprising halogen-containing substituents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1042—Copolyimides derived from at least two different tetracarboxylic compounds or two different diamino compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1046—Polyimides containing oxygen in the form of ether bonds in the main chain
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1075—Partially aromatic polyimides
    • C08G73/1082—Partially aromatic polyimides wholly aromatic in the tetracarboxylic moiety
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08L79/085—Unsaturated polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C08L2201/08—Stabilised against heat, light or radiation or oxydation
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
KR1020247005154A 2021-08-03 2022-06-01 폴리이미드 수지, 당해 폴리이미드 수지를 함유하는 수지 조성물 및 그의 경화물 Pending KR20240038743A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-127039 2021-08-03
JP2021127039 2021-08-03
PCT/JP2022/022278 WO2023013224A1 (ja) 2021-08-03 2022-06-01 ポリイミド樹脂、該ポリイミド樹脂を含有する樹脂組成物及びその硬化物

Publications (1)

Publication Number Publication Date
KR20240038743A true KR20240038743A (ko) 2024-03-25

Family

ID=85154112

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020247005154A Pending KR20240038743A (ko) 2021-08-03 2022-06-01 폴리이미드 수지, 당해 폴리이미드 수지를 함유하는 수지 조성물 및 그의 경화물

Country Status (6)

Country Link
US (1) US20240343865A1 (https=)
JP (1) JPWO2023013224A1 (https=)
KR (1) KR20240038743A (https=)
CN (1) CN117693544A (https=)
TW (1) TWI892019B (https=)
WO (1) WO2023013224A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7698563B2 (ja) * 2021-11-19 2025-06-25 日本化薬株式会社 樹脂付き銅箔及び銅張積層板
CN117186765B (zh) * 2023-11-08 2024-01-30 成都石大力盾科技有限公司 一种固体自润滑涂层及其制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018168369A (ja) 2017-03-29 2018-11-01 荒川化学工業株式会社 ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4386454B2 (ja) * 2006-08-22 2009-12-16 信越化学工業株式会社 アルカリ水溶液に可溶な感光性ポリイミド樹脂、該樹脂を含む組成物、及び該組成物から得られる膜
KR101966736B1 (ko) * 2015-09-15 2019-04-09 주식회사 엘지화학 변성 폴리이미드 및 이를 포함하는 경화성 수지 조성물
CN113474380A (zh) * 2019-03-15 2021-10-01 日本化药株式会社 聚酰胺酸树脂、聚酰亚胺树脂及含有这些的树脂组合物
KR20200119124A (ko) * 2019-04-09 2020-10-19 주식회사 엘지화학 폴리아미드-이미드 블록 공중합체, 이의 제조방법 및 이를 포함하는 폴리아미드-이미드 필름
US20220204696A1 (en) * 2019-04-26 2022-06-30 Designer Molecules, Inc. Phenolic functionalized polyimides and compositions thereof
JP7367049B2 (ja) * 2019-10-28 2023-10-23 富士フイルム株式会社 パターン形成方法、感光性樹脂組成物、積層体の製造方法、及び、半導体デバイスの製造方法
CN115210648A (zh) * 2020-03-18 2022-10-18 东丽株式会社 感光性树脂组合物、感光性片材、固化膜、固化膜的制造方法、电子部件、天线元件、半导体封装及显示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018168369A (ja) 2017-03-29 2018-11-01 荒川化学工業株式会社 ポリイミド、接着剤、フィルム状接着材、接着層、接着シート、樹脂付銅箔、銅張積層板、プリント配線板、並びに多層配線板及びその製造方法

Also Published As

Publication number Publication date
TWI892019B (zh) 2025-08-01
TW202340323A (zh) 2023-10-16
WO2023013224A1 (ja) 2023-02-09
CN117693544A (zh) 2024-03-12
JPWO2023013224A1 (https=) 2023-02-09
US20240343865A1 (en) 2024-10-17

Similar Documents

Publication Publication Date Title
KR102808317B1 (ko) 폴리암산 수지, 폴리이미드 수지 및 그의 용도
JP7704622B2 (ja) ポリイミド樹脂、該ポリイミド樹脂含有する樹脂組成物及びその硬化物
JP7734667B2 (ja) イソシアネート変性ポリイミド樹脂、樹脂組成物及びその硬化物
CN108690194B (zh) 聚酰亚胺、胶粘剂、胶粘材料、胶粘层、胶粘片、铜箔、覆铜层叠板、布线板及制造方法
KR20160117368A (ko) 접착제 조성물 필름상의 접착제 접착층, 접착 시트, 수지 부착 동박, 동장 적층판, 플렉서블 동장 적층판, 프린트 배선판, 플렉서블 프린트 배선판, 다층 배선판, 인쇄 회로 기판 및 플렉서블 인쇄 회로 기판
KR20240121252A (ko) 이소시아네이트 변성 폴리이미드 수지, 당해 이소시아네이트 변성 폴리이미드 수지를 함유하는 수지 조성물 및 그의 경화물
CN114940757A (zh) 聚酰亚胺树脂组合物、粘接剂组合物及它们的相关制品
TWI892019B (zh) 聚醯亞胺樹脂、含有該聚醯亞胺樹脂之樹脂組成物及其硬化物
JP2023068801A (ja) ポリイミド樹脂組成物及びその硬化物
TWI912565B (zh) 聚醯亞胺樹脂、含有該聚醯亞胺樹脂的樹脂組成物及其硬化物
JP7698563B2 (ja) 樹脂付き銅箔及び銅張積層板
JP7682113B2 (ja) ポリイミド樹脂、該ポリイミド樹脂含有する樹脂組成物及びその硬化物
WO2025063274A1 (ja) ポリイミド樹脂含有組成物及びその硬化物
JP7841953B2 (ja) ポリイミド樹脂組成物及びその硬化物
JP2024139792A (ja) ポリイミド樹脂組成物及びその硬化物
JP2024110549A (ja) ポリイミド樹脂組成物及びその硬化物
JP2023157103A (ja) 変性スチレン系エラストマー、該変性スチレン系エラストマーを含有する樹脂組成物及びその硬化物
WO2024202774A1 (ja) ポリイミド樹脂組成物及びその硬化物

Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20240214

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
A201 Request for examination
PA0201 Request for examination

Patent event code: PA02012R01D

Patent event date: 20241217

Comment text: Request for Examination of Application