KR20240030709A - Device and method for separating driver ic from display panel - Google Patents

Abstract

A device for separating a driving IC from a display panel has a first stage supporting a display panel on which a plurality of pads are formed, and an adhesive resin contained in an anisotropic conductive film that electrically connects the driving IC to the plurality of pads. It includes a laser light source that selectively burns the adhesive resin by irradiating high laser energy.

Description

Apparatus and method for separating driver IC from display panel {DEVICE AND METHOD FOR SEPARATING DRIVER IC FROM DISPLAY PANEL}

The present invention relates to an apparatus and method for separating a driver IC from a display panel, and more particularly, to an apparatus and method for separating a driver IC from a display panel in a flexible display device.

A display device includes a display panel on which an image is displayed, a gate driver for driving the display panel, and a data driver. The gate driver applies a gate signal to the gate lines connected to the plurality of pixels, and the data driver applies a data voltage to the data lines connected to the plurality of pixels.

The data driver and gate driver may be provided as separate integrated circuit chips (IC chips) and may be mounted on a flexible printed circuit board (FPCB) and electrically connected to the display panel, or may be mounted directly on the display panel. It can be.

Display driver IC (DDI) such as data driver and gate driver (hereinafter referred to as 'drive IC') is connected to the electrode pad of the display panel or flexible printed circuit board through an anisotropic conductive film (ACF). Can be electrically connected.

When a defect occurs during the manufacturing process of a display device, the driver IC is separated from the display panel and reassembled (or recycled) to increase production yield. Conventionally, the display panel and driver IC were separated using heat and physical force. High temperature heat is applied to the driving IC for a certain period of time, and when the adhesive strength of the anisotropic conductive film weakens, the driving IC is separated using physical force. For example, turn on the heating tool, let the temperature reach 400℃, place a 0.05mm thick Teflon sheet on the driving IC, and heat the driving IC on the Teflon sheet for 5 seconds with the heating tool. After doing so, apply force as if twisting the heating device to separate the driving IC.

The conventional method of applying high-temperature heat and then separating using physical force cannot be applied to flexible displays, which are plastic panel substrates. Currently, in the case of a defect in a flexible display device, there is no way to separate the display panel and the driver IC, so the entire display device is discarded.

The technical problem to be solved by the present invention is to provide an apparatus and method for separating the flexible display panel and the driving IC from the display panel without damage.

A device for separating a driving IC from a display panel according to an embodiment of the present invention includes a first stage supporting a display panel on which a plurality of pads are formed, and an anisotropic conductive film electrically connecting the driving IC to the plurality of pads. It includes a laser light source that irradiates the included adhesive resin with a laser having a high absorption rate to selectively burn the adhesive resin.

The laser light source may be located below the first stage and irradiate the laser toward the display panel located on the top of the first stage.

The laser may pass through the substrate included in the display panel and the first stage and be absorbed by the adhesive resin.

The laser light source may irradiate the laser in a vertical direction while moving in a horizontal direction.

The laser light source may irradiate the laser to the entire anisotropic conductive film at once using an optical element.

The laser light source may be located on a side of the first stage and irradiate the laser in a horizontal direction to burn the adhesive resin.

The separation device may further include a second stage that adsorbs the driving IC and separates the driving IC from the display panel.

The laser may include a laser in the near-infrared or infrared wavelength range.

A device for separating a driver IC from a display panel according to another embodiment of the present invention includes a first stage supporting a display panel on which a plurality of pads are formed, and an anisotropic conductive film electrically connecting a printed circuit board to the plurality of pads. It includes a laser light source that irradiates a laser with a high absorption rate to the adhesive resin included in and selectively burns the adhesive resin.

The printed circuit board may be a flexible printed circuit board on which a driver IC is mounted.

A method of separating a driver IC from a display panel according to another embodiment of the present invention includes the steps of aligning and arranging a display panel to which the driver IC is bonded by an anisotropic conductive film at a predetermined position on a first stage; It includes selectively burning the adhesive resin included in the anisotropic conductive film by irradiating a laser having a high absorption rate to the adhesive resin, and separating the driving IC from the display panel.

The laser light source may be located below the first stage and irradiate the laser toward the display panel located on the top of the first stage.

The laser may pass through the substrate included in the display panel and the first stage and be absorbed by the adhesive resin.

The laser light source may be located on a side of the first stage and irradiate the laser in a horizontal direction to burn the adhesive resin.

The second stage may adsorb the driving IC and separate the driving IC from the display panel.

The laser may include a laser in the near-infrared or infrared wavelength range.

In a method of separating a driver IC from a display panel according to another embodiment of the present invention, the display panel on which the printed circuit board on which the driver IC is mounted is attached by an anisotropic conductive film is arranged in a predetermined position on the first stage. A laser light source irradiates a laser having a high absorption rate to the adhesive resin included in the anisotropic conductive film to selectively burn the adhesive resin, and separating the printed circuit board from the display panel. .

The flexible display panel and the driving IC can be separated without damage, thereby solving economic losses and environmental problems caused by the disposal of defective flexible display devices.

1 is a plan view schematically showing a display device according to an embodiment.
FIG. 2 is a cross-sectional view of a display device according to an embodiment taken along line II-II′ of FIG. 1 .
Figure 3 is a flowchart showing a method of separating a driver IC from a display panel according to an embodiment of the present invention.
4 to 7 are cross-sectional views showing a method of separating a driver IC from a display panel using a separation device according to an embodiment of the present invention.
Figure 8 is a plan view schematically showing a display device according to another embodiment.
FIG. 9 is a cross-sectional view of a display device of another embodiment taken along line IX-IX' of FIG. 8.

Hereinafter, with reference to the attached drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily practice the present invention. The invention may be implemented in many different forms and is not limited to the embodiments described herein.

In addition, in various embodiments, components having the same configuration will be representatively described in the first embodiment using the same symbols, and in other embodiments, only configurations different from the first embodiment will be described. .

In order to clearly explain the present invention, parts that are not relevant to the description are omitted, and identical or similar components are assigned the same reference numerals throughout the specification.

Since the size and thickness of each component shown in the drawings are arbitrarily shown for convenience of explanation, the present invention is not necessarily limited to what is shown. In the drawing, the thickness is enlarged to clearly express various layers and regions. And in the drawings, for convenience of explanation, the thicknesses of some layers and regions are exaggerated.

When a part of a layer, membrane, region, plate, etc. is said to be "on" or "on" another part, this includes not only being "directly above" the other part, but also cases where there is another part in between. Conversely, when a part is said to be “right on top” of another part, it means that there is no other part in between. In addition, being “on” or “on” a reference part means being located above or below the reference part, and does not necessarily mean being located “above” or “on” the direction opposite to gravity. .

Throughout the specification, when a part is said to “include” a certain element, this means that it may further include other elements rather than excluding other elements, unless specifically stated to the contrary.

Throughout the specification, when we say “on a plane,” this means when the target part is viewed from above, and when we say “on a cross section,” it means when we look at a cross section cut vertically from the target part from the side.

Hereinafter, a display device according to an embodiment will be described with reference to FIGS. 1 and 2.

1 is a plan view schematically showing a display device according to an embodiment. FIG. 2 is a cross-sectional view of a display device according to an embodiment taken along line II-II′ of FIG. 1 .

1 and 2, a display device according to an embodiment may include a substrate 100, a driving IC 200, and an anisotropic conductive film 300 for bonding the substrate 100 and the driving IC 200. You can.

The substrate 100 includes a display area (DA) and a non-display area (NA). The substrate 100 may be made of plastic that has characteristics such as high heat resistance, electrical insulation, flexibility, and non-flammability. For example, the substrate 100 may be made of synthetic resin such as polyimide (PI).

The display area DA includes a plurality of pixels (PX) arranged in the first direction (X) and the second direction (Y), a plurality of data lines 122 connected to the plurality of pixels (PX), and a plurality of gate lines This is the area that displays the image including (123). On a plane, the plurality of gate lines 123 may extend in the first direction (X), and the plurality of data lines 122 may extend in the second direction (Y). The second direction (Y) may be perpendicular to the first direction (X).

The non-display area (NA) is an area where the driver IC 200 is mounted and wiring or circuits for applying signals to the plurality of pixels (PX) are arranged, and is an area where no image is displayed. The non-display area (NA) may surround the display area (DA).

The driving IC 200 may be placed in the non-display area (NA), and the fanout wire 121 connected from the driving IC 200 to the display area (DA) may be placed in the non-display area (NA). there is. The fan-out wire 121 can connect the driver IC 200 and a plurality of data lines 122, and the driver IC 200 applies a data voltage to a plurality of pixels (PX) through the data line 122. It may be a data driving unit. Here, the driver IC 200 is illustrated as a data driver, but depending on the embodiment, the driver IC 200 may be connected to a plurality of gate lines 123 and serve as a gate driver for applying a gate signal. Alternatively, the driving IC 200 may serve to apply a signal such as a light emitting signal or a power supply voltage to a signal line such as a light emitting signal line (not shown) or a voltage line (not shown) connected to a plurality of pixels (PX).

A plurality of pads 110 are formed in the non-display area NA to apply driving signals to the plurality of pixels PX. Signals, voltages, etc. may be applied to the data lines 122, gate lines 123, light emitting signal lines, and voltage lines connected to the plurality of pixels (PX) through the plurality of pads 110. A plurality of pads 110 may be arranged on the substrate 100 . The arrangement direction and form of the plurality of pads 110 are not limited. The plurality of pads 110 are copper (Cu), molybdenum (Mo), aluminum (Al), silver (Ag), platinum (Pt), palladium (Pd), chromium (Cr), tantalum (Ta), and titanium (Ti). ) may include metals such as or alloys thereof.

The driving IC 200 may be mounted on the plurality of pads 110 (third direction (Z)). The driving IC 200 includes a plurality of bumps 210 formed on its lower surface, and may be electrically connected to a plurality of pads 110 through the plurality of bumps 210. The plurality of bumps 210 may be located on the plurality of pads 110 and overlap the plurality of pads 110 .

The substrate 100 and the driving IC 200 may be bonded to each other using an anisotropic conductive film 300 . The anisotropic conductive film 300 may include adhesive resin 310 made in a film state and conductive particles 320 distributed within the adhesive resin 310. The adhesive resin 310 may include an epoxy-based material. The conductive particle 320 has a basic structure of a high molecular polymer coated with a metal film, and an insulating film may be additionally coated on the metal film. The metal film may include metals such as nickel (Ni), aluminum (Al), copper (Cu), lead (Pb), silver (Ag), and gold (Au), or alloys thereof. The conductive particles 320 may be formed in various forms, such as a sphere or a shape with protrusions formed on a spherical surface, or a metal piece having a sharp fragment structure.

An anisotropic conductive film 300 is disposed between the substrate 100 and the driving IC 200, and the driving IC 200 can be bonded to the substrate 100 by applying heat and pressure for a certain period of time. At this time, the conductive particles 320 located between the plurality of bumps 210 of the driving IC 200 and the plurality of pads 110 of the substrate 100 are connected to the plurality of bumps 210 of the driving IC 200 and the substrate. A plurality of pads 110 (100) may be electrically connected.

Hereinafter, an apparatus and method for separating the driver IC 200 from the display panel according to an embodiment of the present invention will be described with reference to FIGS. 3 to 7. The display panel includes a substrate 100 on which a plurality of pixels (PX) and various wiring lines are formed, and may be a flexible display panel.

Figure 3 is a flowchart showing a method of separating a driver IC from a display panel according to an embodiment of the present invention. 4 to 7 are cross-sectional views showing a method of separating a driver IC from a display panel using a separation device according to an embodiment of the present invention.

Referring to FIGS. 3 to 7 , a separation device for separating the driving IC 200 from the display panel may include a first stage 510, a laser light source 520, and a second stage 530.

The first stage 510 may be configured to support the display panel.

The laser light source 520 has a low absorption rate for the bump 210 of the driving IC 200, the pad 110 and metal wiring of the substrate 100, and has a low absorption rate for the adhesive resin 310 of the anisotropic conductive film 300. A laser that is high and can penetrate the substrate 100 can be irradiated. These lasers may include lasers in the Near InfraRed (NIR) or InfraRed (IR) wavelength range.

As illustrated in FIG. 5 , the laser light source 520 is located below the first stage 510 and can radiate laser toward the display panel located on the top of the first stage 510 . At this time, the first stage 510 is made of a material that does not affect the laser, and the laser can pass through the first stage 510. Alternatively, the laser light source 520 may be located on the side of the first stage 510 and radiate laser toward the display panel located on the upper surface of the first stage 510, as illustrated in FIG. 6 .

The second stage 530 is located above the driving IC 200 and serves to fix the display panel and the driving IC 200 during the separation process of the driving IC 200. The laser irradiated from the lower side of the first stage 510 It can perform the role of blocking, adsorbing and separating the driving IC 200, etc. Depending on the embodiment, the second stage 530 may be omitted in the separation device.

As illustrated in FIG. 4, the display panel is aligned and positioned on the first stage 510 (S110). The display panel, in which the driving IC 200 is bonded to the substrate 100 by the anisotropic conductive film 300, may be arranged and aligned at a predetermined position on the first stage 510. The second stage 530 may press the display panel with enough pressure to fix the display panel to which the driving IC 200 is bonded, thereby preventing the display panel from leaving its designated position.

As illustrated in FIG. 5 , the laser light source 520 located below the first stage 510 can selectively burn the adhesive resin 310 by irradiating laser (S120). The laser light source 520 may move in the horizontal direction and irradiate laser in the third direction (Z) (vertical direction) toward the anisotropic conductive film 300. The horizontal direction refers to a direction parallel to the plane of the substrate 100 or the first stage 510, that is, a direction parallel to the plane formed by the first direction (X) and the second direction (Y). The laser may pass through the first stage 510 and the substrate 100 and be absorbed only by the adhesive resin 310 of the anisotropic conductive film 300. The adhesive resin 310 of the anisotropic conductive film 300 that absorbs the energy of the laser is burned and completely loses its adhesive strength. Depending on the embodiment, the laser light source 520 may burn the adhesive resin 310 by irradiating the laser to the entire anisotropic conductive film 300 at once using an optical element such as a beam expander without moving. .

In another embodiment, as illustrated in FIG. 6, the laser light source 520 located on the side of the first stage 510 may selectively burn the adhesive resin 310 by irradiating laser (S120). At this time, the laser light source 520 may burn the adhesive resin 310 by moving in the horizontal direction and radiating laser in the horizontal direction toward the anisotropic conductive film 300. Alternatively, the laser light source 520 may burn the adhesive resin 310 by irradiating a laser to the entire anisotropic conductive film 300 at once using an optical element such as a beam expander without moving.

As illustrated in FIG. 7 , after the adhesive resin 310 is burned and loses adhesive strength, the display panel and the driving IC 200 can be separated (S130). The second stage 530 can separate the driving IC 200 from the display panel by adsorbing the driving IC 200 and moving it in the third direction (Z). Since the adhesive resin 310 has lost its adhesive strength, no direct physical force is applied to the display panel and the driving IC 200. Accordingly, the display panel and the driving IC 200 can be separated without damage, and the display panel and the driving IC 200 can be recycled. Depending on the embodiment, the display panel and the driving IC 200 are separated by the operator directly moving the driving IC 200 without using the second stage 530, or the display panel is moved by gravity by tilting or flipping the display panel. The driving IC 200 may be separated from the.

The above-described separation device and method for separating the driving IC 200 from the display panel can be used in the process of separating the display panel and the printed circuit board bonded with the anisotropic conductive film 300.

Hereinafter, a display device according to another embodiment will be described with reference to FIGS. 8 and 9, and a method of separating the printed circuit board from the display panel will be described.

Figure 8 is a plan view schematically showing a display device according to another embodiment. FIG. 9 is a cross-sectional view of a display device of another embodiment taken along line IX-IX' of FIG. 8.

Referring to FIGS. 8 and 9 , a display device according to another embodiment may include a substrate 100 and a printed circuit board 400. At this time, the driving IC 200 described above in the embodiments of FIGS. 1 and 2 may be mounted on the printed circuit board 400.

The non-display area NA may include a pad portion PA on which a plurality of pads 110' are formed to apply driving signals to the plurality of pixels PX. The pad portion PA is located in the non-display area NA and may include a plurality of pads 110'. A data voltage or a power voltage may be applied to the data line 122 or voltage line (not shown) connected to the plurality of pixels PX through the plurality of pads 110'. The plurality of pads 110' are copper (Cu), molybdenum (Mo), aluminum (Al), silver (Ag), platinum (Pt), palladium (Pd), chromium (Cr), tantalum (Ta), titanium ( It may include metals such as Ti) or alloys thereof.

The printed circuit board 400 may include a plurality of conductive patterns 410 extending in the second direction (Y). The printed circuit board 400 may be attached to the non-display area (NA) and electrically connected to the pad portion (PA). The printed circuit board 400 may be bonded to the pad portion PA by the anisotropic conductive film 300. The printed circuit board 400 may transmit driving signals such as the data line 122 or the voltage line (not shown) to the plurality of pixels PX through the plurality of pads 110' of the pad portion PA. The printed circuit board 400 may be a flexible printed circuit board. The plurality of conductive patterns 410 may be located on the plurality of pads 110' and overlap the plurality of pads 110'.

The substrate 100 and the printed circuit board 400 may be bonded to each other using an anisotropic conductive film 300 . The anisotropic conductive film 300 may include adhesive resin 310 made in a film state and conductive particles 320 distributed within the adhesive resin 310.

An anisotropic conductive film 300 is disposed between the substrate 100 and the printed circuit board 400, and the printed circuit board 400 can be bonded to the substrate 100 by applying heat and pressure for a certain period of time. At this time, the conductive particles 320 located between the conductive pattern 410 of the printed circuit board 400 and the pad 110' of the substrate 100 electrically connect the conductive pattern 410 and the pad 110'. You can.

The separation device according to an embodiment of the present invention can separate the printed circuit board 400 from the display panel in the same manner as the method of separating the driver IC 200 from the display panel described above with reference to FIGS. 3 to 7.

In more detail, the display panel to which the printed circuit board 400 is attached may be arranged and aligned at a predetermined position on the first stage 510. At this time, the second stage 530 can press the display panel to prevent the display panel from deviating from its designated position.

Next, the laser light source 520 located below the first stage 510 can selectively burn the adhesive resin 310 by irradiating laser. The laser light source 520 can burn the adhesive resin 310 by irradiating a laser to the anisotropic conductive film 300 while moving in the horizontal direction, or by irradiating the laser to the entire anisotropic conductive film 300 at once using an optical element. there is. In another embodiment, the laser light source 520 may be located on the side of the first stage 510 and irradiate a laser in a horizontal direction to burn the adhesive resin 310. In this case, the laser light source 520 may radiate a laser in a horizontal direction. You can irradiate the laser while moving, or you can irradiate the laser all at once using an optical element.

Next, after the adhesive resin 310 is burned and loses its adhesive force, the display panel and the printed circuit board 400 can be separated. The second stage 530 can separate the printed circuit board 400 from the display panel by adsorbing the printed circuit board 400 and moving it in the third direction (Z). Alternatively, the display panel and the printed circuit board 400 may be separated by the operator directly moving the printed circuit board 400 without using the second stage 530, or the display panel may be separated from the display panel by gravity by tilting or flipping the display panel. The printed circuit board 400 may also be separated.

The drawings and detailed description of the invention described so far are merely illustrative of the present invention, and are used only for the purpose of explaining the present invention, and are not used to limit the meaning or scope of the present invention described in the claims. That is not the case. Therefore, those skilled in the art will understand that various modifications and other equivalent embodiments are possible therefrom. Therefore, the true scope of technical protection of the present invention should be determined by the technical spirit of the appended claims.

100: substrate
110, 110': multiple pads
121: Fanout wiring
122: Multiple data lines
123: Multiple gate lines
200: driver IC
210: Bump of Revenge
300: Anisotropic conductive film
310: adhesive resin
320: Conductive particles
400: printed circuit board
410: Revenge Challenge Pattern
510: Stage 1
520: Laser light source
530: Second stage

Claims (17)

a first stage supporting a display panel on which a plurality of pads are formed; and
A separation device comprising a laser light source that selectively burns the adhesive resin contained in an anisotropic conductive film that electrically connects the driving IC to the plurality of pads by irradiating a laser with a high absorption rate to the adhesive resin. According to claim 1,
The laser light source is located below the first stage and irradiates the laser toward the display panel located on the top of the first stage. According to clause 2,
A separation device in which the laser penetrates the substrate included in the display panel and the first stage and is absorbed by the adhesive resin. According to clause 2,
A separation device in which the laser light source moves in a horizontal direction and irradiates the laser in a vertical direction. According to clause 2,
The laser light source is a separation device that irradiates the laser to the entire anisotropic conductive film at once using an optical element. According to claim 1,
The laser light source is located on a side of the first stage and irradiates the laser in a horizontal direction to burn the adhesive resin. According to claim 1,
A separation device further comprising a second stage that adsorbs the driving IC and separates the driving IC from the display panel. According to claim 1,
The laser is a separation device including a laser in the near-infrared or infrared wavelength range. a first stage supporting a display panel on which a plurality of pads are formed; and
A separation device comprising a laser light source for selectively burning the adhesive resin contained in an anisotropic conductive film that electrically connects a printed circuit board to the plurality of pads by irradiating a laser with a high absorption rate to the adhesive resin. According to clause 9,
A separation device wherein the printed circuit board is a flexible printed circuit board on which a driver IC is mounted. Arranging and arranging a display panel on which a driver IC is bonded by an anisotropic conductive film at a predetermined position on the first stage;
A step of selectively burning the adhesive resin included in the anisotropic conductive film by a laser light source irradiating a laser having a high absorption rate to the adhesive resin included in the anisotropic conductive film; and
A separation method comprising separating the driver IC from the display panel. According to claim 11,
The laser light source is located below the first stage and irradiates the laser toward the display panel located on the top of the first stage. According to claim 12,
A separation method in which the laser penetrates the substrate included in the display panel and the first stage and is absorbed by the adhesive resin. According to claim 11,
A separation method in which the laser light source is located on a side of the first stage and irradiates the laser in a horizontal direction to burn the adhesive resin. According to claim 11,
A separation method in which a second stage adsorbs the driving IC to separate the driving IC from the display panel. According to claim 11,
A separation method comprising a laser in the near-infrared or infrared wavelength range. Arranging and arranging a display panel on which a printed circuit board on which a driving IC is mounted is attached by an anisotropic conductive film at a predetermined position on the first stage;
A step of selectively burning the adhesive resin included in the anisotropic conductive film by a laser light source irradiating a laser having a high absorption rate to the adhesive resin included in the anisotropic conductive film; and
A separation method comprising separating the printed circuit board from the display panel.

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