TW201406249A - Connected body manufacturing method, connection method - Google Patents

Abstract

A light-permeable substrate (22) has a first connection terminal (28) formed thereon, and an object for connection (12) has a light-reflective second connection terminal (18) formed thereon that is to be connected to the first connection terminal (28) and has a larger surface area than the first connection terminal (28). The light-permeable substrate (22) is placed on the object for connection (12), and the first connection terminal (28) is superposed on the second connection terminal (18). Light is shone from the light-permeable substrate (22) side, and positioning is performed between the light-permeable substrate (22) and the object for connection (12) such that reflected light from the second connection terminal (18) is transmitted from the periphery of the first connection terminal (28). The light-permeable substrate (22) and the object for connection (12), which have been positioned, are connected. Substrate space is capable of being saved, and the alignment between the connection terminals is capable of being adjusted rapidly and precisely.

Description

Manufacturing method and connection method of connector

The present invention relates to a method for manufacturing a connector in which a substrate having light transmissivity is connected to a connection object, and a method for connecting a substrate having light transmissivity and a connection object, and more particularly to a method of transmitting light. The alignment of the two connection terminals of the substrate and the connection object is adjusted.

The present application claims priority on the basis of Japanese Patent Application No. 2012-069656, the entire disclosure of which is hereby incorporated by reference.

When a rigid substrate such as a glass substrate or a glass epoxy substrate is connected to a flexible substrate or a flexible substrate is connected to each other, conductive particles are dispersed in the insulating adhesive composition. An anisotropic conductive adhesive. When the connection terminal of the flexible substrate is connected to the connection terminal of the rigid substrate, an anisotropic conductive adhesive is disposed between the two substrates on which the connection terminals are formed, and is thermally pressurized. In this way, the insulating adhesive composition exhibits fluidity, and is discharged between the connection terminal of the flexible substrate and the connection terminal of the rigid substrate, and the conductive particles in the anisotropic conductive adhesive are sandwiched between the two connection terminals. Being squashed.

As a result, the connection terminals of the flexible substrate and the connection terminals of the rigid substrate are electrically connected by the conductive particles, and in this state, the insulating adhesive composition is cured. Does not exist in The conductive particles between the two connection terminals are dispersed in the insulating adhesive composition to maintain electrical insulation. Thereby, electrical conduction is achieved only between the connection terminal of the flexible substrate and the connection terminal of the rigid substrate.

[Patent Document 1] Japanese Patent Laid-Open Publication No. 2004-128324

Here, in recent years, with the miniaturization and high performance of electronic devices, the fine pitch of the terminal electrodes of the electronic components or the wiring electrodes of the substrates has been promoted. When the substrate in which the terminal electrodes are formed as fine pitches or the substrate in which the terminal electrodes are formed at a fine pitch is connected to the electronic component by the anisotropic conductive film, in order to obtain a good on-resistance value, the connection terminals must be large each other. The areas are accurately connected, and therefore, high precision alignment (alignment adjustment) of the substrates or the substrates and the electronic parts is required.

Such alignment adjustments have generally used a method of mechanically performing alignment using an altment mark. However, there is a problem that in order to provide an alignment mark, it is necessary to secure an installation area on a substrate, particularly in a substrate requiring miniaturization and space saving, which hinders the degree of freedom in design.

Further, in the case where a plurality of types of substrates are produced in a small amount, or a connection between a substrate and an electronic component, etc., since the advantages of automation are small, alignment adjustment is sometimes performed manually. For example, when a flexible substrate is connected to a rigid substrate such as a glass substrate, first, an anisotropic conductive film is temporarily bonded to a terminal region of the glass substrate on which a plurality of connection terminals are formed. Then, the flexible substrate is opposed to the terminal region, and the X direction, the Y direction, and the slope of the two substrates are manually operated so that the connection terminals of the glass substrate and the connection terminals of the flexible substrate overlap each other. After the adjustment in the θ direction, the flexible substrate is pressed against the glass substrate to be temporarily fixed.

However, it is difficult to accurately adjust the alignment of the connection terminals with each other, especially The development of fine pitch of wiring electrodes has required considerable proficiency and time.

Accordingly, an object of the present invention is to provide a method of manufacturing a connector and a method of connecting the same, which can realize space saving of a substrate and accurately adjust the alignment of the connection terminals in a short time.

In order to solve the problem, the method of manufacturing a connector of the present invention is a method of manufacturing a connector in which a light-transmitting substrate is connected to a connection target, and the light-transmitting substrate is formed with a first connection terminal, and the connection object is formed. a second connection terminal that is connected to the first connection terminal and has a larger light reflectance than the first connection terminal, and the light-transmissive substrate is placed on the connection target, and the second connection terminal is superposed on the second connection terminal. a connection terminal that illuminates light from the side of the light-transmitting substrate, and aligns the light-transmitting substrate and the object to be connected so that reflected light from the second connection terminal passes through the periphery of the first connection terminal And the light-transmitting substrate after the alignment is connected to the connection object.

Moreover, the connection method of the present invention is a method of connecting a light-transmitting substrate and a connection object to be connected to the light-transmitting substrate, and the light-transmitting substrate is formed with a first connection terminal, and the connection object is formed with the above-described a second connection terminal having a connection-connecting terminal and having a light-reflecting area larger than that of the first connection terminal, wherein the light-transmitting substrate is placed on the connection target, and the first connection terminal is superposed on the second connection terminal. The light is irradiated from the side of the light-transmitting substrate, and the light-transmitting substrate is aligned with the object to be connected so that the reflected light from the second connection terminal is transmitted from the periphery of the first connection terminal, and the position is set. The aligned light-transmitting substrate is connected to the object to be connected.

According to the invention, in the connection between the connection object and the light-transmitting substrate, the surface of the second connection terminal is covered with a reflective material, and the second connection terminal has a larger area than the first connection terminal formed on the light-transmitting substrate. By irradiating light from the upper side of the light-transmitting substrate, the reflected light from the second connection terminal can be observed by being transmitted from both sides of the first connection terminal. therefore, According to the present invention, it is possible to realize space saving of the connection object or the light-transmitting substrate without using the alignment mark exclusively, and it is quick and accurate as compared with the case where the first connection terminal and the second connection terminal have the same width. The alignment of the object to be bonded and the light-transmitting substrate are adjusted.

1‧‧‧ anisotropic conductive film

10‧‧‧LCD panel

11, 12‧‧‧ Transparent substrate

12a‧‧‧Edge of the transparent substrate 12

13‧‧‧Seal

14‧‧‧LCD

15‧‧‧ Panel display

16, 17‧‧ ‧ transparent electrode

18‧‧‧ Terminals

18a, 28a‧‧‧ conduction terminals

18b, 28b‧‧‧ alignment adjustment terminal

19‧‧‧Electronic parts

20‧‧‧Metal plating

21‧‧‧COG Construction Department

22‧‧‧Flexible substrate

23‧‧‧FOG Construction Department

24‧‧‧Alignment film

25, 26‧‧‧ polarizing film

27‧‧‧Substrate

28‧‧‧Connecting terminal

29, 30‧‧‧Orthogonal terminal

40‧‧‧heating pressure head

Fig. 1 is a cross-sectional view showing a liquid crystal display panel which is an example of a connector to which the present invention is applied.

2 is a perspective view showing a configuration in which an ACF connection is made between a terminal portion of a transparent substrate and a connection terminal of the flexible substrate.

Fig. 3 is a plan view showing a connection method to which the present invention is applied.

Fig. 4 is a plan view showing another connection method to which the present invention is applied.

Fig. 5 is a plan view showing another connection method to which the present invention is applied.

Fig. 6 is a plan view showing another connection method to which the present invention is applied.

Fig. 7 is a plan view showing a comparative example.

Fig. 8 is a plan view showing a comparative example.

Hereinafter, a method of manufacturing a connector to which the present invention is applied and a connection method will be described in detail with reference to the drawings. It is to be understood that the invention is not limited thereto, and various modifications may be made without departing from the spirit and scope of the invention. Further, the drawings are schematic, and there are cases where the ratio of each size is different from the actual one. The specific dimensions and the like should be judged by considering the following instructions. Further, of course, the drawings also include portions in which the relationship or ratio of the dimensions of each other is different.

[Liquid Crystal Display Panel]

A method of manufacturing a connector according to the present invention is a method of manufacturing a connector in which a light-transmitting substrate is connected to a connection object, and for example, can be used for manufacturing a television or a PC monitor, a mobile phone, a palm-type game machine, and a tablet. A liquid crystal display panel of various display mechanisms such as a tablet terminator or a vehicle monitor. In such a liquid crystal display panel, a so-called FOG (film on) in which a flexible substrate on which a liquid crystal driving circuit is formed is directly mounted on a substrate of a liquid crystal display panel is used from the viewpoint of fine pitch, light weight, and the like. Glass, film on glass).

As shown in FIG. 1, the liquid crystal display panel 10 is disposed such that two transparent substrates 11 and 12 formed of a glass substrate or the like are opposed to each other, and the transparent substrates 11 and 12 are bonded to each other by a frame-shaped sealing member 13. Further, the liquid crystal display panel 10 forms the panel display portion 15 by filling the liquid crystal 14 in a space surrounding the transparent substrates 11, 12.

The transparent substrates 11 and 12 are formed with stripe-shaped transparent electrodes 16 and 17 made of ITO (indium tin oxide) or the like so as to intersect each other on the inner side surfaces facing each other. Further, the two transparent electrodes 16 and 17 constitute pixels which are the smallest unit of the liquid crystal display by the intersection of the two transparent electrodes 16 and 17.

Among the two transparent substrates 11 and 12, one transparent substrate 12 is formed to have a larger planar size than the other transparent substrate 11, and an electronic component such as a liquid crystal driving IC is disposed on the edge portion 12a of the largely formed transparent substrate 12. In the COG (Chip on Glass) mounting portion 21 of the 19th, the FOG mounting portion 23 constituting the flexible substrate 22 is provided in the vicinity of the outer side of the COG mounting portion 21, and the flexible substrate 22 is provided. A liquid crystal driving circuit is formed.

Further, the liquid crystal driving IC or the liquid crystal driving circuit can perform a specific liquid crystal display by selectively applying a liquid crystal driving voltage to the pixels to locally change the alignment of the liquid crystal.

The terminal portion 18 of the transparent electrode 17 is formed in each of the structures 21 and 23. A metal plating layer 20 such as gold plating on the surface is formed on the terminal portion 18, and has light reflectivity. Further, as shown in FIG. 2, the terminal portion 18 is formed, for example, in a substantially rectangular shape, and is orthogonal to the longitudinal direction. It is formed by arranging a plurality of arrays.

In the terminal portion 18, the electronic component 19 such as the liquid crystal driving IC or the flexible substrate 22 is connected by using the anisotropic conductive film 1 as a conductive adhesive. The anisotropic conductive film 1 contains conductive particles, and the conductive member is interposed between the electrode of the electronic component 19 or the flexible substrate 22 and the terminal portion 18 of the transparent electrode 17 formed on the edge portion 12a of the transparent substrate 12 to be electrically conductive. connection. The anisotropic conductive film 1 is an adhesive of a thermosetting type, a thermoplastic type, or an ultraviolet curing type, and is fluidized by thermocompression bonding using a heating pressing head 40 described below to cause conductive particles to be at the terminals. The portion 18 is flattened between the respective electrodes of the electronic component 19 or the flexible substrate 22, and is hardened by heating or ultraviolet irradiation in a state where the conductive particles are crushed. Thereby, the anisotropic conductive film 1 electrically and mechanically connects the transparent substrate 12 to the electronic component 19 or the flexible substrate 22.

Further, an alignment film 24 subjected to a specific rubbing treatment is formed on the two transparent electrodes 16 and 17, and the alignment film 24 restricts the initial alignment of the liquid crystal molecules. Further, a pair of polarizing plates 25 and 26 are disposed on the outer sides of the two transparent substrates 11 and 12, and the two polarizing plates 25 and 26 restrict the vibration direction of the transmitted light from a light source (not shown) such as a backlight.

[Flexible substrate]

The flexible substrate 22 connected to the terminal portion 18 of the transparent substrate 12 is attached to a flexible and light-transmitting substrate 27 such as polyimide, and is connected to the terminal portion as shown in FIG. The connection terminal 28 of 18 is formed. The connection terminal 28 is formed by, for example, patterning a copper foil or the like and appropriately performing a plating treatment such as nickel plating gold, and is formed, for example, in a substantially rectangular shape as in the terminal portion 18, and is orthogonal to the longitudinal direction. The direction is formed by a plurality of arrangements.

The flexible substrate 22 is connected to the terminal portion 18 of the transparent substrate 12 via the anisotropic conductive film 1 and the connection terminal 28. At this time, the flexible substrate 22 is formed by superposing the connection terminal 28 on the terminal portion 18 and radiating light from the upper side to pass through the inside of the flexible substrate 22 and reflected by the terminal portion 18 of the transparent substrate 12 from the connection terminal. 28 and the transparent substrate 12 alignment adjustment.

Therefore, the terminal portion 18 of the transparent substrate 12 and the connection terminal 28 of the flexible substrate 22 which are connected via the anisotropic conductive film 1 are formed to have a larger area than the connection terminal 28. As shown in FIG. 2, when the terminal portion 18 and the connection terminal 28 are each formed in a rectangular shape, the terminal portion 18 is formed to be wider than the connection terminal 28. Thereby, it is judged that the flexible substrate 22 is adjusted by the alignment of the transparent substrate 12 by uniformly transmitting the reflected light of the terminal portion 18 from both sides in the width direction of the connection terminal 28 superposed on the terminal portion 18.

As described above, in the connection between the transparent substrate 12 and the flexible substrate 22, the surface of the terminal portion 18 is covered with a reflective material, and the terminal portion 18 is provided to be larger than the connection terminal 28 formed on the flexible substrate 22 having light transmissivity. The area is irradiated with light from the upper side of the flexible substrate 22, and the reflected light from the terminal portion 18 is transmitted through both sides of the connection terminal 28 to be observed. Therefore, according to the present connection, the space saving of the transparent substrate 12 or the flexible substrate 22 can be realized without using the alignment mark, and can be performed quickly and accurately as compared with the case where the terminal portion and the connection terminal have the same width. The alignment of the flexible substrate 22 and the transparent substrate 12 is adjusted.

The connection terminal 28 of the flexible substrate 22 is formed to have a width of 10% to 80% of the width of the terminal portion 18. If the width of the connection terminal 28 is narrower than 10% of the width of the terminal portion 18, it is difficult to visually recognize the connection terminal 28. If the width of the connection terminal 28 is wider than 80% of the width of the terminal portion 18, it is difficult to visually recognize the reflection from the terminal portion 18. In either case, the alignment adjustment of the flexible substrate 22 and the transparent substrate 12 cannot be performed quickly and accurately.

The state in which the alignment between the transparent substrate 12 and the flexible substrate 22 is adjusted is shown in FIGS. 3 to 6 . In addition, in FIGS. 3 to 6, for the sake of convenience, the translucent flexible substrate 22 is not shown, and only the connection terminal 28 is shown on the terminal portion 18.

As shown in FIG. 3, when the transparent substrate 12 and the flexible substrate 22 are arranged in plural in the direction orthogonal to the longitudinal direction of the terminal portion 18 and the connection terminal 28, the terminals are formed in the arrangement direction. a plurality of terminal portions 18 on one side or on both sides of the array direction The connection terminal 28 is set as a terminal for alignment adjustment. Thereby, the transparent substrate 12 and the flexible substrate 22 can be aligned accurately and accurately compared with the case where the terminal portion and the connection terminal are formed with the same width.

The transparent substrate 12 and the flexible substrate 22 are used as terminals for alignment adjustment by the terminal portion 18 and the connection terminal 28 formed on one side of the arrangement direction of the terminal portion 18 and the connection terminal 28 or on both sides in the arrangement direction. Further, the alignment adjustment can be performed over the entire area in which the terminal portion 18 and the connection terminal 28 are formed, and the connection area of all the terminal portions 18 and the connection terminals 28 can be ensured to be large.

Further, the transparent substrate 12 and the flexible substrate 22 are adjusted by aligning a plurality of terminal portions 18 and connection terminals 28 formed on one side of the arrangement direction of the terminal portion 18 and the connection terminal 28 or on both sides in the arrangement direction. The terminal is used, and alignment adjustment can be performed in consideration of the tendency of the formation of each of the pattern of the terminal portion 18 and the connection terminal 28. In other words, the tendency of the pattern error is known from the balance of the reflected light from the opposite sides of the plurality of terminal portions 18, and the connection area of all the terminal portions 18 and the connection terminals 28 can be surely ensured by referring to the tendency of the pattern error. Larger.

Here, as shown in FIG. 3, the flexible substrate 22 has all of the plurality of connection terminals 28 arranged in the same area. Further, the transparent substrate 12 and the flexible substrate 22 serve to electrically connect the plurality of terminal portions 18 and the connection terminals 28 formed on one side or both sides of the plurality of terminal portions 18 and the connection terminals 28 which are arranged in series. The terminals 18a and 28a and the alignment adjustment terminals 18b and 28b of the transparent substrate 12 and the flexible substrate 22. Further, the transparent substrate 12 and the flexible substrate 22 have the other terminal portions 18 and the connection terminals 28 as the conduction terminals 18a and 28a.

The transparent substrate 12 and the flexible substrate 22 can be used as a conduction terminal and an alignment adjustment terminal by using the terminal portion 18 and the connection terminal 28, and space saving can be realized without using an alignment mark.

Further, the transparent substrate 12 and the flexible substrate 22 may have a plurality of terminal portions 18 and connection terminals formed on one or both sides of the plurality of terminal portions 18 and connection terminals 28 arranged in series 28 is used as the dedicated terminals 18b and 28b for alignment adjustment.

Further, the transparent substrate 12 and the flexible substrate 22 may be used as the dedicated terminal 18b for alignment adjustment by only the terminal portion 18 and the connection terminal 28 which are provided at one or both ends of the terminal portion 18 and the connection terminal 28 which are arranged in plural numbers. And 28b, or the conduction terminals 18a and 28a are aligned with the adjustment terminals 18b and 28b.

Further, as shown in FIG. 4, the transparent substrate 12 may have an area of the plurality of terminal portions 18 formed on one side or both sides of the plurality of terminal portions 18 arranged larger than the area of the connection terminals 28 of the flexible substrate 22. The area of the other terminal portion 18 is made the same as the area of the connection terminal 28. At this time, the transparent substrate 12 and the flexible substrate 22 have a plurality of terminal portions 18 and connection terminals 28 formed on one side or both sides as the conduction terminals 18a and 28a and are aligned with the adjustment terminals 18b and 28b. Further, the transparent substrate 12 and the flexible substrate 22 have the other terminal portions 18 and the connection terminals 28 having the same area as the conduction terminals 18a and 28a.

The transparent substrate 12 and the flexible substrate 22 can improve the electrical conduction reliability of the terminal portion 18 and the connection terminal 28 by setting the conduction terminals 18a and 28a to the same area. Further, since the transparent substrate 12 and the flexible substrate 22 have the same area of the connection terminals 28, even when the conduction terminal 28a is used as the alignment adjustment terminal 28b, the electric power to the terminal portion 18 is not impaired. Sexual continuity reliability.

Further, even in the configuration shown in FIG. 4, the transparent substrate 12 and the flexible substrate 22 may be connected to the terminal portion 18 and the terminal portion 18 which are formed on one or both sides of the plurality of terminal portions 18 and the connection terminals 28 which are arranged in series. The terminal 28 serves as a dedicated terminal 18b, 28b for alignment adjustment.

Further, even in the configuration shown in FIG. 4, the transparent substrate 12 and the flexible substrate 22 may be provided with only one or both of the terminal portions 18 and the connection terminals of the terminal portions 18 and the connection terminals 28 which are arranged at one end or both ends. 28 is used as the dedicated terminals 18b and 28b for alignment adjustment, or as the conduction terminals 18a and 28a and the alignment adjustment terminals 18b and 28b.

Moreover, the transparent substrate 12 may also have a plurality of terminal portions arranged as shown in FIG. 18 are all set to the same area. At this time, the flexible substrate 22 has an area of the plurality of connection terminals 28 formed on one side or both sides of the plurality of connection terminals 28 which is smaller than the area of the other connection terminals 28 having the same area as the terminal portion 18. The transparent substrate 12 and the flexible substrate 22 have a plurality of terminal portions 18 and connection terminals 28 formed on one side or both sides as the conduction terminals 18a and 28a and are aligned with the adjustment terminals 18b and 28b. Further, the transparent substrate 12 and the flexible substrate 22 have the other terminal portions 18 and the connection terminals 28 having the same area as the conduction terminals 18a and 28a.

The transparent substrate 12 and the flexible substrate 22 can improve the electrical conduction reliability of the terminal portion 18 and the connection terminal 28 by setting the conduction terminals 18a and 28a to the same area.

Further, even in the configuration shown in FIG. 5, the transparent substrate 12 and the flexible substrate 22 may be connected to the terminal portion 18 and the terminal portion 18 formed on one or both sides of the plurality of terminal portions 18 and the connection terminals 28 The terminal 28 serves as a dedicated terminal 18b, 28b for alignment adjustment.

Further, even in the configuration shown in FIG. 5, the transparent substrate 12 and the flexible substrate 22 may be provided only in the terminal portion 18 and the connection terminal in which the plurality of terminal portions 18 and the connection terminals 28 are provided at one end or both ends. 28 is used as the dedicated terminals 18b and 28b for alignment adjustment, or as the conduction terminals 18a and 28a and the alignment adjustment terminals 18b and 28b.

Further, as shown in FIG. 6, the terminal portions 18 provided at one end or both ends of the terminal portion 18 of the transparent substrate 12 may be the same area, and only the connection terminals 28 of the flexible substrate 22 may be disposed in the connection terminal 28. The connection terminal 28 at one end or both ends has a smaller area than the other connection terminals 28 having the same area as the terminal portion 18.

At this time, the terminal portion 18 and the connection terminal 28 of the plurality of arrays are the terminal portions 18 and the connection terminals 28 provided at one end or both ends as the dedicated terminals 18b and 28b for alignment adjustment, and the other terminal portions 18 of the same area are provided. And the connection terminal 28 serves as the conduction terminals 18a and 28a.

That is, in the configuration shown in FIG. 6, in the transparent substrate 12 and the flexible substrate 22, the electrical continuity reliability of the terminal portion 18 and the connection terminal 28 can be improved by setting the conduction terminals 18a and 28a to the same area.

Further, in the transparent substrate 12 and the flexible substrate 22, the terminal portion 18 and the connection terminal 28 provided at one end or both ends may be used as the dedicated terminals 18b and 28b for the alignment terminals 18a and 28a.

Further, in any of the configurations of FIGS. 3 to 6, the transparent substrate 12 and the flexible substrate 22 may be used as a dedicated terminal 18b for alignment adjustment in the plurality of terminal portions 18 and the connection terminals 28, The formation pitch of the terminal portion 18 and the connection terminal 28 on one side or both sides of the 28b is formed to be narrower than the formation pitch of the other terminal portion 18 and the connection terminal 28.

Thereby, the transparent substrate 12 and the flexible substrate 22 can realize the space saving of the formation region of the terminal portion 18 or the connection terminal 28. Further, the terminal portion 18 and the connection terminal 28 which serve as the dedicated terminals 18b and 28b for alignment adjustment do not have a short circuit between the terminal portions 18 or between the connection terminals 28 caused by the conductive particles of the anisotropic conductive film 1. Therefore, the narrow pitch can be achieved within the limits of the alignment adjustment.

Further, the transparent substrate 12 and the flexible substrate 22 may have a plurality of terminal portions 18 and connection terminals 28 for alignment adjustment arranged in a direction orthogonal to the longitudinal direction, and as shown in FIGS. 3 to 6 The orthogonal terminal portion 29 extending in the arrangement direction is formed at the terminal portion 18 at the end portion on one side or both sides in the arrangement direction, and the orthogonal terminal portion 30 is similarly formed at the connection terminal 28.

The orthogonal terminal portion 29 constitutes a portion of the transparent electrode 17, and is formed simultaneously with the terminal portion 18 in the same step, and has light reflectivity. Further, the orthogonal terminal portion 30 is formed simultaneously with the connection terminal 28 in the same step. The orthogonal terminal portions 29 and 30 adjust the inclination θ of the in-plane direction of the transparent substrate 12 and the flexible substrate 22, and are formed in a rectangular shape in a similar shape, for example. Further, the orthogonal terminal portion 29 formed in the terminal portion 18 is formed to have a larger area than the orthogonal terminal portion 30 formed in the connection terminal 28.

Similarly to the terminal portion 18 and the connection terminal 28, the orthogonal terminal portions 29 and 30 are superimposed and irradiated with light from the side of the flexible substrate 22 to be reflected from the orthogonal terminal portion 29. The alignment adjustment with the transparent substrate 12 is performed such that light is uniformly transmitted from the periphery of the orthogonal terminal portion 30. Thereby, the transparent substrate 12 and the flexible substrate 22 can adjust the alignment of the inclination θ of the in-plane direction of the transparent substrate 12 and the flexible substrate 22.

Further, the orthogonal terminal portions 29 and 30 can be formed on all of the terminal portions 18 by the terminal portions 18 and the connection terminals 28 formed at the end portions of one or both of the terminal portions 18 and the connection terminals 28 of the plurality of arrays. And the inclination of the connection terminal 28 is adjusted.

[other]

In the above description, the liquid crystal display panel 10 has been described as an example of the connection body. However, the present invention can be applied to the manufacture of all the connectors to which the light-transmitting substrate is connected. Further, in the above, the transparent substrate 12 and the flexible substrate 22 are connected by the anisotropic conductive film 1, but they may be in the form of a film or a paste as an adhesive, or may be made of conductive particles. Insulating adhesive.

[Examples]

Next, an embodiment of the present invention will be described. In the present embodiment, a flexible substrate (FPC, Flexible Printed Circuit) and a rigid wiring substrate (PWB, Printed Wiring Board) are interposed by ACF (Anisotropic Conductive Film). (Printed wiring board)) After the alignment adjustment was performed by superimposing, hot pressing was performed to connect the FPC, and the number of particle captures was measured.

PWB uses a glass epoxy substrate FR-4 grade: MCL-E-67. The thickness of the PWB was 1.1 mm, and a gold-plated Cu wiring having a thickness of 35 μm was formed at a distance of 200 μm (L/S = 1/1).

The FPC system uses NFX-2ABEPFE (25T). The FPC was formed on a polyimide substrate having a thickness of 25 μm, and a gold-plated Cu wiring having a thickness of 12 μm was formed at a distance of 200 μm (L/S = 1/1).

The adhesive used to connect FPC to PWB is Sony. ACF manufactured by Chemical & Information Device Co., Ltd.: DP3342MS. The ACF contained gold-plated/nickel resin particles having an average particle diameter of 10 μm.

In the examples and the comparative examples, after the ACF was temporarily bonded to the wiring pattern of the PWB, the alignment adjustment of the FPC was performed and temporarily mounted on the PWB. The alignment adjustment is to illuminate the light from the FPC side. The light source was SZX-LGR66 manufactured by Olympus Co., Ltd., and the light source intensity was set to the maximum intensity of the light source. Also, the distance from the light source to the FPC is 10 cm. The alignment adjustment of the terminal portion of the PWB and the connection terminal of the FPC was carried out using a stereo microscope SZX7 (magnification: 100 times) manufactured by Olympus Co., Ltd.

After alignment adjustment, the FPC is attached to the PWB using a heated pressure head. The hot pressurization conditions using ACF were 130 ° C, 2 MPa, and 6 seconds. Further, a silicone rubber having a thickness of 0.2 mm was provided as a cushioning material in the heating pressure indenter.

In the first embodiment, in the configuration shown in FIG. 3, the three terminal portions and the connection terminals formed on both sides are used as the terminals for the conduction terminals and the alignment adjustment terminals, and the other terminal portions and the connection terminals are used as the other terminals. Conduction terminal. Then, each of the three terminal portions and the connection terminals formed on both sides was observed with a microscope, and alignment adjustment was performed.

In the second embodiment, in the configuration shown in FIG. 6, the terminal portions and the connection terminals formed at both ends are used as the alignment adjustment terminals, and the other terminal portions and the connection terminals are used as the conduction terminals. Then, the terminal portions and the connection terminals formed at both ends were observed under a microscope, and alignment adjustment was performed.

In the third embodiment, in the configuration shown in FIG. 5, the terminal portions and the connection terminals formed at both ends are used as the alignment adjustment terminals, and the other terminal portions and the connection terminals are used as the conduction terminals. Then, the terminal portions and the connection terminals formed at both ends were observed under a microscope, and alignment adjustment was performed.

In the fourth embodiment, in the configuration shown in FIG. 4, each of the three terminal portions and the connection terminals formed on both sides serves as a common terminal for the conduction terminal and the alignment adjustment terminal, and the other is The terminal portion and the connection terminal serve as conduction terminals. Then, each of the three terminal portions and the connection terminals formed on both sides was observed with a microscope, and alignment adjustment was performed.

In the first comparative example, in the configuration shown in FIG. 7, the terminal portions 18 and the connection terminals 28 formed at both ends are used as the alignment adjustment terminals 18b and 28b, and the other terminal portions 18 and the connection terminals 28 are used as the conduction terminals. 18a, 28a. In FIG. 7, the terminal portion 18 formed in the PWB and the connection terminal 28 formed in the FPC are all formed to have the same width. Then, the terminal portion 18b and the connection terminal 28b formed at both ends were observed under a microscope, and alignment adjustment was performed.

In the comparative example 2, in the configuration shown in FIG. 8, the terminal portions 18 and the connection terminals 28 formed at both ends are used as the alignment adjustment terminals 18b and 28b, and the other terminal portions 18 and the connection terminals 28 are used as the conduction terminals. 18a, 28a. In FIG. 8, the connection terminal 28 formed in the FPC is formed to have a wider width than the terminal portion 18 formed in the PWB. Then, the terminal portion 18b and the connection terminal 28b formed at both ends were observed under a microscope, and alignment adjustment was performed.

The visibility and alignment workability, and the number of particle captures of the PWB wiring when the FPC was superposed were measured in the examples and the comparative examples. The visibility of the PWB wiring when the FPC is superimposed is that when the light is irradiated from the FPC side and observed under the microscope, the case where the PWB wiring is easily observed by the FPC is ○, and the case where the observation is difficult to observe is ×. Microscopic observation of the alignment of the workability system, the adjustment of the offset between the terminal portion and the connection terminal within 20% of the time within 5 seconds can be made ○, and it takes 5 seconds or more. The case where the offset between the terminal portion and the connection terminal is 21% or more is set to ×. Further, the number of particle captures was peeled off from the PWB after crimping the FPC, and the number of conductive particles on the terminal portion was counted by an optical microscope. In addition, when the number of the conductive particles attached to the one terminal is 20 or more, it is ◎, and when the number of the conductive particles attached to the one terminal is 10 to 19, it is ○. In addition, in Table 1, the visibility of the PWB wiring and the alignment workability were both ○, and the number of particles captured on the conduction terminal was ◎, and it was judged as ◎, and the visibility of the PWB wiring was When one of the alignment workability is ×, it is judged as ×, and otherwise, it is judged as ○. The results are shown in Table 1.

As shown in Table 1, in Examples 1 to 4, any of the evaluation items of the visibility, alignment workability, and particle capture number of the PWB wiring was good. On the other hand, in Comparative Example 1 and Comparative Example 2, since the terminal portions formed in the PWB and the connection terminals formed in the FPC are formed to have the same width or the width of the connection terminals is wider, the visibility of the PWB wiring and Poor alignment workability.

12‧‧‧Transparent substrate

18a, 28a‧‧‧ conduction terminals

18b, 28b‧‧‧ alignment adjustment terminal

28‧‧‧Connecting terminal

29, 30‧‧‧Orthogonal terminal

Claims (16)

A method of manufacturing a connector in which a light-transmitting substrate is connected to a connection target; a light-transmissive substrate is formed with a first connection terminal; and the connection object is formed to be connected to the first connection terminal and has an area larger than the first a second connection terminal that is light-reflective to the connection terminal; the light-transmitting substrate is placed on the connection target, and the first connection terminal is superposed on the second connection terminal; and the light-transmissive substrate is irradiated Light is transmitted between the light-transmitting substrate and the object to be connected so that the reflected light from the second connection terminal passes through the periphery of the first connection terminal; and the light transmittance after alignment is performed The substrate is connected to the object to be connected. The method of manufacturing a connector according to the first aspect of the invention, wherein the plurality of first connection terminals are arranged in the light-transmissive substrate, and the plurality of second connection terminals are arranged in the connection object. The method of manufacturing a connector according to the second aspect of the invention, wherein the first and second connection terminals formed on one side or both sides of the array direction in the plurality of the first and second connection terminals arranged in the plurality of rows The light is irradiated for positional alignment. The method of manufacturing a connector according to claim 3, wherein all of the first connection terminals of the plurality of arrays of the light-transmitting substrate have the same area. The method of manufacturing a connector according to the fourth aspect of the invention, wherein the first connecting terminal formed on one or both sides of the light-transmitting substrate also serves as a conductive terminal and a terminal for alignment with the object to be connected. . The method of manufacturing a connector according to the fourth aspect of the invention, wherein the first connection terminal formed on one side or both sides of the light-transmitting substrate is a terminal for alignment with the object to be connected. The method of manufacturing a connector according to the fourth aspect of the invention, wherein the area of the second connection terminal connected to the first connection terminal provided on one side or both sides of the light-transmissive substrate It is larger than the area of the other second connection terminal having the same area as the first connection terminal. The method of manufacturing a connector according to claim 7, wherein the second connection terminal connected to the first connection terminal provided on one side or both sides of the light-transmissive substrate is used as the connection target. The conduction terminal and the alignment terminal of the light-transmissive substrate and the other second connection terminal having the same area as the first connection terminal are used as the conduction terminals of the light-transmitting substrate. The method of manufacturing a connector according to the seventh aspect of the invention, wherein the connection target device is a second connection terminal that is connected to the first connection terminal provided on one side or both sides of the light-transmissive substrate The terminal for alignment of the light-transmitting substrate has a second connection terminal having the same area as the first connection terminal as a conduction terminal to the light-transmitting substrate. The method of manufacturing a connector according to the third aspect of the invention, wherein, in the translucent substrate, an area of the first connection terminal formed on one side or both sides of the plurality of the first connection terminals arranged in the plurality of rows is smaller than The area of the other first connection terminal having the same area as the second connection terminal. The method of manufacturing a connector according to claim 10, wherein the first connecting terminal formed on one or both sides of the light-transmitting substrate serves as a terminal and a terminal for alignment with the object to be connected. . The method of manufacturing a connector according to claim 10, wherein the first connection terminal formed on one side or both sides of the light-transmitting substrate is a terminal for alignment with the object to be connected. The method of manufacturing a connector according to claim 12, wherein the distance between the first connection terminals formed on one side or both sides of the light-transmitting substrate is smaller than other first connection terminals The distance between the two is narrow. The method of manufacturing a connector according to the second aspect of the invention, wherein the first and second connection terminals have a rectangular shape; and the first and second connection terminals of the plurality of arrays are formed on one side or two The first and second connection terminals on the side are also formed with orthogonal terminal portions in a direction orthogonal to the longitudinal direction. The method for producing a connector according to the first aspect of the invention, wherein the first and second connection terminals are conductive adhesives containing conductive particles in the adhesive, or the conductive particles are not contained in the adhesive. The insulating adhesive is connected. A connection method is a method of connecting a translucent substrate and a connection object connected to the translucent substrate; the translucent substrate is formed with a first connection terminal; and the connection object is formed to be connected to the first connection terminal And a second connection terminal having an area greater than a light reflectivity of the first connection terminal; the light-transmitting substrate is disposed on the connection target, and the first connection terminal is superposed on the second connection terminal; Light is irradiated on the optical substrate side, and the light-transmitting substrate is aligned with the connection target so that the reflected light from the second connection terminal is transmitted from the periphery of the first connection terminal; and the position is aligned The light-transmitting substrate is connected to the object to be connected.