KR20240023250A - Pcb coining system - Google Patents

Abstract

The present invention relates to a PCB coining system, and includes a magazine loading unit 100 equipped to move a magazine storing PCBs of different models to a supply position and recognize and load the PCB model, and a cross table by moving the PCB. The PCB moving unit 200 is equipped to supply or retrieve the unit 300, the coining inspection unit 500, or the magazine unloading unit 600, and the PCB is seated on the upper table 310 or lower table 320. A cross table unit 300 is provided to correct the position and simultaneously supply and retrieve operations to the coining unit 400 at the intersection, and sets the coining work position and flatness for each PCB model to adjust the bump to a certain standard. A coining unit 400 equipped to perform coining, a coining inspection unit 500 equipped to set the coined PCB on the inspection table 520 and inspect the specifications of the bump with 3D vision, and coining and inspection. It is configured to include a magazine unloading unit (600) that moves the finished PCB to the recovery position, unloads it, recognizes the model, and stores it in each magazine, thereby enabling coining and inspection of different model PCBs. It features an automated system that significantly improves efficiency and productivity.

Description

PCB Coining System{PCB COINING SYSTEM}

The present invention relates to a PCB coining system, and more specifically, a series of coining systems that enable coining and inspection of heterogeneous model PCBs in configuring a coining system that uniformly adjusts the height deviation of the bumps solder pasted on the PCB. This relates to a PCB coining system that significantly improves efficiency and productivity by configuring an automated system.

Generally, a PCB consists of an insulator, a circuit, and a solder resist. In the solder resist, bumps called solder balls are formed to connect circuits and external elements.

In addition, in order to miniaturize electronic devices, a coining process is additionally performed to flatten the height of the bump during the PCB manufacturing process. In other words, after forming a bump using a conductive paste on the PCB original plate, the top surface of the bump is pressed flat to form a certain height and diameter through a coining process.

Looking briefly at the process of performing a coining process when manufacturing a PCB through known technology, as an example, Korean Patent No. 10-1109240 includes the step of preparing a base substrate having a connection pad exposed by a solder resist open portion. and forming a resist pattern on a solder resist having an opening for forming a solder bump corresponding to the open part, applying a solder paste to the opening for forming a solder bump, and first reflowing the applied solder paste. a step of removing the resist pattern, a second reflow of the first reflowed solder paste, a step of removing the flux remaining after the second reflow, and the reflowed solder after removing the flux. Constructs a manufacturing method of a semiconductor package substrate including the step of coining a bump.

As another example, Korean Patent No. 10-0726242 includes forming a solder resist layer on a substrate containing a conductive layer, applying flux to the opening of the solder resist layer, and applying a thin metal film layer on the solder resist layer. It includes the steps of stacking, pressurizing the metal thin film layer to correspond to the position where the flux is applied, depressurizing, reflowing the substrate, removing the flux, and coining the substrate. Constructs a method of manufacturing a substrate.

Meanwhile, the configuration of a typical coining system, for example, as known in Korean Patent No. 10-1156860, includes a coining portion formed at the lower part of the body to press the solder ball to form a fret-type bump on the substrate; , It consists of a coin head for a substrate, which is composed of a pair of pins or a plate shape and includes a protrusion provided on the coining portion to be formed at the edge of the coining portion and protrude toward the substrate.

As another example, Korean Patent Publication No. 10 - 2015 - 0046614 includes an upper head that pressurizes and flattens solder bumps formed on a printed circuit board, a pressurizing part that presses the upper surface of the upper head, and the upper head and pressurizing part are connected, Constructs a coining device including a lifting part that controls the movement of the upper head.

Korean Patent No. 10 - 1109240 (2012.01.30) Korean Patent No. 10 - 0726242 (2007.06.11) Korean Patent No. 10 - 1156860 (2012.06.20) Korean Patent Publication No. 10 - 2015 - 0046614 (2015.04.30)

The PCB coining process to which the above-described prior art is applied includes a coining system on a PCB manufacturing line, inputting PCBs that form solder-pasted bumps, and carrying out a process of equalizing the height deviation of the bumps.

However, the PCB coining system according to the prior art is generally designed to optimize equipment on a one-to-one basis depending on the model type of the PCB, so it has the disadvantage of being able to perform work only for a single PCB.

Therefore, performing the coining process for different types of PCB models involves the inconvenience of having to stop the process operation and change the equipment type one by one each time, which significantly reduces workability and productivity.

In addition, the conventional PCB coining system does not have a verification system for the coining process results, such as the height and diameter of the bump, so a separate system and process must be performed additionally, which hinders the continuity of the process and interferes with the entire coining process. Since automation is difficult to realize, there are problems that may cause a decrease in process efficiency and quality.

Accordingly, the present invention was invented to solve the problems of the prior art as described above.

A magazine loading unit 100 provided to move a magazine storing PCBs of different models to a supply position and to recognize and load the PCB models;

A PCB moving unit 200 provided to move the PCB to supply or retrieve the cross table unit 300, the coining inspection unit 500, or the magazine unloading unit 600;

A cross table unit 300 equipped to correct the position of the PCB by seating it on the upper table 310 or lower table 320 and to simultaneously supply and retrieve the coining unit 400 at the cross table;

A coining unit 400 equipped to coin bumps to a certain standard by setting the coining operation position and flatness for each PCB model;

A coining inspection unit 500 equipped to set the coined PCB on the inspection table 520 and inspect the specifications of the bump with 3D vision,

Coining and inspection of heterogeneous model PCBs is possible by including a magazine unloading unit 600 that moves PCBs that have completed coining and inspection to a recovery location, unloads them, recognizes the model, and stores them in each magazine. By providing a series of possible automation systems, it is possible to achieve the goal of significantly improving efficiency and productivity.

The present invention provides a coining system that uniformly adjusts the height deviation of the solder paste bumps on the PCB.

In particular, the present invention differs from conventional simple coining devices in that mixed production of heterogeneous models is possible, and coining work and in-line inspection are performed continuously, which has the effect of significantly improving workability and productivity.

In addition, the PCB coining system according to the present invention automates a series of processes such as loading a plurality of PCBs subject to coining from a magazine for each model, position correction, synchronization of supply and recovery operations, coining inspection, and unloading. This has the effect of promoting process continuity and efficiency and realizing a high-quality coining process.

1 is a perspective view of the PCB coining system according to the present invention.
Figure 2 is a schematic plan view of the PCB coining system according to the present invention.
3 to 5 are perspective views of the configuration included in the magazine loading unit of the PCB coining system according to the present invention.
6 to 8 are perspective views of the configuration included in the PCB moving unit and the cross table unit of the PCB coining system according to the present invention.
9 to 10 are perspective views of the configuration included in the cross table unit of the PCB coining system according to the present invention.
Figure 11 is a perspective view of the configuration included in the coining unit of the PCB coining system according to the present invention.
Figure 12 is a perspective view of the configuration included in the coining inspection unit of the PCB coining system according to the present invention.

Hereinafter, the configuration and operation according to a preferred embodiment of the PCB coining system of the present invention will be described in detail with reference to the accompanying drawings. In the following description, detailed descriptions of parts that can be easily implemented by those skilled in the art may be omitted. In addition, since the following description describes the present invention with preferred embodiments, the present invention is not limited by the following examples, and it is natural that various modifications may be made without departing from the scope of the present invention. will be.

The PCB coining system to which the technology of the present invention is applied is a series of automated PCBs capable of coining and inspecting heterogeneous model PCBs in constructing a coining system that uniformly adjusts the height deviation of the bumps solder pasted on the PCB. Please note that this is about the coining system.

For this purpose, the PCB coining system of the present invention includes a magazine loading unit 100, a PCB moving unit 200, a cross table unit 300, a coining unit 400, a coining inspection unit 500, and It is configured to include a magazine unloading unit 600, and in an embodiment of the present invention, a plurality of cross table units 300 and coining units 400 are installed on both sides of the system to enable batch work on heterogeneous model PCBs. Install and configure.

The magazine loading unit 100 is equipped to move a magazine storing PCBs of different models to a supply position, recognize the PCB model, and load it.

The magazine loading unit 100 includes a loading unit 110, a clamp robot 120, and a pusher 130.

The loading unit 110 is provided to, for example, attach the A model PCB magazine and the B model PCB magazine to one side of each tray and stack them in multiple layers.

Each tray provided in the loading unit 110 is equipped with an air cylinder to automatically fix the magazine in close contact with the reference surface when the operator loads the magazine on the tray.

The clamp robot 120 is mounted on one side of the loading unit 110 to clamp the magazine and move it to the supply position by three-axis driving.

The clamp robot 120 is configured to drive the clamp header 121, which is provided to clamp the magazine, in the X, Y, and Z axes to move the magazine to the supply position, RFID reader position, or pusher 130 position. .

The clamp header 121 is provided with a magazine seating portion to closely adhere to the lower part of the magazine, and is equipped to clamp the magazine in close contact with the inner surface by an air cylinder. Each time one PCB is supplied, the pitch is moved by the height of the next PCB to adjust the height.

One side of the clamp robot 120 is equipped with a reader 140 that reads the RFID attached to one side of the magazine for each model, and the RFID reader reads the PCB model information before inputting the PCB stored in the corresponding magazine into the system. Configure to register.

A pusher 130 is mounted at the supply position of the magazine loading unit 100 to load PCBs stored in the magazine one by one into the supply loader 210.

The pusher 130 adjusts the width by moving the right pusher 132 on the 210).

A load prevention sensor is mounted on one side of the pusher 130 so that when the PCB is not moved from the supply loader 210 to the supply picker 220, the pusher 130 does not supply the next PCB and stops operating. Equipped with

The PC ratio moving unit 200 moves the PC ratio supplied by the magazine loading unit 100 to supply or retrieve it to the cross table unit 300, coining inspection unit 500, or magazine unloading unit 600. Equipped with

The PC non-moving unit 200 includes a supply loader 210, a supply picker 220, a recovery picker 230, and a recovery loader 240.

The supply loader 210 is equipped to receive and seat PCBs one by one by the pusher 130 of the magazine loading unit 100.

The supply loader 210 consists of a conveyor that moves the PCB back and forth from the magazine loading unit 100 to the PCB moving unit 200 and supplies it. If necessary, it is configured so that the operator can manually insert PCB into the conveyor of the supply loader 210.

The supply loader 210 is equipped to be raised and lowered by an air cylinder 212 and interlocks with each other in the process of receiving PCB from the pusher 130, and its width is variable by the position variable motor 211 according to the PCB model. Configure to apply.

An ultrasonic cleaning unit 250 is mounted on one side of the supply loader 210 to perform dry cleaning by applying ultrasonic waves to the PCB.

The ultrasonic cleaning unit 250 is equipped with an ultrasonic cleaning head that can be raised and lowered, so that floating foreign substances not removed from the PCB are dry cleaned using bubble vibration and bubble destruction by ultrasonic waves, thereby eliminating the drying process by wet cleaning and removing organic substances and It is designed to effectively remove minerals.

The supply picker 220 is provided on the upper side of the supply loader 210 to lift and lower the PCB or to drive left and right by a linear robot 260 to pick up the PCB and move it to the cross table unit 300.

The supply picker 220, the recovery picker 230, and the alignment camera 330 of the cross table unit 300, which will be described later, are mounted on the linear robot 260 mounted left and right on the PCB coining system of the present invention. It is configured to be placed in and driven in the horizontal direction.

The supply picker 220 moves left and right along the linear robot 260 and is equipped with a vacuum pad so that it can be lifted up and down. Therefore, the PCB is vacuum-sucked from the supply loader 210 and delivered to the cross table unit 300.

The recovery picker 230 is provided on the upper side of the inspection loader 510, which will be described later, by lifting and lowering or being driven left and right by a linear robot 260 to pick up the PCB and move it to the recovery loader 240.

The recovery picker 230 moves left and right along the linear robot 260 and is equipped with a vacuum pad so that it can be lifted up and down. Therefore, the PCB is vacuum adsorbed from the inspection loader 510 and delivered to the recovery loader 240.

The recovery loader 240 is equipped to place the PCBs recovered by the recovery picker 230 one by one and unload the PCBs from the magazine unloading unit 600.

The recovery loader 240 consists of a conveyor that moves the PCB back and forth from the PCB moving unit 200 to the magazine unloading unit 600 and delivers the PCB to a loading compartment in an empty magazine.

The recovery loader 240 is equipped to be raised and lowered by an air cylinder 242 and receives PCB by interconnecting with the recovery picker 230. The width is variable and applied by the position variable motor 241 according to the PCB model. Configure it to do so.

The cross table unit 300 is equipped to correct the position of the PCB by seating it on the upper table 310 or the lower table 320 and to simultaneously supply and retrieve the coining unit 400 at the intersection.

The cross table unit 300 includes an upper table 310 and a lower table 320, an alignment camera 330, a correction means 340, and a fixing means 350.

The upper table 310 and the lower table 320 are provided to slide back and forth between the coining units 400 on one side of the supply loader 210 at the intersection.

The upper table 310 and the lower table 320 are each provided in a rectangular shape so that a plurality of PCBs can be seated, and are driven to slide in the forward and backward directions between the coining units 400, which will be described later, at upper and lower intersections along both rails. Equipped with

A servo motor is mounted on one side of the rail of the upper table 310 and the lower table 320, and is configured to enable two-axis synchronous or asynchronous control, so that the upper table 310 or the lower table 320 is lifted and lowered along the Z axis and Y axis. Forward and backward and Configure it to be

The alignment camera 330 is driven left and right by a linear robot 260 on the upper side of the upper table 310 or lower table 320 to photograph the alignment state of the PCB and calculate a correction value.

The alignment camera 330 consists of a reference camera 331 whose position is fixed and a variable camera 332 whose position is variable. A reference camera is provided to check a mark on one side of the PCB on the upper table 310 or lower table 320. The variable camera is configured to move the position according to the PCB model, check the mark information, calculate correction values for the X, Y, and θ positions and transmit them to the correction means 340.

The correction means 340 moves up and down on the lower side of the upper table 310 or lower table 320 and aligns the PC ratio in three axes according to the correction value of the alignment camera 330 to correct the position.

The correction means 340 receives the X, Y, and θ correction values from the alignment camera 330 and is configured to correct the position through 3-axis alignment while in close contact with the bottom of the PCB.

The alignment camera 330 and the correction means 340 are provided to align or process defective PCBs that are bent based on mark information, and are configured to enable alignment with a tolerance of approximately 0.05 mm.

The fixing means 350 is mounted on the upper table 310 and the lower table 320 to closely fix the side portion of the position-corrected PCB and to be able to slide left and right.

The fixing means 350 is provided to move forward and backward or lift up and down toward both sides of the PCB by a cylinder on the upper table 310 and the lower table 320 to clamp the side portion of the PCB.

The fixing means 350 is configured to be movable left and right while the PCB is fixed, so that the position of the bump can be aligned on the lower side of the coining head 410 during coining work using the coining unit 400, which will be described later. Configure it to do so.

The coining unit 400 is equipped to coin the bump to a certain standard by setting the coining work position and flatness for each PCB model.

The coining unit 400 includes a coining head 410, a coining bottom 420, and a head tilt unit 430.

The coining head 410 is mounted on the upper table 310 or the lower table 320 of the cross table unit 300, moves up and down, and coins bumps on the PCB to a set standard.

A Z-axis servomotor and a reducer are mounted on the upper side of the coining head 410 to press the bump through a lifting operation. A load cell is mounted at the bottom of the coining head 410 to check whether the load value reaches the target value, and is configured to enable pressing at a level of approximately 50 to 3000 kg.

The coining bottom 420 is fixedly mounted on the lower side of the upper table 310 or the lower table 320 of the cross table unit 300 to support the PCB by interlocking with the coining head 410 on the coaxial line. Equipped with

The head tilt unit 430 is mounted on one side of the coining head 410 and is equipped to automatically adjust the flatness of the coining head 410 according to the height deviation test result of the PC ratio.

The head tilt unit 430 is configured to correct the flatness by driving X and Y variable axis motors to adjust the angle of the coining head 410 according to the diameter, height, and deviation of the bump for each PCB model.

The coining inspection unit 500 is equipped to set the PCB that has been coined by the coining unit 400 on the inspection table 520 and inspect the specifications of the bump with 3D vision.

The coining inspection unit 500 is configured to enable in-line inspection after the coining operation within the PCB coining system according to the present invention, and is configured to prevent the occurrence of mass defects in advance through dimeter and double coining inspection. do.

The coining inspection unit 500 includes an inspection loader 510, an inspection table 520, an inspection picker 530, and a 3D vision head 540.

The inspection loader 510 is equipped to seat the PCB moved by the recovery picker 230 and move it to one side of the inspection table 520.

The inspection picker 530 is equipped with a vacuum pad that is raised and lowered by an air cylinder to vacuum-suck the PCB from the inspection loader 510 and set it on the inspection table 520.

The inspection table 520 is equipped with a rack gear to adjust the left and right variable width based on the center.

The 3D vision head 540 is equipped to be raised and lowered from the upper side of the inspection table 520, and is configured to inspect the presence, height, and diameter of bumps on the coined PCB. Through the inspection results, the bump pattern is confirmed, the coining head 410 is tilted, and the distortion diameter and height are measured to enable automatic correction.

The magazine unloading unit 600 moves PCBs that have been coined and inspected to a recovery position, unloads them, and stores them in each magazine.

The magazine unloading unit 600 is provided to unload the PCB from the recovery loader 240 of the PCB moving unit 200 at the recovery position, and includes a loading unit 610 and a clamp robot 620.

The clamp robot 620 is equipped to clamp an empty magazine at the recovery position and move it to the loading unit 610 by three-axis driving.

The clamp robot 620 is equipped to drive the clamp header provided to clamp the magazine in the X-axis, Y-axis, and Z-axis directions by an air cylinder to move the magazine storing the recovered PCB to the loading unit 610. Compose.

The loading unit 610 of the magazine unloading unit 600 is equipped to attach the A model PCB magazine and the B model PCB magazine to one side of each tray, stack them in multiple layers, and discharge them.

The coining method using the PCB coining system to which the technology of the present invention is applied, consisting of the configuration described above, is largely divided into a magazine loading step (S10), a PCB supply step (S20), a PCB correction step (S30), and a table crossing step (S40). ), coining step (S60), PC fee recovery step (S70), coining inspection step (S80), and magazine unloading step (S90).

In the magazine loading step (S10), the clamp robot 120 moves the magazine to the supply position, reads the RFID to check the PCB model, and then the pusher 130 loads one unit of PCB into the supply loader 210.

In the magazine loading step (S10), when the operator manually loads magazines containing, for example, model A and model B PCBs into the tray fixing part, the air cylinder moves forward and brings the magazines into close contact with the reference surface.

The clamp header of the clamp robot 120 moves forward to clamp the magazine, then moves backwards and moves along the X-axis to the supply position. The clamp header moves down the Z axis to set the RFID reading height, and after the reader reads, the first PCB in the magazine is set to the position of the pusher (130). Each time one sheet is supplied, the pitch is moved by the next PC ratio height to adjust the height. When all PCBs in the magazine are supplied, the empty magazine is moved to the magazine unloading unit (600).

The PCB supply step (S20) is a step in which the surface of the PCB loaded on the supply loader 210 is ultrasonically cleaned and the supply picker 220 adsorbs the PCB to move and settle on the upper table 310 or lower table 320. .

In the PCB supply step (S20), the conveyor of the supply loader 210 moves forward and backward to supply PCB, and the head of the ultrasonic cleaning unit 250 descends to dry clean the upper surface of the PCB. The air cylinder goes up and down and waits for supply to the supply picker (220).

In the PC ratio correction step (S30), the alignment camera 330 photographs the PC ratio on the upper side of the upper table 310 or the lower table 320 to calculate a correction value, and the correction means 340 corrects the PC ratio position and fixes it. This is the step of fixing by means 350.

In the PC ratio correction step (S30), the supply picker 220 vacuum-adsorbs the PC ratio and moves it to the cross table unit 300, and the alignment camera 330 checks the mark and calculates correction values for the X, Y, and θ positions. do. The correction means 340 corrects the position of the PCB, and the fixing means 350 clamps and fixes the PCB.

The table crossing step (S40) is a step of simultaneously supplying and recovering PC to the coining unit 400 by cross-driving the upper table 310 or the lower table 320.

In the table crossing step (S40), the upper table 310 and the lower table 320 move to the coining unit 400 to simultaneously supply and collect PCBs.

The coining step (S60) is a step in which the coining head 410 and the coining bottom 420 interact with each other on the upper and lower sides of the PCB fixed to the fixing means 350 to coin the bumps of the PCB.

In the coining step (S60), the upper coining header is raised and lowered using a Z-axis servomotor to press the bump. The press load value is received from the load cell and worked to reach the target value.

Meanwhile, in the present invention, the head tilt unit 430 automatically adjusts the flatness of the coining head 410 on the upper side of the upper table 310 or lower table 320 before performing the coining step (S60). Perform the tilt step (S50).

In the head tilt step (S50), the head tilt unit 430 drives the X and Y variable axis motors to adjust the angle of the coining head 410 according to the diameter, height, and deviation of the PCB bump to correct the flatness.

The PC rain recovery step (S70) is a step in which the PC rain recovered from the coining unit 400 in the table crossing step (S40) is adsorbed by the recovery picker 230 and moved and placed on the inspection loader 510.

The coining inspection step (S80) is a step of setting the PCB mounted on the inspection loader 510 on the inspection table 520 and inspecting the specifications of the coined bump through 3D vision.

In the coining inspection step (S80), the inspection picker 530 vacuum-adsorbs the PCB and seats it on the inspection table 520, and while fixing the PCB by adjusting the left and right variable widths based on the center, the 3D vision head 540 detects the bump. Check presence, height, and diameter. According to the test results, the bump pattern is confirmed and applied to the head tilt step (S50), or the distortion diameter and height are measured to perform automatic correction.

In the magazine unloading step (S90), the recovery picker 230 adsorbs the PCB seated on the inspection loader 510 and unloads it into the recovery loader 240, and discharges the PCB in the reverse order of the magazine loading step (S10). This is the stage of loading into the magazine.

In the magazine unloading step, the recovery loader 240 receives the PCB from the recovery picker 230 and moves the conveyor back and forth to transfer the PCB to the loading compartment in the empty magazine. It is pushed forward completely inward by the air cylinder.

The PCB coining system according to the present invention as described above constitutes a coining system made to uniformly adjust the height deviation of the solder paste bump on the PCB, and in particular, a series of automation capable of coining and inspecting heterogeneous model PCBs. There are advantages to providing a system.

Therefore, the present invention differs from the conventional simple coining device in that mixed production of different models is possible and coining work and in-line inspection are performed continuously, which has the effect of significantly improving workability and productivity.

In addition, the PCB coining system according to the present invention automates a series of processes such as loading a plurality of PCBs subject to coining from a magazine for each model, position correction, synchronization of supply and recovery operations, coining inspection, and unloading. Since it has various effects, such as promoting process continuity and efficiency and realizing a high-quality coining process, it is expected to have great industrial applicability.

A: Model A B: Model B
100: magazine loading unit 110: loading unit
120: Clamp robot 130: Pusher
140: RFID reader 200: PCB mobile unit
210: Supply loader 220: Supply picker
230: recovery picker 240: recovery loader
250: Ultrasonic cleaning unit 260: Linear robot
300: cross table unit 310: upper table
320: lower table 330: alignment camera
340: correction means 350: fixation means
400: Coining unit 410: Coining head
420: Coining bottom 430: Head tilt unit
500: Coining inspection unit 510: Inspection loader
520: Inspection table 530: Inspection picker
540: 3D vision head 600: Magazine unloading unit
610: Loading unit 620: Clamp robot
S10: Magazine loading step S20: PC supply step
S30: PC ratio correction step S40: Table intersection step
S50: Head tilt stage S60: Coining stage
S70: PC fee recovery step S80: Coining inspection step
S90: Magazine unloading step

Claims (5)

A magazine loading unit 100 provided to move a magazine storing PCBs of different models to a supply position and to recognize and load the PCB models;
A PCB moving unit 200 provided to move the PCB to supply or retrieve the cross table unit 300, the coining inspection unit 500, or the magazine unloading unit 600;
A cross table unit 300 equipped to correct the position of the PCB by seating it on the upper table 310 or lower table 320 and to simultaneously supply and retrieve the coining unit 400 at the cross table;
A coining unit 400 equipped to coin bumps to a certain standard by setting the coining operation position and flatness for each PCB model;
A coining inspection unit 500 equipped to set the coined PCB on the inspection table 520 and inspect the specifications of the bump with 3D vision,
A PCB coining system characterized by including a magazine unloading unit 600 that moves the PCB that has completed coining and inspection to a recovery position, unloads it, recognizes the model, and stores it in each magazine. According to claim 1,
The PC mobile unit 200,
A supply loader 210 that receives and seats PCBs one by one by the pusher 130 of the magazine loading unit 100,
A supply picker 220 that is lifted and lowered from the upper side of the supply loader 210 or driven left and right by a linear robot 260 to pick up the PCB and move to the cross table unit 300;
A recovery picker 230 that is lifted and lowered from the upper side of the inspection loader 510 or driven left and right by a linear robot 260 to pick up the PCB and move to the recovery loader 240;
It includes a recovery loader 240 that seats the recovered PCBs one by one and unloads the PCBs by the pusher 130 of the magazine unloading unit 600,
A PCB coining system characterized in that an ultrasonic cleaning unit 250 is mounted on one side of the supply loader 210 to perform dry cleaning by applying ultrasonic waves to the PCB. According to claim 1,
The cross table unit 300,
An upper table 310 and a lower table 320 provided to slide back and forth between the coining units 400 on one side of the supply loader 210, and
An alignment camera 330 that is driven left and right by a linear robot 260 on the upper side of the upper table 310 or lower table 320 to photograph the alignment state of the PCB and calculate a correction value,
Correction means 340 for lifting and lowering the lower side of the upper table 310 or lower table 320 and correcting the position by aligning the PC ratio in three axes according to the correction value of the alignment camera 330,
A PCB nose characterized in that it includes a fixing means 350 provided to closely fix the side parts of the PCB whose position has been corrected by mounting a plurality of them on the upper table 310 and the lower table 320 and to enable sliding operation to the left and right. Inning system. According to claim 1,
The coining unit 400,
A coining head 410 that is mounted on the upper table 310 or lower table 320 of the cross table unit 300 and moves up and down to coin bumps on the PCB to a set standard,
Coining bottoms 420 that are fixedly mounted on the lower side of the upper table 310 or lower table 320 of the cross table unit 300 and interlock on the same axis with the coining head 410 to support the PCB;
A PCB coining system comprising a head tilt unit 430 mounted on one side of the coining head 410 to automatically adjust the flatness of the coining head 410 according to the height difference of the PCB bump. In the coining method using the PCB coining system according to any one of claims 1 to 4,
A magazine loading step (S10) in which the clamp robot 120 moves the magazine to the supply position, reads the RFID to check the PCB model, and then the pusher 130 loads 1 unit of PCB into the supply loader 210;
A PCB supply step (S20) in which the surface of the PCB loaded on the supply loader 210 is ultrasonically cleaned and the supply picker 220 adsorbs the PCB and moves and settles on the upper table 310 or lower table 320;
The alignment camera 330 photographs the PC ratio on the upper side of the upper table 310 or the lower table 320 to calculate a correction value, and the correction means 340 corrects the PC ratio position and then fixes the PC ratio with the fixing means 350. Correction step (S30),
A table crossing step (S40) of simultaneously supplying and recovering PC to the coining unit 400 by cross-driving the upper table 310 or lower table 320;
A coining step (S60) in which the coining head 410 and the coining bottom 420 are interlocked on the upper and lower sides of the PCB fixed to the fixing means 350 to coin the bumps of the PCB,
A PC rain recovery step (S70) in which the recovery picker 230 adsorbs the PC rain recovered from the coining unit 400 in the table crossing step (S40) and moves and lands on the inspection loader 510;
A coining inspection step (S80) in which the PCB mounted on the inspection loader 510 is set on the inspection table 520 and the specifications of the coined bump are inspected with 3D vision,
The recovery picker 230 adsorbs the PCB seated on the inspection loader 510 and unloads it into the recovery loader 240, and the PCB is discharged and loaded into the magazine in the reverse order of the magazine loading step (S10) (magazine unloading step ( PCB coining method comprising S90).