KR20240022002A - Apparatus for treating substrate and method for treating a substrate - Google Patents

Abstract

The present invention provides an apparatus for processing a substrate. A substrate processing apparatus according to an embodiment includes a housing having a processing space; a support unit supporting a substrate in the processing space; and a brush unit for cleaning the substrate supported on the support unit, wherein the brush unit includes: a body; and a plurality of contact pads formed on the body, wherein a groove portion through which impurities dropped from the substrate are discharged may be positioned between the contact pads.

Description

Substrate processing apparatus and substrate processing method {APPARATUS FOR TREATING SUBSTRATE AND METHOD FOR TREATING A SUBSTRATE}

The present invention relates to an apparatus and method for processing a substrate, and more particularly, to a substrate processing apparatus and method for cleaning a substrate.

The semiconductor process includes a process of cleaning thin films or impurities such as foreign substances and particles on a substrate. These processes include a top surface cleaning process that cleans the top surface of the substrate on which the pattern is formed and a back surface cleaning process that cleans the back surface of the substrate on which the pattern is not formed. Generally, the surface cleaning process is performed by supplying a cleaning liquid to the upper surface of the substrate while the upper surface of the substrate is facing upward. Additionally, the back side cleaning process is performed by supplying liquid to the back side of the substrate and scrubbing the back side of the substrate with a brush while the back side of the substrate is facing upward.

In order for impurities attached to the back side of the substrate to be removed from the back side of the substrate, a certain amount of force must be applied to the substrate when the brush rubs the back side of the substrate. If a certain amount of force is not applied to the substrate, impurities attached to the back side of the substrate are difficult to remove. On the other hand, if a certain amount of force or more is applied to the substrate, damage such as scratches may occur on the back side of the substrate.

Impurities removed from the back of the substrate by the brush mix with the liquid supplied to the back of the substrate to form a contaminated liquid. The brush comes into contact with the back side of the substrate and removes impurities from the back side of the substrate, so contaminated liquid is easily trapped between the brush and the substrate. In other words, it is difficult for contaminated liquid to be discharged to the outside of the brush. While the brush moves on the back side of the board and cleans the board, the contaminated liquid trapped between the brush and the board causes contamination throughout the back side of the board.

One object of the present invention is to provide a substrate processing device and a substrate processing method that can improve substrate cleaning efficiency.

Another object of the present invention is to provide a substrate processing device and a substrate processing method that can easily discharge contaminated chemicals to the outside of the pad when cleaning a substrate using a pad.

The problem to be solved by the present invention is not limited to the above-mentioned problems, and problems not mentioned can be clearly understood by those skilled in the art from this specification and the accompanying drawings. There will be.

The present invention provides an apparatus for processing a substrate. A substrate processing apparatus according to an embodiment includes a housing having a processing space; a support unit supporting a substrate in the processing space; and a brush unit for cleaning the substrate supported on the support unit, wherein the brush unit includes: a body formed in a circular shape; and a plurality of contact pads formed on the body, wherein a groove portion through which impurities dropped from the substrate are discharged is located between the contact pads, and the width of the groove portion in the central area of the body is determined by The width of the groove portion may be different.

According to one embodiment, the contact pad is divided into a plurality of pieces along the circumferential direction of the body, and the width of the groove portion in the central area of the body may be smaller than the width of the groove portion in the edge area of the body.

According to one embodiment, the width of the groove portion may gradually become wider as it moves from the central area of the body to the edge area of the body.

According to one embodiment, the brush unit may further include a plurality of contact protrusions disposed in the groove portion.

According to one embodiment, the lower end of the contact protrusion may be located at the same height as the lower end of the contact pad, or may be located at a height closer to the body than the lower end of the contact pad.

According to one embodiment, one group of the plurality of groups of contact protrusions is located adjacent to the central area of the body, and another group of the plurality of groups of contact protrusions is located adjacent to the edge area of the body. can be located

According to one embodiment, the lower end of the contact protrusion may be formed to be round.

According to one embodiment, the contact pad may include a material that is relatively more ductile than the contact protrusion.

According to one embodiment, the material of the contact pad may include polyvinyl alcohol (PVA), and the material of the contact protrusion may include nylon, polypropylene (PP), or silicon carbide (SiC).

According to one embodiment, the body is formed in a circular shape with a central area penetrating, the contact pad is formed to protrude downward from the bottom of the body, and the bottom of the contact pad may be in contact with the substrate.

According to one embodiment, the brush unit may further include a plurality of polishing pads disposed in the groove portion and in contact with the substrate.

According to one embodiment, the brush unit may further include a cleaning nozzle that discharges a cleaning liquid onto the substrate supported by the support unit.

According to one embodiment, the brush unit includes an arm supporting the body and the cleaning nozzle; an arm driver that moves the arm; A holder supporting the side of the body; a support rod connected to the holder through the arm and having an elastic member disposed therein; And it may further include a holder driver that rotates the holder.

According to one embodiment, the body can be moved between a central area and an edge area of the substrate supported on the support unit by the arm driver.

Additionally, the present invention provides an apparatus for processing a substrate. A substrate processing apparatus according to one embodiment includes an index block; and a processing block located adjacent to the index block, wherein the index block includes: at least one load port on which a container containing a substrate is placed; and an index frame in which an index robot for transporting a substrate is disposed between the container and the processing block, wherein the processing block includes: a buffer unit in which the substrate is temporarily stored; an inversion unit arranged to be stacked with the buffer unit and inverting the substrate up and down; a processing chamber for processing a substrate; and a transfer chamber in which the buffer unit, the inversion unit, and a transfer robot that transfers the substrate between the processing chambers are disposed, the processing chamber comprising: a housing having a processing space; a support unit supporting a substrate in the processing space; a liquid supply unit supplying a processing liquid to the substrate supported on the support unit; and a brush unit for cleaning the substrate supported on the support unit, wherein the brush unit includes: a circular body with a central area penetrating; a plurality of contact pads formed on the body and divided along a circumferential direction of the body to contact the substrate; At least one contact protrusion; and a cleaning nozzle that discharges a cleaning liquid onto the substrate supported by the support unit, wherein a groove portion through which impurities dropped from the substrate are discharged is positioned between the contact pads, and the contact protrusion may be disposed in the groove portion.

According to one embodiment, the width of the groove may increase from the central area of the body toward the edge area of the body.

According to one embodiment, the groove portion may have a fan-shaped shape when viewed from above.

According to one embodiment, the contact pad may include a material that is relatively more ductile than the contact protrusion.

Additionally, the present invention provides a brush unit that contacts the substrate and removes impurities attached to the substrate. A brush unit according to one embodiment includes a body formed in a circular shape; a plurality of contact pads formed on the body and divided along a circumferential direction of the body to contact the substrate; and at least one contact protrusion, wherein a groove through which the impurities are discharged is positioned between the contact pads. The width of the groove may have a fan-shaped shape when viewed from above.

According to one embodiment, the lower end of the contact protrusion may be located at the same height as the lower end of the contact pad, or may be located at a height closer to the body than the lower end of the contact pad.

Additionally, the present invention provides a method of processing a substrate using a substrate processing device according to an embodiment. A substrate processing method according to an embodiment is a state in which the support unit supports the substrate with the non-pattern side of the pattern side and the non-pattern side of the substrate facing upward, and while supplying a cleaning solution to the non-pattern side, the contact pads By contacting the non-pattern surface, impurities may fall off from the non-pattern surface, and the fallen impurities may be discharged into the groove portion.

According to one embodiment, the support unit may rotate when the non-patterned surface contacts the contact pad.

According to one embodiment, the body may rotate when the contact pad contacts the non-patterned surface.

According to one embodiment, the body may rotate before the contact pad contacts the non-patterned surface, and the support unit may rotate after the non-patterned surface contacts the contact pad.

According to one embodiment, the body and the support unit may rotate in different directions.

According to one embodiment, the body and the support unit rotate in the same direction, but the number of rotations per unit time of the body and the number of rotations per unit time of the support unit may be different.

According to one embodiment, the body may move back and forth between a central area including the center of the substrate and an edge area of the substrate when cleaning the non-pattern surface.

According to one embodiment, the body moves from the upper side to the lower side of the central region including the center of the substrate to bring the contact pad into contact with the non-patterned surface, and while the contact pad and the non-patterned surface contact the After moving from the central area to the edge area of the substrate, it moves to the upper side of the edge area to be spaced from the substrate, and after moving from the upper side of the edge area to the upper side of the central area, the contact pad contacts the non-patterned surface. The mechanism can be performed at least once.

According to one embodiment, the body moves from the top to the bottom of the edge area of the substrate to bring the contact pad into contact with the non-pattern surface, and the contact pad and the non-pattern surface contact the substrate in the edge area. After moving to the central area, the contact pad moves to the upper side of the central area to be separated from the substrate, and after moving from the upper side of the central area to the upper side of the edge region, at least one mechanism is used for the contact pad to contact the non-patterned surface. Can be performed more than once.

According to one embodiment, the substrate on which the non-pattern side has been cleaned is inverted in an inversion unit and positioned so that the pattern side faces upward, and the inverted substrate is supported on the support unit with the pattern side facing upward. The liquid supply unit that supplies the processing liquid to the substrate supported on the support unit may supply the processing liquid to the pattern surface to clean the pattern surface.

According to an embodiment of the present invention, the cleaning efficiency of the substrate can be improved.

Additionally, according to an embodiment of the present invention, when cleaning a substrate using a pad, contaminated chemicals can be easily discharged to the outside of the pad.

Additionally, according to an embodiment of the present invention, when cleaning a substrate using a pad, damage to the substrate caused by the pad can be minimized.

The effects of the present invention are not limited to the effects described above, and effects not mentioned can be clearly understood by those skilled in the art from this specification and the attached drawings.

1 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention of FIG. 1 .
FIG. 3 is a view viewed along line I-I of FIG. 2.
FIG. 4 is a view viewed along line II-II in FIG. 2.
Figure 5 is a cross-sectional view schematically showing the structure of an inversion unit according to an embodiment.
Figure 6 is a perspective view schematically showing a first transfer robot according to an embodiment.
Figure 7 is a cross-sectional view schematically showing a first process chamber according to an embodiment.
8 is a perspective view schematically showing one embodiment of a body, a contact pad, and a contact protrusion.
FIG. 9 is a flow chart sequentially showing an embodiment of a process for transporting and processing a substrate using the substrate processing apparatus according to the embodiment of FIG. 1 .
10 to 13 are diagrams sequentially showing an embodiment of an operation in which a substrate is inverted by an inversion unit.
14 to 17 are views sequentially showing an embodiment of the first process.
Figure 18 is a partial enlarged view schematically showing the discharge of chemical liquid from the body, contact pad, and contact protrusion.
Figure 19 is a diagram showing an example of the second process processing.
20 and 21 are views schematically showing another embodiment of a brush unit.
Figures 22 and 23 are views schematically showing another embodiment of the first process.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the attached drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited by the embodiments described below. This example is provided to more completely explain the present invention to those with average knowledge in the art. Therefore, the shapes of components in the drawings are exaggerated to emphasize a clearer explanation.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms may be used for the purpose of distinguishing one component from another component. For example, a first component may be referred to as a second component, and similarly, the second component may also be referred to as a first component without departing from the scope of the present invention.

The substrate according to an embodiment of the present invention described below will be described by taking a circular substrate such as a semiconductor wafer as an example. However, it is not limited to this, and the substrate described in one embodiment of the present invention may be a square substrate such as a mask or a display panel.

1 is a perspective view schematically showing a substrate processing apparatus according to an embodiment of the present invention. FIG. 2 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention of FIG. 1 . FIG. 3 is a view viewed along line I-I of FIG. 2. FIG. 4 is a view viewed along line II-II in FIG. 2.

Hereinafter, a substrate processing apparatus according to an embodiment of the present invention will be described in detail with reference to FIGS. 1 to 4.

Referring to FIG. 1 , the substrate processing apparatus 1 includes an index block 10 and a processing block 20 . According to one embodiment, the index block 10 and the processing block 20 may be arranged in one direction. Hereinafter, the direction in which the index block 10 and the processing block 20 are arranged is defined as the first direction (2), and the direction perpendicular to the first direction (2) when viewed from above is defined as the second direction (4). and the direction perpendicular to the plane including both the first direction (2) and the second direction (4) is defined as the third direction (6).

The index block 10 transports the substrate between the processing block 20 and the container F in which the substrate is stored. For example, the index block 10 transports the substrate on which predetermined processing has been completed in the processing block 20 to the container F. Additionally, the index block 10 transports substrates scheduled to be processed in the processing block 20 from the container F to the processing block 20 . According to one embodiment, the index block 10 may have a longitudinal direction parallel to the second direction 4.

Processing block 20 may include a first processing block 22 and a second processing block 24. The first processing block 22 and the second processing block 24 are arranged to be stacked. According to one embodiment, the first processing block 22 may be located above the second processing block 24. The first processing block 22 and the second processing block 24 have the same or similar structure and configuration.

Hereinafter, in order to avoid explanation of overlapping content, the description will focus on the first processing block 22. Accordingly, in FIGS. 2 to 4, reference numerals are given only to components included in the first processing block 22, and reference numerals for components included in the second processing block 24 are omitted.

Referring to FIGS. 1 and 2 , the index block 10 may include a load port 12 and an index frame 14. A container (F) containing a substrate is seated in the load port (12). The load port 12 may be placed on the opposite side of the processing block 20 based on the index frame 14. A plurality of load ports 12 may be provided, and the plurality of load ports 12 may be arranged along the second direction 4. The number of load ports 12 may increase or decrease depending on the process efficiency and footprint conditions of the processing block 20.

The container (F) may be an airtight container such as a front opening unified pod (FOUP). Container F may be placed in load port 12 by an operator or a transfer means (not shown) such as an overhead transfer, overhead conveyor, or Automatic Guided Vehicle. there is.

The substrate according to one embodiment of the present invention has two sides. One of the two surfaces may be a patterned surface on which a pattern is formed, and the other one of the two surfaces may be a non-patterned surface on which a pattern is not formed. The substrate according to one embodiment may be stored inside the container F with the pattern side facing upward.

Referring to FIG. 2, the index frame 14 has a longitudinal direction parallel to the second direction 4. The index frame 14 has a transport space for transporting the substrate. An index robot 140 and an index rail 144 are arranged in the conveyance space of the index frame 14. The index robot 140 transports the substrate within the transport space. Specifically, the index robot 140 transports the substrate between the index block 10 and the processing block 20. The index robot 140 has an index hand 142.

A substrate is placed on the index hand 142. The index hand 142 can move forward and backward, rotate about a vertical direction (eg, the third direction 6), and move up and down in the axial direction. A plurality of index hands 142 may be provided. Each of the plurality of index hands 142 may be arranged to be spaced apart in the vertical direction. The plurality of index hands 142 can move forward and backward independently of each other.

The index rail 144 may have a longitudinal direction parallel to the second direction 4. The index robot 140 is placed on the index rail 144, and the index robot 140 can move linearly along the longitudinal direction of the index rail 144. That is, the index robot 140 can move forward and backward along the index rail 144.

Referring to FIGS. 2 and 3 , the first processing block 22 may include a buffer unit 300, an inversion unit 400, a transfer chamber 500, and a processing chamber 600.

The buffer unit 300 has a buffer space. The buffer space functions as a space where the substrate being transported between the container F and the processing chamber 600 temporarily stays. Buffer unit 300 is placed adjacent to index frame 14. The buffer unit 300 and the index frame 14 are arranged in the first direction 92. Additionally, the buffer unit 300 is disposed between the index frame 14 and the component storage space 900, which will be described later.

The buffer unit 300 may have a main buffer 320 and a sub buffer 340. The main buffer 320 and sub buffer 340 each have a buffer space. A slot (not shown) on which a substrate is mounted is disposed in the buffer space of the main buffer 320 and the buffer space of the sub-buffer 340.

The substrate immediately after being taken out of the container F may temporarily stay in the buffer space of the main buffer 320. Additionally, the substrate just before being loaded into the container F may temporarily stay in the buffer space of the main buffer 320. According to one embodiment, the main buffer 320 may be a frame that has a generally rectangular parallelepiped shape. According to one embodiment, all sides of the main buffer 320 may be open. The buffer space of the main buffer 320 may function as a movement path for the index hand 142 described above, the first return hand 526 described later, or the second return hand 546 described later. Accordingly, the substrate transferred by the index hand 142, the first transfer hand 526, or the second transfer hand 546 may be seated in a slot (not shown) disposed in the main buffer 320.

The sub buffer 340 is arranged to be stacked with the main buffer 320. According to one embodiment, the sub buffer 340 may be located above the main buffer 320. A substrate immediately after being loaded into the main buffer 320 may temporarily stay in the buffer space of the sub-buffer 340. Additionally, a substrate just before being exported to the main buffer 320 may temporarily stay in the buffer space of the sub-buffer 340. According to one embodiment, when transporting a substrate to one of the main buffer 320, the inversion unit 400, which will be described later, and the processing chamber 600, the main buffer 320 and the inversion unit ( 400), or when it is difficult to directly transport the substrate to the processing chamber 600, the substrate may temporarily stay in the sub-buffer 340.

According to one embodiment, the sub-buffer 340 may have a substantially rectangular parallelepiped shape. Among the sides of the sub-buffer 340, the sides facing the first and second transfer chambers 501 and 502, which will be described later, may be open. Accordingly, the buffer space of the sub-buffer 340 may function as a movement path for the first transfer hand 526, which will be described later, or the second transfer hand 546, which will be described later. Accordingly, the substrate transferred by the first transfer hand 526 or the second transfer hand 546 may be seated in a slot (not shown) disposed in the sub-buffer 340.

Referring to FIG. 3, the inversion unit 400 is arranged to be stacked with the buffer unit 300 in the third direction 6. According to one embodiment, the inversion unit 400 may be located above the buffer unit 300. The inversion unit 400 reverses the positions of the patterned surface and the non-patterned surface of the substrate. According to one embodiment, the inversion unit 400 may be placed above the sub-buffer 340. There may be a plurality of inversion units 400. According to one embodiment, two inversion units 400 may be provided in each of the first processing block 22 and the second processing block 24. A plurality of inversion units 400 may be arranged to be stacked on top of each other.

Figure 5 is a cross-sectional view schematically showing the structure of an inversion unit according to an embodiment.

Referring to FIG. 5 , the inversion unit 400 may include a housing 410 and an inversion member 420. The housing 410 may have a generally rectangular parallelepiped shape. Among the sides of the housing 410, an entrance (not shown) through which a substrate is loaded will be formed on the side facing the first transfer chamber 501, which will be described later, and the side facing the second transfer chamber 502, which will be described later. You can. An inversion member 420 is disposed inside the housing 410.

The inversion member 420 may include a rotating body 430, a first gripper 440, a second gripper 450, a linear driver 460, and a rotating driver 470.

The first gripper 440 and the second gripper 450 are mounted on the rotating body 430. The first gripper 440 and the second gripper 450 are arranged to face each other in the vertical direction. The first gripper 440 and the second gripper 450 are installed on the rotating body 430 so that the separation distance between them can be changed. The linear driver 460 changes the positions of the first gripper 440 and the second gripper 450. Additionally, the rotation driver 470 rotates the rotation body 430.

According to one embodiment, the first gripper 440 may include a support 442 and a grip pin 444. The support 442 is installed on the rotating body 430. The support 442 may have a generally disk shape. Optionally, support 442 may have a generally ring shape. The grip pin 444 is coupled to the support 442. According to one embodiment, four grip pins 444 may be coupled to the support 442. Grip pins 444 support the ends of the substrate during inversion of the substrate. The first gripper 440 and the second gripper 450 may have structures that are symmetrical to each other based on the substrate supported between them. Since the second gripper 450 has the same or similar structure as the first gripper 440, description of the second gripper 450 will be omitted below.

The linear actuator 460 changes the positions of the first gripper 440 and the second gripper 450 so that the separation distance between the first gripper 440 and the second gripper 450 changes between the grip position and the release position. I order it. The grip position may be defined as a position where the first gripper 440 and the second gripper 450 are combined to grip the substrate placed between the first gripper 440 and the second gripper 450. The release position is defined as the position where the gap between the first gripper 440 and the second gripper 450 is widened so that the substrate can be brought in or taken out between the first gripper 440 and the second gripper 450. It can be.

Referring again to FIGS. 2 to 4, the transfer chamber 500 according to one embodiment may include two transfer chambers 500 in each of the first processing block 22 and the second processing block 24. . Hereinafter, the two transfer chambers 500 disposed in the first processing block 22 are defined as the first transfer chamber 501 and the second transfer chamber 502.

With respect to the inversion unit 400, the first transfer chamber 501 is located on one side of the inversion unit 400, and the second transfer chamber 502 is located on the other side of the inversion unit 400. When viewed from above, the first transfer chamber 501, the inversion unit 400, and the second transfer chamber 502 are sequentially arranged in a direction parallel to the second direction 4.

A transfer robot is disposed in the first transfer chamber 501 and the second transfer chamber 502, respectively. According to one embodiment, a first guide rail 510 and a first transfer robot 520 are disposed in the first transfer chamber 501. Additionally, a second guide rail 530 and a second transfer robot 540 are disposed in the second transfer chamber 502. The first transfer chamber 501 and the second transfer chamber 502, the first guide rail 510 and the second guide rail 530, and the first transfer robot 520 and the second transfer robot 540 are connected to each other. Since it has the same or similar structure, the following description will focus on the components included in the first transfer chamber 501.

The first guide rail 510 is disposed inside the first transfer chamber 501. The first guide rail 510 has a longitudinal direction parallel to the third direction 6. The first transfer robot 520 moves along the first guide rail 510. That is, the first guide rail 510 guides the movement of the first transport robot 520 in the vertical direction.

Figure 6 is a perspective view schematically showing a first transfer robot according to an embodiment.

Referring to FIG. 6 , the first transfer robot 520 may include a driving block 521, a base plate 522, and a first transfer hand 526.

The driving block 521 is installed on the first guide rail 510. The driving block 521 moves linearly along the longitudinal direction of the first guide rail 510. For example, the driving block 521 moves straight in a direction parallel to the third direction 6. The base plate 522 is installed on the drive block 521 via the support shaft 523. The support shaft 523 is mounted on the drive block 521 so that it can be rotated about its central axis by the rotation driver 524. According to one embodiment, the rotation driver 524 may be a motor. Additionally, the support shaft 523 can move up and down by the vertical driver 525. For example, vertical actuator 525 can be a cylinder or a motor.

The first transfer hand 526 supports the substrate. A plurality of first transfer hands 526 may be provided. A plurality of first transfer hands 526 are arranged to face each other in the vertical direction. Additionally, the plurality of first transfer hands 526 are arranged to be spaced apart from each other at a certain distance. According to one embodiment, there may be two first transfer hands 526. The plurality of first transfer hands 526 may move forward or backward independently of each other. The plurality of first transfer hands 526 are respectively installed on the base plate 522 via brackets 527. Each of the brackets 527 is coupled to a guide hole 528 formed on the side of the base plate 522. That is, the bracket 527 is coupled to the base plate 522 through the guide hole 528, and the bracket 527 moves by a driver (not shown), and the first transfer hand coupled to the bracket 527 accordingly. (526) can move forward and backward.

Referring again to FIGS. 2 and 4, the processing chamber 600 performs a predetermined process on the substrate. According to one embodiment, the predetermined treatment may be a cleaning treatment to remove impurities (byproducts) on the substrate. The processing chamber 600 may include a first cleaning chamber 601 and a second cleaning chamber 602.

The first cleaning chamber 601 is disposed adjacent to the first transfer chamber 501. Based on the first transfer chamber 501, the index frame 14 is disposed on one side of the first transfer chamber 501, and the first cleaning chamber 601 is placed on the other side of the first transfer chamber 501. It is placed. When viewed from above, the index frame 14, the first transfer chamber 501, and the first cleaning chamber 601 are sequentially arranged in a direction parallel to the first direction 2. According to one embodiment, a plurality of first cleaning chambers 601 may be provided. For example, each of the first processing block 22 and the second processing block 24 may be provided with two first cleaning chambers 601. The plurality of first cleaning chambers 601 are arranged to be stacked in the vertical direction. The plurality of first cleaning chambers 601 have the same or similar structures and can perform the same type of processing on the substrate.

The second cleaning chamber 602 is disposed adjacent to the second transfer chamber 502. Based on the second transfer chamber 502, the index frame 14 is disposed on one side of the second transfer chamber 502, and the second cleaning chamber 602 is located on the other side of the second transfer chamber 502. It is placed. When viewed from above, the index frame 14, the second transfer chamber 502, and the second cleaning chamber 602 are sequentially arranged along the second direction 4. According to one embodiment, a plurality of second cleaning chambers 602 may be provided. For example, each of the first processing block 22 and the second processing block 24 may be provided with two second cleaning chambers 602. The plurality of second cleaning chambers 602 are arranged to be stacked up and down. Each of the plurality of second cleaning chambers 602 has the same or similar structure and can perform the same type of processing on the substrate. Additionally, the first cleaning chambers 601 and the second cleaning chambers 602 have the same structure and can perform the same type of processing on the substrate.

Due to the above-described arrangement, when viewed from above, the first cleaning chamber 601 and the second cleaning chamber 602 are located in a direction parallel to the second direction 4. Additionally, the first cleaning chamber 601 and the second cleaning chamber 602 are positioned to be spaced apart from each other.

The space between the first cleaning chamber 601 and the second cleaning chamber 602 may function as a parts storage space 900. According to one embodiment, parts may be stored in the parts storage space 900. Components stored in the components storage space 900 may include electrical components, valve units, etc. Optionally, parts stored in the parts storage space 900 may include various types of parts used in a liquid supply system in addition to electrical components or valve units.

Unlike the above-described example, the space between the first cleaning chamber 601 and the second cleaning chamber 602 is divided into a buffer unit 300, an inversion unit 400, a first cleaning chamber 601, or a second cleaning chamber. It may function as a passage for workers to enter during maintenance of 602. In this case, the surface facing the buffer unit 300 and the inversion unit 400, the surface facing the first cleaning chamber 601, and the surface facing the second cleaning chamber 602 are each accessible to the operator. A door (not shown) may be installed.

The first cleaning chamber 601 and the second cleaning chamber 602 clean the substrate. Since the first cleaning chamber 601 and the second cleaning chamber 602 have the same or similar structures and perform the same types of processing on the substrate, the following description will focus on the first cleaning chamber 601. .

The first cleaning chamber 601 according to one embodiment performs a first process and a second process on a substrate. The first process may be a process of processing the substrate with the non-patterned side of the substrate facing upward. Additionally, the second process may be a process of processing the substrate with the pattern surface of the substrate facing upward. According to one embodiment, in the first process, the non-patterned surface of the substrate may be cleaned using a brush unit 700 (see FIG. 7), which will be described later. According to one embodiment, in the first process, the non-patterned surface of the substrate may be cleaned using the brush unit 700 while supplying a cleaning liquid to the non-patterned surface of the substrate. Additionally, in the second process, the pattern surface of the substrate can be cleaned by supplying a processing liquid to the pattern surface of the substrate. In the second process, the processing liquid is supplied to the pattern surface of the substrate to clean the pattern surface of the substrate W, and then the processing liquid can be removed from the pattern surface of the substrate.

Specifically, according to one embodiment, the second process may include a removal process, a rinse process, and a replacement process. According to one embodiment, the treatment liquid may include chemicals, rinse liquid, and organic solvent. For example, the removal process may remove impurities such as foreign substances or thin films attached to the pattern surface of the substrate by supplying chemicals to the pattern surface of the substrate. Additionally, the rinse process may remove chemicals supplied to the patterned side of the substrate by supplying a rinse liquid to the patterned side of the substrate. For example, the rinse liquid may contain water. Additionally, the substitution process may supply an organic solvent such as isopropyl alcohol (IPA) to the pattern side of the substrate to replace the rinse solution supplied to the pattern side of the substrate with the organic solvent.

Unlike the above-described example, either the rinse process or the substitution process may be omitted in the second process. Additionally, the removal process may be performed multiple times using different types of chemicals. Additionally, the removal process can be performed multiple times using the same type of chemical with different compositions.

Unlike the above-described example, the second process may be a process of supplying a polymer and a solvent to the pattern side of the substrate, volatilizing the solvent to form a solidified body on the pattern side of the substrate, and removing it from the pattern side of the substrate.

Figure 7 is a cross-sectional view schematically showing a first process chamber according to an embodiment.

Referring to FIG. 7, the first cleaning chamber 601 includes a housing 610, a processing container 620, a support unit 630, a liquid supply unit 640, a lifting unit 650, and a brush unit 700. may include.

The housing 610 may have a generally rectangular parallelepiped shape. A semi-inlet (not shown) is formed on the side wall of the housing 610. The inlet (not shown) functions as a passage through which the substrate W is brought in or out. The inlet (not shown) may be formed on a side wall of the housing 610 that faces the first transfer chamber 501 (see FIG. 2). The substrate W is carried in or out of the internal space of the housing 610 by the first transfer robot 520 (see FIG. 2). A processing vessel 620, a support unit 630, a liquid supply unit 640, a lifting unit 650, and a brush unit 700 are disposed in the inner space of the housing 610.

The processing vessel 620 may be a bowl with an open top. The processing container 620 has a processing space 621 with an open top. The processing space 621 functions as a space where the substrate W is processed. For example, the substrate W may be processed in the first process or the second process within the processing space 621. The support unit 630 supports the substrate W within the processing space 621. Additionally, the support unit 630 rotates the substrate W within the processing space 621. The liquid supply unit 640 supplies processing liquid to the substrate W supported on the support unit 630. The lifting unit 650 adjusts the relative height between the processing vessel 620 and the support unit 630.

According to one embodiment, the processing vessel 620 may have a guide wall 622 and a plurality of recovery bins 624, 636, and 638. The guide wall 622 and the recovery containers 624, 626, and 628 each have a ring shape surrounding the support unit 630. Each of the recovery containers 624, 626, and 628 has a recovery space 624b, 626b, and 628b for separating and recovering different liquids used to treat the substrate W. When the liquid treatment process progresses, the liquid scattered by the rotation of the substrate W flows through the inlets 624a, 626b, and 628b of the respective recovery containers 624, 626, and 628 into the above-mentioned recovery spaces 624b and 626b. , 628b).

According to one embodiment, the processing container 620 may include a first recovery container 624, a second recovery container 626, and a third recovery container 628. The first recovery container 624 is arranged to surround the support unit 630, the second recovery container 626 is arranged to surround the first recovery container 624, and the third recovery container 628 is the second recovery container 628. It is arranged to surround the recovery container 626. The first inlet 624a, which flows liquid into the recovery space 624b of the first recovery tank 624, is larger than the second inlet 626a, which flows liquid into the recovery space 626b of the second recovery tank 626. It is located below. Additionally, the second inlet 626a is located below the third inlet 628a through which liquid flows into the recovery space 628b of the third recovery container 628. Liquid discharge pipes 624c, 626c, and 628c for discharging liquid are coupled to each of the recovery containers 624, 626, and 628, respectively. The liquid discharged through the liquid discharge pipes 624c, 626c, and 628c can be reused using an external regeneration system (not shown).

The number of recovery containers described above can vary depending on the number of liquids used and the number of liquids to be recovered or disposed of. Although not shown, an exhaust line for exhausting fume and gas may be connected to the bottom of the processing vessel 620.

The support unit 630 may include a spin chuck 631 and a drive shaft 634. The upper surface of the spin chuck 631 may be formed in a generally circular shape. Additionally, the upper surface of the spin chuck 631 may have a larger diameter than the substrate W. A support pin 632 that supports the rear side of the substrate W may be disposed in the center of the spin chuck 631. A plurality of support pins 632 may be disposed on the spin chuck 631. The support pin 632 is disposed in the upper portion of the spin chuck 631. The support pin 632 is arranged so that its upper end protrudes upward from the upper surface of the spin chuck 631. Accordingly, the substrate W is supported by the spin chuck 631 at a certain distance from the upper surface of the substrate W.

A chuck pin 633 is disposed on the edge of the spin chuck 631. The chuck pin 633 is disposed in the upper portion of the spin chuck 631. The chuck pin 633 is disposed so that its upper end protrudes from the upper surface of the spin chuck 631. The chuck pin 633 supports the side of the substrate W so that the substrate W does not deviate laterally from its fixed position on the support unit 630 when the substrate W rotates.

The drive shaft 634 is driven by the chuck driver 635 and is connected to the spin chuck 631. The drive shaft 634 may receive power from the chuck driver 635 and rotate around that axis. Accordingly, the spin chuck 631 connected to the drive shaft 634 may also rotate, and the substrate W supported on the spin chuck 631 may also rotate. Additionally, according to one embodiment, the chuck driver 635 can move the spin chuck 631 in the vertical direction.

The liquid supply unit 640 may include a first nozzle 641, a second nozzle 642, and a third nozzle 643. The first nozzle 641 according to one embodiment supplies chemicals to the substrate W supported on the support unit 630. Additionally, the second nozzle 642 supplies water onto the substrate W supported on the support unit 630. Water according to one embodiment may be pure water or deionized water. Additionally, the third nozzle 643 supplies an organic solvent (organic solution) onto the substrate W supported on the support unit 630. The organic solvent according to one embodiment may be isopropyl alcohol.

Each of the first nozzle 641, the second nozzle 642, and the third nozzle 643 is supported by an arm 644. Arm 644 is coupled with actuator 645. The actuator 645 may swing the arm 644 or move it in a straight line. The nozzles 641, 642, and 643 can be moved between the standby position and the liquid supply position by the driver 645.

The standby position may be a position where the nozzles 641, 642, and 643 wait when the processing liquid is not supplied to the substrate W. For example, in the standby position, nozzles 641 , 642 , and 643 may be located in an area outside the processing vessel 620 when viewed from above. The liquid supply position may be a position where the nozzles 641, 642, and 643 supply processing liquid to the substrate W. For example, at the liquid supply position, the nozzles 641, 642, and 643 may be located in the inner area of the processing vessel 620 when viewed from above.

Unlike the above-described example, the first nozzle 641, the second nozzle 642, and the third nozzle 643 are respectively connected to different arms, and each arm may be independently connected to a different actuator. Additionally, the liquid supply unit 640 may further include one or more nozzles in addition to the first nozzle 641, the second nozzle 642, and the third nozzle 643. The added nozzle can supply different types of processing liquid to the substrate (W).

The lifting unit 650 changes the position of the processing vessel 620. For example, the lifting unit 650 moves the processing container 620 in the vertical direction (eg, the third direction 6). As the processing container 620 moves up and down, the relative height between the processing container 620 and the substrate W supported on the support unit 630 changes. Accordingly, depending on the type of liquid supplied to the substrate W, the recovery containers 624, 626, and 628 can separate and recover the liquid. Unlike the above-described example, the position of the processing container 620 is fixed, and the support unit 630 moves in the vertical direction by the chuck driver 635 to adjust the relative height between the processing container 620 and the substrate W. You can change it.

The brush unit 700 cleans the substrate W supported on the support unit 630. The brush unit 700 removes impurities (byproducts) attached to the substrate W supported on the support unit 630 from the substrate W. According to one embodiment, the brush unit 700 may remove impurities attached to the non-patterned surface among the patterned surface and the non-patterned surface of the substrate W.

The brush unit 700 may include a body 710, a contact pad 720, a contact protrusion 730, a holder 740, a support rod 750, a holder driver 760, and a cleaning nozzle 790. there is.

The body 710 may be supported by a holder 740. According to one embodiment, the holder 740 may support the side of the body 710. The holder 740 may include an elastic material. According to one embodiment, the material of the holder 740 may include PEEK.

The support rod 750 generally has a rod shape. Support rod 750 may penetrate arm 770. The support rod 750 may penetrate the arm 770 and be connected to the holder driver 760 disposed on the top of the arm 770. According to one embodiment, one end of the support rod 750 is connected to the top of the holder 740, and the other end of the support rod 750 is connected to the holder driver 760. Accordingly, the body 710 may be coupled to the arm 770 by the support rod 750 at one end of the arm 770.

The holder driver 760 rotates the holder 740 around the support rod 750 as a central axis, and may also rotate the body 710 supported on the holder 740. Additionally, the holder driver 760 can move the holder 740 in the vertical direction via the support rod 750. Accordingly, the body 710 supported on the holder 740 can also move in the vertical direction. For example, holder driver 760 may be a motor.

An elastic member 752 may be disposed inside the support rod 750. An elastic member 752 may be disposed from the top of the support rod 750 to the bottom of the support rod 750. According to one embodiment, the elastic member 752 may be a spring. The elastic member 752 applies pressure applied to the non-patterned surface of the substrate W when the contact pad 720, which will be described later, contacts the non-patterned surface of the substrate W and scrubs the substrate W. By mitigating this, damage to the substrate W can be minimized.

The arm 770 supports the body 710 and a cleaning nozzle 790, which will be described later. Arm 770 is coupled to arm actuator 780. The arm driver 780 can move the entire arm 770, including the body 710, in the vertical direction. Additionally, the arm driver 780 can swing the entire arm 770, including the body 710. Arm driver 780 may include a plurality of motors. One of the plurality of motors may be a linear motor, and the other may be a rotary motor.

The position of the body 710 may be changed by the holder driver 760 and/or the arm driver 780. According to one embodiment, body 710 may be moved between a standby position and a process position by a holder driver 760 and/or an arm driver 780. The process position is a position where the contact pad 720 and/or the contact protrusion 730, which will be described later, can contact the substrate W, and the standby position is a position where the brush unit 700 does not process the substrate W. At this time, the body 710 may be in a waiting position. For example, body 710 in a process position may be located in an inner region of processing vessel 620 when viewed from above. Additionally, the body 710 in the standby position may be located in an area outside the processing vessel 620 when viewed from above.

The cleaning nozzle 790 may be installed on the arm 770. The lower end of the cleaning nozzle 790 may be located above the lower end of the contact pad 720, which will be described in detail below. The cleaning nozzle 790 discharges cleaning liquid onto the substrate. The cleaning nozzle 790 discharges the cleaning liquid to the non-patterned surface of the substrate W supported on the support unit 630. The cleaning liquid according to one embodiment may be pure water or deionized water. Unlike shown in FIG. 7 , the cleaning nozzle 790 may be installed closer to the front end of the arm 770 than the body 710.

8 is a perspective view schematically showing one embodiment of a body, a contact pad, and a contact protrusion. Hereinafter, the body, contact pad, and contact protrusion according to an embodiment of the present invention will be described in detail with reference to FIG. 8.

The body 710 may have a generally disk shape. The central area of body 710 may be penetrated. That is, according to one embodiment, the body 710 may be formed in a ring shape with a thickness.

The contact pad 720 contacts the substrate W to remove impurities attached to the substrate W. For example, the contact pad 720 can contact the non-patterned side of the substrate W and scrub the non-patterned side of the substrate W, thereby removing impurities attached to the non-patterned side of the substrate W. there is. Contact pad 720 is formed on body 710. The contact pad 720 is formed to protrude downward from the bottom of the body 710. According to one embodiment, the body 710 and the contact pad 720 may be formed integrally.

The contact pad 720 may be formed to protrude a certain distance from the bottom of the body 710. The curvature of the inner portion of the contact pad 720 may correspond to the curvature of the central region of the body 710. Additionally, the curvature of the outer portion of the contact pad 720 may correspond to the curvature of the edge area of the body 710. According to one embodiment, the contact pad 720 may have a generally fan-shaped shape when viewed from above. For example, the width (or width) of the contact pad 720 may gradually increase from the central area of the body 710 to the edge area of the body 710.

The material of the contact pad 720 according to one embodiment may include a material that is relatively more ductile than the contact protrusion 730, which will be described later. Specifically, the material of the contact pad 720 may include a material with a relatively smaller Young's modulus than that of the contact protrusion 730, which will be described later. For example, the material of the contact pad 720 may include polyvinyl alcohol (PVA).

The contact pad 720 may be divided into a plurality of pieces along the circumferential direction of the body 710. The plurality of divided contact pads 720 may be positioned to be spaced apart from each other along the circumferential direction of the body 710. The space between the plurality of contact pads 720 may be defined as a groove portion 712. When viewed from above, the contact pads 720 and the groove portion 712 may be combined to form the shape of the body 710. The groove portion 712 functions as a space where impurities that fall off from the non-patterned surface of the substrate W are discharged when the contact pad 720 contacts the non-patterned surface of the substrate W. The detailed mechanism for this will be described later.

According to one embodiment, the width (or width) of the groove portion 712 in the central region of the body 710 may be different from the width (or width) of the groove portion 712 in the edge region of the body 710. You can. According to one embodiment, the width of the groove 712 in the central area of the body 710 may be smaller than the width of the groove 712 in the edge area of the body 710. According to one embodiment, the width of the groove portion 712 may gradually increase from the central area of the body 710 to the edge area. That is, the groove portion 712 according to one embodiment may have a generally fan-shaped shape when viewed from above.

The contact protrusion 730 causes impurities attached to the substrate W to fall off. The contact protrusion 730 can remove impurities that are not removed by the contact pad 720 among impurities strongly attached to the non-patterned surface of the substrate W by causing them to fall off from the non-patterned surface of the substrate W. The material of the contact protrusion 730 according to one embodiment may include a material that is relatively stronger than that of the contact pad 720. Specifically, the material of the contact protrusion 730 may include a material with a relatively larger Young's modulus than that of the contact pad 720. For example, the material of the contact protrusion 730 may include nylon, polypropylene (PP), or silicon carbide (SiC).

The contact protrusion 730 is installed on the body 710. The contact protrusion 730 is disposed in the groove portion 712. The contact protrusion 730 has an upper and lower longitudinal direction. According to one embodiment, the contact protrusion 730 may have a generally cylindrical shape. Optionally, the contact protrusion 730 may have a plurality of hairs. Additionally, the lower end of the contact protrusion 730 may be formed to be round.

The lower end of the contact protrusion 730 protrudes a certain distance downward from the bottom of the body 710. Additionally, the lower end of the contact protrusion 730 may be located at a height corresponding to the lower end of the contact pad 720. For example, the bottom of the contact protrusion 730 may be located at the same height as the bottom of the contact pad 720. In this case, the contact protrusion 720 may contact the non-patterned surface of the substrate W. Accordingly, the contact protrusion 720 can remove impurities attached to the non-patterned surface of the substrate W from the non-patterned surface of the substrate W.

More preferably, the lower end of the contact protrusion 730 may be located at a height that does not protrude from the lower end of the contact pad 720. That is, the lower end of the contact protrusion 730 may be located at a height closer to the body 710 than the lower end of the contact pad 720. At this time, the height difference between the bottom of the contact protrusion 730 and the bottom of the contact pad 720 may be a small value of several micrometers to several millimeters. In this case, even if the contact protrusion 720 does not directly contact the substrate W, impurities protruding from the non-patterned surface of the substrate W can be removed from the non-patterned surface of the substrate W.

As described above, the contact protrusion 730 is made of a material that is relatively more rigid than the contact pad 720, so the lower end of the contact protrusion 730 is farther downward than the lower end of the contact pad 720. When positioned to protrude, the contact protrusion 730 may preemptively contact the substrate (W). Due to the above structure, the contact protrusion 730 contacts the substrate W before the contact pad 720, thereby minimizing damage to the substrate W caused by the contact protrusion 730.

Hereinafter, for convenience of understanding, an example is taken where the bottom of the contact protrusion 730 is located at the same height as the bottom of the contact pad 720, and the contact protrusion 730 contacts the non-patterned surface of the substrate W. Listen and explain.

A plurality of contact protrusions 730 may be provided. A plurality of contact protrusions 730 may be combined with each other to form a group. For example, five contact protrusions 730 may constitute one group. The contact protrusions 730 belonging to each group may be spaced a certain distance apart from each other, but may be located adjacent to each other. Hereinafter, one group composed of five contact protrusions 730 will be referred to as the first group 731, and another group composed of five other contact protrusions 730 that do not belong to the first group 731 will be referred to as the first group 731. It is called the second group 732, and another group composed of five contact protrusions 730 that do not belong to both the first group 731 and the second group 732 is called the third group 733. It is called.

The first group 731 may be located closer to the central area of the groove portion 712 than the second group 732 and the third group 733. Additionally, each of the second group 732 and the third group 733 may be located closer to the edge area of the groove portion 712 than the first group 731. For example, the second group 732 and the third group 733 may be located in an area that is the same distance away from the center of the body 710.

Additionally, the first groups 731 located in each groove portion 712 may be combined with each other to form a circle having a first diameter. Additionally, the second groups 732 and third groups 733 located in each groove portion 712 may be combined to form a circle having a second diameter. The first diameter may be smaller than the second diameter. Additionally, the first diameter may be larger than the diameter of the central area of the pierced body 710. Additionally, the second diameter may be smaller than the diameter of the end of the edge area of the body 710.

FIG. 9 is a flow chart sequentially showing an embodiment of a process for transporting and processing a substrate using the substrate processing apparatus according to the embodiment of FIG. 1 .

Hereinafter, a method of processing a substrate using the substrate processing apparatus according to the embodiment of FIG. 1 will be described in detail with reference to FIG. 9 . The substrate processing method described below may be performed by a controller (not shown) controlling the substrate processing device. For example, the controller may control the configurations of the substrate processing apparatus according to the embodiment of FIG. 1 . Accordingly, hereinafter, a substrate processing method according to an embodiment of the present invention will be described by directly citing the reference numerals shown in FIGS. 1 to 8.

The controller includes a process controller consisting of a microprocessor (computer) that controls the substrate processing device, a keyboard that allows the operator to input commands to manage the substrate processing device, and a device that visualizes and displays the operating status of the substrate processing device. A user interface consisting of a display, etc., a control program for executing the processing performed in the substrate processing device under the control of the process controller, and a program for executing processing in each component according to various data and processing conditions, that is, a processing recipe. A stored memory unit may be provided. Additionally, the user interface and storage may be connected to the process controller. The processing recipe may be stored in a storage medium in the storage unit, and the storage medium may be a hard disk, a portable disk such as a CD-ROM or DVD, or a semiconductor memory such as a flash memory.

The substrate processing method according to an embodiment of the present invention includes a first transport step (S10), a first processing step (S20), a second transport step (S30), a second processing step (S40), and a third processing step (S40). It may include a return step (S50). According to one embodiment, the first conveyance step (S10), the first process processing step (S20), the second conveyance step (S30), the second process processing step (S40), and the third conveyance step (S50) are performed by time. It can be performed in the following order.

In the first transfer step (S10), the substrate W is transferred from the container F to the first cleaning chamber 601 and/or the second cleaning chamber 602. Hereinafter, for convenience of explanation, the first transport step (S10) will be described as an example of transporting the substrate W from the container F to the first cleaning chamber 601.

The index robot 120 removes the substrate W from the container F placed in the load port 12 and carries it into the main buffer 320. As described above, since the substrate W is placed with the pattern side facing upward in the container F, the substrate W is stored in the main buffer 320 with the pattern side facing upward. The first transfer robot 520 carries out the substrate W from the main buffer 320 and loads the substrate W into the inversion unit 400 . According to one embodiment, when other substrates W are brought into all the reversal units 400 and the first transfer robot 520 cannot load the substrate W into the reversal units 400, the first transfer robot 520 is unable to load the substrate W into the inversion units 400. The robot 520 may load the substrate W from the main buffer 320 into the sub-buffer 340. Thereafter, when any one of the inversion units 400 is empty, the first transfer robot 520 may unload the substrate W loaded into the sub-buffer 340 and transfer it to the inversion unit 400.

10 to 13 are diagrams sequentially showing an embodiment of an operation in which a substrate is inverted by an inversion unit.

Referring to FIGS. 10 to 13 , the positions of the pattern surface and the non-pattern surface of the substrate W are reversed in the inversion unit 400 . According to one embodiment, with the first gripper 440 and the second gripper 450 disposed at the release position, the substrate W is transported between the first gripper 440 and the second gripper 450. . Afterwards, the first gripper 440 and the second gripper 450 move from the release position to the grip position. Accordingly, the substrate W is gripped by the first gripper 440 and the second gripper 450. With the substrate W gripped, the rotation driver 470 rotates the rotation body 430. As the rotating body 430 rotates, the substrate W is inverted. That is, the substrate W is inverted with the non-pattern surface facing upward as the rotating body 430 rotates. Afterwards, the first gripper 440 and the second gripper 450 move from the grip position to the release position.

The first transfer robot 520 carries out the substrate W from the inversion unit 400 and carries it into the first cleaning chamber 601 . At this time, the substrate W is brought into the first cleaning chamber 601 with the non-patterned side facing upward, and is supported by the support unit 630.

In the first process processing step (S20), the first process is performed on the non-patterned side of the substrate W. According to one embodiment, in the first process, the non-patterned surface of the substrate W is cleaned using the brush unit 700. According to one embodiment, in the first process, the non-patterned surface of the substrate W can be cleaned using the brush unit 700 while discharging the cleaning liquid onto the non-patterned surface of the substrate W.

14 to 17 are views sequentially showing an embodiment of the first process.

The substrate W with the pattern surface facing downward is supported on the support unit 630 . At this time, the support pin 632 and the chuck pin 633 do not interfere with the pattern surface of the substrate W, respectively. When the substrate W is supported on the support unit 630, the body 710 moves from the standby position to the process position. For example, the body 710 may move to a position where it overlaps the substrate W when viewed from above. The body 710 moves to the upper side of the central area of the substrate W. The body 710 located in the center of the substrate W moves downward, and accordingly, the contact pad 720 and/or the contact protrusion 730 may contact the non-patterned surface formed in the central area of the substrate W. You can.

Additionally, before the contact pad 720 and/or the contact protrusion 730 contacts the non-patterned surface formed on the substrate W, the body 710 may rotate. That is, while the body 710 rotates, the contact pad 720 and/or the contact protrusion 730 may contact the non-patterned surface of the substrate W. Additionally, after the contact pad 720 and/or the contact protrusion 730 contacts the non-patterned surface of the substrate W, the spin chuck 631 may rotate. However, the present invention is not limited to this, and the spin chuck 631 may rotate before or simultaneously with the contact pad 720 and/or the contact protrusion 730 contacting the non-patterned surface of the substrate W.

According to one embodiment, the rotation direction of the body 710 and the rotation direction of the spin chuck 631 may be the same. In this case, the number of rotations per unit time of the body 710 and the number of rotations per unit time of the spin chuck 631 may be different from each other. For example, the number of rotations per unit time of the body 710 may be greater than the number of rotations per unit time of the spin chuck 631.

Additionally, when the contact pad 720 and/or the contact protrusion 730 and the substrate W contact each other, the elastic member 752 may be compressed. Accordingly, damage to the substrate W while the body 710 moves downward to contact the substrate W can be minimized.

Additionally, while the contact pad 720 and/or the contact protrusion 730 and the substrate W are in contact with each other, the cleaning nozzle 790 discharges the cleaning liquid E toward the non-patterned surface of the substrate W. Since the spin chuck 631 is rotating, the cleaning liquid E discharged by the cleaning nozzle 790 can flow to the entire area of the substrate W. Unlike the above-described example, the cleaning nozzle 790 is directed toward the non-patterned surface of the substrate W before the contact pad 720 and/or the contact protrusion 730 and the substrate W contact each other. ) can be discharged. Additionally, discharge of the cleaning liquid E may be continued while the contact pad 720 and/or the contact protrusion 730 and the substrate W are in contact with each other.

The body 710 moves from the central area of the substrate W to the edge area of the substrate W. While the body 710 moves from the central area of the substrate W to the edge area of the substrate W, the body 710 continuously rotates. Additionally, while the body 710 moves from the central area of the substrate W to the edge area of the substrate W, the contact pad 720 and/or the contact protrusion 730 are connected to the non-patterned surface of the substrate W. You can be in continuous contact. While the spin chuck 631 rotates, the body 710 moves from the central area of the substrate W to the edge area, so that the entire non-patterned area of the substrate W is exposed to the contact pad 720 and/or contact protrusion. Contact (730). As the contact pad 720 and/or the contact protrusion 730 continuously contacts the non-patterned surface of the substrate W, impurities attached to the non-patterned surface of the substrate W are removed from the non-patterned surface of the substrate W. I order it.

When the body 710 moves to the edge area, the body 710 moves upward and is spaced a certain distance away from the non-patterned surface of the substrate W. The body 710 moves again from above the edge area of the substrate W to above the central area of the substrate W. When the body 710 is located on the upper side of the central area of the substrate W, the body 710 moves downward again and contacts the non-patterned surface of the substrate W, the contact pad 720 and/or the contact protrusion ( 730) is repeated. The above-described mechanism may be performed at least once.

A large amount of impurities may be attached to the non-patterned side of the substrate. Such impurities may bounce back to the pattern surface of the substrate in subsequent processes, causing process defects. Additionally, if impurities attached to the non-patterned side of the substrate are not removed, when processing the substrate while supporting it in a subsequent process, the substrate may be tilted due to impurities attached to the portion supporting the substrate.

Generally, when cleaning a substrate using a pad, impurities attached to the substrate are removed through contact between the pad and the substrate. In this case, the contaminated cleaning solution mixed with impurities that has fallen from the substrate cannot be discharged between the pad and the substrate and is trapped between the pad and the substrate. Contaminated cleaning solution that cannot be discharged remains on the surface of the pad, and when the pad cleans another area of the substrate, impurities mixed in the cleaning solution may adhere to the substrate again.

Figure 18 is a partial enlarged view schematically showing the discharge of chemical liquid from the body, contact pad, and contact protrusion.

Referring to FIG. 18, the cleaning liquid (E) discharged and remaining on the non-patterned side of the substrate is discharged into the groove portion 712 by the contact pad 720. Due to the shape of the contact pad 720 of the groove portion 712 according to an embodiment of the present invention, the width (or width) of the groove portion 712 gradually increases from the central area to the edge area of the body 710. increases. Due to the structural characteristics of the groove portion 712, the capillary force (F1) of the cleaning solution (E) increases toward the edge area of the groove portion (712). According to the capillary force F1 that increases from the central area of the groove 712 to the edge area, that is, the cleaning liquid E in the groove 712 flows from the central area of the groove 712 to the edge area. It is guided to be discharged in this direction. Accordingly, the cleaning solution (E) in the groove portion 712 and impurities (not shown) mixed in the cleaning solution (E) are discharged to the outside of the body 710 and removed from the substrate.

The contact protrusion 730 according to an embodiment of the present invention is formed to have a rounded bottom. Accordingly, capillary force F2 is generated by the interface between the bottom of the contact protrusion 730 and the non-patterned surface of the substrate W, contributing to the discharge of the cleaning liquid E within the groove portion 712. Additionally, by combining a plurality of contact protrusions 730 to form a group, the capillary force F2 generated by each contact protrusion 730 forming one group can be further increased.

In addition, since the material of the contact pad 720 according to an embodiment of the present invention includes a highly ductile material (e.g., PVA), damage to the non-patterned surface of the substrate W is caused when it contacts the substrate W. Giving can be minimized. That is, the contact pad 720 according to an embodiment of the present invention can prevent deformation of the non-patterned surface of the substrate W.

Generally, when cleaning a substrate using a pad, a large force cannot be applied to contact the substrate to prevent damage to the substrate. If the impurities attached to the surface of the substrate are made of a material that is difficult to remove from the substrate, such impurities are not easily removed even when using a pad. Accordingly, since the material of the contact protrusion 730 according to an embodiment of the present invention includes a material with strong rigidity, impurities attached to the non-pattern surface of the substrate W are not easily removed by the contact pad 720. Impurities can be easily removed from the non-patterned surface of the substrate W.

Additionally, because body 710 rotates while in contact with the non-patterned surface of substrate W, the angular velocity in the central region including the center of body 710 is greater than the angular velocity in edge regions of body 710. Relatively small. Accordingly, the central area of the body 710 according to one embodiment is formed to be penetrating, so that the cleaning liquid (E) remaining in the central area of the body 710 can be easily discharged to the edge area of the body 710. there is.

Referring again to FIG. 9, the second return step (S30) is performed after the first processing step (S20) is completed. When the first processing step (S20) is completed, the first transfer robot 520 carries out the substrate W from the first cleaning chamber 601 and transfers it to the empty inversion unit 400. In the inversion unit 400, the positions of the pattern surface and the non-pattern surface of the substrate W are reversed. For example, in the inversion unit 400, the substrate W may be inverted so that the pattern side faces upward. The first transfer robot 520 transfers the upside-down substrate W to the first cleaning chamber 601 . However, it is not limited to this, and the first transfer robot 520 determines the situation in which the substrate is processed in the processing chamber 600 and operates the first cleaning chamber 601, the second cleaning chamber 602, and the sub-buffer ( The substrate (W) can be transported in any one of 340).

The substrate W brought into the first cleaning chamber 601 is supported on the support unit 630 with the pattern side facing upward. When the substrate W is supported on the support unit 630, a second processing step (S40) is performed.

Figure 19 is a diagram showing an example of the second process processing.

Referring to FIG. 19, the liquid supply unit 640 supplies processing liquid toward the pattern surface of the substrate W. For example, the liquid supply unit 640 may sequentially supply chemicals, rinse liquid, and organic solvent to the pattern surface of the substrate W. However, the present invention is not limited to this, and only some of the chemicals, rinse liquid, and organic solvent may be supplied to the pattern surface of the substrate W, and the supply order of the chemicals, rinse liquid, and organic solvent may also be changed.

Referring again to FIG. 9, after the second processing step (S40) is completed, the first transfer robot 520 removes the substrate W from the first cleaning chamber 601 and transfers it to the main buffer 320. . At this time, the substrate W maintains the pattern surface facing upward. When there is no empty space in the main buffer 320, the first transfer robot 520 loads the substrate W into the sub buffer 340. Thereafter, when an empty space is created in the main buffer 320, the first transfer robot 520 carries out the substrate W from the sub-buffer 340 and brings it into the main buffer 320. Thereafter, the index robot 120 takes out the substrate W from the main buffer 320 and stores the substrate W in the container F placed in the load port 12.

According to an embodiment of the present invention, the first process step (S20) of cleaning the non-pattern side of the substrate (W) is first performed, and then the second process step (S20) of cleaning the pattern side of the substrate (W) is performed ( S40) can be performed. During the process of performing the first processing step (S20), impurities may attach to the pattern surface of the substrate (W). In this case, by performing the second processing step (S40) after the first processing step (S20), impurities can be removed from the pattern surface of the substrate (W) in the second processing step (S40).

Unlike the above-described example, the body 710 may rotate after or simultaneously with the contact pad 720 and/or the contact protrusion 730 contacting the non-patterned surface formed on the substrate W.

Unlike the above-described example, before the contact pad 720 and the contact protrusion 730 contact the non-patterned surface of the substrate W, the cleaning liquid is already supplied to the non-patterned surface of the substrate W, and the contact pad ( While the contact protrusion 720) and the contact protrusion 730 are in contact with the non-patterned surface of the substrate W, the cleaning liquid may not be supplied to the substrate W.

In addition, after the contact pad 720 and the contact protrusion 730 contact the non-patterned surface of the substrate W to remove impurities from the non-patterned surface of the substrate W, they are transferred to the non-patterned surface of the substrate W. A treatment liquid may be supplied. Additionally, after supplying the processing liquid, the substrate W can be dried by rotating at high speed.

In addition, before the contact pad 720 and the contact protrusion 730 contact the non-patterned surface of the substrate W to remove impurities from the non-patterned surface of the substrate W, A treatment liquid may be supplied. Thereafter, while discharging the cleaning liquid onto the non-patterned side of the substrate W, the contact pad 720 and the contact protrusion 730 come into contact with the non-patterned side of the substrate W, and the rinse liquid is applied to the non-patterned side of the substrate W. can be supplied.

Additionally, unlike the above-described example, the second processing step (S40) may be performed first, and then the first processing step (S20) may be performed.

Additionally, unlike the above-described example, the brush unit 700 may not include the cleaning nozzle 790. In this case, when performing the first processing step (S20), the liquid supply unit 640 may supply deionized water to the non-patterned side of the substrate W. When the liquid supply unit 640 supplies deionized water to the non-patterned surface of the substrate W, the arm 644 of the liquid supply unit 640 and the arm 770 of the brush unit 700 operate so as not to interfere with each other. can do.

Additionally, unlike the above-described example, the brush unit 700 may contact the pattern surface of the substrate W to remove impurities attached to the pattern surface of the substrate W from the pattern surface of the substrate W.

In addition, unlike the above-described example, a first process step (S20) of cleaning only the non-patterned surface of the substrate W is performed in one of the first cleaning chamber 601 and the second cleaning chamber 602, A second process step (S40) of cleaning only the pattern surface of the substrate W may be performed in the other of the first cleaning chamber 601 and the second cleaning chamber 602, respectively.

Additionally, unlike the above-described example, one processing block 20 may be provided. Optionally, three or more processing blocks 20 may be provided. Additionally, unlike the above-described example, the buffer unit 300 may include only the main buffer 320.

Below, a brush unit according to another embodiment of the present invention will be described. The brush unit according to an embodiment described below has a structure that is mostly the same or similar to the brush unit 700 described with reference to FIGS. 7 and 8, except where additionally described. Accordingly, hereinafter, description of overlapping configurations will be omitted.

20 and 21 are views schematically showing another embodiment of a brush unit.

Referring to FIG. 20, the first group 731, the second group 732, and the third group 733 may be sequentially arranged in a direction from the center area of the groove portion 712 toward the edge area. For example, the first group 731 is located closer to the central area of the groove portion 712 than the second group 732 and the third group 733. Additionally, the second group 732 is located closer to the central area of the groove portion 712 than the third group 733. The third group 733 is located closer to the edge area of the groove portion 712 than the first group 731 and the second group 732. However, it is not limited to the above-described example, and groups composed of a plurality of protrusions 730 may be arranged in various areas within the groove portion 712.

Referring to Figure 21, the brush unit 700 according to an embodiment of the present invention includes a body 710, a contact pad 720, a holder 740, a support rod 750, a holder driver 760, and a cleaning nozzle. 790, and may include a polishing pad 830. Hereinafter, the description will focus on the polishing pad 830, which has a non-overlapping configuration.

The polishing pad 830 according to one embodiment may be placed in the groove portion 712. Additionally, the polishing pad 830 may be positioned to be spaced apart from the contact pad 720 by a certain distance. The bottom of the polishing pad 830 may be positioned at the same height as the bottom of the contact pad 720. According to one embodiment, the polishing pad 830 may be formed integrally with the body 710.

According to the above-described embodiment of the present invention, when the contact pad 720 contacts the non-patterned surface of the substrate W, the polishing pad 830 also contacts the non-patterned surface of the substrate W. Fine and uniform voids may exist on the lower surface of the polishing pad 830. Optionally, fine grooves may be uniformly formed on the lower surface of the polishing pad 830. Accordingly, when the polishing pad 830 contacts the non-patterned surface of the substrate W, scratches on the non-patterned surface of the substrate W can be minimized. Additionally, impurities that adhere to the non-patterned surface of the substrate W and are not easily removed by the contact pad 720 can be easily removed by the polishing pad 830.

Figures 22 and 23 are views schematically showing another embodiment of the first process.

Referring to FIG. 22, the substrate W and the body 710 may each rotate in the first processing step. According to one embodiment, the substrate W and the body 710 may rotate in different directions. For example, the substrate W may rotate counterclockwise, and the body 710 may rotate clockwise. Optionally, the substrate W may rotate clockwise and the body 710 may rotate counterclockwise.

According to an embodiment of the present invention, the substrate W and the body 710 rotate in opposite directions, so that impurities attached to the non-patterned surface of the substrate W can be more easily removed. That is, according to one embodiment of the present invention, when the contamination state of the non-pattern surface of the substrate W is relatively serious, the rotation directions of the substrate W and the body 710 are set in opposite directions to ) Impurities attached to the rain pattern surface can be removed more efficiently.

Referring to FIG. 23 , in the first processing step, the body 710 may move back and forth between the central area of the substrate W and the edge area of the substrate W. While cleaning the non-patterned surface of the substrate W, the body 710 may move back and forth between the central area of the substrate W and the edge area of the substrate W multiple times.

The above detailed description is illustrative of the present invention. Additionally, the foregoing is intended to illustrate preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications can be made within the scope of the inventive concept disclosed in this specification, a scope equivalent to the written disclosure, and/or within the scope of technology or knowledge in the art. The written examples illustrate the best state for implementing the technical idea of the present invention, and various changes required for specific application fields and uses of the present invention are also possible. Accordingly, the detailed description of the invention above is not intended to limit the invention to the disclosed embodiments. Additionally, the appended claims should be construed to include other embodiments as well.

10: Index block
120: Index robot
20: Processing block
300: buffer unit
320: main buffer
340: sub buffer
400: Inversion unit
500: Return chamber
520: First transfer robot
600: processing chamber
601: First cleaning chamber
620: Processing vessel
630: support unit
640: Liquid supply unit
700: Brush unit
710: body
720: contact pad
730: Contact protrusion

Claims (30)

In a device for processing a substrate,
a housing having a processing space;
a support unit supporting a substrate in the processing space; and
Includes a brush unit for cleaning the substrate supported on the support unit,
The brush unit is,
A body formed in a circular shape; and
It includes a plurality of contact pads formed on the body,
Between the contact pads, a groove portion through which impurities falling off from the substrate are discharged is located,
A substrate processing apparatus, wherein the width of the groove portion in the central region of the body and the width of the groove portion in the edge region of the body are different from each other. According to paragraph 1,
The contact pad is divided into a plurality of pieces along the circumferential direction of the body,
A substrate processing apparatus, wherein the width of the groove portion in the central area of the body is smaller than the width of the groove portion in the edge area of the body. According to paragraph 2,
A substrate processing device wherein the width of the groove portion gradually widens from the central region of the body to the edge region of the body. According to paragraph 1,
The brush unit is,
A substrate processing device further comprising a plurality of contact protrusions disposed in the groove portion. According to paragraph 4,
The bottom of the contact protrusion is,
A substrate processing device located at the same height as the bottom of the contact pad, or located at a height closer to the body than the bottom of the contact pad. According to paragraph 4,
One group of the plurality of groups of contact protrusions is located adjacent to the central area of the body,
Another group of the plurality of contact protrusions is located adjacent to an edge area of the body. According to paragraph 4,
A substrate processing device in which the bottom of the contact protrusion is formed to be round. According to paragraph 4,
A substrate processing device wherein the contact pad includes a material that is relatively more ductile than the contact protrusion. According to clause 8,
The material of the contact pad includes PVA (polyvinyl alcohol),
A substrate processing device wherein the contact protrusion is made of nylon, polypropylene (PP), or silicon carbide (SiC). According to paragraph 1,
The body is formed in a circular shape with a central area penetrating,
The contact pad is formed to protrude downward from the bottom of the body, and the bottom of the contact pad is in contact with the substrate. According to paragraph 1,
The brush unit is,
A substrate processing apparatus further comprising a plurality of polishing pads disposed in the groove portion and in contact with the substrate. According to paragraph 1,
The brush unit is,
A substrate processing apparatus further comprising a cleaning nozzle that discharges a cleaning liquid onto the substrate supported on the support unit. According to clause 12,
The brush unit is,
an arm supporting the body and the cleaning nozzle;
an arm driver that moves the arm;
A holder supporting the side of the body;
a support rod connected to the holder through the arm and having an elastic member disposed therein; and
A substrate processing apparatus further comprising a holder driver that rotates the holder. According to clause 13,
A substrate processing apparatus wherein the body moves between a central area and an edge area of a substrate supported on the support unit by the arm driver. In a device for processing a substrate,
index block; and
Including a processing block located adjacent to the index block,
The index block is,
At least one load port on which a container containing a substrate is placed; and
Comprising an index frame on which an index robot for transporting a substrate is disposed between the container and the processing block,
The processing block is,
a buffer unit where the substrate is temporarily stored;
an inversion unit arranged to be stacked with the buffer unit and inverting the substrate up and down;
a processing chamber for processing a substrate; and
Comprising a transfer chamber in which the buffer unit, the inversion unit, and a transfer robot for transferring the substrate between the processing chambers are disposed,
The processing chamber is,
a housing having a processing space;
a support unit supporting a substrate in the processing space;
a liquid supply unit supplying a processing liquid to the substrate supported on the support unit; and
Includes a brush unit for cleaning the substrate supported on the support unit,
The brush unit is,
A circular body with a central area pierced;
a plurality of contact pads formed on the body and divided along a circumferential direction of the body to contact the substrate;
At least one contact protrusion; and
It includes a cleaning nozzle that discharges a cleaning liquid onto the substrate supported on the support unit,
Between the contact pads, a groove portion through which impurities falling off from the substrate are discharged is located,
A substrate processing device wherein the contact protrusion is disposed in the groove portion. According to clause 15,
The width of the groove is,
A substrate processing device characterized in that it increases from the central area of the body toward the edge area of the body. According to clause 15,
A substrate processing device, wherein the groove portion has a fan-shaped shape when viewed from above. According to clause 15,
A substrate processing device wherein the contact pad includes a material that is relatively more ductile than the contact protrusion. In the brush unit that contacts the substrate and removes impurities attached to the substrate,
A body formed in a circular shape;
a plurality of contact pads formed on the body and divided along a circumferential direction of the body to contact the substrate; and
Comprising at least one contact protrusion,
A groove through which the impurities are discharged is located between the contact pads,
The width of the groove is,
A brush unit, characterized in that the groove portion has a fan-shaped shape when viewed from above. According to clause 19,
The bottom of the contact protrusion is,
A brush unit located at the same height as the bottom of the contact pad, or located at a height closer to the body than the bottom of the contact pad. In the method of processing a substrate using the device of claim 1,
In a state where the support unit supports the substrate so that the non-pattern side of the pattern side and the non-pattern side of the substrate is facing upward, the contact pads are in contact with the non-pattern side while supplying the cleaning liquid to the non-pattern side. A substrate processing method in which impurities are removed from the pattern surface and the removed impurities are discharged into the groove portion. According to clause 21,
and wherein the support unit rotates when the non-patterned surface contacts the contact pad. According to clause 21,
A method of processing a substrate wherein the body rotates when the contact pad contacts the non-patterned surface. According to clause 21,
The substrate processing method of claim 1 , wherein the body rotates before the contact pad contacts the non-patterned surface, and the support unit rotates after the non-patterned surface contacts the contact pad. According to clause 24,
A substrate processing method in which the body and the support unit rotate in different directions. According to clause 24,
The body and the support unit rotate in the same direction,
A substrate processing method wherein the number of rotations per unit time of the body and the number of rotations per unit time of the support unit are different from each other. According to any one of claims 21 to 26,
The body is,
A substrate processing method of reciprocating between a central area including the center of the substrate and an edge area of the substrate when cleaning the non-patterned surface. According to any one of claims 21 to 26,
The body is,
The contact pad is brought into contact with the non-patterned surface by moving from the upper to the lower side of the central area including the center of the substrate, and the contact pad and the non-patterned surface are in contact while moving from the central area to the edge area of the substrate. Thereafter, the substrate moves to the upper side of the edge region to be spaced from the substrate, and performs a mechanism in which the contact pad contacts the non-pattern surface at least once after moving from the upper side of the edge region to the upper side of the central region. How to handle it. According to any one of claims 21 to 26,
The body is,
The contact pad is brought into contact with the non-pattern surface by moving from the top to the bottom of the edge area of the substrate, and the contact pad and the non-pattern surface are in contact while moving from the edge area to the center area of the substrate and then separated from the substrate. A method of processing a substrate, wherein the contact pad moves to the upper side of the central area as much as possible and moves from the upper side of the central area to the upper side of the edge area, and then performs a mechanism in which the contact pad contacts the non-patterned surface at least once. According to any one of claims 21 to 26,
The substrate on which the non-pattern surface has been cleaned is inverted in an inversion unit and positioned so that the pattern surface is facing upward, and the inverted substrate is supported on the support unit with the pattern surface facing upward. A substrate processing method wherein a liquid supply unit that supplies a processing liquid to a supported substrate supplies the processing liquid to the pattern surface to clean the pattern surface.

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