KR20240014516A - 표면 개질제, 적층체, 금속 배선 패턴의 형성 방법, 및 프린트 배선판의 제조 방법 - Google Patents

표면 개질제, 적층체, 금속 배선 패턴의 형성 방법, 및 프린트 배선판의 제조 방법 Download PDF

Info

Publication number
KR20240014516A
KR20240014516A KR1020237045158A KR20237045158A KR20240014516A KR 20240014516 A KR20240014516 A KR 20240014516A KR 1020237045158 A KR1020237045158 A KR 1020237045158A KR 20237045158 A KR20237045158 A KR 20237045158A KR 20240014516 A KR20240014516 A KR 20240014516A
Authority
KR
South Korea
Prior art keywords
group
layer
metal
forming
wiring pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237045158A
Other languages
English (en)
Korean (ko)
Inventor
히로아키 아리타
준 하라
데츠야 야마다
Original Assignee
코니카 미놀타 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 코니카 미놀타 가부시키가이샤 filed Critical 코니카 미놀타 가부시키가이샤
Publication of KR20240014516A publication Critical patent/KR20240014516A/ko
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/067—Etchants
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/16—Acidic compositions
    • C23F1/18—Acidic compositions for etching copper or alloys thereof
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F1/00—Etching metallic material by chemical means
    • C23F1/10—Etching compositions
    • C23F1/14—Aqueous compositions
    • C23F1/32—Alkaline compositions
    • C23F1/34—Alkaline compositions for etching copper or alloys thereof
    • H01L21/306—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00—Etching of wafers, substrates or parts of devices

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • General Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
  • Manufacturing Of Printed Wiring (AREA)
KR1020237045158A 2021-07-15 2022-06-23 표면 개질제, 적층체, 금속 배선 패턴의 형성 방법, 및 프린트 배선판의 제조 방법 Pending KR20240014516A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JPJP-P-2021-116802 2021-07-15
JP2021116802 2021-07-15
PCT/JP2022/025011 WO2023286555A1 (ja) 2021-07-15 2022-06-23 表面改質剤、積層体、金属配線パターンの形成方法、及びプリント配線板の製造方法

Publications (1)

Publication Number Publication Date
KR20240014516A true KR20240014516A (ko) 2024-02-01

Family

ID=84919284

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237045158A Pending KR20240014516A (ko) 2021-07-15 2022-06-23 표면 개질제, 적층체, 금속 배선 패턴의 형성 방법, 및 프린트 배선판의 제조 방법

Country Status (5)

Country Link
JP (1) JPWO2023286555A1 (https=)
KR (1) KR20240014516A (https=)
CN (1) CN117546615A (https=)
TW (1) TWI815535B (https=)
WO (1) WO2023286555A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024153251A (ja) * 2023-04-17 2024-10-29 コニカミノルタ株式会社 積層体、プリント基板、及びプリント基板の製造方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009299096A (ja) 2008-06-10 2009-12-24 Ebara Densan Ltd プリント回路基板用銅及び銅合金の表面処理液と表面処理方法
JP2019159151A (ja) 2018-03-14 2019-09-19 株式会社東芝 配線パターンの形成方法、これを用いたプリント回路基板、半導体パッケージ、及び電子機器

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2834885B2 (ja) * 1990-11-07 1998-12-14 四国化成工業株式会社 銅及び銅合金の表面処理方法
JP4750645B2 (ja) * 2006-08-11 2011-08-17 日本表面化学株式会社 銅又は銅合金表面の表面処理剤及び処理方法
US10017863B2 (en) * 2007-06-21 2018-07-10 Joseph A. Abys Corrosion protection of bronzes
JP5708422B2 (ja) * 2011-09-30 2015-04-30 Jsr株式会社 液浸用上層膜形成組成物及びレジストパターン形成方法
JP7194525B2 (ja) * 2017-12-28 2022-12-22 東京応化工業株式会社 表面処理方法、表面処理剤、及び基板上に領域選択的に製膜する方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009299096A (ja) 2008-06-10 2009-12-24 Ebara Densan Ltd プリント回路基板用銅及び銅合金の表面処理液と表面処理方法
JP2019159151A (ja) 2018-03-14 2019-09-19 株式会社東芝 配線パターンの形成方法、これを用いたプリント回路基板、半導体パッケージ、及び電子機器

Also Published As

Publication number Publication date
CN117546615A (zh) 2024-02-09
TW202313861A (zh) 2023-04-01
JPWO2023286555A1 (https=) 2023-01-19
TWI815535B (zh) 2023-09-11
WO2023286555A1 (ja) 2023-01-19

Similar Documents

Publication Publication Date Title
JP4629048B2 (ja) 銅および混合金属回路の微細粗面化処理のための改良された方法
KR102547264B1 (ko) 배선 패턴 부착 수지 적층체의 제조 방법
JP4986082B2 (ja) プリント配線基板の製造方法
KR20240014516A (ko) 표면 개질제, 적층체, 금속 배선 패턴의 형성 방법, 및 프린트 배선판의 제조 방법
WO2011043881A1 (en) Nickel-chromium alloy stripper for flexible wiring boards
JP4986081B2 (ja) プリント配線基板の製造方法
JP5010554B2 (ja) 導電性パタンの形成方法
TWI872730B (zh) 處理液及積層體
KR102820513B1 (ko) 표면 개질제 및 프린트 배선판의 제조 방법
TWI841340B (zh) 非感光性表面改質劑、積層體、印刷基板及電子裝置
TWI822452B (zh) 非感光性表面改質劑、積層體、印刷電路板及電子裝置
TWI895793B (zh) 處理液及積層體
KR102138341B1 (ko) 고연성 니켈/주석 도금을 이용한 필름형 안테나 및 그 제조방법
JP5190780B2 (ja) エッチング液、選択的エッチング方法及びこれを用いた配線板の製造方法
JP2024153251A (ja) 積層体、プリント基板、及びプリント基板の製造方法
JP5190779B2 (ja) エッチング液、選択的エッチング方法及びこれを用いた配線板の製造方法
WO2025220628A1 (ja) プリント配線板の製造方法
JP2007260940A (ja) 金属パタンの形成方法

Legal Events

Date Code Title Description
P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

D13-X000 Search requested

St.27 status event code: A-1-2-D10-D13-srh-X000

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P22-X000 Classification modified

St.27 status event code: A-2-2-P10-P22-nap-X000

D22 Grant of ip right intended

Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D22-EXM-PE0701 (AS PROVIDED BY THE NATIONAL OFFICE)

PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701