KR20240012985A - Inline deposition system - Google Patents

Abstract

According to one aspect of the present invention, a plurality of process chamber modules are arranged to communicate with each other and perform individual processes on a substrate; a substrate shuttle on which the substrate is mounted and moves within the plurality of process chamber modules; a magnetic levitation rail installed along the inside of the plurality of process chamber modules and levitating the substrate shuttle by magnetic force to induce movement of the substrate shuttle; Proximity sensors installed to be spaced apart from each other along the magnetic levitation rail and determine whether the substrate shuttle is close to each other; An in-line deposition system is provided, including a deposition shield unit disposed to cover the magnetic levitation rail and opening and closing the magnetic levitation rail according to detection by the proximity sensor.

Description

Inline deposition system

The present invention relates to in-line deposition systems. More specifically, the present invention relates to an in-line deposition system equipped with a magnetic levitation transport system, which can prevent parasitic deposition of gaseous deposition material on the magnetic levitation transport system.

An Organic Luminescence Emitting Device (OLED) is a self-luminous device that emits light by itself using the electroluminescence phenomenon, which emits light when a current flows through a fluorescent organic compound. It does not require a backlight to apply light to a non-luminescent device. Therefore, it is possible to manufacture a lightweight and thin flat display device.

Flat panel displays using such organic electroluminescent devices have a fast response speed and a wide viewing angle, and are emerging as next-generation display devices.

In an organic electroluminescent device, except for the anode and cathode electrodes, the remaining organic layers, such as a hole injection layer, a hole transport layer, a light emitting layer, an electron transport layer, and an electron injection layer, are made of organic thin films, and these organic thin films are deposited on a substrate using a vacuum thermal evaporation method. It is deposited.

A cluster-type deposition system or an in-line deposition system is used as an equipment system for forming an organic thin film or a metal thin film by a vacuum thermal deposition method. The in-line deposition system shuttles multiple substrates with multiple process chambers arranged in a row. On the other hand, the cluster-type deposition system is a method of depositing organic thin films on a substrate by forming a plurality of vacuum chambers into a cluster to form several organic thin films.

However, recently, as substrates have become larger in area and heavier in weight, it is difficult to transport the substrate within the in-line deposition system.

For example, in the case of a glass substrate for an 8th generation display, the size is 2200 mm x 2500 mm and the weight is approximately 300 kg, making it difficult to smoothly transfer the glass substrate using a conventional substrate transfer system.

In response to this, recently, a magnetic levitation transfer system has been developed to transport substrates by levitating heavy substrates using magnetic force. While transporting substrates using an in-line method, deposition particles in the gaseous state are magnetically activated during deposition on the substrate. There is a problem that parasitic deposition occurs in the floating transfer system, preventing smooth transfer of the substrate.

Republic of Korea Registered Utility Model Publication No. 20-0310597 (published on April 23, 2003)

The present invention provides an in-line deposition system equipped with a magnetic levitation transport system, which can prevent parasitic deposition of gaseous deposition material in the magnetic levitation transport system.

According to one aspect of the present invention, a plurality of process chamber modules are arranged to communicate with each other and perform individual processes on a substrate; a substrate shuttle on which the substrate is mounted and moves within the plurality of process chamber modules; a magnetic levitation rail installed along the inside of the plurality of process chamber modules and levitating the substrate shuttle by magnetic force to induce movement of the substrate shuttle; Proximity sensors installed to be spaced apart from each other along the magnetic levitation rail and determine whether the substrate shuttle is close to each other; An in-line deposition system is provided, including a deposition shield unit disposed to cover the magnetic levitation rail and opening and closing the magnetic levitation rail according to detection by the proximity sensor.

At least one of the plurality of process chamber modules includes a deposition chamber module that performs deposition on the substrate, and in this case, the proximity sensor and the deposition shield unit may be installed inside the deposition chamber module.

The deposition shield unit includes a shield plate disposed to cover the magnetic levitation rail and opening and closing the magnetic levitation rail according to detection by the proximity sensor; It may include a lifting unit that elevates the shield plate to open and close the magnetic levitation rail.

The lifting unit includes a first up-down rod and a second up-down rod, one end of which is coupled to a shield plate and the other end of which penetrates the process chamber module, respectively; a driving plate horizontally coupled to other ends of the first up-down rod and the second up-down rod; It may include an actuator unit that moves the driving plate up and down.

The actuator unit includes a pair of driving rods penetrating the driving plate; a support plate to which one end of each of the pair of drive rods is coupled and attached to an outer wall of the process chamber module; a fixing plate to which the other ends of the pair of driving rods are respectively coupled; The elastic rod may pass through the fixed plate and include an actuator coupled to the fixed plate that is coupled to the support plate.

A plurality of the deposition shield units may be installed continuously along the magnetic attachment rail, and the shield plates may be arranged adjacent to each other in a continuous manner.

According to an embodiment of the present invention, in an in-line deposition system equipped with a magnetic levitation transfer system, it is possible to prevent parasitic deposition of gaseous deposition material on the magnetic levitation transfer system during the deposition process on the substrate.

1 is a diagram briefly illustrating a magnetic levitation substrate transfer system of an in-line deposition system according to an embodiment of the present invention.
Figure 2 is a diagram briefly illustrating the plan configuration of an in-line deposition system according to an embodiment of the present invention.
Figure 3 is a diagram briefly showing the cross-sectional configuration of an in-line deposition system according to an embodiment of the present invention.
FIG. 4 is a diagram illustrating the configuration of a deposition shield unit of an in-line deposition system according to an embodiment of the present invention.
5 and 6 are diagrams for explaining the operating state of the deposition shield unit of the in-line deposition system according to an embodiment of the present invention.

Since the present invention can be modified in various ways and can have various embodiments, specific embodiments will be illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and should be understood to include all transformations, equivalents, and substitutes included in the spirit and technical scope of the present invention. In describing the present invention, if it is determined that a detailed description of related known technologies may obscure the gist of the present invention, the detailed description will be omitted.

Terms such as first, second, etc. may be used to describe various components, but the components should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

The terms used in this application are only used to describe specific embodiments and are not intended to limit the invention. Singular expressions include plural expressions unless the context clearly dictates otherwise. In this application, terms such as "comprise" or "have" are intended to designate the presence of features, numbers, steps, operations, components, parts, or combinations thereof described in the specification, but are not intended to indicate the presence of one or more other features. It should be understood that this does not exclude in advance the possibility of the existence or addition of elements, numbers, steps, operations, components, parts, or combinations thereof.

Hereinafter, embodiments of the in-line deposition system according to the present invention will be described in detail with reference to the accompanying drawings. In the description with reference to the accompanying drawings, identical or corresponding components are assigned the same drawing numbers and overlapping references thereto. The explanation will be omitted.

1 is a diagram briefly illustrating a magnetic levitation substrate transfer system of an in-line deposition system according to an embodiment of the present invention. Additionally, FIG. 2 is a diagram briefly showing the plan configuration of an inline deposition system according to an embodiment of the present invention, and FIG. 3 is a diagram briefly showing a cross-sectional configuration of an inline deposition system according to an embodiment of the present invention. Additionally, FIG. 4 is a diagram for explaining the configuration of a deposition shield unit of an in-line deposition system according to an embodiment of the present invention, and FIGS. 5 and 6 are diagrams of a deposition shield unit of an in-line deposition system according to an embodiment of the present invention. This is a drawing to explain the operating status of.

1 to 6, a process chamber module 12, a substrate 13, a substrate shuttle 14, a deposition chamber module 16, an evaporation source 18, a deposition material 19, a magnetic levitation rail 20, Proximity sensor 22, deposition shield unit 24, shield plate 26, lifting unit 28, first up-down rod 30, second up-down rod 32, driving plate 34, actuator unit ( 36), the driving rod 38, the fixed flange 40, the support plate 42, the fixed plate 44, the actuator 46, and the expansion rod 48 are shown.

The in-line deposition system according to this embodiment includes a plurality of process chamber modules 12 that perform individual processes on the substrate 13 and are arranged to communicate with each other; a substrate shuttle 14 on which a substrate 13 is mounted and moves within a plurality of process chamber modules 12; A magnetic levitation rail 20 installed along the inside of the plurality of process chamber modules 12 and levitating the substrate shuttle 14 by magnetic force to induce movement of the substrate shuttle 14; Proximity sensors 22 installed to be spaced apart from each other along the magnetic levitation rail 20 and determine whether the substrate shuttle 14 is close to each other; It is arranged to cover the magnetic levitation rail 20 and includes a deposition shield unit 24 that opens and closes the magnetic levitation rail 20 according to detection by the proximity sensor 22.

In this embodiment, the process chamber module 12, such as the deposition chamber module 16, includes a chamber body whose interior is made of a vacuum when processing the substrate 13, and a chamber body for processing the substrate 13. It refers to a chamber-shaped module that performs a process on the substrate 13, including various devices mounted inside.

As shown in FIG. 1, the in-line deposition system is a type in which a plurality of process chamber modules 12 as described above are arranged sequentially so as to communicate with each other, and the substrate 13 is deposited within each process chamber module 12. Each individual process is performed.

The in-line deposition system is equipped with a magnetic levitation substrate transport system consisting of a substrate shuttle 14 and a magnetic levitation rail 20. The substrates 13 are each mounted on a plurality of substrate shuttles 14 that circulate through the in-line deposition system, and individual processes on the substrates 13 are performed as the substrate shuttles 14 sequentially move through each process chamber module 12. It is structured as possible.

The substrate shuttle 14 moves within a plurality of process chamber modules 12 on which the substrate 13 is mounted. Inside the in-line deposition system, a plurality of substrate shuttles 14 continuously circulate, and the substrate 13 is mounted on the substrate shuttle 14 and moves individually to the substrate 13 within each process chamber module 12. The process is carried out.

The substrate shuttle 14 is a component for moving the inside of the in-line deposition system on which the substrate 13 is mounted. It includes a substrate chuck on which the substrate 13 is attached to the lower surface, and is disposed on the upper part of the substrate chuck and located below the substrate 13. It may include a magnet plate that magnetically attaches the mask.

The substrate chuck is a device to which the upper surface of the substrate 13 is attached and fixed, and an electrostatic chuck or an adhesive chuck can be used as a substrate chuck. Electrostatic chucks and adhesive chucks can churn the substrate 13 in a vacuum state, so they can also be used inside the process chamber module 12, where a vacuum state is maintained during the process.

In this embodiment, a form using an electrostatic chuck as a substrate chuck is presented. Electrostatic Chuck is a chucking device that fixes the substrate 13 using the power of static electricity. When '+' or '-' is applied to the electrostatic chuck, the opposite potential is charged ('-', ') to the object. +'), and the substrate 13 is attached and fixed to the electrostatic chuck using the principle that an attractive force is generated by the charged potential.

Meanwhile, a magnetic material (not shown) that levitates the substrate shuttle 14 by attractive force may be attached to the substrate shuttle 14 in correspondence with the levitation magnet 21 of the magnetic levitation rail 20, which will be described later.

As shown in FIG. 1, the magnetic levitation rail 20 is installed along the inside of the plurality of process chamber modules 12 and levitates the substrate shuttle 14 by magnetic force to induce movement of the substrate shuttle 14. do.

The magnetic levitation rail 20 includes a levitation magnet 21 corresponding to the magnetic material of the substrate shuttle 14, and a propulsion linear motor (not shown) that moves the substrate shuttle 14 mounted on the magnetic levitation rail 20. etc. can be installed.

The magnetic levitation substrate transport system, which consists of a substrate shuttle 14 and a magnetic levitation rail 20, is a system for transporting a substrate 13 inside the process chamber module 12, and is a system for transporting a large-area, high-weight substrate 13. Mass production can be increased by smoothly transporting and handling.

As shown in FIG. 2, the proximity sensors 22 are installed to be spaced apart from each other along the magnetic levitation rail 20 and determine whether the substrate shuttle 14 is close. A plurality of proximity sensors 22 may be installed to be spaced apart from each other along the magnetic levitation rail 20, and determine whether the substrate shuttle 14 is in proximity while the substrate shuttle 14 is moving. A hall sensor, a photo sensor, etc. may be used as the proximity sensor 22.

As shown in FIG. 2, the deposition shield unit 24 is arranged to cover the magnetic levitation rail 20, and opens and closes the magnetic levitation rail 20 according to the movement of the substrate shuttle 14.

The deposition shield unit 24 is configured to prevent the gaseous deposition material 19 generated during the deposition process from attaching to the magnetic levitation rail 20, when the substrate shuttle 14 arrives. Before doing so, it covers the magnetic levitation rail 20, and when the substrate shuttle 14 arrives at that location, the proximity sensor 22 detects the position in advance, and the magnetic levitation rail located at the rear end of the proximity sensor 22 ( 20) Open. When it is determined by the proximity sensor 22 that the substrate shuttle 14 has passed the corresponding location, the magnetic levitation rail 20 at the rear end of the substrate shuttle 14 is covered so as to be closed.

In particular, since much parasitic deposition may occur on the magnetic levitation rail 20 within the deposition chamber module 16 where the deposition process for the substrate 13 is performed, the proximity sensor 22 and the deposition shield unit according to the present embodiment (24) may be installed inside the deposition chamber module (16).

FIG. 3 is a diagram briefly showing the cross-sectional configuration of the in-line deposition system at the position where the substrate shuttle 14 enters. Referring to FIG. 3, when the substrate shuttle 14 enters the deposition chamber module 16, the gaseous deposition material 19 ejected from the evaporation source 18 is deposited on the substrate 13. At this time, parasitic deposition of the deposition material 19 may be performed on the magnetic levitation rail 20 other than the substrate 13. Therefore, at the position where the substrate shuttle 14 is moving, the shield plate 26 of the deposition shield unit 24 is raised to open the magnetic levitation rail 20, and at locations other than the moving position of the substrate shuttle 14, the deposition shield unit ( The shield plate 26 of 24) is lowered to cover the magnetic levitation rail 20.

Hereinafter, the configuration will be described focusing on the deposition shield unit 24 installed in the deposition chamber module 16.

FIG. 4 is a diagram for explaining the configuration of the deposition shield unit 24 of the inline deposition system according to this embodiment.

Referring to FIG. 4, the deposition shield unit 24 according to this embodiment is arranged to cover the magnetic levitation rail 20, and is a shield that opens and closes the magnetic levitation rail 20 according to detection by the proximity sensor 22. Pan (26) and; It includes an elevating part 28 that elevates the shield plate 30 to open and close the magnetic levitation rail 20.

The shield plate 26 is continuously disposed on the front surface to cover the magnetic levitation rail 20 and prevents the gaseous deposition material 19 ejected from the evaporation source 18 from reaching the magnetic levitation rail 20.

The lifting unit 28 opens and closes the magnetic levitation rail 20 by raising or lowering the shield plate 26 located in the front of the magnetic levitation rail 20. 5 and 6, when the shield plate 26 is lifted according to the operation of the lifting unit 28, the magnetic levitation rail 20 is exposed to the deposition material 19, and when the shield plate 26 is lowered, the magnetic levitation rail 20 is exposed to the deposition material 19. Covers the floating rail 20 to block the deposition material 17 from reaching it.

When the driving parts for operating the lifting unit 28 are placed in the high vacuum process chamber module 12, there is a risk of out-gassing or malfunction, so in this embodiment, the lifting unit 28 is placed in the process chamber module 12. It was placed outside of.

To this end, referring to FIG. 4, the lifting unit 28 according to the present embodiment includes a first up-down rod 30, one end of which is coupled to the shield plate 26 and the other end of which penetrates the process chamber module 12. ) and a second up-down rod 32; a driving plate 34 horizontally coupled to the other ends of the first up-down rod 30 and the second up-down rod 32; It includes an actuator unit 36 that moves the driving plate 34 up and down.

One end of the first up-down rod 30 and the second up-down rod 32 are each coupled to the upper end of the shield plate 26, and penetrate the wall of the process chamber module 12 in an airflow-sealed state. The other ends of the first up-down rod 30 and the second up-down rod 32 are placed outside the process chamber module 12.

The fixing flange 40 is coupled to the external wall of the process chamber module 12 to penetrate the first up-down rod 30 and the second up-down rod 32 to the outside of the process chamber module 12 while disconnecting the airflow. And a portion of the first up-down rod 30 and the second up-down rod 32 that penetrate the fixed flange 40 are sealed by the bellows pipe and are cut off from the external environment of normal pressure in terms of airflow.

The driving plate 34 is laterally coupled to the other ends of the first up-down rod 30 and the second up-down rod 32 penetrating the process module chamber, and is integrally connected to the first up-down rod 30 and the second up-down rod 32. Let the rod (32) move. The actuator unit 36 raises and lowers the driving plate 34 to which the first up-down rod 30 and the second up-down rod 32 are combined from the outside of the process module chamber, resulting in the shield plate inside the process chamber module 12. (26) is raised and lowered.

The actuator unit 36 according to this embodiment includes a pair of drive rods 38 penetrating the drive plate 34; a support plate 42 to which one end of a pair of drive rods 38 is coupled and attached to the outer wall of the process chamber module 12; a fixing plate 44 to which the other ends of the pair of driving rods 38 are coupled; The elastic rod 48 penetrates the fixed plate 44 and includes an actuator 46 coupled to the fixed plate 44, which is coupled to the support plate 42.

Referring to FIG. 4, a support plate 42 attached to the outer wall of the process chamber module 12 is coupled to one end of the pair of drive rods 38 that penetrate the drive plate 34, and is moved by the actuator 46. The first up-down rod 30 and the second up-down rod 32 are coupled to the driving plate 34 by lifting the driving plate 34 relative to the support plate 42 attached to the outside of the process chamber module 12. ascending and descending takes place. The actuator 46 is coupled to the fixed plate 44, and the elastic rod 48 of the actuator 46 penetrates the fixed plate 44 and is coupled to the driving plate 34.

The expansion rod 48 of the actuator 46 is a member that is pulled out and extended from the body of the actuator 46 by hydraulic or pneumatic pressure or is drawn into the body and reduced. The expansion and contraction of the expansion rod 48 of the actuator 46 As a result, the shield plate 26 is raised and lowered according to the reduction. As described above, by disposing the lifting unit 28 outside the process chamber module 12, outgassing or malfunction of the lifting unit 28 can be prevented.

5 and 6 show the operating state of the deposition shield unit 24 of the in-line deposition system according to this embodiment.

As shown in FIG. 5, before the substrate shuttle 14 enters, the telescopic rod 48 of the actuator 46 is extended and the shield plate 26 is lowered to cover the magnetic levitation rail 20, and then the shield plate 26 is lowered. When the substrate shuttle 14 detects proximity by the proximity sensor 22 at the front end of the plate 26, the telescopic rod 48 of the actuator 46 contracts and lifts and opens the shield plate 26. When the proximity sensor 22 detects that the substrate shield has passed, the elastic rod 48 of the actuator 46 extends again and lowers the shield plate 26 to cover the magnetic levitation rail 20.

The above-mentioned deposition shield unit 24 can be installed continuously along the longitudinal direction to cover along the magnetic levitation rail 20, and can be continuously arranged so that the side ends of the shield plate 26 are adjacent to each other.

Although the present invention has been described above with reference to specific embodiments, those skilled in the art can vary the present invention without departing from the spirit and scope of the present invention as set forth in the claims below. You will understand that it can be modified and changed.

Many embodiments other than those described above are within the scope of the claims of the present invention.

12: Process chamber module 13: Substrate
14: substrate shuttle 16: deposition chamber module
18: evaporation source 19: deposition material
20: magnetic levitation rail 22: proximity sensor
24: deposition shield unit 26: shield plate
28: Elevating unit 30: First up and down rod
32: second up-down rod 34: driving plate
36: Actuator part 38: Driving rod
40: fixed flange 42: support plate
44: fixing plate 46: actuator
48: Extension rod

Claims (6)

a plurality of process chamber modules that perform individual processes on a substrate and are arranged to communicate with each other;
a substrate shuttle on which the substrate is mounted and moves within the plurality of process chamber modules;
a magnetic levitation rail installed along the inside of the plurality of process chamber modules and levitating the substrate shuttle by magnetic force to induce movement of the substrate shuttle;
Proximity sensors installed to be spaced apart from each other along the magnetic levitation rail and determine whether the substrate shuttle is close to each other;
An in-line deposition system comprising a deposition shield unit disposed to cover the magnetic levitation rail and opening and closing the magnetic levitation rail according to detection by the proximity sensor.
According to paragraph 1,
At least one of the plurality of process chamber modules includes a deposition chamber module that performs deposition on the substrate,
An in-line deposition system, characterized in that the proximity sensor and the deposition shield unit are installed inside the deposition chamber module.
According to paragraph 1,
The deposition shield unit,
A shield plate disposed to cover the magnetic levitation rail and opening and closing the magnetic levitation rail according to detection by the proximity sensor;
An in-line deposition system, characterized in that it includes a lifting unit that raises the shield plate to open and close the magnetic levitation rail.
According to paragraph 3,
The lifting unit,
a first up-down rod and a second up-down rod, one end of which is respectively coupled to a shield plate and the other end of which penetrates the process chamber module;
a driving plate horizontally coupled to other ends of the first up-down rod and the second up-down rod;
An in-line deposition system including an actuator unit that moves the driving plate up and down.
According to clause 4,
The actuator part,
a pair of driving rods penetrating the driving plate;
a support plate to which one end of each of the pair of drive rods is coupled and attached to an outer wall of the process chamber module;
a fixing plate to which the other ends of the pair of driving rods are respectively coupled;
An in-line deposition system, characterized in that the elastic rod penetrates the fixed plate and includes an actuator coupled to the fixed plate that is coupled to the support plate.
According to paragraph 3,
An in-line deposition system, wherein a plurality of deposition shield units are installed sequentially along the magnetic attachment rail, and the shield plates are arranged adjacent to each other in succession.