KR20240005214A - Layered film, release film, and layered body - Google Patents
Layered film, release film, and layered body Download PDFInfo
- Publication number
- KR20240005214A KR20240005214A KR1020237044895A KR20237044895A KR20240005214A KR 20240005214 A KR20240005214 A KR 20240005214A KR 1020237044895 A KR1020237044895 A KR 1020237044895A KR 20237044895 A KR20237044895 A KR 20237044895A KR 20240005214 A KR20240005214 A KR 20240005214A
- Authority
- KR
- South Korea
- Prior art keywords
- layer
- film
- laminated film
- fluorine atom
- atom content
- Prior art date
Links
- 239000010410 layer Substances 0.000 claims abstract description 352
- 125000001153 fluoro group Chemical group F* 0.000 claims abstract description 115
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 100
- 229920006254 polymer film Polymers 0.000 claims abstract description 42
- 239000013464 silicone adhesive Substances 0.000 claims abstract description 34
- 239000012790 adhesive layer Substances 0.000 claims abstract description 22
- 229920002050 silicone resin Polymers 0.000 claims description 46
- 238000000034 method Methods 0.000 claims description 42
- -1 methylsiloxane ion Chemical class 0.000 claims description 18
- 229920006267 polyester film Polymers 0.000 claims description 9
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 claims description 2
- 150000002500 ions Chemical group 0.000 claims description 2
- 238000012360 testing method Methods 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 abstract description 12
- 238000000576 coating method Methods 0.000 description 71
- 239000011248 coating agent Substances 0.000 description 64
- 239000007788 liquid Substances 0.000 description 35
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 33
- 229920005989 resin Polymers 0.000 description 29
- 239000011347 resin Substances 0.000 description 29
- 239000000243 solution Substances 0.000 description 27
- 239000000203 mixture Substances 0.000 description 24
- 239000003054 catalyst Substances 0.000 description 21
- 239000002904 solvent Substances 0.000 description 21
- 229920001296 polysiloxane Polymers 0.000 description 19
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 18
- 239000000463 material Substances 0.000 description 17
- 229910052697 platinum Inorganic materials 0.000 description 16
- 239000007787 solid Substances 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 13
- 239000003431 cross linking reagent Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 8
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 8
- 238000007259 addition reaction Methods 0.000 description 8
- 239000011737 fluorine Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 7
- 230000015572 biosynthetic process Effects 0.000 description 6
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 6
- 238000005530 etching Methods 0.000 description 6
- 239000012046 mixed solvent Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 5
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 5
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 4
- ZAFNJMIOTHYJRJ-UHFFFAOYSA-N Diisopropyl ether Chemical compound CC(C)OC(C)C ZAFNJMIOTHYJRJ-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 125000000524 functional group Chemical group 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000005011 time of flight secondary ion mass spectroscopy Methods 0.000 description 3
- AFABGHUZZDYHJO-UHFFFAOYSA-N 2-Methylpentane Chemical compound CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920001634 Copolyester Polymers 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 238000005481 NMR spectroscopy Methods 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000006087 Silane Coupling Agent Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- YIMQCDZDWXUDCA-UHFFFAOYSA-N [4-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1CCC(CO)CC1 YIMQCDZDWXUDCA-UHFFFAOYSA-N 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 125000003342 alkenyl group Chemical group 0.000 description 2
- DMEGYFMYUHOHGS-UHFFFAOYSA-N cycloheptane Chemical compound C1CCCCCC1 DMEGYFMYUHOHGS-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- SWXVUIWOUIDPGS-UHFFFAOYSA-N diacetone alcohol Chemical compound CC(=O)CC(C)(C)O SWXVUIWOUIDPGS-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- MTZQAGJQAFMTAQ-UHFFFAOYSA-N ethyl benzoate Chemical compound CCOC(=O)C1=CC=CC=C1 MTZQAGJQAFMTAQ-UHFFFAOYSA-N 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 229910052734 helium Inorganic materials 0.000 description 2
- 239000001307 helium Substances 0.000 description 2
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- ZUBZATZOEPUUQF-UHFFFAOYSA-N isononane Chemical compound CCCCCCC(C)C ZUBZATZOEPUUQF-UHFFFAOYSA-N 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- RXOHFPCZGPKIRD-UHFFFAOYSA-N naphthalene-2,6-dicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 2
- 239000012454 non-polar solvent Substances 0.000 description 2
- 239000003921 oil Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- PGMYKACGEOXYJE-UHFFFAOYSA-N pentyl acetate Chemical compound CCCCCOC(C)=O PGMYKACGEOXYJE-UHFFFAOYSA-N 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002798 polar solvent Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- RYHBNJHYFVUHQT-UHFFFAOYSA-N 1,4-Dioxane Chemical compound C1COCCO1 RYHBNJHYFVUHQT-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- PTTPXKJBFFKCEK-UHFFFAOYSA-N 2-Methyl-4-heptanone Chemical compound CC(C)CC(=O)CC(C)C PTTPXKJBFFKCEK-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- MMINFSMURORWKH-UHFFFAOYSA-N 3,6-dioxabicyclo[6.2.2]dodeca-1(10),8,11-triene-2,7-dione Chemical group O=C1OCCOC(=O)C2=CC=C1C=C2 MMINFSMURORWKH-UHFFFAOYSA-N 0.000 description 1
- OWNRRUFOJXFKCU-UHFFFAOYSA-N Bromadiolone Chemical compound C=1C=C(C=2C=CC(Br)=CC=2)C=CC=1C(O)CC(C=1C(OC2=CC=CC=C2C=1O)=O)C1=CC=CC=C1 OWNRRUFOJXFKCU-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- 101000595548 Homo sapiens TIR domain-containing adapter molecule 1 Proteins 0.000 description 1
- 239000013032 Hydrocarbon resin Substances 0.000 description 1
- NHTMVDHEPJAVLT-UHFFFAOYSA-N Isooctane Chemical compound CC(C)CC(C)(C)C NHTMVDHEPJAVLT-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 102100036073 TIR domain-containing adapter molecule 1 Human genes 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 230000003373 anti-fouling effect Effects 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000004566 building material Substances 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000006482 condensation reaction Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 239000002537 cosmetic Substances 0.000 description 1
- WJTCGQSWYFHTAC-UHFFFAOYSA-N cyclooctane Chemical compound C1CCCCCCC1 WJTCGQSWYFHTAC-UHFFFAOYSA-N 0.000 description 1
- 239000004914 cyclooctane Substances 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- JVSWJIKNEAIKJW-UHFFFAOYSA-N dimethyl-hexane Natural products CCCCCC(C)C JVSWJIKNEAIKJW-UHFFFAOYSA-N 0.000 description 1
- 238000001941 electron spectroscopy Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 125000004185 ester group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 229920006270 hydrocarbon resin Polymers 0.000 description 1
- 238000005470 impregnation Methods 0.000 description 1
- 239000003999 initiator Substances 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 239000011147 inorganic material Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 238000010899 nucleation Methods 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 125000005375 organosiloxane group Chemical group 0.000 description 1
- 229920006280 packaging film Polymers 0.000 description 1
- 239000012785 packaging film Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000013500 performance material Substances 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 239000002861 polymer material Substances 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- LLHKCFNBLRBOGN-UHFFFAOYSA-N propylene glycol methyl ether acetate Chemical compound COCC(C)OC(C)=O LLHKCFNBLRBOGN-UHFFFAOYSA-N 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 239000005871 repellent Substances 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 150000003384 small molecules Chemical class 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/043—Improving the adhesiveness of the coatings per se, e.g. forming primers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/283—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polysiloxanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/30—Layered products comprising a layer of synthetic resin comprising vinyl (co)polymers; comprising acrylic (co)polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/36—Layered products comprising a layer of synthetic resin comprising polyesters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/042—Coating with two or more layers, where at least one layer of a composition contains a polymer binder
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J7/00—Chemical treatment or coating of shaped articles made of macromolecular substances
- C08J7/04—Coating
- C08J7/044—Forming conductive coatings; Forming coatings having anti-static properties
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
- C09D183/04—Polysiloxanes
- C09D183/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/20—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/20—Diluents or solvents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/403—Adhesives in the form of films or foils characterised by release liners characterised by the structure of the release feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/405—Adhesives in the form of films or foils characterised by release liners characterised by the substrate of the release liner
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/70—Other properties
- B32B2307/748—Releasability
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2367/00—Characterised by the use of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Derivatives of such polymers
- C08J2367/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2483/00—Characterised by the use of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen, or carbon only; Derivatives of such polymers
- C08J2483/04—Polysiloxanes
- C08J2483/08—Polysiloxanes containing silicon bound to organic groups containing atoms other than carbon, hydrogen, and oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2427/00—Presence of halogenated polymer
- C09J2427/005—Presence of halogenated polymer in the release coating
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2483/00—Presence of polysiloxane
- C09J2483/005—Presence of polysiloxane in the release coating
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Laminated Bodies (AREA)
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Adhesive Tapes (AREA)
- Materials For Medical Uses (AREA)
Abstract
실리콘 점착제 등의 강점착성을 가지는 점착층에 대하여 우수한 박리성을 가지는 적층 필름을 제공한다. 적층 필름은, 고분자 필름의 적어도 편면에 A층 및 B층이, 이 순서로 적층되어 이루어지는 적층 필름으로서, 상기 A층 및 B층의 양층이 불소 원자를 함유하고, 또한 B층의 불소 원자 함유 비율이 A층의 불소 원자 함유 비율보다 많은 것을 특징으로 한다.A laminated film having excellent peelability for adhesive layers having strong adhesive properties such as silicone adhesives is provided. The laminated film is a laminated film in which an A layer and a B layer are laminated on at least one side of a polymer film in this order, wherein both the A layer and the B layer contain fluorine atoms, and the B layer contains a fluorine atom content ratio. It is characterized by a higher fluorine atom content than the A layer.
Description
본 발명은 적층 필름에 관한 것이며, 특히 이형성(離形性)을 가지는 적층 필름에 관한 것이다.The present invention relates to a laminated film, and particularly to a laminated film having release properties.
최근, 액정 패널을 탑재한 자동차가 많아지고 있다. 이와 같은 차량 탑재용의 용도에서는, 고온이나 저온에 장시간 노출되는 경우도 많아, 패널 구성 부재를 첩합(貼合)하는 점착제에도 고도의 내후성, 내열성이 요구된다. 이에 적합한 점착제로서, 강점착성인 실리콘 점착제가 주목을 받고 있다.Recently, the number of cars equipped with liquid crystal panels is increasing. In such vehicle-mounted applications, the adhesive is often exposed to high or low temperatures for long periods of time, and the adhesive for bonding the panel constituent members is also required to have high weather resistance and heat resistance. As a suitable adhesive for this purpose, highly adhesive silicone adhesives are attracting attention.
실리콘 점착제는, 이것을 점착층으로서 테이프(필름) 형상으로 한 것이 이용되지만, 통상, 사용하기 전에는 편면 또는 양면을 이형 필름으로 피복한 상태로 보관되고 있으며, 사용 시에 당해 이형 필름을 벗겨 이용된다. 그러나, 강점착성의 실리콘 점착제(점착층)는 널리 이용되고 있는 오르가노실리콘을 코팅한 이형 필름과 강하게 점착되어 버려, 사용 시에 이형 필름의 박리가 곤란해지는 문제가 있었다.Silicone adhesives are used in the form of a tape (film) as an adhesive layer, but are usually stored with one or both sides covered with a release film before use, and are used by peeling off the release film at the time of use. However, the highly adhesive silicone adhesive (adhesive layer) adheres strongly to the widely used organosilicone-coated release film, which poses a problem in that it becomes difficult to peel off the release film during use.
실리콘 수지 조성물 등의 몰드 수지의 성형 가공으로 이루어지는 성형품과의 박리성을 발현하기 위한 방법으로서는, 불소 치환기를 가지는 불소화 실리콘 재료가 제안되고 있다.(특허 문헌 1)A fluorinated silicone material having a fluorine substituent has been proposed as a method for demonstrating peelability from a molded product made by molding a mold resin such as a silicone resin composition (Patent Document 1).
그러나, 이형층으로서 불소화 실리콘 재료를 이용한 경우, 고분자 필름과 이형층과의 사이의 밀착성이 불충분해져 층간 박리를 일으키거나, 이형층이 균일하게 형성되지 않아 피착체에 대한 박리성이 악화되거나 하는 문제가 일어나는 예를 볼 수 있었다.However, when a fluorinated silicone material is used as the release layer, the adhesion between the polymer film and the release layer becomes insufficient, causing interlayer peeling, or the release layer is not formed uniformly, resulting in deterioration of the peelability to the adherend. I was able to see an example of this happening.
본 발명은, 상기 실정을 감안하여 이루어진 것으로서, 실리콘 점착제 등의 강점착성을 가지는 점착층에 대하여 우수한 박리성을 가지는 이형 필름을 제공하는 것을 과제로 하는 것이다.The present invention was made in consideration of the above-mentioned circumstances, and its object is to provide a release film having excellent peelability for an adhesive layer having strong adhesiveness such as a silicone adhesive.
상기의 과제를 해결하기 위해, 본 발명자들은 예의 검토한 결과, 고분자 필름의 적어도 편면에 A층과 B층이 이 순서로 적층된 적층 필름의, 각각의 층에 불소 원자를 함유시킴과 함께, 이 양층의 불소 원자 함유 비율을 제어함으로써, 상기 과제를 해결할 수 있는 것을 발견하여, 본 발명을 완성하였다.In order to solve the above problems, the present inventors have conducted intensive studies and found that, in addition to containing fluorine atoms in each layer of a laminated film in which the A layer and the B layer are laminated in this order on at least one side of the polymer film, It was discovered that the above problem could be solved by controlling the fluorine atom content ratio of both layers, and the present invention was completed.
즉, 본 발명의 요지는, 고분자 필름의 적어도 편면에 A층 및 B층이, 이 순서로 적층되어 이루어지는 적층 필름으로서, 상기 A층 및 B층의 양층이 불소 원자를 함유하고, 또한 B층의 불소 원자 함유 비율이 A층의 불소 원자 함유 비율보다 많은 것을 특징으로 하는 적층 필름이다.That is, the gist of the present invention is a laminated film in which an A layer and a B layer are laminated in this order on at least one side of a polymer film, wherein both the A layer and the B layer contain fluorine atoms, and the B layer It is a laminated film characterized in that the fluorine atom content rate is greater than the fluorine atom content rate of the A layer.
또한, 본 발명의 요지는, 고분자 필름의 적어도 편면에 A층 및 B층이, 이 순서로 적층되어 이루어지는 적층 필름으로서, 상기 B층이 불소 원자를 함유하고, 하기의 방법으로 측정하였을 때의 상태 박리력이 100mN/cm 이하인 것을 특징으로 하는 적층 필름이다.Furthermore, the gist of the present invention is a laminated film in which an A layer and a B layer are laminated in this order on at least one side of a polymer film, wherein the B layer contains a fluorine atom and is in the state when measured by the following method. It is a laminated film characterized by a peeling force of 100 mN/cm or less.
<상태 박리력의 측정><Measurement of state peeling force>
적층 필름의 B층 표면에 실리콘 점착제를 가지는 테이프(쓰리엠·재팬사제, No 5413 테이프, 50mm 폭)를 첩합하고, 박리 속도가 0.3m/min의 조건으로 180° 박리 시험을 행함A tape with a silicone adhesive (made by 3M Japan, No 5413 tape, 50 mm wide) was bonded to the surface of layer B of the laminated film, and a 180° peel test was performed under the condition that the peel speed was 0.3 m/min.
본 발명에 의하면, 실리콘 점착제 등의 강점착성을 가지는 점착층에 대한 우수한 박리성을 가지는 적층 필름을 얻을 수 있다.According to the present invention, it is possible to obtain a laminated film having excellent peelability against an adhesive layer having strong adhesiveness such as a silicone adhesive.
도 1은 본 발명의 적층 필름의 개략도이다.
도 2는 종래 기술 (a)와 본 발명 (b)의 적층 필름에 있어서의 실리콘 점착제층과의 박리 상태를 나타내는 모식도이다.1 is a schematic diagram of the laminated film of the present invention.
Figure 2 is a schematic diagram showing the peeling state of the silicone adhesive layer in the laminated films of the prior art (a) and the present invention (b).
이하, 본 발명의 적층 필름의 실시 형태를 보다 구체적으로 설명한다.Hereinafter, embodiments of the laminated film of the present invention will be described in more detail.
본 발명의 적층 필름은, 도 1에 예시하는 바와 같이, 고분자 필름의 적어도 편면에 A층(언더코팅층), B층(이형층)이 이 순서로 적층된 적층 필름이다.As illustrated in FIG. 1, the laminated film of the present invention is a laminated film in which a layer A (undercoat layer) and a layer B (release layer) are laminated in this order on at least one side of a polymer film.
상기 본 발명의 적층 필름에 대하여, 이하에, 고분자 필름, A층(언더코팅층) 및 B층(이형층)의 순서로 설명한다.The laminated film of the present invention is described below in the following order: polymer film, A layer (undercoat layer), and B layer (release layer).
1. 고분자 필름1. Polymer film
본 발명의 적층 필름의 기재(基材)가 되는 고분자 필름으로서는, 폴리에틸렌, 폴리프로필렌, 폴리에스테르, 폴리스티렌, 폴리카보네이트, 폴리에테르술폰, 폴리아미드, 폴리이미드 등의 고분자를 막 형상으로 형성한 필름을 들 수 있다. 또한 필름화가 가능하면, 이들 재료를 혼합한 것(폴리머 블렌드)이나 구성 단위를 복합화한 것(공중합체)이어도 상관없다.As a polymer film that serves as a base material for the laminated film of the present invention, a film formed of polymers such as polyethylene, polypropylene, polyester, polystyrene, polycarbonate, polyethersulfone, polyamide, and polyimide in the form of a film. I can hear it. Additionally, as long as film formation is possible, it may be a mixture of these materials (polymer blend) or a composite of structural units (copolymer).
또한 고분자 필름은, 필름화된 것이면 특별히 한정되지 않고, 무연신 필름이어도 연신 필름이어도 되지만, 1축 방향 또는 2축 방향으로 연신된 연신 필름인 것이 바람직하다. 그 중에서도 역학 특성의 밸런스나 평면성의 관점에서 2축 연신 필름이 보다 바람직하다.In addition, the polymer film is not particularly limited as long as it is formed into a film. It may be an unstretched film or a stretched film, but it is preferable that it is a stretched film stretched in a uniaxial direction or a biaxial direction. Among them, biaxially stretched films are more preferable from the viewpoint of balance of mechanical properties and planarity.
본 발명에 있어서의 적층 필름을 구성하는 고분자 필름의 두께는, 필름으로서 제막 가능한 범위이면 특별히 한정되는 것은 아니지만, 5㎛ 이상 1000㎛ 이하가 바람직하고, 10㎛ 이상 혹은 500㎛ 이하가 보다 바람직하며, 15㎛ 이상 혹은 200㎛ 이하가 더 바람직하다.The thickness of the polymer film constituting the laminated film in the present invention is not particularly limited as long as it is within the range that can be formed as a film, but is preferably 5 μm or more and 1000 μm or less, and more preferably 10 μm or more or 500 μm or less, 15㎛ or more or 200㎛ or less is more preferable.
상기 예시한 필름 중에서도, 폴리에스테르 필름은 내열성, 평면성, 광학 특성, 강도 등의 물성이 우수하기 때문에 바람직하고, 그 중에서도, 2축 연신 폴리에스테르 필름이 특히 바람직하다.Among the films exemplified above, polyester films are preferable because they are excellent in physical properties such as heat resistance, planarity, optical properties, and strength, and among them, biaxially oriented polyester films are particularly preferable.
상기 폴리에스테르 필름은 단층이어도, 또한 성질이 상이한 2 이상의 층을 가지는 다층 필름(적층 필름)이어도 된다.The polyester film may be a single layer or a multilayer film (laminated film) having two or more layers with different properties.
본 발명에 있어서, 폴리에스테르 필름에 사용하는 폴리에스테르는, 호모 폴리에스테르여도 공중합 폴리에스테르여도 된다. 호모 폴리에스테르로서는, 방향족 디카르본산과 지방족 글리콜을 중축합시켜 얻어지는 것이 바람직하다. 방향족 디카르본산으로서는, 테레프탈산, 2,6-나프탈렌디카르본산 등을 들 수 있고, 지방족 글리콜로서는, 에틸렌글리콜, 디에틸렌글리콜, 1,4-부탄디올, 1,4-시클로헥산디메탄올 등을 들 수 있다.In the present invention, the polyester used for the polyester film may be homopolyester or copolyester. As homopolyester, one obtained by polycondensing aromatic dicarboxylic acid and aliphatic glycol is preferable. Examples of aromatic dicarboxylic acids include terephthalic acid and 2,6-naphthalene dicarboxylic acid, and examples of aliphatic glycols include ethylene glycol, diethylene glycol, 1,4-butanediol, and 1,4-cyclohexanedimethanol. You can.
대표적인 호모 폴리에스테르로서는, 폴리에틸렌테레프탈레이트(PET)나, 폴리에틸렌나프탈레이트(PEN), 폴리부틸렌테레프탈레이트(PBT) 등을 예시할 수 있다. 한편, 공중합 폴리에스테르의 디카르본산 성분으로서는, 이소프탈산, 프탈산, 테레프탈산, 2,6-나프탈렌디카르본산, 아디프산, 세바스산 등의 1종 또는 2종 이상을 들 수 있고, 글리콜 성분으로서, 에틸렌글리콜, 디에틸렌글리콜, 프로필렌글리콜, 1,4-부탄디올, 1,4-시클로헥산디메탄올, 네오펜틸글리콜 등의 1종 또는 2종 이상을 들 수 있다.Representative homopolyesters include polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and polybutylene terephthalate (PBT). On the other hand, examples of the dicarboxylic acid component of the copolyester include one or two or more of isophthalic acid, phthalic acid, terephthalic acid, 2,6-naphthalenedicarboxylic acid, adipic acid, and sebacic acid, and as a glycol component, , ethylene glycol, diethylene glycol, propylene glycol, 1,4-butanediol, 1,4-cyclohexanedimethanol, and neopentyl glycol.
그 중에서도, 본 발명에 있어서는, 통상 60몰% 이상, 바람직하게는 80몰% 이상이 에틸렌테레프탈레이트 단위인 폴리에틸렌테레프탈레이트가 바람직하다.Among them, in the present invention, polyethylene terephthalate is preferred, wherein usually 60 mol% or more, preferably 80 mol% or more, is ethylene terephthalate unit.
본 발명에 있어서, 고분자 필름의 표면에는, 대전 방지성이나, 필름 표면으로의 배합물이나 올리고머의 삼출(渗出)(블리드, 플레이트 아웃)의 봉지성을 부여하거나, 필름의 광 투과성이나 후술의 A층(언더코팅층)과의 밀착성을 향상시키거나 하기 위해, 밑칠층(베이스 코팅층)을 마련해도 된다.In the present invention, the surface of the polymer film is provided with antistatic properties, sealing properties against exudation (bleed, plate out) of compounds or oligomers on the film surface, and the light transmittance of the film or A as described later. In order to improve adhesion to the layer (undercoat layer), an undercoating layer (base coating layer) may be provided.
상기 밑칠층은, 고분자 필름의 제막과 동시에 밑칠층을 형성하는 인라인 코팅법이나, 제막이 끝난 필름에 별도 밑칠층을 형성하는 오프라인 코팅법 중 어느 것으로 형성해도 된다.The undercoat layer may be formed by either an in-line coating method in which the undercoat layer is formed simultaneously with the formation of the polymer film, or an offline coating method in which a separate undercoat layer is formed on the film after film formation.
상기 밑칠층을 마련하는 경우에는, 고분자 필름의 적어도 편면에 형성되어 있으면 된다. 양면에 형성하는 경우에는, 양면에 동일한 밑칠층을 형성해도, 각각의 면에 상이한 밑칠층을 형성해도 된다. 밑칠층은, 유기물로 이루어지는 층, 무기막으로 이루어지는 층, 유기물과 무기물과의 혼합물로 이루어지는 층 중 어느 것이어도 된다.When providing the undercoat layer, it may be formed on at least one side of the polymer film. When forming on both sides, the same undercoat layer may be formed on both sides, or a different undercoat layer may be formed on each side. The undercoating layer may be any of a layer made of an organic material, a layer made of an inorganic film, or a layer made of a mixture of an organic material and an inorganic material.
2. A층(언더코팅층)2. A layer (undercoating layer)
본 발명에서는, 고분자 필름의 적어도 편면에 A층(언더코팅층)을 구비한다.In the present invention, an A layer (undercoating layer) is provided on at least one side of the polymer film.
<A층의 구성><Configuration of A-floor>
A층은 통상, 불소 원자를 함유한다. 이에 따라, A층과 후술의 B층과의 밀착성을 가질 뿐만 아니라, 이형 필름으로서 이용한 경우에 B층과 피착체인 점착제층과의 경박리성이 발현되어, 피착체를 벗겨지기 쉽게 할 수 있다.The A layer usually contains fluorine atoms. Accordingly, not only does it have adhesion between the A layer and the B layer described later, but when used as a release film, light peelability between the B layer and the adhesive layer that is the adherend is exhibited, making it easy to peel off the adherend.
A층 중에 불소 원자를 함유시키는 방법은 한정되지 않고, 적어도, 불소 원자를 함유하는 화합물을 A층 중에 함유하고 있으면 된다. 구체적으로는, 불소 원자를 함유하는 저분자 화합물, 불소 원자를 함유하는 수지 등을 들 수 있다. 그 중에서도, 불소 원자를 함유하는 수지를 이용하는 것이 바람직하고, 특히, 당해 수지가 경화성인 것이 바람직하다.There is no limitation on the method of containing a fluorine atom in the A layer, and at least a compound containing a fluorine atom may be contained in the A layer. Specifically, low molecular weight compounds containing a fluorine atom, resins containing a fluorine atom, etc. can be mentioned. Among these, it is preferable to use a resin containing a fluorine atom, and it is especially preferable that the resin is curable.
또한, 이형 필름으로서 이용할 때, A층의 위에 B층을 적층함으로써, 피착체에 대한 박리력이 작아져, 경박리성을 가질 수 있다. 본 발명자에 의하면, 적층 필름에 A층이 적층되어 있지 않은 경우, 적층 필름의 박리 시에 박리 방향으로 피착체(점착제)도 추종되기 때문에, 피착체와 박리하기 위해서는 보다 큰 힘이 필요해져, 박리하기 어려운 것(중박리)이 추측되었다(도 2의 (a)). 한편, 본 발명과 같이, 적층 필름에 불소 원자를 함유하는 A층이 적층되어 있는 경우, A층이 상대적으로 유연성을 가지기 때문에, 박리 시에 A층이 쿠션과 같이 작용하여, 피착체의 변형이 억제되기 때문에, 보다 작은 힘으로 피착체와 박리할 수 있어, 박리하기 쉬워졌다(경박리)고 추측된다(도 2의 (b)).Additionally, when used as a release film, by laminating the B layer on the A layer, the peeling force against the adherend is reduced and easy peelability can be achieved. According to the present inventor, when the layer A is not laminated on the laminated film, the adherend (adhesive) also follows the direction of peeling when the laminated film is peeled, so a greater force is required to peel from the adherend, and peeling occurs. It was assumed that it was difficult to do (medium peeling) (Figure 2(a)). On the other hand, as in the present invention, when the A layer containing fluorine atoms is laminated on the laminated film, because the A layer is relatively flexible, the A layer acts like a cushion when peeled, preventing deformation of the adherend. Because it is suppressed, it is assumed that peeling from the adherend can be done with less force, making peeling easier (light peeling) (Figure 2(b)).
<A층의 불소 원자 함유 비율><Fluorine atom content ratio in A layer>
A층은 불소 원자를 함유하는 재료를 포함하고, 그 불소 원자 함유 비율(원자수 분율)은, 밀착성이나 경박리성의 관점에서, A층 전체로서, 50ppm 이상이 바람직하고, 500ppm 이상이 보다 바람직하며, 1,000ppm 이상이 더 바람직하고, 50,000ppm 이상이 특히 바람직하다. 한편 상한은 특별히 한정되지 않지만, 900,000ppm 미만이 바람직하고, 800,000ppm 이하가 보다 바람직하며, 700,000ppm 이하가 더 바람직하다.The A layer contains a material containing a fluorine atom, and the fluorine atom content ratio (atomic number fraction) for the entire A layer is preferably 50 ppm or more, more preferably 500 ppm or more, from the viewpoint of adhesion and easy peelability. , 1,000 ppm or more is more preferable, and 50,000 ppm or more is particularly preferable. On the other hand, the upper limit is not particularly limited, but is preferably less than 900,000 ppm, more preferably 800,000 ppm or less, and still more preferably 700,000 ppm or less.
A층의 불소 원자 함유 비율은, 예를 들면 적층 필름을 구성하는 언더코팅층에서 고분자 필름의 근방을 X선 광전자 분광법(XPS법)에 의해, 스팩터 에칭에 의한 깊이 방향 분석을 행함으로써 확인할 수 있다. A층의 불소 원자 함유 비율은, 미리 불소 원자 함유 비율이 알려져 있는 재료(불소화 실리콘 등)를 기준으로 하여 이용함으로써, 정량화하는 것도 가능하다. 또한 XPS법에 의해 확인하는 경우, 수소 및 헬륨을 제외한 모든 원소에 대하여 불소가 차지하는 비율을 불소 원자 함유 비율이라고 했다.The fluorine atom content ratio of the A layer can be confirmed, for example, by performing depth direction analysis by spectro etching in the vicinity of the polymer film in the undercoat layer constituting the laminated film using X-ray photoelectron spectroscopy (XPS method). . The fluorine atom content ratio of the A layer can also be quantified by using as a reference a material (such as fluorinated silicon) whose fluorine atom content ratio is previously known. In addition, when confirming by the XPS method, the ratio of fluorine to all elements except hydrogen and helium was referred to as the fluorine atom content ratio.
A층의 불소 원자 함유 비율을 상기 범위로 함으로써, 마찬가지로 불소 원자를 포함하는 B층(이형층)을, A층 상에 도포법으로 마련할 때에 균일하게 도포할 수 있음과 함께, 도포나 적층 후의 A층과 B층과의 밀착성도 높게 할 수 있다.By keeping the fluorine atom content ratio of the A layer within the above range, the B layer (release layer), which also contains fluorine atoms, can be uniformly applied when preparing it on the A layer by a coating method, and the Adhesion between the A layer and the B layer can also be increased.
또한, A층 전체로서 상기의 불소 원자 함유 비율이 되면, A층에 이용하는 수지는, 불소 원자를 포함하는 수지 단독이어도, 불소 원자를 포함하지 않는 수지(비불소화 수지)를 혼합하여 이용해도 된다.In addition, if the above-mentioned fluorine atom content ratio is achieved in the entire A layer, the resin used in the A layer may be used alone as a resin containing a fluorine atom, or may be used in combination with a resin that does not contain a fluorine atom (non-fluorinated resin).
또한, A층 중에서 두께 방향으로 불소 원자 함유 비율이 경사진 조성으로 되어 있어도 된다. 후술하는 B층에 대해서도 마찬가지이다.Additionally, the A layer may have a composition in which the fluorine atom content ratio is inclined in the thickness direction. The same applies to the B layer, which will be described later.
<불소 원자를 포함하는 수지><Resin containing fluorine atoms>
본 발명에 이용하는 불소 원자를 포함하는 수지로서는, 수지 골격의 측쇄 부분에 불소 원자를 포함하는 수지를 들 수 있다. 불소 원자를 포함하는 수지의 구체예로서는, 불소화 실리콘 수지 이외에, 폴리테트라플루오로에틸렌 등의 함불소 탄화수소 수지, 그 밖의 불소화 처리된 각종 수지 등을 들 수 있지만, 이들 중에서도, 박리성의 관점에서 불소화 실리콘 수지가 바람직하다.Examples of the resin containing a fluorine atom used in the present invention include a resin containing a fluorine atom in the side chain portion of the resin skeleton. Specific examples of the resin containing a fluorine atom include, in addition to fluorinated silicone resins, fluorinated hydrocarbon resins such as polytetrafluoroethylene, and various other fluorinated resins. Among these, fluorinated silicone resins are preferred from the viewpoint of peelability. is desirable.
불소화 실리콘 수지로서는, 경화성의 것도 비경화성의 것도 특별히 한정하지 않고 이용할 수 있다. 그 중에서도, 보다 강고한 층을 형성하는 점에서, 경화성 불소화 실리콘 수지가 바람직하다. 또한, 불소화 실리콘 수지가 용제형이어도, 무용제형이어도, 이들을 혼합한 것이어도 된다. 경화성 불소화 실리콘 수지에는, 통상, 알케닐기나 히드로실릴기 등, 반응(경화)함으로써 가교 구조를 형성할 수 있는 관능기가 결합되어 있다.As the fluorinated silicone resin, both curable and non-curable resins can be used without particular limitation. Among them, curable fluorinated silicone resin is preferable because it forms a stronger layer. Additionally, the fluorinated silicone resin may be of a solvent type, a non-solvent type, or a mixture of these. A curable fluorinated silicone resin usually has a functional group bonded thereto, such as an alkenyl group or a hydrosilyl group, that can form a crosslinked structure by reacting (curing).
경화성 불소화 실리콘 수지로서는, 신에츠가가쿠(주)제의 KP-911, X-70-201S; 도레이·다우코닝(주)제의 FS1265-300CS, FS1265-1000CS, FS1265-10000CS, BY24-900, BY24-903, Syl-off 3062, Q2-7785 등을 들 수 있다.Examples of the curable fluorinated silicone resin include KP-911 and X-70-201S manufactured by Shin-Etsu Chemical Co., Ltd.; Examples include FS1265-300CS, FS1265-1000CS, FS1265-10000CS, BY24-900, BY24-903, Syl-off 3062, and Q2-7785 manufactured by Toray Dow Corning Co., Ltd.
또한, 불소화 실리콘 수지의 불소 원자 함유 비율(원자수 분율)은, 일반적으로 수천 ppm~수십 % 정도이다.Additionally, the fluorine atom content ratio (atomic number fraction) of the fluorinated silicone resin is generally on the order of several thousand ppm to several tens of percent.
<불소 원자를 포함하지 않는 수지><Resin not containing fluorine atoms>
본 발명에 이용하는 불소 원자를 포함하지 않는 수지(비불소화 수지)로서는, 실리콘 수지, 폴리올레핀 수지, 아크릴 수지 등을 들 수 있지만, 이들 중에서도, 불소 원자를 포함하는 수지, 특히 불소화 실리콘 수지와의 상용성의 관점에서 실리콘 수지가 바람직하다(본 발명에 있어서, 불소 원자를 포함하지 않는 실리콘 수지를 「비불소화 실리콘 수지」라고 하는 경우가 있다). 또한, 비불소화 수지는 경화성의 것, 비경화성의 것 중 어느 것을 이용해도 되고, 양자를 혼합하여 이용해도 상관없다. 비경화성 불소화 실리콘 수지에도, 경화성 불소화 실리콘 수지와 마찬가지로, 통상, 알케닐기나 히드로실릴기 등, 반응(경화)함으로써 가교 구조를 형성할 수 있는 관능기가 결합되어 있다.Resins (non-fluorinated resins) that do not contain fluorine atoms used in the present invention include silicone resins, polyolefin resins, and acrylic resins. Among these, resins containing fluorine atoms are compatible with fluorinated silicone resins, in particular. From this point of view, silicone resins are preferable (in the present invention, silicone resins that do not contain fluorine atoms are sometimes referred to as “non-fluorinated silicone resins”). In addition, the non-fluorinated resin may be either curable or non-curable, or a mixture of both may be used. Like curable fluorinated silicone resins, non-curable fluorinated silicone resins also usually contain functional groups such as alkenyl groups and hydrosilyl groups that can form a crosslinked structure by reacting (curing).
경화성 hardenability 비불소화Non-fluoridated 실리콘 수지 silicone resin
경화성의 비불소화 실리콘 수지로서는 용제형이어도 무용제형이어도 된다.The curable non-fluorinated silicone resin may be of a solvent type or a non-solvent type.
경화성의 비불소화 실리콘 수지의 구체예로서는, 신에츠가가쿠(주)제의 KNS-3051, KNS-320A, KNS-316, KNS-3002, KNS-3300, X-62-1387, KS-3656, KS-837, X-62-2829, KS-3650, KS-847, KS-847T, KS-847H, KS-776L, KS-776A, KS-774, KS-3703T, KS-3601, KS-830E, X-62-2825, X-62-9201-A, X-62-9201B, KM3951, KM-768, X-52-6015, KF-2005, X-62-7205, X-62-7028-A, X-62-7028-B, X-62-7052, X-62-7622, X-62-7660, X-62-7655; 도레이·다우코닝(주)제의 SP7017, SP7015, SP7025, SP7031, LTC1006L, LTC1063L, LTC1036M, LTC1056L, SRX357, SRX211, SRX345, SRX370, LTC300B, LTC310, LTC355A, LTC759, LTC755, LTC750A, LTC752, LTC761, LTC856, LTC851 등을 들 수 있다.Specific examples of curable non-fluorinated silicone resins include KNS-3051, KNS-320A, KNS-316, KNS-3002, KNS-3300, 837, 62-2825, X-62-9201-A, X-62-9201B, KM3951, KM-768, 62-7028-B, X-62-7052, X-62-7622, X-62-7660, X-62-7655; Toray Dow Corning Co., Ltd. SP7017, SP7015, SP7025, SP7031, LTC1006L, LTC1063L, LTC1036M, LTC1056L, SRX357, SRX211, SRX345, SRX370, LTC300B, LTC310, LTC355A, LTC759, L TC755, LTC750A, LTC752, LTC761, LTC856 , LTC851, etc.
또한, 상기 경화성의 비불소화 실리콘 수지에 중박리 첨가제를 더해도 되고, 그 예로서는, 신에츠가가쿠(주)제의 KS-3800; 도레이·다우코닝(주)제의 SD7292, BY24-4980 등을 들 수 있다.Additionally, a heavy release additive may be added to the curable non-fluorinated silicone resin, examples of which include KS-3800 manufactured by Shin-Etsu Chemical Co., Ltd.; Examples include SD7292 and BY24-4980 manufactured by Toray Dow Corning Co., Ltd.
또한, 상기의 경화형 비불소화 실리콘은, 단독으로 이용해도 되고, 또한, 상이한 2종류 이상을 혼합하여 이용해도 된다. 2종류 이상의 경화형 비불소화 실리콘을 혼합함으로써, 경화 반응을 조정하거나, A층의 도포액 점도를 조정하거나, 나아가서는, B층의 젖음성 및 반응성을 높이거나 할 수 있다. 그 때, 무용제형 실리콘끼리를 혼합하도록 해도, 용제형 실리콘끼리를 혼합하도록 해도, 무용제형 실리콘과 용제형 실리콘을 혼합하도록 해도 된다. 특히, 보다 경박리한 이형 필름을 얻기 위해, A층의 막 두께를 두껍게 하는 경우에는, A층을 형성하는 도포액의 고형분 농도는 높아지는 경향이 있다. 이 때문에, 도포액의 점도가 높아져, 코팅 외관의 악화나 두께 불균일이 커진다고 하는 문제가 발생할 가능성이 있다. 따라서, 무용제형 실리콘과 용제형 실리콘을 혼합함으로써, 도포액의 점도를 저하시켜, 양호한 코팅 외관 및 작은 두께 불균일을 가지는 A층을 형성할 수 있다.In addition, the above curable non-fluorinated silicone may be used alone, or two or more different types may be mixed and used. By mixing two or more types of curable non-fluorinated silicones, the curing reaction can be adjusted, the coating liquid viscosity of the A layer can be adjusted, and the wettability and reactivity of the B layer can be further increased. At that time, non-solvent type silicones may be mixed, solvent type silicones may be mixed, or solvent free type silicones and solvent type silicones may be mixed. In particular, when the film thickness of the A layer is increased in order to obtain a release film that is more easily peeled, the solid content concentration of the coating liquid forming the A layer tends to increase. For this reason, the viscosity of the coating liquid increases, and problems such as deterioration of the coating appearance or increased thickness unevenness may occur. Therefore, by mixing non-solvent type silicone and solvent type silicone, the viscosity of the coating liquid can be reduced and an A layer with a good coating appearance and small thickness unevenness can be formed.
여기서 「무용제형 실리콘」은, 용제에 희석하지 않더라도 도공할 수 있는 점도의 실리콘이며, 짧은 폴리실록산쇄(鎖)로 이루어져 있으며, 비교적 저분자량의 실리콘이다.Here, “solvent-free silicone” is a silicone with a viscosity that can be coated even without diluting with a solvent, and is made up of short polysiloxane chains and has a relatively low molecular weight.
무용제형 실리콘의 점도는, 100% 농도로 하였을 때의 점도가 단체(單體)에서 1000mPa·s 미만인 것이 바람직하고, 그 중에서도 50mPa·s 이상 혹은 900mPa·s이하, 그 중에서도 80mPa·s 이상 혹은 800mPa·s 이하인 것이 더 바람직하다.The viscosity of the non-solvent type silicone at 100% concentration is preferably less than 1000 mPa·s, especially 50 mPa·s or more or 900 mPa·s or less, and especially 80 mPa·s or more or 800 mPa. ·s or less is more preferable.
한편, 「용제형 실리콘」이란, 용제에 희석하지 않으면 도공할 수 없을 정도로 점도가 높은 점도를 가지는 실리콘이며, 비교적 높은 분자량으로 이루어지는 실리콘이다.On the other hand, “solvent-type silicone” is a silicone that has a viscosity so high that it cannot be coated unless diluted with a solvent, and is a silicone that has a relatively high molecular weight.
용제형 실리콘의 점도는, 30% 톨루엔 용액으로 하였을 때의 점도가 1000mPa·s 이상인 것이 바람직하고, 그 중에서도 2000mPa·s 이상 혹은 20000mPa·s 이하, 그 중에서도 3000mPa·s 이상 혹은 18000mPa·s 이하인 것이 더 바람직하다.The viscosity of the solvent-type silicone when used as a 30% toluene solution is preferably 1000 mPa·s or more, especially 2000 mPa·s or more or 20000 mPa·s or less, and especially 3000 mPa·s or more or 18000 mPa·s or less. desirable.
비경화성Non-hardening 비불소화Non-fluoridated 실리콘 수지 silicone resin
A층에 비경화성 비불소화 실리콘 수지가 포함됨으로써, 경화 반응의 제어성을 개량할 수 있음과 함께, A층에 충분한 유연성도 부여되고, 또한 적층 필름과 점착제층과 적층시킨 적층체의 보존 안정성도 양호해진다. 비경화성 비불소화 실리콘 수지로서는, 상기에서 열거한 비불소화 실리콘 수지이며 반응성 관능기를 가지고 있지 않은 실리콘 수지를 특별히 한정하지 않고 이용할 수 있다. 구체적으로는, 하기 일반 식 (I)로 나타나는, 오르가노폴리실록산이 바람직하다.By including a non-curable non-fluorinated silicone resin in the A layer, the controllability of the curing reaction can be improved, and sufficient flexibility is provided to the A layer, and the storage stability of the laminate laminated with the laminated film and the adhesive layer is also improved. It gets better. As the non-curable non-fluorinated silicone resin, the non-fluorinated silicone resins listed above that do not have a reactive functional group can be used without particular limitation. Specifically, organopolysiloxane represented by the following general formula (I) is preferable.
R3SiO(R2SiO)mSiR3…… (I)R 3 SiO(R 2 SiO) m SiR 3 … … (I)
(식 중, R은 지방족 불포화 결합을 가지지 않는 동일 또는 이종(異種)의 1가 탄화수소기, m은 정(正)의 정수를 나타낸다.)(In the formula, R represents the same or different monovalent hydrocarbon group without an aliphatic unsaturated bond, and m represents a positive integer.)
경화성의 실리콘 수지(불소화 및 비불소화의 합계)와 비경화성 비불소화 실리콘 수지의 질량 혼합비는, 1:1000~1000:1의 범위 내인 것이 바람직하고, 1:100~100:1의 범위 내인 것이 보다 바람직하며, 1:50~50:1의 범위 내인 것이 더 바람직하다. 특히 바람직한 것은, 1:20~20:1의 범위 내이며, 그 중에서도 1:1~20:1이 바람직하다.The mass mixing ratio of the curable silicone resin (total of fluorinated and non-fluorinated) and the non-curable non-fluorinated silicone resin is preferably within the range of 1:1000 to 1000:1, and more preferably within the range of 1:100 to 100:1. It is preferable, and it is more preferable that it is within the range of 1:50 to 50:1. Particularly preferable is the range of 1:20 to 20:1, with 1:1 to 20:1 being particularly preferable.
A층의 막 두께는, 10㎚ 이상 100㎛ 이하가 바람직하고, 20㎚ 이상 10㎛ 이하가 보다 바람직하며, 50㎚ 이상 1㎛ 이하가 더 바람직하다. 특히 바람직한 범위는, 80㎚ 이상 800㎚ 이하이다.The film thickness of layer A is preferably 10 nm or more and 100 μm or less, more preferably 20 nm or more and 10 μm or less, and still more preferably 50 nm or more and 1 μm or less. A particularly preferable range is 80 nm or more and 800 nm or less.
이 막 두께가 10㎚ 미만과 같이 과도하게 얇은 경우에는, A층과 B층과의 밀착성의 악화뿐만 아니라, 실리콘 점착제층과 적층 필름의 B층과의 박리성이 악화되는 경향이 있다. 한편, A층의 막 두께가 지나치게 두꺼운 경우에는, 재료의 사용량이 증가하고, 그 사용량 증가에 걸맞는 효과의 증가가 얻어지기 어렵다.When this film thickness is excessively thin, such as less than 10 nm, not only the adhesion between the A layer and the B layer deteriorates, but also the peelability between the silicone adhesive layer and the B layer of the laminated film tends to deteriorate. On the other hand, when the film thickness of the A layer is too thick, the amount of material used increases, and it is difficult to obtain an increase in effect commensurate with the increase in the amount used.
3. B층(이형층)3. B layer (release layer)
<B층의 구성><Configuration of B-floor>
B층(이형층)을 형성하는 재료로서는, 전술의 A층(언더코팅층)에 기재와 마찬가지의 불소 원자를 포함하는 수지를 마찬가지로 이용할 수 있다. 그 중에서도, 피착체와의 이형성의 관점에서, 불소화 실리콘 수지가 바람직하고, 특히, 경화성 불소화 실리콘 수지가 바람직하다. 경화성 불소화 실리콘 수지를 B층(이형층)에 이용함으로써, 실리콘 점착제층에 대하여 안정된 박리성을 가지는 이형 필름을 얻을 수 있다.As a material for forming the B layer (release layer), a resin containing the same fluorine atoms as the base material for the above-described A layer (undercoat layer) can be similarly used. Among them, from the viewpoint of release properties from the adherend, fluorinated silicone resin is preferable, and curable fluorinated silicone resin is especially preferable. By using a curable fluorinated silicone resin for the B layer (release layer), a release film with stable peelability from the silicone adhesive layer can be obtained.
B층은 경화성 불소화 실리콘 수지 단독으로 형성해도 되고, 경화성 비불소화 실리콘 수지와 혼합하는 등, 복수의 재료의 혼합물을 이용해도 된다.The B layer may be formed of the curable fluorinated silicone resin alone, or may be formed of a mixture of a plurality of materials, such as mixed with a curable non-fluorinated silicone resin.
B층을 형성하기 위한 도포액은, A층에 대한 젖음성을 높일 목적으로 불소 원자를 함유하는 불소계 용매를 포함하는 것이 특히 바람직하다.It is particularly preferable that the coating liquid for forming the B layer contains a fluorine-based solvent containing a fluorine atom for the purpose of increasing wettability to the A layer.
B층의 막 두께는, 지나치게 얇으면 본 발명의 효과가 얻어지기 어려워지는 경우가 있고, 한편, 지나치게 두꺼운 경우에는 재료의 사용량의 증가분에 걸맞는 효과의 증가는 얻어지기 어려워지는 경우가 있다.If the film thickness of the B layer is too thin, it may be difficult to obtain the effect of the present invention, and on the other hand, if it is too thick, it may be difficult to obtain an increase in effect commensurate with the increase in the amount of material used.
B층의 막 두께의 하한은, 5㎚ 이상이 바람직하고, 10㎚ 이상이 보다 바람직하며, 20㎚ 이상이 특히 바람직하다. 또한 그 상한은, 50㎛ 이하가 바람직하고, 1㎛ 이하가 보다 바람직하며, 500㎚ 이하가 특히 바람직하다.The lower limit of the film thickness of layer B is preferably 5 nm or more, more preferably 10 nm or more, and particularly preferably 20 nm or more. Moreover, the upper limit is preferably 50 μm or less, more preferably 1 μm or less, and especially preferably 500 nm or less.
<B층의 불소 원자 함유 비율><Fluorine atom content ratio in B layer>
본 발명의 적층 필름은, A층(언더코팅층)의 위에 B층(이형층)이 형성되어 있다. 이 B층의 재료로서 바람직한 것은, 상기 A층의 설명에 기재한 것과 마찬가지이지만, 밀착성이나 경박리성의 관점에서, B층에 포함되는 단위 체적당의 불소 원자 함유 비율은 A층보다 많이 포함되어 있는 것이 필요하다.In the laminated film of the present invention, a B layer (release layer) is formed on the A layer (undercoat layer). Preferred materials for this B layer are the same as those described in the description of the A layer above, but from the viewpoint of adhesion and easy peelability, the B layer has a higher fluorine atom content per unit volume than the A layer. need.
본 발명에 있어서는, SIMS법 등에 의해 측정되는 B층 중에 포함되는 불소 원자 함유 비율(원자수 분율)의 하한은, 3,000ppm 이상인 것이 바람직하고, 5,000ppm 이상이 보다 바람직하며, 10,000ppm 이상이 더 바람직하고, 20,000ppm 이상이 특히 바람직하다. 한편 상한은, 특별히 한정되지 않지만, 900,000ppm 이하가 바람직하고, 800,000ppm 이하가 보다 바람직하며, 700,000ppm 이하가 특히 바람직하다.In the present invention, the lower limit of the fluorine atom content ratio (atomic number fraction) contained in the B layer measured by SIMS method or the like is preferably 3,000 ppm or more, more preferably 5,000 ppm or more, and even more preferably 10,000 ppm or more. And, 20,000 ppm or more is particularly preferable. Meanwhile, the upper limit is not particularly limited, but is preferably 900,000 ppm or less, more preferably 800,000 ppm or less, and especially preferably 700,000 ppm or less.
B층의 불소 원자 함유 비율은, 예를 들면 적층 필름의 이형층 표면을 2차 이온 질량 분석법(SIMS법)이나 X선 광전자 분광법(XPS법)에 의해 확인할 수 있다. B층의 불소 원자 함유 비율은, 미리 불소 원자 함유 비율이 알려져 있는 재료(불소화 실리콘 등)를 기준으로 하여 이용함으로써, 정량화하는 것도 가능하다. 또한 XPS법에 의해 확인하는 경우, 수소 및 헬륨을 제외한 모든 원소에 대하여 불소가 차지하는 비율을 불소 원자 함유 비율이라고 했다.The fluorine atom content ratio of the B layer can be confirmed, for example, by secondary ion mass spectrometry (SIMS method) or X-ray photoelectron spectroscopy (XPS method) on the surface of the release layer of the laminated film. The fluorine atom content ratio of the B layer can also be quantified by using as a reference a material (such as fluorinated silicon) whose fluorine atom content ratio is known in advance. In addition, when confirming by the XPS method, the ratio of fluorine to all elements except hydrogen and helium was referred to as the fluorine atom content ratio.
이상, 불소 원자 함유 비율이 상이한 A층과 B층을 순차 적층하는 경우에 대하여 설명했지만, 1회의 적층 공정에 있어서 당해 층 중에서 두께 방향으로 불소 원자 함유 비율이 경사 구조를 가지도록(경사진 조성이 되도록) 궁리함으로써, 실질적으로 상기의 A층과 B층과의 적층 구성과 동등한 구조를 취할 수 있는 경우가 있다. 예를 들면, 불소 원자를 포함하는 수지와 불소 원자를 포함하지 않는 수지를 용매에 희석시켜 도포액으로 하고, 고분자 필름의 적어도 편면에 당해 도포액을 도포하여, 건조시킴으로써 불소 원자를 포함하는 수지가 층의 표면에 농축되어, 두께 방향으로 경사 구조를 가지게 한 층으로 하는 방법을 들 수 있다. 이와 같은 적층 공정을 취할 수 있는 경우에는, 반드시 A층과 B층을 단계적으로 순차 적층하는 수단에 한정되는 것은 아니고, 또한 반드시 양층의 계면이 명확하지 않아도 되고, 하나의 층 중의 표면측이 B층, 고분자 필름측이 A층으로 되어 있어, 실질적으로 동일한 구성으로 되어 있으면 본 발명에 포함된다.Above, the case where layers A and B with different fluorine atom content ratios are sequentially laminated has been described. However, in one lamination process, the fluorine atom content ratio in the layer has an inclined structure in the thickness direction (inclined composition). By devising as much as possible, there are cases where a structure substantially equivalent to the above-described lamination structure of the A layer and the B layer can be obtained. For example, a resin containing a fluorine atom and a resin not containing a fluorine atom are diluted in a solvent to form a coating solution, and the coating solution is applied to at least one side of a polymer film and dried to form a resin containing a fluorine atom. A method of forming a layer by concentrating it on the surface of the layer and having an inclined structure in the thickness direction is an example. When such a stacking process can be used, it is not necessarily limited to a means of sequentially stacking the A layer and the B layer in stages, and the interface between the two layers does not necessarily have to be clear, and the surface side of one layer is the B layer. , if the polymer film side is the A layer and has substantially the same structure, it is included in the present invention.
이와 같이 A층 및 B층을 경사 구조로 함으로써, 실질적인 A층과 고분자 필름과의 계면이나, A층과 B층과의 계면의 밀착성을 높이는 것도 기대할 수 있다. 나아가서는, B층 표면의 불소 원자 함유 비율을 높일 수 있기 때문에, 적층 필름 전체의 불소 원자를 포함하는 수지의 함유량을 낮게 억제하면서, 경박리성을 보다 한층 향상시킬 수 있는 경우가 있다.By making the A layer and the B layer into an inclined structure in this way, it can be expected to substantially improve the adhesion of the interface between the A layer and the polymer film or the interface between the A layer and the B layer. Furthermore, since the fluorine atom content ratio of the B layer surface can be increased, light peelability may be further improved while suppressing the content of the resin containing fluorine atoms in the entire laminated film to a low level.
4. 불소 원자 함유비4. Fluorine atom content ratio
본 발명에 있어서는, 밀착성이나 경박리성의 관점에서, A층 및 B층의 양층이 불소 원자를 함유하는 것에 더해, 그 함유 비율이, 각 층의 기재가 되는 실리콘 수지의 메틸실록산 이온(CH3SiO2 -)의 함유 비율과, 특정의 관계에 있는 것이 바람직하다.In the present invention, from the viewpoint of adhesion and easy peelability, in addition to the fact that both layers A and B contain fluorine atoms, the content ratio is methylsiloxane ion (CH 3 SiO) of the silicone resin that serves as the base material of each layer. 2- ) It is desirable to have a specific relationship with the content ratio.
즉, SIMS법 등에 의해 산출되는 B층에 포함되는 불소 이온 함유 비율과 메틸실록산 이온 함유 비율과의 비([F-]/[CH3SiO2 -])(이하, 「불소 원자 함유비」라고 약기함)는, A층의 불소 원자 함유비보다 큰 것이 바람직하다.That is, the ratio between the fluorine ion content ratio and the methylsiloxane ion content ratio calculated by the SIMS method, etc. ([F - ]/[CH 3 SiO 2 - ]) (hereinafter referred to as the "fluorine atom content ratio") (abbreviated) is preferably larger than the fluorine atom content ratio of the A layer.
또한, A층, B층 각각의 불소 원자 함유비는, A층에서는 1 이상, 1,000 이하, B층에서는 3 이상 5,000 이하인 것이 바람직하다.In addition, the fluorine atom content ratio of each of the A layer and the B layer is preferably 1 or more and 1,000 or less in the A layer, and 3 or more and 5,000 or less in the B layer.
B층의 보다 바람직한 불소 원자 함유비의 하한은, 5 이상이 바람직하고, 10 이상이 보다 바람직하며, 20 이상이 더 바람직하다. 또한, 그 상한은, 3,000 이하가 바람직하고, 보다 바람직한 상한은 1,000 이하이다.The lower limit of the more preferable fluorine atom content ratio of the B layer is preferably 5 or more, more preferably 10 or more, and still more preferably 20 or more. Additionally, the upper limit is preferably 3,000 or less, and a more preferable upper limit is 1,000 or less.
B층의 불소 원자 함유비는, 실리콘 점착제층과의 경박리성의 관점에서, A층의 불소 원자 함유비의 1.1배 이상인 것이 바람직하고, 1.5배 이상이 보다 바람직하며, 2배 이상이 더 바람직하고, 3배 이상이 특히 바람직하며, 5배 이상이 가장 바람직하다. 한편, 상한은 특별히 한정되지 않지만, A층과 B층과의 밀착성의 관점에서 1000배 이하가 바람직하고, 100배 이하가 보다 바람직하다.The fluorine atom content ratio of the B layer is preferably 1.1 times or more, more preferably 1.5 times or more, and still more preferably 2 times or more than the fluorine atom content ratio of the A layer from the viewpoint of easy peelability with the silicone adhesive layer. , 3 times or more is particularly preferable, and 5 times or more is most preferable. On the other hand, the upper limit is not particularly limited, but from the viewpoint of adhesion between the A layer and the B layer, 1000 times or less is preferable, and 100 times or less is more preferable.
본 발명에서는, B층 중의 불소 원자 함유 비율(원자수 분율)은, 실리콘 점착제층과의 경박리성과의 관점에서, A층 중의 불소 원자 함유 비율(원자수 분율)의 1.1배 이상인 것이 바람직하고, 1.5배 이상이 보다 바람직하며, 2배 이상이 더 바람직하고, 3배 이상이 특히 바람직하며, 5배 이상이 가장 바람직하다. 한편, 상한은 특별히 한정되지 않지만, A층과 B층과의 밀착성의 관점에서 1000배 이하가 바람직하고, 100배 이하가 보다 바람직하다.In the present invention, the fluorine atom content ratio (atomic number fraction) in the B layer is preferably 1.1 times or more than the fluorine atom content ratio (atomic number fraction) in the A layer from the viewpoint of easy peelability with the silicone adhesive layer, 1.5 times or more is more preferable, 2 times or more is more preferable, 3 times or more is particularly preferable, and 5 times or more is most preferable. On the other hand, the upper limit is not particularly limited, but from the viewpoint of adhesion between the A layer and the B layer, 1000 times or less is preferable, and 100 times or less is more preferable.
여기서, 「불소 원자 함유 비율(원자수 분율)」은, 당해 층에 대한 불소 원자의 비율을 의미한다. A층, B층의 모두가 실질적으로 실리콘 수지(불소화, 비불소화 및, 경화성, 비경화성을 포함함)로 구성되어 있는 경우에 있어서는, 상기의 「불소 원자 함유비」와 「불소 원자 함유 비율(원자수 분율)」에 관하여, A층과 B층과의 비율은 마찬가지의 값이 된다.Here, “fluorine atom content ratio (atomic number fraction)” means the ratio of fluorine atoms to the layer. In the case where both the A layer and the B layer are substantially composed of silicone resin (including fluorinated, non-fluorinated, curable, and non-curable), the above "fluorine atom content ratio" and "fluorine atom content ratio ( Regarding the atomic number fraction), the ratio between the A layer and the B layer is the same value.
B층의 불소 원자 함유비를 상기 범위로 함으로써, A층과 B층과의 사이에 충분한 밀착성이 얻어지고, 또한 B층과 실리콘 점착제층과의 양호한 박리성을 발현할 수 있다.By setting the fluorine atom content ratio of the B layer within the above range, sufficient adhesion can be obtained between the A layer and the B layer, and good peelability between the B layer and the silicone adhesive layer can be achieved.
또한 B층의 불소 원자 함유 비율 및/또는 불소 원자 함유비가 A층보다 높음으로써, A층과 B층과의 충분한 밀착성이 얻어지고, 또한 B층과 실리콘 점착제층과의 양호한 박리성을 안정적으로 발현할 수 있다.In addition, since the fluorine atom content ratio and/or the fluorine atom content ratio of the B layer is higher than that of the A layer, sufficient adhesion between the A layer and the B layer is obtained, and good peelability between the B layer and the silicone adhesive layer is stably exhibited. can do.
또한, 상기 A층, B층의 불소 원자 함유 비율 혹은 불소 원자 함유비는, 도포제의 핵자기 공명 스펙트럼(NMR)법에 의해 그 구조 분석을 행하여 산출하거나, 또한 층 형성 후에도 2차 이온 질량 분석법(SIMS법)이나 X선 전자 분광법(XPS법) 등에 의해 정량하거나 할 수 있다.In addition, the fluorine atom content ratio or the fluorine atom content ratio of the A layer and the B layer can be calculated by analyzing the structure of the coating agent using nuclear magnetic resonance spectroscopy (NMR), or even after layer formation, secondary ion mass spectrometry ( It can be quantified by SIMS method) or X-ray electron spectroscopy (XPS method).
SIMS법이나 XPS법에 의한 측정에 있어서는, 미리 불소 원자 함유 비율이 알려져 있는 재료(불소화 실리콘 등)를 기준으로 하여, 각 층의 불소 원자 함유 비율을 정량할 수도 있다.In measurements by the SIMS method or the
불소 원자가 A층, B층 각각의 중에서 균일하게 존재하고 있지 않은 경우(예를 들면, 상기한 경사 구조인 경우)에는, SIMS법 등에 의해 측정한 각 층 중에 포함되는 불소 원자의 총량을 각 층의 체적으로 나눈 단위 체적당의 불소 원자 함유 비율을 A층, B층 각 층의 불소 원자 함유비로 하면 된다.In cases where fluorine atoms do not exist uniformly in each of layer A and layer B (for example, in the case of the above-described inclined structure), the total amount of fluorine atoms contained in each layer measured by the SIMS method, etc. The fluorine atom content ratio per unit volume divided by the volume can be defined as the fluorine atom content ratio of each layer A and B.
<그 밖의 배합제><Other mixing agents>
A층 및 B층에 관한 것으로서, 경화성 비불소화 실리콘 수지 및 경화성 불소화 실리콘 수지를 가지는 도포액에는, 가교제, 촉매, 및 반응 개시제(반응 촉진제)가 포함되어 있는 것이 바람직하다. 또한, 경화성 실리콘 수지를 포함하는 시판의 도료에는, 처음부터 가교제나 촉매가 포함되어 있는 경우도 있다.Regarding the A layer and the B layer, it is preferable that the coating liquid containing the curable non-fluorinated silicone resin and the curable fluorinated silicone resin contains a crosslinking agent, a catalyst, and a reaction initiator (reaction accelerator). Additionally, commercially available paints containing curable silicone resins may initially contain a crosslinking agent or catalyst.
A층 및 B층을 형성함에 있어서, 수지에 포함되는 반응성 관능기와 반응하여 가교 구조를 형성하기 위해 가교제가 포함되어 있는 것이 바람직하다. 가교제로서는, 비닐실록산이나 히드로실록산 부위를 가지는 오르가노실록산 등을 들 수 있다. 상기 가교제의 구체예로서는, 도레이·다우코닝(주)제의 SP7297, 7560, 3062A, 3062B, 3062C, 3062D 등을 들 수 있다.When forming the A layer and the B layer, it is preferable that a crosslinking agent is included in order to form a crosslinked structure by reacting with the reactive functional group contained in the resin. Examples of the crosslinking agent include vinylsiloxane and organosiloxane having a hydrosiloxane moiety. Specific examples of the crosslinking agent include SP7297, 7560, 3062A, 3062B, 3062C, and 3062D manufactured by Toray Dow Corning Co., Ltd.
또한, 가교제는 불소 치환기를 가지는 부위를 포함하고 있어도 되고, 불소화된 치환기를 가지는 실란커플링제 등을 이용해도 된다.Additionally, the crosslinking agent may contain a portion having a fluorine substituent, or a silane coupling agent having a fluorinated substituent, etc. may be used.
또한, A층 및 B층을 형성함에 있어서, 부가형의 반응을 촉진하는 촉매가 포함되어 있는 것이 바람직하고, 그 중에서도 백금 촉매가 포함되어 있는 것이 바람직하다. 백금 촉매로서는, 염화 백금산, 염화 백금산의 알코올 용액, 염화 백금산과 올레핀과의 착체, 염화 백금산과 알케닐실록산과의 착체 등의 백금계 화합물, 백금흑, 백금 담지 실리카, 백금 담지 활성탄이 예시된다. 백금 촉매는 1종 또는 2종 이상을 병용해도 된다.In addition, when forming the A layer and the B layer, it is preferable that a catalyst that promotes the addition reaction is contained, and it is especially preferable that a platinum catalyst is contained. Examples of the platinum catalyst include platinum-based compounds such as chloroplatinic acid, alcohol solution of chloroplatinic acid, complex of chloroplatinic acid and olefin, complex of chloroplatinic acid and alkenylsiloxane, platinum black, platinum-supported silica, and platinum-supported activated carbon. The platinum catalyst may be used alone or in combination of two or more types.
또한, 상기 촉매의 구체예로서는, 신에츠가가쿠(주)제의 CAT PL-50T, 도레이·다우코닝(주)제의 SRX212, SRX212P, NC-25, FS XK-3077 등을 들 수 있다.Specific examples of the catalyst include CAT PL-50T manufactured by Shin-Etsu Chemical Co., Ltd., SRX212, SRX212P, NC-25, and FS XK-3077 manufactured by Toray Dow Corning Co., Ltd.
A층 및 B층에 배합할 수 있는 그 밖의 첨가제로서는, 에스테르기의 탄소수가 1~20의 (메타)아크릴산 알킬에스테르, 아크릴 수지, 올레핀 수지 등을 예시할 수 있다. 그 중에서도 불소화된 치환기를 가지는 실란커플링제가 바람직하다.Other additives that can be mixed in the A layer and the B layer include (meth)acrylic acid alkyl esters having 1 to 20 carbon atoms in the ester group, acrylic resins, and olefin resins. Among them, a silane coupling agent having a fluorinated substituent is preferable.
5. 본 발명의 적층 필름의 물성5. Physical properties of the laminated film of the present invention
<상태(常態) 박리력><State peeling force>
본 발명의 적층 필름의 상태 박리력은, 100mN/cm 이하인 것이 바람직하다.It is preferable that the normal peeling force of the laminated film of the present invention is 100 mN/cm or less.
적층 필름을 이형 필름으로서 이용할 때, 상태 박리력이 낮을수록, 점착제층과의 박리에 필요한 힘이 적어도 된다. 이 때문에, 점착제층이 적층된 적층체로부터 이형 필름을 박리하고, 점착제층을 각종 부재에 첩착(貼着)하는 생산 공정에 있어서의 박리의 실패, 점착제층의 변형 등의 문제를 억제할 수 있다. 그 중에서도, 본 발명의 적층 필름은, 실리콘 점착제 등의 강점착성을 가지는 점착층이어도, 상기 문제는 억제되어, 낮은 박리성을 가질 수 있다. 또한, 이형 필름으로서, 점착제층의 양면에 이형 필름을 구비하는 적층체에 있어서, 의도하지 않는 측의 이형 필름이 벗겨져버리는 현상을 방지하는 것이 가능하다.When using a laminated film as a release film, the lower the normal peeling force, the less force required to peel off the adhesive layer. For this reason, problems such as peeling failure and deformation of the adhesive layer in the production process of peeling the release film from the laminate on which the adhesive layer is laminated and attaching the adhesive layer to various members can be suppressed. . Among them, even if the laminated film of the present invention is an adhesive layer having strong adhesive properties such as a silicone adhesive, the above problems are suppressed and the laminated film can have low peelability. In addition, as a release film, in a laminate provided with a release film on both sides of an adhesive layer, it is possible to prevent the phenomenon of the release film being peeled off on an unintended side.
이러한 관점에서, 상태 박리력은 70mN/cm 이하인 것이 바람직하고, 그 중에서도 40mN/cm 이하인 것이 더 바람직하며, 35mN/cm 이하인 것이 특히 바람직하고, 30mN/cm이하인 것이 가장 바람직하다. 한편, 하한은 특별히 한정되지 않지만, 적층 필름과 점착제층을 적층시킨 적층체의 보존 안정성의 관점에서, 1mN/cm 이상이 바람직하고, 3mN/cm 이상이 보다 바람직하다.From this point of view, the normal peeling force is preferably 70 mN/cm or less, more preferably 40 mN/cm or less, particularly preferably 35 mN/cm or less, and most preferably 30 mN/cm or less. On the other hand, the lower limit is not particularly limited, but from the viewpoint of storage stability of the laminate in which the laminated film and the adhesive layer are laminated, 1 mN/cm or more is preferable, and 3 mN/cm or more is more preferable.
상태 박리력을 낮게 하는 방법으로서, A층이나 B층의 불소 원자 함유 비율을 조정하는 등의 방법을 들 수 있다. 또한, 상태 박리력은, 후술하는 실시예에 기재된 방법으로 측정하는 것으로 한다.Methods for lowering the normal peeling force include adjusting the fluorine atom content ratio of the A layer or B layer. In addition, the normal peeling force is measured by the method described in the Examples described later.
6. 적층 구성6. Laminated construction
본 발명의 적층 필름은, 고분자 필름의 편면측 또는 양면측에, A층을 구비하고, 당해 A층의 위에 B층을 구비한 구성을 가지고 있으면 된다. 또한 필요에 따라, 고분자 필름과 A층과의 사이, A층과 B층과의 사이에, 다른 층이 개재되어 있어도 된다.The laminated film of the present invention may have a structure in which a layer A is provided on one side or both sides of the polymer film, and a layer B is provided on the layer A. Additionally, if necessary, another layer may be interposed between the polymer film and the A layer or between the A layer and the B layer.
다른 층으로서는, 대전 방지성을 구비한 대전 방지층, 필름 표면으로의 배합물이나 올리고머의 삼출(블리드, 플레이트 아웃)을 봉지하는 올리고머 봉지층 등을 들 수 있다.Other layers include an antistatic layer with antistatic properties and an oligomer sealing layer that seals exudation (bleed, plate out) of the compound or oligomer onto the film surface.
또한, 상기의 대전 방지층, 올리고머 봉지층 등의 층은, 고분자 필름을 제막함과 동시에 형성하는 인라인 코팅법이나, 제막이 끝난 고분자 필름에 별도 공정으로 형성하는 오프라인 코팅법 중 어느 것을 채용하여 형성할 수도 있다.In addition, the layers such as the antistatic layer and the oligomer encapsulation layer can be formed by either an in-line coating method that is formed at the same time as the polymer film is formed, or an offline coating method that is formed in a separate process on the polymer film that has been formed. It may be possible.
본 발명에 있어서의 적층 필름 전체의 두께는, 5㎛ 이상 1250㎛ 이하가 바람직하고, 10㎛ 이상 500㎛ 이하가 보다 바람직하며, 10~200㎛ 이하가 더 바람직하다.The thickness of the entire laminated film in the present invention is preferably 5 μm or more and 1250 μm or less, more preferably 10 μm or more and 500 μm or less, and still more preferably 10 to 200 μm or less.
7. 본 발명의 적층 필름의 제조 방법7. Method for producing the laminated film of the present invention
<제조 방법><Manufacturing method>
(1) 고분자 필름(1) Polymer film
본 발명의 적층 필름의 기재가 되는 고분자 필름으로서는, 상기한 바와 같이 폴리에틸렌, 폴리프로필렌, 폴리에스테르, 폴리스티렌, 폴리카보네이트, 그 밖의 고분자 재료를 막 형상으로 형성한 필름이 이용된다.As the polymer film that serves as the base of the laminated film of the present invention, a film formed of polyethylene, polypropylene, polyester, polystyrene, polycarbonate, and other polymer materials into a film shape is used, as described above.
이하, 폴리에스테르 필름의 제조 방법을 예로 이용하여 설명한다.Hereinafter, a method for producing a polyester film will be described using an example.
본 발명에 이용하는 폴리에스테르 필름을 제조하기 위한 방법으로서는, 전술의 폴리에틸렌테레프탈레이트 등의 폴리에스테르 원료를 사용하고, 다이로부터 압출된 용융 시트를 냉각 롤로 냉각 고화하여 미연신 시트를 얻는 방법이 바람직하다. 이 때, 시트의 평면성을 향상시키 위해 정전 인가 밀착법 및/또는 액체 도포 밀착법에 의해, 시트와 회전 냉각 드럼과의 밀착성을 높이는 것이 바람직하다.As a method for producing the polyester film used in the present invention, a method of using polyester raw materials such as the above-mentioned polyethylene terephthalate and cooling and solidifying the molten sheet extruded from the die with a cooling roll to obtain an unstretched sheet is preferable. At this time, in order to improve the flatness of the sheet, it is desirable to increase the adhesion between the sheet and the rotary cooling drum by electrostatic application adhesion method and/or liquid application adhesion method.
얻어진 미연신 시트는 그대로 이용할 수도 있지만, 적어도 1축의 연신을 하는 것이 바람직하고, 2축 연신하는 것이 보다 바람직하다. 폴리에스테르 필름이 1축 이상 연신됨으로써, 양호한 기계적 강도, 치수 안정성이 얻어진다. 또한 이형 필름으로서 사용하는 경우, 피착체(점착층)를 적층하여 적층 필름을 가지는 점착 시트를 제조할 때, 첩합 시에 있어서의 문제의 발생을 억제할 수 있다.Although the obtained unstretched sheet can be used as is, it is preferable to stretch it at least uniaxially, and more preferably, stretch it biaxially. When the polyester film is stretched uniaxially or more, good mechanical strength and dimensional stability are obtained. Additionally, when used as a release film, when laminating adherends (adhesion layers) to produce an adhesive sheet having a laminated film, the occurrence of problems during bonding can be suppressed.
연신 조건도 특별히 한정되지 않고, 예를 들면, 롤 연신법에 의해 미연신 시트를 길이 방향(종방향)으로 70~145℃에서 2~6배로 연신하여, 1축 연신 폴리에스테르 필름을 얻고, 이어서, 텐터로 이전의 연신 방향과는 직각 방향(폭 방향)으로 80~160℃에서 2~6배로 연신하고, 또한, 150~250℃에서 1~600초간 열처리를 행함으로써 2축 연신 필름이 얻어진다.Stretching conditions are also not particularly limited. For example, an unstretched sheet is stretched 2 to 6 times in the longitudinal direction (machine direction) at 70 to 145°C by a roll stretching method to obtain a uniaxially stretched polyester film, and then A biaxially stretched film is obtained by stretching 2 to 6 times at 80 to 160°C in a direction perpendicular to the previous stretching direction (width direction) using a tenter, and then heat treating the film at 150 to 250°C for 1 to 600 seconds. .
이 때, 열처리 존 및/또는 열 처리 출구의 쿨링 존에 있어서, 종방향 및/또는 폭 방향으로 0.1~20% 이완하는 방법이 보다 바람직하다.At this time, in the heat treatment zone and/or the cooling zone at the heat treatment outlet, a method of relaxing 0.1 to 20% in the longitudinal direction and/or the width direction is more preferable.
(2) A층(언더코팅층) 및 B층(이형층)의 형성(2) Formation of A layer (undercoating layer) and B layer (release layer)
상기 A층 및 B층의 형성 방법은 한정되는 것은 아니고, 공압출법 등에 의해 형성해도 되지만, 도포에 의한 방법이 바람직하다.The method of forming the A layer and the B layer is not limited, and may be formed by a coextrusion method or the like, but a coating method is preferable.
상기 A층 및 B층의 도포 횟수는 1회여도 되고, 2회 이상이어도 된다. 도포 횟수를 2회 이상으로 하여 A층 및 B층을 형성하는 경우에는, 상이한 도포액을 도포해도 된다. 다만, 적어도 어느 도포액 중에 불소 원자가 포함되어 있는 것이 필요하다.The number of applications of the A layer and the B layer may be one or two or more times. When forming the A layer and the B layer by applying two or more times, different coating liquids may be applied. However, it is necessary that at least any coating liquid contains a fluorine atom.
도포 방법으로서는, 인라인 코팅이어도, 오프라인 코팅이어도 되고, 예를 들면 「코팅 방식」(하라자키 유지 저, 마키서점, 1979년 발행)에 나타나 있는 바와 같은 도포 기술을 이용할 수 있다.The application method may be in-line coating or offline coating, and for example, an application technique as shown in “Coating Method” (written by Yuji Harazaki, Maki Shoten, published in 1979) can be used.
예를 들면 코팅 헤드로서, 에어덕트 코터, 블레이드 코터, 로드 코터, 나이프 코터, 스퀴즈 코터, 함침 코터, 리버스 롤 코터, 트랜스퍼 롤 코터, 그라비아 코터, 키스 롤 코터, 캐스트 코터, 스프레이 코터, 커튼 코터, 캘린더 코터, 압출 코터 등이 예시된다.For example, coating heads include air duct coaters, blade coaters, rod coaters, knife coaters, squeeze coaters, impregnation coaters, reverse roll coaters, transfer roll coaters, gravure coaters, kiss roll coaters, cast coaters, spray coaters, curtain coaters, Examples include a calendar coater and an extrusion coater.
A층 및 B층을 형성하는 도포액의 고형분 질량 농도는, 0.01질량% 이상이 바람직하고, 0.05질량% 이상이 보다 바람직하며, 0.1질량% 이상이 더 바람직하다. 한편 상한으로서는, 90질량% 이하가 바람직하고, 50질량% 이하가 보다 바람직하며, 20질량% 이하가 특히 바람직하다.The solid mass concentration of the coating liquid forming the A layer and the B layer is preferably 0.01 mass% or more, more preferably 0.05 mass% or more, and still more preferably 0.1 mass% or more. On the other hand, as an upper limit, 90 mass% or less is preferable, 50 mass% or less is more preferable, and 20 mass% or less is especially preferable.
희석을 위한 용제로서는, 극성 용매여도 되고, 비극성 용매여도 된다. 또한, 불소 원자를 가지는 불소 용매를 이용해도 된다. 또한, 상기 용제를 2종류 이상 혼합하여 이용해도 된다. 특히, B층을 형성하는 도포액에는, A층에 대한 젖음성을 높일 목적으로 불소 원자를 가지는 불소 용매를 포함하는 것이 바람직하다.The solvent for dilution may be a polar solvent or a non-polar solvent. Additionally, a fluorine solvent having a fluorine atom may be used. Additionally, two or more types of the above solvents may be mixed and used. In particular, it is preferable that the coating liquid forming the B layer contains a fluorine solvent having a fluorine atom for the purpose of increasing wettability to the A layer.
극성 용매로서는, 에탄올, (이소)프로필알코올 등의 알코올류, 아세트산 메틸, 아세트산 에틸, 아세트산 (이소)프로필, 아세트산 (이소)부틸, 아세트산 (이소)펜틸, 젖산 에틸, 벤조산 에틸 등의 에스테르류, 메틸에틸케톤, 메틸이소부틸케톤, 시클로펜타논, 시클로헥사논, 디아세톤알코올, 디이소부틸케톤 등의 케톤류, 에틸렌글리콜, 에틸렌글리콜 모노에틸에테르, 에틸렌글리콜 모노부틸에테르, 프로필렌글리콜 모노메틸에테르아세테이트, 프로필렌글리콜 모노메틸에테르 등의 글리콜류, N-메틸-2-피롤리돈, N,N-디메틸포름아미드, 테트라히드로푸란, 아세토니트릴 등을 들 수 있다.Polar solvents include alcohols such as ethanol and (iso)propyl alcohol; esters such as methyl acetate, ethyl acetate, (iso)propyl acetate, (iso)butyl acetate, (iso)pentyl acetate, ethyl lactate, and ethyl benzoate; Ketones such as methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone, diacetone alcohol, diisobutyl ketone, ethylene glycol, ethylene glycol monoethyl ether, ethylene glycol monobutyl ether, propylene glycol monomethyl ether acetate , glycols such as propylene glycol monomethyl ether, N-methyl-2-pyrrolidone, N,N-dimethylformamide, tetrahydrofuran, and acetonitrile.
비극성 용매로서는, 벤젠, 톨루엔, 크실렌 등의 방향족 탄화 수소류, 헥산, 헵탄, 옥탄 등의 지방족 탄화 수소류, 이소헥산, 이소옥탄, 이소노난 등의 분기 구조를 가지는 탄화 수소류, 시클로헥산, 시클로헵탄, 시클로옥탄 등의 지환식 탄화수소류, 디옥산 등을 들 수 있다. 불소 용매로서는, 하이드로플루오로에테르류, 메타자일렌헥사플루오라이드, 트리데카플루오로옥탄 등을 들 수 있다.Nonpolar solvents include aromatic hydrocarbons such as benzene, toluene, and xylene, aliphatic hydrocarbons such as hexane, heptane, and octane, hydrocarbons with branched structures such as isohexane, isooctane, and isononane, cyclohexane, and cycloheptane. , alicyclic hydrocarbons such as cyclooctane, and dioxane. Examples of fluorine solvents include hydrofluoroethers, metaxylenehexafluoride, and tridecafluorooctane.
이러한 층을 형성하기 위한 방법으로서는, 도포액으로서, 도포·건조 후에 각각의 층에 상당하는 불소 원자 함유 비율이 되는 도포액을 미리 준비해 두고, 이것을 이용하는 방법을 예시할 수 있다.An example of a method for forming such a layer is to prepare in advance a coating liquid that has a fluorine atom content ratio corresponding to each layer after application and drying, and then use this.
또한, 경화성 비불소화 실리콘 수지를 이용하고, 이것과 불소화된 재료를 소정량 혼합하여 A층/B층에 상당하는 조성의 도포액을 조제한 다음에, 도포·건조시킴으로써, 원하는 불소 원자를 포함하는 A층 및/또는 B층을 형성할 수 있다. 이 방법은, 보다 간편하게 소정의 불소 원자 함유 비율의 A층/B층을 가지는 이형 필름을 제조할 수 있으므로 바람직하다.In addition, a curable non-fluorinated silicone resin is used, and a predetermined amount of fluorinated material is mixed with the curable liquid to prepare a coating liquid with a composition corresponding to the A layer/B layer, and then applied and dried to form A containing the desired fluorine atom. layer and/or B layer. This method is preferable because it can more simply produce a release film having an A layer/B layer with a predetermined fluorine atom content ratio.
또한, 이들 A층 및 B층은, A층을 도포·건조한 후에 B층을 도포·건조시킴으로써 형성할 수 있지만, 본 발명에 있어서는, A층의 도포에 이어 B층을 도포하고, 그 후 건조를 행한다고 하는 웨트·코팅법에 의해 형성하는 것이 가능하고, 이에 따라 생산 공정의 단축이나 에너지 효율의 향상도 기대할 수 있다.In addition, these A layers and B layers can be formed by applying and drying the A layer and then applying and drying the B layer. However, in the present invention, the B layer is applied following the application of the A layer, and then dried. It is possible to form it by the wet coating method, which can be expected to shorten the production process and improve energy efficiency.
다른 방법으로서, A층을 경화성의 불소화 실리콘 수지 및 경화성의 비불소화 실리콘 수지의 혼합물을 도포하여 형성하고, 이어서 B층으로서 경화성의 불소화 실리콘 수지를 주성분으로 하는 용액을 도포하여 형성하는 방법이 있으며, 이 방법은 이형 필름을 안정적으로 제조할 수 있으므로 보다 바람직하다.As another method, the A layer is formed by applying a mixture of a curable fluorinated silicone resin and a curable non-fluorinated silicone resin, and then the B layer is formed by applying a solution containing a curable fluorinated silicone resin as a main component, This method is more preferable because it can stably produce a release film.
또 다른 방법으로서, 미리 비불소화 수지를 코팅에 의해 형성하고, 그 후 4불화 탄소(CF4) 플라즈마 처리 등의 드라이 프로세스에 의해 불소화된 층을 만들 수도 있다. 다만, 이 방법은 플라즈마 처리용의 챔버를 마련할 필요가 있으므로, 대규모 생산에 적합하다고 할 수 있다.As another method, a non-fluorinated resin may be formed in advance by coating, and then a fluorinated layer may be created through a dry process such as carbon tetrafluoride (CF 4 ) plasma treatment. However, this method requires the provision of a chamber for plasma processing, so it can be said to be suitable for large-scale production.
본 발명의 적층 필름의 제조 방법으로서, 고분자 필름을 제조하는 공정 내에서 코팅하는, 이른바 인라인 코팅을 이용하는 경우, A층 및 B층의 쌍방을 인라인 코팅으로 해도 되고, A층만을 인라인 코팅으로 하고, B층을 오프라인 코팅으로 해도 된다.As a method for producing a laminated film of the present invention, when using so-called in-line coating, which is coating within the process of manufacturing a polymer film, both the A layer and the B layer may be in-line coated, or only the A layer may be in-line coated, Layer B may be coated offline.
상기 A층 및 B층을 모두 오프라인 코팅에 의해 마련하는 경우에는, 1회의 「기재 필름 권출-권취 공정」에서 연속적으로 형성해도, 또한 복수회의 「기재 필름 권출-권취 공정」을 거쳐 순차 형성해도 되지만, 전자 쪽은 제조 공정이 심플해져, 보다 저비용으로 제조할 수 있는 점에서, 특히 바람직한 방법이다.When preparing both the A layer and the B layer by offline coating, they may be formed continuously in one “base film unwinding-winding process” or may be formed sequentially through multiple “base film unwinding-winding processes.” , the former is a particularly preferable method because the manufacturing process is simple and can be manufactured at a lower cost.
또한, 상기 A층 형성 시에 필름에 가해지는 열량을 상기 B층 형성 시에 가해지는 열량보다 낮게 함으로써, B층 형성 시의 필름 평면성 악화를 억제할 수 있고, 아울러 B층의 도포 불균일 발생도 효과적으로 방지할 수 있으므로 바람직하다.In addition, by lowering the amount of heat applied to the film when forming the A layer than the amount of heat applied when forming the B layer, deterioration of the film planarity during the formation of the B layer can be suppressed, and the occurrence of uneven application of the B layer can also be effectively prevented. This is desirable because it can be prevented.
8. 적층 필름의 이용 방법8. How to use laminated film
본 발명의 적층 필름은 우수한 이형성을 가지기 때문에, 예를 들면, 상기 적층 필름과 점착층이 적층되어 이루어지는 구성을 구비한 적층 필름을 가지는 점착 시트로서 제공할 수 있다. 특히 본 발명의 적층 필름은, 강한 점착성을 가지는 실리콘 점착제에 대해서도 우수한 이형성을 가지기 때문에, 예를 들면, 상기 적층 필름과, 실리콘 점착제로 이루어지는 점착층이 적층되어 이루어지는 구성을 구비한 적층 필름을 가지는 점착 시트로서 제공할 수 있다.Since the laminated film of the present invention has excellent release properties, it can be provided, for example, as an adhesive sheet having a laminated film having a structure in which the laminated film and the adhesive layer are laminated. In particular, since the laminated film of the present invention has excellent release properties even for silicone adhesives having strong adhesiveness, for example, an adhesive having a laminated film having a structure in which the above-described laminated film and an adhesive layer made of a silicone adhesive are laminated. It can be provided as a sheet.
다만, 적층 필름의 이용 방법을 이러한 이용 방법에 한정하는 것은 아니다. 예를 들면, 적층 필름에 불소 원자가 포함되어 있기 때문에, 내수성, 발수성, 내유성, 발유성, 방담성, 방오성, 내약품성, 내부식성 등이 우수한 점에서, 프린트 기판, 광학 부재 보호 필름, 건재용 필름, 농업용 필름, 고발수 필름, 포장용 필름, 화장 필름, 표면 보호 필름 등을 들 수 있다. B층 표면을 최표면으로서 사용하는 용도의 경우에는, 고분자 필름에 대하여 A층 및 B층을 가지는 면과는 반대의 면에, 점착층, 접착층, 히트 시일층 등을 형성해도 된다.However, the method of using the laminated film is not limited to these methods. For example, since the laminated film contains fluorine atoms, it is excellent in water resistance, water repellency, oil resistance, oil repellency, anti-fog property, anti-fouling property, chemical resistance, corrosion resistance, etc., so it is used for printed boards, optical member protective films, and building materials films. , agricultural films, high water-repellent films, packaging films, cosmetic films, surface protection films, etc. In the case of applications in which the B layer surface is used as the outermost surface, an adhesive layer, an adhesive layer, a heat seal layer, etc. may be formed on the side of the polymer film opposite to the side having the A layer and the B layer.
<실리콘 점착제><Silicone adhesive>
실리콘 점착제로서는, 예를 들면, 부가 반응형, 과산화물 경화형 또는 축합 반응형의 실리콘 점착제 등을 들 수 있다. 그 중에서도, 저온 단시간으로 경화 가능하다고 하는 관점에서, 부가 반응형 실리콘 점착제가 바람직하게 이용된다. 또한, 이러한 부가 반응형 실리콘 점착제는 지지체 상에 점착제층의 형성 시에 경화하는 것이다.Examples of the silicone adhesive include addition reaction type, peroxide curing type, or condensation reaction type silicone adhesive. Among them, an addition reaction type silicone adhesive is preferably used from the viewpoint of being able to be cured at a low temperature and in a short time. In addition, this addition reaction type silicone adhesive is cured upon forming the adhesive layer on the support.
상기 실리콘 점착제로서, 부가 반응형 실리콘 점착제를 이용하는 경우, 상기 실리콘 점착제는 백금 촉매 등의 촉매를 포함하고 있어도 된다.When an addition reaction type silicone adhesive is used as the silicone adhesive, the silicone adhesive may contain a catalyst such as a platinum catalyst.
예를 들면, 상기 부가 반응형 실리콘 점착제는, 필요에 따라, 톨루엔 등의 용제로 희석한 실리콘 수지 용액을, 백금 촉매 등의 촉매를 첨가하여 균일해지도록 교반한 후, 지지체 상에 도포하여, 100~130℃/1~5분으로 경화시킬 수 있다.For example, the addition reaction type silicone adhesive is, if necessary, a silicone resin solution diluted with a solvent such as toluene, added with a catalyst such as a platinum catalyst, stirred to become uniform, and then applied on a support to obtain a solution of 100%. It can be cured at ~130℃/1~5 minutes.
또한, 필요에 따라, 상기 부가 반응형 실리콘 점착제에 가교제, 점착력을 제어하기 위한 첨가제를 더하거나, 상기 점착제층의 형성 전에 상기 지지체에 프라이머 처리를 실시하거나 해도 된다.Additionally, if necessary, a crosslinking agent and an additive for controlling adhesive strength may be added to the addition reaction type silicone adhesive, or the support may be subjected to primer treatment before forming the adhesive layer.
상기 부가 반응형 실리콘 점착제에 이용하는 실리콘 수지의 시판품으로서는, SD4580PSA, SD4584PSA, SD4585PSA, SD4587LPSA, SD4560PSA, SD4570PSA, SD4600FCPSA, SD4593PSA, DC7651ADHESIVE, DC7652ADHESIVE, LTC-755, LTC-310(모두 도레이·다우코닝사제), KR-3700, KR-3701, X-40-3237-1, X-40-3240, X-40-3291-1, X-40-3229, X-40-3323, X-40-3306, X-40-3270-1(모두 신에츠가가쿠사제), AS-PSA001, AS-PSA002, AS-PSA003, AS-PSA004, AS-PSA005, AS-PSA012, AS-PSA014, PSA-7465(모두 아라카와화학공업사제), TSR1512, TSR1516, TSR1521(모두 모멘티브·퍼포먼스·머티리얼스사제) 등을 들 수 있다.Commercially available silicone resins used in the addition reaction type silicone adhesive include SD4580PSA, SD4584PSA, SD4585PSA, SD4587LPSA, SD4560PSA, SD4570PSA, SD4600FCPSA, SD4593PSA, DC7651ADHESIVE, DC7652ADHESIVE, LTC-755, and LTC-310 (all Toray ·Made by Dow Corning), KR-3700, KR-3701, X-40-3237-1, X-40-3240, X-40-3291-1, X-40-3229, 40-3270-1 (all manufactured by Shin-Etsu Chemical Co., Ltd.), AS-PSA001, AS-PSA002, AS-PSA003, AS-PSA004, AS-PSA005, AS-PSA012, AS-PSA014, PSA-7465 (all manufactured by Arakawa Chemical Industry Co., Ltd. ), TSR1512, TSR1516, TSR1521 (all manufactured by Momentive Performance Materials), etc.
실시예Example
이하, 실시예를 이용하여 본 발명을 보다 구체적으로 설명하지만, 본 발명은 이하의 실시예에 의해 한정되는 것은 아니다. 또한, 이하의 실시예에 있어서 「부가형」이라고 기재한 원료는, 모두 「경화성」을 의미하는 것이다.Hereinafter, the present invention will be described in more detail using examples, but the present invention is not limited to the following examples. In addition, in the examples below, all raw materials described as “additional type” mean “curable.”
(1) 평가 방법(1) Evaluation method
(1-1) 상태 박리력(1-1) State peeling force
23℃의 환경하에 있어서, 적층 필름의 B층(이형층) 표면에 실리콘 점착제를 가지는 테이프(쓰리엠·재팬사제, No5413 테이프, 50㎜ 폭)를 첩합하여, 박리 시험기에 세팅했다. 박리 속도가 0.3m/min, 박리 각도가 180°의 조건으로 상태 박리력을 측정했다.In an environment of 23°C, a tape with a silicone adhesive (No5413 tape, 50 mm wide, manufactured by 3M Japan) was bonded to the surface of the B layer (release layer) of the laminated film, and set in a peel tester. The normal peeling force was measured under the conditions of a peeling speed of 0.3 m/min and a peeling angle of 180°.
(1-2) 불소 원자 함유 비율, 불소 원자 함유 비율의 비(1-2) Fluorine atom content ratio, fluorine atom content ratio
A층 및 B층 중의 불소 원자 함유비를 TOF-SIMS(알박·파이사제, TRIF V)를 이용하여 평가했다.The fluorine atom content ratio in the A layer and the B layer was evaluated using TOF-SIMS (TRIF V, manufactured by Ulbak-Pi Corporation).
1차 이온으로서 Au3 +를 이용하고, 가속 전압은 30kV로 했다.Au 3+ was used as the primary ion, and the acceleration voltage was 30 kV.
단위 체적당의 불소 원자 함유비를 평가하기 위해, Ar 가스에 의한 에칭(전압: 5kV, 전류: 2nA, 에칭 속도: 20㎚/min(PET 필름 환산))을 0min, 1min, 2min, 3min 행하고, 각각의 에칭 시간에 있어서 검출된 음이온(「F-」와 「CH3SiO2 -」)의 카운트 수의 비를 평균한 것을 단위 체적당의 불소 원자 함유비(「F-」/「CH3SiO2 -」)라고 했다.To evaluate the fluorine atom content per unit volume, etching with Ar gas (voltage: 5 kV, current: 2 nA, etching speed: 20 nm/min (PET film equivalent)) was performed for 0 min, 1 min, 2 min, and 3 min, respectively. The average of the ratio of the number of counts of anions (“F - ” and “CH 3 SiO 2 - ”) detected at the etching time is calculated as the fluorine atom content ratio per unit volume (“F - ”/“CH 3 SiO 2 - 」).
또한, 〔B층의 불소 원자 함유비〕/〔A층의 불소 원자 함유비〕의 값을, 불소 원자 함유 비율의 비라고 했다. 이 값은, XPS를 이용하여 A층, B층 각각의 불소 원자 함유 비율(원자수 분율)을 측정하고, 각 층의 값의 비를 산출한 결과와 마찬가지의 의미를 가진다.In addition, the value of [Fluorine atom content ratio of B layer]/[Fluorine atom content ratio of A layer] was taken as the ratio of fluorine atom content ratio. This value has the same meaning as the result of measuring the fluorine atom content ratio (atomic number fraction) of each of the A and B layers using XPS and calculating the ratio of the values for each layer.
[실시예 1][Example 1]
(도포액 1)(Coating solution 1)
이하의 조성을 혼합하고, 이소프로필에테르와 아세트산 에틸의 혼합 용매(질량비=1:1)를 이용하여, 고형분 농도가 4질량%가 되도록 희석하여 「도포액 1」을 조제했다.The following composition was mixed and diluted using a mixed solvent of isopropyl ether and ethyl acetate (mass ratio = 1:1) so that the solid content concentration was 4% by mass, to prepare “Coating Liquid 1.”
<도포액 1 조성><Composition of coating solution 1>
부가형 오르가노실리콘(신에츠가가쿠사제, KS-847): 67질량부Addition-type organosilicon (KS-847, manufactured by Shin-Etsu Chemical Co., Ltd.): 67 parts by mass
백금 촉매(신에츠가가쿠사제, CAT-PL-50T): 0.7질량부Platinum catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., CAT-PL-50T): 0.7 parts by mass
부가형 불소화 실리콘(도레이·다우코닝사제, Syl-off 3062): 100질량부Addition-type fluorinated silicon (Toray-Dow Corning, Syl-off 3062): 100 parts by mass
가교제(도레이·다우코닝사제, Syl-off 3062A): 0.5질량부Cross-linking agent (manufactured by Toray/Dow Corning, Syl-off 3062A): 0.5 parts by mass
백금 촉매(도레이·다우코닝사제, FSXK-3077): 0.5질량부Platinum catalyst (Toray/Dow Corning, FSXK-3077): 0.5 parts by mass
(도포액 2)(Coating liquid 2)
이하의 조성을 혼합하고, FS 시너(신에츠가가쿠사제)/아세트산 에틸=1:1(질량비)의 혼합 용매를 이용하여, 고형분 농도가 0.5질량%가 되도록 희석하여 「도포액 2」를 제작했다.The following compositions were mixed and diluted so that the solid content concentration was 0.5% by mass using a mixed solvent of FS thinner (manufactured by Shin-Etsu Chemical Co., Ltd.)/ethyl acetate = 1:1 (mass ratio) to prepare “Coating Liquid 2.”
<도포액 2 조성><Composition of coating solution 2>
부가형 불소화 실리콘(신에츠가가쿠사제, X-70-201S): 100질량부Addition type fluorinated silicone (manufactured by Shin-Etsu Chemical, X-70-201S): 100 parts by mass
백금 촉매(신에츠가가쿠사제, CAT-PL-50T): 0.5질량부Platinum catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., CAT-PL-50T): 0.5 parts by mass
(적층 필름의 작성)(Creation of laminated film)
고분자 필름으로서 PET 필름(미츠비시케미컬사제 「T100-38」, 두께 38㎛)을 사용하여, 고분자 필름의 위에 상기 도포액 1을 바 코터(No4 바)에 의해 도포하고, 150℃의 오븐 중에서 30초간 건조하여 A층의 수지를 경화시켜, A층(언더코팅층)을 가지는 고분자 필름을 작성했다.Using a PET film (“T100-38” manufactured by Mitsubishi Chemical Corporation, thickness 38 μm) as a polymer film, the above-mentioned coating solution 1 was applied on the polymer film using a bar coater (No4 bar) and incubated in an oven at 150°C for 30 seconds. By drying, the resin of the A layer was cured, and a polymer film having an A layer (undercoat layer) was created.
상기 A층(언더코팅층)을 가지는 고분자 필름의 A층의 위에, 추가로 상기 도포액 2를 바 코터(No4 바)에 의해 도포하고, 150℃의 오븐에서 30초간 건조하여 B층의 수지를 경화시킴으로써, A층(언더코팅층)의 위에 B층(이형층)을 마련한 적층 필름을 제작했다.On top of the A layer of the polymer film having the A layer (undercoating layer), the above coating liquid 2 is further applied using a bar coater (No4 bar) and dried in an oven at 150° C. for 30 seconds to cure the resin of the B layer. By doing so, a laminated film was produced in which layer B (release layer) was provided on layer A (undercoat layer).
[실시예 2][Example 2]
상기 도포액 2의 고형분 농도를 4질량%로 한 것 이외는, 실시예 1과 마찬가지로 하여 적층 필름을 제작했다.A laminated film was produced in the same manner as in Example 1, except that the solid content concentration of the coating liquid 2 was 4% by mass.
또한, 실시예 1과 동일한 바 코터를 사용하여 도포액 2를 도포하고 있기 때문에, 고형분 농도를 높게 함으로써, 실시예 1에 비해 B층의 두께가 커진다.Additionally, since Coating Liquid 2 is applied using the same bar coater as Example 1, the thickness of layer B increases compared to Example 1 by increasing the solid content concentration.
[비교예 1][Comparative Example 1]
고분자 필름의 위에 A층(언더코팅층)을 형성하지 않고, 상기 도포액 2만을 바 코터(No4 바)에 의해 도포한 것 이외는 실시예 1과 마찬가지로 하여, 실질적으로 고분자 필름과 B층(이형층)만으로 이루어지는 적층 필름을 제작했다.In the same manner as in Example 1, except that the A layer (undercoating layer) was not formed on the polymer film and only the above coating solution 2 was applied using a bar coater (No4 bar), the polymer film and the B layer (release layer) were substantially formed. ) A laminated film consisting of only was produced.
[비교예 2][Comparative Example 2]
상기 도포액 2의 고형분 농도를 4질량%로 한 것 이외는, 비교예 1과 마찬가지로 하여 적층 필름을 제작했다.A laminated film was produced in the same manner as in Comparative Example 1, except that the solid content concentration of the coating liquid 2 was set to 4% by mass.
또한, 비교예 1과 동일한 바 코터를 사용하여 도포액 2를 도포하고 있기 때문에, 고형분 농도를 높게 함으로써, 비교예 1에 비해 B층의 두께가 커진다.In addition, since Coating Liquid 2 is applied using the same bar coater as Comparative Example 1, the thickness of layer B increases compared to Comparative Example 1 by increasing the solid content concentration.
[비교예 3][Comparative Example 3]
상기 A층(언더코팅층)의 위에, 상기 도포액 2를 도포하지 않고 B층(이형층)을 형성하지 않은 것 이외는 실시예 1과 마찬가지로 하여, 실질적으로 고분자 필름과 A층(언더코팅층)만으로 이루어지는 적층 필름을 제작했다.On top of the A layer (undercoat layer), the application liquid 2 was not applied and the B layer (release layer) was not formed in the same manner as in Example 1, and substantially only the polymer film and the A layer (undercoat layer) were used. A laminated film was produced.
[비교예 4][Comparative Example 4]
(도포액 3)(Coating solution 3)
이하의 조성으로 도포액 3을 조제했다.Coating liquid 3 was prepared with the following composition.
<도포액 3 조성><Composition of coating solution 3>
부가형 오르가노실리콘(신에츠가가쿠사제, KS-847H): 67질량부Addition-type organosilicon (manufactured by Shin-Etsu Chemical Co., Ltd., KS-847H): 67 parts by mass
백금 촉매(신에츠가가쿠사제, CAT-PL-50T): 0.7질량부Platinum catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., CAT-PL-50T): 0.7 parts by mass
상기 조성물을, n-헥산과 MEK의 혼합 용매(질량비=1:1)로, 고형분 농도가 4질량%가 되도록 희석했다.The composition was diluted with a mixed solvent of n-hexane and MEK (mass ratio = 1:1) so that the solid content concentration was 4% by mass.
(적층 필름의 작성)(Creation of laminated film)
고분자 필름의 위에, 상기 도포액 3을 바 코터(No4 바)에 의해 도포를 행하고, 150℃의 오븐에서 30초간 건조하여, A층(언더코팅층)을 마련했다.On top of the polymer film, the coating liquid 3 was applied using a bar coater (No4 bar) and dried in an oven at 150°C for 30 seconds to prepare A layer (undercoat layer).
이어서, 상기 A층(언더코팅층)의 위에, 상기 도포액 2를 바 코터(No4 바)에 의해 도포하려고 했다. 그러나, 상기 도포액 2가 상기 A층(언더코팅층)의 위에서 균일하게 도포되지 않고, 점 형상 혹은 선 형상(망목(網目) 형상)이 되는 현상(씨싱(cissing))이 발생하였기 때문에, B층(이형층)을 형성할 수 없었다.Next, the coating liquid 2 was attempted to be applied onto the A layer (undercoat layer) using a bar coater (No4 bar). However, since the coating liquid 2 was not uniformly applied on the A layer (undercoating layer) and a dot-shaped or linear (mesh-shaped) phenomenon (cissing) occurred, the B layer (release layer) could not be formed.
[비교예 5][Comparative Example 5]
B층(이형층)에 대하여, 상기 도포액 2의 고형분 농도를 4질량%로 한 것 이외는, 비교예 4와 마찬가지로 하여 적층 필름을 제작하려고 했다. 그러나, 「도포액 2」가 상기 A층(언더코팅층)의 위에서 균일하게 도포되지 않고, 점 형상 혹은 선 형상(망목 형상)이 되는 현상(씨싱)이 발생하였기 때문에, B층(이형층)을 형성할 수 없었다.For the B layer (release layer), a laminated film was attempted to be produced in the same manner as in Comparative Example 4, except that the solid content concentration of the coating liquid 2 was set to 4% by mass. However, since “Coating Liquid 2” was not uniformly applied on the A layer (undercoating layer) and a dot-shaped or linear (mesh-shaped) phenomenon (seeding) occurred, the B layer (release layer) was used. could not be formed.
[실시예 3][Example 3]
(도포액 4)(Coating solution 4)
이하의 조성을 혼합하여, 이소프로필에테르와 아세트산 에틸의 혼합 용매(질량비=1:1)를 이용하여, 고형분 농도가 4질량%가 되도록 희석하여 「도포액 4」를 조제했다.The following composition was mixed and diluted using a mixed solvent of isopropyl ether and ethyl acetate (mass ratio = 1:1) so that the solid content concentration was 4% by mass, to prepare “Coating Liquid 4.”
<도포액 4 조성><Composition of coating solution 4>
부가형 오르가노실리콘(신에츠가가쿠사제, KS-847): 133질량부Addition-type organosilicon (manufactured by Shin-Etsu Chemical, KS-847): 133 parts by mass
백금 촉매(신에츠가가쿠사제, CAT-PL-50T): 1.3질량부Platinum catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., CAT-PL-50T): 1.3 parts by mass
부가형 불소화 실리콘(도레이·다우코닝사제, Syl-off 3062): 100질량부Addition-type fluorinated silicon (Toray-Dow Corning, Syl-off 3062): 100 parts by mass
가교제(도레이·다우코닝사제, Syl-off 3062A): 0.5질량부Cross-linking agent (manufactured by Toray/Dow Corning, Syl-off 3062A): 0.5 parts by mass
백금 촉매(도레이·다우코닝사제, FSXK-3077): 0.5질량부Platinum catalyst (Toray/Dow Corning, FSXK-3077): 0.5 parts by mass
(적층 필름의 작성)(Creation of laminated film)
고분자 필름의 위에, 상기 도포액 1 대신에 상기 도포액 4를 도포하여 경화시킨 A층(언더코팅층)의 위에, 고형분 농도가 2질량%가 되도록 희석한 상기 도포액 2를 도포한 것 이외는, 실시예 1과 마찬가지로 하여, 적층 필름을 제작했다.On top of the polymer film, the above-mentioned coating solution 4 was applied instead of the above-mentioned coating solution 1, except that the above-mentioned coating solution 2 diluted to a solid content concentration of 2% by mass was applied on the cured A layer (undercoat layer). In the same manner as in Example 1, a laminated film was produced.
[실시예 4][Example 4]
(도포액 5)(Coating solution 5)
이하의 조성을 혼합하고, 이소프로필에테르와 아세트산 에틸의 혼합 용매(질량비=1:1)를 이용하여, 고형분 농도가 4질량%가 되도록 희석하여 「도포액 5」를 조제했다.The following composition was mixed and diluted using a mixed solvent of isopropyl ether and ethyl acetate (mass ratio = 1:1) so that the solid content concentration was 4% by mass, to prepare “Coating Liquid 5.”
< 도포액 5 조성><Composition of coating solution 5>
부가형 오르가노실리콘(신에츠가가쿠사제, KS-847): 200질량부Addition-type organosilicon (manufactured by Shin-Etsu Chemical, KS-847): 200 parts by mass
백금 촉매(신에츠가가쿠사제, CAT-PL-50T): 2.0질량부Platinum catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., CAT-PL-50T): 2.0 parts by mass
부가형 불소화 실리콘(도레이·다우코닝사제, Syl-off 3062): 100질량부Addition-type fluorinated silicon (Toray-Dow Corning, Syl-off 3062): 100 parts by mass
가교제(도레이·다우코닝사제, Syl-off 3062A): 0.5질량부Cross-linking agent (manufactured by Toray/Dow Corning, Syl-off 3062A): 0.5 parts by mass
백금 촉매(도레이·다우코닝사제, FSXK-3077): 0.5질량부Platinum catalyst (Toray/Dow Corning, FSXK-3077): 0.5 parts by mass
(적층 필름의 작성)(Creation of laminated film)
고분자 필름의 위에, 상기 도포액 4 대신에 상기 도포액 5를 도포하여 A층(언더코팅층)을 형성한 것 이외는, 실시예 3과 마찬가지로 하여, 적층 필름을 제작했다.A laminated film was produced in the same manner as in Example 3, except that the coating solution 5 was applied on the polymer film instead of the coating solution 4 to form an A layer (undercoat layer).
[실시예 5][Example 5]
(도포액 6)(Coating solution 6)
이하의 조성을 혼합하고, 이소프로필에테르와 아세트산 에틸의 혼합 용매(질량비=1:1)를 이용하여, 고형분 농도가 4질량%가 되도록 희석하여 「도포액 6」을 조제했다.The following composition was mixed and diluted using a mixed solvent of isopropyl ether and ethyl acetate (mass ratio = 1:1) so that the solid content concentration was 4% by mass, to prepare “Coating Liquid 6.”
<도포액 6 조성><Composition of coating solution 6>
부가형 오르가노실리콘(신에츠가가쿠사제, KS-847): 267질량부Addition-type organosilicon (manufactured by Shin-Etsu Chemical, KS-847): 267 parts by mass
백금 촉매(신에츠가가쿠사제, CAT-PL-50T): 2.0질량부Platinum catalyst (manufactured by Shin-Etsu Chemical Co., Ltd., CAT-PL-50T): 2.0 parts by mass
부가형 불소화 실리콘(도레이·다우코닝사제, Syl-off 3062): 100질량부Addition-type fluorinated silicon (Toray-Dow Corning, Syl-off 3062): 100 parts by mass
가교제(도레이·다우코닝사제, Syl-off 3062A): 0.5질량부Cross-linking agent (manufactured by Toray/Dow Corning, Syl-off 3062A): 0.5 parts by mass
백금 촉매(도레이·다우코닝사제, FSXK-3077): 0.5질량부Platinum catalyst (Toray/Dow Corning, FSXK-3077): 0.5 parts by mass
(적층 필름의 작성)(Creation of laminated film)
고분자 필름의 위에, 상기 도포액 4 대신에 상기 도포액 6을 도포하여 A층(언더코팅층)을 형성한 것 이외는, 실시예 3과 마찬가지로 하여, 적층 필름을 제작했다.A laminated film was produced in the same manner as in Example 3, except that the coating solution 6 was applied on the polymer film instead of the coating solution 4 to form an A layer (undercoat layer).
(3) 결과의 평가(3) Evaluation of results
얻어진 적층 필름에 대하여, A층(언더코팅층) 및 B층(이형층)의 불소 원자 함유 비율, 실리콘 점착 테이프를 이용한 상태 박리력을 측정했다. 결과를 하기 표 1에 나타낸다.For the obtained laminated film, the fluorine atom content ratio of the A layer (undercoat layer) and B layer (release layer) and the normal peeling force using a silicone adhesive tape were measured. The results are shown in Table 1 below.
실시예 1, 2에 있어서는, PET 필름 상에 본 발명에서 규정하는 A층(언더코팅층)과 B층(이형층)을 형성하였으므로, B층(이형층)만의 필름을 이용한 비교예 1, 2에 비해, 양호한 박리성이 얻어지는 것을 알 수 있었다.In Examples 1 and 2, the A layer (undercoating layer) and B layer (release layer) specified in the present invention were formed on the PET film, so in Comparative Examples 1 and 2 using a film of only the B layer (release layer) In comparison, it was found that good peelability was obtained.
특히, 실시예 1의 적층 필름은, B층(이형층)의 두께를 얇게 형성하고 있음(도포액 2의 농도가 「0.5질량%」)에도 불구하고, 당해 실시예 1보다 B층(이형층)이 두꺼운 실시예 2(도포액 2의 농도가 「4질량%」)의 이형 필름과 동레벨의 박리성이 얻어지고 있다. 이 점에서, 실리콘 점착제에 대하여 우수한 박리성을 가지는 이형 필름을, 보다 적은 양의 불소계 재료에 의해 제조하는 것이 가능한 것을 알 수 있었다.In particular, the laminated film of Example 1 had a thinner B layer (release layer) than Example 1, despite the fact that the thickness of the B layer (release layer) was thin (the concentration of coating liquid 2 was "0.5% by mass"). ), the same level of peelability as the thick release film of Example 2 (concentration of coating liquid 2 was "4% by mass") was obtained. From this point of view, it was found that it was possible to produce a release film with excellent peelability for silicone adhesives using a smaller amount of fluorine-based material.
또한, 당해 실시예 1보다 A층(언더코팅층)의 불소 원자 함유 비율이 작은 실시예 3~5의 이형 필름도, 당해 실시예 1의 이형 필름과 동레벨의 박리성이 얻어지고 있으며, 실리콘 점착제에 대하여 우수한 박리성을 가지는 이형 필름을, 보다 적은 양의 불소계 재료에 의해 제조하는 것이 가능한 것을 알 수 있었다.In addition, the release films of Examples 3 to 5, in which the fluorine atom content of the A layer (undercoat layer) is smaller than that of Example 1, also achieved the same level of peelability as the release film of Example 1, and the silicone adhesive It was found that it was possible to produce a release film with excellent peelability using a smaller amount of fluorine-based material.
또한, 각 층의 불소 원자 함유비를 평가하기 위해, 비교예 3(A층만) 및 비교예 2(B층만)의 샘플에 대해 TOF-SIMS에 의한 불소 원자 함유비를 측정하고, 각각 A층 및 B층의 값이라고 했다. 그 결과, A층과 비교해 B층 쪽이 단위 체적당의 불소 원자 함유 비율이 많은 것을 확인할 수 있었다.In addition, in order to evaluate the fluorine atom content ratio of each layer, the fluorine atom content ratio was measured by TOF-SIMS for the samples of Comparative Example 3 (A layer only) and Comparative Example 2 (B layer only), respectively, for A layer and It was said to be the value of the B floor. As a result, it was confirmed that the B layer had a higher fluorine atom content per unit volume compared to the A layer.
또한, 도포액의 조성이 동일하기 때문에, 이 값을 가지고 실시예 1, 2 및 비교예 1에 있어서의 각 층의 불소 원자 함유비의 값이라고 했다. 또한, 실시예 3~5에 있어서의 A층의 불소 원자 함유비는, 실시예 1에 있어서의 불소 원자 함유비의 값을 기초로, 원료 조성비로부터 계산하여 구했다.In addition, since the composition of the coating liquid was the same, this value was used as the value of the fluorine atom content ratio of each layer in Examples 1 and 2 and Comparative Example 1. In addition, the fluorine atom content ratio of the A layer in Examples 3 to 5 was calculated and obtained from the raw material composition ratio based on the value of the fluorine atom content ratio in Example 1.
또한, A층의 불소 원자 함유 비율은, 표면(TOF-SIMS에 있어서의 에칭 시간 0분)에 있어서 가장 많고, 에칭 시간이 길어질수록(즉 기재 PET 필름측이 될수록) 적어지고 있으며, 표면측의 불소 원자 함유 비율이 많아지는 경사 구조로 되어 있다고 생각된다. 표 1에 나타내는 값은, 두께 방향에서의 평균값이다.In addition, the fluorine atom content of the A layer is highest on the surface (etching time of 0 minutes in TOF-SIMS), and decreases as the etching time becomes longer (i.e., towards the base PET film side), and the fluorine atom content on the surface side decreases. It is thought that it has an inclined structure in which the fluorine atom content increases. The values shown in Table 1 are average values in the thickness direction.
1 고분자 필름
2 A층(언더코팅층)
3 B층(이형층)
4 실리콘 점착제층1 polymer film
2 A layer (undercoating layer)
3 B layer (different layer)
4 Silicone adhesive layer
Claims (12)
상기 A층 및 B층의 양층이 불소 원자를 함유하고, 또한 B층의 불소 원자 함유 비율이 A층의 불소 원자 함유 비율보다 많은 것을 특징으로 하는 적층 필름.A laminated film in which an A layer and a B layer are laminated in this order on at least one side of a polymer film,
A laminated film characterized in that both layers of the A layer and the B layer contain fluorine atoms, and the fluorine atom content of the B layer is greater than the fluorine atom content of the A layer.
상기 B층 중의 불소 원자의 함유 비율이, 상기 A층 중의 불소 원자의 함유 비율에 대하여 1.1배 이상인 적층 필름.According to claim 1,
A laminated film wherein the content of fluorine atoms in the B layer is 1.1 times or more than the content of fluorine atoms in the A layer.
상기 B층이 불소 원자를 함유하고, 하기의 방법으로 측정하였을 때의 상태 박리력이 100mN/cm 이하인 것을 특징으로 하는 적층 필름.
<상태 박리력의 측정>
적층 필름의 B층 표면에 실리콘 점착제를 가지는 테이프(쓰리엠·재팬사제, No5413 테이프, 50㎜ 폭)를 첩합하고, 박리 속도가 0.3m/min의 조건으로 180° 박리 시험을 행함A laminated film in which an A layer and a B layer are laminated in this order on at least one side of a polymer film,
A laminated film, wherein the B layer contains a fluorine atom and has a normal peeling force of 100 mN/cm or less as measured by the method below.
<Measurement of state peeling force>
A tape with a silicone adhesive (No5413 tape, 50 mm wide, manufactured by 3M Japan) was bonded to the surface of layer B of the laminated film, and a 180° peel test was performed under the condition of a peel speed of 0.3 m/min.
상기 고분자 필름이 2축 연신 폴리에스테르 필름인 적층 필름.According to claim 1 or 3,
A laminated film wherein the polymer film is a biaxially oriented polyester film.
상기 A층 및 B층에 불소화 실리콘 수지를 함유하는 적층 필름.According to claim 1 or 3,
A laminated film containing a fluorinated silicone resin in the A layer and the B layer.
상기 A층은, 비불소화 실리콘 수지 및 불소화 실리콘 수지를 함유하는 적층 필름.According to claim 1 or 3,
The layer A is a laminated film containing a non-fluorinated silicone resin and a fluorinated silicone resin.
상기 A층 및 B층이, 경화성 불소화 실리콘 수지를 경화시켜 형성된 층인 적층 필름.According to claim 1 or 3,
A laminated film wherein the A layer and the B layer are layers formed by curing a curable fluorinated silicone resin.
비행 시간 2차 이온 질량 분석계(TOF-SIMS)를 이용하여 측정하였을 때의 불소 이온(F-) 함유 비율과 메틸실록산 이온(CH3SiO2 -) 함유 비율과의 비([F-]/[CH3SiO2 -])가, A층에서는 1 이상 1,000 이하, B층에서는 3 이상 5,000 이하인 것을 특징으로 하는 적층 필름.According to claim 5,
The ratio of the fluorine ion (F - ) content and the methylsiloxane ion (CH 3 SiO 2 - ) content as measured using a time-of-flight secondary ion mass spectrometer (TOF-SIMS) ([F - ]/[ CH 3 SiO 2 - ]) is 1 to 1,000 in the A layer and 3 to 5,000 in the B layer.
A층의 불소 원자 함유 비율(원자수 분율)이 50ppm 이상, 900,000ppm 미만, 또한 B층의 불소 원자 함유 비율(원자수 분율)이 3,000ppm 이상, 900,000ppm 이하인 적층 필름.According to claim 1 or 3,
A laminated film in which the fluorine atom content ratio (atomic number fraction) of the A layer is 50 ppm or more and less than 900,000 ppm, and the fluorine atom content ratio (atomic number fraction) of the B layer is 3,000 ppm or more and 900,000 ppm or less.
상기 A층과 접하지 않는 측의 B층의 면에 점착제층이 마련되어 이루어지는 적층체.According to claim 11,
A laminate in which an adhesive layer is provided on the side of the B layer that is not in contact with the A layer.
Applications Claiming Priority (8)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2017-236634 | 2017-12-11 | ||
JP2017236634 | 2017-12-11 | ||
JPJP-P-2018-183215 | 2018-09-28 | ||
JP2018183215 | 2018-09-28 | ||
JP2018190010 | 2018-10-05 | ||
JPJP-P-2018-190010 | 2018-10-05 | ||
PCT/JP2018/045230 WO2019117059A1 (en) | 2017-12-11 | 2018-12-10 | Layered film, release film, and layered body |
KR1020207015538A KR102639595B1 (en) | 2017-12-11 | 2018-12-10 | Laminated films, release films and laminates |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207015538A Division KR102639595B1 (en) | 2017-12-11 | 2018-12-10 | Laminated films, release films and laminates |
Publications (1)
Publication Number | Publication Date |
---|---|
KR20240005214A true KR20240005214A (en) | 2024-01-11 |
Family
ID=66819211
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020237044895A KR20240005214A (en) | 2017-12-11 | 2018-12-10 | Layered film, release film, and layered body |
KR1020207015538A KR102639595B1 (en) | 2017-12-11 | 2018-12-10 | Laminated films, release films and laminates |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020207015538A KR102639595B1 (en) | 2017-12-11 | 2018-12-10 | Laminated films, release films and laminates |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7173045B2 (en) |
KR (2) | KR20240005214A (en) |
CN (2) | CN111465639B (en) |
TW (2) | TWI801466B (en) |
WO (1) | WO2019117059A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2020121687A1 (en) * | 2018-12-11 | 2020-06-18 | 三菱ケミカル株式会社 | Release film |
JPWO2021019845A1 (en) * | 2019-07-29 | 2021-02-04 | ||
KR102459382B1 (en) * | 2021-03-05 | 2022-10-26 | 도레이첨단소재 주식회사 | Release film |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011201035A (en) | 2010-03-24 | 2011-10-13 | Shin Etsu Polymer Co Ltd | Mold release film |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2584918B2 (en) * | 1991-09-24 | 1997-02-26 | リンテック株式会社 | Release sheet |
EP0850999A3 (en) * | 1996-12-30 | 1998-12-02 | Dow Corning Corporation | Silicone release coating compositions |
JP4205512B2 (en) * | 2003-07-03 | 2009-01-07 | 三菱樹脂株式会社 | Fluorine-based laminated film |
JP2005047132A (en) * | 2003-07-28 | 2005-02-24 | Mitsubishi Plastics Ind Ltd | Release laminated film and its manufacturing method |
US20050038183A1 (en) | 2003-08-14 | 2005-02-17 | Dongchan Ahn | Silicones having improved surface properties and curable silicone compositions for preparing the silicones |
WO2005115751A1 (en) * | 2004-05-27 | 2005-12-08 | Mitsubishi Plastics, Inc. | Mold releasing laminated film |
DE112009005372T5 (en) | 2009-11-16 | 2012-11-22 | 3M Innovative Properties Co. | Release agent materials based on a Fluorsilicongemisches |
CN105829465A (en) | 2013-12-16 | 2016-08-03 | 3M创新有限公司 | Blended release materials |
CN107530918B (en) * | 2015-04-27 | 2020-08-04 | 株式会社寺冈制作所 | Adhesive tape for mold release |
-
2018
- 2018-12-10 CN CN201880079992.8A patent/CN111465639B/en active Active
- 2018-12-10 JP JP2019559616A patent/JP7173045B2/en active Active
- 2018-12-10 CN CN202311249495.7A patent/CN117447743A/en active Pending
- 2018-12-10 WO PCT/JP2018/045230 patent/WO2019117059A1/en active Application Filing
- 2018-12-10 KR KR1020237044895A patent/KR20240005214A/en not_active Application Discontinuation
- 2018-12-10 KR KR1020207015538A patent/KR102639595B1/en active IP Right Grant
- 2018-12-11 TW TW107144495A patent/TWI801466B/en active
- 2018-12-11 TW TW112115993A patent/TW202333953A/en unknown
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2011201035A (en) | 2010-03-24 | 2011-10-13 | Shin Etsu Polymer Co Ltd | Mold release film |
Also Published As
Publication number | Publication date |
---|---|
KR20200090792A (en) | 2020-07-29 |
TWI801466B (en) | 2023-05-11 |
TW201936390A (en) | 2019-09-16 |
JPWO2019117059A1 (en) | 2021-01-07 |
WO2019117059A1 (en) | 2019-06-20 |
JP7173045B2 (en) | 2022-11-16 |
CN111465639B (en) | 2023-09-05 |
KR102639595B1 (en) | 2024-02-23 |
CN111465639A (en) | 2020-07-28 |
TW202333953A (en) | 2023-09-01 |
CN117447743A (en) | 2024-01-26 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
KR102639595B1 (en) | Laminated films, release films and laminates | |
TWI802931B (en) | Adhesive film and its manufacturing method | |
TWI845660B (en) | Release film, film stack, and method for manufacturing the same | |
KR102516507B1 (en) | Laminated film and method for producing same | |
TWI741051B (en) | Protection plate | |
JP2010285591A (en) | Antistatic polyester film containing acetylene diol-based surfactant and method for producing the film | |
WO2013047861A1 (en) | Mold-releasing film and method for producing same | |
JP6531349B2 (en) | Release film | |
JP2022114930A (en) | Release layer composition, release film and method for producing the same, and film laminate and method for using the same | |
KR20190077311A (en) | A laminated film, a member for an electronic device, and an electronic device | |
KR102473995B1 (en) | Double sided anti-static silicone release film | |
JP7206918B2 (en) | release film | |
JP7537210B2 (en) | Release Film | |
KR102581996B1 (en) | Release film and manufacturing method thereof | |
JPWO2018159602A1 (en) | Gas barrier adhesive film, and electronic member and optical member | |
KR102459382B1 (en) | Release film | |
KR102639732B1 (en) | Release film and method of preparing the same | |
TW201819196A (en) | Front sheet for solar cell and manufacturing method thereof, and solar cell module | |
JP2013052553A (en) | Mold release film | |
JP2017202652A (en) | Laminate | |
JP2023135935A (en) | release film | |
JP4900927B2 (en) | Protective film separator | |
JP5519161B2 (en) | In-mold transfer film | |
KR20240130617A (en) | Release film and method for producing release film | |
JP2014008720A (en) | Release film |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A107 | Divisional application of patent | ||
E902 | Notification of reason for refusal |