KR20230161968A - 광경화성 수지 조성물, 광학 부품, 광학 부품의 제조 방법, 및 발광 장치 - Google Patents

광경화성 수지 조성물, 광학 부품, 광학 부품의 제조 방법, 및 발광 장치 Download PDF

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KR20230161968A
KR20230161968A KR1020237031938A KR20237031938A KR20230161968A KR 20230161968 A KR20230161968 A KR 20230161968A KR 1020237031938 A KR1020237031938 A KR 1020237031938A KR 20237031938 A KR20237031938 A KR 20237031938A KR 20230161968 A KR20230161968 A KR 20230161968A
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South Korea
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compound
composition
mass
photocurable resin
resin composition
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KR1020237031938A
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English (en)
Korean (ko)
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다카히로 센슈
유스케 우라오카
히로키 이케가미
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파나소닉 아이피 매니지먼트 가부시키가이샤
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Publication of KR20230161968A publication Critical patent/KR20230161968A/ko
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F20/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride, ester, amide, imide or nitrile thereof
    • C08F20/02—Monocarboxylic acids having less than ten carbon atoms, Derivatives thereof
    • C08F20/10—Esters
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F12/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an aromatic carbocyclic ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F2/00—Processes of polymerisation
    • C08F2/46—Polymerisation initiated by wave energy or particle radiation
    • C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
    • C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H05B33/04—Sealing arrangements, e.g. against humidity
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C08K2003/2241—Titanium dioxide
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2244—Oxides; Hydroxides of metals of zirconium

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polymerisation Methods In General (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
KR1020237031938A 2021-03-26 2022-03-25 광경화성 수지 조성물, 광학 부품, 광학 부품의 제조 방법, 및 발광 장치 Pending KR20230161968A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021054318 2021-03-26
JPJP-P-2021-054318 2021-03-26
PCT/JP2022/014672 WO2022203081A1 (ja) 2021-03-26 2022-03-25 光硬化性樹脂組成物、光学部品、光学部品の製造方法、及び発光装置

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Publication Number Publication Date
KR20230161968A true KR20230161968A (ko) 2023-11-28

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KR1020237031938A Pending KR20230161968A (ko) 2021-03-26 2022-03-25 광경화성 수지 조성물, 광학 부품, 광학 부품의 제조 방법, 및 발광 장치

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JP (1) JPWO2022203081A1 (https=)
KR (1) KR20230161968A (https=)
CN (1) CN117016043A (https=)
WO (1) WO2022203081A1 (https=)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020026515A (ja) * 2018-08-10 2020-02-20 Jsr株式会社 硬化性組成物及び化合物
JP2024035657A (ja) * 2022-09-02 2024-03-14 住友化学株式会社 組成物、硬化物、表示装置、及び固体撮像素子
JP2024035658A (ja) * 2022-09-02 2024-03-14 住友化学株式会社 組成物、硬化物、表示装置、及び固体撮像素子
WO2025164088A1 (ja) * 2024-02-01 2025-08-07 三洋化成工業株式会社 活性エネルギー線硬化性組成物とその硬化物
JP2025174660A (ja) * 2024-05-17 2025-11-28 デクセリアルズ株式会社 高屈折率硬化性組成物、及び高屈折率硬化物
JP2025174649A (ja) * 2024-05-17 2025-11-28 デクセリアルズ株式会社 高屈折率硬化性組成物、及び高屈折率硬化物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020026515A (ja) 2018-08-10 2020-02-20 Jsr株式会社 硬化性組成物及び化合物

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Publication number Priority date Publication date Assignee Title
KR101878117B1 (ko) * 2016-04-01 2018-07-12 주식회사 다이셀 수지 조성물
JP7203028B2 (ja) * 2016-12-29 2023-01-12 スリーエム イノベイティブ プロパティズ カンパニー 硬化性高屈折率インク組成物及びインク組成物から調製された物品
KR102444454B1 (ko) * 2019-06-03 2022-09-16 삼성에스디아이 주식회사 유기발광소자 봉지용 조성물 및 이로부터 제조된 유기발광소자 표시장치

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2020026515A (ja) 2018-08-10 2020-02-20 Jsr株式会社 硬化性組成物及び化合物

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WO2022203081A1 (ja) 2022-09-29
CN117016043A (zh) 2023-11-07

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