KR20230118100A - 성형용 수지 조성물 및 전자 부품 장치 - Google Patents

성형용 수지 조성물 및 전자 부품 장치 Download PDF

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Publication number
KR20230118100A
KR20230118100A KR1020237019296A KR20237019296A KR20230118100A KR 20230118100 A KR20230118100 A KR 20230118100A KR 1020237019296 A KR1020237019296 A KR 1020237019296A KR 20237019296 A KR20237019296 A KR 20237019296A KR 20230118100 A KR20230118100 A KR 20230118100A
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KR
South Korea
Prior art keywords
resin composition
molding
inorganic filler
volume
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237019296A
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English (en)
Korean (ko)
Inventor
마사시 야마우라
미치토시 아라타
아유미 나카야마
유스케 곤도
유지 노구치
Original Assignee
가부시끼가이샤 레조낙
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 가부시끼가이샤 레조낙 filed Critical 가부시끼가이샤 레조낙
Publication of KR20230118100A publication Critical patent/KR20230118100A/ko
Pending legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
KR1020237019296A 2020-12-11 2021-12-10 성형용 수지 조성물 및 전자 부품 장치 Pending KR20230118100A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020206029 2020-12-11
JPJP-P-2020-206029 2020-12-11
PCT/JP2021/045637 WO2022124406A1 (ja) 2020-12-11 2021-12-10 成形用樹脂組成物及び電子部品装置

Publications (1)

Publication Number Publication Date
KR20230118100A true KR20230118100A (ko) 2023-08-10

Family

ID=81974588

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237019296A Pending KR20230118100A (ko) 2020-12-11 2021-12-10 성형용 수지 조성물 및 전자 부품 장치

Country Status (6)

Country Link
US (1) US20240026118A1 (https=)
JP (2) JP7609173B2 (https=)
KR (1) KR20230118100A (https=)
CN (1) CN116583548A (https=)
TW (1) TW202222888A (https=)
WO (1) WO2022124406A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202436504A (zh) * 2022-11-22 2024-09-16 日商力森諾科股份有限公司 成形用樹脂組成物及電子零件裝置
WO2025249327A1 (ja) * 2024-05-27 2025-12-04 株式会社レゾナック 液状硬化性組成物及び電子部品装置
KR102789700B1 (ko) 2024-11-19 2025-04-03 주식회사 티에스아이코리아 이차전지 검사 장치 및 검사 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015036410A (ja) 2013-08-15 2015-02-23 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
JP2017057268A (ja) 2015-09-16 2017-03-23 住友ベークライト株式会社 高誘電樹脂組成物および静電容量型センサ
JP2018141052A (ja) 2017-02-27 2018-09-13 京セラ株式会社 樹脂組成物および樹脂封止型半導体装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080028679A (ko) * 2006-09-27 2008-04-01 삼성전자주식회사 인쇄회로기판 및 이를 갖는 표시장치
JP2011021166A (ja) * 2009-07-21 2011-02-03 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2012216685A (ja) * 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 多層基板
KR101454111B1 (ko) * 2013-04-17 2014-10-22 삼성전기주식회사 열팽창율 및 유전손실율이 낮은 인쇄회로기판용 절연수지 조성물, 이를 이용한 프리프레그 및 인쇄회로기판
CN103351578B (zh) * 2013-07-19 2015-08-19 广东生益科技股份有限公司 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
CN104744892A (zh) * 2013-12-27 2015-07-01 台燿科技股份有限公司 树脂组合物及其应用
JP6679849B2 (ja) * 2015-07-01 2020-04-15 味の素株式会社 樹脂組成物
WO2020066856A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
CN113330643A (zh) * 2019-01-23 2021-08-31 株式会社村田制作所 天线模块以及通信装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015036410A (ja) 2013-08-15 2015-02-23 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
JP2017057268A (ja) 2015-09-16 2017-03-23 住友ベークライト株式会社 高誘電樹脂組成物および静電容量型センサ
JP2018141052A (ja) 2017-02-27 2018-09-13 京セラ株式会社 樹脂組成物および樹脂封止型半導体装置

Also Published As

Publication number Publication date
JPWO2022124406A1 (https=) 2022-06-16
JP7609173B2 (ja) 2025-01-07
JP2024144537A (ja) 2024-10-11
CN116583548A (zh) 2023-08-11
WO2022124406A1 (ja) 2022-06-16
TW202222888A (zh) 2022-06-16
US20240026118A1 (en) 2024-01-25

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