JPWO2022124406A1 - - Google Patents

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Publication number
JPWO2022124406A1
JPWO2022124406A1 JP2022568353A JP2022568353A JPWO2022124406A1 JP WO2022124406 A1 JPWO2022124406 A1 JP WO2022124406A1 JP 2022568353 A JP2022568353 A JP 2022568353A JP 2022568353 A JP2022568353 A JP 2022568353A JP WO2022124406 A1 JPWO2022124406 A1 JP WO2022124406A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Application number
JP2022568353A
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Japanese (ja)
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JP7609173B2 (ja
JPWO2022124406A5 (https=
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Publication of JPWO2022124406A1 publication Critical patent/JPWO2022124406A1/ja
Publication of JPWO2022124406A5 publication Critical patent/JPWO2022124406A5/ja
Priority to JP2024118015A priority Critical patent/JP2024144537A/ja
Application granted granted Critical
Publication of JP7609173B2 publication Critical patent/JP7609173B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C08K3/11—Compounds containing metals of Groups 4 to 10 or of Groups 14 to 16 of the Periodic Table
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/04—Oxygen-containing compounds
    • C08K5/10—Esters; Ether-esters
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/12—Supports; Mounting means
    • H01Q1/22—Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/2283—Supports; Mounting means by structural association with other equipment or articles mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/40—Radiating elements coated with or embedded in protective material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2206—Oxides; Hydroxides of metals of calcium, strontium or barium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2237—Oxides; Hydroxides of metals of titanium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Epoxy Resins (AREA)
JP2022568353A 2020-12-11 2021-12-10 成形用樹脂組成物及び電子部品装置 Active JP7609173B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2024118015A JP2024144537A (ja) 2020-12-11 2024-07-23 成形用樹脂組成物及び電子部品装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020206029 2020-12-11
JP2020206029 2020-12-11
PCT/JP2021/045637 WO2022124406A1 (ja) 2020-12-11 2021-12-10 成形用樹脂組成物及び電子部品装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2024118015A Division JP2024144537A (ja) 2020-12-11 2024-07-23 成形用樹脂組成物及び電子部品装置

Publications (3)

Publication Number Publication Date
JPWO2022124406A1 true JPWO2022124406A1 (https=) 2022-06-16
JPWO2022124406A5 JPWO2022124406A5 (https=) 2024-02-15
JP7609173B2 JP7609173B2 (ja) 2025-01-07

Family

ID=81974588

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022568353A Active JP7609173B2 (ja) 2020-12-11 2021-12-10 成形用樹脂組成物及び電子部品装置
JP2024118015A Pending JP2024144537A (ja) 2020-12-11 2024-07-23 成形用樹脂組成物及び電子部品装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2024118015A Pending JP2024144537A (ja) 2020-12-11 2024-07-23 成形用樹脂組成物及び電子部品装置

Country Status (6)

Country Link
US (1) US20240026118A1 (https=)
JP (2) JP7609173B2 (https=)
KR (1) KR20230118100A (https=)
CN (1) CN116583548A (https=)
TW (1) TW202222888A (https=)
WO (1) WO2022124406A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202436504A (zh) * 2022-11-22 2024-09-16 日商力森諾科股份有限公司 成形用樹脂組成物及電子零件裝置
WO2025249327A1 (ja) * 2024-05-27 2025-12-04 株式会社レゾナック 液状硬化性組成物及び電子部品装置
KR102789700B1 (ko) 2024-11-19 2025-04-03 주식회사 티에스아이코리아 이차전지 검사 장치 및 검사 방법

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011021166A (ja) * 2009-07-21 2011-02-03 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2012216685A (ja) * 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 多層基板
CN103351578A (zh) * 2013-07-19 2013-10-16 广东生益科技股份有限公司 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
JP2015036410A (ja) * 2013-08-15 2015-02-23 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
US20150183952A1 (en) * 2013-12-27 2015-07-02 Taiwan Union Technology Corporation Resin composition and uses of the same
JP2017014406A (ja) * 2015-07-01 2017-01-19 味の素株式会社 樹脂組成物
WO2020066856A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
WO2020153068A1 (ja) * 2019-01-23 2020-07-30 株式会社村田製作所 アンテナモジュール及び通信装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20080028679A (ko) * 2006-09-27 2008-04-01 삼성전자주식회사 인쇄회로기판 및 이를 갖는 표시장치
KR101454111B1 (ko) * 2013-04-17 2014-10-22 삼성전기주식회사 열팽창율 및 유전손실율이 낮은 인쇄회로기판용 절연수지 조성물, 이를 이용한 프리프레그 및 인쇄회로기판
JP6519424B2 (ja) 2015-09-16 2019-05-29 住友ベークライト株式会社 高誘電樹脂組成物
JP6832193B2 (ja) 2017-02-27 2021-02-24 京セラ株式会社 樹脂組成物および樹脂封止型半導体装置

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011021166A (ja) * 2009-07-21 2011-02-03 Hitachi Chem Co Ltd 封止用エポキシ樹脂組成物及び電子部品装置
JP2012216685A (ja) * 2011-03-31 2012-11-08 Nippon Zeon Co Ltd 多層基板
CN103351578A (zh) * 2013-07-19 2013-10-16 广东生益科技股份有限公司 一种用于形成天线用的介质基板的介质层的树脂组合物及其用途
JP2015036410A (ja) * 2013-08-15 2015-02-23 信越化学工業株式会社 高誘電率エポキシ樹脂組成物および半導体装置
US20150183952A1 (en) * 2013-12-27 2015-07-02 Taiwan Union Technology Corporation Resin composition and uses of the same
JP2017014406A (ja) * 2015-07-01 2017-01-19 味の素株式会社 樹脂組成物
WO2020066856A1 (ja) * 2018-09-27 2020-04-02 日立化成株式会社 封止用樹脂組成物、電子部品装置及び電子部品装置の製造方法
WO2020153068A1 (ja) * 2019-01-23 2020-07-30 株式会社村田製作所 アンテナモジュール及び通信装置

Also Published As

Publication number Publication date
JP7609173B2 (ja) 2025-01-07
JP2024144537A (ja) 2024-10-11
CN116583548A (zh) 2023-08-11
KR20230118100A (ko) 2023-08-10
WO2022124406A1 (ja) 2022-06-16
TW202222888A (zh) 2022-06-16
US20240026118A1 (en) 2024-01-25

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