KR20230111601A - adhesive sheet - Google Patents
adhesive sheet Download PDFInfo
- Publication number
- KR20230111601A KR20230111601A KR1020237011319A KR20237011319A KR20230111601A KR 20230111601 A KR20230111601 A KR 20230111601A KR 1020237011319 A KR1020237011319 A KR 1020237011319A KR 20237011319 A KR20237011319 A KR 20237011319A KR 20230111601 A KR20230111601 A KR 20230111601A
- Authority
- KR
- South Korea
- Prior art keywords
- pressure
- sensitive adhesive
- layer
- meth
- acrylate
- Prior art date
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 173
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 173
- 239000010410 layer Substances 0.000 claims abstract description 193
- 239000004820 Pressure-sensitive adhesive Substances 0.000 claims abstract description 144
- 238000012546 transfer Methods 0.000 claims abstract description 107
- 239000011521 glass Substances 0.000 claims abstract description 19
- 229920000058 polyacrylate Polymers 0.000 claims description 55
- 239000000758 substrate Substances 0.000 claims description 31
- 238000007373 indentation Methods 0.000 claims description 28
- 229920005601 base polymer Polymers 0.000 claims description 22
- 238000012545 processing Methods 0.000 claims description 8
- 230000001678 irradiating effect Effects 0.000 claims description 6
- 238000000034 method Methods 0.000 abstract description 16
- 230000001747 exhibiting effect Effects 0.000 abstract description 3
- 238000005406 washing Methods 0.000 abstract description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 96
- -1 (meth)acrylic acid aryl esters Chemical class 0.000 description 72
- 239000000178 monomer Substances 0.000 description 62
- 229920000139 polyethylene terephthalate Polymers 0.000 description 54
- 239000005020 polyethylene terephthalate Substances 0.000 description 54
- 239000003431 cross linking reagent Substances 0.000 description 52
- 239000012790 adhesive layer Substances 0.000 description 32
- 229920005989 resin Polymers 0.000 description 27
- 239000011347 resin Substances 0.000 description 27
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 24
- 238000002834 transmittance Methods 0.000 description 19
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 18
- 229920001971 elastomer Polymers 0.000 description 18
- 239000005060 rubber Substances 0.000 description 18
- 238000011156 evaluation Methods 0.000 description 17
- 239000003999 initiator Substances 0.000 description 17
- 239000000243 solution Substances 0.000 description 17
- 150000001875 compounds Chemical class 0.000 description 16
- 125000000524 functional group Chemical group 0.000 description 16
- 239000012948 isocyanate Substances 0.000 description 16
- 239000000463 material Substances 0.000 description 16
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 14
- 239000000203 mixture Substances 0.000 description 14
- 230000000052 comparative effect Effects 0.000 description 13
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 13
- 239000004342 Benzoyl peroxide Substances 0.000 description 12
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 12
- 235000019400 benzoyl peroxide Nutrition 0.000 description 12
- 229910052757 nitrogen Inorganic materials 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 11
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 11
- 150000002513 isocyanates Chemical class 0.000 description 10
- 229920000642 polymer Polymers 0.000 description 10
- 229920001296 polysiloxane Polymers 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 9
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 8
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 8
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical class CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 8
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 8
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 7
- 239000000654 additive Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 238000002156 mixing Methods 0.000 description 7
- 229940059574 pentaerithrityl Drugs 0.000 description 7
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 7
- 150000003839 salts Chemical class 0.000 description 7
- PCKZAVNWRLEHIP-UHFFFAOYSA-N 2-hydroxy-1-[4-[[4-(2-hydroxy-2-methylpropanoyl)phenyl]methyl]phenyl]-2-methylpropan-1-one Chemical compound C1=CC(C(=O)C(C)(O)C)=CC=C1CC1=CC=C(C(=O)C(C)(C)O)C=C1 PCKZAVNWRLEHIP-UHFFFAOYSA-N 0.000 description 6
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 6
- 238000004873 anchoring Methods 0.000 description 6
- 125000003118 aryl group Chemical group 0.000 description 6
- 229920001577 copolymer Polymers 0.000 description 6
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000012299 nitrogen atmosphere Substances 0.000 description 6
- 239000004014 plasticizer Substances 0.000 description 6
- 238000002360 preparation method Methods 0.000 description 6
- 238000010521 absorption reaction Methods 0.000 description 5
- 125000000623 heterocyclic group Chemical group 0.000 description 5
- 150000002430 hydrocarbons Chemical group 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 4
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 4
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000008065 acid anhydrides Chemical class 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 4
- 229910052753 mercury Inorganic materials 0.000 description 4
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 4
- 239000003504 photosensitizing agent Substances 0.000 description 4
- 229920001223 polyethylene glycol Polymers 0.000 description 4
- 230000000644 propagated effect Effects 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 235000007586 terpenes Nutrition 0.000 description 4
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 4
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 4
- 239000013638 trimer Substances 0.000 description 4
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 3
- GOXQRTZXKQZDDN-UHFFFAOYSA-N 2-Ethylhexyl acrylate Chemical compound CCCCC(CC)COC(=O)C=C GOXQRTZXKQZDDN-UHFFFAOYSA-N 0.000 description 3
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- 239000002202 Polyethylene glycol Substances 0.000 description 3
- 229920002367 Polyisobutene Polymers 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 3
- 239000006096 absorbing agent Substances 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000346 polystyrene-polyisoprene block-polystyrene Polymers 0.000 description 3
- 239000010453 quartz Substances 0.000 description 3
- 229920013730 reactive polymer Polymers 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 125000000542 sulfonic acid group Chemical group 0.000 description 3
- 150000003505 terpenes Chemical class 0.000 description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 3
- 229920002554 vinyl polymer Polymers 0.000 description 3
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical compound O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 2
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 2
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 2
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 2
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 2
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- ROGIWVXWXZRRMZ-UHFFFAOYSA-N 2-methylbuta-1,3-diene;styrene Chemical compound CC(=C)C=C.C=CC1=CC=CC=C1 ROGIWVXWXZRRMZ-UHFFFAOYSA-N 0.000 description 2
- JEHFRMABGJJCPF-UHFFFAOYSA-N 2-methylprop-2-enoyl isocyanate Chemical compound CC(=C)C(=O)N=C=O JEHFRMABGJJCPF-UHFFFAOYSA-N 0.000 description 2
- AUZRCMMVHXRSGT-UHFFFAOYSA-N 2-methylpropane-1-sulfonic acid;prop-2-enamide Chemical compound NC(=O)C=C.CC(C)CS(O)(=O)=O AUZRCMMVHXRSGT-UHFFFAOYSA-N 0.000 description 2
- AGBXYHCHUYARJY-UHFFFAOYSA-N 2-phenylethenesulfonic acid Chemical compound OS(=O)(=O)C=CC1=CC=CC=C1 AGBXYHCHUYARJY-UHFFFAOYSA-N 0.000 description 2
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 2
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 2
- KWOLFJPFCHCOCG-UHFFFAOYSA-N Acetophenone Chemical compound CC(=O)C1=CC=CC=C1 KWOLFJPFCHCOCG-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 2
- JIGUQPWFLRLWPJ-UHFFFAOYSA-N Ethyl acrylate Chemical compound CCOC(=O)C=C JIGUQPWFLRLWPJ-UHFFFAOYSA-N 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 244000043261 Hevea brasiliensis Species 0.000 description 2
- 239000005058 Isophorone diisocyanate Substances 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- 229920000877 Melamine resin Polymers 0.000 description 2
- 229920000459 Nitrile rubber Polymers 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- XSQUKJJJFZCRTK-UHFFFAOYSA-N Urea Chemical compound NC(N)=O XSQUKJJJFZCRTK-UHFFFAOYSA-N 0.000 description 2
- QYKIQEUNHZKYBP-UHFFFAOYSA-N Vinyl ether Chemical compound C=COC=C QYKIQEUNHZKYBP-UHFFFAOYSA-N 0.000 description 2
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 2
- 230000000996 additive effect Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000004703 alkoxides Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N anhydrous trimellitic acid Natural products OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 230000003712 anti-aging effect Effects 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 2
- 229920005549 butyl rubber Polymers 0.000 description 2
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- 150000001718 carbodiimides Chemical class 0.000 description 2
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- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- 229920001519 homopolymer Polymers 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 2
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 2
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- 238000001000 micrograph Methods 0.000 description 2
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- 229920001721 polyimide Polymers 0.000 description 2
- 239000005056 polyisocyanate Substances 0.000 description 2
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- UIIIBRHUICCMAI-UHFFFAOYSA-N prop-2-ene-1-sulfonic acid Chemical compound OS(=O)(=O)CC=C UIIIBRHUICCMAI-UHFFFAOYSA-N 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellityc acid Natural products OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 229920006132 styrene block copolymer Polymers 0.000 description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 description 2
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 2
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 2
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 2
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- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- XMBWDFGMSWQBCA-UHFFFAOYSA-N hydrogen iodide Chemical class I XMBWDFGMSWQBCA-UHFFFAOYSA-N 0.000 description 1
- 230000000977 initiatory effect Effects 0.000 description 1
- 229920000554 ionomer Polymers 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 125000002960 margaryl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 125000001421 myristyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- ZQXSMRAEXCEDJD-UHFFFAOYSA-N n-ethenylformamide Chemical class C=CNC=O ZQXSMRAEXCEDJD-UHFFFAOYSA-N 0.000 description 1
- OPECTNGATDYLSS-UHFFFAOYSA-N naphthalene-2-sulfonyl chloride Chemical compound C1=CC=CC2=CC(S(=O)(=O)Cl)=CC=C21 OPECTNGATDYLSS-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- VABATIYWCXGQQP-UHFFFAOYSA-N nonadecyl prop-2-enoate Chemical compound CCCCCCCCCCCCCCCCCCCOC(=O)C=C VABATIYWCXGQQP-UHFFFAOYSA-N 0.000 description 1
- MDYPDLBFDATSCF-UHFFFAOYSA-N nonyl prop-2-enoate Chemical compound CCCCCCCCCOC(=O)C=C MDYPDLBFDATSCF-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 229920002601 oligoester Polymers 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical compound C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- 125000000913 palmityl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002958 pentadecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000001147 pentyl group Chemical group C(CCCC)* 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 150000004714 phosphonium salts Chemical class 0.000 description 1
- 210000002381 plasma Anatomy 0.000 description 1
- 229920001643 poly(ether ketone) Polymers 0.000 description 1
- 229920002401 polyacrylamide Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001083 polybutene Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920013716 polyethylene resin Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 229920001195 polyisoprene Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000306 polymethylpentene Polymers 0.000 description 1
- 239000011116 polymethylpentene Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005990 polystyrene resin Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000005033 polyvinylidene chloride Substances 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 239000002516 radical scavenger Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007763 reverse roll coating Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 229920003048 styrene butadiene rubber Polymers 0.000 description 1
- 229960002317 succinimide Drugs 0.000 description 1
- 150000005846 sugar alcohols Polymers 0.000 description 1
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical compound ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 1
- 229920003051 synthetic elastomer Polymers 0.000 description 1
- 239000005061 synthetic rubber Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 125000002889 tridecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/06—Interconnection of layers permitting easy separation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
- C09J7/38—Pressure-sensitive adhesives [PSA]
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/40—Adhesives in the form of films or foils characterised by release liners
- C09J7/401—Adhesives in the form of films or foils characterised by release liners characterised by the release coating composition
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/30—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
- C09J2301/312—Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
- C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Laminated Bodies (AREA)
Abstract
피착체를 박리 가능하게 임시 고정할 수 있는 점착 시트이며, 저출력의 레이저 광으로 박리성이 발현되고, 박리 후에 피착체를 세정하는 공정을 불필요하게 할 수 있고, 또한 박리 발현 개소가 좁은 범위인 점착 시트를 제공한다. 본 발명의 점착 시트는, 점착제층과, 해당 점착제층의 한쪽에 배치된 전사층을 구비하는 점착 시트이며, 해당 전사층이, 활성 에너지선의 조사에 의해, 경화되는 층이고, 해당 점착 시트의 해당 점착제층을 유리에 접착했을 때의 23℃에서의 점착력 I가, 2N/20mm 이상이고, 해당 점착 시트의 해당 점착제층을 유리에 접착했을 때의 23℃에서의 점착력 I의, 해당 전사층에 300mJ/cm2의 자외선을 조사한 후의 23℃에서의 점착력 B에 대한 비가, 5 이상이다.A pressure-sensitive adhesive sheet capable of temporarily fixing an adherend in a peelable manner, exhibiting peelability with low-power laser light, making a process of washing the adherend unnecessary after peeling, and having a narrow range of areas where peeling occurs. The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer and a transfer layer disposed on one side of the pressure-sensitive adhesive layer, the transfer layer is a layer that is cured by irradiation with active energy rays, the adhesive strength I of the pressure-sensitive adhesive sheet at 23°C when the pressure-sensitive adhesive layer is adhered to glass is 2 N/20 mm or more, and the adhesive strength I of the pressure-sensitive adhesive sheet at 23°C when the pressure-sensitive adhesive layer is bonded to glass is equivalent to the transfer layer The ratio to the adhesive force B at 23°C after irradiation with 300 mJ/cm 2 ultraviolet rays is 5 or more.
Description
본 발명은 점착 시트에 관한 것이다.The present invention relates to an adhesive sheet.
전자 부품으로 대표되는 각종 부재를 가공할 때, 점착 시트를 사용하여 부재를 지지체에 임시 고정하고, 이송, 가공 등의 후에, 가공 완료된 부재를 지지체로부터 박리하는 것이 일반적으로 행해지고 있다. 예를 들어, 특허문헌 1에는, 기판(피가공 부재)을 접착제층 및 분리층을 개재시켜 지지체에 임시 고정한 상태에서 가공하고, 가공 후, 분리층을 레이저 광 조사에 의해 파괴하여, 접착제층마다 기판을 지지체로부터 박리하고, 그 후, 기판으로부터 접착제층을 제거하는 방법이 기재되어 있다. 그러나, 상기 방법에서는, 부재로부터 접착제층을 제거하고, 부재의 비접착면을 세정하는 공정을 필요로 하고, 생산 비용의 면에서 문제가 있다. 또한, 고출력으로 레이저 광을 조사한 경우에, 부재에 대미지를 준다는 문제도 있다.When processing various members typified by electronic components, it is generally practiced to temporarily fix the member to a support using an adhesive sheet, and to peel the processed member from the support after transferring, processing, or the like. For example, Patent Document 1 describes a method in which a substrate (member to be processed) is processed while temporarily fixed to a support body via an adhesive layer and a separation layer, and after processing, the separation layer is destroyed by laser light irradiation, the substrate is separated from the support body for each adhesive layer, and thereafter, the adhesive layer is removed from the substrate. However, the above method requires a step of removing the adhesive layer from the member and cleaning the non-adhesive surface of the member, and there is a problem in terms of production cost. In addition, there is also a problem that the member is damaged when the laser beam is irradiated with high output.
또한, 특허문헌 2에는, 복수의 피가공 부재를 접착제층을 개재시켜 캐리어에 임시 고정하고, 접착제층에 레이저 빔을 집중시켜 블리스터를 발생시킴으로써, 피가공 부재의 일부를 선택적으로, 캐리어로부터 분리, 전사하는 방법이 기재되어 있다. 그러나, 이 방법에서는, 레이저 조사 후에 발생한 블리스터가 경시적으로 확산되고, 그 결과, 캐리어의 박리, 전사를 요하지 않는 피가공 부재의 불필요한 탈락이 생긴다는 문제가 있다.Further, Patent Literature 2 describes a method of temporarily fixing a plurality of workpiece members to a carrier via an adhesive layer, and concentrating a laser beam on the adhesive layer to generate blisters, thereby selectively separating and transferring a part of the workpiece members from the carrier. However, in this method, there is a problem that blisters generated after laser irradiation spread over time, and as a result, separation of the carrier and unnecessary detachment of the workpiece member that does not require transfer occur.
본 발명은 상기 종래의 과제를 해결하기 위해 이루어진 것이며, 그 목적으로 하는 바는, 피착체를 박리 가능하게 임시 고정할 수 있는 점착 시트이며, 저출력의 레이저 광으로 박리성이 발현되고, 박리 후에 피착체를 세정하는 공정을 불필요하게 할 수 있고, 또한 박리 발현 개소가 좁은 범위인 점착 시트를 제공하는 데 있다.The present invention has been made in order to solve the above conventional problems, and its object is to provide an adhesive sheet capable of temporarily fixing an adherend in a peelable manner, exhibiting peelability with a low-power laser beam, eliminating the need for a step of cleaning the adherend after peeling, and having a narrow range of peeling occurrence sites.
본 발명의 점착 시트는, 점착제층과, 해당 점착제층의 한쪽에 배치된 전사층을 구비하는 점착 시트이며, 해당 전사층이, 활성 에너지선의 조사에 의해, 경화되는 층이고, 해당 점착 시트의 해당 점착제층을 유리판에 접착했을 때의 23℃에서의 점착력 I가, 2N/20mm 이상이고, 해당 점착 시트의 해당 점착제층을 유리판에 접착했을 때의 23℃에서의 점착력 I의, 해당 전사층에 300mJ/cm2의 자외선을 조사한 후의 23℃에서의 점착력 B에 대한 비가, 5 이상이다.The pressure-sensitive adhesive sheet of the present invention is a pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer and a transfer layer disposed on one side of the pressure-sensitive adhesive layer, wherein the transfer layer is a layer that is cured by irradiation with active energy rays, the adhesive strength I at 23°C when the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet is adhered to a glass plate is 2 N/20 mm or more, and the adhesive strength I at 23°C when the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet is adhered to a glass plate is the transfer The ratio to the adhesive strength B at 23° C. after irradiating the layer with 300 mJ/cm 2 ultraviolet rays is 5 or more.
하나의 실시 형태에 있어서는, 상기 점착 시트는, 상기 점착제층과, 상기 전사층 사이에, 기재를 더 구비한다.In one embodiment, the pressure-sensitive adhesive sheet further includes a substrate between the pressure-sensitive adhesive layer and the transfer layer.
하나의 실시 형태에 있어서는, 300mJ/cm2의 자외선을 조사한 후에, 상기 전사층의 23℃에서의 압입 탄성률 B가, 상기 점착제층의 23℃에서의 압입 탄성률 I의 5배 이상으로 된다.In one embodiment, after irradiation with ultraviolet rays of 300 mJ/cm 2 , the indentation elastic modulus B at 23°C of the transfer layer is 5 times or more than the indentation elastic modulus I at 23°C of the pressure-sensitive adhesive layer.
하나의 실시 형태에 있어서는, 상기 전사층이, 활성 에너지선 경화형 점착제를 포함하고, 해당 활성 에너지선 경화형 점착제가, 베이스 폴리머로서, 아크릴계 폴리머를 포함한다.In one embodiment, the transfer layer contains an active energy ray-curable pressure-sensitive adhesive, and the active energy ray-curable pressure-sensitive adhesive contains an acrylic polymer as a base polymer.
하나의 실시 형태에 있어서는, 상기 점착 시트는, 해당 점착 시트를 사용하여 부재를 지지체에 임시 고정하고, 이송 및/또는 가공 등의 후에, 레이저 광 조사에 의해 해당 부재를 지지체로부터 박리하는 용도로 사용된다.In one embodiment, the pressure-sensitive adhesive sheet is used to temporarily fix a member to a support body using the pressure-sensitive adhesive sheet, and to peel the member from the support body by laser light irradiation after transfer and/or processing.
본 발명에 따르면, 피착체를 박리 가능하게 임시 고정할 수 있는 점착 시트이며, 저출력의 레이저 광으로 박리성이 발현되고, 박리 후에 피착체를 세정하는 공정을 불필요하게 할 수 있고, 또한 박리 발현 개소가 좁은 범위인 점착 시트를 제공할 수 있다.According to the present invention, it is possible to provide an adhesive sheet capable of temporarily fixing an adherend in a peelable manner, exhibiting peelability with a low-power laser beam, eliminating the need for a step of washing the adherend after peeling, and having a narrow range of areas where peeling occurs.
도 1의 (a)는 본 발명에 하나의 실시 형태에 따른 점착 시트의 개략 단면도이다. (b)는 본 발명의 다른 실시 형태에 따른 점착 시트의 개략 단면도이다.
도 2의 (a)는 실시예 1에 있어서의 전사층 표면의 현미경 사진 도면이다. (b)는 비교예 1에 있어서의 전사층 표면의 현미경 사진 도면이다.1(a) is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention. (b) is a schematic cross-sectional view of an adhesive sheet according to another embodiment of the present invention.
Fig. 2(a) is a photomicrograph of the surface of the transfer layer in Example 1. (b) is a photomicrograph of the surface of the transfer layer in Comparative Example 1.
A. 점착 시트의 개요A. Outline of adhesive sheet
도 1의 (a)는 본 발명에 하나의 실시 형태에 따른 점착 시트의 개략 단면도이다. 이 실시 형태에 따른 점착 시트(100)는, 점착제층(10)과, 점착제층(10)의 한쪽에 배치된 전사층(20)을 구비한다. 도 1의 (b)는 본 발명의 다른 실시 형태에 따른 점착 시트의 개략 단면도이다. 이 실시 형태에 따른 점착 시트(200)는, 점착제층(10)과 전사층(20) 사이에, 기재(30)를 더 구비한다. 도시하고 있지 않지만, 본 발명의 점착 시트는, 사용에 제공할 때까지의 동안, 점착면을 보호할 목적으로, 점착제층 및 전사층의 외측에 박리 라이너가 마련되어 있어도 된다. 또한, 점착 시트는, 본 발명의 효과가 얻어지는 한, 임의의 적절한 기타의 층을 더 포함하고 있어도 된다.1(a) is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention. The PSA sheet 100 according to this embodiment includes an PSA layer 10 and a transfer layer 20 disposed on one side of the PSA layer 10 . 1(b) is a schematic cross-sectional view of an adhesive sheet according to another embodiment of the present invention. The PSA sheet 200 according to this embodiment further includes a substrate 30 between the PSA layer 10 and the transfer layer 20 . Although not shown, the pressure-sensitive adhesive sheet of the present invention may be provided with a release liner on the outside of the pressure-sensitive adhesive layer and transfer layer for the purpose of protecting the adhesive surface during use. In addition, the adhesive sheet may further contain any appropriate other layer as long as the effect of the present invention is obtained.
본 발명의 점착 시트는, 당해 점착 시트를 사용하여 부재를 지지체(예를 들어, 유리 기체)에 임시 고정하고, 이송, 가공 등의 후에, 당해 부재를 지지체로부터 박리하는 용도로 사용될 수 있다. 박리 시에는, 레이저 광 조사가 행해지고, 원하는 위치에 있는 부재만이 핀포인트로 박리될 수 있다.The PSA sheet of the present invention can be used for temporarily fixing a member to a support (eg, glass base) using the PSA sheet, and then peeling the member from the support after transfer, processing, and the like. At the time of peeling, laser light irradiation is performed, and only the member in a desired position can be peeled with pinpoint.
상기 전사층은, 활성 에너지선의 조사에 의해, 경화되는 층이다. 보다 상세하게는, 상기 전사층은, 피착체를 고정하기 위한 점착성을 갖고, 활성 에너지선의 조사에 의해 경화되어 당해 점착성이 저하되도록 구성된다. 경화 후에 있어서도, 피착체를 고정할 수 있을 정도의 점착력(예를 들어, 피착체가 자연 낙하하지 않을 정도의 점착력)은 잔존하고 있는 것이 바람직하다. 하나의 실시 형태에 있어서는, 활성 에너지선을 조사함으로써, 전사층 전체의 점착력이 저하된다. 활성 에너지선으로서는, 예를 들어 감마선, 자외선, 가시광선, 적외선(열선), 라디오파, 알파선, 베타선, 전자선, 플라스마류, 전리선, 입자선 등을 들 수 있다. 바람직하게는, 자외선이다.The said transfer layer is a layer hardened|cured by irradiation of an active energy ray. More specifically, the transfer layer has adhesiveness for fixing an adherend, and is cured by irradiation with active energy rays to lower the adhesiveness. Even after curing, it is preferable that the adhesive force to the extent that the adherend can be fixed (for example, the adhesive force to the extent that the adherend does not fall naturally) remains. In one embodiment, the adhesive strength of the entire transfer layer is reduced by irradiating the active energy ray. Examples of active energy rays include gamma rays, ultraviolet rays, visible rays, infrared rays (heat rays), radio waves, alpha rays, beta rays, electron rays, plasmas, ionizing rays, and particle rays. Preferably, it is ultraviolet.
상기 점착제층은, 본 발명의 효과가 얻어지는 한, 임의의 적절한 구성일 수 있다. 하나의 실시 형태에 있어서는, 상기 점착제층은, 감압 점착제로 구성된다. 상기 점착 시트는, 점착제층을 지지체(예를 들어, 유리 기체)에 접착하여 사용할 수 있다. 상기 점착 시트에 있어서는, 레이저 광 조사에 의해 상기 점착제층(기재를 갖는 구성에 있어서는, 또한 기재)에 부분적인 변형이 생기고, 이 변형이 전사층에 전파되어, 전사층 표면(접착면)이 일시적으로 형상 변화함으로써, 당해 개소에 배치된 피착체를 박리시키는 것이 가능하게 된다. 본 발명에 있어서는, 점착제층의 성분(예를 들어, 베이스 폴리머의 종류; 점착 부여제, 가교제 등의 첨가제의 종류; 이들의 배합량 등)을 조정함으로써, 점착제층이 소정 파장의 레이저 광을 흡수할 수 있고, 그 결과, 점착제층의 변형이 생기기 쉬워진다. 기재도 또한, 그 구성 재료를 적절하게 선택함으로써, 변형이 생기기 쉬운 기재로 할 수 있다. 또한, 상기한 바와 같이 전사층을 경화시킨 후에, 레이저 광 조사를 행함으로써, 변형 전파에 의한 박리성을 바람직하게 발현시킬 수 있다. 본 발명에 있어서는, 상기의 작용에 의해, 박리성이 발현되기 때문에, 고출력의 레이저 광을 필요로 하지 않고, 박리 후에 피착체를 세정하는 공정이 불필요하게 되고, 또한 박리 발현 개소를 좁은 범위로 할 수 있다. 또한, 박리 후에 있어서는, 전사층 표면 형상의 변화가 지속되지 않고(즉, 경시적으로 광범위화되지 않고, 오히려, 변화 전의 형상으로 되돌아갈 수 있음), 그 때문에, 박리를 원하지 않는 개소에 있어서, 피착체가 불필요하게 탈락하는 등의 문제를 방지할 수 있다.The pressure-sensitive adhesive layer may have any suitable structure as long as the effects of the present invention are obtained. In one embodiment, the pressure-sensitive adhesive layer is composed of a pressure-sensitive adhesive. The pressure-sensitive adhesive sheet may be used by adhering the pressure-sensitive adhesive layer to a support (eg, glass substrate). In the pressure-sensitive adhesive sheet, partial deformation occurs in the pressure-sensitive adhesive layer (or the base material in the configuration having a base material) by laser light irradiation, and this strain is propagated to the transfer layer, and the surface of the transfer layer (adhesive surface) temporarily changes shape, thereby making it possible to peel off the adherend placed at the location. In the present invention, by adjusting the components of the pressure-sensitive adhesive layer (for example, the type of base polymer; the type of additives such as tackifier and crosslinking agent; their compounding amounts, etc.), the pressure-sensitive adhesive layer can absorb laser light of a predetermined wavelength, and as a result, the pressure-sensitive adhesive layer is easily deformed. The base material can also be made into a base material that is easily deformed by appropriately selecting the constituent material thereof. In addition, by performing laser beam irradiation after curing the transfer layer as described above, peelability by strain propagation can be favorably developed. In the present invention, since peelability is developed by the above action, a high-output laser light is not required, a step of washing the adherend after peeling is unnecessary, and the peeling occurrence site can be narrowed. In addition, after peeling, the change in the surface shape of the transfer layer does not continue (i.e., it does not widen over time, but rather can return to the shape before the change), and therefore, in a location where peeling is not desired, problems such as unnecessarily falling off of the adherend can be prevented.
상기 점착 시트의 점착제층을 유리판에 접착했을 때의 23℃에서의 점착력 I는, 2N/20mm 이상이다. 당해 점착력 I를 높게 함으로써, 레이저 광 조사에 의한 각 층의 변형을 적성화할 수 있고, 박리 발현 개소를 좁은 범위로 할 수 있어, 박리를 원하지 않는 개소에 있어서, 피착체가 불필요하게 탈락하는 등의 문제를 방지할 수 있다. 상기 점착력 I는, 바람직하게는 2N/20mm 내지 25N/20mm이고, 더욱 바람직하게는 5N/20mm 내지 20N/20mm이다. 이러한 범위이면, 상기 본 발명의 효과는 현저해진다. 점착력은, JIS Z 0237:2000에 준하여 측정된다. 구체적으로는, 2kg의 롤러를 1왕복에 의해 점착 시트의 점착제층을 유리판(산술 평균 표면 조도 Ra: 50±25nm)에 접착하고, 23℃ 하에서 30분간 방치한 후, 박리 각도 180°, 박리 속도(인장 속도) 300mm/min의 조건으로, 점착 시트를 잡아떼어 측정된다.The adhesive strength I at 23°C when the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet is adhered to the glass plate is 2 N/20 mm or more. By increasing the adhesive force I, deformation of each layer due to laser light irradiation can be made suitable, and peeling occurrence areas can be made within a narrow range, and in areas where peeling is not desired, problems such as unnecessarily falling off of adherends can be prevented. The adhesive strength I is preferably 2 N/20 mm to 25 N/20 mm, more preferably 5 N/20 mm to 20 N/20 mm. In such a range, the effect of the present invention described above becomes remarkable. Adhesion is measured according to JIS Z 0237:2000. Specifically, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet was adhered to a glass plate (arithmetic average surface roughness Ra: 50 ± 25 nm) by reciprocating a 2 kg roller, and left at 23 ° C. for 30 minutes. Then, the pressure-sensitive adhesive sheet was peeled off under conditions of a peeling angle of 180 ° and a peeling speed (tensile speed) of 300 mm / min.
상기 점착 시트의 전사층을 스테인리스판에 접착한 직후 23℃에서의 초기 점착력 A는, 바람직하게는 1N/20mm 내지 20N/20mm이고, 보다 바람직하게는 1.5N/20mm 내지 15N/20mm이고, 더욱 바람직하게는 2N/20mm 내지 10N/20mm이다. 이러한 범위이면, 양호하게 피착체를 보유 지지할 수 있는 점착 시트를 얻을 수 있다. 전사층 측의 점착력도 또한, JIS Z 0237:2000에 준하여 측정된다. 구체적으로는, 2kg의 롤러를 1왕복에 의해 점착 시트의 전사층을 스테인리스판(산술 평균 표면 조도 Ra: 50±25nm)에 접착하고, 23℃ 하에서 30분간 방치한 후, 박리 각도 180°, 박리 속도(인장 속도) 300mm/min의 조건으로, 점착 시트를 잡아떼어 측정된다. 전사층은, 활성 에너지선 조사 및 레이저 광 조사에 의해 점착력이 변화하지만, 본 명세서에 있어서, 「초기 점착력」이란, 활성 에너지선 및 레이저 광을 조사하기 전의 점착력을 의미한다.The initial adhesive force A at 23° C. immediately after the transfer layer of the pressure-sensitive adhesive sheet is adhered to the stainless plate is preferably 1 N/20 mm to 20 N/20 mm, more preferably 1.5 N/20 mm to 15 N/20 mm, still more preferably 2 N/20 mm to 10 N/20 mm. If it is this range, the adhesive sheet which can hold|maintain an adherend satisfactorily can be obtained. The adhesive force on the transfer layer side is also measured according to JIS Z 0237:2000. Specifically, the transfer layer of the adhesive sheet was adhered to a stainless steel plate (arithmetic mean surface roughness Ra: 50 ± 25 nm) by one reciprocation of a 2 kg roller, left at 23 ° C. for 30 minutes, and then peeled off at a peel angle of 180 ° and a peel rate (tensile speed) of 300 mm / min. The adhesive sheet was peeled off and measured. The adhesive force of the transfer layer changes with active energy ray irradiation and laser light irradiation. In this specification, "initial adhesive strength" means the adhesive force before irradiation with active energy ray and laser light.
하나의 실시 형태에 있어서는, 상기 점착 시트는, 점착 시트를 상기 스테인리스판에 접착하고, 전사층에 300mJ/cm2의 자외선을 조사한 후의 23℃에서의 점착력 B(경화 후 점착력 B이라고도 함)가 바람직하게는 1N/20mm 이하로 되고, 보다 바람직하게는 0.5N/20mm 이하로 되고, 더욱 바람직하게는 0.2N/20mm 이하로 되고, 특히 바람직하게는 0.1N/20mm 이하로 된다. 이러한 범위이면, 박리성이 우수하여, 접착제 잔여물이 적은 점착 시트를 얻을 수 있다. 경화 후 점착력 B의 하한은, 예를 들어 0.01N/20mm(바람직하게는 0.001N/20mm)이다. 상기 자외선 조사는, 예를 들어 자외선 조사 장치(닛토 세이키사제, 상품명 「UM-810」)를 사용하여, 고압 수은등의 자외선(특성 파장: 365nm, 적산 광량: 300mJ/cm2)을 전사층에 조사하여 행해진다. 자외선 조사는, 점착제층 측에서 행해질 수 있다.In one embodiment, the adhesive sheet has an adhesive strength B at 23° C. (also referred to as adhesive strength B after curing) after the adhesive sheet is adhered to the stainless plate and the transfer layer is irradiated with ultraviolet rays of 300 mJ/cm 2 . It becomes 1N/20mm or less. Within this range, a pressure-sensitive adhesive sheet having excellent peelability and a small amount of adhesive residue can be obtained. The lower limit of the adhesive force B after curing is, for example, 0.01 N/20 mm (preferably 0.001 N/20 mm). The ultraviolet irradiation is performed by irradiating the transfer layer with ultraviolet rays (characteristic wavelength: 365 nm, integrated light amount: 300 mJ/cm 2 ) of a high-pressure mercury lamp using, for example, an ultraviolet irradiation device (manufactured by Nitto Seiki Co., Ltd., trade name “UM-810”). Ultraviolet irradiation may be performed from the side of the pressure-sensitive adhesive layer.
점착제층을 유리에 접착했을 때의 23℃에서의 점착력 I의 전사층의 경화 후 점착력 B에 대한 비(점착력 I/경화 후 점착력 B)는 5 이상이다. 환언하면, 상기 점착 시트에 있어서는, 경화 후 점착력 B가, 점착력 I의 0.2배 이하(바람직하게는 0.1배 이하, 보다 바람직하게는 0.05배 이하, 더욱 바람직하게는 0.005배 이하)로 된다. (점착력 I/경화 후 점착력 B)를 상기와 같이 특정함으로써, 레이저 광 조사에 의한 각 층의 변형을 적성화할 수 있고, 또한 레이저 광 조사에 의한 박리성이 우수한 점착 시트를 얻을 수 있다. 이러한 점착 시트는, 좁은 범위에 있어서 확실한 박리성을 실현할 수 있다. (점착력 I/경화 후 점착력 B)는 바람직하게는 10 이상이고, 보다 바람직하게는 20 이상이고, 더욱 바람직하게는 200 이상이다. 이러한 범위이면, 상기 본 발명의 효과는 현저해진다. (점착력 I/경화 후 점착력 B)의 상한은, 예를 들어 1000이며, 바람직하게는 5000이고, 보다 바람직하게는 10000이다. 즉, 상기 점착 시트에 있어서는, 경화 후 점착력 B가, 점착력 I의 0.0001배 이상으로 될 수 있다.The ratio of the adhesive strength I at 23° C. to the adhesive strength B after curing of the transfer layer when the pressure-sensitive adhesive layer is adhered to glass (adhesive strength I/adhesive strength after curing B) is 5 or more. In other words, in the adhesive sheet, the adhesive strength B after curing is 0.2 times or less (preferably 0.1 times or less, more preferably 0.05 times or less, still more preferably 0.005 times or less) of the adhesive strength I. By specifying (adhesive force I/adhesive force after curing) as described above, deformation of each layer due to laser light irradiation can be made appropriate, and an adhesive sheet having excellent peelability by laser light irradiation can be obtained. Such an adhesive sheet can realize reliable peelability in a narrow range. (Adhesive strength I/Adhesive strength after curing B) is preferably 10 or more, more preferably 20 or more, still more preferably 200 or more. In such a range, the effect of the present invention described above becomes remarkable. The upper limit of (adhesive force I/adhesive force after curing B) is, for example, 1000, preferably 5000, and more preferably 10000. That is, in the adhesive sheet, the adhesive force B after curing can be 0.0001 times or more of the adhesive force I.
전사층의 초기 점착력 A의 전사층의 경화 후 점착력 B에 대한 비(초기 점착력 A/경화 후 점착력 B)는 바람직하게는 5 이상이고, 보다 바람직하게는 10 이상이고, 보다 바람직하게는 10 내지 100이고, 더욱 바람직하게는 30 내지 80이다. 이러한 범위이면, 피착체의 고정성과 박리성의 밸런스가 우수한 점착 시트를 얻을 수 있다.The ratio of the initial adhesive force A of the transfer layer to the adhesive force B after curing of the transfer layer (initial adhesive force A/adhesive force after curing B) is preferably 5 or more, more preferably 10 or more, more preferably 10 to 100, and still more preferably 30 to 80. If it is this range, the adhesive sheet excellent in the balance of the fixation property of a to-be-adhered body and peelability can be obtained.
상기 점착 시트에 있어서, 상기 점착제층과 접하여 배치되는 층(예를 들어, 전사층, 기재, 기타의 층)과 점착제층의 23℃에서의 투묘력은, 바람직하게는 2N/20mm 이상이고, 보다 바람직하게 4N/20mm 이상이고, 더욱 바람직하게는 6N/20mm 이상이고, 특히 바람직하게는 8N/20mm 이상이다. 당해 투묘력의 상한은, 예를 들어 30N/20mm(바람직하게는 50N/20mm)이다. 투묘력은, 23℃ 하, 박리 각도 180°, 박리 속도(인장 속도) 300mm/min의 조건으로, 점착제층을 인접 층으로부터 잡아떼어 측정된다.In the pressure-sensitive adhesive sheet, the anchoring force at 23 ° C. of the layer (e.g., transfer layer, substrate, other layers) and the pressure-sensitive adhesive layer disposed in contact with the pressure-sensitive adhesive layer is preferably 2 N / 20 mm or more, more preferably 4 N / 20 mm or more, still more preferably 6 N / 20 mm or more, and particularly preferably 8 N / 20 mm or more. The upper limit of the anchoring force is, for example, 30 N/20 mm (preferably 50 N/20 mm). The anchoring force is measured by pulling the pressure-sensitive adhesive layer away from the adjacent layer under conditions of a peeling angle of 180° and a peeling speed (tensile speed) of 300 mm/min under 23°C.
상기 점착 시트에 있어서, 상기 전사층과 접하여 배치되는 층(예를 들어, 점착제층, 기재, 기타의 층)과 전사층의 23℃에서의 투묘력은, 바람직하게는 2N/20mm 이상이고, 보다 바람직하게 4N/20mm 이상이고, 더욱 바람직하게는 6N/20mm 이상이고, 특히 바람직하게는 8N/20mm 이상이다. 당해 투묘력의 상한은, 예를 들어 30N/20mm(바람직하게는 50N/20mm)이다. 투묘력은, 23℃ 하, 박리 각도 180°, 박리 속도(인장 속도) 300mm/min의 조건으로, 전사층을 인접 층으로부터 잡아떼어 측정된다.In the pressure-sensitive adhesive sheet, the anchoring force at 23° C. of the layer (e.g., pressure-sensitive adhesive layer, base material, other layer) and the transfer layer disposed in contact with the transfer layer is preferably 2 N/20 mm or more, more preferably 4 N/20 mm or more, still more preferably 6 N/20 mm or more, and particularly preferably 8 N/20 mm or more. The upper limit of the anchoring force is, for example, 30 N/20 mm (preferably 50 N/20 mm). The anchoring force is measured by pulling the transfer layer away from the adjacent layer under conditions of a peeling angle of 180° and a peeling speed (tensile speed) of 300 mm/min under 23°C.
본 발명의 점착 시트의 파장 248nm의 광투과율은, 바람직하게는 50% 이하이고, 보다 바람직하게는 30% 이하이고, 더욱 바람직하게는 10% 이하이고, 특히 바람직하게는 5% 이하이다. 하나의 실시 형태에 있어서는, 점착 시트의 파장 248nm의 광투과율은, 점착제층 및/또는 기재의 당해 광의 투과율에 의해 제어될 수 있다. 구체적으로는, 점착제층의 성분(예를 들어, 베이스 폴리머의 종류; 점착 부여제, 가교제 등의 첨가제의 종류; 이들의 배합량 등), 점착제층의 두께, 기재의 구성 재료, 기재의 두께 등을 조정함으로써, 상기 투과율이 제어된다. 본 발명에 있어서는, 당해 광투과율을 낮게 함으로써, 점착제층 및/또는 기재의 변형의 발생을 촉진하여, 박리 시의 레이저 출력을 낮게 할 수 있다. 본 발명의 점착 시트는, 저출력의 레이저 광으로 박리성을 발현시키기 때문에, 당해 점착 시트를 사용하면, 박리 시의 피착체에 대한 대미지를 저감시켜, 당해 피착체의 파손을 방지할 수 있다. 파장 248nm의 광투과율은, 낮을수록 바람직하지만, 그 하한은, 예를 들어 0.5%(바람직하게는 0%)이다.The light transmittance of the pressure-sensitive adhesive sheet of the present invention at a wavelength of 248 nm is preferably 50% or less, more preferably 30% or less, still more preferably 10% or less, and particularly preferably 5% or less. In one embodiment, the light transmittance of the pressure-sensitive adhesive sheet at a wavelength of 248 nm can be controlled by the light transmittance of the pressure-sensitive adhesive layer and/or the substrate. Specifically, the transmittance is controlled by adjusting the components of the pressure-sensitive adhesive layer (e.g., the type of base polymer; the type of additives such as tackifiers and crosslinking agents; their blending amounts, etc.), the thickness of the pressure-sensitive adhesive layer, the constituent material of the base material, and the thickness of the base material. In the present invention, by lowering the light transmittance, generation of deformation of the pressure-sensitive adhesive layer and/or substrate can be promoted, and the laser output at the time of peeling can be lowered. Since the pressure-sensitive adhesive sheet of the present invention develops peelability with low-power laser light, use of the pressure-sensitive adhesive sheet can reduce damage to the adherend during peeling and prevent damage to the adherend. The light transmittance at a wavelength of 248 nm is preferably as low as possible, but the lower limit thereof is, for example, 0.5% (preferably 0%).
본 발명의 점착 시트의 파장 365nm의 광투과율은, 바람직하게는 50% 이상이고, 보다 바람직하게는 60% 이상이고, 더욱 바람직하게는 70% 이상이다. 이러한 범위이면, 활성 에너지선의 조사에 의한 전사층의 경화가 바람직하게 생기는 점착 시트를 얻을 수 있다. 점착 시트의 파장 365nm의 광투과율은 높을수록 바람직하지만, 그 상한은, 예를 들어 95%(바람직하게는 100%)이다.The light transmittance of the pressure-sensitive adhesive sheet of the present invention at a wavelength of 365 nm is preferably 50% or more, more preferably 60% or more, still more preferably 70% or more. Within this range, a pressure-sensitive adhesive sheet in which the transfer layer can be preferably cured by irradiation with active energy rays can be obtained. The light transmittance of the adhesive sheet at a wavelength of 365 nm is preferably as high as possible, but the upper limit thereof is, for example, 95% (preferably 100%).
본 발명의 점착 시트의 헤이즈값은, 바람직하게는 70% 이하이고, 보다 바람직하게는 65% 이하이다. 이러한 범위이면, 활성 에너지선의 조사에 의한 전사층의 경화가 바람직하게 생기는 점착 시트를 얻을 수 있다. 하나의 실시 형태에 있어서는, 상기 점착 시트의 헤이즈값은 20% 이하이다. 점착 시트의 헤이즈값은 낮을수록 바람직하지만, 그 하한은, 예를 들어 0.1%이다.The haze value of the pressure-sensitive adhesive sheet of the present invention is preferably 70% or less, and more preferably 65% or less. Within this range, a pressure-sensitive adhesive sheet in which the transfer layer can be preferably cured by irradiation with active energy rays can be obtained. In one embodiment, the haze value of the pressure-sensitive adhesive sheet is 20% or less. The lower the haze value of the PSA sheet, the better, but the lower limit thereof is, for example, 0.1%.
점착 시트의 두께는, 바람직하게는 1㎛ 내지 300㎛이고, 보다 바람직하게는 5㎛ 내지 200㎛이다. 하나의 실시 형태에 있어서는, 상기 점착 시트의 두께는, 30㎛ 이하이다. 점착 시트가 얇으면, 점착제층에 생긴 변형이 전사층으로 전파되기 쉬워, 박리성이 우수한 점착 시트를 얻을 수 있다.The thickness of the pressure-sensitive adhesive sheet is preferably 1 μm to 300 μm, more preferably 5 μm to 200 μm. In one embodiment, the thickness of the pressure-sensitive adhesive sheet is 30 μm or less. When the PSA sheet is thin, strain generated in the PSA layer is easily propagated to the transfer layer, and a PSA sheet having excellent peelability can be obtained.
상기 점착 시트가, 기재 및/또는 임의의 적절한 기타의 층을 더 포함하는 경우, 점착제층과 전사층의 거리는, 바람직하게는 50㎛ 미만이고, 보다 바람직하게는 30㎛ 이하이고, 더욱 바람직하게는 25㎛ 이하이고, 특히 바람직하게는 10㎛ 이하이다. 이러한 범위이면, 점착제층에 생긴 변형이 전사층으로 전파되기 쉬워, 박리성이 우수한 점착 시트를 얻을 수 있다.When the pressure-sensitive adhesive sheet further includes a substrate and/or any suitable other layer, the distance between the pressure-sensitive adhesive layer and the transfer layer is preferably less than 50 μm, more preferably less than 30 μm, still more preferably less than 25 μm, and particularly preferably less than 10 μm. Within this range, the strain generated in the pressure-sensitive adhesive layer is easily propagated to the transfer layer, and a pressure-sensitive adhesive sheet having excellent peelability can be obtained.
B. 전사층B. transfer layer
상기 전사층의 두께는, 바람직하게는 1㎛ 내지 30㎛이고, 보다 바람직하게는 2㎛ 내지 20㎛이고, 더욱 바람직하게는 3㎛ 내지 10㎛이다. 이러한 범위이면, 상기 효과가 현저해진다.The thickness of the transfer layer is preferably 1 μm to 30 μm, more preferably 2 μm to 20 μm, still more preferably 3 μm to 10 μm. In such a range, the said effect becomes remarkable.
상기 전사층의 23℃에서의 초기 압입 탄성률 A는, 바람직하게는 0.1MPa 이상 14MPa 미만이고, 보다 바람직하게는 0.1MPa 내지 10MPa이고, 더욱 바람직하게는 0.2MPa 내지 8MPa이다. 이러한 범위이면 고정성이 우수한 점착 시트를 얻을 수 있다. 압입 탄성률은, 23℃에서의 단일 압입법에 의해, 압입 속도 10nm/s, 압입 깊이 100nm에 의해 측정될 수 있다. 전사층은, 활성 에너지선 조사 및 레이저 광 조사에 의해 점착력이 변화하지만, 본 명세서에 있어서, 「초기 압입 탄성률 A」란, 활성 에너지선 및 레이저 광을 조사하기 전의 점착력을 의미한다.The initial indentation modulus A of the transfer layer at 23°C is preferably 0.1 MPa or more and less than 14 MPa, more preferably 0.1 MPa to 10 MPa, still more preferably 0.2 MPa to 8 MPa. If it is this range, the adhesive sheet excellent in fixation property can be obtained. The indentation modulus can be measured by a single indentation method at 23° C. at an indentation speed of 10 nm/s and an indentation depth of 100 nm. The adhesive strength of the transfer layer changes with active energy ray irradiation and laser light irradiation. In this specification, "initial indentation elastic modulus A" means adhesive strength before active energy ray and laser light irradiation.
상기 전사층은, 300mJ/cm2의 자외선을 조사한 후에, 23℃에서의 압입 탄성률 B(경화 후 탄성률 B이라고도 함)가 14MPa 이상으로 되는 층인 것이 바람직하고, 15MPa 이상으로 되는 층인 것이 보다 바람직하고, 20MPa 이상으로 되는 층인 것이 더욱 바람직하고, 50MPa 이상으로 되는 층인 것이 특히 바람직하다. 이러한 범위이면, 박리성이 우수한 점착 시트를 얻을 수 있다. 또한, 박리 시의 피착체의 오염을 방지할 수 있다. 23℃에서의 경화 후 탄성률 B의 상한은, 예를 들어 500MPa(바람직하게는 300MPa)이다.The transfer layer is preferably a layer having an indentation modulus B (also referred to as an elastic modulus after curing) of 14 MPa or more at 23° C. after irradiation with ultraviolet rays of 300 mJ/cm 2 , It is more preferable that it is a layer with 15 MPa or more, more preferably a layer with 20 MPa or more, and particularly preferably a layer with 50 MPa or more. If it is this range, the adhesive sheet excellent in peelability can be obtained. In addition, contamination of the adherend at the time of peeling can be prevented. The upper limit of the elastic modulus B after curing at 23°C is, for example, 500 MPa (preferably 300 MPa).
상기 전사층은, 300mJ/cm2의 자외선을 조사한 후에, 23℃에서의 압입 탄성률 B가, 전사층의 23℃에서의 초기 압입 탄성률 A의 20배 이상으로 되는 것이 바람직하고, 30배 이상으로 되는 것이 보다 바람직하고, 30배 내지 1000배로 되는 것이 보다 바람직하고, 50배 내지 200배로 되는 것이 특히 바람직하다. 이러한 범위이면, 피착체의 고정성과 박리성의 밸런스가 우수한 점착 시트를 얻을 수 있다.After the transfer layer is irradiated with ultraviolet rays of 300 mJ / cm 2 , the indentation elastic modulus B at 23 ° C is preferably 20 times or more, more preferably 30 times or more, more preferably 30 times to 1000 times, and particularly preferably 50 times to 200 times the initial indentation elastic modulus A at 23 ° C. of the transfer layer. If it is this range, the adhesive sheet excellent in the balance of the fixation property of a to-be-adhered body and peelability can be obtained.
상기 전사층은, 300mJ/cm2의 자외선을 조사한 후에, 23℃에서의 압입 탄성률 B가, 점착제층의 23℃에서의 압입 탄성률 I의 5배 이상으로 되는 것이 바람직하고, 10배 이상으로 되는 것이 보다 바람직하고, 50배 내지 5000배로 되는 것이 더욱 바람직하고, 100배 내지 3000배로 되는 것이 특히 바람직하다. 이러한 범위이면, 레이저 광 조사에 의한 각 층의 변형을 적성화할 수 있고, 또한 레이저 광 조사에 의한 박리성이 우수한 점착 시트를 얻을 수 있다. 이러한 점착 시트는, 좁은 범위에 있어서 확실한 박리성을 실현할 수 있다.After the transfer layer is irradiated with ultraviolet rays of 300 mJ / cm 2 , the indentation elastic modulus B at 23 ° C is preferably 5 times or more, more preferably 10 times or more, more preferably 50 times to 5000 times, and particularly preferably 100 times to 3000 times the indentation elastic modulus I at 23 ° C of the pressure-sensitive adhesive layer. Within this range, deformation of each layer due to laser light irradiation can be made suitable, and an adhesive sheet having excellent peelability by laser light irradiation can be obtained. Such an adhesive sheet can realize reliable peelability in a narrow range.
하나의 실시 형태에 있어서는, 상기 전사층은, 활성 에너지선 경화형 점착제를 포함한다. 활성 에너지선 경화형 점착제는, 자외선 흡수제 및/또는 광중합 개시제를 더 포함하고 있어도 된다.In one embodiment, the transfer layer contains an active energy ray-curable pressure-sensitive adhesive. The active energy ray-curable pressure-sensitive adhesive may further contain a ultraviolet absorber and/or a photopolymerization initiator.
(활성 에너지선 경화형 점착제)(active energy ray curable adhesive)
하나의 실시 형태에 있어서는, 활성 에너지선 경화형 점착제로서, 모제가 되는 베이스 폴리머와, 해당 베이스 폴리머와 결합 가능한 활성 에너지선 반응성 화합물(모노머 또는 올리고머)을 포함하는 활성 에너지선 경화형 점착제 (A1)이 사용된다. 다른 실시 형태에 있어서는, 베이스 폴리머로서 활성 에너지선 반응성 폴리머를 포함하는 활성 에너지선 경화형 점착제 (A2)가 사용된다. 바람직하게는, 상기 베이스 폴리머는, 광중합 개시제와 반응할 수 있는 관능기를 갖는다. 해당 관능기로서는, 예를 들어 히드록실기, 카르복실기 등을 들 수 있다.In one embodiment, as an active energy ray-curable pressure-sensitive adhesive, an active energy ray-curable pressure-sensitive adhesive (A1) containing a base polymer serving as a base material and an active energy ray-reactive compound (monomer or oligomer) capable of bonding with the base polymer is used. In another embodiment, an active energy ray-curable pressure-sensitive adhesive (A2) containing an active energy ray-reactive polymer is used as a base polymer. Preferably, the base polymer has a functional group capable of reacting with the photopolymerization initiator. As this functional group, a hydroxyl group, a carboxyl group, etc. are mentioned, for example.
상기 점착제 (A1)에 있어서 사용되는 베이스 폴리머로서는, 예를 들어 천연 고무, 폴리이소부틸렌 고무, 스티렌·부타디엔 고무, 스티렌·이소프렌·스티렌 블록 공중합체 고무, 재생 고무, 부틸 고무, 폴리이소부틸렌 고무, 니트릴 고무(NBR) 등의 고무계 폴리머; 실리콘계 폴리머; 아크릴계 폴리머 등을 들 수 있다. 이들 폴리머는, 단독으로 또는 2종 이상 조합하여 사용해도 된다. 그 중에서도 바람직하게는, 아크릴계 폴리머이다.Examples of the base polymer used in the pressure-sensitive adhesive (A1) include rubber-based polymers such as natural rubber, polyisobutylene rubber, styrene-butadiene rubber, styrene-isoprene-styrene block copolymer rubber, recycled rubber, butyl rubber, polyisobutylene rubber, and nitrile rubber (NBR); silicone-based polymers; An acrylic polymer etc. are mentioned. You may use these polymers individually or in combination of 2 or more types. Among these, acrylic polymers are preferred.
아크릴계 폴리머로서는, (메트)아크릴산알킬에스테르, (메트)아크릴산시클로알킬에스테르, (메트)아크릴산아릴에스테르 등의 탄화수소기 함유 (메트)아크릴산에스테르의 단독 중합체 또는 공중합체; 해당 탄화수소기 함유 (메트)아크릴산에스테르와 다른 공중합성 모노머의 공중합체 등을 들 수 있다. (메트)아크릴산알킬에스테르로서는, 예를 들어 (메트)아크릴산의 메틸에스테르, 에틸에스테르, 프로필에스테르, 이소프로필에스테르, 부틸에스테르, 이소부틸에스테르, s-부틸에스테르, t-부틸에스테르, 펜틸에스테르, 이소펜틸에스테르, 헥실에스테르, 헵틸에스테르, 옥틸에스테르, 2-에틸헥실에스테르, 이소옥틸에스테르, 노닐에스테르, 데실에스테르, 이소데실에스테르, 운데실에스테르, 도데실에스테르 즉 라우릴에스테르, 트리데실에스테르, 테트라데실에스테르, 헥사데실에스테르, 옥타데실에스테르 및 에이코실에스테르를 들 수 있다. (메트)아크릴산시클로알킬에스테르로서는, 예를 들어 (메트)아크릴산의 시클로펜틸에스테르 및 시클로헥실에스테르를 들 수 있다. (메트)아크릴산아릴에스테르로서는, 예를 들어 (메트)아크릴산페닐 및 (메트)아크릴산벤질을 들 수 있다. 상기 탄화수소기 함유 (메트)아크릴산에스테르 유래의 구성 단위의 함유 비율은, 베이스 폴리머 100중량부에 대하여, 바람직하게는 40중량부 이상이고, 보다 바람직하게는 60중량부 이상이다.Examples of the acrylic polymer include homopolymers or copolymers of hydrocarbon group-containing (meth)acrylic acid esters such as (meth)acrylic acid alkyl esters, (meth)acrylic acid cycloalkyl esters and (meth)acrylic acid aryl esters; and copolymers of the hydrocarbon group-containing (meth)acrylic acid ester with other copolymerizable monomers. Examples of (meth)acrylic acid alkyl esters include (meth)acrylic acid methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, isopentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester i.e. lauryl ester, tridecyl ester, tetradecyl ester, hexadecyl ester, octadecyl ester and eicosyl ester. Examples of the (meth)acrylic acid cycloalkyl ester include cyclopentyl ester and cyclohexyl ester of (meth)acrylic acid. Examples of the aryl (meth)acrylate include phenyl (meth)acrylate and benzyl (meth)acrylate. The proportion of the structural unit derived from the hydrocarbon group-containing (meth)acrylic acid ester is preferably 40 parts by weight or more, and more preferably 60 parts by weight or more with respect to 100 parts by weight of the base polymer.
상기 다른 공중합성 모노머로서는, 예를 들어 카르복시기 함유 모노머, 산 무수물 모노머, 히드록시기 함유 모노머, 글리시딜기 함유 모노머, 술폰산기 함유 모노머, 인산기 함유 모노머, 아크릴아미드 및 아크릴로니트릴 등의 관능기 함유 모노머 등을 들 수 있다. 카르복시기 함유 모노머로서는, 예를 들어 아크릴산, 메타크릴산, 카로복시에틸(메트)아크릴레이트, 카로복시펜틸(메트)아크릴레이트, 이타콘산, 말레산, 푸마르산 및 크로톤산을 들 수 있다. 산 무수물 모노머로서는, 예를 들어 무수 말레산 및 무수 이타콘산을 들 수 있다. 히드록시기 함유 모노머로서는, 예를 들어 (메트)아크릴산2-히드록시에틸, (메트)아크릴산2-히드록시프로필, (메트)아크릴산4-히드록시부틸, (메트)아크릴산6-히드록시헥실, (메트)아크릴산8-히드록시옥틸, (메트)아크릴산10-히드록시데실, (메트)아크릴산12-히드록시라우릴 및 (4-히드록시메틸시클로헥실)메틸(메트)아크릴레이트를 들 수 있다. 글리시딜기 함유 모노머로서는, 예를 들어 (메트)아크릴산글리시딜 및 (메트)아크릴산메틸글리시딜을 들 수 있다. 술폰산기 함유 모노머로서는, 예를 들어 스티렌술폰산, 알릴술폰산, 2-(메트)아크릴아미드-2-메틸프로판술폰산, (메트)아크릴아미드프로판술폰산, 술포프로필(메트)아크릴레이트 및 (메트)아크릴로일옥시나프탈렌술폰산을 들 수 있다. 인산기 함유 모노머로서는, 예를 들어 2-히드록시에틸아크릴로일포스페이트를 들 수 있다. 아크릴아미드로서는, 예를 들어 N-아크릴로일모르폴린을 들 수 있다. 이들은, 1종을 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다. 상기 공중합성 모노머 유래의 구성 단위의 함유 비율은, 베이스 폴리머 100중량부에 대하여, 바람직하게는 60중량부 이하이고, 보다 바람직하게는 40중량부 이하이다.Examples of the other copolymerizable monomers include carboxyl group-containing monomers, acid anhydride monomers, hydroxyl group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, and functional group-containing monomers such as acrylamide and acrylonitrile. Examples of the carboxy group-containing monomer include acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. As an acid anhydride monomer, maleic acid anhydride and itaconic acid anhydride are mentioned, for example. Examples of the hydroxy group-containing monomer include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, 8-hydroxyoctyl (meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl (meth)acrylate. Examples of the glycidyl group-containing monomer include glycidyl (meth)acrylate and methylglycidyl (meth)acrylate. Examples of the sulfonic acid group-containing monomer include styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidepropanesulfonic acid, sulfopropyl (meth)acrylate, and (meth)acryloyloxynaphthalenesulfonic acid. As a phosphoric acid group containing monomer, 2-hydroxyethyl acryloyl phosphate is mentioned, for example. As acrylamide, N-acryloylmorpholine is mentioned, for example. These may be used individually by 1 type, and may be used in combination of 2 or more type. The content of the structural unit derived from the copolymerizable monomer is preferably 60 parts by weight or less, and more preferably 40 parts by weight or less with respect to 100 parts by weight of the base polymer.
아크릴계 폴리머는, 그 폴리머 골격 중에 가교 구조를 형성하기 위해, 다관능성 모노머 유래의 구성 단위를 포함할 수 있다. 다관능성 모노머로서, 예를 들어 헥산디올디(메트)아크릴레이트, (폴리)에틸렌글리콜디(메트)아크릴레이트, (폴리)프로필렌글리콜디(메트)아크릴레이트, 네오펜틸글리콜디(메트)아크릴레이트, 펜타에리트리톨디(메트)아크릴레이트, 트리메틸올프로판트리(메트)아크릴레이트, 펜타에리트리톨트리(메트)아크릴레이트, 디펜타에리트리톨헥사(메트)아크릴레이트, 에폭시(메트)아크릴레이트 (즉, 폴리글리시딜(메트)아크릴레이트), 폴리에스테르(메트)아크릴레이트 및 우레탄(메트)아크릴레이트를 들 수 있다. 이들은, 1종을 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다. 상기 다관능성 모노머 유래의 구성 단위의 함유 비율은, 베이스 폴리머 100중량부에 대하여, 바람직하게는 40중량부 이하이고, 보다 바람직하게는 30중량부 이하이다.The acrylic polymer may contain structural units derived from polyfunctional monomers in order to form a cross-linked structure in its polymer backbone. As the polyfunctional monomer, for example, hexanedioldi(meth)acrylate, (poly)ethylene glycoldi(meth)acrylate, (poly)propylene glycoldi(meth)acrylate, neopentylglycoldi(meth)acrylate, pentaerythritoldi(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy(meth)acrylate (i.e. , polyglycidyl (meth)acrylate), polyester (meth)acrylate and urethane (meth)acrylate. These may be used individually by 1 type, and may be used in combination of 2 or more type. The content of the structural unit derived from the polyfunctional monomer is preferably 40 parts by weight or less, and more preferably 30 parts by weight or less with respect to 100 parts by weight of the base polymer.
상기 아크릴계 폴리머의 중량 평균 분자량은, 바람직하게는 10만 내지 300만이고, 보다 바람직하게는 20만 내지 200만이다. 중량 평균 분자량은, GPC(용매: THF)에 의해 측정될 수 있다.The weight average molecular weight of the acrylic polymer is preferably 100,000 to 3,000,000, more preferably 200,000 to 2,000,000. A weight average molecular weight can be measured by GPC (solvent: THF).
상기 점착제 (A1)에 사용될 수 있는 상기 활성 에너지선 반응성 화합물로서는, 예를 들어 아크릴로일기, 메타크릴로일기, 비닐기, 알릴기, 아세틸렌기 등의 중합성 탄소-탄소 다중 결합을 갖는 관능기를 갖는 광반응성의 모노머 또는 올리고머를 들 수 있다. 해당 광반응성의 모노머의 구체예로서는, 트리메틸올프로판트리(메트)아크릴레이트, 테트라메틸올메탄테트라(메트)아크릴레이트, 펜타에리트리톨트리(메트)아크릴레이트, 펜타에리트리톨테트라(메트)아크릴레이트, 디펜타에리트리톨모노히드록시펜타(메트)아크릴레이트, 디펜타에리트리톨헥사(메트)아크릴레이트, 1,4-부탄디올디(메트)아크릴레이트, 1,6-헥산디올디(메트)아크릴레이트, 폴리에틸렌글리콜디(메트)아크릴레이트 등의 (메트)아크릴산과 다가 알코올의 에스테르화물; 다관능 우레탄(메트)아크릴레이트; 에폭시(메트)아크릴레이트; 올리고에스테르(메트)아크릴레이트 등을 들 수 있다. 또한, 메타크릴로이소시아네이트, 2-메타크릴로일옥시에틸이소시아네이트(2-이소시아나토에틸메타크릴레이트), m-이소프로페닐-α, α-디메틸벤질이소시아네이트 등의 모노머를 사용해도 된다. 광반응성의 올리고머의 구체예로서는, 상기 모노머의 2 내지 5량체 등을 들 수 있다. 광반응성의 올리고머의 분자량은, 바람직하게는 100 내지 3000이다.Examples of the active energy ray-reactive compound that can be used for the pressure-sensitive adhesive (A1) include photoreactive monomers or oligomers having functional groups having polymerizable carbon-carbon multiple bonds such as acryloyl, methacryloyl, vinyl, allyl, and acetylene groups. Specific examples of the photoreactive monomer include trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol monohydroxypenta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanedioldi(meth)acrylate, 1,6-hexanedioldi( esterified products of (meth)acrylic acid and polyhydric alcohol, such as meth)acrylate and polyethylene glycol di(meth)acrylate; polyfunctional urethane (meth)acrylate; epoxy (meth)acrylate; Oligo ester (meth)acrylate etc. are mentioned. Further, monomers such as methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate (2-isocyanatoethyl methacrylate), m-isopropenyl-α, and α-dimethylbenzyl isocyanate may be used. Specific examples of the photoreactive oligomer include dimers and pentamers of the above monomers. The molecular weight of the photoreactive oligomer is preferably 100 to 3000.
또한, 상기 활성 에너지선 반응성 화합물로서, 에폭시화 부타디엔, 글리시딜메타크릴레이트, 아크릴아미드, 비닐실록산 등의 모노머; 또는 해당 모노머로 구성되는 올리고머를 사용해도 된다.Examples of the active energy ray-reactive compound include monomers such as epoxidized butadiene, glycidyl methacrylate, acrylamide, and vinylsiloxane; Or you may use the oligomer comprised from the said monomer.
또한, 상기 활성 에너지선 반응성 화합물로서, 오늄염 등의 유기염류와, 분자 내에 복수의 복소환을 갖는 화합물의 혼합물을 사용해도 된다. 해당 혼합물은, 활성 에너지선(예를 들어, 자외선, 전자선)의 조사에 의해 유기염이 개열하여 이온을 생성하고, 이것이 개시종이 되어 복소환의 개환 반응을 일으켜서 3차원 그물눈 구조를 형성할 수 있다. 상기 유기염류로서는, 예를 들어 요오드늄염, 포스포늄염, 안티모늄염, 술포늄염, 보레이트염 등을 들 수 있다. 상기 분자 내에 복수의 복소환을 갖는 화합물에 있어서의 복소환으로서는, 옥시란, 옥세탄, 옥솔란, 티이란, 아지리딘 등을 들 수 있다.Further, as the active energy ray-reactive compound, a mixture of an organic salt such as an onium salt and a compound having a plurality of heterocycles in the molecule may be used. In the mixture, organic salts are cleaved by irradiation with active energy rays (eg, ultraviolet rays, electron beams) to generate ions, which become initiating species and cause ring-opening reactions of heterocycles to form a three-dimensional network structure. As said organic salt, an iodonium salt, a phosphonium salt, an antimonium salt, a sulfonium salt, a borate salt etc. are mentioned, for example. Examples of the heterocycle in the compound having a plurality of heterocycles in the molecule include oxirane, oxetane, oxolane, thirane, aziridine and the like.
상기 점착제 (A1)에 있어서, 활성 에너지선 반응성 화합물의 함유 비율은, 베이스 폴리머 100중량부에 대하여, 바람직하게는 0.1중량부 내지 500중량부이고, 보다 바람직하게는 5중량부 내지 300중량부이고, 더욱 바람직하게는 40중량부 내지 150중량부이다.In the pressure-sensitive adhesive (A1), the content of the active energy ray-reactive compound is preferably 0.1 part by weight to 500 parts by weight, more preferably 5 parts by weight to 300 parts by weight, and still more preferably 40 parts by weight to 150 parts by weight, based on 100 parts by weight of the base polymer.
상기 점착제 (A2)에 포함되는 활성 에너지선 반응성 폴리머(베이스 폴리머)로서는, 예를 들어 아크릴로일기, 메타크릴로일기, 비닐기, 알릴기, 아세틸렌기 등의 탄소-탄소 다중 결합을 갖는 관능기를 갖는 폴리머를 들 수 있다. 활성 에너지선 반응성 폴리머의 구체예로서는, 다관능 (메트)아크릴레이트로 구성되는 폴리머; 광 양이온 중합형 폴리머; 폴리비닐신나메이트 등의 신나모일기 함유 폴리머; 디아조화된 아미노노볼락 수지; 폴리아크릴아미드; 등을 들 수 있다.Examples of the active energy ray-responsive polymer (base polymer) contained in the pressure-sensitive adhesive (A2) include polymers having functional groups having carbon-carbon multiple bonds such as acryloyl, methacryloyl, vinyl, allyl, and acetylene groups. Specific examples of the active energy ray reactive polymer include polymers composed of polyfunctional (meth)acrylates; photo cationic polymerization type polymer; cinnamoyl group-containing polymers such as polyvinylcinnamate; diazotized aminonovolak resins; polyacrylamide; etc. can be mentioned.
하나의 실시 형태에 있어서는, 상기 아크릴계 폴리머의 측쇄, 주쇄 및/또는 주쇄 말단에, 활성 에너지선 중합성의 탄소-탄소 다중 결합이 도입되어 구성된 활성 에너지선 반응성 폴리머가 사용된다. 아크릴계 폴리머에 대한 방사선 중합성의 탄소-탄소 이중 결합의 도입 방법으로서는, 예를 들어 소정의 관능기(제1 관능기)를 갖는 모노머를 포함하는 원료 모노머를 공중합시켜 아크릴계 폴리머를 얻은 후, 제1 관능기와의 사이에서 반응을 발생시켜 결합할 수 있는 소정의 관능기(제2 관능기)와 방사선 중합성 탄소-탄소 이중 결합을 갖는 화합물을, 탄소-탄소 이중 결합의 방사선 중합성을 유지한 채 아크릴계 폴리머에 대하여 축합 반응 또는 부가 반응시키는 방법을 들 수 있다.In one embodiment, an active energy ray-reactive polymer formed by introducing active energy ray polymerizable carbon-carbon multiple bonds into side chains, main chains and/or main chain terminals of the acrylic polymer is used. As a method for introducing a radiation-polymerizable carbon-carbon double bond into an acrylic polymer, for example, a raw material monomer containing a monomer having a predetermined functional group (first functional group) is copolymerized to obtain an acrylic polymer, and then a compound having a radiation-polymerizable carbon-carbon double bond and a predetermined functional group (second functional group) that can be bonded by causing a reaction between the first functional group and a compound having a radiation-polymerizable carbon-carbon double bond are subjected to condensation reaction or addition to the acrylic polymer while maintaining radiation polymerizability of the carbon-carbon double bond. How to react can be mentioned.
제1 관능기와 제2 관능기의 조합으로서는, 예를 들어 카르복시기와 에폭시기, 에폭시기와 카르복시기, 카르복시기와 아지리딜기, 아지리딜기와 카르복시기, 히드록시기와 이소시아네이트기, 이소시아네이트기와 히드록시기를 들 수 있다. 이들 조합 중, 반응 추적의 용이함의 관점에서는, 히드록시기와 이소시아네이트기의 조합이나, 이소시아네이트기와 히드록시기의 조합이, 바람직하다. 또한, 반응성이 높은 이소시아네이트기를 갖는 폴리머를 제작하는 것은 기술적 난이도가 높은 바, 아크릴계 폴리머의 제작 또는 입수의 용이함의 관점에서는, 아크릴계 폴리머 측의 상기 제1 관능기가 히드록시기이고 또한 상기 제2 관능기가 이소시아네이트기인 경우가 보다 바람직하다. 이 경우, 방사선 중합성 탄소-탄소 이중 결합과 제2 관능기된 이소시아네이트기를 병유하는 이소시아네이트 화합물로서는, 예를 들어 메타크릴로일이소시아네이트, 2-메타크릴로일옥시에틸이소시아네이트 및 m-이소프로페닐-α, α-디메틸벤질이소시아네이트를 들 수 있다. 또한, 제1 관능기를 갖는 아크릴계 폴리머로서는, 상기의 히드록시기 함유 모노머 유래의 구성 단위를 포함하는 것이 바람직하고, 2-히드록시에틸비닐에테르나, 4-히드록시부틸비닐에테르, 디에틸렌글리콜모노비닐에테르 등의 에테르계 화합물 유래의 구성 단위를 포함하는 것도 바람직하다.Examples of the combination of the first functional group and the second functional group include a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, a hydroxyl group and an isocyanate group, and an isocyanate group and a hydroxyl group. Among these combinations, a combination of a hydroxyl group and an isocyanate group and a combination of an isocyanate group and a hydroxyl group are preferable from the viewpoint of easiness of tracking the reaction. In addition, since producing a polymer having a highly reactive isocyanate group is a high technical difficulty, from the viewpoint of ease of production or acquisition of an acrylic polymer, the first functional group on the acrylic polymer side is a hydroxy group and the second functional group is an isocyanate group. It is more preferable. In this case, examples of the isocyanate compound having a radiation polymerizable carbon-carbon double bond and a second functionalized isocyanate group include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, and m-isopropenyl-α, α-dimethylbenzyl isocyanate. Further, the acrylic polymer having a first functional group preferably includes a structural unit derived from the above hydroxy group-containing monomer, and preferably includes a structural unit derived from an ether compound such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, or diethylene glycol monovinyl ether.
상기 점착제 (A2)는 상기 활성 에너지선 반응성 화합물(모노머 또는 올리고머)을 더 포함하고 있어도 된다.The pressure-sensitive adhesive (A2) may further contain the active energy ray-reactive compound (monomer or oligomer).
상기 활성 에너지선 경화형 점착제는, 자외선 흡수제 및/또는 광중합 개시제를 포함할 수 있다. 사용되는 자외선 흡수제 및 광중합 개시제의 상세는, 후술한다.The active energy ray-curable pressure-sensitive adhesive may include a UV absorber and/or a photopolymerization initiator. Details of the ultraviolet absorber and photopolymerization initiator used are described later.
하나의 실시 형태에 있어서는, 상기 활성 에너지선 경화형 점착제는, 광증감제를 포함할 수 있다. 광증감제로서는, 가와사키 가세이 고교 가부시키가이샤제의 상품명 「UVS-581」, 9,10-디에톡시안트라센(예를 들어, 가와사키 가세이 고교사제, 상품명 「UVS-1101」) 등을 들 수 있다. 상기 광증감제의 기타의 예로서는, 9,10-디부톡시안트라센(예를 들어, 가와사키 가세이 고교사제, 상품명 「UVS-1331」), 2-이소프로필티옥산톤, 벤조페논, 티옥산톤 유도체, 4,4'-비스(디메틸아미노)벤조페논 등을 들 수 있다. 티옥산톤 유도체로서는, 예를 들어 에톡시카르보닐티옥산톤, 이소프로필티옥산톤 등을 들 수 있다.In one embodiment, the active energy ray-curable pressure-sensitive adhesive may contain a photosensitizer. As a photosensitizer, Kawasaki Kasei Kogyo Co., Ltd. brand name "UVS-581", 9, 10- diethoxy anthracene (for example, Kawasaki Kasei Kogyo Co., Ltd. make, brand name "UVS-1101"), etc. are mentioned. Other examples of the photosensitizer include 9,10-dibutoxyanthracene (for example, manufactured by Kawasaki Chemical Industries, Ltd., trade name "UVS-1331"), 2-isopropylthioxanthone, benzophenone, thioxanthone derivatives, 4,4'-bis (dimethylamino) benzophenone, and the like. As a thioxanthone derivative, ethoxycarbonyl thioxanthone, isopropyl thioxanthone, etc. are mentioned, for example.
상기 광증감제의 함유 비율은, 베이스 폴리머 100중량부에 대하여, 바람직하게는 0.01중량부 내지 2중량부이고, 보다 바람직하게는 0.5중량부 내지 2중량부이다.The content of the photosensitizer is preferably 0.01 part by weight to 2 parts by weight, more preferably 0.5 part by weight to 2 parts by weight, based on 100 parts by weight of the base polymer.
바람직하게는, 상기 활성 에너지선 경화형 점착제는, 가교제를 포함한다. 가교제로서는, 예를 들어 이소시아네이트계 가교제, 에폭시계 가교제, 옥사졸린계 가교제, 아지리딘계 가교제, 멜라민계 가교제, 과산화물계 가교제, 요소계 가교제, 금속 알콕시드계 가교제, 금속 킬레이트계 가교제, 금속염계 가교제, 카르보디이미드계 가교제, 아민계 가교제 등을 들 수 있다.Preferably, the active energy ray-curable pressure-sensitive adhesive contains a crosslinking agent. Examples of the crosslinking agent include isocyanate crosslinking agents, epoxy crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, urea crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents, carbodiimide crosslinking agents, and amine crosslinking agents.
상기 가교제의 함유 비율은, 점착제의 베이스 폴리머 100중량부에 대하여, 바람직하게는 0.5중량부 내지 10중량부이고, 보다 바람직하게는 1중량부 내지 8중량부이다.The content of the crosslinking agent is preferably 0.5 parts by weight to 10 parts by weight, more preferably 1 part by weight to 8 parts by weight, based on 100 parts by weight of the base polymer of the pressure-sensitive adhesive.
하나의 실시 형태에 있어서는, 이소시아네이트계 가교제가 바람직하게 사용된다. 이소시아네이트계 가교제는, 다종의 관능기와 반응할 수 있다는 점에서 바람직하다. 상기 이소시아네이트계 가교제의 구체예로서는, 부틸렌디이소시아네이트, 헥사메틸렌디이소시아네이트 등의 저급 지방족 폴리이소시아네이트류; 시클로펜틸렌디이소시아네이트, 시클로헥실렌디이소시아네이트, 이소포론디이소시아네이트 등의 지환족 이소시아네이트류; 2,4-톨릴렌디이소시아네이트, 4,4'-디페닐메탄디이소시아네이트, 크실릴렌디이소시아네이트 등의 방향족 이소시아네이트류; 트리메틸올프로판/톨릴렌디이소시아네이트 3량체 부가물(도소사제, 상품명 「코로네이트 L」), 트리메틸올프로판/헥사메틸렌디이소시아네이트 3량체 부가물(도소사제, 상품명 「코로네이트 HL」), 헥사메틸렌디이소시아네이트의 이소시아누레이트체 (도소사제, 상품명 「코로네이트 HX」) 등의 이소시아네이트 부가물; 등을 들 수 있다. 바람직하게는, 이소시아네이트기를 3개 이상 갖는 가교제가 사용된다.In one embodiment, an isocyanate-based crosslinking agent is preferably used. An isocyanate-based crosslinking agent is preferable in that it can react with a variety of functional groups. Specific examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, and isophorone diisocyanate; aromatic isocyanates such as 2,4-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate; Isocyanate adducts such as trimethylolpropane/tolylene diisocyanate trimer adduct (trade name “Coronate L”, manufactured by Tosoh Corporation), trimethylolpropane/hexamethylene diisocyanate trimer adduct (trade name “Coronate HL”, manufactured by Tosoh Corporation), and isocyanurate of hexamethylene diisocyanate (trade name “Coronate HX”, manufactured by Tosoh Corporation); etc. can be mentioned. Preferably, a crosslinking agent having three or more isocyanate groups is used.
활성 에너지선 경화형 점착제는, 필요에 따라, 임의의 적절한 첨가제를 더 포함할 수 있다. 첨가제로서는, 예를 들어 활성 에너지선 중합 촉진제, 라디칼 포착제, 커플링제(예를 들어, 실란 커플링제), 점착 부여제, 가소제(예를 들어, 트리멜리트산에스테르계 가소제, 피로멜리트산에스테르계 가소제 등), 안료, 염료, 충전제, 노화 방지제, 도전재, 대전 방지제, 광안정제, 박리 조정제, 연화제, 계면 활성제, 난연제, 산화 방지제, 입자, 자외선 흡수제 등을 들 수 있다.The active energy ray-curable pressure-sensitive adhesive may further contain any appropriate additives, if necessary. Examples of additives include active energy ray polymerization accelerators, radical scavengers, coupling agents (eg, silane coupling agents), tackifiers, plasticizers (eg, trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers, etc.), pigments, dyes, fillers, anti-aging agents, conductive materials, antistatic agents, light stabilizers, peeling regulators, softeners, surfactants, flame retardants, antioxidants, particles, ultraviolet absorbers, etc. can be heard
(광중합 개시제)(photopolymerization initiator)
광중합 개시제로서는, 임의의 적절한 개시제를 사용할 수 있다. 광중합 개시제로서는, 예를 들어 4-(2-히드록시에톡시)페닐(2-히드록시-2-프로필)케톤, α-히드록시-α, α'-디메틸아세토페논, 2-메틸-2-히드록시프로피오페논, 1-히드록시시클로헥실페닐케톤 등의 α-케톨계 화합물; 메톡시아세토페논, 2,2-디메톡시-2-페닐아세토페논, 2,2-디에톡시아세토페논, 2-메틸-1-[4-(메틸티오)-페닐]-2-모르폴리노프로판-1 등의 아세토페논계 화합물; 벤조인에틸에테르, 벤조인이소프로필에테르, 아니소인메틸에테르 등의 벤조인에테르계 화합물; 벤질디메틸케탈 등의 케탈계 화합물; 2-나프탈렌술포닐클로라이드 등의 방향족 술포닐클로라이드계 화합물; 1-페논-1,1-프로판디온-2-(o-에톡시카르보닐)옥심 등의 광 활성 옥심계 화합물; 벤조페논, 벤조일벤조산, 3,3'-디메틸-4-메톡시벤조페논 등의 벤조페논계 화합물; 티옥산톤, 2-클로로티옥산톤, 2-메틸티옥산톤, 2,4-디메틸티옥산톤, 이소프로필티옥산톤, 2,4-디클로로티옥산톤, 2,4-디에틸티옥산톤, 2,4-디이소프로필티옥산톤 등의 티옥산톤계 화합물; 캄포퀴논; 할로겐화 케톤; 아실포스핀옥사이드; 아실 포스포네이트 등을 들 수 있다. 광중합 개시제의 사용량은, 임의의 적절한 양으로 설정될 수 있다.As the photopolymerization initiator, any suitable initiator can be used. Examples of the photopolymerization initiator include α-ketol compounds such as 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α′-dimethylacetophenone, 2-methyl-2-hydroxypropiophenone, and 1-hydroxycyclohexylphenyl ketone; acetophenone-based compounds such as methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, and 2-methyl-1-[4-(methylthio)-phenyl]-2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether; ketal-based compounds such as benzyldimethyl ketal; aromatic sulfonyl chloride-based compounds such as 2-naphthalenesulfonyl chloride; photoactive oxime-based compounds such as 1-phenone-1,1-propanedione-2-(o-ethoxycarbonyl)oxime; benzophenone compounds such as benzophenone, benzoylbenzoic acid, and 3,3'-dimethyl-4-methoxybenzophenone; thioxanthone-based compounds such as thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4-diethylthioxanthone, and 2,4-diisopropylthioxanthone; camphorquinone; halogenated ketones; acyl phosphine oxide; Acyl phosphonate etc. are mentioned. The usage amount of the photopolymerization initiator can be set to any suitable amount.
하나의 실시 형태에 있어서는, 400nm 이하(바람직하게는 380nm 이하, 보다 바람직하게는 340nm 이하)의 범위에 최대 흡수 파장을 갖는 광중합 개시제가 사용된다.In one embodiment, a photopolymerization initiator having a maximum absorption wavelength in the range of 400 nm or less (preferably 380 nm or less, more preferably 340 nm or less) is used.
상기 광중합 개시제의 사용량은, 임의의 적절한 양으로 설정될 수 있다.The usage amount of the photopolymerization initiator may be set to any suitable amount.
상기 광중합 개시제로서, 시판품을 사용해도 된다. 예를 들어, 400nm 이하의 범위에 최대 흡수 파장을 갖는 광중합 개시제로서, BASF사제의 상품명 「이르가큐어 127」, 「이르가큐어 369」, 「이르가큐어 369E」, 「이르가큐어 379」, 「이르가큐어 379EG」, 「이르가큐어 819」, 「이르가큐어 TOP」, 「이르가큐어 784」, 「이르가큐어 OXE01」 등을 들 수 있다.As said photoinitiator, you may use a commercial item. For example, as a photopolymerization initiator having a maximum absorption wavelength in the range of 400 nm or less, BASF's trade names "Irgacure 127", "Irgacure 369", "Irgacure 369E", "Irgacure 379", "Irgacure 379EG", "Irgacure 819", "Irgacure TOP", "Irgacure 7" 84”, “Irgacure OXE01” and the like.
C. 점착제층C. Adhesive layer
상기 점착제층의 두께는, 바람직하게는 30㎛ 이하이고, 보다 바람직하게는 20㎛ 이하이고, 더욱 바람직하게는 10㎛ 이하이다. 이러한 범위이면, 상기 효과가 현저해진다. 점착제층 두께의 하한은, 예를 들어 1㎛(바람직하게는 0.5㎛)이다.The thickness of the pressure-sensitive adhesive layer is preferably 30 μm or less, more preferably 20 μm or less, still more preferably 10 μm or less. In such a range, the said effect becomes remarkable. The lower limit of the thickness of the pressure-sensitive adhesive layer is, for example, 1 μm (preferably 0.5 μm).
상기 점착제층의 23℃에서의 압입 탄성률 I는, 바람직하게는 0.05MPa 내지 20MPa이고, 보다 바람직하게는 0.08MPa 내지 10MPa이고, 더욱 바람직하게는 0.08MPa 내지 5MPa이다. 이러한 범위이면, 레이저 광 조사에 의한 각 층의 변형을 적성화할 수 있고, 또한 레이저 광 조사에 의한 박리성이 우수한 점착 시트를 얻을 수 있다. 이러한 점착 시트는, 좁은 범위에 있어서 확실한 박리성을 실현할 수 있다.The indentation modulus I at 23°C of the pressure-sensitive adhesive layer is preferably 0.05 MPa to 20 MPa, more preferably 0.08 MPa to 10 MPa, still more preferably 0.08 MPa to 5 MPa. Within this range, deformation of each layer due to laser light irradiation can be made suitable, and an adhesive sheet having excellent peelability by laser light irradiation can be obtained. Such an adhesive sheet can realize reliable peelability in a narrow range.
상기 점착제층의 파장 248nm의 광투과율은, 바람직하게는 50% 이하이고, 보다 바람직하게는 30% 이하이고, 더욱 바람직하게는 10% 이하이고, 특히 바람직하게는 5% 이하이다. 상기 점착제층의 파장 248nm의 광투과율은, 낮을수록 바람직하지만, 그 하한은, 예를 들어 0.5%(바람직하게는 0%)이다.The light transmittance of the pressure-sensitive adhesive layer at a wavelength of 248 nm is preferably 50% or less, more preferably 30% or less, still more preferably 10% or less, and particularly preferably 5% or less. The light transmittance of the pressure-sensitive adhesive layer at a wavelength of 248 nm is preferably as low as possible, but the lower limit thereof is, for example, 0.5% (preferably 0%).
상기 점착제층의 파장 365nm의 광투과율은, 바람직하게는 50% 이상이고, 보다 바람직하게는 60% 이상이고, 더욱 바람직하게는 70% 이상이다. 상기 점착제층의 파장 365nm의 광투과율은 높을수록 바람직하지만, 그 상한은, 예를 들어 95%(바람직하게는 100%)이다.The light transmittance of the pressure-sensitive adhesive layer at a wavelength of 365 nm is preferably 50% or more, more preferably 60% or more, still more preferably 70% or more. The light transmittance of the pressure-sensitive adhesive layer at a wavelength of 365 nm is preferably higher, but the upper limit thereof is, for example, 95% (preferably 100%).
상기 점착제층의 점착 시트의 헤이즈값은, 바람직하게는 70% 이하이고, 보다 바람직하게는 65% 이하이다. 하나의 실시 형태에 있어서는, 상기 점착제층의 헤이즈값은 20% 이하이다. 점착제층의 헤이즈값은 낮을수록 바람직하지만, 그 하한은, 예를 들어 0.1%이다.The haze value of the pressure-sensitive adhesive sheet of the pressure-sensitive adhesive layer is preferably 70% or less, and more preferably 65% or less. In one embodiment, the haze value of the said adhesive layer is 20 % or less. Although the haze value of an adhesive layer is so preferable that it is low, the lower limit is 0.1 %, for example.
상기 점착제층은, 임의의 적절한 점착제를 포함한다. 당해 점착제로서는, 본 발명의 효과가 얻어지는 한, 임의의 적절한 점착제가 사용될 수 있다. 상기 점착제로서는, 예를 들어 감압 점착제가 사용될 수 있다.The pressure-sensitive adhesive layer contains any suitable pressure-sensitive adhesive. As the pressure-sensitive adhesive, any appropriate pressure-sensitive adhesive may be used as long as the effects of the present invention are obtained. As the pressure-sensitive adhesive, for example, a pressure-sensitive adhesive may be used.
(감압 점착제)(pressure sensitive adhesive)
감압 점착제로서는, 예를 들어 아크릴계 점착제, 고무계 점착제, 비닐알킬에테르계 점착제, 실리콘계 점착제, 폴리에스테르계 점착제, 폴리아미드계 점착제, 우레탄계 점착제, 스티렌-디엔 블록 공중합체계 점착제 등을 들 수 있다. 그 중에서도 바람직하게는, 아크릴계 점착제 또는 고무계 점착제이고, 보다 바람직하게는 아크릴계 점착제이다. 또한, 상기 점착제는, 단독으로 또는 2종 이상 조합하여 사용해도 된다. 하나의 실시 형태에 있어서는, 자외선 흡수의 관점에서, 방향환 및/또는 이중 결합을 갖는 베이스 폴리머를 포함하는 점착제가 사용된다. 이러한 점에서도, 아크릴계 점착제는 바람직하게 사용될 수 있다.Examples of the pressure-sensitive adhesive include acrylic adhesives, rubber-based adhesives, vinylalkyl ether-based adhesives, silicone-based adhesives, polyester-based adhesives, polyamide-based adhesives, urethane-based adhesives, and styrene-diene block copolymer-based adhesives. Among them, acrylic adhesives or rubber-based adhesives are preferred, and acrylic adhesives are more preferred. Moreover, you may use the said adhesive individually or in combination of 2 or more types. In one embodiment, from the viewpoint of UV absorption, an adhesive containing a base polymer having an aromatic ring and/or a double bond is used. Also from this point of view, an acrylic pressure sensitive adhesive can be preferably used.
상기 아크릴계 점착제로서는, 예를 들어 (메트)아크릴산알킬에스테르의 1종 또는 2종 이상을 단량체 성분으로서 사용한 아크릴계 폴리머(호모폴리머 또는 코폴리머)를 베이스 폴리머로 하는 아크릴계 점착제 등을 들 수 있다. (메트)아크릴산알킬에스테르의 구체예로서는, (메트)아크릴산메틸, (메트)아크릴산에틸, (메트)아크릴산프로필, (메트)아크릴산이소프로필, (메트)아크릴산부틸, (메트)아크릴산이소부틸, (메트)아크릴산s-부틸, (메트)아크릴산t-부틸, (메트)아크릴산펜틸, (메트)아크릴산헥실, (메트)아크릴산헵틸, (메트)아크릴산옥틸, (메트)아크릴산2-에틸헥실, (메트)아크릴산이소옥틸, (메트)아크릴산노닐, (메트)아크릴산이소노닐, (메트)아크릴산데실, (메트)아크릴산이소데실, (메트)아크릴산운데실, (메트)아크릴산도데실, (메트)아크릴산트리데실, (메트)아크릴산테트라데실, (메트)아크릴산펜타데실, (메트)아크릴산헥사데실, (메트)아크릴산헵타데실, (메트)아크릴산옥타데실, (메트)아크릴산노나데실, (메트)아크릴산에이코실 등의 (메트)아크릴산 C1-20 알킬에스테르를 들 수 있다. 그 중에서도, 탄소수가 4 내지 18의 직쇄상 혹은 분지상의 알킬기를 갖는 (메트)아크릴산알킬에스테르가 바람직하게 사용될 수 있다.Examples of the acrylic pressure-sensitive adhesive include acrylic pressure-sensitive adhesives having, as a base polymer, an acrylic polymer (homopolymer or copolymer) using one or two or more (meth)acrylic acid alkyl esters as monomer components. Specific examples of the alkyl (meth)acrylate include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, butyl (meth)acrylate, isobutyl (meth)acrylate, s-butyl (meth)acrylate, t-butyl (meth)acrylate, pentyl (meth)acrylate, hexyl (meth)acrylate, heptyl (meth)acrylate, octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, (meth)acrylate. Isooctyl acrylate, (meth)nonyl acrylate, (meth)isononyl acrylate, (meth)decyl acrylate, isodecyl (meth)acrylate, undecyl (meth)acrylate, dodecyl (meth)acrylate, tridecyl (meth)acrylate, tetradecyl (meth)acrylate, pentadecyl (meth)acrylate, hexadecyl (meth)acrylate, heptadecyl (meth)acrylate, octadecyl (meth)acrylate, (meth) and (meth)acrylic acid C1-20 alkyl esters such as nonadecyl acrylate and eicosyl (meth)acrylate. Among them, (meth)acrylic acid alkyl esters having a linear or branched alkyl group having 4 to 18 carbon atoms can be preferably used.
상기 아크릴계 폴리머는, 응집력, 내열성, 가교성 등의 개질을 목적으로 하여, 필요에 따라, 상기 (메트)아크릴산알킬에스테르와 공중합 가능한 다른 단량체 성분에 대응하는 단위를 포함하고 있어도 된다. 이러한 단량체 성분으로서, 예를 들어 아크릴산, 메타크릴산, 카르복시에틸아크릴레이트, 카르복시펜틸아크릴레이트, 이타콘산, 말레산, 푸마르산, 크로톤산 등의 카르복실기 함유 모노머; 무수 말레산, 무수 이코탄산 등의 산 무수물 모노머; (메트)아크릴산히드록시에틸, (메트)아크릴산히드록시프로필, (메트)아크릴산히드록시부틸, (메트)아크릴산히드록시헥실, (메트)아크릴산히드록시옥틸, (메트)아크릴산히드록시데실, (메트)아크릴산히드록시라우릴, (4-히드록시메틸시클로헥실)메틸메타크릴레이트 등의 히드록실기 함유 모노머; 스티렌술폰산, 알릴술폰산, 2-(메트)아크릴아미드-2-메틸프로판술폰산, (메트)아크릴아미드프로판술폰산, 술포프로필(메트)아크릴레이트, (메트)아크릴로일옥시나프탈렌술폰산 등의 술폰산기 함유 모노머; (메트)아크릴아미드, N,N-디메틸(메트)아크릴아미드, N-부틸(메트)아크릴아미드, N-메틸올(메트)아크릴아미드, N-메틸올 프로판(메트)아크릴아미드 등의 (N-치환)아미드계 모노머; (메트)아크릴산아미노에틸, (메트)아크릴산 N,N-디메틸아미노에틸, (메트)아크릴산t-부틸아미노에틸 등의 (메트)아크릴산아미노알킬계 모노머; (메트)아크릴산메톡시에틸, (메트)아크릴산에톡시에틸 등의 (메트)아크릴산알콕시알킬계 모노머; N-시클로헥실말레이미드, N-이소프로필말레이미드, N-라우릴말레이미드, N-페닐말레이미드 등의 말레이미드계 모노머; N-메틸이타콘이미드, N-에틸이타콘이미드, N-부틸이타콘이미드, N-옥틸이타콘이미드, N-2-에틸헥실이타콘이미드, N-시클로헥실이타콘이미드, N-라우릴이타콘이미드 등의 이타콘이미드계 모노머; N-(메트)아크릴로일옥시메틸렌숙신이미드, N-(메트)아크릴로일-6-옥시헥사메틸렌숙신이미드, N-(메트)아크릴로일-8-옥시옥타메틸렌숙신이미드 등의 숙신이미드계 모노머; 아세트산비닐, 프로피온산비닐, N-비닐피롤리돈, 메틸비닐피롤리돈, 비닐피리딘, 비닐피페리돈, 비닐피리미딘, 비닐피페라진, 비닐피라진, 비닐피롤, 비닐이미다졸, 비닐옥사졸, 비닐모르폴린, N-비닐카르복실산아미드류, 스티렌, α-메틸스티렌, N-비닐카프로락탐 등의 비닐계 모노머; 아크릴로니트릴, 메타크릴로니트릴 등의 시아노아크릴레이트 모노머; (메트)아크릴산글리시딜 등의 에폭시기 함유 아크릴계 모노머; (메트)아크릴산폴리에틸렌글리콜, (메트)아크릴산폴리프로필렌글리콜, (메트)아크릴산메톡시에틸렌글리콜, (메트)아크릴산메톡시폴리프로필렌글리콜 등의 글리콜계 아크릴에스테르 모노머; (메트)아크릴산테트라하이드로푸르푸릴, 불소 (메트)아크릴레이트, 실리콘 (메트)아크릴레이트 등의 복소환, 할로겐 원자, 규소 원자 등을 갖는 아크릴산에스테르계 모노머; 헥산디올디(메트)아크릴레이트, (폴리)에틸렌글리콜디(메트)아크릴레이트, (폴리)프로필렌글리콜디(메트)아크릴레이트, 네오펜틸글리콜디(메트)아크릴레이트, 펜타에리트리톨디(메트)아크릴레이트, 트리메틸올프로판트리(메트)아크릴레이트, 펜타에리트리톨트리(메트)아크릴레이트, 디펜타에리트리톨헥사(메트)아크릴레이트, 에폭시아크릴레이트, 폴리에스테르아크릴레이트, 우레탄아크릴레이트 등의 다관능 모노머; 이소프렌, 부타디엔, 이소부틸렌 등의 올레핀계 모노머; 비닐에테르 등의 비닐에테르계 모노머 등을 들 수 있다. 이들의 단량체 성분은, 단독으로 또는 2종 이상 조합하여 사용해도 된다.The acrylic polymer may contain units corresponding to other monomeric components copolymerizable with the alkyl (meth)acrylic acid ester, if necessary, for the purpose of modification such as cohesive force, heat resistance, and crosslinkability. Examples of such monomer components include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; acid anhydride monomers such as maleic anhydride and icotanoic acid anhydride; Hydroxyl group-containing monomers such as hydroxyethyl (meth)acrylate, hydroxypropyl (meth)acrylate, hydroxybutyl (meth)acrylate, hydroxyhexyl (meth)acrylate, hydroxyoctyl (meth)acrylate, hydroxydecyl (meth)acrylate, hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methylmethacrylate; sulfonic acid group-containing monomers such as styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamide-2-methylpropanesulfonic acid, (meth)acrylamidepropanesulfonic acid, sulfopropyl (meth)acrylate, and (meth)acryloyloxynaphthalenesulfonic acid; (N-substituted) amide monomers such as (meth)acrylamide, N,N-dimethyl(meth)acrylamide, N-butyl(meth)acrylamide, N-methylol(meth)acrylamide, and N-methylol propane(meth)acrylamide; aminoalkyl (meth)acrylate monomers such as aminoethyl (meth)acrylate, N,N-dimethylaminoethyl (meth)acrylate, and t-butylaminoethyl (meth)acrylate; alkoxyalkyl (meth)acrylate monomers such as methoxyethyl (meth)acrylate and ethoxyethyl (meth)acrylate; maleimide monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide, and N-phenylmaleimide; itaconimide monomers such as N-methyl itaconimide, N-ethyl itaconimide, N-butyl itaconimide, N-octyl itaconimide, N-2-ethylhexyl itaconimide, N-cyclohexyl itaconimide, and N-lauryl itaconimide; succinimide monomers such as N-(meth)acryloyloxymethylenesuccinimide, N-(meth)acryloyl-6-oxyhexamethylenesuccinimide, and N-(meth)acryloyl-8-oxyoctamethylenesuccinimide; vinyl monomers such as vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methylvinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholine, N-vinylcarboxylic acid amides, styrene, α-methylstyrene, and N-vinylcaprolactam; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy group-containing acrylic monomers such as glycidyl (meth)acrylate; glycol-based acrylic ester monomers such as polyethylene glycol (meth)acrylate, polypropylene glycol (meth)acrylate, methoxyethylene glycol (meth)acrylate, and methoxypolypropylene glycol (meth)acrylate; acrylic acid ester monomers having heterocycles such as (meth)acrylate tetrahydrofurfuryl, fluorine (meth)acrylate, and silicon (meth)acrylate, halogen atoms, silicon atoms, and the like; Hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy acrylate, polyester acrylate, urethane acrylate, etc. mer; olefinic monomers such as isoprene, butadiene, and isobutylene; Vinyl ether type monomers, such as vinyl ether, etc. are mentioned. You may use these monomer components individually or in combination of 2 or more types.
상기 고무계 점착제로서는, 예를 들어 천연 고무; 폴리이소프렌 고무, 스티렌·부타디엔(SB) 고무, 스티렌·이소프렌(SI) 고무, 스티렌·이소프렌·스티렌 블록 공중합체(SIS) 고무, 스티렌·부타디엔·스티렌 블록 공중합체(SBS) 고무, 스티렌·에틸렌·부틸렌·스티렌 블록 공중합체(SEBS) 고무, 스티렌·에틸렌·프로필렌·스티렌 블록 공중합체(SEPS) 고무, 스티렌·에틸렌·프로필렌 블록 공중합체(SEP) 고무, 재생 고무, 부틸 고무, 폴리이소부틸렌, 이들의 변성체 등의 합성 고무; 등을 베이스 폴리머로 하는 고무계 점착제를 들 수 있다.Examples of the rubber-based adhesive include natural rubber; Polyisoprene rubber, styrene-butadiene (SB) rubber, styrene-isoprene (SI) rubber, styrene-isoprene-styrene block copolymer (SIS) rubber, styrene-butadiene-styrene block copolymer (SBS) rubber, styrene-ethylene-butylene-styrene block copolymer (SEBS) rubber, styrene-ethylene-propylene-styrene block copolymer (SEPS) rubber, styrene-ethylene-propylene block copolymer (SEP) Synthetic rubbers such as rubber, recycled rubber, butyl rubber, polyisobutylene, and modified products thereof; The rubber type adhesive which uses etc. as a base polymer is mentioned.
상기 감압 점착제는, 필요에 따라, 임의의 적절한 첨가제를 포함할 수 있다. 해당 첨가제로서는, 예를 들어 가교제, 점착 부여제(예를 들어, 로진계 점착 부여제, 테르펜계 점착 부여제, 탄화수소계 점착 부여제 등), 가소제(예를 들어, 트리멜리트산에스테르계 가소제, 피로멜리트산에스테르계 가소제), 안료, 염료, 노화 방지제, 도전재, 대전 방지제, 광안정제, 박리 조정제, 연화제, 계면 활성제, 난연제, 산화 방지제, 자외선 흡수제, 입자 등을 들 수 있다.The pressure-sensitive adhesive may contain any suitable additive, if necessary. Examples of the additives include crosslinking agents, tackifiers (eg, rosin-based tackifiers, terpene-based tackifiers, hydrocarbon-based tackifiers, etc.), plasticizers (eg, trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers), pigments, dyes, anti-aging agents, conductive materials, antistatic agents, light stabilizers, peeling regulators, softeners, surfactants, flame retardants, antioxidants, ultraviolet absorbers, Particles etc. are mentioned.
상기 가교제로서는, 예를 들어 이소시아네이트계 가교제, 에폭시계 가교제, 멜라민계 가교제, 과산화물계 가교제 외에, 요소계 가교제, 금속 알콕시드계 가교제, 금속 킬레이트계 가교제, 금속염계 가교제, 카르보디이미드계 가교제, 옥사졸린계 가교제, 아지리딘계 가교제, 아민계 가교제 등을 들 수 있다. 그 중에서도 바람직하게는, 이소시아네이트계 가교제 또는 에폭시계 가교제이다. 하나의 실시 형태에 있어서는, 자외선 흡수의 관점에서, 방향환 및/또는 이중 결합을 갖는 가교제(예를 들어, 방향족 이소시아네이트계 가교제)가 사용된다.Examples of the crosslinking agent include isocyanate crosslinking agents, epoxy crosslinking agents, melamine crosslinking agents, peroxide crosslinking agents, urea crosslinking agents, metal alkoxide crosslinking agents, metal chelate crosslinking agents, metal salt crosslinking agents, carbodiimide crosslinking agents, oxazoline crosslinking agents, aziridine crosslinking agents, and amine crosslinking agents. Among them, an isocyanate-based crosslinking agent or an epoxy-based crosslinking agent is preferred. In one embodiment, a crosslinking agent having an aromatic ring and/or a double bond (for example, an aromatic isocyanate-based crosslinking agent) is used from the viewpoint of UV absorption.
상기 이소시아네이트계 가교제의 구체예로서는, 부틸렌디이소시아네이트, 헥사메틸렌디이소시아네이트 등의 저급 지방족 폴리이소시아네이트류; 시클로펜틸렌디이소시아네이트, 시클로헥실렌디이소시아네이트, 이소포론디이소시아네이트 등의 지환족 이소시아네이트류; 2,4-톨릴렌디이소시아네이트, 4,4'-디페닐메탄디이소시아네이트, 크실릴렌디이소시아네이트 등의 방향족 이소시아네이트류; 트리메틸올프로판/톨릴렌디이소시아네이트 3량체 부가물(도소사제, 상품명 「코로네이트 L」), 트리메틸올프로판/헥사메틸렌디이소시아네이트 3량체 부가물(도소사제, 상품명 「코로네이트 HL」), 헥사메틸렌디이소시아네이트의 이소시아누레이트체 (도소사제, 상품명 「코로네이트 HX」) 등의 이소시아네이트 부가물; 등을 들 수 있다. 이소시아네이트계 가교제의 함유량은, 원하는 점착력에 따라, 임의의 적절한 양으로 설정될 수 있고, 베이스 폴리머 100중량부에 대하여, 대표적으로는 0.1중량부 내지 20중량부이고, 보다 바람직하게는 0.5중량부 내지 10중량부이다.Specific examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate, and isophorone diisocyanate; aromatic isocyanates such as 2,4-tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, and xylylene diisocyanate; Isocyanate adducts such as trimethylolpropane/tolylene diisocyanate trimer adduct (trade name “Coronate L”, manufactured by Tosoh Corporation), trimethylolpropane/hexamethylene diisocyanate trimer adduct (trade name “Coronate HL”, manufactured by Tosoh Corporation), and isocyanurate of hexamethylene diisocyanate (trade name “Coronate HX”, manufactured by Tosoh Corporation); etc. can be mentioned. The content of the isocyanate-based crosslinking agent can be set to any suitable amount depending on the desired adhesive force, and is typically 0.1 part by weight to 20 parts by weight, more preferably 0.5 part by weight to 10 parts by weight based on 100 parts by weight of the base polymer. It is 10 parts by weight.
상기 에폭시계 가교제로서는, 예를 들어 N,N,N',N'-테트라글리시딜-m-크실렌디아민,디글리시딜아닐린, 1,3-비스(N,N-글리시딜아미노메틸) 시클로헥산(미쓰비시 가스 가가쿠사제, 상품명 「테트래드 C」), 1,6-헥산디올디글리시딜에테르(교에이샤 가가쿠사제, 상품명 「에폴라이트 1600」), 네오펜틸글리콜디글리시딜에테르(교에이샤 가가쿠사제, 상품명 「에폴라이트 1500NP」), 에틸렌글리콜디글리시딜에테르(교에이샤 가가쿠사제, 상품명 「에폴라이트 40E」), 프로필렌글리콜디글리시딜에테르(교에이샤 가가쿠사제, 상품명 「에폴라이트 70P」), 폴리에틸렌글리콜디글리시딜에테르(닛폰 유시사제, 상품명 「에피올 E-400」), 폴리프로필렌글리콜디글리시딜에테르(닛폰 유시사제, 상품명 「에피올 P-200」), 소르비톨폴리글리시딜에테르(나가세 켐텍스사제, 상품명 「데나콜 EX-611」), 글리세롤폴리글리시딜에테르(나가세 켐텍스사제, 상품명 「데나콜 EX-314」), 펜타에리트리톨폴리글리시딜에테르,폴리글리세롤폴리글리시딜에테르(나가세 켐텍스사제, 상품명 「데나콜 EX-512」), 소르비탄폴리글리시딜에테르, 트리메틸올프로판폴리글리시딜에테르, 아디프산디글리시딜에스테르, o-프탈산디글리시딜에스테르, 트리글리시딜-트리스(2-히드록시에틸)이소시아누레이트, 레조르신디글리시딜에테르, 비스페놀-S-디글리시딜에테르, 분자 내에 에폭시기를 2개 이상 갖는 에폭시계 수지 등을 들 수 있다. 에폭시계 가교제의 함유량은, 원하는 점착력에 따라, 임의의 적절한 양으로 설정될 수 있고, 베이스 폴리머 100중량부에 대하여, 대표적으로는 0.01중량부 내지 10중량부이고, 보다 바람직하게는 0.03중량부 내지 5중량부이다.Examples of the epoxy-based crosslinking agent include N,N,N',N'-tetraglycidyl-m-xylenediamine, diglycidylaniline, 1,3-bis(N,N-glycidylaminomethyl) cyclohexane (manufactured by Mitsubishi Gas Chemical Co., Ltd., trade name "Tetrade C"), 1,6-hexanediol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epol Light 1600"), neopentyl glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolite 1500NP"), ethylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Co., Ltd., trade name "Epolite 40E"), propylene glycol diglycidyl ether (manufactured by Kyoeisha Chemical Corporation, trade name "Epolite 70P"), polyethylene glycol digly Cidyl ether (manufactured by Nippon Yushi Co., Ltd., trade name "Epiol E-400"), polypropylene glycol diglycidyl ether (manufactured by Nippon Yushi Co., Ltd., trade name "Epiol P-200"), sorbitol polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name "Denacol EX-611"), glycerol polyglycidyl ether (manufactured by Nagase Chemtex Corporation, trade name "Denacol EX-314"), Pentaerythritol polyglycidyl ether, polyglycerol polyglycidyl ether (manufactured by Nagase ChemteX Co., Ltd., trade name "Denacol EX-512"), sorbitan polyglycidyl ether, trimethylolpropane polyglycidyl ether, adipic acid diglycidyl ester, o-phthalic acid diglycidyl ester, triglycidyl-tris (2-hydroxyethyl) isocyanurate, resorcin diglycidyl ether, bisphenol -S-diglycidyl ether, an epoxy resin having two or more epoxy groups in the molecule, and the like. The content of the epoxy-based crosslinking agent can be set to any appropriate amount depending on the desired adhesive strength, and is typically 0.01 part by weight to 10 parts by weight, more preferably 0.03 part by weight to 5 parts by weight, based on 100 parts by weight of the base polymer.
상기 점착 부여제로서, 예를 들어 로진계 수지(예를 들어, 로진 에스테르 수지 등), 테르펜계 수지(예를 들어, 테르펜페놀 공중합체(테르펜 변성 페놀 수지), 수소 첨가 테르펜 수지 등), 쿠마론인덴계 수지, 지환족 포화 탄화수소계 수지, 석유계 수지(예를 들어, 지방족/방향족 공중합계 석유 수지, 방향족계 석유 수지 등의 탄화수소계 석유 수지 등), 페놀계 수지 등을 들 수 있다. 하나의 실시 형태에 있어서는, 자외선 흡수의 관점에서, 방향환 및/또는 이중 결합을 갖는 가교제(예를 들어, 로진계 수지)가 사용된다. 점착 부여제의 함유량은, 원하는 점착력에 따라, 임의의 적절한 양으로 설정될 수 있고, 베이스 폴리머 100중량부에 대하여, 대표적으로는 1중량부 내지 50중량부이고, 보다 바람직하게는 10중량부 내지 30중량부이다.As the adhesive subsidiary, for example, rosin resin (eg, rosin ester resin, etc.), terpene -based resin (eg, terpenphenols (terpene degeneration resin), hydrogen additive terpen resin, etc.) Hydrocarbon -based petroleum resins such as petroleum resin and aromatic petroleum resin) and phenolic resin are mentioned. In one embodiment, a crosslinking agent (for example, a rosin-based resin) having an aromatic ring and/or a double bond is used from the viewpoint of ultraviolet absorption. The content of the tackifier can be set to any suitable amount depending on the desired adhesive strength, and is typically 1 part by weight to 50 parts by weight, more preferably 10 parts by weight to 30 parts by weight, based on 100 parts by weight of the base polymer.
D. 기재D. Description
상기 기재는, 임의의 적절한 수지로 구성될 수 있다. 해당 수지로서는, 예를 들어 폴리에틸렌계 수지, 폴리프로필렌계 수지, 폴리부텐계 수지, 폴리메틸펜텐계 수지 등의 폴리올레핀계 수지, 폴리우레탄계 수지, 폴리에스테르계 수지, 폴리이미드계 수지, 폴리에테르케톤계 수지, 폴리스티렌계 수지, 폴리염화비닐계 수지, 폴리염화비닐리덴계 수지, 불소계 수지, 실리콘계 수지, 셀룰로오스계 수지, 아이오노머 수지 등을 들 수 있다. 그 중에서도 바람직하게는 폴리올레핀계 수지이다.The substrate may be made of any suitable resin. Examples of the resin include polyolefin resins such as polyethylene resins, polypropylene resins, polybutene resins, and polymethylpentene resins, polyurethane resins, polyester resins, polyimide resins, polyether ketone resins, polystyrene resins, polyvinyl chloride resins, polyvinylidene chloride resins, fluorine resins, silicone resins, cellulose resins, and ionomer resins. Among them, polyolefin-based resins are preferred.
하나의 실시 형태에 있어서는, 상기 기재는, 폴리에틸렌테레프탈레이트계 수지, 폴리이미드계 수지, 폴리스티렌계 수지, 폴리카르보네이트계 수지로 이루어지는 군에서 선택되는 적어도 1종으로 구성된다. 이들 수지로 구성된 기재는, 파장 248nm의 광투과율이 낮은 점에서 유리하다.In one embodiment, the substrate is composed of at least one selected from the group consisting of polyethylene terephthalate-based resins, polyimide-based resins, polystyrene-based resins, and polycarbonate-based resins. A base material composed of these resins is advantageous in that the light transmittance at a wavelength of 248 nm is low.
상기 기재의 두께는, 바람직하게는 2㎛ 내지 300㎛이고, 보다 바람직하게는 2㎛ 내지 100㎛이고, 더욱 바람직하게는 2㎛ 내지 50㎛이다. 하나의 실시 형태에 있어서는, 상기 기재의 두께는, 50㎛ 미만이고, 보다 바람직하게는 30㎛ 이하이고, 더욱 바람직하게는 20㎛ 이하이고, 특히 바람직하게는 10㎛ 이하이고, 가장 바람직하게는 5㎛ 이하이다. 기재의 두께를 얇게 함으로써, 점착제층에 생긴 변형이 전사층으로 전파되기 쉬워, 박리성이 우수한 점착 시트를 얻을 수 있다.The thickness of the substrate is preferably 2 μm to 300 μm, more preferably 2 μm to 100 μm, still more preferably 2 μm to 50 μm. In one embodiment, the substrate has a thickness of less than 50 μm, more preferably 30 μm or less, still more preferably 20 μm or less, particularly preferably 10 μm or less, and most preferably 5 μm or less. By reducing the thickness of the base material, the strain generated in the pressure-sensitive adhesive layer is easily propagated to the transfer layer, and a pressure-sensitive adhesive sheet having excellent peelability can be obtained.
상기 기재의 23℃에서의 압입 탄성률은, 바람직하게는 5000MPa 이하이고, 보다 바람직하게는 3000MPa 이하이고, 더욱 바람직하게는 1000MPa 이하이다. 이러한 범위이면, 점착제층에 생긴 변형을 흡수하기 어렵고, 전사층에 변형을 전파하기 쉬운 기재로 할 수 있다. 기재의 23℃에서의 압입 탄성률의 하한은, 바람직하게는 1MPa이고, 보다 바람직하게는 5MPa이고, 더욱 바람직하게는 10MPa이다. 이러한 범위이면, 적당한 강성을 갖고, 핸들링성이 우수한 점착 시트를 얻을 수 있다.The indentation modulus of the substrate at 23°C is preferably 5000 MPa or less, more preferably 3000 MPa or less, still more preferably 1000 MPa or less. If it is within this range, it is possible to make a base material that does not easily absorb the strain generated in the pressure-sensitive adhesive layer and easily propagates the strain to the transfer layer. The lower limit of the indentation modulus of the base material at 23°C is preferably 1 MPa, more preferably 5 MPa, still more preferably 10 MPa. Within this range, an adhesive sheet having appropriate rigidity and excellent handling properties can be obtained.
기재의 전광선 투과율은, 바람직하게는 70% 이상이고, 보다 바람직하게는 80% 이상이고, 더욱 바람직하게는 90% 이상이고, 특히 바람직하게는 95% 이상이다. 기재의 전광선 투과율의 상한은, 예를 들어 98%(바람직하게는 99%)이다.The total light transmittance of the substrate is preferably 70% or more, more preferably 80% or more, still more preferably 90% or more, and particularly preferably 95% or more. The upper limit of the total light transmittance of the substrate is, for example, 98% (preferably 99%).
E. 점착 시트의 제조 방법E. Manufacturing method of adhesive sheet
상기 점착 시트는, 임의의 적절한 방법에 의해 제조될 수 있다. 점착 시트는, 예를 들어 기재 또는 박리 라이너 상에, 점착제층 및 전사층을 형성하는 상기 점착제를 각각 도공하여 얻어질 수 있다. 도공 방법으로서는, 바 코터 도공, 에어 나이프 도공, 그라비아 도공, 그라비아 리버스 도공, 리버스 롤 도공, 립 도공, 다이 도공, 딥 도공, 오프셋 인쇄, 플렉소 인쇄, 스크린 인쇄 등 다양한 방법을 채용할 수 있다. 또한, 박리 라이너에 점착제층을 형성하고, 다른 박리 라이너에 전사층을 형성하고, 이들을 접합하거나, 혹은, 이들을 기재에 접합함으로써, 점착 시트를 형성해도 된다.The pressure-sensitive adhesive sheet may be manufactured by any suitable method. The pressure-sensitive adhesive sheet can be obtained, for example, by applying the pressure-sensitive adhesive forming the pressure-sensitive adhesive layer and the transfer layer onto a substrate or a release liner, respectively. As the coating method, various methods such as bar coater coating, air knife coating, gravure coating, gravure reverse coating, reverse roll coating, lip coating, die coating, dip coating, offset printing, flexographic printing, and screen printing can be employed. Alternatively, the pressure-sensitive adhesive sheet may be formed by forming a pressure-sensitive adhesive layer on a release liner, forming a transfer layer on another release liner, bonding them together, or bonding them to a base material.
F. 점착 시트의 사용 방법F. How to use the adhesive sheet
본 발명의 점착 시트는, 임의의 적절한 피가공 부재(예를 들어, 전자 부품)를 가공 및/또는 이송할 때, 당해 피가공 부재를 임시 고정할 때 사용될 수 있다. 본 발명의 점착 시트의 사용 방법으로서는, 예를 들어, (i) 점착제층을 지지체에 접착하고, (ii) 피착 시트의 전사층에 피가공 부재를 접착하여 고정하고, (ii) 해당 피가공 부재를 가공 또는 이송하고, (iii) 점착 시트에 활성 에너지선(예를 들어, 자외선)을 조사하여, 점착 시트의 전사층 측의 점착력을 저하시키고, (iv) 박리성 발현을 원하는 개소에 레이저 광을 조사하여, 점착제층에 변형을 발생시키도록 하여 사용하는 방법을 들 수 있다. 당해 방법에 의하면, 피가공 부재를 자연 낙하에 의해 박리시키는 것이 가능하게 된다. 또한, 복수의 피가공 부재를 임시 고정 한 경우에는, 그 일부만을 박리시키는 것도 가능하게 된다. 본 발명의 점착 시트를 사용하면, 자연 낙하할 정도까지 점착력을 저하시킬 수 있기 때문에, 매우 작은(예를 들어, 한 변이 50㎛인 정사각형) 피가공 부재여도, 각각 따로 박리시키는 것이 가능하다.The pressure-sensitive adhesive sheet of the present invention can be used when processing and/or transporting any suitable member to be processed (e.g., an electronic component) and temporarily fixing the member to be processed. A method of using the PSA sheet of the present invention includes, for example, (i) bonding the PSA layer to a support, (ii) bonding and fixing a member to be processed to the transfer layer of the PSA sheet, (ii) processing or transferring the member to be processed, (iii) irradiating the PSA sheet with active energy rays (eg, ultraviolet rays) to reduce the adhesive force on the transfer layer side of the PSA sheet, (iv) irradiating a laser beam to a portion where peelability is desired, It is possible to use a method by causing deformation to occur. According to the method, it becomes possible to peel the member to be processed by natural fall. Further, when a plurality of workpiece members are temporarily fixed, it is also possible to peel only a part of them. Since the use of the PSA sheet of the present invention can reduce the adhesive force to the extent that it naturally falls, even a very small (e.g., 50 µm square) member to be processed can be separated from each other.
상기 (i)에 있어서의 지지체로서는, 예를 들어 유리판이 사용된다. 지지체는 광투과성인 것이 바람직하다. 지지체의 전광선 투과율은, 예를 들어 50% 이상이고, 바람직하게는 80% 이상이다.As a support body in said (i), a glass plate is used, for example. The support is preferably light-transmitting. The total light transmittance of the support is, for example, 50% or more, preferably 80% or more.
하나의 실시 형태에 있어서는, 상기 (iii)에 있어서의 활성 에너지선은, 점착 시트의 점착제층 측(실질적으로는, 지지체 측)에서 조사된다.In one embodiment, the active energy rays in (iii) above are irradiated from the pressure-sensitive adhesive layer side (substantially, the support body side) of the pressure-sensitive adhesive sheet.
하나의 실시 형태에 있어서는, 상기 (iv)에 있어서의 레이저 광은, 점착 시트의 점착제층 측(실질적으로는, 지지체 측)에서 조사된다.In one embodiment, the laser beam in (iv) above is irradiated from the pressure-sensitive adhesive layer side (substantially, the support body side) of the pressure-sensitive adhesive sheet.
하나의 실시 형태에 있어서는, 상기 레이저 광의 파장은, 200nm 내지 300nm이다.In one embodiment, the wavelength of the laser light is 200 nm to 300 nm.
실시예Example
이하, 실시예에 의해 본 발명을 구체적으로 설명하지만, 본 발명은 이들 실시예에 의해 한정되는 것은 아니다. 실시예에 있어서의 시험 및 평가 방법은 이하와 같다. 또한, 특별히 명기하지 않는 한, 「부」 및 「%」는 중량 기준이다.Hereinafter, the present invention will be specifically described by examples, but the present invention is not limited by these examples. Tests and evaluation methods in Examples are as follows. In addition, "part" and "%" are based on weight unless otherwise specified.
(1) 점착제층의 유리에 대한 점착력 I(1) Adhesion to glass of the pressure-sensitive adhesive layer I
점착 시트의 전사층 측 PET 세퍼레이터를 박리하고, 두께 25㎛의 PET(도레이제 루미러 S10)를 접합하였다. 그 후 다른 한쪽 면의 PET 세퍼레이터를 박리하고, 2kg의 롤러를 1왕복에 의해 유리판(마쯔나미 가라스 고교사제, 상품명 「S200423」)에 접합하고, JIS Z 0237:2000에 준한 방법(박리 각도 180°, 박리 속도(인장 속도) 300mm/min, 측정 온도: 23℃)으로 점착력을 측정하였다.The PET separator on the transfer layer side of the adhesive sheet was peeled off, and PET (Lumiror S10, manufactured by Toray) having a thickness of 25 μm was bonded. After that, the PET separator on the other side was peeled off, and a 2 kg roller was bonded to a glass plate (manufactured by Matsunami Glass Kogyo Co., Ltd., trade name "S200423") by one reciprocation, and the adhesive strength was measured by a method according to JIS Z 0237: 2000 (peeling angle 180 °, peeling rate (tensile speed) 300 mm / min, measurement temperature: 23 ° C.).
(2) 전사층의 스테인리스판에 대한 점착력(2) Adhesion of the transfer layer to the stainless plate
점착 시트의 점착제층 측 PET 세퍼레이터(비교예 2에 있어서는, 전사층에 접착한 한 쪽의 PET 세퍼레이터)를 박리하고, 두께 25㎛의 PET(도레이제 루미러 S10)를 접합하였다. 그 후 다른 한쪽 면의 PET 세퍼레이터를 박리하고, 2kg의 롤러를 1왕복에 의해 SUS304에 접합하고, JIS Z 0237:2000에 준한 방법(박리 각도 180°, 박리 속도(인장 속도) 300mm/min, 측정 온도: 23℃)으로 점착력을 측정하여 초기 점착력 A라 하였다.The PET separator on the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive sheet (in Comparative Example 2, one PET separator adhered to the transfer layer) was peeled off, and a 25 μm-thick PET (Lumiror S10 manufactured by Toray) was bonded. After that, the PET separator on the other side was peeled off, a 2 kg roller was bonded to SUS304 by one reciprocation, and the adhesive force was measured by a method according to JIS Z 0237: 2000 (peeling angle 180 °, peeling speed (tensile speed) 300 mm / min, measurement temperature: 23 ° C.), and the initial adhesive force was referred to as A.
마찬가지의 방법으로, SUS304에 점착 시트를 접합한 후, 점착제층 측에서 자외선 조사 장치(닛토 세이키제, 상품명 「UM-810」)를 사용하여, 고압 수은등의 자외선(특정 파장: 365nm, 적산 광량: 300mJ/cm2)을 전체면에 조사한 후, 마찬가지로 점착력을 측정하여, 경화 후 점착력 B라 하였다.In the same way, after bonding the adhesive sheet to SUS304, the entire surface was irradiated with ultraviolet rays (specific wavelength: 365 nm, integrated light amount: 300 mJ/cm 2 ) of a high-pressure mercury lamp using an ultraviolet irradiation device (manufactured by Nitto Seiki, trade name “UM-810”) from the adhesive layer side, and then the adhesive force was similarly measured and referred to as adhesive force B after curing.
(3) 압입 탄성률(경화 전)(3) Indentation modulus (before curing)
점착제층 및 전사층의 압입 탄성률을, Hysitron사제 트라이포인덴터 TI-950을 사용하여, 압입 탄성률을 측정하였다. 측정은, 23℃에서의 단일 압입법에 의해, 압입 속도 10nm/s, 압입 깊이 100nm로 행하였다.The indentation modulus of the pressure-sensitive adhesive layer and the transfer layer was measured using a Tripoint Indenter TI-950 manufactured by Hysitron. The measurement was performed at an indentation speed of 10 nm/s and an indentation depth of 100 nm by a single indentation method at 23°C.
(4) 압입 탄성률(경화 후)(4) Indentation modulus (after hardening)
점착 시트의 점착제층 측 PET 세퍼레이터(비교예 2에 있어서는, 전사층에 접착한 한 쪽의 PET 세퍼레이터)를 박리하고, 대형 슬라이드 글래스(마쯔나미 글래스제, 상품명 「S9111」)에 핸드 롤러를 사용하여 접합하였다. 얻어진 샘플의 슬라이드 글래스면 측에서 자외선 조사 장치(닛토 세이키제, 상품명 「UM-810」)를 사용하여, 고압 수은등의 자외선(특정 파장: 365nm, 적산 광량: 300mJ/cm2)을 전체면에 조사하였다. 그 후, 다른 한쪽의 PET 세퍼레이터를 박리하여 전사층을 노출시키고, Hysitron사제 트라이포인덴터 TI-950을 사용하여, 압입 탄성률을 측정하였다. 측정은, 23℃에서의 단일 압입법에 의해, 압입 속도 10nm/s, 압입 깊이 100nm로 행하였다.The PET separator on the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive sheet (in Comparative Example 2, one PET separator adhered to the transfer layer) was peeled off and bonded to a large slide glass (manufactured by Matsunami Glass, trade name "S9111") using a hand roller. The entire surface was irradiated with ultraviolet rays (specific wavelength: 365 nm, integrated light amount: 300 mJ/cm 2 ) of a high-pressure mercury lamp using an ultraviolet irradiation device (manufactured by Nitto Seiki, trade name “UM-810”) from the slide glass surface side of the obtained sample. Thereafter, the other PET separator was peeled off to expose the transfer layer, and the indentation modulus was measured using a Tripoint Indenter TI-950 manufactured by Hysitron. The measurement was performed at an indentation speed of 10 nm/s and an indentation depth of 100 nm by a single indentation method at 23°C.
(5) 헤이즈값(5) Haze value
헤이즈미터(상품명 「HAZE METER HM-150」, 무라카미 시키사이 기쥬츠 겐큐죠제)를 사용하여, 점착 시트의 헤이즈값을 측정하였다.The haze value of the adhesive sheet was measured using a haze meter (trade name "HAZE METER HM-150", manufactured by Murakami Shikisai Kijutsu Genkyujo).
(6) 광투과율(6) light transmittance
분광 광도계(상품명 「분광 광도계 U-4100」, 히타치 하이테크 사이언스제)를 사용하여, 점착 시트의 파장 365nm의 광투과율 및 248nm의 광투과율을 측정하였다.The light transmittance at a wavelength of 365 nm and the light transmittance at 248 nm of the adhesive sheet were measured using a spectrophotometer (trade name "Spectrophotometer U-4100", manufactured by Hitachi High-Tech Sciences).
(7) 박리성(전사성)(7) peelability (transferability)
점착 시트의 점착제층 측 PET 세퍼레이터(비교예 2에 있어서는, 전사층에 접착한 한 쪽의 PET 세퍼레이터)를 박리하고, 석영판(애즈원사제)에 핸드 롤러를 사용하여 접합하였다. 그 후, 다른 한쪽 면의 PET 세퍼레이터를 박리하고, 전사층의 점착면에, 125㎛×100㎛의 실리콘 칩을 접합하였다.The PET separator on the pressure-sensitive adhesive layer side of the pressure-sensitive adhesive sheet (in Comparative Example 2, one PET separator adhered to the transfer layer) was peeled off and bonded to a quartz plate (manufactured by As One Co., Ltd.) using a hand roller. Thereafter, the PET separator on the other side was peeled off, and a silicon chip of 125 μm × 100 μm was bonded to the adhesive side of the transfer layer.
석영판면 측에서 자외선 조사 장치(닛토 세이키제, 상품명 「UM-810」)를 사용하여, 고압 수은등의 자외선(특정 파장: 365nm, 적산 광량: 300mJ/cm2)을 전체면에 조사하였다.The entire surface was irradiated with ultraviolet rays (specific wavelength: 365 nm, integrated light amount: 300 mJ/cm 2 ) of a high-pressure mercury lamp using an ultraviolet irradiation device (manufactured by Nitto Seiki, trade name "UM-810") from the side of the quartz plate.
그 후, 파장 248nm의 레이저 광을(조사 면적: 130㎛×105㎛, 출력 100mJ/cm2), 석영판 측에서 목적으로 하는 부재 위치에만 조사하여(1plus per chip), 자연 낙하한 경우를 합격(○), 자연 낙하하지 않은 경우를 불합격(×)으로 하였다.Thereafter, laser light having a wavelength of 248 nm (irradiation area: 130 μm × 105 μm, output 100 mJ / cm 2 ) was irradiated only on the target member position from the quartz plate side (1 plus per chip), and the case where it fell naturally was rated as pass (○), and the case where it did not fall naturally was rated as fail (×).
(8) 변형 유무(8) Presence or absence of deformation
현미경에 의해, 레이저 조사 후의 전사층 표면의 변형을 관찰하였다. 레이저 조사 개소와 그 이외의 개소에 있어서 현저한 색차가 보이는 경우를 불합격(×), 그렇지 않은 경우를 합격(○)으로 하였다.The surface deformation of the transfer layer after laser irradiation was observed under a microscope. A case in which significant color difference was observed between the laser irradiation site and other locations was rated as fail (X), and a case where it was not was rated as pass (○).
또한, 실시예 1(변형 유무 평가: 합격)에 있어서의 전사층 표면의 현미경 사진 도면을 도 2의 (a)에, 비교예 1(변형 유무 평가: 불합격)에 있어서의 전사층 표면의 현미경 사진 도면을 도 2의 (b)에 나타낸다.In addition, a micrograph of the surface of the transfer layer in Example 1 (evaluation of deformation: pass) is shown in FIG. 2 (a), and a micrograph of the surface of the transfer layer in Comparative Example 1 (evaluation of deformation: fail) is shown in FIG.
(9) 접착제 잔여물(9) adhesive residue
상기 「(1) 점착제층의 유리에 대한 점착력」의 평가 후의 유리판을 눈으로 보아 관찰하였다. 유리에 점착제층이 남은 경우를 불합격(×), 그렇지 않은 경우를 합격(○)으로 하였다.The glass plate after evaluation of said "(1) adhesive force with respect to the glass of an adhesive layer" was visually observed. The case where the pressure-sensitive adhesive layer remained on the glass was rated as disqualified (X), and the case where it was not was evaluated as pass (○).
[제조예 1] 아크릴 폴리머 I의 조정[Production Example 1] Adjustment of Acrylic Polymer I
2-에틸헥실아크릴레이트 30중량부, 부틸아크릴레이트 70중량부, 아크릴산 3중량부, 4-히드록시부틸아크릴레이트 1중량부를 혼합하여, 모노머 조성물을 조제하였다.A monomer composition was prepared by mixing 30 parts by weight of 2-ethylhexyl acrylate, 70 parts by weight of butyl acrylate, 3 parts by weight of acrylic acid, and 1 part by weight of 4-hydroxybutyl acrylate.
이어서, 질소 도입관, 온도계, 교반기를 구비한 반응 용기에 질소를 도입하고, 질소 분위기 하에서, 상기 모노머 조성물 103.1중량부, 벤조일퍼옥사이드(BPO) 0.2중량부 및 톨루엔 150중량부를 투입하고, 60℃에서 6시간 교반하여, 아크릴계 폴리머 I를 포함하는 아크릴계 폴리머 용액 I을 얻었다.Subsequently, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet pipe, a thermometer, and a stirrer, and under a nitrogen atmosphere, 103.1 parts by weight of the monomer composition, 0.2 parts by weight of benzoyl peroxide (BPO), and 150 parts by weight of toluene were added, and stirred at 60 ° C. for 6 hours to obtain an acrylic polymer solution I containing acrylic polymer I.
[제조예 2] 아크릴 폴리머 II의 조정[Production Example 2] Adjustment of Acrylic Polymer II
에틸아크릴레이트 70중량부, 2-히드록시에틸아크릴레이트 30중량부, 메타크릴산메틸아크릴레이트 5중량부, 히드록시에틸아크릴레이트 4중량부를 혼합하여, 모노머 조성물을 조제하였다.A monomer composition was prepared by mixing 70 parts by weight of ethyl acrylate, 30 parts by weight of 2-hydroxyethyl acrylate, 5 parts by weight of methyl methacrylate, and 4 parts by weight of hydroxyethyl acrylate.
이어서, 질소 도입관, 온도계, 교반기를 구비한 반응 용기에 질소를 도입하고, 질소 분위기 하에서, 톨루엔 295중량부, 상기 모노머 조성물 109중량부, 및 벤조일퍼옥사이드(BPO) 0.2중량부를 투입하고, 60℃에서 4시간 교반하여, 중량 평균 분자량 50만의 아크릴계 폴리머 II를 포함하는 아크릴계 폴리머 용액 II를 얻었다.Next, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer, and 295 parts by weight of toluene, 109 parts by weight of the monomer composition, and 0.2 parts by weight of benzoyl peroxide (BPO) were introduced under a nitrogen atmosphere, and stirred at 60 ° C. for 4 hours to obtain an acrylic polymer solution II containing acrylic polymer II having a weight average molecular weight of 500,000.
[제조예 3] 아크릴 폴리머 III의 조정[Production Example 3] Adjustment of Acrylic Polymer III
2-에틸헥실아크릴레이트 100중량부, 아크릴산 2중량부, 트리메틸올프로판트리아크릴레이트 0.01 중량을 혼합하여, 모노머 조성물을 조제하였다.A monomer composition was prepared by mixing 100 parts by weight of 2-ethylhexyl acrylate, 2 parts by weight of acrylic acid, and 0.01 part by weight of trimethylolpropane triacrylate.
이어서, 질소 도입관, 온도계, 교반기를 구비한 반응 용기에 질소를 도입하고, 질소 분위기 하에서, 상기 모노머 조성물 102.01중량부, 벤조일퍼옥사이드(BPO) 0.2중량부 및 톨루엔 189중량부를 투입하고, 60℃에서 7시간 교반하여, 아크릴계 폴리머 III을 포함하는 아크릴계 폴리머 용액 III을 얻었다.Next, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet pipe, a thermometer, and a stirrer, and under a nitrogen atmosphere, 102.01 parts by weight of the monomer composition, 0.2 parts by weight of benzoyl peroxide (BPO), and 189 parts by weight of toluene were added and stirred at 60 ° C. for 7 hours to obtain an acrylic polymer solution III containing acrylic polymer III.
[제조예 4] 아크릴 폴리머 IV의 조정[Production Example 4] Adjustment of Acrylic Polymer IV
부틸아크릴레이트 100중량부, 에틸아크릴레이트 78중량부, 히드록시에틸아크릴레이트 40중량부를 혼합하여, 모노머 조성물을 조제하였다.A monomer composition was prepared by mixing 100 parts by weight of butyl acrylate, 78 parts by weight of ethyl acrylate, and 40 parts by weight of hydroxyethyl acrylate.
이어서, 질소 도입관, 온도계, 교반기를 구비한 반응 용기에 질소를 도입하고, 질소 분위기 하에서, 톨루엔 507중량부, 상기 모노머 조성물 218중량부, 및 벤조일퍼옥사이드(BPO) 1.2중량부를 투입하고, 60℃에서 5시간 교반하였다. 그 후, 실온까지 냉각하고, 2-메타크릴로일옥시에틸이소시아네이트 42.6중량부를 첨가하여 반응시키고, 공중합체 중의 아크릴산2-히드록시에틸의 측쇄 말단 OH기에 NCO기를 부가하여, 말단에 탄소-탄소 이중 결합을 갖는 아크릴계 폴리머 IV를 함유하는 아크릴계 폴리머 용액 IV를 얻었다.Subsequently, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet pipe, a thermometer, and a stirrer, and 507 parts by weight of toluene, 218 parts by weight of the monomer composition, and 1.2 parts by weight of benzoyl peroxide (BPO) were introduced under a nitrogen atmosphere, and stirred at 60 ° C. for 5 hours. Then, it was cooled to room temperature, 42.6 parts by weight of 2-methacryloyloxyethyl isocyanate was added and reacted, an NCO group was added to the terminal OH group of the side chain of 2-hydroxyethyl acrylate in the copolymer, and an acrylic polymer solution IV containing acrylic polymer IV having a carbon-carbon double bond at the terminal was obtained.
[제조예 5] 아크릴 폴리머 V의 조정[Production Example 5] Adjustment of Acrylic Polymer V
2-에틸헥실아크릴레이트 100중량부, 아크릴로일모르폴린 25.5중량부, 히드록시에틸아크릴레이트 18.5중량부를 혼합하여, 모노머 조성물을 조제하였다.A monomer composition was prepared by mixing 100 parts by weight of 2-ethylhexyl acrylate, 25.5 parts by weight of acryloylmorpholine, and 18.5 parts by weight of hydroxyethyl acrylate.
이어서, 질소 도입관, 온도계, 교반기를 구비한 반응 용기에 질소를 도입하고, 질소 분위기 하에서, 톨루엔 60중량부, 상기 모노머 조성물 144중량부, 및 벤조일퍼옥사이드(BPO) 0.3중량부를 투입하고, 60℃에서 4시간 교반하였다. 그 후, 실온까지 냉각하고, 2-메타크릴로일옥시에틸이소시아네이트 12중량부를 첨가하여 반응시키고, 공중합체 중의 아크릴산2-히드록시에틸의 측쇄 말단 OH기에 NCO기를 부가하여, 말단에 탄소-탄소 이중 결합을 갖는 아크릴계 폴리머 V를 함유하는 아크릴계 폴리머 용액 V를 얻었다.Subsequently, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet pipe, a thermometer, and a stirrer, and 60 parts by weight of toluene, 144 parts by weight of the monomer composition, and 0.3 parts by weight of benzoyl peroxide (BPO) were introduced under a nitrogen atmosphere, and stirred at 60 ° C. for 4 hours. Then, it was cooled to room temperature, 12 parts by weight of 2-methacryloyloxyethyl isocyanate was added and reacted, an NCO group was added to the terminal OH group of the side chain of 2-hydroxyethyl acrylate in the copolymer, and the acrylic polymer solution V containing the acrylic polymer V having a carbon-carbon double bond at the terminal was obtained.
[제조예 6] 아크릴 폴리머 VI의 조정[Production Example 6] Adjustment of Acrylic Polymer VI
2-메톡시에틸아크릴레이트 100중량부, 아크릴로일모르폴린 27중량부, 아크릴산2-히드록시에틸 22중량부를 혼합하여, 모노머 조성물을 조제하였다.A monomer composition was prepared by mixing 100 parts by weight of 2-methoxyethyl acrylate, 27 parts by weight of acryloylmorpholine, and 22 parts by weight of 2-hydroxyethyl acrylate.
이어서, 질소 도입관, 온도계, 교반기를 구비한 반응 용기에 질소를 도입하고, 질소 분위기 하에서, 톨루엔 500중량부, 상기 모노머 조성물 149중량부, 및 벤조일퍼옥사이드(BPO) 0.3중량부를 투입하고, 60℃에서 5시간 교반하였다. 그 후, 실온까지 냉각하고, 2-메타크릴로일옥시에틸이소시아네이트 24중량부를 첨가하여 반응시키고, 공중합체 중의 아크릴산2-히드록시에틸의 측쇄 말단 OH기에 NCO기를 부가하여, 말단에 탄소-탄소 이중 결합을 갖는 아크릴계 폴리머 VI를 함유하는 아크릴계 폴리머 용액 VI를 얻었다.Subsequently, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet pipe, a thermometer, and a stirrer, and 500 parts by weight of toluene, 149 parts by weight of the monomer composition, and 0.3 parts by weight of benzoyl peroxide (BPO) were introduced under a nitrogen atmosphere, and stirred at 60 ° C. for 5 hours. Then, it was cooled to room temperature, 24 parts by weight of 2-methacryloyloxyethyl isocyanate was added and reacted, an NCO group was added to the terminal OH group of the side chain of 2-hydroxyethyl acrylate in the copolymer, and an acrylic polymer solution VI containing acrylic polymer VI having a carbon-carbon double bond at the terminal was obtained.
[실시예 1][Example 1]
(점착제의 조제)(Preparation of adhesive)
아크릴 폴리머 I를 100중량부 포함하는 아크릴계 폴리머 용액 I에, 가교제(도소사제, 상품명 「코로네이트 L」) 2중량부, 점착 부여 수지(아라카와 가가쿠 고교사제, 상품명 「D-125」) 30중량부를 첨가하여, 점착제층 형성용의 점착제 (1)을 얻었다.To the acrylic polymer solution I containing 100 parts by weight of the acrylic polymer I, 2 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) and 30 parts by weight of a tackifying resin (manufactured by Arakawa Chemical Industry, trade name “D-125”) were added to obtain an adhesive (1) for forming an adhesive layer.
아크릴 폴리머 IV를 100중량부 포함하는 아크릴 폴리머 용액 IV에, 가교제(도소사제, 상품명 「코로네이트 L」) 3중량부, 광중합 개시제(BASF사제, 상품명 「이르가큐어 127」) 10중량부를 첨가하여, 전사층 형성용의 점착제 (A)를 얻었다.To acrylic polymer solution IV containing 100 parts by weight of acrylic polymer IV, 3 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, trade name “Irgacure 127”) were added to obtain an adhesive (A) for forming a transfer layer.
(점착 시트)(adhesive sheet)
PET 세퍼레이터(두께: 38㎛)의 실리콘 처리면에, 상기 점착제 (1)을 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 4㎛의 점착제층을 형성하였다.The adhesive (1) was applied to the silicone-treated surface of a PET separator (thickness: 38 μm) and then heated at 120° C. for 2 minutes to form an adhesive layer having a thickness of 4 μm.
별도로, PET 세퍼레이터(두께: 75㎛)의 실리콘 처리면에, 상기 점착제 (A)를 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 5㎛의 전사층을 형성하였다.Separately, the adhesive (A) was applied to the siliconized surface of a PET separator (thickness: 75 μm) and then heated at 120° C. for 2 minutes to form a transfer layer having a thickness of 5 μm.
PET 기재(도레이사제, 상품명 「루미러2DC61」, 두께: 2㎛)의 한쪽 면에, PET 세퍼레이터 구비의 점착제층을 접합하고, 다른 쪽 면에 PET 세퍼레이터 구비 전사층을 접합하여, PET 세퍼레이터/점착제층/기재/전사층/PET 세퍼레이터로 이루어지는 점착 시트를 얻었다.An adhesive layer with a PET separator was bonded to one side of a PET substrate (manufactured by Toray, trade name: “Lumiror 2DC61”, thickness: 2 μm), and a transfer layer with a PET separator was bonded to the other side to obtain an adhesive sheet composed of PET separator/adhesive layer/substrate/transfer layer/PET separator.
얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[실시예 2][Example 2]
아크릴 폴리머 용액 IV 대신에, 아크릴 폴리머 V를 100중량부 포함하는 아크릴 폴리머 용액 V를 사용한 것 이외는, 실시예 1과 마찬가지로 하여 점착 시트를 얻었다. 얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.An adhesive sheet was obtained in the same manner as in Example 1, except that the acrylic polymer solution V containing 100 parts by weight of the acrylic polymer V was used instead of the acrylic polymer solution IV. The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[실시예 3][Example 3]
아크릴 폴리머 VI를 100중량부 포함하는 아크릴 폴리머 용액 VI에, 가교제(도소사제, 상품명 「코로네이트 L」) 5중량부, 광중합 개시제(BASF사제, 상품명 「이르가큐어 127」) 10중량부를 첨가하여, 전사층 형성용의 점착제 (C)를 얻었다.To acrylic polymer solution VI containing 100 parts by weight of acrylic polymer VI, 5 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, trade name “Irgacure 127”) were added to obtain an adhesive (C) for forming a transfer layer.
점착제 (A) 대신에, 점착제 (C)를 사용하여 전사층을 형성한 것 이외는, 실시예 1과 마찬가지로 하여 점착 시트를 얻었다. 얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.An adhesive sheet was obtained in the same manner as in Example 1 except that the transfer layer was formed using the adhesive (C) instead of the adhesive (A). The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[실시예 4][Example 4]
아크릴 폴리머 VI를 100중량부 포함하는 아크릴 폴리머 용액 VI에, 가교제(도소사제, 상품명 「코로네이트 L」) 5중량부, 광중합 개시제(BASF사제, 상품명 「이르가큐어 127」) 10중량부, 실리카 미립자(애드마텍스사제, 상품명 「YA050C」) 5중량부를 첨가하여, 전사층 형성용의 점착제 (D)를 얻었다.To acrylic polymer solution VI containing 100 parts by weight of acrylic polymer VI, 5 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name “Coronate L”), 10 parts by weight of a photopolymerization initiator (manufactured by BASF, trade name “Irgacure 127”), 5 parts by weight of silica fine particles (manufactured by Admatechs, trade name “YA050C”) were added to obtain an adhesive (D) for forming a transfer layer.
점착제 (A) 대신에, 점착제 (D)를 사용하여 전사층을 형성한 것 이외는, 실시예 1과 마찬가지로 하여 점착 시트를 얻었다. 얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.An adhesive sheet was obtained in the same manner as in Example 1, except that the transfer layer was formed using the adhesive (D) instead of the adhesive (A). The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[실시예 5][Example 5]
점착제층의 두께를 20㎛로 한 것 이외는, 실시예 3과 마찬가지로 하여 점착 시트를 얻었다. 얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 3 except that the thickness of the pressure-sensitive adhesive layer was 20 µm. The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[실시예 6][Example 6]
(점착제의 조제)(Preparation of adhesive)
실시예 1과 마찬가지로 하여, 점착제층 형성용의 점착제 (1)을 얻었다.It carried out similarly to Example 1, and obtained the adhesive (1) for adhesive layer formation.
아크릴 폴리머 VI를 100중량부 포함하는 아크릴 폴리머 용액 VI에, 가교제(도소사제, 상품명 「코로네이트 L」) 5중량부, 광중합 개시제(BASF사제, 상품명 「이르가큐어 127」) 10중량부, 자외선 흡수제(BASF사제, 상품명 「Tinuvin 405」, 분자량: 583.8) 5중량부를 첨가하여, 전사층 형성용의 점착제 (E)를 얻었다.In the acrylic polymer solution VI containing 100 parts by weight of the acrylic polymer VI, 5 parts by weight of cross -derivative (wholesale priests, the product name "Coronate L"), the photocurrent initiator (BASF Priest, the product name "Irga Cure 127") 10 parts by weight, ultraviolet absorbent (BASF priest, product name "Tinuvin 405”, molecular weight : 583.8) 5 parts by weight was added to obtain an adhesive (E) for the formation of a warrior layer.
(점착 시트)(adhesive sheet)
PET 세퍼레이터(두께: 38㎛)의 실리콘 처리면에, 상기 점착제 (1)을 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 4㎛의 점착제층을 형성하였다.The adhesive (1) was applied to the silicone-treated surface of a PET separator (thickness: 38 μm) and then heated at 120° C. for 2 minutes to form an adhesive layer having a thickness of 4 μm.
별도로, PET 세퍼레이터(두께: 75㎛)의 실리콘 처리면에, 상기 점착제 (E)를 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 5㎛의 전사층을 형성하였다.Separately, the adhesive (E) was applied to the silicone-treated surface of a PET separator (thickness: 75 μm), and then heated at 120° C. for 2 minutes to form a transfer layer having a thickness of 5 μm.
PET 기재(도레이사제, 상품명 「루미러 S10」, 두께: 25㎛)의 한쪽 면에, PET 세퍼레이터 구비의 점착제층을 접합하고, 다른 쪽 면에 PET 세퍼레이터 구비 전사층을 접합하여, PET 세퍼레이터/점착제층/기재/전사층/PET 세퍼레이터로 이루어지는 점착 시트를 얻었다.An adhesive layer with a PET separator was bonded to one side of a PET substrate (manufactured by Toray, trade name “Lumiror S10”, thickness: 25 μm), and a transfer layer with a PET separator was bonded to the other side to obtain an adhesive sheet composed of PET separator/adhesive layer/substrate/transfer layer/PET separator.
얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[실시예 7][Example 7]
전사층의 두께를 25㎛로 한 것 이외는, 실시예 3과 마찬가지로 하여 점착 시트를 얻었다. 얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.An adhesive sheet was obtained in the same manner as in Example 3 except that the thickness of the transfer layer was 25 μm. The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[실시예 8][Example 8]
(점착제의 조제)(Preparation of adhesive)
아크릴 폴리머 II를 100중량부 포함하는 아크릴계 폴리머 용액 II에, 가교제(도소사제, 상품명 「코로네이트 L」) 8.5중량부를 첨가하여, 점착제층 형성용의 점착제 (2)를 얻었다.8.5 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name "Coronate L") was added to acrylic polymer solution II containing 100 parts by weight of acrylic polymer II to obtain an adhesive (2) for forming an adhesive layer.
실시예 3과 마찬가지로 하여, 전사층 형성용의 점착제 (C)를 얻었다.In the same manner as in Example 3, an adhesive (C) for forming a transfer layer was obtained.
(점착 시트)(adhesive sheet)
PET 세퍼레이터(두께: 38㎛)의 실리콘 처리면에, 상기 점착제 (2)를 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 4㎛의 점착제층을 형성하였다.The adhesive (2) was applied to the siliconized surface of a PET separator (thickness: 38 μm) and then heated at 120° C. for 2 minutes to form an adhesive layer having a thickness of 4 μm.
별도로, PET 세퍼레이터(두께: 75㎛)의 실리콘 처리면에, 상기 점착제 (C)를 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 5㎛의 전사층을 형성하였다.Separately, the adhesive (C) was applied to the silicone treated surface of a PET separator (thickness: 75 μm), and then heated at 120° C. for 2 minutes to form a transfer layer having a thickness of 5 μm.
PET 기재(도레이사제, 상품명 「루미러2DC61」, 두께: 2㎛)의 한쪽 면에, PET 세퍼레이터 구비의 점착제층을 접합하고, 다른 쪽 면에 PET 세퍼레이터 구비 전사층을 접합하여, PET 세퍼레이터/점착제층/기재/전사층/PET 세퍼레이터로 이루어지는 점착 시트를 얻었다.An adhesive layer with a PET separator was bonded to one side of a PET substrate (manufactured by Toray, trade name: “Lumiror 2DC61”, thickness: 2 μm), and a transfer layer with a PET separator was bonded to the other side to obtain an adhesive sheet composed of PET separator/adhesive layer/substrate/transfer layer/PET separator.
얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[비교예 1][Comparative Example 1]
(점착제의 조제)(Preparation of adhesive)
아크릴 폴리머 III을 100중량부 포함하는 아크릴계 폴리머 용액 III에, 가교제(도소사제, 상품명 「코로네이트 L」) 2중량부를 첨가하여, 점착제층 형성용의 점착제 (3)을 얻었다.To acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 2 parts by weight of a crosslinking agent (trade name "Coronate L" manufactured by Tosoh Corporation) was added to obtain an adhesive (3) for forming an adhesive layer.
실시예 3과 마찬가지로 하여, 전사층 형성용의 점착제 (C)를 얻었다.In the same manner as in Example 3, an adhesive (C) for forming a transfer layer was obtained.
(점착 시트)(adhesive sheet)
PET 세퍼레이터(두께: 38㎛)의 실리콘 처리면에, 상기 점착제 (3)을 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 4㎛의 점착제층을 형성하였다.The adhesive (3) was applied to the silicone-treated surface of a PET separator (thickness: 38 μm) and then heated at 120° C. for 2 minutes to form an adhesive layer having a thickness of 4 μm.
별도로, PET 세퍼레이터(두께: 75㎛)의 실리콘 처리면에, 상기 점착제 (C)를 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 5㎛의 전사층을 형성하였다.Separately, the adhesive (C) was applied to the silicone treated surface of a PET separator (thickness: 75 μm), and then heated at 120° C. for 2 minutes to form a transfer layer having a thickness of 5 μm.
PET 기재(도레이사제, 상품명 「루미러2DC61」, 두께: 2㎛)의 한쪽 면에, PET 세퍼레이터 구비의 점착제층을 접합하고, 다른 쪽 면에 PET 세퍼레이터 구비 전사층을 접합하여, PET 세퍼레이터/점착제층/기재/전사층/PET 세퍼레이터로 이루어지는 점착 시트를 얻었다.An adhesive layer with a PET separator was bonded to one side of a PET substrate (manufactured by Toray, trade name: “Lumiror 2DC61”, thickness: 2 μm), and a transfer layer with a PET separator was bonded to the other side to obtain an adhesive sheet composed of PET separator/adhesive layer/substrate/transfer layer/PET separator.
얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[비교예 2][Comparative Example 2]
(점착제의 조제)(Preparation of adhesive)
실시예 3과 마찬가지로 하여, 전사층 형성용의 점착제 (C)를 얻었다.In the same manner as in Example 3, an adhesive (C) for forming a transfer layer was obtained.
(점착 시트)(adhesive sheet)
PET 세퍼레이터(두께: 75㎛)의 실리콘 처리면에, 상기 점착제 (C)를 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 5㎛의 전사층을 형성하였다.The adhesive (C) was applied to the silicone treated surface of a PET separator (thickness: 75 μm), and then heated at 120° C. for 2 minutes to form a transfer layer having a thickness of 5 μm.
당해 전사층에 다른 PET 세퍼레이터(두께: 38㎛)를 적층하고, PET 세퍼레이터/전사층/PET 세퍼레이터로 이루어지는 점착 시트를 얻었다.Another PET separator (thickness: 38 μm) was laminated on the transfer layer to obtain a pressure-sensitive adhesive sheet composed of PET separator/transfer layer/PET separator.
[비교예 3][Comparative Example 3]
아크릴 폴리머 I를 100중량부 포함하는 아크릴 폴리머 용액 I에, 가교제(도소사제, 상품명 「코로네이트 L」) 2중량부, 점착 부여 수지(아라카와 가가쿠 고교사제, 상품명 「D-125」) 30중량부를 첨가하여, 전사층 형성용의 점착제 (F)를 얻었다.To acrylic polymer solution I containing 100 parts by weight of acrylic polymer I, 2 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name “Coronate L”) and 30 parts by weight of a tackifying resin (manufactured by Arakawa Chemical Industry, trade name “D-125”) were added to obtain an adhesive (F) for forming a transfer layer.
점착제 (A) 대신에, 점착제 (F)를 사용하여 전사층을 형성한 것 이외는, 실시예 1과 마찬가지로 하여 점착 시트를 얻었다. 얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.An adhesive sheet was obtained in the same manner as in Example 1, except that the transfer layer was formed using the adhesive (F) instead of the adhesive (A). The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[비교예 4][Comparative Example 4]
아크릴 폴리머 V를 100중량부 포함하는 아크릴 폴리머 용액 V에, 가교제(도소사제, 상품명 「코로네이트 L」) 3중량부, 광중합 개시제(BASF사제, 상품명 「이르가큐어 127」) 0.5중량부를 첨가하여, 전사층 형성용의 점착제 (G)를 얻었다.To the acrylic polymer solution V containing 100 parts by weight of the acrylic polymer V, 3 parts by weight of a crosslinking agent (manufactured by Tosoh Corporation, trade name “Coronate L”), and 0.5 parts by weight of a photopolymerization initiator (manufactured by BASF, trade name “Irgacure 127”) were added to obtain an adhesive (G) for forming a transfer layer.
점착제 (C) 대신에, 점착제 (G)를 사용하여 전사층을 형성한 것 이외는, 실시예 8과 마찬가지로 하여 점착 시트를 얻었다. 얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.An adhesive sheet was obtained in the same manner as in Example 8, except that the transfer layer was formed using the adhesive (G) instead of the adhesive (C). The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[비교예 5][Comparative Example 5]
(점착제의 조제)(Preparation of adhesive)
실시예 1과 마찬가지로 하여, 점착제층 형성용의 점착제 (1)을 얻었다.It carried out similarly to Example 1, and obtained the adhesive (1) for adhesive layer formation.
비교예 3과 마찬가지로 하여, 전사층 형성용의 점착제 (F)를 얻었다.In the same manner as in Comparative Example 3, an adhesive (F) for forming a transfer layer was obtained.
(점착 시트)(adhesive sheet)
PET 세퍼레이터(두께: 38㎛)의 실리콘 처리면에, 상기 점착제 (1)을 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 4㎛의 점착제층을 형성하였다.The adhesive (1) was applied to the silicone-treated surface of a PET separator (thickness: 38 μm) and then heated at 120° C. for 2 minutes to form an adhesive layer having a thickness of 4 μm.
별도로, PET 세퍼레이터(두께: 75㎛)의 실리콘 처리면에, 상기 점착제 (F)를 도포하고, 그 후, 120℃에서 2분간 가열하여, 두께 5㎛의 전사층을 형성하였다.Separately, the adhesive (F) was applied to the siliconized surface of a PET separator (thickness: 75 μm) and then heated at 120° C. for 2 minutes to form a transfer layer having a thickness of 5 μm.
PET 기재(도레이사제, 상품명 「루미러 S27」, 두께: 75㎛)의 한쪽 면에, PET 세퍼레이터 구비의 점착제층을 접합하고, 다른 쪽 면에 PET 세퍼레이터 구비 전사층을 접합하여, PET 세퍼레이터/점착제층/기재/전사층/PET 세퍼레이터로 이루어지는 점착 시트를 얻었다.An adhesive layer with a PET separator was bonded to one side of a PET base material (manufactured by Toray, trade name “Lumiror S27”, thickness: 75 μm), and a transfer layer with a PET separator was bonded to the other side to obtain a pressure-sensitive adhesive sheet composed of PET separator/adhesive layer/substrate/transfer layer/PET separator.
얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
[비교예 6][Comparative Example 6]
PET 기재(도레이사제, 상품명 「루미러 S27」, 두께: 75㎛) 대신에, PP 기재(도레이사제, 상품명 「트레팬 BO 12D-KW37」, 두께: 12㎛)를 사용한 것 이외는, 비교예 5와 마찬가지로 하여, 점착 시트를 얻었다.An adhesive sheet was obtained in the same manner as in Comparative Example 5, except that a PP substrate (manufactured by Toray, trade name: "Trepan BO 12D-KW37", thickness: 12 µm) was used instead of the PET substrate (manufactured by Toray, trade name "Lumiror S27", thickness: 75 µm).
얻어진 점착 시트를 상기 평가에 제공하였다. 결과를 표 1에 나타낸다.The obtained PSA sheet was subjected to the above evaluation. The results are shown in Table 1.
10: 점착제층
20: 전사층
30: 기재
100, 200: 점착 시트10: adhesive layer
20: transfer layer
30: substrate
100, 200: adhesive sheet
Claims (5)
해당 전사층이, 활성 에너지선의 조사에 의해, 경화되는 층이고,
해당 점착 시트의 해당 점착제층을 유리판에 접착했을 때의 23℃에서의 점착력 I가, 2N/20mm 이상이고,
해당 점착 시트의 해당 점착제층을 유리판에 접착했을 때의 23℃에서의 점착력 I의, 해당 전사층에 300mJ/cm2의 자외선을 조사한 후의 23℃에서의 점착력 B에 대한 비가, 5 이상인,
점착 시트.A pressure-sensitive adhesive sheet comprising a pressure-sensitive adhesive layer and a transfer layer disposed on one side of the pressure-sensitive adhesive layer,
The transfer layer is a layer that is cured by irradiation with active energy rays,
The adhesive force I at 23°C when the PSA layer of the PSA sheet is adhered to the glass plate is 2 N/20 mm or more,
The ratio of the adhesive force I at 23 ° C when the PSA layer of the PSA sheet is adhered to the glass plate to the adhesive force B at 23 ° C after irradiating the transfer layer with 300 mJ / cm 2 ultraviolet rays is 5 or more,
adhesive sheet.
상기 점착제층과, 상기 전사층 사이에, 기재를 더 구비하는, 점착 시트.According to claim 1,
The pressure-sensitive adhesive sheet further comprising a substrate between the pressure-sensitive adhesive layer and the transfer layer.
300mJ/cm2의 자외선을 조사한 후에, 상기 전사층의 23℃에서의 압입 탄성률 B가, 상기 점착제층의 23℃에서의 압입 탄성률 I의 5배 이상으로 되는, 점착 시트.According to claim 1 or 2,
The pressure-sensitive adhesive sheet, wherein after being irradiated with ultraviolet rays of 300 mJ/cm 2 , the transfer layer has an indentation modulus B at 23°C that is 5 times or more than the indentation modulus I at 23°C of the PSA layer.
상기 전사층이, 활성 에너지선 경화형 점착제를 포함하고,
해당 활성 에너지선 경화형 점착제가, 베이스 폴리머로서, 아크릴계 폴리머를 포함하는,
점착 시트.According to any one of claims 1 to 3,
The transfer layer contains an active energy ray-curable pressure-sensitive adhesive,
The active energy ray-curable pressure-sensitive adhesive contains an acrylic polymer as a base polymer,
adhesive sheet.
상기 점착 시트를 사용하여 부재를 지지체에 임시 고정하고, 이송 및/또는 가공 등의 후에, 레이저 광 조사에 의해 해당 부재를 지지체로부터 박리하는 용도로 사용되는, 점착 시트.According to any one of claims 1 to 4,
A pressure-sensitive adhesive sheet used for temporarily fixing a member to a support body using the pressure-sensitive adhesive sheet and peeling the member from the support body by laser light irradiation after transport and/or processing.
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PCT/JP2021/029529 WO2022118499A1 (en) | 2020-12-04 | 2021-08-10 | Adhesive sheet |
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JPS6053756U (en) | 1983-09-20 | 1985-04-16 | 日清紡績株式会社 | Warp sizing device with split magazine creel cart |
JP5875850B2 (en) | 2011-12-16 | 2016-03-02 | 東京応化工業株式会社 | Laminate and separation method |
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JP2012033637A (en) * | 2010-07-29 | 2012-02-16 | Nitto Denko Corp | Dicing tape integrated semiconductor rear face film, and method of manufacturing semiconductor device |
JP6058534B2 (en) * | 2011-05-17 | 2017-01-11 | リンテック株式会社 | Film and adhesive sheet |
JP6036502B2 (en) * | 2013-04-10 | 2016-11-30 | 王子ホールディングス株式会社 | Multilayer double-sided pressure-sensitive adhesive sheet, laminate, display device with touch panel, and multi-layer double-sided pressure-sensitive adhesive sheet peeling method |
JP6377541B2 (en) * | 2015-01-20 | 2018-08-22 | 富士フイルム株式会社 | Flexible device manufacturing method and flexible device laminate |
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JPS6053756U (en) | 1983-09-20 | 1985-04-16 | 日清紡績株式会社 | Warp sizing device with split magazine creel cart |
JP5875850B2 (en) | 2011-12-16 | 2016-03-02 | 東京応化工業株式会社 | Laminate and separation method |
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