CN111725122A - Cutting belt - Google Patents
Cutting belt Download PDFInfo
- Publication number
- CN111725122A CN111725122A CN202010211027.0A CN202010211027A CN111725122A CN 111725122 A CN111725122 A CN 111725122A CN 202010211027 A CN202010211027 A CN 202010211027A CN 111725122 A CN111725122 A CN 111725122A
- Authority
- CN
- China
- Prior art keywords
- adhesive layer
- dicing tape
- pressure
- sensitive adhesive
- acrylate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005520 cutting process Methods 0.000 title description 3
- 239000012790 adhesive layer Substances 0.000 claims abstract description 55
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 claims abstract description 51
- 238000000034 method Methods 0.000 claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 22
- 238000004519 manufacturing process Methods 0.000 claims abstract description 18
- 239000002904 solvent Substances 0.000 claims abstract description 18
- 238000004140 cleaning Methods 0.000 claims abstract description 13
- 238000010828 elution Methods 0.000 claims abstract description 7
- 239000000654 additive Substances 0.000 claims description 20
- 239000000203 mixture Substances 0.000 claims description 19
- 239000000463 material Substances 0.000 claims description 17
- 230000000996 additive effect Effects 0.000 claims description 14
- 229920005601 base polymer Polymers 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 abstract description 53
- 230000001070 adhesive effect Effects 0.000 abstract description 53
- 238000011109 contamination Methods 0.000 abstract description 7
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 74
- 239000010410 layer Substances 0.000 description 74
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 49
- 239000000178 monomer Substances 0.000 description 44
- 235000012431 wafers Nutrition 0.000 description 39
- -1 polypropylene Polymers 0.000 description 35
- 239000000758 substrate Substances 0.000 description 34
- 239000003431 cross linking reagent Substances 0.000 description 26
- 229920005989 resin Polymers 0.000 description 13
- 239000011347 resin Substances 0.000 description 13
- 239000011521 glass Substances 0.000 description 11
- 239000003999 initiator Substances 0.000 description 11
- 239000012948 isocyanate Substances 0.000 description 11
- 238000002834 transmittance Methods 0.000 description 10
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 9
- 230000002209 hydrophobic effect Effects 0.000 description 7
- 239000002356 single layer Substances 0.000 description 6
- 230000003746 surface roughness Effects 0.000 description 6
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 238000000227 grinding Methods 0.000 description 5
- 150000002513 isocyanates Chemical class 0.000 description 5
- 239000011254 layer-forming composition Substances 0.000 description 5
- 229920013716 polyethylene resin Polymers 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 4
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 4
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 229920006243 acrylic copolymer Polymers 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000004049 embossing Methods 0.000 description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 4
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- KZNICNPSHKQLFF-UHFFFAOYSA-N succinimide Chemical compound O=C1CCC(=O)N1 KZNICNPSHKQLFF-UHFFFAOYSA-N 0.000 description 4
- QNODIIQQMGDSEF-UHFFFAOYSA-N (1-hydroxycyclohexyl)-phenylmethanone Chemical compound C=1C=CC=CC=1C(=O)C1(O)CCCCC1 QNODIIQQMGDSEF-UHFFFAOYSA-N 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 150000001875 compounds Chemical class 0.000 description 3
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 3
- 125000000524 functional group Chemical group 0.000 description 3
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000002156 mixing Methods 0.000 description 3
- 239000004014 plasticizer Substances 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000003505 polymerization initiator Substances 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 229960002317 succinimide Drugs 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- XMGQYMWWDOXHJM-JTQLQIEISA-N (+)-α-limonene Chemical compound CC(=C)[C@@H]1CCC(C)=CC1 XMGQYMWWDOXHJM-JTQLQIEISA-N 0.000 description 2
- ZGEGCLOFRBLKSE-UHFFFAOYSA-N 1-Heptene Chemical compound CCCCCC=C ZGEGCLOFRBLKSE-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- KWVGIHKZDCUPEU-UHFFFAOYSA-N 2,2-dimethoxy-2-phenylacetophenone Chemical compound C=1C=CC=CC=1C(OC)(OC)C(=O)C1=CC=CC=C1 KWVGIHKZDCUPEU-UHFFFAOYSA-N 0.000 description 2
- KANZWHBYRHQMKZ-UHFFFAOYSA-N 2-ethenylpyrazine Chemical compound C=CC1=CN=CC=N1 KANZWHBYRHQMKZ-UHFFFAOYSA-N 0.000 description 2
- OMIGHNLMNHATMP-UHFFFAOYSA-N 2-hydroxyethyl prop-2-enoate Chemical compound OCCOC(=O)C=C OMIGHNLMNHATMP-UHFFFAOYSA-N 0.000 description 2
- FKAWETHEYBZGSR-UHFFFAOYSA-N 3-methylidenepyrrolidine-2,5-dione Chemical compound C=C1CC(=O)NC1=O FKAWETHEYBZGSR-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 239000003963 antioxidant agent Substances 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical compound CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- HVYWMOMLDIMFJA-DPAQBDIFSA-N cholesterol Chemical compound C1C=C2C[C@@H](O)CC[C@]2(C)[C@@H]2[C@@H]1[C@@H]1CC[C@H]([C@H](C)CCCC(C)C)[C@@]1(C)CC2 HVYWMOMLDIMFJA-DPAQBDIFSA-N 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000000284 extract Substances 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- RBQRWNWVPQDTJJ-UHFFFAOYSA-N methacryloyloxyethyl isocyanate Chemical compound CC(=C)C(=O)OCCN=C=O RBQRWNWVPQDTJJ-UHFFFAOYSA-N 0.000 description 2
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920005672 polyolefin resin Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical class C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 2
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- 239000013638 trimer Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- AURYLBASVGNSON-UHFFFAOYSA-N (2,5-dioxopyrrolidin-3-ylidene)methyl prop-2-enoate Chemical compound C=CC(=O)OC=C1CC(=O)NC1=O AURYLBASVGNSON-UHFFFAOYSA-N 0.000 description 1
- FKTHNVSLHLHISI-UHFFFAOYSA-N 1,2-bis(isocyanatomethyl)benzene Chemical class O=C=NCC1=CC=CC=C1CN=C=O FKTHNVSLHLHISI-UHFFFAOYSA-N 0.000 description 1
- MSAHTMIQULFMRG-UHFFFAOYSA-N 1,2-diphenyl-2-propan-2-yloxyethanone Chemical compound C=1C=CC=CC=1C(OC(C)C)C(=O)C1=CC=CC=C1 MSAHTMIQULFMRG-UHFFFAOYSA-N 0.000 description 1
- OVBFMUAFNIIQAL-UHFFFAOYSA-N 1,4-diisocyanatobutane Chemical compound O=C=NCCCCN=C=O OVBFMUAFNIIQAL-UHFFFAOYSA-N 0.000 description 1
- VNQXSTWCDUXYEZ-UHFFFAOYSA-N 1,7,7-trimethylbicyclo[2.2.1]heptane-2,3-dione Chemical compound C1CC2(C)C(=O)C(=O)C1C2(C)C VNQXSTWCDUXYEZ-UHFFFAOYSA-N 0.000 description 1
- ZVEMLYIXBCTVOF-UHFFFAOYSA-N 1-(2-isocyanatopropan-2-yl)-3-prop-1-en-2-ylbenzene Chemical compound CC(=C)C1=CC=CC(C(C)(C)N=C=O)=C1 ZVEMLYIXBCTVOF-UHFFFAOYSA-N 0.000 description 1
- IAUGBVWVWDTCJV-UHFFFAOYSA-N 1-(prop-2-enoylamino)propane-1-sulfonic acid Chemical compound CCC(S(O)(=O)=O)NC(=O)C=C IAUGBVWVWDTCJV-UHFFFAOYSA-N 0.000 description 1
- PWMWNFMRSKOCEY-UHFFFAOYSA-N 1-Phenyl-1,2-ethanediol Chemical compound OCC(O)C1=CC=CC=C1 PWMWNFMRSKOCEY-UHFFFAOYSA-N 0.000 description 1
- XTKZBPGQKMDFMC-UHFFFAOYSA-N 1-butyl-3-methylidenepyrrolidine-2,5-dione Chemical compound CCCCN1C(=O)CC(=C)C1=O XTKZBPGQKMDFMC-UHFFFAOYSA-N 0.000 description 1
- BGKQCHAKBLWCDU-UHFFFAOYSA-N 1-cyclohexyl-3-methylidenepyrrolidine-2,5-dione Chemical compound O=C1C(=C)CC(=O)N1C1CCCCC1 BGKQCHAKBLWCDU-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- SJLLJZNSZJHXQN-UHFFFAOYSA-N 1-dodecylpyrrole-2,5-dione Chemical compound CCCCCCCCCCCCN1C(=O)C=CC1=O SJLLJZNSZJHXQN-UHFFFAOYSA-N 0.000 description 1
- 229940106006 1-eicosene Drugs 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- QJJDJWUCRAPCOL-UHFFFAOYSA-N 1-ethenoxyoctadecane Chemical compound CCCCCCCCCCCCCCCCCCOC=C QJJDJWUCRAPCOL-UHFFFAOYSA-N 0.000 description 1
- UBPXWZDJZFZKGH-UHFFFAOYSA-N 1-ethenyl-3-methylpyrrolidin-2-one Chemical compound CC1CCN(C=C)C1=O UBPXWZDJZFZKGH-UHFFFAOYSA-N 0.000 description 1
- JWYVGKFDLWWQJX-UHFFFAOYSA-N 1-ethenylazepan-2-one Chemical compound C=CN1CCCCCC1=O JWYVGKFDLWWQJX-UHFFFAOYSA-N 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- DCRYNQTXGUTACA-UHFFFAOYSA-N 1-ethenylpiperazine Chemical compound C=CN1CCNCC1 DCRYNQTXGUTACA-UHFFFAOYSA-N 0.000 description 1
- PBGPBHYPCGDFEZ-UHFFFAOYSA-N 1-ethenylpiperidin-2-one Chemical compound C=CN1CCCCC1=O PBGPBHYPCGDFEZ-UHFFFAOYSA-N 0.000 description 1
- BMZZOWWYEBTMBX-UHFFFAOYSA-N 1-ethyl-3-methylidenepyrrolidine-2,5-dione Chemical compound CCN1C(=O)CC(=C)C1=O BMZZOWWYEBTMBX-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- CSCSROFYRUZJJH-UHFFFAOYSA-N 1-methoxyethane-1,2-diol Chemical compound COC(O)CO CSCSROFYRUZJJH-UHFFFAOYSA-N 0.000 description 1
- QSWFISOPXPJUCT-UHFFFAOYSA-N 1-methyl-3-methylidenepyrrolidine-2,5-dione Chemical compound CN1C(=O)CC(=C)C1=O QSWFISOPXPJUCT-UHFFFAOYSA-N 0.000 description 1
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 1
- NQDOCLXQTQYUDH-UHFFFAOYSA-N 1-propan-2-ylpyrrole-2,5-dione Chemical compound CC(C)N1C(=O)C=CC1=O NQDOCLXQTQYUDH-UHFFFAOYSA-N 0.000 description 1
- YIKSHDNOAYSSPX-UHFFFAOYSA-N 1-propan-2-ylthioxanthen-9-one Chemical compound S1C2=CC=CC=C2C(=O)C2=C1C=CC=C2C(C)C YIKSHDNOAYSSPX-UHFFFAOYSA-N 0.000 description 1
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- BRKORVYTKKLNKX-UHFFFAOYSA-N 2,4-di(propan-2-yl)thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C(C)C)=CC(C(C)C)=C3SC2=C1 BRKORVYTKKLNKX-UHFFFAOYSA-N 0.000 description 1
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- LZHUBCULTHIFNO-UHFFFAOYSA-N 2,4-dihydroxy-1,5-bis[4-(2-hydroxyethoxy)phenyl]-2,4-dimethylpentan-3-one Chemical compound C=1C=C(OCCO)C=CC=1CC(C)(O)C(=O)C(O)(C)CC1=CC=C(OCCO)C=C1 LZHUBCULTHIFNO-UHFFFAOYSA-N 0.000 description 1
- LCHAFMWSFCONOO-UHFFFAOYSA-N 2,4-dimethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(C)=CC(C)=C3SC2=C1 LCHAFMWSFCONOO-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- GJKGAPPUXSSCFI-UHFFFAOYSA-N 2-Hydroxy-4'-(2-hydroxyethoxy)-2-methylpropiophenone Chemical compound CC(C)(O)C(=O)C1=CC=C(OCCO)C=C1 GJKGAPPUXSSCFI-UHFFFAOYSA-N 0.000 description 1
- IMSODMZESSGVBE-UHFFFAOYSA-N 2-Oxazoline Chemical compound C1CN=CO1 IMSODMZESSGVBE-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- 125000000022 2-aminoethyl group Chemical group [H]C([*])([H])C([H])([H])N([H])[H] 0.000 description 1
- FGTYTUFKXYPTML-UHFFFAOYSA-N 2-benzoylbenzoic acid Chemical compound OC(=O)C1=CC=CC=C1C(=O)C1=CC=CC=C1 FGTYTUFKXYPTML-UHFFFAOYSA-N 0.000 description 1
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/24—Plastics; Metallised plastics based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
- C09J7/241—Polyolefin, e.g.rubber
- C09J7/243—Ethylene or propylene polymers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2423/00—Presence of polyolefin
- C09J2423/04—Presence of homo or copolymers of ethene
- C09J2423/046—Presence of homo or copolymers of ethene in the substrate
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2433/00—Presence of (meth)acrylic polymer
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2467/00—Presence of polyester
- C09J2467/005—Presence of polyester in the release coating
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
- Dicing (AREA)
Abstract
Provided is a dicing tape which can appropriately hold a semiconductor wafer even when used for manufacturing the semiconductor wafer including a solvent cleaning step, and prevent a reduction in yield due to contamination of the wafer with an adhesive. The dicing tape of the present invention comprises: the dicing tape is used for a method for manufacturing a semiconductor wafer including a solvent cleaning step. The isopropanol elution of the adhesive layer is 5mg or less.
Description
Technical Field
The present invention relates to a dicing tape.
Background
A workpiece (e.g., a semiconductor wafer) as an aggregate of electronic components is manufactured in a large diameter, patterned on a front surface, and then a back surface is generally ground so that a thickness of the wafer becomes about 100 μm to 600 μm, and then cut and separated (diced) into small device pieces, and then the wafer is transferred to a mounting step. In the dicing step, the work is cut and diced. In the semiconductor manufacturing process, an adhesive sheet is used to fix a semiconductor wafer and a dicing frame (for example, SUS ring) used in a dicing process (for example, patent document 1).
In some cases, the semiconductor wafer is processed to be thin by a back grinding process, and the strength thereof is reduced, thereby causing cracks and/or warpage in the wafer. Further, handling of the wafer having a reduced strength is also difficult. Therefore, glass, hard plastic, or the like as a support material may be attached to the wafer in advance and a back grinding process may be performed to secure the strength of the wafer. The support member may be bonded to the wafer using, for example, an adhesive composition or an adhesive tape. The support material can support the wafer during the back grinding process and the back wiring and bump forming process. Thereafter, the wafer is bonded to an adhesive sheet (e.g., dicing tape), and the support member is peeled off and then subjected to a dicing step. Therefore, as an adhesive for bonding the support member, an adhesive which can be easily peeled off after the back grinding step has been proposed (for example, patent document 1). In general, when the support material is attached using an adhesive, the support material is peeled off by dissolving the adhesive using a solvent. However, in the cleaning (adhesive dissolution) step using the solvent, there is a problem that the adhesive strength of the pressure-sensitive adhesive tape (dicing tape) is reduced and the wafer cannot be sufficiently held. In addition, there is a problem that the adhesive dissolved in the solvent causes contamination of the wafer and a yield is lowered.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2003-007646
Patent document 2: japanese patent laid-open No. 2014-37458
Disclosure of Invention
Problems to be solved by the invention
The present invention has been made to solve the above-described conventional problems, and an object of the present invention is to provide a dicing tape which can appropriately hold a wafer and prevent a reduction in yield due to wafer contamination of an adhesive even when used for manufacturing a semiconductor wafer including a solvent cleaning step.
Means for solving the problems
The dicing tape of the present invention comprises: the dicing tape is used for a method for manufacturing a semiconductor wafer including a solvent cleaning step. The isopropanol elution of the adhesive layer is 5mg or less.
In 1 embodiment, the composition for forming the pressure-sensitive adhesive layer contains an additive having a weight-average molecular weight of 5000 or more.
In 1 embodiment, the content of the additive is 5 to 100 parts by weight based on 100 parts by weight of the base polymer of the adhesive.
In 1 embodiment, the dicing tape of the present invention is used by being bonded to an adherend having an uneven surface.
In 1 embodiment, the adherend having the uneven surface is a TSV wafer.
ADVANTAGEOUS EFFECTS OF INVENTION
The dicing tape of the present invention comprises: the pressure-sensitive adhesive layer comprises a base material and a pressure-sensitive adhesive layer disposed on one side of the base material, wherein the isopropanol elution of the pressure-sensitive adhesive layer is 5mg or less. By using such a dicing tape, it is possible to provide a dicing tape which can appropriately hold a wafer and prevent a reduction in yield due to wafer contamination of an adhesive even when used for manufacturing a semiconductor wafer including a solvent cleaning step.
Drawings
Fig. 1 is a schematic cross-sectional view of a dicing tape of 1 embodiment of the present invention.
Description of the reference numerals
10 base material
20 adhesive layer
100 cutting belt
Detailed Description
A. Outline of dicing tape
Fig. 1 is a schematic cross-sectional view of a dicing tape of 1 embodiment of the present invention. The dicing tape 100 of the illustrated example includes: a substrate 10, and an adhesive layer 20 disposed on one surface of the substrate 10. The adhesive layer is typically formed of an active energy ray-curable adhesive composition. In practical use, in order to suitably protect the adhesive layer 20 until use, a separator is temporarily bonded in a peelable manner to the adhesive layer 20. In addition, dicing tape 100 may also contain any suitable additional layers. Preferably, the adhesive layer is disposed directly on the substrate.
In another embodiment of the present invention, the pressure-sensitive adhesive layer is formed of 2 layers, and the dicing tape includes, in order: a substrate, a 1 st adhesive layer, and a 2 nd adhesive layer (not shown).
The dicing tape of the present invention is used for a method for manufacturing a semiconductor wafer including a solvent cleaning step. In the solvent cleaning step, cleaning with a hydrophobic organic solvent (e.g., d-limonene) for removing the adhesive used for attaching the support material, and cleaning with a hydrophilic solvent (e.g., isopropyl alcohol) for removing the organic solvent are performed. The isopropyl alcohol-eluted content of the pressure-sensitive adhesive layer 20 is 5mg or less, preferably 4mg or less, and more preferably 3mg or less. By setting the isopropyl alcohol elution amount of the adhesive layer to 5mg or less, even when the adhesive layer is used for manufacturing a semiconductor wafer including a solvent cleaning step, the wafer can be appropriately held, and a reduction in yield due to wafer contamination of the adhesive can be prevented. The smaller the amount of isopropyl alcohol eluted from the adhesive layer, the more preferable, for example, 0mg can be used. In the present specification, the isopropyl alcohol extract of the pressure-sensitive adhesive layer is a value measured by the following method. SUS Ring having an inner diameter of 75mm (inner diameter: 44.2 cm)2) To the pressure-sensitive adhesive layer of the dicing tape, 4ml of isopropyl alcohol was added to the inside of the SUS ring, and the resultant was left to stand for 30 minutes. Thereafter, the isopropyl alcohol was recovered into a glass bottle whose weight was measured in advance. Subsequently, the glass bottle was heated at 130 ℃ for 3 hours, and then dried at 180 ℃ for 1 hour, and the weight of the glass bottle was measured. The weight (mg) of the dissolved matter was determined by subtracting the weight of the heated glass bottle from the weight of the glass bottle before heating (before recovering isopropyl alcohol).
The initial adhesive force at 23 ℃ when the dicing tape of the present invention is attached to a stainless steel plate is preferably 0.2N/20mm to 10N/20mm, more preferably 0.5N/20mm to 6N/20 mm. In the present specification, the adhesive force refers to a force according to JISZ 0237: 2000 measured values. Specifically, the following values are indicated: the dicing tape was attached to a stainless steel plate (arithmetic average surface roughness Ra: 50. + -.25 nm) by reciprocating a 2kg roller 1 time, left at 23 ℃ for 30 minutes, and then peeled under the conditions of a peeling angle of 180 ℃ and a peeling speed (tensile speed) of 300 mm/min. In the present specification, the "initial adhesion" refers to an adhesion before irradiation with active energy rays.
In 1 embodiment, a dicing tape was attached to a silicon mirror wafer and irradiated with 460mJ/cm2The adhesive force at 23 ℃ after UV ray of (1) is preferably 0.01N/20mm to 0.3N/20mm, more preferably 0.02N/20mm to 0.2N/20 mm. In the case of such a range, a dicing tape in which the adhesive force is reduced by ultraviolet irradiation after dicing and picking up of a workpiece (for example, a semiconductor chip) formed into a small piece is easy can be obtained. The ultraviolet irradiation is performed by irradiating the adhesive layer with ultraviolet rays (characteristic wavelength: 365nm, cumulative light amount: 460 mJ/cm) from a high-pressure mercury lamp using, for example, an ultraviolet irradiation apparatus (product of Nindon Seiko Kagaku K., trade name: UM-810)2Irradiation energy: 70W/cm2)6.6 seconds.
The thickness of the dicing tape is preferably 35 to 500. mu.m, more preferably 60 to 300. mu.m, and still more preferably 80 to 200. mu.m.
The total light transmittance of the dicing tape is preferably 70% or more, more preferably 80% or more, further preferably 90% or more, and particularly preferably 95% or more. By using such dicing tape, the dicing tape can be suitably used also in a manufacturing process of a semiconductor wafer including an invisible dicing process. The total light transmittance of the dicing tape is, for example, 98% or less, preferably 99% or less.
The transmittance of light having a wavelength of 1064nm in the cut band is preferably 70% or more, more preferably 80% or more, further preferably 90% or more, and particularly preferably 95% or more. Within such a range, the method can be suitably used in a process for manufacturing a semiconductor wafer including a stealth dicing process. The transmittance of light having a wavelength of 1064nm in the cut band is, for example, 98% or less, preferably 99% or less.
The haze value of the dicing tape is preferably 20% or less, more preferably 10% or less, and further preferably 5% or less. Within such a range, the method can be suitably used in a process for manufacturing a semiconductor wafer including a stealth dicing process. The haze value of the dicing tape is, for example, 1% or more.
B. Base material
The substrate 10 may be made of any suitable resin. Examples of the resin include polyolefin resins such as polyethylene resins, polypropylene resins, polybutylene resins, and polymethylpentene resins, polyurethane resins, polyester resins, polyimide resins, polyether ketone resins, polystyrene resins, polyvinyl chloride resins, polyvinylidene chloride resins, fluorine resins, silicon resins, cellulose resins, and ionomer resins. Preferably a polyolefin resin.
In 1 embodiment, the base material comprises a polyethylene resin. Examples of the polyethylene resin include low-density polyethylene, linear polyethylene, medium-density polyethylene, high-density polyethylene, and ultra-low-density polyethylene.
The content ratio of the ethylene-derived structural unit in the polyethylene resin is preferably 80 mol% or more, more preferably 90 mol% or more, and still more preferably 95 mol% or more. Examples of the structural unit other than the structural unit derived from ethylene include structural units derived from a monomer copolymerizable with ethylene, such as propylene, 1-butene, isobutylene, 1-pentene, 2-methyl-1-butene, 3-methyl-1-butene, 1-hexene, 3-methyl-1-pentene, 4-methyl-1-pentene, 1-heptene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, and 1-eicosene.
The content of the polyethylene resin is preferably 80% by weight or more, more preferably 85% by weight to 100% by weight, and further preferably 95% by weight to 100% by weight of the resin forming the base material.
The substrate may further comprise any suitable additive. Examples of the additives include lubricants, antioxidants, ultraviolet absorbers, processing aids, fillers, antistatic agents, stabilizers, antibacterial agents, flame retardants, and colorants.
In 1 embodiment, one surface of the substrate is preferably subjected to embossing treatment. It is preferable that only one side of the base material is subjected to embossing treatment and the embossed side is the side on the pressure-sensitive adhesive layer side. By embossing the surface on the pressure-sensitive adhesive layer side, the adhesion between the pressure-sensitive adhesive layer and the substrate can be improved. The arithmetic average surface roughness Ra (JISB0601) of the unembossed surface of the substrate is preferably less than 1.0. mu.m, more preferably 0.8 μm or less, still more preferably 0.5 μm or less, and particularly preferably 0.01 to 0.5. mu.m. The arithmetic average surface roughness Ra (JISB0601) of the embossed surface of the substrate is preferably 1.0 to 3 μm, more preferably 1.4 to 2 μm. If the arithmetic average surface roughness Ra of the embossed surface of the base material exceeds 3 μm, a void may be easily generated between the pressure-sensitive adhesive layer and the base material. When the Ra is less than 1 μm, blocking may occur during storage of the substrate.
The thickness of the substrate is preferably 30 to 300. mu.m, more preferably 53 to 200. mu.m, and still more preferably 70 to 160. mu.m.
The total light transmittance of the substrate is preferably 70% or more, more preferably 80% or more, further preferably 90% or more, and particularly preferably 95% or more. The total light transmittance of the substrate is preferably 98% or less, more preferably 99% or less.
The tensile modulus of elasticity of the substrate at 22 ℃ is preferably 50MPa to 120MPa, more preferably 70MPa to 90 MPa. In the case of such a range, a dicing tape excellent in expandability can be obtained. For the measurement of the tensile elastic modulus of the base material, a tensile tester (product of SHIMADZU corporation, "AG-IS") was used, and the distance between chucks: 50mm, drawing speed: 300 mm/min, substrate width: 10 mm.
C. Adhesive layer
The adhesive layer 20 is formed using an adhesive layer-forming composition (adhesive composition). As described above, the isopropanol elution of the adhesive layer is 5mg or less. By setting the isopropyl alcohol elution of the adhesive layer to 5mg or less, it is possible to provide a dicing tape which can appropriately hold a wafer and prevent a reduction in yield due to contamination of the wafer with an adhesive even when used in a semiconductor wafer manufacturing process including a solvent cleaning process.
C-1. adhesive composition
As the adhesive composition (adhesive), any suitable adhesive can be used. Examples of the adhesive include acrylic adhesives, rubber adhesives, silicone adhesives, and polyvinyl ether adhesives.
In 1 embodiment, the adhesive composition is preferably an active energy ray-curable adhesive composition. By using an active energy ray-curable adhesive, a dicing tape can be obtained in which the adhesive force is reduced by irradiation with active energy rays (typically ultraviolet rays) after dicing, and picking up of a workpiece (for example, a semiconductor chip) that has been diced can be facilitated.
C-1-1. base Polymer
The adhesive composition may comprise a base polymer exhibiting adhesion. Examples of the monomer constituting the base polymer include hydrophilic monomers. As the hydrophilic monomer, any suitable monomer having a polar group can be used. Specific examples thereof include carboxyl group-containing monomers such as acrylic acid, methacrylic acid, carboxyethyl acrylate, carboxypentyl acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid; anhydride monomers such as maleic anhydride and itaconic anhydride; hydroxyl group-containing monomers such as 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 4-hydroxybutyl (meth) acrylate, 6-hydroxyhexyl (meth) acrylate, 8-hydroxyoctyl (meth) acrylate, 10-hydroxydecyl (meth) acrylate, 12-hydroxylauryl (meth) acrylate, and (4-hydroxymethylcyclohexyl) methyl methacrylate; sulfonic acid group-containing monomers such as styrenesulfonic acid, allylsulfonic acid, 2- (meth) acrylamido-2-methylpropanesulfonic acid, (meth) acrylamidopropanesulfonic acid, sulfopropyl (meth) acrylate, and (meth) acryloyloxynaphthalenesulfonic acid; phosphoric acid group-containing monomers such as 2-hydroxyethyl acryloyl phosphate; (N-substituted) amide monomers such as (meth) acrylamide, N-dimethyl (meth) acrylamide, N-butyl (meth) acrylamide, N-methylol (meth) acrylamide, N-methylolpropane (meth) acrylamide, and acryloylmorpholine; aminoalkyl ester (meth) acrylate monomers such as aminoethyl (meth) acrylate, N-dimethylaminoethyl (meth) acrylate, and t-butylaminoethyl (meth) acrylate; alkoxyalkyl (meth) acrylate monomers such as methoxyethyl (meth) acrylate and ethoxyethyl (meth) acrylate; maleimide monomers such as N-cyclohexylmaleimide, N-isopropylmaleimide, N-laurylmaleimide and N-phenylmaleimide; itaconimide-based monomers such as N-methylitaconimide, N-ethylitaconimide, N-butylitaconimide, N-octylitaconimide, N-2-ethylhexyl itaconimide, N-cyclohexylitaconimide and N-lauryl itaconimide; succinimide monomers such as N- (meth) acryloyloxymethylene succinimide, N- (meth) acryloyl-6-oxohexamethylene succinimide, and N- (meth) acryloyl-8-oxooctamethylene succinimide; vinyl monomers such as vinyl acetate, vinyl propionate, N-vinylpyrrolidone, methyl-vinylpyrrolidone, vinylpyridine, vinylpiperidone, vinylpyrimidine, vinylpiperazine, vinylpyrazine, vinylpyrrole, vinylimidazole, vinyloxazole, vinylmorpholine, N-vinylcarboxylic acid amides, styrene, alpha-methylstyrene and N-vinylcaprolactam; cyanoacrylate monomers such as acrylonitrile and methacrylonitrile; epoxy group-containing acrylic monomers such as glycidyl (meth) acrylate; glycol-based acrylate monomers such as polyethylene glycol (meth) acrylate, polypropylene glycol (meth) acrylate, methoxyethylene glycol (meth) acrylate, and methoxypolypropylene glycol (meth) acrylate; acrylate monomers having a heterocycle, a halogen atom, a silicon atom, and the like, such as tetrahydrofurfuryl (meth) acrylate, fluoro (meth) acrylate, and silicon (meth) acrylate; a polyfunctional monomer such as hexanediol di (meth) acrylate, (poly) ethylene glycol di (meth) acrylate, (poly) propylene glycol di (meth) acrylate, neopentyl glycol di (meth) acrylate, pentaerythritol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol hexa (meth) acrylate, epoxy acrylate, polyester acrylate, and urethane acrylate. As the hydrophilic monomer, a hydroxyl group-containing monomer and/or an (N-substituted) amide-based monomer can be suitably used. The hydrophilic monomer may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
In addition, the above-mentioned hydrophilic monomer and hydrophobic monomer may be used in combination. As the hydrophobic monomer, any suitable monomer may be used as long as it is a hydrophobic monomer. Specific examples thereof include vinyl alkyl or aryl ethers having an alkyl group with 9 to 30 carbon atoms such as vinyl 2-ethylhexanoate, vinyl laurate, vinyl stearate, and stearyl vinyl ether; alkyl esters having 6 to 30 carbon atoms of (meth) acrylic acid such as hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl acrylate, isononyl acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, dodecyl (meth) acrylate, 2-ethylhexyl (meth) acrylate, benzyl (meth) acrylate, lauryl (meth) acrylate, oleyl (meth) acrylate, palmityl (meth) acrylate, and stearyl (meth) acrylate; unsaturated vinyl esters of (meth) acrylic acid derived from fatty acids and fatty alcohols; a monomer derived from cholesterol; olefin monomers such as 1-butene, 2-butene, 1-pentene, 1-hexene, 1-octene, isobutylene and isoprene. The hydrophobic monomers may be used alone in 1 kind, or in combination of 2 or more kinds. The hydrophobic monomer used in the present invention is a monomer having a solubility of 0.02g or less with respect to 100g of water.
The base polymer may further contain a monomer component other than the hydrophilic monomer and the hydrophobic monomer. Examples of the other monomer component include alkyl acrylates such as butyl acrylate and ethyl acrylate. The other monomer components may be used alone in 1 kind, or may be used in combination in 2 or more kinds.
The base polymer may further contain a structural unit derived from an isocyanate compound having a curable functional group in the molecule. The base polymer containing a structural unit derived from an isocyanate compound can be obtained, for example, by reacting a substituent (for example, OH group) contained in a structural unit derived from the hydrophilic monomer with an NCO group of the isocyanate compound. Examples of the isocyanate compound include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, 2-acryloxyethyl isocyanate, and m-isopropenyl- α, α -dimethylbenzyl isocyanate.
The weight average molecular weight of the base polymer constituting the binder is preferably 30 to 200 ten thousand, and more preferably 50 to 150 ten thousand. The weight average molecular weight can be determined by GPC (solvent: THF).
C-1-2, additive with weight average molecular weight more than 5000
The adhesive composition preferably contains an additive having a weight average molecular weight of 5000 or more. By including such an additive, the amount of isopropyl alcohol eluted from the adhesive layer can be reduced. Even when the adherend has an uneven surface (for example, a TSV wafer), the pressure-sensitive adhesive layer adheres to the concave portion, and the adherend can be sufficiently held. The weight average molecular weight of the additive is preferably 7000 or more, more preferably 8000 or more, and further preferably 10000 or more. The weight average molecular weight of the additive is preferably 70000 or less, more preferably 50000 or less. The weight average molecular weight of the additive can be measured by GPC (solvent: THF), for example.
As the additive having a weight average molecular weight of 5000 or more, for example, any suitable polymer or oligomer can be used. Specifically, an active energy ray-reactive oligomer, a thermosetting oligomer, and the like can be mentioned. The active energy ray-reactive oligomer is preferable. Only 1 kind of such additives may be used, or 2 or more kinds may be used in combination.
Examples of the active energy ray-reactive oligomer include urethane acrylate oligomer, epoxy (meth) acrylate oligomer, and acrylic (meth) acrylate oligomer. Urethane acrylate oligomers, acrylic (meth) acrylate oligomers, and the like are preferably used.
As the active energy ray-reactive oligomer, a commercially available product can be used. Examples thereof include those manufactured by Nippon synthetic chemical industries, Violet (registered trademark) UV-3000B (weight average molecular weight: 18000), those manufactured by Toyo Kasei K.K., trade name: ARONIX M321 (weight average molecular weight: 10000), etc.
As the thermosetting oligomer, for example, any suitable oligomer having at least 1 glycidyl group, carboxyl group, hydroxyl group, amino group, or other thermosetting functional group can be used.
As described above, in 1 embodiment of the present invention, the adhesive layer has a 2-layer structure. When a dicing tape having such a 2-layer structure of the pressure-sensitive adhesive layer is produced, at least the 2 nd pressure-sensitive adhesive layer (the pressure-sensitive adhesive layer in contact with an adherend) may contain an additive having a weight average molecular weight of 5000 or more.
C-1-3 polymerization initiator
The active energy ray-curable adhesive composition typically contains a polymerization initiator. As the polymerization initiator, any suitable initiator can be used, and a photopolymerization initiator is preferably used. As the photopolymerization initiator, any suitable initiator can be used. Examples of the photopolymerization initiator include α -ketol compounds such as 4- (2-hydroxyethoxy) phenyl (2-hydroxy-2-propyl) ketone, α -hydroxy- α, α' -dimethylacetophenone, 2-methyl-2-hydroxypropiophenone, and 1-hydroxycyclohexyl phenyl ketone; acetophenone compounds such as methoxyacetophenone, 2-dimethoxy-2-phenylacetophenone, 2-diethoxyacetophenone and 2-methyl-1- [4- (methylthio) -phenyl ] -2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether; ketal compounds such as benzil dimethyl ketal; aromatic sulfonyl chloride compounds such as 2-naphthalenesulfonyl chloride; optically active oxime compounds such as 1-phenyl-1, 1-propanedione-2- (O-ethoxycarbonyl) oxime; benzophenone-based compounds such as benzophenone, benzoylbenzoic acid, and 3, 3' -dimethyl-4-methoxybenzophenone; thioxanthone compounds such as thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2, 4-dimethylthioxanthone, isopropylthioxanthone, 2, 4-dichlorothioxanthone, 2, 4-diethylthioxanthone and 2, 4-diisopropylthioxanthone; camphorquinone; a halogenated ketone; acyl phosphine oxides; acyl phosphonates and the like. The photopolymerization initiator may be used in a single type or in a combination of 2 or more types. The amount of the photopolymerization initiator to be used may be set to any appropriate amount. The amount of the photopolymerization initiator used is preferably 1 to 10 parts by weight, more preferably 3 to 7 parts by weight, based on 100 parts by weight of the base polymer.
As the photopolymerization initiator, commercially available products can be used. Examples thereof include trade names "Irgacure 651", "Irgacure 184", "Irgacure 369", "Irgacure 819" and "Irgacure 2959" manufactured by BASF corporation.
C-1-4. crosslinking agent
The active energy ray-curable adhesive composition preferably further contains a crosslinking agent. Examples of the crosslinking agent include isocyanate-based crosslinking agents, epoxy-based crosslinking agents, oxazoline-based crosslinking agents, aziridine-based crosslinking agents, melamine-based crosslinking agents, peroxide-based crosslinking agents, urea-based crosslinking agents, metal alkoxide-based crosslinking agents, metal chelate-based crosslinking agents, metal salt-based crosslinking agents, carbodiimide-based crosslinking agents, and amine-based crosslinking agents.
In 1 embodiment, an isocyanate-based crosslinking agent is preferably used. The isocyanate-based crosslinking agent is preferable in that it can react with various functional groups. Specific examples of the isocyanate-based crosslinking agent include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; alicyclic isocyanates such as cyclopentylene diisocyanate, cyclohexylene diisocyanate and isophorone diisocyanate; aromatic isocyanates such as 2, 4-tolylene diisocyanate, 4' -diphenylmethane diisocyanate, and xylylene diisocyanate; isocyanate adducts such as trimethylolpropane/tolylene diisocyanate trimer adduct (product name "CORONATE L", manufactured by Tosoh corporation), trimethylolpropane/hexamethylene diisocyanate trimer adduct (product name "CORONATE HL", manufactured by Nippon Polyurethane Industry Co., Ltd.), and isocyanurate of hexamethylene diisocyanate (product name "CORONATE HX", manufactured by Nippon Polyurethane Industry Co., Ltd.); and the like. It is preferable to use a crosslinking agent having 3 or more isocyanate groups.
The active energy ray-curable adhesive composition may further contain any appropriate additive. Examples of the additives include an active energy ray polymerization accelerator, a radical scavenger, a tackifier, a plasticizer (e.g., a trimellitate ester plasticizer and a pyromellitic ester plasticizer), a pigment, a dye, a filler, an age inhibitor, a conductive material, an antistatic agent, an ultraviolet absorber, a light stabilizer, a release modifier, a softener, a surfactant, a flame retardant, and an antioxidant.
The content of the crosslinking agent may be adjusted to any appropriate amount. For example, the amount is 0.005 to 20 parts by weight, preferably 0.02 to 10 parts by weight, based on 100 parts by weight of the base polymer. When the pressure-sensitive adhesive layer is formed of a single layer, the content of the crosslinking agent is preferably 0.1 to 10 parts by weight, more preferably 0.5 to 8 parts by weight, based on 100 parts by weight of the base polymer of the pressure-sensitive adhesive. In the case of such a range, a pressure-sensitive adhesive layer having an appropriately adjusted elastic modulus can be formed.
C-2 adhesive layer consisting of a single layer
In 1 embodiment, the adhesive layer is composed of a single layer. When the pressure-sensitive adhesive layer is composed of a single layer, the tensile modulus of elasticity at 22 ℃ of the pressure-sensitive adhesive layer is preferably 0.05 to 1MPa, more preferably 0.1 to 0.8MPa, and still more preferably 0.15 to 0.6 MPa. In the case where the thickness is within such a range, the pressure-sensitive adhesive layer can be formed with sufficient strength, and the pressure-sensitive adhesive layer can be favorably adhered to the substrate, whereby the occurrence of voids in the vicinity of the interface between the substrate and the pressure-sensitive adhesive layer can be suppressed. In particular, when a substrate having an embossed surface on the pressure-sensitive adhesive layer side is used, voids are generally likely to be generated. By setting the tensile elastic modulus of the pressure-sensitive adhesive layer to the above range, the occurrence of voids can be suppressed. If the tensile elastic modulus exceeds 1MPa, the pressure-sensitive adhesive layer may not follow the irregularities of the substrate when the pressure-sensitive adhesive layer is laminated on the embossed surface of the substrate. When the tensile elastic modulus is less than 0.05MPa, the pressure-sensitive adhesive layer may not retain a set shape and may not have sufficient properties. When the pressure-sensitive adhesive layer is formed of an active energy ray-curable pressure-sensitive adhesive as described above, the tensile elastic modulus at 22 ℃ before the irradiation with the active energy ray is preferably in this range. The method of measuring the tensile elastic modulus of the pressure-sensitive adhesive layer will be described later.
When the adhesive layer is formed of a single layer, the ultraviolet ray (460 mJ/cm) of the adhesive layer2) The tensile modulus of elasticity at 22 ℃ after irradiation is preferably 50MPa to E3000MPa, more preferably 100 to 1500MPa, and still more preferably 200 to 1000 MPa. Within such a range, a dicing tape having excellent pickup properties can be obtained.
When the pressure-sensitive adhesive layer is formed of a single layer, the thickness of the pressure-sensitive adhesive layer is preferably 5 to 470 μm, more preferably 7 to 247 μm, and still more preferably 10 to 130 μm. In the case where the pressure-sensitive adhesive layer is formed on the embossed surface within such a range, the pressure-sensitive adhesive layer can favorably fill the emboss and prevent the occurrence of useless voids.
The total light transmittance of the pressure-sensitive adhesive layer is preferably 70% or more, more preferably 80% or more, further preferably 90% or more, and particularly preferably 95% or more. The total light transmittance of the pressure-sensitive adhesive layer is, for example, 98% or less, preferably 99% or less.
The haze value of the pressure-sensitive adhesive layer is preferably 20% or less, more preferably 10% or less, and further preferably 5% or less. The haze value of the adhesive layer is, for example, 1% or more.
Adhesive layer consisting of C-3.2 layers
In another embodiment, the adhesive layer is composed of 2 layers. Hereinafter, for convenience, the pressure-sensitive adhesive layer on the substrate side is referred to as the 1 st pressure-sensitive adhesive layer, and the pressure-sensitive adhesive layer on the opposite side to the substrate is referred to as the 2 nd pressure-sensitive adhesive layer. The 1 st adhesive layer can be distinguished from the 2 nd adhesive layer by a difference in tensile elastic modulus. The 1 st adhesive layer is preferably less elastic than the 2 nd adhesive layer. By providing the 1 st pressure-sensitive adhesive layer having low elasticity on the substrate side, the pressure-sensitive adhesive layer and the substrate are favorably adhered to each other, and generation of voids in the vicinity of the interface between the substrate and the pressure-sensitive adhesive layer can be suppressed. In addition, the 2 nd adhesive layer having high elasticity can be used as a dicing tape which can contribute to high-precision dicing.
In this embodiment, the tensile modulus of elasticity at 22 ℃ of the 1 st pressure-sensitive adhesive layer is preferably 0.05 to 1MPa, more preferably 0.06 to 0.8MPa, and still more preferably 0.07 to 0.5 MPa. Within such a range, the adhesive layer and the substrate are favorably adhered to each other, and generation of voids in the vicinity of the interface between the substrate and the adhesive layer can be significantly suppressed. In particular, when a substrate having an embossed surface on the pressure-sensitive adhesive layer side is used, voids are generally likely to be generated. By setting the tensile elastic modulus of the pressure-sensitive adhesive layer to the above range, the occurrence of voids can be suppressed. When the 1 st pressure-sensitive adhesive layer is composed of an active energy ray-curable pressure-sensitive adhesive, the tensile elastic modulus at 22 ℃ before the irradiation with the active energy ray is preferably in this range.
In 1 embodiment, the ultraviolet ray (460 mJ/cm) of the adhesive layer 12) The tensile modulus at 22 ℃ after irradiation is preferably 50MPa to 300MPa, more preferably 100MPa to 1500MPa, and still more preferably 200MPa to 1000 MPa. Within such a range, the dicing tape can be suitably used as a dicing tape excellent in pickup property.
The tensile modulus of elasticity at 22 ℃ of the 2 nd pressure-sensitive adhesive layer is preferably 0.1MPa to 2MPa, more preferably 0.15MPa to 1.5MPa, and still more preferably 0.2MPa to 1 MPa. Within such a range, a dicing tape having appropriate rigidity as the entire adhesive layer and contributing to high-precision dicing can be obtained. When the 2 nd pressure-sensitive adhesive layer is formed of an active energy ray-curable pressure-sensitive adhesive, the tensile elastic modulus at 22 ℃ before the irradiation with the active energy ray is preferably in this range.
The thickness of the 1 st adhesive layer is preferably 5 to 468. mu.m, more preferably 7 to 244 μm. When the thickness of the 1 st pressure-sensitive adhesive layer is 5 μm or more, the 1 st pressure-sensitive adhesive layer is favorably filled and embossed when the 1 st pressure-sensitive adhesive layer is formed on the embossed surface, and the formation of useless voids can be prevented. In addition, when the 1 st adhesive layer is 468 μm or less, it becomes easy to pick up a work (for example, a semiconductor chip) which is formed into a small piece when used as a dicing tape.
The thickness of the 2 nd adhesive layer is preferably 2 to 465 μm, more preferably 3 to 240 μm.
When the pressure-sensitive adhesive layer is composed of 2 layers, the total thickness of the pressure-sensitive adhesive layer is preferably 7 to 470 μm, more preferably 10 to 247 μm, and still more preferably 15 to 130 μm.
When the pressure-sensitive adhesive layer is composed of 2 layers, the total light transmittance of the pressure-sensitive adhesive layer is preferably 70% or more, more preferably 80% or more, further preferably 90% or more, and particularly preferably 95% or more. The total light transmittance of the pressure-sensitive adhesive layer is, for example, 98% or less, preferably 99% or less.
When the pressure-sensitive adhesive layer is 2 layers, the haze value of the pressure-sensitive adhesive layer is preferably 20% or less, more preferably 10% or less, and still more preferably 5% or less. The haze value of the adhesive layer is, for example, 1% or more.
The pressure-sensitive adhesive described in the above item C-1 can be used as the pressure-sensitive adhesive constituting the 1 st pressure-sensitive adhesive layer and the 2 nd pressure-sensitive adhesive layer. An active energy ray-curable adhesive is preferably used.
The content of the crosslinking agent in the active energy ray-curable pressure-sensitive adhesive constituting the 1 st pressure-sensitive adhesive layer is preferably 0.005 to 5 parts by weight, more preferably 0.02 to 3 parts by weight, based on 100 parts by weight of the base polymer of the pressure-sensitive adhesive. Within such a range, the adhesive layer can be formed so as to have an appropriately adjusted elastic modulus, to fill the embossed surface of the substrate satisfactorily, and to maintain a set shape.
The content of the crosslinking agent in the active energy ray-curable adhesive constituting the 2 nd adhesive layer is preferably 1 to 20 parts by weight, more preferably 2 to 10 parts by weight, based on 100 parts by weight of the base polymer of the adhesive. In the case of such a range, an adhesive layer in which the elastic modulus and the adhesive force (adhesive force capable of achieving both holding of the wafer at the time of dicing and picking up of the chip after dicing) are appropriately adjusted can be formed.
D. Method for manufacturing dicing tape
The dicing tape described above may be manufactured by any suitable method. The dicing tape can be obtained by, for example, applying the above adhesive to a substrate. As the coating method, various methods such as bar coater coating, air knife coating, gravure reverse coating, reverse roll coating, lip coating, die coating, dip coating, offset printing, flexographic printing, screen printing, and the like can be used. In addition, a method of separately forming an adhesive layer on the separator and then bonding the adhesive layer to the substrate may be employed.
[ examples ]
The present invention will be described more specifically with reference to the following examples, but the present invention is not limited to these examples. The test and evaluation methods in the examples are as follows. Unless otherwise specified, "part(s)" and "%" are based on weight.
< production example 1> preparation of Polymer solution
Monomer liquid 1 was prepared by mixing 100 parts by weight of 2-methoxyethyl acrylate, 27 parts by weight of acryloyl morpholine, and 22 parts by weight of 2-hydroxyethyl acrylate. Subsequently, a nitrogen gas was introduced into a reaction vessel equipped with a nitrogen introduction tube, a thermometer and a stirrer, and 500 parts by weight of ethyl acetate, 0.2 parts by weight of monomer liquid 1 and Azobisisobutyronitrile (AIBN) were charged under a nitrogen atmosphere, and stirring was performed at 60 ℃ for 24 hours. Thereafter, the mixture was cooled to room temperature to obtain an acrylic copolymer solution containing an acrylic copolymer (weight average molecular weight: 60 ten thousand). To the obtained acrylic copolymer solution was added 24 parts by weight of 2-methacryloyloxyethyl isocyanate to cause a reaction, thereby obtaining an acrylic copolymer solution 1 (polymer) in which the terminal OH of the side chain of 2-hydroxyethyl acrylate in the copolymer was added to the NCO group and the terminal had a carbon-carbon double bond, and which had a weight average molecular weight of 80 ten thousand.
[ examples 1 to 6]
(preparation of adhesive layer-forming composition 1)
An adhesive composition was obtained by mixing and stirring 100 parts by weight of the acrylic polymer solution obtained in production example 1 with 0.025 parts by weight of a crosslinking agent (product name: CORONATE L, manufactured by tokyo corporation), 7 parts by weight of a photopolymerization initiator (product name: Irgacure 184, manufactured by BASF corporation), and a diluting solvent (ethyl acetate).
(preparation of adhesive layer-forming composition)
An adhesive composition was obtained by mixing and stirring 7 parts by weight of a photopolymerization initiator (Irgacure 184, product of ciba japan) and the amount of a crosslinking agent (CORONATE L, product of tokyo co., ltd.) and additives described in table 1, and a diluting solvent (ethyl acetate) to 100 parts by weight of the acrylic polymer solution obtained in production example 1.
(preparation of base Material)
High-pressure Polyethylene (PE) (product name: SUMIKATHENE F213-P, manufactured by Sumitomo chemical Co., Ltd.) was put into an extruder, and subjected to T-die melt coextrusion (extruder: GM ENGINEERING co., manufactured by Ltd., product name: GM30-28/T die: feedblock type; extrusion temperature 240 ℃ C.), followed by subjecting one surface of the film to surface roughness Ra: embossing treatment of 1.42 μm gave a film having a thickness of 100. mu.m. Note that the thickness of the layer is controlled by the shape of the T-die exit. The embossed side of the resulting film was corona treated. The surface roughness Ra of the embossed surface was measured by the trade name of KEYENCECORPORATION: VK-X150.
(production of separator)
One surface of a polyethylene terephthalate (PET) film (product name: MRF38, thickness: 38 μm, manufactured by Mitsubishi resin corporation) was subjected to silicone treatment to obtain a separator.
(preparation of dicing tape)
The 1 st adhesive layer-forming composition was applied to the silicone-treated surface of the separator, and then heated at 120 ℃ for 2 minutes to form a 1 st adhesive layer having a thickness of 10 μm.
Separately, the 2 nd pressure-sensitive adhesive layer-forming composition was applied to the silicone-treated surface of the separator, and then heated at 120 ℃ for 2 minutes to form a pressure-sensitive adhesive layer having a thickness shown in table 1.
The 1 st adhesive layer was transferred to a substrate using a hand press roll, and the 2 nd adhesive layer was further transferred to the 1 st adhesive layer, followed by aging treatment at 50 ℃ for 48 hours to obtain a dicing tape. The adhesive layer is laminated on the embossed surface of the substrate.
Comparative examples 1 to 7
Dicing tapes were obtained in the same manner as in examples except that the additives shown in Table 1 were used and the crosslinking agent and additives were used in amounts shown in Table 1.
The dicing tapes obtained in examples and comparative examples were used to perform the following evaluations. The results are shown in Table 1.
(1) Determination of the isopropanol extract
SUS Ring having an inner diameter of 75mm (inner diameter: 44.2 cm)2) Plaster with adhesive layerTo the adhesive layer of the dicing tape, 4ml of isopropyl alcohol was added to the inside of the SUS ring, and the mixture was left to stand for 30 minutes. Thereafter, the isopropyl alcohol was recovered into a glass bottle whose weight was measured in advance. Subsequently, the glass bottle was heated at 130 ℃ for 3 hours, and then dried at 180 ℃ for 1 hour, and the weight of the glass bottle was measured. The weight of the dissolved matter was determined by subtracting the weight of the heated glass bottle from the weight of the glass bottle before heating (before recovering isopropyl alcohol).
(2) Following height difference (embedding bump)
A dicing tape was bonded to a semiconductor wafer (a 4-inch silicon mirror wafer having bumps formed at a height of 5 μm/spacing of 30 μm) by using a back-grinding tape bonding machine (product name: R-3000III, manufactured by Nindon Seiki Seisaku-Sho K.K.) under a condition that the conveying speed of the dicing tape was 10mm/sec and the pressing force at the time of bonding was 0.20 MPa. After the bonding, the semiconductor wafer with the dicing tape was placed in an environment at 22 ℃ and the height difference following property was evaluated by whether or not the dicing tape was bonded to the bump-to-bump spacing using an optical microscope (250 times). In table 1, the case where the dicing tape was bonded to the gap was indicated by o, and the case where the dicing tape was not bonded was indicated by x.
[ Table 1]
As is clear from Table 1, the dicing tapes of examples 1 to 6 had a small amount of dissolved isopropyl alcohol and prevented contamination of the wafers. Further, the resin composition is excellent in embeddability and can be suitably used for an adherend having uneven surfaces.
Claims (5)
1. A dicing tape comprising: a base material and an adhesive layer disposed on one side of the base material,
the dicing tape is used in a method for manufacturing a semiconductor wafer including a solvent cleaning process,
the isopropanol elution of the adhesive layer is 5mg or less.
2. The dicing tape according to claim 1, wherein the composition forming the adhesive layer contains an additive having a weight average molecular weight of 5000 or more.
3. The dicing tape according to claim 2, wherein the additive is contained in an amount of 5 to 100 parts by weight with respect to 100 parts by weight of the base polymer of the composition forming the adhesive layer.
4. The dicing tape according to any one of claims 1 to 3, which is used by being attached to an adherend having an uneven surface.
5. The dicing tape according to any one of claims 1 to 4, wherein the adherend having an uneven surface is a TSV wafer.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2019-054576 | 2019-03-22 | ||
| JP2019054576A JP7324023B2 (en) | 2019-03-22 | 2019-03-22 | dicing tape |
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| CN111725122A true CN111725122A (en) | 2020-09-29 |
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| CN202010211027.0A Pending CN111725122A (en) | 2019-03-22 | 2020-03-20 | Cutting belt |
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| JP (1) | JP7324023B2 (en) |
| KR (1) | KR20200112705A (en) |
| CN (1) | CN111725122A (en) |
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| KR102521063B1 (en) * | 2021-03-25 | 2023-04-13 | 율촌화학 주식회사 | Dicing tape with excellent solvent resistance |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120850A (en) * | 2004-10-21 | 2006-05-11 | Anritsu Corp | Manufacturing method of semiconductor chip |
| JP2007277282A (en) * | 2006-04-03 | 2007-10-25 | Nitto Denko Corp | Pressure-sensitive adhesive sheet for processing semiconductor wafer |
| CN103426743A (en) * | 2012-05-15 | 2013-12-04 | 古河电气工业株式会社 | Method of dicing semiconductor wafer, and dicing tape for processing semiconductor using the same |
| CN105765700A (en) * | 2013-11-29 | 2016-07-13 | 古河电气工业株式会社 | Semiconductor-processing pressure-sensitive adhesive tape |
| CN107924864A (en) * | 2016-06-30 | 2018-04-17 | 华殷高科技股份有限公司 | Ultraviolet ray hardening type bonding sheet is used in back side grinding processing after semiconductor wafer hemisect |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003007646A (en) | 2001-06-18 | 2003-01-10 | Nitto Denko Corp | Adhesive sheet for dicing and method of manufacturing cut chip |
| JP2014037458A (en) | 2012-08-13 | 2014-02-27 | Tokyo Ohka Kogyo Co Ltd | Adhesive composition, adhesive film, and adhesion method |
| KR102394517B1 (en) * | 2014-03-03 | 2022-05-06 | 린텍 가부시키가이샤 | Sheet for semiconductor-related-member processing and process for producing chip using said sheet |
| JP2018115333A (en) * | 2018-03-20 | 2018-07-26 | リンテック株式会社 | Adhesive tape and method for producing semiconductor device |
-
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- 2019-03-22 JP JP2019054576A patent/JP7324023B2/en active Active
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- 2020-03-02 TW TW109106736A patent/TWI837315B/en active
- 2020-03-18 KR KR1020200033004A patent/KR20200112705A/en not_active Application Discontinuation
- 2020-03-20 CN CN202010211027.0A patent/CN111725122A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006120850A (en) * | 2004-10-21 | 2006-05-11 | Anritsu Corp | Manufacturing method of semiconductor chip |
| JP2007277282A (en) * | 2006-04-03 | 2007-10-25 | Nitto Denko Corp | Pressure-sensitive adhesive sheet for processing semiconductor wafer |
| CN103426743A (en) * | 2012-05-15 | 2013-12-04 | 古河电气工业株式会社 | Method of dicing semiconductor wafer, and dicing tape for processing semiconductor using the same |
| CN105765700A (en) * | 2013-11-29 | 2016-07-13 | 古河电气工业株式会社 | Semiconductor-processing pressure-sensitive adhesive tape |
| CN107924864A (en) * | 2016-06-30 | 2018-04-17 | 华殷高科技股份有限公司 | Ultraviolet ray hardening type bonding sheet is used in back side grinding processing after semiconductor wafer hemisect |
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| TWI837315B (en) | 2024-04-01 |
| KR20200112705A (en) | 2020-10-05 |
| JP7324023B2 (en) | 2023-08-09 |
| TW202039745A (en) | 2020-11-01 |
| JP2020155689A (en) | 2020-09-24 |
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