WO2023100401A1 - Adhesive sheet - Google Patents

Adhesive sheet Download PDF

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Publication number
WO2023100401A1
WO2023100401A1 PCT/JP2022/025049 JP2022025049W WO2023100401A1 WO 2023100401 A1 WO2023100401 A1 WO 2023100401A1 JP 2022025049 W JP2022025049 W JP 2022025049W WO 2023100401 A1 WO2023100401 A1 WO 2023100401A1
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WO
WIPO (PCT)
Prior art keywords
pressure
sensitive adhesive
adhesive sheet
layer
weight
Prior art date
Application number
PCT/JP2022/025049
Other languages
French (fr)
Japanese (ja)
Inventor
克矩 伊藤
みずほ 千葉
Original Assignee
日東電工株式会社
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Filing date
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Publication of WO2023100401A1 publication Critical patent/WO2023100401A1/en

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00Layered products comprising a layer of synthetic resin
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B32LAYERED PRODUCTS
    • B32BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04Interconnection of layers
    • B32B7/06Interconnection of layers permitting easy separation
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J183/00Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
    • C09J183/04Polysiloxanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22Plastics; Metallised plastics
    • C09J7/25Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/20Adhesives in the form of films or foils characterised by their carriers
    • C09J7/29Laminated material
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38Pressure-sensitive adhesives [PSA]
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304Mechanical treatment, e.g. grinding, polishing, cutting

Definitions

  • the present invention relates to an adhesive sheet.
  • Patent Document 1 a substrate (member to be processed) is processed in a state temporarily fixed to a support via an adhesive layer and a separation layer, and after processing, the separation layer is destroyed by laser light irradiation, and adhesion is performed.
  • a method is described in which the substrate is peeled from the support together with the adhesive layer, and then the adhesive layer is removed from the substrate.
  • the above method requires a step of removing the adhesive layer from the member and cleaning the non-adhesive surface of the member, which poses a problem in terms of production cost.
  • Patent Document 2 a plurality of workpieces are temporarily fixed to a carrier via an adhesive layer, and a laser beam is focused on the adhesive layer to generate blisters, thereby partially fixing the workpieces.
  • a method for optionally separating and transferring from the carrier is described.
  • this method has the problem that the blisters generated after laser irradiation spread over time, resulting in peeling of the carrier and unnecessary dropping of the workpiece that does not require transfer.
  • the present invention has been made to solve the above-mentioned conventional problems, and its object is to provide a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a releasable manner, and is releasable with a low-power laser beam. To provide a pressure-sensitive adhesive sheet in which the peeling is exhibited in a narrow range, without the need for a step of washing the adherend after peeling.
  • the pressure-sensitive adhesive sheet of the present invention comprises a pressure-sensitive adhesive layer, a substrate, and a transfer layer in this order, and the pressure-sensitive adhesive layer contains a silicone-based pressure-sensitive adhesive.
  • the pressure-sensitive adhesive layer has a light transmittance of 25% or more at a wavelength of 248 nm.
  • the base material has a light transmittance of 60% or less at a wavelength of 248 nm.
  • the substrate is composed of a polyester-based resin and/or a polyimide-based resin.
  • the base material has a thickness of 50 ⁇ m or less.
  • the transfer layer is a layer that is cured by irradiation with active energy rays.
  • the transfer layer has a thickness of 50 ⁇ m or less.
  • the adhesive force I at 23° C. when the adhesive layer of the adhesive sheet is adhered to a glass plate is 2 N/20 mm or more.
  • the adhesive strength I at 23° C. when the adhesive layer of the adhesive sheet is attached to a glass plate is measured at 23° C. after irradiating the transfer layer with ultraviolet rays of 300 mJ/cm 2 .
  • the ratio to the adhesive strength B is 5 or more.
  • the indentation elastic modulus B of the transfer layer at 23°C is five times or more the indentation elastic modulus I of the pressure-sensitive adhesive layer at 23°C after irradiation with ultraviolet rays of 300 mJ/cm 2 .
  • the pressure-sensitive adhesive sheet is used to temporarily fix a member to a support, and after transfer and/or processing, the member is peeled off from the support by laser light irradiation.
  • the member is a semiconductor wafer, optical semiconductor element, miniLED or microLED.
  • a pressure-sensitive adhesive sheet capable of releasably temporarily fixing an adherend, exhibiting releasability with a low-power laser beam, and eliminating the need for a step of washing the adherend after peeling, and , it is possible to provide a pressure-sensitive adhesive sheet in which peeling occurs in a narrow range.
  • FIG. 1 is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention.
  • FIG. 1 is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention.
  • the adhesive sheet 100 according to this embodiment comprises an adhesive layer 10, a substrate 20, and a transfer layer 30.
  • the adhesive layer 10 contains a silicone-based adhesive.
  • the pressure-sensitive adhesive sheet of the present invention may be provided with a release liner on the outside of the pressure-sensitive adhesive layer and the transfer layer for the purpose of protecting the pressure-sensitive adhesive surface until it is used.
  • the pressure-sensitive adhesive sheet may further contain any appropriate other layer as long as the effects of the present invention can be obtained.
  • the substrate and the transfer layer are laminated directly (that is, without interposing another layer).
  • the pressure-sensitive adhesive sheet of the present invention can be used to temporarily fix a member to a support (for example, a glass substrate) using the pressure-sensitive adhesive sheet, and peel the member from the support after transfer, processing, and the like.
  • the pressure-sensitive adhesive sheet can be used by attaching the pressure-sensitive adhesive layer to a support (for example, a glass substrate). At the time of peeling, laser light irradiation is performed, and only a member at a desired position can be peeled with pinpoint accuracy.
  • the transfer layer may be a layer exhibiting releasability upon irradiation with a laser beam. Moreover, laser light irradiation can be performed from the pressure-sensitive adhesive layer side.
  • the base material In the pressure-sensitive adhesive sheet, the base material is partially distorted by laser light irradiation, and this distortion propagates to the transfer layer, temporarily changing the shape of the transfer layer surface (adhering surface). It becomes possible to peel off the member (adherend) arranged at the location.
  • the components of the pressure-sensitive adhesive layer for example, the type of base polymer, etc.
  • the pressure-sensitive adhesive layer can transmit a laser beam of a predetermined wavelength, and as a result, distortion of the substrate is likely to occur.
  • the base material can be easily strained. For example, if the substrate is configured so that laser light of a predetermined wavelength is difficult to pass through, the substrate can be easily distorted.
  • the peelability is exhibited by the above action, so a high-power laser beam is not required, the step of washing the adherend after peeling is unnecessary, and the peeling area is narrowed. be able to.
  • the change in the surface shape of the transfer layer does not persist (that is, it does not widen over time, but rather can return to the shape before the change). It is possible to prevent troubles such as unnecessary dropping of the adherend.
  • the present invention is advantageous in that the power of laser light irradiation required for peeling can be reduced.
  • peeling occurs preferably by low-power laser light irradiation, so damage to the member to be processed is small, and unnecessary deformation of the pressure-sensitive adhesive layer and accompanying detachment from the support are prevented. be able to.
  • the pressure-sensitive adhesive sheet of the present invention can contribute to production cost reduction.
  • the use of the pressure-sensitive adhesive sheet of the present invention is advantageous in that the range of selection of manufacturing equipment is widened.
  • the adhesive force I at 23° C. when the adhesive layer of the adhesive sheet is attached to a glass plate is preferably 0.02 N/20 mm or more, more preferably 2 N/20 mm or more, and still more preferably 2 N/ It is 20 mm to 25 N/20 mm, more preferably 5 N/20 mm to 20 N/20 mm.
  • Adhesion is measured according to JIS Z 0237:2000.
  • the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet is adhered to a glass plate (arithmetic mean surface roughness Ra: 50 ⁇ 25 nm) by reciprocating a 2 kg roller once, and left at 23 ° C. for 30 minutes. It is measured by peeling off the pressure-sensitive adhesive sheet under the conditions of 180° and peeling speed (tensile speed) of 300 mm/min.
  • the initial adhesive force A at 23° C. immediately after the transfer layer of the adhesive sheet is attached to the stainless steel plate is preferably 1 N/20 mm to 20 N/20 mm, more preferably 1.5 N/20 mm to 15 N/20 mm. , more preferably 2 N/20 mm to 10 N/20 mm. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet that can hold an adherend well. Adhesion on the transfer layer side is also measured according to JIS Z 0237:2000. Specifically, the transfer layer of the adhesive sheet was adhered to a stainless steel plate (arithmetic mean surface roughness Ra: 50 ⁇ 25 nm) by reciprocating a 2 kg roller once, left at 23° C. for 30 minutes, and peeled at a peeling angle of 180.
  • the adhesive strength of the transfer layer changes due to irradiation with active energy rays and laser light, and the term "initial adhesive strength" as used herein means the adhesive strength before irradiation with active energy rays and laser light.
  • the adhesive sheet has an adhesive strength B at 23 ° C. after the adhesive sheet is attached to the stainless steel plate and the transfer layer is irradiated with ultraviolet rays of 300 mJ / cm 2 (also known as adhesive strength B after curing is preferably 1 N/20 mm or less, more preferably 0.5 N/20 mm or less, still more preferably 0.2 N/20 mm or less, and particularly preferably 0.1 N/20 mm or less. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet with excellent releasability and little adhesive residue.
  • the lower limit of the post-curing adhesive strength B is, for example, 0.01 N/20 mm (preferably 0.001 N/20 mm).
  • the ultraviolet irradiation is performed by, for example, using an ultraviolet irradiation device (manufactured by Nitto Seiki Co., Ltd., trade name “UM-810”) and applying ultraviolet rays (characteristic wavelength: 365 nm, integrated light amount: 300 mJ/cm 2 ) from a high-pressure mercury lamp to the transfer layer. It is done by irradiation. Ultraviolet irradiation can be performed from the pressure-sensitive adhesive layer side.
  • the ratio of the adhesive strength I at 23° C. to the adhesive strength B after curing of the transfer layer when the adhesive layer is attached to the glass is 5 or more.
  • the post-curing adhesive strength B is 0.2 times or less (preferably 0.1 times or less, more preferably 0.05 times or less, and still more preferably 0.02 times) the adhesive strength I after curing. below).
  • Such a pressure-sensitive adhesive sheet can achieve reliable releasability in a narrow range.
  • Adhesive strength I/adhesive strength after curing B is preferably 10 or more, more preferably 20 or more, still more preferably 50 or more, particularly preferably 70 or more, and most preferably 90 or more. be. Within such a range, the effect of the present invention is remarkable.
  • the upper limit of (adhesive strength I/post-curing adhesive strength B) is, for example, 1,000, preferably 5,000, and more preferably 10,000. That is, in the pressure-sensitive adhesive sheet, the post-curing adhesive force B can be 0.0001 times or more the adhesive force I.
  • the ratio of the initial adhesive strength A of the transfer layer to the adhesive strength B after curing of the transfer layer is preferably 5 or more, more preferably 10 or more, and more preferably 10 to 100, more preferably 20 to 100, particularly preferably 30 to 80. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet having an excellent balance between fixability and releasability of an adherend.
  • the anchoring force at 23° C. between the layers (e.g., transfer layer, base material, other layers) arranged in contact with the pressure-sensitive adhesive layer and the pressure-sensitive adhesive layer is preferably 2 N/20 mm or more. , more preferably 4 N/20 mm or more, still more preferably 6 N/20 mm or more, and particularly preferably 8 N/20 mm or more.
  • the upper limit of the anchoring force is, for example, 30N/20mm (preferably 50N/20mm).
  • the anchoring force is measured by peeling off the adhesive layer from the adjacent layer under the conditions of 23° C., 180° peeling angle, and 300 mm/min peeling speed (tensile speed).
  • the anchoring force at 23° C. between a layer (e.g., pressure-sensitive adhesive layer, base material, other layer) disposed in contact with the transfer layer and the transfer layer is preferably 2 N/20 mm or more, It is more preferably 4 N/20 mm or more, still more preferably 6 N/20 mm or more, and particularly preferably 8 N/20 mm or more.
  • the upper limit of the anchoring force is, for example, 30N/20mm (preferably 50N/20mm).
  • the anchoring force is measured by peeling off the transfer layer from the adjacent layer under conditions of 23° C., a peel angle of 180°, and a peel speed (tensile speed) of 300 mm/min.
  • the haze value of the adhesive sheet of the present invention is preferably 70% or less, more preferably 65% or less. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet in which the transfer layer is favorably cured by irradiation with active energy rays. In one embodiment, the adhesive sheet has a haze value of 20% or less. The haze value of the adhesive sheet is preferably as low as possible, but its lower limit is, for example, 0.1%.
  • the thickness of the adhesive sheet is preferably 1 ⁇ m to 300 ⁇ m, more preferably 5 ⁇ m to 200 ⁇ m. In one embodiment, the adhesive sheet has a thickness of 30 ⁇ m or less. If the pressure-sensitive adhesive sheet is thin, strain generated in the base material is easily propagated to the transfer layer, and a pressure-sensitive adhesive sheet with excellent peelability can be obtained.
  • the thickness of the transfer layer is preferably 50 ⁇ m or less, more preferably 40 ⁇ m or less, still more preferably 30 ⁇ m or less, particularly preferably 20 ⁇ m or less, most preferably 10 ⁇ m or less. Within such a range, strain generated in the base material is easily propagated to the surface of the transfer layer, and a pressure-sensitive adhesive sheet having excellent peelability can be obtained.
  • the lower limit of the thickness of the transfer layer is, for example, 2 ⁇ m.
  • the transfer layer is a layer that is cured by irradiation with active energy rays. More specifically, in the present embodiment, the transfer layer has adhesiveness for fixing the member (adherend), and is configured to be cured by irradiation with active energy rays to reduce the adhesiveness. be done.
  • the transfer layer has adhesiveness for fixing the member (adherend), and is configured to be cured by irradiation with active energy rays to reduce the adhesiveness. be done.
  • adhesive strength to the extent that the adherend can be fixed for example, adhesive strength to the extent that the adherend does not fall naturally
  • the irradiation with active energy rays reduces the adhesive strength of the entire transfer layer.
  • active energy rays examples include gamma rays, ultraviolet rays, visible rays, infrared rays (heat rays), radio waves, alpha rays, beta rays, electron beams, plasma currents, ionizing rays, and particle beams.
  • Ultraviolet rays are preferred.
  • the initial indentation modulus A of the transfer layer at 23° C. is preferably 0.1 MPa or more and less than 14 MPa, more preferably 0.1 MPa to 10 MPa, even more preferably 0.2 MPa to 5 MPa, and particularly preferably 0.5 MPa to 2 MPa. With such a range, it is possible to obtain a pressure-sensitive adhesive sheet with excellent fixability.
  • the indentation modulus can be measured by the single indentation method at 23° C. with an indentation speed of 10 nm/s and an indentation depth of 100 nm.
  • the adhesive strength of the transfer layer changes due to irradiation with active energy rays and laser light.
  • the term "initial indentation elastic modulus A" means the adhesive strength before irradiation with active energy rays and laser light. do.
  • the transfer layer is preferably a layer having an indentation elastic modulus B (also referred to as post-curing elastic modulus B) at 23° C. of 14 MPa or more after irradiation with ultraviolet rays of 300 mJ/cm 2 , and a layer having 15 MPa or more. It is more preferable to be a layer of 20 MPa or more, more preferably of 50 MPa or more, and most preferably of 100 MPa or more. Within such a range, a pressure-sensitive adhesive sheet with excellent peelability can be obtained. In addition, contamination of the adherend during peeling can be prevented.
  • the upper limit of the post-curing elastic modulus B at 23° C. is, for example, 500 MPa (preferably 300 MPa).
  • the indentation modulus B of the transfer layer at 23° C. is preferably 20 times or more, more preferably 30 times or more, the initial indentation modulus A of the transfer layer at 23° C. more preferably 30 to 1,000 times, and particularly preferably 50 to 200 times. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet having an excellent balance between fixability and releasability of an adherend.
  • the indentation elastic modulus B at 23° C. is preferably 5 times or more the indentation elastic modulus I at 23° C. of the pressure-sensitive adhesive layer, preferably 10 times or more. more preferably 50-fold to 5000-fold, more preferably 80-fold to 4500-fold, and particularly preferably 100-fold to 3000-fold.
  • deformation of each layer by laser light irradiation can be optimized, and a pressure-sensitive adhesive sheet with excellent peelability by laser light irradiation can be obtained.
  • Such a pressure-sensitive adhesive sheet can achieve reliable releasability in a narrow range.
  • the transfer layer contains an active energy ray-curable adhesive.
  • the transfer layer may further contain an ultraviolet absorber and/or a photoinitiator.
  • the active energy ray-curable pressure-sensitive adhesive is an active energy ray-curable adhesive containing a base polymer as a base material and an active energy ray-reactive compound (monomer or oligomer) capable of bonding with the base polymer.
  • An adhesive (A1) is used.
  • an active energy ray-curable pressure-sensitive adhesive (A2) containing an active energy ray-reactive polymer as a base polymer is used.
  • the base polymer has functional groups capable of reacting with the photoinitiator. Examples of the functional group include hydroxyl group and carboxyl group.
  • Examples of the base polymer used in the adhesive (A1) include natural rubber, polyisobutylene rubber, styrene/butadiene rubber, styrene/isoprene/styrene block copolymer rubber, recycled rubber, butyl rubber, polyisobutylene rubber, and nitrile rubber.
  • rubber-based polymers such as (NBR); silicone-based polymers; and acrylic polymers. These polymers may be used alone or in combination of two or more. Among them, acrylic polymers are preferred.
  • acrylic polymers include homopolymers and copolymers of hydrocarbon group-containing (meth)acrylic esters such as (meth)acrylic acid alkyl esters, (meth)acrylic acid cycloalkyl esters, and (meth)acrylic acid aryl esters.
  • hydrocarbon group-containing (meth)acrylic esters such as (meth)acrylic acid alkyl esters, (meth)acrylic acid cycloalkyl esters, and (meth)acrylic acid aryl esters.
  • (Meth)acrylic acid alkyl esters include, for example, (meth)acrylic acid methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, iso Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester or lauryl ester, tridecyl ester, tetradecyl ester, hexa Decyl esters, octa
  • (Meth)acrylic acid cycloalkyl esters include, for example, cyclopentyl and cyclohexyl esters of (meth)acrylic acid.
  • (Meth)acrylic acid aryl esters include, for example, phenyl (meth)acrylate and benzyl (meth)acrylate.
  • the content of structural units derived from the hydrocarbon group-containing (meth)acrylic acid ester is preferably 40 parts by weight or more, more preferably 60 parts by weight or more, relative to 100 parts by weight of the base polymer.
  • Examples of other copolymerizable monomers include carboxy group-containing monomers, acid anhydride monomers, hydroxy group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, acrylamide, and acrylonitrile.
  • Examples include functional group-containing monomers.
  • Carboxy group-containing monomers include, for example, acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid.
  • Anhydride monomers include, for example, maleic anhydride and itaconic anhydride.
  • hydroxy group-containing monomers examples include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, ( 8-hydroxyoctyl meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl (meth)acrylate.
  • Glycidyl group-containing monomers include, for example, glycidyl (meth)acrylate and methylglycidyl (meth)acrylate.
  • Sulfonic acid group-containing monomers include, for example, styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, and (meth) ) acryloyloxynaphthalene sulfonic acid.
  • Phosphate group-containing monomers include, for example, 2-hydroxyethyl acryloyl phosphate.
  • Acrylamides include, for example, N-acryloylmorpholine. These may be used individually by 1 type, and may be used in combination of 2 or more type.
  • the content of structural units derived from the copolymerizable monomer is preferably 60 parts by weight or less, more preferably 40 parts by weight or less, relative to 100 parts by weight of the base polymer.
  • the acrylic polymer may contain structural units derived from polyfunctional monomers in order to form a crosslinked structure in the polymer backbone.
  • polyfunctional monomers include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, (meth)acrylates, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy (meth)acrylate (i.e.
  • polyglycidyl (meth)acrylate polyglycidyl (meth)acrylate), polyester (meth)acrylate ) acrylates, and urethane (meth)acrylates. These may be used individually by 1 type, and may be used in combination of 2 or more type.
  • the content of the structural unit derived from the polyfunctional monomer is preferably 40 parts by weight or less, more preferably 30 parts by weight or less, relative to 100 parts by weight of the base polymer.
  • the weight average molecular weight of the acrylic polymer is preferably 100,000 to 3,000,000, more preferably 200,000 to 2,000,000.
  • a weight average molecular weight can be measured by GPC (solvent: THF).
  • Examples of the active energy ray-reactive compound that can be used in the adhesive (A1) include a functional group having a polymerizable carbon-carbon multiple bond such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, and an acetylene group.
  • photoreactive monomers or oligomers having Specific examples of the photoreactive monomer include trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol mono Hydroxy penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate ( Esterified product of meth)acrylic acid and polyhydric alcohol; polyfunctional urethane (meth)acrylate; epoxy (meth)acrylate; oligoester (meth)acrylate and the like.
  • monomers such as methacryloylisocyanate, 2-methacryloyloxyethyl isocyanate (2-isocyanatoethyl methacrylate), m-isopropenyl- ⁇ , ⁇ -dimethylbenzyl isocyanate may be used.
  • photoreactive oligomers include dimers to pentamers of the above monomers. The molecular weight of the photoreactive oligomer is preferably 100-3000.
  • active energy ray-reactive compound monomers such as epoxidized butadiene, glycidyl methacrylate, acrylamide, and vinylsiloxane; or oligomers composed of such monomers may be used.
  • the active energy ray-reactive compound a mixture of an organic salt such as an onium salt and a compound having a plurality of heterocycles in the molecule may be used.
  • an active energy ray e.g., ultraviolet rays, electron beams
  • the organic salt is cleaved to generate ions, which act as starting species to cause a heterocyclic ring-opening reaction to form a three-dimensional network structure.
  • the organic salts include iodonium salts, phosphonium salts, antimonium salts, sulfonium salts, borate salts and the like.
  • the heterocyclic ring in the compound having a plurality of heterocyclic rings in the molecule include oxirane, oxetane, oxolane, thiirane, aziridine and the like.
  • the content of the active energy ray-reactive compound is preferably 0.1 parts by weight to 500 parts by weight, more preferably 5 parts by weight to 300 parts by weight, with respect to 100 parts by weight of the base polymer. parts by weight, more preferably 40 to 150 parts by weight.
  • Examples of the active energy ray-reactive polymer (base polymer) contained in the adhesive (A2) include functional groups having carbon-carbon multiple bonds such as acryloyl groups, methacryloyl groups, vinyl groups, allyl groups, and acetylene groups.
  • polymer having Specific examples of active energy ray-reactive polymers include polymers composed of polyfunctional (meth)acrylates; photo-cationically polymerizable polymers; cinnamoyl group-containing polymers such as polyvinyl cinnamate; diazotized amino novolak resins; ; and the like.
  • an active energy ray-reactive polymer is formed by introducing an active energy ray-polymerizable carbon-carbon multiple bond into the side chain, main chain and/or end of the main chain of the acrylic polymer.
  • an acrylic polymer is obtained by copolymerizing raw material monomers containing a monomer having a predetermined functional group (first functional group).
  • a compound having a predetermined functional group (second functional group) and a radiation-polymerizable carbon-carbon double bond capable of reacting with and bonding to the first functional group is carbon-carbon
  • a method of subjecting an acrylic polymer to a condensation reaction or an addition reaction while maintaining the radiation polymerizability of the double bond can be mentioned.
  • Combinations of the first functional group and the second functional group include, for example, a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, a hydroxy group and an isocyanate group, and an isocyanate group. and hydroxy groups.
  • a combination of a hydroxy group and an isocyanate group and a combination of an isocyanate group and a hydroxy group are preferable from the viewpoint of ease of reaction tracking.
  • examples of isocyanate compounds having both a radiation-polymerizable carbon-carbon double bond and an isocyanate group as the second functional group include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl- ⁇ , and ⁇ -dimethylbenzyl isocyanate.
  • the acrylic polymer having the first functional group preferably contains a structural unit derived from the hydroxy group-containing monomer, such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether. It is also preferable to contain a constitutional unit derived from an ether-based compound.
  • the adhesive (A2) may further contain the active energy ray-reactive compound (monomer or oligomer).
  • the active energy ray-curable adhesive may contain an ultraviolet absorber and/or a photopolymerization initiator. The details of the ultraviolet absorber and photopolymerization initiator used will be described later.
  • the active energy ray-curable pressure-sensitive adhesive may contain a photosensitizer.
  • photosensitizers include "UVS-581" (trade name) manufactured by Kawasaki Chemical Industries, Ltd., and 9,10-diethoxyanthracene (eg, "UVS-1101” (trade name) manufactured by Kawasaki Chemical Industries, Ltd.).
  • Other examples of the photosensitizer include 9,10-dibutoxyanthracene (eg, trade name “UVS-1331” manufactured by Kawasaki Chemical Industries, Ltd.), 2-isopropylthioxanthone, benzophenone, thioxanthone derivatives, 4,4 '-bis(dimethylamino)benzophenone and the like.
  • Thioxanthone derivatives include, for example, ethoxycarbonylthioxanthone and isopropylthioxanthone.
  • the content of the photosensitizer is preferably 0.01 to 2 parts by weight, more preferably 0.5 to 2 parts by weight, relative to 100 parts by weight of the base polymer.
  • the active energy ray-curable pressure-sensitive adhesive contains a cross-linking agent.
  • cross-linking agents include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, Examples include metal chelate cross-linking agents, metal salt cross-linking agents, carbodiimide cross-linking agents, amine cross-linking agents and the like.
  • the content of the cross-linking agent is preferably 0.5 to 10 parts by weight, more preferably 1 to 8 parts by weight, with respect to 100 parts by weight of the base polymer of the adhesive.
  • an isocyanate-based cross-linking agent is preferably used.
  • An isocyanate-based cross-linking agent is preferable because it can react with various functional groups.
  • Specific examples of the isocyanate-based cross-linking agents include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; Aromatic isocyanates such as tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; trimethylolpropane/tolylene diisocyanate trimer adduct (manufactured by Tosoh Corporation, trade name "Coronate L”), trimethylolpropane / Isocyanate adducts such as hexamethylene diisocyanate trimer adduct (manufactured by Tosoh Corporation, trade name "Coronate HL”), isocyanurate form of hexamethylene
  • the active energy ray-curable adhesive may further contain any suitable additive as necessary.
  • Additives include, for example, active energy ray polymerization accelerators, radical scavengers, coupling agents (e.g., silane coupling agents), tackifiers, plasticizers (e.g., trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers, etc.), pigments, dyes, fillers, antioxidants, conductive materials, antistatic agents, light stabilizers, release modifiers, softeners, surfactants, flame retardants, antioxidants, particles, ultraviolet rays Absorbents and the like are included.
  • photopolymerization initiators Any appropriate initiator can be used as the photopolymerization initiator.
  • photopolymerization initiators include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, ⁇ -hydroxy- ⁇ , ⁇ '-dimethylacetophenone, 2-methyl-2-hydroxypropio ⁇ -ketol compounds such as phenone and 1-hydroxycyclohexylphenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-[4-(methylthio) Acetophenone compounds such as -phenyl]-2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether; ketal compounds such as benzyl dimethyl ketal; 2-naphthalenesulfonyl chloride, etc.
  • aromatic sulfonyl chloride compounds 1-phenone-1,1-propanedione-2-(o-ethoxycarbonyl) oxime and other photoactive oxime compounds; benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4 -benzophenone compounds such as methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4 thioxanthone-based compounds such as diethylthioxanthone and 2,4-diisopropylthioxanthone; camphorquinone; halogenated ketones;
  • the amount of photopolymerization initiator used can be set to any appropriate amount.
  • a photopolymerization initiator having a maximum absorption wavelength in the range of 400 nm or less preferably 380 nm or less, more preferably 340 nm or less is used.
  • the amount of the photopolymerization initiator used can be set to any appropriate amount.
  • a commercially available product may be used as the photopolymerization initiator.
  • a photopolymerization initiator having a maximum absorption wavelength in the range of 400 nm or less BASF trade names "Irgacure 127”, “Irgacure 369”, “Irgacure 369E”, “Irgacure 379”, “Irgacure 379EG”, “ Irgacure 819”, “Irgacure TOP”, “Irgacure 784", and "Irgacure OXE01".
  • the thickness of the adhesive layer is preferably 2 to 50 ⁇ m, more preferably 2 to 40 ⁇ m, still more preferably 2 to 30 ⁇ m. Within such a range, deformation of each layer by laser light irradiation can be optimized, and a pressure-sensitive adhesive sheet with excellent peelability by laser light irradiation can be obtained. Such a pressure-sensitive adhesive sheet can achieve reliable releasability in a narrow range.
  • the indentation modulus I of the adhesive layer at 23°C is preferably 0.03 MPa to 20 MPa, more preferably 0.05 MPa to 10 MPa, and still more preferably 0.06 MPa to 5 MPa.
  • deformation of each layer by laser light irradiation can be optimized, and a pressure-sensitive adhesive sheet with excellent peelability by laser light irradiation can be obtained.
  • Such a pressure-sensitive adhesive sheet can achieve reliable releasability in a narrow range.
  • the light transmittance of the pressure-sensitive adhesive layer at a wavelength of 248 nm is preferably 25% or more, more preferably 40% or more, still more preferably 55% or more, particularly preferably 80% or more, and most preferably. is 90% or more.
  • the light transmittance of the pressure-sensitive adhesive layer at a wavelength of 248 nm is preferably as high as possible, but its upper limit is, for example, 99%. Within such a range, the laser beam can effectively reach the base material during peeling by laser beam irradiation, and excellent peelability can be achieved.
  • the adhesive layer contains a silicone-based adhesive.
  • a silicone-based pressure-sensitive adhesive contains a silicone-based polymer as a base polymer.
  • silicone-based adhesive for example, a silicone-based pressure-sensitive adhesive having a base polymer such as silicone rubber containing organopolysiloxane or silicone resin is preferably used.
  • a base polymer obtained by cross-linking the above silicone rubber or silicone resin may be used as the base polymer constituting the silicone pressure-sensitive adhesive.
  • silicone rubber means a polymer (e.g., a viscosity of 1000 Pa s) in which diorganosiloxane (D unit) as a main component is linked in a straight chain, and a "silicone resin”.
  • M unit triorganosilhemioxane
  • Q unit silicate
  • silicone rubber examples include organopolysiloxane containing dimethylsiloxane as a structural unit.
  • a functional group for example, a vinyl group
  • the weight average molecular weight of the organopolysiloxane is preferably from 100,000 to 1000,000, more preferably from 150,000 to 500,000.
  • a weight average molecular weight can be measured by GPC (solvent: THF).
  • silicone resin examples include organopolysiloxanes containing at least one structural unit selected from R 3 SiO 1/2 structural units, SiO 2 structural units, RSiO 3/2 structural units and R 2 SiO structural units. (R is a monovalent hydrocarbon or hydroxyl group).
  • the above silicone rubber and silicone resin may be used in combination.
  • the weight ratio of the silicone rubber to the silicone resin (rubber:resin) in the silicone adhesive is preferably 100:0 to 100:220, more preferably 100:0 to 100:180, still more preferably 100: 10-100:100.
  • the silicone rubber and the silicone resin may be contained in the silicone pressure-sensitive adhesive as a simple mixture, or may be contained in the silicone pressure-sensitive adhesive in the form of partial condensation of the silicone rubber and the silicone resin.
  • the rubber:resin ratio can also be determined from the ratio of Q units (resin) to D units (rubber) obtained by measuring the composition of the silicone adhesive by 29 Si-NMR.
  • the silicone-based pressure-sensitive adhesive may contain any suitable additive as necessary.
  • the additives include, for example, cross-linking agents, vulcanizing agents, tackifiers, plasticizers, pigments, dyes, fillers, anti-aging agents, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, and release control agents. agents, softeners, surfactants, flame retardants, antioxidants and the like.
  • the silicone pressure-sensitive adhesive contains a cross-linking agent.
  • the cross-linking agent include siloxane-based cross-linking agents and peroxide-based cross-linking agents. Any appropriate cross-linking agent can be used as the peroxide-based cross-linking agent.
  • Peroxide cross-linking agents include, for example, benzoyl peroxide, t-butyl peroxybenzoate, dicumyl peroxide and the like.
  • siloxane-based cross-linking agents include polyorganohydrogensiloxanes.
  • the polyorganohydrogensiloxane preferably has two or more silicon-bonded hydrogen atoms.
  • the polyorganohydrogensiloxane preferably has an alkyl group, a phenyl group, or a halogenated alkyl group as functional groups bonded to silicon atoms.
  • a commercially available product may be used as the silicone adhesive.
  • Specific examples of commercially available products include SD series manufactured by Dow Toray Industries, KR-3700 series, X-40 series and KR-100 series manufactured by Shin-Etsu Chemical Co., Ltd.
  • the solid content of the silicone adhesive is preferably 50 parts by weight or more, more preferably 80 parts by weight or more, and still more preferably 90 parts by weight or more, relative to 100 parts by weight of the adhesive layer.
  • the substrate may be composed of any suitable resin.
  • the resin include polyolefin-based resins such as polyethylene-based resins, polypropylene-based resins, polybutene-based resins, and polymethylpentene-based resins, polyurethane-based resins, polyester-based resins, polyimide-based resins, polyetherketone-based resins, and polystyrene-based resins. Resins, polyvinyl chloride resins, polyvinylidene chloride resins, fluorine resins, silicon resins, cellulose resins, ionomer resins, and the like can be mentioned.
  • the substrate is made of polyester resin and/or polyimide resin.
  • Base materials made of these resins are advantageous in that they have low light transmittance at a wavelength of 248 nm and are easily distorted by laser light irradiation.
  • the light transmittance of the base material at a wavelength of 248 nm is preferably 60% or less, more preferably 30% or less, even more preferably 15% or less, and particularly preferably 10% or less. Within such a range, the substrate can be easily distorted by laser light irradiation.
  • the lower limit of the light transmittance of the substrate at a wavelength of 248 nm is, for example, 0.005%.
  • the thickness of the base material is preferably 2 ⁇ m to 300 ⁇ m, more preferably 2 ⁇ m to 100 ⁇ m, still more preferably 2 ⁇ m to 50 ⁇ m.
  • the thickness of the substrate is 50 ⁇ m or less, more preferably 30 ⁇ m or less, still more preferably 20 ⁇ m or less, particularly preferably 15 ⁇ m or less, and most preferably 10 ⁇ m or less. .
  • the indentation elastic modulus of the base material at 23°C is preferably 5000 MPa or less, more preferably 3000 MPa or less, and still more preferably 1000 MPa or less. Within such a range, the base material can easily propagate strain to the transfer layer.
  • the lower limit of the indentation modulus of the substrate at 23° C. is preferably 1 MPa, more preferably 5 MPa, and still more preferably 10 MPa. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet having appropriate rigidity and excellent handleability.
  • the total light transmittance of the substrate is preferably 70% or higher, more preferably 80% or higher, even more preferably 90% or higher, and particularly preferably 95% or higher.
  • the upper limit of the total light transmittance of the substrate is, for example, 98% (preferably 99%).
  • the above-mentioned pressure-sensitive adhesive sheet can be produced by any appropriate method.
  • the pressure-sensitive adhesive sheet can be obtained, for example, by applying the above-mentioned pressure-sensitive adhesives forming the pressure-sensitive adhesive layer and the transfer layer onto a base material or a release liner. Coating methods include bar coater coating, air knife coating, gravure coating, gravure reverse coating, reverse roll coating, lip coating, die coating, dip coating, offset printing, flexographic printing, screen printing, etc. Various methods can be employed.
  • the pressure-sensitive adhesive sheet may be formed by forming a pressure-sensitive adhesive layer on a release liner, forming a transfer layer on another release liner, and bonding them together, or by bonding these to a substrate.
  • the adhesive sheet of the present invention can be used to temporarily fix any suitable work member (for example, an electronic component) during processing and/or transfer of the work member.
  • any suitable work member for example, an electronic component
  • the pressure-sensitive adhesive sheet of the present invention for example, (i) the pressure-sensitive adhesive layer is attached to the support, (ii) the member to be processed is attached and fixed to the transfer layer of the adherend sheet, and (ii) the adhesive layer is attached to the support. ) processing or transferring the member to be processed, (iii) irradiating the adhesive sheet with an active energy ray (e.g., ultraviolet rays) to reduce the adhesive strength of the adhesive sheet on the transfer layer side, and (iv) exhibiting peelability.
  • an active energy ray e.g., ultraviolet rays
  • a method of using the pressure-sensitive adhesive layer by irradiating a desired portion with a laser beam to cause strain in the pressure-sensitive adhesive layer is exemplified. According to this method, it is possible to separate the workpiece by natural fall. Moreover, when a plurality of workpieces are temporarily fixed, it is also possible to peel off only a part of them.
  • the adhesive sheet of the present invention the adhesive force can be reduced to the point that it naturally falls, so even very small (for example, 50 ⁇ m square) workpieces can be individually peeled off. is.
  • the member include semiconductor wafers, optical semiconductor elements, miniLEDs, microLEDs, and the like.
  • a glass plate is used as the support in (i) above.
  • the support is light transmissive.
  • the total light transmittance of the support is, for example, 50% or more, preferably 80% or more.
  • the active energy ray in (iii) above is irradiated from the adhesive layer side (substantially, the support side) of the adhesive sheet.
  • the laser light in (iv) above is irradiated from the adhesive layer side (substantially, the support side) of the adhesive sheet.
  • the wavelength of the laser light is 200 nm to 300 nm.
  • Adhesive strength I of adhesive layer to glass The PET release liner on the transfer layer side of the adhesive sheet was peeled off, and PET (Lumirror S10 manufactured by Toray Industries, Inc.) having a thickness of 25 ⁇ m was adhered. After that, the PET release liner on the other side is peeled off, and a 2 kg roller is reciprocated once to bond it to a glass plate (manufactured by Matsunami Glass Industry Co., Ltd., trade name "S200423"). The adhesive force was measured at an angle of 180°, a peeling speed (tensile speed) of 300 mm/min, and a measurement temperature of 23°C.
  • Indentation modulus (before curing) The indentation elastic modulus of the pressure-sensitive adhesive layer and the transfer layer was measured using a tripoindenter TI-950 manufactured by Hysitron. The measurements were made by the single indentation method at 23° C. with an indentation speed of 10 nm/s and an indentation depth of 100 nm.
  • the other PET release liner was peeled off to expose the transfer layer, and the indentation modulus was measured using a tripoindenter TI-950 manufactured by Hysitron.
  • the measurements were made by the single indentation method at 23° C. with an indentation speed of 10 nm/s and an indentation depth of 100 nm.
  • a spectrophotometer (trade name “Spectrophotometer U-4100” manufactured by Hitachi High-Tech Science) was used to measure the light transmittance of the pressure-sensitive adhesive layer and the substrate at 248 nm.
  • the entire surface was irradiated with ultraviolet light from a high-pressure mercury lamp (specified wavelength: 365 nm, integrated light amount: 300 mJ/cm 2 ) using an ultraviolet irradiation device (manufactured by Nitto Seiki, trade name “UM-810”).
  • a laser beam with a wavelength of 248 nm is irradiated only to the target member position from the quartz plate side while changing the output (1 plus per chip; irradiation area: 130 ⁇ m ⁇ 105 ⁇ m). was evaluated as pass ( ⁇ ), and the case where free fall occurred at an output of 50 mJ/cm 2 or less was evaluated as failure (x).
  • Example 1 100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name “DOWSIL SD 4584 PSA”) was applied to the surface of a PET release liner (PET38X1-SS4A, manufactured by Nippa Corporation, thickness: 38 ⁇ m) treated with silicone fluoride, and 0.9 parts by weight of mixture A of a catalyst (manufactured by Dow Toray Industries, trade name "DOWSIL SRX212”) was applied and then heated at 100° C. for 3 minutes to form an adhesive layer with a thickness of 4 ⁇ m.
  • a silicone polymer manufactured by Dow Toray Industries, trade name "DOWSIL SD 4584 PSA”
  • Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L”), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer.
  • the pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 ⁇ m), and then heated at 120° C. for 2 minutes to give a thickness of 5 ⁇ m. to form a transfer layer.
  • Example 2 A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that 5 parts by weight of an additive (manufactured by Dow Toray Co., Ltd., trade name "CP-96 Black") was further added to the above mixture A to form a transfer layer. rice field. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
  • an additive manufactured by Dow Toray Co., Ltd., trade name "CP-96 Black
  • Example 3 A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that 5 parts by weight of an additive (manufactured by BASF, trade name "Tinuvin 477") was further added to the mixture A to form a transfer layer. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
  • Example 4 A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that 5 parts by weight of an additive (manufactured by BASF, trade name "TinuvinPS”) was further added to the mixture A to form a transfer layer. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
  • Example 5 Instead of 100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name “DOWSIL SD 4584 PSA”), 100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name “DOWSIL SD 4580 PSA”) is used.
  • a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that the The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
  • Example 6 A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that the thickness of the pressure-sensitive adhesive layer was 12 ⁇ m. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
  • Example 7 Example 1 except that a PET base material (manufactured by Toray Industries, Inc., trade name “Lumirror 2DC61", thickness: 2 ⁇ m) was used instead of the PET base material (manufactured by Toray Industries, Inc., trade name “Lumirror S-10").
  • a pressure-sensitive adhesive sheet was obtained in the same manner as above. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
  • Example 8 instead of the PET base material (manufactured by Toray Industries, Inc., trade name “Lumirror S-10”), a polyimide base material (manufactured by Toray DuPont, trade name “Kapton 50H", thickness: 12 ⁇ m) was used. A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
  • Example 9 100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name “DOWSIL SD 4584 PSA”) was applied to the surface of a PET release liner (PET38X1-SS4A, manufactured by Nippa Corporation, thickness: 38 ⁇ m) treated with silicone fluoride, and 0.9 parts by weight of mixture A of a catalyst (manufactured by Dow Toray Industries, trade name "DOWSIL SRX212”) was applied and then heated at 100° C. for 3 minutes to form an adhesive layer with a thickness of 4 ⁇ m.
  • a silicone polymer manufactured by Dow Toray Industries, trade name "DOWSIL SD 4584 PSA
  • PET38X1-SS4A manufactured by Nippa Corporation, thickness: 38 ⁇ m
  • mixture A of a catalyst manufactured by Dow Toray Industries, trade name "DOWSIL SRX212
  • Acrylic polymer solution IV containing 100 parts by weight of acrylic polymer IV, 3 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L”), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") parts were added to obtain a pressure-sensitive adhesive (B) for forming a transfer layer.
  • the pressure-sensitive adhesive (B) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 ⁇ m), and then heated at 120° C. for 2 minutes to give a thickness of 5 ⁇ m. to form a transfer layer.
  • Example 10 Instead of 100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name "DOWSIL SD 4584 PSA”), 100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name “DOWSIL LTC757 Coating”) was used.
  • a pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except for the above. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
  • Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L”), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer.
  • the pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 ⁇ m), and then heated at 120° C. for 2 minutes to give a thickness of 5 ⁇ m. to form a transfer layer.
  • Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L”), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer.
  • the pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 ⁇ m), and then heated at 120° C. for 2 minutes to give a thickness of 5 ⁇ m. to form a transfer layer.
  • Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L”), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer.
  • the pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 ⁇ m), and then heated at 120° C. for 2 minutes to give a thickness of 5 ⁇ m. to form a transfer layer.
  • Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L”), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer.
  • the pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 ⁇ m), and then heated at 120° C. for 2 minutes to give a thickness of 5 ⁇ m. to form a transfer layer.
  • the pressure-sensitive adhesive layer with the PET release liner and the transfer layer with the PET release liner were laminated to obtain a pressure-sensitive adhesive sheet consisting of PET release liner/adhesive layer/transfer layer/PET release liner.
  • the obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
  • the member on the transfer layer can be peeled off in a narrow range by low-power laser light irradiation.
  • Adhesive sheets with an adhesive layer composed of an adhesive other than a silicone-based adhesive (Comparative Examples 1 to 3), an adhesive sheet without an adhesive layer (Comparative Example 4), and an adhesive sheet without a substrate (Comparative Example 5) resulted in poor transferability.

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Abstract

Provided is an adhesive sheet capable of temporarily fixing an adherend in a detachable manner, wherein the adhesive sheet exhibits peelability with respect to low-power laser light, eliminates the need for a step for rinsing an adherend after detachment, and which is configured so that a site at which detachment is exhibited is narrow. This adhesive sheet comprises an adhesive layer, a base, and a transfer layer, in that order. The adhesive layer contains a silicone adhesive. In one embodiment, the light transmittance of the adhesive layer at a wavelength of 248 nm is preferably 25% or more. In one embodiment, the light transmittance of the base at a wavelength of 248 nm is 60% or less.

Description

粘着シートAdhesive sheet
 本発明は、粘着シートに関する。 The present invention relates to an adhesive sheet.
 電子部品に代表される各種の部材を加工する際、粘着シートを用いて部材を支持体に仮固定し、移送、加工等の後に、加工済みの部材を支持体から剥離することが一般に行われている。例えば、特許文献1には、基板(被加工部材)を接着剤層および分離層を介して支持体に仮固定した状態で加工し、加工後、分離層をレーザー光照射により破壊して、接着剤層ごと基板を支持体から剥離し、その後、基板から接着剤層を除去する方法が記載されている。しかしながら、上記方法では、部材から接着剤層を除去し、部材の非接着面を洗浄する工程を必要とし、生産コストの面で問題がある。また、高出力でレーザー光を照射した場合に、部材へダメージを与えるという問題もある。 When processing various members represented by electronic components, it is common practice to temporarily fix the member to a support using an adhesive sheet, and peel off the processed member from the support after transfer, processing, etc. ing. For example, in Patent Document 1, a substrate (member to be processed) is processed in a state temporarily fixed to a support via an adhesive layer and a separation layer, and after processing, the separation layer is destroyed by laser light irradiation, and adhesion is performed. A method is described in which the substrate is peeled from the support together with the adhesive layer, and then the adhesive layer is removed from the substrate. However, the above method requires a step of removing the adhesive layer from the member and cleaning the non-adhesive surface of the member, which poses a problem in terms of production cost. Moreover, there is also a problem that the member is damaged when the laser beam is irradiated with a high output.
 また、特許文献2には、複数の被加工部材を接着剤層を介してキャリアに仮固定し、接着剤層へレーザービームを集中させてブリスターを発生させることにより、被加工部材の一部を選択的に、キャリアから分離、転写する方法が記載されている。しかしながら、この方法では、レーザー照射後に発生したブリスターが経時で広がり、その結果、キャリアの剥がれ、転写を要しない被加工部材の不要な脱落が生じるという問題がある。 Further, in Patent Document 2, a plurality of workpieces are temporarily fixed to a carrier via an adhesive layer, and a laser beam is focused on the adhesive layer to generate blisters, thereby partially fixing the workpieces. A method for optionally separating and transferring from the carrier is described. However, this method has the problem that the blisters generated after laser irradiation spread over time, resulting in peeling of the carrier and unnecessary dropping of the workpiece that does not require transfer.
特許5875850号Patent No. 5875850 特許6053756号Patent No. 6053756
 本発明は上記従来の課題を解決するためになされたものであり、その目的とするところは、被着体を剥離可能に仮固定し得る粘着シートであって、低出力なレーザー光で剥離性が発現され、剥離後に被着体を洗浄する工程を不要とし得、かつ、剥離発現箇所が狭範囲である粘着シートを提供することにある。 The present invention has been made to solve the above-mentioned conventional problems, and its object is to provide a pressure-sensitive adhesive sheet that can temporarily fix an adherend in a releasable manner, and is releasable with a low-power laser beam. To provide a pressure-sensitive adhesive sheet in which the peeling is exhibited in a narrow range, without the need for a step of washing the adherend after peeling.
 本発明の粘着シートは、粘着剤層と、基材と、転写層とをこの順に備え、該粘着剤層がシリコーン系粘着剤を含む。
 1つの実施形態においては、上記粘着剤層の波長248nmの光透過率が、25%以上である。
 1つの実施形態においては、上記基材の波長248nmの光透過率が、60%以下である。
 1つの実施形態においては、上記基材が、ポリエステル系樹脂および/またはポリイミド系樹脂から構成される。
 1つの実施形態においては、上記基材の厚みが、50μm以下である。
 1つの実施形態においては、上記転写層が、活性エネルギー線の照射により硬化する層である。
 1つの実施形態においては、上記転写層の厚みが、50μm以下である。
 1つの実施形態においては、上記粘着シートの前記粘着剤層をガラス板に貼着した際の23℃における粘着力Iが、2N/20mm以上である。
 1つの実施形態においては、上記粘着シートの該粘着剤層をガラス板に貼着した際の23℃における粘着力Iの、該転写層に300mJ/cmの紫外線を照射した後の23℃における粘着力Bに対する比が、5以上である。
 1つの実施形態においては、300mJ/cmの紫外線を照射した後に、上記転写層の23℃における押し込み弾性率Bが、上記粘着剤層の23℃における押し込み弾性率Iの5倍以上となる。
 1つの実施形態においては、上記粘着シートを用いて部材を支持体に仮固定し、移送および/または加工等の後に、レーザー光照射により該部材を支持体から剥離する用途に用いられる。
 1つの実施形態においては、上記部材が、半導体ウエハ、光半導体素子、miniLEDまたはmicroLEDである。
The pressure-sensitive adhesive sheet of the present invention comprises a pressure-sensitive adhesive layer, a substrate, and a transfer layer in this order, and the pressure-sensitive adhesive layer contains a silicone-based pressure-sensitive adhesive.
In one embodiment, the pressure-sensitive adhesive layer has a light transmittance of 25% or more at a wavelength of 248 nm.
In one embodiment, the base material has a light transmittance of 60% or less at a wavelength of 248 nm.
In one embodiment, the substrate is composed of a polyester-based resin and/or a polyimide-based resin.
In one embodiment, the base material has a thickness of 50 μm or less.
In one embodiment, the transfer layer is a layer that is cured by irradiation with active energy rays.
In one embodiment, the transfer layer has a thickness of 50 μm or less.
In one embodiment, the adhesive force I at 23° C. when the adhesive layer of the adhesive sheet is adhered to a glass plate is 2 N/20 mm or more.
In one embodiment, the adhesive strength I at 23° C. when the adhesive layer of the adhesive sheet is attached to a glass plate is measured at 23° C. after irradiating the transfer layer with ultraviolet rays of 300 mJ/cm 2 . The ratio to the adhesive strength B is 5 or more.
In one embodiment, the indentation elastic modulus B of the transfer layer at 23°C is five times or more the indentation elastic modulus I of the pressure-sensitive adhesive layer at 23°C after irradiation with ultraviolet rays of 300 mJ/cm 2 .
In one embodiment, the pressure-sensitive adhesive sheet is used to temporarily fix a member to a support, and after transfer and/or processing, the member is peeled off from the support by laser light irradiation.
In one embodiment, the member is a semiconductor wafer, optical semiconductor element, miniLED or microLED.
 本発明によれば、被着体を剥離可能に仮固定し得る粘着シートであって、低出力なレーザー光で剥離性が発現され、剥離後に被着体を洗浄する工程を不要とし得、かつ、剥離発現箇所が狭範囲である粘着シートを提供することができる。 According to the present invention, there is provided a pressure-sensitive adhesive sheet capable of releasably temporarily fixing an adherend, exhibiting releasability with a low-power laser beam, and eliminating the need for a step of washing the adherend after peeling, and , it is possible to provide a pressure-sensitive adhesive sheet in which peeling occurs in a narrow range.
本発明の1つの実施形態による粘着シートの概略断面図である。1 is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention; FIG.
A.粘着シートの概要
 図1は、本発明の1つの実施形態による粘着シートの概略断面図である。この実施形態による粘着シート100は、粘着剤層10と、基材20と、転写層30とを備える。粘着剤層10は、シリコーン系粘着剤を含む。図示していないが、本発明の粘着シートは、使用に供するまでの間、粘着面を保護する目的で、粘着剤層および転写層の外側にはく離ライナーが設けられていてもよい。また、粘着シートは、本発明の効果が得られる限り、任意の適切なその他の層をさらに含んでいてもよい。好ましくは、基材と転写層とは直接(すなわち、他の層を介することなく)積層される。
A. Outline of Adhesive Sheet FIG. 1 is a schematic cross-sectional view of an adhesive sheet according to one embodiment of the present invention. The adhesive sheet 100 according to this embodiment comprises an adhesive layer 10, a substrate 20, and a transfer layer 30. As shown in FIG. The adhesive layer 10 contains a silicone-based adhesive. Although not shown, the pressure-sensitive adhesive sheet of the present invention may be provided with a release liner on the outside of the pressure-sensitive adhesive layer and the transfer layer for the purpose of protecting the pressure-sensitive adhesive surface until it is used. In addition, the pressure-sensitive adhesive sheet may further contain any appropriate other layer as long as the effects of the present invention can be obtained. Preferably, the substrate and the transfer layer are laminated directly (that is, without interposing another layer).
 本発明の粘着シートは、当該粘着シートを用いて部材を支持体(例えば、ガラス基体)に仮固定し、移送、加工等の後に、当該部材を支持体から剥離する用途に用いられ得る。上記粘着シートは、粘着剤層を支持体(例えば、ガラス基体)に貼着して用いることができる。剥離の際には、レーザー光照射が行われ、所望の位置にある部材のみがピンポイントで剥離され得る。上記粘着シートにおいては、転写層が、レーザー光照射により剥離性が発現する層であり得る。また、レーザー光照射は、粘着剤層側から行われ得る。上記粘着シートにおいては、レーザー光照射により上記基材に部分的なひずみが生じ、このひずみが転写層に伝搬して、転写層表面(貼着面)が一時的に形状変化することにより、当該箇所に配置された部材(被着体)を剥離させることが可能となる。本発明においては、粘着剤層の成分(例えば、ベースポリマーの種類等)を調整することより、粘着剤層が所定波長のレーザー光を透過し得、その結果、基材のひずみが生じやすくなる。基材においては、その構成材料を適切に選択することにより、ひずみが生じやすい基材とすることができる。例えば、所定波長のレーザー光が透過しにくいように基材を構成すれば、ひずみが生じやすい基材とすることができる。本発明においては、上記の作用により、剥離性が発現するため、高出力なレーザー光を必要とせず、剥離後に被着体を洗浄する工程が不要となり、かつ、剥離発現箇所を狭範囲とすることができる。また、剥離後においては、転写層表面形状の変化が持続せず(すなわち、経時で広範囲化することがなく、むしろ、変化前の形状に戻り得る)、そのため、剥離を所望しない箇所において、被着体が不要に脱落する等の不具合を防止することができる。 The pressure-sensitive adhesive sheet of the present invention can be used to temporarily fix a member to a support (for example, a glass substrate) using the pressure-sensitive adhesive sheet, and peel the member from the support after transfer, processing, and the like. The pressure-sensitive adhesive sheet can be used by attaching the pressure-sensitive adhesive layer to a support (for example, a glass substrate). At the time of peeling, laser light irradiation is performed, and only a member at a desired position can be peeled with pinpoint accuracy. In the pressure-sensitive adhesive sheet, the transfer layer may be a layer exhibiting releasability upon irradiation with a laser beam. Moreover, laser light irradiation can be performed from the pressure-sensitive adhesive layer side. In the pressure-sensitive adhesive sheet, the base material is partially distorted by laser light irradiation, and this distortion propagates to the transfer layer, temporarily changing the shape of the transfer layer surface (adhering surface). It becomes possible to peel off the member (adherend) arranged at the location. In the present invention, by adjusting the components of the pressure-sensitive adhesive layer (for example, the type of base polymer, etc.), the pressure-sensitive adhesive layer can transmit a laser beam of a predetermined wavelength, and as a result, distortion of the substrate is likely to occur. . By appropriately selecting the constituent materials of the base material, the base material can be easily strained. For example, if the substrate is configured so that laser light of a predetermined wavelength is difficult to pass through, the substrate can be easily distorted. In the present invention, the peelability is exhibited by the above action, so a high-power laser beam is not required, the step of washing the adherend after peeling is unnecessary, and the peeling area is narrowed. be able to. In addition, after peeling, the change in the surface shape of the transfer layer does not persist (that is, it does not widen over time, but rather can return to the shape before the change). It is possible to prevent troubles such as unnecessary dropping of the adherend.
 特に、本発明においては、剥離に要するレーザー光照射の出力を低くすることができる点で、有利である。本発明の粘着シートを用いれば、低出力のレーザー光照射により好ましく剥離が生じるため、被加工部材へのダメージが少なく、粘着剤層の不要な変形およびそれに伴う支持体からの脱離を防止することができる。また、本発明の粘着シートは、製造コスト低減に寄与し得る。また、本発明の粘着シートを用いれば、製造装置選択の幅が広くなる点でも有利である。 In particular, the present invention is advantageous in that the power of laser light irradiation required for peeling can be reduced. When the pressure-sensitive adhesive sheet of the present invention is used, peeling occurs preferably by low-power laser light irradiation, so damage to the member to be processed is small, and unnecessary deformation of the pressure-sensitive adhesive layer and accompanying detachment from the support are prevented. be able to. In addition, the pressure-sensitive adhesive sheet of the present invention can contribute to production cost reduction. Moreover, the use of the pressure-sensitive adhesive sheet of the present invention is advantageous in that the range of selection of manufacturing equipment is widened.
 上記粘着シートの粘着剤層をガラス板に貼着した際の23℃における粘着力Iは、好ましくは0.02N/20mm以上であり、より好ましくは2N/20mm以上であり、さらに好ましくは2N/20mm~25N/20mmであり、さらに好ましくは5N/20mm~20N/20mmである。このような範囲であれば、レーザー光照射による各層の変形を適性化することができ、剥離発現箇所を狭範囲とすることができ、剥離を所望しない箇所において、被着体が不要に脱落する等の不具合を防止することができる。粘着力は、JIS Z 0237:2000に準じて測定される。具体的には、2kgのローラーを1往復により粘着シートの粘着剤層をガラス板(算術平均表面粗さRa:50±25nm)に貼着し、23℃下で30分間放置した後、剥離角度180°、剥離速度(引張速度)300mm/minの条件で、粘着シートを引きはがして測定される。 The adhesive force I at 23° C. when the adhesive layer of the adhesive sheet is attached to a glass plate is preferably 0.02 N/20 mm or more, more preferably 2 N/20 mm or more, and still more preferably 2 N/ It is 20 mm to 25 N/20 mm, more preferably 5 N/20 mm to 20 N/20 mm. Within such a range, the deformation of each layer due to laser light irradiation can be optimized, the range where peeling occurs can be narrowed, and the adherend is unnecessarily detached at locations where peeling is not desired. Such troubles can be prevented. Adhesion is measured according to JIS Z 0237:2000. Specifically, the pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet is adhered to a glass plate (arithmetic mean surface roughness Ra: 50 ± 25 nm) by reciprocating a 2 kg roller once, and left at 23 ° C. for 30 minutes. It is measured by peeling off the pressure-sensitive adhesive sheet under the conditions of 180° and peeling speed (tensile speed) of 300 mm/min.
 上記粘着シートの転写層をステンレス板に貼着した直後の23℃における初期粘着力Aは、好ましくは1N/20mm~20N/20mmであり、より好ましくは1.5N/20mm~15N/20mmであり、さらに好ましくは2N/20mm~10N/20mmである。このような範囲であれば、良好に被着体を保持し得る粘着シートを得ることができる。転写層側の粘着力もまた、JIS Z 0237:2000に準じて測定される。具体的には、2kgのローラーを1往復により粘着シートの転写層をステンレス板(算術平均表面粗さRa:50±25nm)に貼着し、23℃下で30分間放置した後、剥離角度180°、剥離速度(引張速度)300mm/minの条件で、粘着シートを引きはがして測定される。転写層は、活性エネルギー線照射およびレーザー光照射により粘着力が変化するが、本明細書において、「初期粘着力」とは、活性エネルギー線およびレーザー光を照射する前の粘着力を意味する。 The initial adhesive force A at 23° C. immediately after the transfer layer of the adhesive sheet is attached to the stainless steel plate is preferably 1 N/20 mm to 20 N/20 mm, more preferably 1.5 N/20 mm to 15 N/20 mm. , more preferably 2 N/20 mm to 10 N/20 mm. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet that can hold an adherend well. Adhesion on the transfer layer side is also measured according to JIS Z 0237:2000. Specifically, the transfer layer of the adhesive sheet was adhered to a stainless steel plate (arithmetic mean surface roughness Ra: 50±25 nm) by reciprocating a 2 kg roller once, left at 23° C. for 30 minutes, and peeled at a peeling angle of 180. °, peeling speed (tensile speed) of 300 mm/min, peel off the pressure-sensitive adhesive sheet and measure. The adhesive strength of the transfer layer changes due to irradiation with active energy rays and laser light, and the term "initial adhesive strength" as used herein means the adhesive strength before irradiation with active energy rays and laser light.
 1つの実施形態においては、上記粘着シートは、粘着シートを上記ステンレス板に貼着し、転写層に300mJ/cmの紫外線を照射した後の23℃における粘着力B(硬化後粘着力Bともいう)が、好ましくは1N/20mm以下となり、より好ましくは0.5N/20mm以下となり、さらに好ましくは0.2N/20mm以下となり、特に好ましくは0.1N/20mm以下となる。このような範囲であれば、剥離性に優れ、糊残りの少ない粘着シートを得ることができる。硬化後粘着力Bの下限は、例えば、0.01N/20mm(好ましくは0.001N/20mm)である。上記紫外線照射は、例えば、紫外線照射装置(日東精機社製、商品名「UM-810」)を用いて、高圧水銀灯の紫外線(特性波長:365nm、積算光量:300mJ/cm)を転写層に照射して行われる。紫外線照射は、粘着剤層側から行われ得る。 In one embodiment, the adhesive sheet has an adhesive strength B at 23 ° C. after the adhesive sheet is attached to the stainless steel plate and the transfer layer is irradiated with ultraviolet rays of 300 mJ / cm 2 (also known as adhesive strength B after curing is preferably 1 N/20 mm or less, more preferably 0.5 N/20 mm or less, still more preferably 0.2 N/20 mm or less, and particularly preferably 0.1 N/20 mm or less. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet with excellent releasability and little adhesive residue. The lower limit of the post-curing adhesive strength B is, for example, 0.01 N/20 mm (preferably 0.001 N/20 mm). The ultraviolet irradiation is performed by, for example, using an ultraviolet irradiation device (manufactured by Nitto Seiki Co., Ltd., trade name “UM-810”) and applying ultraviolet rays (characteristic wavelength: 365 nm, integrated light amount: 300 mJ/cm 2 ) from a high-pressure mercury lamp to the transfer layer. It is done by irradiation. Ultraviolet irradiation can be performed from the pressure-sensitive adhesive layer side.
 粘着剤層をガラスに貼着した際の23℃における粘着力Iの転写層の硬化後粘着力Bに対する比(粘着力I/硬化後粘着力B)は、5以上である。換言すると、上記粘着シートにおいては、硬化後粘着力Bが、粘着力Iの0.2倍以下(好ましくは0.1倍以下、より好ましくは0.05倍以下、さらに好ましくは0.02倍以下)となる。(粘着力I/硬化後粘着力B)を上記のように特定することにより、レーザー光照射による各層の変形を適性化することができ、かつ、レーザー光照射による剥離性に優れる粘着シートを得ることができる。このような粘着シートは、狭範囲において確実な剥離性を実現し得る。(粘着力I/硬化後粘着力B)は、好ましくは10以上であり、より好ましくは20以上であり、さらに好ましくは50以上であり、特に好ましくは70以上であり、最も好ましくは90以上である。このような範囲であれば、上記本発明の効果は顕著となる。(粘着力I/硬化後粘着力B)の上限は、例えば、1000であり、好ましくは5000であり、より好ましくは10000である。すなわち、上記粘着シートにおいては、硬化後粘着力Bが、粘着力Iの0.0001倍以上となり得る。 The ratio of the adhesive strength I at 23° C. to the adhesive strength B after curing of the transfer layer when the adhesive layer is attached to the glass (adhesive strength I/adhesive strength after curing B) is 5 or more. In other words, in the adhesive sheet, the post-curing adhesive strength B is 0.2 times or less (preferably 0.1 times or less, more preferably 0.05 times or less, and still more preferably 0.02 times) the adhesive strength I after curing. below). By specifying (adhesive strength I/adhesive strength after curing B) as described above, it is possible to optimize the deformation of each layer due to laser light irradiation, and to obtain a pressure-sensitive adhesive sheet that is excellent in peelability due to laser light irradiation. be able to. Such a pressure-sensitive adhesive sheet can achieve reliable releasability in a narrow range. (Adhesive strength I/adhesive strength after curing B) is preferably 10 or more, more preferably 20 or more, still more preferably 50 or more, particularly preferably 70 or more, and most preferably 90 or more. be. Within such a range, the effect of the present invention is remarkable. The upper limit of (adhesive strength I/post-curing adhesive strength B) is, for example, 1,000, preferably 5,000, and more preferably 10,000. That is, in the pressure-sensitive adhesive sheet, the post-curing adhesive force B can be 0.0001 times or more the adhesive force I.
 転写層の初期粘着力Aの転写層の硬化後粘着力Bに対する比(初期粘着力A/硬化後粘着力B)は、好ましくは5以上であり、より好ましくは10以上であり、より好ましくは10~100であり、さらに好ましくは20~100であり、特に好ましくは30~80である。このような範囲であれば、被着体の固定性と剥離性とのバランスに優れた粘着シートを得ることができる。 The ratio of the initial adhesive strength A of the transfer layer to the adhesive strength B after curing of the transfer layer (initial adhesive strength A/adhesive strength B after curing) is preferably 5 or more, more preferably 10 or more, and more preferably 10 to 100, more preferably 20 to 100, particularly preferably 30 to 80. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet having an excellent balance between fixability and releasability of an adherend.
 上記粘着シートにおいて、上記粘着剤層と接して配置される層(例えば、転写層、基材、その他の層)と粘着剤層との23℃における投錨力は、好ましくは2N/20mm以上であり、より好ましく4N/20mm以上であり、さらに好ましくは6N/20mm以上であり、特に好ましくは8N/20mm以上である。当該投錨力の上限は、例えば、30N/20mm(好ましくは50N/20mm)である。投錨力は、23℃下、剥離角度180°、剥離速度(引張速度)300mm/minの条件で、粘着剤層を隣接層から引き剥がして測定される。 In the pressure-sensitive adhesive sheet, the anchoring force at 23° C. between the layers (e.g., transfer layer, base material, other layers) arranged in contact with the pressure-sensitive adhesive layer and the pressure-sensitive adhesive layer is preferably 2 N/20 mm or more. , more preferably 4 N/20 mm or more, still more preferably 6 N/20 mm or more, and particularly preferably 8 N/20 mm or more. The upper limit of the anchoring force is, for example, 30N/20mm (preferably 50N/20mm). The anchoring force is measured by peeling off the adhesive layer from the adjacent layer under the conditions of 23° C., 180° peeling angle, and 300 mm/min peeling speed (tensile speed).
 上記粘着シートにおいて、上記転写層と接して配置される層(例えば、粘着剤層、基材、その他の層)と転写層との23℃における投錨力は、好ましくは2N/20mm以上であり、より好ましく4N/20mm以上であり、さらに好ましくは6N/20mm以上であり、特に好ましくは8N/20mm以上である。当該投錨力の上限は、例えば、30N/20mm(好ましくは50N/20mm)である。投錨力は、23℃下、剥離角度180°、剥離速度(引張速度)300mm/minの条件で、転写層を隣接層から引き剥がして測定される。 In the pressure-sensitive adhesive sheet, the anchoring force at 23° C. between a layer (e.g., pressure-sensitive adhesive layer, base material, other layer) disposed in contact with the transfer layer and the transfer layer is preferably 2 N/20 mm or more, It is more preferably 4 N/20 mm or more, still more preferably 6 N/20 mm or more, and particularly preferably 8 N/20 mm or more. The upper limit of the anchoring force is, for example, 30N/20mm (preferably 50N/20mm). The anchoring force is measured by peeling off the transfer layer from the adjacent layer under conditions of 23° C., a peel angle of 180°, and a peel speed (tensile speed) of 300 mm/min.
 本発明の粘着シートのヘイズ値は、好ましくは70%以下であり、より好ましくは65%以下である。このような範囲であれば、活性エネルギー線の照射による転写層の硬化が好ましく生じる粘着シートを得ることができる。1つの実施形態においては、上記粘着シートのヘイズ値は20%以下である。粘着シートのヘイズ値は低いほど好ましいが、その下限は、例えば、0.1%である。 The haze value of the adhesive sheet of the present invention is preferably 70% or less, more preferably 65% or less. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet in which the transfer layer is favorably cured by irradiation with active energy rays. In one embodiment, the adhesive sheet has a haze value of 20% or less. The haze value of the adhesive sheet is preferably as low as possible, but its lower limit is, for example, 0.1%.
 粘着シートの厚みは、好ましくは1μm~300μmであり、より好ましくは5μm~200μmである。1つの実施形態においては、上記粘着シートの厚みは、30μm以下である。粘着シートが薄ければ、基材に生じたひずみが転写層に伝搬しやすく、剥離性に優れる粘着シートを得ることができる。 The thickness of the adhesive sheet is preferably 1 μm to 300 μm, more preferably 5 μm to 200 μm. In one embodiment, the adhesive sheet has a thickness of 30 μm or less. If the pressure-sensitive adhesive sheet is thin, strain generated in the base material is easily propagated to the transfer layer, and a pressure-sensitive adhesive sheet with excellent peelability can be obtained.
B.転写層
 上記転写層の厚みは、好ましくは50μm以下であり、より好ましくは40μm以下であり、さらに好ましくは30μm以下であり、特に好ましくは20μm以下であり、最も好ましくは10μm以下である。このような範囲であれば、基材に生じたひずみが転写層表面に伝搬しやすく、剥離性に優れる粘着シートを得ることができる。転写層の厚みの下限は、例えば、2μmである。
B. Transfer Layer The thickness of the transfer layer is preferably 50 µm or less, more preferably 40 µm or less, still more preferably 30 µm or less, particularly preferably 20 µm or less, most preferably 10 µm or less. Within such a range, strain generated in the base material is easily propagated to the surface of the transfer layer, and a pressure-sensitive adhesive sheet having excellent peelability can be obtained. The lower limit of the thickness of the transfer layer is, for example, 2 μm.
 1つの実施形態においては、上記転写層は、活性エネルギー線の照射により硬化する層である。より詳細には、本実施形態において、上記転写層は、部材(被着体)を固定するための粘着性を有し、活性エネルギー線の照射により硬化して当該粘着性が低下するように構成される。転写層を硬化させた後に、レーザー光照射を行うことにより、ひずみ伝搬による剥離性を好ましく発現させることができる。なお、硬化後においても、被着体を固定し得る程度の粘着力(例えば、被着体が自然落下しない程度の粘着力)は残存していることが好ましい。1つの実施形態においては、活性エネルギー線を照射することにより、転写層全体の粘着力が低下する。活性エネルギー線としては、例えば、ガンマ線、紫外線、可視光線、赤外線(熱線)、ラジオ波、アルファ線、ベータ線、電子線、プラズマ流、電離線、粒子線等が挙げられる。好ましくは、紫外線である。 In one embodiment, the transfer layer is a layer that is cured by irradiation with active energy rays. More specifically, in the present embodiment, the transfer layer has adhesiveness for fixing the member (adherend), and is configured to be cured by irradiation with active energy rays to reduce the adhesiveness. be done. By irradiating the transfer layer with a laser beam after curing the transfer layer, it is possible to preferably develop peelability due to strain propagation. In addition, it is preferable that adhesive strength to the extent that the adherend can be fixed (for example, adhesive strength to the extent that the adherend does not fall naturally) remains even after curing. In one embodiment, the irradiation with active energy rays reduces the adhesive strength of the entire transfer layer. Examples of active energy rays include gamma rays, ultraviolet rays, visible rays, infrared rays (heat rays), radio waves, alpha rays, beta rays, electron beams, plasma currents, ionizing rays, and particle beams. Ultraviolet rays are preferred.
 上記転写層の23℃における初期押し込み弾性率Aは、好ましくは0.1MPa以上14MPa未満であり、より好ましくは0.1MPa~10MPaであり、さらに好ましくは0.2MPa~5MPaであり、特に好ましくは0.5MPa~2MPaである。このような範囲であれば固定性に優れる粘着シートを得ることができる。押し込み弾性率は、23℃における単一押し込み法により、押し込み速度10nm/s、押し込み深さ100nmにより測定され得る。転写層は、活性エネルギー線照射およびレーザー光照射により粘着力が変化するが、本明細書において、「初期押し込み弾性率A」とは、活性エネルギー線およびレーザー光を照射する前の粘着力を意味する。 The initial indentation modulus A of the transfer layer at 23° C. is preferably 0.1 MPa or more and less than 14 MPa, more preferably 0.1 MPa to 10 MPa, even more preferably 0.2 MPa to 5 MPa, and particularly preferably 0.5 MPa to 2 MPa. With such a range, it is possible to obtain a pressure-sensitive adhesive sheet with excellent fixability. The indentation modulus can be measured by the single indentation method at 23° C. with an indentation speed of 10 nm/s and an indentation depth of 100 nm. The adhesive strength of the transfer layer changes due to irradiation with active energy rays and laser light. In this specification, the term "initial indentation elastic modulus A" means the adhesive strength before irradiation with active energy rays and laser light. do.
 上記転写層は、300mJ/cmの紫外線を照射した後に、23℃における押し込み弾性率B(硬化後弾性率Bともいう)が14MPa以上となる層であることが好ましく、15MPa以上となる層であることがより好ましく、20MPa以上となる層であることがさらに好ましく、50MPa以上となる層であることが特に好ましく、100MPa以上となる層であることが最も好ましい。このような範囲であれば、剥離性に優れる粘着シートを得ることができる。また、剥離時における被着体の汚染を防止することができる。23℃における硬化後弾性率Bの上限は、例えば、500MPa(好ましくは300MPa)である。 The transfer layer is preferably a layer having an indentation elastic modulus B (also referred to as post-curing elastic modulus B) at 23° C. of 14 MPa or more after irradiation with ultraviolet rays of 300 mJ/cm 2 , and a layer having 15 MPa or more. It is more preferable to be a layer of 20 MPa or more, more preferably of 50 MPa or more, and most preferably of 100 MPa or more. Within such a range, a pressure-sensitive adhesive sheet with excellent peelability can be obtained. In addition, contamination of the adherend during peeling can be prevented. The upper limit of the post-curing elastic modulus B at 23° C. is, for example, 500 MPa (preferably 300 MPa).
 上記転写層は、300mJ/cmの紫外線を照射した後に、23℃における押し込み弾性率Bが、転写層の23℃における初期押し込み弾性率Aの20倍以上となることが好ましく、30倍以上となることがより好ましく、30倍~1000倍となることがより好ましく、50倍~200倍となることが特に好ましい。このような範囲であれば、被着体の固定性と剥離性とのバランスに優れた粘着シートを得ることができる。 After being irradiated with ultraviolet rays of 300 mJ/cm 2 , the indentation modulus B of the transfer layer at 23° C. is preferably 20 times or more, more preferably 30 times or more, the initial indentation modulus A of the transfer layer at 23° C. more preferably 30 to 1,000 times, and particularly preferably 50 to 200 times. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet having an excellent balance between fixability and releasability of an adherend.
 上記転写層は、300mJ/cmの紫外線を照射した後に、23℃における押し込み弾性率Bが、粘着剤層の23℃における押し込み弾性率Iの5倍以上となることが好ましく、10倍以上となることがより好ましく、50倍~5000倍となることがさらに好ましく、80倍~4500倍となることがより好ましく、100倍~3000倍となることが特に好ましい。このような範囲であれば、レーザー光照射による各層の変形を適性化することができ、かつ、レーザー光照射による剥離性に優れる粘着シートを得ることができる。このような粘着シートは、狭範囲において確実な剥離性を実現し得る。 After the transfer layer is irradiated with ultraviolet rays of 300 mJ/cm 2 , the indentation elastic modulus B at 23° C. is preferably 5 times or more the indentation elastic modulus I at 23° C. of the pressure-sensitive adhesive layer, preferably 10 times or more. more preferably 50-fold to 5000-fold, more preferably 80-fold to 4500-fold, and particularly preferably 100-fold to 3000-fold. Within such a range, deformation of each layer by laser light irradiation can be optimized, and a pressure-sensitive adhesive sheet with excellent peelability by laser light irradiation can be obtained. Such a pressure-sensitive adhesive sheet can achieve reliable releasability in a narrow range.
 1つの実施形態においては、上記転写層は、活性エネルギー線硬化型粘着剤を含む。転写層は、紫外線吸収剤および/または光重合開始剤をさらに含んでいてもよい。 In one embodiment, the transfer layer contains an active energy ray-curable adhesive. The transfer layer may further contain an ultraviolet absorber and/or a photoinitiator.
(活性エネルギー線硬化型粘着剤)
 1つの実施形態においては、活性エネルギー線硬化型粘着剤として、母剤となるベースポリマーと、該ベースポリマーと結合可能な活性エネルギー線反応性化合物(モノマーまたはオリゴマー)とを含む活性エネルギー線硬化型粘着剤(A1)が用いられる。別の実施形態においては、ベースポリマーとして活性エネルギー線反応性ポリマーを含む活性エネルギー線硬化型粘着剤(A2)が用いられる。好ましくは、上記ベースポリマーは、光重合開始剤と反応し得る官能基を有する。該官能基としては、例えば、ヒドロキシル基、カルボキシル基等が挙げられる。
(Active energy ray-curable adhesive)
In one embodiment, the active energy ray-curable pressure-sensitive adhesive is an active energy ray-curable adhesive containing a base polymer as a base material and an active energy ray-reactive compound (monomer or oligomer) capable of bonding with the base polymer. An adhesive (A1) is used. In another embodiment, an active energy ray-curable pressure-sensitive adhesive (A2) containing an active energy ray-reactive polymer as a base polymer is used. Preferably, the base polymer has functional groups capable of reacting with the photoinitiator. Examples of the functional group include hydroxyl group and carboxyl group.
 上記粘着剤(A1)において用いられるベースポリマーとしては、例えば、天然ゴム、ポリイソブチレンゴム、スチレン・ブタジエンゴム、スチレン・イソプレン・スチレンブロック共重合体ゴム、再生ゴム、ブチルゴム、ポリイソブチレンゴム、ニトリルゴム(NBR)等のゴム系ポリマー;シリコーン系ポリマー;アクリル系ポリマー等が挙げられる。これらのポリマーは、単独で、または2種以上組み合わせて用いてもよい。なかでも好ましくは、アクリル系ポリマーである。 Examples of the base polymer used in the adhesive (A1) include natural rubber, polyisobutylene rubber, styrene/butadiene rubber, styrene/isoprene/styrene block copolymer rubber, recycled rubber, butyl rubber, polyisobutylene rubber, and nitrile rubber. rubber-based polymers such as (NBR); silicone-based polymers; and acrylic polymers. These polymers may be used alone or in combination of two or more. Among them, acrylic polymers are preferred.
 アクリル系ポリマーとしては、(メタ)アクリル酸アルキルエステル、(メタ)アクリル酸シクロアルキルエステル、(メタ)アクリル酸アリールエステルなどの炭化水素基含有(メタ)アクリル酸エステルの単重合体または共重合体;該炭化水素基含有(メタ)アクリル酸エステルと他の共重合性モノマーとの共重合体等が挙げられる。(メタ)アクリル酸アルキルエステルとしては、例えば、(メタ)アクリル酸のメチルエステル、エチルエステル、プロピルエステル、イソプロピルエステル、ブチルエステル、イソブチルエステル、s-ブチルエステル、t-ブチルエステル、ペンチルエステル、イソペンチルエステル、ヘキシルエステル、ヘプチルエステル、オクチルエステル、2-エチルヘキシルエステル、イソオクチルエステル、ノニルエステル、デシルエステル、イソデシルエステル、ウンデシルエステル、ドデシルエステルすなわちラウリルエステル、トリデシルエステル、テトラデシルエステル、ヘキサデシルエステル、オクタデシルエステル、およびエイコシルエステルが挙げられる。(メタ)アクリル酸シクロアルキルエステルとしては、例えば、(メタ)アクリル酸のシクロペンチルエステルおよびシクロヘキシルエステルが挙げられる。(メタ)アクリル酸アリールエステルとしては、例えば、(メタ)アクリル酸フェニルおよび(メタ)アクリル酸ベンジルが挙げられる。上記炭化水素基含有(メタ)アクリル酸エステル由来の構成単位の含有割合は、ベースポリマー100重量部に対して、好ましくは40重量部以上であり、より好ましくは60重量部以上である。 Examples of acrylic polymers include homopolymers and copolymers of hydrocarbon group-containing (meth)acrylic esters such as (meth)acrylic acid alkyl esters, (meth)acrylic acid cycloalkyl esters, and (meth)acrylic acid aryl esters. a copolymer of the hydrocarbon group-containing (meth)acrylic acid ester and another copolymerizable monomer; (Meth)acrylic acid alkyl esters include, for example, (meth)acrylic acid methyl ester, ethyl ester, propyl ester, isopropyl ester, butyl ester, isobutyl ester, s-butyl ester, t-butyl ester, pentyl ester, iso Pentyl ester, hexyl ester, heptyl ester, octyl ester, 2-ethylhexyl ester, isooctyl ester, nonyl ester, decyl ester, isodecyl ester, undecyl ester, dodecyl ester or lauryl ester, tridecyl ester, tetradecyl ester, hexa Decyl esters, octadecyl esters, and eicosyl esters are included. (Meth)acrylic acid cycloalkyl esters include, for example, cyclopentyl and cyclohexyl esters of (meth)acrylic acid. (Meth)acrylic acid aryl esters include, for example, phenyl (meth)acrylate and benzyl (meth)acrylate. The content of structural units derived from the hydrocarbon group-containing (meth)acrylic acid ester is preferably 40 parts by weight or more, more preferably 60 parts by weight or more, relative to 100 parts by weight of the base polymer.
 上記他の共重合性モノマーとしては、例えば、カルボキシ基含有モノマー、酸無水物モノマー、ヒドロキシ基含有モノマー、グリシジル基含有モノマー、スルホン酸基含有モノマー、リン酸基含有モノマー、アクリルアミド、およびアクリロニトリルなどの官能基含有モノマー等が挙げられる。カルボキシ基含有モノマーとしては、例えば、アクリル酸、メタクリル酸、カルボキシエチル(メタ)アクリレート、カルボキシペンチル(メタ)アクリレート、イタコン酸、マレイン酸、フマル酸、およびクロトン酸が挙げられる。酸無水物モノマーとしては、例えば、無水マレイン酸および無水イタコン酸が挙げられる。ヒドロキシ基含有モノマーとしては、例えば、(メタ)アクリル酸2-ヒドロキシエチル、(メタ)アクリル酸2-ヒドロキシプロピル、(メタ)アクリル酸4-ヒドロキシブチル、(メタ)アクリル酸6-ヒドロキシヘキシル、(メタ)アクリル酸8-ヒドロキシオクチル、(メタ)アクリル酸10-ヒドロキシデシル、(メタ)アクリル酸12-ヒドロキシラウリル、および(4-ヒドロキシメチルシクロヘキシル)メチル(メタ)アクリレートが挙げられる。グリシジル基含有モノマーとしては、例えば、(メタ)アクリル酸グリシジルおよび(メタ)アクリル酸メチルグリシジルが挙げられる。スルホン酸基含有モノマーとしては、例えば、スチレンスルホン酸、アリルスルホン酸、2-(メタ)アクリルアミド-2-メチルプロパンスルホン酸、(メタ)アクリルアミドプロパンスルホン酸、スルホプロピル(メタ)アクリレート、および(メタ)アクリロイルオキシナフタレンスルホン酸が挙げられる。リン酸基含有モノマーとしては、例えば、2-ヒドロキシエチルアクリロイルホスフェートが挙げられる。アクリルアミドとしては、例えばN-アクリロイルモルホリンが挙げられる。これらは、1種を単独で用いてもよいし、2種以上を組み合わせて用いてもよい。上記共重合性モノマー由来の構成単位の含有割合は、ベースポリマー100重量部に対して、好ましくは60重量部以下であり、より好ましくは40重量部以下である。 Examples of other copolymerizable monomers include carboxy group-containing monomers, acid anhydride monomers, hydroxy group-containing monomers, glycidyl group-containing monomers, sulfonic acid group-containing monomers, phosphoric acid group-containing monomers, acrylamide, and acrylonitrile. Examples include functional group-containing monomers. Carboxy group-containing monomers include, for example, acrylic acid, methacrylic acid, carboxyethyl (meth)acrylate, carboxypentyl (meth)acrylate, itaconic acid, maleic acid, fumaric acid, and crotonic acid. Anhydride monomers include, for example, maleic anhydride and itaconic anhydride. Examples of hydroxy group-containing monomers include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, 6-hydroxyhexyl (meth)acrylate, ( 8-hydroxyoctyl meth)acrylate, 10-hydroxydecyl (meth)acrylate, 12-hydroxylauryl (meth)acrylate, and (4-hydroxymethylcyclohexyl)methyl (meth)acrylate. Glycidyl group-containing monomers include, for example, glycidyl (meth)acrylate and methylglycidyl (meth)acrylate. Sulfonic acid group-containing monomers include, for example, styrenesulfonic acid, allylsulfonic acid, 2-(meth)acrylamido-2-methylpropanesulfonic acid, (meth)acrylamidopropanesulfonic acid, sulfopropyl (meth)acrylate, and (meth) ) acryloyloxynaphthalene sulfonic acid. Phosphate group-containing monomers include, for example, 2-hydroxyethyl acryloyl phosphate. Acrylamides include, for example, N-acryloylmorpholine. These may be used individually by 1 type, and may be used in combination of 2 or more type. The content of structural units derived from the copolymerizable monomer is preferably 60 parts by weight or less, more preferably 40 parts by weight or less, relative to 100 parts by weight of the base polymer.
 アクリル系ポリマーは、そのポリマー骨格中に架橋構造を形成するために、多官能性モノマー由来の構成単位を含み得る。多官能性モノマーとして、例えば、ヘキサンジオールジ(メタ)アクリレート、(ポリ)エチレングリコールジ(メタ)アクリレート、(ポリ)プロピレングリコールジ(メタ)アクリレート、ネオペンチルグリコールジ(メタ)アクリレート、ペンタエリスリトールジ(メタ)アクリレート、トリメチロールプロパントリ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、エポキシ(メタ)アクリレート(すなわち、ポリグリシジル(メタ)アクリレート)、ポリエステル(メタ)アクリレート、およびウレタン(メタ)アクリレートが挙げられる。これらは、1種を単独で用いてもよいし、2種以上を組み合わせて用いてもよい。上記多官能性モノマー由来の構成単位の含有割合は、ベースポリマー100重量部に対して、好ましくは40重量部以下であり、より好ましくは30重量部以下である。 The acrylic polymer may contain structural units derived from polyfunctional monomers in order to form a crosslinked structure in the polymer backbone. Examples of polyfunctional monomers include hexanediol di(meth)acrylate, (poly)ethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, pentaerythritol di(meth)acrylate, (meth)acrylates, trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, dipentaerythritol hexa(meth)acrylate, epoxy (meth)acrylate (i.e. polyglycidyl (meth)acrylate), polyester (meth)acrylate ) acrylates, and urethane (meth)acrylates. These may be used individually by 1 type, and may be used in combination of 2 or more type. The content of the structural unit derived from the polyfunctional monomer is preferably 40 parts by weight or less, more preferably 30 parts by weight or less, relative to 100 parts by weight of the base polymer.
 上記アクリル系ポリマーの重量平均分子量は、好ましくは10万~300万であり、より好ましくは20万~200万である。重量平均分子量は、GPC(溶媒:THF)により測定され得る。 The weight average molecular weight of the acrylic polymer is preferably 100,000 to 3,000,000, more preferably 200,000 to 2,000,000. A weight average molecular weight can be measured by GPC (solvent: THF).
 上記粘着剤(A1)に用いられ得る上記活性エネルギー線反応性化合物としては、例えば、アクリロイル基、メタクリロイル基、ビニル基、アリル基、アセチレン基等の重合性炭素-炭素多重結合を有する官能基を有する光反応性のモノマーまたはオリゴマーが挙げられる。該光反応性のモノマーの具体例としては、トリメチロールプロパントリ(メタ)アクリレート、テトラメチロールメタンテトラ(メタ)アクリレート、ペンタエリスリトールトリ(メタ)アクリレート、ペンタエリスリトールテトラ(メタ)アクリレート、ジペンタエリスリトールモノヒドロキシペンタ(メタ)アクリレート、ジペンタエリスリトールヘキサ(メタ)アクリレート、1,4-ブタンジオールジ(メタ)アクリレート、1,6-ヘキサンジオールジ(メタ)アクリレート、ポリエチレングリコールジ(メタ)アクリレート等の(メタ)アクリル酸と多価アルコールとのエステル化物;多官能ウレタン(メタ)アクリレート;エポキシ(メタ)アクリレート;オリゴエステル(メタ)アクリレート等が挙げられる。また、メタクリロイソシアネート、2-メタクリロイルオキシエチルイソシアネート(2-イソシアナトエチルメタクリレート)、m-イソプロペニル-α,α-ジメチルベンジルイソシアネート等のモノマーを用いてもよい。光反応性のオリゴマーの具体例としては、上記モノマーの2~5量体等が挙げられる。光反応性のオリゴマーの分子量は、好ましくは100~3000である。 Examples of the active energy ray-reactive compound that can be used in the adhesive (A1) include a functional group having a polymerizable carbon-carbon multiple bond such as an acryloyl group, a methacryloyl group, a vinyl group, an allyl group, and an acetylene group. photoreactive monomers or oligomers having Specific examples of the photoreactive monomer include trimethylolpropane tri(meth)acrylate, tetramethylolmethane tetra(meth)acrylate, pentaerythritol tri(meth)acrylate, pentaerythritol tetra(meth)acrylate, dipentaerythritol mono Hydroxy penta (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1,4-butanediol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate ( Esterified product of meth)acrylic acid and polyhydric alcohol; polyfunctional urethane (meth)acrylate; epoxy (meth)acrylate; oligoester (meth)acrylate and the like. Also, monomers such as methacryloylisocyanate, 2-methacryloyloxyethyl isocyanate (2-isocyanatoethyl methacrylate), m-isopropenyl-α,α-dimethylbenzyl isocyanate may be used. Specific examples of photoreactive oligomers include dimers to pentamers of the above monomers. The molecular weight of the photoreactive oligomer is preferably 100-3000.
 また、上記活性エネルギー線反応性化合物として、エポキシ化ブタジエン、グリシジルメタクリレート、アクリルアミド、ビニルシロキサン等のモノマー;または該モノマーから構成されるオリゴマーを用いてもよい。 Further, as the active energy ray-reactive compound, monomers such as epoxidized butadiene, glycidyl methacrylate, acrylamide, and vinylsiloxane; or oligomers composed of such monomers may be used.
 さらに、上記活性エネルギー線反応性化合物として、オニウム塩等の有機塩類と、分子内に複数の複素環を有する化合物との混合物を用いてもよい。該混合物は、活性エネルギー線(例えば、紫外線、電子線)の照射により有機塩が開裂してイオンを生成し、これが開始種となって複素環の開環反応を引き起こして3次元網目構造を形成し得る。上記有機塩類としては、例えば、ヨードニウム塩、フォスフォニウム塩、アンチモニウム塩、スルホニウム塩、ボレート塩等が挙げられる。上記分子内に複数の複素環を有する化合物における複素環としては、オキシラン、オキセタン、オキソラン、チイラン、アジリジン等が挙げられる。 Furthermore, as the active energy ray-reactive compound, a mixture of an organic salt such as an onium salt and a compound having a plurality of heterocycles in the molecule may be used. When the mixture is irradiated with an active energy ray (e.g., ultraviolet rays, electron beams), the organic salt is cleaved to generate ions, which act as starting species to cause a heterocyclic ring-opening reaction to form a three-dimensional network structure. can. Examples of the organic salts include iodonium salts, phosphonium salts, antimonium salts, sulfonium salts, borate salts and the like. Examples of the heterocyclic ring in the compound having a plurality of heterocyclic rings in the molecule include oxirane, oxetane, oxolane, thiirane, aziridine and the like.
 上記粘着剤(A1)において、活性エネルギー線反応性化合物の含有割合は、ベースポリマー100重量部に対して、好ましくは0.1重量部~500重量部であり、より好ましくは5重量部~300重量部であり、さらに好ましくは40重量部~150重量部である。 In the adhesive (A1), the content of the active energy ray-reactive compound is preferably 0.1 parts by weight to 500 parts by weight, more preferably 5 parts by weight to 300 parts by weight, with respect to 100 parts by weight of the base polymer. parts by weight, more preferably 40 to 150 parts by weight.
 上記粘着剤(A2)に含まれる活性エネルギー線反応性ポリマー(ベースポリマー)としては、例えば、アクリロイル基、メタクリロイル基、ビニル基、アリル基、アセチレン基等の炭素-炭素多重結合を有する官能基を有するポリマーが挙げられる。活性エネルギー線反応性ポリマーの具体例としては、多官能(メタ)アクリレートから構成されるポリマー;光カチオン重合型ポリマー;ポリビニルシンナマート等のシンナモイル基含有ポリマー;ジアゾ化されたアミノノボラック樹脂;ポリアクリルアミド;等が挙げられる。 Examples of the active energy ray-reactive polymer (base polymer) contained in the adhesive (A2) include functional groups having carbon-carbon multiple bonds such as acryloyl groups, methacryloyl groups, vinyl groups, allyl groups, and acetylene groups. polymer having Specific examples of active energy ray-reactive polymers include polymers composed of polyfunctional (meth)acrylates; photo-cationically polymerizable polymers; cinnamoyl group-containing polymers such as polyvinyl cinnamate; diazotized amino novolak resins; ; and the like.
 1つの実施形態においては、上記アクリル系ポリマーの側鎖、主鎖および/または主鎖末端に、活性エネルギー線重合性の炭素-炭素多重結合が導入されて構成された活性エネルギー線反応性ポリマーが用いられる。アクリル系ポリマーへの放射線重合性の炭素-炭素二重結合の導入手法としては、例えば、所定の官能基(第1の官能基)を有するモノマーを含む原料モノマーを共重合させてアクリル系ポリマーを得た後、第1の官能基との間で反応を生じて結合しうる所定の官能基(第2の官能基)と放射線重合性炭素-炭素二重結合とを有する化合物を、炭素-炭素二重結合の放射線重合性を維持したままアクリル系ポリマーに対して縮合反応または付加反応させる方法が、挙げられる。 In one embodiment, an active energy ray-reactive polymer is formed by introducing an active energy ray-polymerizable carbon-carbon multiple bond into the side chain, main chain and/or end of the main chain of the acrylic polymer. Used. As a technique for introducing a radiation-polymerizable carbon-carbon double bond into an acrylic polymer, for example, an acrylic polymer is obtained by copolymerizing raw material monomers containing a monomer having a predetermined functional group (first functional group). After obtaining, a compound having a predetermined functional group (second functional group) and a radiation-polymerizable carbon-carbon double bond capable of reacting with and bonding to the first functional group is carbon-carbon A method of subjecting an acrylic polymer to a condensation reaction or an addition reaction while maintaining the radiation polymerizability of the double bond can be mentioned.
 第1の官能基と第2の官能基の組み合わせとしては、例えば、カルボキシ基とエポキシ基、エポキシ基とカルボキシ基、カルボキシ基とアジリジル基、アジリジル基とカルボキシ基、ヒドロキシ基とイソシアネート基、イソシアネート基とヒドロキシ基が挙げられる。これら組み合わせのうち、反応追跡の容易さの観点からは、ヒドロキシ基とイソシアネート基の組み合わせや、イソシアネート基とヒドロキシ基の組み合わせが、好ましい。また、反応性の高いイソシアネート基を有するポリマーを作製するのは技術的難易度が高いところ、アクリル系ポリマーの作製または入手のしやすさの観点からは、アクリル系ポリマー側の上記第1の官能基がヒドロキシ基であり且つ上記第2の官能基がイソシアネート基である場合が、より好ましい。この場合、放射線重合性炭素-炭素二重結合と第2の官能基たるイソシアネート基とを併有するイソシアネート化合物としては、例えば、メタクリロイルイソシアネート、2-メタクリロイルオキシエチルイソシアネート、およびm-イソプロペニル-α,α-ジメチルベンジルイソシアネートが挙げられる。また、第1の官能基を有するアクリル系ポリマーとしては、上記のヒドロキシ基含有モノマー由来の構成単位を含むものが好ましく、2-ヒドロキシエチルビニルエーテルや、4-ヒドロキシブチルビニルエーテル、ジエチレングルコールモノビニルエーテルなどのエーテル系化合物由来の構成単位を含むものも好ましい。 Combinations of the first functional group and the second functional group include, for example, a carboxy group and an epoxy group, an epoxy group and a carboxy group, a carboxy group and an aziridyl group, an aziridyl group and a carboxy group, a hydroxy group and an isocyanate group, and an isocyanate group. and hydroxy groups. Among these combinations, a combination of a hydroxy group and an isocyanate group and a combination of an isocyanate group and a hydroxy group are preferable from the viewpoint of ease of reaction tracking. In addition, it is technically difficult to produce a polymer having a highly reactive isocyanate group. More preferred is when the group is a hydroxy group and said second functional group is an isocyanate group. In this case, examples of isocyanate compounds having both a radiation-polymerizable carbon-carbon double bond and an isocyanate group as the second functional group include methacryloyl isocyanate, 2-methacryloyloxyethyl isocyanate, m-isopropenyl-α, and α-dimethylbenzyl isocyanate. Further, the acrylic polymer having the first functional group preferably contains a structural unit derived from the hydroxy group-containing monomer, such as 2-hydroxyethyl vinyl ether, 4-hydroxybutyl vinyl ether, and diethylene glycol monovinyl ether. It is also preferable to contain a constitutional unit derived from an ether-based compound.
 上記粘着剤(A2)は、上記活性エネルギー線反応性化合物(モノマーまたはオリゴマー)をさらに含んでいてもよい。 The adhesive (A2) may further contain the active energy ray-reactive compound (monomer or oligomer).
 上記活性エネルギー線硬化型粘着剤は、紫外線吸収剤および/または光重合開始剤を含み得る。用いられる紫外線吸収剤および光重合開始剤の詳細は、後述する。 The active energy ray-curable adhesive may contain an ultraviolet absorber and/or a photopolymerization initiator. The details of the ultraviolet absorber and photopolymerization initiator used will be described later.
 1つの実施形態においては、上記活性エネルギー線硬化型粘着剤は、光増感剤を含み得る。光増感剤としては、川崎化成工業社製の商品名「UVS-581」、9,10-ジエトキシアントラセン(例えば、川崎化成工業社製、商品名「UVS-1101」)等が挙げられる。上記光増感剤のその他の例としては、9,10-ジブトキシアントラセン(例えば、川崎化成工業社製、商品名「UVS-1331」)、2-イソプロピルチオキサントン、ベンゾフェノン、チオキサントン誘導体、4,4’-ビス(ジメチルアミノ)ベンゾフェノン等が挙げられる。チオキサントン誘導体としては、例えば、エトキシカルボニルチオキサントン、イソプロピルチオキサントン等が挙げられる。 In one embodiment, the active energy ray-curable pressure-sensitive adhesive may contain a photosensitizer. Examples of photosensitizers include "UVS-581" (trade name) manufactured by Kawasaki Chemical Industries, Ltd., and 9,10-diethoxyanthracene (eg, "UVS-1101" (trade name) manufactured by Kawasaki Chemical Industries, Ltd.). Other examples of the photosensitizer include 9,10-dibutoxyanthracene (eg, trade name “UVS-1331” manufactured by Kawasaki Chemical Industries, Ltd.), 2-isopropylthioxanthone, benzophenone, thioxanthone derivatives, 4,4 '-bis(dimethylamino)benzophenone and the like. Thioxanthone derivatives include, for example, ethoxycarbonylthioxanthone and isopropylthioxanthone.
 上記光増感剤の含有割合は、ベースポリマー100重量部に対して、好ましくは0.01重量部~2重量部であり、より好ましくは0.5重量部~2重量部である。 The content of the photosensitizer is preferably 0.01 to 2 parts by weight, more preferably 0.5 to 2 parts by weight, relative to 100 parts by weight of the base polymer.
 好ましくは、上記活性エネルギー線硬化型粘着剤は、架橋剤を含む。架橋剤としては、例えば、イソシアネート系架橋剤、エポキシ系架橋剤、オキサゾリン系架橋剤、アジリジン系架橋剤、メラミン系架橋剤、過酸化物系架橋剤、尿素系架橋剤、金属アルコキシド系架橋剤、金属キレート系架橋剤、金属塩系架橋剤、カルボジイミド系架橋剤、アミン系架橋剤等が挙げられる。 Preferably, the active energy ray-curable pressure-sensitive adhesive contains a cross-linking agent. Examples of cross-linking agents include isocyanate-based cross-linking agents, epoxy-based cross-linking agents, oxazoline-based cross-linking agents, aziridine-based cross-linking agents, melamine-based cross-linking agents, peroxide-based cross-linking agents, urea-based cross-linking agents, metal alkoxide-based cross-linking agents, Examples include metal chelate cross-linking agents, metal salt cross-linking agents, carbodiimide cross-linking agents, amine cross-linking agents and the like.
 上記架橋剤の含有割合は、粘着剤のベースポリマー100重量部に対して、好ましくは0.5重量部~10重量部であり、より好ましくは1重量部~8重量部である。 The content of the cross-linking agent is preferably 0.5 to 10 parts by weight, more preferably 1 to 8 parts by weight, with respect to 100 parts by weight of the base polymer of the adhesive.
 1つの実施形態においては、イソシアネート系架橋剤が好ましく用いられる。イソシアネート系架橋剤は、多種の官能基と反応し得る点で好ましい。上記イソシアネート系架橋剤の具体例としては、ブチレンジイソシアネート、ヘキサメチレンジイソシアネート等の低級脂肪族ポリイソシアネート類;シクロペンチレンジイソシアネート、シクロへキシレンジイソシアネート、イソホロンジイソシアネート等の脂環族イソシアネート類;2,4-トリレンジイソシアネート、4,4’-ジフェニルメタンジイソシアネート、キシリレンジイソシアネート等の芳香族イソシアネート類;トリメチロールプロパン/トリレンジイソシアネート3量体付加物(東ソー社製、商品名「コロネートL」)、トリメチロールプロパン/へキサメチレンジイソシアネート3量体付加物(東ソー社製、商品名「コロネートHL」)、ヘキサメチレンジイソシアネートのイソシアヌレート体(東ソー社製、商品名「コロネートHX」)等のイソシアネート付加物;等が挙げられる。好ましくは、イソシアネート基を3個以上有する架橋剤が用いられる。 In one embodiment, an isocyanate-based cross-linking agent is preferably used. An isocyanate-based cross-linking agent is preferable because it can react with various functional groups. Specific examples of the isocyanate-based cross-linking agents include lower aliphatic polyisocyanates such as butylene diisocyanate and hexamethylene diisocyanate; Aromatic isocyanates such as tolylene diisocyanate, 4,4'-diphenylmethane diisocyanate, xylylene diisocyanate; trimethylolpropane/tolylene diisocyanate trimer adduct (manufactured by Tosoh Corporation, trade name "Coronate L"), trimethylolpropane / Isocyanate adducts such as hexamethylene diisocyanate trimer adduct (manufactured by Tosoh Corporation, trade name "Coronate HL"), isocyanurate form of hexamethylene diisocyanate (manufactured by Tosoh Corporation, trade name "Coronate HX"); mentioned. Preferably, a cross-linking agent having 3 or more isocyanate groups is used.
 活性エネルギー線硬化型粘着剤は、必要に応じて、任意の適切な添加剤をさらに含み得る。添加剤としては、例えば、活性エネルギー線重合促進剤、ラジカル捕捉剤、カップリング剤(例えば、シランカップリング剤)、粘着付与剤、可塑剤(例えば、トリメリット酸エステル系可塑剤、ピロメリット酸エステル系可塑剤等)、顔料、染料、充填剤、老化防止剤、導電材、帯電防止剤、光安定剤、剥離調整剤、軟化剤、界面活性剤、難燃剤、酸化防止剤、粒子、紫外線吸収剤等が挙げられる。 The active energy ray-curable adhesive may further contain any suitable additive as necessary. Additives include, for example, active energy ray polymerization accelerators, radical scavengers, coupling agents (e.g., silane coupling agents), tackifiers, plasticizers (e.g., trimellitic acid ester plasticizers, pyromellitic acid ester plasticizers, etc.), pigments, dyes, fillers, antioxidants, conductive materials, antistatic agents, light stabilizers, release modifiers, softeners, surfactants, flame retardants, antioxidants, particles, ultraviolet rays Absorbents and the like are included.
(光重合開始剤)
 光重合開始剤としては、任意の適切な開始剤を用いることができる。光重合開始剤としては、例えば、4-(2-ヒドロキシエトキシ)フェニル(2-ヒドロキシ-2-プロピル)ケトン、α-ヒドロキシ-α,α’-ジメチルアセトフェノン、2-メチル-2-ヒドロキシプロピオフェノン、1-ヒドロキシシクロヘキシルフェニルケトン等のα-ケトール系化合物;メトキシアセトフェノン、2,2-ジメトキシ-2-フェニルアセトフェノン、2,2-ジエトキシアセトフェノン、2-メチル-1-[4-(メチルチオ)-フェニル]-2-モルホリノプロパン-1等のアセトフェノン系化合物;ベンゾインエチルエーテル、ベンゾインイソプロピルエーテル、アニソインメチルエーテル等のベンゾインエーテル系化合物;ベンジルジメチルケタール等のケタール系化合物;2-ナフタレンスルホニルクロリド等の芳香族スルホニルクロリド系化合物;1-フェノン-1,1―プロパンジオン-2-(o-エトキシカルボニル)オキシム等の光活性オキシム系化合物;ベンゾフェノン、ベンゾイル安息香酸、3,3’-ジメチル-4-メトキシベンゾフェノン等のベンゾフェノン系化合物;チオキサンソン、2-クロロチオキサンソン、2-メチルチオキサンソン、2,4-ジメチルチオキサンソン、イソプロピルチオキサンソン、2,4-ジクロロチオキサンソン、2,4-ジエチルチオキサンソン、2,4-ジイソプロピルチオキサンソン等のチオキサンソン系化合物;カンファーキノン;ハロゲン化ケトン;アシルホスフィノキシド;アシルホスフォナート等が挙げられる。光重合開始剤の使用量は、任意の適切な量に設定され得る。
(Photoinitiator)
Any appropriate initiator can be used as the photopolymerization initiator. Examples of photopolymerization initiators include 4-(2-hydroxyethoxy)phenyl(2-hydroxy-2-propyl)ketone, α-hydroxy-α,α'-dimethylacetophenone, 2-methyl-2-hydroxypropio α-ketol compounds such as phenone and 1-hydroxycyclohexylphenyl ketone; methoxyacetophenone, 2,2-dimethoxy-2-phenylacetophenone, 2,2-diethoxyacetophenone, 2-methyl-1-[4-(methylthio) Acetophenone compounds such as -phenyl]-2-morpholinopropane-1; benzoin ether compounds such as benzoin ethyl ether, benzoin isopropyl ether, and anisoin methyl ether; ketal compounds such as benzyl dimethyl ketal; 2-naphthalenesulfonyl chloride, etc. aromatic sulfonyl chloride compounds; 1-phenone-1,1-propanedione-2-(o-ethoxycarbonyl) oxime and other photoactive oxime compounds; benzophenone, benzoylbenzoic acid, 3,3'-dimethyl-4 -benzophenone compounds such as methoxybenzophenone; thioxanthone, 2-chlorothioxanthone, 2-methylthioxanthone, 2,4-dimethylthioxanthone, isopropylthioxanthone, 2,4-dichlorothioxanthone, 2,4 thioxanthone-based compounds such as diethylthioxanthone and 2,4-diisopropylthioxanthone; camphorquinone; halogenated ketones; The amount of photopolymerization initiator used can be set to any appropriate amount.
 1つの実施形態においては、400nm以下(好ましくは380nm以下、より好ましくは340nm以下)の範囲に最大吸収波長を有する光重合開始剤が用いられる。 In one embodiment, a photopolymerization initiator having a maximum absorption wavelength in the range of 400 nm or less (preferably 380 nm or less, more preferably 340 nm or less) is used.
 上記光重合開始剤の使用量は、任意の適切な量に設定され得る。 The amount of the photopolymerization initiator used can be set to any appropriate amount.
 上記光重合開始剤として、市販品を用いてもよい。例えば、400nm以下の範囲に最大吸収波長を有する光重合開始剤として、BASF社製の商品名「イルガキュア127」、「イルガキュア369」、「イルガキュア369E」、「イルガキュア379」、「イルガキュア379EG」、「イルガキュア819」、「イルガキュアTOP」、「イルガキュア784」、「イルガキュアOXE01」等が挙げられる。 A commercially available product may be used as the photopolymerization initiator. For example, as a photopolymerization initiator having a maximum absorption wavelength in the range of 400 nm or less, BASF trade names "Irgacure 127", "Irgacure 369", "Irgacure 369E", "Irgacure 379", "Irgacure 379EG", " Irgacure 819", "Irgacure TOP", "Irgacure 784", and "Irgacure OXE01".
C.粘着剤層
 上記粘着剤層の厚みは、好ましくは2~50μmであり、より好ましくは2~40μmであり、さらに好ましくは2~30μmである。このような範囲であれば、レーザー光照射による各層の変形を適性化することができ、かつ、レーザー光照射による剥離性に優れる粘着シートを得ることができる。このような粘着シートは、狭範囲において確実な剥離性を実現し得る。
C. Adhesive layer The thickness of the adhesive layer is preferably 2 to 50 µm, more preferably 2 to 40 µm, still more preferably 2 to 30 µm. Within such a range, deformation of each layer by laser light irradiation can be optimized, and a pressure-sensitive adhesive sheet with excellent peelability by laser light irradiation can be obtained. Such a pressure-sensitive adhesive sheet can achieve reliable releasability in a narrow range.
 上記粘着剤層の23℃における押し込み弾性率Iは、好ましくは0.03MPa~20MPaであり、より好ましくは0.05MPa~10MPaであり、さらに好ましくは0.06MPa~5MPaである。このような範囲であれば、レーザー光照射による各層の変形を適性化することができ、かつ、レーザー光照射による剥離性に優れる粘着シートを得ることができる。このような粘着シートは、狭範囲において確実な剥離性を実現し得る。 The indentation modulus I of the adhesive layer at 23°C is preferably 0.03 MPa to 20 MPa, more preferably 0.05 MPa to 10 MPa, and still more preferably 0.06 MPa to 5 MPa. Within such a range, deformation of each layer by laser light irradiation can be optimized, and a pressure-sensitive adhesive sheet with excellent peelability by laser light irradiation can be obtained. Such a pressure-sensitive adhesive sheet can achieve reliable releasability in a narrow range.
 上記粘着剤層の波長248nmの光透過率は、好ましくは25%以上であり、より好ましくは40%以上であり、さらに好ましくは55%以上であり、特に好ましくは80%以上であり、最も好ましくは90%以上である。上記粘着剤層の波長248nmの光透過率は、高いほど好ましいが、その上限は、例えば、99%である。このような範囲であれば、レーザー光照射による剥離の際、当該レーザー光が効果的に基材に到達し、優れた剥離性を実現することができる。 The light transmittance of the pressure-sensitive adhesive layer at a wavelength of 248 nm is preferably 25% or more, more preferably 40% or more, still more preferably 55% or more, particularly preferably 80% or more, and most preferably. is 90% or more. The light transmittance of the pressure-sensitive adhesive layer at a wavelength of 248 nm is preferably as high as possible, but its upper limit is, for example, 99%. Within such a range, the laser beam can effectively reach the base material during peeling by laser beam irradiation, and excellent peelability can be achieved.
 上記粘着剤層は、シリコーン系粘着剤を含む。シリコーン系粘着剤は、ベースポリマーとしてシリコーン系ポリマーを含む。シリコーン系粘着剤を用いることにより、所定波長の光の透過性に優れる粘着剤層を形成することができる。その結果、レーザー光照射による剥離の際、当該レーザー光が効果的に基材に到達し、優れた剥離性を実現することができる。 The adhesive layer contains a silicone-based adhesive. A silicone-based pressure-sensitive adhesive contains a silicone-based polymer as a base polymer. By using a silicone-based pressure-sensitive adhesive, a pressure-sensitive adhesive layer having excellent transparency to light of a predetermined wavelength can be formed. As a result, the laser light effectively reaches the base material during the peeling by laser light irradiation, and excellent peelability can be realized.
 上記シリコーン系粘着剤としては、本発明の効果が得られる限り、任意の適切な粘着剤が用いられ得る。上記シリコーン系粘着剤として、例えば、オルガノポリシロキサンを含むシリコーンゴムまたはシリコーンレジン等をベースポリマーとするシリコーン系粘着剤が好ましく用いられる。シリコーン系粘着剤を構成するベースポリマーとして、上記シリコーンゴムまたはシリコーンレジンを、架橋して得られたベースポリマーを用いてもよい。なお、本明細書において、「シリコーンゴム」とは、主成分としてのジオルガノシロキサン(D単位)が直鎖状に連なった重合体(例えば、粘度1000Pa・s)を意味し、「シリコーンレジン」とは、主成分としてのトリオルガノシルヘミオキサン(M単位)とシリケート(Q単位)から構成される重合体を意味する(「粘着剤(フィルム・テープ)の材料設計と機能性付与」、技術情報協会、2009年9月30日発刊)。 Any appropriate adhesive can be used as the silicone-based adhesive as long as the effects of the present invention can be obtained. As the silicone-based pressure-sensitive adhesive, for example, a silicone-based pressure-sensitive adhesive having a base polymer such as silicone rubber containing organopolysiloxane or silicone resin is preferably used. A base polymer obtained by cross-linking the above silicone rubber or silicone resin may be used as the base polymer constituting the silicone pressure-sensitive adhesive. In the present specification, the term "silicone rubber" means a polymer (e.g., a viscosity of 1000 Pa s) in which diorganosiloxane (D unit) as a main component is linked in a straight chain, and a "silicone resin". means a polymer composed of triorganosilhemioxane (M unit) and silicate (Q unit) as main components (“Material design and functionalization of adhesives (films and tapes)”, Technical Information Association, September 30, 2009).
 上記シリコーンゴムとしては、例えば、ジメチルシロキサンを構成単位として含むオルガノポリシロキサン等が挙げられる。オルガノポリシロキサンには、必要に応じて、官能基(例えば、ビニル基)が導入されていてもよい。オルガノポリシロキサンの重量平均分子量は、好ましくは100,000~1000,000であり、より好ましくは150,000~500,000である。重量平均分子量は、GPC(溶媒:THF)により測定することができる。 Examples of the silicone rubber include organopolysiloxane containing dimethylsiloxane as a structural unit. A functional group (for example, a vinyl group) may be introduced into the organopolysiloxane, if necessary. The weight average molecular weight of the organopolysiloxane is preferably from 100,000 to 1000,000, more preferably from 150,000 to 500,000. A weight average molecular weight can be measured by GPC (solvent: THF).
 上記シリコーンレジンとしては、例えば、RSiO1/2構成単位、SiO構成単位、RSiO3/2構成単位およびRSiO構成単位から選ばれる少なくとも1種の構成単位を含むオルガノポリシロキサン挙げられる(Rは、一価炭化水素基または水酸基である)。 Examples of the silicone resin include organopolysiloxanes containing at least one structural unit selected from R 3 SiO 1/2 structural units, SiO 2 structural units, RSiO 3/2 structural units and R 2 SiO structural units. (R is a monovalent hydrocarbon or hydroxyl group).
 上記シリコーンゴムとシリコーンレジンとは併用され得る。シリコーン粘着剤中のシリコーンゴムとシリコーンレジンの重量比(ゴム:レジン)は、好ましくは100:0~100:220であり、より好ましくは100:0~100:180であり、さらに好ましくは100:10~100:100である。シリコーンゴムとシリコーンレジンとは、単なる混合物としてシリコーン系粘着剤中に含まれていてもよく、シリコーンゴムとシリコーンレジンとが部分縮合した形態でシリコーン系粘着剤中に含まれていてもよい。ゴム:レジン比は、シリコーン粘着剤の組成を29Si-NMRにより測定して得られたQ単位(レジン)とD単位(ゴム)との比からも求めることができる。 The above silicone rubber and silicone resin may be used in combination. The weight ratio of the silicone rubber to the silicone resin (rubber:resin) in the silicone adhesive is preferably 100:0 to 100:220, more preferably 100:0 to 100:180, still more preferably 100: 10-100:100. The silicone rubber and the silicone resin may be contained in the silicone pressure-sensitive adhesive as a simple mixture, or may be contained in the silicone pressure-sensitive adhesive in the form of partial condensation of the silicone rubber and the silicone resin. The rubber:resin ratio can also be determined from the ratio of Q units (resin) to D units (rubber) obtained by measuring the composition of the silicone adhesive by 29 Si-NMR.
 上記シリコーン系粘着剤は、必要に応じて、任意の適切な添加剤を含み得る。該添加剤としては、例えば、架橋剤、加硫剤、粘着付与剤、可塑剤、顔料、染料、充填剤、老化防止剤、導電材、帯電防止剤、紫外線吸収剤、光安定剤、剥離調整剤、軟化剤、界面活性剤、難燃剤、酸化防止剤等が挙げられる。 The silicone-based pressure-sensitive adhesive may contain any suitable additive as necessary. The additives include, for example, cross-linking agents, vulcanizing agents, tackifiers, plasticizers, pigments, dyes, fillers, anti-aging agents, conductive materials, antistatic agents, ultraviolet absorbers, light stabilizers, and release control agents. agents, softeners, surfactants, flame retardants, antioxidants and the like.
 好ましくは、上記シリコーン系粘着剤は架橋剤を含む。該架橋剤としては、例えば、シロキサン系架橋剤、過酸化物系架橋剤等が挙げられる。過酸化物系架橋剤としては、任意の適切な架橋剤が用いられ得る。過酸化物系架橋剤としては、例えば、過酸化ベンゾイル、t-ブチルパーオキシベンゾエート、ジクミルパーオキサイト等が挙げられる。シロキサン系架橋剤としては、例えば、ポリオルガノハイドロジェンシロキサン等が挙げられる。該ポリオルガノハイドロジェンシロキサンは、ケイ素原子に結合した水素原子を2個以上有することが好ましい。また、該ポリオルガノハイドロジェンシロキサンは、ケイ素原子に結合した官能基として、アルキル基、フェニル基、ハロゲン化アルキル基を有することが好ましい。 Preferably, the silicone pressure-sensitive adhesive contains a cross-linking agent. Examples of the cross-linking agent include siloxane-based cross-linking agents and peroxide-based cross-linking agents. Any appropriate cross-linking agent can be used as the peroxide-based cross-linking agent. Peroxide cross-linking agents include, for example, benzoyl peroxide, t-butyl peroxybenzoate, dicumyl peroxide and the like. Examples of siloxane-based cross-linking agents include polyorganohydrogensiloxanes. The polyorganohydrogensiloxane preferably has two or more silicon-bonded hydrogen atoms. The polyorganohydrogensiloxane preferably has an alkyl group, a phenyl group, or a halogenated alkyl group as functional groups bonded to silicon atoms.
 シリコーン系粘着剤として、市販品を用いてもよい。市販品の具体例としては、ダウ・東レ社製:SDシリーズ、信越化学工業社製:KR-3700シリーズ、X-40シリーズ、KR-100シリーズが挙げられる。 A commercially available product may be used as the silicone adhesive. Specific examples of commercially available products include SD series manufactured by Dow Toray Industries, KR-3700 series, X-40 series and KR-100 series manufactured by Shin-Etsu Chemical Co., Ltd.
 シリコーン系粘着剤の固形分含有割合は、粘着剤層100重量部に対して、好ましくは50重量部以上であり、より好ましくは80重量部以上であり、さらに好ましくは90重量部以上である。 The solid content of the silicone adhesive is preferably 50 parts by weight or more, more preferably 80 parts by weight or more, and still more preferably 90 parts by weight or more, relative to 100 parts by weight of the adhesive layer.
D.基材
 上記基材は、任意の適切な樹脂から構成され得る。該樹脂としては、例えば、ポリエチレン系樹脂、ポリプロピレン系樹脂、ポリブテン系樹脂、ポリメチルペンテン系樹脂等のポリオレフィン系樹脂、ポリウレタン系樹脂、ポリエステル系樹脂、ポリイミド系樹脂、ポリエーテルケトン系樹脂、ポリスチレン系樹脂、ポリ塩化ビニル系樹脂、ポリ塩化ビニリデン系樹脂、フッ素系樹脂、シリコン系樹脂、セルロース系樹脂、アイオノマー樹脂等が挙げられる。
D. Substrate The substrate may be composed of any suitable resin. Examples of the resin include polyolefin-based resins such as polyethylene-based resins, polypropylene-based resins, polybutene-based resins, and polymethylpentene-based resins, polyurethane-based resins, polyester-based resins, polyimide-based resins, polyetherketone-based resins, and polystyrene-based resins. Resins, polyvinyl chloride resins, polyvinylidene chloride resins, fluorine resins, silicon resins, cellulose resins, ionomer resins, and the like can be mentioned.
 1つの実施形態においては、上記基材は、ポリエステル系樹脂および/またはポリイミド系樹脂から構成される。これらの樹脂から構成された基材は、波長248nmの光透過率が低く、レーザー光照射によりひずみが生じやすい点で有利である。 In one embodiment, the substrate is made of polyester resin and/or polyimide resin. Base materials made of these resins are advantageous in that they have low light transmittance at a wavelength of 248 nm and are easily distorted by laser light irradiation.
 上記基材の波長248nmの光透過率は、好ましくは60%以下であり、より好ましくは30%以下であり、さらに好ましくは15%以下であり、特に好ましくは10%以下である。このような範囲であれば、レーザー光照射によりひずみが生じやすい基材とすることができる。基材の波長248nmの光透過率の下限は、例えば、0.005%である。 The light transmittance of the base material at a wavelength of 248 nm is preferably 60% or less, more preferably 30% or less, even more preferably 15% or less, and particularly preferably 10% or less. Within such a range, the substrate can be easily distorted by laser light irradiation. The lower limit of the light transmittance of the substrate at a wavelength of 248 nm is, for example, 0.005%.
 上記基材の厚みは、好ましくは2μm~300μmであり、より好ましくは2μm~100μmであり、さらに好ましくは2μm~50μmである。1つの実施形態においては、上記基材の厚みは、50μm以下であり、より好ましくは30μm以下であり、さらに好ましくは20μm以下であり、特に好ましくは15μm以下であり、最も好ましくは10μm以下である。基材の厚みを薄くすることにより、基材に生じたひずみが転写層に伝搬しやすく、剥離性に優れる粘着シートを得ることができる。 The thickness of the base material is preferably 2 μm to 300 μm, more preferably 2 μm to 100 μm, still more preferably 2 μm to 50 μm. In one embodiment, the thickness of the substrate is 50 µm or less, more preferably 30 µm or less, still more preferably 20 µm or less, particularly preferably 15 µm or less, and most preferably 10 µm or less. . By reducing the thickness of the base material, the strain generated in the base material is easily propagated to the transfer layer, and a pressure-sensitive adhesive sheet having excellent peelability can be obtained.
 上記基材の23℃における押し込み弾性率は、好ましくは5000MPa以下であり、より好ましくは3000MPa以下であり、さらに好ましくは1000MPa以下である。このような範囲であれば、転写層にひずみを伝播しやすい基材とすることができる。基材の23℃における押し込み弾性率の下限は、好ましくは1MPaであり、より好ましくは5MPaであり、さらに好ましくは10MPaである。このような範囲であれば、適度な剛性を有し、ハンドリング性に優れる粘着シートを得ることができる。 The indentation elastic modulus of the base material at 23°C is preferably 5000 MPa or less, more preferably 3000 MPa or less, and still more preferably 1000 MPa or less. Within such a range, the base material can easily propagate strain to the transfer layer. The lower limit of the indentation modulus of the substrate at 23° C. is preferably 1 MPa, more preferably 5 MPa, and still more preferably 10 MPa. Within such a range, it is possible to obtain a pressure-sensitive adhesive sheet having appropriate rigidity and excellent handleability.
 基材の全光線透過率は、好ましくは70%以上であり、より好ましくは80%以上であり、さらに好ましくは90%以上であり、特に好ましくは95%以上である。基材の全光線透過率の上限は、例えば、98%(好ましくは99%)である。 The total light transmittance of the substrate is preferably 70% or higher, more preferably 80% or higher, even more preferably 90% or higher, and particularly preferably 95% or higher. The upper limit of the total light transmittance of the substrate is, for example, 98% (preferably 99%).
E.粘着シートの製造方法
 上記粘着シートは、任意の適切な方法により製造され得る。粘着シートは、例えば、基材またははく離ライナー上に、粘着剤層および転写層を形成する上記粘着剤をそれぞれ塗工して得られ得る。塗工方法としては、バーコーター塗工、エアナイフ塗工、グラビア塗工、グラビアリバース塗工、リバースロール塗工、リップ塗工、ダイ塗工、ディップ塗工、オフセット印刷、フレキソ印刷、スクリーン印刷など種々の方法を採用することができる。また、はく離ライナーに粘着剤層を形成し、別のはく離ライナーに転写層を形成し、これらを貼り合わせるか、あるいは、これらを基材に貼り合わせることにより、粘着シートを形成してもよい。
E. Production method of pressure-sensitive adhesive sheet The above-mentioned pressure-sensitive adhesive sheet can be produced by any appropriate method. The pressure-sensitive adhesive sheet can be obtained, for example, by applying the above-mentioned pressure-sensitive adhesives forming the pressure-sensitive adhesive layer and the transfer layer onto a base material or a release liner. Coating methods include bar coater coating, air knife coating, gravure coating, gravure reverse coating, reverse roll coating, lip coating, die coating, dip coating, offset printing, flexographic printing, screen printing, etc. Various methods can be employed. Alternatively, the pressure-sensitive adhesive sheet may be formed by forming a pressure-sensitive adhesive layer on a release liner, forming a transfer layer on another release liner, and bonding them together, or by bonding these to a substrate.
F.粘着シートの使用方法
 本発明の粘着シートは、任意の適切な被加工部材(例えば、電子部品)を加工および/または移送する際に、当該被加工部材を仮固定する際に用いられ得る。本発明の粘着シートの使用方法としては、例えば、(i)粘着剤層を支持体に貼着し、(ii)被着シートの転写層に被加工部材を貼着して固定し、(ii)該被加工部材を加工または移送し、(iii)粘着シートに活性エネルギー線(例えば、紫外線)を照射して、粘着シートの転写層側の粘着力を低下させ、(iv)剥離性発現を所望する箇所にレーザー光を照射して、粘着剤層にひずみを生じさせるようにして使用する方法が挙げられる。当該方法によれば、被加工部材を自然落下により剥離させることが可能となる。また、複数の被加工部材を仮固定した場合には、その一部のみを剥離させることも可能となる。本発明の粘着シートを用いれば、自然落下するほどまでに粘着力を低下させることができるため、非常に小さい(例えば、50μm角)被加工部材であっても、個々別々に剥離させることが可能である。部材としては、例えば、半導体ウエハ、光半導体素子、miniLED、microLED等が挙げられる。
F. Method of Using the Adhesive Sheet The adhesive sheet of the present invention can be used to temporarily fix any suitable work member (for example, an electronic component) during processing and/or transfer of the work member. As a method of using the pressure-sensitive adhesive sheet of the present invention, for example, (i) the pressure-sensitive adhesive layer is attached to the support, (ii) the member to be processed is attached and fixed to the transfer layer of the adherend sheet, and (ii) the adhesive layer is attached to the support. ) processing or transferring the member to be processed, (iii) irradiating the adhesive sheet with an active energy ray (e.g., ultraviolet rays) to reduce the adhesive strength of the adhesive sheet on the transfer layer side, and (iv) exhibiting peelability. A method of using the pressure-sensitive adhesive layer by irradiating a desired portion with a laser beam to cause strain in the pressure-sensitive adhesive layer is exemplified. According to this method, it is possible to separate the workpiece by natural fall. Moreover, when a plurality of workpieces are temporarily fixed, it is also possible to peel off only a part of them. By using the adhesive sheet of the present invention, the adhesive force can be reduced to the point that it naturally falls, so even very small (for example, 50 μm square) workpieces can be individually peeled off. is. Examples of the member include semiconductor wafers, optical semiconductor elements, miniLEDs, microLEDs, and the like.
 上記(i)における支持体としては、例えば、ガラス板が用いられる。支持体は光透過性であることが好ましい。支持体の全光線透過率は、例えば、50%以上であり、好ましくは80%以上である。 For example, a glass plate is used as the support in (i) above. Preferably, the support is light transmissive. The total light transmittance of the support is, for example, 50% or more, preferably 80% or more.
 1つの実施形態においては、上記(iii)における活性エネルギー線は、粘着シートの粘着剤層側(実質的には、支持体側)から照射される。 In one embodiment, the active energy ray in (iii) above is irradiated from the adhesive layer side (substantially, the support side) of the adhesive sheet.
 1つの実施形態においては、上記(iv)におけるレーザー光は、粘着シートの粘着剤層側(実質的には、支持体側)から照射される。 In one embodiment, the laser light in (iv) above is irradiated from the adhesive layer side (substantially, the support side) of the adhesive sheet.
 1つの実施形態においては、上記レーザー光の波長は、200nm~300nmである。 In one embodiment, the wavelength of the laser light is 200 nm to 300 nm.
 以下、実施例によって本発明を具体的に説明するが、本発明はこれら実施例によって限定されるものではない。実施例における試験および評価方法は以下のとおりである。また、特に明記しない限り、「部」および「%」は重量基準である。 The present invention will be specifically described below with reference to examples, but the present invention is not limited to these examples. Tests and evaluation methods in Examples are as follows. Also, "parts" and "%" are by weight unless otherwise specified.
(1)粘着剤層のガラスに対する粘着力I
 粘着シートの転写層側PETはく離ライナーを剥離し、厚み25μmのPET(東レ製ルミラーS10)を貼り合わせた。その後もう一方の面のPETはく離ライナーを剥離し、2kgのローラーを1往復によりガラス板(松浪硝子工業社製、商品名「S200423」)に貼り合わせ、JIS Z 0237:2000に準じた方法(剥離角度180°、剥離速度(引張速度)300mm/min、測定温度:23℃)で粘着力を測定した。
(1) Adhesive strength I of adhesive layer to glass
The PET release liner on the transfer layer side of the adhesive sheet was peeled off, and PET (Lumirror S10 manufactured by Toray Industries, Inc.) having a thickness of 25 μm was adhered. After that, the PET release liner on the other side is peeled off, and a 2 kg roller is reciprocated once to bond it to a glass plate (manufactured by Matsunami Glass Industry Co., Ltd., trade name "S200423"). The adhesive force was measured at an angle of 180°, a peeling speed (tensile speed) of 300 mm/min, and a measurement temperature of 23°C.
(2)転写層のステンレス板に対する粘着力
 粘着シートの粘着剤層側PETはく離ライナー(比較例4においては、転写層に貼着したPETはく離ライナー)を剥離し、厚み25μmのPET(東レ製ルミラーS10)を貼り合わせた。その後もう一方の面のPETはく離ライナーを剥離し、2kgのローラーを1往復によりSUS304に貼り合わせ、JIS Z 0237:2000に準じた方法(剥離角度180°、剥離速度(引張速度)300mm/min、測定温度:23℃)で粘着力を測定し初期粘着力Aとした。
 同様の方法で、SUS304に粘着シートを貼り合わせた後、粘着剤層側から紫外線照射装置(日東精機製、商品名「UM-810」)を用い、高圧水銀灯の紫外線(特定波長:365nm、積算光量:300mJ/cm)を全面に照射した後、同様に粘着力を測定し、硬化後粘着力Bとした。
(2) Adhesive strength of the transfer layer to the stainless steel plate The PET release liner on the adhesive layer side of the adhesive sheet (in Comparative Example 4, the PET release liner attached to the transfer layer) was peeled off, and PET (Lumirror manufactured by Toray) with a thickness of 25 µm was removed. S10) was pasted together. After that, the PET release liner on the other side was peeled off, and a 2-kg roller was reciprocated once to bond it to SUS304. Measurement temperature: 23°C), and the initial adhesive strength A was obtained.
In the same manner, after bonding the adhesive sheet to SUS304, from the adhesive layer side, using an ultraviolet irradiation device (manufactured by Nitto Seiki, trade name “UM-810”), ultraviolet light from a high-pressure mercury lamp (specific wavelength: 365 nm, cumulative After irradiating the entire surface with a light intensity of 300 mJ/cm 2 , the adhesive strength was measured in the same manner, and was defined as adhesive strength B after curing.
(3)押し込み弾性率(硬化前)
 粘着剤層および転写層の押し込み弾性率を、Hysitron社製トライポインデンターTI-950を用い、押し込み弾性率を測定した。測定は、23℃における単一押し込み法により、押し込み速度10nm/s、押し込み深さ100nmで行った。
(3) Indentation modulus (before curing)
The indentation elastic modulus of the pressure-sensitive adhesive layer and the transfer layer was measured using a tripoindenter TI-950 manufactured by Hysitron. The measurements were made by the single indentation method at 23° C. with an indentation speed of 10 nm/s and an indentation depth of 100 nm.
(4)押し込み弾性率(硬化後)
 粘着シートの粘着剤層側PETはく離ライナー(比較例4においては、転写層に貼着したPETはく離ライナー)を剥離し、大型スライドグラス(松浪硝子製、商品名「S9111」)にハンドローラーを用い貼り合わせた。得られたサンプルのスライドグラス面側から紫外線照射装置(日東精機製、商品名「UM-810」)を用い、高圧水銀灯の紫外線(特定波長:365nm、積算光量:300mJ/cm)を全面に照射した。その後、もう一方のPETはく離ライナーを剥離し転写層を露出させ、Hysitron社製トライポインデンターTI-950を用い、押し込み弾性率を測定した。測定は、23℃における単一押し込み法により、押し込み速度10nm/s、押し込み深さ100nmで行った。
(4) Indentation modulus (after curing)
The PET release liner on the adhesive layer side of the adhesive sheet (in Comparative Example 4, the PET release liner attached to the transfer layer) was peeled off, and a hand roller was used on a large slide glass (manufactured by Matsunami Glass, trade name "S9111"). pasted together. Using an ultraviolet irradiator (manufactured by Nitto Seiki, trade name “UM-810”) from the side of the slide glass of the obtained sample, the entire surface was exposed to ultraviolet light from a high-pressure mercury lamp (specific wavelength: 365 nm, integrated light amount: 300 mJ/cm 2 ). irradiated. Thereafter, the other PET release liner was peeled off to expose the transfer layer, and the indentation modulus was measured using a tripoindenter TI-950 manufactured by Hysitron. The measurements were made by the single indentation method at 23° C. with an indentation speed of 10 nm/s and an indentation depth of 100 nm.
(5)光透過率
 分光光度計(商品名「分光光度計 U-4100」、日立ハイテクサイエンス製)を使用して、粘着剤層および基材の248nmの光透過率を測定した。
(5) Light transmittance A spectrophotometer (trade name “Spectrophotometer U-4100” manufactured by Hitachi High-Tech Science) was used to measure the light transmittance of the pressure-sensitive adhesive layer and the substrate at 248 nm.
(6)剥離性(転写性)
 粘着シートの粘着剤層側PETセパレーター(比較例4においては、転写層に貼着したPETはく離ライナー)を剥離し、石英板(アズワン社製)にハンドローラーを用い貼り合わせた。その後、もう一方の面のPETはく離ライナーを剥離し、転写層の粘着面に、125μm×100μmのシリコンチップを貼り合わせた。
 石英板面側から紫外線照射装置(日東精機製、商品名「UM-810」)を用い、高圧水銀灯の紫外線(特定波長:365nm、積算光量:300mJ/cm)を全面に照射した。
 その後、波長248nmのレーザー光を、出力を変えながら、石英板側から狙いの部材位置にのみ照射し(1plus per chip;照射面積:130μm×105μm)、出力50mJ/cm以下で自然落下した場合を合格(〇)、出力50mJ/cm以下で自然落下しなった場合を不合格(×)とした。
(6) Peelability (transferability)
The PET separator on the adhesive layer side of the adhesive sheet (in Comparative Example 4, the PET release liner attached to the transfer layer) was peeled off, and attached to a quartz plate (manufactured by AS ONE) using a hand roller. After that, the PET release liner on the other side was peeled off, and a silicon chip of 125 μm×100 μm was attached to the adhesive side of the transfer layer.
From the quartz plate surface side, the entire surface was irradiated with ultraviolet light from a high-pressure mercury lamp (specified wavelength: 365 nm, integrated light amount: 300 mJ/cm 2 ) using an ultraviolet irradiation device (manufactured by Nitto Seiki, trade name “UM-810”).
After that, a laser beam with a wavelength of 248 nm is irradiated only to the target member position from the quartz plate side while changing the output (1 plus per chip; irradiation area: 130 μm × 105 μm). was evaluated as pass (◯), and the case where free fall occurred at an output of 50 mJ/cm 2 or less was evaluated as failure (x).
(7)変形有無
 上記(7)の評価において、自然落下した際のレーザー光出力(表中、「転写エネルギー」)にてレーザー光を照射した後の転写層表面の変形を観察した。レーザー照射箇所とそれ以外の箇所において顕著な色差が認められる場合を不合格(×)、そうでない場合を合格(○)とした。
(7) Presence or Absence of Deformation In the evaluation of (7) above, the deformation of the surface of the transfer layer was observed after irradiation with laser light at the laser light output (“transfer energy” in the table) during free fall. A case in which a significant color difference was observed between the laser-irradiated portion and the other portion was evaluated as unsatisfactory (×), and a case in which this was not observed was evaluated as acceptable (◯).
(8)糊残り
 上記「(1)粘着剤層のガラスに対する粘着力」の評価後のガラス板を目視で観察した。ガラスに粘着剤層が残る場合を不合格(×)、そうでない場合を合格(○)とした。
(8) Adhesive residue The glass plate was visually observed after the evaluation of "(1) Adhesive strength of adhesive layer to glass". When the adhesive layer remained on the glass, it was rejected (X), and when not, it was accepted (○).
[製造例1]アクリルポリマーIの調整
 2-エチルヘキシルアクリレート30重量部、ブチルアクリレート70重量部、アクリル酸3重量部、4-ヒドロキシブチルアクリレート1重量部を混合して、モノマー組成物を調製した。
 次いで、窒素導入管、温度計、攪拌機を備えた反応容器に窒素を導入し、窒素雰囲気下で、上記モノマー組成物103.1重量部、ベンゾイルパーオキサイド(BPO)0.2重量部、およびトルエン150重量部を仕込み、60℃で6時間攪拌し、アクリル系ポリマーIを含むアクリル系ポリマー溶液Iを得た。
[Production Example 1] Preparation of acrylic polymer I A monomer composition was prepared by mixing 30 parts by weight of 2-ethylhexyl acrylate, 70 parts by weight of butyl acrylate, 3 parts by weight of acrylic acid, and 1 part by weight of 4-hydroxybutyl acrylate.
Next, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer, and under a nitrogen atmosphere, 103.1 parts by weight of the above monomer composition, 0.2 parts by weight of benzoyl peroxide (BPO), and toluene were mixed. 150 parts by weight was charged and stirred at 60° C. for 6 hours to obtain acrylic polymer solution I containing acrylic polymer I.
[製造例2]アクリルポリマーIIの調整
 エチルアクリレート70重量部、2-ヒドロキシエチルアクリレート30重量部、メタクリル酸メチルアクリレート5重量部、ヒドロキシエチルアクリレート4重量部を混合して、モノマー組成物を調製した。
 次いで、窒素導入管、温度計、攪拌機を備えた反応容器に窒素を導入し、窒素雰囲気下で、トルエン295重量部、上記モノマー組成物109重量部、および、ベンゾイルパーオキサイド(BPO)0.2重量部を仕込み、60℃で4時間攪拌し、重量平均分子量50万のアクリル系ポリマーIIを含むアクリル系ポリマー溶液IIを得た。
[Production Example 2] Preparation of acrylic polymer II A monomer composition was prepared by mixing 70 parts by weight of ethyl acrylate, 30 parts by weight of 2-hydroxyethyl acrylate, 5 parts by weight of methyl methacrylate, and 4 parts by weight of hydroxyethyl acrylate. .
Next, nitrogen was introduced into a reaction vessel equipped with a nitrogen introduction tube, a thermometer, and a stirrer, and under a nitrogen atmosphere, 295 parts by weight of toluene, 109 parts by weight of the above monomer composition, and 0.2 parts of benzoyl peroxide (BPO) were added. Parts by weight were charged and stirred at 60° C. for 4 hours to obtain acrylic polymer solution II containing acrylic polymer II having a weight average molecular weight of 500,000.
[製造例3]アクリルポリマーIIIの調整
 2-エチルヘキシルアクリレート100重量部、アクリル酸2重量部、トリメチロールプロパントリアクリレート0.01重量を混合して、モノマー組成物を調製した。
 次いで、窒素導入管、温度計、攪拌機を備えた反応容器に窒素を導入し、窒素雰囲気下で、上記モノマー組成物102.01重量部、ベンゾイルパーオキサイド(BPO)0.2重量部、およびトルエン189重量部を仕込み、60℃で7時間攪拌し、アクリル系ポリマーIIIを含むアクリル系ポリマー溶液IIIを得た。
[Production Example 3] Preparation of acrylic polymer III A monomer composition was prepared by mixing 100 parts by weight of 2-ethylhexyl acrylate, 2 parts by weight of acrylic acid, and 0.01 part by weight of trimethylolpropane triacrylate.
Next, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer, and under a nitrogen atmosphere, 102.01 parts by weight of the above monomer composition, 0.2 parts by weight of benzoyl peroxide (BPO), and toluene were mixed. 189 parts by weight were charged and stirred at 60° C. for 7 hours to obtain acrylic polymer solution III containing acrylic polymer III.
[製造例4]アクリルポリマーIVの調整
 2-メトキシエチルアクリレート100重量部、アクリロイルモルホリン27重量部、アクリル酸2-ヒドロキシエチル22重量部を混合して、モノマー組成物を調製した。
 次いで、窒素導入管、温度計、攪拌機を備えた反応容器に窒素を導入し、窒素雰囲気下で、トルエン500重量部、上記モノマー組成物149量部、および、ベンゾイルパーオキサイド(BPO)0.3重量部を仕込み、60℃で5時間攪拌した。その後、室温まで冷却し、2-メタクリロイルオキシエチルイソシアネート24重量部を添加し反応させて、共重合体中のアクリル酸2-ヒドロキシエチルの側鎖末端OH基にNCO基を付加し、末端に炭素-炭素二重結合を有するアクリル系ポリマーIVを含有するアクリル系ポリマー溶液IVを得た。
[Production Example 4] Preparation of Acrylic Polymer IV 100 parts by weight of 2-methoxyethyl acrylate, 27 parts by weight of acryloylmorpholine and 22 parts by weight of 2-hydroxyethyl acrylate were mixed to prepare a monomer composition.
Next, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer, and under a nitrogen atmosphere, 500 parts by weight of toluene, 149 parts by weight of the above monomer composition, and 0.3 parts of benzoyl peroxide (BPO) were added. Parts by weight were charged and stirred at 60° C. for 5 hours. Then, it is cooled to room temperature, and 24 parts by weight of 2-methacryloyloxyethyl isocyanate is added and reacted to add an NCO group to the side chain terminal OH group of 2-hydroxyethyl acrylate in the copolymer, and carbon at the end. - An acrylic polymer solution IV containing an acrylic polymer IV having a carbon double bond was obtained.
[製造例5]アクリルポリマーVの調整
 ブチルアクリレート100重量部、エチルアクリレート78重量部、ヒドロキシエチルアクリレート40重量部を混合して、モノマー組成物を調製した。
 次いで、窒素導入管、温度計、攪拌機を備えた反応容器に窒素を導入し、窒素雰囲気下で、トルエン507重量部、上記モノマー組成物218重量部、および、ベンゾイルパーオキサイド(BPO)1.2重量部を仕込み、60℃で5時間攪拌した。その後、室温まで冷却し、2-メタクリロイルオキシエチルイソシアネート42.6重量部を添加し反応させて、共重合体中のアクリル酸2-ヒドロキシエチルの側鎖末端OH基にNCO基を付加し、末端に炭素-炭素二重結合を有するアクリル系ポリマーVを含有するアクリル系ポリマー溶液Vを得た。
[Production Example 5] Preparation of acrylic polymer V 100 parts by weight of butyl acrylate, 78 parts by weight of ethyl acrylate, and 40 parts by weight of hydroxyethyl acrylate were mixed to prepare a monomer composition.
Next, nitrogen was introduced into a reaction vessel equipped with a nitrogen inlet tube, a thermometer, and a stirrer, and under a nitrogen atmosphere, 507 parts by weight of toluene, 218 parts by weight of the above monomer composition, and 1.2 parts of benzoyl peroxide (BPO) were mixed. Parts by weight were charged and stirred at 60° C. for 5 hours. Then, it is cooled to room temperature, and 42.6 parts by weight of 2-methacryloyloxyethyl isocyanate is added and reacted to add an NCO group to the side chain terminal OH group of 2-hydroxyethyl acrylate in the copolymer, and An acrylic polymer solution V containing an acrylic polymer V having a carbon-carbon double bond was obtained.
[実施例1]
 PETはく離ライナー(商品名PET38X1―SS4A、ニッパ社製、厚さ:38μm)のフッ化シリコーン処理面に、シリコーン系ポリマー(ダウ・東レ社製、商品名「DOWSIL SD 4584 PSA」)100重量部および触媒(ダウ・東レ社製、商品名「DOWSIL SRX212」)0.9重量部の混合物Aを塗布し、その後、100℃で3分間加熱して、厚さ4μmの粘着剤層を形成した。
 アクリルポリマーIIIを100重量部含むアクリルポリマー溶液IIIに、架橋剤(東ソー社製、商品名「コロネートL」)5重量部、光重合開始剤(BASF社製、商品名「イルガキュア127」)10重量部を加え、転写層形成用の粘着剤(A)を得た。PETはく離ライナー(商品名HY-75Gt、東山フィルム社製、厚さ:75μm)のシリコーン処理面に、上記粘着剤(A)を塗布し、その後、120℃で2分間加熱して、厚さ5μmの転写層を形成した。
 PET基材(東レ社製、商品名「ルミラーS―10」、厚み:12μm)の一方の面に、PETはく離ライナー付の上記粘着剤層を貼り合わせ、他方の面にPETはく離ライナー付の上記転写層を貼り合わせて、PETはく離ライナー/粘着剤層/基材/転写層/PETはく離ライナーからなる粘着シートを得た。
 得られた粘着シートを上記評価に供した。結果を表1に示す。
[Example 1]
100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name "DOWSIL SD 4584 PSA") was applied to the surface of a PET release liner (PET38X1-SS4A, manufactured by Nippa Corporation, thickness: 38 μm) treated with silicone fluoride, and 0.9 parts by weight of mixture A of a catalyst (manufactured by Dow Toray Industries, trade name "DOWSIL SRX212") was applied and then heated at 100° C. for 3 minutes to form an adhesive layer with a thickness of 4 μm.
Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L"), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer. The pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 μm), and then heated at 120° C. for 2 minutes to give a thickness of 5 μm. to form a transfer layer.
On one side of a PET substrate (manufactured by Toray Industries, Inc., product name “Lumirror S-10”, thickness: 12 μm), the above adhesive layer with a PET release liner is attached, and the other side is the above with a PET release liner. The transfer layer was laminated to obtain an adhesive sheet consisting of PET release liner/adhesive layer/substrate/transfer layer/PET release liner.
The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[実施例2]
 上記混合物Aに、添加剤(ダウ・東レ社製、商品名「CP-96Black」)5重量部をさらに添加して転写層を形成したこと以外は、実施例1と同様にして粘着シートを得た。得られた粘着シートを上記評価に供した。結果を表1に示す。
[Example 2]
A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that 5 parts by weight of an additive (manufactured by Dow Toray Co., Ltd., trade name "CP-96 Black") was further added to the above mixture A to form a transfer layer. rice field. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[実施例3]
 上記混合物Aに、添加剤(BASF社製、商品名「Tinuvin477」)5重量部をさらに添加して転写層を形成したこと以外は、実施例1と同様にして粘着シートを得た。得られた粘着シートを上記評価に供した。結果を表1に示す。
[Example 3]
A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that 5 parts by weight of an additive (manufactured by BASF, trade name "Tinuvin 477") was further added to the mixture A to form a transfer layer. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[実施例4]
 上記混合物Aに、添加剤(BASF社製、商品名「TinuvinPS」)5重量部をさらに添加して転写層を形成したこと以外は、実施例1と同様にして粘着シートを得た。得られた粘着シートを上記評価に供した。結果を表1に示す。
[Example 4]
A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that 5 parts by weight of an additive (manufactured by BASF, trade name "TinuvinPS") was further added to the mixture A to form a transfer layer. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[実施例5]
 シリコーン系ポリマー(ダウ・東レ社製、商品名「DOWSIL SD 4584 PSA」)100重量部に代えて、シリコーン系ポリマー(ダウ・東レ社製、商品名「DOWSIL SD 4580 PSA」)100重量部を用いたこと以外は、実施例1と同様にして、粘着シートを得た。得られた粘着シートを上記評価に供した。結果を表1に示す。
[Example 5]
Instead of 100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name "DOWSIL SD 4584 PSA"), 100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name "DOWSIL SD 4580 PSA") is used. A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that the The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[実施例6]
 粘着剤層の厚みを12μmとしたこと以外は、実施例1と同様にして、粘着シートを得た。得られた粘着シートを上記評価に供した。結果を表1に示す。
[Example 6]
A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except that the thickness of the pressure-sensitive adhesive layer was 12 μm. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[実施例7]
 PET基材(東レ社製、商品名「ルミラーS―10」)に代えて、PET基材(東レ社製、商品名「ルミラー2DC61」、厚み:2μm)を用いたこと以外は、実施例1と同様にして、粘着シートを得た。得られた粘着シートを上記評価に供した。結果を表1に示す。
[Example 7]
Example 1 except that a PET base material (manufactured by Toray Industries, Inc., trade name "Lumirror 2DC61", thickness: 2 μm) was used instead of the PET base material (manufactured by Toray Industries, Inc., trade name "Lumirror S-10"). A pressure-sensitive adhesive sheet was obtained in the same manner as above. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[実施例8]
 PET基材(東レ社製、商品名「ルミラーS―10」)に代えて、ポリイミド基材(東レ・デュポン社製、商品名「カプトン50H」、厚み:12μm)を用いたこと以外は、実施例1と同様にして、粘着シートを得た。得られた粘着シートを上記評価に供した。結果を表1に示す。
[Example 8]
Instead of the PET base material (manufactured by Toray Industries, Inc., trade name "Lumirror S-10"), a polyimide base material (manufactured by Toray DuPont, trade name "Kapton 50H", thickness: 12 μm) was used. A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[実施例9]
 PETはく離ライナー(商品名PET38X1―SS4A、ニッパ社製、厚さ:38μm)のフッ化シリコーン処理面に、シリコーン系ポリマー(ダウ・東レ社製、商品名「DOWSIL SD 4584 PSA」)100重量部および触媒(ダウ・東レ社製、商品名「DOWSIL SRX212」)0.9重量部の混合物Aを塗布し、その後、100℃で3分間加熱して、厚さ4μmの粘着剤層を形成した。
 アクリルポリマーIVを100重量部含むアクリルポリマー溶液IVに、架橋剤(東ソー社製、商品名「コロネートL」)3重量部、光重合開始剤(BASF社製、商品名「イルガキュア127」)10重量部を加え、転写層形成用の粘着剤(B)を得た。PETはく離ライナー(商品名HY-75Gt、東山フィルム社製、厚さ:75μm)のシリコーン処理面に、上記粘着剤(B)を塗布し、その後、120℃で2分間加熱して、厚さ5μmの転写層を形成した。
 PET基材(東レ社製、商品名「ルミラーS―10」、厚み:12μm)の一方の面に、PETはく離ライナー付の上記粘着剤層を貼り合わせ、他方の面にPETはく離ライナー付の上記転写層を貼り合わせて、PETはく離ライナー/粘着剤層/基材/転写層/PETはく離ライナーからなる粘着シートを得た。
 得られた粘着シートを上記評価に供した。結果を表1に示す。
[Example 9]
100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name "DOWSIL SD 4584 PSA") was applied to the surface of a PET release liner (PET38X1-SS4A, manufactured by Nippa Corporation, thickness: 38 μm) treated with silicone fluoride, and 0.9 parts by weight of mixture A of a catalyst (manufactured by Dow Toray Industries, trade name "DOWSIL SRX212") was applied and then heated at 100° C. for 3 minutes to form an adhesive layer with a thickness of 4 μm.
Acrylic polymer solution IV containing 100 parts by weight of acrylic polymer IV, 3 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L"), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") parts were added to obtain a pressure-sensitive adhesive (B) for forming a transfer layer. The pressure-sensitive adhesive (B) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 μm), and then heated at 120° C. for 2 minutes to give a thickness of 5 μm. to form a transfer layer.
On one side of a PET substrate (manufactured by Toray Industries, Inc., trade name “Lumirror S-10”, thickness: 12 μm), the above adhesive layer with a PET release liner is attached, and on the other side, the above adhesive layer with a PET release liner is attached. The transfer layer was laminated to obtain an adhesive sheet consisting of PET release liner/adhesive layer/substrate/transfer layer/PET release liner.
The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[実施例10]
 シリコーン系ポリマー(ダウ・東レ社製、商品名「DOWSIL SD 4584 PSA」)100重量部に代えて、シリコーン系ポリマー(ダウ・東レ社製、商品名「DOWSIL LTC757 Coating」)100重量部を用いたこと以外は、実施例1と同様にして、粘着シートを得た。得られた粘着シートを上記評価に供した。結果を表1に示す。
[Example 10]
Instead of 100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name "DOWSIL SD 4584 PSA"), 100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name "DOWSIL LTC757 Coating") was used. A pressure-sensitive adhesive sheet was obtained in the same manner as in Example 1, except for the above. The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[比較例1]
 PETはく離ライナー(商品名MRF38、三菱樹脂社製、厚さ:38μm)のシリコーン処理面に、アクリルポリマーIを100重量部含むアクリルポリマー溶液Iと、架橋剤(東ソー社製、商品名「コロネートL」)2重量部と、添加剤(荒川化学工業社製、商品名「D-125」)30重量部の混合物Bを塗布し、その後、100℃で3分間加熱して、厚さ4μmの粘着剤層を形成した。
 アクリルポリマーIIIを100重量部含むアクリルポリマー溶液IIIに、架橋剤(東ソー社製、商品名「コロネートL」)5重量部、光重合開始剤(BASF社製、商品名「イルガキュア127」)10重量部を加え、転写層形成用の粘着剤(A)を得た。PETはく離ライナー(商品名HY-75Gt、東山フィルム社製、厚さ:75μm)のシリコーン処理面に、上記粘着剤(A)を塗布し、その後、120℃で2分間加熱して、厚さ5μmの転写層を形成した。
 PET基材(東レ社製、商品名「ルミラーS―10」、厚み:12μm)の一方の面に、PETはく離ライナー付の上記粘着剤層を貼り合わせ、他方の面にPETはく離ライナー付の上記転写層を貼り合わせて、PETはく離ライナー/粘着剤層/基材/転写層/PETはく離ライナーからなる粘着シートを得た。
 得られた粘着シートを上記評価に供した。結果を表1に示す。
[Comparative Example 1]
Acrylic polymer solution I containing 100 parts by weight of acrylic polymer I and a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L ”) and 30 parts by weight of an additive (manufactured by Arakawa Chemical Industries, Ltd., trade name “D-125”), a mixture B is applied, and then heated at 100 ° C. for 3 minutes to form an adhesive with a thickness of 4 μm. A layer was formed.
Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L"), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer. The pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 μm), and then heated at 120° C. for 2 minutes to give a thickness of 5 μm. to form a transfer layer.
On one side of a PET substrate (manufactured by Toray Industries, Inc., trade name “Lumirror S-10”, thickness: 12 μm), the above adhesive layer with a PET release liner is attached, and on the other side, the above adhesive layer with a PET release liner is attached. The transfer layer was laminated to obtain an adhesive sheet consisting of PET release liner/adhesive layer/substrate/transfer layer/PET release liner.
The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[比較例2]
 PETはく離ライナー(商品名MRF38、三菱樹脂社製、厚さ:38μm)のシリコーン処理面に、アクリルポリマーIIを100重量部含むアクリルポリマー溶液IIと、架橋剤(東ソー社製、商品名「コロネートL」)8.5重量部の混合物Cを塗布し、その後、100℃で3分間加熱して、厚さ4μmの粘着剤層を形成した。
 アクリルポリマーIIIを100重量部含むアクリルポリマー溶液IIIに、架橋剤(東ソー社製、商品名「コロネートL」)5重量部、光重合開始剤(BASF社製、商品名「イルガキュア127」)10重量部を加え、転写層形成用の粘着剤(A)を得た。PETはく離ライナー(商品名HY-75Gt、東山フィルム社製、厚さ:75μm)のシリコーン処理面に、上記粘着剤(A)を塗布し、その後、120℃で2分間加熱して、厚さ5μmの転写層を形成した。
 PET基材(東レ社製、商品名「ルミラーS―10」、厚み:12μm)の一方の面に、PETはく離ライナー付の上記粘着剤層を貼り合わせ、他方の面にPETはく離ライナー付の上記転写層を貼り合わせて、PETはく離ライナー/粘着剤層/基材/転写層/PETはく離ライナーからなる粘着シートを得た。
 得られた粘着シートを上記評価に供した。結果を表1に示す。
[Comparative Example 2]
Acrylic polymer solution II containing 100 parts by weight of acrylic polymer II and a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L ”) 8.5 parts by weight of mixture C was applied and then heated at 100° C. for 3 minutes to form an adhesive layer with a thickness of 4 μm.
Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L"), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer. The pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 μm), and then heated at 120° C. for 2 minutes to give a thickness of 5 μm. to form a transfer layer.
On one side of a PET substrate (manufactured by Toray Industries, Inc., product name “Lumirror S-10”, thickness: 12 μm), the above adhesive layer with a PET release liner is attached, and the other side is the above with a PET release liner. The transfer layer was laminated to obtain an adhesive sheet consisting of PET release liner/adhesive layer/substrate/transfer layer/PET release liner.
The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[比較例3]
 PETはく離ライナー(商品名MRF38、三菱樹脂社製、厚さ:38μm)のシリコーン処理面に、ポリエステル系ポリマー(三菱ケミカル社製、商品名「ニチゴーポリエスター NP110S50EO」Iを100重量部含むアクリルポリマー溶液Iと、架橋剤(東ソー社製、商品名「コロネートL」)2重量部と、添加剤(荒川化学工業社製、商品名「D-125」)30重量部の混合物Bを塗布し、その後、100℃で3分間加熱して、厚さ4μmの粘着剤層を形成した。
 アクリルポリマーIIIを100重量部含むアクリルポリマー溶液IIIに、架橋剤(東ソー社製、商品名「コロネートL」)5重量部、光重合開始剤(BASF社製、商品名「イルガキュア127」)10重量部を加え、転写層形成用の粘着剤(A)を得た。PETはく離ライナー(商品名HY-75Gt、東山フィルム社製、厚さ:75μm)のシリコーン処理面に、上記粘着剤(A)を塗布し、その後、120℃で2分間加熱して、厚さ5μmの転写層を形成した。
 PET基材(東レ社製、商品名「ルミラーS―10」、厚み:12μm)の一方の面に、PETはく離ライナー付の上記粘着剤層を貼り合わせ、他方の面にPETはく離ライナー付の上記転写層を貼り合わせて、PETはく離ライナー/粘着剤層/基材/転写層/PETはく離ライナーからなる粘着シートを得た。
 得られた粘着シートを上記評価に供した。結果を表1に示す。
[Comparative Example 3]
An acrylic polymer solution containing 100 parts by weight of a polyester polymer (manufactured by Mitsubishi Chemical Co., Ltd., trade name "Nichigo Polyester NP110S50EO" I) was applied to the silicone-treated surface of a PET release liner (trade name MRF38, manufactured by Mitsubishi Plastics Co., Ltd., thickness: 38 μm). I, 2 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, trade name "Coronate L"), and 30 parts by weight of an additive (manufactured by Arakawa Chemical Industries, Ltd., trade name "D-125"). , and 100° C. for 3 minutes to form a 4 μm-thick pressure-sensitive adhesive layer.
Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L"), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer. The pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 μm), and then heated at 120° C. for 2 minutes to give a thickness of 5 μm. to form a transfer layer.
On one side of a PET substrate (manufactured by Toray Industries, Inc., trade name “Lumirror S-10”, thickness: 12 μm), the above adhesive layer with a PET release liner is attached, and on the other side, the above adhesive layer with a PET release liner is attached. The transfer layer was laminated to obtain an adhesive sheet consisting of PET release liner/adhesive layer/substrate/transfer layer/PET release liner.
The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[比較例4]
 アクリルポリマーIIIを100重量部含むアクリルポリマー溶液IIIに、架橋剤(東ソー社製、商品名「コロネートL」)5重量部、光重合開始剤(BASF社製、商品名「イルガキュア127」)10重量部を加え、転写層形成用の粘着剤(A)を得た。PETはく離ライナー(商品名HY-75Gt、東山フィルム社製、厚さ:75μm)のシリコーン処理面に、上記粘着剤(A)を塗布し、その後、120℃で2分間加熱して、厚さ5μmの転写層を形成した。当該転写層に別のPETはく離ライナー(商品名MRF38、三菱樹脂社製、厚さ:38μm)のシリコーン処理面を積層し、PETはく離ライナー/転写層/PETはく離ライナーからなる粘着シートを得た。
 得られた粘着シートを上記評価に供した。結果を表1に示す。
[Comparative Example 4]
Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L"), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer. The pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 μm), and then heated at 120° C. for 2 minutes to give a thickness of 5 μm. to form a transfer layer. The silicone-treated surface of another PET release liner (trade name: MRF38, manufactured by Mitsubishi Plastics, Inc., thickness: 38 μm) was laminated on the transfer layer to obtain an adhesive sheet consisting of PET release liner/transfer layer/PET release liner.
The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
[比較例5]
 PETはく離ライナー(商品名PET38X1―SS4A、ニッパ社製、厚さ:38μm)のフッ化シリコーン処理面に、シリコーン系ポリマー(ダウ・東レ社製、商品名「DOWSIL SD 4584 PSA」)100重量部および触媒(ダウ・東レ社製、商品名「DOWSIL SRX212」)0.9重量部の混合物Aを塗布し、その後、100℃で3分間加熱して、厚さ4μmの粘着剤層を形成した。
 アクリルポリマーIIIを100重量部含むアクリルポリマー溶液IIIに、架橋剤(東ソー社製、商品名「コロネートL」)5重量部、光重合開始剤(BASF社製、商品名「イルガキュア127」)10重量部を加え、転写層形成用の粘着剤(A)を得た。PETはく離ライナー(商品名HY-75Gt、東山フィルム社製、厚さ:75μm)のシリコーン処理面に、上記粘着剤(A)を塗布し、その後、120℃で2分間加熱して、厚さ5μmの転写層を形成した。
 PETはく離ライナー付の上記粘着剤層と、PETはく離ライナー付の上記転写層とを貼り合わせて、PETはく離ライナー/粘着剤層/転写層/PETはく離ライナーからなる粘着シートを得た。
 得られた粘着シートを上記評価に供した。結果を表1に示す。
[Comparative Example 5]
100 parts by weight of a silicone polymer (manufactured by Dow Toray Industries, trade name "DOWSIL SD 4584 PSA") was applied to the surface of a PET release liner (PET38X1-SS4A, manufactured by Nippa Corporation, thickness: 38 μm) treated with silicone fluoride, and 0.9 parts by weight of mixture A of a catalyst (manufactured by Dow Toray Industries, trade name "DOWSIL SRX212") was applied and then heated at 100° C. for 3 minutes to form an adhesive layer with a thickness of 4 μm.
Acrylic polymer solution III containing 100 parts by weight of acrylic polymer III, 5 parts by weight of a cross-linking agent (manufactured by Tosoh Corporation, product name "Coronate L"), and 10 parts by weight of a photopolymerization initiator (manufactured by BASF, product name "Irgacure 127") were added to obtain a pressure-sensitive adhesive (A) for forming a transfer layer. The pressure-sensitive adhesive (A) is applied to the silicone-treated surface of a PET release liner (trade name HY-75Gt, manufactured by Higashiyama Film Co., Ltd., thickness: 75 μm), and then heated at 120° C. for 2 minutes to give a thickness of 5 μm. to form a transfer layer.
The pressure-sensitive adhesive layer with the PET release liner and the transfer layer with the PET release liner were laminated to obtain a pressure-sensitive adhesive sheet consisting of PET release liner/adhesive layer/transfer layer/PET release liner.
The obtained pressure-sensitive adhesive sheet was subjected to the above evaluation. Table 1 shows the results.
Figure JPOXMLDOC01-appb-T000001
Figure JPOXMLDOC01-appb-T000001
 表1から明らかなように、本発明によれば、低出力のレーザー光照射により、転写層上の部材を狭範囲で剥離することができる。シリコーン系粘着剤以外の粘着剤から構成された粘着剤層を備える粘着シート(比較例1~3)、粘着剤層を備えない粘着シート(比較例4)および基材を備えない粘着シート(比較例5)は、転写性が劣る結果となった。 As is clear from Table 1, according to the present invention, the member on the transfer layer can be peeled off in a narrow range by low-power laser light irradiation. Adhesive sheets with an adhesive layer composed of an adhesive other than a silicone-based adhesive (Comparative Examples 1 to 3), an adhesive sheet without an adhesive layer (Comparative Example 4), and an adhesive sheet without a substrate (Comparative Example 5) resulted in poor transferability.
 10       粘着剤層
 20       基材
 30       転写層
 100      粘着シート
REFERENCE SIGNS LIST 10 Adhesive layer 20 Base material 30 Transfer layer 100 Adhesive sheet

Claims (12)

  1.  粘着剤層と、基材と、転写層とをこの順に備え、
     該粘着剤層がシリコーン系粘着剤を含む、
     粘着シート。
    An adhesive layer, a base material, and a transfer layer are provided in this order,
    The pressure-sensitive adhesive layer contains a silicone-based pressure-sensitive adhesive,
    adhesive sheet.
  2.  前記粘着剤層の波長248nmの光透過率が、25%以上である、請求項1に記載の粘着シート。 The pressure-sensitive adhesive sheet according to claim 1, wherein the pressure-sensitive adhesive layer has a light transmittance of 25% or more at a wavelength of 248 nm.
  3.  前記基材の波長248nmの光透過率が、60%以下である、請求項1または2に記載の粘着シート。 The pressure-sensitive adhesive sheet according to claim 1 or 2, wherein the base material has a light transmittance of 60% or less at a wavelength of 248 nm.
  4.  前記基材が、ポリエステル系樹脂および/またはポリイミド系樹脂から構成される、請求項1または2に記載の粘着シート。 The pressure-sensitive adhesive sheet according to claim 1 or 2, wherein the base material is composed of a polyester-based resin and/or a polyimide-based resin.
  5.  前記基材の厚みが、50μm以下である、請求項1から4のいずれかに記載の粘着シート。 The pressure-sensitive adhesive sheet according to any one of claims 1 to 4, wherein the base material has a thickness of 50 µm or less.
  6.  前記転写層が、活性エネルギー線の照射により硬化する層である、請求項1から5のいずれかに記載の粘着シート。 The pressure-sensitive adhesive sheet according to any one of claims 1 to 5, wherein the transfer layer is a layer that is cured by irradiation with active energy rays.
  7.  前記転写層の厚みが、50μm以下である、請求項1から6のいずれかに記載の粘着シート。 The pressure-sensitive adhesive sheet according to any one of claims 1 to 6, wherein the transfer layer has a thickness of 50 µm or less.
  8.  前記粘着シートの前記粘着剤層をガラス板に貼着した際の23℃における粘着力Iが、2N/20mm以上である、請求項1から7のいずれかに記載の粘着シート。 The adhesive sheet according to any one of claims 1 to 7, wherein the adhesive force I at 23°C when the adhesive layer of the adhesive sheet is adhered to a glass plate is 2 N/20 mm or more.
  9.  前記粘着シートの該粘着剤層をガラス板に貼着した際の23℃における粘着力Iの、該転写層に300mJ/cmの紫外線を照射した後の23℃における粘着力Bに対する比が、5以上である、請求項1から8のいずれかに記載の粘着シート。 The ratio of the adhesive strength I at 23° C. when the adhesive layer of the adhesive sheet is attached to a glass plate to the adhesive strength B at 23° C. after irradiating the transfer layer with ultraviolet rays of 300 mJ/cm 2 is The pressure-sensitive adhesive sheet according to any one of claims 1 to 8, which is 5 or more.
  10.  300mJ/cmの紫外線を照射した後に、前記転写層の23℃における押し込み弾性率Bが、前記粘着剤層の23℃における押し込み弾性率Iの5倍以上となる、請求項1から9のいずれかに記載の粘着シート。 10. Any one of claims 1 to 9, wherein the indentation elastic modulus B of the transfer layer at 23° C. is five times or more the indentation elastic modulus I of the pressure-sensitive adhesive layer at 23° C. after irradiation with ultraviolet rays of 300 mJ/cm 2 . The adhesive sheet described in Crab.
  11.  前記粘着シートを用いて部材を支持体に仮固定し、移送および/または加工等の後に、レーザー光照射により該部材を支持体から剥離する用途に用いられる、請求項1から10のいずれかに記載の粘着シート。 11. Any one of claims 1 to 10, wherein the pressure-sensitive adhesive sheet is used for temporarily fixing a member to a support, and peeling the member from the support by laser light irradiation after transfer and/or processing. Adhesive sheet described.
  12.  前記部材が、半導体ウエハ、光半導体素子、miniLEDまたはmicroLEDである、請求項11に記載の粘着シート。 The pressure-sensitive adhesive sheet according to claim 11, wherein the member is a semiconductor wafer, optical semiconductor element, miniLED or microLED.
PCT/JP2022/025049 2021-12-03 2022-06-23 Adhesive sheet WO2023100401A1 (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001311057A (en) * 2000-04-28 2001-11-09 Bando Chem Ind Ltd Adhesive sheet
JP2015168711A (en) * 2014-03-05 2015-09-28 日東電工株式会社 Pressure sensitive adhesive sheet
KR20200060647A (en) * 2018-11-22 2020-06-01 (주)이녹스첨단소재 The double-faced adhesive tape for RDL forming process, Laminate containing the same, and Manufacturing process of Fan-out package
WO2021131517A1 (en) * 2019-12-27 2021-07-01 日東電工株式会社 Pressure-sensitive adhesive sheet
WO2021220662A1 (en) * 2020-05-01 2021-11-04 日東電工株式会社 Adhesive sheet

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001311057A (en) * 2000-04-28 2001-11-09 Bando Chem Ind Ltd Adhesive sheet
JP2015168711A (en) * 2014-03-05 2015-09-28 日東電工株式会社 Pressure sensitive adhesive sheet
KR20200060647A (en) * 2018-11-22 2020-06-01 (주)이녹스첨단소재 The double-faced adhesive tape for RDL forming process, Laminate containing the same, and Manufacturing process of Fan-out package
WO2021131517A1 (en) * 2019-12-27 2021-07-01 日東電工株式会社 Pressure-sensitive adhesive sheet
WO2021220662A1 (en) * 2020-05-01 2021-11-04 日東電工株式会社 Adhesive sheet

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