KR20230103888A - substrate for temperature measurement and die bonding device and temperature measuring method of the same - Google Patents

Abstract

A die bonding apparatus is disclosed. The die bonding apparatus includes a magazine in which substrates for bonding dies are loaded; a substrate stage for supporting a substrate; a substrate transfer module for transferring the substrate from a magazine in which the substrate is accommodated onto the substrate stage; a die bonding module for bonding a die on the substrate supported on the substrate stage; It is loaded in the magazine and includes a substrate for measuring temperature for measuring the temperature of the substrate stage; The substrate for temperature measurement may have the same size as the substrate and be transferred from the magazine to the substrate stage by the substrate transfer module.

Description

Substrate for temperature measurement and die bonding device and temperature measuring method of the same}

The present invention relates to a die bonding apparatus, and more particularly, to a die bonding apparatus that picks up a die from a wafer divided into a plurality of dies and bonds them on a substrate.

In general, semiconductor devices can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing processes, and the semiconductor devices formed as described above can be divided through a dicing process and a substrate through a die bonding process. can be bonded onto.

A die bonding device for performing the die bonding process is provided to pick up dies from a wafer divided into a plurality of dies and attach them to a printed circuit board. In this case, the bonding head may pick up individualized dies from the attach film and attach the dies on the printed circuit board by thermal compression bonding.

The substrate stage of the die bonding device includes a vacuum plate for supporting and fixing a printed circuit board by vacuum adsorption, and a heater provided under the vacuum plate to provide heat to heat the printed circuit board fixed to the vacuum plate.

Here, it is very important to uniformly heat the printed circuit board in the process of pressing the die on the printed circuit board in order to perform a stable die bonding process.

However, in order to measure the temperature distribution of the substrate stage in the die bonding apparatus, the operator directly checks a number of points using a temperature sensor (TC probe). Therefore, there are disadvantages in that measurement errors may occur due to differences in measurement points between operators, differences in contact surfaces, and the like, and work man-hours due to manual checks are high.

An object of the present invention is to provide a substrate and die bonding device for temperature measurement, and a temperature measurement method for easily measuring the temperature of a substrate stage.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the description below.

According to one aspect of the present invention, a magazine loaded with substrates for bonding dies; a substrate stage for supporting a substrate; a substrate transfer module for transferring the substrate from a magazine in which the substrate is accommodated onto the substrate stage; a die bonding module for bonding a die on the substrate supported on the substrate stage; It is loaded in the magazine and includes a substrate for measuring temperature for measuring the temperature of the substrate stage; It is intended to provide a die bonding device in which the substrate for temperature measurement has the same size as the substrate and is transferred from the magazine to the substrate stage by the substrate transfer module.

In addition, the substrate for measuring the temperature may include a printed circuit board; temperature sensors that divide the upper surface of the printed circuit board into a plurality of regions and are disposed in the divided regions; a wireless communication unit transmitting measurement values of the temperature sensors; A battery unit supplying power to the sensor unit and the wireless communication unit, and the die bonding apparatus may further include a control unit receiving a measurement value from the substrate for temperature measurement and controlling a temperature of each region of the substrate stage. .

In addition, the substrate for measuring the temperature may further include a humidity sensor and a leveling sensor installed on the printed circuit board.

In addition, the substrate stage may include a preheating area and a main heating area, and the substrate for temperature measurement may simultaneously measure the temperature of the preheating area and the main heating area.

According to another aspect of the present invention, (a) a substrate for temperature measurement is stored in a magazine in which substrates for bonding dies are loaded, and (b) a handler of the die bonder device removes the substrate for temperature measurement from the magazine. It is intended to provide a method for measuring the temperature of a die bonder device that simultaneously measures the temperature of each region of a substrate stage while handling.

Also, (c) in the step (b), the temperature measurement value for each region of the substrate stage is provided to the controller through wireless communication, and the controller may control the temperature for each region of the substrate stage.

Also, (d) the substrate for temperature measurement used to measure the temperature of the substrate stage may be loaded into the magazine by the handler.

In addition, the substrate for measuring the temperature may have temperature sensors mounted on a rectangular printed circuit board.

According to one embodiment of the present invention, the reliability of measuring the temperature of the substrate stage can be increased.

The effects of the present invention are not limited to the above-mentioned effects, and effects not mentioned will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

1 is a schematic plan view for explaining a die bonding apparatus according to an embodiment of the present invention.
2 is a schematic side view for explaining the die transfer module shown in FIG. 1;
FIG. 3 is a schematic side view for explaining the substrate transfer module shown in FIG. 1 .
FIG. 4 is a view for explaining the substrate for temperature measurement shown in FIG. 3 .
5 and 6 are diagrams for explaining that the substrate for temperature measurement is moved to the substrate stage.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. In addition, in describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and actions.

'Including' a certain component means that other components may be further included, rather than excluding other components unless otherwise stated. Specifically, terms such as "comprise" or "having" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features or It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Singular expressions include plural expressions unless the context clearly dictates otherwise. In addition, shapes and sizes of elements in the drawings may be exaggerated for clearer description.

Terms such as first and second may be used to describe various components, but the components should not be limited by the terms. The terms may be used for the purpose of distinguishing one component from another. For example, a first element may be termed a second element, and similarly, the second element may also be termed a first element, without departing from the scope of the present invention.

It is understood that when an element is referred to as being "connected" or "connected" to another element, it may be directly connected or connected to the other element, but other elements may exist in the middle. It should be. On the other hand, when a component is referred to as “directly connected” or “directly connected” to another component, it should be understood that no other component exists in the middle. Other expressions describing the relationship between components, such as "between" and "directly between" or "adjacent to" and "directly adjacent to", etc., should be interpreted similarly.

Unless defined otherwise, all terms used herein, including technical or scientific terms, have the same meaning as commonly understood by one of ordinary skill in the art to which the present invention belongs. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with the meaning in the context of the related art, and unless explicitly defined in this application, they are not interpreted in an ideal or excessively formal meaning. .

The above detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and describe preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed in this specification, within the scope equivalent to the written disclosure and / or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in the specific application field and use of the present invention are also possible. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to cover other embodiments as well.

1 is a schematic plan view for explaining a die bonding apparatus according to an embodiment of the present invention, FIG. 2 is a schematic side view for explaining a die transfer module shown in FIG. 1, and FIG. 3 is shown in FIG. It is a schematic side view for explaining the substrate transfer module.

1 to 3 , a die bonding apparatus 10 according to an embodiment of the present invention bonds individualized dies 22 to a lead frame, a printed circuit board, It can be used for bonding on a substrate 30 such as the like.

The die bonding device 10 includes a die transfer module 100 for picking up and transferring the die 22 from the wafer 20 including the dies 22, and transferring the die 22 to the substrate 30. A die bonding module 200 for bonding on the substrate stage 300 for supporting the substrate 30, a substrate transfer module 400 for transferring the substrate 30 onto the substrate stage 300 And it may include a substrate for temperature measurement (900; see FIG. 3) for measuring the temperature of the substrate stage 300.

The wafer 20 may include a dicing tape 24 to which the dies 22 are attached, and a substantially circular ring-shaped mount frame 26 to which the dicing tape 24 is mounted. The dicing tape 24 may be attached to a lower surface of the mount frame 26 and the dies 22 may be attached to an upper surface of the dicing tape 24 .

The die transfer module 100 may include a wafer stage 110 for supporting the wafer 20 . On the wafer stage 110, a support ring 112 for supporting the dicing tape 24, a clamp 114 for holding the mount frame 26, and the clamp 114 are placed in a vertical direction. A clamp driver (not shown) for moving may be disposed. Specifically, as shown, the support ring 112 may support the dicing tape 24 between the dies 22 and the mount frame 26, and the clamp driver may support the clamp 114 ), the dicing tape 24 can be expanded.

A die ejector 120 may be disposed under the dicing tape 24 supported by the support ring 112 to separate the dies 22 from the dicing tape 24 . Although not shown in detail, as an example, the die ejector 120 may vacuum the lower surface of the dicing tape 24 and raise the die 22 to be transferred among the dies 22. Ejector pins (not shown) separating the die 22 from the dicing tape 24 may be included.

The die transfer module 100 includes a picker 130 disposed above the wafer stage 110 to pick up the die 22 separated from the dicing tape 24 by the die ejector 120 and , a picker driving unit 132 for moving the picker 130 in vertical and horizontal directions. The picker 130 may pick up the die 22 using vacuum pressure, and a die stage on which the die 22 transferred by the picker 130 is placed on one side of the wafer stage 110 ( 140) may be placed. In addition, a camera unit 150 for detecting a die 22 to be picked up may be disposed above the wafer stage 110 .

Although not shown, the die bonding apparatus 10 may include a stage driver (not shown) for horizontally moving the wafer stage 110 . The stage driver may adjust the position of the wafer stage 110 so that the die 22 to be picked up is positioned on the die ejector 120 .

The die bonding apparatus 10 includes a cassette load port 42 in which a cassette 40 for receiving the wafer 20 is placed, and the wafer 20 is transferred from the cassette 40 to the wafer stage 110. It may include a wafer transfer unit 44 for transferring the wafer 20 upwards, and guide rails 46 for guiding the transfer of the wafer 20 . Specifically, the stage driver may move the wafer stage 110 to be adjacent to ends of the guide rails 46, and the wafer transfer unit 44 may move the wafer 20 stored in the cassette 40. After gripping one side of ), the wafer 20 may be moved onto the wafer stage 110 . As an example, although not shown, the wafer transfer unit 44 may include a gripper for gripping the mount frame 26 and a gripper driving unit for horizontally moving the gripper.

The die bonding module 200 may pick up the die 22 transferred onto the die stage 140 and bond it to the substrate 30 positioned on the substrate stage 300 . As an example, the die bonding module 200 includes a bonding head 210 for picking up the die 22 and a head driving unit 220 for moving the bonding head 210 in vertical and horizontal directions. can include Although not shown, the bonding head 210 may include a bonding tool for picking up the die 22 using vacuum pressure and pressing the die 22 onto the substrate 30 .

The substrate 30 may be supplied from the first magazine 50 and may be stored in the second magazine 60 after the die bonding process is completed. As an example, the die bonding apparatus 10 includes a first magazine handling unit 52 for handling the first magazine 50 and a second magazine handling unit for handling the second magazine 60 ( 62) may be included. The substrate 30 may be a rectangular printed circuit board having a length and a width.

The substrate 30 may be accommodated in the first magazine 50 in multiple stages. The substrate stored in the first magazine 50 may be moved onto the transfer rail 410 by the pusher 460 .

In addition, the die bonding device 10 includes a first magazine load port 54 on which the first magazine 50 is placed, a second magazine load port 64 on which the second magazine 60 is placed, A first magazine transfer unit (56) for transferring the first magazine (50) between the first magazine load port (54) and the first magazine handling unit (52), and the second magazine load port (64) and a second magazine transfer unit 66 for transferring the second magazine 60 between the second magazine handling unit 62 .

Although not shown, the substrate transfer module 400 includes a first substrate transfer unit 482 (substrate handler) for transferring the substrate 30 from the first magazine 50 onto the substrate stage 300 and the die bonding. After the process is completed, a second substrate transfer unit 484 (substrate handler) for transferring the substrate 30 to the second magazine 60 may be included. Each of the first and second substrate transfer units may include grippers that hold the substrate and a driving unit that moves the grippers. Configurations of these components are well known in die bonding apparatuses, and detailed descriptions thereof will be omitted.

Meanwhile, although not shown, the first magazine 50 and the second magazine 60 may have slots formed in a horizontal direction to accommodate the substrate 30 .

According to one embodiment of the present invention, the substrate transfer module 400 extends in a first horizontal direction, for example, an X-axis direction, and transfer rails for moving the substrate 30 in the first horizontal direction ( 410) may be included. The transfer rail 410 may be used to move the substrate 30 from the first magazine 50 onto the substrate stage 300 . That is, the first magazine 50 may be disposed on one side of the transfer rail 410 and the substrate stage 300 may be disposed on the other side of the transfer rail 410 .

The substrate stage 300 may support a substrate 30 for die bonding. The substrate stage 300 may be provided to heat the substrate. The substrate stage 300 may have a plurality of heating zones. For example, the substrate stage 300 may include a pre-heating area 310 and a main heating area 320 . The pre-heating area 310 and the main heating area 320 may be disposed in the direction of transport of the substrate. Vacuum holes 328 for vacuum adsorbing the substrate are provided in the main heating area 320 . The substrate 30 is vacuum-adsorbed only in a section located on the main heating area 320 .

The substrate 30 may be transferred from the transfer rail 410 to the preheating area 310 in the first substrate transfer unit, and the substrate stage 300 may transfer the substrate 30 onto the preheating area 310. ) may include a first heater 312 to heat to a preset preheating temperature. The substrate 30 preheated in the pre-heating area 310 may be moved to the main heating area 320 by the first substrate transfer unit, and the substrate 30 may be bonded by the second heater 322 can be heated to temperature.

The substrate 900 for temperature measurement has the same material and the same size as the substrate. The substrate 900 for temperature measurement may stand by while stored in the first magazine 50 . When checking the temperature of the substrate stage 3000, the substrate 900 for temperature measurement can be taken out of the first magazine 50 by the first substrate transfer unit and transferred onto the substrate stage 300. The temperature measurement of the substrate stage using 900 can be performed even while the bonding process is in progress, and can be performed periodically for stable process progress.

4 is a view for explaining the substrate for temperature measurement shown in FIG. 3, and FIGS. 5 and 6 are views for explaining that the substrate for temperature measurement is moved to the substrate stage.

4 to 6 , the substrate 900 for measuring temperature may include a printed circuit board 910, temperature sensors 920, a wireless communication unit 930, and a battery unit 940.

The printed circuit board 910 may be divided into a plurality of areas. For example, the printed circuit board 910 may include temperature measurement regions 902 and 904 corresponding to the preheating region 310 and the main heating region 320 of the substrate stage 300 . For example, the printed circuit board 910 may include a first temperature measurement region 902 and a second temperature measurement region 904 . The temperature sensors 920 may be evenly disposed in the first temperature measurement region 902 and the second temperature measurement region 904 . The wireless communication unit 930 may wirelessly transmit measurement values of the temperature sensors 920 and provide the measured values to the controller 800 . The battery unit 940 may supply power to the temperature sensors 920 and the wireless communication unit 930 .

The control unit 800 may receive a measured value from the substrate 900 for temperature measurement and control the temperature of each region of the substrate stage 300 . As described above, the die bonding apparatus of the present invention can receive the temperature of each region of the substrate stage in real time, so the work speed is fast, and temperature-based offset turning automation can be performed in conjunction with the die bonding apparatus.

Although not shown, in the substrate 900 for temperature measurement, a humidity sensor and a leveling sensor may be additionally installed on the printed circuit board 910 . The control unit 800 can simultaneously check the state of the facility by receiving the measured values of humidity and leveling from the substrate 900 for temperature measurement.

A temperature measurement method in the die bonding apparatus having the above structure is as follows.

Referring to FIGS. 1 to 6 , a substrate 900 for temperature measurement is stored in a first magazine 50 on which substrates 30 for bonding dies are loaded. The first substrate transfer unit 482 (see FIG. 1 ) of the die bonder apparatus moves the substrate 900 for temperature measurement from the first magazine 50 onto the substrate stage 300 while handling it. The substrate 900 for temperature measurement moved onto the substrate stage 300 simultaneously measures the temperature of each region of the substrate stage 300 . Temperature measurement values for each region of the substrate stage 300 are provided to the controller 800 through wireless communication. The controller 800 controls a corresponding heater when the temperature of each region of the substrate stage 300 is non-uniform. After the temperature measurement of the substrate stage 300 is completed, the substrate 900 for temperature measurement is returned to the first magazine 50 by the first substrate transfer unit and stored therein.

In the foregoing embodiments, the method is described on the basis of a flow chart as a series of steps or blocks, but the present invention is not limited to the order of steps, and some steps may occur in a different order or concurrently with other steps as described above. there is. Further, those skilled in the art will understand that the steps shown in the flowcharts are not exclusive, and that other steps may be included or one or more steps of the flowcharts may be deleted without affecting the scope of the present invention.

It should be understood that the above embodiments are presented to aid understanding of the present invention, do not limit the scope of the present invention, and various deformable embodiments also fall within the scope of the present invention. The scope of technical protection of the present invention should be determined by the technical spirit of the claims, and the scope of technical protection of the present invention is not limited to the literal description of the claims themselves, but is substantially equal to the scope of technical value. It should be understood that it extends to the invention of.

10: die bonding device 20: wafer
22: die 24: dicing tape
26: mount frame 30: substrate
40: cassette 50: first magazine
60: second magazine 100: die transfer module
110: wafer stage 200: die bonding module
400: substrate transfer module 410: transfer rail
900: substrate for temperature measurement

Claims (9)

a magazine in which substrates for bonding dies are loaded;
a substrate stage for supporting a substrate;
a substrate transfer module for transferring the substrate from a magazine in which the substrate is accommodated onto the substrate stage;
a die bonding module for bonding a die on the substrate supported on the substrate stage;
It is loaded in the magazine and includes a substrate for measuring temperature for measuring the temperature of the substrate stage;
The substrate for temperature measurement has the same size as the substrate and is transferred from the magazine to the substrate stage by the substrate transfer module. According to claim 1,
The substrate for temperature measurement is
printed circuit board;
temperature sensors that divide the upper surface of the printed circuit board into a plurality of regions and are disposed in the divided regions;
a wireless communication unit transmitting measurement values of the temperature sensors;
A battery unit for supplying power to the sensor unit and the wireless communication unit;
The die bonding device
The die bonding apparatus further includes a control unit receiving a measurement value from the substrate for temperature measurement and controlling the temperature of each region of the substrate stage. According to claim 2,
The substrate for temperature measurement is
A die bonding device further comprising a humidity sensor and a leveling sensor installed on the printed circuit board. According to claim 2,
The substrate stage
Including a pre-heating area and a main heating area,
The substrate for temperature measurement is
A die bonding device for simultaneously measuring temperatures of the pre-heating region and the main heating region. In the temperature measurement method of the die bonder device:
(a) storing substrates for temperature measurement in a magazine loaded with substrates for bonding dies;
(b) The temperature measurement method of the die bonder device, wherein the handler of the die bonder device simultaneously measures the temperature of each region of the substrate stage while handling the substrate for temperature measurement from the magazine. According to claim 5,
(c) In step (b), the temperature measurement value for each region of the substrate stage is provided to a controller through wireless communication, and the controller controls the temperature for each region of the substrate stage. Method for measuring temperature. According to claim 5,
(d) the temperature measuring substrate used to measure the temperature of the substrate stage is loaded into the magazine by the handler. According to claim 5,
The temperature measuring substrate is a temperature measuring method of a die bonder device in which temperature sensors are mounted on a rectangular printed circuit board. a rectangular printed circuit board;
temperature sensors that divide the upper surface of the printed circuit board into a plurality of regions and are disposed in the divided regions;
a wireless communication unit transmitting measurement values of the temperature sensors;
Including a battery unit for supplying power to the sensor unit and the wireless communication unit;
The printed circuit board is a substrate for temperature measurement made of the same size and material as a substrate to which a die is bonded in a die bonding device.

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