KR20230097145A - Mounted board inspection device and inspection device - Google Patents

Abstract

This mounting board inspection apparatus 100 includes a concentric circle lighting unit 32 for irradiating an inspection object with concentric circular lights of RGB in which red (R), green (G), and blue (B) are concentrically arranged, and concentric RGB concentric circles. Acquisition of the inclination angle of the inspection subject based on the imaging result of the imaging unit 31 of the inspection subject P1 irradiated with original light, and control of inspecting the state of the inspection subject based on the acquired inclination angle of the inspection subject and a control unit 40 that performs

Description

Mounted board inspection device and inspection device

The present invention relates to a mounting board inspection device and inspection device, and more particularly to a mounting board inspection device and inspection device having an imaging unit for capturing an image of an object to be inspected.

BACKGROUND OF THE INVENTION [0002] Conventionally, an inspection apparatus having an imaging unit that captures an image of an inspection target is known. Such an apparatus is disclosed in Japanese Patent No. 5866573, for example.

Japanese Patent No. 5866573 discloses an inspection system (inspection device) including an inspection lighting device for irradiating inspection light onto an inspection subject and an imaging device for capturing an image of the inspection subject. This inspection system is configured to obtain an inclination angle of an inspection target by using a relation between an irradiation solid angle of inspection light formed by an inspection lighting device and an observation solid angle formed by an imaging device. Specifically, this inspection system is configured to acquire the inclination angle of the inspection subject by utilizing the fact that the irradiation solid angle included in the observation solid angle changes according to the inclination angle of the inspection object and the amount of light in the observation solid angle changes. That is, this inspection system is configured to acquire the inclination angle of the inspection target based on the contrast information.

Japanese Patent No. 5866573

However, in the inspection system described in Patent No. 5866573, since the inclination angle of the inspection target is acquired based on the contrast information, when the reflectance of the inspection target changes and the light amount changes, the change in light amount due to the change in the reflectance of the inspection target There is a nonconformity in that is erroneously acquired as a change in inclination angle. In this case, since the angle of inclination of the object to be inspected cannot be obtained with high accuracy, there is a problem that the inspection of the state of the object of inspection based on the angle of inclination cannot be performed with high accuracy.

This invention was made in order to solve the above problems, and one object of this invention is to provide a mounted board inspection device and inspection device capable of accurately inspecting the state of an inspection target based on an inclination angle.

A mounting board inspection apparatus according to a first aspect of the present invention comprises an imaging unit for capturing an image of an inspection target including a mounting board on which components are mounted, and red (R), green (G), and blue (B) are concentrically formed. Acquisition of the inclination angle of the inspection subject based on the imaging result by the concentric lighting unit for irradiating the inspection subject with the arranged RGB concentric circular light and the imaging unit for the inspection subject irradiating the RGB concentric circular light, and the acquired inclination of the inspection subject A control unit for performing control to inspect the state of the inspection target based on the angle is provided. Also, RGB is a combination of the two letters "Red", "Green", and "Blue".

In the mounting board inspection device according to the first aspect of the present invention, an imaging unit for capturing an image of an inspection target including a mounting board on which components are mounted as described above, and red (R), green (G), and blue (B) Acquisition of the inclination angle of the inspection subject based on the imaging result by the concentric lighting unit for irradiating the inspection subject with concentric circular light of RGB arranged in a concentric circle, and the imaging unit of the inspection subject irradiating the concentric circular light of RGB, and the acquired inspection A control unit that performs control of inspecting the state of an object to be inspected based on the inclination angle of the object is provided. This makes it possible to acquire the inclination angle of the inspection subject by utilizing the fact that the brightness of each color of RGB in the image pickup result changes depending on the inclination angle of the inspection subject. Here, when the reflectance of the inspection target is changed, the brightness (brightness) of each color of RGB is changed, but the state of change (circumstance) of brightness of each color of RGB is maintained without change. For this reason, by acquiring the inclination angle of the inspection subject by utilizing the fact that the brightness of each color of RGB in the image pickup result changes according to the inclination angle of the inspection subject, the inclination angle of the inspection subject is acquired based on the contrast information of the single color. Unlike the case, the inclination angle of the inspection target can be acquired with high precision regardless of the change in the reflectance of the inspection target. As a result, the inspection of the state of the inspection target based on the inclination angle can be performed with high precision.

In the mounting substrate inspection device according to the first aspect, preferably, the control unit is configured to obtain an inclination angle of the inspection target based on an RGB ratio, which is a ratio of red, green, and blue of the inspection target in the image pickup result. there is. With this configuration, the inclination angle of the inspection object can be acquired with higher precision based on the RGB ratio regardless of the change in the reflectance of the inspection object, so that the inspection of the state of the inspection object based on the inclination angle can be performed with more precision. .

In this case, the control unit is preferably configured to acquire the inclination angle of the inspection subject based on the RGB ratio of the inspection subject and conversion information for converting the previously obtained RGB ratio into an inclination angle. With this configuration, the inclination angle of the inspection object can be easily and reliably obtained simply by converting the RGB ratio of the inspection object into an inclination angle using the conversion information for converting the RGB ratio into an inclination angle.

In the mounted board inspection device according to the first aspect, preferably, the concentric light source includes a red light source, a green light source, and a blue light source concentrically arranged, or a white light source and a white light source are disposed at a position opposite to each other Contains RGB concentric circle color filters. In this configuration, when the concentric lighting unit includes the red light source, the green light source, and the blue light source concentrically arranged, RGB concentric light sources in which red, green, and blue are concentrically arranged can be easily obtained. In addition, in the case of including a white light source and concentric RGB color filters disposed opposite to the white light source, unlike the case where the light sources for each color of RGB are separately formed, the light sources are divided to suppress color mixing. Since there is no need for a structure to do so, the structure of the concentric lighting unit can be simplified.

In the mounted board inspection apparatus according to the first aspect, preferably, the concentric circle lighting unit emits RGB concentric circle lights including one color each and the outermost part of the concentric circles with the same color as the center color of the concentric circles. Consists of. In this configuration, the RGB concentric circle light includes the same color as the center of the concentric circle among RGB at the outermost part of the concentric circle, so that it is at the end of the inspection target's tilt angle measurement range (ie, when the inspection target's tilt angle is large). In this case, the inclination angle of the inspection target can be acquired with high accuracy based on the change in brightness of a plurality of colors.

In the mounting substrate inspection device according to the first aspect, the control unit is preferably configured to perform control for detecting a change point of the inclination angle as a crack based on the inclination angle of the object to be inspected. With this configuration, since the inclination angle is usually different on both sides of the crack when a crack occurs, the crack to be inspected can be detected with high accuracy by using the fact that the change point of the inclination angle corresponds to the crack. Here, there is a method of detecting the dark portion of an image as a crack, but when detecting the dark portion of an image as a crack, if the width of the crack is narrow (for example, less than 1 pixel), the crack cannot be recognized in the image. may not be detectable. On the other hand, since the change point of the inclination angle is detected as a crack in this configuration, unlike the case of detecting the dark part of the image as a crack, the width of the crack is narrow and the crack is detected with high precision even when the crack cannot be recognized as a dark part in the image. can do.

In this case, the component preferably includes a semiconductor wafer chip, and the control unit is configured to perform control for detecting cracks in the semiconductor wafer chip based on the inclination angle of the object to be inspected. With this configuration, it is possible to detect cracks with high accuracy in semiconductor wafer chips prone to cracks.

In the mounting board inspection apparatus according to the first aspect, the control unit is preferably configured to perform control for detecting a component on the mounting board based on an inclination angle of the inspection target. With this configuration, it is possible to accurately detect a component on the mounting board based on the acquired inclination angle of the inspection target with high accuracy.

[0025] In the mounting substrate inspection apparatus according to the first aspect, preferably, a three-dimensional measuring unit capable of measuring height information of the inspection target is further provided, and the control unit irradiates RGB concentric circular light to obtain an image pickup result by the imaging unit of the inspection target. It is comprised so that control which inspects the state of an inspection subject is performed based on the inclination angle of an inspection subject based on it, and the height information of the inspection subject by the 3-dimensional measuring unit. With this configuration, the state of the inspection target can be measured more precisely based on the height information of the inspection target by the 3D measurement unit as well as the inclination angle of the inspection target based on the image pickup result by the imaging unit of the inspection target irradiated with RGB concentric circular light. can be checked well.

In the mounted board inspection device according to the first aspect, preferably, the imaging unit has an imaging lens, and the concentric lighting unit irradiates RGB concentric circular light to the inspection target using the imaging lens. With this configuration, the concentric circular light of RGB can be irradiated to the inspection target by effectively using the existing lens for imaging, so that there is no need to separately and independently install a lens for illumination in the concentric lighting unit. As a result, while being able to achieve simplification of the structure of an imaging part and a concentric lighting part, space saving of arrangement|positioning of an imaging part and a concentric lighting part can be aimed at.

In this case, preferably, the imaging lens is an objective lens disposed at a position closest to the inspection target side in the imaging section. With this configuration, it is possible to irradiate RGB concentric circular light to the inspection target by effectively using the imaging lens as the objective lens.

In the mounting substrate inspection apparatus according to the first aspect, the control unit preferably controls the color of the inspection target obtained from the imaging result of the inspection subject by the imaging unit irradiated with RGB concentric circular light and the imaging result of the inspection subject by irradiation with white light. It is configured to acquire the inclination angle of the inspection target based on the information. With this configuration, the inclination angle of the inspection target can be adjusted more accurately by taking into account the fact that the RGB reflection characteristics are different for the colored and non-color surfaces, and that the RGB reflection characteristics are different for each color even on the color-bearing surface. can be acquired

In the inspection apparatus according to the second aspect of the present invention, an imaging unit that captures an image of an inspection subject and RGB concentric circular lights in which red (R), green (G), and blue (B) are concentrically arranged are irradiated to the inspection subject. Acquisition of the inclination angle of the inspection subject based on the image pickup result by the concentric lighting unit and the imaging unit of the inspection subject irradiated with concentric circular light of RGB, and inspecting the state of the inspection subject based on the acquired inclination angle of the inspection subject A control unit for performing control is provided.

In the inspection device according to the second aspect of the present invention, as described above, an imaging unit for imaging an inspection object and red (R), green (G), and blue (B) concentric circular lights of RGB arranged concentrically are inspected. Acquire the inclination angle of the inspection subject based on the imaging result by the concentric lighting unit irradiating the subject and the imaging unit of the inspection subject irradiating RGB concentric circular light, and obtain the state of the inspection subject based on the acquired inclination angle of the inspection subject A control unit that performs control for inspecting is formed. This makes it possible to provide an inspection device capable of accurately inspecting the state of the inspection target based on the inclination angle, similarly to the mounting board inspection device according to the first aspect.

ADVANTAGE OF THE INVENTION According to this invention, the mounting board inspection apparatus and inspection apparatus which can carry out the inspection of the state of an inspection target based on an inclination angle with high precision as mentioned above can be provided.

1 is a schematic diagram showing a mounting substrate inspection device according to a first embodiment.
Fig. 2 is a schematic diagram showing a concentric lighting unit and an imaging unit according to the first embodiment.
3(A) is a schematic view of the light source unit of the first example of the concentric lighting unit according to the first embodiment as viewed from a direction substantially orthogonal to the optical axis. 3(B) is a schematic view of the light source unit of the first example of the concentric lighting unit according to the first embodiment, viewed from the optical axis direction.
4(A) is a schematic view of the light source unit of the second example of the concentric lighting unit according to the first embodiment as seen from a direction substantially orthogonal to the optical axis. 4(B) is a schematic view of the light source unit of the second example of the concentric lighting unit according to the first embodiment as viewed from the optical axis direction.
Fig. 5 is a schematic diagram for explaining the concentric circular light of RGB by the concentric circular lighting unit according to the first embodiment.
Fig. 6 is a schematic diagram for explaining the principle of acquisition of the inclination angle of an inspection target by the mounting board inspection apparatus according to the first embodiment.
7 is a graph for explaining the change in brightness of each color of RGB according to the inclination angle of the inspection target according to the first embodiment.
Fig. 8(A) is a schematic diagram showing the observation solid angle according to the first embodiment. Fig. 8(B) is a schematic diagram showing irradiation solid angles according to the first embodiment. Fig. 8(C) is a schematic diagram showing the included limit angle according to the first embodiment.
Fig. 9 is a schematic diagram for explaining changes in the RGB ratio according to the inclination angle of the inspection target according to the first embodiment and acquisition of conversion information for converting the RGB ratio into the inclination angle.
Fig. 10 is a schematic diagram for explaining the detection of cracks in components according to the first embodiment.
Fig. 11 is a schematic diagram for explaining the detection of moxibustion of components according to the first embodiment.
Fig. 12 is a flowchart for explaining table acquisition processing according to the first embodiment.
Fig. 13 is a schematic diagram for explaining table acquisition processing according to the first embodiment.
14 is a flowchart for explaining the substrate inspection process according to the first embodiment.
Fig. 15 is a schematic diagram showing a concentric lighting unit and an imaging unit according to the second embodiment.
Fig. 16 is a schematic diagram showing a concentric lighting unit and an imaging unit according to a third embodiment.
Fig. 17 is a schematic diagram for explaining the concentric circular light of RGB by the concentric circular lighting unit according to the third embodiment.
18 is a graph for explaining the change of the RGB ratio according to the inclination angle of the inspection target according to the third embodiment.
Fig. 19(A) is a schematic view of the light source unit of the concentric lighting unit according to the fourth embodiment as viewed from a direction substantially orthogonal to the optical axis. Fig. 19(B) is a schematic view of the light source unit of the concentric lighting unit according to the fourth embodiment as viewed from the optical axis direction.
Fig. 20 is a schematic diagram for explaining the RGB ratio on a surface having no color.
Fig. 21 is a schematic diagram for explaining the RGB ratio in the color plane.
Fig. 22 is a schematic diagram for explaining the acquisition of color information and correction based on the color information according to the fourth embodiment.
23 is a flowchart for explaining the substrate inspection process according to the fourth embodiment.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment which actualized this invention is described based on drawing.

[First Embodiment]

(Configuration of Mounted Board Inspection Device)

Referring to Fig. 1, the configuration of a mounting substrate inspection apparatus 100 according to an embodiment of the present invention will be described. In addition, the mounting board inspection device 100 is an example of the "inspection device" of the claims.

As shown in Fig. 1, the mounting board inspection device 100 captures an image of a mounting board P such as a printed circuit board as an inspection target P1 (imaging target), and detects the mounting board P and the components on the mounting board P. It is a visual inspection apparatus that performs various inspections for (E). The mounting board inspection device 100 is part of a board manufacturing line for manufacturing a circuit board by mounting components E (electronic components) such as ICs, transistors, capacitors, resistors, and semiconductor wafer chips on a mounting board P. is constituting The mounting board inspection device 100 is an example of the "inspection device" of the present invention.

As an outline of the substrate manufacturing process, first, solder (solder paste) is printed (applied) in a predetermined pattern by a solder printing device (not shown) on the mounting substrate P on which a wiring pattern is formed (solder printing process ). Subsequently, the component E is mounted (mounted) on the solder-printed mounting board P by a component mounting device (not shown) (mounting step), so that the terminal portion of the component E is disposed on the solder. Thereafter, the mounted board P, which has been mounted, is conveyed to a reflow furnace (not shown), and solder is melted and hardened (cooled) (reflow process), so that the terminal portion of the component E is mounted on the board P ) is soldered to the wiring. As a result, the component E is fixed on the mounting board P in a state of being electrically connected to the wiring, and board manufacturing is completed.

The mounting board inspection device 100 is used, for example, for inspecting the mounted state of the component E after a mounting process or inspecting the mounted state of the component E after a reflow step. Therefore, one or a plurality of mounting substrate inspection apparatuses 100 are installed in the substrate production line. As the mounting state of the component E, whether the type and direction (polarity) of the component E are appropriate, whether the amount of positional deviation relative to the designed mounting position of the component E is within the allowable range, solder bonding of the terminal portion Inspections are made to determine whether or not the state is normal, whether or not moxibustion has occurred in the component E on the mounting board P, and whether or not cracks (cracks) have occurred in the component E. In addition, detection of foreign matter such as dust and other deposits is also performed as a common inspection content between each process.

The mounting substrate inspection device 100 includes a substrate transport conveyor 10 for transporting a mounted substrate P, and an upward movement of the substrate transport conveyor 10 in the XY direction (horizontal direction) and the Z direction (vertical direction). A head moving mechanism 20, an imaging head 30 held by the head moving mechanism 20, and a control device 40 for controlling the mounted substrate inspection device 100 are provided. In addition, the control device 40 is an example of a "control unit" in the claims.

The substrate transport conveyor 10 is configured to be able to stop and hold the mounting substrate P at a predetermined inspection position while conveying the mounting substrate P in the X direction. In addition, the substrate transport conveyor 10 is configured to transport the mounted substrate P for which inspection has been completed in the X direction from a predetermined inspection position, and to carry the mounted substrate P out of the mounted substrate inspection device 100. has been

The head movement mechanism 20 is installed above the substrate transport conveyor 10 (Z1 direction) and is constituted by, for example, an orthogonal three-axis (XYZ-axis) robot using a ball screw shaft and a servo motor. The head moving mechanism 20 includes an X-axis motor 21, a Y-axis motor 22, and a Z-axis motor 23 for driving the X-axis, Y-axis, and Z-axis. With these X-axis motors 21, Y-axis motors 22, and Z-axis motors 23, the head moving mechanism 20 moves the imaging head 30 to the substrate transport conveyor 10 (mounted substrate P). ) from above (Z1 direction) to the XY direction (horizontal direction) and Z direction (vertical direction).

The imaging head 30 is configured to measure (acquire) two-dimensional information (two-dimensional image) and three-dimensional information (three-dimensional image) of the mounting substrate P (inspection target P1). The imaging head unit 30 includes an imaging unit 31, a concentric circle lighting unit 32, a two-dimensional lighting unit 33 serving as a two-dimensional measurement unit, and a three-dimensional measurement unit 34.

The imaging unit 31 is a camera that captures an image of the mounting substrate P (inspection target P1) disposed at the inspection position. The imaging unit 31 is configured to capture an image of the mounting substrate P (inspection target P1) under irradiation of light by the concentric lighting unit 32, the two-dimensional lighting unit 33, or the three-dimensional measurement unit 34. . In addition, the imaging unit 31 has an optical axis disposed in a vertical direction with respect to a reference plane in a horizontal direction. That is, the imaging unit 31 captures an image of the upper surface of the mounting substrate P (inspection target P1) from a position substantially vertically upward to acquire a two-dimensional image of the mounting substrate P (inspection target P1). Consists of.

The concentric circle lighting unit 32 is configured to irradiate the mounting substrate P (inspection target P1) with RGB concentric circle lights in which red (R), green (G), and blue (B) are concentrically arranged. . A detailed configuration of the concentric circle lighting unit 32 will be described later.

The two-dimensional lighting unit 33 includes a dome lighting unit 33a and a low angle lighting unit 33b. The dome lighting unit 33a has a dome-shaped (half-spherical) reflecting unit 51 and a plurality of light source units 52 formed on the inner surface side of the reflecting unit 51 . Under the irradiation of the illumination light of the dome lighting unit 33a, it is possible to acquire a non-image captured image of the mounting substrate P (inspection target P1). The low-angle lighting part 33b has a ring-shaped attaching part 53 and a plurality of light source parts 54 formed in a ring shape on the inner surface side of the attaching part 53. Under irradiation of illumination light from the low-angle lighting unit 33b, it is possible to acquire a captured image in which the edge of the mounting substrate P (inspection target P1) is highlighted. The light source parts 52 and 54 are white LEDs, for example.

The three-dimensional measurement unit 34 is configured to be able to measure three-dimensional information including height information of the mounting substrate P (inspection target P1). The 3D measurement unit 34 is, for example, a laser measurement unit capable of measuring 3D information by an optical cutting method using laser light or a phase lighting unit capable of measuring 3D information by a phase shift method using stripe pattern light. It is possible to acquire three-dimensional information including height information of the mounting substrate P (inspection object P1) based on the imaging result of the laser light by the optical cutting method or the stripe pattern light by the phase shift method.

The control device 40 includes a control unit 41, a storage unit 42, an image processing unit 43, an imaging control unit 44, a lighting control unit 45, and a motor control unit 46.

The control unit 41 includes a CPU that executes logic calculations, a ROM (Read Only Memory) that stores programs for controlling the CPU, and the like, and a RAM (Random Access Memory) that temporarily stores various data during device operation. Consists of. The control unit 41 controls the image processing unit 43, the imaging control unit 44, the lighting control unit 45, and the motor control unit 46 according to programs stored in the ROM or software (programs) stored in the storage unit 42. It is configured to control each part of the mounting board inspection device 100 through Then, the control unit 41 controls the imaging head unit 30 to perform various appearance inspections on the mounting substrate P.

The storage unit 42 is made of a non-volatile storage device capable of storing various data and being read by the control unit 41 . In the storage unit 42, captured image data captured by the imaging unit 31, board data defining design positional information of the component E to be mounted on the mounting substrate P, and the like are stored. The image processing unit 43 performs image processing on the captured image captured by the imaging unit 31 to obtain image data suitable for recognizing (image recognition) the mounting substrate P and the component E on the mounting substrate P. configured to create.

The imaging control unit 44 reads the imaging signal from the imaging unit 31 at a predetermined timing based on the control signal output from the control unit 41, and outputs the read imaging signal to the image processing unit 43. Consists of. The lighting control unit 45 is configured to turn on the concentric lighting unit 32 and the two-dimensional lighting unit 33 at a predetermined timing based on a control signal output from the control unit 41 . The motor control unit 46 controls each servomotor (X-axis motor 21 and Y-axis motor 22 of the head moving mechanism 20) of the mounting board inspection device 100 based on the control signal output from the control unit 41. , and the Z-axis motor 23, a motor (not shown) for driving the substrate transport conveyor 10, etc.) are configured to control driving. In addition, the motor controller 46 is configured to acquire the positions of the imaging head 30 and the mounting board P based on signals from encoders (not shown) of each servomotor.

(Composition of imaging unit and concentric lighting unit)

As shown in Fig. 2, the imaging unit 31 has an objective lens (front lens) 31a, an imaging lens 31b, and an imaging element 31c. The objective lens 31a is a lens arranged at a position closest to the inspection target P1 side (object side) in the imaging unit 31 . In addition, the objective lens 31a is a telecentric lens in which the principal ray of light passing through the objective lens 31a and the optical axis of the objective lens 31a are substantially parallel on the imaging element 31c side (image side). It is installed. The imaging lens 31b is configured to form an image of light rays passing through the objective lens 31a. The objective lens 31a and the imaging lens 31b are installed in the lens barrel 31d. The imaging element 31c includes, for example, a CMOS image sensor, and is configured to receive light that has passed through the objective lens 31a and the imaging lens 31b and convert it into an electrical signal. The imaging unit 31 has a telecentric optical system.

The concentric light source 32 has a concentric light source 32a, an irradiation lens 32b, and a half mirror 32c. The concentric light source unit 32a is configured to emit RGB concentric circular lights in which red, green, and blue are concentrically arranged. The RGB concentric light surrounds the substantially circular first color light, the substantially ring-shaped second color light arranged so as to surround the outer periphery of the substantially circular first color light, and the substantially ring-shaped second color light. and light of a third color in a substantially ring shape arranged so as to be visible. The light of the first color, the light of the second color, and the light of the third color are arranged in this order from the center to the outer circumference. In addition, the arrangement order of red, green, and blue in RGB concentric circular lights is not particularly limited, but in the first to fourth embodiments, red, green, and blue are arranged in this order from the center side to the outer periphery side for convenience. An example of arrangement will be described.

Referring to FIG. 3(A) and FIG. 3(B), the 1st structural example of the concentric light source part 32a is demonstrated. As shown in FIG. 3(A) and FIG. 3(B), the concentric light source part 32a of the first structural example includes a red light source 61, a green light source 62, and a blue light source 63 arranged concentrically. are doing The red light source 61 is disposed at the most central side, and is configured to emit red light in a substantially circular shape. The red light source 61 is constituted by a plurality of (four in Fig. 3(B)) red LEDs. The green light source 62 is arranged at an intermediate position and is configured to emit green light in a substantially ring shape. The green light source 62 is constituted by a plurality of (16 in Fig. 3(B)) green LEDs. The blue light source 63 is disposed on the outermost circumferential side and is configured to emit blue light in a substantially ring shape. The blue light source 63 is constituted by a plurality of blue LEDs (32 in Fig. 3(B)).

Further, in the concentric light source portion 32a of the first configuration example, a diffuser plate 64 is provided forward in the light output direction of the light sources 61, 62, 63 of each color, and the light sources 61, 62 of each color , 63), a partition plate 65 is provided. The diffuser plate 64 is configured to diffuse the light emitted from the light sources 61, 62 and 63. The partition plate 65 is arranged so as to partition between adjacent light sources so that light (color) from adjacent light sources does not mix. With these configurations, the concentric light source unit 32a of the first configuration example is configured to emit RGB concentric circular light.

Referring to FIG. 4(A) and FIG. 4(B), the 2nd structural example of the concentric light source part 32a is demonstrated. As shown in FIG. 4(A) and FIG. 4(B), the concentric light source part 32a of the second configuration example has a white light source 71 and an RGB concentric color filter disposed at a position facing the white light source 71. (72) is included. The white light source 71 is configured to emit substantially circular white light. The white light source 71 is constituted by a plurality of (17 in Fig. 4(B)) white LEDs. The concentric color filter 72 includes a red filter 72a, a green filter 72b, and a blue filter 72c arranged concentrically. The red filter 72a is disposed at the most central side and is configured to selectively transmit red light. The red filter 72a has a substantially circular shape and is configured to transmit substantially circular red light. The red filter 72a is made of, for example, red cellophane. The green filter 72b is disposed at an intermediate position and is configured to selectively transmit green light. The green filter 72b has a substantially ring shape, and is configured to transmit substantially ring-shaped green light. The green filter 72b is made of, for example, green cellophane. The blue filter 72c is disposed on the outermost circumferential side and is configured to selectively transmit blue light. The blue filter 72c has a substantially ring shape, and is configured to transmit substantially ring-shaped blue light. The blue filter 72c is made of, for example, blue cellophane.

Further, in the concentric light source unit 32a of the second structural example, a diffusion plate 73 is provided between the white light source 71 and the concentric color filter 72 . The diffuser plate 73 is configured to diffuse the light emitted from the white light source 71 . With these configurations, the concentric light source unit 32a of the second configuration example is configured to emit RGB concentric circular light.

As shown in FIG. 2, the irradiation lens 32b is provided between the concentric light source part 32a and the inspection object P1, and is configured so that RGB concentric light is irradiated from the concentric light source part 32a. The irradiation lens 32b is composed of a chief ray of light (RGB concentric circular light from the concentric light source part 32a) passing through the irradiation lens 32b on the inspection target P1 side (object side) and the optical axis of the irradiation lens 32b. It is installed as a telecentric lens that becomes substantially collimated. The inspection object P1 is irradiated with concentric circular lights of RGB, in which the optical axis of the irradiation lens 32b and the chief ray are substantially parallel. In addition, the concentric light source unit 32a is configured to irradiate the inspection target P1 with concentric RGB light, the optical axis of the irradiation lens 32b and the principal ray being substantially parallel, corresponding to the focal distance of the irradiation lens 32b from the irradiation lens 32b. It is placed in a spaced position.

The half mirror 32c is provided between the irradiation lens 32b and the inspection target P1, and is configured to irradiate RGB concentric circular light passing through the irradiation lens 32b. The half mirror 32c is configured to reflect the concentric circular light of RGB and to convert the traveling direction of the concentric circular light of RGB to irradiate the inspection object P1 with the concentric circular light of RGB. In addition, the half mirror 32c is configured so that the concentric circular light of RGB reflected from the inspection object P1 is transmitted and received by the imaging element 31c of the imaging section 31. The concentric lighting unit 32 has a telecentric optical system and functions as a coaxial lighting unit that irradiates the inspection object P1 with light substantially coaxial with the optical axis of the imaging unit 31 (RGB concentric circular light). In addition, the center of the diameter of the concentric circular light of RGB (the center of the diameter of the concentric light source part 32a), the optical axis of the irradiation lens 32b, and the imaging lenses of the imaging part 31 (objective lens 31a, imaging lens 31b The optical axes of )) are aligned to approximately coincide.

With these configurations, as shown in Fig. 5, the concentric lighting unit 32 emits concentric circular light of RGB in which the optical axis of the irradiation lens 32b and the chief ray are substantially parallel to each point on the inspection surface of the inspection object P1. Consists of. In addition, the concentric light unit 32 is configured to radiate concentric circular light of RGB whose chief ray is substantially perpendicular to the inspection surface (substantially horizontal inspection surface) of the inspection subject P1 when the inspection subject P1 is not inclined. has been 5, illustration of the half mirror 32c is omitted for ease of understanding.

Here, in the present embodiment, the control device 40 of the mounting board inspection device 100 irradiates RGB concentric circular light by the concentric circle lighting unit 32, and the imaging result by the imaging unit 31 of the inspection target P1 While acquiring the inclination angle of the inspection subject P1 based on the obtained, it is configured to perform control for inspecting the state of the inspection subject P1 based on the acquired inclination angle of the inspection subject P1.

(Principle of acquisition of inclination angle)

The principle of acquisition of the inclination angle by concentric circular light of RGB is demonstrated with reference to FIG.6 and FIG.7.

FIG. 6 shows an inclusive relationship between an observation solid angle O formed by the imaging unit 31 and an irradiation solid angle I formed by the concentric circle lighting unit 32 . Here, the observation solid angle O represents the imaging range (light receiving range) of the imaging unit 31 for each point on the inspection surface of the inspection target P1, and is expressed as a cone with each point on the inspection surface as a vertex. can In addition, the irradiation solid angle I indicates the irradiation range of the irradiation light (concentric circular light of RGB) to each point on the inspection surface of the inspection target P1, and can be expressed as a cone with each point on the inspection surface as a vertex. . In addition, the reflected light of the irradiated light can also be represented by the same irradiation solid angle I as that of the irradiated light. What is received (imaged) by the imaging unit 31 is a portion included in the observation solid angle O (a portion overlapping the observation solid angle O) among the reflected light of the irradiation solid angle I.

Here, when the inspection surface of the inspection target P1 is not inclined (when the inspection surface is horizontal), if the irradiated light is regularly reflected on the inspection surface of the inspection subject P1, the reflected light (regular reflection light) coincides with the irradiated light. do. On the other hand, when the inspection surface of the inspection target P1 is inclined at the inclination angle θb, when the irradiation light is regularly reflected on the inspection surface of the inspection target P1, the reflected light (regular reflection light) is transmitted to the inspection surface of the inspection target P1. It is reflected in a direction symmetrical to the irradiation light with respect to the normal of (a direction inclined at an inclination angle of 2θb from the irradiation light). In this case, the relation between the observation solid angle O and the reflected light irradiation solid angle I is changed. As a result, the brightness of each color of RGB light received (imaged) by the imaging unit 31 is changed.

7 is a graph showing changes in the brightness of each RGB color according to the inclination angle of the inspection surface of the inspection target P1. In the graph of FIG. 7 , the vertical axis represents lightness (256 gradations), and the horizontal axis represents the inclination angle of the inspection surface of the inspection target P1. As can be understood from the graph of FIG. 7 , the brightness of each RGB color is continuously changed according to the inclination angle of the inspection surface of the inspection target P1. Specifically, when the inclination angle of the inspection surface of the inspection target P1 is small, the ratio of red (R) to green (G) and blue (B) is large. After that, as the inclination angle of the inspection surface of the inspection target P1 becomes medium, the ratio of red (R) gradually decreases while the ratio of green (G) gradually increases. After that, as the inclination angle of the inspection surface of the inspection target P1 becomes larger, the ratio of green (G) gradually decreases, while the ratio of blue (B) gradually increases.

For this reason, it is possible to acquire the inclination angle of the inspection surface of the inspection target P1 by utilizing the change in the brightness of each color of RGB in the imaging result by the imaging unit 31. Specifically, it is possible to acquire the inclination angle of the inspection surface of the inspection target P1 by utilizing the fact that the ratio of RGB in the imaging result by the imaging unit 31 changes.

(Design example of solid angle)

Next, design examples of the observation solid angle O and the irradiation solid angle I will be described with reference to Figs. 8(A) to 8(C).

As shown in Fig. 8(A), the value of the observation solid angle O can be obtained by the following formulas (1) and (2).

NA = M/2Fe ... (1)

θw = arcsin(NA) ... (2)

From here,

NA: object-side numerical aperture of the imaging lens (objective lens)

M: imaging magnification of the imaging device

Fe: Effective F number of the imaging lens (objective lens)

θw: Value of observation solid angle.

For example, when the imaging magnification M is 0.45 and the execution F number Fe is 14.7, the numerical aperture NA is approximately 0.015306 (0.45/(2×14.7)). In this case, the value (θw) of the observation solid angle O is about 0.88° (arcsin(0.015306)).

As shown in Fig. 8(B), the value of the irradiation solid angle I can be obtained by the following formulas (3) to (5).

F = f/Φ ... (3)

NA = 1/2F ... (4)

θL = arcsin(NA) ... (5)

From here,

F: F number of irradiation lens

f: focal length of the irradiation lens

Φ: maximum diameter of the concentric light source

NA: numerical aperture of the irradiation lens

θL: It is the value (maximum value) of the irradiation solid angle.

For example, when the focal length f is 208.2 mm and the largest diameter ? is 26 mm, the F number F is about 8.007692 (208.2/26). In this case, the numerical aperture NA is approximately 0.06244 (1/(2×8.007692)). In addition, the value (θL) of the irradiation solid angle (I) is about 3.58° (arcsin(0.06244)).

In addition, the value of the irradiation solid angle (I) of each color of RGB can be obtained by the following equations (6) to (8).

θz = θL × Φz / Φx ... (6)

θy=θL×Φy/Φx−θz ... (7)

θx = θL-(θy+θz) ... (8)

From here,

θz: the value of the irradiation solid angle of the central color

θy: the value of the irradiation solid angle of the middle color

θx: the value of the irradiation solid angle of the outermost circumference color

θL: value of irradiation solid angle (maximum value)

Φz: the outermost diameter of the light source of the central color

Φy: the outermost diameter of the medium-colored light source

Φx: the outermost diameter of the light source of the outermost circumferential color.

For example, the maximum value θL of the irradiation solid angle I is about 3.58°, the outermost diameter Φz of the light source of the center color (red in the first embodiment) is 8.6 mm, and the middle color (first embodiment When the outermost diameter Φy of the light source of green) is 17.4 mm and the outermost diameter φx of the light source of the outermost periphery color (blue in the first embodiment) is 26 mm, the value of the irradiation solid angle I of the central color ( θx) is about 1.18° (3.58×8.6/26), the value (θy) of the irradiation solid angle I of the middle color is about 1.21° (3.58×17.4/26-1.18), and the outermost color The value (θx) of the irradiation solid angle (I) of is about 1.19° (3.58 - (1.21 + 1.18)). The value of the irradiation solid angle I of each color can be set based on the outermost diameter of the light source of each color.

As shown in Fig. 8(C), the included limit angle (see Fig. 6) can be obtained by the following equation (9). The included limit angle is an angle formed by the optical axis of the observation solid angle O and the optical axis of the reflected light irradiation solid angle I when the observation solid angle O does not include the reflected light irradiation solid angle I. In addition, the inclination angle of the inspection surface of the inspection target P1 in the case of the included limit angle can be obtained by the following equation (10).

θe = θw + θL ... (9)

θb = θe/2 ... (10)

From here,

θe: Include limit angle

θw: value of observation solid angle

θL: value of irradiation solid angle

θb: Inclination angle of the inspection surface of the inspection target in the case of the included limit angle.

For example, when the value θw of the observation solid angle O is about 0.88° and the value θL of the irradiation solid angle I is about 3.58°, the included limit angle θe is about 4.46° (0.88+ 3.58). In the case of the included limit angle θe, the inclination angle θb of the inspection surface of the inspection target P1 is about 2.23° (4.46/2). In this case, the measurable range of the inclination angle of the inspection surface of the inspection target P1 using the inclusive relationship between the observation solid angle O and the irradiation solid angle I is 0° to about 2.23°.

As can be understood from these, by setting the value θw of the observation solid angle O and the value θL of the irradiation solid angle I according to the angular range desired for measurement, the inspection target P1 can be inspected in the desired angular range. It is possible to measure the inclination angle of the inspection surface of

(Inspection of inspection target)

Next, with reference to FIGS. 9 to 11, the inspection of the inspection target P1 using concentric circular light of RGB will be described.

In this embodiment, the control device 40 is configured to perform control to image the inspection target P1 (mounted substrate P) irradiated with RGB concentric circular light by the imaging unit 31 . In addition, the control device 40 is configured to acquire an imaging result by the imaging unit 31 of the inspection target P1 irradiated with RGB concentric circular light. In addition, the control device 40 is configured to acquire the brightness of each color (RGB brightness) of the red, green, and blue colors of the inspection target P1 in the image pickup result based on the obtained image pickup result. In addition, the control device 40 is configured to acquire an RGB ratio, which is a ratio of red, green, and blue of the inspection target P1 in the image pickup result, based on the brightness of each color of the acquired RGB. Further, the control device 40 is configured to acquire the inclination angle of the inspection subject P1 based on the acquired RGB ratio of the inspection subject P1. Specifically, the control device 40 is configured to acquire the inclination angle of the inspection subject P1 based on the RGB ratio of the inspection subject P1 and the conversion information 42a for converting the previously acquired RGB ratio into an inclination angle. has been

As shown in Fig. 9, the conversion information 42a is a conversion table for converting the RGB ratio into the inclination angle. In the conversion information 42a, the RGB ratio and the inclination angle are correlated. Specifically, in the conversion information 42a, inclination angles are associated with each predetermined RGB ratio range. In addition, in FIG. 9, for convenience, only the center value of a predetermined RGB ratio range is shown. When the acquired RGB ratio of the inspection target P1 is within the predetermined RGB ratio range, the control device 40 converts the inclination angle corresponding to the predetermined RGB ratio range from the conversion information 42a to the inclination angle of the inspection target P1. It is configured to acquire as The conversion information 42a has been acquired in advance and stored in the storage unit 42 . In addition, the details of the acquisition method of the conversion information 42a are mentioned later.

As shown in FIGS. 10 and 11 , the control device 40 controls to inspect the component E on the mounting board P as the inspection target P1 based on the inclination angle of the inspection target P1. Consists of.

Specifically, as shown in FIG. 10, the control device 40 is configured to perform control for detecting a change point of the inclination angle (change boundary of the inclination angle) as a crack based on the inclination angle of the inspection target P1. there is. Thereby, the control device 40 is configured to perform control for detecting a crack in the component E as a semiconductor wafer chip (so-called die) based on the inclination angle of the inspection target P1. The control device 40 is configured to perform control to detect the change point of the inclination angle as a crack when the change in the inclination angle is equal to or greater than a reference value.

Fig. 10 is a schematic diagram of a cracked component E, which was imaged by irradiating RGB concentric circular light. When the component E is imaged by irradiation with RGB concentric circular light, an image pickup result is obtained in which both sides of the crack are colored as surfaces with different RGB ratios because the inclination angles are usually different on both sides of the crack. 10 shows an example in which one side of the crack is a blue-colored surface and the other side of the crack is a green-colored surface. In this case, since the boundary between the blue-colored surface and the green-colored surface serves as a change point of the inclination angle, cracks are detected. In addition, although FIG. 10 shows an example of indexes of different systems on both sides of the crack for ease of understanding, even if both sides of the crack are colors of the same system (blue colors, etc.), if there is a change in the inclination angle of more than the reference value, the crack can be detected as

Moreover, as shown in FIG. 11, the control apparatus 40 is comprised so that it may perform control which detects the swelling of the component E on the mounting board P based on the inclination angle of the inspection object P1. Here, in the case of using concentric circular lights of RGB, the inclination angle can be acquired, but the inclination direction cannot be known. For this reason, the case where the inclination angle of the component E is acquired by moxibustion on the component E on the mounting board P, and the mounting board P despite the fact that moxibustion does not occur on the component E It is difficult to distinguish the case where the angle of inclination of the component E is obtained by inclining itself.

Therefore, in the present embodiment, the control device 40 determines the inclination angle of the inspection subject P1 based on the imaging result of the inspection subject P1 irradiated with RGB concentric circular light by the imaging unit 31, and the three-dimensional measurement unit ( Based on the height information of the inspection target P1 by 34), control is performed to inspect the component E on the mounting board P (state of the inspection target P1).

Specifically, the control device 40 determines the inclination direction and inclination angle of the mounting board P and the inclination direction of the component E based on the height information of the inspection target P1 by the three-dimensional measurement unit 34. It is structured to acquire. Then, the control device 40 considers the inclination direction of the mounting board P and the tilting direction of the component E obtained using the three-dimensional measuring unit 34, and the mounting substrate obtained using the three-dimensional measuring unit 34. It is comprised so that the angular difference of the inclination angle of (P) and the inclination angle of component E acquired using RGB concentric circular light is acquired. Then, the control device 40 is configured to perform control for detecting that the component E on the mounting board P has come off when the acquired angular difference is equal to or greater than a reference value. In addition, since this configuration does not sufficiently obtain scattered light, it is difficult to accurately measure the inclination angle in the three-dimensional measuring unit 34 that measures using scattered light. It is particularly effective for detection. In addition, with respect to the mounting substrate P, since scattered light is normally sufficiently obtained, it is possible to measure the inclination direction and the inclination angle by the three-dimensional measuring unit 34. In addition, it is possible to measure the oblique direction of the component E by the three-dimensional measuring unit 34 even when scattered light is not sufficiently obtained.

(table acquisition processing)

Next, with reference to Figs. 12 and 13, table acquisition processing by the mounting board inspection device 100 of the first embodiment will be described based on a flowchart. In addition, the table acquisition processing is performed before inspection of the inspection target P1 by the mounting substrate inspection apparatus 100. Incidentally, each process in the flow chart may be performed by the control device 40 or may be performed by an operator.

In addition, as shown in FIG. 13, a table acquisition process is performed using the dedicated jig J for acquiring conversion information 42a. The jig (J) is a plate having no color. For example, as the jig J, a mirror-finished aluminum plate can be used.

As shown in FIG. 12 and FIG. 13, first, in step S1, the result of imaging by the imaging unit 31 of the jig J irradiated with RGB concentric circular light by the concentric lighting unit 32 is obtained. In step S1 of the 1st time, the jig J is set to the horizontal state (the state of inclination angle 0).

Then, in step S2, the RGB ratio of the jig J is acquired and stored based on the imaging result of the jig J.

Then, in step S3, the jig J is inclined at a predetermined angle (for example, 0.1°).

And in step S4, it is judged whether or not the measurement range (for example, 2.5 degrees) was measured. If it is determined that the measurement is not carried out in the measurement range, the process proceeds to step S1. Then, the processing of steps S1 to S4 is repeated until the measurement for the measurement range is completed.

In addition, when it is judged that the measuring range is being measured in step S4, it progresses to step S5. In the step of advancing to step S5, it is possible to acquire the measurement result of the change of RGB ratio according to the inclination angle of the jig J as shown in FIG.

Then, in step S5, conversion information 42a for converting the RGB ratio to the inclination angle is acquired (created) based on the measurement result of the change in RGB ratio according to the inclination angle of the jig J, and the storage unit 42 ) is remembered.

(substrate inspection processing)

Next, with reference to FIG. 14, the board|substrate inspection process by the mounting board inspection apparatus 100 of 1st Embodiment is demonstrated based on a flow chart. In addition, each process in the flow chart is performed by the control device 40.

As shown in Fig. 14, first, in step S11, the result of imaging by the imaging unit 31 of the inspection target P1 (mounting board P) irradiated with RGB concentric circular light by the concentric lighting unit 32 is obtained. do.

And in step S12, the RGB ratio of the inspection subject P1 is acquired based on the imaging result of the inspection subject P1. In step S12, for example, the RGB ratio for each pixel of the imaging result (image) is obtained. Further, in step S12, for example, the RGB ratio (average ratio of RGB in the aggregate) for each aggregate of pixels of the imaging result (image) is acquired. Incidentally, an aggregate of pixels is a set of pixels that can be regarded as the same plane in an imaging result (image), for example.

And in step S13, the inclination angle of the inspection subject P1 is acquired based on the RGB ratio of the inspection subject P1 and the conversion information 42a. In step S13, for example, an inclination angle for each pixel of the imaging result (image) is obtained. Further, in step S12, for example, an inclination angle for each pixel aggregate of the imaging result (image) is obtained.

And in step S14, based on the inclination angle of the inspection subject P1, the inspection of the state of the inspection subject P1 is performed. In step S14, the change point of the inclination angle is detected as a crack in the component E based on the inclination angle of the inspection target P1. Further, in step S14, based on the inclination angle of the component E, the inclination direction and inclination angle of the mounting board P obtained by the three-dimensional measurement unit 34, and the inclination direction of the component E, the mounting board A component (E) having an extreme angular difference between (P) is detected as a component (E) where moxibustion from the mounting board (P) has occurred. Then, the substrate inspection process ends.

(Effect of the first embodiment)

In the first embodiment, the following effects can be obtained.

In the first embodiment, the imaging unit 31 for imaging the inspection target P1 including the mounting board P on which the component E is mounted on the mounting board inspection device 100 as described above, and a red color (R ), green (G), and blue (B) of the concentric circle lighting unit 32 for irradiating concentric circular lights of RGB to the inspection target P1, and the inspection target P1 irradiating concentric circular lights of RGB. Acquisition of the inclination angle of the inspection target P1 based on the image pickup result by the imaging unit 31, and control of inspecting the state of the inspection target P1 based on the acquired inclination angle of the inspection target P1 A control device 40 is installed. Thereby, the inclination angle of the inspection subject P1 can be acquired by utilizing the fact that the brightness of each color of RGB in the image pickup result changes according to the inclination angle of the inspection subject P1. Here, when the reflectance of the inspection target P1 is changed, the brightness (brightness) of each color of RGB is changed, but the state of change (circumstance) of the brightness of each color of RGB is maintained without change. For this reason, by acquiring the angle of inclination of the inspection target P1 using the fact that the brightness of each color of RGB in the image pickup result changes depending on the inclination angle of the inspection target P1, the inspection is performed based on the contrast information of a single color. Unlike the case where the angle of inclination of the object P1 is obtained, the angle of inclination of the object P1 to be inspected can be obtained with high accuracy regardless of the change in the reflectance of the object P1 to be inspected. As a result, the inspection of the state of the inspection target P1 based on the inclination angle can be performed with high precision.

In addition, in the first embodiment, as described above, the control device 40 determines the inclination angle of the inspection target P1 based on the RGB ratio, which is the ratio of red, green, and blue of the inspection target P1 in the image pickup result. is configured to acquire As a result, since the angle of inclination of the object P1 to be inspected can be obtained more accurately based on the RGB ratio not dependent on the change in the reflectance of the object P1 to be inspected, the state of the object P1 to be inspected based on the angle of inclination can be performed more precisely.

Further, in the first embodiment, as described above, the control device 40 determines the RGB ratio of the inspection subject P1 and the conversion information 42a for converting the RGB ratio obtained in advance into an inclination angle to inspect the inspection subject P1. It is configured to acquire an inclination angle of . In this way, the inclination angle of the inspection target P1 is easily and reliably obtained by simply converting the RGB ratio of the inspection target P1 into an inclination angle using the conversion information 42a for converting the RGB ratio into an inclination angle. can do.

Further, in the first embodiment, as described above, the concentric light source 32 includes the red light source 61, the green light source 62, and the blue light source 63 arranged concentrically, or the white light source 71 and an RGB concentric color filter 72 disposed at a position facing the white light source 71. As a result, when the concentric circle lighting unit 32 includes the red light source 61, the green light source 62, and the blue light source 63 concentrically arranged, red, green, and blue are concentrically arranged RGB Concentric circular light can be easily obtained. In addition, when the white light source 71 and the RGB concentric color filters 72 disposed opposite to the white light source 71 are included, unlike the case where the light sources for each color of RGB are separately formed, the color Since mixing is suppressed and there is no need for a structure for partitioning the light sources, the structure of the concentric light source 32 can be simplified.

Moreover, in 1st Embodiment, as mentioned above, the control apparatus 40 is comprised so that based on the inclination angle of the inspection object P1, it may perform control which detects the change point of the inclination angle as a crack. As a result, when a crack occurs, since the inclination angle is different on both sides of the crack, the crack in the inspection target P1 can be detected with high accuracy by using the fact that the change point of the inclination angle corresponds to the crack. Here, there is also a method of detecting the dark portion of the image as a crack, but when detecting the dark portion of the image as a crack, if the width of the crack is narrow (for example, less than 1 pixel), the crack cannot be recognized in the image. There are cases where cracks cannot be detected. On the other hand, since the change point of the inclination angle is detected as a crack in this configuration, unlike the case of detecting the dark part of the image as a crack, the width of the crack is narrow and the crack is detected with high precision even when the crack cannot be recognized as a dark part in the image. can do.

Also, in the first embodiment, as described above, the component E includes a semiconductor wafer chip. In addition, the control device 40 is configured to perform control for detecting cracks in the semiconductor wafer chip based on the inclination angle of the inspection target P1. This makes it possible to detect cracks with high precision in semiconductor wafer chips prone to cracks.

In addition, in the first embodiment, as described above, the control device 40 is configured to perform control for detecting the component E on the mounting board P based on the inclination angle of the inspection target P1. . Thereby, based on the inclination angle of the inspection object P1 acquired with high precision, the moxibustion of the component E on the mounting board P can be detected with high precision.

In addition, in the first embodiment, as described above, the mounting board inspection device 100 includes the three-dimensional measuring unit 34 capable of measuring height information of the inspection target P1. In addition, the control device 40 measures the inclination angle of the inspection target P1 based on the imaging result of the imaging unit 31 of the inspection target P1 irradiated with RGB concentric circular light and the three-dimensional measuring unit 34. It is configured to perform control for inspecting the state of the inspection subject P1 based on the height information of the inspection subject P1. As a result, not only the inclination angle of the inspection target P1 based on the imaging result of the imaging unit 31 of the inspection target P1 irradiated with RGB concentric circular light, but also the inspection target by the three-dimensional measurement unit 34 ( Based on the height information of P1), the state of the inspection target P1 can be inspected more precisely.

[Second Embodiment]

Next, referring to Fig. 15, a second embodiment will be described. Unlike the first embodiment in which the irradiation lens is provided in the concentric lighting unit, in this second embodiment, an example in which the objective lens of the imaging unit is used as the irradiation lens of the concentric lighting unit will be described. In addition, about the same structure as the said 1st Embodiment, the same code|symbol is attached|subjected and illustrated in drawing, and the description is abbreviate|omitted.

(Configuration of Mounted Board Inspection Device)

As shown in Fig. 15, the mounting substrate inspection device 200 according to the second embodiment of the present invention has the concentric lighting unit 132 instead of the concentric lighting unit 32 of the first embodiment. It is different from the mounting substrate inspection device 100 according to the embodiment. In addition, the mounting board inspection device 200 includes a two-dimensional lighting unit 33 and a three-dimensional measuring unit 34 . In addition, the mounting board inspection device 200 is an example of the "inspection device" of the claims.

Here, in the second embodiment, as shown in FIG. 15 , the concentric illumination unit 132 performs inspection using the objective lens 31a disposed at the position closest to the inspection target P1 side in the imaging unit 31. It is configured to irradiate the object P1 with concentric circular light of RGB. That is, the concentric lighting unit 132 of the second embodiment includes the objective lens 31a of the imaging unit 31 instead of the irradiation lens 32b of the first embodiment. The objective lens 31a serves both as a lens for imaging of the imaging unit 31 and a lens for irradiation of the concentric lighting unit 132 . In addition, the objective lens 31a is an example of the "lens for imaging" in the claims.

In the second embodiment, the objective lens 31a is provided between the half mirror 32c and the inspection object P1, and is configured so that RGB concentric circular light reflected by the half mirror 32c is irradiated. The objective lens 31a is composed of a chief ray of light (concentric circular light of RGB from the concentric light source unit 32a) passing through the objective lens 31a on the inspection target P1 side (object side) and an optical axis of the objective lens 31a. It is installed as a telecentric lens that becomes substantially collimated. In addition, the concentric light source unit 32a is configured to irradiate the object P1 with concentric circular light of RGB, in which the optical axis of the objective lens 31a and the chief ray are substantially parallel, by the focal distance of the objective lens 31a from the objective lens 31a. It is placed in a spaced position.

Other configurations of the second embodiment are the same as those of the first embodiment.

(Effect of the second embodiment)

In the second embodiment, the following effects can be obtained.

In the second embodiment, as described above, the imaging unit 31 has an objective lens 31a. In addition, the concentric circle lighting unit 132 is configured to irradiate the inspection object P1 with concentric circular light of RGB using the objective lens 31a. As a result, since the concentric circular light of RGB can be irradiated to the inspection target P1 by effectively using the existing objective lens 31a, there is no need to separately and independently provide a lens for illumination in the concentric lighting unit 132. As a result, the structure of the imaging unit 31 and the concentric lighting unit 132 can be simplified, and space saving of the arrangement of the imaging unit 31 and the concentric lighting unit 132 can be achieved.

Further, in the second embodiment, as described above, the objective lens 31a is an objective lens disposed at a position closest to the inspection target P1 side in the imaging unit 31 . Thereby, concentric circular light of RGB can be irradiated to the inspection target P1 by using the objective lens 31a effectively.

Other effects of the second embodiment are the same as those of the first embodiment.

[Third Embodiment]

Next, a third embodiment will be described with reference to FIGS. 16 to 18 . In this third embodiment, unlike the first and second embodiments in which three colors are formed in the concentric circle lighting section, an example in which four colors are formed in the concentric circle lighting section will be described. In addition, about the same structure as the said 1st and 2nd embodiment, the same code|symbol is attached|subjected in drawing, and the description is abbreviate|omitted.

(Configuration of Mounted Board Inspection Device)

As shown in Fig. 16, the mounting board inspection apparatus 300 according to the third embodiment of the present invention has a concentric lighting unit 232 instead of the concentric lighting unit 132 of the second embodiment. It is different from the mounting substrate inspection device 200 according to the embodiment. In addition, the mounting board inspection device 300 includes a two-dimensional lighting unit 33 and a three-dimensional measuring unit 34 . In addition, the mounting board inspection device 300 is an example of the "inspection device" of the claims.

Here, in the third embodiment, as shown in Fig. 16, the concentric circle lighting unit 232 emits RGB concentric circle light each of RGB and the outermost part of the concentric circle including the same color as the center color of the concentric circle. structured to investigate. Specifically, the concentric light source unit 232 has a concentric light source unit 232a instead of the concentric light source unit 32a of the second embodiment.

As shown in FIGS. 16 and 17, the concentric light source unit 232a is configured to emit RGB concentric light with one color each and RGB containing the same color as the center color of the concentric circle at the outermost part of the concentric circle. . The RGB concentric light surrounds the substantially circular first color light, the substantially ring-shaped second color light arranged so as to surround the outer periphery of the substantially circular first color light, and the substantially ring-shaped second color light. and light of a substantially ring-shaped third color arranged so as to surround the outer periphery of the substantially ring-shaped third color light. The central first color light, the second color light, the third color light, and the outermost first color light are arranged in this order from the center to the outer circumference. In addition, the order of arrangement of red, green, and blue colors in RGB concentric circular lights and the center and outermost colors are not particularly limited, but in the examples shown in Figs. 16 and 17, as an example, red, green, blue, and Red is arranged in this order from the center side toward the outer periphery side.

In addition, in the concentric light source unit 232a, the angle between the end (outer end) of the irradiation solid angle I of the central color and the start end (inner end) of the irradiation solid angle I of the outermost color is the observation solid angle O It is configured to emit concentric circular light of RGB greater than the value of . That is, the concentric light source unit 232a is configured to simultaneously emit RGB concentric circular lights in which the central color light and the outermost color light of the same color are not included in the observation solid angle O.

18 is a graph showing a change in RGB ratio according to an inclination angle of the inspection surface of the inspection target P1 using the concentric circle lighting unit 232 of the third embodiment. Comparing the graph shown in Fig. 18 with the graph shown in Fig. 9 of the first embodiment, in the graph shown in Fig. 18, the end of the range of measuring the inclination angle of the inspection target P1 (that is, the inclination angle of the inspection target P1) is compared. is large), it can be seen that the ratio of red and blue is changed. That is, in the graph shown in FIG. 18, it is understood that the inclination angle can be obtained based on the change in brightness (change in ratio) of a plurality of colors (two colors) even at the end of the inclination angle measurement range of the inspection target P1. there is. That is, in the third embodiment, it is possible to acquire the inclination angle in a state where the reference data in the final stage of the inclination angle measurement range of the inspection target P1 is increased. Incidentally, although detailed description is omitted, in the third embodiment, information corresponding to a graph as shown in Fig. 18 is acquired (created) as conversion information 42a.

Other configurations of the third embodiment are the same as those of the first and second embodiments.

(Effect of the third embodiment)

In the third embodiment, the following effects can be obtained.

In the third embodiment, as described above, the concentric circle lighting unit 232 is configured to emit RGB concentric light for each color and RGB concentric light including the same color as the center color of the concentric circle to the outermost part of the concentric circle. As a result, the concentric circle light of RGB includes the same color as the color of the center of the concentric circle among RGB at the outermost part of the concentric circle, and thus the end of the range of measuring the inclination angle of the inspection target P1 (ie, the inclination angle of the inspection target P1). is large), the inclination angle of the inspection target P1 can be acquired with high precision based on the change in brightness of a plurality of colors.

Other effects of the third embodiment are the same as those of the first and second embodiments.

[Fourth Embodiment]

Next, a fourth embodiment will be described with reference to FIGS. 19 to 23 . In this fourth embodiment, in addition to the configuration of the first embodiment, an example in which an inclination angle is obtained by further considering color information will be described. In addition, about the same structure as the said 1st Embodiment, the same code|symbol is attached|subjected in drawing, and the description is abbreviate|omitted.

(Configuration of Mounted Board Inspection Device)

As shown in Figs. 19(A) and 19(B), the mounting board inspection apparatus 400 according to the fourth embodiment of the present invention includes a concentric circle lighting unit 332 instead of the concentric lighting unit 32 of the first embodiment. It differs from the mounting substrate inspection apparatus 100 according to the first embodiment in that it includes. In addition, the mounting board inspection device 400 includes a two-dimensional lighting unit 33 and a three-dimensional measuring unit 34 . In addition, the mounting board inspection device 400 is an example of the "inspection device" of the claims.

In the fourth embodiment, as shown in FIGS. 19(A) and 19(B), the concentric circle lighting unit 332 is configured to be able to irradiate the inspection object P1 with white light in addition to the concentric circular light of RGB. . Specifically, the concentric light source unit 332 has a concentric light source unit 332a instead of the concentric light source unit 32a of the first embodiment.

The concentric light source unit 332a further includes a white light source 366 in addition to the red light source 61 , the green light source 62 , and the blue light source 63 . The white light source 366 is configured to emit white light in a substantially circular shape substantially identical to RGB concentric circular light. The white light source 366 is constituted by a plurality (17 in Fig. 19(B)) of white LEDs. In addition, the concentric light source unit 332a is configured to independently light the red light source 61, the green light source 62, the blue light source 63, and the white light source 366. Thereby, the concentric circle lighting unit 332 is configured to be able to independently irradiate the RGB concentric circle light and the white light to the inspection target P1. In this case, since there is no need to install white light separately from the concentric light unit 332, it is possible to suppress the complexity of the structure of the device.

Here, the difference in RGB reflection characteristics between the surface having color and the surface not having color will be described with reference to FIGS. 20 and 21 .

As shown in Fig. 20, the reflection characteristics for each color of RGB are the same on the surface having no color (mirror surface, white surface, black surface, gray surface, etc.). For this reason, when concentric circular light of RGB is irradiated to a surface having no color, the intensity of the reflected light changes depending on the type of the surface having no color (mirror surface, white surface, black surface, gray surface, etc.), but Regardless of the type of surface (mirror surface, white surface, black surface, gray surface, etc.), the RGB ratio of the reflected light remains unchanged. In this case, it is possible to acquire an inclination angle by the conversion information 42a as shown in FIG.

On the other hand, as shown in Fig. 21, the reflection characteristics for each color of RGB are different for each color on the surface having color (a green surface, a yellow surface, and a red surface, etc.). For this reason, when concentric circular light of RGB is irradiated to a surface having a color, the RGB ratio of the reflected light changes according to the type of the surface having a color (green surface, yellow surface, red surface, etc.). In this case, it is difficult to acquire the inclination angle only with the conversion information 42a as shown in FIG. 9 . In the mounting substrate P, the colored surface is, for example, a copper foil surface (red color surface) and a gold foil surface (yellow color surface).

Then, as shown in FIG. 22, in the 4th embodiment, the control apparatus 40 measures the imaging result by the imaging part 31 of the inspection object P1 irradiated with RGB concentric circular light, and the inspection object P1 irradiated with white light. ) is configured to acquire the inclination angle of the inspection subject P1 based on the color information of the inspection subject P1 acquired from the image capturing result.

Specifically, the control device 40 is configured to control the imaging unit 31 to image the inspection target P1 (mounted substrate P) irradiated with white light by the concentric lighting unit 332 . In addition, the control device 40 is configured to acquire a result of imaging by the imaging unit 31 of the inspection target P1 irradiated with white light. In addition, the control device 40 is configured to acquire the brightness (color information) of each color of RGB of the inspection target P1 in the image pickup result based on the acquired image pickup result. Further, the control device 40 is configured to acquire color correction coefficients (color information) of the inspection subject P1 based on the obtained lightness of each RGB color of the inspection subject P1. The color correction coefficient is a coefficient for canceling a difference in RGB ratio due to color. The color correction coefficient is obtained as a reciprocal of the RGB ratio of the inspection target P1 under irradiation of white light, for example.

In addition, the control device 40, as in the first embodiment, emits concentric circular light of RGB by the concentric lighting unit 332, and based on the result of imaging by the imaging unit 31 of the inspection target P1, each of the RGB It is configured to acquire the lightness of a color. In addition, the control device 40 multiplies the brightness of each color of RGB of the inspection target P1 obtained using the RGB concentric circular light by the color correction coefficient of the inspection target P1, thereby obtaining the brightness obtained using the RGB concentric circular light. It is configured to perform control for correcting the imaging result of the inspection target P1. In this way, the control device 40 is configured to acquire the imaging result of the inspection target P1 corrected for color difference.

In addition, the control device 40 is configured to acquire the RGB ratio of the inspection subject P1 whose color difference has been corrected based on the image capturing result of the inspection subject P1 after correction. Further, the control device 40 is configured to acquire the inclination angle of the inspection subject P1 based on the acquired RGB ratio of the inspection subject P1. Specifically, the control device 40 is configured to acquire the inclination angle of the inspection subject P1 based on the RGB ratio of the inspection subject P1 and the conversion information 42a.

Further, in the fourth embodiment, since the imaging result of the inspection target P1 by the white light irradiated with the same optical path (same irradiation path) as the concentric circular light of RGB is acquired, based on the imaging result of the inspection target P1 by the white light It is possible to acquire the color correction coefficient (color information) of the inspection target P1 with high accuracy.

22 shows an example of performing the color correction on three surfaces: a silver surface without color (semiconductor wafer chip), a yellow surface with color (gold foil), and a red surface (copper foil) with color. . Also, the three faces are inclined at the same angle.

In the image pickup result under the irradiation of white light, since the reflection characteristics of each color of RGB are the same on the colorless silver surface, the brightness of red, green, and blue are all 100. In addition, since the reflection characteristics of each color of RGB are different on the yellow surface having color, the brightness of red is 100, the brightness of green is 100, and the brightness of blue is 50. In addition, since the reflection characteristics of each color of RGB are different on the red surface having color, the brightness of red is 100, the brightness of green is 50, and the brightness of blue is 25.

When color correction coefficients are acquired based on this imaging result, the color correction coefficients of red, green, and blue are all 1 (R coefficient: G coefficient: B coefficient = 1:1:1) on the silver surface having no hue. becomes In addition, on the yellow surface having color, the color correction coefficient for red is 1, the color correction coefficient for green is 1, and the color correction coefficient for blue is 2 (R coefficient:G coefficient:B coefficient = 1:1:2 ) becomes In addition, in the red plane having color, the color correction coefficient for red is 1, the color correction coefficient for green is 2, and the color correction coefficient for blue is 4 (R coefficient: G coefficient: B coefficient = 1:2:4 ) becomes

Further, in the imaging result under the irradiation of RGB concentric circular light, the brightness of red is 42, the brightness of green is 5, and the brightness of blue is 92 on the silver surface having no color. In addition, since it is difficult to obtain blue reflected light on the yellow surface having a color, unlike the silver surface having no color, the brightness of red is 42, the brightness of green is 5, and the brightness of blue is 46. In addition, since it is difficult to obtain green and blue reflected light on the red surface having color, unlike the silver surface having no color, the brightness of red is 42, the brightness of green is 2.5, and the brightness of blue is 23.

In the case where the color correction is not performed in this way, since the RGB ratios are different on each of the three surfaces of the silver surface without color, the yellow surface with color, and the red surface with color, each of the three surfaces has the same slope In spite of having an angle, different inclination angles are acquired in three surfaces.

On the other hand, when the imaging result under RGB concentric circular light irradiation is corrected based on the color correction coefficient, the color correction coefficient is multiplied by the brightness because R coefficient:G coefficient:B coefficient = 1:1:1 for the silver surface without color In the lower case, the brightness of red after correction is 42, the brightness of green after correction is 5, and the brightness of blue after correction is 92. In addition, on the yellow side with color, since R coefficient:G coefficient:B coefficient = 1:1:2, when the color correction coefficient is multiplied by the brightness, the brightness of red after correction is 42, and the brightness of green after correction is 5. and the brightness of blue becomes 92. In addition, since the color correction coefficient is multiplied by the lightness, the lightness of red after correction is 42, and the lightness of green after correction is 5. and the brightness of blue becomes 92.

In this way, when the color correction is performed, since the RGB ratio is the same on each of the three surfaces of the silver surface without color, the yellow surface with color, and the red surface with color, the three surfaces with the same inclination angle It is possible to obtain the same inclination angle in .

(substrate inspection processing)

Next, with reference to FIG. 23, the board|substrate inspection process by the mounting board inspection apparatus 400 of 4th Embodiment is demonstrated based on a flowchart. In addition, each process in the flow chart is performed by the control device 40.

As shown in Fig. 23, first, in step S21, a result of imaging by the imaging unit 31 of the inspection target P1 (mounted substrate P) irradiated with white light by the concentric circle lighting unit 332 is acquired.

And in step S22, the color correction coefficient of the inspection subject P1 is acquired based on the imaging result of the inspection subject P1. In step S22, for example, color correction coefficients for each pixel of the imaging result (image) are obtained. Further, in step S22, for example, a color correction coefficient for each pixel aggregate of the imaging result (image) (an average color correction coefficient in the aggregate) is obtained.

And in step S23, the imaging result by the imaging part 31 of the inspection target P1 (mounting board P) irradiated with RGB concentric circular light by the concentric circle lighting part 332 is acquired.

Then, in step S24, the image pickup result of the inspection target P1 acquired using RGB concentric circular light is corrected based on the color correction coefficient.

And in step S25, the RGB ratio of the inspection subject P1 is acquired based on the imaging result of the inspection subject P1 after correction. In step S25, for example, the RGB ratio for each pixel of the imaging result (image) is acquired. Further, in step S25, for example, the RGB ratio for each pixel aggregate of the imaging result (image) is acquired.

Then, in step S26, the inclination angle of the inspection subject P1 is acquired based on the RGB ratio of the inspection subject P1 after correction and the conversion information 42a. In step S26, for example, an inclination angle for each pixel of the imaging result (image) is acquired. Further, in step S12, for example, an inclination angle for each pixel aggregate of the imaging result (image) is obtained.

And in step S27, based on the inclination angle of the inspection subject P1, the inspection of the state of the inspection subject P1 is performed. In step S27, based on the inclination angle of the inspection object P1, the change point of the inclination angle is detected as a crack in the component E. Further, in step S27, based on the inclination angle of the component E, the inclination direction and inclination angle of the mounting board P obtained by the three-dimensional measuring unit 34, and the inclination direction of the component E, the mounting board A component (E) having an extreme angular difference between (P) is detected as a component (E) where moxibustion from the mounting board (P) has occurred. Then, the substrate inspection process ends.

Other configurations of the fourth embodiment are the same as those of the first embodiment.

(Effect of 4th Embodiment)

In the fourth embodiment, the following effects can be obtained.

In the fourth embodiment, as described above, the control device 40 obtains from the imaging result by the imaging unit 31 of the inspection subject P1 irradiated with RGB concentric circular light and the imaging result of the inspection subject P1 irradiated with white light. It is configured to acquire the inclination angle of the inspection target P1 based on the acquired color information of the inspection target P1. As a result, the angle of inclination of the inspection target P1 is determined by taking into account the fact that the RGB reflection characteristics are different for each color even on the surface having the color and the surface having the color and the surface not having the color. Accuracy can be obtained.

Other effects of the fourth embodiment are the same as those of the first embodiment.

(modified example)

In addition, it should be thought that embodiment disclosed this time is an illustration in all points, and is not restrictive. The scope of the present invention is shown by the claims rather than the description of the above-described embodiments, and includes all changes (modifications) within the scope and meaning equivalent to the scope of the claims.

For example, in the above first to fourth embodiments, an example in which the present invention is applied to a mounting substrate inspection device has been shown, but the present invention is not limited to this. The present invention may be applied to inspection devices other than the mounting board inspection device. Further, the present invention is particularly suitable for inspection of a member (inspection target) for which inclination angle information is difficult to obtain because it is difficult to obtain sufficient scattered light, such as a mirror surface member and a transparent member (such as a transparent case).

Further, in the above first to fourth embodiments, an example in which the mounting substrate inspection device (inspection device) includes a two-dimensional lighting unit and a three-dimensional measuring unit has been shown, but the present invention is not limited to this. In the present invention, the inspection device does not need to include a two-dimensional lighting unit and a three-dimensional measuring unit. In addition, the inspection device may include only either one of the two-dimensional lighting unit and the three-dimensional measurement unit.

Further, in the above first to fourth embodiments, an example in which a half mirror is provided between the concentric light source unit and the inspection target has been shown, but the present invention is not limited to this. In the present invention, a prism may be provided between the concentric light source unit and the inspection target.

Further, in the above first to fourth embodiments, an example in which the conversion information is a conversion table has been shown, but the present invention is not limited to this. In the present invention, the conversion information may be a conversion function for converting an RGB ratio into an inclination angle.

Further, in the first to fourth embodiments described above, examples of detecting cracks of components and lagging of components based on the inclination angle of the object to be inspected have been shown, but the present invention is not limited to these. In the present invention, deformation of the inspection target (eg, parts and substrates) may be detected based on the inclination angle of the inspection target.

Further, in the above first to fourth embodiments, an example of detecting a crack in a semiconductor wafer chip based on an inclination angle of an object to be inspected has been shown, but the present invention is not limited to this. In this invention, you may detect the crack of the mold part (transparent resin part) of an LED component based on the inclination angle of the inspection object.

Further, in the first to fourth embodiments described above, based on the inclination angle of the inspection target based on the imaging result by the imaging unit of the inspection target irradiated with RGB concentric circular light and the height information of the inspection target by the three-dimensional measuring unit, parts are detected. Although an example of detecting moxibustion has been shown, the present invention is not limited to this. In the present invention, based on the inclination angle of the inspection subject based on the imaging result of the imaging unit of the inspection subject irradiated with RGB concentric circular light and the height information of the inspection subject by the three-dimensional measurement unit, cracks in the component may be detected. Further, in the present invention, if possible, component flaking may be detected based only on the inclination angle of the inspection subject based on the result of imaging by the imaging unit of the inspection subject irradiated with RGB concentric circular light.

In the first and fourth embodiments, for convenience of description, control processing was described using a flow-driven flow in which processing is sequentially performed according to a processing flow, but the present invention is not limited to this. In the present invention, control processing may be performed by event-driven (event-driven) processing that executes processing in units of events. In this case, it may be completely event-driven or a combination of event-driven and flow-driven.

31: imaging unit 31a: objective lens (lens for imaging)
32, 132, 232, 332: concentric lighting unit 34: 3D measurement unit
40: control device (control unit) 42a: conversion information
61: red light source 62: green light source
63: blue light source 71: white light source
72: color filter
100, 200, 300, 400: mounting board inspection device (inspection device)
E: Component P: Mounting Board
P1: Inspection target

Claims (13)

an imaging unit that captures an image of an inspection target including a mounting board on which components are mounted;
A concentric circle lighting unit for irradiating concentric circle lights of RGB in which red (R), green (G), and blue (B) are concentrically arranged to the inspection object;
Obtaining an inclination angle of the inspection subject based on a result of imaging by the imaging unit of the inspection subject irradiated with the concentric circular light of the RGB, and inspecting a state of the inspection subject based on the acquired inclination angle of the inspection subject A mounting substrate inspection apparatus having a control unit that performs control to According to claim 1,
The controller is configured to acquire an inclination angle of the inspection subject based on an RGB ratio, which is a ratio of red, green, and blue of the inspection subject in an image pickup result. According to claim 2,
The controller is configured to acquire an inclination angle of the inspection object based on the RGB ratio of the inspection object and conversion information for converting the RGB ratio obtained in advance into an inclination angle. According to any one of claims 1 to 3,
The concentric circle lighting unit includes a red light source, a green light source, and a blue light source disposed concentrically, or a white light source and an RGB concentric color filter disposed at a position opposite to the white light source. According to any one of claims 1 to 4,
The concentric circle lighting unit is configured to irradiate each RGB color and the concentric circle light of the RGB including the same color as the center of the concentric circle among the RGB at the outermost part of the concentric circle. According to any one of claims 1 to 5,
The control unit is configured to perform control for detecting a change point of an inclination angle as a crack based on an inclination angle of the inspection target. According to claim 6,
The component includes a semiconductor wafer chip,
The controller is configured to perform control for detecting a crack in the semiconductor wafer chip based on an inclination angle of the object to be inspected. According to any one of claims 1 to 7,
and the control unit is configured to perform control for detecting the component on the mounting board based on the inclination angle of the inspection target. According to any one of claims 1 to 8,
Further comprising a three-dimensional measurement unit capable of measuring height information of the inspection target,
The control unit measures the inspection target based on the inclination angle of the inspection target based on the imaging result of the imaging unit of the inspection target irradiated with the concentric circular light of the RGB and the height information of the inspection target by the 3D measurement unit. A mounting board inspection device configured to perform control for inspecting the state of the board. According to any one of claims 1 to 9,
The imaging unit has a lens for imaging,
The mounting board inspection apparatus of claim 1 , wherein the concentric lighting unit is configured to irradiate the RGB concentric circular light to the inspection object using the imaging lens. According to claim 10,
The imaging lens is an objective lens disposed at a position closest to the inspection target side in the imaging unit. According to any one of claims 1 to 11,
The control unit determines the inclination angle of the inspection target based on the color information of the inspection target obtained from the imaging result of the inspection target irradiated with the RGB concentric circular light by the imaging unit and the imaging result of the inspection target irradiated with white light. A mounting board inspection device configured to obtain a. an imaging unit that captures an image of an object to be inspected;
A concentric circle lighting unit for irradiating concentric circle lights of RGB in which red (R), green (G), and blue (B) are concentrically arranged to the inspection object;
Obtaining an inclination angle of the inspection subject based on a result of imaging by the imaging unit of the inspection subject irradiated with the concentric circular light of the RGB, and inspecting a state of the inspection subject based on the acquired inclination angle of the inspection subject An inspection device having a control unit that performs control to

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