TW202223338A - Mounting-board inspection apparatus and inspection apparatus - Google Patents

Mounting-board inspection apparatus and inspection apparatus Download PDF

Info

Publication number
TW202223338A
TW202223338A TW110102101A TW110102101A TW202223338A TW 202223338 A TW202223338 A TW 202223338A TW 110102101 A TW110102101 A TW 110102101A TW 110102101 A TW110102101 A TW 110102101A TW 202223338 A TW202223338 A TW 202223338A
Authority
TW
Taiwan
Prior art keywords
inspection object
rgb
inspection
inclination angle
light
Prior art date
Application number
TW110102101A
Other languages
Chinese (zh)
Inventor
新井健史
松久保貴裕
Original Assignee
日商山葉發動機股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商山葉發動機股份有限公司 filed Critical 日商山葉發動機股份有限公司
Publication of TW202223338A publication Critical patent/TW202223338A/en

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0608—Height gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/24—Measuring arrangements characterised by the use of optical techniques for measuring contours or curvatures
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/26—Measuring arrangements characterised by the use of optical techniques for measuring angles or tapers; for testing the alignment of axes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8806—Specially adapted optical and illumination features
    • G01N2021/8845—Multiple wavelengths of illumination or detection
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854—Grading and classifying of flaws
    • G01N2021/8858—Flaw counting

Abstract

A mounting-board inspection apparatus comprises a concentric-circle illumination unit that illuminates a test object with RGB concentric-circle light in which red(R), green(G), and blue(B) are concentrically arranged, and a control unit that acquires the tilt angle of the test object on the basis of an imaging result obtained by an imaging unit for the test object illuminated with the RGB concentric-circle light and that performs control to inspect the state of the test object on the basis of the acquired tilt angle of the test object.

Description

安裝基板檢查裝置及檢查裝置Mounting board inspection device and inspection device

本發明係關於一種安裝基板檢查裝置及檢查裝置，尤其是關於一種具備拍攝檢查對象之攝像部之安裝基板檢查裝置及檢查裝置。The present invention relates to a mounted substrate inspection device and an inspection device, and more particularly, to a mounted substrate inspection device and an inspection device including an imaging unit for photographing an inspection object.

先前，已知有具備拍攝檢查對象之攝像部之檢查裝置。此種裝置例如揭示於日本專利第5866573號公報中。Conventionally, there has been known an inspection apparatus including an imaging unit that captures an image of an inspection object. Such a device is disclosed in, for example, Japanese Patent No. 5866573 .

上述日本專利第5866573號公報中，揭示有一種檢查系統(檢查裝置)，其具備對檢查對象照射檢查光之檢查用照明裝置、及拍攝檢查對象之攝像裝置。該檢查系統構成為，利用由檢查用照明裝置形成之檢查光之照射立體角、與由攝像裝置形成之觀察立體角之包含關係，獲取檢查對象之傾斜角度。具體而言，該檢查系統構成為利用以下情況來獲取檢查對象之傾斜角度，即，包含在觀察立體角內之照射立體角會根據檢查對象之傾斜角度變化，從而觀察立體角內之光量會變化。即，該檢查系統構成為基於明暗資訊來獲取檢查對象之傾斜角度。The above-mentioned Japanese Patent No. 5866573 discloses an inspection system (inspection device) including an inspection illumination device for irradiating inspection light to an inspection object, and an imaging device for photographing the inspection object. The inspection system is configured to acquire the inclination angle of the inspection object by using the inclusive relationship between the irradiation solid angle of inspection light formed by the inspection illumination device and the observation solid angle formed by the imaging device. Specifically, the inspection system is configured to obtain the inclination angle of the inspection object by using the fact that the irradiation solid angle included in the observation solid angle changes according to the inclination angle of the inspection object, and thus the amount of light in the observation solid angle changes. . That is, the inspection system is configured to acquire the inclination angle of the inspection object based on the shading information.

然而，於上述日本專利第5866573號公報所記載的檢查系統中，存在如下不良情況：由於基於明暗資訊來獲取檢查對象之傾斜角度，故而於檢查對象之反射率變化而使光量變化之情形時，會錯誤地將檢查對象之反射率變化所引起之光量變化視為傾斜角度之變化而獲取。於該情形時，無法高精度地獲取檢查對象之傾斜角度，因此存在無法基於傾斜角度，高精度地對檢查對象之狀態進行檢查之問題。However, in the inspection system described in Japanese Patent No. 5866573, the inclination angle of the inspection object is acquired based on the shading information. Therefore, when the reflectance of the inspection object changes and the amount of light changes, the The change in the amount of light caused by the change in the reflectivity of the inspection object is incorrectly acquired as the change in the tilt angle. In this case, since the inclination angle of the inspection object cannot be obtained with high accuracy, there is a problem that the state of the inspection object cannot be inspected with high accuracy based on the inclination angle.

本發明係為了解決如上所述之問題而完成者，本發明之一個目的在於提供一種能夠基於傾斜角度，高精度地對檢查對象之狀態進行檢查之安裝基板檢查裝置及檢查裝置。The present invention has been made in order to solve the above-mentioned problems, and an object of the present invention is to provide a mounted board inspection apparatus and an inspection apparatus capable of inspecting the state of an inspection object with high accuracy based on an inclination angle.

本發明之第1態樣之安裝基板檢查裝置具備：攝像部，其對包含安裝有零件之安裝基板的檢查對象進行拍攝；同心圓照明部，其對檢查對象照射呈同心圓狀配置有紅色(R)、綠色(G)及藍色(B)之RGB同心圓光；以及控制部，其進行以下控制，即，基於攝像部對照射了RGB同心圓光之檢查對象的拍攝結果，獲取檢查對象之傾斜角度，並且基於所獲取之檢查對象之傾斜角度，對檢查對象之狀態進行檢查。再者，所謂RGB係由「Red(紅色)」、「Green(綠色)」及「Blue(藍色)」之首字母拼成。The mounting board inspection apparatus according to the first aspect of the present invention is provided with: an imaging unit for photographing an inspection object including a mounting substrate on which components are mounted; and a concentric circle illumination unit for illuminating the inspection object with concentrically arranged red ( R), green (G), and blue (B) RGB concentric circles of light; and a control section that controls to acquire the inclination of the inspection object based on the imaging section's photographing result of the inspection object irradiated with the RGB concentric circles of light angle, and based on the acquired inclination angle of the inspection object, the state of the inspection object is checked. Furthermore, the so-called RGB is made up of the initials of "Red (red)", "Green (green)" and "Blue (blue)".

本發明之第1態樣之安裝基板檢查裝置中，如上所述般設置有：攝像部，其對包含安裝有零件之安裝基板的檢查對象進行拍攝；同心圓照明部，其對檢查對象照射呈同心圓狀配置有紅色(R)、綠色(G)及藍色(B)之RGB同心圓光；以及控制部，其進行以下控制，即，基於攝像部對照射了RGB同心圓光之檢查對象的拍攝結果，獲取檢查對象之傾斜角度，並且基於所獲取之檢查對象之傾斜角度，對檢查對象之狀態進行檢查。藉此，可利用拍攝結果中之RGB各顏色之明度會根據檢查對象之傾斜角度而變化這一情況，獲取檢查對象之傾斜角度。此處，於檢查對象之反射率發生變化之情形時，RGB各顏色之明度(亮度)發生變化，但RGB各顏色之明度之變化狀態(情況)保持不變。因此，藉由利用拍攝結果中之RGB各顏色之明度會根據檢查對象之傾斜角度而變化這一情況，獲取檢查對象之傾斜角度，與基於單色之明暗資訊獲取檢查對象之傾斜角度之情形時不同，無論檢查對象之反射率如何變化，均可高精度地獲取檢查對象之傾斜角度。其結果，可基於傾斜角度，高精度地對檢查對象之狀態進行檢查。In the mounted board inspection apparatus according to the first aspect of the present invention, as described above, the imaging unit is provided for photographing the inspection object including the mounting substrate on which the components are mounted, and the concentric circle illumination unit irradiates the inspection object RGB concentric lights of red (R), green (G), and blue (B) are arranged in concentric circles; and a control section that performs control based on the imaging section of the inspection object irradiated with the RGB concentric lights As a result, the inclination angle of the inspection object is acquired, and based on the acquired inclination angle of the inspection object, the state of the inspection object is checked. Thereby, the inclination angle of the inspection object can be obtained by taking advantage of the fact that the brightness of each RGB color in the photographing result changes according to the inclination angle of the inspection object. Here, when the reflectance of the inspection object changes, the lightness (brightness) of each color of RGB changes, but the change state (condition) of the lightness of each color of RGB remains unchanged. Therefore, by using the fact that the brightness of each RGB color in the photographing result changes according to the inclination angle of the inspection object, the inclination angle of the inspection object is obtained, and the inclination angle of the inspection object is obtained based on the light and shade information of a single color. Differently, the inclination angle of the inspection object can be obtained with high accuracy regardless of the change in the reflectivity of the inspection object. As a result, the state of the inspection object can be inspected with high accuracy based on the inclination angle.

上述第1態樣之安裝基板檢查裝置中，較佳為，控制部構成為基於拍攝結果中之檢查對象之紅色、綠色及藍色之比率即RGB比率，獲取檢查對象之傾斜角度。若以此方式構成，則可基於不受檢查對象之反射率變化影響之RGB比率，更高精度地獲取檢查對象之傾斜角度，故而可基於傾斜角度，更高精度地對檢查對象之狀態進行檢查。In the mounted board inspection apparatus of the first aspect, the control unit is preferably configured to acquire the inclination angle of the inspection object based on the ratio of red, green, and blue of the inspection object in the imaging result, that is, the RGB ratio. If configured in this way, the inclination angle of the inspection object can be obtained with higher accuracy based on the RGB ratio that is not affected by the change in the reflectance of the inspection object, so that the state of the inspection object can be inspected with higher accuracy based on the inclination angle. .

於該情形時，較佳為，控制部構成為基於檢查對象之RGB比率、及將預先獲取之RGB比率換算成傾斜角度之換算資訊，獲取檢查對象之傾斜角度。若以此方式構成，則僅藉由利用將RGB比率換算成傾斜角度之換算資訊，將檢查對象之RGB比率換算成傾斜角度，便可簡單且確實地獲取檢查對象之傾斜角度。In this case, the control unit is preferably configured to acquire the inclination angle of the inspection object based on the RGB ratio of the inspection object and conversion information for converting the RGB ratio acquired in advance into the inclination angle. With this configuration, the inclination angle of the inspection object can be easily and reliably obtained by simply converting the RGB ratio of the inspection object into the inclination angle using the conversion information for converting the RGB ratio into the inclination angle.

上述第1態樣之安裝基板檢查裝置中，較佳為，同心圓照明部包含呈同心圓狀配置之紅色光源、綠色光源及藍色光源，或者包含白色光源、及配置於與白色光源對向之位置之RGB同心圓彩色濾光片。若以此方式構成，則於同心圓照明部包含呈同心圓狀配置之紅色光源、綠色光源及藍色光源之情形時，可容易地獲得呈同心圓狀配置有紅色、綠色及藍色之RGB同心圓光。又，於包含白色光源、及配置於與白色光源對向之位置之RGB同心圓彩色濾光片之情形時，與個別地設置RGB各顏色之光源之情形時不同，無需為了抑制混色而將光源彼此隔開之構造，因此可簡化同心圓照明部之構造。In the mounted substrate inspection apparatus according to the first aspect, it is preferable that the concentric circle illumination section includes a red light source, a green light source, and a blue light source arranged concentrically, or includes a white light source, and is arranged opposite to the white light source. The position of the RGB concentric circle color filter. With this configuration, when the concentric illumination portion includes the red light source, the green light source, and the blue light source that are concentrically arranged, it is possible to easily obtain RGB in which red, green, and blue are arranged concentrically. Concentric circles of light. In addition, in the case of including a white light source and an RGB concentric circular color filter arranged at a position opposite to the white light source, unlike the case where the light sources of each color of RGB are provided individually, it is not necessary to separate the light source to suppress color mixing. The structures are spaced apart from each other, thus simplifying the structure of the concentric circle illumination portion.

上述第1態樣之安裝基板檢查裝置中，較佳為，同心圓照明部構成為照射RGB同心圓光，該RGB同心圓光包含RGB三種顏色各1圈，且於同心圓最外側包含與RGB中之位於同心圓中心之顏色相同之顏色。若以此方式構成，則藉由使RGB同心圓光於同心圓最外側包含與RGB中之位於同心圓中心之顏色相同之顏色，而即便於檢查對象之傾斜角度測定範圍之最後階段(即，於檢查對象之傾斜角度較大之情形時)，亦可基於複數種顏色之明度變化，高精度地獲取檢查對象之傾斜角度。In the mounting board inspection apparatus of the first aspect, preferably, the concentric circle illumination unit is configured to emit RGB concentric circle light, the RGB concentric circle light includes one circle for each of the three colors of RGB, and the outermost side of the concentric circle includes one of RGB and RGB. The same color as the center of the concentric circles. If configured in this way, by causing the RGB concentric circles to include the same color as the color located at the center of the concentric circles in the RGB at the outermost side of the concentric circles, even in the final stage of the measurement range of the inclination angle of the inspection object (that is, in the When the inclination angle of the inspection object is large), the inclination angle of the inspection object can also be obtained with high accuracy based on the change of the brightness of a plurality of colors.

上述第1態樣之安裝基板檢查裝置中，較佳為，控制部構成為進行以下控制，即，基於檢查對象之傾斜角度，檢測傾斜角度之變化點作為裂縫。若以此方式構成，則當產生了裂縫時，通常裂縫兩側之傾斜角度不同，因此傾斜角度之變化點對應於裂縫，利用此種情況，可高精度地檢測檢查對象之裂縫。此處，雖存在檢測圖像之暗部作為裂縫之方法，但於檢測圖像之暗部作為裂縫此種情形時，存在因裂縫之寬度較窄(例如未達1像素)時於圖像中無法識別裂縫，而無法檢測出裂縫之情形。另一方面，於本構成中，檢測傾斜角度之變化點作為裂縫，故而與檢測圖像之暗部作為裂縫此種情形時不同，即便於裂縫之寬度較窄於圖像中無法識別裂縫作為暗部之情形時，亦可高精度地檢測裂縫。In the mounted board inspection apparatus of the above-mentioned first aspect, it is preferable that the control unit is configured to perform control to detect a change point of the inclination angle as a crack based on the inclination angle of the inspection object. With this configuration, when a crack occurs, the inclination angles on both sides of the crack are usually different, so that the point of change in the inclination angle corresponds to the crack. Using this situation, the crack to be inspected can be detected with high accuracy. Here, although there is a method of detecting the dark part of the image as a crack, when the dark part of the image is detected as a crack, there is a possibility that the crack cannot be recognized in the image because the width of the crack is narrow (for example, less than 1 pixel). cracks, and the cracks cannot be detected. On the other hand, in this configuration, the change point of the inclination angle is detected as the crack, so unlike the case where the dark part of the image is detected as the crack, even if the width of the crack is narrower than that in the image, the crack cannot be recognized as the dark part. In some cases, cracks can also be detected with high accuracy.

於該情形時，較佳為，零件包含半導體晶圓晶片，且控制部構成為進行以下控制，即，基於檢查對象之傾斜角度，檢測半導體晶圓晶片之裂縫。若以此方式構成，則於容易產生裂縫之半導體晶圓晶片中，可高精度地檢測裂縫。In this case, it is preferable that the component includes a semiconductor wafer, and the control unit is configured to perform control to detect cracks in the semiconductor wafer based on the inclination angle of the inspection object. By configuring in this manner, cracks can be detected with high accuracy in semiconductor wafers that are prone to cracks.

上述第1態樣之安裝基板檢查裝置中，較佳為，控制部構成為進行以下控制，即，基於檢查對象之傾斜角度，檢測安裝基板上之零件隆起。若以此方式構成，則可基於高精度地獲取之檢查對象之傾斜角度，高精度地檢測安裝基板上之零件隆起。In the mounted substrate inspection apparatus of the above-mentioned first aspect, it is preferable that the control unit is configured to perform control to detect the component bulge on the mounted substrate based on the inclination angle of the inspection object. According to this configuration, based on the inclination angle of the inspection object acquired with high accuracy, the component bulge on the mounting board can be detected with high accuracy.

上述第1態樣之安裝基板檢查裝置中，較佳為，進而具備能夠計測檢查對象之高度資訊之三維計測部，且控制部構成為進行以下控制，即，根據檢查對象之傾斜角度與檢查對象之高度資訊，對檢查對象之狀態進行檢查，上述檢查對象之傾斜角度係基於攝像部對照射了RGB同心圓光之檢查對象的拍攝結果所得，上述檢查對象之高度資訊係藉由三維計測部所得。若以此方式構成，則不僅可根據基於攝像部對照射了RGB同心圓光之檢查對象之拍攝結果所得的檢查對象之傾斜角度，還可根據藉由三維計測部所得之檢查對象之高度資訊，更高精度地對檢查對象之狀態進行檢查。Preferably, in the mounted board inspection apparatus of the first aspect, the three-dimensional measurement unit capable of measuring height information of the inspection object is further provided, and the control unit is configured to perform control according to the inclination angle of the inspection object and the inspection object. The height information of the inspection object is used to inspect the state of the inspection object. The inclination angle of the inspection object is obtained based on the result of photographing the inspection object irradiated with RGB concentric circle light by the imaging unit. The height information of the inspection object is obtained by the three-dimensional measurement unit. If configured in this way, not only the inclination angle of the inspection object obtained based on the result of photographing the inspection object irradiated with RGB concentric circles of light by the imaging unit, but also the height information of the inspection object obtained by the three-dimensional measurement unit can be used. The state of the inspection object is inspected with high precision.

上述第1態樣之安裝基板檢查裝置中，較佳為，攝像部具有拍攝用透鏡，同心圓照明部構成為使用拍攝用透鏡，對檢查對象照射RGB同心圓光。若以此方式構成，則可有效地利用既有之拍攝用透鏡，對檢查對象照射RGB同心圓光，而無需於同心圓照明部中個別地獨立設置照明用透鏡。其結果，可簡化攝像部及同心圓照明部之構造，並且可節省攝像部及同心圓照明部之配置空間。In the mounted substrate inspection apparatus according to the first aspect, preferably, the imaging unit has an imaging lens, and the concentric circle illumination unit is configured to use the imaging lens to irradiate the inspection object with RGB concentric light. With this configuration, the existing imaging lens can be effectively used to irradiate the inspection object with RGB concentric circle light, and it is not necessary to separately and independently provide the illumination lens in the concentric circle illumination section. As a result, the structure of the imaging unit and the concentric illumination unit can be simplified, and the arrangement space of the imaging unit and the concentric illumination unit can be saved.

於該情形時，較佳為，拍攝用透鏡係於攝像部中配置於最靠近檢查對象側之位置之物鏡。若以此方式構成，則可有效地利用作為物鏡之拍攝用透鏡，對檢查對象照射RGB同心圓光。In this case, it is preferable that the imaging lens is an objective lens arranged at the position closest to the inspection object side in the imaging section. If comprised in this way, the imaging lens which is an objective lens can be utilized effectively, and RGB concentric circle light can be irradiated to an inspection object.

上述第1態樣之安裝基板檢查裝置中，較佳為，控制部構成為，基於攝像部對照射了RGB同心圓光之檢查對象的拍攝結果、與從照射了白色光之檢查對象之拍攝結果獲取的檢查對象之色相資訊，獲取檢查對象之傾斜角度。若以此方式構成，則可考慮具有色相之面與不具有色相之面中RGB反射特性不同、以及具有色相之面中每個色相之RGB反射特性亦不同，而更高精度地獲取檢查對象之傾斜角度。In the mounted board inspection apparatus according to the above-mentioned first aspect, preferably, the control unit is configured to acquire based on a result of photographing the inspection object irradiated with RGB concentric circle light by the imaging unit and a result of photographing the inspection object irradiated with white light The hue information of the inspection object is obtained, and the inclination angle of the inspection object is obtained. If configured in this way, the RGB reflection characteristics of the surface with a hue and the surface without a hue are different, and the RGB reflection characteristics of each hue in the surface with a hue are also different, and it is possible to obtain the inspection object more accurately. slope.

本發明之第2態樣之檢查裝置具備：攝像部，其拍攝檢查對象；同心圓照明部，其對檢查對象照射呈同心圓狀配置有紅色(R)、綠色(G)及藍色(B)之RGB同心圓光；以及控制部，其進行以下控制，即，基於攝像部對照射了RGB同心圓光之檢查對象的拍攝結果，獲取檢查對象之傾斜角度，並且基於所獲取之檢查對象之傾斜角度，對檢查對象之狀態進行檢查。The inspection apparatus according to the second aspect of the present invention includes: an imaging unit for photographing an inspection object; and a concentric circle illumination unit for illuminating the inspection object with red (R), green (G), and blue (B) arranged in concentric circles ) of the RGB concentric circles of light; and a control section that performs control of acquiring the inclination angle of the inspection object based on a result of photographing the inspection object irradiated with the RGB concentric circles of light by the imaging section, and based on the acquired inclination angle of the inspection object , to check the status of the inspection object.

本發明之第2態樣之檢查裝置中，如上所述般設置有：攝像部，其拍攝檢查對象；同心圓照明部，其對檢查對象照射呈同心圓狀配置有紅色(R)、綠色(G)及藍色(B)之RGB同心圓光；以及控制部，其進行以下控制，即，基於攝像部對照射了RGB同心圓光之檢查對象的拍攝結果，獲取檢查對象之傾斜角度，並且基於所獲取之檢查對象之傾斜角度，對檢查對象之狀態進行檢查。藉此，與上述第1態樣之安裝基板檢查裝置同樣地，可提供一種能夠基於傾斜角度，高精度地對檢查對象之狀態進行檢查之檢查裝置。In the inspection apparatus according to the second aspect of the present invention, as described above, an imaging unit for photographing an inspection object, and a concentric illumination unit for illuminating the inspection object are provided with red (R) and green (R) and green ( G) and blue (B) RGB concentric circle lights; and a control section that controls, based on the imaging section's photographing results of the inspection object irradiated with the RGB concentric circle lights, to acquire the inclination angle of the inspection object, and based on the The obtained inclination angle of the inspection object is used to check the state of the inspection object. Thereby, similarly to the mounted board|substrate inspection apparatus of the said 1st aspect, the inspection apparatus which can inspect the state of an inspection object based on an inclination angle can be provided with high precision.

以下，基於圖式說明實現本發明的實施方式。Hereinafter, embodiments for realizing the present invention will be described based on the drawings.

[第1實施方式] (安裝基板檢查裝置之構成) 參照圖1說明本發明之實施方式之安裝基板檢查裝置100之構成。再者，安裝基板檢查裝置100係申請專利範圍中之「檢查裝置」之一例。 [First Embodiment] (Configuration of the mounting board inspection device) 1, the structure of the mounted board|substrate inspection apparatus 100 which concerns on embodiment of this invention is demonstrated. In addition, the mounted board|substrate inspection apparatus 100 is an example of the "inspection apparatus" in the scope of the patent application.

如圖1所示，安裝基板檢查裝置100係對作為檢查對象P1(拍攝對象)之印刷基板等安裝基板P進行拍攝，並對安裝基板P及安裝基板P上之零件E進行各種檢查之外觀檢查裝置。安裝基板檢查裝置100構成基板生產線之一部分，基板生產線係用以將IC、電晶體、電容器、電阻及半導體晶圓晶片等零件E(電子零件)安裝於安裝基板P來製造電路基板。再者，安裝基板檢查裝置100係本發明之「檢查裝置」之一例。As shown in FIG. 1 , the mounted substrate inspection apparatus 100 images the mounted substrate P such as a printed circuit board as an inspection object P1 (photographing object), and performs various inspections on the mounted substrate P and the components E on the mounted substrate P. device. The mounting board inspection apparatus 100 constitutes a part of a board production line for manufacturing circuit boards by mounting components E (electronic components) such as ICs, transistors, capacitors, resistors, and semiconductor wafers on a mounting board P. In addition, the mounted board|substrate inspection apparatus 100 is an example of the "inspection apparatus" of this invention.

作為基板製造工藝之概要，首先，於形成有配線圖案之安裝基板P上，利用焊料印刷裝置(未圖示)以特定之圖案進行焊料(焊料膏)之印刷(塗佈)(焊料印刷步驟)。繼而，於印刷焊料後之安裝基板P上，利用零件安裝裝置(未圖示)搭載(安裝)零件E(安裝步驟)，藉此將零件E之端子部配置於焊料上。其後，將安裝結束後之安裝基板P搬送至回焊爐(未圖示)中進行焊料之熔融及硬化(冷卻)(回焊步驟)，藉此，零件E之端子部被焊接至安裝基板P之配線。藉此，零件E以電性連接於配線之狀態固定於安裝基板P上，從而完成基板製造。As an outline of the substrate manufacturing process, first, on the mounting substrate P on which the wiring pattern is formed, the solder (solder paste) is printed (applied) in a specific pattern using a solder printing apparatus (not shown) (solder printing step) . Then, on the mounting board P after printing the solder, the components E are mounted (mounted) by a component mounting apparatus (not shown) (mounting step), thereby arranging the terminal portions of the components E on the solder. After that, the mounting board P after the mounting is transported to a reflow furnace (not shown) for melting and hardening (cooling) of the solder (reflow step), whereby the terminal portions of the components E are soldered to the mounting board. P wiring. Thereby, the component E is fixed to the mounting board P in the state of being electrically connected to the wiring, and the board manufacturing is completed.

安裝基板檢查裝置100例如用於安裝步驟後之零件E之安裝狀態之檢查、或回焊步驟後之零件E之安裝狀態之檢查等。因此，安裝基板檢查裝置100於基板生產線中設置有1個或複數個。關於零件E之安裝狀態，進行如下等檢查：零件E之種類及朝向(極性)是否精確；零件E之相對於設計安裝位置之位置偏移量是否處於容許範圍內；端子部之焊接狀態是否正常；安裝基板P上之零件E是否產生隆起；以及零件E是否產生了裂縫(破裂)。又，作為各步驟間之共通之檢查內容，亦進行污物或其他附著物等異物之檢測。The mounting board inspection apparatus 100 is used, for example, to inspect the mounting state of the component E after the mounting step, or to inspect the mounting state of the component E after the reflow step. Therefore, one or a plurality of mounted substrate inspection apparatuses 100 are installed in the substrate production line. Regarding the installation state of the part E, check the following: whether the type and orientation (polarity) of the part E are accurate; whether the positional offset of the part E relative to the designed installation position is within the allowable range; whether the welding state of the terminal part is normal ; Whether or not the parts E on the mounting substrate P are raised; and whether or not the parts E are cracked (cracked). In addition, detection of foreign matter such as dirt and other attached matter is also performed as a common inspection content among the steps.

安裝基板檢查裝置100具備：基板搬送輸送器10，其用以搬送安裝基板P；頭移動機構20，其能夠於基板搬送輸送器10之上方，沿XY方向(水平方向)及Z方向(上下方向)移動；攝像頭部30，其由頭移動機構20保持；以及控制裝置40，其進行安裝基板檢查裝置100之控制。再者，控制裝置40係申請專利範圍中之「控制部」之一例。The mounted substrate inspection apparatus 100 includes: a substrate transfer conveyor 10 for transferring the mounted substrate P; ) movement; the camera head 30 , which is held by the head moving mechanism 20 ; Furthermore, the control device 40 is an example of a "control unit" within the scope of the patent application.

基板搬送輸送器10構成為能夠將安裝基板P沿X方向搬送，並且使安裝基板P於特定之檢查位置停止並保持在該位置。又，基板搬送輸送器10構成為能夠將已結束檢查之安裝基板P從特定之檢查位置沿X方向搬送，並將安裝基板P從安裝基板檢查裝置100搬出。The board conveyance conveyor 10 is configured to be able to convey the mounting board P in the X direction, and to stop the mounting board P at a specific inspection position and hold the position. Moreover, the board|substrate conveyance conveyor 10 is comprised so that the mounted board|substrate P whose inspection is complete|finished can be conveyed in the X direction from a specific inspection position, and can carry out the mounted board|substrate P from the mounted board|substrate inspection apparatus 100.

頭移動機構20設置於基板搬送輸送器10之上方(Z1方向)，例如由使用滾珠螺桿軸及伺服馬達之正交三軸(XYZ軸)機器人構成。頭移動機構20具備用以進行該等X軸、Y軸及Z軸之驅動之X軸馬達21、Y軸馬達22及Z軸馬達23。藉由該等X軸馬達21、Y軸馬達22及Z軸馬達23，頭移動機構20構成為能夠使攝像頭部30於基板搬送輸送器10(安裝基板P)之上方(Z1方向)，沿XY方向(水平方向)及Z方向(上下方向)移動。The head moving mechanism 20 is provided above the substrate transfer conveyor 10 (Z1 direction), and is constituted by, for example, an orthogonal three-axis (XYZ axis) robot using a ball screw shaft and a servo motor. The head moving mechanism 20 includes an X-axis motor 21 , a Y-axis motor 22 , and a Z-axis motor 23 for driving the X-axis, Y-axis, and Z-axis. By the X-axis motor 21 , the Y-axis motor 22 and the Z-axis motor 23 , the head moving mechanism 20 is configured so that the camera head 30 can move along the XY above the board conveying conveyor 10 (the mounting board P) (Z1 direction). direction (horizontal direction) and Z direction (up and down direction).

攝像頭部30構成為測定(獲取)安裝基板P(檢查對象P1)之二維資訊(二維圖像)及三維資訊(三維圖像)。攝像頭部30具備攝像部31、同心圓照明部32、作為二維計測部之二維照明部33以及三維計測部34。The camera head 30 is configured to measure (acquire) two-dimensional information (two-dimensional image) and three-dimensional information (three-dimensional image) of the mounting substrate P (inspection object P1 ). The imaging head 30 includes an imaging unit 31 , a concentric circle illumination unit 32 , a two-dimensional illumination unit 33 serving as a two-dimensional measurement unit, and a three-dimensional measurement unit 34 .

攝像部31係拍攝配置於檢查位置之安裝基板P(檢查對象P1)之相機。攝像部31構成為於同心圓照明部32、二維照明部33或三維計測部34之光照射下，拍攝安裝基板P(檢查對象P1)。又，攝像部31之光軸配置於與水平方向之基準面垂直之方向上。亦即，攝像部31構成為從大致垂直上方之位置拍攝安裝基板P(檢查對象P1)之上表面，獲取安裝基板P(檢查對象P1)之二維圖像。The imaging unit 31 is a camera for photographing the mounting board P (inspection object P1 ) disposed at the inspection position. The imaging unit 31 is configured to photograph the mounting board P (inspection object P1 ) under light irradiation from the concentric circle illumination unit 32 , the two-dimensional illumination unit 33 , or the three-dimensional measurement unit 34 . Moreover, the optical axis of the imaging part 31 is arrange|positioned in the direction perpendicular|vertical to the reference plane of a horizontal direction. That is, the imaging part 31 is comprised so that the upper surface of the mounting board P (inspection object P1) may be imaged from a position substantially vertically upward, and a two-dimensional image of the mounting board P (inspection object P1) may be acquired.

同心圓照明部32構成為對安裝基板P(檢查對象P1)照射呈同心圓狀配置有紅色(R)、綠色(G)及藍色(B)之RGB同心圓光。關於同心圓照明部32之詳細構成將於下文敍述。The concentric circle illumination unit 32 is configured to irradiate the mounting board P (inspection object P1 ) with RGB concentric circle lights in which red (R), green (G), and blue (B) are arranged concentrically. The detailed configuration of the concentric circle illumination portion 32 will be described later.

二維照明部33包含圓頂照明部33a與低角度照明部33b。圓頂照明部33a具有圓頂狀(半球殼狀)之反射部51、及設置於反射部51之內表面側之複數個光源部52。於圓頂照明部33a之照明光之照射下，能夠獲取安裝基板P(檢查對象P1)之無影拍攝圖像。低角度照明部33b具有環狀之安裝部53、及呈環狀設置於安裝部53之內表面側之複數個光源部54。於低角度照明部33b之照明光之照射下，能夠獲取安裝基板P(檢查對象P1)之邊緣清晰之拍攝圖像。光源部52及54例如為白色LED(Light Emitting Diode，發光二極體)。The two-dimensional illumination unit 33 includes a dome illumination unit 33a and a low-angle illumination unit 33b. The dome illumination part 33 a has a dome-shaped (hemispheric shell-shaped) reflection part 51 and a plurality of light source parts 52 provided on the inner surface side of the reflection part 51 . Under the irradiation of the illumination light of the dome illumination part 33a, the shadowless photographed image of the mounting board P (inspection object P1) can be acquired. The low-angle lighting portion 33b includes a ring-shaped mounting portion 53 and a plurality of light source portions 54 annularly disposed on the inner surface side of the mounting portion 53 . Under the irradiation of the illuminating light of the low-angle illuminating part 33b, the photographed image which the edge of the mounting board P (inspection object P1) is clear can be acquired. The light source units 52 and 54 are, for example, white LEDs (Light Emitting Diodes).

三維計測部34構成為能夠計測包含安裝基板P(檢查對象P1)之高度資訊之三維資訊。三維計測部34例如為能夠藉由使用雷射光之光切斷法計測三維資訊之雷射計測部、或能夠藉由使用條紋圖案光之相位偏移法計測三維資訊之相位照明部。基於光切斷法之雷射光或相位偏移法之條紋圖案光之拍攝結果，能夠獲取包含安裝基板P(檢查對象P1)之高度資訊之三維資訊。The three-dimensional measurement unit 34 is configured to be able to measure three-dimensional information including height information of the mounting board P (inspection object P1 ). The three-dimensional measurement unit 34 is, for example, a laser measurement unit capable of measuring three-dimensional information by a photo-cutting method using laser light, or a phase illumination unit capable of measuring three-dimensional information by a phase shift method using fringe pattern light. Three-dimensional information including height information of the mounting substrate P (inspection object P1 ) can be acquired based on the imaging result of the laser light by the optical cutting method or the fringe pattern light by the phase shift method.

控制裝置40包含控制部41、記憶部42、圖像處理部43、攝像控制部44、照明控制部45及馬達控制部46。The control device 40 includes a control unit 41 , a memory unit 42 , an image processing unit 43 , an imaging control unit 44 , an illumination control unit 45 , and a motor control unit 46 .

控制部41包含執行邏輯運算之CPU(Central Processing Unit，中央處理單元)、記憶有控制CPU之程式等之ROM(Read Only Memory，唯讀記憶體)及於裝置之動作中暫時記憶各種資料之RAM(Random Access Memory，隨機存取記憶體)等。控制部41構成為，按照記憶於ROM中之程式、或儲存於記憶部42中之軟體(程式)，經由圖像處理部43、攝像控制部44、照明控制部45及馬達控制部46，控制安裝基板檢查裝置100之各部。而且，控制部41控制攝像頭部30，以對安裝基板P進行各種外觀檢查。The control unit 41 includes a CPU (Central Processing Unit) that executes logical operations, a ROM (Read Only Memory) that stores programs that control the CPU, and a RAM that temporarily stores various data during the operation of the device. (Random Access Memory, random access memory) and so on. The control unit 41 is configured to control the image processing unit 43 , the imaging control unit 44 , the lighting control unit 45 , and the motor control unit 46 according to a program stored in the ROM or software (program) stored in the memory unit 42 . Each part of the board inspection apparatus 100 is mounted. Further, the control unit 41 controls the camera unit 30 to perform various appearance inspections on the mounting substrate P. As shown in FIG.

記憶部42包含能夠進行各種資料之記憶與利用控制部41之讀出之非揮發性記憶裝置。記憶部42中，記憶有由攝像部31拍攝到之拍攝圖像資料、以及規定了要安裝於安裝基板P上之零件E之設計位置資訊的基板資料等。圖像處理部43構成為，對由攝像部31拍攝到之拍攝圖像進行圖像處理，以產生適於識別(圖像識別)安裝基板P及安裝基板P上之零件E等之圖像資料。The memory unit 42 includes a non-volatile memory device capable of storing various data and reading out by the control unit 41 . In the memory unit 42 , captured image data captured by the imaging unit 31 , board data specifying design position information of the components E to be mounted on the mounting board P, and the like are stored. The image processing unit 43 is configured to perform image processing on the captured image captured by the imaging unit 31 to generate image data suitable for identifying (image recognition) the mounting board P and the components E on the mounting board P, etc. .

攝像控制部44構成為，基於從控制部41輸出之控制信號，於特定之時點從攝像部31讀出拍攝信號，並且將所讀出之拍攝信號輸出至圖像處理部43。照明控制部45構成為，基於從控制部41輸出之控制信號，於特定之時點使同心圓照明部32及二維照明部33點亮。馬達控制部46構成為，基於從控制部41輸出之控制信號，控制安裝基板檢查裝置100之各伺服馬達(頭移動機構20之X軸馬達21、Y軸馬達22及Z軸馬達23、以及用以驅動基板搬送輸送器10之馬達(未圖示)等)之驅動。又，馬達控制部46構成為，基於來自各伺服馬達之編碼器(未圖示)之信號，獲取攝像頭部30及安裝基板P等之位置。The imaging control unit 44 is configured to read out the imaging signal from the imaging unit 31 at a specific timing based on the control signal output from the control unit 41 , and to output the read imaging signal to the image processing unit 43 . The illumination control unit 45 is configured to turn on the concentric circle illumination unit 32 and the two-dimensional illumination unit 33 at a specific timing based on a control signal output from the control unit 41 . The motor control unit 46 is configured to control each of the servo motors (the X-axis motor 21 , the Y-axis motor 22 , and the Z-axis motor 23 of the head moving mechanism 20 , and the servo motors 23 of the head moving mechanism 20 ) It is driven by a motor (not shown), etc., which drives the substrate conveying conveyor 10 . Moreover, the motor control part 46 is comprised so that the position of the imaging head part 30, the mounting board|substrate P, etc. may be acquired based on the signal from the encoder (not shown) of each servomotor.

(攝像部及同心圓照明部之構成) 如圖2所示，攝像部31具有物鏡(前透鏡(front lens))31a、成像透鏡31b及攝像元件31c。物鏡31a係於攝像部31中配置於最靠近檢查對象P1側(物體側)之位置之透鏡。又，物鏡31a係作為遠心透鏡而設置，此種遠心透鏡係於攝像元件31c側(圖像側)，通過物鏡31a之光之主光線與物鏡31a之光軸大致平行。成像透鏡31b構成為使通過物鏡31a之光線成像。物鏡31a及成像透鏡31b設置於鏡筒31d內。攝像元件31c例如包含CMOS(Complementary Metal-Oxide Semiconductor，互補金氧半導體)影像感測器，構成為接收通過物鏡31a及成像透鏡31b之光線，並將其轉換成電信號。攝像部31具有遠心光學系統。 (Constitution of imaging unit and concentric circle illumination unit) As shown in FIG. 2 , the imaging unit 31 includes an objective lens (front lens) 31a, an imaging lens 31b, and an imaging element 31c. The objective lens 31a is a lens arranged at the position closest to the inspection object P1 side (object side) in the imaging unit 31 . Further, the objective lens 31a is provided as a telecentric lens which is on the imaging element 31c side (image side), and the chief ray of light passing through the objective lens 31a is substantially parallel to the optical axis of the objective lens 31a. The imaging lens 31b is configured to image the light passing through the objective lens 31a. The objective lens 31a and the imaging lens 31b are provided in the lens barrel 31d. The imaging element 31c includes, for example, a CMOS (Complementary Metal-Oxide Semiconductor) image sensor, and is configured to receive the light passing through the objective lens 31a and the imaging lens 31b and convert it into an electrical signal. The imaging unit 31 has a telecentric optical system.

同心圓照明部32具有同心圓光源部32a、照射透鏡32b及半反射鏡32c。同心圓光源部32a構成為發出呈同心圓狀配置有紅色、綠色及藍色之RGB同心圓光。RGB同心圓光包含大致圓形狀之第1色光、以包圍大致圓形狀之第1色光之外周的方式配置之大致環狀之第2色光、以及以包圍大致環狀之第2色光之外周的方式配置之大致環狀之第3色光。第1色光、第2色光及第3色光係從中心側朝向外周側依序配置。再者，RGB同心圓光中之紅色、綠色及藍色之配置順序並無特別限制，於第1～第4實施方式中，為方便起見，對從中心側朝向外周側依序配置有紅色、綠色及藍色之例進行說明。The concentric circle illumination unit 32 includes a concentric circle light source unit 32a, an illumination lens 32b, and a half mirror 32c. The concentric circle light source portion 32a is configured to emit RGB concentric circle lights in which red, green, and blue are arranged concentrically. The RGB concentric circle light includes a substantially circular first color light, a substantially annular second color light arranged so as to surround the outer periphery of the substantially circular first color light, and a substantially annular second color light arranged so as to surround the substantially circular outer periphery The roughly annular third color light. The first color light, the second color light, and the third color light are arranged in this order from the center side toward the outer peripheral side. Furthermore, the order of arrangement of red, green, and blue in the RGB concentric circles of light is not particularly limited. In the first to fourth embodiments, for the sake of convenience, red, Examples of green and blue will be explained.

參照圖3(A)(B)，說明同心圓光源部32a之第1構成例。如圖3(A)(B)所示，第1構成例之同心圓光源部32a包含呈同心圓狀配置之紅色光源61、綠色光源62及藍色光源63。紅色光源61配置於最中心側，構成為發出大致圓形狀之紅色光。紅色光源61包含複數個(圖3(B)中為4個)紅色LED。綠色光源62配置於中間位置，構成為發出大致環狀之綠色光。綠色光源62包含複數個(圖3(B)中為16個)綠色LED。藍色光源63配置於最外周側，構成為發出大致環狀之藍色光。藍色光源63包含複數個(圖3(B)中為32個)藍色LED。3(A) and (B), a first configuration example of the concentric circle light source portion 32a will be described. As shown in FIG.3(A)(B), the concentric circle light source part 32a of the 1st structural example contains the red light source 61, the green light source 62, and the blue light source 63 which are concentrically arranged. The red light source 61 is arranged on the most central side, and is configured to emit substantially circular red light. The red light source 61 includes a plurality of (four in FIG. 3(B) ) red LEDs. The green light source 62 is arranged in the middle position, and is configured to emit green light in a substantially annular shape. The green light source 62 includes a plurality of (16 in FIG. 3(B) ) green LEDs. The blue light source 63 is arranged on the outermost peripheral side, and is configured to emit substantially annular blue light. The blue light source 63 includes a plurality of (32 in FIG. 3(B) ) blue LEDs.

又，第1構成例之同心圓光源部32a中，於各色光源(61、62、63)之光出射方向之前方設置有擴散板64，並且於各色光源(61、62、63)之間設置有間隔板65。擴散板64構成為使從光源(61、62、63)出射之光擴散。間隔板65係為了防止相鄰光源之光(顏色)混合，而以將相鄰光源之間區隔開之方式配置。藉由該等構成，第1構成例之同心圓光源部32a構成為能夠發出RGB同心圓光。In addition, in the concentric circle light source portion 32a of the first configuration example, the diffusing plate 64 is provided in front of the light emission direction of the respective color light sources (61, 62, 63), and is provided between the respective color light sources (61, 62, 63) There is a partition plate 65 . The diffusing plate 64 is configured to diffuse light emitted from the light sources (61, 62, 63). The spacer 65 is arranged so as to partition the adjacent light sources in order to prevent the light (color) of the adjacent light sources from being mixed. With these configurations, the concentric light source portion 32a of the first configuration example is configured to emit RGB concentric lights.

參照圖4(A)(B)，說明同心圓光源部32a之第2構成例。如圖4(A)(B)所示，第2構成例之同心圓光源部32a包含白色光源71、及配置於與白色光源71對向之位置之RGB同心圓彩色濾光片72。白色光源71構成為發出大致圓形狀之白色光。白色光源71包含複數個(圖4(B)中為17個)白色LED。同心圓彩色濾光片72包含呈同心圓狀配置之紅色濾光片72a、綠色濾光片72b及藍色濾光片72c。紅色濾光片72a配置於最中心側，構成為選擇性地使紅色光透過。紅色濾光片72a具有大致圓形狀，構成為使大致圓形狀之紅色光透過。紅色濾光片72a例如由紅色之賽璐凡(cellophane)構成。綠色濾光片72b配置於中間位置，構成為選擇性地使綠色光透過。綠色濾光片72b具有大致環形狀，構成為使大致環狀之綠色光透過。綠色濾光片72b例如由綠色之賽璐凡構成。藍色濾光片72c配置於最外周側，構成為選擇性地使藍色光透過。藍色濾光片72c具有大致環形狀，構成為使大致環狀之藍色光透過。藍色濾光片72c例如由藍色之賽璐凡構成。4(A) and (B), a second configuration example of the concentric circle light source portion 32a will be described. As shown in FIGS. 4(A) and 4(B) , the concentric circle light source portion 32 a of the second configuration example includes a white light source 71 and RGB concentric circle color filters 72 arranged in a position opposite to the white light source 71 . The white light source 71 is configured to emit substantially circular white light. The white light source 71 includes a plurality of (17 in FIG. 4(B) ) white LEDs. The concentric color filter 72 includes a red filter 72a, a green filter 72b, and a blue filter 72c which are arranged in a concentric circle. The red filter 72a is arranged on the most central side, and is configured to selectively transmit red light. The red filter 72a has a substantially circular shape, and is configured to transmit the substantially circular red light. The red filter 72a is made of, for example, red cellophane. The green filter 72b is arranged at an intermediate position, and is configured to selectively transmit green light. The green filter 72b has a substantially annular shape, and is configured to transmit the substantially annular green light. The green filter 72b is made of, for example, green cellophane. The blue color filter 72c is arranged on the outermost peripheral side, and is configured to selectively transmit blue light. The blue filter 72c has a substantially annular shape, and is configured to transmit substantially annular blue light. The blue color filter 72c is made of, for example, blue cellophane.

又，第2構成例之同心圓光源部32a中，於白色光源71與同心圓彩色濾光片72之間設置有擴散板73。擴散板73構成為使從白色光源71出射之光擴散。藉由該等構成，第2構成例之同心圓光源部32a構成為能夠發出RGB同心圓光。Further, in the concentric light source portion 32 a of the second configuration example, the diffusion plate 73 is provided between the white light source 71 and the concentric color filter 72 . The diffuser plate 73 is configured to diffuse the light emitted from the white light source 71 . With these configurations, the concentric light source portion 32a of the second configuration example is configured to emit RGB concentric light.

如圖2所示，照射透鏡32b設置於同心圓光源部32a與檢查對象P1之間，構成為從同心圓光源部32a照射RGB同心圓光。照射透鏡32b係作為遠心透鏡而設置，此種遠心透鏡係於檢查對象P1側(物體側)，通過照射透鏡32b之光(來自同心圓光源部32a之RGB同心圓光)之主光線與照射透鏡32b之光軸大致平行。對檢查對象P1照射主光線與照射透鏡32b之光軸大致平行之RGB同心圓光。又，同心圓光源部32a配置於與照射透鏡32b隔開和照射透鏡32b之焦點距離相應之程度之位置，以對檢查對象P1照射主光線與照射透鏡32b之光軸大致平行之RGB同心圓光。As shown in FIG. 2, the irradiation lens 32b is provided between the concentric circle light source part 32a and the inspection object P1, and is comprised so that RGB concentric circle light is irradiated from the concentric circle light source part 32a. The irradiation lens 32b is provided as a telecentric lens, and this telecentric lens is located on the inspection object P1 side (object side), and passes the chief ray of the light of the irradiation lens 32b (RGB concentric light from the concentric light source portion 32a) and the irradiation lens 32b. The optical axes are roughly parallel. The inspection object P1 is irradiated with RGB concentric circular lights whose chief rays are substantially parallel to the optical axis of the irradiation lens 32b. Further, the concentric circle light source portion 32a is arranged at a position spaced apart from the irradiation lens 32b by a distance corresponding to the focal distance of the irradiation lens 32b, and irradiates the inspection object P1 with RGB concentric circle lights whose chief rays are substantially parallel to the optical axis of the irradiation lens 32b.

半反射鏡32c設置於照射透鏡32b與檢查對象P1之間，構成為被照射通過照射透鏡32b之RGB同心圓光。半反射鏡32c構成為藉由使RGB同心圓光反射，而改變RGB同心圓光之前進方向，藉此對檢查對象P1照射RGB同心圓光。又，半反射鏡32c構成為藉由使經檢查對象P1反射之RGB同心圓光透過，而由攝像部31之攝像元件31c接收光。同心圓照明部32具有遠心光學系統，並且作為對檢查對象P1照射與攝像部31之光軸大致同軸之光(RGB同心圓光)之同軸照明發揮功能。又，以RGB同心圓光之直徑之中心(同心圓光源部32a之直徑之中心)、照射透鏡32b之光軸及攝像部31之攝像透鏡(物鏡31a、成像透鏡31b)之光軸大致一致之方式對準。The half mirror 32c is provided between the irradiation lens 32b and the inspection object P1, and is configured to be irradiated with RGB concentric circles of light passing through the irradiation lens 32b. The half mirror 32c is configured to irradiate the inspection object P1 with the RGB concentric light by changing the advancing direction of the RGB concentric light by reflecting the RGB concentric light. In addition, the half mirror 32c is configured to receive the light by the imaging element 31c of the imaging unit 31 by transmitting the RGB concentric circle light reflected by the inspection object P1. The concentric circle illumination unit 32 has a telecentric optical system, and functions as coaxial illumination for irradiating the inspection object P1 with light (RGB concentric circle light) substantially coaxial with the optical axis of the imaging unit 31 . In addition, the center of the diameter of the RGB concentric circle light (the center of the diameter of the concentric circle light source portion 32a), the optical axis of the irradiation lens 32b, and the optical axis of the imaging lens (objective lens 31a, imaging lens 31b) of the imaging portion 31 are substantially identical. alignment.

藉由該等構成，如圖5所示，同心圓照明部32構成為對檢查對象P1之檢查面之各點，照射主光線與照射透鏡32b之光軸大致平行之RGB同心圓光。又，同心圓照明部32構成為對檢查對象P1未傾斜時之檢查對象P1之檢查面(大致水平之檢查面)，照射主光線大致垂直之RGB同心圓光。再者，於圖5中，為了更容易理解，省略了半反射鏡32c之圖示。With these configurations, as shown in FIG. 5 , the concentric circle illumination unit 32 is configured to irradiate RGB concentric circles of light whose chief ray is substantially parallel to the optical axis of the irradiation lens 32b to each point on the inspection surface of the inspection object P1. The concentric circle illumination unit 32 is configured to irradiate the inspection surface (substantially horizontal inspection surface) of the inspection object P1 when the inspection object P1 is not inclined, and irradiate RGB concentric circle lights whose chief rays are substantially vertical. Furthermore, in FIG. 5 , the illustration of the half mirror 32 c is omitted for easier understanding.

此處，本實施方式中，安裝基板檢查裝置100之控制裝置40構成為進行以下控制：基於攝像部31對藉由同心圓照明部32照射了RGB同心圓光之檢查對象P1之拍攝結果，獲取檢查對象P1之傾斜角度，並且基於所獲取之檢查對象P1之傾斜角度，對檢查對象P1之狀態進行檢查。Here, in the present embodiment, the control device 40 of the mounted board inspection apparatus 100 is configured to perform control to acquire inspection based on the imaging result of the imaging unit 31 on the inspection object P1 irradiated with RGB concentric light by the concentric illumination unit 32 The inclination angle of the object P1, and based on the acquired inclination angle of the inspection object P1, the state of the inspection object P1 is inspected.

(傾斜角度之獲取原理) 參照圖6及圖7，說明利用RGB同心圓光獲取傾斜角度之原理。 (The principle of obtaining the tilt angle) Referring to FIG. 6 and FIG. 7 , the principle of using RGB concentric circle light to obtain the tilt angle will be described.

圖6表示由攝像部31形成之觀察立體角O、與由同心圓照明部32形成之照射立體角I之包含關係。此處，所謂觀察立體角O，表示攝像部31對檢查對象P1之檢查面之各點之拍攝範圍(受光範圍)，可表示為以檢查面之各點為頂點之錐體。又，所謂照射立體角I，表示照射光(RGB同心圓光)對檢查對象P1之檢查面之各點之照射範圍，可表示為以檢查面之各點為頂點之錐體。又，照射光之反射光亦可利用與照射光相同之照射立體角I表示。所謂由攝像部31接收光(拍攝)，係指照射立體角I之反射光中之包含於觀察立體角O之部分(與觀察立體角O重疊之部分)。FIG. 6 shows the inclusive relationship between the observation solid angle O formed by the imaging unit 31 and the irradiation solid angle I formed by the concentric illumination unit 32 . Here, the observation solid angle O represents the imaging range (light-receiving range) of each point on the inspection surface of the inspection object P1 by the imaging unit 31 , and can be represented as a cone with each point on the inspection surface as an apex. In addition, the irradiation solid angle I represents the irradiation range of the irradiation light (RGB concentric circle light) to each point of the inspection surface of the inspection object P1, and can be expressed as a cone with each point of the inspection surface as the vertex. In addition, the reflected light of the irradiation light can also be represented by the irradiation solid angle I which is the same as that of the irradiation light. The light received (photographed) by the imaging unit 31 refers to the portion included in the observation solid angle O (the portion overlapping the observation solid angle O) of the reflected light irradiating the solid angle I.

此處，當檢查對象P1之檢查面未傾斜時(檢查面水平時)，若照射光於檢查對象P1之檢查面上正反射，則反射光(正反射光)與照射光一致。另一方面，當檢查對象P1之檢查面以傾斜角度θb傾斜時，若照射光於檢查對象P1之檢查面正反射，則反射光(正反射光)向相對於檢查對象P1之檢查面之法線與照射光對稱之方向(從照射光以傾斜角度2θb傾斜後之方向)反射。於該情形時，觀察立體角O與反射光之照射立體角I之包含關係發生變化。藉此，由攝像部31接收(拍攝)到之RGB各顏色之明度發生變化。Here, when the inspection surface of the inspection object P1 is not inclined (when the inspection surface is horizontal), if the irradiated light is regularly reflected on the inspection surface of the inspection object P1, the reflected light (regular reflection light) matches the irradiated light. On the other hand, when the inspection surface of the inspection object P1 is inclined at the inclination angle θb, if the irradiated light is specularly reflected on the inspection surface of the inspection object P1, the reflected light (regular reflection light) is directed toward the inspection surface of the inspection object P1. The line is reflected in a direction symmetrical to the irradiated light (direction from which the irradiated light is inclined at an inclination angle 2θb). In this case, the inclusion relationship between the observation solid angle O and the irradiation solid angle I of the reflected light changes. Thereby, the lightness of each color of RGB received (photographed) by the imaging unit 31 changes.

圖7係表示與檢查對象P1之檢查面之傾斜角度對應之RGB各顏色之明度變化的曲線圖。圖7之曲線圖中，縱軸表示明度(256灰階)，橫軸表示檢查對象P1之檢查面之傾斜角度。根據圖7之曲線圖可得出，RGB各顏色之明度根據檢查對象P1之檢查面之傾斜角度而連續變化。具體而言，當檢查對象P1之檢查面之傾斜角度較小時，紅色(R)之比率大於綠色(G)及藍色(B)。其後，隨著檢查對象P1之檢查面之傾斜角度變為中等程度，紅色(R)之比率逐漸變小，同時綠色(G)之比率逐漸變大。其後，隨著檢查對象P1之檢查面之傾斜角度進一步變大，綠色(G)之比率逐漸變小，同時藍色(B)之比率逐漸變大。FIG. 7 is a graph showing changes in lightness of each color of RGB in accordance with the inclination angle of the inspection surface of the inspection object P1. In the graph of FIG. 7 , the vertical axis represents lightness (256 gradations), and the horizontal axis represents the inclination angle of the inspection surface of the inspection object P1. According to the graph of FIG. 7, it can be seen that the brightness of each color of RGB changes continuously according to the inclination angle of the inspection surface of the inspection object P1. Specifically, when the inclination angle of the inspection surface of the inspection object P1 is small, the ratio of red (R) is larger than that of green (G) and blue (B). Thereafter, as the inclination angle of the inspection surface of the inspection object P1 becomes moderate, the ratio of red (R) gradually becomes smaller, and the ratio of green (G) gradually becomes larger. Then, as the inclination angle of the inspection surface of the inspection object P1 becomes larger, the ratio of green (G) gradually becomes smaller, and the ratio of blue (B) becomes larger gradually.

因此，能夠利用攝像部31之拍攝結果中之RGB各顏色之明度變化，獲取檢查對象P1之檢查面之傾斜角度。具體而言，能夠利用攝像部31之拍攝結果中之RGB之比率變化，獲取檢查對象P1之檢查面之傾斜角度。Therefore, it is possible to obtain the inclination angle of the inspection surface of the inspection object P1 by using the change in the brightness of each color of RGB in the photographing result of the imaging unit 31 . Specifically, the inclination angle of the inspection surface of the inspection object P1 can be acquired by utilizing the change in the ratio of RGB in the imaging result of the imaging unit 31 .

(立體角之設計例) 其次，參照圖8(A)～(C)，說明觀察立體角O與照射立體角I之設計例。 (Design example of solid angle) Next, a design example of the observation solid angle O and the irradiation solid angle I will be described with reference to FIGS. 8(A) to (C).

如圖8(A)所示，觀察立體角O之值可利用以下之式(1)及(2)求出。 NA＝M/2Fe        ・・・(1) θw＝arcsin(NA)       ・・・(2) 此處， NA：攝像透鏡(物鏡)之物體側數值孔徑 M：攝像元件之拍攝倍率 Fe：攝像透鏡(物鏡)之實效F數值 θw：觀察立體角之值。 As shown in FIG. 8(A), the value of the observation solid angle O can be obtained by the following equations (1) and (2). NA=M/2Fe ・・・(1) θw=arcsin(NA) ・・・(2) here, NA: object-side numerical aperture of the imaging lens (objective) M: The shooting magnification of the camera element Fe: Effective F value of the imaging lens (objective) θw: The value of the observed solid angle.

例如，當拍攝倍率M為0.45，執行F數值Fe為14.7時，數值孔徑NA為約0.015306(0.45/(2×14.7))。於該情形時，觀察立體角O之值θw為約0.88度(arcsin(0.015306))。For example, when the shooting magnification M is 0.45 and the execution F number Fe is 14.7, the numerical aperture NA is about 0.015306 (0.45/(2×14.7)). In this case, the value θw of the observed solid angle O is about 0.88 degrees (arcsin(0.015306)).

如圖8(B)所示，照射立體角I之值可利用以下之式(3)～(5)求出。 F＝f/Φ                ・・・(3) NA＝1/2F           ・・・(4) θL＝arcsin(NA)        ・・・(5) 此處， F：照射透鏡之F數值 f：照射透鏡之焦點距離 Φ：同心圓光源部之最大直徑 NA：照射透鏡之數值孔徑 θL：照射立體角之值(最大值)。 As shown in FIG. 8(B), the value of the irradiation solid angle I can be obtained by the following equations (3) to (5). F=f/Φ     ・・・(3) NA＝1/2F・・・(4) θL=arcsin(NA) ・・・(5) here, F: F value of the irradiating lens f: The focal length of the irradiating lens Φ: Maximum diameter of concentric circle light source NA: Numerical aperture of the illumination lens θL: The value (maximum value) of the irradiation solid angle.

例如，當焦點距離f為208.2 mm，最大直徑Φ為26 mm時，F數值F為約8.007692(208.2/26)。於該情形時，數值孔徑NA為約0.06244(1/(2×8.007692))。又，照射立體角I之值θL為約3.58度(arcsin(0.06244))。For example, when the focal distance f is 208.2 mm and the maximum diameter Φ is 26 mm, the F-number F is about 8.007692 (208.2/26). In this case, the numerical aperture NA is about 0.06244 (1/(2×8.007692)). In addition, the value θL of the irradiation solid angle I is about 3.58 degrees (arcsin(0.06244)).

又，RGB各顏色之照射立體角I之值可利用以下之式(6)～(8)求出。 θz＝θL×Φz/Φx         ・・・(6) θy＝θL×Φy/Φx－θz       ・・・(7) θx＝θL－(θy＋θz)          ・・・(8) 此處， θz：中心之顏色之照射立體角之值 θy：中間之顏色之照射立體角之值 θx：最外周之顏色之照射立體角之值 θL：照射立體角之值(最大值) Φz：中心之顏色之光源之最外徑 Φy：中間之顏色之光源之最外徑 Φx：最外周之顏色之光源之最外徑。 In addition, the value of the irradiation solid angle I of each color of RGB can be calculated|required by the following formulas (6)-(8). θz＝θL×Φz/Φx・・・(6) θy＝θL×Φy/Φx－θz・・・(7) θx＝θL－(θy＋θz)・・・(8) here, θz: The value of the solid angle of illumination of the color in the center θy: The value of the solid angle of illumination of the color in the middle θx: The value of the solid angle of illumination of the outermost color θL: The value of the irradiation solid angle (maximum value) Φz: the outermost diameter of the light source of the color in the center Φy: the outermost diameter of the light source of the middle color Φx: the outermost diameter of the light source of the outermost color.

例如，當照射立體角I之最大值θL為約3.58度，中心之顏色(第1實施方式中為紅色)之光源之最外徑Φz為8.6 mm，中間之顏色(第1實施方式中為綠色)之光源之最外徑Φy為17.4 mm，最外周之顏色(第1實施方式中為藍色)之光源之最外徑Φx為26 mm時，中心之顏色之照射立體角I之值θx為約1.18度(3.58×8.6/26)，中間之顏色之照射立體角I之值θy為約1.21度(3.58×17.4/26－1.18)，最外周之顏色之照射立體角I之值θx為約1.19度(3.58－(1.21＋1.18))。各顏色之照射立體角I之值能夠基於各色光源之最外徑來設定。For example, when the maximum value θL of the irradiation solid angle I is about 3.58 degrees, the outermost diameter Φz of the light source of the color in the center (red in the first embodiment) is 8.6 mm, and the color in the middle (green in the first embodiment) When the outermost diameter Φy of the light source of ) is 17.4 mm, and the outermost diameter Φx of the light source of the outermost color (blue in the first embodiment) is 26 mm, the value θx of the irradiation solid angle I of the color in the center is About 1.18 degrees (3.58×8.6/26), the value θy of the irradiation solid angle I of the middle color is about 1.21 degrees (3.58×17.4/26-1.18), and the value θx of the irradiation solid angle I of the outermost color is about 1.19 degrees (3.58-(1.21+1.18)). The value of the irradiation solid angle I of each color can be set based on the outermost diameter of each color light source.

如圖8(C)所示，包含極限角度(見圖6)可利用以下之式(9)求出。包含極限角度係觀察立體角O不包含反射光之照射立體角I時之觀察立體角O之光軸與反射光之照射立體角I之光軸所成之角度。又，包含極限角度之情形時之檢查對象P1之檢查面之傾斜角度可利用以下之式(10)求出。 θe＝θw＋θL        ・・・(9) θb＝θe/2       ・・・(10) 此處， θe：包含極限角度 θw：觀察立體角之值 θL：照射立體角之值 θb：包含極限角度之情形時之檢查對象之檢查面之傾斜角度。 As shown in Fig. 8(C), the inclusion limit angle (see Fig. 6) can be obtained by the following equation (9). Including the limit angle is the angle formed by the optical axis of the observation solid angle O when the observation solid angle O does not include the irradiation solid angle I of the reflected light and the optical axis of the irradiation solid angle I of the reflected light. In addition, the inclination angle of the inspection surface of the inspection object P1 when the limit angle is included can be calculated|required by the following formula (10). θe＝θw＋θL・・・(9) θb＝θe/2・・・(10) here, θe: including the limit angle θw: the value of the observation solid angle θL: The value of the irradiation solid angle θb: The inclination angle of the inspection surface of the inspection object when the limit angle is included.

例如，當觀察立體角O之值θw為約0.88度，照射立體角I之值θL為約3.58度時，包含極限角度θe為約4.46度(0.88＋3.58)。又，包含極限角度θe之情形時之檢查對象P1之檢查面之傾斜角度θb為約2.23度(4.46/2)。於該情形時，利用觀察立體角O與照射立體角I之包含關係能夠測定之檢查對象P1之檢查面之傾斜角度的範圍為0度～約2.23度。For example, when the value θw of the observation solid angle O is about 0.88 degrees and the value θL of the irradiation solid angle I is about 3.58 degrees, the inclusive limit angle θe is about 4.46 degrees (0.88+3.58). In addition, the inclination angle θb of the inspection surface of the inspection object P1 when the limit angle θe is included is about 2.23 degrees (4.46/2). In this case, the range of the inclination angle of the inspection surface of the inspection object P1 that can be measured by the inclusion relationship between the observation solid angle O and the irradiation solid angle I is 0 degrees to about 2.23 degrees.

根據上述內容可得出，藉由依照需要測定之角度範圍，設定觀察立體角O之值θw及照射立體角I之值θL，能夠於需要之角度範圍內，測定檢查對象P1之檢查面之傾斜角度。From the above, it can be concluded that by setting the value θw of the observation solid angle O and the value θL of the irradiation solid angle I according to the angle range to be measured, the inclination of the inspection surface of the inspection object P1 can be measured within the required angle range angle.

(檢查對象之檢查) 其次，參照圖9～圖11，說明利用RGB同心圓光進行之檢查對象P1之檢查。 (Inspection of inspection object) Next, the inspection of the inspection object P1 using RGB concentric circle light will be described with reference to FIGS. 9 to 11 .

本實施方式中，控制裝置40構成為進行以下控制，即，使攝像部31拍攝照射了RGB同心圓光之檢查對象P1(安裝基板P)。又，控制裝置40構成為獲取攝像部31對照射了RGB同心圓光之檢查對象P1的拍攝結果。又，控制裝置40構成為基於所獲取之拍攝結果，獲取拍攝結果中之檢查對象P1之紅色、綠色及藍色各顏色之明度(RGB之明度)。又，控制裝置40構成為基於所獲取之RGB各顏色之明度，獲取拍攝結果中之檢查對象P1之紅色、綠色及藍色之比率即RGB比率。又，控制裝置40構成為基於所獲取之檢查對象P1之RGB比率，獲取檢查對象P1之傾斜角度。具體而言，控制裝置40構成為基於檢查對象P1之RGB比率、及將預先獲取之RGB比率換算成傾斜角度之換算資訊42a，來獲取檢查對象P1之傾斜角度。In the present embodiment, the control device 40 is configured to perform control such that the imaging unit 31 images the inspection object P1 (the mounting substrate P) to which the RGB concentric lights are irradiated. Moreover, the control apparatus 40 is comprised so that the imaging|photography result of the imaging|photography part 31 of the inspection object P1 irradiated with RGB concentric circle light may be acquired. Furthermore, the control device 40 is configured to acquire the lightness of each of the red, green, and blue colors (RGB lightness) of the inspection object P1 in the photographing result based on the obtained photographing result. Furthermore, the control device 40 is configured to acquire the ratio of red, green, and blue of the inspection object P1 in the photographing result, that is, the RGB ratio, based on the acquired lightness of each color of RGB. Moreover, the control apparatus 40 is comprised so that the inclination angle of the inspection object P1 may be acquired based on the acquired RGB ratio of the inspection object P1. Specifically, the control device 40 is configured to acquire the inclination angle of the inspection object P1 based on the RGB ratio of the inspection object P1 and the conversion information 42a for converting the RGB ratio acquired in advance into the inclination angle.

如圖9所示，換算資訊42a係將RGB比率換算成傾斜角度之換算表。於換算資訊42a中，RGB比率與傾斜角度建立了對應。具體而言，於換算資訊42a中，傾斜角度與每個特定之RGB比率範圍建立了對應。再者，圖9中，為方便起見，僅圖示了特定之RGB比率範圍之中心值。控制裝置40構成為，於所獲取之檢查對象P1之RGB比率處於特定之RGB比率範圍內之情形時，從換算資訊42a獲取與特定出之RGB比率範圍建立了對應之傾斜角度，作為檢查對象P1之傾斜角度。換算資訊42a被預先獲取並記憶於記憶部42中。再者，換算資訊42a之獲取方法之詳細情況將於下文敍述。As shown in FIG. 9, the conversion information 42a is a conversion table for converting the RGB ratio into the tilt angle. In the conversion information 42a, the RGB ratios are associated with the tilt angles. Specifically, in the conversion information 42a, the tilt angle corresponds to each specific RGB ratio range. Furthermore, in FIG. 9 , for the sake of convenience, only the center value of a specific RGB ratio range is shown. The control device 40 is configured to acquire, from the conversion information 42a, the inclination angle corresponding to the specified RGB ratio range as the inspection object P1 when the RGB ratio of the acquired inspection object P1 is within a specific RGB ratio range. the inclination angle. The conversion information 42a is acquired in advance and stored in the memory unit 42 . Furthermore, the details of the acquisition method of the conversion information 42a will be described below.

如圖10及圖11所示，控制裝置40構成為進行以下控制，即，基於檢查對象P1之傾斜角度，對作為檢查對象P1之安裝基板P上之零件E進行檢查。As shown in FIGS. 10 and 11 , the control device 40 is configured to perform control to inspect the components E on the mounting board P as the inspection object P1 based on the inclination angle of the inspection object P1.

具體而言，如圖10所示，控制裝置40構成為進行以下控制，即，基於檢查對象P1之傾斜角度，檢測傾斜角度之變化點(傾斜角度之變化邊界)作為裂縫。藉此，控制裝置40構成為進行以下控制，即，基於檢查對象P1之傾斜角度，對作為半導體晶圓晶片(所謂之晶粒)之零件E之裂縫進行檢測。控制裝置40構成為進行以下控制，即，於傾斜角度之變化為基準值以上之情形時，檢測傾斜角度之變化點作為裂縫。Specifically, as shown in FIG. 10 , the control device 40 is configured to perform control to detect a change point of the inclination angle (a change boundary of the inclination angle) as a crack based on the inclination angle of the inspection object P1. Thereby, the control apparatus 40 is comprised so that it may perform control to detect the crack of the component E which is a semiconductor wafer (so-called die) based on the inclination angle of the inspection object P1. The control device 40 is configured to perform control such that, when the change in the inclination angle is equal to or greater than the reference value, the point of change in the inclination angle is detected as a crack.

圖10係照射RGB同心圓光所拍攝到之產生了裂縫之零件E之模式圖。於照射RGB同心圓光而拍攝零件E之情形時，通常會因裂縫兩側之傾斜角度不同，而獲得拍攝到之裂縫兩側呈現附著有RGB比率不同之顏色之面的拍攝結果。圖10中，圖示了拍攝到之裂縫一側為附有藍色系顏色之面，裂縫另一側為附有綠色系顏色之面之例。於該情形時，附有藍色系顏色之面與附有綠色系顏色之面的邊界成為傾斜角度之變化點，因此檢測為裂縫。再者，圖10中，為了更容易理解，圖示了裂縫兩側為不同系統之顏色之例，但即便為裂縫兩側為同一系統之顏色(藍色系顏色彼此等)，只要存在基準值以上之傾斜角度之變化，便能夠檢測為裂縫。FIG. 10 is a schematic view of the part E with cracks, photographed by irradiating RGB concentric circle light. When the part E is photographed by irradiating RGB concentric circles of light, usually due to the different inclination angles on both sides of the crack, a photographing result is obtained in which the two sides of the crack are photographed with colors with different RGB ratios attached. In FIG. 10 , an example is shown in which one side of the crack is a surface with a blue color, and the other side of the crack is a surface with a green color. In this case, the boundary between the blue-colored surface and the green-colored surface becomes a point of change in the inclination angle, so it is detected as a crack. Furthermore, in Fig. 10, for easier understanding, an example of the color of different systems on both sides of the crack is shown, but even if the two sides of the crack are the color of the same system (blue colors are mutual, etc.), as long as there is a reference value The above change in the inclination angle can be detected as a crack.

又，如圖11所示，控制裝置40構成為進行以下控制，即，基於檢查對象P1之傾斜角度，檢測安裝基板P上之零件E之隆起。此處，於利用RGB同心圓光之情形時，可獲取傾斜角度，另一方面，傾斜方向未知。因此，難以區分因安裝基板P上之零件E產生隆起而獲得零件E之傾斜角度的情況、與儘管零件E未產生隆起但因安裝基板P本身傾斜而獲得零件E之傾斜角度的情況。Moreover, as shown in FIG. 11, the control apparatus 40 is comprised so that it may perform the control which detects the protrusion of the component E on the mounting board|substrate P based on the inclination angle of the inspection object P1. Here, in the case of using RGB concentric circle light, the tilt angle can be obtained, on the other hand, the tilt direction is unknown. Therefore, it is difficult to distinguish the case where the inclination angle of the component E is obtained because the component E on the mounting board P is raised, and the case where the inclination angle of the component E is obtained because the mounting board P itself is tilted although the component E does not have the protrusion.

因此，本實施方式中，控制裝置40構成為進行以下控制，即，根據檢查對象P1之傾斜角度及檢查對象P1之高度資訊，檢測安裝基板P上之零件E之隆起(檢查對象P1之狀態)，上述檢查對象P1之傾斜角度係基於攝像部31對照射了RGB同心圓光之檢查對象P1的拍攝結果所得，上述檢查對象P1之高度資訊係利用三維計測部34所得。Therefore, in the present embodiment, the control device 40 is configured to perform control to detect the bulge of the component E on the mounting board P (the state of the inspection object P1) based on the inclination angle of the inspection object P1 and the height information of the inspection object P1. The inclination angle of the inspection object P1 is obtained based on the result of photographing the inspection object P1 irradiated with RGB concentric circle light by the imaging unit 31 , and the height information of the inspection object P1 is obtained by the three-dimensional measuring unit 34 .

具體而言，控制裝置40構成為基於利用三維計測部34所得之檢查對象P1之高度資訊，獲取安裝基板P之傾斜方向及傾斜角度、以及零件E之傾斜方向。而且，控制裝置40構成為，於考慮使用三維計測部34所獲取之安裝基板P之傾斜方向及零件E之傾斜方向之情況下，獲取使用三維計測部34所獲取之安裝基板P之傾斜角度、與使用RGB同心圓光所獲取之零件E之傾斜角度的角度差。而且，控制裝置40構成為進行以下控制，即，於所獲取之角度差為基準值以上之情形時，視為檢測出產生了安裝基板P上之零件E之隆起。再者，本構成無法充分地獲得散射光，因此對於某些零件E(半導體晶圓晶片等)之隆起之檢測尤其有效，例如具有藉由使用散射光進行計測之三維計測部34難以準確地計測傾斜角度之鏡面的零件E(半導體晶圓晶片等)。又，由於安裝基板P通常能夠獲得足夠之散射光，因此能夠藉由三維計測部34計測傾斜方向及傾斜角度。又，關於零件E之傾斜方向，於無法獲取充分之散射光之情形時，亦能藉由三維計測部34進行計測。Specifically, the control device 40 is configured to acquire the inclination direction and inclination angle of the mounting board P, and the inclination direction of the components E based on the height information of the inspection object P1 obtained by the three-dimensional measurement unit 34 . In addition, the control device 40 is configured to acquire the inclination angle of the mounting board P acquired by the three-dimensional measurement unit 34, The angle difference with the inclination angle of the part E obtained by using RGB concentric circle light. And the control apparatus 40 is comprised so that it may detect that the raised part of the component E on the mounting board P has arisen when the acquired angle difference is more than a reference value. Furthermore, this configuration cannot obtain sufficient scattered light, so it is particularly effective for detecting the bumps of some parts E (semiconductor wafers, etc.), for example, with the three-dimensional measuring unit 34 that measures by using scattered light, it is difficult to measure accurately. Part E (semiconductor wafer, etc.) of the mirror surface of the inclined angle. Moreover, since the mounting board P can usually obtain sufficient scattered light, the three-dimensional measurement unit 34 can measure the inclination direction and the inclination angle. Moreover, the inclination direction of the component E can also be measured by the three-dimensional measurement unit 34 when sufficient scattered light cannot be obtained.

(表格獲取處理) 其次，參照圖12及圖13，基於流程圖說明利用第1實施方式之安裝基板檢查裝置100進行之表格獲取處理。再者，表格獲取處理係於利用安裝基板檢查裝置100進行檢查對象P1之檢查之前進行。又，流程圖之各處理可藉由控制裝置40進行，亦可由作業人員進行。 (Form acquisition processing) Next, referring to FIGS. 12 and 13 , the table acquisition process performed by the mounted board inspection apparatus 100 of the first embodiment will be described based on a flowchart. In addition, the table acquisition process is performed before the inspection of the inspection object P1 by the mounted board|substrate inspection apparatus 100. In addition, each process of a flowchart may be performed by the control apparatus 40, and may be performed by an operator.

又，如圖13所示，使用專門用於獲取換算資訊42a之治具J進行表格獲取處理。治具J係不具有色相之平板。例如，作為治具J，可採用鏡面之鋁製平板。Furthermore, as shown in FIG. 13, table acquisition processing is performed using a jig J exclusively for acquiring conversion information 42a. Jig J is a flat plate without hue. For example, as the jig J, a mirror-finished aluminum plate can be used.

如圖12及圖13所示，首先，於步驟S1中，獲取攝像部31對藉由同心圓照明部32照射了RGB同心圓光之治具J之拍攝結果。於第一次步驟S1中，治具J被設定為水平狀態(傾斜角度0之狀態)。As shown in FIGS. 12 and 13 , first, in step S1 , the imaging result of the jig J irradiated with RGB concentric circle light by the concentric circle illumination section 32 is acquired by the imaging section 31 . In the first step S1, the jig J is set to a horizontal state (a state of an inclination angle of 0).

然後，於步驟S2中，基於治具J之拍攝結果，獲取治具J之RGB比率並保存。Then, in step S2, based on the photographing result of the jig J, the RGB ratio of the jig J is obtained and saved.

然後，於步驟S3中，使治具J傾斜特定角度(例如，0.1度)。Then, in step S3, the jig J is inclined by a specific angle (for example, 0.1 degree).

然後，於步驟S4中，判斷是否已測定了全部測定範圍(例如，2.5度之範圍)。於判斷為尚未對全部測定範圍進行測定之情形時，進行至步驟S1。然後，於完成全部測定範圍之測定之前，反覆進行步驟S1～S4之處理。Then, in step S4, it is determined whether or not the entire measurement range (for example, a range of 2.5 degrees) has been measured. When it is determined that the entire measurement range has not been measured, the process proceeds to step S1. Then, until the measurement of the entire measurement range is completed, the processing of steps S1 to S4 is repeatedly performed.

又，於步驟S4中，於判斷為已測定了全部測定範圍之情形時，進行至步驟S5。於進行至步驟S5之階段，能夠獲取如圖9所示般之與治具J之傾斜角度對應之RGB比率之變化之測定結果。Moreover, in step S4, when it is judged that the whole measurement range has been measured, it progresses to step S5. At the stage of proceeding to step S5, as shown in FIG. 9, the measurement result of the change of the RGB ratio corresponding to the inclination angle of the jig J can be acquired.

然後，於步驟S5中，基於與治具J之傾斜角度對應之RGB比率變化之測定結果，獲取(製作)將RGB比率換算成傾斜角度之換算資訊42a，並記憶於記憶部42中。Then, in step S5 , based on the measurement result of the change in the RGB ratio corresponding to the inclination angle of the jig J, conversion information 42 a for converting the RGB ratio into the inclination angle is acquired (created) and stored in the memory unit 42 .

(基板檢查處理) 其次，參照圖14，基於流程圖說明利用第1實施方式之安裝基板檢查裝置100所進行之基板檢查處理。再者，流程圖之各處理係藉由控制裝置40來進行。 (Substrate inspection process) Next, with reference to FIG. 14, the board|substrate inspection process performed by the mounted board|substrate inspection apparatus 100 of 1st Embodiment is demonstrated based on a flowchart. In addition, each process of a flowchart is performed by the control apparatus 40. FIG.

如圖14所示，首先，於步驟S11中，獲取攝像部31對藉由同心圓照明部32照射了RGB同心圓光之檢查對象P1(安裝基板P)之拍攝結果。As shown in FIG. 14 , first, in step S11 , the imaging result of the inspection object P1 (mounting substrate P) irradiated with RGB concentric circle light by the concentric circle illumination section 32 is acquired by the imaging section 31 .

然後，於步驟S12中，基於檢查對象P1之拍攝結果獲取檢查對象P1之RGB比率。於步驟S12中，例如，獲取拍攝結果(圖像)中之每個像素之RGB比率。又，於步驟S12中，例如，獲取拍攝結果(圖像)中之每個像素集合體之RGB比率(集合體中之RGB平均比率)。再者，像素集合體例如為拍攝結果(圖像)中被視為同一平面之像素之集合。Then, in step S12, the RGB ratio of the inspection object P1 is acquired based on the photographing result of the inspection object P1. In step S12, for example, the RGB ratio of each pixel in the photographing result (image) is acquired. Moreover, in step S12, for example, the RGB ratio of each pixel aggregate in the photographing result (image) (the average RGB ratio in the aggregate) is acquired. In addition, the pixel group is, for example, a group of pixels considered to be the same plane in the photographing result (image).

然後，於步驟S13中，基於檢查對象P1之RGB比率與換算資訊42a，獲取檢查對象P1之傾斜角度。於步驟S13中，例如，獲取拍攝結果(圖像)中之每個像素之傾斜角度。又，於步驟S12中，例如，獲取拍攝結果(圖像)中之每個像素集合體之傾斜角度。Then, in step S13, based on the RGB ratio of the inspection object P1 and the conversion information 42a, the inclination angle of the inspection object P1 is acquired. In step S13, for example, the inclination angle of each pixel in the photographing result (image) is acquired. Moreover, in step S12, for example, the inclination angle of each pixel aggregate in the photographing result (image) is acquired.

然後，於步驟S14中，基於檢查對象P1之傾斜角度，對檢查對象P1之狀態進行檢查。於步驟S14中，基於檢查對象P1之傾斜角度，檢測傾斜角度之變化點作為零件E之裂縫。又，於步驟S14中，基於零件E之傾斜角度與藉由三維計測部34所獲取之安裝基板P之傾斜方向、傾斜角度及零件E之傾斜方向，檢測與安裝基板P之間具有極端角度差之零件E，作為產生了從安裝基板P之隆起之零件E。然後，基板檢查處理結束。Then, in step S14, the state of the inspection object P1 is inspected based on the inclination angle of the inspection object P1. In step S14, based on the inclination angle of the inspection object P1, the change point of the inclination angle is detected as the crack of the part E. Furthermore, in step S14, based on the inclination angle of the component E, the inclination direction and the inclination angle of the mounting board P acquired by the three-dimensional measuring unit 34, the inclination angle, and the inclination direction of the component E, it is detected that there is an extreme angle difference between the mounting board P and the mounting board P. The part E is the part E in which the bulge from the mounting board P is generated. Then, the substrate inspection process ends.

(第1實施方式之效果) 第1實施方式中，可獲得如下效果。 (Effect of the first embodiment) In the first embodiment, the following effects can be obtained.

第1實施方式中，如上所述，安裝基板檢查裝置100中設置有：攝像部31，其對包含安裝有零件E之安裝基板P之檢查對象P1進行拍攝；同心圓照明部32，其對檢查對象P1照射呈同心圓狀配置有紅色(R)、綠色(G)及藍色(B)之RGB同心圓光；以及控制裝置40，其進行以下控制，即，基於攝像部31對照射了RGB同心圓光之檢查對象P1的拍攝結果，獲取檢查對象P1之傾斜角度，並且基於所獲取之檢查對象P1之傾斜角度，對檢查對象P1之狀態進行檢查。藉此，可利用拍攝結果中之RGB各顏色之明度根據檢查對象P1之傾斜角度而變化這一情況，獲取檢查對象P1之傾斜角度。此處，於檢查對象P1之反射率發生變化之情形時，RGB各顏色之明度(亮度)發生變化，但RGB各顏色之明度之變化狀態(情況)保持不變。因此，藉由利用拍攝結果中之RGB各顏色之明度根據檢查對象P1之傾斜角度而變化這一情況，獲取檢查對象P1之傾斜角度，與基於單色之明暗資訊獲取檢查對象P1之傾斜角度之情形時不同，無論檢查對象P1之反射率如何變化，均可高精度地獲取檢查對象P1之傾斜角度。其結果，可基於傾斜角度，高精度地對檢查對象P1之狀態進行檢查。In the first embodiment, as described above, the mounted substrate inspection apparatus 100 is provided with the imaging unit 31 for photographing the inspection object P1 including the mounting substrate P on which the components E are mounted, and the concentric circle illumination unit 32 for inspecting The object P1 is irradiated with RGB concentric circles of light in which red (R), green (G), and blue (B) are arranged in concentric circles; The inclination angle of the inspection object P1 is acquired from the photographing result of the inspection object P1 of the round light, and the state of the inspection object P1 is inspected based on the acquired inclination angle of the inspection object P1. Thereby, the inclination angle of the inspection object P1 can be acquired by utilizing the fact that the brightness of each color of RGB in the photographing result changes according to the inclination angle of the inspection object P1. Here, when the reflectance of the inspection object P1 changes, the lightness (brightness) of each color of RGB changes, but the change state (condition) of the lightness of each color of RGB remains unchanged. Therefore, the difference between the inclination angle of the inspection object P1 and the inclination angle of the inspection object P1 obtained based on the light and shade information of the single color is obtained by using the fact that the brightness of each color of RGB in the photographing result changes according to the inclination angle of the inspection object P1. Depending on the case, the inclination angle of the inspection object P1 can be acquired with high accuracy regardless of the change in the reflectance of the inspection object P1. As a result, the state of the inspection object P1 can be inspected with high accuracy based on the inclination angle.

又，第1實施方式中，如上所述，控制裝置40構成為基於拍攝結果中之檢查對象P1之紅色、綠色及藍色之比率即RGB比率，獲取檢查對象P1之傾斜角度。藉此，可基於不受檢查對象P1之反射率變化影響之RGB比率，更高精度地獲取檢查對象P1之傾斜角度，因此可基於傾斜角度，更高精度地對檢查對象P1之狀態進行檢查。Furthermore, in the first embodiment, as described above, the control device 40 is configured to acquire the inclination angle of the inspection object P1 based on the ratio of red, green, and blue of the inspection object P1 in the imaging result, that is, the RGB ratio. Thereby, the inclination angle of the inspection object P1 can be obtained with higher accuracy based on the RGB ratio that is not affected by the change in the reflectance of the inspection object P1, so that the state of the inspection object P1 can be inspected with higher accuracy based on the inclination angle.

又，第1實施方式中，如上所述，控制裝置40構成為基於檢查對象P1之RGB比率與將預先獲取之RGB比率換算成傾斜角度之換算資訊42a，獲取檢查對象P1之傾斜角度。藉此，僅藉由利用將RGB比率換算成傾斜角度之換算資訊42a，將檢查對象P1之RGB比率換算成傾斜角度，便可簡單且確實地獲取檢查對象P1之傾斜角度。In the first embodiment, as described above, the control device 40 is configured to acquire the inclination angle of the inspection object P1 based on the RGB ratio of the inspection object P1 and the conversion information 42a for converting the RGB ratio acquired in advance into the inclination angle. Thereby, only by converting the RGB ratio of the inspection object P1 into the inclination angle using the conversion information 42a for converting the RGB ratio into the inclination angle, the inclination angle of the inspection object P1 can be easily and reliably obtained.

又，第1實施方式中，如上所述，同心圓照明部32包含呈同心圓狀配置之紅色光源61、綠色光源62及藍色光源63，或者包含白色光源71、及配置於與白色光源71對向之位置之RGB同心圓彩色濾光片72。藉此，於同心圓照明部32包含呈同心圓狀配置之紅色光源61、綠色光源62及藍色光源63之情形時，可容易地獲得呈同心圓狀配置有紅色、綠色及藍色之RGB同心圓光。又，於包含白色光源71、及配置於與白色光源71對向之位置之RGB同心圓彩色濾光片72之情形時，與個別地設置RGB各顏色之光源之情形時不同，無需為了抑制混色而將光源彼此隔開之構造，因此可簡化同心圓照明部32之構造。Furthermore, in the first embodiment, as described above, the concentric circle illumination unit 32 includes the red light source 61 , the green light source 62 , and the blue light source 63 arranged concentrically, or includes the white light source 71 , and the white light source 71 and the white light source 71 . The RGB concentric circle color filters 72 in the opposite position. Therefore, when the concentric illumination portion 32 includes the red light source 61 , the green light source 62 and the blue light source 63 arranged in a concentric circle, it is possible to easily obtain RGB in which red, green and blue are arranged in a concentric circle. Concentric circles of light. In addition, in the case of including the white light source 71 and the RGB concentric color filters 72 arranged at the position opposite to the white light source 71, unlike the case where the light sources of the RGB colors are provided individually, there is no need to suppress color mixing. Since the light sources are separated from each other, the structure of the concentric illumination portion 32 can be simplified.

又，第1實施方式中，如上所述，控制裝置40構成為進行以下控制，即，基於檢查對象P1之傾斜角度，檢測傾斜角度之變化點作為裂縫。藉此，於產生了裂縫之情形時，通常裂縫兩側之傾斜角度不同，因此可利用傾斜角度之變化點對應於裂縫這一情況，高精度地檢測檢查對象P1之裂縫。此處，雖存在檢測圖像之暗部作為裂縫之方法，但於檢測圖像之暗部作為裂縫此種情形時，若裂縫之寬度較窄(例如未達1像素)，則無法識別出圖像中之裂縫，因此可能無法檢測出裂縫。另一方面，本構成中，檢測傾斜角度之變化點作為裂縫，因此與檢測圖像之暗部作為裂縫此種情形時不同，即便於裂縫之寬度較窄，無法以暗部之形態識別圖像中之裂縫之情形時，亦可高精度地檢測裂縫。Furthermore, in the first embodiment, as described above, the control device 40 is configured to perform control to detect the point of change in the inclination angle as a crack based on the inclination angle of the inspection object P1. Thereby, when a crack occurs, the inclination angles of both sides of the crack are usually different, so that the change point of the inclination angle corresponds to the crack, and the crack of the inspection object P1 can be detected with high accuracy. Here, although there is a method of detecting the dark part of the image as a crack, when the dark part of the image is detected as a crack, if the width of the crack is narrow (for example, less than 1 pixel), it cannot be recognized in the image. cracks, so cracks may not be detected. On the other hand, in this configuration, the change point of the inclination angle is detected as the crack, so unlike the case where the dark part of the image is detected as the crack, even if the width of the crack is narrow, it cannot be recognized in the form of the dark part in the image. In the case of cracks, cracks can also be detected with high accuracy.

又，第1實施方式中，如上所述，零件E包含半導體晶圓晶片。又，控制裝置40構成為進行如下控制，即，基於檢查對象P1之傾斜角度，檢測半導體晶圓晶片之裂縫。藉此，可於容易產生裂縫之半導體晶圓晶片中，高精度地檢測裂縫。Moreover, in 1st Embodiment, as mentioned above, the component E contains a semiconductor wafer chip. Moreover, the control apparatus 40 is comprised so that it may perform control which detects the crack of a semiconductor wafer based on the inclination angle of the inspection object P1. As a result, cracks can be detected with high accuracy in semiconductor wafers that are prone to cracks.

又，第1實施方式中，如上所述，控制裝置40構成為進行以下控制，即，基於檢查對象P1之傾斜角度，檢測安裝基板P上之零件E之隆起。藉此，可基於高精度地獲取之檢查對象P1之傾斜角度，高精度地檢測安裝基板P上之零件E之隆起。Moreover, in 1st Embodiment, as mentioned above, the control apparatus 40 is comprised so that it may perform the control which detects the protrusion of the component E on the mounting board P based on the inclination angle of the inspection object P1. Thereby, the bulge of the component E on the mounting board P can be detected with high precision based on the inclination angle of the inspection object P1 acquired with high precision.

又，第1實施方式中，如上所述，安裝基板檢查裝置100具備能夠計測檢查對象P1之高度資訊之三維計測部34。又，控制裝置40構成為進行以下控制，即，根據檢查對象P1之傾斜角度與檢查對象P1之高度資訊，對檢查對象P1之狀態進行檢查，上述檢查對象P1之傾斜角度係基於攝像部31對照射了RGB同心圓光之檢查對象P1的拍攝結果所得，上述檢查對象P1之高度資訊係利用三維計測部34所得。藉此，不僅可根據基於攝像部31對照射了RGB同心圓光之檢查對象P1的拍攝結果所得之檢查對象P1之傾斜角度，亦可根據利用三維計測部34所得之檢查對象P1之高度資訊，而更高精度地對檢查對象P1之狀態進行檢查。Furthermore, in the first embodiment, as described above, the mounted board inspection apparatus 100 includes the three-dimensional measurement unit 34 capable of measuring the height information of the inspection object P1. In addition, the control device 40 is configured to perform control for inspecting the state of the inspection object P1 based on the inclination angle of the inspection object P1 and the height information of the inspection object P1 based on the measurement of the inclination angle of the inspection object P1 by the imaging unit 31 . The height information of the above-mentioned inspection object P1 is obtained by the three-dimensional measurement part 34 obtained by the imaging result of the inspection object P1 irradiated with RGB concentric circle light. In this way, not only the inclination angle of the inspection object P1 obtained based on the result of photographing the inspection object P1 irradiated with the RGB concentric circles of light by the imaging unit 31 but also the height information of the inspection object P1 obtained by the three-dimensional measuring unit 34 can be used. The state of the inspection object P1 is inspected with higher accuracy.

[第2實施方式] 其次，參照圖15說明第2實施方式。於該第2實施方式中，說明與在同心圓照明部設置有照射透鏡之上述第1實施方式不同，使用攝像部之物鏡作為同心圓照明部之照射透鏡之例。再者，對與上述第1實施方式相同之構成，於圖中標註相同之符號來圖示，並省略其說明。 [Second Embodiment] Next, the second embodiment will be described with reference to FIG. 15 . In this second embodiment, an example in which the objective lens of the imaging unit is used as the irradiation lens of the concentric illumination unit, unlike the above-described first embodiment in which the illumination lens is provided in the concentric illumination unit, will be described. In addition, about the same structure as the above-mentioned 1st Embodiment, the same code|symbol is attached|subjected and shown in the drawing, and the description is abbreviate|omitted.

(安裝基板檢查裝置之構成) 如圖15所示，本發明之第2實施方式之安裝基板檢查裝置200於具備同心圓照明部132以代替上述第1實施方式之同心圓照明部32之方面，與上述第1實施方式之安裝基板檢查裝置100不同。再者，安裝基板檢查裝置200具備二維照明部33與三維計測部34。又，安裝基板檢查裝置200係申請專利範圍中之「檢查裝置」之一例。 (Configuration of the mounting board inspection device) As shown in FIG. 15 , the mounting board inspection apparatus 200 according to the second embodiment of the present invention is provided with a concentric circle illumination part 132 instead of the concentric circle illumination part 32 of the above-mentioned first embodiment, which is similar to the installation of the above-mentioned first embodiment. The board inspection apparatus 100 is different. Furthermore, the mounted board inspection apparatus 200 includes a two-dimensional illumination unit 33 and a three-dimensional measurement unit 34 . In addition, the mounted board|substrate inspection apparatus 200 is an example of the "inspection apparatus" in the scope of the patent application.

此處，於第2實施方式中，如圖15所示，同心圓照明部132構成為，使用於攝像部31中配置於最靠近檢查對象P1側之位置之物鏡31a，對檢查對象P1照射RGB同心圓光。即，第2實施方式之同心圓照明部132包含攝像部31之物鏡31a以代替上述第1實施方式之照射透鏡32b。物鏡31a兼用作攝像部31之拍攝用透鏡與同心圓照明部132之照射用透鏡。再者，物鏡31a係申請專利範圍中之「拍攝用透鏡」之一例。Here, in the second embodiment, as shown in FIG. 15 , the concentric circle illumination unit 132 is configured to irradiate the inspection object P1 with RGB using the objective lens 31 a disposed at the position closest to the inspection object P1 in the imaging unit 31 . Concentric circles of light. That is, the concentric circle illumination unit 132 of the second embodiment includes the objective lens 31a of the imaging unit 31 in place of the illumination lens 32b of the above-described first embodiment. The objective lens 31 a is also used as the imaging lens of the imaging unit 31 and the irradiation lens of the concentric circle illumination unit 132 . Furthermore, the objective lens 31a is an example of a "photographing lens" within the scope of the patent application.

於第2實施方式中，物鏡31a設置於半反射鏡32c與檢查對象P1之間，且構成為被照射經半反射鏡32c反射之RGB同心圓光。物鏡31a係作為遠心透鏡而設置，使通過物鏡31a之光(來自同心圓光源部32a之RGB同心圓光)之主光線於檢查對象P1側(物體側)與物鏡31a之光軸大致平行。又，同心圓光源部32a配置於與物鏡31a隔開和物鏡31a之焦點距離相應之程度之位置，以對檢查對象P1照射主光線與物鏡31a之光軸大致平行之RGB同心圓光。In the second embodiment, the objective lens 31a is provided between the half mirror 32c and the inspection object P1, and is configured to be irradiated with RGB concentric circle lights reflected by the half mirror 32c. The objective lens 31a is provided as a telecentric lens so that the chief ray of the light passing through the objective lens 31a (RGB concentric circle light from the concentric circle light source portion 32a) is substantially parallel to the optical axis of the objective lens 31a on the inspection object P1 side (object side). Further, the concentric circle light source portion 32a is arranged at a position spaced from the objective lens 31a by a distance corresponding to the focal distance of the objective lens 31a, and irradiates the inspection object P1 with RGB concentric circle lights whose chief rays are substantially parallel to the optical axis of the objective lens 31a.

再者，第2實施方式之其他構成與上述第1實施方式相同。In addition, the other structure of 2nd Embodiment is the same as that of said 1st Embodiment.

(第2實施方式之效果) 於第2實施方式中，可獲得如下效果。 (Effect of the second embodiment) In the second embodiment, the following effects can be obtained.

於第2實施方式中，如上所述，攝像部31具有物鏡31a。又，同心圓照明部132構成為使用物鏡31a，對檢查對象P1照射RGB同心圓光。藉此，可有效地利用既有之物鏡31a，對檢查對象P1照射RGB同心圓光，因此無需於同心圓照明部132中個別地獨立設置照明用透鏡。其結果，可簡化攝像部31及同心圓照明部132之構造，並且可節省攝像部31及同心圓照明部132之配置空間。In the second embodiment, as described above, the imaging unit 31 includes the objective lens 31a. In addition, the concentric circle illumination unit 132 is configured to irradiate the inspection object P1 with RGB concentric circle lights using the objective lens 31a. Thereby, since the existing objective lens 31a can be used effectively, RGB concentric circle light can be irradiated to the inspection object P1, and therefore it is not necessary to separately and independently provide an illumination lens in the concentric circle illumination part 132. FIG. As a result, the structures of the imaging unit 31 and the concentric circular illumination unit 132 can be simplified, and the arrangement space of the imaging unit 31 and the concentric circular illumination unit 132 can be saved.

又，於第2實施方式中，如上所述，物鏡31a係於攝像部31中配置於最靠近檢查對象P1側之位置之物鏡。藉此，可有效地利用物鏡31a，對檢查對象P1照射RGB同心圓光。Furthermore, in the second embodiment, as described above, the objective lens 31 a is an objective lens that is disposed at the position closest to the inspection object P1 in the imaging unit 31 . As a result, the objective lens 31a can be effectively used to irradiate the inspection object P1 with RGB concentric circle lights.

再者，第2實施方式之其他效果與上述第1實施方式相同。In addition, other effects of the second embodiment are the same as those of the above-described first embodiment.

[第3實施方式] 其次，參照圖16～圖18說明第3實施方式。於該第3實施方式中，說明與同心圓照明部中設置有3種顏色之上述第1及第2實施方式不同，於同心圓照明部中設置有4種顏色之例。再者，對與上述第1及第2實施方式相同之構成，於圖中標註相同之符號來圖示，並省略其說明。 [Third Embodiment] Next, a third embodiment will be described with reference to FIGS. 16 to 18 . In this third embodiment, an example in which four colors are provided in the concentric circle illumination portion will be described, unlike the above-mentioned first and second embodiments in which the concentric circle illumination portion is provided with three colors. In addition, about the same structure as the above-mentioned 1st and 2nd embodiment, the same code|symbol is attached|subjected and shown in the drawing, and the description is abbreviate|omitted.

(安裝基板檢查裝置之構成) 如圖16所示，本發明之第3實施方式之安裝基板檢查裝置300於具備同心圓照明部232以代替上述第2實施方式之同心圓照明部132之方面，與上述第2實施方式之安裝基板檢查裝置200不同。再者，安裝基板檢查裝置300具備二維照明部33及三維計測部34。又，安裝基板檢查裝置300係申請專利範圍中之「檢查裝置」之一例。 (Configuration of the mounting board inspection device) As shown in FIG. 16 , the mounting board inspection apparatus 300 according to the third embodiment of the present invention is provided with a concentric circle illumination portion 232 in place of the concentric circle illumination portion 132 of the above-mentioned second embodiment. The board inspection apparatus 200 is different. Furthermore, the mounted board inspection apparatus 300 includes a two-dimensional illumination unit 33 and a three-dimensional measurement unit 34 . In addition, the mounted board|substrate inspection apparatus 300 is an example of the "inspection apparatus" in the scope of the patent application.

此處，於第3實施方式中，如圖16所示，同心圓照明部232構成為照射RGB同心圓光，該RGB同心圓光包含RGB三種顏色各1圈，且於同心圓最外側包含與RGB中之位於同心圓中心之顏色相同之顏色。具體而言，同心圓照明部232具有同心圓光源部232a，以代替上述第2實施方式之同心圓光源部32a。Here, in the third embodiment, as shown in FIG. 16 , the concentric circle illumination unit 232 is configured to emit RGB concentric circle light, the RGB concentric circle light includes one circle for each of the three colors of RGB, and the outermost side of the concentric circle includes and RGB The same color as the color at the center of the concentric circles. Specifically, the concentric circle illumination part 232 has a concentric circle light source part 232a instead of the concentric circle light source part 32a of the above-mentioned second embodiment.

如圖16及圖17所示，同心圓光源部232a構成為發出RGB同心圓光，該RGB同心圓光包含RGB三種顏色各1圈，且於同心圓最外側包含與RGB中之位於同心圓中心之顏色相同之顏色。RGB同心圓光包含大致圓形狀之第1色光、以包圍大致圓形狀之第1色光之外周的方式配置之大致環狀之第2色光、以包圍大致環狀之第2色光之外周的方式配置之大致環狀之第3色光、以及以包圍大致環狀之第3色光之外周的方式配置之大致環狀之第1色光。中心之第1色光、第2色光、第3色光及最外側之第1色光係從中心側朝向外周側依序配置。再者，RGB同心圓光中之紅色、綠色及藍色之配置順序以及中心與最外側之顏色並無特別限制，於圖16及圖17所示之例中，作為一例，從中心側朝向外周側依序配置有紅色、綠色、藍色及紅色。As shown in FIG. 16 and FIG. 17 , the concentric circle light source part 232a is configured to emit RGB concentric circle light, the RGB concentric circle light includes three colors of RGB and one circle each, and the outermost of the concentric circle includes the color located in the center of the concentric circle among RGB. the same color. The RGB concentric circle light includes a substantially circular first color light, a substantially annular second color light arranged so as to surround the outer circumference of the substantially circular first color light, and a substantially annular second color light arranged so as to surround the substantially circular outer circumference of the second color light. The substantially annular third color light, and the substantially annular first color light arranged so as to surround the outer periphery of the substantially annular third colored light. The first colored light in the center, the second colored light, the third colored light, and the outermost first colored light are arranged in this order from the center side toward the outer peripheral side. Furthermore, the order of arrangement of red, green, and blue in the RGB concentric circle light and the colors of the center and outermost are not particularly limited. Red, green, blue and red are arranged in sequence.

又，同心圓光源部232a構成為照射如下RGB同心圓光，即中心之顏色之照射立體角I之終端(外側端)與最外側之顏色之照射立體角I之起始端(內側端)之間的角度大於觀察立體角O之值。即，同心圓光源部232a構成為照射如下RGB同心圓光，即中心之顏色之光與最外側之顏色之光這兩個同色光不會同時包含在觀察立體角O內。Also, the concentric circle light source portion 232a is configured to emit RGB concentric circle light between the end (outer end) of the irradiation solid angle I of the color at the center and the start end (inner end) of the illumination solid angle I of the outermost color. The angle is greater than the value of the viewing solid angle O. That is, the concentric circle light source portion 232a is configured to emit RGB concentric circle light, that is, the light of the color in the center and the light of the outermost color are not included in the observation solid angle O at the same time.

圖18係表示利用第3實施方式之同心圓照明部232時之檢查對象P1之檢查面之傾斜角度所對應的RGB比率之變化的曲線圖。對圖18所示之曲線圖與上述第1實施方式之圖9所示之曲線圖進行比較，可知圖18所示之曲線圖中，於檢查對象P1之傾斜角度測定範圍之最後階段(即，檢查對象P1之傾斜角度較大時)，紅色與藍色之比率發生變化。即，根據圖18所示之曲線圖可知，於檢查對象P1之傾斜角度測定範圍之最後階段，亦可基於複數種顏色(兩種顏色)之明度變化(比率變化)，獲取傾斜角度。即，於第3實施方式中，能夠於檢查對象P1之傾斜角度測定範圍之最後階段中之參考資料增加的狀態下，獲取傾斜角度。再者，於第3實施方式中，獲取(製作)與圖18所示般之曲線圖對應之資訊作為換算資訊42a，但省略詳細之說明。FIG. 18 is a graph showing the change of the RGB ratio according to the inclination angle of the inspection surface of the inspection object P1 when the concentric circle illumination unit 232 of the third embodiment is used. Comparing the graph shown in FIG. 18 with the graph shown in FIG. 9 of the above-mentioned first embodiment, it can be seen that the graph shown in FIG. When the inclination angle of the inspection object P1 is large), the ratio of red to blue changes. That is, as can be seen from the graph shown in FIG. 18, in the final stage of the inclination angle measurement range of the inspection object P1, the inclination angle can also be obtained based on the change in brightness (ratio change) of a plurality of colors (two colors). That is, in 3rd Embodiment, the inclination angle can be acquired in the state which increased the reference material in the last stage of the inclination-angle measurement range of the inspection object P1. Furthermore, in the third embodiment, information corresponding to the graph shown in FIG. 18 is acquired (created) as the conversion information 42a, but the detailed description is omitted.

再者，第3實施方式之其他構成與上述第1及第2實施方式相同。In addition, the other structure of 3rd Embodiment is the same as that of said 1st and 2nd Embodiment.

(第3實施方式之效果) 於第3實施方式中，可獲得如下效果。 (Effect of the third embodiment) In the third embodiment, the following effects can be obtained.

於第3實施方式中，如上所述，同心圓照明部232構成為照射RGB同心圓光，該RGB同心圓光包含RGB三種顏色各1圈，且於同心圓最外側包含與RGB中之位於同心圓中心之顏色相同之顏色。藉此，藉由使RGB同心圓光於同心圓最外側包含與RGB中之位於同心圓中心之顏色相同之顏色，而即便於檢查對象P1之傾斜角度測定範圍之最後階段(即，檢查對象P1之傾斜角度較大時)，亦可基於複數種顏色之明度變化，高精度地獲取檢查對象P1之傾斜角度。In the third embodiment, as described above, the concentric circle illumination unit 232 is configured to emit RGB concentric circle light, the RGB concentric circle light includes one circle for each of the three colors of RGB, and the outermost of the concentric circle includes the center of the concentric circle with RGB. the same color. Thereby, by causing the RGB concentric circles of light to include the same color as the color located at the center of the concentric circles in the RGB at the outermost side of the concentric circles, even in the final stage of the measurement range of the inclination angle of the inspection object P1 (that is, the When the inclination angle is large), the inclination angle of the inspection object P1 can also be obtained with high accuracy based on the change in the brightness of a plurality of colors.

再者，第3實施方式之其他效果與上述第1及第2實施方式相同。In addition, other effects of the third embodiment are the same as those of the first and second embodiments described above.

[第4實施方式] 其次，參照圖19～圖23說明第4實施方式。於該第4實施方式中，說明除了上述第1實施方式之構成以外，進而考慮色相資訊來獲取傾斜角度之例。再者，對與上述第1實施方式相同之構成，於圖中標註相同之符號來圖示，並省略其說明。 [4th Embodiment] Next, the fourth embodiment will be described with reference to FIGS. 19 to 23 . In this fourth embodiment, in addition to the configuration of the above-described first embodiment, an example of acquiring the inclination angle in consideration of hue information will be described. In addition, about the same structure as the above-mentioned 1st Embodiment, the same code|symbol is attached|subjected and shown in the drawing, and the description is abbreviate|omitted.

(安裝基板檢查裝置之構成) 如圖19(A)(B)所示，本發明之第4實施方式之安裝基板檢查裝置400於具備同心圓照明部332以代替上述第1實施方式之同心圓照明部32之方面，與上述第1實施方式之安裝基板檢查裝置100不同。再者，安裝基板檢查裝置400具備二維照明部33與三維計測部34。又，安裝基板檢查裝置400係申請專利範圍中之「檢查裝置」之一例。 (Configuration of the mounting board inspection device) As shown in FIGS. 19(A) and 19B , the mounting board inspection apparatus 400 according to the fourth embodiment of the present invention is the same as the above-mentioned in that it includes a concentric circle illumination portion 332 instead of the concentric circle illumination portion 32 of the above-mentioned first embodiment. The mounted substrate inspection apparatus 100 of the first embodiment is different. Furthermore, the mounted board inspection apparatus 400 includes a two-dimensional illumination unit 33 and a three-dimensional measurement unit 34 . In addition, the mounted board|substrate inspection apparatus 400 is an example of the "inspection apparatus" in the scope of the patent application.

於第4實施方式中，如圖19(A)(B)所示，同心圓照明部332構成為除了能對檢查對象P1照射RGB同心圓光以外，還能對檢查對象P1照射白色光。具體而言，同心圓照明部332具有同心圓光源部332a以代替上述第1實施方式之同心圓光源部32a。In the fourth embodiment, as shown in FIGS. 19(A) and 19B , the concentric circle illumination unit 332 is configured to irradiate the inspection object P1 with white light in addition to the RGB concentric circle lights. Specifically, the concentric circle illumination part 332 has a concentric circle light source part 332a instead of the concentric circle light source part 32a of the above-mentioned first embodiment.

同心圓光源部332a除了包含紅色光源61、綠色光源62及藍色光源63之外，進而包含白色光源366。白色光源366構成為發出與RGB同心圓光大致相同之大致圓形狀之白色光。白色光源366包含複數個(圖19(B)中為17個)白色LED。又，同心圓光源部332a構成為能夠使紅色光源61、綠色光源62及藍色光源63、與白色光源366彼此獨立地點亮。藉此，同心圓照明部332構成為對檢查對象P1分別獨立地照射RGB同心圓光與白色光。於該情形時，無需與同心圓照明部332個別地獨立設置白色照明，因此能夠抑制裝置構造之複雜化。In addition to the red light source 61 , the green light source 62 , and the blue light source 63 , the concentric light source portion 332 a further includes a white light source 366 . The white light source 366 is configured to emit white light having substantially the same circular shape as the RGB concentric light. The white light source 366 includes a plurality of (17 in FIG. 19(B) ) white LEDs. Moreover, the concentric circle light source part 332a is comprised so that the red light source 61, the green light source 62, the blue light source 63, and the white light source 366 can be turned on independently of each other. Thereby, the concentric circle illumination unit 332 is configured to independently irradiate the inspection object P1 with the RGB concentric circle light and the white light. In this case, it is not necessary to provide white illumination separately from the concentric circle illumination portion 332, so that the complexity of the device structure can be suppressed.

此處，參照圖20及圖21，說明具有色相之面與不具有色相之面之RGB反射特性之差異。Here, with reference to FIG. 20 and FIG. 21, the difference of the RGB reflection characteristic of the surface with a hue and the surface without a hue will be demonstrated.

如圖20所示，不具有色相之面(鏡面、白色面、黑色面及灰色面等)對於RGB各顏色之反射特性相同。因此，於對不具有色相之面照射RGB同心圓光之情形時，反射光之強度會根據不具有色相之面之種類(鏡面、白色面、黑色面及灰色面等)而變化，但無論不具有色相之面為哪一種(鏡面、白色面、黑色面及灰色面等)，反射光之RGB比率均保持不變。於該情形時，藉由如圖9所示之換算資訊42a，能夠獲取傾斜角度。As shown in FIG. 20 , the surfaces without hue (mirror surface, white surface, black surface, gray surface, etc.) have the same reflection characteristics for each color of RGB. Therefore, when irradiating RGB concentric circles of light on a surface without hue, the intensity of the reflected light varies depending on the type of surface without hue (mirror surface, white surface, black surface, gray surface, etc.) Whichever side of the hue is (mirror, white, black, gray, etc.), the RGB ratio of the reflected light remains unchanged. In this case, the inclination angle can be obtained by the conversion information 42a as shown in FIG. 9 .

另一方面，如圖21所示，具有色相之面(綠色面、黃色面及紅色面等)對RGB各顏色之反射特性會因色相而不同。因此，於對具有色相之面照射RGB同心圓光之情形時，反射光之RGB比率根據具有色相之面之種類(綠色面、黃色面及紅色面等)而變化。於該情形時，僅利用如圖9所示之換算資訊42a，難以獲取傾斜角度。再者，安裝基板P中，具有色相之面例如為銅箔面(紅色系色相之面)及金箔面(黃色系色相之面)等。On the other hand, as shown in FIG. 21 , the reflection characteristics of the surfaces having hues (green surface, yellow surface, red surface, etc.) for each color of RGB differ depending on the hue. Therefore, when the RGB concentric circle light is irradiated to the surface having the hue, the RGB ratio of the reflected light varies depending on the type of the surface having the hue (green surface, yellow surface, red surface, etc.). In this case, it is difficult to obtain the inclination angle only by using the conversion information 42a as shown in FIG. 9 . In addition, in the mounting board|substrate P, the surface which has a hue is, for example, a copper foil surface (surface of a red-based hue), a gold foil surface (a surface of a yellow-based hue), and the like.

因此，如圖22所示，於第4實施方式中，控制裝置40構成為，基於攝像部31對照射了RGB同心圓光之檢查對象P1的拍攝結果、與從照射了白色光之檢查對象P1之拍攝結果獲取的檢查對象P1之色相資訊，獲取檢查對象P1之傾斜角度。Therefore, as shown in FIG. 22 , in the fourth embodiment, the control device 40 is configured based on the imaging result of the inspection object P1 irradiated with the RGB concentric circle light by the imaging unit 31 and the difference between the inspection object P1 irradiated with the white light The hue information of the inspection object P1 obtained from the photographing result is used to obtain the inclination angle of the inspection object P1.

具體而言，控制裝置40構成為進行以下控制，即，使攝像部31拍攝藉由同心圓照明部332照射了白色光之檢查對象P1(安裝基板P)。又，控制裝置40構成為獲取攝像部31對照射了白色光之檢查對象P1的拍攝結果。又，控制裝置40構成為，基於所獲取之拍攝結果，獲取拍攝結果中之檢查對象P1之RGB各顏色之明度(色相資訊)。又，控制裝置40構成為，基於所獲取之檢查對象P1之RGB各顏色之明度，獲取檢查對象P1之色相修正係數(色相資訊)。色相修正係數係用以消除因色相所致之RGB比率差異之係數。色相修正係數例如被獲取以作為白色光照射下之檢查對象P1之RGB比率之反數。Specifically, the control device 40 is configured to control the imaging unit 31 to image the inspection object P1 (mounting substrate P) irradiated with white light by the concentric circle illumination unit 332 . Moreover, the control apparatus 40 is comprised so that the imaging|photography result of the inspection object P1 irradiated with white light by the imaging part 31 may be acquired. Further, the control device 40 is configured to acquire the lightness (hue information) of each color of RGB of the inspection object P1 in the imaging result based on the acquired imaging result. Moreover, the control apparatus 40 is comprised so that the hue correction coefficient (hue information) of the inspection object P1 may be acquired based on the acquired lightness of each color of RGB of the inspection object P1. The hue correction coefficient is a coefficient used to eliminate the difference in RGB ratio due to hue. The hue correction coefficient is acquired, for example, as the inverse of the RGB ratio of the inspection object P1 under the irradiation of white light.

又，控制裝置40與上述第1實施方式同樣地，構成為基於攝像部31對藉由同心圓照明部332照射了RGB同心圓光之檢查對象P1之拍攝結果，獲取RGB各顏色之明度。又，控制裝置40構成為進行以下控制，即，藉由將使用RGB同心圓光所獲取之檢查對象P1之RGB各顏色之明度乘以檢查對象P1之色相修正係數，來修正使用RGB同心圓光所獲取之檢查對象P1之拍攝結果。藉此，控制裝置40構成為獲取色相差異得以修正之檢查對象P1之拍攝結果。Also, the control device 40 is configured to acquire the lightness of each color of RGB based on the imaging result of the imaging unit 31 on the inspection object P1 irradiated with RGB concentric light by the concentric illumination unit 332 , as in the above-described first embodiment. In addition, the control device 40 is configured to perform control such that, by multiplying the lightness of each color of RGB of the inspection object P1 obtained using the RGB concentric circle light by the hue correction coefficient of the inspection object P1, the acquisition using the RGB concentric circle light is corrected. The photographing result of the inspection object P1. Thereby, the control apparatus 40 is comprised so that the imaging result of the inspection object P1 whose hue difference is corrected is acquired.

又，控制裝置40構成為基於修正後之檢查對象P1之拍攝結果，獲取色相差異得以修正之檢查對象P1之RGB比率。又，控制裝置40構成為基於所獲取之檢查對象P1之RGB比率，獲取檢查對象P1之傾斜角度。具體而言，控制裝置40構成為基於檢查對象P1之RGB比率及換算資訊42a，獲取檢查對象P1之傾斜角度。Moreover, the control apparatus 40 is comprised so that the RGB ratio of the inspection object P1 whose hue difference is corrected is acquired based on the photographing result of the inspection object P1 after correction. Moreover, the control apparatus 40 is comprised so that the inclination angle of the inspection object P1 may be acquired based on the acquired RGB ratio of the inspection object P1. Specifically, the control device 40 is configured to acquire the inclination angle of the inspection object P1 based on the RGB ratio of the inspection object P1 and the conversion information 42a.

又，於第4實施方式中，以RGB同心圓光之同一光路(同一照射路徑)照射白色光，獲取利用該白色光所得之檢查對象P1之拍攝結果，因此能夠基於利用白色光所得之檢查對象P1之拍攝結果，高精度地獲取檢查對象P1之色相修正係數(色相資訊)。Furthermore, in the fourth embodiment, the white light is irradiated with the same optical path (same irradiation path) of the RGB concentric circles of light, and the imaging result of the inspection object P1 obtained by the white light is obtained, so the inspection object P1 obtained by using the white light can be based on the white light. As a result of the photographing, the hue correction coefficient (hue information) of the inspection object P1 is obtained with high accuracy.

圖22中，圖示了對不具有色相之銀色面(半導體晶圓晶片)、具有色相之黃色面(金箔)及具有色相之紅色面(銅箔)這3個面進行上述色相修正之例。再者，3個面傾斜成同一角度。FIG. 22 shows an example in which the above-mentioned hue correction is performed on three surfaces of a silver surface without hue (semiconductor wafer), a yellow surface with hue (gold foil), and a red surface with hue (copper foil). Furthermore, the three surfaces are inclined at the same angle.

白色光照射下之拍攝結果中，不具有色相之銀色面對於RGB各顏色之反射特性相同，因此紅色、綠色及藍色之明度均為100。又，具有色相之黃色面對於RGB各顏色之反射特性不同，因此紅色之明度為100，綠色之明度為100，藍色之明度為50。又，具有色相之紅色面對於RGB各顏色之反射特性不同，因此紅色之明度為100，綠色之明度為50，藍色之明度為25。In the photographed result under the illumination of white light, the silver surface with no hue has the same reflection characteristics for each color of RGB, so the brightness of red, green and blue are all 100. In addition, the yellow surface with hue has different reflection characteristics for each color of RGB, so the lightness of red is 100, the lightness of green is 100, and the lightness of blue is 50. In addition, the red surface with hue has different reflection characteristics for each color of RGB, so the lightness of red is 100, the lightness of green is 50, and the lightness of blue is 25.

於基於該拍攝結果獲取色相修正係數之情形時，不具有色相之銀色面對紅色、綠色及藍色之色相修正係數均為1(R係數：G係數：B係數＝1：1：1)。又，具有色相之黃色面對紅色之色相修正係數為1，對綠色之色相修正係數為1，對藍色之色相修正係數為2(R係數：G係數：B係數＝1：1：2)。又，具有色相之紅色面對紅色之色相修正係數為1，對綠色之色相修正係數為2，對藍色之色相修正係數為4(R係數：G係數：B係數＝1：2：4)。In the case of obtaining the hue correction coefficient based on the photographing result, the hue correction coefficients for red, green and blue of silver without hue are all 1 (R coefficient: G coefficient: B coefficient=1:1:1). In addition, the hue correction coefficient of yellow with hue is 1 for red, the hue correction coefficient for green is 1, and the hue correction coefficient for blue is 2 (R coefficient: G coefficient: B coefficient = 1:1:2) . Also, the hue correction coefficient for red with hue is 1, the hue correction coefficient for green is 2, and the hue correction coefficient for blue is 4 (R coefficient: G coefficient: B coefficient = 1:2:4) .

又，RGB同心圓光之照射下之拍攝結果中，不具有色相之銀色面上，紅色之明度為42，綠色之明度為5，藍色之明度為92。又，具有色相之黃色面上難以獲得藍色之反射光，因此與不具有色相之銀色面不同，紅色之明度為42，綠色之明度為5，藍色之明度為46。又，具有色相之紅色面上難以獲得綠色及藍色之反射光，因此與不具有色相之銀色面不同，紅色之明度為42，綠色之明度為2.5，藍色之明度為23。In addition, in the photographing result under the illumination of RGB concentric circles, on the silver surface without hue, the lightness of red is 42, the lightness of green is 5, and the lightness of blue is 92. In addition, it is difficult to obtain blue reflected light on the yellow surface with hue, so unlike the silver surface without hue, the lightness of red is 42, the lightness of green is 5, and the lightness of blue is 46. In addition, it is difficult to obtain the reflected light of green and blue on the red surface with hue, so unlike the silver surface without hue, the lightness of red is 42, the lightness of green is 2.5, and the lightness of blue is 23.

如此，於不進行上述色相修正之情形時，不具有色相之銀色面、具有色相之黃色面以及具有色相之紅色面這3個面各自的RGB比率不同，因此儘管3個面各自具有相同之傾斜角度，亦會於3個面上獲得不同之傾斜角度。In this way, in the case where the above-mentioned hue correction is not performed, the RGB ratios of the three surfaces of the silver surface without hue, the yellow surface with hue, and the red surface with hue are different, so although the three surfaces each have the same inclination Angle, will also obtain different inclination angles on the 3 planes.

另一方面，於基於色相修正係數對RGB同心圓光之照射下之拍攝結果進行修正之情形時，不具有色相之銀色面上，R係數：G係數：B係數＝1：1：1，因此若使明度乘以色相修正係數，則修正後之紅色之明度成為42，修正後之綠色之明度成為5，修正後之藍色之明度成為92。又，具有色相之黃色面上，R係數：G係數：B係數＝1：1：2，因此若使明度乘以色相修正係數，則修正後之紅色之明度成為42，修正後之綠色之明度成為5，藍色之明度成為92。又，具有色相之紅色面上，R係數：G係數：B係數＝1：2：4，因此若使明度乘以色相修正係數，則修正後之紅色之明度成為42，修正後之綠色之明度成為5，藍色之明度成為92。On the other hand, in the case of correcting the photographing result under the illumination of RGB concentric circle light based on the hue correction coefficient, on the silver surface without hue, R coefficient: G coefficient: B coefficient = 1:1:1, so if By multiplying the lightness by the hue correction coefficient, the lightness of red after correction becomes 42, the lightness of green after correction becomes 5, and the lightness of blue after correction becomes 92. In addition, on the yellow surface with hue, R coefficient: G coefficient: B coefficient = 1:1:2. Therefore, if the lightness is multiplied by the hue correction coefficient, the lightness of red after correction becomes 42, and the lightness of green after correction becomes 42. It becomes 5, and the lightness of blue becomes 92. Also, on the red surface with hue, R coefficient: G coefficient: B coefficient = 1: 2: 4. Therefore, if the lightness is multiplied by the hue correction coefficient, the lightness of red after correction becomes 42, and the lightness of green after correction becomes 42. It becomes 5, and the lightness of blue becomes 92.

如此，於進行上述色相修正之情形時，因不具有色相之銀色面、具有色相之黃色面以及具有色相之紅色面這3個面各自的RGB比率相同，而能夠於具有相同傾斜角度之3個面上獲得相同之傾斜角度。In this way, in the case of the above-mentioned hue correction, since the RGB ratios of the three surfaces of the silver surface without hue, the yellow surface with hue, and the red surface with hue are the same, the three surfaces with the same inclination angle can be to obtain the same inclination angle on the surface.

(基板檢查處理) 其次，參照圖23，基於流程圖說明利用第4實施方式之安裝基板檢查裝置400所進行之基板檢查處理。再者，流程圖之各處理係藉由控制裝置40來進行。 (Substrate inspection process) Next, with reference to FIG. 23, the board|substrate inspection process performed by the mounted board|substrate inspection apparatus 400 of 4th Embodiment is demonstrated based on a flowchart. In addition, each process of a flowchart is performed by the control apparatus 40. FIG.

如圖23所示，首先，於步驟S21中，獲取攝像部31對藉由同心圓照明部332照射了白色光之檢查對象P1(安裝基板P)之拍攝結果。As shown in FIG. 23 , first, in step S21 , the imaging result of the imaging unit 31 on the inspection object P1 (the mounting substrate P) irradiated with the white light by the concentric circle illumination unit 332 is acquired.

然後，於步驟S22中，基於檢查對象P1之拍攝結果獲取檢查對象P1之色相修正係數。於步驟S22中，例如，獲取拍攝結果(圖像)中之每個像素之色相修正係數。又，於步驟S22中，例如，獲取拍攝結果(圖像)中之每個像素集合體之色相修正係數(集合體中之平均色相修正係數)。Then, in step S22, the hue correction coefficient of the inspection object P1 is acquired based on the photographing result of the inspection object P1. In step S22, for example, the hue correction coefficient of each pixel in the photographing result (image) is acquired. Moreover, in step S22, for example, the hue correction coefficient (average hue correction coefficient in the aggregate) of each pixel aggregate in the photographing result (image) is acquired.

然後，於步驟S23中，獲取攝像部31對藉由同心圓照明部332照射了RGB同心圓光之檢查對象P1(安裝基板P)之拍攝結果。Then, in step S23, the imaging part 31 acquires the imaging result of the inspection object P1 (mounting board P) irradiated with RGB concentric circle light by the concentric circle illumination part 332.

然後，於步驟S24中，基於色相修正係數，對使用RGB同心圓光所獲取之檢查對象P1之拍攝結果進行修正。Then, in step S24, the photographing result of the inspection object P1 obtained by using the RGB concentric circle light is corrected based on the hue correction coefficient.

然後，於步驟S25中，基於修正後之檢查對象P1之拍攝結果，獲取檢查對象P1之RGB比率。於步驟S25中，例如，獲取拍攝結果(圖像)中之每個像素之RGB比率。又，於步驟S25中，例如，獲取拍攝結果(圖像)中之每個像素集合體之RGB比率。Then, in step S25 , the RGB ratio of the inspection object P1 is acquired based on the corrected photographing result of the inspection object P1 . In step S25, for example, the RGB ratio of each pixel in the photographed result (image) is acquired. Moreover, in step S25, for example, the RGB ratio of each pixel aggregate in the photographed result (image) is acquired.

然後，於步驟S26中，基於修正後之檢查對象P1之RGB比率與換算資訊42a，獲取檢查對象P1之傾斜角度。於步驟S26中，例如，獲取拍攝結果(圖像)中之每個像素之傾斜角度。又，於步驟S12中，例如，獲取拍攝結果(圖像)中之每個像素集合體之傾斜角度。Then, in step S26, the inclination angle of the inspection object P1 is acquired based on the corrected RGB ratio of the inspection object P1 and the conversion information 42a. In step S26, for example, the inclination angle of each pixel in the photographed result (image) is acquired. Moreover, in step S12, for example, the inclination angle of each pixel aggregate in the photographing result (image) is acquired.

然後，於步驟S27中，基於檢查對象P1之傾斜角度，對檢查對象P1之狀態進行檢查。於步驟S27中，基於檢查對象P1之傾斜角度，檢測傾斜角度之變化點作為零件E之裂縫。又，於步驟S27中，基於零件E之傾斜角度與由三維計測部34獲取之安裝基板P之傾斜方向、傾斜角度及零件E之傾斜方向，檢測出與安裝基板P之間具有極端角度差之零件E作為從安裝基板P產生隆起之零件E。然後，基板檢查處理結束。Then, in step S27, the state of the inspection object P1 is inspected based on the inclination angle of the inspection object P1. In step S27, based on the inclination angle of the inspection object P1, the change point of the inclination angle is detected as the crack of the part E. Furthermore, in step S27, based on the inclination angle of the component E, the inclination direction and the inclination angle of the mounting board P acquired by the three-dimensional measuring unit 34, the inclination angle, and the inclination direction of the component E, it is detected that there is an extreme angle difference between the component E and the mounting board P. The part E is the part E which protrudes from the mounting board P. As shown in FIG. Then, the substrate inspection process ends.

再者，第4實施方式之其他構成與上述第1實施方式相同。In addition, the other structure of 4th Embodiment is the same as that of said 1st Embodiment.

(第4實施方式之效果) 第4實施方式中，可獲得如下效果。 (Effect of the fourth embodiment) In the fourth embodiment, the following effects can be obtained.

第4實施方式中，如上所述，控制裝置40構成為，基於攝像部31對照射了RGB同心圓光之檢查對象P1的拍攝結果、與從照射了白色光之檢查對象P1之拍攝結果獲取的檢查對象P1之色相資訊，獲取檢查對象P1之傾斜角度。藉此，可於考慮具有色相之面與不具有色相之面上的RGB反射特性不同、以及即便是具有色相之面亦根據色相而RGB反射特性不同的情況下，更高精度地獲取檢查對象P1之傾斜角度。In the fourth embodiment, as described above, the control device 40 is configured to perform the inspection based on the result of photographing the inspection object P1 irradiated with RGB concentric circle light by the imaging unit 31 and the result of photographing the inspection object P1 irradiated with white light. The hue information of the object P1 is used to obtain the inclination angle of the inspection object P1. Thereby, the inspection object P1 can be acquired with higher accuracy, taking into account that the RGB reflection characteristics of the surface having a hue and the surface having no hue are different, and that the RGB reflection characteristics are different depending on the hue even in the surface having a hue. the inclination angle.

再者，第4實施方式之其他效果與上述第1實施方式相同。In addition, other effects of the fourth embodiment are the same as those of the above-described first embodiment.

(變化例) 再者，應明白此次揭示之實施方式係於所有方面進行例示，而並非進行限定。本發明之範圍並非由上述實施方式之說明表示，而是藉由申請專利範圍表示，進而包含與申請專利範圍同等之含義及範圍內之所有變更(變化例)。 (Variation example) In addition, it should be understood that the embodiments disclosed this time are illustrative in all respects and not restrictive. The scope of the present invention is shown not by the description of the above-mentioned embodiments but by the scope of the claims, and further includes the meaning equivalent to the scope of the claims and all changes (modifications) within the scope.

例如，上述第1～第4實施方式中，示出了將本發明應用於安裝基板檢查裝置之例，但本發明並不限於此。本發明亦可應用於除安裝基板檢查裝置以外之檢查裝置。再者，本發明難以獲得鏡面構件及透明構件(透明殼體等)等之充分之散射光，因此尤其適合檢查難以獲得傾斜角度之資訊之構件(檢查對象)。For example, in the above-mentioned first to fourth embodiments, an example in which the present invention is applied to a mounted board inspection apparatus is shown, but the present invention is not limited to this. The present invention can also be applied to inspection apparatuses other than mounting substrate inspection apparatuses. Furthermore, the present invention is difficult to obtain sufficient scattered light for mirror-surface members and transparent members (transparent casings, etc.), and thus is particularly suitable for inspecting members (inspection objects) for which it is difficult to obtain information on inclination angles.

又，上述第1～第4實施方式中，示出了安裝基板檢查裝置(檢查裝置)具備二維照明部與三維計測部之例，但本發明並不限於此。本發明中，檢查裝置亦可不具備二維照明部與三維計測部。又，檢查裝置亦可僅具備二維照明部與三維計測部中之任一者。Moreover, in the said 1st - 4th embodiment, the mounted board|substrate inspection apparatus (inspection apparatus) showed the example which provided the two-dimensional illumination part and the three-dimensional measurement part, but this invention is not limited to this. In the present invention, the inspection apparatus may not include the two-dimensional illumination unit and the three-dimensional measurement unit. In addition, the inspection apparatus may include only one of the two-dimensional illumination unit and the three-dimensional measurement unit.

又，上述第1～第4實施方式中，示出了於同心圓光源部與檢查對象之間設置有半反射鏡之例，但本發明並不限於此。本發明中，亦可於同心圓光源部與檢查對象之間設置稜鏡。Moreover, in the said 1st - 4th Embodiment, the example which provided the half mirror between the concentric circle light source part and the inspection object was shown, but this invention is not limited to this. In the present invention, a diaphragm may be provided between the concentric light source unit and the inspection object.

又，上述第1～第4實施方式中，示出了換算資訊為換算表之例，但本發明並不限於此。本發明中，換算資訊亦可為將RGB比率換算成傾斜角度之換算用函數。In addition, in the above-described first to fourth embodiments, the conversion information is shown as an example of the conversion table, but the present invention is not limited to this. In the present invention, the conversion information may also be a conversion function for converting the RGB ratio into the tilt angle.

又，上述第1～第4實施方式中，示出了基於檢查對象之傾斜角度，檢測零件之裂縫及零件之隆起之例，但本發明並不限於此。本發明中，亦可基於檢查對象之傾斜角度，檢測檢查對象(零件及基板等)之變形。Moreover, in the said 1st - 4th Embodiment, based on the inclination angle of an inspection object, the example which detects the crack of a component and the bulge of a component was shown, but this invention is not limited to this. In the present invention, deformation of the inspection object (components, substrates, etc.) may be detected based on the inclination angle of the inspection object.

又，上述第1～第4實施方式中，示出了基於檢查對象之傾斜角度，檢測半導體晶圓晶片之裂縫之例，但本發明並不限於此。本發明中，亦可基於檢查對象之傾斜角度，檢測LED零件之塑模部分(透明樹脂部分)之裂縫。In addition, in the above-mentioned first to fourth embodiments, the example in which cracks in semiconductor wafers are detected based on the inclination angle of the inspection object is shown, but the present invention is not limited to this. In the present invention, cracks in the mold portion (transparent resin portion) of the LED component can also be detected based on the inclination angle of the inspection object.

又，上述第1～第4實施方式中，示出了根據檢查對象之傾斜角度與檢查對象之高度資訊，檢測零件之隆起之例，上述檢查對象之傾斜角度係基於攝像部對照射了RGB同心圓光之檢查對象的拍攝結果所得，上述檢查對象之高度資訊係利用三維計測部所得，但本發明並不限於此。本發明中，亦可根據檢查對象之傾斜角度與檢查對象之高度資訊，檢測零件之裂縫，上述檢查對象之傾斜角度係基於攝像部對照射了RGB同心圓光之檢查對象的拍攝結果所得，上述檢查對象之高度資訊係利用三維計測部所得。又，本發明中，如若可能，亦可僅根據基於攝像部對照射了RGB同心圓光之檢查對象之拍攝結果所得的檢查對象之傾斜角度，檢測零件之隆起。In the above-mentioned first to fourth embodiments, an example is shown in which the bulge of the component is detected based on the inclination angle of the inspection object and the height information of the inspection object. The height information of the inspection object is obtained from the photographing result of the inspection object of the circular light, and the above-mentioned height information of the inspection object is obtained by the three-dimensional measurement unit, but the present invention is not limited to this. In the present invention, cracks in parts can also be detected based on the inclination angle of the inspection object and the height information of the inspection object. The inclination angle of the inspection object is obtained based on the result of photographing the inspection object irradiated with RGB concentric circle light by the imaging unit. The height information of the object is obtained by the three-dimensional measurement unit. Furthermore, in the present invention, if possible, the bulge of the component may be detected based only on the inclination angle of the inspection object obtained based on the result of photographing the inspection object irradiated with RGB concentric circle light by the imaging unit.

又，上述第1及第4實施方式中，為便於說明，使用按照處理流程依序進行處理之流程驅動型流程對控制處理進行了說明，但本發明並不限於此。本發明中，亦可藉由以事件單位執行處理之事件驅動型(event driven type)處理進行控制處理。於該情形時，可用完全之事件驅動型來進行，亦可組合事件驅動與流程驅動來進行。Furthermore, in the above-described first and fourth embodiments, the control processing has been described using a flow-driven flow in which processing is performed sequentially in accordance with the processing flow for convenience of description, but the present invention is not limited to this. In the present invention, control processing can also be performed by event driven type processing in which processing is performed in units of events. In this case, a complete event-driven approach can be used, or a combination of event-driven and process-driven approaches can be used.

10:基板搬送輸送器 20:頭移動機構 21:X軸馬達 22:Y軸馬達 23:Z軸馬達 30:攝像頭部 31:攝像部 31a:物鏡 31b:成像透鏡 31c:攝像元件 31d:鏡筒 32:同心圓照明部 32a:同心圓光源部 32b:照射透鏡 32c:半反射鏡 33:二維照明部 33a:圓頂照明部 33b:低角度照明部 34:三維計測部 40:控制裝置 41:控制部 42:記憶部 42a:換算資訊 43:圖像處理部 44:攝像控制部 45:照明控制部 46:馬達控制部 51:反射部 52:光源部 53:安裝部 54:光源部 61:紅色光源 62:綠色光源 63:藍色光源 64:擴散板 65:間隔板 71:白色光源 72:RGB同心圓彩色濾光片 72a:紅色濾光片 72b:綠色濾光片 72c:藍色濾光片 73:擴散板 100:安裝基板檢查裝置 132:同心圓照明部 200:安裝基板檢查裝置 300:安裝基板檢查裝置 332:同心圓照明部 332a:同心圓光源部 366:白色光源 400:安裝基板檢查裝置 E:零件 I:照射立體角 J:治具 O:觀察立體角 P:安裝基板 P1:檢查對象 10: Substrate transfer conveyor 20: Head moving mechanism 21: X-axis motor 22: Y-axis motor 23: Z-axis motor 30: Camera head 31: Camera Department 31a: Objective lens 31b: Imaging Lens 31c: camera element 31d: lens barrel 32: Concentric circle lighting 32a: Concentric circle light source part 32b: Illumination lens 32c: Half mirror 33: 2D Lighting Department 33a: Dome lighting section 33b: Low Angle Lighting Section 34: 3D Measurement Department 40: Control device 41: Control Department 42: Memory Department 42a: Conversion information 43: Image Processing Department 44: Camera Control Department 45: Lighting Control Department 46: Motor Control Department 51: Reflector 52: Light source part 53: Installation Department 54: Light source part 61: red light source 62: Green light source 63: blue light source 64: Diffuser plate 65: Spacer 71: White light source 72: RGB concentric circle color filter 72a: red filter 72b: Green filter 72c: blue filter 73: Diffuser plate 100: Install the board inspection device 132: Concentric circle lighting department 200: Install the board inspection device 300: Install the board inspection device 332: Concentric circle lighting 332a: Concentric circle light source 366: White light source 400: Install the board inspection device E: Parts I: Irradiation solid angle J: Jig O: observation solid angle P: Mounting substrate P1: check object

圖1係表示第1實施方式之安裝基板檢查裝置之模式圖。 圖2係表示第1實施方式之同心圓照明部及攝像部之模式圖。 圖3A係從與光軸大致正交之方向觀察第1實施方式之同心圓照明部之第1例之光源部所得之模式圖。 圖3B係從光軸方向觀察第1實施方式之同心圓照明部之第1例之光源部所得之模式圖。 圖4A係從與光軸大致正交之方向觀察第1實施方式之同心圓照明部之第2例之光源部所得之模式圖。 圖4B係從光軸方向觀察第1實施方式之同心圓照明部之第2例之光源部所得之模式圖。 圖5係用以說明第1實施方式之同心圓照明部所發出之RGB同心圓光之模式圖。 圖6係用以說明利用第1實施方式之安裝基板檢查裝置獲取檢查對象之傾斜角度之原理的模式圖。 圖7係用以說明與第1實施方式之檢查對象之傾斜角度對應之RGB各顏色之明度之變化的曲線圖。 圖8A係表示第1實施方式之觀察立體角之模式圖。 圖8B係表示第1實施方式之照射立體角之模式圖。 圖8C係表示第1實施方式之包含極限角度之模式圖。 圖9係用以說明與第1實施方式之檢查對象之傾斜角度對應之RGB比率變化、及對將RGB比率換算成傾斜角度之換算資訊之獲取的模式圖。 圖10係用以說明第1實施方式之零件裂縫之檢測之模式圖。 圖11係用以說明第1實施方式之零件隆起之檢測之模式圖。 圖12係用以說明第1實施方式之表格獲取處理之流程圖。 圖13係用以說明第1實施方式之表格獲取處理之模式圖。 圖14係用以說明第1實施方式之基板檢查處理之流程圖。 圖15係表示第2實施方式之同心圓照明部及攝像部之模式圖。 圖16係表示第3實施方式之同心圓照明部及攝像部之模式圖。 圖17係用以說明第3實施方式之同心圓照明部所發出之RGB同心圓光之模式圖。 圖18係用以說明與第3實施方式之檢查對象之傾斜角度對應之RGB比率之變化的曲線圖。 圖19A係從與光軸大致正交之方向觀察第4實施方式之同心圓照明部之光源部所得之模式圖。 圖19B係從光軸方向觀察第4實施方式之同心圓照明部之光源部所得之模式圖。 圖20係用以說明不具有色相之面中之RGB比率之模式圖。 圖21係用以說明具有色相之面中之RGB比率之模式圖。 圖22係用以說明第4實施方式之色相資訊之獲取以及基於色相資訊之修正之模式圖。 圖23係用以說明第4實施方式之基板檢查處理之流程圖。 FIG. 1 is a schematic view showing a mounted substrate inspection apparatus according to the first embodiment. FIG. 2 is a schematic diagram showing a concentric circle illumination unit and an imaging unit according to the first embodiment. 3A is a schematic view of the light source part of the first example of the concentric circle illumination part of the first embodiment viewed from a direction substantially orthogonal to the optical axis. 3B is a schematic view of the light source portion of the first example of the concentric circle illumination portion of the first embodiment, viewed from the optical axis direction. 4A is a schematic view of the light source portion of the second example of the concentric circle illumination portion of the first embodiment, viewed from a direction substantially orthogonal to the optical axis. 4B is a schematic view of the light source part of the second example of the concentric circle illumination part of the first embodiment, viewed from the optical axis direction. FIG. 5 is a schematic diagram for explaining the RGB concentric circle lights emitted by the concentric circle illumination part of the first embodiment. FIG. 6 is a schematic diagram for explaining the principle of acquiring the inclination angle of the inspection object by the mounted board inspection apparatus according to the first embodiment. FIG. 7 is a graph for explaining the change of the lightness of each color of RGB according to the inclination angle of the inspection object of the first embodiment. FIG. 8A is a schematic view showing an observation solid angle of the first embodiment. FIG. 8B is a schematic view showing the irradiation solid angle of the first embodiment. FIG. 8C is a schematic diagram including a limit angle of the first embodiment. 9 is a schematic diagram for explaining the change of the RGB ratio according to the inclination angle of the inspection object in the first embodiment, and the acquisition of conversion information for converting the RGB ratio into the inclination angle. FIG. 10 is a schematic diagram for explaining the detection of the part crack in the first embodiment. FIG. 11 is a schematic diagram for explaining the detection of the component bulge according to the first embodiment. FIG. 12 is a flowchart for explaining the table acquisition process of the first embodiment. FIG. 13 is a schematic diagram for explaining the table acquisition process of the first embodiment. FIG. 14 is a flowchart for explaining the substrate inspection process of the first embodiment. FIG. 15 is a schematic diagram showing a concentric circle illumination unit and an imaging unit according to the second embodiment. FIG. 16 is a schematic diagram showing a concentric circle illumination unit and an imaging unit according to the third embodiment. FIG. 17 is a schematic diagram for explaining the RGB concentric circle lights emitted by the concentric circle illumination part of the third embodiment. FIG. 18 is a graph for explaining the change of the RGB ratio according to the inclination angle of the inspection object in the third embodiment. 19A is a schematic view of the light source part of the concentric circle illumination part of the fourth embodiment viewed from a direction substantially orthogonal to the optical axis. 19B is a schematic view of the light source part of the concentric circle illumination part of the fourth embodiment viewed from the optical axis direction. FIG. 20 is a schematic diagram for explaining the ratio of RGB in a plane without hue. FIG. 21 is a schematic diagram for explaining the ratio of RGB in a plane with hue. FIG. 22 is a schematic diagram for explaining acquisition of hue information and correction based on hue information in the fourth embodiment. FIG. 23 is a flowchart for explaining the substrate inspection process of the fourth embodiment.

31:攝像部 31: Camera Department

31a:物鏡 31a: Objective lens

31b:成像透鏡 31b: Imaging Lens

31c:攝像元件 31c: camera element

31d:鏡筒 31d: lens barrel

32:同心圓照明部 32: Concentric circle lighting

32a:同心圓光源部 32a: Concentric circle light source part

32b:照射透鏡 32b: Illumination lens

32c:半反射鏡 32c: Half mirror

P1:檢查對象 P1: check object

Claims (13)

一種安裝基板檢查裝置，其具備： 攝像部，其對包含安裝有零件之安裝基板的檢查對象進行拍攝； 同心圓照明部，其對上述檢查對象照射呈同心圓狀配置有紅色(R)、綠色(G)及藍色(B)之RGB同心圓光；以及 控制部，其進行以下控制，即，基於上述攝像部對照射了上述RGB同心圓光之上述檢查對象的拍攝結果，獲取上述檢查對象之傾斜角度，並且基於所獲取之上述檢查對象之傾斜角度，檢查上述檢查對象之狀態。 A mounting board inspection device, comprising: an imaging unit for photographing an inspection object including a mounting substrate on which components are mounted; A concentric circle illumination unit for irradiating the inspection object with RGB concentric circles of light in which red (R), green (G), and blue (B) are arranged concentrically; and a control unit that performs control to acquire an inclination angle of the inspection object based on a result of photographing the inspection object irradiated with the RGB concentric light by the imaging unit, and to inspect the inspection object based on the acquired inclination angle of the inspection object The status of the above inspection objects. 如請求項1之安裝基板檢查裝置，其中 上述控制部構成為，基於拍攝結果中之上述檢查對象之紅色、綠色及藍色之比率即RGB比率，獲取上述檢查對象之傾斜角度。 The mounting board inspection device of claim 1, wherein The said control part is comprised so that the inclination angle of the said inspection object may be acquired based on the ratio of red, green, and blue of the said inspection object in the imaging result, ie, the RGB ratio. 如請求項2之安裝基板檢查裝置，其中 上述控制部構成為，基於上述檢查對象之RGB比率、與將預先獲取之RGB比率換算成傾斜角度之換算資訊，獲取上述檢查對象之傾斜角度。 The mounting board inspection device of claim 2, wherein The control unit is configured to acquire the inclination angle of the inspection object based on the RGB ratio of the inspection object and conversion information for converting the RGB ratio acquired in advance into the inclination angle. 如請求項1至3中任一項之安裝基板檢查裝置，其中 上述同心圓照明部包含呈同心圓狀配置之紅色光源、綠色光源及藍色光源，或者包含白色光源、及配置於與上述白色光源對向之位置之RGB同心圓彩色濾光片。 The mounting board inspection apparatus according to any one of claims 1 to 3, wherein The concentric circle illumination portion includes red light sources, green light sources, and blue light sources arranged in concentric circles, or includes white light sources, and RGB concentric circle color filters arranged at positions opposite to the white light sources. 如請求項1至4中任一項之安裝基板檢查裝置，其中 上述同心圓照明部構成為照射上述RGB同心圓光，上述RGB同心圓光包含RGB三種顏色各1圈，且於同心圓最外側包含與RGB中之位於同心圓中心之顏色相同之顏色。 The mounting board inspection apparatus of any one of claims 1 to 4, wherein The concentric circle illumination unit is configured to illuminate the RGB concentric circle light, the RGB concentric circle light includes three colors of RGB and one circle each, and the outermost side of the concentric circle includes the same color as the color located in the center of the concentric circle among the RGB. 如請求項1至5中任一項之安裝基板檢查裝置，其中 上述控制部構成為進行以下控制，即，基於上述檢查對象之傾斜角度，檢測傾斜角度之變化點作為裂縫。 The mounting board inspection apparatus according to any one of claims 1 to 5, wherein The said control part is comprised so that it may perform control which detects the change point of an inclination angle as a crack based on the inclination angle of the said inspection object. 如請求項6之安裝基板檢查裝置，其中 上述零件包含半導體晶圓晶片， 上述控制部構成為進行以下控制，即，基於上述檢查對象之傾斜角度，檢測上述半導體晶圓晶片之裂縫。 The mounting board inspection device of claim 6, wherein The above-mentioned parts include semiconductor wafer chips, The said control part is comprised so that it may perform the control which detects the crack of the said semiconductor wafer based on the inclination angle of the said inspection object. 如請求項1至7中任一項之安裝基板檢查裝置，其中 上述控制部構成為進行以下控制，即，基於上述檢查對象之傾斜角度，檢測上述安裝基板上之上述零件之隆起。 The mounting board inspection device of any one of claims 1 to 7, wherein The said control part is comprised so that it may perform the control which detects the protrusion of the said component on the said mounting board based on the inclination angle of the said inspection object. 如請求項1至8中任一項之安裝基板檢查裝置，其進而具備三維計測部， 上述三維計測部能夠計測上述檢查對象之高度資訊， 上述控制部構成為進行以下控制，即，根據上述檢查對象之傾斜角度與上述檢查對象之高度資訊，檢查上述檢查對象之狀態，上述檢查對象之傾斜角度係基於上述攝像部對照射了上述RGB同心圓光之上述檢查對象的拍攝結果所得，上述檢查對象之高度資訊係利用上述三維計測部所得。 The mounting board inspection apparatus according to any one of claims 1 to 8, further comprising a three-dimensional measurement unit, The three-dimensional measurement unit can measure the height information of the inspection object, The control unit is configured to perform control for inspecting the state of the inspection object based on the inclination angle of the inspection object and the height information of the inspection object, and the inclination angle of the inspection object is based on the imaging unit irradiating the RGB concentrically. The photographing result of the inspection object of the circular light is obtained, and the height information of the inspection object is obtained by the three-dimensional measurement unit. 如請求項1至9中任一項之安裝基板檢查裝置，其中 上述攝像部具有拍攝用透鏡， 上述同心圓照明部構成為，使用上述拍攝用透鏡，對上述檢查對象照射上述RGB同心圓光。 The mounting board inspection device of any one of claims 1 to 9, wherein The imaging unit has an imaging lens, The said concentric circle illumination part is comprised so that the said RGB concentric circle light may be irradiated to the said inspection object using the said imaging lens. 如請求項10之安裝基板檢查裝置，其中 上述拍攝用透鏡係於上述攝像部中配置於最靠近上述檢查對象側之位置之物鏡。 The mounting board inspection device of claim 10, wherein The said imaging lens is an objective lens arrange|positioned at the position closest to the said inspection object side in the said imaging part. 如請求項1至11中任一項之安裝基板檢查裝置，其中 上述控制部構成為，基於上述攝像部對照射了上述RGB同心圓光之上述檢查對象的拍攝結果、與從照射了白色光之上述檢查對象之拍攝結果獲取的上述檢查對象之色相資訊，獲取上述檢查對象之傾斜角度。 The mounting board inspection apparatus according to any one of claims 1 to 11, wherein The control unit is configured to acquire the inspection based on a result of photographing the inspection object irradiated with the RGB concentric circles of light by the imaging unit, and hue information of the inspection object obtained from a result of photographing the inspection object irradiated with white light The tilt angle of the object. 一種檢查裝置，其具備： 攝像部，其拍攝檢查對象； 同心圓照明部，其對上述檢查對象照射呈同心圓狀配置有紅色(R)、綠色(G)及藍色(B)之RGB同心圓光；以及 控制部，其進行以下控制，即，基於上述攝像部對照射了上述RGB同心圓光之上述檢查對象的拍攝結果，獲取上述檢查對象之傾斜角度，並且基於所獲取之上述檢查對象之傾斜角度，檢查上述檢查對象之狀態。 An inspection device comprising: The camera department, which photographs the inspection object; A concentric circle illumination unit for irradiating the inspection object with RGB concentric circles of light in which red (R), green (G), and blue (B) are arranged concentrically; and a control unit that performs control to acquire an inclination angle of the inspection object based on a result of photographing the inspection object irradiated with the RGB concentric light by the imaging unit, and to inspect the inspection object based on the acquired inclination angle of the inspection object The status of the above inspection objects.
TW110102101A 2020-11-30 2021-01-20 Mounting-board inspection apparatus and inspection apparatus TW202223338A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
WOPCT/JP2020/044568 2020-11-30
PCT/JP2020/044568 WO2022113369A1 (en) 2020-11-30 2020-11-30 Mounting-board inspection apparatus and inspection apparatus

Publications (1)

Publication Number Publication Date
TW202223338A true TW202223338A (en) 2022-06-16

Family

ID=81754218

Family Applications (1)

Application Number Title Priority Date Filing Date
TW110102101A TW202223338A (en) 2020-11-30 2021-01-20 Mounting-board inspection apparatus and inspection apparatus

Country Status (4)

Country Link
JP (1) JPWO2022113369A1 (en)
KR (1) KR20230097145A (en)
TW (1) TW202223338A (en)
WO (1) WO2022113369A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024041395A (en) * 2022-09-14 2024-03-27 株式会社Ｓｃｒｅｅｎホールディングス Imaging device

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3551188B2 (en) * 2002-01-10 2004-08-04 オムロン株式会社 Surface condition inspection method and substrate inspection device
JP4389982B2 (en) * 2007-08-09 2009-12-24 オムロン株式会社 Substrate visual inspection device
JP6287360B2 (en) * 2014-03-06 2018-03-07 オムロン株式会社 Inspection device
JP2015210226A (en) * 2014-04-30 2015-11-24 三菱電機株式会社 Visual inspection device and visual inspection method
JP5866573B1 (en) * 2015-03-23 2016-02-17 マシンビジョンライティング株式会社 Inspection lighting device and inspection system
JP6791631B2 (en) * 2016-01-06 2020-11-25 株式会社サキコーポレーション Image generation method and inspection equipment
CN106289099B (en) * 2016-07-28 2018-11-20 汕头大学 A kind of single camera vision system and the three-dimensional dimension method for fast measuring based on the system
JP6954142B2 (en) * 2018-01-17 2021-10-27 オムロン株式会社 Image inspection equipment and lighting equipment

Also Published As

Publication number Publication date
KR20230097145A (en) 2023-06-30
WO2022113369A1 (en) 2022-06-02
JPWO2022113369A1 (en) 2022-06-02

Similar Documents

Publication Publication Date Title
US5995220A (en) Semiconductor package inspection apparatus
US7471381B2 (en) Method and apparatus for bump inspection
EP1116950A1 (en) Method and apparatus for inspecting a printed circuit board assembly
WO2010082901A2 (en) System and method for inspecting a wafer
EP2387796A2 (en) System and method for inspecting a wafer
US20090123060A1 (en) inspection system
KR101876934B1 (en) Vision Detecting Device
JP2003279334A (en) Three-dimensional measuring apparatus, filter lattice moire plate and illuminating means
JP2014526706A (en) Non-contact type component inspection apparatus and component inspection method
KR100281881B1 (en) cream solder inspection apparatus and the method thereof
JP7174768B2 (en) 3D measuring device
WO2012124260A1 (en) Solder height detection method and solder height detection device
KR960005091B1 (en) Bonding wire inspection apparatus
JP2015190826A (en) Substrate inspection device
KR100956547B1 (en) Apparatus and method for measuring three dimension shape of a object
KR102393237B1 (en) Conductive ball inspection and repair device
TW202223338A (en) Mounting-board inspection apparatus and inspection apparatus
KR101431917B1 (en) examination apparatus of package
TW201520511A (en) 3D measurement device, 3D measurement method, and manufacturing method of substrate
JP4084383B2 (en) Vision inspection apparatus and vision inspection method using a total reflection mirror
US20030025906A1 (en) Optical inspection of solder joints
JP2009162492A (en) Inspection apparatus
KR20050085957A (en) Image recognition apparatus and image recognition method
KR100833717B1 (en) Vision inspection system
KR101876391B1 (en) Apparatus for inspecting three dimension Using multi-channel image of single color light Moire