KR20230070014A - 무선 센서 모듈 및 무선 센서 모듈을 구성하는 모듈러 시스템 - Google Patents

무선 센서 모듈 및 무선 센서 모듈을 구성하는 모듈러 시스템 Download PDF

Info

Publication number
KR20230070014A
KR20230070014A KR1020237013079A KR20237013079A KR20230070014A KR 20230070014 A KR20230070014 A KR 20230070014A KR 1020237013079 A KR1020237013079 A KR 1020237013079A KR 20237013079 A KR20237013079 A KR 20237013079A KR 20230070014 A KR20230070014 A KR 20230070014A
Authority
KR
South Korea
Prior art keywords
module
sensor
wireless sensor
sensor module
wireless
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
KR1020237013079A
Other languages
English (en)
Korean (ko)
Inventor
요하네스 에크
아르노 크룩
가브리엘 바흐만
크리스티안 무에시크
미카엘 하이더
크리스티안 프로홈마더
세바스티안 거츠
토마스 아이페르트
크리스티안 비를
랄스 고에틀
하이코 케른
Original Assignee
비카 알렉산더 비간드 에스이 운트 코. 케이쥐.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 비카 알렉산더 비간드 에스이 운트 코. 케이쥐. filed Critical 비카 알렉산더 비간드 에스이 운트 코. 케이쥐.
Publication of KR20230070014A publication Critical patent/KR20230070014A/ko
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H05K7/1427—Housings
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D21/00—Measuring or testing not otherwise provided for
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D11/00—Component parts of measuring arrangements not specially adapted for a specific variable
    • G01D11/24—Housings ; Casings for instruments
    • G01D11/245—Housings for sensors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D7/00—Indicating measured values
    • G—PHYSICS
    • G08—SIGNALLING
    • G08C—TRANSMISSION SYSTEMS FOR MEASURED VALUES, CONTROL OR SIMILAR SIGNALS
    • G08C17/00—Arrangements for transmitting signals characterised by the use of a wireless electrical link
    • G08C17/02—Arrangements for transmitting signals characterised by the use of a wireless electrical link using a radio link
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L67/00—Network arrangements or protocols for supporting network services or applications
    • H04L67/01—Protocols
    • H04L67/12—Protocols specially adapted for proprietary or special-purpose networking environments, e.g. medical networks, sensor networks, networks in vehicles or remote metering networks
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04L—TRANSMISSION OF DIGITAL INFORMATION, e.g. TELEGRAPHIC COMMUNICATION
    • H04L69/00—Network arrangements, protocols or services independent of the application payload and not provided for in the other groups of this subclass
    • H04L69/18—Multiprotocol handlers, e.g. single devices capable of handling multiple protocols
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04Q—SELECTING
    • H04Q9/00—Arrangements in telecontrol or telemetry systems for selectively calling a substation from a main station, in which substation desired apparatus is selected for applying a control signal thereto or for obtaining measured values therefrom
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0243—Printed circuits associated with mounted high frequency components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0086—Casings, cabinets or drawers for electric apparatus portable, e.g. battery operated apparatus
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10151—Sensor

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Signal Processing (AREA)
  • Computing Systems (AREA)
  • General Health & Medical Sciences (AREA)
  • Medical Informatics (AREA)
  • Health & Medical Sciences (AREA)
  • Computer Security & Cryptography (AREA)
  • Arrangements For Transmission Of Measured Signals (AREA)
  • Measuring Fluid Pressure (AREA)
KR1020237013079A 2020-09-21 2021-07-21 무선 센서 모듈 및 무선 센서 모듈을 구성하는 모듈러 시스템 Pending KR20230070014A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102020124535 2020-09-21
DE102020124535.1 2020-09-21
PCT/EP2021/070349 WO2022058071A1 (de) 2020-09-21 2021-07-21 Funksensormodul und baukastensystem zur bildung eines funksensormoduls

Publications (1)

Publication Number Publication Date
KR20230070014A true KR20230070014A (ko) 2023-05-19

Family

ID=77316986

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020237013079A Pending KR20230070014A (ko) 2020-09-21 2021-07-21 무선 센서 모듈 및 무선 센서 모듈을 구성하는 모듈러 시스템

Country Status (7)

Country Link
US (1) US20230225071A1 (https=)
EP (1) EP4214472A1 (https=)
JP (1) JP7625072B2 (https=)
KR (1) KR20230070014A (https=)
CN (1) CN116761985B (https=)
BR (1) BR112023003251A2 (https=)
WO (1) WO2022058071A1 (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025254493A1 (ko) * 2024-06-07 2025-12-11 엘지이노텍 주식회사 수도 계량기 검침장치
WO2025254491A1 (ko) * 2024-06-07 2025-12-11 엘지이노텍 주식회사 수도 계량기 검침장치

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR3144482B1 (fr) * 2022-12-26 2025-01-03 Lacroix Group Dispositif de surveillance étanche
US20250389556A1 (en) * 2024-06-25 2025-12-25 Rosemount Inc. Sensor devices with option modules

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0396810A (ja) * 1989-09-08 1991-04-22 Omron Corp 多回転アブソリュートエンコーダ
JP2009187742A (ja) * 2008-02-05 2009-08-20 Hitachi Maxell Ltd 電池パック
US8042402B2 (en) 2008-05-01 2011-10-25 General Electric Company Modular sensor assembly
CN102197509B (zh) * 2008-09-09 2014-11-26 江森自控帅福得先进能源动力系统有限责任公司 用于电池组件的互连垫圈组件
US8686902B2 (en) * 2009-05-13 2014-04-01 Norberto Lopez Antenna structures
EP2498202A3 (en) * 2009-10-02 2012-11-28 Research In Motion Limited Connector and system for connectors for a mobile device
DK2517473T3 (da) * 2009-12-22 2013-07-01 Abb As Trådløs sensoranordning og fremgangsmåde til trådløs kommunikation af en affølt fysisk parameter
DE102010056038A1 (de) * 2010-12-16 2012-03-08 Stöber Antriebstechnik GmbH & Co. KG Aufnahme für einen Langzeit-Energiespeicher eines Encoders
DE102011107303A1 (de) * 2011-07-06 2013-01-10 Techem Energy Services Gmbh Vorrichtung zur Halterung einer Antenne und einer Batterie
US9322678B1 (en) * 2012-06-08 2016-04-26 Electrochem Solutions, Inc. Antenna covering for wireless sensor
CN203100729U (zh) * 2013-03-11 2013-07-31 浙江维思无线网络技术有限公司 一种实时在线监测倾斜角度的无线传感器
US10213272B2 (en) * 2013-12-27 2019-02-26 Inter-Med, Inc. Piezoelectric device and circuitry
TWM479863U (zh) * 2014-02-06 2014-06-11 Da-Min Peng 雙通式無線溫度及壓力感應器
DE102014215504A1 (de) 2014-08-06 2016-02-11 Robert Bosch Gmbh Sensormodul mit mindestens einer Schnittstelle
US20160104374A1 (en) * 2014-10-08 2016-04-14 Gentex Corporation Secondary security and authentication for trainable transceiver
CN204461452U (zh) * 2015-01-28 2015-07-08 北京耐朗智能科技有限公司 无线传感器
EP3148219B1 (en) * 2015-09-28 2020-12-02 Oticon A/s Hearing device
CN106891676B (zh) * 2015-12-21 2018-12-07 上海保隆汽车科技股份有限公司 角度可调的轮胎压力发射机及装配结构
DE102016211592A1 (de) * 2016-06-28 2017-12-28 Stabilo International Gmbh Federnder Batteriekontakt mit Sensorschutz
DE102016008517A1 (de) * 2016-07-15 2018-01-18 Testo SE & Co. KGaA Datenlogger
US11735778B2 (en) * 2016-09-20 2023-08-22 Honeywell Limited Battery pack device with casings for multiple cells
DE102016124796A1 (de) * 2016-12-19 2018-06-21 Endress+Hauser Conducta Gmbh+Co. Kg Sensorkopfmodul zur kontinuierlichen automatisierten Datenerfassung
JP6313883B2 (ja) 2017-05-16 2018-04-18 株式会社木幡計器製作所 計器用ｉｃタグユニット、計器用ｉｃタグシステム、ｉｃタグユニットを備えた計器及びｉｃタグユニットを備えた計器の校正方法
DE102017113983A1 (de) * 2017-06-23 2018-12-27 Husqvarna Ab Befestigungsvorrichtung für mobile Energiespeicher, Tragevorrichtung für mobile Energiespeicher, sowie tragbare Energiespeichervorrichtung
DE102017213863A1 (de) * 2017-08-09 2019-02-14 Robert Bosch Gmbh Drucksensor zum Messen eines Drucks eines Fluids und Verfahren zum Herstellen eines Drucksensors zum Messen eines Drucks eines Fluids
CN107645035A (zh) * 2017-08-30 2018-01-30 维沃移动通信有限公司 一种电池盖结构及移动终端
US11116984B2 (en) * 2017-09-08 2021-09-14 Advanced Bionics Ag Extended length antenna assembly for use within a multi-component system
JP7035471B2 (ja) * 2017-11-16 2022-03-15 横河電機株式会社 測定器
CN108200262A (zh) * 2018-01-05 2018-06-22 深圳市信维通信股份有限公司 一种手机天线测试装置
CN108414003A (zh) * 2018-01-15 2018-08-17 厦门致联科技有限公司 一种智能检测仪
CN208606779U (zh) * 2018-08-21 2019-03-15 西安因联信息科技有限公司 一种内置天线式的无线智能传感器
CN109617217A (zh) * 2019-01-09 2019-04-12 成都凯天电子股份有限公司 自供电无线传感器
CN110793575A (zh) * 2019-11-23 2020-02-14 浙江托普云农科技股份有限公司 一种农田信息监测装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2025254493A1 (ko) * 2024-06-07 2025-12-11 엘지이노텍 주식회사 수도 계량기 검침장치
WO2025254491A1 (ko) * 2024-06-07 2025-12-11 엘지이노텍 주식회사 수도 계량기 검침장치

Also Published As

Publication number Publication date
EP4214472A1 (de) 2023-07-26
JP7625072B2 (ja) 2025-01-31
JP2023543674A (ja) 2023-10-18
US20230225071A1 (en) 2023-07-13
BR112023003251A2 (pt) 2023-04-04
WO2022058071A1 (de) 2022-03-24
CN116761985A (zh) 2023-09-15
CN116761985B (zh) 2026-03-31

Similar Documents

Publication Publication Date Title
KR20230070014A (ko) 무선 센서 모듈 및 무선 센서 모듈을 구성하는 모듈러 시스템
US8580423B2 (en) Bus bar holder and battery pack including the same
KR101108181B1 (ko) 배터리팩
US10637109B2 (en) Battery pack including contact arrangement contacting cladding surface of battery cell for a handheld power tool
KR101986384B1 (ko) 이차전지모듈용 센싱어셈블리 및 상기 센싱어셈블리를 구비한 이차전지모듈
JP6927051B2 (ja) 蓄電装置
CN101944752B (zh) 电源装置
US11489234B2 (en) Energy storage apparatus
KR20040040350A (ko) 전자기기의 전원공급장치
KR20070110567A (ko) 방수기능을 구비한 ｂｍｓ
KR102505611B1 (ko) 배터리 팩
EP2562846A1 (en) Battery, battery holder and battery assembling method
KR20100044194A (ko) 인터섹트하는 배터리 공동들
US11165124B2 (en) Battery pack
US5827619A (en) Battery holder
KR20180105142A (ko) 통신 장치
JP2007294281A (ja) 電池パック
KR20010092656A (ko) 전지를 내장한 휴대전기기기
JP2012084452A (ja) ねじ形電池
JP2017016886A (ja) 蓄電装置
KR200247738Y1 (ko) 양면 장착이 가능한 배터리 팩
CN117677105A (zh) 电控总成
JP2002260607A (ja) 電子機器
KR20090026698A (ko) 전지 팩
JPH0851726A (ja) 電子機器

Legal Events

Date Code Title Description
PA0105 International application

St.27 status event code: A-0-1-A10-A15-nap-PA0105

PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

P11 Amendment of application requested

Free format text: ST27 STATUS EVENT CODE: A-2-2-P10-P11-NAP-X000 (AS PROVIDED BY THE NATIONAL OFFICE)

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000