KR20230065160A - 레이저 가공 장치 및 레이저 가공 방법 - Google Patents
레이저 가공 장치 및 레이저 가공 방법 Download PDFInfo
- Publication number
- KR20230065160A KR20230065160A KR1020220139949A KR20220139949A KR20230065160A KR 20230065160 A KR20230065160 A KR 20230065160A KR 1020220139949 A KR1020220139949 A KR 1020220139949A KR 20220139949 A KR20220139949 A KR 20220139949A KR 20230065160 A KR20230065160 A KR 20230065160A
- Authority
- KR
- South Korea
- Prior art keywords
- region
- wafer
- modified region
- line
- processing
- Prior art date
Links
- 238000012545 processing Methods 0.000 title claims abstract description 261
- 238000003672 processing method Methods 0.000 title claims description 30
- 230000002093 peripheral effect Effects 0.000 claims abstract description 28
- 230000004048 modification Effects 0.000 claims abstract description 11
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- 238000000034 method Methods 0.000 claims description 127
- 230000008569 process Effects 0.000 claims description 113
- 230000001678 irradiating effect Effects 0.000 claims description 65
- 238000007781 pre-processing Methods 0.000 claims description 40
- 238000009966 trimming Methods 0.000 abstract description 30
- 235000012431 wafers Nutrition 0.000 description 226
- 230000015572 biosynthetic process Effects 0.000 description 27
- 238000005755 formation reaction Methods 0.000 description 27
- 238000010586 diagram Methods 0.000 description 24
- 238000003754 machining Methods 0.000 description 24
- 239000004973 liquid crystal related substance Substances 0.000 description 17
- 230000004075 alteration Effects 0.000 description 16
- 239000004065 semiconductor Substances 0.000 description 13
- 230000006866 deterioration Effects 0.000 description 12
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- 238000005336 cracking Methods 0.000 description 5
- 230000006870 function Effects 0.000 description 5
- 230000007246 mechanism Effects 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 230000015654 memory Effects 0.000 description 4
- 238000002407 reforming Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
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- 238000003860 storage Methods 0.000 description 4
- 206010073261 Ovarian theca cell tumour Diseases 0.000 description 3
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- 238000005520 cutting process Methods 0.000 description 2
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- 239000011159 matrix material Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
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Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/50—Working by transmitting the laser beam through or within the workpiece
- B23K26/53—Working by transmitting the laser beam through or within the workpiece for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/40—Removing material taking account of the properties of the material involved
- B23K26/402—Removing material taking account of the properties of the material involved involving non-metallic material, e.g. isolators
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Laser Beam Processing (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Dicing (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021180559A JP2023069018A (ja) | 2021-11-04 | 2021-11-04 | レーザ加工装置、及び、レーザ加工方法 |
| JPJP-P-2021-180559 | 2021-11-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230065160A true KR20230065160A (ko) | 2023-05-11 |
Family
ID=86172276
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020220139949A KR20230065160A (ko) | 2021-11-04 | 2022-10-27 | 레이저 가공 장치 및 레이저 가공 방법 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2023069018A (zh) |
| KR (1) | KR20230065160A (zh) |
| CN (1) | CN116060781A (zh) |
| TW (1) | TW202330135A (zh) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5456510B2 (ja) | 2010-02-23 | 2014-04-02 | 株式会社ディスコ | レーザ加工装置 |
-
2021
- 2021-11-04 JP JP2021180559A patent/JP2023069018A/ja active Pending
-
2022
- 2022-10-21 TW TW111140055A patent/TW202330135A/zh unknown
- 2022-10-27 KR KR1020220139949A patent/KR20230065160A/ko unknown
- 2022-11-02 CN CN202211360346.3A patent/CN116060781A/zh active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5456510B2 (ja) | 2010-02-23 | 2014-04-02 | 株式会社ディスコ | レーザ加工装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023069018A (ja) | 2023-05-18 |
| CN116060781A (zh) | 2023-05-05 |
| TW202330135A (zh) | 2023-08-01 |
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