KR20230058638A - Led 디바이스 및 led 디바이스를 제조하는 방법 - Google Patents
Led 디바이스 및 led 디바이스를 제조하는 방법 Download PDFInfo
- Publication number
- KR20230058638A KR20230058638A KR1020237007769A KR20237007769A KR20230058638A KR 20230058638 A KR20230058638 A KR 20230058638A KR 1020237007769 A KR1020237007769 A KR 1020237007769A KR 20237007769 A KR20237007769 A KR 20237007769A KR 20230058638 A KR20230058638 A KR 20230058638A
- Authority
- KR
- South Korea
- Prior art keywords
- led
- layer
- region
- porous
- light emitting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
- H10H20/818—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous within the light-emitting regions
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- H01L33/32—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
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- H01L27/156—
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- H01L33/007—
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- H01L33/06—
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- H01L33/08—
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- H01L33/16—
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- H01L33/46—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/813—Bodies having a plurality of light-emitting regions, e.g. multi-junction LEDs or light-emitting devices having photoluminescent regions within the bodies
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/84—Coatings, e.g. passivation layers or antireflective coatings
- H10H20/841—Reflective coatings, e.g. dielectric Bragg reflectors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/01—Manufacture or treatment
- H10H29/012—Manufacture or treatment of active-matrix LED displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/30—Active-matrix LED displays
Landscapes
- Led Devices (AREA)
Applications Claiming Priority (21)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2012103.4 | 2020-08-04 | ||
| GBGB2012103.4A GB202012103D0 (en) | 2020-08-04 | 2020-08-04 | Semiconductor structure |
| GB2012105.9 | 2020-08-04 | ||
| GBGB2012108.3A GB202012108D0 (en) | 2020-08-04 | 2020-08-04 | Semiconductor structure |
| GB2012098.6 | 2020-08-04 | ||
| GB2012110.9 | 2020-08-04 | ||
| GBGB2012098.6A GB202012098D0 (en) | 2020-08-04 | 2020-08-04 | Semiconductor structure |
| GB2012108.3 | 2020-08-04 | ||
| GBGB2012105.9A GB202012105D0 (en) | 2020-08-04 | 2020-08-04 | Semiconductor structure |
| GBGB2012110.9A GB202012110D0 (en) | 2020-08-04 | 2020-08-04 | Semiconductor structure |
| GB2018016.2 | 2020-11-16 | ||
| GBGB2018016.2A GB202018016D0 (en) | 2020-11-16 | 2020-11-16 | Red led and method of manufacture |
| PCT/GB2021/050158 WO2021148813A1 (en) | 2020-01-22 | 2021-01-22 | Semiconductor structure and method of manufacture |
| GBPCT/GB2021/050152 | 2021-01-22 | ||
| GBPCT/GB2021/050147 | 2021-01-22 | ||
| GBPCT/GB2021/050158 | 2021-01-22 | ||
| PCT/GB2021/050152 WO2021148808A1 (en) | 2020-01-22 | 2021-01-22 | Red led and method of manufacture |
| PCT/GB2021/050147 WO2021148803A1 (en) | 2020-01-22 | 2021-01-22 | Micro-led and manufacturing method thereof |
| GBGB2110882.4A GB202110882D0 (en) | 2020-08-04 | 2021-07-28 | LED and method of manufacture |
| GB2110882.4 | 2021-07-28 | ||
| PCT/GB2021/052020 WO2022029434A1 (en) | 2020-08-04 | 2021-08-04 | Led device and method of manufacturing an led device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230058638A true KR20230058638A (ko) | 2023-05-03 |
Family
ID=80120107
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020237007769A Pending KR20230058638A (ko) | 2020-08-04 | 2021-08-04 | Led 디바이스 및 led 디바이스를 제조하는 방법 |
Country Status (7)
| Country | Link |
|---|---|
| US (2) | US12563866B2 (cg-RX-API-DMAC7.html) |
| EP (2) | EP4193392B1 (cg-RX-API-DMAC7.html) |
| JP (2) | JP7844440B2 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20230058638A (cg-RX-API-DMAC7.html) |
| CN (1) | CN116250091A (cg-RX-API-DMAC7.html) |
| TW (1) | TWI905241B (cg-RX-API-DMAC7.html) |
| WO (1) | WO2022029434A1 (cg-RX-API-DMAC7.html) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7469677B2 (ja) * | 2019-11-26 | 2024-04-17 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| TW202315111A (zh) | 2021-07-28 | 2023-04-01 | 英商普羅科技有限公司 | 顯示裝置 |
| GB202213149D0 (en) | 2022-09-08 | 2022-10-26 | Poro Tech Ltd | Method of separating a semiconductor device from a substrate |
| GB202213939D0 (en) | 2022-09-23 | 2022-11-09 | Poro Tech Ltd | Monolithic array of semiconductor devices, display device, template wafer and method of manufacture |
| GB202216889D0 (en) | 2022-11-11 | 2022-12-28 | Poro Tech Ltd | Opto-electronic device and method of manufacturing |
| GB202218165D0 (en) | 2022-12-02 | 2023-01-18 | Poro Tech Ltd | Opto-electronic device having an electrical interconnection layer |
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| JP3352118B2 (ja) | 1992-08-25 | 2002-12-03 | キヤノン株式会社 | 半導体装置及びその製造方法 |
| JP4005275B2 (ja) | 1999-08-19 | 2007-11-07 | 日亜化学工業株式会社 | 窒化物半導体素子 |
| JP5379973B2 (ja) | 2004-05-10 | 2013-12-25 | ザ リージェンツ オブ ザ ユニバーシティ オブ カリフォルニア | 有機金属気相成長法による非極性窒化インジウムガリウム薄膜、ヘテロ構造物およびデバイスの製作 |
| JP4525500B2 (ja) | 2005-07-14 | 2010-08-18 | パナソニック電工株式会社 | 半導体発光素子およびそれを用いる照明装置ならびに半導体発光素子の製造方法 |
| KR100691444B1 (ko) | 2005-11-19 | 2007-03-09 | 삼성전기주식회사 | 질화물 반도체 발광소자 |
| JP2007173316A (ja) | 2005-12-19 | 2007-07-05 | Matsushita Electric Ind Co Ltd | 窒化物半導体発光素子及びその製造方法 |
| US20090001416A1 (en) | 2007-06-28 | 2009-01-01 | National University Of Singapore | Growth of indium gallium nitride (InGaN) on porous gallium nitride (GaN) template by metal-organic chemical vapor deposition (MOCVD) |
| JP2009021361A (ja) | 2007-07-11 | 2009-01-29 | Sumitomo Electric Ind Ltd | 窒化物系半導体発光素子、および窒化物系半導体発光素子を作製する方法 |
| WO2009038324A2 (en) | 2007-09-18 | 2009-03-26 | Chungbuk National University Industry-Academic Cooperation Foundation | Porous pattern semiconductor structure and semiconductor device and manufacturing method thereof |
| CN101821861B (zh) | 2007-10-12 | 2012-02-01 | 新加坡科技研究局 | 不含磷的基于氮化物的红和白发光二极管的制造 |
| US7928448B2 (en) * | 2007-12-04 | 2011-04-19 | Philips Lumileds Lighting Company, Llc | III-nitride light emitting device including porous semiconductor layer |
| TWI392118B (zh) | 2008-12-04 | 2013-04-01 | 廣鎵光電股份有限公司 | 發光二極體之製造方法及發光二極體 |
| KR20130007557A (ko) | 2010-01-27 | 2013-01-18 | 예일 유니버시티 | GaN 소자의 전도도 기반 선택적 에칭 및 그의 응용 |
| US8575592B2 (en) * | 2010-02-03 | 2013-11-05 | Cree, Inc. | Group III nitride based light emitting diode structures with multiple quantum well structures having varying well thicknesses |
| JP5349420B2 (ja) | 2010-08-04 | 2013-11-20 | 株式会社東芝 | 半導体発光素子の製造方法 |
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| WO2013140320A1 (en) | 2012-03-19 | 2013-09-26 | Koninklijke Philips N.V. | Light emitting device grown on a silicon substrate |
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| JP2014127708A (ja) | 2012-12-27 | 2014-07-07 | Toshiba Corp | 半導体発光素子及び半導体発光素子の製造方法 |
| JP2014187159A (ja) | 2013-03-22 | 2014-10-02 | Rohm Co Ltd | 半導体発光素子 |
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| WO2018063391A1 (en) | 2016-09-30 | 2018-04-05 | Intel Corporation | High performance light emitting diode and monolithic multi-color pixel |
| EP3529838B1 (en) | 2016-10-24 | 2022-02-23 | Nanosys, Inc. | Indium gallium nitride red light emitting diode and method of making thereof |
| US10708995B2 (en) | 2017-05-12 | 2020-07-07 | The Regents Of The University Of Michigan | Color mixing monolithically integrated light-emitting diode pixels |
| US10734545B2 (en) | 2017-06-21 | 2020-08-04 | The Regents Of The University Of Michigan | Monolithically integrated InGaN/GaN quantum nanowire devices |
| US20200152841A1 (en) * | 2017-07-31 | 2020-05-14 | Yale University | Nanoporous micro-led devices and methods for making |
| US10439101B2 (en) | 2017-08-18 | 2019-10-08 | Intel Corporation | Micro light-emitting diode (LED) elements and display |
| JP7062757B2 (ja) | 2017-09-27 | 2022-05-06 | ケンブリッジ エンタープライズ リミテッド | 材料および半導体構造を多孔質化する方法 |
| US11005004B2 (en) | 2017-10-20 | 2021-05-11 | Korea Advanced Institute Of Science And Technology | Micro light emitting diode (LED) structure, method for manufacturing the same and display including the same |
| CN107946417B (zh) | 2017-11-29 | 2019-09-03 | 北京工业大学 | 一种全色微型led阵列垂直外延制备方法 |
| CN110034216A (zh) | 2018-01-12 | 2019-07-19 | 中国科学院苏州纳米技术与纳米仿生研究所 | Iii-v族氮化物深紫外发光二极管结构及其制作方法 |
| GB201801337D0 (en) * | 2018-01-26 | 2018-03-14 | Cambridge Entpr Ltd | Method for etching a semiconductor structure |
| CN108520911A (zh) | 2018-04-11 | 2018-09-11 | 山东大学 | 一种具有纳米多孔GaN分布布拉格反射镜的InGaN基蓝光发光二极管的制备方法 |
-
2021
- 2021-08-03 TW TW110128574A patent/TWI905241B/zh active
- 2021-08-04 WO PCT/GB2021/052020 patent/WO2022029434A1/en not_active Ceased
- 2021-08-04 KR KR1020237007769A patent/KR20230058638A/ko active Pending
- 2021-08-04 JP JP2023507872A patent/JP7844440B2/ja active Active
- 2021-08-04 CN CN202180067709.1A patent/CN116250091A/zh active Pending
- 2021-08-04 EP EP21752135.0A patent/EP4193392B1/en active Active
- 2021-08-04 US US18/040,542 patent/US12563866B2/en active Active
- 2021-08-04 EP EP25189661.9A patent/EP4608102A3/en active Pending
-
2026
- 2026-01-27 US US19/461,257 patent/US20260231564A1/en active Pending
- 2026-04-01 JP JP2026060025A patent/JP2026113572A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP2023536361A (ja) | 2023-08-24 |
| EP4608102A3 (en) | 2025-11-12 |
| JP7844440B2 (ja) | 2026-04-13 |
| EP4193392A1 (en) | 2023-06-14 |
| CN116250091A (zh) | 2023-06-09 |
| TW202221938A (zh) | 2022-06-01 |
| US12563866B2 (en) | 2026-02-24 |
| JP2026113572A (ja) | 2026-07-07 |
| US20230290903A1 (en) | 2023-09-14 |
| US20260231564A1 (en) | 2026-08-06 |
| WO2022029434A1 (en) | 2022-02-10 |
| TWI905241B (zh) | 2025-11-21 |
| EP4608102A2 (en) | 2025-08-27 |
| EP4193392B1 (en) | 2025-07-16 |
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