KR20230046253A - 전자 부품의 실장 장치 및 전자 부품의 실장 방법 - Google Patents
전자 부품의 실장 장치 및 전자 부품의 실장 방법 Download PDFInfo
- Publication number
- KR20230046253A KR20230046253A KR1020220123391A KR20220123391A KR20230046253A KR 20230046253 A KR20230046253 A KR 20230046253A KR 1020220123391 A KR1020220123391 A KR 1020220123391A KR 20220123391 A KR20220123391 A KR 20220123391A KR 20230046253 A KR20230046253 A KR 20230046253A
- Authority
- KR
- South Korea
- Prior art keywords
- electronic component
- mounting
- suction
- mounting head
- collet
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000000758 substrate Substances 0.000 claims abstract description 84
- 238000012546 transfer Methods 0.000 claims description 49
- 238000001179 sorption measurement Methods 0.000 claims description 43
- 238000013459 approach Methods 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 2
- 230000000977 initiatory effect Effects 0.000 claims 1
- 230000007246 mechanism Effects 0.000 description 108
- 238000003384 imaging method Methods 0.000 description 62
- 239000007789 gas Substances 0.000 description 37
- 235000012431 wafers Nutrition 0.000 description 33
- 238000006073 displacement reaction Methods 0.000 description 15
- 238000010586 diagram Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000012423 maintenance Methods 0.000 description 8
- 239000004065 semiconductor Substances 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
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- 230000009471 action Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 238000012937 correction Methods 0.000 description 4
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- 239000011148 porous material Substances 0.000 description 3
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- 239000000470 constituent Substances 0.000 description 2
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- 230000005484 gravity Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
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- 230000003313 weakening effect Effects 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 210000004185 liver Anatomy 0.000 description 1
- 239000007937 lozenge Substances 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Die Bonding (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021159119 | 2021-09-29 | ||
| JPJP-P-2021-159119 | 2021-09-29 | ||
| JPJP-P-2022-148805 | 2022-09-20 | ||
| JP2022148805A JP2023050145A (ja) | 2021-09-29 | 2022-09-20 | 電子部品の実装装置及び電子部品の実装方法 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20230046253A true KR20230046253A (ko) | 2023-04-05 |
Family
ID=85770166
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020220123391A KR20230046253A (ko) | 2021-09-29 | 2022-09-28 | 전자 부품의 실장 장치 및 전자 부품의 실장 방법 |
Country Status (3)
| Country | Link |
|---|---|
| KR (1) | KR20230046253A (zh) |
| CN (1) | CN115881589A (zh) |
| TW (1) | TWI827281B (zh) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63124746A (ja) | 1986-11-14 | 1988-05-28 | Toshiba Corp | 亀甲形コイルの製造方法 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6839143B2 (ja) * | 2017-09-28 | 2021-03-03 | 芝浦メカトロニクス株式会社 | 素子実装装置、素子実装方法及び素子実装基板製造方法 |
| JP7465197B2 (ja) * | 2019-12-17 | 2024-04-10 | 芝浦メカトロニクス株式会社 | 素子実装装置 |
-
2022
- 2022-09-28 CN CN202211196992.0A patent/CN115881589A/zh active Pending
- 2022-09-28 KR KR1020220123391A patent/KR20230046253A/ko not_active Application Discontinuation
- 2022-09-28 TW TW111136733A patent/TWI827281B/zh active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63124746A (ja) | 1986-11-14 | 1988-05-28 | Toshiba Corp | 亀甲形コイルの製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI827281B (zh) | 2023-12-21 |
| CN115881589A (zh) | 2023-03-31 |
| TW202314924A (zh) | 2023-04-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| E902 | Notification of reason for refusal |