KR20230035912A - Apparatus for treating a substrate and Nozzle unit - Google Patents

Abstract

Provided is a nozzle unit for supplying a processing liquid onto a substrate. The nozzle unit includes: a main body in which an inner space for receiving the processing liquid from a fluid supply line is formed, and a jetting body in which an outlet for discharging the processing liquid onto a substrate is formed. The jetting body is moved between a discharge position drawn from the inner space of the main body and a stand-by position drawn into the inner space of the main body by hydraulic pressure and elastic force of the processing liquid supplied to the main body. Therefore, a substrate processing device does not require an actuator that provides a driving force such as rotation or linear movement of a support rod to move a nozzle arm.

Description

Substrate treatment device and nozzle unit {Apparatus for treating a substrate and Nozzle unit}

The present invention relates to a substrate processing method and a substrate processing apparatus, and more particularly, to a substrate processing method and a substrate processing apparatus for liquid processing a substrate by supplying a liquid to the substrate.

A semiconductor process includes a process of cleaning thin films, foreign substances, particles, and the like on a substrate. These processes are performed by placing a substrate on a spin head with the pattern side facing up or down, supplying a processing liquid to the substrate while rotating the spin head, and then drying the wafer.

The supply of the treatment liquid onto the substrate is performed by the nozzle unit 600 . When the process is not in progress, the nozzle unit 600 stands by at the standby position, and when discharging the processing liquid onto the substrate, the nozzle unit 600 moves to the discharging position.

1 schematically shows an example of a general nozzle unit 600 .

The nozzle unit 600 has a support rod and a nozzle arm, and the nozzle arm is supported by the support rod in a cantilever manner. The support rod is rotated about its central axis as shown in FIG. 1 by a driver coupled to its lower end. As a result, the entire nozzle arm is swing-moved to move between the standby position and the ejection position.

2 shows another example of the nozzle unit 600 .

As shown in FIG. 1 , the nozzle unit 600 has a structure in which a nozzle arm is supported by a support rod in a cantilever manner. The support rod is linearly moved by the driver along the guide rail. The linear movement of the support rod causes the nozzle arm to linearly move between the stand-by position and the discharge position. The nozzle unit shown in FIGS. 1 and 2 requires a separate driving unit for swing or linear movement. In addition, since the nozzle arm is cantilevered on the support rod, it is vulnerable to vibration due to the long length of the nozzle arm.

In addition, since the entire nozzle must move between the standby position and the discharge position, a space required for movement is required, thereby increasing the area of the entire equipment.

An object of the present invention is to provide a substrate processing apparatus and a nozzle unit that do not require a driver for providing a driving force such as rotation or linear movement of a support rod to move a nozzle arm.

In addition, an object of the present invention is to provide a substrate processing apparatus and a nozzle unit capable of minimizing vibration or bending of a nozzle arm.

In addition, an object of the present invention is to provide a substrate processing apparatus and a nozzle unit that minimize a movement space required for nozzle movement.

The object of the present invention is not limited thereto, and other objects not mentioned will be clearly understood by those skilled in the art from the following description.

The present invention provides an apparatus for processing a substrate. According to an embodiment, a substrate processing apparatus includes a cup providing a processing space therein, a support unit supporting and rotating a substrate in the processing space, and a nozzle unit supplying a processing fluid to the substrate. The nozzle unit includes a main body in which an inner space for receiving the processing fluid from a fluid supply line is formed, and a jet body in which a discharge port for discharging the processing fluid onto a substrate is formed. The injection body is installed on the main body so as to be movable between a discharge position drawn from the inner space of the main body and a standby position drawn into the inner space of the main body.

According to one embodiment, the injection body extends to the outside of the main body through a flange located in the inner space of the main body and an opening formed in the main body from the flange at each of the standby position and the discharge position, The discharge port may have a discharge arm formed thereon.

According to one embodiment, the injection body may be moved from the standby position to the discharge position by the pressure of the treatment fluid.

According to one embodiment, the inner space of the main body is partitioned into a front space where the opening is formed by the flange and a rear space into which the processing fluid is introduced, and the flange is a portion of the processing fluid introduced into the rear space. It may be provided to be movable in the front and rear directions within the inner space by pressure.

According to one embodiment, the jet body may be provided to be movable from the discharge position to the standby position by an elastic force.

According to one embodiment, an elastic member providing the elastic force may be installed in the front space.

According to one embodiment, the elastic member may be provided to be compressed when the jet body moves from the standby position to the discharge position.

According to one embodiment, the nozzle unit may further include a damper for mitigating an impact when the jet body moves between the standby position and the discharge position.

According to one embodiment, the damper may be located in the front space.

According to one embodiment, the jet body is moved along the longitudinal direction of the jet body between the standby position and the discharge position, and in the discharge position, the jet body discharges the liquid toward the center of the substrate placed on the support unit. can be provided.

According to one embodiment, when viewed from above, a home port in which the spraying body waits may be disposed in a path along the longitudinal direction of the spraying body.

According to one embodiment, the fluid may be a liquid.

In addition, the present invention provides a nozzle unit for supplying a fluid to be treated with a substrate. The nozzle unit includes a main body in which an inner space for receiving the processing fluid from a fluid supply line is formed, and a jet body in which an outlet for discharging the processing fluid onto a substrate is formed. The injection body is installed on the main body so as to be movable between a discharge position drawn from the inner space of the main body and a standby position drawn into the inner space of the main body.

According to one embodiment, the injection body extends to the outside of the main body through a flange located in the inner space of the main body and an opening formed in the main body from the flange at each of the standby position and the discharge position. , A discharge arm having the discharge port formed therein, and the injection body may be moved from the standby position to the discharge position by the pressure of the treatment fluid.

According to one embodiment, the inner space of the main body is partitioned into a front space where the opening is formed by the flange and a rear space into which the processing fluid is introduced, and the flange is a portion of the processing fluid introduced into the rear space. It may be provided to be movable in the front and rear directions within the inner space by pressure.

According to one embodiment, an elastic member providing the elastic force is installed in the front space, one end of the elastic member is fixed to the main body, the other end of the elastic member is fixed to the flange, and the elastic member is The jet body may be provided to be compressed when moving from the standby position to the discharge position, and the jet body may be provided to move from the discharge position to the standby position by an elastic force.

According to one embodiment, the nozzle unit further includes a damper for mitigating an impact when the jet body moves between the standby position and the discharge position, the damper is located in the front space, and one end of the damper is It is fixed to the body, and the other end of the damper may be fixed to the flange.

According to one embodiment of the present invention, a driver providing separate power to move the nozzle unit is unnecessary.

In addition, according to one embodiment of the present invention, vibration of the nozzle unit can be minimized when the nozzle unit moves.

In addition, according to one embodiment of the present invention, the installation area can be reduced by minimizing the moving space of the nozzle unit.

The effects of the present invention are not limited to the above-mentioned effects, and effects not mentioned will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

1 is a view schematically showing an example of a general nozzle unit.
2 is a view schematically showing another example of a general nozzle unit.
3 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention.
FIG. 4 is a diagram schematically showing an embodiment of the liquid processing chamber of FIG. 1 .
5 is a diagram schematically showing a nozzle unit according to an embodiment of the present invention.
6 to 11 are a cross-sectional view of the nozzle unit and a plan view of the substrate processing apparatus showing a state in which the nozzle unit of FIG. 5 is moved between a standby position and an ejection position, respectively.
12 is a diagram schematically showing another example of the liquid processing chamber of the present invention.

Hereinafter, with reference to the accompanying drawings, embodiments of the present invention will be described in detail so that those skilled in the art can easily carry out the present invention. However, the present invention may be implemented in many different forms and is not limited to the embodiments described herein. In addition, in describing preferred embodiments of the present invention in detail, if it is determined that a detailed description of a related known function or configuration may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted. In addition, the same reference numerals are used throughout the drawings for parts having similar functions and actions.

'Including' a certain component means that other components may be further included, rather than excluding other components unless otherwise stated. Specifically, terms such as "comprise" or "having" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features or It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following examples. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes of elements in the figures are exaggerated to emphasize clearer description.

1 is a view schematically showing an example of a general nozzle unit.

2 is a view schematically showing another example of a general nozzle unit.

3 is a plan view schematically showing a substrate processing apparatus according to an embodiment of the present invention.

Referring to FIG. 3 , the substrate processing system includes an index module 10 , a processing module 20 , and a controller (not shown). According to one embodiment, the index module 10 and the processing module 20 are disposed along one direction. Hereinafter, the direction in which the index module 10 and the processing module 20 are disposed is referred to as a first direction 92, and a direction perpendicular to the first direction 92 when viewed from above is referred to as a second direction 94. And, a direction perpendicular to both the first direction 92 and the second direction 94 is referred to as a third direction 96.

The index module 10 transfers the wafer W from the container 80 in which the wafer W is stored to the processing module 20, and transfers the wafer W processed in the processing module 20 to the container 80. stored as The longitudinal direction of the index module 10 is provided in the second direction 94 . The index module 10 has a load port 12 and an index frame 14 . Based on the index frame 14, the load port 12 is located on the opposite side of the processing module 20. The container 80 in which the wafers W are stored is placed in the load port 12 . A plurality of load ports 12 may be provided, and the plurality of load ports 12 may be disposed along the second direction 94 .

As the container 80, an airtight container such as a Front Open Unified Pod (FOUP) may be used. The vessel 80 may be placed on the loadport 12 by a transport means (not shown) such as an overhead transfer, an overhead conveyor, or an automatic guided vehicle or by an operator. can

An index robot 120 is provided on the index frame 14 . A guide rail 140 provided in the second direction 94 is provided in the index frame 14 , and the index robot 120 may be provided to be movable on the guide rail 140 . The index robot 120 includes a hand 122 on which a wafer W is placed, and the hand 122 moves forward and backward, rotates about a third direction 96 as an axis, and rotates in the third direction 96. It may be provided to be movable along. A plurality of hands 122 are provided spaced apart in the vertical direction, and the hands 122 may move forward and backward independently of each other.

The processing module 20 includes a buffer unit 200, a transfer device 300, a liquid processing device 400, and a supercritical processing device 500. The buffer unit 200 provides a space in which the wafer W carried into the processing module 20 and the wafer W unloaded from the processing module 20 temporarily stay. The liquid processing apparatus 400 performs a liquid processing process of liquid treating the wafer W by supplying liquid onto the wafer W. The supercritical processing device 500 performs a drying process of removing liquid remaining on the wafer (W). The transport device 300 transports the wafer W between the buffer unit 200 , the liquid processing device 400 , and the supercritical processing device 500 .

The conveying device 300 may be provided in a first direction 92 in its longitudinal direction. The buffer unit 200 may be disposed between the index module 10 and the transport device 300 . The liquid processing device 400 and the supercritical processing device 500 may be disposed on the side of the conveying device 300 . The liquid processing device 400 and the conveying device 300 may be disposed along the second direction 94 . The supercritical processing device 500 and the transport device 300 may be disposed along the second direction 94 . The buffer unit 200 may be located at one end of the conveying device 300 .

According to an example, the liquid processing devices 400 are disposed on both sides of the conveying device 300, the supercritical processing devices 500 are disposed on both sides of the conveying device 300, and the liquid processing devices 400 are supercritical. It may be disposed closer to the buffer unit 200 than the threshold processing devices 500 . On one side of the transport device 300, the liquid treatment devices 400 may be provided in an arrangement of A X B (where A and B are 1 or a natural number greater than 1, respectively) along the first direction 92 and the third direction 96, respectively. there is. In addition, at one side of the transport device 300, supercritical processing devices 500 are provided along the first direction 92 and the third direction 96, respectively, C X D (C and D are 1 or a natural number greater than 1, respectively). It can be. Unlike the above description, only the liquid processing device 400 may be provided on one side of the transport device 300 and only the supercritical processing device 500 may be provided on the other side.

The transport device 300 has a transport robot 320 . A guide rail 340 having a longitudinal direction in the first direction 92 is provided in the transport device 300 , and the transport robot 320 may be provided to be movable on the guide rail 340 . The transfer robot 320 includes a hand 322 on which the wafer W is placed, and the hand 322 moves forward and backward, rotates about the third direction 96 as an axis, and rotates in the third direction 96. It may be provided to be movable along. A plurality of hands 322 are provided spaced apart in the vertical direction, and the hands 322 may move forward and backward independently of each other.

The buffer unit 200 includes a plurality of buffers 220 on which the wafer W is placed. The buffers 220 may be disposed to be spaced apart from each other along the third direction 96 . The front face and rear face of the buffer unit 200 are open. The front side is a side facing the index module 10, and the rear side is a side facing the conveying device 300. The index robot 120 may approach the buffer unit 200 through the front side, and the transfer robot 320 may approach the buffer unit 200 through the rear side.

A controller (not shown) may control the substrate processing system. The controller 30 may control components of the substrate processing system so that the substrate is processed according to the setting process. In addition, the controller (not shown) includes a process controller composed of a microprocessor (computer) that controls the substrate processing system, a keyboard through which an operator inputs commands to manage the substrate processing device, and the like, and operates the substrate processing device. A user interface consisting of a display that visualizes and displays the situation, a control program for executing processes executed in the substrate processing system under the control of a process controller, and a process for causing each component to execute processes in accordance with various data and process conditions. A storage unit in which a program, that is, a processing recipe, is stored may be provided. Also, the user interface and storage may be connected to the process controller. The processing recipe may be stored in a storage medium of the storage unit, and the storage medium may be a hard disk, a portable disk such as a CD-ROM or a DVD, or a semiconductor memory such as a flash memory.

FIG. 4 is a diagram schematically showing an embodiment of the liquid processing device 400 of FIG. 1. Referring to FIG. 4, the liquid processing device 400 includes a housing 410, a cup 420, and a support unit 440. ), a liquid supply unit 460, and a lifting unit 480. The housing 410 is generally provided in a rectangular parallelepiped shape. The cup 420 , the support unit 440 , and the liquid supply unit 460 are disposed within the housing 410 .

The cup 420 has a processing space with an open top, and the wafer W is liquid-processed in the processing space. The support unit 440 supports the wafer W within the processing space. The liquid supply unit 460 supplies liquid onto the wafer W supported by the support unit 440 . A plurality of types of liquid may be provided, and may be sequentially supplied onto the wafer (W). The lifting unit 480 adjusts the relative height between the cup 420 and the support unit 440 .

According to one example, the cup 420 has a plurality of collection containers 422 , 424 , and 426 . The recovery containers 422 , 424 , and 426 each have a recovery space for recovering liquid used in substrate processing. Each of the collection containers 422 , 424 , and 426 is provided in a ring shape surrounding the support unit 440 . During the liquid treatment process, all chemical liquid scattered by the rotation of the wafer W flows into the recovery space through the inlets 422a, 424a, and 426a of the respective recovery containers 422, 424, and 426. According to one example, the cup 420 has a first collection container 422 , a second collection container 424 , and a third collection container 426 . The first collection container 422 is disposed to surround the support unit 440, the second collection container 424 is disposed to surround the first collection container 422, and the third collection container 426 is disposed to surround the second collection container 426. It is disposed so as to surround the collection container 424. The second inlet 424a for introducing liquid into the second collection container 424 is located above the first inlet 422a for introducing liquid into the first collection container 422, and the third collection container 426 The third inlet 426a through which the liquid flows into may be located above the second inlet 424a.

The support unit 440 has a support plate 442 and a driving shaft 444 . An upper surface of the support plate 442 may be provided in a substantially circular shape and may have a larger diameter than the wafer W. A support pin 442a is provided at the center of the support plate 442 to support the rear surface of the wafer W, and the upper end of the support pin 442a is spaced apart from the support plate 442 by a predetermined distance. 442). A chuck pin 442b is provided at an edge of the support plate 442 . The chuck pin 442b protrudes upward from the support plate 442 and supports the side of the wafer W to prevent the wafer W from being separated from the support unit 440 when the wafer W is rotated. The driving shaft 444 is driven by the driving unit 446, is connected to the center of the bottom surface of the wafer W, and rotates the support plate 442 about its central axis.

According to one example, the liquid supply unit 460 has a nozzle unit. The nozzle unit has a first nozzle 462 , a second nozzle 464 , and a third nozzle 466 . The first nozzle 462 supplies the first liquid onto the wafer (W). The first liquid may be a liquid for removing a film remaining on the wafer W or a foreign material. The second nozzle 464 supplies the second liquid onto the wafer (W). The second liquid may be a liquid that dissolves well in the third liquid. For example, the second liquid may be a liquid that dissolves better in the third liquid than in the first liquid. The second liquid may be a liquid that neutralizes the first liquid supplied on the wafer (W). In addition, the second liquid may be a liquid that neutralizes the first liquid and dissolves well in the third liquid compared to the first liquid. According to one example, the second liquid may be water. The third nozzle 466 supplies the third liquid onto the wafer (W). The third liquid may be a liquid well soluble in the supercritical fluid used in the supercritical processing device 500 . For example, the third liquid may be a liquid that dissolves well in the supercritical fluid used in the supercritical processing device 500 compared to the second liquid. According to one example, the third liquid may be an organic solvent. The organic solvent may be isopropyl alcohol (IPA). According to one example, the supercritical fluid may be carbon dioxide.

The lifting unit 480 moves the cup 420 up and down. The relative height between the cup 420 and the wafer W is changed by the vertical movement of the cup 420 . As a result, since the collection containers 422, 424, and 426 for recovering the entire chemical liquid are changed according to the type of liquid supplied to the wafer W, the liquids can be separately collected. Unlike the above description, the cup 420 is fixedly installed, and the lifting unit 480 may move the support unit 440 in the vertical direction.

5 is a diagram schematically showing a nozzle unit 600 according to an embodiment of the present invention.

According to one embodiment, the nozzle unit 600 has a main body 620, a spray body 640, an elastic member 660, and a damper 680.

The main body 620 has a cylindrical shape with an inner space 624. For example, the main body 620 may be provided in a cylindrical shape. The main body 620 has a front surface 621, a side surface 622 and a rear surface 623. The front surface 621 and the rear surface 623 are each provided as a generally flat plane and are positioned to face each other. The side surface 622 is provided with a circular cross section perpendicular to its longitudinal direction, and has the same cross section along its longitudinal direction. An opening 621a is formed in the center of the front surface 621 . A liquid supply port 674 is installed on the rear side, and a liquid supply line 672 is connected to the liquid supply port 674 .

The injection body 640 discharges the liquid to the substrate. The spray body 640 includes a discharge arm 644 and a flange 642 .

The flange 642 is located in the inner space 624 of the main body 620 . The flange 642 has a thin disk shape. The inner space 624 of the main body 620 is divided into a front space 624a and a rear space 624b by the flange 642. The flange 642 is inside the inner space 624 of the main body 620. It is provided to be movable in the forward and backward directions. A sealing member 646 may be provided between the flange 642 and the inner wall of the main body 620 . The sealing member 646 is fixedly installed on the outer edge of the flange 642 and can move along with the flange 642 . The flange 642 is provided to be movable in the forward and backward directions within the inner space 624 by the pressure of the processing fluid introduced into the rear space 624b.

The discharge arm 644 has a rod shape formed in a straight line in its longitudinal direction. The discharge arm 644 extends from the flange 642 toward the front surface of the main body 620 . The discharge arm 644 extends to the outside of the main body 620 through an opening 621a formed in the main body 620 . A discharge port 644a through which liquid is discharged is formed on the lower surface of the front end of the discharge arm 644 . Optionally, a nozzle for dispensing liquid in a downward direction may be coupled to the discharge port 644a. During the process, the discharge arm 644 discharges the liquid from the center of the substrate when viewed from above. After the process is finished, the discharge arm 644 moves into the spray body 640 and is located in a standby position. A discharge arm 644 extends from the flange 642 forward thereof. The discharge arm 644 is formed in the main body 620 and passes through the opening 621a, and the end of the discharge arm 644 is located outside the main body 620.

The jetting body 640 is moved along the longitudinal direction of the jetting body 640 between the standby position and the discharge position. The discharge position is a position when the processing liquid is supplied to the substrate. The standby position is a position where the spray body 640 stands by after the supply of the treatment liquid to the substrate is completed. During the loading/unloading of the substrate in the standby position, the substrate and the ejection body 640 do not interfere. According to one example, the movement of the injection body 640 from the standby position to the discharge position is performed by hydraulic pressure. When the treatment liquid is supplied into the main body 620 through the liquid supply port 674, the treatment liquid collides with the flange 642, and the flange 642 presses the front of the main body 620 by the hydraulic pressure of the treatment liquid. is moved in the direction With the movement of the flange 642, the injection body 640 is also moved.

The elastic member 660 returns the injection body 640 from the process position to the standby position when the supply of the treatment liquid is completed. The elastic member 660 is located in the front space 624a of the main body 620. The elastic member 660 is provided to be compressed by the flange 642 as the jetting body 640 moves from the standby position to the dispensing position. Thereafter, when the discharge of the treatment liquid onto the substrate is completed and the hydraulic pressure applied to the flange 642 within the main body 620 is reduced, the flange 642 is moved away from the main body 620 by the restoring force of the elastic member 660. is moved in a direction away from the front surface 621 of the As a result, the injection body 640 is moved from the discharge position to the standby position.

According to one example, a spring may be used as the elastic member 660 . One end of the spring is fixedly coupled to the main body 620, and the other end of the spring is fixedly coupled to the flange 642. One or more elastic members 660 may be provided. When a plurality of elastic members 660 are provided, the elastic members 660 may be disposed at equal intervals from each other.

The damper 680 is located in the front space 624a of the main body 620. The damper 680 relieves the movement speed when the spray body 640 moves between the standby position and the discharge position. For example, the damper 680 may be an oil damper. One end of the damper 680 is fixed to the main body 620, and the other end of the damper 680 is fixed to the flange 642. One or a plurality of dampers 680 may be provided.

According to one example, the same number of elastic members 660 and dampers 680 may be provided, and dampers 680 may be respectively provided between adjacent elastic members 660 . Optionally, the elastic members 660 may be provided in greater numbers than the dampers 680 .

When the jetting body 640 is in a standby position, a home port (not shown) may be provided under the discharge port 664a of the jetting body 640 . The liquid remaining in the outlet 664a may be discharged into a home port (not shown), or the surface of the spray body 640 may be cleaned in the home port (not shown).

Next, a process of processing a substrate using the nozzle unit 600 of FIG. 5 will be described using FIGS. 6 to 11 .

6 to 11 are a cross-sectional view of the nozzle unit 600 and a plan view of the substrate processing apparatus showing a state in which the nozzle unit 600 of FIG. 1 is moved between a standby position and a discharge position, respectively.

Initially, as shown in FIGS. 6 and 7 , before the substrate is loaded into the support unit 440, the injection body 640 is placed in a standby position. At this time, a valve installed on the liquid supply line 672 ( 700) is closed, and the elastic member 660 maintains an equilibrium state without being compressed or stretched.

Next, as shown in FIG. 8 , the valve 700 installed on the liquid supply line 672 is opened and the treatment liquid is supplied to the rear space 624b of the main body 620 . The flange 642 of the injection body 640 is moved toward the front of the main body 620 by the hydraulic pressure of the treatment liquid, and thereby the injection body 640 is moved from the standby position to the discharge position. Even when the pressure applied to the flange 642 is high, the damper 680 reduces the movement speed of the flange 642 . The elastic member 660 is compressed by the movement of the flange 642 . When the spray body 640 is moved to the discharge position, the treatment liquid is supplied onto the rotating substrate through the discharge port 644a of the spray body 640 as shown in FIG. 9 . When the discharge of the treatment liquid is completed, the liquid supply line Valve 700 installed on 672 is closed.

As shown in FIG. 10, the flange 642 is moved in a direction toward the rear surface 623 of the main body 620 by the restoring force of the spring, whereby the spray body 640 moves from the discharge position to the standby position. do.

Any one of the first nozzle 462 , the second nozzle 464 , and the third nozzle 466 provided in the substrate processing apparatus may be provided in a structure shown in FIG. 5 . Optionally, as shown in FIG. 12 , each of the first nozzle 462 , the second nozzle 464 , and the third nozzle 466 may be provided in a structure shown in FIG. 5 .

Optionally, a nozzle for supplying gas is additionally provided in the substrate processing apparatus, and the gas supply nozzle may be provided in a structure as shown in FIG. 5 . In this case, the injection body 640 may be moved from the standby position to the discharge position by gas pressure, and may be moved from the discharge position to the standby position by the restoring force of the elastic member 660 .

The above detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and describe preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed in this specification, within the scope equivalent to the written disclosure, and within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in the specific application field and use of the present invention are also possible. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to cover other embodiments as well.

600: nozzle unit 620: main body
624: inner space 624a: front space
624b: rear space 640: injection body
642: flange 644: discharge arm
644a: discharge port 660: elastic member
680: damper

Claims (17)

In the device for processing the substrate
a cup providing a processing space therein;
a support unit for supporting and rotating the substrate in the processing space; and,
A nozzle unit supplying a processing fluid to the substrate;
The nozzle unit,
A main body in which an inner space receiving the treatment fluid from a fluid supply line is formed; and
Including a spray body formed with a discharge port for discharging the processing fluid onto a substrate,
The jetting body is installed on the main body so as to be movable between a discharge position drawn from the inner space of the main body and a standby position drawn into the inner space of the main body. According to claim 1,
The injection body,
a flange positioned within the inner space of the main body at each of the standby position and the discharge position;
A substrate processing apparatus having a discharge arm extending from the flange to the outside of the main body through an opening formed in the main body and having the discharge port formed therein. According to claim 2,
The injection body,
A substrate processing apparatus that is moved from the standby position to the discharge position by the pressure of the processing fluid. According to claim 3,
The inner space of the main body is divided into a front space in which the opening is formed by the flange and a rear space into which the processing fluid is introduced;
The flange is provided to be movable in the front and rear directions within the inner space by the pressure of the processing fluid introduced into the rear space. According to claim 4,
The jetting body is provided to be movable from the discharge position to the standby position by an elastic force. According to claim 5,
An elastic member provided with the elastic force is installed in the front space. According to claim 6,
The elastic member is provided to be compressed when the ejection body moves from the standby position to the ejection position. According to claim 6,
The nozzle unit further includes a damper for mitigating a moving speed of the spray body between the standby position and the ejection position. According to claim 8,
The substrate processing apparatus wherein the damper is located in the front space. According to any one of claims 1 to 9,
The jet body is moved along the longitudinal direction of the jet body between the standby position and the discharge position,
At the ejection position, the ejection body is provided to eject the liquid toward the center of the substrate placed on the support unit. According to claim 10,
When viewed from above, a substrate processing apparatus in which a home port in which the spraying body waits is disposed in a path along a longitudinal direction of the spraying body. According to any one of claims 1 to 9,
The substrate processing apparatus wherein the fluid is a liquid. A nozzle unit for supplying a processing fluid to a substrate,
A main body in which an inner space receiving the treatment fluid from a fluid supply line is formed; and
Including a spray body formed with a discharge port for discharging the processing fluid onto a substrate,
The spray body is installed on the main body so as to be movable between a discharge position drawn from the inner space of the main body and a standby position drawn into the inner space of the main body. According to claim 13,
The injection body,
a flange positioned within the inner space of the main body at each of the standby position and the discharge position;
a discharge arm extending from the flange to the outside of the main body through an opening formed in the main body and having the discharge port;
The injection body,
A nozzle unit moved from the standby position to the discharge position by the pressure of the treatment fluid. According to claim 14,
The inner space of the main body is divided into a front space in which the opening is formed by the flange and a rear space into which the processing fluid is introduced;
The nozzle unit is provided to be movable in the front and rear directions within the inner space by the pressure of the processing fluid introduced into the rear space. According to claim 15,
An elastic member providing the elastic force is installed in the front space,
One end of the elastic member is fixed to the main body, and the other end of the elastic member is fixed to the flange;
The elastic member is provided to be compressed when the spray body moves from the standby position to the discharge position,
The spray body is provided to be movable from the discharge position to the standby position by an elastic force. According to claim 16,
The nozzle unit further includes a damper for mitigating an impact when the jet body moves between the standby position and the discharge position,
The damper is located in the front space,
One end of the damper is fixed to the main body,
The other end of the damper is a nozzle unit fixed to the flange.

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