KR20220167690A - Antenna pattern making device for back cover of electronic devices, how to make back cover of electronic devices equipped with antennas, and back cover of electronic devices equipped with antennas - Google Patents

Abstract

Disclosed are a device and a method for producing an antenna pattern for the back cover of an electronic device, and the back cover of an electronic device manufactured thereby. The device for producing an antenna pattern for the back cover of an electronic device, which forms an antenna pattern on one side of a resin film that will form the back cover of a portable electronic device, comprises: a drum-shaped rotating roll continuously rotating in one direction; a film supply unit for continuously unwinding a resin film to supply the same to the rotating roll; a plurality of heat transfer units for imprinting a specific antenna pattern on one side of the resin film, which continuously moves in one direction along the rotating roll, at regular intervals by using a roll-to-roll transfer method; and a film recovery unit for continuously winding the resin film of which the side is printed with the specific antenna pattern at the regular intervals. The plurality of heat transfer units are aligned in the circumferential direction of the rotating roll at intervals to be adjacent to the rotating roll. The resin film is continuously moved in the direction while coming into contact with the surface of the rotating roll. The plurality of heat transfer units sequentially transfer a conductive pattern to the side of the resin film, which is moved in contact with the surface of the rotating roll, at the same location, so that the specific antenna pattern is formed in a multilayer structure. Therefore, the device can provide the antenna pattern having various thicknesses in one process.

Description

Antenna pattern making device for back cover of electronic devices, how to make back cover of electronic devices with mounted antenna, and antenna pattern making device for back cover of electronic devices, how to make back cover of electronic devices equipped with antennas, and back cover of electronic devices equipped with antennas}

The present invention relates to an antenna pattern manufacturing apparatus, and more particularly, to a continuous transfer method using a roll-to-roll transfer technique to form various antenna patterns on a film layer constituting a back cover of an electronic device with various thicknesses. It relates to an antenna pattern manufacturing device for a back cover of an electronic device that can be implemented, a method for manufacturing a back cover of an electronic device on which an antenna is mounted, and a back cover of an electronic device on which an antenna is mounted.

Among portable electronic devices, a mobile terminal commonly referred to as a 'smart phone' has a large-screen touch display module, and has a high-pixel camera module in addition to a basic function of communication, enabling still and video recording. In addition, music and other multimedia contents can be played, and web surfing can be performed by accessing a network.

In the recent trend of high-performance and multi-functionality, these portable electronic devices can be competitive to be selected in the market only when they are portable and have a relatively beautiful appearance. For example, even if an electronic device has the same function, it can be selected by the market only if it is more lightweight and compact and uses a material with a texture preferred by consumers.

Therefore, electronic device manufacturers are making repeated attempts to develop electronic devices that can exhibit better performance, have various functions, and are lighter, thinner and smaller than competitors' products. Such attempts are being made in the same way in the antenna section, which is an essential component mounted on electronic equipment, that is, in the device section for transmitting and receiving radio waves or information.

Most of the antennas applied to portable electronic devices are built-in antennas. In the case of existing products with relatively small thickness and size restrictions, there was no great difficulty in designing the antenna because of the ample internal mounting space. However, as portable electronic devices become smaller and thinner, antennas must be designed in a size or structure that can be mounted in a small space, which increases the burden and imposes many restrictions on design.

Accordingly, a technique of mounting an antenna on the back cover of an electronic device has been proposed to overcome design problems due to lack of installation space and to also function as an antenna without affecting the function of the device. Korean Patent Publication No. 10-2018-0023095 (hereinafter referred to as 'Prior Document 1') filed under the title of "metal cover for electronic devices including an antenna function" is a representative example.

Prior Document 1 is characterized by forming a metal thin film layer on a transparent substrate, forming a mask layer thereon, and forming an antenna pattern through etching or laser patterning in configuring the antenna on the back cover of a smartphone as an integral type. That is, the prior literature is characterized in that an antenna is formed on one side of the back cover using a silk screen technique or a photosensitive material.

However, as in Prior Document 1, the method of forming an antenna using a silk screen technique or a photosensitive material necessarily requires a photosensitive or drying process, so a complicated process is involved, and the metal thin film layer is partially chemically etched or laser-etched using a mask layer. By patterning, there is a disadvantage in that the patterning operation must be repeated several times in some cases when trying to vary the thickness of the antenna.

Korean Patent Publication No. 10-2018-0023095 (2018.03.07.) Korean Patent Publication No. 10-2021-0058732 (2021.05.24.)

The problem to be solved by the present invention is to manufacture an electronic device back cover with an antenna mounted to solve the difficulties in antenna design accompanying the lack of space due to the smaller and thinner size of portable electronic devices. It is intended to provide an antenna pattern manufacturing device for a device rear cover.

Another problem to be solved by the present invention is that various antenna patterns can be easily implemented on the film layer constituting the back cover by a continuous transfer method using a roll-to-roll transfer technique, and one process It is intended to provide an antenna pattern manufacturing device for an electronic device back cover capable of implementing antenna patterns with various thicknesses.

Another problem to be solved by the present invention is a method for manufacturing a rear cover using an antenna-mounted film (resin film) produced by an antenna pattern manufacturing apparatus for a rear cover, and an antenna capable of suppressing the increase in size and weight of electronic devices. It is intended to provide a rear cover of an electronic device mounted thereon.

According to one aspect of the present invention as a means of solving the problem,

A device for forming an antenna pattern on one side of a resin film constituting a back cover of a portable electronic device,

Drum-shaped rotating rolls continuously rotating in one direction;

a film supply unit for continuously unwinding a resin film and supplying it to the rotating roll;

A plurality of thermal transfer units imprinting a specific antenna pattern at regular intervals in a roll-to-roll transfer method on one side of a resin film continuously moving in one direction along a rotating roll; and

A film recovery unit for continuously winding a resin film having a specific antenna pattern printed on one surface at regular intervals;

The plurality of thermal transfer parts are aligned adjacent to the rotating roll at intervals in the circumferential direction of the rotating roll,

The resin film is continuously moved in one direction in a state in contact with the surface of the rotating roll,

The plurality of thermal transfer units sequentially transfer the conductive pattern to the same position on one side of the resin film moving in contact with the surface of the rotating roll to form the specific antenna pattern in a multi-layered back cover for electronic devices. An antenna pattern manufacturing device is provided.

Here, the rotating roll may be a rubber roll having an elastic surface with a surface contacting the resin film.

In addition, the film supply unit and the film recovery unit are disposed at a distance from each other in the same direction away from the rotation roll, and a first tension roll for imparting tension so that the supplied resin film can adhere to the surface of the rotation roll. A second tension roll installed between the film supply unit and the rotating roll and providing tension so that the recovered resin film remains in contact with the rotating roll until it is separated from the rotating roll is installed between the film collecting unit and the rotating roll. can

In this case, the distance between the first tension roll and the second tension roll may be formed to be smaller than the distance between the film supply unit and the film recovery unit.

In addition, 3 to 8 thermal transfer units adjacent to the rotating roll may be aligned in a circumferential direction of the rotating roll.

In addition, each of the thermal transfer units has a thermal transfer unit having a head on which heating pins are densely mounted in one row on the surface, and a binder film having an Ag binder printed layer formed on one surface thereof. Consisting of a binder film supply roll supplied to the head of the yarn unit and a binder film recovery roll that continuously winds and recovers the remaining binder film after transfer in which the Ag binder printed layer is partially lost due to the exothermic action of the head. can

Here, the heat generation pins individually control heat generation, and the heat generation pins, which individually control heat generation, locally apply heat to the binder film in contact with the resin film to form an Ag binder in a specific pattern on one side of the resin film. The antenna pattern may be formed by transferring.

In addition, the operation of the plurality of thermal transfer units is individually controlled, and the thickness of a specific antenna pattern transferred to one surface of the resin film may be adjusted by the individually controlled thermal transfer units.

An antenna pattern manufacturing apparatus for a back cover of an electronic device according to an aspect of the present invention may further include a curing means for curing a specific antenna pattern transferred to a resin film in a roll-to-roll transfer method.

In this case, the curing means may be configured to be positioned between a thermal transfer unit located at the rearmost part of the plurality of thermal transfer units and the film recovery unit.

In addition, the film supply unit includes a film supply roll that rotates to continuously unwind the resin film, and a front protective film winding roll that removes and winds the front protective film attached to the front surface of the resin film unwound from the film supply roll, It may be configured to include a rear protective film winding roll that removes and winds the rear protective film attached to the rear surface of the resin film unwound from the film supply roll.

Preferably, the film supply unit may further include an encoder roll that detects a moving distance of the resin film continuously supplied to the rotary roll while rotating when the resin film is moved.

In addition, the film recovery unit is provided with a spacer film interposed between a film recovery roll that continuously rotates to wind a resin film having a specific antenna pattern transferred thereto, and a resin film that has been transferred and wound around the film recovery roll. It may include a spacer film roll to supply.

An antenna pattern manufacturing apparatus for an electronic device rear cover according to an aspect of the present invention also,

A marker for marking a location confirmation mark for confirming a re-transfer start location on the resin film continuously moved from the film supply unit toward the rotating roll; and

It may further include a sensor unit that senses the positioning mark and provides sensing information to the control unit.

According to another aspect of the present invention as a means of solving the problem,

Forming a specific antenna pattern on one side of a resin film in a multi-layer structure in a roll-to-roll transfer method using the antenna pattern manufacturing apparatus for a back cover of an electronic device according to one aspect;

Bonding the decoration film to the other side of the resin film on which the specific antenna pattern of the multilayer structure is formed;

Attaching a transparent adhesive film, Optically Clear Adhesive (OCA), on the decoration film; and

Attaching a cover glass on a decoration film using Optically Clear Adhesive (OCA); provides a method for manufacturing a back cover of an electronic device with an antenna mounted thereon.

According to another aspect of the present invention as a means of solving the problem,

On one side, a decoration film is attached to the other side of the resin film formed by the antenna pattern manufacturing device for the back cover of electronic devices according to the above-described aspect, and the cover glass on the decoration film is a transparent adhesive film. Provides an electronic device back cover with an antenna attached through OCA (Optically Clear Adhesive).

According to the antenna pattern manufacturing apparatus for the back cover of an electronic device according to an aspect of the present invention, various antenna patterns are applied to the resin film layer constituting the back cover of the electronic device by a continuous transfer method using a roll-to-roll transfer technique. can be easily implemented, and antenna patterns can be implemented with various thicknesses in one process, so there is an advantage in that it is possible to quickly respond to requests for process reduction and antenna thickness change.

And the electronic device rear cover according to another aspect of the present invention, by mounting the antenna in the form of a single object on one surface (inner surface) of the rear cover, according to the lack of space due to the smaller and thinner size of portable electronic devices It is possible to solve the accompanying difficulties in designing the antenna, and has an advantageous effect on miniaturization, slimming, and lightening of portable electronic devices compared to the conventional method of mounting the antenna on a board.

1 is a device configuration schematically showing an antenna pattern manufacturing apparatus for an electronic device rear cover according to an embodiment of the present invention.
Figure 2 is a view showing a preferred embodiment of the film supply unit shown in Figure 1;
Figure 3 is a view showing a preferred embodiment of the film recovery shown in Figure 1;
4 is an enlarged view of a thermal transfer unit of the thermal transfer unit shown in FIG. 1;
5 is an exploded view of a head of the thermal transfer unit of FIG. 4;
6 is a diagram showing antenna patterns formed in various thicknesses on one surface of a resin film by the apparatus for manufacturing an antenna pattern for a back cover of an electronic device according to an embodiment of the present invention.
7 is a process flow chart illustrating a process of manufacturing a back cover of an electronic device equipped with an antenna using an antenna pattern manufacturing apparatus for a back cover of an electronic device according to an embodiment of the present invention.
8 is a schematic cross-sectional view of an electronic device rear cover manufactured by a rear cover manufacturing method.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Terms used in the specification are only used to describe specific embodiments, and are not intended to limit the present invention. Singular expressions include plural expressions unless the context clearly dictates otherwise.

In this specification, terms such as "comprise" or "having" are intended to indicate that there is a feature, number, step, operation, component, part, or combination thereof described in the specification, but one or more other features or It should be understood that the presence or addition of numbers, steps, operations, components, parts, or combinations thereof is not precluded.

Also, terms such as first and second may be used to describe various components, but the components should not be limited by the terms. In addition, terms such as "...unit", "...unit", and "...module" described in the specification mean a unit that processes at least one function or operation, which may be implemented by hardware or software or a combination of hardware and software. can

In the description with reference to the accompanying drawings, the same reference numerals will be given to the same components, and overlapping descriptions thereof will be omitted. In addition, in the description of the present invention, if it is determined that a detailed description of a related known technology may unnecessarily obscure the subject matter of the present invention, the detailed description will be omitted.

1 is a device configuration diagram schematically showing an antenna pattern manufacturing apparatus for an electronic device rear cover according to an aspect of the present invention, with reference to this, the overall configuration of the electronic device rear cover antenna pattern manufacturing apparatus according to an aspect of the present invention Let's take a look from

Referring to FIG. 1, an antenna pattern manufacturing apparatus according to an aspect of the present invention is a device for forming an antenna pattern on one side of a resin film 100 constituting a back cover of a portable electronic device. (20), a film supply unit 10 for supplying the film 100 to the rotary roll 20, a plurality of thermal transfer units 30 for printing the antenna pattern on the film 100, and recovering the film on which the antenna pattern is printed. It includes a film recovery unit 40 to do.

For reference, in the present invention, the electronic device may include a touch input unit that recognizes a user's touch, and more specifically, a smart phone, tablet, smart watch, laptop, etc. having a touch screen, but depending on the type and characteristics of the electronic device The present invention is not limited or limited by.

The rotary roll 20 is formed in a drum shape and may be configured to continuously rotate in one direction by a drive source not shown, for example, a motor. The film continuously supplied from the film supply unit 10, preferably the resin film 100, is moved in the direction of rotation of the rotary roll 20 in a state in contact with the surface of the rotary roll 20. At this time, the resin film 100 ), that is, the surface of the rotary roll 20 may be a rubber roll that is an elastic surface.

The film supply unit 10 continuously unwinds the resin film 100 and supplies it to the rotary roll 20, and the film recovery unit 40 has a certain antenna pattern on one surface by the plurality of thermal transfer units 30. It functions to continuously wind the printed resin film 100 at intervals. Here, the resin film 100 may be a transparent polyethylene terephthalate (PET) film or a polyimide (PI) film, but is not limited thereto.

The thermal transfer unit 30 is adjacent to the rotation roll 20 and is composed of a plurality aligned at intervals in the circumferential direction of the rotation roll 20 . The thermal transfer unit 30 is a resin that is unwound from the film supply unit 10 and supplied to the rotary roll 20, and continuously moves in one direction (rotational direction of the rotary roll 20) while one surface is in contact with the rotary roll 20. It serves to imprint a specific antenna pattern at regular intervals in a roll-to-roll transfer method on one side of the film 100.

In the drawings, a configuration in which a total of six thermal transfer units 30 are adjacent to each other and arranged at predetermined intervals around the rotary roll 20 is shown as an example, but this is only one preferred embodiment, and the number of thermal transfer units 30 is not limited to the number shown. This is because more antennas can be added or omitted according to specifications, and preferably 3 to 8 antennas can be arranged around the rotating roll 20 at predetermined intervals.

As the rotary roll 20 rotates by the plurality of thermal transfer units 30 arranged at intervals around the rotary roll 20, the resin film 100 moved in contact with the surface of the rotary roll 20 The same conductive pattern is sequentially transferred to one side (the side opposite to the side in contact with the surface of the rotating roll 20) at the same location. Accordingly, one specific antenna pattern may be formed in a multi-layer structure in which the same conductive pattern is stacked in at least two or more layers (see FIG. 6).

An antenna pattern manufacturing apparatus for a back cover of an electronic device according to an aspect of the present invention also includes tension rolls 25 and 26 for imparting tension so that the resin film 100 moved in one direction can be moved while maintaining a tension state includes In the embodiment of the present invention, the tension roll is preferably installed between the first tension roll 25 installed between the film supply unit 10 and the rotation roll 20, and between the rotation roll 20 and the film recovery unit 40. It may be the second tension roll 26 installed.

For reference, the tension rolls 25 and 26 are a compound word of tension, which means physical tension, and a roller that rotates. In the present invention, the resin film (100) in contact with the resin film ( 100) is preferably understood as a term meaning a rotating element that applies tension so that the moving resin film 100 can maintain a tight tension state while performing a rotational movement in accordance with one-way movement.

The first tension roll 25 applies tension so that the resin film 100 supplied from the film supply unit 10 toward the rotary roll 20 adheres to the surface of the rotary roll 20 . In addition, the second tension roll 26 undergoes sequential transfer processing by the thermal transfer unit 30 until the resin film 100 printed with a specific antenna pattern on one side is separated from the rotation roll 20. ) and give tension to maintain the contact state.

As shown in the example of FIG. 1 , the film supply unit 10 and the film recovery unit 40 may be spaced apart from each other in the same direction (left direction in the drawing) away from the rotating roll 20 . At this time, the distance D2 between the first tension roll 25 and the second tension roll 26 is formed narrower than the distance D1 between the film supply unit 10 and the film recovery unit 40, so that the resin film 100 ) can be maintained in close contact with the rotary roll 20 from the moment it is supplied to the rotary roll 20 to the moment it is separated from the rotary roll 20.

The apparatus for manufacturing an antenna pattern for a back cover of an electronic device according to an aspect of the present invention may further include a marker 28 and a sensor unit 29. The marker 28 marks a location confirmation mark for confirming the location where the transfer process starts again on the resin film 100 continuously moved from the film supply unit 10 toward the rotating roll 20, and the sensor unit 29 The location confirmation mark marked on the silver resin film 100 is sensed and related sensing information is provided to the control unit 50 .

Based on the information provided by the sensor unit 29 (information on the position where the transfer process starts again), the control unit 50 recognizes the exact start position (transfer start position) on the resin film 100 where the re-transfer process is to be performed. In addition, the control unit 50 controls the operation of the thermal transfer unit 30 based on the positional information of the recognized resin film 100, so that the precise position on the resin film 100, more specifically, the first conductive pattern Conductive patterns of exactly the same pattern can be transferred.

The sensor unit 29 preferably has a conductive pattern of the same pattern as the thermal transfer unit 30 disposed thereafter at a position that exactly coincides with the position of the conductive pattern transferred onto the resin film 100 via the first thermal transfer unit 30. It may be disposed between the first thermal transfer unit 30 and the second thermal transfer unit 30 based on the moving direction of the resin film 100, as shown in the example of the drawing, so that may be additionally transferred.

In FIG. 1, reference numeral 60 denotes a hardening means. The curing means 60 serves to cure a specific antenna pattern formed by transferring a conductive pattern to one surface of the resin film 100 in several layers in a roll-to-roll transfer method. The curing unit 60 may be located between the thermal transfer unit 30 located at the rearmost position among the plurality of thermal transfer units 30 and the film recovery unit 40 .

The hardening means 60 may vary according to the components of the binder included in the conductive material constituting the antenna pattern. Therefore, it is not specifically limited. For example, when the binder is a thermosetting resin, the curing means 60 may be a heater for dissipating heat toward the resin film 100 on which the antenna pattern is transferred, and when the binder is a photocurable resin, the curing means 60 may be an ultraviolet irradiator.

Figure 2 is a view showing a preferred embodiment of the film supply unit.

Referring to FIG. 2 , the film supply unit 10 includes a film supply roll 12 that rotates to continuously unwind the resin film 100 . A resin film 100, for example, the aforementioned PET film or PI film, is wound on the film supply roll 12 in a roll form, and the front and rear surfaces of the resin film 100 wound on the film supply roll 12 in a roll form. A protective film may be attached to the resin film 100 to prevent surface damage due to friction between the resin films 100 in a wound state.

When the protective film is attached to the front and rear surfaces of the resin film 100 as described above, it is necessary to remove the protective film before a full-scale transfer operation is performed. To this end, the film supply unit 10 removes the front protective film 200 and the rear protective film 300 attached to the front and rear surfaces of the resin film 100 unwound from the film supply roll 12 to protect the surface. A front protective film winding roll 14 and a rear protective film winding roll 16 may be provided.

The film supply unit 10 may also include an encoder roll 18 . The encoder roll 18 is a means for detecting the moving distance of the resin film 100 continuously supplied to the rotary roll 20 while rotating when the resin film 100 moves, and the detected information (resin film 100) It may be communicatively connected to the control unit 50 in a wired/wireless network method to provide the control unit 50 with information about a moving distance of the user.

For reference, the encoder roll 18 is a compound word of an encoder that converts and outputs the amount of physical change in motion elements into an electrical signal and a roller that rotates. In the present invention, the resin film 100 is moved. Converting the physical displacement (moving distance) of the resin film 100 continuously supplied toward the rotating roll 20 while rotating along the electrical signal to output it to the control element (referred to as the control unit 50 in the present invention) means electronic device.

Based on the information provided by the encoder roll 18, the control unit 50 can control the rotational speed of the film recovery roll 42 of the film recovery unit 40, which will be described later. As the amount of winding of the resin film 100 wound around the film recovery roll 42 increases, the moving distance of the resin film 100 increases and the speed increases when the film recovery roll 42 rotates once. This is because if the rotational speed of (42) is always constant, the quality uniformity of the antenna pattern transferred onto the resin film (100) is degraded.

3 is a view showing a preferred embodiment of the film recovery unit.

Referring to FIG. 3 , the film recovery unit 40 includes a film recovery roll 42 . The film recovery roll 42 may be a drive roll (roll rotated by a motor) that continuously rotates to wind the resin film 100 having a specific antenna pattern transferred thereon. The film recovery unit 40 may also include a spacer film roll 44 for supplying the spacer film 500 to be interposed between the transferred resin films 100 wound around the film recovery roll 42, depending on the case. .

In the spacer film roll 44, the resin film 100 is continuously wound around the film recovery roll 42 with the spacer film 500 interposed between the resin films 100 wound around the film recovery roll 42, which is a drive roll. When overlapped in several layers, direct contact between the inside and outside of the resin film 100 is blocked, thereby preventing the specific antenna pattern transferred to the resin film 100 from being deformed or damaged.

FIG. 4 is an enlarged view of the thermal transfer unit 34 of the thermal transfer unit shown in FIG. 1 , and FIG. 5 is an exploded view of the head of the thermal transfer unit 34 of FIG. 4 .

Referring to FIGS. 1 , 4 , and 5 , each thermal transfer unit 30 includes a thermal transfer unit 34 , a binder film supply roll 32 , and a binder film recovery roll 38 . The thermal transfer unit 34 has a head 35 on which heating fins 36 are densely mounted in one row on the surface (see FIG. 5), and the binder film supply roll 32 has an Ag binder printed layer on one side. The binder film 400 on which 420 is formed is continuously unwound and supplied to the head 35 of the thermal transfer unit 34 .

The binder film 400 may have a structure in which an Ag binder printed layer 420 is formed by coating an Ag binder on one surface of a resin film, preferably a transparent PET film 410, in a uniform thickness. Here, the Ag binder may be a material in which Ag sludge and an adhesive component are mixed in a specific ratio. At this time, the adhesive component is a resin, an organic compound (wax), a solvent, and a silicon compound. may consist of

The head 35 of the thermal transfer unit 34 may be configured in the form of a rotating element that rotates in engagement with the rotating roll 20, and the heating fins 36 densely mounted on the surface of the head 35 are the control unit 50 Ag binder in a specific pattern on one surface of the resin film 100 by locally applying heat to the binder film 400 in contact with the resin film 100, as the heat generation is individually controlled by ). may be transferred to form a conductive pattern constituting one antenna pattern.

Preferably, about 3700 to 4000 heating fins 36 in one head 35 may be configured in one row, and each heating fin 36 heats up (about 350 degrees or more) / cools (about 80 degrees or less) As a result, Ag binder transfer of a desired pattern can be performed on the resin film 100 . At this time, the amount of the pattern (length of the pattern) may be adjusted according to the time during which the binder film 400 is exposed to the heating pins 36, that is, the time during which heat is applied to the binder film 400.

That is, according to the individual control of the heating pins 36 and the time for which the heating pins 36 apply heat to the binder film 400, the width of each unit pattern constituting the conductive pattern, as well as the distance between adjacent unit patterns , And the amount of the pattern (pattern length) is adjusted, and as a result, the heating/cooling control of each heating pin 36 and the exposure time of the binder film 400 to the heating pin 36 are controlled to achieve conductivity. This allows the pattern to be implemented in any desired form.

Meanwhile, the binder film recovery roll 38 plays a role of continuously winding and recovering the remaining binder film 400 after transfer in which the Ag binder printed layer 420 is partially lost due to the heating action of the head 35, and the binder film 400 is recovered. The thermal transfer unit 30 composed of the film supply roll 32, the thermal transfer unit 34, and the film recovery roll 42 is individually controlled by the control unit 50 to transfer the resin film 100 to one side. The thickness of a specific antenna pattern to be can be adjusted.

For example, when six thermal transfer units 30 are arranged at intervals around the rotating roll 20 (see FIG. 1), when only one thermal transfer unit 30 is operated, a resin film as shown in FIG. 6 (a) An antenna pattern 120 composed of a single-layer conductive pattern 110 is formed on (100), and when two or three thermal transfer units 30 are operated in sequence, the conductivity as shown in (b) or (c) of FIG. The antenna pattern 120 is implemented in a multi-layer structure in which the pattern 110 is stacked in two or three layers.

Of course, if all six thermal transfer units 30 are set to sequentially transfer conductive patterns of the same pattern to the same location on one surface of the resin film 100, six layers of conductive patterns 110 can be formed in one process (1 cycle). The antenna pattern 120 composed of is implemented. In other words, in the configuration in which six thermal transfer units 30 are distributed around the rotary roll 20 as shown in FIG. 1 , the conductive pattern 110 can be formed in up to six layers in one process.

The conductive pattern 110 constituting the antenna pattern 120 includes Ag sludge as a conductive material. At this time, the resistance value of the conductive pattern varies according to the amount of Ag sludge constituting the conductive pattern 110 . Therefore, by controlling the number of stacking of the conductive pattern 110, it is possible to adjust the resistance value of the entire antenna pattern 120, and it is possible to quickly respond to a request for changing the thickness of the antenna that varies according to product specifications.

According to the apparatus for manufacturing an antenna pattern for a back cover of an electronic device according to an aspect of the present invention, a resin film constituting a back cover of an electronic device by a continuous transfer method using a roll to roll transfer technique. Various antenna patterns can be easily implemented on a layer, and antenna patterns can be implemented with various thicknesses in one process, so it is possible to quickly respond to requests for process reduction and antenna thickness change.

7 is a process flow chart illustrating a process of manufacturing a rear cover of an electronic device having an antenna mounted thereon using the apparatus for manufacturing an antenna pattern for a rear cover of an electronic device according to the above-described aspect.

Referring to FIG. 7, a method for manufacturing a back cover of an electronic device equipped with an antenna according to another aspect of the present invention includes forming a multi-layered structure with a specific antenna pattern on one side of a resin film in a roll-to-roll transfer method (S100), Attaching a decoration film to the other surface of the resin film on the opposite side of the antenna pattern (S200), and attaching an optically clear adhesive (OCA) film on the decoration film (S300).

In step S100, a specific antenna pattern is formed on one surface of the resin film using the above-described antenna pattern manufacturing device, and a plurality of thermal transfer units are individually controlled to vary the number of laminations of the conductive patterns transferred to the resin film to meet the required specifications of the product. The thickness of the antenna is adjusted accordingly, and elements that can add decorativeness, such as various patterns, symbols, and photos, can be transferred or printed on the decoration film.

On the other hand, after the S300 step of attaching OCA (Optically Clear Adhesive), which is a transparent adhesive film, on the decoration film, finally, by using OCA (Optically Clear Adhesive) attached on the decoration film in step S300, cover glass on the decoration film (Cover) Glass) can complete the production of the back cover of the electronic device on which the antenna is mounted.

8 is a schematic cross-sectional view of an electronic device rear cover manufactured by the above-described rear cover manufacturing method, and the electronic device rear cover 1 according to the present embodiment is formed through the antenna pattern manufacturing device for the electronic device rear cover described above on one side. A decoration film 130 is attached to the other surface of the resin film 100 on which the antenna pattern 120 is formed, and a cover glass 150 on the decoration film 130 is an optically clear adhesive (OCA) that is a transparent adhesive film. 140) may be a configuration attached via.

In the electronic device rear cover 1 having such a configuration, the antenna is mounted in the form of a single object on one surface (inner surface) of the rear cover 1, resulting in a lack of space as portable electronic devices become smaller and thinner. It is possible to solve the difficulties in antenna design according to the method, and there is an advantageous effect in miniaturization, slimming, and lightening of portable electronic devices compared to the conventional method of mounting the antenna on a substrate.

In the above detailed description of the present invention, only special embodiments have been described accordingly. However, it should be understood that the present invention is not limited to the particular forms mentioned in the detailed description, but rather it is understood to include all modifications, equivalents and substitutes within the spirit and scope of the present invention as defined by the appended claims. It should be.

1: rear cover 10: film supply unit
12: film supply roll 14: front protective film winding roll
16: back protective film winding roll 18: encoder roll
20: rotation roll 25: first tension roll
26: second tension roll 28: marker
29: sensor unit 30: thermal transfer unit
32: binder film supply roll 34: thermal transfer unit
35: head 36: heating pin
38: binder film recovery roll 40: film recovery unit
42: film recovery roll 44: spacer film roll
50: control unit 60: curing means
100: resin film 110: conductive patterner
120: antenna pattern 200: front protective film
300: back protective film 400: binder film
410: PET film 420: Ag binder printing layer

Claims (16)

A device for forming an antenna pattern on one side of a resin film constituting a back cover of a portable electronic device,
Drum-shaped rotating rolls continuously rotating in one direction;
a film supply unit for continuously unwinding a resin film and supplying it to the rotating roll;
A plurality of thermal transfer units imprinting a specific antenna pattern at regular intervals in a roll-to-roll transfer method on one side of a resin film continuously moving in one direction along a rotating roll; and
A film recovery unit for continuously winding a resin film having a specific antenna pattern printed on one surface at regular intervals;
The plurality of thermal transfer parts are aligned adjacent to the rotating roll at intervals in the circumferential direction of the rotating roll,
The resin film is continuously moved in one direction in a state in contact with the surface of the rotating roll,
The plurality of thermal transfer units sequentially transfer the conductive pattern to the same position on one side of the resin film moving in contact with the surface of the rotating roll to form the specific antenna pattern in a multi-layered back cover for electronic devices. Antenna pattern making device.
According to claim 1,
The rotating roll is an antenna pattern manufacturing device for an electronic device back cover in which the surface in contact with the resin film is an elastic surface.
According to claim 1,
The film supply unit and the film recovery unit are disposed at a distance from each other in the same direction away from the rotating roll,
A first tension roll for applying tension so that the supplied resin film can adhere to the surface of the rotary roll is installed between the film supply unit and the rotary roll,
An antenna pattern manufacturing apparatus for an electronic device rear cover in which a second tension roll for imparting tension to maintain the recovered resin film in contact with the rotary roll until it is separated from the rotary roll is installed between the film recovery unit and the rotary roll.
According to claim 3,
An antenna pattern manufacturing apparatus for an electronic device rear cover in which the distance between the first tension roll and the second tension roll is narrower than the distance between the film supply unit and the film recovery unit.
According to claim 1,
The thermal transfer unit is adjacent to the rotation roll, and 3 to 8 antenna pattern manufacturing apparatus for electronic device back cover are aligned in the circumferential direction of the rotation roll.
According to claim 1,
Each of the thermal transfer units,
A thermal transfer unit having a head on which heating fins are densely mounted in one row on a surface thereof;
A binder film supply roll for continuously unwinding a binder film having an Ag binder printed layer formed on one surface thereof and supplying the binder film to the head of the thermal transfer unit;
An antenna pattern production device for back cover of electronic devices consisting of a binder film recovery roll that continuously winds and recovers the remaining binder film after transfer in which the Ag binder printing layer is partially lost due to the exothermic action of the head.
According to claim 6,
Heating of the heating pins is individually controlled,
The heating pins, which individually control heat generation, locally apply heat to the binder film in contact with the resin film to transfer Ag binder in a specific pattern to one surface of the resin film to form the antenna pattern. Back cover of electronic device Antenna pattern production device for use.
According to claim 1,
The operation of the plurality of thermal transfer units is individually controlled,
An antenna pattern manufacturing device for an electronic device rear cover in which the thickness of a specific antenna pattern transferred to one surface of a resin film is adjusted by thermal transfer units whose operation is individually controlled.
According to claim 1,
A curing means for curing a specific antenna pattern transferred to a resin film in a roll-to-roll transfer method; antenna pattern manufacturing apparatus for a rear cover of an electronic device further comprising a.
According to claim 9,
The curing means is an antenna pattern manufacturing apparatus for an electronic device rear cover located between a thermal transfer unit located at the rear in the process of a plurality of thermal transfer units and the film recovery unit.
According to claim 1,
The film supply unit,
A film supply roll that rotates to continuously unwind the resin film;
A front protective film winding roll that removes and winds the front protective film attached to the front surface of the resin film unwound from the film supply roll;
An antenna pattern manufacturing apparatus for a rear cover of electronic devices including a rear protective film winding roll for removing and winding a rear protective film attached to the rear surface of a resin film unwound from a film supply roll.
According to claim 11,
The film supply unit,
Antenna pattern manufacturing apparatus for an electronic device rear cover further comprising an encoder roll for detecting a moving distance of the resin film continuously supplied to the rotating roll while rotating when the resin film is moved.
According to claim 1,
The film recovery unit,
A film recovery roll that continuously rotates to wind a resin film having a specific antenna pattern transferred thereon;
An antenna pattern manufacturing apparatus for a rear cover of an electronic device comprising a spacer film roll for supplying a spacer film to be interposed between the transfer-treated resin films wound on the film recovery roll.
According to claim 1,
A marker for marking a location confirmation mark for confirming a re-transfer start location on the resin film continuously moved from the film supply unit toward the rotating roll; and
An antenna pattern manufacturing apparatus for a back cover of an electronic device further comprising a sensor unit that senses the positioning mark marked on the resin film and provides the sensed information to the control unit.
Forming a specific antenna pattern in a multi-layer structure on one side of a resin film in a roll-to-roll transfer method using the apparatus for manufacturing an antenna pattern for a rear cover of an electronic device according to any one of claims 1 to 14 ;
Bonding the decoration film to the other side of the resin film on which the specific antenna pattern of the multilayer structure is formed;
Attaching a transparent adhesive film, Optically Clear Adhesive (OCA), on the decoration film; and
Attaching a cover glass on a decoration film using Optically Clear Adhesive (OCA); manufacturing method of a back cover of an electronic device with an antenna mounted thereon.
A decoration film is attached to the other side of the resin film on one side of which a specific antenna pattern is formed through the antenna pattern manufacturing device for the back cover of electronic equipment according to any one of claims 1 to 14,
An electronic device rear cover with an antenna attached to the decoration film through OCA (Optically Clear Adhesive), a transparent adhesive film.

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