KR20220164169A - Conductive particle and testing socket comprsing the same - Google Patents

Abstract

One embodiment of the present invention relates to conductive particles used in a test socket disposed between a device under test and a test board to electrically connect a lead of the device under test and a pad of the test board to each other, wherein the conductive particles include a central portion and a plurality of protrusions protruding in multiple directions based on the central portion.

Description

Conductive particles and test sockets containing them {CONDUCTIVE PARTICLE AND TESTING SOCKET COMPRSING THE SAME}

The present invention relates to conductive particles and a test socket including the same, and more particularly, to conductive particles and the conductive particles are disposed between a device under test and a test board so that leads of the device under test and pads of the test board are electrically connected to each other. It is about a test socket that connects to

In general, after a manufacturing process of a device to be tested, such as a semiconductor device, is completed, a test of the device to be tested is required. That is, the device to be inspected, such as a semiconductor device that has been manufactured, is subjected to an electrical test to determine whether or not it is defective. Specifically, a predetermined test signal is transmitted from the test equipment to the device to be tested to determine whether the device to be tested is defective.

These test sockets have stable mechanical contact ability when each device under test moves to the correct position and make accurate and repeated contact with the socket mounted on the test board, and stable electrical contact ability to minimize signal distortion at the electrical contact point during signal transmission. this is required

At this time, the test board and the device under test are not directly connected to each other, but are indirectly connected using an intermediate device called a test socket. A variety of things such as a pogo pin may be used as the test socket, but recently, due to technological changes in semiconductor devices, test sockets using elastic sheets having anisotropy are increasing.

1 is a view showing contact between a lead and a conductive part of a device under test according to the prior art.

The test socket 10 according to the prior art is formed in a form in which a plurality of conductive particles 12 are contained in a substrate 11 made of an insulating elastic material. The plurality of conductive particles 12 are irregular spherical particles, and are oriented in the thickness direction to form one conductive portion 13, and the conductive portion 13 is the lead 21 of the device under test 20. ) are arranged in the plane direction so as to correspond to Meanwhile, the conductive part is insulated and supported by the insulating support part 11 .

Each of the conductive parts 13 of the test socket 10 is in contact with the pad 31 of the test board 30 in a state of being mounted on the test board 30 . After that, as shown in FIG. ) is pressed, and accordingly, the conductive particles 12 in the conductive part 13 form a state in which electricity can be conducted while being in close contact with each other. Thereafter, when a predetermined test signal is applied from the test board 30, the test signal is transmitted to the device under test 20 via the test socket 10, and the reflected signal from the device under test is reversed to the test socket ( 10) and is transferred to the test board 30.

Such a socket for inspection has a characteristic of exhibiting conductivity only in the thickness direction when pressed in the thickness direction, and since mechanical means such as soldering or springs are not used, durability is excellent and simple electrical connection can be achieved.

In addition, since it can absorb mechanical shock or deformation, it has the advantage of being able to connect smoothly, and is widely used for electrical connection with various electrical circuit devices and test boards.

However, the test socket according to the prior art has the following problems.

First, when the conductive particles are spherical, there is a problem that stable electrical connection is difficult. In general, the wider the contact area, the better the electrical connection. However, since only point contact is possible between spherical particles, the contact area is small, so resistance increases and loss increases, making it difficult to achieve stable connection. There are difficult problems.

In addition, when the conductive particles have a spherical shape and only adjacent conductive particles in the same row are in contact with each other and the contact of some of the conductive particles is broken, the overall contact resistance may increase rapidly.

And, if the conductive particles are spherical, there is a concern that they are easily separated from the elastic material when repeatedly pressed due to the limitation of the compression range. That is, when the electrode of the device to be inspected is repeatedly brought into contact with the conductive particle tens of thousands of times or more in a vertical direction, there is a problem in that the contact force between the elastic material and the conductive particle is weakened or the elastic material is torn. In this way, when the conductive particles are separated from the elastic material, the electrical connection between the electrode and the pad is degraded or lost because the configuration for transmitting the electric flow is lost. In particular, in the case of spherical particles, the contact area with the adjacent elastic material is small, so this problem appears remarkably.

Korean Registered Patent Publication No. 10-1782604 (2017.09.21)

The present invention is to solve the problems of the prior art described above, an object of the present invention is to provide a conductive particle including a central portion and protrusions protruding in multiple directions from the central portion, and a test socket including the same.

One aspect of the present invention is a conductive particle disposed between a device under test and a test board and used in a test socket for electrically connecting a lead of the device under test and a pad of the test board to each other, wherein the conductive particle comprises: And having a plurality of protrusions protruding in multiple directions based on the central portion, it provides conductive particles.

In one embodiment, the protruding part is characterized in that it protrudes in up, down, left and right directions based on the center.

In one embodiment, the length of the conductive particles in the vertical direction is longer than the length in the left-right direction.

In one embodiment, the central portion is characterized in that it extends long in the vertical direction.

In one embodiment, at least one of the protrusions located in the vertical direction of the central portion is characterized in that it extends long in the vertical direction.

In one embodiment, the protrusions located in the left and right directions of the center are characterized in that they are arranged so as to stagger each other with respect to the center.

In one embodiment, the protrusions located in the left and right directions of the center are characterized in that they are arranged so as to stagger each other with respect to the center.

In one embodiment, the end of the protrusion is characterized in that formed to be curved.

In one embodiment, a test socket including conductive particles, comprising: a conductive part disposed between a device under test and a test board to electrically connect a lead of the device under test and a pad of the test board to each other; and an insulating portion surrounding the conductive portion and supporting the conductive portion so as to be spaced apart from each other. and wherein the conductive particles are aligned in the conductive portion and contact each other, and the conductive portion includes an intermediate layer in which the conductive particles are aligned in a thickness direction of the conductive portion.

In one embodiment, the intermediate layer is characterized in that the center of the conductive particles are aligned in the thickness direction of the conductive portion to coincide with each other.

In one embodiment, the intermediate layer is characterized in that the center of the conductive particles are aligned in the thickness direction of the conductive portion to stagger each other.

In one embodiment, a test socket including conductive particles, comprising: a conductive part disposed between a device under test and a test board to electrically connect a lead of the device under test and a pad of the test board to each other; and an insulating portion surrounding the conductive portion and supporting the conductive portion so as to be spaced apart from each other. The conductive particles are aligned in the conductive portion and contact each other, and the conductive particles in a horizontal direction are coupled to each other or the conductive particles in a horizontal direction and the conductive particles in a vertical direction are coupled to each other in an upper layer of the conductive portion. , a test socket is provided.

In one embodiment, the conductive part is characterized in that it comprises an intermediate layer having the conductive particles and aligned in the thickness direction of the conductive part.

In one embodiment, the conductive particles are characterized in that aligned in the conductive portion by a magnetic field.

)이 줄어드는 효과가 발휘될 수 있다. According to one aspect of the present invention, the length of the conductive particles in the vertical direction is longer than the length in the left and right directions, so that the conductive particles are easily arranged in the vertical direction when aligned by a magnetic field applied in the vertical direction, and in addition, the conductive columns The overall contact resistance (

) can be reduced.

In addition, the conductive particles of the present invention are formed to have a longer length in the vertical direction than conventional spherical conductive particles, and can be manufactured by increasing the thickness of the insulating support of the test socket, whereby the device under test repeatedly contacts the insulating support. Even if it does, the insulating support can be more elastically restored.

The effects of the present invention are not limited to the above effects, and should be understood to include all effects that can be inferred from the detailed description of the present invention or the configuration of the invention described in the claims.

1 is a view showing contact between a lead and a conductive part of a device under test according to the prior art.
2 is a diagram showing an approximate manner in which the resistance of a conductive part is determined.
3 is a view showing various embodiments of the conductive particles of the present invention.
4 is a diagram illustrating a test socket according to an embodiment of the present invention.
5(a) is a view showing a conventional conductive column, and (b) to (g) are views showing various embodiments of the conductive column of the present invention.
6(a) is a view showing a conventional conductive part, and (b) to (d) are views showing various embodiments of the conductive part according to the present invention.
FIG. 7(a) shows conductive particles of a conventional conductive column, and FIG. 7(b) is a diagram showing a circuit diagram when contact between conductive particles is broken in a conventional conductive column.
8 and 9 (a) show the conductive particles of the conductive column of the present invention, and FIGS. 8 and 9 (b) are diagrams showing a circuit diagram when the contact of the conductive particles is broken in the conductive column of the present invention. to be.

Hereinafter, the present invention will be described with reference to the accompanying drawings. However, the present invention may be embodied in many different forms and, therefore, is not limited to the embodiments described herein. And in order to clearly explain the present invention in the drawings, parts irrelevant to the description are omitted, and similar reference numerals are attached to similar parts throughout the specification.

Throughout the specification, when a part is said to be "connected" to another part, this includes not only the case where it is "directly connected" but also the case where it is "indirectly connected" with another member interposed therebetween. . In addition, when a part "includes" a certain component, it means that it may further include other components without excluding other components unless otherwise stated.

Terms including ordinal numbers such as 'first' or 'second' used herein may be used to describe various components or steps, but the components or steps should not be limited by ordinal numbers. . Terms containing ordinal numbers should only be construed to distinguish one component or step from other components or steps.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Referring to FIG. 2, an approximate method for determining the resistance of the conductive portion is as follows.

라 하고, 도전성 입자 간의 접촉 저항을

라 하면, 도전성 입자가 수직 방향으로 정렬되어 형성되는 도전 컬럼의 저항

은 각각의 저항들이 직렬 연결인 바,

= Σ

+ Σ

이 된다. 이때, 도전성 입자의 개별 고유 저항(

) 보다 도전성 입자 간의 접촉 저항(

)이 상대적으로 크기 때문에,

≒ Σ

이 된다.First, the individual specific resistance of the conductive particles

, and the contact resistance between conductive particles is

, the resistance of the conductive column formed by aligning the conductive particles in the vertical direction.

As each resistor is connected in series,

= Σ

+ Σ

becomes At this time, the individual specific resistance of the conductive particles (

) contact resistance between conductive particles (

) is relatively large,

≒ Σ

becomes

)에 의해 결정되는 것으로서, 본 발명에서는

를 줄이기 위해 도전성 입자 간의 물리적 접촉면적을 확대하며 아울러 도전 컬럼 내의 도전성 입자 수를 감소시키고자 한다.Therefore, when the size and material of the conductive particles are the same, the resistance of the conductive part is the contact resistance between the conductive particles (

) As determined by, in the present invention

In order to reduce , the physical contact area between conductive particles is enlarged and the number of conductive particles in the conductive column is also reduced.

To this end, the conductive particles according to an embodiment of the present invention are characterized by having protrusions protruding in multiple directions from the center in order to enlarge the physical contact area between the center and the conductive particles as a standard. Hereinafter, an embodiment in which the protrusion protrudes in the vertical direction of the central portion will be mainly described, but it is not limited thereto and the protrusion portion may protrude in various directions from the central portion.

Figure 3 is a view showing various embodiments of the conductive particles (110, 111, 112, 113) of the present invention. The conductive particles 110, 111, 112, and 113 according to an exemplary embodiment of the present invention are disposed in the vertical and horizontal directions of the center portions 110a, 111a, 112a, and 113a as references and the center portions 110a, 111a, 112a, and 113a. It consists of a plurality of protruding protrusions. More specifically, the conductive particles 110, 111, 112, and 113 include first protrusions 110b, 111b, 112b, and 113b protruding to the right of the central portions 110a, 111a, 112a, and 113a, the central portions 110a, Second protrusions 110c, 111c, 112c, 113c protruding upward from 111a, 112a, 113a, and third protrusions 110d, 111d, 112d protruding to the left of the center portions 110a, 111a, 112a, 113a, 113d) and fourth protrusions 110e, 111e, 112e, and 113e protruding downward from the central portions 110a, 111a, 112a, and 113a.

)을 감소될 수 있다. 또한, 선접촉 또는 면접촉의 물리적 접촉면적이 확대되는 바 단위 접촉 압력이 낮춰져 전달되는 충격이 완화될 수 있고, 이에 고유한 전기적 기계적 특성을 오랫동안 유지할 수 있다.As such, if the conductive particles have protrusions protruding up, down, left and right, when arranged vertically by a magnetic field, point contact between each conductive particle as well as line contact or surface contact is made, resulting in unit contact resistance (

) can be reduced. In addition, since the physical contact area of the line contact or surface contact is enlarged, the unit contact pressure is lowered so that the transmitted shock can be alleviated, and the electrical and mechanical properties inherent thereto can be maintained for a long time.

Preferably, the conductive particles 110, 111, and 112 according to an embodiment of the present invention have a length in the vertical direction longer than that in the left-right direction, as shown in FIGS. 3(a) to 3(c). may be formed.

For example, as shown in FIG. 3(a), when the central portion 110a, the first protrusion 110b, and the third protrusion 110d are formed in a square shape having a predetermined thickness, the second protrusion 110c And the fourth protrusion 110e may be formed in a rectangular shape extending longer in the vertical direction than the length of one side of the square. At this time, the first protrusion 110b and the third protrusion 110d may be arranged so that their centers lie on a straight line with the central portion 110a, but are not limited thereto, and the first protrusion 110b and the third protrusion 110b are not limited thereto. 110d is offset by a predetermined distance in the vertical direction with respect to the center 110a, so that the first protrusion 110b is disposed between the center 110a and the second protrusion 110c, and the third protrusion 110d has a center portion 110d. It may be disposed between (110a) and the fourth protrusion (110e). However, it is not limited thereto, and as shown in FIG. 3(b), only one of the second protrusion 111c and the fourth protrusion 111e may extend long in the vertical direction.

Preferably, the length of the protrusions 110c, 110e, and 111e in the vertical direction may be greater than 1 time and less than 5 times the length of one side of the center portion 110a or 111a. More preferably, the vertical lengths of the protrusions 110c, 110e, and 111e may be formed to be more than twice as long as the length of one side of the center portions 110a and 111a.

In addition, as shown in FIG. 3(c), when the first protrusion 112b to the fourth protrusion 112e are formed in a square shape having a predetermined thickness, the central portion 112a is above and below the length of one side of the square. It may be formed in a rectangular shape elongated in the direction. At this time, the first protrusion 112b and the third protrusion 112d are offset by a predetermined distance in the vertical direction with respect to the central portion 112a, so that the first protrusion 112b is disposed above the right side of the central portion 112a, The three protrusions 112d may be disposed below the left side of the central portion 112a. However, it is not limited thereto, and the first protrusion 112b and the third protrusion 112d may be arranged such that their centers lie on a straight line with the central portion 112a. Preferably, the length of the central portion 112a in the vertical direction may be formed to be more than one to five times the length of one side of the protrusions 112b, 112c, 112d, and 112e. More preferably, the length of the central portion 112a in the vertical direction may be formed to be more than one to two times the length of one side of the protrusions 112b, 112c, 112d, and 112e.

In addition, as shown in FIG. 3(c), when the first protrusion 112b to the fourth protrusion 112e are formed in a square shape having a predetermined thickness, the central portion 112a is above and below the length of one side of the square. It may be formed in a rectangular shape elongated in the direction. At this time, the first protrusion 112b and the third protrusion 112d are offset by a predetermined distance in the vertical direction with respect to the central portion 112a, so that the first protrusion 112b is disposed above the right side of the central portion 112a, The three protrusions 112d may be disposed below the left side of the central portion 112a. However, it is not limited thereto, and the first protrusion 112b and the third protrusion 112d may be arranged such that their centers lie on a straight line with the central portion 112a. As such, when the vertical length of the conductive particles 110, 111, and 112 is longer than the left-right direction, the conductive particles 110, 111, and 112 are formed by a magnetic field applied in an external vertical direction. When aligned, it can be easily arranged in the vertical direction. That is, line or surface contact between the conductive particles 110, 111, and 112 may be more easily achieved by arranging the conductive particles 110, 111, and 112 in a vertical direction without randomly rotating.

)이 줄어드는 효과도 발생한다.In addition, since the length of the conductive particles 110, 111, and 112 in the vertical direction is longer than that of the conventional spherical conductive particles, the number of conductive particles 110, 111, and 112 in the conductive column is reduced, and thus the overall contact resistance (

) is also reduced.

However, it is not limited to the above-described conductive particles 110, 111, and 112, and as shown in FIG. 3(d), the length of the conductive particles 113 in the vertical direction may be formed to be similar to the length in the left and right directions. may be For example, the central portion 113a and the protrusions 113b, 113c, 113d, and 113e are formed in a square shape having a predetermined thickness and one side having the same length, and the first protrusion 113b and the third protrusion 113d are The first protrusion 113b is disposed between the center portion 113a and the second protrusion 113c, and the third protrusion 113d is offset from the center portion 113a by a predetermined distance in the vertical direction based on the center portion 113a. It may be disposed between the fourth protrusions 113e.

Preferably, in order to prevent breakage of the silicone rubber surrounding the conductive particles, the ends may be formed to be curved.

On the other hand, of course, the central portion and the protrusion may be formed in various shapes such as a circular shape in addition to the above-described rectangular shape.

Preferably, the conductive particles include particles made of a metal exhibiting magnetism such as nickel, iron, and cobalt, or particles made of an alloy thereof, or particles containing these metals, or using these particles as core particles, on the surface of the core particles Plated with a conductive metal that is difficult to oxidize, such as gold, silver, palladium, and rhodium, can be used.

On the other hand, technology development is progressing in the direction of increasing the number of leads 21 and decreasing the pitch between the leads 21 of the device to be tested 20 such as a semiconductor device, and accordingly, the test socket 1000 is also It is being manufactured according to the direction of this technology development. However, since the diameter of the conductive portion 100 of the test socket 1000 decreases as the pitch of the lead 21 decreases, the number of conductive particles inevitably decreases. When the conductive particles become smaller, the column of the conductive part 100 also decreases, so that the elastic section for pressure when in contact with the device under test 20 is reduced, making it easier to break, and the life span decreases due to non-uniform resistance between the conductive parts 100. there is a problem In addition, as the diameter of the conductive portion 100 decreases, the number of conductive columns 120 decreases, resulting in an increase in resistance and a decrease in allowable current, thereby deteriorating electrical performance.

Accordingly, the test socket 1000 according to an embodiment of the present invention is disposed between the device under test and the test board 30, and the lead 21 of the device under test and the pad 31 of the test board 30 Conductive parts 100 electrically connecting them to each other; and an insulating portion made of an elastic insulating material, surrounding the conductive portion, and supporting the conductive portion 100 to be spaced apart from each other. Including, it is characterized in that the above-described conductive particles of the present invention are aligned in the conductive part 100 by a magnetic field and come into line contact or surface contact with each other.

In this regard, FIG. 4 is a diagram illustrating a test socket 1000 according to an embodiment of the present invention.

In detail, the test socket 1000 may be formed in the form of a sheet having a predetermined thickness. At this time, the test socket 1000 is configured to allow only electrical flow in the thickness direction without electrical flow in the surface direction, so that the lead 21 of the device under test 20 and the pad of the test board 30 ( 31) electrically connected in the vertical direction.

The test socket 1000 is used to perform an electrical test on the device under test 20, and thus it is determined whether or not the manufactured device 20 is defective.

The insulating support 200 constitutes the body of the test socket 1000, supports the conductive parts 100 when each of the conductive parts 100 to be described later receives a contact load, and provides a barrier between the conductive parts 100 adjacent to each other. It serves to break the electrical connection.

More specifically, when the lead 21 of the device under test 20, such as a semiconductor element, or the pad 31 of the test board 30 is in contact, the insulating support 200 absorbs contact force so that each conductive portion 100 ) serves to protect

The insulating support 200 is preferably composed of an insulating polymer material having a cross-linked structure. More specifically, the insulating polymer material includes conjugated diene-based rubbers such as polybutadiene rubber, natural rubber, polyisoprene rubber, styrene-butadiene copolymer rubber, and acrylonitrile-butadiene copolymer rubber, and their hydrogenated products, styrene- Block copolymer rubbers such as butadiene-diene block copolymer rubber and styrene-isoprene block copolymer and their hydrogenated products, chloroprene, urethane rubber, polyester rubber, epichlorohydrin rubber, silicone rubber, ethylene-propylene copolymer Rubber, ethylene-propylene-diene copolymer rubber, and the like can be used. In particular, it is preferable to use silicone rubber from the viewpoints of molding processability and electrical properties.

포어즈에서

포어즈 이하인 것이 바람직하고, 축합형인 것, 부가형인 것, 비닐기 및 히드록실기를 함유하는 것 중의 어느 하나일 수 있다. 구체적으로는, 디메틸실리콘 생고무, 메틸비닐실리콘 생고무, 메틸페닐비닐실리콘 생고무 등을 들 수 있다.As such a silicone rubber, a crosslinked or condensed liquid silicone rubber is preferable. The viscosity of liquid silicone rubber is the shear rate.

at the fores

Pores or less is preferable, and it may be any one of a condensation type type, an addition type type, and a type containing a vinyl group and a hydroxyl group. Specifically, dimethyl silicone raw rubber, methylvinyl silicone raw rubber, methylphenylvinyl silicone raw rubber, etc. are mentioned.

The conductive parts 100 extend in the thickness direction and are compressed when pressed in the thickness direction to enable electrical flow in the thickness direction, and each conductive part 100 is spaced apart from each other in the plane direction. An insulating support 200 having insulation is disposed between the conductive parts 100 to block electrical flow between the conductive parts 100 .

The conductive part 100 is configured such that its upper end can contact the lead 21 of the device under test 20 and its lower end can contact the pad 31 of the test board 30 . A plurality of conductive particles 110, 111, 112, and 113 are formed between the upper and lower ends of the conductive part 100 so as to be vertically oriented in the elastic insulating material. The plurality of conductive particles 110 , 111 , 112 , and 113 contact each other when the conductive part 100 is pressed by the device 20 to be tested, and serve to enable electrical connection.

That is, before being pressed by the device under test 20, the conductive particles 110, 111, 112, and 113 are finely spaced apart or in weak contact, and when the conductive part 100 is pressed and compressed, the conductive particles 110, 111 , 112, 113) are securely contacted with each other to enable electrical connection.

Specifically, the conductive part 100 has a form in which a plurality of conductive particles 110, 111, 112, and 113 are densely arranged in an up-and-down direction in an elastic insulating material, and each conductive part 100 is approximately avoided. It is arranged in a position corresponding to the lead 21 of the inspection device 20.

At this time, when lines of magnetic force act on the conductive part 100, each of the conductive particles 110, 111, 112, 113 are aligned in the elastic insulating material by the magnetic field, and the conductive columns 120, 121, 122, 123, 124, 125) are formed. That is, the conductive part 100 has a structure in which a plurality of conductive columns 120 , 121 , 122 , 123 , 124 , and 125 are arranged in parallel.

In this regard, FIG. 5 (a) is a diagram showing a conventional conductive column, and (b) to (g) show various embodiments of the conductive columns 120, 121, 122, 123, 124, and 125 of the present invention. It is a drawing that represents

In detail, as shown in FIG. 5(a), when the conventional conductive particles are spherical and aligned in an elastic insulating material by a magnetic field, the spherical conductive particles maintain one-point contact with adjacent spherical conductive particles and are perpendicular to each other. are placed so that

On the other hand, the conductive particles 110, 111, 112, and 113 of the present invention have a plurality of protrusions, and when arranged vertically by a magnetic field, not only point contact between the conductive particles 110, 111, 112, and 113 but also line contact or surface contact. In detail, as shown in FIGS. 5(b), 5(d), and 5(f), the centers of the conductive particles 110, 111, and 112 coincide with each other and the conductive columns arranged in a row ( In the case of 120, 122, and 124), surface contact is made between the second protrusions 110c, 111c, and 112c and the fourth protrusions 110e, 111e, and 112e located in the vertical direction.

Meanwhile, as shown in FIGS. 5(c), 5(e), and 5(g), the conductive columns 121, 123, and 125 of the present invention may be aligned in the thickness direction of the conductive portion so that their centers are staggered. have. In this case, the first protrusions 110b, 111b, 112b or the third protrusions 110d, 111d, and 112d of each of the conductive particles 110, 111, and 112 are adjacent to each other of the conductive particles 110, 111, and 112. Surface contact may be made with the two protrusions 110c, 111c, and 112c or the fourth protrusions 110e, 111e, and 112e.

)이 감소될 수 있다.As such, the conductive particles 110, 111, 112, and 113 of the present invention have protrusions, and when the conductive columns 120, 121, 122, 123, 124, and 125 are formed, the adjacent conductive particles 110, 111, and 112 , 113), and the overall contact resistance (

) can be reduced.

The conductive column of the present invention is not limited to the embodiment of FIGS. 5(b) to 5(g) described above, and when the conductive particles 110, 111, 112, and 113 of the present invention are vertically aligned, each conductive particle 110 , 111, 112, 113) also includes cases where line contact or point contact is made between the protrusions.

)이 줄어드는 효과도 발생한다.On the other hand, since the conductive particles of the present invention are 1.3 to 1.5 times larger in size than conventional spherical conductive particles, when the thickness of the insulating support is the same, the number of contacts of the conductive particles in the thickness direction is reduced by about 30 to 50%, Accordingly, the overall contact resistance (

) is also reduced.

Specifically, as shown in (a), (b), (d) and (f) of FIG. 5, when six spherical conductive particles are arranged, the conductive particles 110, 111, and 112 of the present invention 4 can be disposed, in this case, the spherical conductive particles have 5 contacts, but the conductive particles 110 and 111 of the present invention have 3 contacts, and the overall resistance can be reduced by reducing the number of contacts. Also, as shown in Fig. 5(g) and Fig. 9, resistance due to contact may be connected in series and parallel, so that the overall resistance may be reduced.

Preferably, the conductive particles may be aligned in the thickness direction of the conductive part so that their centers coincide with each other. However, it is not limited thereto, and as described above, the conductive particles may be aligned in the thickness direction of the conductive part so that their centers are staggered.

On the other hand, conventionally, the spherical conductive particles provided on the upper layer (x) of the conductive part are arranged in a vertical direction and make point contact but cannot be coupled to each other, so that the conductive particles are connected to the lead ( 21), the electrical and mechanical properties could be degraded as a concentrated load was applied. In addition, since the surface area of the spherical conductive particles is not large compared to the volume, the adhesion with the silicone rubber on which the conductive particles are placed is weak, and thus, when pressed by the lead 21 of the device 20 to be tested, the problem is that they are separated or collapsed. there was.

Hereinafter, the conductive parts 100, 101, and 102 according to an exemplary embodiment of the present invention will be described. Here, the conductive parts 100, 101, and 102 are exemplified by the conductive particles 112, but are not limited thereto, and the aforementioned conductive particles 110 and 111 can be equally applied. 6(a) is a view showing a conventional conductive part, and (b) to (d) are views showing various embodiments of the conductive part 100, 101, and 102 according to the present invention.

In detail, as shown in (a) of FIG. 6 , in the conductive part of the conventional test socket 1000, spherical conductive particles are vertically aligned in the middle layer (y) and the upper layer (x).

In contrast, the conductive particles 112 of the present invention may be coupled to the upper layer (x) of the conductive parts 100, 101, and 102 of the test socket 1000 according to an embodiment of the present invention. In detail, as in the conductive part 100 shown in FIG. 6 (b), each of the conductive particles 112 may be coupled horizontally while making surface contact with each other. Also, like the conductive part 101 shown in (c) of FIG. 6, the conductive particles 112 in the horizontal direction and the conductive particles 112 in the vertical direction may be combined.

In this case, even if the conductive particles are pressed by the lead 21 of the device 20, the adjacent conductive particles 112 are bonded to each other, the strength is improved, and the physical contact area of line contact or surface contact is enlarged, so unit contact pressure The lowered and transmitted shock can be alleviated, and the electrical and mechanical properties inherent thereto can be maintained for a long time.

In addition, since the surface area of the conductive particles of the present invention is increased compared to spheres having the same volume, the area of adhesion between the conductive particles and the silicone rubber is also increased.

Therefore, when the conductive particles 112 of the present invention are combined in the upper layer (x) of the conductive parts 100 and 101 as shown in (b) and (c) of FIG. 6, elastic insulation is compared to conventional spherical conductive particles. Since the surface area in contact with the material is large, it is strongly adhered to the insulating support 200, so that the possibility of separation from the insulating support 200 is low even during repeated testing, so durability can be improved.

)이 줄어드는 효과도 발생한다.More preferably, in the middle layer (y) of the conductive part 102, the conductive particles 112 conduct surface contact or line contact between adjacent protrusions, as in the above-described embodiments of the conductive columns 120 and 121 of the present invention. It can be aligned in the thickness direction of the portion, in this case, the surface area of each conductive particle 112 is enlarged to reduce separability from the insulating support 200, so that durability can be further improved. In addition, since the conductive particles 112 of the present invention are 1.3 to 1.5 times larger in size than conventional spherical conductive particles, when the thickness of the insulating support 200 is the same, the number of contact points of the conductive particles in the thickness direction is about 30 ~50% reduction, resulting in overall contact resistance (

) is also reduced.

On the other hand, according to the conductive particles according to an embodiment of the present invention, even if a part of the conductive particles in the conductive column is disconnected, the protruding portion makes contact with the adjacent conductive particles, so the increase in resistance is not large compared to the conventional method.

)을 1 Ω 이며 열이 2 개인 도전부를 예로 들면, 열간 접촉이 유지되는 경우 구형 도전성 입자 및 본 발명의 일 실시예에 따른 도전성 입자 모두 전체 접촉 저항(

)이 2.5 Ω 으로서 동일하지만, 1 열내 일부 도전성 입자의 접촉이 끊기는 경우, 구형 도전성 입자의 경우 전체 저항이 5 Ω 으로 급격히 상승하지만, 본 발명의 일 실시예에 따른 도전성 입자의 경우 전체 저항이 3 Ω 으로서, 기존의 구형 도전성 입자에 비해 저항의 증가폭이 크지 않다는 장점이 있다.In detail, as shown in FIGS. 7 to 9 , the contact resistance between conductive particles (

) is 1 Ω and the conductive part having two columns is taken as an example, when hot contact is maintained, the total contact resistance of both the spherical conductive particles and the conductive particles according to an embodiment of the present invention (

) is the same as 2.5 Ω, but when the contact of some conductive particles in one column is broken, the total resistance rises rapidly to 5 Ω in the case of spherical conductive particles, but in the case of conductive particles according to an embodiment of the present invention, the total resistance is 3 As Ω, there is an advantage that the increase in resistance is not large compared to conventional spherical conductive particles.

)이 줄어드는 효과가 발휘될 수 있다.As described above, the conductive particles of the present invention are formed so that the length in the vertical direction is longer than the length in the left and right directions, so that the conductive particles are easily arranged in the vertical direction when aligned by a magnetic field applied in the external vertical direction, In addition, since the number of conductive particles in the conductive column is reduced, the overall contact resistance (

) can be reduced.

In addition, the conductive particles of the present invention are formed to have a longer length in the vertical direction than spherical conductive particles, so that they can be manufactured by increasing the thickness of the insulating support of the test socket. The support portion may be more elastically restored.

The above description of the present invention is for illustrative purposes, and those skilled in the art can understand that it can be easily modified into other specific forms without changing the technical spirit or essential features of the present invention. will be. Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting. For example, each component described as a single type may be implemented in a distributed manner, and similarly, components described as distributed may be implemented in a combined form.

The scope of the present invention is indicated by the following claims, and all changes or modifications derived from the meaning and scope of the claims and equivalent concepts should be interpreted as being included in the scope of the present invention.

도전성 입자의 고유 저항

도전성 입자 간의 접촉 저항

도전 컬럼의 저항1000 test socket
100, 101, 102 conductive part
110, 111, 112 conductive particles
120, 121, 122, 123 Conductive column
200 insulating support
20 Tested device
21 lead
30 test board
31 pads
x upper layer
middle layer

Specific resistance of conductive particles

Contact resistance between conductive particles

resistance of the conductive column

Claims (14)

A conductive particle used in a test socket disposed between a device under test and a test board to electrically connect a lead of the device under test and a pad of the test board to each other,
The conductive particle has a center and a plurality of protrusions protruding in multiple directions relative to the center, conductive particles. According to claim 1,
Characterized in that the protruding portion protrudes in up, down, left and right directions based on the center, conductive particles. According to claim 2,
Characterized in that the length in the vertical direction of the conductive particles is longer than the length in the left-right direction, conductive particles. According to claim 3,
The central portion is characterized in that it extends long in the vertical direction, conductive particles. According to claim 3,
At least one of the protrusions located in the vertical direction of the central portion is characterized in that it extends long in the vertical direction, conductive particles. According to claim 5,
The protrusions located in the left and right directions of the central part are arranged to be staggered with respect to the central part, conductive particles. According to claim 2,
The protrusions located in the left and right directions of the central part are arranged to be staggered with respect to the central part, conductive particles. According to any one of claims 1 to 7,
Characterized in that the end of the protrusion is formed to be curved, conductive particles. An inspection socket comprising the conductive particles according to any one of claims 1 to 7,
a conductive part disposed between the device under test and the test board to electrically connect the leads of the device under test and the pads of the test board to each other; and
an insulating portion surrounding the conductive portion and supporting the conductive portion so as to be spaced apart from each other; including,
The conductive particles are aligned in the conductive part and come into contact with each other,
The test socket of claim 1 , wherein the conductive portion includes an intermediate layer in which the conductive particles are aligned in a thickness direction of the conductive portion. According to claim 9,
The intermediate layer is characterized in that aligned in the thickness direction of the conductive portion so that the centers of the conductive particles coincide with each other, the test socket. According to claim 10,
The intermediate layer is characterized in that, the test socket is aligned in the thickness direction of the conductive portion so that the center of the conductive particles are staggered with each other. An inspection socket comprising the conductive particles according to any one of claims 1 to 7,
a conductive part disposed between the device under test and the test board to electrically connect the leads of the device under test and the pads of the test board to each other; and
an insulating portion surrounding the conductive portion and supporting the conductive portion so as to be spaced apart from each other; including,
The conductive particles are aligned in the conductive part and come into contact with each other,
In the upper layer of the conductive part, the conductive particles in the horizontal direction are coupled to each other or the conductive particles in the horizontal direction and the conductive particles in the vertical direction are coupled to each other. According to claim 12,
Characterized in that the conductive part includes an intermediate layer having the conductive particles and aligned in the thickness direction of the conductive part, the test socket According to claim 12,
Characterized in that the conductive particles are aligned in the conductive part by a magnetic field, the test socket.

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