KR20220155064A - Method for dispensing and dispenser - Google Patents

Abstract

The present invention relates to a dispensing method and a dispenser in which a nozzle dispenses a dispenser liquid while moving along a nozzle travel path a position-specific height of which is calibrated based on flatness information of a substrate, obtained by a gap sensor, such that the dispenser liquid is applied to have a uniform thickness and width. The dispensing method according to one embodiment of the present invention comprises the processes of: obtaining flatness information of a substrate while a gap sensor moves along a predetermined nozzle travel path; calibrating a position-specific height of the nozzle traveling path based on the flatness information of a substrate; and dispensing, by a nozzle, a dispenser liquid while the nozzle moves along the nozzle travel path the position-specific height of which is calibrated.

Description

Dispensing method and dispenser {Method for dispensing and dispenser}

The present invention relates to a dispensing method and dispenser, and more particularly, to a dispensing method and dispenser capable of applying uniform thickness and width.

The dispenser device is a device that performs a role of spraying a certain amount of a predetermined dispenser liquid through a nozzle and applying a precise and set amount to a corresponding position of a target object. This dispenser device is used for coating or bonding processing of the corresponding part in the precision industry field such as semiconductor manufacturing process.

The dispenser device applies the dispenser liquid to the substrate in a predetermined pattern while changing the relative position between the nozzle and the substrate. That is, the dispenser device horizontally moves the nozzle and / or substrate in the X-axis and Y-axis directions while constantly controlling the gap between the nozzle and the substrate by moving the nozzle mounted on the head unit up and down in the Z-axis, The dispenser liquid is applied to the substrate in a predetermined pattern.

According to the prior art, in order to constantly control the gap, the gap was measured through a gap sensor while applying the dispenser liquid to the substrate. However, there is a problem in that process defects occur due to diffuse reflection of the gap sensor due to diffuse reflection of the substrate, scattering of the gap sensor due to the dispenser liquid deposited on the nozzle, and interference between the line measured through the gap sensor and the line applied through the nozzle. .

Therefore, in order to minimize process defects, a technique capable of applying the dispenser liquid with a uniform thickness and width by securing stable gap sensor data is required.

Patent Publication No. 2019-0133901

The present invention provides a dispensing method and dispenser capable of applying uniform thickness and width through a process of acquiring flatness data by scanning a substrate.

A dispensing method according to an embodiment of the present invention includes obtaining flatness information of a substrate while a gap sensor moves along a preset nozzle travel path; correcting a height of each position of the nozzle traveling path using flatness information of the substrate; and a process of discharging the dispenser liquid while the nozzle moves along the nozzle traveling path, the height of which has been corrected for each position.

The obtaining of the flatness information of the substrate may include calculating an accumulated movement distance of the gap sensor; and determining a flatness acquisition position of the substrate at a predetermined interval with respect to the accumulated movement distance, and flatness information of the substrate may be obtained at the determined flatness acquisition position.

A moving speed of the gap sensor in the process of acquiring the flatness information of the substrate may be slower than a moving speed of the nozzle in the process of applying the dispenser liquid while the nozzle moves.

A height recalibration process for each position of the nozzle traveling path for recalibrating the height for each position of the nozzle traveling path using the gap between the substrate and the nozzle discharging the dispenser liquid while moving measured through the gap sensor. can include

The process of recalibrating the height of the nozzle traveling path by position may include monitoring a gap deviation between a gap between the corrected nozzle traveling path and the substrate and a gap between the nozzle discharging the dispenser liquid and the substrate; and when the gap deviation is detected, recalibrating the height of each position of the nozzle travel path by using the gap deviation.

The method may further include a process of discharging the dispenser liquid while the nozzle moves along the nozzle traveling path whose height for each position is recalibrated.

The process of monitoring the gap deviation may be performed at the flatness acquisition position.

If a gap deviation is detected at the flatness acquisition position (nth) during the process of monitoring the gap deviation, the process of recalibrating the height of each position of the nozzle traveling path is the next flatness acquisition position (n+ 1) can be performed.

In the process of recalibrating the height of each position of the nozzle travel path, when the gap deviation is greater than the sum of the height correction value in the process of correcting the height of each position of the nozzle travel path and the thickness deviation value of the substrate, an undetected path can judge

A dispenser according to another embodiment of the present invention includes a nozzle for discharging a dispenser liquid to a substrate; a gap sensor measuring a gap between the nozzle and the substrate; a moving unit moving the nozzle and the gap sensor along a nozzle travel path; a substrate flatness acquisition unit acquiring flatness information of the substrate through the gap sensor moving along the nozzle travel path; and a nozzle traveling path correction value calculating unit that calculates a correction value of a height of each position of a nozzle traveling path using flatness information of the substrate, wherein the movement unit receives the nozzle driving path correction value calculating unit from the nozzle traveling path correction value calculating unit. Receiving information on the correction value of the height at each position of the path, the height at each position of the nozzle travel path is corrected, and the nozzle can discharge the dispenser liquid while moving along the nozzle travel path whose height at each position is corrected. .

The substrate flatness obtaining unit may include: an accumulated distance calculator configured to calculate an accumulated movement distance of the gap sensor; and a positioning unit determining a flatness acquisition position of the substrate at a predetermined interval with respect to the accumulated movement distance, and may obtain flatness information of the substrate at the determined flatness acquisition position.

A nozzle travel path recalibration value calculation unit that calculates a recalibration value of a height of each position of a nozzle travel path using a gap between the substrate and the nozzle that discharges the dispenser liquid while moving, measured by the gap sensor. can include more.

The nozzle travel path recalibration value calculator includes a gap deviation monitoring unit that monitors a gap deviation between a gap between the corrected nozzle travel path and the substrate and a gap between the substrate and the nozzle that discharges the dispenser liquid. and when the gap deviation is detected through the gap deviation monitoring unit, the moving unit may recalibrate the height of each position of the nozzle travel path using the calculated recalibration value of the height of each position of the nozzle travel path.

The gap variance monitoring unit may monitor the gap variance at the flatness acquisition position.

When the gap deviation monitoring unit detects the gap deviation at the flatness acquisition position (nth), the moving unit measures the height of each position of the nozzle traveling path at the next flatness acquisition position (n+1th) in the driving direction of the nozzle can be corrected

The gap deviation monitoring unit may determine that the gap deviation is not detected when the gap deviation is greater than the sum of the height correction value for each position of the nozzle traveling path and the thickness deviation value of the substrate.

The dispensing method according to an embodiment of the present invention includes a process of obtaining flatness information of a substrate while a gap sensor moves along a preset nozzle travel path, so that the gap between the nozzle and the substrate can be maintained constant. Due to this, the nozzle can apply the dispenser liquid to the substrate with a uniform thickness and width. In addition, by scanning the substrate through the gap sensor before applying the dispenser liquid to the substrate, scattering of the gap sensor due to the dispenser liquid on the nozzle and interference between the line measured through the gap sensor and the line applied through the nozzle are suppressed, thereby improving the process defects can be reduced. In addition, in the process of obtaining the flatness information of the substrate, the movement coordinates of the gap sensor are calculated as a vector sum to calculate the accumulated movement distance, so that the trigger board may not be mounted. In addition, flatness information of the substrate can be obtained at regular intervals due to the process of determining the flatness acquisition position at preset intervals with respect to the accumulated movement distance.

In addition, the dispensing method may further include a process of recalibrating the height of the nozzle travel path for each position, so that the gap between the nozzle and the substrate can be adjusted at a more regular interval. At this time, due to the determined flatness acquisition position, the height of each position of the nozzle traveling path may be recalibrated using the flatness information of the substrate for the same position and the gap between the nozzle and the substrate. In addition, through the process of monitoring the gap deviation, the diffuse reflection of the gap sensor due to the diffuse reflection of the substrate, the scattering of the gap sensor due to the dispenser liquid deposited on the nozzle, and the interference of the line measured through the gap sensor and the line applied through the nozzle Errors can be filtered. Due to this, when the nozzle discharges the dispenser liquid, the gap between the nozzle and the substrate is maintained at a more constant interval, so that the dispenser liquid can be applied to the substrate with a uniform thickness and width. In addition, OLEDs manufactured through such a dispensing method can improve light emitting characteristics by preventing penetration of external air and moisture and maintaining an internal atmospheric pressure.

1 is a flowchart illustrating a dispensing method according to an embodiment of the present invention;
2 is a schematic diagram showing a dispensing method according to an embodiment of the present invention.
3 is a schematic diagram illustrating a process of determining a flatness acquisition position in a dispensing method according to an embodiment of the present invention.
Figure 4 is a schematic diagram showing the correction of the height of the dispenser and its nozzle travel path according to another embodiment of the present invention for each position.
5 is a schematic diagram showing recalibration of the height for each position of a nozzle traveling path of a dispenser according to another embodiment of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, but will be implemented in a variety of different forms, only these embodiments will complete the disclosure of the present invention, and will fully cover the scope of the invention to those skilled in the art. It is provided to inform you. During the description, the same reference numerals are assigned to the same components, and the drawings may be partially exaggerated in size in order to accurately describe the embodiments of the present invention, and the same numerals refer to the same elements in the drawings.

1 is a flowchart illustrating a dispensing method according to an embodiment of the present invention.

Referring to FIG. 1 , a dispensing method according to an embodiment of the present invention includes a process of obtaining flatness information of a substrate S while a gap sensor 200 moves along a preset nozzle travel path A (S100). ); correcting the height of each position of the nozzle traveling path (A) using flatness information of the substrate (S) (S200); and discharging the dispenser liquid while the nozzle 100 moves along the nozzle travel path B, the height of which has been corrected for each position (S300).

First, while the gap sensor 200 moves along the preset nozzle travel path A, flatness information of the substrate S is acquired (S100). At this time, the gap sensor 200 may obtain flatness information of the substrate S by measuring the gap g between the nozzle 100 and the substrate S.

The gap sensor 200 may pre-scan the entire area of the substrate S to be coated with the dispenser liquid before the nozzle 100 moves and discharges the dispenser liquid.

Conventionally, when a dispenser liquid is applied through a nozzle, a gap between the nozzle and the substrate is corrected by scanning the substrate through a gap sensor and acquiring flatness of the substrate in real time. However, by simultaneously applying the dispenser liquid through the nozzle and scanning the substrate through the gap sensor, scattering of the gap sensor due to the dispenser liquid deposited on the nozzle and interference between the line measured through the gap sensor and the line applied through the nozzle this happens Due to this, since the gap between the nozzle and the substrate cannot be maintained constant, the dispenser liquid is applied to the substrate in a non-uniform thickness and width, resulting in process defects.

On the other hand, in the present invention, by pre-scanning the substrate (S) through the gap sensor 200 before applying the dispenser liquid through the nozzle 100, the dispenser liquid is applied to the substrate (S) with a uniform thickness and width It can be applied to reduce defects. In particular, the substrate is not perfectly flat and may include curvatures. For example, when the substrate is glass, the substrate may include curvatures caused by characteristics of the glass or due to glass processing deviations. Accordingly, in order to maintain a constant gap between the nozzle 100 and the substrate S, the substrate S may be pre-scanned through the gap sensor 200 . That is, by pre-scanning the gap sensor 200 to obtain flatness information of the substrate (S) and correcting the height of each position of the previously set nozzle traveling path (A), the nozzle 100 is configured to S) can be applied more quickly with the dispenser liquid.

Next, by using the flatness information of the substrate (S), the height of each position of the previously set nozzle traveling path (A) is corrected (S200). When measuring the gap g between the nozzle 100 and the substrate S through the gap sensor 200 along a preset nozzle travel path A, the nozzle 100 and the substrate S The gap g between them may not be a regular interval. For this reason, the gap between the nozzle 100 and the substrate S can be maintained constant by correcting the height of each position of the preset nozzle traveling path A using the flatness information of the substrate S. have. In this case, the distance to be maintained between the nozzle 100 and the substrate S may be a target gap. That is, the preset height of each position of the nozzle traveling path A may be corrected so that the gap g between the nozzle 100 and the substrate S becomes a target gap.

Next, the nozzle 100 discharges the dispenser liquid while moving along the nozzle traveling path B, the height of which has been corrected for each position (S300). The gap between the nozzle 100 and the substrate S is maintained at a constant interval through the nozzle traveling path B, the height of which is corrected for each position, so that the dispenser liquid has a uniform thickness and width on the substrate S can be applied as

In this way, the nozzle 100 and the gap sensor 200 are disposed next to each other and can move along the X, Y, and Z axes together along a preset nozzle travel path (A) or a corrected nozzle travel path (B).

Such a dispensing method may be an encapsulation process, which is a process for blocking an organic material and an electrode that emits light in an OLED from oxygen and moisture. Through the dispensing method of the present invention, the dispenser liquid can be applied to the edge of the substrate with a uniform thickness and width. For this reason, the OLED manufactured by the dispensing method of the present invention can prevent penetration of external air and moisture and maintain an internal atmospheric pressure to enhance light emitting characteristics.

2 is a schematic diagram showing a dispensing method according to an embodiment of the present invention.

2, it can be seen that the gap sensor 200 obtains flatness information of the substrate S by measuring the gap between the nozzle 100 and the substrate S before the nozzle 100 discharges the dispenser liquid. have. At this time, it can be confirmed that the position of the substrate S, which is pre-scanned by the gap sensor 200, is the position where the dispenser liquid is to be applied.

The process of acquiring the flatness information of the substrate S may include calculating an accumulated movement distance D of the gap sensor 200 (S110); and determining the flatness acquisition positions (a to c, etc.) of the substrate S at predetermined intervals with respect to the accumulated movement distance D (S120); and the determined flatness acquisition position (a). ~ c, etc.), it is possible to obtain flatness information of the substrate (S).

First, the accumulated movement distance D of the gap sensor 200 is calculated (S110). To this end, after contacting the nozzle 100 to the reference position of the substrate S, the nozzle 100 may be separated from the substrate S by a predetermined interval. In this case, a predetermined distance between the nozzle 100 and the substrate S may be a target cap. In addition, the Z-axis of the nozzle 100 is maintained at a constant height so that the substrate S can be scanned through the gap sensor 200 disposed next to the nozzle 100 . At this time, the accumulated movement distance D for the moving gap sensor 200 may be calculated.

The accumulated movement distance D may be calculated by calculating a vector sum of movement coordinates of the gap sensor 200 as an encoder. In this case, the movement coordinate of the gap sensor 200 may be a motor position value that moves the gap sensor 200 along the nozzle traveling path A. Here, since the gap sensor 200 is disposed next to the nozzle 100 and moves together, the motor position values of the gap sensor 200 and the nozzle 100 may be the same.

The movement coordinates may be X and Y coordinates due to the constant height of the Z axis of the nozzle 100 and the gap sensor 200 . And the accumulated movement distance D may be Equation 1 below.

<Equation 1>

(x and y are the movement coordinates of the gap sensor)

The accumulated movement distance D may be a value obtained by accumulating and adding L calculated as a vector sum of movement coordinates of the gap sensor 200 in real time.

Conventionally, a trigger board is additionally mounted in order to acquire flatness information of a substrate at an accurate position while a gap sensor moves. However, since the present invention uses an internal vector calculation that calculates the moving coordinates of the gap sensor 200 as a vector sum, it does not require a trigger board, so it can be implemented without additional hardware.

Next, the flatness acquisition positions (eg, a to c) of the substrate S are determined at preset intervals for the accumulated movement distance D (S120). In this case, the preset interval may be a value input as an interval for obtaining flatness information of the substrate (S). In this way, by determining the flatness acquisition positions (a to c, etc.) of the substrate S at predetermined intervals with respect to the accumulated movement distance D, data increases when flatness information of the substrate S is continuously obtained. can reduce the amount of In addition, the preset interval is the same interval, and it is possible to reduce deviations occurring when flatness information of the substrate S is obtained at irregular intervals. These flatness acquisition positions (a to c, etc.) may serve as a trigger.

Additionally, a flatness table may be created by obtaining flatness information of the substrate S at the flatness acquisition positions (a to c, etc.). In this case, the flatness table may store flatness information of the substrate S at the flatness acquisition positions (a to c, etc.) in the direction in which the nozzle 100 travels. The flatness table may be Table 1 below.

flatness acquisition position Flatness (㎛) a -2.706050873 b -4.38451767 c -6.215572357 ㆍㆍㆍ ㆍㆍㆍ

The process of obtaining the flatness information of the substrate S (S100) may be performed by determining the flatness acquisition positions (a to c, etc.) of the substrate S based on the distance interval. Here, when the flatness information of the substrate S is obtained based on the time interval, when scanning through the gap sensor 200, the speed of the straight portion and the corner portion are different due to the deceleration of the corner portion, and the substrate ( The flatness information of S) cannot be obtained. In addition, the process of obtaining the flatness information of the substrate S (S100) is the movement of the gap sensor 200, the stop of the gap sensor 200, and the flatness of the substrate S through the gap sensor 200 Since acquisition of degree information is repeatedly performed, the amount of data may be excessive when performed at time intervals.

3 is a schematic diagram showing a process (S120) of determining the flatness acquisition positions (a to c, etc.) of the dispensing method according to an embodiment of the present invention.

Looking at Figure 3, it can be seen that the accumulated movement distance (D) is calculated through the coordinates of the X and Y axes. In addition, it can be confirmed that the flatness acquisition positions (a to c, etc.) of the substrate S are determined at predetermined intervals with respect to the accumulated movement distance D.

The moving speed of the gap sensor 200 in the process of acquiring the flatness information of the substrate S (S100) is the nozzle 100 in the process of applying the dispenser liquid while the nozzle 100 is moving (S300). ) can be slower than the movement speed of

In the process of acquiring the flatness information of the substrate S (S100), the gap sensor 200 moves to the flatness acquisition position (a to c, etc.), and from the flatness acquisition position (a to c, etc.) The process of obtaining flatness information of the substrate S (S100) may be repeatedly performed at the stop and the flatness acquisition positions (a to c, etc.). In contrast, in the process of applying the dispenser liquid while the nozzle 100 moves (S300), the nozzle 100 may move without stopping. Accordingly, the time taken to perform the process of obtaining the flatness information of the substrate S (S100) may be longer than the process of applying the dispenser liquid while the nozzle 100 moves (S300).

Using the gap between the substrate (S) and the nozzle 100 for discharging the dispenser liquid while moving measured through the gap sensor 200, the height of the nozzle travel path (B) for each position is corrected again A process of recalibrating the height for each position of the nozzle traveling path (B) (S400) may be further included.

When the dispenser liquid is applied to the substrate (S) or when the substrate (S) is replaced with another substrate (S), the nozzle travel path (B) for recalibrating the height of each position of the nozzle travel path (B) A process of recalibrating the height for each position (S400) may be performed.

When the dispenser liquid is applied to the substrate (S), by performing a height recalibration process (S400) for each position of the nozzle traveling path (B), the nozzle 100 and the substrate (S) through the gap sensor 200 ) can reduce the measurement error that can occur when measuring the gap between In addition, when the substrate (S) is replaced with another substrate (S), by performing a height recalibration process (S400) for each position of the nozzle travel path (B), the glass and stage constituting the substrate (S) Recalibration may be performed in response to the flatness of the substrate S, which has changed due to the change in curvature. Accordingly, by performing a recalibration process (S400) of the height of the nozzle traveling path B by position, the error of the recalibrated height of the nozzle traveling path (not shown) by position is reduced with the target gap, thereby reducing the nozzle ( 100) and the substrate S may have a more regular interval.

To this end, the gap sensor 200 may measure the gap between the nozzle 100 discharging the dispenser liquid and the substrate S while moving. That is, while the nozzle 100 applies the dispenser liquid to the substrate S, the gap sensor 200 may measure the gap between the nozzle 100 and the substrate S. At this time, the flatness deviation at the flatness acquisition positions (a to c, etc.) of the same substrate (S) is the gap between the corrected nozzle traveling path (B) and the substrate (S), and the dispenser liquid is discharged It may be the same as the gap deviation G between the nozzle 100 and the substrate S. Therefore, the nozzle travel path B is measured using the gap measured by the gap sensor 200, the flatness information of the substrate S obtained by the gap sensor 200, or a combination thereof. You can calibrate the height by position again.

In the step of recalibrating the height of the nozzle travel path (B) by position (S400), the gap between the corrected nozzle travel path (B) and the substrate (S), and the nozzle 100 for discharging the dispenser liquid and Monitoring the gap deviation (G) between the gaps between the substrates (S) (S410); and when the gap deviation G is detected, recalibrating the height of each position of the nozzle traveling path B using the gap deviation G (S420).

First, the gap deviation G between the corrected nozzle traveling path B and the substrate S and the gap between the nozzle 100 discharging the dispenser liquid and the substrate S is monitored. (S410). To this end, in the step of monitoring the gap deviation (G) (S410), the nozzle 100 for discharging the dispenser liquid measured through the flatness information of the substrate S and the gap sensor 200 and the The gap deviation G may be obtained using a gap between the substrates S.

In this case, in the gap between the corrected nozzle traveling path B and the substrate S, the substrate S may be a reference surface from which flatness information of the substrate S is obtained. Therefore, the gap between the corrected nozzle travel path B and the substrate S may be the height from the reference plane from which the flatness information of the substrate S is obtained to the corrected nozzle travel path B. have. That is, the gap between the corrected nozzle traveling path B and the substrate S may be a target gap.

On the other hand, in the gap between the nozzle 100 discharging the dispenser liquid and the substrate S, the substrate S may be a reference surface on which the dispenser liquid is applied. Therefore, the gap between the nozzle 100 for discharging the dispenser liquid and the substrate S may be a height from the reference surface on which the dispenser liquid is applied to the nozzle 100 for discharging the dispenser liquid.

Next, when the gap deviation (G) is detected, the height of each position of the nozzle travel path (B) is corrected again using the gap deviation (G) (S420). The gap between the nozzle 100 and the substrate S may be maintained at a target gap distance by recalibrating the height of each position of the nozzle travel path B by the detected gap deviation G.

A process of discharging the dispenser liquid while the nozzle 100 moves along the nozzle travel path (not shown) whose height for each position is recalibrated (S500) may be further included.

By discharging the dispenser liquid while the nozzle 100 moves along the nozzle travel path (not shown) whose height for each position is recalibrated, by controlling the gap between the nozzle 100 and the substrate S to be constant The dispenser liquid may be applied to the substrate S with a uniform thickness and width.

The process of monitoring the gap deviation G (S410) may be performed at the flatness acquisition positions (a to c, etc.).

The process of monitoring the gap deviation (G) (S410) is performed at the flatness acquisition positions (a to c, etc.), so that the flatness of the substrate S at the same flatness acquisition positions (a to c, etc.) A gap between the substrate S and the nozzle 100 discharging the map information and the dispenser liquid may be used. That is, the gap between the corrected nozzle traveling path B and the substrate S at the same flatness acquisition position (a to c, etc.), and the nozzle 100 discharging the dispenser liquid and the substrate ( The gap deviation (G) between the gaps between S) can be monitored.

In the process of monitoring the gap deviation (G) (S410), when the gap deviation (G) is detected at the flatness acquisition position (nth, a), the process of recalibrating the height of each position of the nozzle traveling path (B) (S420) may be performed at the next flatness acquisition position (n+1th, b) in the driving direction of the nozzle 100. In this case, n may be an integer.

During the process of monitoring the gap deviation (G) (S410), when the gap deviation (G) is detected at the flatness acquisition position (n-th, a), the obtained gap deviation (G) is used as the running direction of the nozzle 100 The height of each position of the nozzle travel path B may be corrected again by reflecting the next flatness acquisition position (n+1th, b) of . As a result, the nozzle travel path (not shown) whose height is recalibrated for each position can allow the nozzle 100 to apply the dispenser liquid to the substrate S with a uniform thickness and width. At this time, the process of monitoring the gap deviation (G) (S410) and the process of recalibrating the height of each position of the nozzle travel path (B) (S420) may be performed for each flatness acquisition position.

In the process of recalibrating the height of each position of the nozzle travel path (B) (S400), the gap deviation (G) is the height correction value of the process of correcting the height of each position of the nozzle travel path (A) (S200) When it is greater than the sum of the thickness deviation value of the substrate S and the thickness deviation value of the substrate S, it can be determined as non-detection.

When the nozzle 100 applies the dispenser liquid to the substrate S and the gap sensor 200 measures the gap between the nozzle 100 and the substrate S at the same time, errors may occur in application and measurement can For example, scattering of the gap sensor due to the dispenser liquid deposited on the nozzle and interference between the line measured through the gap sensor and the line applied through the nozzle may occur. Therefore, through the process of monitoring the gap deviation (G) (S410), errors occurring in application and measurement can be reduced.

To this end, when the gap deviation (G) is greater than the sum of the height correction value in the step of correcting the height of each position of the nozzle traveling path (A) (S200) and the thickness deviation value of the substrate (S), an error Recognizable. Due to this, the height of each position of the nozzle traveling path B may not be corrected again. That is, it can be recognized by the diffuse reflection of the gap sensor due to the diffuse reflection of the substrate, the scattering of the gap sensor due to the dispenser liquid deposited on the nozzle, and the interference between the line measured through the gap sensor and the line applied through the nozzle.

Here, the sum of the height correction value in the process of correcting the height of each position of the nozzle travel path (A) (S200) and the thickness deviation value of the substrate (S) is the glass processing deviation that occurs when the substrate (S) is replaced. can be

In this case, the height correction value in the step of correcting the height of each position of the nozzle travel path A (S200) may be a flatness deviation of the substrate S. In addition, the height recalibration value of the height recalibration process (S400) for each position of the nozzle traveling path B may be the gap deviation G.

Hereinafter, a dispenser according to another embodiment of the present invention will be described in more detail, and details overlapping with those described above in relation to the dispensing method according to an embodiment of the present invention will be omitted.

The dispenser according to another embodiment of the present invention includes a nozzle 100 for discharging a dispenser liquid to a substrate (S); a gap sensor 200 for measuring a gap g between the nozzle 100 and the substrate S; a moving unit 300 that moves the nozzle 100 and the gap sensor 200 along a nozzle travel path A; a substrate flatness acquisition unit 400 acquiring flatness information of a substrate S through the gap sensor 200 moving along the nozzle travel path A; and a nozzle traveling path correction value calculating unit 500 that calculates a correction value of the height of each position of the nozzle traveling path A using the flatness information of the substrate S.

At this time, the moving unit 300 receives information on the correction value of the height of each position of the nozzle traveling path A from the nozzle traveling path correction value calculating unit 500, and determines the nozzle traveling path A. The height of each position is corrected, and the nozzle 100 may discharge the dispenser liquid while moving along the nozzle traveling path B for which the height of each position is corrected.

The nozzle 100 may discharge the dispenser liquid to the substrate (S).

The gap sensor 200 measures the gap g between the nozzle 100 and the substrate S, and can obtain flatness information of the substrate S through the measured gap. At this time, two gap sensors 200 are disposed in front and behind the nozzle 100 in the running direction of the nozzle to more accurately measure the gap g between the nozzle 100 and the substrate S have.

The moving unit 300 moves the nozzle 100 and the gap sensor 200 in the X, Y, and Z axes along the nozzle travel path A, so that the nozzle 100 and the gap sensor 200 ) can be discharged and measured while moving along the nozzle traveling path (A). Also, the moving unit 300 may correct the height of each position of the nozzle traveling path A.

The substrate flatness acquisition unit 400 may obtain flatness information of the substrate S using the gap sensor 200 moving along the nozzle traveling path A through the moving unit 300. have.

The nozzle traveling path correction value calculation unit 500 may calculate a correction value of the height of each position of the nozzle traveling path A using the flatness information of the substrate S.

The gap sensor 200 may acquire flatness information of the substrate S while moving along a preset nozzle travel path A through the moving unit 300 . That is, the gap sensor 200 may scan the entire area of the substrate S where the dispenser liquid is to be applied before the nozzle 100 moves and discharges the dispenser liquid.

The nozzle travel path correction value calculation unit 500 calculates a correction value for the height of each position of the nozzle travel path A using the flatness information of the substrate S obtained through the gap sensor 200 do. Accordingly, the moving unit 300 receives information on the correction value of the height of each position of the nozzle traveling path A from the nozzle traveling path correction value calculating unit 500, and the nozzle traveling path A The height of each position can be corrected. Due to this, the nozzle 100 can discharge the dispenser liquid while moving along the nozzle travel path B whose height for each position is corrected. In this way, the gap between the nozzle 100 and the substrate S may be constantly maintained by correcting the height of each position of the nozzle traveling path A using the flatness information of the substrate S.

4 is a schematic diagram showing the correction of the height of a dispenser according to another embodiment of the present invention and its nozzle travel path by position.

Referring to FIG. 4 , it can be seen that the gap sensor 200 moves along a predetermined nozzle travel path A having a constant Z-axis height. Also, it can be confirmed that the corrected nozzle travel path B corresponds to the flatness of the substrate S, and the nozzle 100 moves along the corrected nozzle travel path B.

The substrate flatness obtaining unit 400 includes an accumulated distance calculator 410 that calculates an accumulated movement distance D of the gap sensor 200; and a position determining unit 420 determining flatness acquisition positions (a to c, etc.) of the substrate S at predetermined intervals with respect to the accumulated movement distance D, and the determined flatness acquisition positions. Flatness information of the substrate S may be obtained from (a to c, etc.).

The accumulated distance calculation unit 410 may calculate the accumulated movement distance D by calculating the movement coordinates of the gap sensor 200 as a vector sum. First, in order to obtain flatness information of the substrate S, the nozzle 100 is brought into contact with a reference position of the substrate S, and then the nozzle 100 is spaced apart from the substrate S by a target gap. , the substrate S may be scanned through the gap sensor 200 . In this case, the movement coordinate may be a motor position value of the moving unit 300 that moves the gap sensor 200 along the nozzle traveling path A. Here, the movement coordinates may be X and Y coordinates due to the gap sensor 200 having a constant Z-axis height.

As described above, the position determining unit 420 may determine a position where flatness information is obtained on the substrate S at a predetermined interval with respect to the accumulated movement distance D. In this case, the preset interval may be an input value.

In addition, the substrate flatness obtaining unit 400 may create a flatness table by acquiring flatness information of the substrate S at the flatness obtaining positions (a to c, etc.). In this case, the flatness table may store flatness information of the substrate S at the flatness acquisition positions (a to c, etc.) in the direction in which the nozzle 100 travels.

Using the gap between the substrate (S) and the nozzle 100 discharging the dispenser liquid while moving measured through the gap sensor 200, the recalibration value of the height of each position of the nozzle travel path (B) It may further include a nozzle traveling path recalibration value calculation unit 600 that calculates.

The nozzle travel path recalibration value calculation unit 600 measures the gap between the substrate S and the nozzle 100 discharging the dispenser liquid while moving through the gap sensor 200, and the measured gap It is possible to calculate the recalibration value of the height of each position of the nozzle travel path (B) using That is, while the nozzle 100 applies the dispenser liquid to the substrate S, the gap sensor 200 may measure the gap between the nozzle 100 and the substrate S.

In this way, the nozzle travel path recalibration value calculation unit 600 uses the flatness information of the substrate S of the substrate flatness obtaining unit 400 and the gap measured through the gap sensor 200, A re-correction value of the height of each position of the nozzle traveling path B may be calculated.

The nozzle travel path recalibration value calculation unit 600 calculates the nozzle travel path B of the nozzle travel path B when the dispenser liquid is applied to the substrate S or when the substrate S is replaced with another substrate S. The recalibration value of the height for each position can be calculated. Accordingly, the height of each position of the nozzle travel path B is recalibrated through the nozzle travel path recalibration value calculation unit 600 to reduce errors, thereby reducing the distance between the nozzle 100 and the substrate S. The gaps may be more uniformly spaced.

The nozzle travel path recalibration value calculation unit 600 calculates the gap between the corrected nozzle travel path B and the substrate S, and the nozzle 100 discharging the dispenser liquid and the substrate S and a gap difference monitoring unit 610 that monitors a gap deviation G between gaps, and when the gap deviation G is detected through the gap difference monitoring unit 610, the moving unit 300 may recalibrate the height of each position of the nozzle traveling path (B) using the calculated recalibration value of the height of each position of the nozzle traveling path (B).

The gap deviation monitoring unit 610 is a gap between the corrected nozzle traveling path B and the substrate S, and a gap between the nozzle 100 discharging the dispenser liquid and the substrate S. The deviation (G) can be monitored. To this end, the gap deviation monitoring unit 610 determines the flatness information of the substrate S and the gap between the substrate S and the nozzle 100 discharging the dispenser liquid measured through the gap sensor 200. The gap deviation G may be obtained using a gap.

When the gap deviation G is detected, the moving unit 300 calculates the recalibration value of the height of each position of the nozzle traveling path B calculated through the nozzle traveling path recorrection value calculation unit 600. It is possible to recalibrate the height of each position of the nozzle traveling path B by using In this case, the recalibration value of the height of each position of the nozzle traveling path B may be the gap deviation G. For this reason, the gap between the nozzle 100 and the substrate S is recalibrated by recalibrating the positional height of the nozzle traveling path B through the moving unit 300 by the detected gap deviation G. It can be maintained at the interval of the target gap.

The gap deviation monitoring unit 610 may monitor the gap deviation G at the flatness acquisition positions (a to c, etc.).

The gap deviation monitoring unit 610 monitors the gap deviation G at the flatness acquisition positions (a to c, etc.), so that the substrate S at the same flatness acquisition position (a to c, etc.) The flatness information of and the gap between the nozzle 100 discharging the dispenser liquid and the substrate S may be used. That is, the gap deviation monitoring unit 610 discharges the gap between the corrected nozzle travel path B and the substrate S at the same flatness acquisition position (a to c, etc.) and the dispenser liquid A gap deviation G between the nozzle 100 and the substrate S may be monitored.

When the gap deviation monitoring unit 610 detects the gap deviation G at the flatness acquisition position (n-th, a), the moving unit 300 moves the nozzle 100 to the next flatness acquisition position ( At n+1th, b), the height of each position of the nozzle traveling path B may be recalibrated. In this case, n may be an integer.

When the gap deviation monitoring unit 610 detects the gap deviation G at the flatness acquisition position (n-th, a), the detected gap deviation G is converted to the next flatness acquisition position in the nozzle 100 traveling direction. The height of each position of the nozzle traveling path B may be corrected again by reflecting the (n+1th, b). Due to this, the gap between the nozzle 100 and the substrate S is kept constant due to the nozzle traveling path (not shown) whose height is recalibrated for each position, so that the nozzle 100 is moved to the substrate S ) can be applied with a uniform thickness and width of the dispenser liquid.

The gap deviation monitoring unit 610 determines that the gap deviation G is not detected when the gap deviation G is greater than the sum of the height correction value for each position of the nozzle traveling path A and the thickness deviation value of the substrate S. can

The gap deviation monitoring unit 610 recognizes it as an error when the gap deviation G is greater than the sum of the height correction value for each position of the nozzle traveling path A and the thickness deviation value of the substrate S. can For this reason, the moving unit 300 may not correct the positional height of the nozzle travel path B again. That is, it can be recognized by the diffuse reflection of the gap sensor due to the diffuse reflection of the substrate, the scattering of the gap sensor due to the dispenser liquid deposited on the nozzle, and the interference between the line measured through the gap sensor and the line applied through the nozzle.

Here, the sum of the correction value of the height of each position of the nozzle traveling path A and the thickness deviation value of the substrate S may be a glass processing deviation that occurs when the substrate S is replaced.

At this time, the correction value of the height of each position of the nozzle travel path A may be a flatness deviation of the substrate S. Additionally, the recalibration value of the height of each position of the nozzle travel path B may be the gap deviation G.

5 is a schematic diagram showing recalibration of the height of each position of a nozzle traveling path of a dispenser according to another embodiment of the present invention.

Referring to FIG. 5, the substrate S is replaced with another substrate S, and the flatness of the substrate S is changed, and the process of monitoring the gap deviation G at the flatness acquisition position (n-th, a) It can be seen that the gap deviation (G) is detected through (S410). In addition, at the next flatness acquisition position (n+1th, b) in the driving direction of the nozzle 100, the nozzle 100 traveling on a nozzle travel path (not shown) whose height has been recalibrated for each position has a gap deviation It can be seen that it is moved by (G) and recalibrated. As a result, it can be seen that the nozzle 100 traveling on the nozzle travel path (not shown) whose height has been recalibrated by position has a height similar to that of the virtual path C spaced apart from the substrate S by the target gap. .

As described above, in the present invention, the dispensing method includes a process of acquiring flatness information of the substrate while the gap sensor moves along a preset nozzle travel path, so that the gap between the nozzle and the substrate can be maintained constant. Due to this, the nozzle can apply the dispenser liquid to the substrate with a uniform thickness and width. In addition, in the process of acquiring the flatness information of the substrate, the movement coordinates of the gap sensor are calculated as a vector sum to calculate the accumulated movement distance, so that the trigger board may not be mounted. In addition, the dispensing method may further include a process of recalibrating the height for each position of the nozzle travel path, thereby adjusting the gap between the nozzle and the substrate at a more regular interval. At this time, including the process of monitoring the gap deviation, the diffuse reflection of the gap sensor due to the diffuse reflection of the substrate, the scattering of the gap sensor due to the dispenser liquid deposited on the nozzle, and the interference of the line measured through the gap sensor and the line applied through the nozzle, etc. The error of can be filtered. Due to this, when the nozzle discharges the dispenser liquid, the gap between the nozzle and the substrate is maintained at a more constant interval, so that the dispenser liquid can be applied to the substrate with a uniform thickness and width.

Although the preferred embodiments of the present invention have been shown and described above, the present invention is not limited to the above embodiments, and common knowledge in the field to which the present invention pertains without departing from the gist of the present invention claimed in the claims. Those who have will understand that various modifications and other equivalent embodiments are possible from this. Therefore, the technical protection scope of the present invention should be determined by the claims below.

A: Nozzle travel path B: Corrected nozzle travel path
C: imaginary path spaced apart by the gap between the substrate and the target
D: Accumulated travel distance G: Gap deviation
S: substrate a: flatness acquisition position (nth)
b: flatness acquisition position (n+1th) c: flatness acquisition position
g: gap between nozzle and substrate 100: nozzle
200: gap sensor 300: moving unit
400: substrate flatness acquisition unit 410: cumulative distance calculation unit
420: Positioning unit 500: Nozzle travel path correction value calculation unit
600: Nozzle travel path recalibration value calculation unit 610: Gap deviation monitoring unit

Claims (16)

obtaining flatness information of a substrate while a gap sensor moves along a predetermined nozzle travel path;
correcting a height of each position of the nozzle traveling path using flatness information of the substrate; and
A dispensing method comprising: dispensing a dispenser liquid while a nozzle moves along the nozzle traveling path, the height of which has been corrected for each position. The method of claim 1,
The process of obtaining flatness information of the substrate,
calculating an accumulated movement distance of the gap sensor; and
Including; determining the flatness acquisition position of the substrate at a predetermined interval for the accumulated movement distance;
The dispensing method of acquiring flatness information of the substrate at the determined flatness acquisition position. The method of claim 1,
A moving speed of the gap sensor in the process of acquiring the flatness information of the substrate is slower than a moving speed of the nozzle in the process of applying the dispenser liquid while the nozzle moves. The method of claim 2,
A height recalibration process for each position of the nozzle traveling path for recalibrating the height for each position of the nozzle traveling path using the gap between the substrate and the nozzle discharging the dispenser liquid while moving measured through the gap sensor. Dispensing method comprising. The method of claim 4,
The height recalibration process for each position of the nozzle travel path,
monitoring a gap deviation between a gap between the corrected nozzle travel path and the substrate and a gap between the substrate and the nozzle discharging the dispenser liquid; and
and, when the gap deviation is detected, recalibrating the height of each position of the nozzle travel path by using the gap deviation. The method of claim 4,
The dispensing method further comprising a step of discharging the dispenser liquid while the nozzle moves along the nozzle travel path whose height has been recalibrated for each position. The method of claim 5,
The process of monitoring the gap deviation is performed at the flatness acquisition position. The method of claim 7,
If a gap deviation is detected at the flatness acquisition position (nth) during the process of monitoring the gap deviation,
The process of recalibrating the height of each position of the nozzle travel path is performed at the next flatness acquisition position (n+1th) in the travel direction of the nozzle. The method of claim 5,
In the process of recalibrating the height of each position of the nozzle travel path,
The dispensing method of determining non-detection when the gap deviation is greater than the sum of a height correction value in the process of correcting the height of each position of the nozzle travel path and a thickness deviation value of the substrate. A nozzle for discharging the dispenser liquid to the substrate;
a gap sensor measuring a gap between the nozzle and the substrate;
a moving unit moving the nozzle and the gap sensor along a nozzle travel path;
a substrate flatness obtaining unit acquiring flatness information of the substrate through the gap sensor moving along the nozzle travel path; and
A nozzle traveling path correction value calculation unit for calculating a correction value of the height of each position of the nozzle traveling path using the flatness information of the substrate;
The movement unit receives information about the correction value of the height of each position of the nozzle travel path from the nozzle travel path correction value calculation unit, and corrects the height of the nozzle travel path for each position;
The dispenser dispensing the dispenser liquid while the nozzle moves along a nozzle travel path whose height is corrected for each position. The method of claim 10,
The substrate flatness acquisition unit,
an accumulated distance calculator configured to calculate an accumulated movement distance of the gap sensor; and
A positioning unit determining a flatness acquisition position of the substrate at a predetermined interval with respect to the accumulated movement distance;
The dispenser for obtaining the flatness information of the substrate at the determined flatness acquisition position. The method of claim 11,
A nozzle travel path recalibration value calculator for calculating a recalibration value of the height of each position of the nozzle travel path using the gap between the substrate and the nozzle that discharges the dispenser liquid while moving measured through the gap sensor; Dispenser containing more. The method of claim 12,
The nozzle travel path recalibration value calculation unit,
A gap deviation monitoring unit for monitoring a gap between the corrected nozzle traveling path and the substrate and a gap between the substrate and the nozzle discharging the dispenser liquid,
When the gap deviation is detected through the gap deviation monitoring unit, the moving unit recalibrates the height of each position of the nozzle travel path using the calculated recalibration value of the height of each position of the nozzle travel path. The method of claim 13,
The gap deviation monitoring unit monitors the gap deviation at the flatness acquisition position. The method of claim 14,
When the gap deviation monitoring unit detects the gap deviation at the flatness acquisition position (nth),
The moving unit recalibrates the height of each position of the nozzle travel path at the next flatness acquisition position (n+1th) in the travel direction of the nozzle. The method of claim 13,
The dispenser of claim 1 , wherein the gap deviation monitoring unit determines that the gap deviation is not detected when the gap deviation is greater than the sum of the height correction value for each position of the nozzle traveling path and the thickness deviation value of the substrate.

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