KR20220150605A - Liquid supllying unit, substrate treating apparatus including the same and liquid supllying method using the same - Google Patents

Abstract

The present invention provides a substrate treatment apparatus. According to one embodiment, the substrate treatment apparatus comprises: a housing having a treatment space for treating a substrate therein; a support unit for supporting the substrate in the treatment space; a nozzle for supplying a high-temperature liquid to the substrate placed on the support unit; and a liquid supply unit for supplying the liquid to the nozzle. The liquid supply unit comprises: a tank having an internal space for storing the liquid; a main circulation line for supplying the liquid from the internal space of the tank to the nozzle or recovering the liquid into the internal space; and a supply line connected to the main circulation line to supply the liquid to the nozzle. In the main circulation line, installed are: a heating unit for heating the liquid supplied to the nozzle to a first temperature; a filter installed upstream of the heating unit to remove foreign substances from the liquid flowing through the main circulation line; and a cooling unit installed upstream of the filter to cool the liquid to a second temperature. In one embodiment, the cooling unit and the filter may be adjacently provided. Therefore, contamination of the liquid supply unit for supplying the high-temperature liquid can be efficiently removed.

Description

A liquid supply unit, a substrate processing device including the same, and a liquid supply method using the same

The present invention relates to a liquid supply unit for supplying liquid to a substrate, a substrate processing apparatus including the liquid supply unit, and a liquid supply method using the same.

Contaminants such as particles, organic contaminants, and metal contaminants remaining on the substrate surface greatly affect the characteristics and production yield of semiconductor devices. For this reason, a cleaning process for removing various contaminants attached to the surface of the substrate is very important in the semiconductor manufacturing process, and a process of cleaning the substrate is performed at stages before and after each unit process for manufacturing a semiconductor.

In general, a substrate cleaning process includes a chemical treatment process for removing metal foreign substances, organic substances, or particles remaining on the substrate using a chemical, a rinsing process for removing chemicals remaining on the substrate using pure water, and nitrogen A drying process of drying the substrate using gas, supercritical fluid, or the like is included.

In the chemical treatment process, the liquid supply unit provides liquid to the nozzle unit. In one example, the chemical treatment process may be a process of supplying a high-temperature organic solvent onto the substrate. In general, the liquid supply unit includes a tank for storing the liquid and a supply line for supplying the liquid to the nozzle unit from the inner space of the tank. A heater for heating the liquid and a filter for removing foreign substances in the liquid flowing through the supply line are installed in the supply line.

However, the high-temperature liquid expands the internal structure of the filter and dissolves foreign substances in the liquid. Accordingly, there is a problem in that the foreign matter easily passes through the filter, and thus the liquid containing the foreign matter is supplied onto the substrate as it is.

An object of the present invention is to provide a liquid supply unit that efficiently removes contamination of a liquid supply unit that supplies high-temperature liquid, a substrate processing apparatus including the same, and a liquid supply method using the same.

The problem to be solved by the present invention is not limited to the above-mentioned problems, and problems not mentioned can be clearly understood by those skilled in the art from this specification and the accompanying drawings. will be.

The present invention provides a substrate processing apparatus. According to one embodiment, a substrate processing apparatus includes a housing having a processing space for processing a substrate therein; a support unit supporting the substrate in the processing space; a nozzle for supplying a high-temperature liquid to a substrate placed on the support unit; and a liquid supply unit supplying liquid to the nozzle, wherein the liquid supply unit includes: a tank having an internal space for storing liquid; a main circulation line supplying liquid from the inner space of the tank to the nozzle or recovering the liquid into the inner space; a supply line connected to the main circulation line and supplying liquid to the nozzle, and in the main circulation line, a heating unit for heating the liquid supplied to the nozzle to a first temperature; a filter installed upstream of the heating unit to remove foreign substances from the liquid flowing through the main circulation line; and a cooling unit installed upstream of the filter to cool the liquid to a second temperature.

In one embodiment, the cooling unit and the filter may be provided adjacently.

In one embodiment, the tank includes a first tank and a second tank, and the liquid supply unit is configured to supply liquid stored in the inner space of the second tank while the liquid stored in the inner space of the first tank circulates through the main circulation line. An internal circulation line for circulating the liquid may be further included, and a temperature maintaining device for maintaining the liquid at a second temperature may be installed in the internal circulation line.

In one embodiment, the temperature maintaining device may be provided as a cooling device that cools the liquid.

In one embodiment, a filter for removing foreign substances from the liquid flowing through the internal circulation line may be installed in the internal circulation line, and a temperature maintaining device may be provided as a cooling device provided at a front end of the filter to cool the liquid.

In one embodiment, the first temperature may be provided at 50°C to 100°C.

In one embodiment, the second temperature may be room temperature.

In one embodiment, a heater for heating the liquid to a process temperature for processing the substrate may be installed in the supply line.

In one embodiment, the first temperature and the process temperature may be the same temperature.

In addition, the present invention provides a liquid supply unit. In one embodiment, the liquid supply unit includes a liquid supply line for supplying liquid to a nozzle; a heating unit installed in the liquid supply line to heat the liquid supplied to the nozzle to a first temperature; A filter installed upstream of the heating unit on the liquid supply line to remove foreign substances from the liquid; and a cooling unit installed upstream of the filter on the liquid supply line to cool the liquid to a second temperature.

In one embodiment, the cooling unit and the filter may be provided adjacently.

In one embodiment, the main circulation further includes a first tank and a second tank having an inner space for storing liquid, and the liquid supply line supplies liquid to the nozzle from the inner space or recovers the liquid to the inner space. line and; a supply line connected to the main circulation line to supply liquid to the nozzle; An internal circulation line for circulating the liquid stored in the internal space of the second tank while the liquid stored in the internal space of the first tank circulates through the main circulation line, but the heating unit, the filter and the cooling unit may be provided in the main circulation line. have.

In one embodiment, a temperature maintaining device for maintaining the liquid at the second temperature may be installed in the internal circulation line.

In one embodiment, a filter for removing foreign substances from the liquid flowing through the internal circulation line may be installed in the internal circulation line, and a temperature maintaining device may be provided as a cooling device provided at a front end of the filter to cool the liquid.

In one embodiment, a heater for heating the liquid to a process temperature for processing the substrate may be installed in the supply line.

In one embodiment, the first temperature and the process temperature may be the same temperature.

In addition, the present invention provides a liquid supply method. In one example, the liquid supply method, before supplying the liquid stored in the internal space of the tank to the nozzle, filter the liquid through a filter to remove impurities in the liquid, heat the liquid to a first temperature, and filter the liquid through the filter. The liquid may be cooled to a second temperature prior to incubation.

In one embodiment, the tank includes a first tank and a second tank, and the liquid stored in the inner space of the first tank is circulated through a circulation line while supplying the liquid stored in the inner space of the second tank to the nozzle. However, it may be maintained at the second temperature in the circulation line.

In one embodiment, the liquid in the region adjacent to the nozzle may be heated to a process temperature for processing the substrate.

In one embodiment, the process temperature may be a first temperature.

According to one embodiment of the present invention, it is possible to efficiently remove contamination of a liquid supply unit supplying high-temperature liquid.

The effects of the present invention are not limited to the above-mentioned effects, and effects not mentioned will be clearly understood by those skilled in the art from this specification and the accompanying drawings.

1 is a front view schematically showing an example of a substrate processing facility provided with a substrate processing apparatus according to an embodiment of the present invention.
FIG. 2 is a cross-sectional view showing an example of a substrate processing apparatus provided in the process chamber of FIG. 1 .
3 is a view showing one embodiment of the liquid supply unit of the present invention.
4 to 9 are views sequentially showing a method of treating a substrate using a liquid supply unit according to an embodiment of the present invention.
10 is a view showing another embodiment of the liquid supply unit of the present invention.

Hereinafter, embodiments of the present invention will be described in more detail with reference to the accompanying drawings. Embodiments of the present invention may be modified in various forms, and the scope of the present invention should not be construed as being limited to the following examples. This embodiment is provided to more completely explain the present invention to those skilled in the art. Accordingly, the shapes of elements in the figures are exaggerated to emphasize clearer description.

1 is a plan view schematically showing a substrate processing facility 1 of the present invention. Referring to FIG. 1 , a substrate processing facility 1 includes an index module 10 and a process processing module 20 , and the index module 10 includes a load port 120 and a transfer frame 140 . The load port 120, the transfer frame 140, and the process processing module 20 are sequentially arranged in a line. Hereinafter, the direction in which the load port 120, the transfer frame 140, and the processing module 20 are arranged is referred to as the first direction 12. And when viewed from above, the direction perpendicular to the first direction 12 is referred to as the second direction 14, and the direction perpendicular to the plane including the first direction 12 and the second direction 14 is referred to as the third direction. (16).

The carrier 130 in which the substrate W is accommodated is seated in the load port 140 . A plurality of load ports 120 are provided and they are arranged in a line along the second direction 14 . 1 shows that four load ports 120 are provided. However, the number of load ports 120 may increase or decrease depending on conditions such as process efficiency and footprint of the process processing module 20 . The carrier 130 is formed with slots (not shown) provided to support the edge of the substrate. A plurality of slots are provided in the third direction 16, and the substrates are placed in the carrier in a stacked state spaced apart from each other along the third direction 16. A front opening unified pod (FOUP) may be used as the carrier 130 .

The process processing module 20 has a buffer unit 220, a transfer chamber 240, and a process chamber 260. The transfer chamber 240 is disposed parallel to the first direction 12 in its longitudinal direction. Process chambers 260 are respectively disposed on one side and the other side of the transfer chamber 240 along the second direction 14 . The process chambers 260 located on one side of the transfer chamber 240 and the process chambers 260 located on the other side of the transfer chamber 240 are provided to be symmetrical to each other with respect to the transfer chamber 240 . Some of the process chambers 260 are disposed along the length direction of the transfer chamber 240 . Also, some of the process chambers 260 are stacked with each other.

That is, on one side of the transfer chamber 240, the process chambers 260 may be arranged in an array of A X B (where A and B are each a natural number of 1 or greater). Here, A is the number of process chambers 260 provided in a row along the first direction 12 , and B is the number of process chambers 260 provided in a row along the third direction 16 . When four or six process chambers 260 are provided on one side of the transfer chamber 240, the process chambers 260 may be arranged in a 2 X 2 or 3 X 2 arrangement. The number of process chambers 260 may increase or decrease. Unlike the above description, the process chamber 260 may be provided only on one side of the transfer chamber 240 . Also, unlike the above description, the process chamber 260 may be provided as a single layer on one side and both sides of the transfer chamber 240 .

The buffer unit 220 is disposed between the transfer frame 140 and the transfer chamber 240 . The buffer unit 220 provides a space where the substrate W stays between the transfer chamber 240 and the transfer frame 140 before the substrate W is transported. The buffer unit 220 is provided with a slot (not shown) in which the substrate W is placed, and a plurality of slots (not shown) are provided to be spaced apart from each other along the third direction 16 . In the buffer unit 220, a surface facing the transfer frame 140 and a surface facing the transfer chamber 240 are opened.

The transfer frame 140 transports the substrate W between the carrier 130 seated on the load port 120 and the buffer unit 220 . An index rail 142 and an index robot 144 are provided on the transfer frame 140 . The length direction of the index rail 142 is parallel to the second direction 14 . The index robot 144 is installed on the index rail 142 and linearly moves in the second direction 14 along the index rail 142 .

The index robot 144 has a base 144a, a body 144b, and an index arm 144c. The base 144a is installed to be movable along the index rail 142. The body 144b is coupled to the base 144a. The body 144b is provided to be movable along the third direction 16 on the base 144a. In addition, the body 144b is provided to be rotatable on the base 144a. The index arm 144c is coupled to the body 144b and is provided to be movable forward and backward with respect to the body 144b. A plurality of index arms 144c are provided to be individually driven. The index arms 144c are stacked and spaced apart from each other along the third direction 16 . Some of the index arms 144c are used to transfer the substrate W from the process module 20 to the carrier 130, and some of the index arms 144c are used to transport the substrate W from the carrier 130 to the process module 20. Can be used when transporting. This can prevent particles generated from the substrate W before processing from being attached to the substrate W after processing in the process of carrying in and unloading the substrate W by the index robot 144 .

The transfer chamber 240 transfers the substrate W between the buffer unit 220 and the process chamber 260 and between the process chambers 260 . A guide rail 242 and a main robot 244 are provided in the transfer chamber 240 . The guide rail 242 is arranged so that its longitudinal direction is parallel to the first direction 12 . The main robot 244 is installed on the guide rail 242 and moves linearly along the first direction 12 on the guide rail 242 . The main robot 244 has a base 244a, a body 244b, and a main arm 244c. The base 244a is installed to be movable along the guide rail 242 . The body 244b is coupled to the base 244a. The body 244b is provided to be movable along the third direction 16 on the base 244a. In addition, the body 244b is provided to be rotatable on the base 244a. The main arm 244c is coupled to the body 244b, and is provided to be movable forward and backward with respect to the body 244b. A plurality of main arms 244c are provided to be individually driven. The main arms 244c are stacked and spaced apart from each other along the third direction 16 . The main arm 244c used to transfer substrates from the buffer unit 220 to the process chamber 260 and the main arm 244c used to transfer substrates from the process chamber 260 to the buffer unit 220 are may differ from each other.

A substrate processing apparatus 300 performing a cleaning process on the substrate W is provided in the process chamber 260 . The substrate processing apparatus 300 provided in each process chamber 260 may have a different structure depending on the type of cleaning process to be performed. Optionally, the substrate processing apparatus 300 in each process chamber 260 may have the same structure. Optionally, the process chambers 260 are divided into a plurality of groups, so that the substrate processing apparatuses 300 provided to the process chambers 260 belonging to the same group have the same structure and provided to the process chambers 260 belonging to different groups. The substrate processing apparatuses 300 may have structures different from each other.

For example, when the process chambers 260 are divided into two groups, a first group of process chambers 260 are provided on one side of the transfer chamber 240, and a second group of process chambers 260 are provided on the other side of the transfer chamber 240. Process chambers 260 may be provided. Optionally, a first group of process chambers 260 may be provided on a lower layer on one side and the other side of the transfer chamber 240 , and a second group of process chambers 260 may be provided on an upper layer. The process chambers 260 of the first group and the process chambers 260 of the second group may be classified according to the type of chemical used or the type of cleaning method.

An example of the substrate processing apparatus 300 for cleaning the substrate W using a processing liquid will be described below. 2 is a cross-sectional view showing an example of a substrate processing apparatus 300 . Referring to FIG. 2 , the substrate processing apparatus 300 includes a housing 320, a support unit 340, a lift unit 360, a nozzle unit 380, and a liquid supply unit 400.

The housing 320 provides a space in which a substrate processing process is performed, and an upper portion thereof is open. The housing 320 has an internal collection container 322, an intermediate collection container 324, and an external collection container 326. Each of the collection containers 322 , 324 , and 326 collects different treatment liquids among the treatment liquids used in the process. The internal collection container 322 is provided in an annular ring shape surrounding the support unit 340, the intermediate collection container 324 is provided in an annular ring shape surrounding the internal collection container 322, and the external collection container 326 ) is provided in an annular ring shape surrounding the intermediate recovery container 324. The inner space 322a of the internal collection container 322, the space 324a between the internal collection container 322 and the intermediate collection container 324, and the space between the intermediate collection container 324 and the external collection container 326 ( 326a) serves as an inlet through which the treatment liquid flows into the internal recovery container 322, the intermediate recovery container 324, and the external recovery container 326, respectively. Recovering lines 4170 (322b, 324b, and 326b) extending vertically downward on the lower surface thereof are connected to the respective collection containers 322, 324, and 326. Each of the recovery lines 4170 (322b, 324b, and 326b) discharges the treatment liquid introduced through the respective recovery cylinders 322, 324, and 326. The discharged treatment liquid may be reused through an external treatment liquid recovery system (not shown).

The support unit 340 is disposed within the housing 320 . The support unit 340 supports the substrate and rotates the substrate during the process. The support unit 340 has a body 342 , a support pin 334 , a chuck pin 346 , and a support shaft 348 . The body 342 has an upper surface provided in a generally circular shape when viewed from the top. A support shaft 348 rotatable by a motor 349 is fixedly coupled to the bottom surface of the body 342 . A plurality of support pins 334 are provided. The support pins 334 are spaced apart from each other at predetermined intervals on the edge of the upper surface of the body 342 and protrude upward from the body 342 . Support pins 334 are arranged to have an annular ring shape as a whole by combining with each other. The support pin 334 supports the rear edge of the substrate so that the substrate is separated from the upper surface of the body 342 by a predetermined distance. A plurality of chuck pins 346 are provided. Chuck pin 346 is disposed farther from the center of body 342 than support pin 334 . The chuck pin 346 is provided to protrude upward from the body 342 . The chuck pin 346 supports the side of the substrate so that the substrate is not laterally displaced from the original position when the spin head 340 is rotated. The chuck pin 346 is provided to be linearly movable between a standby position and a support position along the radial direction of the body 342 . The standby position is a position farther from the center of the body 342 compared to the support position. When a substrate is loaded or unloaded from the spin head 340, the chuck pin 346 is positioned at a standby position, and when a process is performed on the substrate, the chuck pin 346 is positioned at a support position. In the supported position, the chuck pins 346 contact the side of the substrate.

The lifting unit 360 linearly moves the housing 320 in the vertical direction. As the housing 320 moves up and down, the relative height of the housing 320 to the support unit 340 changes. The lift unit 360 has a bracket 362, a moving shaft 364, and an actuator 366. The bracket 362 is fixedly installed on the outer wall of the housing 320, and the moving shaft 364 moved in the vertical direction by the driver 366 is fixedly coupled to the bracket 362. When the substrate W is placed on or lifted from the support unit 340 , the housing 320 is lowered so that the support unit 340 protrudes upward from the housing 320 . In addition, when the process is in progress, the height of the housing 320 is adjusted so that the treatment liquid can flow into the predetermined collection container 360 according to the type of the treatment liquid supplied to the substrate W. For example, while the substrate is being treated with the first treatment liquid, the substrate is positioned at a height corresponding to the inner space 322a of the inner recovery container 322 . In addition, while substrates are treated with the second treatment liquid and the third treatment liquid, the substrates are separated from each other in the space 324a between the inner collection container 322 and the intermediate collection container 324, and between the intermediate collection container 324 and the outer collection container 324. It may be located at a height corresponding to the space 326a between the collection containers 326 . Unlike the above description, the lifting unit 360 can move the spin head 340 in the vertical direction instead of the housing 320 .

The nozzle unit 380 supplies a treatment liquid to the substrate W during a substrate treatment process. The nozzle unit 380 has a nozzle support 382 , a nozzle 384 , a support shaft 386 , and an actuator 388 . The support shaft 386 is provided along the third direction 16 in its longitudinal direction, and an actuator 388 is coupled to the lower end of the support shaft 386 . The driver 388 rotates and moves the support shaft 386 up and down. The nozzle support 382 is vertically coupled to the opposite end of the support shaft 386 coupled to the driver 388. The nozzle 384 is installed on the lower end of the nozzle support 382. The nozzle 384 is moved to a process position and a stand-by position by an actuator 388. The process position is a position where the nozzle 384 is disposed vertically above the housing 320, and the stand-by position is a position where the nozzle 384 is displaced from the vertical upper part of the housing 320.

One or a plurality of nozzle units 380 may be provided. When a plurality of nozzle units 380 are provided, chemicals, rinsing liquids, or organic solvents may be provided through different nozzle units 380 . In one example, the chemical may be an acidic solution such as hydrofluoric acid, sulfuric acid, nitric acid, phosphoric acid, and the like, or an alkaline solution containing potassium hydroxide, sodium hydroxide, ammonium, and the like. The rinsing liquid may be pure water, and the organic solvent may be a mixture of isopropyl alcohol vapor and an inert gas or isopropyl alcohol.

The liquid supply unit 4100 supplies liquid to the nozzle unit 380 . In one example, the liquid may be an organic solvent such as isopropyl alcohol. 3 is a view showing a first embodiment of the liquid supply unit 4100 of the present invention. Referring to FIG. 3, the liquid supply unit 4100 includes liquid supply lines 4131 and 4135 for supplying liquid to a liquid supply source 4110, a first tank 4120, a second tank 4130, and a nozzle unit 380. , 4160, 4170, 4190) and drain lines 4181, 4182. The liquid supply lines 4131, 4135, 4150, 4160, and 4190 include inlet lines 4131 and 4135, a main circulation line 4170, an internal circulation line 4160, and a supply line 4190.

The liquid supply source 4110 stores the liquid used in the process and supplies the liquid to the first tank 4120 or the second tank 4130. In one example, the liquid supply source 4110 may have a first liquid supply source 4112 storing the first liquid and a second liquid supply source 4114 storing the second liquid.

The first tank 4120 and the second tank 4130 have substantially the same structure. The first tank 4120 and the second tank 4130 store liquid. While liquid is being supplied to the object to be processed 5000 from one of the first tank 4120 and the second tank 4130, liquid exchange is performed with the other tank. In one example, the object to be processed 5000 is a substrate that is processed within a plurality of process chambers. For example, one of the objects to be processed 5000 is the substrate W shown in FIG. 2 . In one example, sensors (not shown) are mounted inside the first tank 4120 and the second tank 4130 . A sensor (not shown) detects the remaining amount of liquid stored in the inner space of each tank. The first liquid and the second liquid supplied from the liquid supply source 4110 may be mixed and stored in the first tank 4120 and the second tank 4130 . Alternatively, the first tank 4120 and the second tank 4130 may store only one liquid. Alternatively, a single liquid supply source 4110 may be provided, and the first tank 4120 and the second tank 4130 may store the same liquid.

The inlet lines 4131 and 4135 may have a first inlet line 4131 and a second inlet line 4135 . The first inlet line 4131 includes a first tank first inlet line 4132 and a second tank first inlet line 4133 . The second inlet line 4135 has a first tank second inlet line 4136 and a second tank second inlet line 4137. The first tank first inlet line 4132 connects the first liquid supply source 4112 to the first tank 4120 . A first inlet valve 4121 is installed in the first tank first inlet line 4132 to adjust the flow rate of the liquid supplied from the first liquid supply source 4112 to the first tank 4120 . The second tank first inlet line 4133 connects the first liquid source 4112 to the second tank 4130. A second inlet valve 4139 is installed in the first inlet line 4133 of the second tank to adjust the flow rate of the liquid supplied from the first liquid supply source 4112 to the second tank 4130 . A first tank second inlet line 4136 connects the second liquid source 4114 to the first tank 4120 . A third inlet valve 4122 is installed in the second inlet line 4136 of the first tank to adjust the flow rate of the liquid supplied from the second liquid supply source 4114 to the first tank 4120 . The second tank second inlet line 4137 connects the second liquid source 4114 to the second tank 4130. A fourth inlet valve 4141 is installed in the second tank second inlet line 4137 to adjust the flow rate of the liquid supplied from the second liquid supply source 4114 to the second tank 4130 .

The drain lines 4181 and 4182 include a first drain line 4181 and a second drain line 4182 . The first drain line 4181 drains the first tank 4120 . A first drain valve 4185 is installed in the first drain line 4181 to adjust the flow rate of liquid drained from the first tank 4120 . A second drain line 4182 drains the second tank 4130 . A second drain valve 4187 is installed in the second drain line 4182 to adjust the flow rate of liquid drained from the second tank 4130 .

The main circulation line 4170 supplies liquid for processing the substrate to the respective nozzles 5010, 5020, and 5030, or supplies remaining liquid after liquid processing the substrate from the supply line 4190 to the first tank 4120 or It is recovered to the inner space of each of the second tanks 4130. The main circulation line 4170 has a combined outlet line 4150, a first return line 4171 and a second return line 4172.

A combined outlet line 4150 connects the first tank 4120 and the second tank 4130 to a supply line 4190. In one example, a pump 4152 may be installed in the integrated outlet line 4150 to deliver liquid to the supply line 4190.

The supply line 4190 supplies a liquid to a substrate, which is an object to be processed. The combined outlet line 4150 has a first outlet line 4151 and a second outlet line 4152 . A first outlet line 4151 connects the first tank 4120 to a supply line 4190. A first outlet valve 4126 is installed in the first outlet line 4151 to adjust the flow rate of liquid supplied from the first tank 4120 to the supply line 4190 . A second outlet line 4152 connects the second tank 4130 to the supply line 4190. A second outlet valve 4136 is installed in the second outlet line 4152 to adjust the flow rate of liquid supplied from the second tank 4230 to the supply line 4190 .

The first recovery line 4171 recovers liquid into the first tank 4120 . A first recovery valve 4123 is installed in the first recovery line 4171 to adjust the flow rate of liquid recovered from the supply line 4190 to the first tank 4120 . The second recovery line 4172 recovers liquid into the second tank 4130 . A second recovery valve 4138 is installed in the second recovery line 4172 to adjust the flow rate of the liquid recovered from the supply line 4190 to the second tank 4130 .

The inner circulation line 4160 circulates the liquid stored in the inner spaces of the first tank 4120 and the second tank 4130. The internal circulation line 4160 has a first line 4161, a second line 4162, a third line 4163, a fourth line 4164, and a common line 4165.

The shared line 4165 connects the first line 4161, the second line 4162, the third line 4163, and the fourth line 4164. The liquid flowing through the common line 4165 flows back into the first tank 4120 through the first line 4161 or into the second tank 4130 through the second line 4162. Similarly, the liquid stored in the inner space of the first tank 4120 circulates through the first line 4161 , the shared line 4165 , and the third line 4163 . The liquid in the second tank 4130 circulates through the second line 4162, the common line 4165, and the fourth line 4164.

The first line 4161 is connected to the upper surface of the first tank 4120 . The liquid passing through the common line 4165 flows into the first tank 4120 through the first line 4161 . A first valve 4161 is installed in the first line 4161 to adjust the flow rate of liquid flowing into the first tank 4120 from the common line 4165 . The second line 4162 is connected to the upper surface of the second tank 4130. The liquid passing through the common line 4165 flows into the second tank 4130 through the second line 4162 . A second valve 4162 is installed in the second line 4162 to adjust the flow rate of liquid flowing into the second tank 4130 from the common line 4165 . A third line 4163 is connected to the bottom of the first tank 4120. The liquid in the first tank 4120 flows out through the third line 4163. A third valve 4125 is installed in the third line 4163 to adjust the flow rate of liquid supplied from the first tank 4120 to the heater 4174 . A fourth line 4164 is connected to the bottom of the second tank 4130. The liquid stored in the inner space of the second tank 4130 is discharged through the fourth line 4164. A fourth valve 4135 is installed in the fourth line 4164 to adjust the flow rate of liquid supplied from the second tank 4130 to the heater 4174 .

The supply line 4190 supplies liquid to a plurality of chambers. Nozzles 5010, 5020, and 5030 are provided in each chamber to supply liquid to the object to be processed. For example, the liquid is supplied to the substrate through the nozzle 5020 . A supply control valve 4191 is installed in the supply line 4190 to adjust the flow rate of the liquid supplied to the target object. A distributor 4280 is installed in the supply line 4190. The distributor 4280 has a first supply line 4210, a second supply line 4220 and a third supply line 4230 connected to each chamber. Valves 4212, 4222, and 4232 are installed in each of the supply lines 4210, 4220, and 4230 to adjust the flow rate of the liquid supplied to each chamber.

In addition, return lines 4242, 4244, and 4246 are connected to the respective supply lines 4210, 4220, and 4230. The return lines 4242 , 4244 , and 4246 are connected to the integrated return line 4240 and return liquid remaining in the respective supply lines 4210 , 4220 , and 4230 to the main circulation line 4170 . A valve is provided in each of the return lines 4242, 4244, and 4246 to regulate the flow rate of the liquid returned to the return line 4170.

The liquid repeatedly circulated through the main circulation line 4170 may be gradually raised in temperature by heating devices installed in the liquid supply lines 4131 , 4135 , 4160 , 4170 , and 4190 . In addition, various heating devices not shown in the drawing may be further provided in the liquid supply unit 4100 . In one example, a heater for heating the liquid to a process temperature may be provided at a position adjacent to the nozzles 5010, 5020, and 5030 on the supply line. Accordingly, the temperature of the liquid flowing through the liquid supply lines 4131 , 4135 , 4160 , 4170 , and 4190 may gradually rise. To prevent this, a temperature maintaining device 4175 for maintaining the liquid at the second temperature may be installed in the liquid supply lines 4131 , 4135 , 4160 , 4170 , and 4190 . In one example, the temperature maintenance device 4175 is installed in the internal circulation line 4160. In one example, temperature maintenance device 4175 is installed on common line 4165.

In one example, a first filter 4174, a temperature maintaining device 4175, and a pump 4166 are installed in the internal circulation line 4160. The first filter 4174 removes foreign substances from the liquid flowing through the internal circulation line 4160 . The temperature maintaining device 4175 controls the temperature of the liquid flowing through the internal circulation line 4160. The pump 4166 controls the stroke per minute to adjust the supply flow rate of the liquid. In one example, the temperature maintaining device 4175 is located upstream of the first filter 4174. In one example, the temperature maintaining device 4175 may be provided as a cooling device that cools the liquid. The temperature maintaining device 4175 cools the liquid to a second temperature. Thus, excessive heating of the liquid by the device for heating the liquid flowing through the liquid supply line is prevented.

In addition, in the liquid supply lines 4131, 4135, 4160, 4170, and 4190 of the present invention, a heating unit 4158 for heating the liquid supplied to the nozzles 5010, 5020, and 5030, and for removing foreign matter inside the liquid A second filter 4156 and a cooling unit 4154 for cooling the liquid flowing into the second filter 4156 are installed. In one example, the heating unit 4158, the second filter 4156 and the cooling unit 4154 are provided in the main circulation line 4170. For example, the heating unit 4158 installed in the main circulation line 4170 is provided at the rear end of the second filter 4156, and the cooling unit 4154 is provided at the front end of the second filter 4156. In one example, heating section 4158, secondary filter 4156 and cooling section 4154 are provided in integrated outlet line 4150.

The heating unit 4158 heats the liquid supplied to the nozzles 5010, 5020, and 5030 to a first temperature. In one example, the first temperature may be a processing temperature of a liquid for processing a substrate. In one example, the first temperature may be provided at 50°C to 100°C. Optionally, the first temperature may be lower than the process temperature. In one example, the heating unit 4158 may be provided as a device capable of rapidly heating the liquid. For example, the heating unit 4158 may be provided as a heater having a high output.

The cooling unit 4154 is installed upstream of the second filter 4156 to cool the liquid to a second temperature. In one example, the second temperature is provided as room temperature. The cooling unit 4154 cools the liquid before it is supplied to the second filter 4156, and as the liquid supplied to the second filter 4156 is provided at a high temperature, the inside of the second filter 4156 is expanded to cool the liquid. Degrading the performance of the filter 4156 can be prevented. In addition, as the liquid supplied to the second filter 4156 is provided at a high temperature, it is possible to prevent the liquid from easily passing through the second filter 4156 by dissolving foreign substances in the liquid. In one example, the cooling unit 4154 and the second filter 4156 may be provided adjacent to each other. Accordingly, by lowering the temperature of the liquid in the vicinity of the second filter 4156, it is possible to prevent the liquid from being raised in temperature while being transferred to the second filter 4156. In one example, the cooling unit 4154 may be provided as a device capable of rapidly cooling liquid.

The liquid is heated and supplied to the nozzles 5010, 5020, and 5030 only after passing through the cooling unit 4154 and the heating unit 4158. Accordingly, it is possible to prevent heat damage from being applied to the pipe, the second filter 4156, the valve, etc. provided upstream of the heating unit 4158.

Hereinafter, the substrate processing method of the present invention will be described with reference to FIGS. 4 to 9 . 4 to 9 are views sequentially showing a method of processing a substrate using the liquid supply unit 4100 according to an example of the present invention. Arrows indicate fluid flow. When the inside of the valve is filled, it means that the valve is closed, and when the inside of the valve is empty, it means that the valve is open. In each step, when the liquid flows out from the inner space of each tank or is not returned to the inner space of each tank, the liquid inside the tank is circulated through the inner circulation line.

First, as shown in FIG. 4 , liquid is discharged from the inner space of the first tank 4120 through the first outlet line 4151 . Thereafter, the liquid is supplied from the inner space of the first tank 4120 to the feature processing body through the supply line 4190 . In one example, the supply line 4190 supplies liquid to the nozzle 5020, and the liquid is supplied to the substrate through the nozzle 5020. While the liquid stored in the first tank 4120 is supplied to the substrate through the nozzle 5020, the liquid stored in the second tank 4130 is circulated through the internal circulation line 4160.

Then, as shown in FIG. 5 , the liquid is recovered into the inner space of the first tank 4120 . In one example, supplying the liquid stored in the inner space of the first tank 4120 to the nozzles 5010 , 5020 , and 5030 and recovering the liquid into the first tank 4120 may be simultaneously performed. As the liquid is supplied from the first tank 4120 to the nozzle 5020, the water level in the first tank 4120 gradually decreases as shown in FIG.

Thereafter, the liquid is supplied to the nozzle 5020 through the first tank 4120 until the balance of the liquid stored in the first tank 4120 reaches a predetermined amount. As shown in FIG. 6, when the balance of the liquid stored in the first tank 4120 reaches a predetermined amount, as shown in FIG. 7, the liquid is replenished into the first tank 4120, and the second tank (4130) Liquid exchange is performed to supply the liquid stored inside to the nozzle 5020. As shown in FIG. 7 , the liquid stored in the first tank 4120 is circulated through the internal circulation line 4160 while the liquid stored in the second tank 4130 is supplied to the nozzle 5020 .

During the above process, the liquid stored in the first tank 4120 is supplied to the nozzle 5020 through the outlet line 4151 and the combined outlet 4150. Also, the liquid stored in the second tank 4130 is circulated in the internal circulation line 4160.

While the liquid stored in the first tank 4120 is supplied to the nozzle 5020 through the integrated outlet 4150, it is cooled by the cooling unit 4154, and foreign substances are filtered out by the second filter 4156. Accordingly, the liquid becomes clean while passing through the integrated outlet 4150 line. In addition, the liquid is heated by the heating unit 4158 before being supplied to the nozzle 5020 to a temperature suitable for the process. In addition, the liquid stored in the second tank 4130 is cooled by the temperature maintaining device 4175 provided in the internal circulation line 4160, and foreign substances are filtered out by the first filter 4174. Accordingly, the liquid maintains an appropriate temperature in the internal circulation line 4160 and becomes clean.

Then, as shown in FIG. 8 , the liquid is recovered into the inner space of the second tank 4130 . In one example, supplying the liquid stored in the inner space of the second tank 4140 to the respective nozzles 5010, 5020, and 5030 and recovering the liquid to the second tank 4130 may be simultaneously performed. As the liquid is supplied from the second tank 4130 to the nozzle 5020, the water level in the second tank 4130 gradually decreases as shown in FIGS. 8 and 9 . Thereafter, the liquid is supplied to the nozzle 5020 through the second tank 4130 until the balance of the liquid stored in the second tank 4130 reaches a predetermined amount. Then, supply of the liquid from the second tank 4130 to the nozzle 5020 is stopped. Liquid exchange is performed in which supply from the first tank 4120 to the nozzle 5020 starts, and the process of FIGS. 4 to 7 is repeated again.

During the above process, the liquid stored in the second tank 4130 is supplied to the nozzle 5020 through the outlet line 4151 and the combined outlet 4150. In addition, the liquid stored in the first tank 4120 is circulated in the internal circulation line 4160.

While the liquid stored in the second tank 4130 is supplied to the nozzle 5020 through the integrated outlet 4150, it is cooled by the cooling unit 4154, and then the foreign matter is filtered out by the second filter 4156. Accordingly, the liquid becomes clean while passing through the integrated outlet 4150 line. In addition, the liquid is heated by the heating unit 4158 before being supplied to the nozzle 5020 to a temperature suitable for the process. In addition, the liquid stored in the first tank 4120 is cooled by the temperature maintaining device 4175 provided in the internal circulation line 4160, and foreign substances are filtered out by the first filter 4174. Accordingly, the liquid maintains an appropriate temperature in the internal circulation line 4160 and becomes clean.

According to the present invention, in the liquid supply unit for supplying high-temperature liquid, there is an advantage that the filtration rate of the filter can be increased.

In the above example, the temperature maintaining device has been described as being located upstream of the filter. Alternatively, however, the temperature maintaining device may be located downstream of the filter as shown in FIG. 12 .

The above detailed description is illustrative of the present invention. In addition, the foregoing is intended to illustrate and describe preferred embodiments of the present invention, and the present invention can be used in various other combinations, modifications, and environments. That is, changes or modifications are possible within the scope of the concept of the invention disclosed in this specification, within the scope equivalent to the written disclosure and / or within the scope of skill or knowledge in the art. The written embodiment describes the best state for implementing the technical idea of the present invention, and various changes required in the specific application field and use of the present invention are also possible. Therefore, the above detailed description of the invention is not intended to limit the invention to the disclosed embodiments. Also, the appended claims should be construed to cover other embodiments as well.

Claims (20)

In the apparatus for processing the substrate,
a housing having a processing space for processing a substrate therein;
a support unit supporting the substrate in the processing space;
a nozzle supplying a high-temperature liquid to the substrate placed on the support unit; and
A liquid supply unit supplying the liquid to the nozzle;
The liquid supply unit,
a tank having an internal space for storing the liquid;
a main circulation line supplying the liquid from the inner space of the tank to the nozzle or returning the liquid to the inner space;
A supply line connected to the main circulation line to supply liquid to the nozzle;
In the main circulation line,
a heating unit for heating the liquid supplied to the nozzle to a first temperature;
a filter installed upstream of the heating unit to remove foreign matter from the liquid flowing through the main circulation line; and
A substrate processing apparatus comprising a cooling unit installed upstream of the filter to cool the liquid so that the liquid reaches a second temperature. According to claim 1,
The cooling unit and the filter are provided adjacent to the substrate processing apparatus. According to claim 1,
The tank includes a first tank and a second tank,
The liquid supply unit,
While the liquid stored in the inner space of the first tank circulates through the main circulation line,
Further comprising an internal circulation line for circulating the liquid stored in the internal space of the second tank,
In the internal circulation line,
A substrate processing apparatus in which a temperature maintaining device for maintaining the liquid at the second temperature is installed. According to claim 3,
The temperature maintaining device,
A substrate processing device provided as a cooling device for cooling the liquid. According to claim 3,
In the internal circulation line,
A filter for removing foreign substances from the liquid flowing through the internal circulation line is installed,
The temperature maintaining device,
A substrate processing apparatus provided as a cooling device provided at a front end of the filter to cool the liquid. According to claim 1,
The first temperature is provided at 50 ℃ to 100 ℃ substrate processing apparatus. According to claim 1,
The second temperature is room temperature substrate processing apparatus. According to any one of claims 1 to 7,
In the supply line,
A substrate processing apparatus in which a heater for heating the liquid to a process temperature for processing the substrate is installed. According to claim 8,
The first temperature and the process temperature are the same temperature substrate processing apparatus. In the liquid supply unit for supplying the liquid to a nozzle that discharges the liquid for processing the substrate,
a liquid supply line for supplying liquid to the nozzle;
a heating unit installed in the liquid supply line to heat the liquid supplied to the nozzle to a first temperature;
a filter installed upstream of the heating unit on the liquid supply line to remove foreign matter from the liquid; and
A liquid supply unit comprising a cooling unit installed upstream of the filter on the liquid supply line to cool the liquid so that the liquid reaches a second temperature. According to claim 10,
The cooling unit and the liquid supply unit provided adjacent to the filter. According to claim 10,
Further comprising a first tank and a second tank having an inner space for storing the liquid,
The liquid supply line,
a main circulation line supplying the liquid from the inner space to the nozzle or recovering the liquid into the inner space;
a supply line connected to the main circulation line and supplying liquid to the nozzle;
An internal circulation line for circulating the liquid stored in the internal space of the second tank while the liquid stored in the internal space of the first tank circulates through the main circulation line,
The heating unit, the filter and the cooling unit are provided in the main circulation line. According to claim 12,
In the internal circulation line,
A liquid supply unit in which a temperature maintaining device for maintaining the liquid at the second temperature is installed. According to claim 13,
In the internal circulation line,
A filter for removing foreign substances from the liquid flowing through the internal circulation line is installed,
The temperature maintaining device,
A liquid supply unit provided as a cooling device provided at a front end of the filter to cool the liquid. According to any one of claims 12 to 14,
In the supply line,
A liquid supply unit in which a heater for heating the liquid to a process temperature for processing the substrate is installed. According to claim 15,
The first temperature and the process temperature are the same temperature liquid supply unit. In the method of supplying the liquid,
Before supplying the liquid stored in the inner space of the tank to the nozzle, filter the liquid through a filter to remove impurities in the liquid and heat the liquid to a first temperature,
A liquid supply method of cooling the liquid to a second temperature before filtering the liquid through the filter. According to claim 17,
the tank,
Including a first tank and a second tank,
While supplying the liquid stored in the inner space of the second tank to the nozzle, the liquid stored in the inner space of the first tank is circulated through a circulation line,
A liquid supply method maintained at a second temperature in the circulation line. According to claim 17,
A liquid supply method in which the liquid is heated to a process temperature for processing a substrate in a region adjacent to the nozzle. According to claim 19,
The process temperature is the liquid supply method of the first temperature.

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