KR20220140648A - Adhesive composition, adhesive agent, and adhesive sheet - Google Patents

Adhesive composition, adhesive agent, and adhesive sheet Download PDF

Info

Publication number
KR20220140648A
KR20220140648A KR1020227034477A KR20227034477A KR20220140648A KR 20220140648 A KR20220140648 A KR 20220140648A KR 1020227034477 A KR1020227034477 A KR 1020227034477A KR 20227034477 A KR20227034477 A KR 20227034477A KR 20220140648 A KR20220140648 A KR 20220140648A
Authority
KR
South Korea
Prior art keywords
pressure
meth
sensitive adhesive
acrylic acid
adhesive
Prior art date
Application number
KR1020227034477A
Other languages
Korean (ko)
Other versions
KR102658943B1 (en
Inventor
히토시 오하시
요이치 다카하시
Original Assignee
린텍 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=54194351&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR20220140648(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 린텍 가부시키가이샤 filed Critical 린텍 가부시키가이샤
Publication of KR20220140648A publication Critical patent/KR20220140648A/en
Application granted granted Critical
Publication of KR102658943B1 publication Critical patent/KR102658943B1/en

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C09J133/04Homopolymers or copolymers of esters
    • C09J133/06Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
    • C09J133/062Copolymers with monomers not covered by C09J133/06
    • C09J133/066Copolymers with monomers not covered by C09J133/06 containing -OH groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/14Methyl esters, e.g. methyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/12Esters of monohydric alcohols or phenols
    • C08F220/16Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
    • C08F220/18Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
    • C08F220/1808C8-(meth)acrylate, e.g. isooctyl (meth)acrylate or 2-ethylhexyl (meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08FMACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F220/00Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
    • C08F220/02Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
    • C08F220/10Esters
    • C08F220/20Esters of polyhydric alcohols or phenols, e.g. 2-hydroxyethyl (meth)acrylate or glycerol mono-(meth)acrylate
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/62Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/622Polymers of esters of alpha-beta ethylenically unsaturated carboxylic acids
    • C08G18/6225Polymers of esters of acrylic or methacrylic acid
    • C08G18/6229Polymers of hydroxy groups containing esters of acrylic or methacrylic acid with aliphatic polyalcohols
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/28Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the compounds used containing active hydrogen
    • C08G18/40High-molecular-weight compounds
    • C08G18/62Polymers of compounds having carbon-to-carbon double bonds
    • C08G18/6216Polymers of alpha-beta ethylenically unsaturated carboxylic acids or of derivatives thereof
    • C08G18/625Polymers of alpha-beta ethylenically unsaturated carboxylic acids; hydrolyzed polymers of esters of these acids
    • C08G18/6254Polymers of alpha-beta ethylenically unsaturated carboxylic acids and of esters of these acids containing hydroxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G18/00Polymeric products of isocyanates or isothiocyanates
    • C08G18/06Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen
    • C08G18/70Polymeric products of isocyanates or isothiocyanates with compounds having active hydrogen characterised by the isocyanates or isothiocyanates used
    • C08G18/72Polyisocyanates or polyisothiocyanates
    • C08G18/80Masked polyisocyanates
    • C08G18/8003Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen
    • C08G18/8006Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32
    • C08G18/8009Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203
    • C08G18/8022Masked polyisocyanates masked with compounds having at least two groups containing active hydrogen with compounds of C08G18/32 with compounds of C08G18/3203 with polyols having at least three hydroxy groups
    • C08G18/8029Masked aromatic polyisocyanates
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/0025Crosslinking or vulcanising agents; including accelerators
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/0008Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
    • C08K5/005Stabilisers against oxidation, heat, light, ozone
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3472Five-membered rings
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/16Nitrogen-containing compounds
    • C08K5/34Heterocyclic compounds having nitrogen in the ring
    • C08K5/3467Heterocyclic compounds having nitrogen in the ring having more than two nitrogen atoms in the ring
    • C08K5/3477Six-membered rings
    • C08K5/3495Six-membered rings condensed with carbocyclic rings
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04Polyurethanes
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00Adhesives in the form of films or foils
    • C09J7/30Adhesives in the form of films or foils characterised by the adhesive composition
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/318Applications of adhesives in processes or use of adhesives in the form of films or foils for the production of liquid crystal displays
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/10Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
    • C09J2301/12Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
    • C09J2301/124Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/30Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier
    • C09J2301/312Additional features of adhesives in the form of films or foils characterized by the chemical, physicochemical or physical properties of the adhesive or the carrier parameters being the characterizing feature
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00Additional features of adhesives in the form of films or foils
    • C09J2301/40Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

금속 부재와 접촉해 사용되는 점착제를 구성하기 위한 점착성 조성물로서, 중합체를 구성하는 모노머 단위로서 수산기를 갖는 모노머를 15질량% 초과 30질량% 이하 함유하고, 카르복실기를 갖는 모노머를 함유하지 않는 (메트)아크릴산에스테르 중합체(A)와, 벤조트리아졸계 방청제(B)를 함유하는 점착성 조성물. 이러한 점착성 조성물에 의하면, 접촉하는 금속 부재의 부식을 억제할 수 있고, 또한 내습열 백화성도 우수하다.A pressure-sensitive adhesive composition for constituting a pressure-sensitive adhesive used in contact with a metal member, containing more than 15% by mass and 30% by mass or less of a monomer having a hydroxyl group as a monomer unit constituting a polymer, and not containing a monomer having a carboxyl group (meth) A pressure-sensitive adhesive composition comprising an acrylic acid ester polymer (A) and a benzotriazole-based rust inhibitor (B). According to such an adhesive composition, corrosion of the metal member in contact can be suppressed and it is excellent also in moist-heat-resistance whitening property.

Description

점착성 조성물, 점착제 및 점착 시트{ADHESIVE COMPOSITION, ADHESIVE AGENT, AND ADHESIVE SHEET}An adhesive composition, an adhesive, and an adhesive sheet {ADHESIVE COMPOSITION, ADHESIVE AGENT, AND ADHESIVE SHEET}

본 발명은, 금속 부재, 특히 터치 패널의 금속 메시 등과 접촉해 사용되는 점착제 및 점착 시트, 그리고 당해 점착제를 구성하기 위한 점착성 조성물에 관한 것이다.The present invention relates to a pressure-sensitive adhesive and a pressure-sensitive adhesive sheet used in contact with a metal member, particularly a metal mesh of a touch panel, and a pressure-sensitive adhesive composition for constituting the pressure-sensitive adhesive.

최근의 스마트 폰이나 타블렛 단말 등의 각종 모바일 전자 기기에서는, 디스플레이로서 터치 패널이 사용되는 일이 많아지고 있다. 터치 패널의 방식으로서는, 저항막 방식, 정전 용량 방식 등이 있지만, 상기와 같은 모바일 전자 기기에서는 정전 용량 방식이 주로 채용되고 있다.DESCRIPTION OF RELATED ART In various mobile electronic devices, such as a smart phone and a tablet terminal in recent years, a touch panel is used more often as a display. As a touch panel method, there are a resistive film method, a capacitive method, and the like, but in the above mobile electronic devices, the capacitive method is mainly employed.

스마트 폰 등의 소형 터치 패널에 사용되고 있는 전극의 상당수는, 주석 도프 산화인듐(ITO)으로 이루어지는 투명 도전막으로 구성된다. 그러나, ITO는 저항값을 10Ω/□ 이하로 낮추는 것이 곤란하기 때문에, 대형 전극 패턴에 ITO를 사용하면 신호의 열화가 발생하고, 따라서 터치 패널을 대형화하는 것은 곤란했다. Many of the electrodes used for small touch panels, such as a smart phone, are comprised with the transparent conductive film which consists of tin-doped indium oxide (ITO). However, since it is difficult for ITO to lower|hang a resistance value to 10 ohms/square or less, when ITO is used for a large-sized electrode pattern, signal deterioration generate|occur|produces, Therefore, it was difficult to enlarge a touch panel.

그래서, 저항값을 10Ω/□ 이하로 낮출 수 있는 구리가 터치 패널의 전극 재료로서 주목을 모아 구리 전극이 여러 가지 검토되고 있다. 그러나, 구리는 ITO와 비교해 부식되기 쉽기 때문에, ITO 전극에 사용되고 있는 점착제를 그대로 구리 전극에 사용하면, 구리 전극이 부식되어 버린다. 따라서, 구리 전극이 부식되지 않는 점착제가 요구된다.Then, copper which can lower a resistance value to 10 ohms/square or less attracts attention as an electrode material of a touch panel, and various copper electrodes are examined. However, since copper is easy to corrode compared with ITO, when the adhesive used for an ITO electrode is used for a copper electrode as it is, a copper electrode will corrode. Therefore, there is a need for a pressure-sensitive adhesive that does not corrode the copper electrode.

그런데, 터치 패널은, 고온 고습 조건에 놓이는 경우가 있고, 그러한 조건을 거쳐도 문제없이 사용할 수 있는 내구성을 가질 필요가 있다. 그러나, 종래의 터치 패널에 있어서는, 고온 고습 조건 후에 상온 상습으로 되돌렸을 때에, 점착제층이 백화(습열 백화)한다는 문제가 발생하기 쉽다.By the way, the touch panel may be subjected to high temperature, high humidity conditions, and it is necessary to have durability that can be used without any problem even through such conditions. However, in the conventional touchscreen, when returning to normal temperature and humidity after high-temperature, high-humidity conditions, the problem that an adhesive layer whitens (wet-heat whitening) tends to generate|occur|produce.

특허문헌 1에는, 전자파 차폐 필름에 첩부(貼付)되는 점착제로서, 근적외선 흡수 작용을 부여하기 위해서 근적외선 흡수 색소를 첨가함과 함께, 그 근적외선 흡수 색소의 열화를 방지하기 위해서 벤조트리아졸 화합물을 첨가한 점착제가 개시되어 있다.In Patent Document 1, as an adhesive to be affixed to the electromagnetic wave shielding film, a near-infrared absorbing dye is added to impart a near-infrared absorbing action, and a benzotriazole compound is added to prevent deterioration of the near-infrared absorbing dye. A pressure-sensitive adhesive is disclosed.

일본 특허 제4818236호Japanese Patent No. 4818236

그러나, 특허문헌 1의 점착제는, 플라즈마 디스플레이 패널의 광학 필터용의 것이고, 이 점착제를 용도가 상이한 터치 패널에 적용할 수는 없다. 예를 들어, 당해 점착제를 터치 패널에 적용하면, 전술한 습열 백화의 문제가 발생한다.However, the adhesive of patent document 1 is for optical filters of a plasma display panel, and this adhesive cannot be applied to the touch panel from which a use differs. For example, when the said adhesive is applied to a touchscreen, the problem of the wet-heat whitening mentioned above will arise.

본 발명은, 상기와 같은 실상을 감안하여 이루어진 것으로, 접촉하는 금속 부재의 부식을 억제할 수 있고, 또한 내습열 백화성도 우수한 점착성 조성물, 점착제 및 점착 시트를 제공하는 것을 목적으로 한다.The present invention has been made in view of the actual conditions described above, and an object of the present invention is to provide a pressure-sensitive adhesive composition, pressure-sensitive adhesive, and pressure-sensitive adhesive sheet that can suppress corrosion of a contacting metal member and are also excellent in heat-and-moisture whitening resistance.

상기 목적을 달성하기 위해서, 제1로 본 발명은, 금속 부재와 접촉해 사용되는 점착제를 구성하기 위한 점착성 조성물로서, 중합체를 구성하는 모노머 단위로서 수산기를 갖는 모노머를 15질량% 초과 30질량% 이하 함유하고, 카르복실기를 갖는 모노머를 함유하지 않는 (메트)아크릴산에스테르 중합체(A)와, 벤조트리아졸계 방청제(B)를 함유하는 것을 특징으로 하는 점착성 조성물을 제공한다(발명 1).In order to achieve the above object, firstly, the present invention is a pressure-sensitive adhesive composition for constituting a pressure-sensitive adhesive used in contact with a metal member, wherein the amount of a monomer having a hydroxyl group as a monomer unit constituting the polymer is more than 15% by mass and not more than 30% by mass. A (meth)acrylic acid ester polymer (A) that contains and does not contain a monomer having a carboxyl group, and a benzotriazole-based rust preventive agent (B) are provided (Invention 1).

상기 발명(발명 1)에 관련된 점착성 조성물에 있어서의 (메트)아크릴산에스테르 중합체(A)가, 당해 중합체를 구성하는 모노머 단위로서 수산기 함유 모노머를 상기 양으로 함유함으로써, 얻어지는 점착제는 내습열 백화성이 우수한 것이 된다. 한편, 상기와 같이 수산기 등의 친수성기가 소정량 점착제 중에 존재하면, 점착제는 물을 흡수하기 쉬워지고, 당해 점착제에 접촉하는 금속 부재를 부식시키기 쉬워진다. 그러나, 상기 발명(발명 1)에 관련된 점착성 조성물은, 벤조트리아졸계 방청제(B)를 함유함으로써, 접촉하는 금속 부재가 부식되는 것을 억제할 수 있다. 또, 상기 점착성 조성물(발명 1)에 있어서의 (메트)아크릴산에스테르 중합체(A)는, 카르복실기 함유 모노머를 함유하지 않기 때문에, 카르복실기(산)에 의한 금속 부재의 부식도 방지할 수 있다.When the (meth)acrylic acid ester polymer (A) in the pressure-sensitive adhesive composition according to the invention (invention 1) contains a hydroxyl group-containing monomer in the above amount as a monomer unit constituting the polymer, the pressure-sensitive adhesive obtained has heat-and-moisture whitening resistance. it becomes excellent On the other hand, when hydrophilic groups, such as a hydroxyl group, exist in a predetermined amount of an adhesive as mentioned above, an adhesive will become easy to absorb water, and it will become easy to corrode the metal member which contacts the said adhesive. However, the adhesive composition which concerns on the said invention (invention 1) can suppress corrosion of the metal member contacting by containing a benzotriazole-type rust preventive agent (B). Moreover, since the (meth)acrylic acid ester polymer (A) in the said adhesive composition (invention 1) does not contain a carboxyl group containing monomer, corrosion of the metal member by a carboxyl group (acid) can also be prevented.

상기 발명(발명 1)에 있어서는, 상기 벤조트리아졸계 방청제(B)로서 1H-벤조트리아졸, 1H-톨릴트리아졸, 1-[N,N-비스(2-에틸헥실)아미노메틸]벤조트리아졸 및 1-[N,N-비스(2-에틸헥실)아미노메틸]메틸벤조트리아졸로 이루어지는 군에서 선택되는 적어도 1종을 함유하는 것이 바람직하다(발명 2).In the invention (invention 1), 1H-benzotriazole, 1H-tolyltriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole as the benzotriazole-based rust inhibitor (B) And it is preferable to contain at least 1 sort(s) selected from the group which consists of 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole (Invention 2).

상기 발명(발명 1, 2)에 있어서, 상기 (메트)아크릴산에스테르 중합체(A)는, 당해 중합체를 구성하는 모노머 단위로서 호모폴리머로서의 유리 전이 온도가 70℃ 이상인 하드 모노머를 함유하는 것이 바람직하다(발명 3).In the above inventions (Inventions 1 and 2), the (meth)acrylic acid ester polymer (A) preferably contains a hard monomer having a glass transition temperature of 70° C. or higher as a homopolymer as a monomer unit constituting the polymer ( Invention 3).

상기 발명(발명 1∼3)에 있어서, 상기 (메트)아크릴산에스테르 중합체(A)는, 당해 중합체를 구성하는 모노머 단위로서 (메트)아크릴산 2-에틸헥실을 함유하는 것이 바람직하다(발명 4). In the said inventions (Inventions 1-3), it is preferable that the said (meth)acrylic acid ester polymer (A) contains 2-ethylhexyl (meth)acrylic acid as a monomer unit which comprises the said polymer (Invention 4).

상기 발명(발명 1∼4)에 있어서, 상기 점착성 조성물은, 추가로 가교제(C)를 함유하는 것이 바람직하다(발명 5).In the said invention (invention 1-4), it is preferable that the said adhesive composition further contains a crosslinking agent (C) (invention 5).

제2로 본 발명은, 상기 점착성 조성물(발명 1∼5)을 가교시켜 이루어지는 점착제를 제공한다(발명 6).Second, the present invention provides a pressure-sensitive adhesive obtained by crosslinking the pressure-sensitive adhesive composition (Inventions 1 to 5) (Invention 6).

상기 발명(발명 6)에 있어서는, 1.0㎒에 있어서의 유전율이 2.0∼8.0인 것이 바람직하다(발명 7).In the said invention (invention 6), it is preferable that the dielectric constant in 1.0 MHz is 2.0-8.0 (invention 7).

제3으로 본 발명은, 2장의 박리 시트와, 상기 2장의 박리 시트의 박리면과 접하도록 상기 박리 시트에 협지된 점착제층을 구비하고, 상기 점착제층이 상기 점착제(발명 6, 7)로 이루어지는 것을 특징으로 하는 점착 시트를 제공한다(발명 8).Thirdly, the present invention includes two release sheets and a pressure-sensitive adhesive layer sandwiched between the release sheets so as to be in contact with the release surfaces of the two release sheets, wherein the pressure-sensitive adhesive layer is made of the pressure-sensitive adhesive (Inventions 6 and 7) It provides an adhesive sheet, characterized in that (Invention 8).

상기 발명(발명 8)에 있어서, 상기 점착제층은, 터치 패널에 있어서 금속 메시와 접촉하도록 배치되는 것이 바람직하다(발명 9).In the said invention (invention 8), it is preferable that the said adhesive layer is arrange|positioned so that it may contact with the metal mesh in a touch panel (invention 9).

본 발명에 관련된 점착성 조성물, 점착제 및 점착 시트에 의하면, 접촉하는 금속 부재의 부식을 억제할 수 있고, 또한 내습열 백화성도 우수하다.ADVANTAGE OF THE INVENTION According to the adhesive composition which concerns on this invention, an adhesive, and an adhesive sheet, corrosion of the metal member which contacts can be suppressed and it is excellent also in moist-heat resistance whitening property.

도 1은 본 발명의 일실시형태에 관련된 점착 시트의 단면도이다.
도 2는 터치 패널의 일구성예를 나타내는 단면도이다.
BRIEF DESCRIPTION OF THE DRAWINGS It is sectional drawing of the adhesive sheet which concerns on one Embodiment of this invention.
2 is a cross-sectional view showing an example of the configuration of a touch panel.

이하, 본 발명의 실시형태에 대해 설명한다.EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described.

〔점착성 조성물〕[Adhesive composition]

본 실시형태에 관련된 점착성 조성물(이하 「점착성 조성물P」라고 한다)은, 금속 부재와 접촉해 사용되는 점착제를 구성하기 위한 점착성 조성물이다. 금속 부재로서는, 바람직하게는 정전 용량 방식의 터치 패널에 있어서의 전극으로서의 구리 메시가 예시되지만, 이것에 한정되는 것은 아니다.The adhesive composition (henceforth "adhesive composition P") which concerns on this embodiment is an adhesive composition for comprising the adhesive used in contact with a metal member. As a metal member, Preferably, although the copper mesh as an electrode in a capacitive touch panel is illustrated, it is not limited to this.

점착성 조성물P는, 중합체를 구성하는 모노머 단위로서 수산기를 갖는 모노머(수산기 함유 모노머)를 15질량% 초과 30질량% 이하 함유하고, 카르복실기를 갖는 모노머(카르복실기 함유 모노머)를 함유하지 않는 (메트)아크릴산에스테르 중합체(A)와, 벤조트리아졸계 방청제(B)를 함유하고, 바람직하게는 추가로 가교제(C)를 함유한다. 또한, 본 명세서에 있어서, (메트)아크릴산에스테르란, 아크릴산에스테르 및 메타크릴산에스테르 양방을 의미한다. 다른 유사 용어도 동일하다. 또, 「중합체」에는 「공중합체」의 개념도 포함되는 것으로 한다. The adhesive composition P contains more than 15 mass % and 30 mass % or less of a monomer having a hydroxyl group (hydroxyl group-containing monomer) as a monomer unit constituting the polymer, and (meth)acrylic acid which does not contain a monomer having a carboxyl group (carboxyl group-containing monomer) The ester polymer (A) and the benzotriazole-based rust preventive agent (B) are contained, and preferably a crosslinking agent (C) is further contained. In addition, in this specification, (meth)acrylic acid ester means both an acrylic acid ester and a methacrylic acid ester. Other similar terms are the same. In addition, the concept of "copolymer" shall also be included in "polymer".

상기 점착성 조성물P에 있어서의 (메트)아크릴산에스테르 중합체(A)가, 당해 중합체를 구성하는 모노머 단위로서 수산기 함유 모노머를 상기 양으로 함유함으로써, 얻어지는 점착제는, 고온 고습 조건(예를 들어, 85℃, 85%RH의 조건하에서 240시간)을 실시한 후, 상온 상습으로 되돌렸을 때의 백화가 억제되고, 즉 내습열 백화성이 우수한 것이 된다. (메트)아크릴산에스테르 중합체(A)가 모노머 단위로서 상기 양으로 수산기 함유 모노머를 함유하면, 얻어지는 점착제 중에 소정량의 수산기가 잔존하게 된다. 수산기는 친수성기이고, 그러한 친수성기가 소정량 점착제 중에 존재하면, 점착제가 고온 고습 조건하에 놓인 경우라도, 그 고온 고습 조건하에서 점착제에 침입한 수분과의 상용성이 양호하고, 그 결과 점착제의 백화가 억제되게 된다.When the (meth)acrylic acid ester polymer (A) in the pressure-sensitive adhesive composition P contains a hydroxyl group-containing monomer in the above amount as a monomer unit constituting the polymer, the pressure-sensitive adhesive obtained under high-temperature, high-humidity conditions (eg, 85°C) , 240 hours) under the conditions of 85%RH, whitening at the time of returning to normal temperature and normal humidity is suppressed, ie, it becomes the thing excellent in moist-heat-resistance whitening property. When (meth)acrylic acid ester polymer (A) contains a hydroxyl-containing monomer in the said quantity as a monomer unit, a predetermined amount of hydroxyl groups will remain in the adhesive obtained. The hydroxyl group is a hydrophilic group, and when such a hydrophilic group is present in a predetermined amount of the pressure-sensitive adhesive, even when the pressure-sensitive adhesive is placed under high-temperature, high-humidity conditions, compatibility with moisture that has penetrated into the pressure-sensitive adhesive under the high-temperature, high-humidity conditions is good, and as a result, whitening of the pressure-sensitive adhesive is suppressed will become

단, 상기와 같이 친수성기가 소정량 점착제 중에 존재하면, 점착제는 물을 흡수하기 쉬워지고, 당해 점착제에 접촉하는 금속 부재를 부식시키기 쉬워진다. 그러나, 본 실시형태에 관련된 점착성 조성물P는, 벤조트리아졸계 방청제(B)를 함유함으로써, 접촉하는 금속 부재가 부식되는 것을 억제할 수 있다.However, when a hydrophilic group exists in a predetermined amount of an adhesive as mentioned above, an adhesive will become easy to absorb water, and it will become easy to corrode the metal member which contacts the said adhesive. However, by containing the benzotriazole-type rust preventive agent (B), the adhesive composition P which concerns on this embodiment can suppress that the metal member in contact is corroded.

또한, 벤조트리아졸계 방청제(B)의 존재에 의해, 후술하는 가교제(C)와 (메트)아크릴산에스테르 중합체(A)의 반응성이 저하하는 경향이 있지만, (메트)아크릴산에스테르 중합체(A)가 모노머 단위로서 상기 양으로 수산기 함유 모노머를 함유하면, 가교제(C)와 (메트)아크릴산에스테르 중합체(A)의 반응이 양호하게 진행된다.In addition, although the reactivity of the crosslinking agent (C) and (meth)acrylic acid ester polymer (A) mentioned later tends to fall by the presence of a benzotriazole-type rust preventive agent (B), (meth)acrylic acid ester polymer (A) is a monomer When the hydroxyl group-containing monomer is contained in the above amount as a unit, the reaction between the crosslinking agent (C) and the (meth)acrylic acid ester polymer (A) proceeds favorably.

한편, 상기 점착성 조성물P에 있어서의 (메트)아크릴산에스테르 중합체(A)는, 카르복실기 함유 모노머를 함유하지 않기 때문에, 카르복실기(산)에 의한 금속 부재의 부식도 방지할 수 있다.On the other hand, since the (meth)acrylic acid ester polymer (A) in the said adhesive composition P does not contain a carboxyl group containing monomer, corrosion of the metal member by a carboxyl group (acid) can also be prevented.

(1) (메트)아크릴산에스테르 중합체(A)(1) (meth)acrylic acid ester polymer (A)

(메트)아크릴산에스테르 중합체(A)가, 당해 중합체를 구성하는 모노머 단위로서 함유하는 수산기 함유 모노머로서는, 예를 들어 (메트)아크릴산 2-하이드록시에틸, (메트)아크릴산 2-하이드록시프로필, (메트)아크릴산 3-하이드록시프로필, (메트)아크릴산 2-하이드록시부틸, (메트)아크릴산 3-하이드록시부틸, (메트)아크릴산 4-하이드록시부틸 등의 (메트)아크릴산하이드록시알킬에스테르 등을 들 수 있다. 그 중에서도, 얻어지는 (메트)아크릴산에스테르 중합체(A)에 있어서의 수산기의 가교제(C)와의 반응성 및 다른 단량체와의 공중합성의 점에서 (메트)아크릴산 2-하이드록시에틸이 바람직하다. 이들은 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다.As a hydroxyl-containing monomer which (meth)acrylic acid ester polymer (A) contains as a monomer unit which comprises the said polymer, for example, (meth)acrylic acid 2-hydroxyethyl, (meth)acrylic acid 2-hydroxypropyl, ( (meth)acrylic acid hydroxyalkyl esters such as 3-hydroxypropyl (meth)acrylic acid, 2-hydroxybutyl (meth)acrylic acid, 3-hydroxybutyl (meth)acrylic acid, and 4-hydroxybutyl (meth)acrylic acid can be heard Among these, 2-hydroxyethyl (meth)acrylic acid is preferable from the point of reactivity of the hydroxyl group with the crosslinking agent (C) in the obtained (meth)acrylic acid ester polymer (A), and copolymerizability with another monomer. These may be used independently and may be used in combination of 2 or more type.

전술한 바와 같이, (메트)아크릴산에스테르 중합체(A)는, 당해 중합체를 구성하는 모노머 단위로서 수산기 함유 모노머를 15질량% 초과 30질량% 이하 함유한다. (메트)아크릴산에스테르 중합체(A)에 있어서의 모노머 단위로서의 수산기 함유 모노머의 함유량이 15질량% 이하이면, 점착제층이 내습열 백화성이 열등한 것이 된다. 한편, 수산기 함유 모노머의 함유량이 30질량%를 초과하면, 벤조트리아졸계 방청제(B)를 함유했다고 해도, 점착제에 흡수되는 수분량이 지나치게 많아져, 금속 부재를 부식시키기 쉬워진다. As mentioned above, the (meth)acrylic acid ester polymer (A) contains more than 15 mass % and 30 mass % or less of a hydroxyl-containing monomer as a monomer unit which comprises the said polymer. When content of the hydroxyl-containing monomer as a monomer unit in a (meth)acrylic acid ester polymer (A) is 15 mass % or less, an adhesive layer will be inferior to moist-and-heat whitening resistance. On the other hand, when content of a hydroxyl-containing monomer exceeds 30 mass %, even if it contains a benzotriazole-type rust preventive agent (B), the moisture content absorbed by an adhesive will increase too much, and it will become easy to corrode a metal member.

이러한 관점에서, (메트)아크릴산에스테르 중합체(A)는, 당해 중합체를 구성하는 모노머 단위로서 수산기 함유 모노머를 16∼25질량% 함유하는 것이 바람직하고, 특히 18∼20질량% 함유하는 것이 바람직하다. From such a viewpoint, it is preferable that the (meth)acrylic acid ester polymer (A) contains 16-25 mass % of a hydroxyl-containing monomer as a monomer unit which comprises the said polymer, and it is especially preferable to contain 18-20 mass %.

(메트)아크릴산에스테르 중합체(A)는, 당해 중합체를 구성하는 모노머 단위로서 카르복실기 함유 모노머를 함유하지 않는다. 여기서, 「카르복실기를 갖는 모노머를 함유하지 않는다」란, 카르복실기를 갖는 모노머를 실질적으로 함유하지 않는 것을 의미하고, 카르복실기 함유 모노머를 전혀 함유하지 않는 것 외에, 카르복실기에 의한 금속 부재의 부식이 생기지 않을 정도로 카르복실기 함유 모노머를 함유하는 것을 허용하는 것이다. 구체적으로는, (메트)아크릴산에스테르 중합체(A) 중에, 모노머 단위로서 카르복실기 함유 모노머를 0.1질량% 이하, 바람직하게는 0.01질량% 이하의 양으로 함유하는 것을 허용하는 것이다. The (meth)acrylic acid ester polymer (A) does not contain a carboxyl group-containing monomer as a monomer unit constituting the polymer. Here, "does not contain a monomer having a carboxyl group" means substantially not containing a monomer having a carboxyl group, and in addition to not containing a carboxyl group-containing monomer at all, corrosion of the metal member by a carboxyl group does not occur. It is allowed to contain a carboxyl group-containing monomer. Specifically, in the (meth)acrylic acid ester polymer (A), 0.1 mass% or less of a carboxyl group-containing monomer as a monomer unit is allowed to be contained in an amount of preferably 0.01 mass% or less.

(메트)아크릴산에스테르 중합체(A)는, 당해 중합체를 구성하는 모노머 단위로서 알킬기의 탄소수가 1∼20인 (메트)아크릴산알킬에스테르를 함유하는 것이 바람직하다. 이것에 의해, 얻어지는 점착제는, 바람직한 점착성을 발현할 수 있다. 또한, 당해 (메트)아크릴산알킬에스테르로부터 후술하는 하드 모노머는 제외된다.The (meth)acrylic acid ester polymer (A) preferably contains (meth)acrylic acid alkylester having 1 to 20 carbon atoms in the alkyl group as a monomer unit constituting the polymer. Thereby, the adhesive obtained can express preferable adhesiveness. In addition, the hard monomer mentioned later is excluded from the said (meth)acrylic-acid alkylester.

알킬기의 탄소수가 1∼20인 (메트)아크릴산알킬에스테르로서는, 예를 들어 아크릴산메틸, (메트)아크릴산에틸, (메트)아크릴산프로필, (메트)아크릴산 n-부틸, (메트)아크릴산 n-펜틸, (메트)아크릴산 n-헥실, (메트)아크릴산 2-에틸헥실, (메트)아크릴산이소옥틸, (메트)아크릴산 n-데실, (메트)아크릴산 n-도데실, (메트)아크릴산미리스틸, (메트)아크릴산팔미틸, (메트)아크릴산스테아릴 등을 들 수 있다. 그 중에서도, 점착성을 보다 향상시키는 관점에서, 알킬기의 탄소수가 1∼8인 (메트)아크릴산에스테르가 바람직하고, (메트)아크릴산 n-부틸 및 (메트)아크릴산 2-에틸헥실이 특히 바람직하며, (메트)아크릴산 2-에틸헥실이 더 바람직하다. (메트)아크릴산 2-에틸헥실에 의하면, 얻어지는 점착제의 유전율을 낮게 해, 터치 패널의 오작동을 억제할 수 있다. 또한, 이들은 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다.Examples of the (meth)acrylic acid alkyl ester having 1 to 20 carbon atoms in the alkyl group include methyl acrylate, (meth)ethyl acrylate, (meth)acrylic acid propyl, (meth)acrylate n-butyl, (meth)acrylic acid n-pentyl, (meth)acrylic acid n-hexyl, (meth)acrylic acid 2-ethylhexyl, (meth)acrylic acid isooctyl, (meth)acrylic acid n-decyl, (meth)acrylic acid n-dodecyl, (meth)acrylic acid myristyl, (meth)acrylic acid ) palmityl acrylate, stearyl (meth)acrylate, and the like. Among them, (meth)acrylic acid ester having 1 to 8 carbon atoms in the alkyl group is preferable from the viewpoint of further improving the adhesiveness, and n-butyl (meth)acrylate and 2-ethylhexyl (meth)acrylate are particularly preferable, ( More preferred is 2-ethylhexyl meth)acrylic acid. According to 2-ethylhexyl (meth)acrylic acid, the dielectric constant of the adhesive obtained can be made low, and the malfunction of a touchscreen can be suppressed. In addition, these may be used independently and may be used in combination of 2 or more type.

(메트)아크릴산에스테르 중합체(A)는, 당해 중합체를 구성하는 모노머 단위로서 알킬기의 탄소수가 1∼20인 (메트)아크릴산알킬에스테르를 30∼85질량% 함유하는 것이 바람직하고, 특히 40∼75질량% 함유하는 것이 바람직하며, 나아가서는 50∼65질량% 함유하는 것이 바람직하다.It is preferable that the (meth)acrylic acid ester polymer (A) contains 30-85 mass % of C1-C20 (meth)acrylic acid alkylester of an alkyl group as a monomer unit which comprises the said polymer, especially 40-75 mass It is preferable to contain %, Furthermore, it is preferable to contain 50-65 mass %.

또, (메트)아크릴산에스테르 중합체(A)는, 당해 중합체를 구성하는 모노머 단위로서 호모폴리머로서의 유리 전이 온도(Tg)가 70℃ 이상인 하드 모노머를 함유하는 것이 바람직하다. (메트)아크릴산에스테르 중합체(A)를 구성하는 모노머 단위로서 상기 하드 모노머를 함유시킴으로써, 얻어지는 점착제는, 응집력이 향상해, 내구성이 우수한 것이 된다. 특히, (메트)아크릴산에스테르 중합체(A)를 구성하는 모노머 단위로서 (메트)아크릴산 2-에틸헥실을 사용하는 경우에는, 응집력이 낮아지는 경향이 있기 때문에, 상기 하드 모노머를 사용하는 것이 바람직하다. 상기 하드 모노머의 호모폴리머로서의 유리 전이 온도(Tg)는, 75∼200℃인 것이 바람직하고, 특히 80∼180℃인 것이 바람직하다. Moreover, it is preferable that the glass transition temperature (Tg) as a homopolymer contains the hard monomer 70 degreeC or more of (meth)acrylic acid ester polymer (A) as a monomer unit which comprises the said polymer. By containing the said hard monomer as a monomer unit which comprises a (meth)acrylic acid ester polymer (A), the adhesive obtained improves cohesive force and becomes a thing excellent in durability. In particular, when 2-ethylhexyl (meth)acrylic acid is used as the monomer unit constituting the (meth)acrylic acid ester polymer (A), the cohesive force tends to decrease, so it is preferable to use the hard monomer. It is preferable that it is 75-200 degreeC, and, as for the glass transition temperature (Tg) of the homopolymer of the said hard monomer, it is especially preferable that it is 80-180 degreeC.

상기 하드 모노머로서는, 예를 들어 메타크릴산메틸(Tg 105℃), 아크릴산이소보르닐(Tg 94℃), 메타크릴산이소보르닐(Tg 180℃), 아크릴로일모르폴린(Tg 145℃), 아크릴산아다만틸(Tg 115℃), 메타크릴산아다만틸(Tg 141℃), 디메틸아크릴아미드(Tg 89℃), 아크릴아미드(Tg 165℃) 등을 들 수 있다. 이들은 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다. Examples of the hard monomer include methyl methacrylate (Tg 105° C.), isobornyl acrylate (Tg 94° C.), isobornyl methacrylate (Tg 180° C.), and acryloylmorpholine (Tg 145° C.) , adamantyl acrylate (Tg 115°C), adamantyl methacrylate (Tg 141°C), dimethyl acrylamide (Tg 89°C), and acrylamide (Tg 165°C). These may be used independently and may be used in combination of 2 or more type.

상기 하드 모노머 중에서도, 점착성이나 투명성 등 다른 특성에 대한 악영향을 방지하면서 하드 모노머의 성능을 보다 발휘시키는 관점에서, 메타크릴산메틸, 아크릴산이소보르닐 및 아크릴로일모르폴린이 보다 바람직하고, 메타크릴산메틸이 특히 바람직하다.Among the hard monomers, methyl methacrylate, isobornyl acrylate, and acryloylmorpholine are more preferable from the viewpoint of more exhibiting the performance of the hard monomer while preventing adverse effects on other properties such as tackiness and transparency, and methacrylic acid Methyl acid is particularly preferred.

(메트)아크릴산에스테르 중합체(A)는, 당해 중합체를 구성하는 모노머 단위로서 상기 하드 모노머를 10∼45질량% 함유하는 것이 바람직하고, 15∼30질량% 함유하는 것이 특히 바람직하다. 상기 하드 모노머를 10질량% 이상 함유함으로써, 당해 모노머 단위에 의한 내구성의 개선 효과를 기대할 수 있다. 한편, 상기 하드 모노머를 45질량% 이하의 함유량으로 함으로써, (메트)아크릴산에스테르 중합체(A) 중에 있어서의 그 이외의 모노머 단위의 상대적인 부족을 방지해, 얻어지는 점착제의 점착성 및 내습열 백화성을 우수한 것으로 할 수 있다.It is preferable to contain 10-45 mass % of the said hard monomer as a monomer unit which comprises the said polymer, and, as for (meth)acrylic acid ester polymer (A), it is especially preferable to contain 15-30 mass %. By containing the said hard monomer 10 mass % or more, the improvement effect of the durability by the said monomer unit is expectable. On the other hand, by making the said hard monomer into content of 45 mass % or less, the relative shortage of the monomer unit other than that in the (meth)acrylic acid ester polymer (A) is prevented, and it is excellent in the adhesiveness of the adhesive obtained and heat-and-moisture whitening resistance. can be done as

(메트)아크릴산에스테르 중합체(A)는, 원하는 바에 따라, 당해 중합체를 구성하는 모노머 단위로서 다른 모노머를 함유해도 된다. 다른 모노머로서는, 수산기 함유 모노머의 작용을 방해하지 않기 위해서도, 반응성을 갖는 관능기를 포함하지 않는 모노머가 바람직하다. 이러한 다른 모노머로서는, 예를 들어 (메트)아크릴산메톡시에틸, (메트)아크릴산에톡시에틸 등의 (메트)아크릴산알콕시알킬에스테르, (메트)아크릴산시클로헥실 등의 지방족환을 갖는 (메트)아크릴산에스테르, (메트)아크릴산 N,N-디메틸아미노에틸, (메트)아크릴산 N,N-디메틸아미노프로필 등의 비가교성의 3급 아미노기를 갖는 (메트)아크릴산에스테르, 아세트산비닐, 스티렌 등을 들 수 있다. 이들은 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다. The (meth)acrylic acid ester polymer (A) may contain another monomer as a monomer unit constituting the polymer as desired. As another monomer, also in order not to interfere with the action of a hydroxyl-containing monomer, the monomer which does not contain the functional group which has reactivity is preferable. Examples of such other monomers include (meth)acrylic acid alkoxyalkyl esters such as (meth)acrylic acid methoxyethyl and (meth)acrylic acid ethoxyethyl, and (meth)acrylic acid esters having an aliphatic ring such as (meth)acrylic acid cyclohexyl. and (meth)acrylic acid esters having non-crosslinkable tertiary amino groups such as (meth)acrylic acid N,N-dimethylaminoethyl and (meth)acrylic acid N,N-dimethylaminopropyl, vinyl acetate, and styrene. These may be used independently and may be used in combination of 2 or more type.

(메트)아크릴산에스테르 중합체(A)의 중합 양태는, 랜덤 공중합체여도 되고, 블록 공중합체여도 된다.A random copolymer may be sufficient as the polymerization aspect of a (meth)acrylic acid ester polymer (A), and a block copolymer may be sufficient as it.

(메트)아크릴산에스테르 중합체(A)의 중량 평균 분자량은 30만∼100만이고, 40만∼90만인 것이 바람직하며, 특히 50만∼70만인 것이 바람직하다. 또한, 본 명세서에 있어서의 중량 평균 분자량은, 겔 퍼미에이션 크로마토그래피(GPC)법에 의해 측정한 폴리스티렌 환산의 값이다.The weight average molecular weights of the (meth)acrylic acid ester polymer (A) are 300,000 to 1,000,000, preferably 400,000 to 900,000, and particularly preferably 500,000 to 700,000. In addition, the weight average molecular weight in this specification is the value of polystyrene conversion measured by the gel permeation chromatography (GPC) method.

점착성 조성물P의 점착 주제인 (메트)아크릴산에스테르 중합체(A)의 중량 평균 분자량이 30만 이상임으로써, 얻어지는 점착제의 내구성이 향상되고, (메트)아크릴산에스테르 중합체(A)의 중량 평균 분자량이 100만 이하임으로써, 점착성 조성물P의 도공성이 양호해진다. When the weight average molecular weight of the (meth)acrylic acid ester polymer (A), which is the main adhesive of the pressure-sensitive adhesive composition P, is 300,000 or more, the durability of the obtained pressure-sensitive adhesive is improved, and the weight average molecular weight of the (meth)acrylic acid ester polymer (A) is 1 million By being below, the coatability of the adhesive composition P becomes favorable.

또한, 점착성 조성물P에 있어서, (메트)아크릴산에스테르 중합체(A)는, 1종을 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다.In addition, in the adhesive composition P, the (meth)acrylic acid ester polymer (A) may be used individually by 1 type, and may be used in combination of 2 or more type.

(2) 벤조트리아졸계 방청제(B) (2) Benzotriazole-based rust inhibitor (B)

벤조트리아졸계 방청제(B)로서는, 예를 들어 1H-벤조트리아졸, 1H-톨릴트리아졸, 1-[N,N-비스(2-에틸헥실)아미노메틸]벤조트리아졸, 1-[N,N-비스(2-에틸헥실)아미노메틸]메틸벤조트리아졸, 카르복시벤조트리아졸, 2,2'-[[(메틸-1H-벤조트리아졸-1-일)메틸]이미노]비스에탄올 등을 들 수 있다. 그 중에서도, 1H-벤조트리아졸, 1H-톨릴트리아졸, 1-[N,N-비스(2-에틸헥실)아미노메틸]벤조트리아졸 및 1-[N,N-비스(2-에틸헥실)아미노메틸]메틸벤조트리아졸이 바람직하다. 이들에 의하면, 접촉하는 금속 부재의 부식을 특히 효과적으로 억제할 수 있다. 상기 벤조트리아졸계 방청제(B)는, 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다. Examples of the benzotriazole-based rust inhibitor (B) include 1H-benzotriazole, 1H-tolyltriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole, 1-[N, N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole, carboxybenzotriazole, 2,2'-[[(methyl-1H-benzotriazol-1-yl)methyl]imino]bisethanol, etc. can be heard Among them, 1H-benzotriazole, 1H-tolyltriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole and 1-[N,N-bis(2-ethylhexyl) Aminomethyl]methylbenzotriazole is preferred. According to these, corrosion of the metal member in contact can be suppressed especially effectively. The said benzotriazole-type rust preventive agent (B) may be used independently and may be used in combination of 2 or more type.

점착성 조성물P 중에 있어서의 벤조트리아졸계 방청제(B)의 함유량은, (메트)아크릴산에스테르 중합체(A) 100질량부에 대해 0.01∼2.0질량부인 것이 바람직하고, 특히 0.05∼1.0질량부인 것이 바람직하며, 나아가서는 0.1∼0.5질량부인 것이 바람직하다. 벤조트리아졸계 방청제(B)의 함유량이 0.01질량부 이상임으로써, 금속 부재의 부식 억제 효과가 충분히 얻어진다. 또, 벤조트리아졸계 방청제(B)의 함유량이 2.0질량부 이하이면, 점착성에 악영향을 주지 않는다. The content of the benzotriazole-based rust preventive agent (B) in the pressure-sensitive adhesive composition P is preferably 0.01 to 2.0 parts by mass, particularly preferably 0.05 to 1.0 parts by mass, with respect to 100 parts by mass of the (meth)acrylic acid ester polymer (A), Furthermore, it is preferable that it is 0.1-0.5 mass part. When content of a benzotriazole-type rust preventive agent (B) is 0.01 mass part or more, the corrosion inhibitory effect of a metal member is fully acquired. Moreover, adhesiveness will not have a bad influence as content of a benzotriazole type rust preventive agent (B) is 2.0 mass parts or less.

(3) 가교제(C) (3) crosslinking agent (C)

점착성 조성물P는, 가교제(C)를 함유하는 것이 바람직하다. 점착성 조성물P는, 가교제(C)를 함유함으로써 (메트)아크릴산에스테르 공중합체(A)를 가교시켜 삼차원 망목 구조를 형성해, 얻어지는 점착제의 응집력을 향상시킨다.It is preferable that the adhesive composition P contains a crosslinking agent (C). The adhesive composition P crosslinks the (meth)acrylic acid ester copolymer (A) by containing a crosslinking agent (C), forms a three-dimensional network structure, and improves the cohesive force of the adhesive obtained.

가교제(C)로서는, (메트)아크릴산에스테르 공중합체(A)가 갖는 반응성기(모노머 단위인 수산기 함유 모노머의 수산기)와 반응하는 것이면 되고, 예를 들어 이소시아네이트계 가교제, 에폭시계 가교제, 아민계 가교제, 멜라민계 가교제, 아지리딘계 가교제, 하이드라진계 가교제, 알데하이드계 가교제, 옥사졸린계 가교제, 금속 알콕사이드계 가교제, 금속 킬레이트계 가교제, 금속염계 가교제, 암모늄염계 가교제 등을 들 수 있다. 상기 중에서도, (메트)아크릴산에스테르 중합체(A)가 갖는 수산기와의 반응성이 우수한 이소시아네이트계 가교제를 사용하는 것이 바람직하다. 또한, 가교제(C)는, 1종을 단독으로, 또는 2종 이상을 조합하여 사용할 수 있다.The crosslinking agent (C) may react with a reactive group (hydroxyl group of a hydroxyl group-containing monomer that is a monomer unit) of the (meth)acrylic acid ester copolymer (A), for example, an isocyanate crosslinking agent, an epoxy crosslinking agent, an amine crosslinking agent , a melamine-based crosslinking agent, an aziridine-based crosslinking agent, a hydrazine-based crosslinking agent, an aldehyde-based crosslinking agent, an oxazoline-based crosslinking agent, a metal alkoxide-based crosslinking agent, a metal chelate-based crosslinking agent, a metal salt-based crosslinking agent, and an ammonium salt-based crosslinking agent. Among the above, it is preferable to use the isocyanate type crosslinking agent excellent in the reactivity with the hydroxyl group which the (meth)acrylic acid ester polymer (A) has. In addition, a crosslinking agent (C) can be used individually by 1 type or in combination of 2 or more type.

이소시아네이트계 가교제는, 적어도 폴리이소시아네이트 화합물을 포함하는 것이다. 폴리이소시아네이트 화합물로서는, 예를 들어 톨릴렌디이소시아네이트, 디페닐메탄디이소시아네이트, 자일릴렌디이소시아네이트 등의 방향족 폴리이소시아네이트, 헥사메틸렌디이소시아네이트 등의 지방족 폴리이소시아네이트, 이소포론디이소시아네이트, 수소 첨가 디페닐메탄디이소시아네이트 등의 지환식 폴리이소시아네이트 등, 및 그들의 뷰렛체, 이소시아누레이트체, 나아가서는 에틸렌글리콜, 프로필렌글리콜, 네오펜틸글리콜, 트리메틸올프로판, 피마자유 등의 저분자 활성 수소 함유 화합물과의 반응물인 어덕트체 등을 들 수 있다. 그 중에서도 수산기와의 반응성의 관점에서, 트리메틸올프로판 변성의 방향족 폴리이소시아네이트, 특히 트리메틸올프로판 변성 톨릴렌디이소시아네이트가 바람직하다.An isocyanate type crosslinking agent contains a polyisocyanate compound at least. As a polyisocyanate compound, For example, aromatic polyisocyanate, such as tolylene diisocyanate, diphenylmethane diisocyanate, xylylene diisocyanate, aliphatic polyisocyanate, such as hexamethylene diisocyanate, isophorone diisocyanate, hydrogenated diphenylmethane diisocyanate Adducts which are reactants with low molecular weight active hydrogen-containing compounds such as alicyclic polyisocyanates such as alicyclic polyisocyanates, and their biuret forms, isocyanurate forms, and further, ethylene glycol, propylene glycol, neopentyl glycol, trimethylolpropane, and castor oil sieve and the like. Especially, from a reactive viewpoint with a hydroxyl group, trimethylol propane modified|denatured aromatic polyisocyanate, especially trimethylol propane modified|denatured tolylene diisocyanate is preferable.

점착성 조성물P 중에 있어서의 가교제(C)의 함유량은, (메트)아크릴산에스테르 중합체(A) 100질량부에 대해 0.001∼10질량부인 것이 바람직하고, 특히 0.01∼5질량부인 것이 바람직하며, 나아가서는 0.02∼1질량부인 것이 바람직하다.It is preferable that content of the crosslinking agent (C) in the adhesive composition P is 0.001-10 mass parts with respect to 100 mass parts of (meth)acrylic acid ester polymer (A), It is especially preferable that it is 0.01-5 mass parts, Furthermore, it is 0.02 It is preferable that it is -1 mass part.

가교제(C)의 함유량이 상기 범위에 있음으로써, 얻어지는 점착제의 응집력이 바람직한 것이 되어, 점착제의 내구성이 향상된다. When content of a crosslinking agent (C) exists in the said range, the cohesive force of the adhesive obtained becomes a preferable thing, and durability of an adhesive improves.

(4) 각종 첨가제 (4) Various additives

점착성 조성물P에는, 원하는 바에 따라 아크릴계 점착제에 통상 사용되고 있는 각종 첨가제, 예를 들어 실란 커플링제, 대전 방지제, 점착 부여제, 산화 방지제, 자외선 흡수제, 광 안정제, 연화제, 충전제, 굴절률 조정제 등을 첨가할 수 있다.To the pressure-sensitive adhesive composition P, if desired, various additives commonly used in acrylic pressure-sensitive adhesives, such as silane coupling agents, antistatic agents, tackifiers, antioxidants, ultraviolet absorbers, light stabilizers, softeners, fillers, refractive index modifiers, etc. may be added. can

특히 내구성을 개선하는 관점에서, 점착성 조성물P에는, 첨가제로서 실란 커플링제가 첨가되는 것이 바람직하다. 실란 커플링제로서는, 분자 내에 알콕시실릴기를 적어도 1개 갖는 유기 규소 화합물이고, (메트)아크릴산에스테르 중합체(A)와의 상용성이 양호한 것이 바람직하다. 또, 점착 시트(1)가 광학 용도인 경우에는, 광 투과성을 갖는 실란 커플링제가 바람직하다. In particular, it is preferable that a silane coupling agent is added as an additive to the pressure-sensitive adhesive composition P from the viewpoint of improving durability. As a silane coupling agent, it is an organosilicon compound which has at least 1 alkoxysilyl group in a molecule|numerator, Compatibility with the (meth)acrylic acid ester polymer (A) is preferable. Moreover, when the adhesive sheet 1 is an optical use, the silane coupling agent which has light transmittance is preferable.

이러한 실란 커플링제로서는, 예를 들어 비닐트리메톡시실란, 비닐트리에톡시실란, 메타크릴옥시프로필트리메톡시실란 등의 중합성 불포화기 함유 규소 화합물, 3-글리시독시프로필트리메톡시실란, 2-(3,4-에폭시시클로헥실)에틸트리메톡시실란 등의 에폭시 구조를 갖는 규소 화합물, 3-메르캅토프로필트리메톡시실란, 3-메르캅토프로필트리에톡시실란, 3-메르캅토프로필디메톡시메틸실란 등의 메르캅토기 함유 규소 화합물, 3-아미노프로필트리메톡시실란, N-(2-아미노에틸)-3-아미노프로필트리메톡시실란, N-(2-아미노에틸)-3-아미노프로필메틸디메톡시실란 등의 아미노기 함유 규소 화합물, 3-클로로프로필트리메톡시실란, 3-이소시아네이트프로필트리에톡시실란, 혹은 이들 중 적어도 1개와, 메틸트리에톡시실란, 에틸트리에톡시실란, 메틸트리메톡시실란, 에틸트리메톡시실란 등의 알킬기 함유 규소 화합물의 축합물 등을 들 수 있다. 이들은, 1종을 단독으로 사용해도 되고, 2종 이상을 조합하여 사용해도 된다.As such a silane coupling agent, for example, polymerizable unsaturated group-containing silicon compounds such as vinyltrimethoxysilane, vinyltriethoxysilane, and methacryloxypropyltrimethoxysilane; 3-glycidoxypropyltrimethoxysilane; Silicon compounds having an epoxy structure such as 2-(3,4-epoxycyclohexyl)ethyltrimethoxysilane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropyl Mercapto group-containing silicon compounds such as dimethoxymethylsilane, 3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3-aminopropyltrimethoxysilane, N-(2-aminoethyl)-3 -Amino group-containing silicon compounds such as aminopropylmethyldimethoxysilane, 3-chloropropyltrimethoxysilane, 3-isocyanatepropyltriethoxysilane, or at least one of these, and methyltriethoxysilane, ethyltriethoxysilane and a condensate of an alkyl group-containing silicon compound such as methyltrimethoxysilane and ethyltrimethoxysilane. These may be used individually by 1 type, and may be used in combination of 2 or more type.

실란 커플링제의 첨가량은, (메트)아크릴산에스테르 중합체(A) 100질량부에 대해 0.01∼1.0질량부인 것이 바람직하고, 특히 0.05∼0.5질량부인 것이 바람직하다.It is preferable that it is 0.01-1.0 mass part with respect to 100 mass parts of (meth)acrylic acid ester polymers (A), and, as for the addition amount of a silane coupling agent, it is preferable that it is especially 0.05-0.5 mass part.

(5) 점착성 조성물의 제조(5) Preparation of adhesive composition

점착성 조성물P는, (메트)아크릴산에스테르 중합체(A)를 제조하고, 얻어진 (메트)아크릴산에스테르 중합체(A)와, 벤조트리아졸계 방청제(B)를 혼합함과 함께, 원하는 바에 따라 가교제(C) 및 첨가제를 첨가함으로써 제조할 수 있다. The adhesive composition P is a (meth)acrylic acid ester polymer (A) prepared by mixing the obtained (meth)acrylic acid ester polymer (A) and a benzotriazole-based rust preventive agent (B), and optionally a crosslinking agent (C) And it can be prepared by adding an additive.

(메트)아크릴산에스테르 중합체(A)는, 중합체를 구성하는 모노머 단위의 혼합물을 통상적인 라디칼 중합법으로 중합함으로써 제조할 수 있다. (메트)아크릴산에스테르 중합체(A)의 중합은, 원하는 바에 따라 중합 개시제를 사용하여, 용액 중합법 등에 의해 행할 수 있다. 중합 용매로서는, 예를 들어 아세트산에틸, 아세트산 n-부틸, 아세트산이소부틸, 톨루엔, 아세톤, 헥산, 메틸에틸케톤 등을 들 수 있고, 2종류 이상을 병용해도 된다. A (meth)acrylic acid ester polymer (A) can be manufactured by superposing|polymerizing the mixture of the monomer unit which comprises a polymer by the normal radical polymerization method. Superposition|polymerization of the (meth)acrylic acid ester polymer (A) can be performed by the solution polymerization method etc. using a polymerization initiator as needed. As a polymerization solvent, ethyl acetate, n-butyl acetate, isobutyl acetate, toluene, acetone, hexane, methyl ethyl ketone etc. are mentioned, for example, You may use 2 or more types together.

중합 개시제로서는, 아조계 화합물, 유기 과산화물 등을 들 수 있고, 2종류 이상을 병용해도 된다. 아조계 화합물로서는, 예를 들어 2,2'-아조비스이소부티로니트릴, 2,2'-아조비스(2-메틸부티로니트릴), 1,1'-아조비스(시클로헥산1-카르보니트릴), 2,2'-아조비스(2,4-디메틸발레로니트릴), 2,2'-아조비스(2,4-디메틸-4-메톡시발레로니트릴), 디메틸2,2'-아조비스(2-메틸프로피오네이트), 4,4'-아조비스(4-시아노발레르산), 2,2'-아조비스(2-하이드록시메틸프로피오니트릴), 2,2'-아조비스[2-(2-이미다졸린-2-일)프로판] 등을 들 수 있다. As a polymerization initiator, an azo type compound, an organic peroxide, etc. are mentioned, You may use 2 or more types together. As the azo compound, for example, 2,2'-azobisisobutyronitrile, 2,2'-azobis(2-methylbutyronitrile), 1,1'-azobis(cyclohexane1-carbonitrile) ), 2,2'-azobis (2,4-dimethylvaleronitrile), 2,2'-azobis (2,4-dimethyl-4-methoxyvaleronitrile), dimethyl 2,2'-azo Bis(2-methylpropionate), 4,4'-azobis(4-cyanovaleric acid), 2,2'-azobis(2-hydroxymethylpropionitrile), 2,2'-azo bis[2-(2-imidazolin-2-yl)propane] and the like.

유기 과산화물로서는, 예를 들어 과산화벤조일, t-부틸퍼벤조에이트, 쿠멘하이드로퍼옥사이드, 디이소프로필퍼옥시디카보네이트, 디-n-프로필퍼옥시디카보네이트, 디(2-에톡시에틸)퍼옥시디카보네이트, t-부틸퍼옥시네오데카노에이트, t-부틸퍼옥시피발레이트, (3,5,5-트리메틸헥사노일)퍼옥사이드, 디프로피오닐퍼옥사이드, 디아세틸퍼옥사이드 등을 들 수 있다. Examples of the organic peroxide include benzoyl peroxide, t-butyl perbenzoate, cumene hydroperoxide, diisopropyl peroxydicarbonate, di-n-propyl peroxydicarbonate, di(2-ethoxyethyl)peroxydicarbonate, t-butylperoxyneodecanoate, t-butylperoxypivalate, (3,5,5-trimethylhexanoyl)peroxide, dipropionylperoxide, diacetylperoxide, etc. are mentioned.

또한, 상기 중합 공정에 있어서, 2-메르캅토에탄올 등의 연쇄 이동제를 배합함으로써, 얻어지는 중합체의 중량 평균 분자량을 조절할 수 있다. Moreover, the said polymerization process WHEREIN: By mix|blending chain transfer agents, such as 2-mercaptoethanol, the weight average molecular weight of the polymer obtained can be adjusted.

(메트)아크릴산에스테르 중합체(A)가 얻어졌다면, (메트)아크릴산에스테르 중합체(A)의 용액에, 벤조트리아졸계 방청제(B), 그리고 원하는 바에 따라 가교제(C), 첨가제 및 희석 용제를 첨가하고, 충분히 혼합함으로써, 용제로 희석된 점착성 조성물P(도포 용액)를 얻는다. When a (meth)acrylic acid ester polymer (A) is obtained, to the solution of the (meth)acrylic acid ester polymer (A), a benzotriazole-based rust preventive agent (B), and optionally a crosslinking agent (C), an additive and a diluent solvent are added, , by sufficiently mixing to obtain an adhesive composition P (coating solution) diluted with a solvent.

상기 희석 용제로서는, 예를 들어 헥산, 헵탄, 시클로헥산 등의 지방족 탄화수소, 톨루엔, 자일렌 등의 방향족 탄화수소, 염화메틸렌, 염화에틸렌 등의 할로겐화탄화수소, 메탄올, 에탄올, 프로판올, 부탄올, 1-메톡시-2-프로판올 등의 알코올, 아세톤, 메틸에틸케톤, 2-펜타논, 이소포론, 시클로헥사논 등의 케톤, 아세트산에틸, 아세트산부틸 등의 에스테르, 에틸셀로솔브 등의 셀로솔브계 용제 등이 사용된다.Examples of the diluting solvent include aliphatic hydrocarbons such as hexane, heptane and cyclohexane, aromatic hydrocarbons such as toluene and xylene, halogenated hydrocarbons such as methylene chloride and ethylene chloride, methanol, ethanol, propanol, butanol, 1-methoxy Alcohols such as -2-propanol, ketones such as acetone, methyl ethyl ketone, 2-pentanone, isophorone, and cyclohexanone, esters such as ethyl acetate and butyl acetate, and cellosolve solvents such as ethyl cellosolve used

이와 같이 하여 조제된 도포 용액의 농도·점도로서는, 코팅 가능한 범위이면 되고, 특별히 제한되지 않고, 상황에 따라 적절히 선정할 수 있다. 예를 들어, 점착성 조성물P의 농도가 10∼40질량%가 되도록 희석한다. 또한, 도포 용액을 얻을 때에 희석 용제 등의 첨가는 필요 조건은 아니고, 점착성 조성물P가 코팅 가능한 점도 등이면 희석 용제를 첨가하지 않아도 된다. 이 경우, 점착성 조성물P는, (메트)아크릴산에스테르 중합체(A)의 중합 용매를 그대로 희석 용제로 하는 도포 용액이 된다. The concentration and viscosity of the thus prepared coating solution may be within a range that can be coated, and is not particularly limited, and may be appropriately selected depending on the situation. For example, it is diluted so that the density|concentration of the adhesive composition P may become 10-40 mass %. In addition, when obtaining a coating solution, addition of a diluent solvent etc. is not a necessary condition, and it is not necessary to add a diluent solvent as long as the adhesive composition P has a coatable viscosity, etc. In this case, the adhesive composition P turns into a coating solution which uses the polymerization solvent of the (meth)acrylic acid ester polymer (A) as a dilution solvent as it is.

〔점착제〕〔adhesive〕

본 실시형태에 관련된 점착제는, 점착성 조성물P를 가교시켜 이루어지는 것이다. 점착성 조성물P의 가교는, 가열 처리에 의해 행할 수 있다. 또한, 이 가열 처리는, 점착성 조성물P의 희석 용제 등을 휘발시킬 때의 건조 처리로 겸할 수도 있다. The pressure-sensitive adhesive according to the present embodiment is obtained by crosslinking the pressure-sensitive adhesive composition P. Crosslinking of the adhesive composition P can be performed by heat treatment. In addition, this heat treatment can also serve as a drying process at the time of volatilizing the dilution solvent etc. of the adhesive composition P.

가열 처리를 행하는 경우, 가열 온도는 50∼150℃인 것이 바람직하고, 특히 70∼120℃인 것이 바람직하다. 또, 가열 시간은 30초∼10분인 것이 바람직하고, 특히 50초∼2분인 것이 바람직하다. 가열 처리 후, 필요에 따라 상온(예를 들어, 23℃, 50%RH)에서 1∼2주간 정도의 양생 기간을 설정해도 된다. 이 양생 기간이 필요한 경우에는 양생 기간 경과 후, 양생 기간이 불필요한 경우에는 가열 처리 종료 후, 점착제층이 형성된다. When heat-processing, it is preferable that the heating temperature is 50-150 degreeC, and it is especially preferable that it is 70-120 degreeC. Moreover, it is preferable that they are 30 second - 10 minutes, and, as for a heating time, it is especially preferable that they are 50 seconds - 2 minutes. After the heat treatment, if necessary, a curing period of about 1 to 2 weeks may be set at normal temperature (eg, 23°C, 50%RH). A pressure-sensitive adhesive layer is formed after the lapse of the curing period when this curing period is required, and after the end of the heat treatment when the curing period is unnecessary.

점착성 조성물P를 가교시켜 얻어지는 점착제는, 벤조트리아졸계 방청제(B)에 의해, 접촉하는 금속 부재의 부식을 억제할 수 있고, 또한 상기 서술한 (메트)아크릴산에스테르 중합체(A)가 갖는 수산기에 의해 우수한 내습열 백화성을 발휘한다.The pressure-sensitive adhesive obtained by crosslinking the pressure-sensitive adhesive composition P can suppress corrosion of the metal member in contact with the benzotriazole-based rust preventive agent (B), and the (meth)acrylic acid ester polymer (A) has a hydroxyl group It exhibits excellent heat-and-moisture whitening resistance.

본 실시형태에 관련된 점착제는, 1.0㎒에 있어서의 유전율이 2.0∼8.0인 것이 바람직하고, 특히 2.0∼7.0인 것이 바람직하며, 나아가서는 2.0∼6.0인 것이 바람직하다. 점착제의 유전율이 2.0∼8.0임으로써, 점착제에서 기인하는 터치 패널의 오작동을 효과적으로 억제할 수 있다. 또한, 점착제의 유전율 측정 방법은, 후술하는 시험예에 나타내는 바와 같다. It is preferable that the dielectric constant in 1.0 MHz of the adhesive which concerns on this embodiment is 2.0-8.0, It is especially preferable that it is 2.0-7.0, Furthermore, it is preferable that it is 2.0-6.0. When the dielectric constant of an adhesive is 2.0-8.0, the malfunction of the touch panel resulting from an adhesive can be suppressed effectively. In addition, the dielectric constant measuring method of an adhesive is as showing in the test example mentioned later.

〔점착 시트〕[adhesive sheet]

도 1에 나타내는 바와 같이, 본 실시형태에 관련된 점착 시트(1)는, 2장의 박리 시트(12a, 12b)와, 그들 2장의 박리 시트(12a, 12b)의 박리면과 접하도록 당해 2장의 박리 시트(12a, 12b)에 협지된 점착제층(11)으로 구성된다. 단, 점착 시트(1)에 있어서 박리 시트(12a, 12b)는 필수 구성 요소는 아니고, 점착 시트(1)의 사용 시에 박리·제거되는 것이다. 또한, 본 명세서에 있어서의 박리 시트의 박리면이란, 박리 시트에 있어서 박리성을 갖는 면을 말하고, 박리 처리를 실시한 면 및 박리 처리를 실시하지 않아도 박리성을 나타내는 면 모두 포함하는 것이다.As shown in FIG. 1, the adhesive sheet 1 which concerns on this embodiment is peeling of 2 sheets 12a, 12b, so that the peeling surface of these 2 sheets may be in contact with the peeling sheet 12a, 12b. It is composed of an adhesive layer 11 sandwiched between sheets 12a and 12b. However, in the adhesive sheet 1, the peeling sheets 12a, 12b are not essential components, and peeling and removing at the time of use of the adhesive sheet 1 are carried out. In addition, the peeling surface of the peeling sheet in this specification means the surface which has peelability in a peeling sheet, and it includes both the surface to which the peeling process was performed, and the surface which shows peelability even if it does not perform a peeling process.

(1) 점착제층(1) adhesive layer

점착제층(11)은, 전술한 점착성 조성물P를 가교시켜 이루어지는 점착제로 구성된다. 점착제층(11)의 두께(JIS K7130에 준해 측정한 값)는, 10∼300㎛인 것이 바람직하고, 특히 25∼250㎛인 것이 바람직하며, 나아가서는 50∼100㎛인 것이 바람직하다. 점착제층(11)의 두께가 10㎛ 이상임으로써, 우수한 점착력이 충분히 발휘되고, 점착제층(11)의 두께가 300㎛ 이하임으로써, 가공성이 양호해진다. 또, 점착제층(11)의 두께가 25∼100㎛이면, 광학 용도, 특히 터치 패널 용도로서 바람직한 것이 된다. 또한, 점착제층(11)은 단층으로 형성해도 되고, 복수층을 적층해 형성할 수도 있다. The adhesive layer 11 is comprised from the adhesive formed by bridge|crosslinking the adhesive composition P mentioned above. It is preferable that the thickness (value measured according to JISK7130) of the adhesive layer 11 is 10-300 micrometers, It is especially preferable that it is 25-250 micrometers, Furthermore, it is preferable that it is 50-100 micrometers. When the thickness of the adhesive layer 11 is 10 micrometers or more, the outstanding adhesive force is fully exhibited, and when the thickness of the adhesive layer 11 is 300 micrometers or less, workability becomes favorable. Moreover, if the thickness of the adhesive layer 11 is 25-100 micrometers, it will become preferable as an optical use, especially a touchscreen use. In addition, the adhesive layer 11 may be formed in a single layer, and may be formed by laminating|stacking multiple layers.

(2) 박리 시트 (2) release sheet

박리 시트(12a, 12b)로서는, 특별히 한정되지 않고, 공지된 플라스틱 필름을 사용할 수 있다. 예를 들어, 폴리에틸렌 필름, 폴리프로필렌 필름, 폴리부텐 필름, 폴리부타디엔 필름, 폴리메틸펜텐 필름, 폴리염화비닐 필름, 염화비닐 공중합체 필름, 폴리에틸렌테레프탈레이트 필름, 폴리에틸렌나프탈레이트 필름, 폴리부틸렌테레프탈레이트 필름, 폴리우레탄 필름, 에틸렌아세트산비닐 필름, 아이오노머 수지 필름, 에틸렌·(메트)아크릴산 공중합체 필름, 에틸렌·(메트)아크릴산에스테르 공중합체 필름, 폴리스티렌 필름, 폴리카보네이트 필름, 폴리이미드 필름, 불소 수지 필름 등이 사용된다. 또, 이들의 가교 필름도 사용된다. 또한, 이들의 적층 필름이어도 된다. It does not specifically limit as release sheet 12a, 12b, A well-known plastic film can be used. For example, polyethylene film, polypropylene film, polybutene film, polybutadiene film, polymethylpentene film, polyvinyl chloride film, vinyl chloride copolymer film, polyethylene terephthalate film, polyethylene naphthalate film, polybutylene terephthalate Film, polyurethane film, ethylene vinyl acetate film, ionomer resin film, ethylene/(meth)acrylic acid copolymer film, ethylene/(meth)acrylic acid ester copolymer film, polystyrene film, polycarbonate film, polyimide film, fluororesin film or the like is used. Moreover, these crosslinked films are also used. Moreover, these laminated|multilayer films may be sufficient.

상기 박리 시트(12a, 12b)의 박리면(특히 점착제층(11)과 접하는 면)에는, 박리 처리가 실시되어 있는 것이 바람직하다. 박리 처리에 사용되는 박리제로서는, 예를 들어 알키드계, 실리콘계, 불소계, 불포화 폴리에스테르계, 폴리올레핀계, 왁스계의 박리제를 들 수 있다. 또한, 박리 시트(12a, 12b) 중, 일방의 박리 시트를 박리력이 큰 중박리형(重剝離型) 박리 시트로 하고, 타방의 박리 시트를 박리력이 작은 경박리형(輕剝離型) 박리 시트로 하는 것이 바람직하다.It is preferable that the peeling process is given to the peeling surface (particularly, the surface in contact with the adhesive layer 11) of the said peeling sheet 12a, 12b. As a release agent used for a peeling process, the release agent of an alkyd type, a silicone type, a fluorine type, an unsaturated polyester type, a polyolefin type, and a wax type is mentioned, for example. In addition, among the release sheets 12a and 12b, one release sheet is set as a heavy release type release sheet with a large peeling force, and the other release sheet is a light release type release sheet with a small peel force. It is preferable to

박리 시트(12a, 12b)의 두께에 대해서는 특별히 제한은 없지만, 통상 20∼150㎛ 정도이다.Although there is no restriction|limiting in particular about the thickness of peeling sheet 12a, 12b, Usually, it is about 20-150 micrometers.

(3) 점착 시트의 제조 (3) Manufacture of adhesive sheet

점착 시트(1)의 일제조예로서는, 일방의 박리 시트(12a)(또는 12b)의 박리면에, 상기 점착성 조성물P의 도포액을 도포하고, 가열 처리를 행해 점착성 조성물P를 가교시키고, 도포층을 형성한 후, 그 도포층에 타방의 박리 시트(12b)(또는 12a)의 박리면을 중첩한다. 양생 기간이 필요한 경우에는 양생 기간을 둠으로써, 양생 기간이 불필요한 경우에는 그대로, 상기 도포층이 점착제층(11)이 된다. 이것에 의해, 상기 점착 시트(1)가 얻어진다. 가열 처리 및 양생의 조건에 대해서는 전술한 바와 같다.As a single manufacturing example of the adhesive sheet 1, the coating liquid of the said adhesive composition P is apply|coated to the peeling surface of one peeling sheet 12a (or 12b), heat-processing is performed, the adhesive composition P is crosslinked, and an application layer After forming, the release surface of the other release sheet 12b (or 12a) is superimposed on the application layer. By providing a curing period when a curing period is required, when a curing period is unnecessary, the said application layer becomes the adhesive layer 11 as it is. Thereby, the said adhesive sheet 1 is obtained. The conditions of heat treatment and curing are as described above.

점착 시트(1)의 다른 제조예로서는, 일방의 박리 시트(12a)의 박리면에, 상기 점착성 조성물P의 도포액을 도포하고, 가열 처리를 행해 점착성 조성물P를 가교시키고, 도포층을 형성하여, 도포층이 형성된 박리 시트(12a)를 얻는다. 또, 타방의 박리 시트(12b)의 박리면에, 상기 점착성 조성물P의 도포액을 도포하고, 가열 처리를 행해 점착성 조성물P를 가교시키고, 도포층을 형성해, 도포층이 형성된 박리 시트(12b)를 얻는다. 그리고, 도포층이 형성된 박리 시트(12a)와 도포층이 형성된 박리 시트(12b)를, 양 도포층이 서로 접촉하도록 첩합(貼合)한다. 양생 기간이 필요한 경우에는 양생 기간을 둠으로써, 양생 기간이 불필요한 경우에는 그대로, 상기 적층된 도포층이 점착제층(11)이 된다. 이것에 의해, 상기 점착 시트(1)가 얻어진다. 이 제조예에 의하면, 점착제층(11)이 두꺼운 경우라도, 안정적으로 제조할 수 있게 된다.As another manufacturing example of the adhesive sheet 1, the coating liquid of the said adhesive composition P is apply|coated to the peeling surface of one peeling sheet 12a, heat-processing is performed, the adhesive composition P is crosslinked, and an application layer is formed, A release sheet 12a with an application layer is obtained. Moreover, the coating liquid of the said adhesive composition P is apply|coated to the peeling surface of the other peeling sheet 12b, heat-processing is performed, the adhesive composition P is crosslinked, an application layer is formed, and the peeling sheet 12b with an application layer is formed. get And the release sheet 12a with an application layer and the release sheet 12b with an application layer are bonded together so that both application layers may mutually contact. When a curing period is required, by providing a curing period, when a curing period is unnecessary, the laminated application layer becomes the pressure-sensitive adhesive layer 11 as it is. Thereby, the said adhesive sheet 1 is obtained. According to this manufacturing example, even when the adhesive layer 11 is thick, it becomes possible to manufacture stably.

상기 점착성 조성물P의 도포액을 도포하는 방법으로서는, 예를 들어 바 코트법, 나이프 코트법, 롤 코트법, 블레이드 코트법, 다이 코트법, 그라비어 코트법 등을 이용할 수 있다.As a method of applying the coating liquid of the adhesive composition P, for example, a bar coating method, a knife coating method, a roll coating method, a blade coating method, a die coating method, a gravure coating method, or the like can be used.

(4) 헤이즈값(4) Haze value

본 실시형태에 있어서의 점착제층(11)은, 헤이즈값(JIS K7136 : 2000에 준해 측정한 값)이, 1.0% 이하인 것이 바람직하고, 특히 0.8% 이하인 것이 바람직하며, 나아가서는 0.6% 이하인 것이 바람직하다. 헤이즈값이 1.0% 이하이면, 투명성이 매우 높아, 광학 용도로서 바람직한 것이 된다. 또한, 점착제층(11)의 헤이즈값은, 후술하는 내습열 백화성의 평가 시험 후에 있어서도 상기 범위 내에 있는 것이 특히 바람직하다. It is preferable that haze value (value measured according to JIS K7136:2000) of the adhesive layer 11 in this embodiment is 1.0 % or less, It is especially preferable that it is 0.8 % or less, Furthermore, it is preferable that it is 0.6 % or less. do. Transparency is very high that a haze value is 1.0 % or less, and it becomes a thing suitable as an optical use. Moreover, it is especially preferable that the haze value of the adhesive layer 11 exists in the said range also after the evaluation test of the heat-and-moisture whitening resistance mentioned later.

(5) 점착 시트의 사용 (5) Use of adhesive sheet

상기 점착 시트(1)를 사용함으로써, 예를 들어 도 2에 나타내는 정전 용량 방식의 터치 패널(2)을 제조할 수 있다. 터치 패널(2)은, 표시체 모듈(3)과, 그 위에 점착제층(4)을 개재하여 적층된 제 1 필름 센서(5a)와, 그 위에 점착제층(11)을 개재하여 적층된 제 2 필름 센서(5b)와, 그 위에 점착제층(11)을 개재하여 적층된 커버재(6)를 구비하여 구성된다.By using the said adhesive sheet 1, the capacitive touch panel 2 shown in FIG. 2 can be manufactured, for example. The touch panel 2 includes a display module 3, a first film sensor 5a laminated thereon with an adhesive layer 4 interposed thereon, and a second film sensor 5a laminated thereon with an adhesive layer 11 interposed thereon. The film sensor 5b and the cover material 6 laminated|stacked via the adhesive layer 11 thereon are provided, and it is comprised.

상기 터치 패널(2)에 있어서의 점착제층(11)은, 상기 점착 시트(1)의 점착제층(11)이다.The pressure-sensitive adhesive layer 11 in the touch panel 2 is the pressure-sensitive adhesive layer 11 of the pressure-sensitive adhesive sheet 1 .

상기 표시체 모듈(3)로서는, 예를 들어 액정(LCD) 모듈, 발광 다이오드(LED) 모듈, 유기 일렉트로 루미네선스(유기 EL) 모듈, 전자 페이퍼 등을 들 수 있다.Examples of the display module 3 include a liquid crystal (LCD) module, a light emitting diode (LED) module, an organic electroluminescence (organic EL) module, and electronic paper.

점착제층(4)은, 상기 점착 시트(1)의 점착제층(11)에 의해 형성해도 되고, 다른 점착제 또는 점착 시트에 의해 형성해도 된다. 후자의 경우, 점착제층(4)을 구성하는 점착제로서는, 아크릴계 점착제, 고무계 점착제, 실리콘계 점착제, 우레탄계 점착제, 폴리에스테르계 점착제, 폴리비닐에테르계 점착제 등을 들 수 있지만, 그 중에서도 아크릴계 점착제가 바람직하다. The adhesive layer 4 may be formed of the adhesive layer 11 of the said adhesive sheet 1, and may be formed of another adhesive or an adhesive sheet. In the latter case, examples of the pressure-sensitive adhesive constituting the pressure-sensitive adhesive layer 4 include an acrylic pressure-sensitive adhesive, a rubber-based pressure-sensitive adhesive, a silicone pressure-sensitive adhesive, a urethane-based pressure-sensitive adhesive, a polyester-based pressure-sensitive adhesive, and a polyvinyl ether-based pressure-sensitive adhesive. Among them, an acrylic pressure-sensitive adhesive is preferred. .

본 실시형태에 있어서의 제 1 필름 센서(5a) 및 제 2 필름 센서(5b)는, 각각 기재 필름(51)과, 기재 필름(51)에 형성된 금속 메시로 이루어지는 전극(52)을 구비한다. 기재 필름(51)으로서는 특별히 한정되지 않지만, 예를 들어 폴리에틸렌테레프탈레이트 필름, 아크릴 필름, 폴리카보네이트 필름 등이 사용된다. The 1st film sensor 5a and the 2nd film sensor 5b in this embodiment are equipped with the base film 51 and the electrode 52 which consists of the metal mesh formed in the base film 51, respectively. Although it does not specifically limit as the base film 51, For example, a polyethylene terephthalate film, an acrylic film, a polycarbonate film, etc. are used.

전극(52)을 구성하는 금속 메시의 금속으로서는, 구리, 은 등을 들 수 있지만, 특히 구리가 바람직하다. 구리에 의하면, 저항값을 10Ω/□ 이하로 낮출 수 있어 터치 패널을 대형화할 수 있다. 단, 구리는, 백금, 금, 은 등의 귀금속과 비교해, 또 주석 도프 산화인듐(ITO) 등의 투명 도전 재료와 비교해, 부식되기 쉽다. 그러나, 전술한 점착성 조성물P로부터 형성된 점착제층(11)에 의하면, 구리 메시로 이루어지는 전극(52)의 부식을 억제할 수 있다. Although copper, silver, etc. are mentioned as a metal of the metal mesh which comprises the electrode 52, Copper is especially preferable. According to copper, the resistance value can be lowered to 10 Ω/square or less, and the touch panel can be enlarged. However, copper is easy to corrode compared with noble metals, such as platinum, gold|metal|money, silver, and also compared with transparent electrically-conductive materials, such as tin-doped indium oxide (ITO). However, according to the adhesive layer 11 formed from the adhesive composition P mentioned above, corrosion of the electrode 52 which consists of a copper mesh can be suppressed.

제 1 필름 센서(5a)의 전극(52) 및 제 2 필름 센서(5b)의 전극(52)은, 통상 일방이 X축 방향의 회로 패턴을 구성하고, 타방이 Y축 방향의 회로 패턴을 구성한다.As for the electrode 52 of the 1st film sensor 5a and the electrode 52 of the 2nd film sensor 5b, one normally comprises a circuit pattern of an X-axis direction, and the other comprises a circuit pattern of a Y-axis direction. do.

본 실시형태에 있어서의 제 2 필름 센서(5b)의 전극(52)은, 도 2 중 제 2 필름 센서(5b)의 상측에 위치하고 있다. 한편, 제 1 필름 센서(5a)의 전극(52)은, 도 2 중 제 1 필름 센서(5a)의 상측에 위치하고 있지만, 이것에 한정되는 것은 아니고, 제 1 필름 센서(5a)의 하측에 위치해도 된다.The electrode 52 of the 2nd film sensor 5b in this embodiment is located above the 2nd film sensor 5b in FIG. On the other hand, although the electrode 52 of the 1st film sensor 5a is located above the 1st film sensor 5a in FIG. 2, it is not limited to this, It is located below the 1st film sensor 5a also be

커버재(6)는, 통상 유리판 또는 플라스틱판을 주체로 한다. 유리판으로서는, 특별히 한정되지 않고, 예를 들어 화학 강화 유리, 무알칼리 유리, 석영 유리, 소다라임 유리, 바륨·스트론튬 함유 유리, 알루미노규산 유리, 납 유리, 붕규산 유리, 바륨붕규산 유리 등을 들 수 있다. 플라스틱판으로서는, 특별히 한정되지 않고, 예를 들어 폴리메틸메타크릴레이트 등으로 이루어지는 아크릴판, 폴리카보네이트판 등을 들 수 있다.The cover material 6 mainly has a glass plate or a plastic plate. The glass plate is not particularly limited, and examples thereof include chemically strengthened glass, alkali-free glass, quartz glass, soda-lime glass, barium/strontium-containing glass, aluminosilicate glass, lead glass, borosilicate glass, and barium borosilicate glass. have. It does not specifically limit as a plastic board, For example, the acrylic board which consists of polymethyl methacrylate etc., a polycarbonate board, etc. are mentioned.

또한, 상기 유리판이나 플라스틱판의 편면 또는 양면에는, 하드 코트층, 반사 방지층, 방현층 등의 기능층이 형성되어 있어도 되고, 하드 코트 필름, 반사 방지 필름, 방현 필름 등의 광학 부재가 적층되어 있어도 된다.In addition, functional layers, such as a hard coat layer, an antireflection layer, and a glare layer, may be formed on one side or both surfaces of the said glass plate or a plastic plate, Even if optical members, such as a hard coat film, an antireflection film, and an antiglare film, are laminated|stacked do.

본 실시형태에 있어서, 상기 커버재(6)는, 점착제층(11)측의 면에 단차를 가지고 있고, 구체적으로는 인쇄층(7)의 유무에 의한 단차를 가지고 있다. 인쇄층(7)은, 커버재(6)에 있어서의 점착제층(11)측에 프레임상으로 형성되는 것이 일반적이다. In the present embodiment, the cover material 6 has a level difference on the surface on the pressure-sensitive adhesive layer 11 side, and specifically has a level difference depending on the presence or absence of the printed layer 7 . The printing layer 7 is generally formed in a frame shape on the pressure-sensitive adhesive layer 11 side of the cover material 6 .

인쇄층(7)을 구성하는 재료는 특별히 한정되지 않고, 인쇄용의 공지된 재료가 사용된다. 인쇄층(7)의 두께, 즉 단차의 높이는 3∼45㎛인 것이 바람직하고, 5∼35㎛인 것이 보다 바람직하며, 7∼25㎛인 것이 특히 바람직하고, 7∼15㎛인 것이 더 바람직하다. The material constituting the printed layer 7 is not particularly limited, and a known material for printing is used. It is preferable that the thickness of the printed layer 7, ie, the height of a level difference is 3-45 micrometers, it is more preferable that it is 5-35 micrometers, It is especially preferable that it is 7-25 micrometers, It is more preferable that it is 7-15 micrometers. .

또, 인쇄층(7)의 두께(단차의 높이)는, 점착제층(11)의 두께의 3∼30%인 것이 바람직하고, 특히 3.2∼20%인 것이 바람직하며, 나아가서는 3.5∼15%인 것이 바람직하다. 이것에 의해, 점착제층(11)은, 인쇄층(7)에 의한 단차에 추종하기 쉽고, 단차 근방에 들뜸이나 기포 등이 발생하는 것이 억제된다.Moreover, it is preferable that the thickness (height of a step) of the printing layer 7 is 3 to 30 % of the thickness of the adhesive layer 11, It is especially preferable that it is 3.2 to 20 %, Furthermore, it is 3.5 to 15 %. it is preferable Thereby, the adhesive layer 11 is easy to follow the level|step difference by the printed layer 7, and it is suppressed that a float, a bubble, etc. generate|occur|produce in the step|step difference vicinity.

상기 터치 패널(2)의 제조 방법의 일례를, 이하에 설명한다.An example of the manufacturing method of the said touch panel 2 is demonstrated below.

점착 시트(1)로서, 제 1 점착 시트(1) 및 제 2 점착 시트(1)를 준비한다. 제 1 점착 시트(1)로부터 일방의 박리 시트(12a)를 박리하고, 노출된 점착제층(11)(제 1 점착제층(11))을 제 2 필름 센서(5b)의 전극(52)과 접하도록 당해 제 2 필름 센서(5b)와 첩합한다. 또, 제 2 점착 시트(1)로부터 일방의 박리 시트(12a)를 박리하고, 노출된 점착제층(11)(제 2 점착제층)을 제 1 필름 센서(5a)의 전극(52)과 접하도록 당해 제 1 필름 센서(5a)와 첩합한다.As the pressure-sensitive adhesive sheet 1 , a first pressure-sensitive adhesive sheet 1 and a second pressure-sensitive adhesive sheet 1 are prepared. One peeling sheet 12a is peeled off from the 1st adhesive sheet 1, and the exposed adhesive layer 11 (1st adhesive layer 11) is in contact with the electrode 52 of the 2nd film sensor 5b. It bonds with the said 2nd film sensor 5b so that it may be. Moreover, one peeling sheet 12a is peeled from the 2nd adhesive sheet 1, so that the exposed adhesive layer 11 (2nd adhesive layer) may contact with the electrode 52 of the 1st film sensor 5a. It bonds with the said 1st film sensor 5a.

그리고, 제 2 점착 시트에 있어서의 타방의 박리 시트(12b)를 박리하고, 노출된 제 2 점착제층(11)이, 상기 제 2 필름 센서(5b)에 있어서의 제 1 점착제층(11)이 적층된 측과는 반대측의 면(제 2 필름 센서(5b)의 기재 필름(51)의 노출면)에 접하도록 양자를 첩합한다. 이것에 의해, 박리 시트(12b), 제 1 점착제층(11), 제 2 필름 센서(5b), 제 2 점착제층(11) 및 제 1 필름 센서(5a)가 순차 적층되어 이루어지는 적층체가 얻어진다.And the 2nd adhesive layer 11 which peels the other peeling sheet 12b in a 2nd adhesive sheet, and the 1st adhesive layer 11 in the said 2nd film sensor 5b is exposed Both are bonded together so that it may contact|connect the surface (exposed surface of the base film 51 of the 2nd film sensor 5b) on the opposite side to the laminated|stacked side. Thereby, the laminated body in which the release sheet 12b, the 1st adhesive layer 11, the 2nd film sensor 5b, the 2nd adhesive layer 11, and the 1st film sensor 5a are laminated|stacked in order is obtained. .

다음으로, 상기 적층체의 제 1 필름 센서(5a)측의 면(제 1 필름 센서(5a)의 기재 필름(51)의 노출면)에, 박리 시트 상에 형성된 점착제층(4)을 첩합한다. 계속해서, 상기 적층체로부터 박리 시트(12b)를 박리하고, 노출된 제 1 점착제층(11)에 대해, 커버재(6)의 인쇄층(7)측이 당해 점착제층(11)에 접하도록, 당해 커버재(6)를 첩합한다. 이것에 의해, 커버재(6), 제 1 점착제층(11), 제 2 필름 센서(5b), 제 2 점착제층(11), 제 1 필름 센서(5a), 점착제층(4) 및 박리 시트가 순차 적층되어 이루어지는 구성체가 얻어진다. Next, the adhesive layer 4 formed on the release sheet is bonded to the surface (exposed surface of the base film 51 of the 1st film sensor 5a) on the side of the 1st film sensor 5a of the said laminated body. . Then, the release sheet 12b is peeled from the laminate, and with respect to the exposed first pressure-sensitive adhesive layer 11 , the printed layer 7 side of the cover material 6 is in contact with the pressure-sensitive adhesive layer 11 . , the cover member 6 is bonded together. Thereby, the cover material 6, the 1st adhesive layer 11, the 2nd film sensor 5b, the 2nd adhesive layer 11, the 1st film sensor 5a, the adhesive layer 4, and the release sheet|seat A structure in which is sequentially laminated is obtained.

마지막으로, 상기 구성체로부터 박리 시트를 박리하고, 노출된 점착제층(4)이 표시 모듈(3)에 접하도록, 당해 구성체를 표시 모듈(3)에 첩합한다. 이것에 의해, 도 2에 나타내는 터치 패널(2)이 제조된다. Finally, the release sheet is peeled from the structure, and the structure is bonded to the display module 3 so that the exposed pressure-sensitive adhesive layer 4 is in contact with the display module 3 . Thereby, the touch panel 2 shown in FIG. 2 is manufactured.

상기 터치 패널(2)이 고온 고습 조건(예를 들어, 85℃, 85%RH의 조건하에서 240시간)에 놓인 후, 상온 상습으로 되돌려졌을 때에도, 점착제층(11)(제 1 점착제층(11), 제 2 점착제층(11))은 내습열 백화성이 우수하기 때문에, 백화하는 것이 억제된다. 구체적으로는, 점착제층(11)의 헤이즈값은 1.0% 이하를 유지할 수 있다.Even when the touch panel 2 is returned to normal temperature and humidity after being placed under high temperature and high humidity conditions (eg, 85° C. and 85% RH for 240 hours), the pressure-sensitive adhesive layer 11 (first pressure-sensitive adhesive layer 11) ) and 2nd adhesive layer 11), since it is excellent in heat-and-moisture whitening resistance, whitening is suppressed. Specifically, the haze value of the pressure-sensitive adhesive layer 11 can be maintained at 1.0% or less.

이상 설명한 실시형태는, 본 발명의 이해를 용이하게 하기 위해서 기재된 것이고, 본 발명을 한정하기 위해서 기재된 것은 아니다. 따라서, 상기 실시형태에 개시된 각 요소는, 본 발명의 기술적 범위에 속하는 모든 설계 변경이나 균등물도 포함하는 취지이다. The embodiments described above are described in order to facilitate understanding of the present invention, and are not described in order to limit the present invention. Accordingly, each element disclosed in the above embodiment is intended to include all design changes and equivalents falling within the technical scope of the present invention.

예를 들어, 점착 시트(1)에 있어서의 박리 시트(12a, 12b) 중 어느 일방은 생략되어도 된다.For example, either one of the peeling sheets 12a and 12b in the adhesive sheet 1 may be abbreviate|omitted.

실시예Example

이하, 실시예 등에 의해 본 발명을 더욱 구체적으로 설명하지만, 본 발명의 범위는 이들 실시예 등에 한정되는 것은 아니다. Hereinafter, the present invention will be more specifically described by way of Examples and the like, but the scope of the present invention is not limited to these Examples and the like.

〔실시예 1〕[Example 1]

1. (메트)아크릴산에스테르 공중합체의 조제1. Preparation of (meth)acrylic acid ester copolymer

아크릴산 2-에틸헥실 60질량부, 메타크릴산메틸 20질량부 및 아크릴산 2-하이드록시에틸 20질량부를 공중합시켜, (메트)아크릴산에스테르 중합체(A)를 조제했다. 이 (메트)아크릴산에스테르 중합체(A)의 분자량을 후술하는 방법으로 측정한 바, 중량 평균 분자량(Mw) 60만이었다. 60 mass parts of 2-ethylhexyl acrylate, 20 mass parts of methyl methacrylate, and 20 mass parts of acrylic acid 2-hydroxyethyl were copolymerized, and the (meth)acrylic acid ester polymer (A) was prepared. It was a weight average molecular weight (Mw) 600,000 when the molecular weight of this (meth)acrylic acid ester polymer (A) was measured by the method mentioned later.

2. 점착성 조성물의 조제2. Preparation of adhesive composition

상기 공정(1)에서 얻어진 (메트)아크릴산에스테르 중합체(A) 100질량부(고형분 환산값 ; 이하 동일)와, 벤조트리아졸계 방청제(B)로서의 1H-벤조트리아졸(조호쿠카가쿠코교사 제조, 제품명 「BT-120」) 0.3질량부와, 가교제(C)로서의 트리메틸올프로판 변성 톨릴렌디이소시아네이트(닛폰폴리우레탄사 제조, 제품명 「코로네이트L」) 0.15질량부와, 실란 커플링제로서의 3-글리시독시프로필트리메톡시실란(신에츠카가쿠코교사 제조, 제품명 「KBM-403」) 0.2질량부를 혼합해, 충분히 교반하고, 메틸에틸케톤으로 희석함으로써, 고형분 농도 25질량%의 점착성 조성물의 도포 용액을 얻었다. 100 parts by mass of the (meth)acrylic acid ester polymer (A) obtained in the step (1) (solid content conversion; the same hereinafter) and 1H-benzotriazole as a benzotriazole-based rust preventive agent (B) (manufactured by Johoku Chemical Co., Ltd., Product name "BT-120") 0.3 parts by mass, trimethylolpropane-modified tolylene diisocyanate as a crosslinking agent (C) (made by Nippon Polyurethane, product name "Coronate L") 0.15 parts by mass, 3-glycol as a silane coupling agent 0.2 parts by mass of cidoxypropyltrimethoxysilane (manufactured by Shin-Etsu Chemical Co., Ltd., product name "KBM-403") is mixed, thoroughly stirred, and diluted with methyl ethyl ketone, whereby a coating solution of an adhesive composition having a solid content concentration of 25 mass % got

여기서, 당해 점착성 조성물의 배합을 표 1에 나타낸다. 또한, 표 1에 기재된 약호 등의 자세한 것은 이하와 같다. Here, the formulation of the said adhesive composition is shown in Table 1. In addition, details, such as abbreviation of Table 1, are as follows.

[(메트)아크릴산에스테르 중합체(A)] [(meth)acrylic acid ester polymer (A)]

2EHA : 아크릴산 2-에틸헥실 2EHA: 2-ethylhexyl acrylate

MMA : 메타크릴산메틸 MMA: methyl methacrylate

HEA : 아크릴산 2-하이드록시에틸 HEA: 2-hydroxyethyl acrylate

BA : 아크릴산 n-부틸 BA: n-butyl acrylate

[벤조트리아졸계 방청제(B)] [benzotriazole-based rust inhibitor (B)]

방청제B1 : 1H-벤조트리아졸(조호쿠카가쿠코교사 제조, 제품명 「BT-120」)Rust inhibitor B1: 1H-benzotriazole (manufactured by Johoku Chemical Co., Ltd., product name “BT-120”)

방청제B2 : 1H-톨릴트리아졸(시프로카세이사 제조, 제품명 「SEETEC TT-R」)Rust inhibitor B2: 1H-tolyltriazole (manufactured by Cyprocasei, product name "SEETEC TT-R")

방청제B3 : 1-[N,N-비스(2-에틸헥실)아미노메틸]벤조트리아졸(조호쿠카가쿠코교사 제조, 제품명 「BT-LX」) Rust inhibitor B3: 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole (manufactured by Johoku Chemical Co., Ltd., product name "BT-LX")

방청제B4 : 1-[N,N-비스(2-에틸헥실)아미노메틸]메틸벤조트리아졸(조호쿠카가쿠코교사 제조, 제품명 「TT-LX」)Rust inhibitor B4: 1-[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole (manufactured by Johoku Chemical Co., Ltd., product name "TT-LX")

3. 점착 시트의 제조3. Preparation of adhesive sheet

얻어진 점착성 조성물의 도포 용액을, 폴리에틸렌테레프탈레이트 필름의 편면을 실리콘계 박리제로 박리 처리한 중박리형 박리 시트(린텍사 제조, 제품명 「SP-PET382150」, 두께 : 38㎛)의 박리 처리면에, 건조 후의 두께가 50㎛가 되도록 나이프 코터로 도포한 후, 90℃에서 1분간 가열 처리해 도포층을 형성했다. The coating solution of the obtained pressure-sensitive adhesive composition was applied to the release-treated surface of a medium-peelable release sheet (manufactured by Lintec, product name "SP-PET382150", thickness: 38 µm) in which one side of a polyethylene terephthalate film was peeled off with a silicone release agent, after drying. After apply|coating with a knife coater so that thickness might be set to 50 micrometers, it heat-processed at 90 degreeC for 1 minute, and formed the application layer.

폴리에틸렌테레프탈레이트 필름의 편면을 실리콘계 박리제로 박리 처리한 경박리형 박리 시트(린텍사 제조, 제품명 「SP-PET382120」, 두께 : 38㎛)의 박리 처리면이 상기 도포층에 접하도록, 당해 경박리형 박리 시트를 상기 도포층에 첩합했다. 그 후, 23℃, 50%RH의 조건하에서 7일간 양생함으로써, 중박리형 박리 시트/점착제층(두께 : 50㎛)/경박리형 박리 시트의 구성으로 이루어지는 점착 시트를 제조했다.The light-peelable release sheet (manufactured by Lintec, product name "SP-PET382120", thickness: 38 µm) of a light-peelable release sheet (manufactured by Lintec, product name "SP-PET382120", thickness: 38 µm) in which one side of a polyethylene terephthalate film is peeled off with a silicone-based release agent is in contact with the coating layer, The sheet was bonded to the application layer. Then, the adhesive sheet which consists of a structure of a medium-peelable release sheet/adhesive layer (thickness: 50 micrometers)/light-peelable release sheet was manufactured by curing on the conditions of 23 degreeC and 50 %RH for 7 days.

〔실시예 2∼5, 비교예 1∼2〕[Examples 2-5, Comparative Examples 1-2]

(메트)아크릴산에스테르 중합체(A)를 구성하는 각 모노머의 종류 및 비율, (메트)아크릴산에스테르 중합체(A)의 중량 평균 분자량(Mw), 그리고 벤조트리아졸계 방청제(B)의 종류를 표 1에 나타내는 바와 같이 변경하는 것 이외, 실시예 1과 마찬가지로 해 점착 시트를 제조했다. The type and ratio of each monomer constituting the (meth)acrylic acid ester polymer (A), the weight average molecular weight (Mw) of the (meth)acrylic acid ester polymer (A), and the type of the benzotriazole-based rust inhibitor (B) are shown in Table 1 Except changing as shown, it carried out similarly to Example 1, and produced the adhesive sheet.

여기서, 전술한 중량 평균 분자량(Mw)은, 겔 퍼미에이션 크로마토그래피(GPC)를 사용하여 이하의 조건으로 측정(GPC 측정)한 폴리스티렌 환산의 중량 평균 분자량이다.Here, the above-mentioned weight average molecular weight (Mw) is a weight average molecular weight in terms of polystyrene measured using gel permeation chromatography (GPC) under the following conditions (GPC measurement).

<측정 조건><Measurement conditions>

·GPC 측정 장치 : 토소사 제조, HLC-8020 ・GPC measuring device: HLC-8020 manufactured by Tosoh Corporation

·GPC 칼럼(이하의 순서로 통과) : 토소사 제조 ・GPC column (passed in the following order): manufactured by Tosoh Corporation

TSK guard column HXL-H TSK guard column HXL-H

TSK gel GMHXL(×2) TSK gel GMHXL (×2)

TSK gel G2000HXL TSK gel G2000HXL

·측정 용매 : 테트라하이드로푸란 ·Measurement solvent: tetrahydrofuran

·측정 온도 : 40℃・Measurement temperature: 40℃

〔시험예 1〕(내습열 백화성 평가) [Test Example 1] (Evaluation of whitening resistance in moist heat)

실시예 및 비교예에서 얻어진 점착 시트의 점착제층을, 70㎜×70㎜ 사이즈의 무알칼리 유리(두께 : 1㎜) 2장으로 사이에 두고, 그 적층체를 50℃, 0.5㎫의 조건으로 30분간 오토클레이브 처리해, 이것을 샘플로 했다.The pressure-sensitive adhesive layer of the pressure-sensitive adhesive sheet obtained in the Examples and Comparative Examples is sandwiched between two sheets of alkali-free glass (thickness: 1 mm) of a size of 70 mm × 70 mm, and the laminate is 30° C. under the conditions of 0.5 MPa. Minute autoclave treatment was carried out, and this was used as a sample.

얻어진 샘플을, 85℃, 85%RH의 습열 조건하에서 240시간 보관했다. 그 후, 23℃, 50%RH(상온 상습)의 분위기로 되돌려, 점착제층의 헤이즈값을 측정했다. 헤이즈값은, 샘플을 상기 상온 상습의 분위기로 되돌리고 나서 30분 이내에, JIS K7136 : 2000에 준해, 헤이즈미터(닛폰덴쇼쿠코교사 제조, 제품명 「NDH-5000」)를 사용하여 측정했다. 측정한 헤이즈값에 근거해, 이하의 기준에 의해 내습열 백화성을 평가했다. 결과를 표 1에 나타낸다.The obtained sample was stored under the wet heat conditions of 85 degreeC and 85 %RH for 240 hours. Then, it returned to the atmosphere of 23 degreeC and 50 %RH (normal temperature and normal humidity), and the haze value of the adhesive layer was measured. The haze value was measured using a haze meter (manufactured by Nippon Denshoku Co., Ltd., product name "NDH-5000") according to JIS K7136:2000 within 30 minutes after returning the sample to the atmosphere of normal temperature and humidity. Based on the measured haze value, the following reference|standard evaluated heat-and-moisture whitening resistance. A result is shown in Table 1.

○ : 헤이즈값이 1.0% 이하였다○: haze value was 1.0% or less

× : 헤이즈값이 1.0% 초과였다x: haze value was more than 1.0%

〔시험예 2〕(부식 억제 평가)[Test Example 2] (Evaluation of corrosion inhibition)

(1) 구리 메시 적층 필름의 제작 (1) Fabrication of copper mesh laminated film

폴리에틸렌테레프탈레이트(PET) 필름(토요보세키사 제조, 제품명 「PET100A4100」, 두께 : 100㎛)과, 편면을 흑화 처리한 구리박(후루카와서킷포일사 제조, 제품명 「BW-S」, 두께 : 10㎛)과, 폴리우레탄계 접착제(타케다야쿠힝코교사 제조, 타케락A310/타케네이트A10/아세트산에틸=12/1/21(질량비))를 준비했다.Polyethylene terephthalate (PET) film (manufactured by Toyobo Seki Co., Ltd., product name "PET100A4100", thickness: 100 µm) and one side blackened copper foil (manufactured by Furukawa Circuit Foil, product name "BW-S", thickness: 10 µm) ) and a polyurethane adhesive (manufactured by Takedayaku Hinko Co., Ltd., Takelac A310/Takenate A10/ethyl acetate = 12/1/21 (mass ratio)) were prepared.

상기 폴리우레탄계 접착제를 사용하여, 상기 구리박의 흑화 처리면과는 반대측의 표면과 상기 PET 필름을 첩합해, PET 필름/접착제층/구리박으로 이루어지는 적층체를 얻었다. Using the polyurethane adhesive, the surface on the opposite side to the blackening treatment surface of the copper foil and the PET film were bonded to obtain a laminate comprising PET film/adhesive layer/copper foil.

얻어진 적층체의 구리박측(흑화 처리면)에 카세인을 도포하고, 건조시켜, 감광성 수지층으로 했다. 그리고, 패턴이 형성된 마스크를 개재하여 상기 감광성 수지층에 대해 자외선의 밀착 노광을 행하고, 물로 현상했다. 마스크로서는, 선폭 10㎛, 피치 300㎛의 패턴을 갖는 것을 사용했다. 이어서, 경화 처리를 실시한 후, 100℃에서 베이킹을 행해, 레지스트 패턴을 형성했다.Casein was apply|coated to the copper foil side (blackening process surface) of the obtained laminated body, it was made to dry, and it was set as the photosensitive resin layer. And the close_contact exposure of the ultraviolet-ray was performed with respect to the said photosensitive resin layer through the mask in which the pattern was formed, and it developed with water. As the mask, a mask having a pattern having a line width of 10 µm and a pitch of 300 µm was used. Then, after hardening process, baking was performed at 100 degreeC, and the resist pattern was formed.

레지스트 패턴이 형성된 적층체에, 레지스트 패턴측으로부터 염화 제2철 용액(보메도 : 42, 온도 : 30℃)을 분사해 에칭을 실시하고, 수세했다. 이어서, 알칼리 용액을 사용하여 레지스트 패턴을 박리한 후, 세정 및 건조 처리를 행했다. 이와 같이 하여, PET 필름/접착제층/구리 메시로 이루어지는 구리 메시 적층 필름을 얻었다. The laminate on which the resist pattern was formed was etched by spraying a ferric chloride solution (Bomedo: 42, temperature: 30° C.) from the resist pattern side, followed by washing with water. Next, after peeling a resist pattern using an alkali solution, washing|cleaning and drying process were performed. In this way, the copper mesh laminated|multilayer film which consists of PET film/adhesive layer/copper mesh was obtained.

(2) 부식 억제 평가 (2) Corrosion inhibition evaluation

실시예 및 비교예에서 얻어진 점착 시트로부터 경박리형 박리 시트를 박리하고, 노출된 점착제층을, 상기 구리 메시 적층 필름의 구리 메시측에 첩부했다. 그 후, 점착제층으로부터 중박리형 박리 시트를 박리하고, 노출된 점착제층에 대해 PET 필름(토요보세키사 제조, 제품명 「PET A4100」, 두께 : 100㎛)을 첩부해, PET 필름/접착제층/구리 메시/점착제층/PET 필름으로 이루어지는 적층체를 얻고, 이것을 샘플로 했다. The light-peelable release sheet was peeled from the adhesive sheet obtained by the Example and the comparative example, and the exposed adhesive layer was affixed on the copper mesh side of the said copper mesh laminated|multilayer film. Thereafter, the heavy release type release sheet was peeled from the pressure-sensitive adhesive layer, and a PET film (manufactured by Toyobo Seki Corporation, product name “PET A4100”, thickness: 100 μm) was affixed to the exposed pressure-sensitive adhesive layer, and PET film/adhesive layer/copper A laminate comprising a mesh/adhesive layer/PET film was obtained, and this was used as a sample.

상기 샘플을, 85℃, 85%RH의 습열 조건하에서 250시간 보관했다. 그 후, 구리 메시의 부식 유무를 육안에 의해 확인하고, 이하의 기준에 의해 부식 억제 성능을 평가했다. 결과를 표 1에 나타낸다.The sample was stored for 250 hours at 85°C and under moist heat conditions of 85%RH. Then, the presence or absence of corrosion of a copper mesh was confirmed visually, and the following reference|standard evaluated corrosion suppression performance. A result is shown in Table 1.

○ : 구리 메시에 부식이 없었다○: There was no corrosion in the copper mesh

× : 구리 메시에 부식이 있었다x: There was corrosion in the copper mesh

〔시험예 3〕(유전율의 산출) [Test Example 3] (Calculation of dielectric constant)

두께 50㎛의 폴리에틸렌테레프탈레이트 필름의 편면에, 실시예 및 비교예와 마찬가지로 해 두께 100㎛의 점착제층을 형성하고, 그 점착제층에, 두께 50㎛의 폴리에틸렌테레프탈레이트 필름을 첩합한 후, 50㎜×50㎜로 재단했다. 얻어진 적층체에 대해, 임피던스 애널라이저(니혼휴렛팩커드사 제조, 「HP-4194A」)를 사용해 정전 용량(C1)을 측정했다. 또, 상기 두께 50㎛의 폴리에틸렌테레프탈레이트 필름을 2장 겹쳐 50㎜×50㎜로 재단하고, 마찬가지로 하여 정전 용량(C2)를 측정했다. 그리고, C1로부터 C2를 빼서 점착제의 정전 용량(C3)을 산출했다. 이 정전 용량C3에 근거해, 하기 식으로부터 점착제의 유전율εs를 산출했다. 결과를 표 1에 나타낸다.After forming a 100-micrometer-thick adhesive layer on the single side|surface of a 50-micrometer-thick polyethylene terephthalate film like an Example and a comparative example, and bonding a 50-micrometer-thick polyethylene terephthalate film together on the adhesive layer, 50 mm It cut to x50 mm. About the obtained laminated body, the electrostatic capacitance (C1) was measured using the impedance analyzer (The Nippon Hewlett-Packard company make, "HP-4194A"). Moreover, the said 50-micrometer-thick polyethylene terephthalate film overlapped 2 sheets, it cut out to 50 mm x 50 mm, it carried out similarly, and the electrostatic capacitance (C2) was measured. And the electrostatic capacitance (C3) of the adhesive was computed by subtracting C2 from C1. Based on this electrostatic capacitance C3, the dielectric constant ε s of the pressure-sensitive adhesive was calculated from the following formula. A result is shown in Table 1.

εs=(C3×d)/(ε0×S)ε s =(C3×d)/(ε 0 ×S)

εs : 점착제의 유전율ε s : permittivity of adhesive

ε0 : 진공의 유전율(8.854×10-12) ε 0 : permittivity of vacuum (8.854×10 -12 )

C3 : 점착제의 정전 용량 C3: electrostatic capacity of adhesive

S : 점착제층의 면적 S: area of the pressure-sensitive adhesive layer

d : 점착제층의 두께d: the thickness of the pressure-sensitive adhesive layer

상기 결과로부터, 점착제층의 유전율εs가 2.0∼8.0인 것을 양호(○), 8.0 초과인 것을 불량(×)으로 평가했다. 이 평가 결과도 아울러 표 1에 나타낸다.From the above result, the dielectric constant ε s of the pressure-sensitive adhesive layer evaluated a thing of 2.0-8.0 as good (circle) and a thing exceeding 8.0 as bad (x). This evaluation result is also shown in Table 1 collectively.

Figure pat00001
Figure pat00001

표 1로부터 알 수 있는 바와 같이, 실시예에서 얻어진 점착 시트는, 내습열 백화성 및 부식 억제 효과가 우수하고, 또 유전율도 충분히 낮아 양호했다.As Table 1 shows, the adhesive sheet obtained in the Example was excellent in moist-and-heat resistance whitening property and a corrosion inhibitory effect, and also the dielectric constant was low enough and it was favorable.

본 발명에 관련된 점착성 조성물, 점착제 및 점착 시트는, 예를 들어 전극으로서 구리 메시를 사용한 정전 용량 방식의 터치 패널에 바람직하게 사용할 수 있다.The pressure-sensitive adhesive composition, pressure-sensitive adhesive, and pressure-sensitive adhesive sheet according to the present invention can be preferably used for, for example, a capacitive touch panel using a copper mesh as an electrode.

1 : 점착 시트
11 : 점착제층
12a, 12b : 박리 시트
2 : 터치 패널
3 : 표시체 모듈
4 : 점착제층
5a : 제 1 필름 센서
5b : 제 2 필름 센서
51 : 기재 필름
52 : 전극
6 : 커버재
7 : 인쇄층
1: adhesive sheet
11: adhesive layer
12a, 12b: release sheet
2: Touch panel
3: display module
4: adhesive layer
5a: first film sensor
5b: second film sensor
51: base film
52: electrode
6: cover material
7: print layer

Claims (5)

구리를 함유하는 금속 메시의 전극이 형성된 필름 센서와,
상기 필름 센서의 상기 금속 메시와 접촉하도록 배치된 점착제층을 갖고,
상기 점착제층이,
중합체를 구성하는 모노머 단위로서 (메트)아크릴산 2-에틸헥실을 30질량% 이상 함유하고, 호모폴리머로서의 유리 전이 온도가 70℃ 이상인 하드 모노머를 10질량% 이상 함유하고, 수산기를 갖는 모노머를 15질량% 초과 30질량% 이하 함유하고, 카르복실기를 갖는 모노머를 함유하지 않는 (메트)아크릴산에스테르 중합체(A)와,
벤조트리아졸계 방청제(B)
를 함유하는 점착성 조성물을 가교하여 이루어지는 점착제로 이루어지고,
상기 점착제층의 두께가, 25㎛ 이상, 300㎛ 이하인 것을 특징으로 하는 구성체.
A film sensor in which an electrode of a metal mesh containing copper is formed;
a pressure-sensitive adhesive layer disposed in contact with the metal mesh of the film sensor;
The pressure-sensitive adhesive layer,
30% by mass or more of 2-ethylhexyl (meth)acrylic acid as a monomer unit constituting the polymer, 10% by mass or more of a hard monomer having a glass transition temperature of 70° C. or higher as a homopolymer, and 15% by mass of a monomer having a hydroxyl group The (meth)acrylic acid ester polymer (A) which contains more than % and 30 mass % or less and does not contain the monomer which has a carboxyl group;
Benzotriazole rust inhibitor (B)
Consists of a pressure-sensitive adhesive formed by crosslinking the pressure-sensitive adhesive composition containing
A thickness of the pressure-sensitive adhesive layer is 25 µm or more and 300 µm or less.
제 1 항에 있어서, 상기 벤조트리아졸계 방청제(B)로서, 1H-벤조트리아졸, 1H-톨릴트리아졸, 1-[N,N-비스(2-에틸헥실)아미노메틸]벤조트리아졸 및 1-[N,N-비스(2-에틸헥실)아미노메틸]메틸벤조트리아졸로 이루어지는 군에서 선택되는 적어도 1종을 함유하는 것을 특징으로 하는 구성체.The benzotriazole-based rust inhibitor (B) according to claim 1, wherein 1H-benzotriazole, 1H-tolyltriazole, 1-[N,N-bis(2-ethylhexyl)aminomethyl]benzotriazole and 1 A construct comprising at least one selected from the group consisting of -[N,N-bis(2-ethylhexyl)aminomethyl]methylbenzotriazole. 제 1 항에 있어서, 상기 점착성 조성물은, 추가로 가교제(C)를 함유하는 것을 특징으로 하는 구성체.The composition according to claim 1, wherein the pressure-sensitive adhesive composition further contains a crosslinking agent (C). 제 1 항에 있어서, 상기 점착제의 1.0MHz에 있어서의 유전율이 2.0~8.0인 것을 특징으로 하는 구성체.The construct according to claim 1, wherein the pressure-sensitive adhesive has a dielectric constant at 1.0 MHz of 2.0 to 8.0. 제 1 항 내지 제 4 항 중 어느 한 항에 기재된 구성체를 갖는 터치 패널.The touch panel which has the structure in any one of Claims 1-4.
KR1020227034477A 2014-03-28 2014-03-28 Adhesive composition, adhesive agent, and adhesive sheet KR102658943B1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2014/059304 WO2015145767A1 (en) 2014-03-28 2014-03-28 Adhesive composition, adhesive agent, and adhesive sheet
KR1020217012436A KR20210049194A (en) 2014-03-28 2014-03-28 Adhesive composition, adhesive agent, and adhesive sheet

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
KR1020217012436A Division KR20210049194A (en) 2014-03-28 2014-03-28 Adhesive composition, adhesive agent, and adhesive sheet

Publications (2)

Publication Number Publication Date
KR20220140648A true KR20220140648A (en) 2022-10-18
KR102658943B1 KR102658943B1 (en) 2024-04-19

Family

ID=54194351

Family Applications (3)

Application Number Title Priority Date Filing Date
KR1020167029743A KR20160140782A (en) 2014-03-28 2014-03-28 Adhesive composition, adhesive agent, and adhesive sheet
KR1020217012436A KR20210049194A (en) 2014-03-28 2014-03-28 Adhesive composition, adhesive agent, and adhesive sheet
KR1020227034477A KR102658943B1 (en) 2014-03-28 2014-03-28 Adhesive composition, adhesive agent, and adhesive sheet

Family Applications Before (2)

Application Number Title Priority Date Filing Date
KR1020167029743A KR20160140782A (en) 2014-03-28 2014-03-28 Adhesive composition, adhesive agent, and adhesive sheet
KR1020217012436A KR20210049194A (en) 2014-03-28 2014-03-28 Adhesive composition, adhesive agent, and adhesive sheet

Country Status (5)

Country Link
JP (1) JP6093907B2 (en)
KR (3) KR20160140782A (en)
CN (2) CN115322693A (en)
TW (1) TWI668266B (en)
WO (1) WO2015145767A1 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6676429B2 (en) * 2016-03-23 2020-04-08 リンテック株式会社 Adhesive composition, adhesive, adhesive sheet and display
JP6561901B2 (en) * 2016-04-15 2019-08-21 信越化学工業株式会社 Metal surface treatment agent
JP6625927B2 (en) * 2016-04-18 2019-12-25 三菱製紙株式会社 Light transmissive electrode laminate
US10800944B2 (en) * 2016-08-10 2020-10-13 Nitto Denko Corporation Pressure-sensitive adhesive sheet
JP6872869B2 (en) * 2016-08-10 2021-05-19 日東電工株式会社 Adhesive sheet
JP6724767B2 (en) * 2016-12-22 2020-07-15 三菱ケミカル株式会社 Acrylic pressure-sensitive adhesive composition, pressure-sensitive adhesive using the same, pressure-sensitive adhesive sheet, and pressure-sensitive adhesive layer-attached polarizing plate
JP6962411B2 (en) * 2016-12-22 2021-11-05 三菱ケミカル株式会社 An acrylic pressure-sensitive adhesive composition, a pressure-sensitive adhesive using the same, a pressure-sensitive adhesive sheet, and a polarizing plate with a pressure-sensitive adhesive layer.
CN116004127A (en) * 2017-06-23 2023-04-25 三菱化学株式会社 Method for producing laminate for image display device constitution, and method for suppressing corrosion of conductive member
JP7358041B2 (en) * 2018-10-12 2023-10-10 積水化学工業株式会社 Anticorrosive adhesive, anticorrosive adhesive layer, and anticorrosive adhesive tape
US20230203347A1 (en) 2020-03-27 2023-06-29 Nitto Denko Corporation Method for producing pressure-sensitive adhesive sheet, and pressure-sensitive adhesive sheet

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4818236B1 (en) 1969-12-17 1973-06-04
JP5193377B2 (en) * 2011-04-11 2013-05-08 王子ホールディングス株式会社 Double-sided pressure-sensitive adhesive sheet, double-sided pressure-sensitive adhesive sheet with release sheet, and optical laminate
KR20130054200A (en) * 2011-11-15 2013-05-24 닛토덴코 가부시키가이샤 Pressure-sensitive adhesive sheet

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05163473A (en) * 1991-12-17 1993-06-29 Sekisui Chem Co Ltd Tacky agent composition for polyolefin foam and tacky processed product
JP4818236B2 (en) 2007-09-18 2011-11-16 株式会社巴川製紙所 Adhesive sheet and optical filter member using the same
JP2009227851A (en) * 2008-03-24 2009-10-08 Dainippon Printing Co Ltd Adhesive composition for optical filter, and optical filter
JP5525198B2 (en) * 2009-07-16 2014-06-18 大王製紙株式会社 Flame retardant adhesive sheet for electromagnetic shielding film
JP2011168684A (en) * 2010-02-18 2011-09-01 Lintec Corp Adhesive material for optical filter, adhesive, and adhesive sheet
CN102510888B (en) * 2010-08-05 2014-03-12 新塔克化成株式会社 Double-faced pressure-sensitive adhesive sheet, double-faced pressure-sensitive adhesive sheet with release sheet, process for producing same, and transparent laminate
JP5625625B2 (en) * 2010-08-30 2014-11-19 大日本印刷株式会社 Adhesive sheet for metal sticking
JP5630256B2 (en) * 2010-12-24 2014-11-26 Dic株式会社 UV-curable adhesive resin composition, adhesive and laminate
JP2012207055A (en) * 2011-03-29 2012-10-25 Lintec Corp Foil-like adhesive for optical use and adhesive sheet for optical use
WO2012173247A1 (en) * 2011-06-17 2012-12-20 積水化学工業株式会社 Transparent adhesive tape, film laminate with metal thin film, cover panel-touch panel module laminate, cover panel-display panel module laminate, touch panel module-display panel module laminate, and image display device
JP5611129B2 (en) * 2011-06-28 2014-10-22 リンテック株式会社 Adhesive composition, adhesive and adhesive sheet
JP6086761B2 (en) * 2012-03-09 2017-03-01 日本合成化学工業株式会社 Acrylic pressure-sensitive adhesive composition, acrylic pressure-sensitive adhesive, transparent electrode pressure-sensitive adhesive comprising the same, touch panel and image display device
JP5732434B2 (en) * 2012-06-06 2015-06-10 綜研化学株式会社 Adhesive sheet for conductive film, laminate, and touch panel having the laminate
JP6508869B2 (en) * 2013-02-14 2019-05-08 日東電工株式会社 Pressure-sensitive adhesive composition, pressure-sensitive adhesive layer, pressure-sensitive adhesive sheet, optical member, and touch panel

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4818236B1 (en) 1969-12-17 1973-06-04
JP5193377B2 (en) * 2011-04-11 2013-05-08 王子ホールディングス株式会社 Double-sided pressure-sensitive adhesive sheet, double-sided pressure-sensitive adhesive sheet with release sheet, and optical laminate
KR20130054200A (en) * 2011-11-15 2013-05-24 닛토덴코 가부시키가이샤 Pressure-sensitive adhesive sheet

Also Published As

Publication number Publication date
KR20210049194A (en) 2021-05-04
TW201542662A (en) 2015-11-16
CN115322693A (en) 2022-11-11
CN106133100A (en) 2016-11-16
JPWO2015145767A1 (en) 2017-04-13
WO2015145767A1 (en) 2015-10-01
KR102658943B1 (en) 2024-04-19
KR20160140782A (en) 2016-12-07
JP6093907B2 (en) 2017-03-08
TWI668266B (en) 2019-08-11

Similar Documents

Publication Publication Date Title
KR20220140648A (en) Adhesive composition, adhesive agent, and adhesive sheet
CN106103631B (en) Adhesive and adhesive sheet
JP5789350B1 (en) Adhesive sheet and laminate
KR102350143B1 (en) Adhesive and adhesive sheet
KR102215672B1 (en) Double-sided adhesive sheet
KR102498949B1 (en) Adhesive composition, adhesive, adhesive sheet, and display
JP6325653B2 (en) Adhesive composition, adhesive and adhesive sheet
JP2018172537A (en) Adhesive composition, adhesive and adhesive sheet
JP6039451B2 (en) Adhesive for sticking transparent conductive film and adhesive sheet
KR20220136058A (en) Display
KR20190045855A (en) Adhesive sheet and display body
JP6145568B2 (en) Adhesive and adhesive sheet
JP6959749B2 (en) Adhesive sheet and display
KR102350144B1 (en) Adhesive composition, adhesive, adhesive sheet and display element
JP2017160382A (en) Adhesive composition and adhesive sheet
CN111440543B (en) Adhesive composition, adhesive sheet, and display
CN106318284B (en) Migration inhibitor, adhesive and adhesive sheet
JP6227744B2 (en) Adhesive for sticking transparent conductive film and adhesive sheet
KR20220009868A (en) Adhesive composition, adhesive, adhesive sheet, and display
JP2019143039A (en) Adhesive sheet

Legal Events

Date Code Title Description
A107 Divisional application of patent
E902 Notification of reason for refusal
AMND Amendment
E601 Decision to refuse application
AMND Amendment
X701 Decision to grant (after re-examination)
GRNT Written decision to grant