KR20220130387A - Electronic device including connecting member of a shield can - Google Patents

Abstract

The present invention provides an electronic device capable of increasing wiring efficiency while satisfying shield can part protection and noise shielding performance. According to one embodiment of the present invention, the electronic device comprises: a first printed circuit board (PCB) having a structure in which a plurality of conductor layers and a plurality of insulator layers are laminated, and an upper conductor layer and a lower conductor layer are electrically coupled through a via hole penetrating an insulator layer arranged between the plurality of conductor layers; a plurality of pads arranged on the uppermost surface of the first PCB, and electrically coupled to a first conductor layer laminated on the top in the laminated structure of the first PCB; one or more parts electrically coupled to a first pad which is at least one among the plurality of pads; a second PCB arranged on the uppermost surface of the first PCB, and electrically coupled to a second pad which is at least one among the plurality of pads; an outer layer wire laminated between the second pad and the second PCB; a shield can wherein the end of one side thereof is soldered to be electrically coupled to the second PCB, and the end of another side thereof is soldered to the uppermost surface of the first PCB to cover the one or more parts; and a first connector electrically coupled to a third pad which is at least one among the plurality of pads. Various other embodiments identified through the present invention are also possible.

Description

ELECTRONIC DEVICE INCLUDING CONNECTING MEMBER OF A SHIELD CAN

Various embodiments disclosed herein relate to an electronic device including a connecting member of a shield can, and more particularly, to an arrangement structure including a connecting member for connecting the inside and the outside of the shield can will be.

As the utilization of electronic devices such as smart phones increases, electronic devices tend to be miniaturized for easy portability, while their functions are gradually diversified. The electronic device may include a printed circuit board (eg, a printed circuit board (PCB), a printed board assembly (PBA), or a flexible printed circuit board (FPCB)) for mounting various components. The printed circuit board may include a plurality of components (eg, a processor, a memory, a camera, or a communication module) necessary for providing various functions of the electronic device and circuit wiring for electrically connecting these components. In disposing the plurality of components and circuit wiring on the printed circuit board, a protection member shield can may be used to protect some components and shield noise generated by these components.

In order to surface-mount the shield can on the printed circuit board, a pad corresponding to the line of the shield can is formed on the printed circuit board, and the shield can is soldered thereon. . When the shield can is bonded on the printed circuit board, the wiring efficiency may be reduced because the outer layer wiring from the inside of the shield can to the outside (or from the outside to the inside of the shield can) is impossible. For the outer layer wiring, there is a method in which a part of the shield can is opened and the pad in the corresponding section is deleted.

In various embodiments of the present document, by additionally disposing a connection member capable of connecting the inside and the outside of the shield can on the printed circuit board, it is possible to increase wiring efficiency while satisfying the component protection and noise shielding performance of the shield can.

The technical problems to be achieved in the embodiments disclosed in this document are not limited to the technical problems mentioned above, and other technical problems not mentioned are to those of ordinary skill in the art to which the present invention belongs from the description below. can be clearly understood.

In an electronic device according to an embodiment disclosed in this document, a plurality of conductor layers and a plurality of insulator layers are stacked, and an upper conductor is formed through a via hole passing through an insulator layer disposed between the plurality of conductor layers. A first printed circuit board (PCB) having a structure in which a layer and a lower conductor layer are electrically coupled, disposed on an uppermost surface of the first PCB, and stacked on top of the stacked structure of the first PCB a plurality of pads electrically coupled to a conductor layer, one or a plurality of components electrically coupled to a first pad that is at least one of the plurality of pads, disposed on a top surface of the first PCB, the plurality of pads A second PCB electrically coupled to a second pad, which is at least one of the pads of 2 A shield can soldered to be electrically coupled to the PCB, the other end of which is soldered to the top surface of the first PCB, and a first connector electrically coupled to a third pad that is at least one of the plurality of pads can do.

An electronic device according to an embodiment disclosed in this document includes a first printed circuit board (PCB), a plurality of pads disposed on an upper surface of the first PCB, and a first pad that is at least one of the plurality of pads one or a plurality of components electrically coupled to, a second PCB disposed on an upper surface of the first PCB and electrically coupled to a second pad that is at least one of the plurality of pads, the second pad and the The outer layer wiring stacked between the second PCBs, one end is soldered to be electrically coupled to the second PCB so as to cover the one or a plurality of components, and the other end is a shield soldered to the upper surface of the first PCB It may include a can and a first connector electrically coupled to a third pad that is at least one of the plurality of pads.

According to various embodiments disclosed in this document, it is possible to improve wiring efficiency on a printed circuit board while satisfying the component protection and noise shielding performance of the shield can. In addition, it is possible to manufacture more miniaturized and multifunctional electronic devices in accordance with various user needs, thereby increasing user satisfaction.

In addition, various effects directly or indirectly identified through this document may be provided.

1 is a front view of a PCB on which a shield can is disposed, according to an embodiment.
2 is a plan view and a side view of a PCB to which a shield can is bonded, according to an embodiment.
3 is a front view of a PCB on which a connection member PCB of a shield can is disposed, according to an exemplary embodiment.
4A and 4B are front views of a multilayer PCB structure in which a shield can is disposed according to an exemplary embodiment.
5 is a design diagram of a plurality of pads disposed on a lower surface of a connection member PCB according to various embodiments of the present disclosure;
6 is a front view of a PCB to which an outer layer wiring using a connection member PCB of a shield can is applied, according to an exemplary embodiment.
7A and 7B are diagrams illustrating a method in which a connection member PCB is coupled to a shield can using a pad according to an exemplary embodiment.
8 is a view illustrating a method in which a connection member PCB is coupled to a shield can using a clip, according to an embodiment.
9A, 9B, and 9C are front views of a PCB including a connection member PCB on which various types of components are mounted, according to various embodiments of the present disclosure;
10 is a block diagram of an electronic device in a network environment according to an embodiment.
In connection with the description of the drawings, the same or similar reference numerals may be used for the same or similar components.

Hereinafter, various embodiments disclosed in this document will be described with reference to the accompanying drawings. For convenience of description, the size of the components shown in the drawings may be exaggerated or reduced, and the present invention is not necessarily limited to the illustrated bar.

The electronic device according to various embodiments disclosed in this document may be a device of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as "first", "second", or "first" or "second" may simply be used to distinguish an element from other elements in question, and may refer elements to other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of the present document may include a unit implemented in hardware, software, or firmware, for example, and interchangeably with terms such as logic, logic block, component, or circuit. can be used A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to an embodiment, the method according to various embodiments disclosed in this document may be provided by being included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, module or program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

1 is a front view of a printed circuit board (PCB) on which a shield can is disposed, according to an exemplary embodiment. 2 is a plan view and a side view of a PCB to which a shield can is bonded, according to an embodiment.

Referring to FIG. 1 , an electronic device 100 may include a PCB 110 on which a plurality of components are mounted to provide various functions required for a mobile terminal. The PCB 110 may include circuit wires electrically connecting the plurality of components. According to various embodiments of the present disclosure, at least some of the plurality of components mounted on the PCB 110 ( 111 , 112 , 113 , 114 ) may be covered by a shield can 120 which is a protection member. have. For example, in the case of an IC-type component such as a processor (eg, an application processor (AP), a communication processor (CP)), a memory, or a power management integrated circuit (PMIC), the shield can 120 is used to protect the other components. It can protect the parts from radio interference or external impact and shield the noise generated by these parts. For another example, in the case of modules requiring a high current in the electronic device 100 (eg, near field communication (NFC), magnetic secure transmission (MST), or direct charge), the PCB wiring is thick and It may generate noise to negatively affect other components, and may be disposed in the shield can 120 .

In an embodiment, the PCB 110 may include one or more connectors 130 for electrically connecting various circuit wires and components. According to various embodiments of the present disclosure, one or more connectors 130 may be disposed outside the shield can 120 .

In an embodiment, the shield can 120 may be bonded to the upper surface of the PCB 110 using a pad. Referring to FIG. 2 , one or more pads 141 , 142 , 143 corresponding to the lines of the shield can 120 are formed on the upper surface of the PCB 110 , and the shield can 120 is soldered on the formed pads. In this way, the shield can 120 may be bonded to the PCB 110 . In an embodiment, since the shield can 120 serves to protect the components 111 , 112 , 113 , and 114 mounted therein from the outside, it may be connected to the ground terminal of the PCB 110 , and the shield The pads 141 , 142 , and 143 formed to correspond to the line of the can 120 may also be connected to the ground terminal. Due to this, the wiring between the inside and the outside of the shield can 120 on the upper surface of the PCB 110 may be limited.

In an embodiment, a portion of the area corresponding to the line of the shield can 120 may be opened for wiring between the inside and the outside of the shield can 120 , and the pad in the corresponding section may be removed. For example, a section in which the pad 141 is formed among the one or more pads 141 , 142 , and 143 formed along the line of the shield can 120 may be opened and the pad 141 may be removed. In this case, wiring between the inside and the outside of the shield can 120 may be possible through the stretched space 144 of the shield can 120 from which the pad 141 is removed, but it is mounted inside the shield can 120 . Noise generated by at least one of the components 111 , 112 , 113 , and 114 may be emitted to the outside of the shield can 120 through the space 144 .

3 is a front view of a PCB on which a connection member PCB of a shield can is disposed, according to an exemplary embodiment.

In one embodiment, the PCB 110 may include a conductor layer and an insulator layer. A plurality of pads may be disposed on the upper surface of the PCB 110 to be electrically coupled to the conductive layer of the PCB 110 . The plurality of components 111 , 112 , 113 , and 114 mounted on the PCB 110 and the connector 130 may be electrically coupled to at least one of the plurality of pads. According to various embodiments of the present disclosure, at least some of the plurality of parts may be covered by the shield can 120 . The shield can 120 may be coupled to the PCB 110 through at least one of the plurality of pads, and the at least one pad may be connected to a ground terminal of the PCB 110 . In addition, one or more connectors 130 for electrically connecting various circuit wires and components may be disposed on the PCB 110 . The one or more connectors 130 may be electrically coupled to the PCB 110 through at least one of the plurality of pads.

Referring to FIG. 3 , for the outer layer wiring from the inside to the outside of the shield can 120 or from the outside to the inside of the shield can 120 , the connection member PCB 310 is additionally disposed on the PCB 110 . can The connection member PCB 310 may be electrically coupled to the PCB 110 or the shield can 120 through at least one of the plurality of pads. According to various embodiments of the present disclosure, one end of the shield can 120 is soldered to the upper surface of the PCB 110 , and the other end of the shield can 120 is electrically coupled to the connection member PCB 310 . can be soldered. Among the pads formed along the line of the shield can 120 , at least some of the pads corresponding to a section requiring an outer layer wiring between the inside and the outside of the shield can 120 are removed, and the at least some of the pads are removed. A connection member PCB 310 may be disposed on the . According to various embodiments of the present disclosure, at least one of a connector, various electronic component modules including IC-type components, or another shield can may be disposed on the upper surface of the connection member PCB 310 . By additionally disposing the connection member PCB 310 , the outer layer wiring, which was previously limited between the inside and the outside of the shield can 120 due to the ground connection of the shield can 120 , can be made possible.

4A and 4B are front views of a multilayer PCB structure in which a shield can is disposed according to an exemplary embodiment.

In an embodiment, the electronic device 100 may employ the PCB 200 having a multilayer structure. 4A and 4B , the PCB 200 having a multilayer structure may have a structure in which a plurality of conductor layers and a plurality of insulator layers are stacked. For example, copper (CU) 220 and preimpregnated materials (PPG) 230 are alternately laminated on a copper clad laminate (CCL) 210 , and a PPG layer is disposed between the plurality of CU layers. A via 240 passing therethrough may be disposed. The upper CU layer and the lower CU layer of the PCB 200 may be electrically coupled through a via 240 . A plurality of pads 252 plated with gold may be formed on the uppermost surface of the PCB 200 as an outer layer. Various electronic components may be mounted on the PCB 200 through the plurality of pads. The outer layer of the PCB 200 may be coated with a photo imageable solder resist (PSR) 251 to prevent corrosion of the CU layer 220 . In the case of using the multi-layered PCB 200 , as the number of stacked layers decreases, the manufacturing cost may be reduced, and thus a wiring method that increases wiring efficiency while reducing the number of stacking may be required.

In FIG. 4A , one or more components 111 and 112 and a connector 130 may be disposed on the uppermost surface of the multi-layered PCB 200 . According to an embodiment, the one or more components 111 and 112 may be covered and protected by the shield can 120 . The connector 130 that does not require protection (or does not significantly affect noise generation) may be disposed outside the shield can 120 . The shield can 120 may be soldered to the uppermost surface of the PCB 200 through a pad connected to the ground terminal of the PCB 200 . For this reason, the outer layer wiring between the inside and the outside of the shield can 120 is impossible. For example, in order to connect the component 112 mounted inside the shield can 120 with the connector 130 disposed outside the shield can 120 , a conductive layer on the uppermost surface and a via 240 hole are formed. The connector 130 connection wiring 410 may be formed on the lower conductive layer electrically coupled thereto. When the outer layer wiring for connecting the inside and the outside of the shield can 120 is limited as shown in FIG. 4A , there is a limit to reducing the number of stacks in the PCB 200 having a multilayer structure, and wiring efficiency may be reduced. In order to solve this problem, the connection member PCB 400 may be additionally disposed on the uppermost surface of the PCB 200 as shown in FIG. 4B .

Referring to FIG. 4B , one or more components 111 and 112 , a shield can 120 , a connector 130 , a plurality of pads 252 or a connection member PCB 400 are disposed on the uppermost surface of the PCB 200 . can be placed. The one or more components 111 and 112 may be electrically coupled to at least one first pad among the plurality of pads. The shield can 120 covers one or more components 111 and 112 so that one end is soldered through a pad connected to the ground terminal of the PCB 200 and the other end is electrically coupled to the connection member PCB 400 . can be soldered. The connection member PCB 400 may be electrically coupled to at least one second pad among the plurality of pads. An outer layer wiring 420 may be stacked between the at least one second pad and the connection member PCB 400 to electrically connect the inside and the outside of the shield can 120 . At least one of the pads electrically coupled to the connection member PCB 400 may be connected to a ground terminal of the PCB 200 . The connector 130 disposed outside the shield can 120 may be electrically coupled to at least one third pad among the plurality of pads. According to various embodiments of the present disclosure, the component 112 mounted inside the shield can 120 is on the uppermost surface of the PCB 200 in order to connect with the connector 130 disposed outside the shield can 120 . The formed outer layer wiring 420 may be used. When the connecting member PCB 400 is additionally disposed, an outer layer wiring connecting the inside and the outside of the shield can 120 on the top surface of the PCB 200 becomes possible, thereby protecting the components of the shield can 120 or shielding from noise. Wiring efficiency can be increased while maintaining performance.

5 is a design diagram of a plurality of pads disposed on a lower surface of the connection member PCB 400 according to various embodiments of the present disclosure.

Referring to FIG. 5 , the connection member PCB 400 connecting the inside and the outside of the shield can 120 may be designed in various shapes. A plurality of pads for electrical connection with the main PCB (eg, the PCB 100 of FIG. 3 ) or the multilayer PCB (eg, the PCB 200 of the multilayer structure of FIGS. 4A and 4B ) on the lower surface of the connection member PCB 400 ) 510 may be combined. At least one of the plurality of pads 510 may be connected to a ground terminal of the main PCB or the multilayer PCB. In an embodiment, an outer layer wiring for connecting the inside and the outside of the shield can 120 may be stacked between the connecting member PCB 400 and the plurality of pads 510 . In an embodiment, the connection member PCB 400 may be implemented as a PCB having a multi-layer structure.

According to various embodiments of the present disclosure, IC-like components such as over voltage protection (OVP) IC, wireless charging IC, NFC, or MST may require a large current and generate noise, can be mounted. Components mounted inside the shield can 120 are of various types, and there are many signals to be exchanged with the components disposed outside the shield can 120 . For example, components mounted inside the shield can 120 may be connected through the connector 130 outside the shield can 120 for signal exchange with a battery, a charging module, or an antenna. When the connection member PCB 400 is additionally disposed, an outer layer wiring for the signals is possible through the connection member PCB 400 , so that wiring efficiency may be further improved.

6 is a front view of a PCB to which an outer layer wiring using a connection member PCB of a shield can is applied, according to an exemplary embodiment.

Referring to FIG. 6 , a plurality of components 611 , 612 , 613 , a shield can 620 , a connector 630 , a second PCB 640 , and a plurality of pads on the upper surface of the first PCB 610 . The ones 651 , 652 , 653 , 654 , 655 , and 656 or a plurality of outer layer wirings 661 , 662 , 663 , and 664 may be disposed.

In one embodiment, the plurality of components 611, 612, and 613 are IC-type components that may act as a noise source by requiring a large current (or need to be protected from radio wave interference or external impact), and may include a shield can ( 620) can be covered and protected. According to an embodiment, the connector 630 that is irrelevant to noise generation or does not require protection may be disposed outside the shield can 620 .

In an embodiment, one end of the shield can 620 may be soldered to the upper surface of the first PCB 610 so as to cover the one or more components 611 , 612 , and 613 . The other end of the shield can 620 may be soldered to be electrically coupled to the second PCB 640 .

In an embodiment, the second PCB 640 may be electrically coupled to the plurality of pads 651 , 652 , 653 , 654 , 655 , and 656 . A plurality of pads 651 , 652 , 653 , 654 , 655 , and 656 may be electrically coupled to the upper conductor layer of the first PCB 610 , and at least one of the pads may be electrically coupled to the first PCB 610 . It can be connected to the ground terminal of The plurality of outer layer wirings 661 , 662 , 663 , and 664 are stacked between the second PCB 640 and the plurality of pads 651 , 652 , 653 , 654 , 655 , and 656 to form the shield can 620 . An electrical connection may be provided between the components 611 , 612 , and 613 mounted therein and the connector 630 disposed outside the shield can 620 .

According to various embodiments of the present disclosure, the second PCB 640 may have a multilayer PCB structure in which a plurality of conductor layers and a plurality of insulator layers are alternately stacked. In this case, the outer layer wirings 661 , 662 , 663 , and 664 may be electrically connected to another layer of the second PCB 640 through vias passing through the inner layer of the second PCB 640 .

7A and 7B are diagrams illustrating a method in which a connection member PCB is coupled to a shield can using a pad according to an exemplary embodiment.

Referring to FIG. 7A , a connection member added for connection between the components 111 , 112 , 113 , 114 mounted inside the shield can 120 and the connector 130 disposed outside the shield can 120 . The PCB 400 may be bonded to the shield can 120 using the pad 710 . In an embodiment, the connection member PCB 400 may be implemented to shield the open space of the shield can 120 . In a method of forming a pad 710 in a portion of the connecting member PCB 400 in contact with the shield can 120 and soldering one end of the shield can 120 on the formed pad 710 , the shield can 120 ) of the open space can be shielded. The pad 710 to which the shield can 120 is to be bonded on the connection member PCB 400 may be formed by bonding gold plating to one side of the connection member PCB 400 as shown in FIG. 7B .

8 is a view illustrating a method in which a connection member PCB is coupled to a shield can using a clip, according to an embodiment.

Referring to FIG. 8 , a shield can clip 810 for connection to the shield can 120 may be disposed on the upper surface of the connection member PCB 400 . According to various embodiments of the present disclosure, the shield can clip 810 may be manufactured to facilitate coupling and separation between the connection member PCB 400 and the shield can 120 .

9A, 9B, and 9C are front views of a PCB including a connection member PCB on which various types of components are mounted, according to various embodiments of the present disclosure;

9A, 9B and 9C, at least some of the plurality of components mounted on the PCB 110 (111, 112, 113, 114) may be protected by the shield can 120 as a protection member. have. According to various embodiments of the present disclosure, at least some of the components 111 , 112 , 113 and 114 need to be protected from radio wave interference or external shock, or require a large current to generate noise. can be The connector 130 that does not affect the generation of noise may be disposed outside the shield can 120 . In an embodiment, the PCB 110 may further include a connection member PCB 900 for electrical connection 9 between the inside and the outside of the shield can 120 . The connection member PCB 900 may be coupled to the shield can 120 using a pad 910 or a shield can clip formed on the upper surface of the connection member PCB.

According to various embodiments of the present disclosure, various types of components may be mounted on the upper surface of the connection member PCB 900 . For example, as shown in FIG. 9A or FIG. 9B , another connector 920 or an IC-like component 930 may be disposed on the upper surface of the connection member PCB 900 . For another example, another IC component 930 and a shield can 940 for protecting the same may be additionally disposed on the upper surface of the connection member PCB 900 .

10 is a diagram illustrating an electronic device in the network environment 1000 according to an embodiment.

Referring to FIG. 10 , in a network environment 1000 , the electronic device 1001 communicates with the electronic device 1002 through a first network 1098 (eg, a short-range wireless communication network) or a second network 1099 . It may communicate with at least one of the electronic device 1004 and the server 1008 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 1001 may communicate with the electronic device 1004 through the server 1008 . According to an embodiment, the electronic device 1001 includes a processor 1020 , a memory 1030 , an input module 1050 , a sound output module 1055 , a display module 1060 , an audio module 1070 , and a sensor module ( 1076), interface 1077, connection terminal 1078, haptic module 1079, camera module 1080, power management module 1088, battery 1089, communication module 1090, subscriber identification module 1096 , or an antenna module 1097 . In some embodiments, at least one of these components (eg, the connection terminal 1078 ) may be omitted or one or more other components may be added to the electronic device 1001 . In some embodiments, some of these components (eg, sensor module 1076 , camera module 1080 , or antenna module 1097 ) are integrated into one component (eg, display module 1060 ). can be

The processor 1020, for example, executes software (eg, a program 1040) to execute at least one other component (eg, a hardware or software component) of the electronic device 1001 connected to the processor 1020. It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 1020 may store a command or data received from another component (eg, the sensor module 1076 or the communication module 1090) into the volatile memory 1032 . may store the command or data stored in the volatile memory 1032 , and store the result data in the non-volatile memory 1034 . According to an embodiment, the processor 1020 is a main processor 1021 (eg, a central processing unit or an application processor) or a secondary processor 1023 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 1001 includes the main processor 1021 and the auxiliary processor 1023 , the auxiliary processor 1023 uses less power than the main processor 1021 or is set to be specialized for a specified function. can The auxiliary processor 1023 may be implemented separately from or as a part of the main processor 1021 .

The coprocessor 1023 is, for example, on behalf of the main processor 1021 while the main processor 1021 is in an inactive (eg, sleep) state, or the main processor 1021 is active (eg, executing an application). ), together with the main processor 1021, at least one of the components of the electronic device 1001 (eg, the display module 1060, the sensor module 1076, or the communication module 1090) It is possible to control at least some of the related functions or states. According to an embodiment, the coprocessor 1023 (eg, image signal processor or communication processor) may be implemented as part of another functionally related component (eg, camera module 1080 or communication module 1090). have. According to an embodiment, the auxiliary processor 1023 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 1001 itself on which the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 1008). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted Boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The artificial intelligence model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 1030 may store various data used by at least one component of the electronic device 1001 (eg, the processor 1020 or the sensor module 1076 ). The data may include, for example, input data or output data for software (eg, the program 1040 ) and instructions related thereto. The memory 1030 may include a volatile memory 1032 or a non-volatile memory 1034 .

The program 1040 may be stored as software in the memory 1030 , and may include, for example, an operating system 1042 , middleware 1044 , or an application 1046 .

The input module 1050 may receive a command or data to be used in a component (eg, the processor 1020 ) of the electronic device 1001 from the outside (eg, a user) of the electronic device 1001 . The input module 1050 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 1055 may output a sound signal to the outside of the electronic device 1001 . The sound output module 1055 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display module 1060 may visually provide information to the outside (eg, a user) of the electronic device 1001 . The display module 1060 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the corresponding device. According to an embodiment, the display module 1060 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 1070 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 1070 acquires a sound through the input module 1050 or an external electronic device (eg, a sound output module 1055 ) directly or wirelessly connected to the electronic device 1001 . The electronic device 1002) (eg, a speaker or headphones) may output a sound.

The sensor module 1076 detects an operating state (eg, power or temperature) of the electronic device 1001 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 1076 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 1077 may support one or more specified protocols that may be used for the electronic device 1001 to directly or wirelessly connect with an external electronic device (eg, the electronic device 1002 ). According to an embodiment, the interface 1077 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 1078 may include a connector through which the electronic device 1001 can be physically connected to an external electronic device (eg, the electronic device 1002 ). According to an embodiment, the connection terminal 1078 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 1079 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 1079 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 1080 may capture still images and moving images. According to an embodiment, the camera module 1080 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 1088 may manage power supplied to the electronic device 1001 . According to an embodiment, the power management module 1088 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 1089 may supply power to at least one component of the electronic device 1001 . According to an embodiment, the battery 1089 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 1090 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 1001 and an external electronic device (eg, the electronic device 1002, the electronic device 1004, or the server 1008). It can support establishment and communication performance through the established communication channel. The communication module 1090 may include one or more communication processors that operate independently of the processor 1020 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 1090 is a wireless communication module 1092 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 1094 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 1098 (eg, a short-range communication network such as Bluetooth, wireless fidelity (Wi-Fi) direct, or infrared data association (IrDA)) or a second network 1099 (eg, : It is possible to communicate with the external electronic device 1004 through a legacy cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunication network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 1092 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 1096 within a communication network, such as the first network 1098 or the second network 1099 . The electronic device 1001 may be identified or authenticated.

The wireless communication module 1092 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 1092 may support a high frequency band (eg, mmWave band) to achieve a high data rate. The wireless communication module 1092 uses various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 1092 may support various requirements specified in the electronic device 1001 , an external electronic device (eg, the electronic device 1004 ), or a network system (eg, the second network 1099 ). According to an embodiment, the wireless communication module 1092 includes a peak data rate (eg, 20 Gbps or more) for realization of eMBB, loss coverage (eg, 164 dB or less) for realization of mMTC, or U-plane latency (for URLLC realization) ( Example: Downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) can be supported.

The antenna module 1097 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 1097 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 1097 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication scheme used in a communication network such as the first network 1098 or the second network 1099 is selected from the plurality of antennas by, for example, the communication module 1090 . can be A signal or power may be transmitted or received between the communication module 1090 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 1097 .

According to various embodiments, the antenna module 1097 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a specified high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side surface) of the printed circuit board and capable of transmitting or receiving a signal of the designated high frequency band. have.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, a command or data may be transmitted or received between the electronic device 1001 and the external electronic device 1004 through the server 1008 connected to the second network 1099 . Each of the external electronic devices 1002 and 1004 may be the same as or different from the electronic device 1001 . According to an embodiment, all or a part of operations executed by the electronic device 1001 may be executed by one or more of the external electronic devices 1002 , 1004 , or 1008 . For example, when the electronic device 1001 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 1001 performs the function or service by itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 1001 . The electronic device 1001 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this purpose, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 1001 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 1004 may include an Internet of things (IoT) device. The server 1008 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 1004 or the server 1008 may be included in the second network 1099 . The electronic device 1001 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

In the electronic device according to an embodiment, a plurality of conductor layers and a plurality of insulator layers are stacked, and an upper conductor layer and a lower conductor layer are formed through a via hole passing through an insulator layer disposed between the plurality of conductor layers. A first printed circuit board (PCB) having a structure in which the layers are electrically coupled, disposed on the uppermost surface of the first PCB, and electrically with a first conductor layer stacked on top in the stacked structure of the first PCB a plurality of pads coupled to each other, one or a plurality of components electrically coupled to a first pad that is at least one of the plurality of pads, disposed on the uppermost surface of the first PCB, and at least one of the plurality of pads A second PCB electrically coupled to a single second pad, an outer layer wiring stacked between the second pad and the second PCB, and one end of the second PCB and the second PCB are electrically covered so as to cover the one or a plurality of components A shield can soldered to be coupled and the other end thereof is soldered to the uppermost surface of the first PCB, and a first connector electrically coupled to a third pad that is at least one of the plurality of pads.

In one embodiment, the second PCB may be designed in the form of a multi-layer PCB.

In an embodiment, at least one of the plurality of pads electrically coupled to the second PCB may be connected to a ground terminal of the first PCB.

In an embodiment, the one end of the shield can may be soldered to be electrically coupled to the second PCB through a pad.

In an embodiment, a clip for connecting to the shield can may be disposed on the upper surface of the second PCB.

In an embodiment, a second connector may be disposed on the upper surface of the second PCB.

In an embodiment, an IC may be disposed on the upper surface of the second PCB.

In an embodiment, a second shield can may be installed on the upper surface of the second PCB to cover the IC.

An electronic device according to another embodiment includes a first printed circuit board (PCB), a plurality of pads disposed on an upper surface of the first PCB, and a first pad electrically coupled to at least one of the plurality of pads. One or a plurality of components, a second PCB disposed on the upper surface of the first PCB and electrically coupled to a second pad that is at least one of the plurality of pads, and between the second pad and the second PCB A shield can having one end soldered to be electrically coupled to the second PCB and the other end soldered to the upper surface of the first PCB so as to cover the laminated outer layer wiring, the one or the plurality of components, and the plurality of and a first connector electrically coupled to a third pad that is at least one of the pads.

In an embodiment, at least one of the plurality of pads electrically coupled to the second PCB may be connected to a ground terminal of the first PCB.

In an embodiment, the one end of the shield can may be soldered to be electrically coupled to the second PCB through a pad.

In an embodiment, a clip for connecting to the shield can may be disposed on the upper surface of the second PCB.

In one embodiment, the second PCB may be designed in the form of a multi-layer PCB.

In an embodiment, a second connector may be disposed on the upper surface of the second PCB.

In an embodiment, an IC may be disposed on the upper surface of the second PCB.

In an embodiment, a second shield can may be installed on the upper surface of the second PCB to cover the IC.

The electronic device according to various embodiments disclosed in this document may be a device of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to the embodiment of the present document is not limited to the above-described devices.

The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. As used herein, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C," "at least one of A, B and C," and "A , B, or C," each of which may include any one of the items listed together in the corresponding one of the phrases, or all possible combinations thereof. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to those components in other aspects (e.g., importance or order) is not limited. It is said that one (eg, first) component is “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When referenced, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

As used herein, the term “module” may include a unit implemented in hardware, software, or firmware, and may be used interchangeably with terms such as, for example, logic, logic block, component, or circuit. A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present document, one or more instructions stored in a storage medium (eg, internal memory 1036 or external memory 1038) readable by a machine (eg, electronic device 1001) may be implemented as software (eg, a program 1040) including For example, a processor (eg, processor 1020 ) of a device (eg, electronic device 1001 ) may call at least one command among one or more commands stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the called at least one command. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, "non-transitory" only means that the storage medium is a tangible device and does not include a signal (eg, electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments disclosed in this document may be provided by being included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a device-readable storage medium (eg compact disc read only memory (CD-ROM)), or through an application store (eg Play Store™) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly, online between smartphones (eg: smartphones). In the case of online distribution, at least a portion of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities. According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

Claims (16)

In an electronic device,
A plurality of conductor layers and a plurality of insulator layers are stacked, and the upper conductor layer and the lower conductor layer are electrically coupled through a via hole passing through the insulator layer disposed between the plurality of conductor layers. a first printed circuit board (PCB);
a plurality of pads disposed on the uppermost surface of the first PCB and electrically coupled to the first conductor layer stacked on the top in the stacked structure of the first PCB;
one or a plurality of components electrically coupled to a first pad that is at least one of the plurality of pads;
a second PCB disposed on an uppermost surface of the first PCB and electrically coupled to a second pad that is at least one of the plurality of pads;
an outer layer wiring stacked between the second pad and the second PCB;
a shield can having one end soldered to be electrically coupled to the second PCB and the other end soldered to the uppermost surface of the first PCB so as to cover the one or the plurality of components; and
and a first connector electrically coupled to a third pad that is at least one of the plurality of pads. According to claim 1,
The second PCB is an electronic device designed in the form of a multilayer PCB. According to claim 1,
At least one of the plurality of pads electrically coupled to the second PCB is connected to a ground terminal of the first PCB. According to claim 1,
The electronic device is soldered so that the one end of the shield can is electrically coupled to the second PCB through a pad. According to claim 1,
An electronic device having a clip disposed on an upper surface of the second PCB to connect to the shield can. According to claim 1,
An electronic device having a second connector disposed on an upper surface of the second PCB. According to claim 1,
An electronic device in which an IC is disposed on the upper surface of the second PCB 8. The method of claim 7,
An electronic device in which a second shield can is installed on an upper surface of the second PCB to cover the IC. In an electronic device,
a first printed circuit board (PCB);
a plurality of pads disposed on an upper surface of the first PCB;
one or a plurality of components electrically coupled to a first pad that is at least one of the plurality of pads;
a second PCB disposed on an upper surface of the first PCB and electrically coupled to a second pad that is at least one of the plurality of pads;
an outer layer wiring stacked between the second pad and the second PCB;
a shield can having one end soldered to be electrically coupled to the second PCB and the other end soldered to the upper surface of the first PCB so as to cover the one or more components; and
and a first connector electrically coupled to a third pad that is at least one of the plurality of pads. 10. The method of claim 9,
At least one of the plurality of pads electrically coupled to the second PCB is connected to a ground terminal of the first PCB. 10. The method of claim 9,
The electronic device is soldered so that the one end of the shield can is electrically coupled to the second PCB through a pad. 10. The method of claim 9,
An electronic device having a clip disposed on an upper surface of the second PCB to connect to the shield can. 10. The method of claim 9,
The second PCB is an electronic device designed in the form of a multilayer PCB. 10. The method of claim 9,
An electronic device having a second connector disposed on an upper surface of the second PCB. 10. The method of claim 9,
An electronic device in which an IC is disposed on the upper surface of the second PCB. 16. The method of claim 15,
An electronic device in which a second shield can is installed on an upper surface of the second PCB to cover the IC.

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