KR20210102044A - Rigid-Flexible Printed Circuit Board And Electronic device using the same - Google Patents

Abstract

Various embodiments of the present invention relate to a rigid-flexible printed circuit board and an electronic device comprising the same. The electronic device comprises: a housing; a first module placed in one area of the housing; a second module placed in another area of the housing by being apart from the first module; and the rigid-flexible printed circuit board electrically connecting the first module to the second module. The rigid-flexible printed circuit board can include: a rigid area; a flexible area engaged with the rigid area to be overlapped with the rigid area for some parts; and a protective layer which covers at least a part of the engaged part by a designated level and is laminated on at least one place among an upper end and a lower end of the flexible area so that the engaged part of the rigid area and the flexible area can have a designated amount or greater of tensile strength when the flexible area is bent. Various embodiments are possible. The present invention aims to provide a rigid-flexible printed circuit board and an electronic device comprising the same, which are able to improve the strength of the engagement part between a rigid area and a flexible area.

Description

Rigid-Flexible Printed Circuit Board And Electronic device using the same

Various embodiments of the present disclosure relate to a flexible printed circuit board and an electronic device including the same.

Electronic devices (eg, a mobile terminal, a smart phone, or a wearable device) may provide various functions. For example, in addition to the basic voice communication function, a smart phone has a short-range wireless communication (eg, Bluetooth, Wi-Fi, or near field communication) function, mobile communication (3G (generation), 4G, 5G, etc.) function, a music or video playback function, a shooting function, or a navigation function may be provided.

Meanwhile, recent electronic devices may include a plurality of components (eg, one or more printed circuit boards, one or more displays, one or more cameras, or one or more sensor modules). The components may be connected using various means (eg, a cable or a flexible printed circuit board (FPCB)). As another example, the components may be connected using a rigid-FPCB (R-FPCB).

In a rigid printed circuit board, stress may occur at the bonding site between the flexible area and the rigid area during bending of the flexible area, and the stress may cause breakage (eg, tear) and/or fracture (eg, hard part) at the bonding site. lifting/lifting) may occur.

Various embodiments of the present disclosure may provide a flexible printed circuit board capable of improving the strength of a bonding portion between the rigid region and the flexible region, and an electronic device including the same.

The technical problems to be achieved in the present disclosure are not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. There will be.

An electronic device according to various embodiments of the present disclosure may include, for example, a housing; a first module disposed in an area of the housing; a second module spaced apart from the first module and disposed in another area of the housing; and a rigid printed circuit board electrically connecting the first module and the second module, wherein the flexible printed circuit board includes: a rigid region; a flexible region coupled to the hard region so that the hard region and a partial region overlap; and covering at least a portion of the bonding area with a specified value so that, when bending the flexible area, the bonding area between the hard area and the flexible area has a tensile strength greater than or equal to a specified size, the upper or lower end of the flexible area It may include a protective layer laminated on at least one of the.

An electronic device according to various embodiments of the present disclosure may include, for example, a housing; a first module disposed in an area of the housing; a second module spaced apart from the first module and disposed in another area of the housing; and a rigid printed circuit board electrically connecting the first module and the second module, wherein the flexible printed circuit board includes: a rigid region; a flexible region coupled to the hard region so that the hard region and a partial region overlap; and covering at least a portion of a bonding portion of the flexible region and the rigid region, laminated on at least one of an upper end or a lower end of the flexible region, and in a direction substantially perpendicular to the bending direction when the flexible region is bent and a protective layer having a length greater than a minimum length between the lowest points of the binding sites.

A rigid printed circuit board electrically connecting a first module and a second module according to various embodiments of the present disclosure may include, for example, a rigid region; a flexible region coupled to the hard region so that the hard region and a partial region overlap; and covering at least a portion of the bonding portion with a specified value so that the bonding portion between the rigid region and the flexible region has a tensile strength greater than or equal to a specified size when the flexible region is bent, either at the upper end or the lower end of the flexible region. It may include a protective layer laminated on at least one place.

Various embodiments of the present disclosure may prevent breakage and/or breakage of the bonding portion of the rigid printed circuit board due to bending stress by supplementing the rigidity of the bonding portion. In addition, various embodiments of the present disclosure may reduce the defect rate of the electronic device due to breakage and/or breakage of the rigid printed circuit board.

Effects obtainable in the present disclosure are not limited to the above-mentioned effects, and other effects not mentioned may be clearly understood by those of ordinary skill in the art to which the present disclosure belongs from the description below. will be.

1 is a block diagram of an electronic device in a network environment, according to an embodiment of the present disclosure.
2A is a diagram illustrating an electronic device including a flexible printed circuit board according to an embodiment of the present disclosure.
2B is a diagram illustrating an example in which a flexible printed circuit board of an electronic device is bent according to an embodiment of the present disclosure.
3A is a diagram illustrating an electronic device including a flexible printed circuit board according to another embodiment of the present disclosure.
3B is a diagram illustrating an electronic device including a flexible printed circuit board according to another embodiment of the present disclosure.
3C is a diagram illustrating an electronic device including a flexible printed circuit board according to another embodiment of the present disclosure.
4 is a cross-sectional view of a coupling portion of a flexible printed circuit board according to an embodiment of the present disclosure.
5 is an exploded perspective view of a flexible printed circuit board according to an embodiment of the present disclosure;
6A is a diagram illustrating an example in which a protective layer is stacked on a flexible region according to an embodiment of the present disclosure.
6B is a diagram illustrating another example in which a protective layer is stacked on a flexible region according to an embodiment of the present disclosure.
6C is a diagram illustrating another example in which a protective layer is stacked on a flexible region according to an embodiment of the present disclosure.
7 is a diagram illustrating another example in which a protective layer is stacked on a flexible region according to an embodiment of the present disclosure.
8 is a diagram illustrating another example in which a protective layer is stacked on a flexible region according to an embodiment of the present disclosure.
9 is a cross-sectional view of a coupling portion of a flexible printed circuit board according to another embodiment of the present disclosure.
10 is a cross-sectional view of a coupling portion of a rigid printed circuit board according to another embodiment of the present disclosure.

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. In the present disclosure, specific embodiments are illustrated in the drawings and the related detailed description is described, but this is not intended to limit the various embodiments of the present disclosure to a specific form. For example, it is apparent to those of ordinary skill in the art to which the present disclosure pertains that the embodiments of the present disclosure may be variously changed.

1 is a block diagram of an electronic device 101 in a network environment 100 according to various embodiments of the present disclosure.

Referring to FIG. 1 , in a network environment 100 , an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or a second network 199 . It may communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120 , a memory 130 , an input module 150 , a sound output module 155 , a display module 160 , an audio module 170 , and a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or an antenna module 197 . In some embodiments, at least one of these components (eg, the connection terminal 178 ) may be omitted or one or more other components may be added to the electronic device 101 . In some embodiments, some of these components (eg, sensor module 176 , camera module 180 , or antenna module 197 ) are integrated into one component (eg, display module 160 ). can be

The processor 120, for example, executes software (eg, the program 140) to execute at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120 . It can control and perform various data processing or operations. According to an embodiment, as at least part of data processing or operation, the processor 120 converts a command or data received from another component (eg, the sensor module 176 or the communication module 190 ) to the volatile memory 132 . may be stored in the volatile memory 132 , and may process commands or data stored in the volatile memory 132 , and store the result data in the non-volatile memory 134 . According to an embodiment, the processor 120 is a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) a neural processing unit (NPU), an image signal processor, a sensor hub processor, or a communication processor). For example, when the electronic device 101 includes the main processor 121 and the sub-processor 123 , the sub-processor 123 uses less power than the main processor 121 or is set to be specialized for a specified function. can The auxiliary processor 123 may be implemented separately from or as a part of the main processor 121 .

The auxiliary processor 123 may be, for example, on behalf of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or when the main processor 121 is active (eg, executing an application). ), together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to an embodiment, the auxiliary processor 123 (eg, an image signal processor or a communication processor) may be implemented as a part of another functionally related component (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. Artificial intelligence models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself on which artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning, or reinforcement learning, but in the above example not limited The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the above, but is not limited to the above example. The AI model may include, in addition to, or alternatively, a software structure in addition to the hardware structure.

The memory 130 may store various data used by at least one component of the electronic device 101 (eg, the processor 120 or the sensor module 176 ). The data may include, for example, input data or output data for software (eg, the program 140 ) and instructions related thereto. The memory 130 may include a volatile memory 132 or a non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 , and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used in a component (eg, the processor 120 ) of the electronic device 101 from the outside (eg, a user) of the electronic device 101 . The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output a sound signal to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. The receiver can be used to receive incoming calls. According to an embodiment, the receiver may be implemented separately from or as a part of the speaker.

The display module 160 may visually provide information to the outside (eg, a user) of the electronic device 101 . The display module 160 may include, for example, a control circuit for controlling a display, a hologram device, or a projector and a corresponding device. According to an embodiment, the display module 160 may include a touch sensor configured to sense a touch or a pressure sensor configured to measure the intensity of a force generated by the touch.

The audio module 170 may convert a sound into an electric signal or, conversely, convert an electric signal into a sound. According to an embodiment, the audio module 170 acquires a sound through the input module 150 or an external electronic device (eg, a sound output module 155 ) directly or wirelessly connected to the electronic device 101 . The electronic device 102) (eg, a speaker or headphones) may output a sound.

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, user state), and generates an electrical signal or data value corresponding to the sensed state. can do. According to an embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, a barometric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, It may include a temperature sensor, a humidity sensor, or an illuminance sensor.

The interface 177 may support one or more specified protocols that may be used by the electronic device 101 to directly or wirelessly connect with an external electronic device (eg, the electronic device 102 ). According to an embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 can be physically connected to an external electronic device (eg, the electronic device 102 ). According to an embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert an electrical signal into a mechanical stimulus (eg, vibration or movement) or an electrical stimulus that the user can perceive through tactile or kinesthetic sense. According to an embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to an embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to an embodiment, the power management module 188 may be implemented as, for example, at least a part of a power management integrated circuit (PMIC).

The battery 189 may supply power to at least one component of the electronic device 101 . According to an embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). It can support establishment and communication through the established communication channel. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to an embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : It may include a local area network (LAN) communication module, or a power line communication module). A corresponding communication module among these communication modules is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a computer network (eg, a telecommunication network such as a LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or may be implemented as a plurality of components (eg, multiple chips) separate from each other. The wireless communication module 192 uses the subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199 . The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, a new radio access technology (NR). NR access technology includes high-speed transmission of high-capacity data (eMBB (enhanced mobile broadband)), minimization of terminal power and access to multiple terminals (mMTC (massive machine type communications)), or high reliability and low latency (URLLC (ultra-reliable and low-latency) -latency communications)). The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate. The wireless communication module 192 includes various technologies for securing performance in a high-frequency band, for example, beamforming, massive multiple-input and multiple-output (MIMO), all-dimensional multiplexing. It may support technologies such as full dimensional MIMO (FD-MIMO), an array antenna, analog beam-forming, or a large scale antenna. The wireless communication module 192 may support various requirements specified in the electronic device 101 , an external electronic device (eg, the electronic device 104 ), or a network system (eg, the second network 199 ). According to an embodiment, the wireless communication module 192 may include a peak data rate (eg, 20 Gbps or more) for realization of eMBB, loss coverage for realization of mMTC (eg, 164 dB or less), or U-plane latency for realization of URLLC ( Example: downlink (DL) and uplink (UL) each 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive a signal or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module 197 may include an antenna including a conductor formed on a substrate (eg, a PCB) or a radiator formed of a conductive pattern. According to an embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is connected from the plurality of antennas by, for example, the communication module 190 . can be selected. A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) other than the radiator may be additionally formed as a part of the antenna module 197 .

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module comprises a printed circuit board, an RFIC disposed on or adjacent to a first side (eg, bottom side) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, an array antenna) disposed on or adjacent to a second side (eg, top or side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and a signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, the command or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or a part of operations executed by the electronic device 101 may be executed by one or more external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a function or service automatically or in response to a request from a user or other device, the electronic device 101 may perform the function or service itself instead of executing the function or service itself. Alternatively or additionally, one or more external electronic devices may be requested to perform at least a part of the function or the service. One or more external electronic devices that have received the request may execute at least a part of the requested function or service, or an additional function or service related to the request, and transmit a result of the execution to the electronic device 101 . The electronic device 101 may process the result as it is or additionally and provide it as at least a part of a response to the request. For this, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an Internet of things (IoT) device. The server 108 may be an intelligent server using machine learning and/or neural networks. According to an embodiment, the external electronic device 104 or the server 108 may be included in the second network 199 . The electronic device 101 may be applied to an intelligent service (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

According to an embodiment, the electronic device 101 may include at least one rigid-flexible printed circuit board (R-FPCB). The flexible printed circuit board includes a component (or module) included in the electronic device 101 (eg, the display module 160 , the sensor module 176 , the interface 177 , or the camera module 180 ) and the main print. A circuit board (not shown) may be electrically (or operatively) connected, or a main printed circuit board and/or a sub printed circuit board spaced apart from each other may be electrically connected.

The electronic device 101 according to an embodiment includes a normal type that cannot be bent or folded, a foldable type that can be folded inside and/or outside based on at least one axis, and a display module 160 . The electronic device may be a rollable type electronic device capable of being rolled or a slideable type electronic device capable of expanding or reducing a display area by sliding the display module 160 . According to an embodiment, the display module 160 may provide a rectangular screen when unfolded. In various embodiments, the shape of the screen provided by the display module 160 is not limited to a rectangle, and a flexible display including a rectangle with rounded corners and a rectangle having a notch area may be provided depending on the type or design of the electronic device 101 . may include In the present disclosure, for convenience of description, it is assumed that the display module 160 has a rectangular shape and the length of the display module 160 is longer than that of a rectangle, but various modifications are possible.

2A is a diagram illustrating an electronic device including a flexible printed circuit board according to an embodiment of the present disclosure, and FIG. 2B is an example in which a flexible printed circuit board of the electronic device according to an embodiment of the present disclosure is bent. is a diagram showing

2A to 2B , an electronic device (eg, the electronic device 101 ) according to an embodiment of the present disclosure includes a housing 200 , a display module 210 , a printed circuit board 220 , and a flexible structure. A printed circuit board 230 may be included. At least one of the components of the electronic device of FIGS. 2A and 2B according to various embodiments is the same as or similar to at least one of the components of the electronic device 101 of FIG. 1 , and thus overlapping components will be described below. A description of the will be omitted.

According to various embodiments, the housing 200 may include a first housing 200a and a second housing 200b that are coupled (or fastened) to each other. The first housing 200a may be a front housing of the electronic device, and the second housing 200b may be a rear housing of the electronic device.

According to various embodiments, the display module 210 (eg, the display module 160 ) may be disposed in the first housing 200a. The display module 210 may be electrically connected to the printed circuit board 220 through the flexible printed circuit board 230 .

According to various embodiments, the display module 210 may be configured such that the camera module (eg, the camera module 180 of FIG. 1 ) and/or the sensor module (eg, the sensor module 176 of FIG. 1 ) detect the external environment. It can be configured to For example, a camera module and/or a sensor module disposed in an internal space of an electronic device (eg, the electronic device 101 of FIG. 1 ) through an opening and/or a transparent region drilled in the display module 210 may be It may be configured to be in contact with the external environment. According to an embodiment, the area facing the camera module and/or the sensor module of the display module 210 may be a part of the area displaying content, and may be formed as a transmission area having a specified transmittance. According to an embodiment, the transmissive region may be formed to have a transmittance in a range of about 20% to about 40%. The transmission region may include a region overlapping a field of view (FOV) of the camera module through which light for generating an image by being imaged by an image sensor passes. For example, the transmissive area of the display module 210 may include an area having a lower pixel density and/or wiring density than the surrounding area, and the camera module may include an under display camera (UDC). .

According to various embodiments, the printed circuit board 220 may be disposed in the second housing 200b, and a plurality of components (eg, the processor 120, the memory 130, and the communication module 190 of FIG. 1 ) , the audio module 170 , and/or the power management module 188) may be the main printed circuit board on which it is mounted.

According to various embodiments, the flexible printed circuit board 230 may electrically connect electrically separated modules among various modules included in the electronic device. For example, the flexible printed circuit board 230 may electrically (or operatively) connect the display module 210 and the printed circuit board 220 .

According to various embodiments, the flexible printed circuit board 230 includes a flexible region 231 , a rigid region 232 , and a protective layer (not shown) (eg, the protective layer 233 of FIGS. 4 and 5 ). may include

According to various embodiments, the flexible region 231 may have a flexible characteristic. For example, as shown in FIG. 2B , the flexible region 231 may be bent in an arrow direction (hereinafter, a bending direction) while being coupled to the display module 210 . For example, the bending direction may be a rotation direction based on the boundary between the flexible region 231 and the hard region 232 .

According to various embodiments, the rigid region 232 is a rigid region and may overlap at least a partial region of the flexible region 231 .

According to various embodiments, the rigid region 232 may be formed at both ends of the rigid printed circuit board 230 . The rigid region 232 formed at one end of the rigid printed circuit board 230 may include at least one component 211, as shown in FIGS. 2A and 2B, and the rigid printed circuit board ( The rigid region 232 formed at the other end of the 230 is coupled (eg, inserted) to the connector 221b (eg, male connector) included in the printed circuit board 220 through the connector 221a (eg, a female connector). ) can be According to some embodiments, the rigid region 232 may be formed at one end of the rigid printed circuit board 230 . Meanwhile, in FIG. 2A, the rigid region 232 formed at one end of the rigid printed circuit board 230 is shown to be integrally formed with the display module 210, but according to some embodiments, the rigid region 232 formed at one end of the rigid printed circuit board 230 ( The rigid region 232 formed at one end of the 230 may be connected to the display module 210 through a fastening means (eg, a connector).

According to various embodiments, the protective layer (eg, the protective layer 233 of FIGS. 4 and 5 ) may have a tensile force generated in the flexible region 231 and/or the hard region 232 when the flexible region 231 is bent. Due to the stress generated in at least a portion of the bonding region (eg, the cut regions 602, 702, 802 of FIGS. 6A to 8 ) where the hard region 232 and the flexible region 231 overlap by the breakage (e.g. tearing) and/or fracture (e.g. lifting/lifting of rigid parts) can be prevented. For example, the protective layer (eg, the protective layer 233 of FIGS. 4 and 5 ) prevents breakage and/or fracture occurring in at least a portion of the bonding site (eg, the bonding site having a tensile strength greater than or equal to a specified size). ), it may be formed of a specified number (eg, size, range, or ratio). The specified value indicates that the protective layer (for example, the protective layer 233 of FIGS. 4 and 5) is the stress generated at the bonding site (for example, the cut regions 602, 702, 802 of FIGS. 6A to 8). The largest point (eg, the lowest point 601a, 601b of the U-shaped cut region 602 of FIGS. 6A to 6C ), the point where the curve of the R-shaped cut-off region 702 of FIG. 7 ends (701a, 701b), Exceeding the edge points 801a, 801b) of the L-shaped cut region 802 of FIG. 8 in a horizontal direction (or a direction substantially perpendicular to the bending direction) (eg, the X-axis direction of FIGS. 6-8 ), According to some embodiments, the protective layer (eg, the protective layer 233 of FIGS. 4 and 5 ) may be set to cover a point where stress generated during bending of the flexible region 231 is high in the vertical direction (or bending direction) (eg, the Y-axis direction of FIGS. 6 to 8 ) may be laminated on a portion of the flexible region 231 with a specified value to be covered. The protective layer (eg, the protective layer 233 of FIGS. 4 and 5 ) is laminated so as not to overlap with the via holes (eg, the via holes 603 , 703 , and 803 of FIGS. 6A to 8 ) formed in at least a portion of the hard region. A detailed description thereof will be described later with reference to FIGS. 6A to 8 . In the above, an example in which the flexible printed circuit board 230 connects the display module 210 and the printed circuit board 220 . However, the electronic device may connect different modules among various modules included in the electronic device (eg, a main printed circuit board, a sub printed circuit board, a camera module, an interface module, or a sensor module). For example, the electronic device may connect the main printed circuit board and the sub printed circuit board through the flexible printed circuit board 230 .

3A is a diagram illustrating an electronic device including a flexible printed circuit board according to another embodiment of the present disclosure, and FIG. 3B is an electronic device including a flexible printed circuit board according to another embodiment of the present disclosure. It is the drawing shown.

3A and 3B , an electronic device (eg, the electronic device 101 of FIG. 1 ) according to various embodiments of the present disclosure is folded inwardly and/or outwardly (in-folding or in-folding or the electronic device 101 of FIG. 1 ) based on at least one rotation axis. It may be a foldable type electronic device that can be folded out). For example, as illustrated in FIG. 3A , the electronic device may be folded inward (eg, in-folded) with respect to the vertical axis (axis A). As another example, the electronic device may be folded inward with respect to the horizontal axis (C axis) as shown in FIG. 3B .

According to various embodiments, the electronic device includes a first printed circuit board 310 (eg, a main printed circuit board), a second printed circuit board 320 (eg, a sub printed circuit board), and a flexible printed circuit board ( 230) may be included.

According to various embodiments, the first printed circuit board 310 and the second printed circuit board 320 may include a plurality of parts (components). The first printed circuit board 310 and the second printed circuit board 320 may be electrically connected through the flexible printed circuit board 230 .

According to various embodiments, in the flexible printed circuit board 230 , as described with reference to FIGS. 2A and 2B , a protective layer is disposed (stacked) to cover the point where the stress is greatest, so that damage and / or to prevent breakage. Since the flexible printed circuit board 230 is similar to FIGS. 2A and 2B , a detailed description thereof will be omitted.

The electronic device of FIGS. 3A and 3B may further include various components (eg, a housing, a display module, a processor, a communication module, or a sensor module), at least one of which includes the electronic device of FIG. 1 . It may be the same as or similar to at least one of the elements of 101 . For convenience of description, detailed descriptions of the same or similar components will be omitted.

In the above, an example of connecting the first printed circuit board 310 and the second printed circuit board 320 through the flexible printed circuit board 230 of the foldable electronic device of FIGS. 3A and 3B has been described. . However, in the foldable electronic device of FIGS. 3A and 3B , different modules among various modules (eg, a display module, a camera module, an interface module, or a sensor module) are connected to each other through the flexible printed circuit board 230 . can

3C is a diagram illustrating an electronic device including a flexible printed circuit board according to another exemplary embodiment of the present disclosure.

Referring to FIG. 3C , in an electronic device (eg, the electronic device 101 ) according to various embodiments of the present disclosure, the display module 360 (eg, the display module 160 of FIG. 1 ) is slid to slide the display module 360 . ) may be a slideable type electronic device in which the display area can be expanded or reduced. For example, as shown in FIG. 3C , the electronic device slides out in an outward direction (eg, in a right direction in FIG. 3C ) to expand the display area, and in a state in which the display area is expanded, slides out in an inward direction ( For example, the display area may be reduced by sliding-in in the left direction of FIG. 3C .

According to various embodiments, the electronic device may include a flexible printed circuit board 230 , a printed circuit board 350 , and a display module 360 .

According to various embodiments, the printed circuit board 350 and the display module 360 may be electrically connected through the flexible printed circuit board 230 .

According to various embodiments, an operation of bending and unfolding at least a portion of the flexible printed circuit board 230 according to a sliding operation may be repeated. In the flexible printed circuit board 230, as described in FIGS. 2A and 2B, a protective layer is disposed (stacked) to cover the point where the stress is greatest, so that damage and/or fracture occurs during sliding operation. it can be prevented Since the flexible printed circuit board 230 is similar to FIGS. 2A and 2B , a detailed description thereof will be omitted.

The electronic device of FIG. 3C may further include various components, and at least one of the components may be the same as or similar to at least one of the components of the electronic device 101 of FIG. 1 . For convenience of description, detailed descriptions of the same or similar components will be omitted.

In the above, the example of connecting the printed circuit board 350 and the display module 360 through the flexible printed circuit board 230 of the slideable type electronic device of FIG. 3C has been described. However, the slideable type electronic device of FIG. 3C includes various modules (eg, a main printed circuit board, a sub printed circuit board, a camera module, an interface module, or a sensor module) through the flexible printed circuit board 230 . You can connect different modules among them. According to some embodiments, various embodiments of the present disclosure may also be applied to a rollable type electronic device in which the display module ( 160 of FIG. 1 ) can be rolled.

A foldable type electronic device, a rollable type electronic device, and/or a slideable electronic device includes a flexible printed circuit board 230 including a single-sided flexible copper clad laminate (FCCL) as a flexible region. It is used to electrically connect the modules. However, the single-sided flexible copper clad laminated film may be vulnerable to cracking due to its thin thickness. However, as in various embodiments of the present disclosure, when the protective layer is disposed (laminated) to cover the point where the stress exceeds the greatest point during bending of the flexible printed circuit board 230, tearing of the flexible copper clad laminated film of the single side is prevented. can be prevented

4 is a cross-sectional view of a coupling portion of a rigid printed circuit board according to an embodiment of the present disclosure, and FIG. 5 is an exploded perspective view of a rigid flexible printed circuit board according to an embodiment of the present disclosure.

4 and 5 , the flexible region 231 of the flexible printed circuit board 230 according to various embodiments may include a base film (or substrate) 231a and a copper foil layer 231b. For example, the flexible region 231 is a flexible copper clad laminate (FCCL) in which at least one copper clad is laminated at least partially on at least one of the top or the bottom of a polyimide film. can be Meanwhile, although the flexible region 231 is illustrated as including two copper foil layers 231b in FIGS. 4 and 5 above, according to some embodiments, the flexible region 231 includes one copper foil layer 231b. Alternatively, three or more copper foil layers 231b may be included.

According to various embodiments, the hard region 232 may include at least one copper foil layer 232b on top and bottom of at least some regions of the flexible region 231 and a curable material 232c (eg, prepreg (PPG)). ) can be formed by bonding (laminated). The hard region 232 may include a protective layer 232d to prevent corrosion of the at least one copper foil layer 232b and/or damage to the at least one copper foil layer 232b by external impact. For example, the protective layer 232d is formed by applying (eg, coating, and/or printing) a photo imageable solder resist (PSR) to the copper foil layer 232b positioned at the top and bottom of the hard region 232 . can be formed.

According to various embodiments, a base film 232a may be disposed between the copper foil layer 232b and the curable material 232c. Meanwhile, although it is illustrated in FIGS. 4 and 5 that the hard region 232 is formed by laminating a copper foil layer 232b on the upper end and lower end of the flexible region 231 , according to some embodiments, the flexible region 231 . At least one copper foil layer 232b may be stacked on one of the top or bottom of the to form the hard region 232 .

According to various embodiments, the protective layer 233 may be laminated (adhesive, attached) on at least one of an upper end or a lower end of the flexible region 231 to protect the copper foil layer 231b of the flexible region 231 . For example, the protective layer 233 may prevent corrosion of the copper foil layer 231b and/or damage to the copper foil layer 231b by external impact. The protective layer 233 may be a coverlay film in which an adhesive 233b is coated on a base film (eg, a polyimide film) 233a.

According to various embodiments, a partial region 235 of the protective layer 233 may overlap the curable material 232c of the hard region 232 . For example, the protective layer 233 may be partially formed to prevent breakage and/or breakage of the joint portion of the flexible region 231 and the rigid region 232 due to stress generated when the flexible region 231 is bent. Region 235 may overlap curable material 232c of hard region 232 .

According to various embodiments, the flexible printed circuit board 230 is paper phenolic (FR-2, FR-3, etc.), epoxy (FR-4, FR-5, G-2, G-11, etc.), polyamide It can be formed of various materials such as , BT, metal, telflon, ceramic, halogen free, etc.

According to various embodiments, at least one copper foil (eg, copper foil layers 231b and 232b) may be a high-frequency copper foil laminate made of a material capable of responding to high-speed signal transmission. For example, in a printed circuit board (eg, the rigid printed circuit board 230 ), the propagation speed of a signal is inversely proportional to the dielectric constant of the material. For example, the flexible printed circuit board 230 may include a flexible printed circuit board type radio frequency cable (FRC).

6A is a diagram illustrating an example in which a protective layer is stacked on a flexible region according to an embodiment of the present disclosure, and FIG. 6B illustrates another example in which a protective layer is stacked on a flexible region according to an embodiment of the present disclosure. One view, and FIG. 6C is a view illustrating another example in which a protective layer is stacked on a flexible region according to an embodiment of the present disclosure. Components of the flexible printed circuit board of FIGS. 6A to 6C according to various embodiments may be the same as or similar to those of the flexible printed circuit board 230 of FIGS. 2A through 5 .

6A to 6C , the rigid printed circuit board (eg, the rigid printed circuit board 230 ) according to an embodiment of the present disclosure is U-shaped at the bonding portion where the rigid region and the flexible region overlap at least partially. may include a cutting region 602 of

According to various embodiments, the protective layer 633 (eg, the protective layer 233 of FIGS. 4 and 5 ) rotates about a first axis (eg, the X-axis) to form a U-shaped cut region 602 upon bending. ) can cause stress. For example, the greatest stress may occur at the lowest points 601a and 601b of the U-shaped cut region 602 . The protective layer 633 may be adhered (laminated) to the top and/or bottom of the soft region at a specified number to cover the lowest points 601a and 601b. For example, the size (eg, width) 604 in the first axis (eg, X-axis) direction (eg, transverse direction) of the protective layer 633 is the distance 605 between the lowest points 601a and 601b. may have a size exceeding For example, the size in the first axial direction of the protective layer 633 may completely cover the U-shaped cut region 602, as shown in Fig. 6a, or as shown in Figs. 6b and 6c, It may cover more than a specified percentage (eg, 50%) of the U-shaped cut area 602 .

According to various embodiments, the protective layer 633 may be formed in a second axis (eg, Y-axis) direction (eg, vertical) by a specified size (eg, about 0.4 mm) (or ratio) relative to the lowest points 601a and 601b. direction) and at least partially overlap with the hard region (eg, the curable material 232c of the hard region 232 ). The protective layer 633 may be stacked so as not to overlap the at least one via hole 603 formed in the hard region.

According to various embodiments, the protective layer 633 may be laminated (adhesive, adhered) on at least one of the top or bottom of the flexible region (eg, the flexible region 231 of FIGS. 2A to 5 ). In addition, the protective layer 633 laminated (adhesive, attached) on at least one of the top or bottom of the flexible region is, as shown in FIGS. 6A to 6C , the lowest points of the U-shaped cut region 602 . It may be formed in a shape that exceeds (601a, 601b) to cover.

Various embodiments of the present disclosure described above may improve the tensile strength of a rigid printed circuit board. For example, when the protective layer 633 is formed up to the lowermost points 601a and 601b and when it is formed beyond the lowermost points 601a and 601b (eg, a U-shaped cut region 602 as shown in FIG. 6A ) As a result of a comparative experiment, the tensile strength of about 555 gf was improved on average as shown in <Table 1> below.

Not Exceeded (gf) Excess (gf) improvement (gf) One 1192 1908 716 2 1664 1740 76 3 1684 2190 506 4 1679 2246 567 5 1124 2037 913 Average 1468.6 2024.2 555.6 maximum 1684 2246 562 Ieast 1124 1740 616

7 is a diagram illustrating another example in which a protective layer is stacked on a flexible region according to an embodiment of the present disclosure. Components of the flexible printed circuit board of FIG. 7 according to various embodiments may be the same as or similar to those of the flexible printed circuit board 230 of FIGS. 2A to 5 .

Referring to FIG. 7 , a rigid printed circuit board (eg, a rigid printed circuit board 230 ) according to an embodiment of the present disclosure is cut in an R (round) shape at a bonding portion where the rigid region and the flexible region overlap. region 702 .

According to various embodiments, the protective layer 733 (eg, the protective layer 233 of FIGS. 4 and 5 ) rotates about a first axis (eg, the X-axis) and is bent in an R (round) shape. Stress may occur in region 702 . For example, the greatest stress may occur at the end points 701a and 701b where the curvature of the R (round) cut region 702 ends. The protective layer 733 may be adhered (laminated) to the top and/or bottom of the flexible region with a specified number to cover the end points 701a and 701b. For example, the size (eg, width) 704 in the first axis (eg, X-axis) direction (eg, transverse direction) of the protective layer 733 is the distance 705 between the end points 701a and 701b. can exceed The protective layer 733 is a hard region such that it exceeds in the second axis (eg Y-axis) direction (vertical direction) by a specified size (eg, about 0.4 mm) (or ratio) with respect to the end points 701a and 701b. (eg, the curable material 232c of the hard region 232 ) may overlap at least partially. The protective layer 733 may be stacked so as not to overlap the at least one via hole 703 formed in the hard region.

8 is a diagram illustrating another example in which a protective layer is stacked on a flexible region according to an embodiment of the present disclosure.

Referring to FIG. 8 , the rigid printed circuit board (eg, the rigid printed circuit board 230 ) according to an embodiment of the present disclosure may include an L-shaped cut region at a bonding portion between the rigid region and the flexible region. . Components of the flexible printed circuit board of FIG. 8 according to various embodiments may be the same as or similar to those of the flexible printed circuit board 230 of FIGS. 2A to 5 .

According to various embodiments, the protective layer 833 (eg, the protective layer 233 of FIGS. 4 and 5 ) rotates about a first axis (eg, the X-axis) to bend the L-shaped cut region 802 . ) can cause stress. For example, the greatest stress may occur at the edge points 801a and 801b of the L-shaped cut region 802 . The protective layer 833 may be adhered (laminated) to the top and/or bottom of the soft area to a specified number to cover the edge points 801a and 801b. For example, the size (eg, width) 804 in the first axis (eg, X-axis) direction (eg, transverse direction) of the protective layer 833 is the distance 805 between the edge points 801a and 801b. can exceed The protective layer 833 has a hard region (eg, a hard region) to exceed in the second axis (Y-axis) direction (eg, longitudinal direction) by a specified size (eg, about 0.4 mm) with respect to the corner points 801a and 801b. It may overlap at least partially with the curable material 232c of the region 232 . The protective layer 833 may be stacked so as not to overlap the at least one via hole 803 formed in the hard region.

Meanwhile, although FIGS. 6A to 8 show that the rigid printed circuit board includes two cut areas, according to some embodiments, the flexible printed circuit board may include a cut area on one side.

9 is an exploded perspective view of a flexible printed circuit board according to another embodiment of the present disclosure.

Referring to FIG. 9 , a flexible printed circuit board 930 according to another embodiment of the present disclosure may include a flexible region 931 , a rigid region 932 , and a protective layer 933 . In the rigid printed circuit board 930 according to another embodiment of the present disclosure, the rigid region 932 may include six copper foil layers 932b, and the other components are the rigid printed circuit of FIGS. 4 and 5 . It may be similar to or the same as the substrate 230 . Accordingly, a detailed description thereof will be omitted.

10 is an exploded perspective view of a flexible printed circuit board according to another embodiment of the present disclosure;

Referring to FIG. 10 , a flexible printed circuit board 1030 according to another embodiment of the present disclosure may include a flexible region 1031 , a rigid region 1032 , and a protective layer 1033 . As such, in the flexible printed circuit board 1030 according to another embodiment of the present disclosure, the flexible region 1031 may include four copper foil layers 1031b, and the rigid region 1032 may include eight copper foil layers. 1032b may be included. In addition, the protective layer 1033 may include four. Other components may be similar to or the same as the flexible printed circuit board 230 of FIGS. 4 and 5 and/or the flexible printed circuit board 930 of FIG. 9 . Accordingly, a detailed description thereof will be omitted.

An electronic device (eg, the electronic device 101) according to various embodiments of the present disclosure includes a housing (eg, the housing 200); a first module disposed in an area of the housing; a second module spaced apart from the first module and disposed in another area of the housing; and a rigid printed circuit board (eg, a rigid printed circuit board 230) for electrically connecting the first module and the second module, wherein the rigid printed circuit board includes a rigid region (eg, a rigid region). (232, 932, 1032)); a flexible region (eg, flexible regions 231 , 931 , and 1031 ) coupled to the hard region so that the hard region and a partial region overlap; and covering at least a portion of the bonding area with a specified value so that, when bending the flexible area, the bonding area between the hard area and the flexible area has a tensile strength greater than or equal to a specified size, the upper or lower end of the flexible area A protective layer (eg, protective layers 233 , 633 , 733 , 833 , 933 , and 1033 ) stacked on at least one of the plurality of layers may be included.

According to various embodiments, the designated value includes at least one of a size, range, and/or ratio related to the binding site, and the designated value occurs at the binding site when the protective layer is bent It can be set to cover over the point where the applied stress is the greatest.

According to various embodiments, the binding site may include a U-shaped, R-shaped, or L-shaped cleavage region (eg, cleavage regions 602 , 702 , 802 ).

According to various embodiments, the point at which the stress is greatest is the lowest point of the U-shaped cut region (eg, the lowest points 601a and 601b), the point where the curve (curvature) of the R-shaped cut region ends ( Example: end points 701a and 701b), or edge points of the L-shaped cut region (eg, corner points 801a and 801b).

According to various embodiments, the first module and the second module may include a display module (eg, a display module 160, a display module 210, and a display module 360), a main printed circuit board (eg, a printed circuit board). 220, a first printed circuit board 310, a printed circuit board 350), a sub printed circuit board (eg, a second printed circuit board 320), a camera module (eg, a camera module 180), It may be a different module among an interface module (eg, the interface 177) or a sensor module (eg, the sensor module 176).

According to various embodiments, at least a portion of the flexible region includes a base film (eg, the base film 231a), and at least one copper clad is laminated on at least one of an upper end or a lower end of the base film. It may be formed of a flexible copper clad layer (FCCL).

According to various embodiments, the hard region may include at least one copper foil layer (eg, copper foil layer 232b) on at least one of an upper end or a lower end of a partial region of the flexible region using a curable material (eg, curable material 232c). It is formed by bonding to, and may be formed at one end of the flexible region, or formed at both ends of the flexible region.

According to various embodiments, the protective layer may be stacked on the flexible region so as not to overlap with via holes (eg, via holes 603 , 703 , and 803 ) formed in at least a portion of the hard region.

According to various embodiments, the protective layer may be formed by coating an adhesive (eg, adhesive 233b) on a base film (eg, base film 233a).

According to various embodiments of the present disclosure, the rigid printed circuit board (eg, the rigid printed circuit board 230 ) electrically connecting the first module and the second module is a rigid region (eg, the rigid regions 232 and 932 ). , 1032)); a flexible region (eg, flexible regions 231 , 931 , and 1031 ) coupled to the hard region so that the hard region and a partial region overlap; and covering at least a portion of the bonding portion with a specified value so that the bonding portion between the rigid region and the flexible region has a tensile strength greater than or equal to a specified size when the flexible region is bent, either at the upper end or the lower end of the flexible region. A protective layer (eg, protective layers 233 , 633 , 733 , 833 , 933 , and 1033 ) stacked on at least one location may be included.

According to various embodiments, the designated value includes at least one of a size, range, and/or ratio related to the binding site, and the designated value occurs at the binding site when the protective layer is bent It can be set to cover over the point where the applied stress is the greatest.

According to various embodiments, the binding site may include a U-shaped, R-shaped, or L-shaped cleavage region (eg, cleavage regions 602 , 702 , 802 ).

According to various embodiments, the point at which the stress is greatest is the lowest point of the U-shaped cut region (eg, the lowest points 601a and 601b), the point where the curve (curvature) of the R-shaped cut region ends ( Example: end points 701a and 701b), or edge points of the L-shaped cut region (eg, corner points 801a and 801b).

According to various embodiments, the first module and the second module may include a display module (eg, a display module 160, a display module 210, and a display module 360), a main printed circuit board (eg, a printed circuit board). 220, first printed circuit board 310, printed circuit board 350), sub printed circuit board (eg, second printed circuit board 320), camera module (eg, camera module 180), interface It may be a different module among a module (eg, the interface 177 ) or a sensor module (eg, the sensor module 176 ).

According to various embodiments, at least a portion of the flexible region includes a base film (eg, the base film 231a), and at least one copper clad is laminated on at least one of an upper end or a lower end of the base film. It may be formed of a flexible copper clad layer (FCCL).

According to various embodiments, the hard region may include at least one copper foil layer (eg, copper foil layer 232b) on at least one of an upper end or a lower end of a partial region of the flexible region using a curable material (eg, curable material 232c). It is formed by bonding to, and may be formed at one end of the flexible region, or formed at both ends of the flexible region.

According to various embodiments of the present disclosure, the protective layer may be stacked on the flexible region so as not to overlap with via holes (eg, via holes 603 , 703 , and 803 ) formed in at least a portion of the hard region.

According to various embodiments, the protective layer may include a base film (eg, the base film 233a) and an adhesive (eg, the adhesive 233b).

An electronic device (eg, the electronic device 101) according to various embodiments of the present disclosure includes a housing (eg, the housing 200); a first module disposed in an area of the housing; a second module spaced apart from the first module and disposed in another area of the housing; and a rigid printed circuit board (eg, a rigid printed circuit board 230) for electrically connecting the first module and the second module, wherein the rigid printed circuit board includes a rigid region (eg, a rigid region). (232, 932, 1032)); a flexible region (eg, flexible regions 231 , 931 , and 1031 ) coupled to the hard region so that the hard region and a partial region overlap; and a direction substantially perpendicular to a bending direction, covering at least a portion of a bonding portion of the flexible region and the rigid region, laminated on at least one of an upper end or a lower end of the flexible region, and bending the flexible region A protective layer (eg, protective layers 233 , 633 , 733 , 833 , 933 , and 1033 ) having a length greater than a minimum length between lowest points of the binding sites may be included.

According to various embodiments, the bending direction may be a rotation direction based on a boundary between the hard region and the flexible region, and the vertical direction may correspond to a rotation axis direction for the rotation.

The electronic device according to various embodiments disclosed in the present disclosure may have various types of devices. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance device. The electronic device according to various embodiments of the present disclosure is not limited to the aforementioned devices.

The various embodiments of the present disclosure and terms used therein are not intended to limit the technical features described in the present disclosure to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of the embodiments. In connection with the description of the drawings, like reference numerals may be used for similar or related components. The singular form of the noun corresponding to the item may include one or more of the item, unless the relevant context clearly dictates otherwise. In the present disclosure, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A , B, or C" each may include any one of, or all possible combinations of, items listed together in the corresponding one of the phrases. Terms such as “first”, “second”, or “first” or “second” may simply be used to distinguish the component from other such components, and refer to the component in another aspect (e.g., importance or order) is not limited. One (eg, first) component is referred to as “coupled” or “connected” to another (eg, second) component, with or without the terms “functionally” or “communicatively”. When mentioned, it means that one component can be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term “module” used in various embodiments of the present disclosure may include a unit implemented in hardware, software, or firmware, for example, interchangeably with terms such as logic, logic block, component, or circuit. can be used A module may be an integrally formed part or a minimum unit or a part of the part that performs one or more functions. For example, according to an embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments of the present disclosure, one or more instructions stored in a storage medium (eg, the internal memory 136 or the external memory 138) readable by a machine (eg, the electronic device 101) may be implemented as software (eg, the program 140) including For example, the processor (eg, the processor 120 ) of the device (eg, the electronic device 101 ) may call at least one of one or more instructions stored from a storage medium and execute it. This makes it possible for the device to be operated to perform at least one function according to the at least one command called. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-transitory' only means that the storage medium is a tangible device and does not contain a signal (eg, electromagnetic wave), and this term refers to the case where data is semi-permanently stored in the storage medium and It does not distinguish between temporary storage cases.

According to an embodiment, the method according to various embodiments of the present disclosure may be provided by being included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. The computer program product is distributed in the form of a machine-readable storage medium (eg compact disc read only memory (CD-ROM)), or via an application store (eg Play Store ^TM ) or on two user devices ( It can be distributed (eg downloaded or uploaded) directly or online between smartphones (eg: smartphones). In the case of online distribution, at least a part of the computer program product may be temporarily stored or temporarily created in a machine-readable storage medium such as a memory of a server of a manufacturer, a server of an application store, or a memory of a relay server.

According to various embodiments, each component (eg, a module or a program) of the above-described components may include a singular or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. . According to various embodiments, one or more components or operations among the above-described corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg, a module or a program) may be integrated into one component. In this case, the integrated component may perform one or more functions of each component of the plurality of components identically or similarly to those performed by the corresponding component among the plurality of components prior to the integration. . According to various embodiments, operations performed by a module, program, or other component are executed sequentially, in parallel, repeatedly, or heuristically, or one or more of the operations are executed in a different order, omitted, or , or one or more other operations may be added.

Claims (20)

In an electronic device,
housing;
a first module disposed in an area of the housing;
a second module spaced apart from the first module and disposed in another area of the housing; and
and a flexible printed circuit board electrically connecting the first module and the second module, wherein the flexible printed circuit board includes:
hard zone;
a flexible region coupled to the hard region so that the hard region and a partial region overlap; and
When bending the flexible region, at least a portion of the bonding portion is covered with a specified value so that the bonding portion of the rigid region and the flexible region has a tensile strength greater than or equal to a specified size, and the upper or lower end of the flexible region An electronic device comprising a; a protective layer laminated on at least one place.
The method of claim 1,
The specified value includes at least one of a size, range, and/or ratio related to the binding site,
The specified value is set to cover a point at which stress generated at the bonding portion is greatest when the protective layer is bent.
3. The method of claim 2,
and the binding site includes a U-type, R-type, or L-type cleavage region.
4. The method of claim 3,
The most stressful point is
an electronic device including a lowermost point of the U-shaped cut region, a point where a curve (curvature) of the R-shaped cut region ends, or a corner point of the L-shaped cut region.
The method of claim 1,
The first module and the second module are
An electronic device that is different from a display module, a main printed circuit board, a sub printed circuit board, a camera module, an interface module, or a sensor module.
The method of claim 1,
At least a portion of the flexible region includes a base film,
An electronic device formed of a flexible copper clad layer (FCCL) in which at least one copper clad is laminated on at least one of an upper end or a lower end of the base film.
The method of claim 1,
The hard region is
It is formed by adhering at least one copper foil layer to at least one of an upper end or a lower end of a partial region of the flexible region with a curable material,
An electronic device formed at one end or both ends of the flexible region.
The method of claim 1,
The protective layer is
The electronic device is stacked in the flexible region so as not to overlap a via hole formed in at least a portion of the rigid region.
The method of claim 1,
The protective layer is
An electronic device formed by coating an adhesive on a base film.
In the flexible printed circuit board electrically connecting the first module and the second module,
hard zone;
a flexible region coupled to the hard region so that the hard region and a partial region overlap; and
When bending the flexible region, at least a portion of the bonding portion is covered with a specified value so that the bonding portion of the rigid region and the flexible region has a tensile strength of a specified size or more, and at least one of an upper end or a lower end of the flexible region A rigid printed circuit board comprising a; protective layer laminated in one place.
The method of claim 1,
The specified value includes at least one of a size, range, and/or ratio related to the binding site,
The specified value is set to cover a point where the stress generated at the bonding portion is the greatest when the protective layer is bent.
12. The method of claim 11,
The bonding site is a rigid printed circuit board comprising a U-shaped, R-shaped, or L-shaped cut region.
13. The method of claim 12,
The most stressful point is
A flexible printed circuit board including a lowermost point of the U-shaped cut region, a point where a curve (curvature) of the R-shaped cut region ends, or a corner point of the L-shaped cut region.
11. The method of claim 10,
The first module and the second module are
A flexible printed circuit board that is different from a display module, a main printed circuit board, a sub printed circuit board, a camera module, an interface module, or a sensor module.
11. The method of claim 10,
At least a portion of the flexible region
A rigid printed circuit board comprising a base film, and formed of a flexible copper clad layer (FCCL) in which at least one copper clad is laminated on at least one of an upper end or a lower end of the base film.
11. The method of claim 10,
The hard region is
It is formed by adhering at least one copper foil layer to at least one of an upper end or a lower end of a partial region of the flexible region with a curable material,
A rigid printed circuit board formed at one end of the flexible region or formed at both ends.
11. The method of claim 10,
The protective layer is
A rigid printed circuit board laminated on the flexible region so as not to overlap with a via hole formed in at least a portion of the rigid region.
11. The method of claim 10,
The protective layer is
A rigid printed circuit board composed of a base film and an adhesive.
In an electronic device,
housing;
a first module disposed in an area of the housing;
a second module spaced apart from the first module and disposed in another area of the housing; and
and a flexible printed circuit board electrically connecting the first module and the second module, wherein the flexible printed circuit board includes:
hard zone;
a flexible region coupled to the hard region so that the hard region and a partial region overlap; and
A length in a direction substantially perpendicular to a bending direction, covering at least a portion of a bonding portion of the flexible region and the rigid region, laminated on at least one of an upper end or a lower end of the flexible region, and bending the flexible region and a protective layer having a size greater than a minimum length between lowermost points of the binding site.
20. The method of claim 19,
The bending direction is a rotation direction based on the boundary between the hard region and the flexible region,
The vertical direction corresponds to a rotation axis direction for the rotation.

Images