KR20230056517A - Printed circuit board with increased durability in bending region and electronic device including same - Google Patents

Abstract

According to one embodiment, a printed circuit board includes an extension area extending in one direction and a bending area bent with respect to the extension area. The extension area and the bending area include: a non-conductive layer; a first conductive layer disposed on one side of the non-conductive layer; a second conductive layer disposed on the other side of the non-conductive layer; and a via hole passing through the non-conductive layer, the first conductive layer, and the second conductive layer. In the bending area, the cross-sectional area of the via hole in contact with the first conductive layer may be smaller than the cross-sectional area of the via hole in contact with the second conductive layer. In addition, various embodiments may be possible.

Description

Printed circuit board with increased durability in a bending area and an electronic device including the same

Various embodiments relate to a printed circuit board with increased durability in a bending area and an electronic device including the same.

As the electronic device performs various functions according to user requests, the electronic device may include a plurality of printed circuit boards (PCBs). A plurality of electronic components of the electronic device may be disposed on the same printed circuit board or on different printed circuit boards to form electrical connections inside the electronic device.

As electronic devices become smaller, in order to secure a mounting space for electronic components, a printed circuit board may be mounted inside the electronic device in a bent state.

The printed circuit board includes conductive vias that electrically connect different conductive layers, and may be partially bent. As portions of the printed circuit board are bent, stresses may occur in the bent areas of the printed circuit board. When a conductive via is included in a bent region of the printed circuit board, stress generated as the printed circuit board is bent may be concentrated in a region adjacent to the via. When stress is concentrated in a specific region of the printed circuit board, cracks may occur on the printed circuit board. When cracks occur, internal electrical connections of electronic components constituting the electronic device are damaged, and thus the electronic device may not be able to secure an expected lifespan.

Various embodiments may provide a printed circuit board and an electronic device with increased durability in a bending area.

The technical problem to be achieved in this document is not limited to the technical problem mentioned above, and other technical problems not mentioned can be clearly understood by those skilled in the art from the description below. There will be.

According to one embodiment, a printed circuit board includes an extension region extending along one direction and a bending region bent with respect to the extension region, wherein the extension region and the bending region include a non-conductive layer, the non-conductive layer A first conductive layer disposed on one surface of the layer, a second conductive layer disposed on the other surface of the non-conductive layer, and a via penetrating the non-conductive layer, the first conductive layer, and the second conductive layer. A cross-sectional area of the via hole contacting the first conductive layer may be smaller than a cross-sectional area of the via hole contacting the second conductive layer in the bending region.

According to one embodiment, an electronic device includes a first printed circuit board, an extension area connected to the first printed circuit board, and a second printed circuit board including a bending area bent with respect to the extension area, The extension region and the bending region may include a non-conductive layer, a first conductive layer disposed on one surface of the non-conductive layer, a second conductive layer disposed on the other surface of the non-conductive layer, and the non-conductive layer; and a via hole penetrating the first conductive layer and the second conductive layer, and in the bending region, a cross-sectional area of the via hole contacting the first conductive layer may be smaller than a cross-sectional area of the via hole contacting the second conductive layer. there is.

According to one embodiment, a printed circuit board may include a first cover lay, a first adhesive layer disposed on the first cover lay, a first conductive layer disposed on the first adhesive layer, and an upper portion of the first conductive layer. a non-conductive layer disposed on the non-conductive layer, a second conductive layer disposed on the non-conductive layer, a second adhesive layer disposed on the second conductive layer, and a second cover lay disposed on the non-conductive layer; and a plurality of via holes penetrating the first conductive layer, the non-conductive layer, and the second conductive layer, and among the plurality of via holes, the first of the via holes disposed in a bending area of the printed circuit board; A cross-sectional area of a region in contact with the first conductive layer may be different from a cross-sectional area of a region in contact with the second conductive layer of the via hole disposed in the bending region.

In the printed circuit board according to an exemplary embodiment, the cross-sectional area of the via hole in the bending region may be different between the conductive layers, so that stress generated by bending may be dispersed. The printed circuit board according to an exemplary embodiment may have increased durability in a bending area and thus increased lifespan. An electronic device according to an embodiment includes a printed circuit board with increased durability in a bending area, thereby securing an expected lifespan and smoothly providing pre-designed functions to a user without malfunction.

Effects obtainable in the present disclosure are not limited to the effects mentioned above, and other effects not mentioned may be clearly understood by those skilled in the art from the description below. will be.

1 is a block diagram of an electronic device in a network environment according to various embodiments.
2A shows an appearance of an electronic device according to an exemplary embodiment.
2B shows a second side of the electronic device in a state where the cover plate is removed, according to an embodiment.
3 is a perspective view of a second printed circuit board, according to one embodiment.
FIG. 4A is a cross-sectional view illustrating at least a portion of an example in which an extension region and a bend region of a second printed circuit board are cut along line AA′ of FIG. 3 according to an exemplary embodiment.
4B is a cross-sectional view illustrating at least a portion of an example in which a bending region of a second printed circuit board according to an exemplary embodiment is cut along line BB′ of FIG. 3 .
5A is a cross-sectional view illustrating another example of an extension area and a bending area of a second printed circuit board according to an embodiment.
5B is a cross-sectional view illustrating another example of a bending region of a second printed circuit board according to an embodiment.
6 is a cross-sectional view illustrating another example of a bending region of a second printed circuit board according to an embodiment.
7A and 7B show examples in which via holes are formed in the second printed circuit board.
7C is a graph showing a relationship between signal loss and frequency of signal lines on the second printed circuit board.

1 is a block diagram of an electronic device 101 within a network environment 100, according to various embodiments. Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It may communicate with at least one of the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to one embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, the processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to one embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor) or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit ( NPU: neural processing unit (NPU), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 may use less power than the main processor 121 or be set to be specialized for a designated function. can The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, image signal processor or communication processor) may be implemented as part of other functionally related components (eg, camera module 180 or communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where the artificial intelligence model is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to one embodiment, the display module 160 may include a touch sensor set to detect a touch or a pressure sensor set to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to one embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an IR (infrared) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 is a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, legacy It may communicate with the external electronic device 104 through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, a LAN or a WAN). These various types of communication modules may be integrated as one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 is a peak data rate for eMBB realization (eg, 20 Gbps or more), a loss coverage for mMTC realization (eg, 164 dB or less), or a U-plane latency for URLLC realization (eg, Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to one embodiment, the antenna module 197 may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external electronic devices among the external electronic devices 102 , 104 , or 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

2A shows an external appearance of an electronic device according to an embodiment, and FIG. 2B shows a second surface of the electronic device with a cover plate removed according to an embodiment.

Referring to FIGS. 2A and 2B , an electronic device 101 according to an embodiment may include a housing 210 and at least one key button 220 .

According to an embodiment, the housing 210 may form an outer surface of the electronic device 101 that comes into contact with a user's hand when the user grips the electronic device 101 . The housing 210 may form an internal space in which various components of the electronic device 101 are disposed. According to one embodiment, the housing 210 has a first surface 211 on which the display 230 is disposed, and a second surface 212 and a first surface 211 facing the first surface 211 and the first surface 211 . It may include a side surface 213 formed along at least a portion of an edge of the second surface 212 . According to one embodiment, the first surface 211 and the second surface 212 may face each other and be spaced apart, and the side surface 213 is between the first surface 211 and the second surface 212. , By extending along at least a part of the edge of the first surface 211 and the second surface 212, it is possible to form an internal space.

According to one embodiment, the first surface 211 may be formed by a front plate at least partially transparent. The front plate formed on the first surface 211 may transmit visual information provided through the display 230 to the outside. The first surface 211 may include a glass plate or a polymer plate including various layers.

According to one embodiment, the second face 212 may be formed by a substantially opaque cover plate 214 . The cover plate 214 may be formed by coated or colored glass, ceramic, polymer, or a combination of at least two of the foregoing.

According to one embodiment, the side surface 213 is a first side surface 213a extending in the first direction d1, spaced apart from the first side surface 213a, and substantially parallel to the first side surface 213a. A second side surface 213b extending in one direction d1 and one side of the second side surface 213b from one end of the first side surface 213a along the second direction d2 substantially perpendicular to the first direction. It may include a third side surface 213c extending in one direction and a fourth side surface 213d extending from the other end of the first side surface 213a to the other end of the second side surface 213b along the second direction d2. there is. For example, the first side surface 213a and the second side surface 213b may extend longer than the third side surface 213c and the fourth side surface 213d so that the electronic device 101 has a length. The first side surface 213a, the second side surface 213b, the third side surface 213c, and the fourth side surface 213d, together with the first surface 211 and the second surface 212, the electronic device 101 It is possible to form an internal space in which the components of the are mounted.

According to one embodiment, the side surface 213 may include a conductive material or a non-conductive material. For example, the side surface 213 may include a conductive member 215 or a non-conductive member 216 . The side surface 213 may include a plurality of conductive members 215 or non-conductive members 216, and each of the plurality of conductive members 215 or each non-conductive member 216 is spaced apart from each other. It can be.

According to one embodiment, at least one key button 220 may be disposed inside the housing 210 and partially exposed through the side surface 213 . For example, at least one key button 220 may be partially exposed to the side surface 213 of the electronic device 101 through an opening formed in the side surface 213 . When the at least one key button 220 is pressed by the user, the electronic device 101 may perform a designated function in response to pressing the at least one key button 220 . The electronic device 101 may include a plurality of key buttons 220, and each key button 220 may be associated with a different function. For example, in response to pressing at least one key button 220, the electronic device 101 performs a power on/off function, a wake up/sleep function, and a speaker volume control function of the electronic device 101. can be done At least one key button 220 may be disposed at a position corresponding to the user's finger when the user grips the electronic device 101 with one hand. For example, the key button 220 may be disposed on the left and/or right side of the housing 210 to correspond to a position corresponding to a user's thumb or index finger. .

According to one embodiment, the display 230 may be disposed on the first surface 211 of the housing 210 . The display 230 may be configured to display visual information to the outside. The electronic device 101 may include a front camera module 231 on the first surface 211 on which the display 230 is disposed. The display 230 may include a front camera module 231 that forms a recess or an opening in a portion of the screen display area of the display 230 and is aligned with the recess or the opening. According to one embodiment, since the front camera module 231 is disposed under the display 230 , at least a portion of the front camera module 231 may be covered by the display 230 . For example, the front camera module 231 may be disposed below the display 230 in an under display camera (UDC) method.

According to one embodiment, at least a portion of the rear camera module 232 and the flash 233, which are distinguished from the front camera module 231, may be exposed through the opening formed in the second surface 212. A user of the electronic device 101 may take pictures and/or videos using the front camera module 231 and the rear camera module 232 included in the electronic device 101 . The rear camera module 232 may include a plurality of cameras having different functions. For example, the rear camera module 232 may include at least one of a depth camera, a wide-angle camera, an ultra-wide-angle camera, and a telephoto camera.

According to an embodiment, the flash 233 may enhance light emitted or reflected from a subject for photographing in a low-illumination place. The flash 233 may use at least one light emitting diode to emit light toward the subject in order to enhance light emitted or reflected from the subject.

According to an embodiment, the electronic device 101 may further include an antenna array 240 , a first printed circuit board 300 and a second printed circuit board 400 .

According to an embodiment, the antenna array 240 may transmit a signal to the outside of the electronic device 101 or receive a signal from the outside of the electronic device 101 . The antenna array 240 may constitute the aforementioned antenna module (eg, the antenna module 197 of FIG. 1 ). According to one embodiment, the antenna array 240 may include a plurality of antenna elements arranged to form a directional beam. For example, the plurality of antenna elements may include a plurality of antenna arrays (eg, a dipole antenna array and/or a patch antenna array) having the same or different shapes and types. The plurality of antenna elements may increase coverage of a signal radiated from the antenna array 240 by being disposed at different locations.

According to an embodiment, the antenna array 240 may be disposed adjacent to the side surface 213 to transmit or receive a signal to the outside of the electronic device 101 through at least a portion of the side surface 213. . For example, the antenna array 240 may be disposed inside the electronic device 101 so as to be adjacent to at least one of the first side surface 213a, the second side surface 213b, and the fourth side surface 213d. .

According to an embodiment, the first printed circuit board 300 may form electrical connections between components of the electronic device 101 that perform overall operations of the electronic device 101 . For example, the first printed circuit board 300 may be a main circuit board of the electronic device 101 on which a processor (eg, the processor 120 of FIG. 1 ) is disposed. According to an embodiment, the first printed circuit board 300 includes various electronic components disposed on the first printed circuit board 300 or an electronic device 101 disposed outside the first printed circuit board 300 . ) It is possible to form electrical connections between the various components of. The first printed circuit board 300 may be electrically connected to various components of the electronic device 101 through a connecting member. For example, the connecting member may include a coaxial cable connector, a board to board connector, an interposer, or a flexible printed circuit board (FPCB). According to an embodiment, the first printed circuit board 300 may be formed based on a preimpregnated materials (PPG) board. For example, the first printed circuit board 300 may be manufactured to include an epoxy (FR-4, FR-5, G-2, G-11) material. The first printed circuit board 300 formed based on the PPG substrate may have substantially no elasticity and may have rigidity.

According to one embodiment, the second printed circuit board 400 receives a signal related to power supply or a signal related to data transmission from the first printed circuit board 300 or to the first printed circuit board 300. can transmit The second printed circuit board 400 may form an electrical connection with the first printed circuit board 300 . For example, the second printed circuit board 400 configures the antenna module 197 by mounting the antenna array 240 or mounts components of the electronic device 101 that are distinct from the antenna array 240. can do.

According to an embodiment, at least one area of the second printed circuit board 400 may be bent. For example, the second printed circuit board 400 may be bent by plastic deformation or elastic deformation. Plastic deformation may mean that the second printed circuit board 400 maintains a specific shape after receiving a force that deforms the second printed circuit board 400 into a specific shape and then removing the applied force. For example, the second printed circuit board 400 may be plastically deformed by including a plastic deformation material and receiving stress within a predetermined range. Elastic deformation may mean that the second printed circuit board 400 receives a force that deforms the second printed circuit board 400 into a specific shape and then returns to its original shape after the applied force is removed. As at least one region of the second printed circuit board 400 is bent, the second printed circuit board 400 can be mounted in various spaces inside the electronic device 101 .

According to one embodiment, the second printed circuit board 400 may be accommodated in the accommodating space 217 formed to be partially bent. For example, the storage space 217 may extend along the first direction and may have a shape partially bent along the second direction. At least a portion of the second printed circuit board 400 has a shape corresponding to the partially curved storage space 217 and may be accommodated in the storage space 217 .

As described above, in the electronic device 101 according to an embodiment, the second printed circuit board 400 is accommodated in various spaces inside the electronic device 101, thereby saving a mounting space in which components are mounted. can do. For example, when the second printed circuit board 400 does not have a curved shape, since the mounting space of the electronic device 101 is limited as the electronic device 101 is miniaturized, the second printed circuit board 400 ) may be subject to restrictions on being accommodated in the mounting space of the electronic device 101. According to an embodiment, in the electronic device 101, the second printed circuit board 400 has a curved shape and is accommodated in various storage spaces 217, thereby saving a mounting space of the electronic device 101. can

3 is a perspective view of a second printed circuit board, according to one embodiment.

Referring to FIG. 3 , in one embodiment, the second printed circuit board 400 includes an extension region 401, a bending region 402, a flexible region 403, and a connector 404. ), a signal line 405, a ground line 406, and a plurality of via holes 407. According to an embodiment, the second printed circuit board 400 may be a flexible printed circuit board having a plastic deformable material added to a partial region in a general flexible printed circuit board.

The extension area 401 may extend along one direction. According to one embodiment, the extension region 401 may extend in a straight line with substantially no curvature. According to an embodiment, at least one component (not shown) may be disposed in the extension region 401, and the at least one component (not shown) may include a connector, a switch, a resistor, a capacitor, an inductor, a diode, and a transistor. , integrated circuits, antennas, speakers, piezoelectric elements, clips, and/or brackets. According to an embodiment, the extension region 401 may be formed to be well plastically deformed by including at least one layer in which a plastically deformable material is stacked.

The bending region 402 may be bent to have a curvature. For example, the bending region 402 may be bent to have a different curvature at each point of the bending region 402 or to have the same curvature at each point. According to one embodiment, the bending area 402 may include a plastically deformable material. The plastically deformable material may be a material having characteristics of being elastically deformed in an elongation range of 10% or less and plastically deformed in an elongation range of 10% to 80%. The plastically deformable material may have a Young's modulus of 15 MPa or less in an elongation range of 10% to 80%. According to one embodiment, the plastically deformable material may be a material having a characteristic that fracture occurs in a section where the elongation is 80% or more. According to an embodiment, the second printed circuit board 400 may include a plurality of conductive layers (eg, the first conductive layer 430 and the second conductive layer 450 of FIGS. 4A and 4B). there is. For example, the second printed circuit board 400 may include a 4-layer structure including 4 conductive layers (eg, flexible copper clad laminate (FCCL)), a 3-layer structure including 3 conductive layers, or 2 It may be formed as a two-layer structure including two conductive layers (eg, see the second printed circuit board 400 of FIGS. 4A and 4B).

In one embodiment, when the second printed circuit board 400 is formed with a structure including a plurality of conductive layers, the second printed circuit board 400 includes a plurality of plastic deformable materials (eg, the combination of FIG. 4B ). It may include a layer 441 or a bonding sheet For example, when the second printed circuit board 400 is formed in a 4-layer structure including 4 conductive layers, the second printed circuit board 400 400 may include a plurality of plastically deformable materials in at least one of between the first conductive layer and the second conductive layer, between the second conductive layer and the third conductive layer, and between the third conductive layer and the fourth conductive layer. For another example, when the second printed circuit board 400 has a three-layer structure including three conductive layers, the second printed circuit board 400 includes the first conductive layer and the second conductive layer. Plastic deformation materials may be included between the layers, and between the second conductive layer and the third conductive layer, an insulating layer made of polyimide (eg, the first insulating layer 442 of FIG. 4B , the second insulating layer) (443).

In one embodiment, the plastically deformable material may be made of a polymer material including at least one of acrylic, epoxy, and/or nitrile-butadiene rubber.

According to an embodiment, the bending region 402 may be formed by plastic deformation of the extension region 401 under a predetermined range of stress. For example, the bending region 402 and the extending region 401 may be made of the same material. The bending region 402 may be formed by plastic deformation of a portion of the extension region 401 made of the same material under stress. According to an embodiment, the bending area 402 is a worker who assembles the electronic device (eg, the electronic device 101 of FIGS. 1 to 2B ) prior to assembling the electronic device into an internal space in which components are mounted. The shape can be deformed by (or assembly automation device). For example, the bending area 402 may be bent in advance before being disposed on the electronic device 101 to correspond to a bent area in the internal space of the electronic device 101 .

The flexible region 403 may mean a part of the second printed circuit board 400 that can be elastically deformed. For example, unlike the extension region 401 and the bending region 402 , the flexible region 403 may not include a plastically deformable material so as not to be plastically deformed. According to an embodiment, the flexible region 403 is not laminated with a plastic deformable material, but a shielding film (eg, EMI (electro magnetic) is formed on the same layer as the plastic deformable material (eg, the bonding layer 441 of FIG. 4B). interference) films) may be laminated or air gaps may be formed.

The connector 404 may electrically connect the second printed circuit board 400 and another printed circuit board distinct from the second printed circuit board 400 (eg, the first printed circuit board 300 of FIG. 2B ). there is. The connector 404 may be connected to the flexible region 403 . For example, connector 404 can be a plug connector in a board to board connector (btob connector).

The signal line 405 may be a movement path of a signal transmitted from the second printed circuit board 400 or a signal received from the first printed circuit board 300 . The signal line 405 may be formed along the extension area 401 and the bending area 402 . For example, the signal line 405 may be made of a metal material, but is not limited thereto.

The ground line 406 may shield unnecessary electromagnetic waves transmitted to the signal line 405 so that the signal is smoothly transmitted through the signal line 405 . According to one embodiment, the ground line 406 may be spaced apart from the signal line 405 and may extend along an edge of the signal line 405 .

A plurality of via holes 407 may be formed along the ground line 406 . The plurality of via holes 407 may form a via fence that blocks unnecessary electromagnetic waves transmitted to the signal line 405 or prevents leakage of electromagnetic waves from the signal line 405 . According to one embodiment, a plurality of via holes 407 may be formed in the extension area 401 and the bending area 402 along the ground line 406 .

According to an embodiment, the cross-sectional area of the via hole 407a formed in the bending area 402 among the plurality of via holes 407 is one surface 400a and the other surface 400b of the second printed circuit board 400. ) may be different from each other. For example, of the cross-sectional area of the via hole 407a formed in the bending region 402, the cross-sectional area adjacent to one surface 400a of the second printed circuit board 400 is the other surface of the second printed circuit board 400. It may be larger than the cross-sectional area adjacent to (400b). The curvature of the bending region 402 on one surface 400a of the second printed circuit board 400 may be smaller than that on the other surface 400b. Depending on the curvature difference between one surface 400a and the other surface 400b, a tensile force is applied to a region of the via hole 407a adjacent to the one surface 400a of the second printed circuit board 400. and a compression force may be applied to another area of the via hole 407a adjacent to the other surface 400b. When the cross-sectional area of the via hole 407a adjacent to one surface 400a of the second printed circuit board 400 is equal to the cross-sectional area of the via hole 407a adjacent to the other surface 400b, the via hole 407a It can be broken by tensile or compressive forces. According to an embodiment, in the second printed circuit board 400, the cross-sectional area of the via hole 407a formed in the bending area 402 is one surface 400a and the other surface 400b of the second printed circuit board 400. ), it is possible to prevent the via hole 407a formed in the bending region 402 from being damaged by a compressive force or a tensile force. Since the via hole 407a formed in the bending area 402 is prevented from being damaged, the second printed circuit board 400 has a plurality of via holes 407 regardless of the extension area 401 and the bending area 402. may be formed, a via fence may be formed by the plurality of via holes 407 in the entire area of the second printed circuit board 400 .

As described above, in the second printed circuit board 400 according to an embodiment, the cross-sectional area of the via hole 407a formed in the bending region 402 is equal to one surface 400a of the second printed circuit board 400. Since the adjacent area and the area adjacent to the other surface 400b are different from each other, durability in the bending area 402 can be increased. In the second printed circuit board 400, the plurality of via holes 407 may form via fences regardless of the extension area 401 and the bending area 402, so that the signal transmission of the signal line 405 is smooth. can keep it. For example, when the second printed circuit board 400 is disposed adjacent to an antenna array (eg, the antenna array 240 of FIG. 2B ), electromagnetic waves radiated from the antenna array 240, the second printed circuit board (400) may interfere with signal transmission or reception. If signal transmission to the second printed circuit board 400 is hindered, the electronic device (eg, the electronic device 101 of FIGS. 2A and 2B ) may not smoothly provide pre-designed functions to the user. According to an embodiment, in the second printed circuit board 400, a plurality of via holes 407 may be disposed without omission in both the extension area 401 and the bending area 402 where the signal line 405 is formed. , it is possible to prevent unnecessary electromagnetic waves from penetrating the signal line 405.

4A is a cross-sectional view illustrating at least a part of an example in which an extension region and a bending region of a second printed circuit board are cut along line AA′ of FIG. 3 according to an embodiment, and FIG. 4B is a cross-sectional view according to an embodiment. A cross-sectional view showing at least a part of an example in which the bending region of the second printed circuit board is cut along line BB' in FIG. 3 .

Referring to FIGS. 4A and 4B , in one embodiment, the second printed circuit board 400 includes a first cover lay 410 and a first adhesive layer 420 disposed on the first cover lay 410 . , the first conductive layer 430 disposed on the first adhesive layer 420, the non-conductive layer 440 disposed on the first conductive layer 430, and the second disposed on the non-conductive layer 440 It may include a conductive layer 450, a second adhesive layer 460 disposed on the second conductive layer 450, and a second cover lay 470 disposed on the second adhesive layer 460. . According to an embodiment, the first conductive layer 430 and the second conductive layer 450 may form a ground line (eg, the ground line 406 of FIG. 3 ) of the second printed circuit board 400 . there is.

According to an embodiment, in the bending region 402 , the plurality of layers 410 , 420 , 430 , 440 , 450 , 460 , and 470 of the second printed circuit board 400 may be bent to have a curvature. According to an embodiment, the plurality of layers 410 , 420 , 430 , 440 , 450 , 460 , and 470 may have a curvature that decreases from the other surface 400b of the second printed circuit board 400 toward one surface 400a. For example, the second cover lay 470 has a curvature smaller than the second adhesive layer 460, the second adhesive layer 460 has a curvature smaller than the second conductive layer 450, and the second adhesive layer 460 has a curvature smaller than the second conductive layer 450. The conductive layer 450 has a curvature smaller than that of the non-conductive layer 440, the non-conductive layer 440 has a curvature smaller than that of the first conductive layer 430, and the first conductive layer 43 has a first adhesive property. Layer 420 has a smaller curvature, and the first adhesive layer 420 may have a smaller curvature than the first cover lay 410 .

According to an embodiment, the non-conductive layer 440 may electrically separate the first conductive layer 430 and the second conductive layer 450 . The non-conductive layer 440 may refer to a layer through which current does not flow when a voltage less than a breakdown voltage is applied. The non-conductive layer 440 may be interposed between the first conductive layer 430 and the second conductive layer 450 . For example, the first conductive layer 430 is disposed on one surface of the non-conductive layer 440, and the second conductive layer 450 is a non-conductive layer on which the first conductive layer 430 is disposed ( 440) may be disposed on the other side facing one side.

According to an embodiment, the non-conductive layer 440 may include a bonding layer 441 , a first insulating layer 442 and a second insulating layer 443 . The bonding layer 441 may maintain the shape of the bending region 402 by including a plastically deformable material. The first insulating layer 442 may be interposed between the bonding layer 441 and the first conductive layer 430 . The second insulating layer 443 may be interposed between the bonding layer 441 and the second conductive layer 450 . For example, the first insulating layer 442 and the second insulating layer 443 may be made of a polyimide material.

According to an embodiment, the second printed circuit board 400 may further include a via hole 480 penetrating the first conductive layer 430 , the non-conductive layer 440 and the second conductive layer 450 . can The via hole 480 of FIGS. 4A and/or 4B may be substantially the same as the plurality of via holes 407 of FIG. 3 . According to one embodiment, the via hole 480 may be divided into a via hole 481 disposed in the extension area 401 and a via hole 482 disposed in the bending area 402 . According to an embodiment, a plurality of via holes 480 may be arranged to be spaced apart from each other. As the plurality of via holes 480 are arranged to be spaced apart from each other, the area where the via hole 480 is formed and the area where the via hole 480 is not formed may be sequentially repeated on the second printed circuit board 400. there is. Since the area where the via hole 480 is formed is relatively flexible and the area where the via hole 480 is not formed is relatively rigid, the overall durability of the second printed circuit board 400 may increase. there is. According to an embodiment, the via hole 480 may be a conductive hole drilled to electrically connect ground lines 406 of different conductive layers. The via hole 480 may include, for example, a plated through hole (PTH), a laser via hole (LVH), a buried via hole (BVH), or a stacked via.

According to an embodiment, the second printed circuit board 400 may include a slot-shaped conductive structure (not shown) in addition to the via hole 480 . For example, the slot is formed to have a relatively large area compared to the at least one via hole 480, and may be formed in substantially the same or similar manner as the processing method for forming the at least one via hole 480. there is. According to an embodiment, the second printed circuit board 400 has a structure that is strong against compressive force and/or tensile force generated in the via hole 482 by the slot-shaped conductive structure formed in the bending region 402. Accordingly, durability can be increased.

According to an embodiment, in the extension region 401, the cross-sectional area of the via hole 481 contacting the first conductive layer 430 and the cross-sectional area of the via hole 481 contacting the second conductive layer 450 are substantially different from each other. can be the same

According to an embodiment, in the bending region 402, a cross-sectional area of the via hole 482 contacting the first conductive layer 430 and a cross-sectional area of the via hole 482 contacting the second conductive layer 450 may be different from each other. there is. For example, the cross-sectional area of the via hole 482 contacting the first conductive layer 430 may be smaller than the cross-sectional area of the via hole 482 contacting the second conductive layer 450 . According to an embodiment, a cross-sectional area of the via hole 482 in the bending region 402 may increase as the first conductive layer 430 approaches the second conductive layer 450 . The curvature of the first conductive layer 430 in the bending region 402 may be less than the curvature of the second conductive layer 450 . According to the difference in curvature between the first conductive layer 430 and the second conductive layer 450, a compressive force acts on a region of the via hole 482 that contacts the first conductive layer 430, and A tensile force may be applied to another region of the via hole 482 that comes into contact with the layer 450 . In the bending region 402, when the cross-sectional area of the via hole 482 in contact with the first conductive layer 430 and the cross-sectional area of the via hole 482 in contact with the second conductive layer 450 are the same, the via hole 482 is , can be broken by tensile or compressive forces. According to an embodiment, in the second printed circuit board 400, the cross-sectional area of the via hole 482 formed in the bending region 402 is different between the first conductive layer 430 and the second conductive layer 450. Therefore, it is possible to prevent the via hole 482 of the bending region 402 from being damaged by compressive force or tensile force.

According to one embodiment, at least one via hole 480 may be formed by drilling at least one area of the second printed circuit board 400, but is not limited thereto. According to another embodiment, at least one via hole 480 may be formed through laser processing or punching processing. After the via hole 480 is formed, the shape of at least one via hole 482 may be deformed by using an external force on the bending region 402 . For example, by making the first conductive layer 430 and the second conductive layer 450 in which at least one via hole 482 is formed have different cross-sectional areas, the shape of the via hole 482 is polygonal (eg, trapezoidal). ) can be formed.

According to an embodiment, the second printed circuit board 400 may further include a conductive member 480a disposed inside the via hole 480 . The conductive member 480a may electrically connect the first conductive layer 430 and the second conductive layer 450 . For example, the conductive member 480a extends from the first conductive layer 430 to the second conductive layer 450 along the inner surface of the via hole 480, thereby forming the first conductive layer 430 and the second conductive layer 430. The conductive layer 450 may be electrically connected.

According to an embodiment, the inside of the via hole 480 may be filled with a conductive material, and the conductive material may include, for example, copper, silver paste, aluminum, or silver-aluminum ( silver-aluminum), carbon paste, or CNT paste (carbon nanotube paste), but is not limited thereto.

According to an embodiment, the shape of the cross section of the via hole 482 in the bending area 402 and the shape of the cross section of the via hole 481 in the extending area 401 may be different from each other. For example, the cross-sectional area of the via hole 482 included in the bending region 402 contacting the first conductive layer 430 is the first conductive layer 430 of the via hole 481 included in the extension region 401 ) may be smaller than the cross-sectional area tangent to For another example, the cross-sectional area of the via hole 482 included in the bending region 402 contacting the second conductive layer 450 is the second conductive layer of the via hole 481 included in the extension region 401 ( 430).

According to one embodiment, the bending area 402 may have different curvatures according to points. For example, the bending region 402 may have a curvature that changes depending on a point included in a path extending toward the extension region 401 . As the bending area 402 has a changed curvature, the via holes 482 formed in the bending area 402 may have different shapes. For example, a first via hole 482a and a second via hole 482b adjacent to each other may be formed in the bending region 402 . Since the bending area 402 has a variable curvature, the shape of the first via hole 482a and the shape of the second via hole 482b included in the bending area 402 may be different from each other. The difference between the cross-sectional area of the first via hole 482a in contact with the first conductive layer 430 and the cross-sectional area of the second via hole 482b in contact with the second conductive layer 450 is It may be greater than the difference between the cross-sectional area in contact with the second conductive layer 450 and the cross-sectional area in contact with the second conductive layer 450 .

According to an embodiment, the shape of the conductive member 480a disposed in the via hole 482 in the bending area 402 and the conductive member 480a disposed in the via hole 481 in the extending area 401 may be different from each other. For example, the thickness of the conductive member 480a of the via hole 482 formed in the bending region 402 may be greater than that of the conductive member 480a of the via hole 481 formed in the extension region 401. . Since the thickness of the conductive member 480a is thicker in the bending region 402 than in the extension region 401, the second printed circuit board 400 can secure an elongation rate in the bending region 402 and bend A structure that is strong against compressive force and/or tensile force acting in the region 402 can be secured.

As described above, in the second printed circuit board 400 according to an embodiment, the cross-sectional area of the via hole 482 formed in the bending region 402 is the first conductive layer 430 and the second conductive layer 450 ), so that one region of the via hole 482 in contact with the first conductive layer 430 has a structure resistant to compressive force, and the other region of the via hole 482 in contact with the second conductive layer 450 has It can have a structure that is strong against tensile force. As the via hole 482 of the bending area 402 has a structure that is strong against compressive force and tensile force, durability of the second printed circuit board 400 may be increased. According to an embodiment, the second printed circuit board 400 may have increased durability by sequentially repeating a relatively flexible region and a relatively rigid region in the bending region 402 .

According to an embodiment, the second printed circuit board 400 may prevent damage that may occur in the via hole 482 or the vicinity of the via hole 482 by improving durability in the bending area 402. there is. Since the via hole 480 can be formed in the entire area of the second printed circuit board 400 without damage in the bending area 402, the second printed circuit board 400 is It is possible to prevent interference between signals transmitted through and an external signal.

According to an embodiment, the second printed circuit board 400 may be a substrate in which a polymer material for shape molding is laminated on at least some layers of the extension area 401 and the bending area 402 and bonded with the material. there is. In addition, the second printed circuit board 400 may include an elastic dielectric for securing flexibility, a plastic dielectric for maintaining shape, and/or an additional material (eg, gold, curing ink) for inducing elastic deformation and plastic deformation. ) may be a substrate of a composite structure using.

5A is a cross-sectional view illustrating another example of an extension area and a bending area of a second printed circuit board according to an embodiment, and FIG. 5B is a cross-sectional view of another bending area of the second printed circuit board according to an embodiment. It is a cross-sectional view showing an example.

The second printed circuit board 500 of FIG. 5A and/or 5B is the second printed circuit board to which the signal pattern 590 is added ( 500), duplicate descriptions will be omitted.

Referring to FIGS. 5A and 5B , in one embodiment, the second printed circuit board 500 includes a first cover lay 510 and a first adhesive layer 520 disposed on the first cover lay 510 . , the first conductive layer 530 disposed on the first adhesive layer 520, the non-conductive layer 540 disposed on the first conductive layer 530, and the second disposed on the non-conductive layer 540. A conductive layer 550, a second adhesive layer 560 disposed on the second conductive layer 550, a second coverlay 570 disposed on the second adhesive layer 560, and a first conductive layer 530 , a via hole 580 penetrating the non-conductive layer 540 and the second conductive layer 550 .

According to one embodiment, the second printed circuit board 500 may include an extension region 501 extending along one direction and a bending region 502 bent with respect to the extension region 501 to have a curvature. . The extended region 501 and the bent region 502 of FIGS. 5A and/or 5B may be substantially the same as the extended region 401 and the bent region 402 of FIGS. should be omitted.

According to an embodiment, the first conductive layer 530 and the second conductive layer 550 may form a ground line (eg, ground line 406 of FIG. 3 ) of the second printed circuit board 500 . .

According to an embodiment, the non-conductive layer 540 may include a bonding layer 541 , a first insulating layer 542 and a second insulating layer 543 . The bonding layer 541 may maintain the shape of the bending region 502 by including a plastically deformable material. The first insulating layer 542 may be interposed between the bonding layer 541 and the first conductive layer 530 . The second insulating layer 543 may be interposed between the bonding layer 541 and the second conductive layer 550 . For example, the first insulating layer 542 and the second insulating layer 543 may be made of a polyimide material.

According to one embodiment, the second printed circuit board 500 may further include a signal pattern 590 . The signal pattern 590 may refer to a conductive pattern through which a current flows when a voltage less than a breakdown voltage is applied. The signal pattern 590 may form a signal line (eg, the signal line 405 of FIG. 3 ) of the second printed circuit board 500 . The signal pattern 590 may be interposed between the first conductive layer 530 and the second conductive layer 550 . The signal pattern 590 may be covered by the non-conductive layer 540 . For example, the signal pattern 590 may be interposed between the first insulating layer 542 and the coupling layer 541 .

According to an embodiment, the second printed circuit board 500 may further include a conductive member 580a disposed inside the via hole 580 . The conductive member 580a may electrically connect the first conductive layer 530 and the second conductive layer 550 . The via hole 580 and the conductive member 580a may be disposed to surround the signal pattern 590, so that a coaxial cable may be implemented on the second printed circuit board 500.

As described above, in the second printed circuit board 500 according to an embodiment, the cross-sectional area of the via hole 580 formed in the bending region 502 is the first conductive layer 530 and the second conductive layer 550 ), durability in the bending region 502 can be increased. According to an embodiment, in the second printed circuit board 500, the coaxial cable may be formed over the entire area regardless of the extension area 501 and the bending area 502, so that the signal pattern 590 is transmitted. Alternatively, reception may be prevented from being disturbed by unnecessary electromagnetic waves.

6 is a cross-sectional view illustrating another example of a bending region of a second printed circuit board according to an embodiment.

The second printed circuit board 600 of FIG. 6 may be the second printed circuit board 600 to which the signal pattern 690 is added in the second printed circuit board 400 of FIGS. 4A and/or 4B. , duplicate descriptions are omitted.

Referring to FIG. 6 , in one embodiment, the second printed circuit board 600 includes a first cover layer 610, a first adhesive layer 620 disposed on the first cover layer 610, and a first cover layer 610. A first conductive layer 630 disposed on the adhesive layer 620, a non-conductive layer 640 disposed on the first conductive layer 630, and a second conductive layer disposed on the non-conductive layer 640 ( 650), a second adhesive layer 660 disposed on the second conductive layer 650, a second coverlay 670 disposed on the second adhesive layer 660, and a first conductive layer 630 , a via hole 680 penetrating the non-conductive layer 640 and the second conductive layer 650 . According to one embodiment, the second printed circuit board 600 may include a bending area 602 bent to have a curvature. Since the bending area 602 of FIG. 6 may be substantially the same as the bending area 402 of FIGS. 4A and/or 4B , overlapping descriptions will be omitted.

According to an embodiment, the first conductive layer 630 and the second conductive layer 650 may form a ground line (eg, ground line 406 of FIG. 3 ) of the second printed circuit board 600 . .

According to an embodiment, the non-conductive layer 640 may include a bonding layer 641 , a first insulating layer 642 and a second insulating layer 643 . The bonding layer 641 may maintain the shape of the bending region 602 by including a plastically deformable material. The first insulating layer 642 may be interposed between the bonding layer 641 and the first conductive layer 630 . The second insulating layer 643 may be interposed between the bonding layer 641 and the second conductive layer 650 . For example, the first insulating layer 642 and the second insulating layer 643 may be made of a polyimide material.

According to one embodiment, the second printed circuit board 600 may further include a signal pattern 690 . The signal pattern 690 may refer to a conductive pattern through which a current flows when a voltage less than a breakdown voltage is applied. The signal pattern 690 may form a signal line (eg, the signal line 405 of FIG. 3 ) of the second printed circuit board 600 . The signal pattern 690 may be electrically separated from the first conductive layer 630 and the second conductive layer 650 . According to an embodiment, the signal pattern 690 has a non-conductive layer facing one surface of the non-conductive layer 640 on which the first conductive layer 630 is disposed so as to be substantially parallel to the second conductive layer 650. It may be disposed on the other side of the layer 640. For example, the signal pattern 690 may be disposed on the second insulating layer 643 of the non-conductive layer 640 .

According to an embodiment, the second printed circuit board 600 may further include a conductive member 680a disposed inside the via hole 680 . The conductive member 680a may electrically connect the first conductive layer 630 and the second conductive layer 650 . The via hole 680 and the conductive member 680a may be disposed to surround the signal pattern 690, so that a coaxial cable may be implemented on the second printed circuit board 600.

As described above, in the second printed circuit board 600 according to an embodiment, the cross-sectional area of the via hole 680 formed in the bending region 602 is the first conductive layer 630 and the second conductive layer 650 ), durability in the bending region 602 can be increased.

7A and 7B show examples in which via holes are formed on the second printed circuit board, and FIG. 7C is a graph showing a relationship between signal loss and frequency of signal lines on the second printed circuit board.

FIG. 7A shows an example of a second printed circuit board 700 in which a plurality of via holes 707 are formed in a bending area 702, and FIG. 7B shows a plurality of via holes 707 in a bending area 702'. ') is shown as an example of the second printed circuit board 700' not formed.

Referring to FIG. 7A , in one embodiment, a second printed circuit board 700 includes a first signal line 705a and a second signal line 705b disposed in an extension area 701 and a bending area 702. can include In one embodiment, the plurality of via holes 707 may be disposed to surround the first signal line 705a and the second signal line 705b in the extension area 701 and the bending area 702 . The plurality of via holes 707 may form via fences.

Referring to FIG. 7B , the second printed circuit board 700' according to the comparative example includes a first signal line 705a' and a second signal line disposed in an extension area 701' and a bending area 702'. (705b'). In the comparative example, the plurality of via holes 707' surround the first signal line 705a' and the second signal line 705b' only in the extension region 701', except for the bending region 702'. can be arranged to do so. The plurality of via holes 707' may form via fences.

Referring to FIG. 7C , graph (a) shows the relationship between the frequency and signal loss of the first signal lines 705a and 705a', and graph (b) shows the second printed circuit board 700 according to the comparative example. ') shows the relationship between the frequency of the second signal line 705b' and the signal loss, and graph (c) shows the relationship between the second signal line 705b of the second printed circuit board 700 according to an embodiment. It shows the relationship between frequency and signal loss.

In graph (a), the length of the path through which the first signal line 705a in FIG. 7A passes through the bending area 702 is greater than the length of the path through which the second signal line 705a in FIG. 7A passes through the bending area 702. can be short As the length of the path in the bending region 702 is short, resonance may not occur in the first signal line 705a of FIG. 7A. The length of the path through which the first signal line 705a' of FIG. 7B passes through the bending area 702' is shorter than the length of the path through which the second signal line 705b' of FIG. 7B passes through the bending area 702'. can As the length of the path in the bending region 702' is short, resonance may not occur in the first signal line 705a' of FIG. 7B.

In graph (b), the length of the path of the second signal line 705b' passing through the bending area 702' in FIG. 7B is the length of the path of the first signal line 705a' passing through the bending area 702'. can be longer When the plurality of via-holes 707' are not formed in the bending region 702', a gap may occur between the plurality of via-holes 707' equal to the length of the bending region 702'. If a gap occurs between the plurality of via holes 707', the plurality of via holes 707' cannot form a via fence in the bending region 702', so that a signal of a specific frequency band f Resonance may occur when passing the signal line 705b'.

In graph (c), the length of the path through which the second signal line 705b passes through the bending area 702 of FIG. 7A may be longer than the length of the path through which the first signal line 705a passes through the bending area 702. . In the case of the second printed circuit board 700 of FIG. 7A , since the plurality of via holes 707 form a via fence in the bending area 702, a signal of a specific frequency band f is transmitted through the second signal line 705b. When passing , resonance may not occur.

As described above, the second printed circuit board 700 according to an embodiment includes both the extension region 701 and the bending region 702 in which the first signal line 705a and the second signal line 705b are formed. In this case, since the plurality of via-holes 707 can be arranged without omission, it is possible to prevent resonance from occurring when a signal of a specific frequency band f passes through the second signal line 705b.

According to an embodiment, the printed circuit board (eg, the second printed circuit board 400 of FIG. 2B ) includes an extension area (eg, the extension area 401 of FIG. 3 ) extending along one direction and the extension area includes a bending region (eg, the bending region 402 of FIG. 3) that is bent with respect to, and the extension region and the bending region include a non-conductive layer (eg, the non-conductive layer 440 of Figs. 4A and 4B) , a first conductive layer disposed on one surface of the non-conductive layer (eg, the first conductive layer 430 of FIGS. 4A and 4B), and a second conductive layer disposed on the other surface of the non-conductive layer ( Example: the non-conductive layer 450 of FIGS. 4A and 4B) and a via hole passing through the non-conductive layer, the first conductive layer, and the second conductive layer (eg, the via hole 480 of FIGS. 4A and 4B) )), and in the bending region, a cross-sectional area of the via hole contacting the first conductive layer may be smaller than a cross-sectional area of the via hole contacting the second conductive layer.

According to an embodiment, a cross-sectional area of the via hole in the bending area may increase as the first conductive layer approaches the second conductive layer.

According to an embodiment, a cross-sectional area of the via hole in contact with the first conductive layer in the bending area is smaller than a cross-sectional area of the via hole in contact with the first conductive layer in the extension area, and the first conductive layer in the bending area A cross-sectional area of the via hole contacting the second conductive layer may be greater than a cross-sectional area of the via hole contacting the second conductive layer in the extension region.

According to an embodiment, the printed circuit board may include a conductive member electrically connecting the first conductive layer and the second conductive layer by extending from the first conductive layer to the second conductive layer along an inner surface of the via hole. (eg, the conductive member 480a of FIGS. 4A and 4B) may be further included.

According to an embodiment, the printed circuit board is disposed on the other surface of the non-conductive layer so as to be parallel to the second conductive layer, and the signal pattern electrically separated from the second conductive layer (eg, in FIG. 6 ). A signal pattern 690) may be further included.

According to an embodiment, the printed circuit board further includes a signal pattern (eg, the signal pattern 590 of FIGS. 5A and 5B) interposed between the first conductive layer and the second conductive layer. And, the non-conductive layer may cover the signal pattern.

According to an embodiment, the bending area includes a plurality of via holes, and among the plurality of via holes in the bending area, a cross-sectional area of one via hole in contact with the first conductive layer and the second via hole A difference in cross-sectional area contacting the conductive layer may be greater than a difference between a cross-sectional area of the other via hole contacting the first conductive layer and a cross-sectional area contacting the second conductive layer.

According to an embodiment, an electronic device (eg, the electronic device 101 of FIGS. 2A and 2B ) includes a first printed circuit board (eg, the first printed circuit board 300 of FIG. 2B ) and the first printed circuit board. A second printed circuit board including an extension area connected to the circuit board (eg, extension area 401 in FIG. 3 ) and a bending area bent with respect to the extension area (eg, bending area 402 in FIG. 3 ). (eg, the second printed circuit board 400 of FIG. 2B), and the extension region and the bending region include a non-conductive layer (eg, the non-conductive layer 440 of FIGS. 4A and 4B), the non-conductive layer A first conductive layer disposed on one surface of the conductive layer (eg, the first conductive layer 430 of FIGS. 4A and 4B ), and a second conductive layer disposed on the other surface of the non-conductive layer (eg, FIG. The non-conductive layer 450 of FIGS. 4A and 4B) and a via hole penetrating the non-conductive layer, the first conductive layer, and the second conductive layer (for example, the via hole 480 of FIGS. 4A and 4B) and, in the bending region, a cross-sectional area of the via hole contacting the first conductive layer may be smaller than a cross-sectional area of the via hole contacting the second conductive layer.

According to an embodiment, a cross-sectional area of the via hole in the bending area may increase as the first conductive layer approaches the second conductive layer.

According to an embodiment, a cross-sectional area of the via hole in contact with the first conductive layer in the bending area is smaller than a cross-sectional area of the via hole in contact with the first conductive layer in the extension area, and the first conductive layer in the bending area A cross-sectional area of the via hole contacting the second conductive layer may be greater than a cross-sectional area of the via hole contacting the second conductive layer in the extension region.

According to an embodiment, the printed circuit board may include a conductive member electrically connecting the first conductive layer and the second conductive layer by extending from the first conductive layer to the second conductive layer along an inner surface of the via hole. (eg, the conductive member 480a of FIGS. 4A and 4B) may be further included.

According to an embodiment, the printed circuit board is disposed on the other surface of the non-conductive layer so as to be parallel to the second conductive layer, and the signal pattern electrically separated from the second conductive layer (eg, in FIG. 6 ). A signal pattern 690) may be further included.

According to an embodiment, the printed circuit board further includes a signal pattern (eg, the signal pattern 590 of FIGS. 5A and 5B) interposed between the first conductive layer and the second conductive layer. And, the non-conductive layer may cover the signal pattern.

According to an embodiment, the bending area includes a plurality of via holes, and among the plurality of via holes in the bending area, a cross-sectional area of one via hole in contact with the first conductive layer and the second via hole A difference in cross-sectional area contacting the conductive layer may be greater than a difference between a cross-sectional area of the other via hole contacting the first conductive layer and a cross-sectional area contacting the second conductive layer.

According to one embodiment, the printed circuit board (eg, the second printed circuit board 400 of FIG. 3 ) includes a first cover lay (eg, the first cover lay 410 of FIGS. 4A and 4B ), the first 1 A first adhesive layer (eg, the first adhesive layer 420 in FIGS. 4A and 4B) disposed on the cover lay, and a first conductive layer (eg, the first adhesive layer 420 in FIGS. 4A and 4B) disposed on the first adhesive layer. a first conductive layer 430), a non-conductive layer disposed on the first conductive layer (eg, the non-conductive layer 440 of FIGS. 4A and 4B), and a second conductive layer disposed on the non-conductive layer. a layer (eg, the second conductive layer 450 of FIGS. 4A and 4B), a second adhesive layer disposed on the second conductive layer (eg, the second adhesive layer 460 of FIGS. 4A and 4B), A second cover lay disposed on the non-conductive layer (eg, the second cover lay 470 of FIGS. 4A and 4B) and penetrating the first conductive layer, the non-conductive layer, and the second conductive layer. It includes a plurality of via holes (eg, via holes 480 of FIGS. 4A and 4B ), and among the plurality of via holes, in a bending area (eg, bending area 402 of FIG. 3 ) of the printed circuit board. A cross-sectional area of a region of the via hole disposed in contact with the first conductive layer may be different from a cross-sectional area of a region of the via hole disposed in the bending region in contact with the second conductive layer.

According to an embodiment, the printed circuit board is disposed inside each of the plurality of via holes and extends from the first conductive layer to the second conductive layer along an inner surface of each of the plurality of via holes, so that the first conductive layer A plurality of conductive members electrically connecting the first conductive layer and the second conductive layer (eg, the conductive member 480a of FIGS. 4A and 4B) may be further included.

According to an embodiment, a cross-sectional area of a via hole disposed in the bending region among the plurality of via holes may increase from the first conductive layer toward the second conductive layer.

According to an embodiment, an extension region connected to the bending region and extending along one direction (eg, the extension region 401 of FIG. 3 ) is further included, and among the plurality of via holes, in the bending region A cross-sectional area of a via hole in contact with the first conductive layer is smaller than a cross-sectional area of a via hole in contact with the first conductive layer in the extension area, and among the plurality of via holes, a via in contact with the second conductive layer in the bending area A cross-sectional area of the hole may be greater than a cross-sectional area of a via hole contacting the second conductive layer in the extension region.

According to an embodiment, the printed circuit board further includes a signal pattern (eg, the signal pattern 690 of FIG. 6 ) interposed between the first conductive layer and the second conductive layer, A non-conductive layer may cover the signal pattern.

According to an embodiment, a difference between a cross-sectional area in contact with the first conductive layer and a cross-sectional area in contact with the second conductive layer in one via hole disposed in the bending area among the plurality of via holes is in the bending area The difference between the cross-sectional area of the other disposed via hole contacting the first conductive layer and the cross-sectional area contacting the second conductive layer may be greater.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

Various embodiments of this document provide one or more instructions stored in a storage medium (eg, internal memory 136 or external memory 138) readable by a machine (eg, electronic device 101). It may be implemented as software (eg, the program 140) including them. For example, a processor (eg, the processor 120 ) of a device (eg, the electronic device 101 ) may call at least one command among one or more instructions stored from a storage medium and execute it. This enables the device to be operated to perform at least one function according to the at least one command invoked. The one or more instructions may include code generated by a compiler or code executable by an interpreter. The device-readable storage medium may be provided in the form of a non-transitory storage medium. Here, 'non-temporary' only means that the storage medium is a tangible device and does not contain a signal (e.g. electromagnetic wave), and this term refers to the case where data is stored semi-permanently in the storage medium. It does not discriminate when it is temporarily stored.

According to one embodiment, the method according to various embodiments disclosed in this document may be provided by being included in a computer program product. Computer program products may be traded between sellers and buyers as commodities. A computer program product is distributed in the form of a device-readable storage medium (e.g. compact disc read only memory (CD-ROM)), or through an application store (e.g. Play Store™) or on two user devices (e.g. It can be distributed (eg downloaded or uploaded) online, directly between smart phones. In the case of online distribution, at least part of the computer program product may be temporarily stored or temporarily created in a device-readable storage medium such as a manufacturer's server, an application store server, or a relay server's memory.

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

Claims (20)

an extension area extending along one direction; and
Includes; a bending region bent with respect to the extension region;
The extension region and the bending region,
non-conductive layer;
a first conductive layer disposed on one surface of the non-conductive layer;
a second conductive layer disposed on the other surface of the non-conductive layer; and
A via hole passing through the non-conductive layer, the first conductive layer, and the second conductive layer;
In the bending region, the cross-sectional area of the via hole contacting the first conductive layer is
Smaller than the cross-sectional area of the via hole in contact with the second conductive layer,
printed circuit board.
According to claim 1,
The cross-sectional area of the via hole in the bending region is
Increases as the first conductive layer approaches the second conductive layer,
printed circuit board.
According to claim 1,
The cross-sectional area of the via hole in contact with the first conductive layer in the bending region is
smaller than the cross-sectional area of the via hole in contact with the first conductive layer in the extension region;
The cross-sectional area of the via hole in contact with the second conductive layer in the bending region is
greater than the cross-sectional area of the via hole in contact with the second conductive layer in the extension region;
printed circuit board.
According to claim 1,
A conductive member electrically connecting the first conductive layer and the second conductive layer by extending from the first conductive layer to the second conductive layer along the inner surface of the via hole,
printed circuit board.
According to claim 1,
A signal pattern disposed on the other surface of the non-conductive layer in parallel with the second conductive layer and electrically separated from the second conductive layer; further comprising,
printed circuit board.
According to claim 1,
Further comprising a signal pattern interposed between the first conductive layer and the second conductive layer,
The non-conductive layer,
Wrapping the signal pattern,
printed circuit board.
According to claim 1,
The bending area is
Including a plurality of via holes,
Among the plurality of via holes in the bending area,
The difference between the cross-sectional area in contact with the first conductive layer and the cross-sectional area in contact with the second conductive layer in one via hole,
greater than a difference between a cross-sectional area of the other via hole in contact with the first conductive layer and a cross-sectional area in contact with the second conductive layer,
printed circuit board.
a first printed circuit board; and
A second printed circuit board including an extension area electrically connected to the first printed circuit board and a bending area bent with respect to the extension area;
The extension region and the bending region,
non-conductive layer;
a first conductive layer disposed on one surface of the non-conductive layer;
a second conductive layer disposed on the other surface of the non-conductive layer; and
A via hole passing through the non-conductive layer, the first conductive layer, and the second conductive layer;
In the bending region, the cross-sectional area of the via hole contacting the first conductive layer is
Smaller than the cross-sectional area of the via hole in contact with the second conductive layer,
electronic device.
According to claim 8,
The cross-sectional area of the via hole in the bending region is
Increases as the first conductive layer approaches the second conductive layer,
electronic device.
According to claim 8,
The cross-sectional area of the via hole in contact with the first conductive layer in the bending region is
smaller than the cross-sectional area of the via hole in contact with the first conductive layer in the extension region;
The cross-sectional area of the via hole in contact with the second conductive layer in the bending region is
greater than the cross-sectional area of the via hole in contact with the second conductive layer in the extension region;
electronic device.
According to claim 8,
A conductive member electrically connecting the first conductive layer and the second conductive layer by extending from the first conductive layer to the second conductive layer along the inner surface of the via hole,
electronic device.
According to claim 8,
A signal pattern disposed on the other surface of the non-conductive layer in parallel with the second conductive layer and electrically separated from the second conductive layer; further comprising,
electronic device.
According to claim 8,
Further comprising a signal pattern interposed between the first conductive layer and the second conductive layer,
The non-conductive layer,
Wrapping the signal pattern,
electronic device.
According to claim 8,
The bending area is
Including a plurality of via holes,
Among the plurality of via holes in the bending area,
The difference between the cross-sectional area in contact with the first conductive layer and the cross-sectional area in contact with the second conductive layer in one via hole,
greater than a difference between a cross-sectional area of the other via hole in contact with the first conductive layer and a cross-sectional area in contact with the second conductive layer,
electronic device.
In the printed circuit board,
a first cover lay;
a first adhesive layer disposed on the first cover lay;
a first conductive layer disposed on the first adhesive layer;
a non-conductive layer disposed on the first conductive layer;
a second conductive layer disposed on the non-conductive layer;
a second adhesive layer disposed on the second conductive layer;
a second cover lay disposed on the non-conductive layer; and
a plurality of via holes penetrating the first conductive layer, the non-conductive layer, and the second conductive layer;
Among the plurality of via holes, the cross-sectional area of the via hole disposed in the bending area of the printed circuit board in contact with the first conductive layer is the cross-sectional area of the via hole disposed in the bending area in contact with the second conductive layer. different from
printed circuit board.
According to claim 15,
It is disposed inside each of the plurality of via holes and extends from the first conductive layer to the second conductive layer along an inner surface of each of the plurality of via holes, thereby electrically connecting the first conductive layer and the second conductive layer. A plurality of conductive members connected to; further comprising,
printed circuit board.
According to claim 15,
Among the plurality of via holes, the cross-sectional area of the via hole disposed in the bending region is
Increasing from the first conductive layer toward the second conductive layer,
printed circuit board.
According to claim 15,
It further includes; an extension region connected to the bending region and extending along one direction;
Among the plurality of via holes, the cross-sectional area of the via hole in contact with the first conductive layer in the bending region is
smaller than a cross-sectional area of a via hole in contact with the first conductive layer in the extension region;
Among the plurality of via holes, the cross-sectional area of the via hole in contact with the second conductive layer in the bending region is
greater than the cross-sectional area of the via hole in contact with the second conductive layer in the extension region,
printed circuit board.
According to claim 15,
Further comprising a signal pattern interposed between the first conductive layer and the second conductive layer,
The non-conductive layer,
Wrapping the signal pattern,
printed circuit board.
According to claim 15,
Among the plurality of via holes,
The difference between the cross-sectional area in contact with the first conductive layer and the cross-sectional area in contact with the second conductive layer in one via hole disposed in the bending region,
greater than a difference between a cross-sectional area of the other via hole disposed in the bending region and a cross-sectional area in contact with the first conductive layer and a cross-sectional area in contact with the second conductive layer;
printed circuit board.

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