KR20230116643A - Electronic device comprising interposer board - Google Patents

Abstract

An electronic device may be provided. The electronic device includes: a housing; a communication module disposed within the housing; a first power management module configured to control power delivered to the communication module; a processor disposed within the housing; and an interposer substrate disposed within the housing, wherein the interposer substrate includes a first substrate including a first side on which the communication module is located and a second side opposite the first side and on which the first power management module is located, a second substrate including a third side facing the second side and a fourth side opposite the third side and on which the processor is located and an interposer disposed between the first substrate and the second substrate. The second substrate has a first area facing the first power management module, a second area surrounding at least a portion of the first area, and at least one wire located in the first area for supplying power to the processor or charging the electronic device. Therefore, noise and heat generated from the communication module can be reduced.

Description

Electronic device including an interposer board {ELECTRONIC DEVICE COMPRISING INTERPOSER BOARD}

Various embodiments of the present disclosure relate to an electronic device including an interposer substrate.

Due to the development of information and communication technology and semiconductor technology, various functions are being integrated into a single portable electronic device. For example, an electronic device may implement not only a communication function, but also an entertainment function such as a game, a multimedia function such as music/video playback, a communication and security function for mobile banking, and a schedule management and electronic wallet function. These electronic devices are miniaturized so that users can conveniently carry them.

In order to provide a miniaturized electronic device, the electronic device may include an interposer substrate in which a plurality of substrates are stacked. However, when the width of the interposer board is increased, a space in which other components (eg, batteries) of the electronic device are disposed may be reduced. In addition, when the interposer substrate includes components stacked to overlap on four sides, the thickness of the interposer is increased, so that the thickness of the electronic device can be reduced.

Accordingly, the interposer substrate may have a structure in which the communication module and the first power management module for the communication module are disposed on different substrates. However, when the first power management module and the communication module are disposed on different substrates, the length of the electrical path increases, and thus noise generated from the communication module may increase.

According to various embodiments of the present disclosure, an electronic device capable of reducing noise and heat generated from a communication module and reducing heat generated during charging of the electronic device may be provided.

The problem to be solved in the present disclosure is not limited to the above-mentioned problem, and may be expanded in various ways without departing from the spirit and scope of the present disclosure.

According to various embodiments of the present disclosure, an electronic device includes a housing, a communication module disposed within the housing, a first power management module configured to control power delivered to the communication module, a processor disposed within the housing, and a communication module disposed within the housing. An interposer substrate disposed on which a first substrate including a first surface on which the communication module is located and a second surface opposite to the first surface and on which the first power management module is located, and a third substrate facing the second surface And an interposer substrate including a second substrate including a surface and a fourth surface opposite to the third surface and on which the processor is located, and an interposer disposed between the first substrate and the second substrate, wherein the The second substrate includes a first area facing the first power management module, a second area surrounding at least a portion of the first area, and a second substrate disposed in the first area to supply power to the processor or charge the electronic device. It may include at least one wiring for.

According to various embodiments of the present disclosure, an electronic device includes a housing, a communication module disposed in the housing, a battery disposed in the housing, a first power management module configured to control power delivered to the communication module, and a battery A charging circuit configured to control a supplied current, a processor disposed in the housing, and an interposer substrate disposed in the housing, a first surface on which the communication module is located and opposite to the first surface, wherein the first power management module A second substrate including a first substrate including a second surface on which the processor and the charging circuit are located, a third surface facing the second surface and a fourth surface opposite to the third surface on which the processor and the charging circuit are located, 1 including a second substrate including a first area facing a power management module and a second area surrounding at least a portion of the first area, and an interposer disposed between the first substrate and the second substrate A conductive member disposed on the interposer substrate and the third surface and electrically connected to the charging circuit as a conductive member positioned in the first region may be included.

According to various embodiments of the present disclosure, an electronic device may include an interposer board accommodating a communication module and a first power management module disposed to overlap the communication module. For example, the communication module may be electrically connected to the first power management module with one substrate interposed therebetween. Noise and heat generated in the communication module may be reduced by reducing the length of the electrical path between the first power management module and the communication module.

According to various embodiments of the present disclosure, an electronic device may include an interposer board on which components are alternately disposed. For example, the interposer substrate may include a first substrate including a first side on which the communication module is located and a second side opposite to the first side and on which the first power management module is located, and a third side facing the second side and a second side facing the second side. It may include a second substrate opposite of the three sides and including a fourth side on which the processor is located. The second substrate may include a first region facing the first power management module. Since the first power management module is not disposed on the third surface of the first area, the first area does not include wires used in the first power management module, but may include wires used for charging the electronic device. . Heat generation of the electronic device may be reduced by increasing the area of the wiring for charging the electronic device.

In addition to this, various effects identified directly or indirectly through this document may be provided.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.
2 is a front perspective view of an electronic device according to various embodiments of the present disclosure.
3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.
4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.
5 is a front perspective view of an interposer board on which electronic components are mounted, according to various embodiments of the present disclosure.
6 is a rear perspective view of an interposer board on which electric vehicle parts are mounted, according to various embodiments of the present disclosure.
7 is a schematic diagram illustrating electronic components disposed in an interposer of an electronic device according to various embodiments of the present disclosure.
8 is a cross-sectional view of a second substrate, in accordance with various embodiments of the present disclosure.
9 and 10 are schematic diagrams of an electronic device including a conductive member according to various embodiments of the present disclosure.

1 is a block diagram of an electronic device in a network environment according to various embodiments of the present disclosure.

Referring to FIG. 1 , in a network environment 100, an electronic device 101 communicates with an electronic device 102 through a first network 198 (eg, a short-range wireless communication network) or through a second network 199. It is possible to communicate with the electronic device 104 or the server 108 through (eg, a long-distance wireless communication network). According to an embodiment, the electronic device 101 may communicate with the electronic device 104 through the server 108 . According to an embodiment, the electronic device 101 includes a processor 120, a memory 130, an input module 150, an audio output module 155, a display module 160, an audio module 170, a sensor module ( 176), interface 177, connection terminal 178, haptic module 179, camera module 180, power management module 188, battery 189, communication module 190, subscriber identification module 196 , or the antenna module 197 may be included. In some embodiments, in the electronic device 101, at least one of these components (eg, the connection terminal 178) may be omitted or one or more other components may be added. In some embodiments, some of these components (eg, sensor module 176, camera module 180, or antenna module 197) are integrated into a single component (eg, display module 160). It can be.

The processor 120, for example, executes software (eg, the program 140) to cause at least one other component (eg, hardware or software component) of the electronic device 101 connected to the processor 120. It can control and perform various data processing or calculations. According to one embodiment, as at least part of data processing or operation, processor 120 transfers instructions or data received from other components (e.g., sensor module 176 or communication module 190) to volatile memory 132. , processing commands or data stored in the volatile memory 132 , and storing resultant data in the non-volatile memory 134 . According to an embodiment, the processor 120 may include a main processor 121 (eg, a central processing unit or an application processor), or a secondary processor 123 (eg, a graphic processing unit, a neural network processing unit) that may operate independently of or together with the main processor 121 . (NPU: neural processing unit), image signal processor, sensor hub processor, or communication processor). For example, when the electronic device 101 includes the main processor 121 and the auxiliary processor 123, the auxiliary processor 123 uses less power than the main processor 121 or is set to be specialized for a designated function. It can be. The secondary processor 123 may be implemented separately from or as part of the main processor 121 .

The secondary processor 123 may, for example, take the place of the main processor 121 while the main processor 121 is in an inactive (eg, sleep) state, or the main processor 121 is active (eg, running an application). ) state, together with the main processor 121, at least one of the components of the electronic device 101 (eg, the display module 160, the sensor module 176, or the communication module 190) It is possible to control at least some of the related functions or states. According to one embodiment, the auxiliary processor 123 (eg, an image signal processor or a communication processor) may be implemented as part of other functionally related components (eg, the camera module 180 or the communication module 190). there is. According to an embodiment, the auxiliary processor 123 (eg, a neural network processing device) may include a hardware structure specialized for processing an artificial intelligence model. AI models can be created through machine learning. Such learning may be performed, for example, in the electronic device 101 itself where artificial intelligence is performed, or may be performed through a separate server (eg, the server 108). The learning algorithm may include, for example, supervised learning, unsupervised learning, semi-supervised learning or reinforcement learning, but in the above example Not limited. The artificial intelligence model may include a plurality of artificial neural network layers. Artificial neural networks include deep neural networks (DNNs), convolutional neural networks (CNNs), recurrent neural networks (RNNs), restricted boltzmann machines (RBMs), deep belief networks (DBNs), bidirectional recurrent deep neural networks (BRDNNs), It may be one of deep Q-networks or a combination of two or more of the foregoing, but is not limited to the foregoing examples. The artificial intelligence model may include, in addition or alternatively, software structures in addition to hardware structures.

The memory 130 may store various data used by at least one component (eg, the processor 120 or the sensor module 176) of the electronic device 101 . The data may include, for example, input data or output data for software (eg, program 140) and commands related thereto. The memory 130 may include volatile memory 132 or non-volatile memory 134 .

The program 140 may be stored as software in the memory 130 and may include, for example, an operating system 142 , middleware 144 , or an application 146 .

The input module 150 may receive a command or data to be used by a component (eg, the processor 120) of the electronic device 101 from the outside of the electronic device 101 (eg, a user). The input module 150 may include, for example, a microphone, a mouse, a keyboard, a key (eg, a button), or a digital pen (eg, a stylus pen).

The sound output module 155 may output sound signals to the outside of the electronic device 101 . The sound output module 155 may include, for example, a speaker or a receiver. The speaker can be used for general purposes such as multimedia playback or recording playback. A receiver may be used to receive an incoming call. According to one embodiment, the receiver may be implemented separately from the speaker or as part of it.

The display module 160 may visually provide information to the outside of the electronic device 101 (eg, a user). The display module 160 may include, for example, a display, a hologram device, or a projector and a control circuit for controlling the device. According to an embodiment, the display module 160 may include a touch sensor configured to detect a touch or a pressure sensor configured to measure the intensity of force generated by the touch.

The audio module 170 may convert sound into an electrical signal or vice versa. According to an embodiment, the audio module 170 acquires sound through the input module 150, the sound output module 155, or an external electronic device connected directly or wirelessly to the electronic device 101 (eg: Sound may be output through the electronic device 102 (eg, a speaker or a headphone).

The sensor module 176 detects an operating state (eg, power or temperature) of the electronic device 101 or an external environmental state (eg, a user state), and generates an electrical signal or data value corresponding to the detected state. can do. According to one embodiment, the sensor module 176 may include, for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a bio sensor, It may include a temperature sensor, humidity sensor, or light sensor.

The interface 177 may support one or more designated protocols that may be used to directly or wirelessly connect the electronic device 101 to an external electronic device (eg, the electronic device 102). According to one embodiment, the interface 177 may include, for example, a high definition multimedia interface (HDMI), a universal serial bus (USB) interface, an SD card interface, or an audio interface.

The connection terminal 178 may include a connector through which the electronic device 101 may be physically connected to an external electronic device (eg, the electronic device 102). According to one embodiment, the connection terminal 178 may include, for example, an HDMI connector, a USB connector, an SD card connector, or an audio connector (eg, a headphone connector).

The haptic module 179 may convert electrical signals into mechanical stimuli (eg, vibration or motion) or electrical stimuli that a user may perceive through tactile or kinesthetic senses. According to one embodiment, the haptic module 179 may include, for example, a motor, a piezoelectric element, or an electrical stimulation device.

The camera module 180 may capture still images and moving images. According to one embodiment, the camera module 180 may include one or more lenses, image sensors, image signal processors, or flashes.

The power management module 188 may manage power supplied to the electronic device 101 . According to one embodiment, the power management module 188 may be implemented as at least part of a power management integrated circuit (PMIC), for example.

The battery 189 may supply power to at least one component of the electronic device 101 . According to one embodiment, the battery 189 may include, for example, a non-rechargeable primary cell, a rechargeable secondary cell, or a fuel cell.

The communication module 190 is a direct (eg, wired) communication channel or a wireless communication channel between the electronic device 101 and an external electronic device (eg, the electronic device 102, the electronic device 104, or the server 108). Establishment and communication through the established communication channel may be supported. The communication module 190 may include one or more communication processors that operate independently of the processor 120 (eg, an application processor) and support direct (eg, wired) communication or wireless communication. According to one embodiment, the communication module 190 may be a wireless communication module 192 (eg, a cellular communication module, a short-range wireless communication module, or a global navigation satellite system (GNSS) communication module) or a wired communication module 194 (eg, a : a local area network (LAN) communication module or a power line communication module). Among these communication modules, a corresponding communication module is a first network 198 (eg, a short-range communication network such as Bluetooth, wireless fidelity (WiFi) direct, or infrared data association (IrDA)) or a second network 199 (eg, a legacy communication module). It may communicate with an external electronic device through a cellular network, a 5G network, a next-generation communication network, the Internet, or a telecommunications network such as a computer network (eg, LAN or WAN). These various types of communication modules may be integrated into one component (eg, a single chip) or implemented as a plurality of separate components (eg, multiple chips). The wireless communication module 192 uses subscriber information (eg, International Mobile Subscriber Identifier (IMSI)) stored in the subscriber identification module 196 within a communication network such as the first network 198 or the second network 199. The electronic device 101 may be identified or authenticated.

The wireless communication module 192 may support a 5G network after a 4G network and a next-generation communication technology, for example, NR access technology (new radio access technology). NR access technologies include high-speed transmission of high-capacity data (enhanced mobile broadband (eMBB)), minimization of terminal power and access of multiple terminals (massive machine type communications (mMTC)), or high reliability and low latency (ultra-reliable and low latency (URLLC)). -latency communications)) can be supported. The wireless communication module 192 may support a high frequency band (eg, mmWave band) to achieve a high data rate, for example. The wireless communication module 192 uses various technologies for securing performance in a high frequency band, such as beamforming, massive multiple-input and multiple-output (MIMO), and full-dimensional multiplexing. Technologies such as input/output (FD-MIMO: full dimensional MIMO), array antenna, analog beam-forming, or large scale antenna may be supported. The wireless communication module 192 may support various requirements defined for the electronic device 101, an external electronic device (eg, the electronic device 104), or a network system (eg, the second network 199). According to one embodiment, the wireless communication module 192 may be used to realize peak data rate (eg, 20 Gbps or more) for realizing eMBB, loss coverage (eg, 164 dB or less) for realizing mMTC, or U-plane latency (for realizing URLLC). Example: downlink (DL) and uplink (UL) each of 0.5 ms or less, or round trip 1 ms or less) may be supported.

The antenna module 197 may transmit or receive signals or power to the outside (eg, an external electronic device). According to an embodiment, the antenna module may include an antenna including a radiator formed of a conductor or a conductive pattern formed on a substrate (eg, PCB). According to one embodiment, the antenna module 197 may include a plurality of antennas (eg, an array antenna). In this case, at least one antenna suitable for a communication method used in a communication network such as the first network 198 or the second network 199 is selected from the plurality of antennas by the communication module 190, for example. can be chosen A signal or power may be transmitted or received between the communication module 190 and an external electronic device through the selected at least one antenna. According to some embodiments, other components (eg, a radio frequency integrated circuit (RFIC)) may be additionally formed as a part of the antenna module 197 in addition to the radiator.

According to various embodiments, the antenna module 197 may form a mmWave antenna module. According to one embodiment, the mmWave antenna module includes a printed circuit board, an RFIC disposed on or adjacent to a first surface (eg, a lower surface) of the printed circuit board and capable of supporting a designated high frequency band (eg, mmWave band); and a plurality of antennas (eg, array antennas) disposed on or adjacent to a second surface (eg, a top surface or a side surface) of the printed circuit board and capable of transmitting or receiving signals of the designated high frequency band. can do.

At least some of the components are connected to each other through a communication method between peripheral devices (eg, a bus, general purpose input and output (GPIO), serial peripheral interface (SPI), or mobile industry processor interface (MIPI)) and signal ( e.g. commands or data) can be exchanged with each other.

According to an embodiment, commands or data may be transmitted or received between the electronic device 101 and the external electronic device 104 through the server 108 connected to the second network 199 . Each of the external electronic devices 102 or 104 may be the same as or different from the electronic device 101 . According to an embodiment, all or part of operations executed in the electronic device 101 may be executed in one or more external devices among the external electronic devices 102 , 104 , and 108 . For example, when the electronic device 101 needs to perform a certain function or service automatically or in response to a request from a user or another device, the electronic device 101 instead of executing the function or service by itself. Alternatively or additionally, one or more external electronic devices may be requested to perform the function or at least part of the service. One or more external electronic devices receiving the request may execute at least a part of the requested function or service or an additional function or service related to the request, and deliver the execution result to the electronic device 101 . The electronic device 101 may provide the result as at least part of a response to the request as it is or additionally processed. To this end, for example, cloud computing, distributed computing, mobile edge computing (MEC), or client-server computing technology may be used. The electronic device 101 may provide an ultra-low latency service using, for example, distributed computing or mobile edge computing. In another embodiment, the external electronic device 104 may include an internet of things (IoT) device. Server 108 may be an intelligent server using machine learning and/or neural networks. According to one embodiment, the external electronic device 104 or server 108 may be included in the second network 199 . The electronic device 101 may be applied to intelligent services (eg, smart home, smart city, smart car, or health care) based on 5G communication technology and IoT-related technology.

Electronic devices according to various embodiments disclosed in this document may be devices of various types. The electronic device may include, for example, a portable communication device (eg, a smart phone), a computer device, a portable multimedia device, a portable medical device, a camera, a wearable device, or a home appliance. An electronic device according to an embodiment of the present document is not limited to the aforementioned devices.

Various embodiments of this document and terms used therein are not intended to limit the technical features described in this document to specific embodiments, but should be understood to include various modifications, equivalents, or substitutes of the embodiments. In connection with the description of the drawings, like reference numbers may be used for like or related elements. The singular form of a noun corresponding to an item may include one item or a plurality of items, unless the relevant context clearly dictates otherwise. In this document, "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "A Each of the phrases such as "at least one of , B, or C" may include any one of the items listed together in that phrase, or all possible combinations thereof. Terms such as "first", "second", or "first" or "secondary" may simply be used to distinguish a given component from other corresponding components, and may be used to refer to a given component in another aspect (eg, importance or order) is not limited. A (e.g., first) component is said to be "coupled" or "connected" to another (e.g., second) component, with or without the terms "functionally" or "communicatively." When mentioned, it means that the certain component may be connected to the other component directly (eg by wire), wirelessly, or through a third component.

The term "module" used in various embodiments of this document may include a unit implemented in hardware, software, or firmware, and is interchangeable with terms such as, for example, logic, logical blocks, parts, or circuits. can be used as A module may be an integrally constructed component or a minimal unit of components or a portion thereof that performs one or more functions. For example, according to one embodiment, the module may be implemented in the form of an application-specific integrated circuit (ASIC).

According to various embodiments, each component (eg, module or program) of the above-described components may include a single object or a plurality of entities, and some of the plurality of entities may be separately disposed in other components. there is. According to various embodiments, one or more components or operations among the aforementioned corresponding components may be omitted, or one or more other components or operations may be added. Alternatively or additionally, a plurality of components (eg modules or programs) may be integrated into a single component. In this case, the integrated component may perform one or more functions of each of the plurality of components identically or similarly to those performed by a corresponding component of the plurality of components prior to the integration. . According to various embodiments, the actions performed by a module, program, or other component are executed sequentially, in parallel, iteratively, or heuristically, or one or more of the actions are executed in a different order, or omitted. or one or more other actions may be added.

2 is a front perspective view of an electronic device according to various embodiments of the present disclosure. 3 is a rear perspective view of an electronic device according to various embodiments of the present disclosure.

Referring to FIGS. 2 and 3 , the electronic device 200 according to an embodiment includes a front surface 210A, a rear surface 210B, and a side surface 210C surrounding a space between the front surface 210A and the rear surface 210B. ) It may include a housing 210 including a. In another embodiment (not shown), the housing 210 may refer to a structure forming some of the front face 210A of FIG. 2 , the rear face 210B and the side face 210C of FIG. 3 . For example, the housing 210 may include a front plate 202 and a rear plate 211 . According to one embodiment, at least a portion of the front surface 210A may be formed by a substantially transparent front plate 202 (eg, a glass plate or polymer plate including various coating layers). The rear surface 210B may be formed by the rear plate 211 . The back plate 211 may be, for example, glass, ceramic, polymer, metal (eg, titanium (Ti), stainless steel (STS), aluminum (Al) and/or magnesium (Mg)), or the above materials. It may be formed by a combination of at least two of them. The side surface 210C may be formed by a side bezel structure (or "side member") 218 coupled to the front plate 202 and the rear plate 211 and including metal and/or polymer. In some embodiments, the back plate 211 and the side bezel structure 218 may be integrally formed and include the same material (eg, glass, a metal material such as aluminum, or ceramic). According to another embodiment, the front surface 210A and/or the front plate 202 may be interpreted as part of the display 220 .

According to an embodiment, the electronic device 200 includes a display 220, audio modules 203, 207, and 214 (eg, the audio module 170 of FIG. 1), and a sensor module (eg, the sensor module of FIG. 1). 176), camera modules 205 and 206 (eg, camera module 180 of FIG. 1), key input device 217 (eg, input module 150 of FIG. 1), and connector hole 208, 209) (eg, the connection terminal 178 of FIG. 1). In some embodiments, the electronic device 200 may omit at least one of the components (eg, the connector hole 209) or may additionally include other components. According to one embodiment, display 220 may be visually exposed, for example, through a substantial portion of front plate 202 .

According to one embodiment, the surface of the housing 210 (or the front plate 202 ) may include a screen display area formed as the display 220 is visually exposed. For example, the screen display area may include the front surface 210A.

According to an embodiment, the electronic device 200 includes a recess or opening formed in a portion of a screen display area (eg, the front surface 210A) of the display 220 and is aligned with the recess or opening. It may include at least one or more of an audio module 214, a sensor module (not shown), a light emitting device (not shown), and a camera module 205. In another embodiment (not shown), on the rear surface of the screen display area of the display 220, an audio module 214, a sensor module (not shown), a camera module 205, a fingerprint sensor (not shown), and a light emitting element (not shown) may include at least one or more.

According to an embodiment, the display 220 may be combined with or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring the strength (pressure) of a touch, and/or a digitizer detecting a magnetic stylus pen. there is.

According to one embodiment, the audio modules 203 , 207 , and 214 may include, for example, a microphone hole 203 and speaker holes 207 and 214 . A microphone for acquiring external sound may be disposed inside the microphone hole 203, and in some embodiments, a plurality of microphones may be disposed to detect the direction of sound. The speaker holes 207 and 214 may include an external speaker hole 207 and a receiver hole 214 for communication. In some embodiments, the speaker holes 207 and 214 and the microphone hole 203 may be implemented as one hole, or a speaker may be included without the speaker holes 207 and 214 (eg, a piezo speaker).

According to an embodiment, the sensor module (not shown) may generate an electrical signal or data value corresponding to an internal operating state of the electronic device 200 or an external environmental state. The sensor module (not shown) may include, for example, a first sensor module (not shown) (eg, a proximity sensor) and/or a second sensor module (not shown) disposed on the front surface 210A of the housing 210 ( eg a fingerprint sensor). A sensor module (not shown) includes a third sensor module (not shown) (eg HRM sensor) and/or a fourth sensor module (not shown) (eg fingerprint sensor) disposed on the rear surface 210B of the housing 210. ) may be included. In some embodiments (not shown), the fingerprint sensor may be disposed on the rear surface 210B as well as the front surface 210A (eg, the display 220 ) of the housing 210 . The electronic device 200 includes a sensor module (not shown), for example, a gesture sensor, a gyro sensor, an air pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a bio sensor, a temperature sensor, At least one of a humidity sensor and an illuminance sensor (not shown) may be further included.

According to one embodiment, the camera modules 205 and 206 include, for example, a front camera module 205 disposed on the front surface 210A of the electronic device 200 and a rear camera module disposed on the rear surface 210B. 206 , and/or flash 204 . The camera modules 205 and 206 may include one or a plurality of lenses, an image sensor, and/or an image signal processor. The flash 204 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (infrared camera, wide-angle and telephoto lenses) and image sensors may be disposed on one side of the electronic device 200 .

According to one embodiment, the key input device 217 may be disposed on the side surface 210C of the housing 210 . In another embodiment, the electronic device 200 may not include some or all of the above-mentioned key input devices 217, and the key input devices 217 that are not included are on the display 220, such as soft keys. It can be implemented in different forms. According to one embodiment, at least a part of the key input device 217 may be disposed on the side bezel structure 218 .

According to one embodiment, a light emitting device (not shown) may be disposed on, for example, the front surface 210A of the housing 210 . A light emitting element (not shown) may provide, for example, state information of the electronic device 200 in the form of light. In another embodiment, a light emitting device (not shown) may provide, for example, a light source interlocked with the operation of the front camera module 205 . The light emitting device (not shown) may include, for example, an LED, an IR LED, and/or a xenon lamp.

According to one embodiment, the connector holes 208 and 209 are, for example, connectors (eg, USB connectors) for transmitting and receiving power and/or data to and from external electronic devices or audio signals to and from external electronic devices. a first connector hole 208 capable of receiving a connector (eg, an earphone jack) for a storage device (eg, a subscriber identification module (SIM) card) and/or a second connector capable of receiving a storage device (eg, a subscriber identification module (SIM) card) Hole 209 may be included. According to one embodiment, the first connector hole 208 and/or the second connector hole 209 may be omitted.

4 is an exploded perspective view of an electronic device according to various embodiments of the present disclosure.

Referring to FIG. 4 , an electronic device 200 (eg, the electronic device 200 of FIGS. 2 and 3 ) includes a front plate 222 (eg, the front plate 202 of FIG. 2 ), a display 220 (eg display 220 of FIG. 2), bracket 232 (eg front support member), printed circuit board 240, battery 250, rear case 260 (eg rear support member), antenna 270 and a back plate 280 (eg, the back plate 211 of FIG. 3). According to an embodiment, the electronic device 200 may omit at least one of the components (eg, the rear case 260) or may additionally include other components. At least one of the components of the electronic device 200 may be the same as or similar to at least one of the components of the electronic device 200 of FIG. 2 or 3, and duplicate descriptions are omitted below.

According to an embodiment, the bracket 232 may be disposed inside the electronic device 200 and connected to the side bezel structure 231 or integrally formed with the side bezel structure 231 . The bracket 232 may be formed of, for example, a metal material and/or a non-metal (eg, polymer) material. The bracket 232 may accommodate the display 220 on one side and the printed circuit board 240 on the other side. The printed circuit board 240 includes a processor (eg, the processor 120 of FIG. 1 ), a memory (eg, the memory 130 of FIG. 1 ), and/or an interface (eg, the interface 177 of FIG. 1 ). can be fitted

According to one embodiment, the battery 250 is a device for supplying power to at least one component (eg, the camera module 212) of the electronic device 200, for example, a non-rechargeable primary battery, or a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 250 may be disposed on substantially the same plane as the printed circuit board 240 , for example. The battery 250 may be integrally disposed inside the electronic device 200 or may be disposed detachably from the electronic device 200 .

According to one embodiment, the rear case 260 may be disposed between the printed circuit board 240 and the antenna 270 . For example, the rear case 260 may include one surface to which at least one of the printed circuit board 240 or the battery 250 is coupled, and the other surface to which the antenna 270 is coupled.

According to one embodiment, the antenna 270 may be disposed between the rear plate 280 and the battery 250 . The antenna 270 may include, for example, a near field communication (NFC) antenna, a wireless charging antenna, and/or a magnetic secure transmission (MST) antenna. The antenna 270 may, for example, perform short-range communication with an external device or wirelessly transmit/receive power required for charging. For example, the antenna 270 may include a coil for wireless charging. In another embodiment, an antenna structure may be formed by a part of the side bezel structure 231 and/or the bracket 232 or a combination thereof.

According to various embodiments, the electronic device 200 may include a camera module 212 disposed in a housing (eg, the housing 210 of FIG. 2 ). According to an embodiment, the camera module 212 is disposed on the bracket 232 and is a rear camera module (eg, a rear camera module capable of obtaining an image of a subject located in the rear (eg, -Z direction) of the electronic device 200). : It may be the camera module 212 of FIG. 3). According to an embodiment, at least a portion of the camera module 212 may be exposed to the outside of the electronic device 200 through the opening 282 formed in the rear plate 280 .

The electronic device 200 disclosed in FIGS. 2 to 4 has a bar-type or plate-type appearance, but the present invention is not limited thereto. For example, the illustrated electronic device may be a rollable electronic device or a foldable electronic device. A “rollable electronic device” means that a display (e.g., the display 220 of FIG. 4) can be bent or deformed, so that at least a portion thereof is rolled or rolled, or a housing (e.g., the display 220 of FIG. 2) can be bent or deformed. It may refer to an electronic device that can be accommodated inside the housing 210 . Depending on the needs of the user, the rollable electronic device can be used by expanding the screen display area by unfolding the display or exposing a larger area of the display to the outside.

5 is a front perspective view of an interposer board on which electronic components are mounted, according to various embodiments of the present disclosure. 6 is a rear perspective view of an interposer board on which electric vehicle parts are mounted, according to various embodiments of the present disclosure. 7 is a schematic diagram illustrating electronic components disposed in an interposer of an electronic device according to various embodiments of the present disclosure.

5, 6 and/or 7, the electronic device 200 includes power management modules 410 and 420, a communication module 460, a processor 470, a memory 480, and an interposer board 300. ) may be included. The configuration of the power management modules 410 and 420, the communication module 460, the processor 470 and the memory 480 of FIGS. 5, 6 and/or 7 is the power management module 188 of FIG. 1, the communication module 190, the processor 120 and the memory 130 are all or partly the same, and the configuration of the interposer board 300 of FIGS. 5 to 7 is the same as the configuration of the printed circuit board 240 of FIG. It may be the same as all or part of it.

According to various embodiments, the interposer substrate 300 may accommodate electronic components of the electronic device 200 . For example, the interposer substrate 300 may accommodate a first power management module 410, a second power management module 420, a communication module 460, a processor 470, and/or a memory 480. there is. According to an embodiment, the interposer board 300 may be disposed within a housing (eg, the housing 210 of FIG. 3 ) of the electronic device 101 .

According to various embodiments, the interposer substrate 300 may include a plurality of substrates. For example, the interposer substrate 300 may include a first substrate 310, a second substrate 320, and an interposer 330 disposed between the first substrate 310 and the second substrate 320. can According to one embodiment, the first substrate 310 and the second substrate 320 may be substantially parallel to each other. For example, the first substrate 310 and the second substrate 320 may be positioned along the width (eg, XY plane) direction of the electronic device 200 . According to an embodiment, each of the first substrate 310 and/or the second substrate 320 may be a circuit board including at least one layer. According to an embodiment, the interposer 330 may be a sidewall that surrounds at least a portion between the first substrate 310 and the second substrate 320 . For example, at least a portion of the interposer 330 may be formed in a closed curve shape.

According to various embodiments, the first substrate 310 may accommodate the communication module 460 . For example, the first substrate 310 may include a first surface 311 and a second surface 312 opposite to the first surface 311 . The communication module 460 may be disposed on the first surface 311 . According to one embodiment, the first substrate 310 may be referred to as a radio frequency (RF) substrate or a master substrate.

According to various embodiments, the communication module 460 may include components for communicating with an external electronic device (eg, the electronic device 104 of FIG. 1 ) of the electronic device 200 . For example, the communication module 460 may include an amplifier 461 and a transceiver 462 . According to one embodiment, the amplifier 461 may be a power amplifier (PAM) and/or a low noise amplifier (LNA). According to an embodiment, the transceiver 462 may transmit a signal to the external electronic device 104 or receive a signal from the external electronic device 104 .

According to various embodiments, the first substrate 310 may accommodate the first power management module 410 for controlling power delivered to the communication module 460 . For example, the first power management module 410 can be disposed on the second side 312 . According to an embodiment, the first power management module 410 and the communication module 460 may be disposed on the opposite side of the same substrate. For example, the communication module 460 is disposed on the first surface 311 of the first substrate 310, and the first power management module 410 is disposed on the second surface 312 of the first substrate 310. can be placed on top. According to an embodiment, the first power management module 410 may be surrounded by the first substrate 310 , the second substrate 320 and the interposer 330 . Since the first power management module 410 is located inside the interposer board 300, the noise caused by the first power management module 410 is generated by the first board 310, the second board and/or the interposer 330. ) can be shielded by According to one embodiment, the first power management module 410 may be referred to as a radio frequency power management module.

According to various embodiments, the first power management module 410 may be electrically connected to the communication module 460 using the first substrate 310 . According to an embodiment, at least a portion of the first power management module 410 may overlap at least a portion of the amplifier 461 and/or at least a portion of the transceiver 462 . A portion of the first substrate 310 may be disposed between the first power management module 410 and the communication module 460 . For example, when looking at the interposer substrate 300 from above the interposer substrate 300 (eg, in the +Z direction), at least a portion of the amplifier 461 and at least a portion of the transceiver 462 are first power At least a portion of the management module 410 may be located on the same width plane (eg, XY plane). According to an embodiment, the first power management module 410 may supply power to the communication module 460 (eg, the amplifier 461) through the first path P1. At least a portion of the first path P1 may be a conductive path of the first substrate 310 positioned between the communication module 460 and the first power management module 410 . The first path P1 may be referred to as a first electrical path or a first power supply path. According to an embodiment, the first power management module 410 is electrically connected to the communication module 460 through the first substrate 310, so that the first power management module 410 provides power to the communication module 460. The distance for supplying can be reduced. For example, stability of the communication module 460 may be increased by reducing the length of an electrical path between the first power management module 410 and the communication module 460 . For example, noise and/or heat generated by the communication module 460 may be reduced.

According to various embodiments, the second substrate 320 may accommodate the charging circuit 430 , the processor 470 and/or the memory 480 . For example, the second substrate 320 may include a third surface 321 and a fourth surface 322 opposite to the third surface 321 . According to one embodiment, the charging circuit 430 , the processor 470 and the memory 480 may be disposed on the fourth surface 322 . According to an embodiment, the charging circuit 430 may determine a state (eg, fully charged state) of a battery (eg, the battery 250 of FIG. 4 ) or adjust current supplied to the battery 250 .

According to various embodiments, the second substrate 320 may accommodate at least one second power management module 420 for controlling power delivered to the processor 470 and/or the memory 480 . For example, the second power management module 420 may be disposed on the third surface 321 . According to one embodiment, the second power management module 420 may be surrounded by the first substrate 310 , the second substrate 320 and the interposer 330 . Since the second power management module 420 is located inside the interposer board 300, the noise caused by the second power management module 420 is generated by the first board 310, the second board and/or the interposer 330. ) can be shielded by According to an embodiment, the second power management module 420 may be electrically connected to the processor 470 and/or the memory 480 using the second substrate 320 . According to one embodiment, the second power management module 420 may be referred to as a processor power management module.

According to various embodiments, the second substrate 320 may be electrically connected to the first substrate 310 using the interposer 330 . For example, the interposer 330 may include at least one conductive pin 331 . A wiring of the first substrate 310 may be electrically connected to the second substrate 320 using a pin 331 .

According to various embodiments, a component (eg, the first power management module 410) received on the second surface 312 of the first substrate 310 is disposed on the third surface 321 of the second substrate 320. It may be arranged to be staggered with an accommodated component (eg, the second power management module 420). For example, the second substrate 320 may include a first region 323 facing the first power management module 410 and a second region 324 surrounding at least a portion of the first region 323. can

According to an embodiment, the first area 323 may not accommodate the first power management module 410 and/or the second power management module 420 . For example, no electronic component may be disposed on the third surface 321 of the first region 323 . According to an embodiment, since the first power management module 410 is not disposed in the first area 323, the first area 323 does not include wires used by the first power management module 410 and , the usable space in the first region 323 of the second substrate 320 may be increased. For example, the second substrate 320 may be located in the first region 323 and may include at least one wire 325 for supplying power to the processor 120 or charging the electronic device 200 . Heat generation of the electronic device 200 may be reduced by increasing the width or area of a wire used for charging the electronic device 200 . According to an embodiment, the electronic component (eg, the second power management module 420) disposed on the third surface 321 of the second substrate 320 is disposed on the second region 324, and the first It may not be disposed on area 323 .

According to various embodiments, the electronic device 200 may include an interface (eg, the interface 177 of FIG. 1 ) mounted on the interposer substrate 300 . According to one embodiment, the interface 177 may be disposed on the second surface 312 of the first substrate 310 . According to an embodiment, the first region 323 of the second substrate 320 may face the interface 177 together with the first power management module 410 . According to another embodiment, the first region 323 of the second substrate 320 may face the interface 177 . According to an embodiment, since the interface 177 is not disposed in the first region 323, the first region 323 does not include wiring used by the interface 177, and the second substrate 320 A usable space in the first area 323 of may be increased. For example, the second substrate 320 may be located in the first region 323 and may include at least one wire 325 for supplying power to the processor 120 or charging the electronic device 200 . Heat generation of the electronic device 200 may be reduced by increasing the width or area of a wire used for charging the electronic device 200 .

8 is a cross-sectional view of a second substrate, in accordance with various embodiments of the present disclosure.

Referring to FIG. 8 , the second substrate 320 may include a plurality of layers. The configuration of the second substrate 320 of FIG. 8 may be the same as all or part of the configuration of the second substrate 320 of FIGS. 5 to 7 .

According to various embodiments, the second substrate 320 may include a first layer 3201 forming the third surface 321 of the second substrate 320 . According to an embodiment, the first layer 3201 may include a plating layer 3201a, a copper foil 3201b, and an insulating layer 3201c. The plating layer 3201a may be a copper plating layer. According to an embodiment, the insulating layer 3201c may insulate different layers of the second substrate 320 from each other. For example, the insulating layer 3201c may be a prepreg. For example, the insulating layer 3201c may include glass fiber and/or resin. According to one embodiment, the first layer 320a may be referred to as an outer layer.

According to various embodiments, the second substrate 320 may include a plurality of layers positioned under the first layer 3201 (eg, in the -Z direction). For example, the second substrate 320 may include a second layer 3202 located under the first layer 3201, a third layer 3203 located under the second layer 3202, and a plurality of layers located under the third layer. of the inner layer (eg, the fourth layer 3204 and/or the tenth layer 3210).

According to various embodiments, the second substrate 320 includes a first area 323 facing the first power management module (eg, the first power management module 410 of FIG. 7 ) and the electronic device 200 . It may include a second area 324 in which a component (eg, the second power management module 420) is accommodated.

According to an exemplary embodiment, the second substrate 320 forms an accommodation space located in at least a part of the first layer 3201, the second layer 3202, and/or the third layer 3203 of the first region 323. can include Since the first power management module 410 is not disposed on the second substrate 320 , the accommodating space 323a may not include a wire for the first power management module 410 . The accommodating space 323a may be used as a space in which a wiring 325 for a component of the electronic device 200 is located. For example, at least a portion of the copper foil 3201b located in the accommodating space 323a may include at least one wire 325 for supplying power to the processor 120 or charging the electronic device 200 . According to one embodiment, the wire 325 may not be connected to the first power management module 410 of FIG. 7 . According to an embodiment, the accommodating space 323a may be referred to as a part of the first region 323a located on the first layer 3201 , the second layer 3202 , and/or the third layer 3203 .

9 and 10 are schematic diagrams of an electronic device including a conductive member according to various embodiments of the present disclosure.

9 and 10, the electronic device 200 includes an interposer board 300, power management modules 410 and 420, a charging circuit 430, a connector 440, a conductive member 450, and a communication module. 460 , a processor 470 and a memory 480 . The configuration of the interposer board 300, the power management modules 410 and 420, the charging circuit 430, the communication module 460, the processor 470, and the memory 480 of FIGS. 9 and 10 is shown in FIG. Configurations of the poser board 300 , the power management modules 410 and 420 , the charging circuit 430 , the communication module 460 , the processor 470 , and the memory 480 may be all or partly the same.

According to various embodiments, the first board 310 may accommodate the connector 440 . For example, the connector 440 may be disposed on the first surface 311 of the first substrate 310 . According to an embodiment, the connector 440 may receive power from the outside of the electronic device 200 . For example, the connector 440 may be connected to the outside of the electronic device 200 through the connector holes 208 and 209 of FIGS. 2 and 3 . According to one embodiment, at least a portion of power received from the connector 440 may be transferred to the charging circuit 430 .

According to various embodiments, the conductive member 450 may be used as a path through which at least a portion of power received from the connector 440 flows. For example, the conductive member 450 may transfer at least a portion of power received by the connector to the charging circuit 430 . According to an embodiment, the conductive member 450 may include a conductive plate. For example, the conductive member 450 may include a metal plate or graphite. According to an embodiment, the conductive member 450 may include a printed circuit board including one layer or two layers.

Referring to FIG. 9 , the conductive member 450 is disposed on the third surface 321 , the first conductive member 451 disposed in the first region 323 and the second conductive member 451 disposed on the second surface 312 . 2 conductive members 452 may be included. The first conductive member 451 may be electrically connected to the charging circuit 430 . The second conductive member 452 may be electrically connected to the connector 440 . According to an embodiment, power received by the connector 440 is transmitted through the first substrate 310, the second conductive member 452, at least one pin 331, the first conductive member 451, and/or the second conductive member 451. It may pass through the substrate 320 and be transferred to the charging circuit 430 . According to an embodiment, the charging circuit 430 may receive power through the second path P2. For example, at least a portion of power received by the connector 440 may be transferred to the charging circuit 430 through the second path P2 . According to an embodiment, at least a portion of the second path P2 includes the first substrate 310, the second conductive member 452, at least one pin 331, the first conductive member 451, and the second substrate. It may be a conductive path located at 320. The second path P2 may be referred to as a second electrical path or a second power supply path.

Referring to FIG. 10 , the conductive member 450 may further include a third conductive member 453 disposed on the third surface 321 and positioned in the second region 324 . The third conductive member 453 may be electrically connected to the charging circuit 430 . According to an embodiment, power received by the connector 440 passes through the first substrate 310, at least one pin 331, the third conductive member 453, and/or the second substrate 320 to charge the circuit. (430). According to an embodiment, the charging circuit 430 may receive power through the third path P3. For example, at least a portion of the power received by the connector 440 may be transferred to the charging circuit 430 through the third path P3. According to an embodiment, at least a portion of the third path P3 may be a conductive path located on the first substrate 310, the interposer 330, the third conductive member 453, and the second substrate 320. . The third path P3 may be referred to as a third electrical path or a third power supply path.

According to various embodiments, the conductive member 450 may be used as a signal or power path transmitted to electronic components of the electronic device 200 . According to an embodiment, the first conductive member 451 may be electrically connected to the second power management module 420 and the processor 470 . For example, at least a portion of the power transmitted from the second power management module 420 may pass through the first conductive member 451 and be supplied to the processor 470 .

According to an embodiment, the second conductive member 452 may be electrically connected to the amplifier 461 and/or the transceiver 462 . For example, at least a portion of power supplied to the amplifier 461 and/or the transceiver 462 may pass through the second conductive member 452 .

According to various embodiments, a width or an area of a path through which power transmitted to an electronic component passes may be increased due to the conductive member 450 , thereby reducing resistance and heat generation of the electronic device 200 .

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 200 of FIG. 2 ) includes a housing (eg, the housing 210 of FIG. 2 ), and a communication module disposed in the housing (eg, the electronic device 200 of FIG. 7 ). communication module 460), a first power management module (eg, first power management module 410 of FIG. 7) configured to control power delivered to the communication module, and a processor disposed in the housing (eg, FIG. 7 processor 470) and an interposer substrate disposed in the housing (eg, interposer substrate 300 of FIG. 5), on a first surface on which the communication module is located (eg, first surface 311 of FIG. 7 ). )) and a first substrate (eg, the first substrate of FIG. 7 ) including a second surface (eg, the second surface 312 of FIG. 7 ) opposite to the first surface and on which the first power management module is located ( 310)), a third surface facing the second surface (eg, the third surface 321 of FIG. 7 ), and a fourth surface opposite to the third surface and on which the processor is located (eg, the fourth surface of FIG. 7 ). 322) and an interposer disposed between the first substrate and the second substrate (eg, the second substrate 320 of FIG. 7) (eg, the interposer 330 of FIG. 7) ), and the second substrate includes a first area facing the first power management module (eg, the first area of FIG. 7). 323), a second area (eg, the second area 324 of FIG. 7) surrounding at least a portion of the first area, and a power supply of the processor or power supply of the electronic device located in the first area. At least one wiring for charging may be included (eg, the wiring 325 of FIG. 8 ).

According to various embodiments, at least one second power management module (eg, the second power management module 420 of FIG. 7 ) disposed on the third surface and configured to control power delivered to the processor. can include more.

According to various embodiments, the electronic device may include a charging circuit (eg, the charging circuit 430 of FIG. 7 ) disposed on the fourth surface and power from the outside of the electronic device disposed on the first surface. It may further include a connector (eg, the connector 440 of FIG. 9 ) configured to receive the transmission.

According to various embodiments, the interposer includes at least one pin electrically connected to the connector (eg, pin 331 of FIG. 9 ), and the charging circuit connects to the connector through the at least one pin. can be electrically connected.

According to various embodiments, the interposer board is a conductive member including a conductive plate or a printed circuit board, and is configured to transfer at least a portion of the power received by the connector to the charging circuit (eg, in FIG. 9 ). A conductive member 450) may be included.

According to various embodiments, the conductive member is a first conductive member disposed on the third surface, located in the first region, and electrically connected to the charging circuit (eg, the first conductive member in FIG. 9 ). 1 conductive member 451).

According to various embodiments, the conductive member includes a second conductive member (eg, the second conductive member 452 of FIG. 9 ) disposed on the second surface, and the power received by the connector is the first conductive member. It may be configured to pass through two conductive members, the at least one pin, and the first conductive member to the charging circuit.

According to various embodiments, the conductive member is a third conductive member disposed on the third surface and located in the second area, and is configured to transmit at least a portion of power received by the connector to the charging circuit. 3 conductive members (eg, the third conductive member 453 of FIG. 10 ) may be included.

According to various embodiments, the electronic device may further include a memory disposed on the fourth surface.

According to various embodiments, the communication module may include an amplifier (eg, the amplifier 461 of FIG. 7 ) and a transceiver (eg, the transceiver 462 of FIG. 7 ).

According to various embodiments, the first power management module may be positioned to overlap the amplifier or the transceiver, and the first power management module may be electrically connected to the amplifier and the transceiver by using the first substrate.

According to various embodiments, an interface (eg, the interface 177 of FIG. 1 ) disposed on the second surface may be further included, and at least a portion of the interface may face the first area.

According to various embodiments, at least a portion of the interposer may be formed in a closed curve shape.

According to various embodiments, the second substrate may include a first layer (eg, the first layer 3201 of FIG. 8 ) forming the third surface, and a second layer (eg, FIG. 8), a third layer (eg, third layer 3203 in FIG. 8) located below the second layer, and a plurality of inner layers (eg, third layer 3203 in FIG. 8) located below the third layer. a fourth layer 3204 and/or a tenth layer 3210), wherein the wiring is located in at least one of the first layer, the second layer, and the third layer, and the first power management module and may not be connected.

According to various embodiments, the first power management module may be surrounded by the first substrate, the second substrate, and the interposer.

According to various embodiments of the present disclosure, an electronic device (eg, the electronic device 200 of FIG. 2 ) includes a housing (eg, the housing 210 of FIG. 2 ), and a communication module disposed in the housing (eg, the electronic device 200 of FIG. 7 ). communication module 460 of the housing), a battery disposed in the housing (eg, the battery 250 of FIG. 4), and a first power management module configured to control power delivered to the communication module (eg, the first power management module of FIG. 7 ). A power management module 410), a charging circuit configured to control current supplied to the battery (eg, the charging circuit 430 of FIG. 7), a processor disposed in the housing (eg, the processor 470 of FIG. 7), As an interposer board disposed in the housing, a first surface on which the communication module is located (eg, first surface 311 in FIG. 7 ) and a second surface opposite to the first surface on which the first power management module is located A first substrate (eg, the first substrate 310 in FIG. 7) including a surface (eg, the second surface 312 in FIG. 7), a third surface facing the second surface (eg, the first substrate 310 in FIG. 7 ) A second substrate including a third surface 321) and a fourth surface opposite to the third surface and on which the processor and the charging circuit are located (eg, the fourth surface 322 of FIG. 7), wherein the first power A first area (eg, first area 323 in FIG. 7 ) facing the management module and a second area (eg, second area 324 in FIG. 7 ) surrounding at least a portion of the first area are included. An interposer including a second substrate (eg, the second substrate 320 of FIG. 7) and an interposer (eg, the interposer 330 of FIG. 7) disposed between the first substrate and the second substrate. The charging circuit as a substrate (eg, the interposer substrate 300 of FIG. 7 ) and a conductive member disposed on the third surface and located in the first region (eg, the first conductive member 451 of FIG. 9 ) and a conductive member electrically connected to (eg, the first conductive member 451 of FIG. 9 ).

According to various embodiments, the communication module includes an amplifier (eg, the amplifier 461 of FIG. 7 ) and a transceiver (eg, the transceiver 462 of FIG. 7 ), and the first power management module includes the amplifier or Positioned to overlap the transceiver, the first power management module may be electrically connected to the amplifier and the transceiver by using the first substrate.

According to various embodiments, the electronic device further includes a connector (eg, the connector 440 of FIG. 9 ) disposed on the first surface and configured to receive power from the outside of the electronic device, and The poser may include at least one pin (eg, pin 331 of FIG. 9 ) electrically connected to the connector, and the charging circuit may be electrically connected to the connector through the at least one pin.

According to various embodiments, the electronic device may include at least one second power management module (eg, the second power management module of FIG. 7 ) disposed on the third surface and configured to control power delivered to the processor. 420)), and the conductive member may be electrically connected to the processor and the at least one second power management module.

According to various embodiments, the second substrate may include a first layer (eg, the first layer 3201 of FIG. 8 ) forming the third surface, and a second layer (eg, FIG. 8), a third layer positioned under the second layer (eg, third layer 3203 in FIG. 8 ), and a plurality of inner layers positioned under the third layer (eg, shown in FIG. 8 ). a fourth layer 3204 and/or a tenth layer 3210;

The second substrate may be located on at least one of the first layer, the second layer, and the third layer, and may include a wiring (eg, wiring 325 of FIG. 8 ) not connected to the first power management module. can

The electronic device including the interposer substrate of the present disclosure described above is not limited to the above-described embodiments and drawings, and various substitutions, modifications, and changes are possible within the technical scope of the present disclosure. It will be clear to those skilled in the art.

101, 200: electronic device
210: housing
300: interposer board
310: first substrate
320: second substrate
323 first area
324 second area
330: interposer
410: first power management module
420: second power management module
450: conductive member
460: communication module
470: processor
480: memory

Claims (20)

In electronic devices,
housing;
a communication module disposed within the housing;
a first power management module configured to control power delivered to the communication module;
a processor disposed within the housing; and
An interposer substrate disposed within the housing,
A first substrate including a first surface on which the communication module is located and a second surface opposite to the first surface on which the first power management module is located;
A second substrate including a third surface facing the second surface and a fourth surface opposite to the third surface and on which the processor is located; and
An interposer substrate including an interposer disposed between the first substrate and the second substrate,
The second substrate is located in a first area facing the first power management module, a second area surrounding at least a part of the first area, and the first area, and supplies power to the processor or the electronic device. An electronic device comprising at least one wire for charging.
According to claim 1,
and at least one second power management module disposed on the third surface and configured to control power delivered to the processor.
According to claim 1,
a charging circuit disposed on the fourth surface; and
The electronic device further includes a connector disposed on the first surface and configured to receive power from the outside of the electronic device.
According to claim 3,
The interposer includes at least one pin electrically connected to the connector,
The charging circuit is electrically connected to the connector through the at least one pin.
According to claim 4,
The interposer substrate is a conductive member including a conductive plate or a printed circuit board,
An electronic device comprising a conductive member configured to transfer at least a portion of the power received by the connector to the charging circuit.
According to claim 5,
The electronic device of claim 1 , wherein the conductive member includes a first conductive member disposed on the third surface, positioned in the first region, and electrically connected to the charging circuit.
According to claim 6,
the conductive member includes a second conductive member disposed on the second surface;
The electronic device configured to transmit power received by the connector to the charging circuit through the second conductive member, the at least one pin, and the first conductive member.
According to claim 5,
The conductive member includes a third conductive member disposed on the third surface and positioned in the second region, the third conductive member configured to transmit at least a portion of power received by the connector to the charging circuit. Device.
According to claim 1,
The electronic device further comprising a memory disposed on the fourth surface.
According to claim 1,
The communication module includes an amplifier and a transceiver.
According to claim 10,
the first power management module is positioned to overlap the amplifier or the transceiver;
The first power management module is electrically connected to the amplifier and the transceiver by using the first substrate.
According to claim 1,
further comprising an interface disposed on the second surface;
At least a portion of the interface faces the first area.
According to claim 1,
At least a portion of the interposer is formed in a closed curve shape.
According to claim 1,
The second substrate includes a first layer forming the third surface, a second layer positioned below the first layer, a third layer positioned below the second layer, and a plurality of inner layers positioned below the third layer. do,
The wiring is located in at least one of the first layer, the second layer, and the third layer, and is not connected to the first power management module.
According to claim 1,
The first power management module is surrounded by the first substrate, the second substrate, and the interposer.
In electronic devices,
housing;
a communication module disposed within the housing;
a battery disposed within the housing;
a first power management module configured to control power delivered to the communication module;
a charging circuit configured to control current supplied to the battery;
a processor disposed within the housing;
An interposer substrate disposed within the housing,
A first substrate including a first surface on which the communication module is located and a second surface opposite to the first surface on which the first power management module is located;
A second substrate including a third surface facing the second surface and a fourth surface opposite to the third surface and on which the processor and the charging circuit are located, wherein the first area faces the first power management module and the A second substrate including a second region surrounding at least a portion of the first region, and
an interposer substrate including an interposer disposed between the first substrate and the second substrate; and
and a conductive member disposed on the third surface and electrically connected to the charging circuit as a conductive member positioned in the first region.
According to claim 16,
The communication module includes an amplifier and a transceiver,
the first power management module is positioned to overlap the amplifier or the transceiver;
The first power management module is electrically connected to the amplifier and the transceiver by using the first board.
According to claim 16,
Further comprising a connector disposed on the first surface and configured to receive power from the outside of the electronic device;
The interposer includes at least one pin electrically connected to the connector,
The charging circuit is electrically connected to the connector through the at least one pin.
According to claim 16,
at least one second power management module disposed on the third surface and configured to control power delivered to the processor;
The conductive member is electrically connected to the processor and the at least one second power management module.
According to claim 16,
The second substrate includes a first layer forming the third surface, a second layer positioned below the first layer, a third layer positioned below the second layer, and a plurality of inner layers positioned below the third layer. do,
The second substrate is disposed on at least one of the first layer, the second layer, and the third layer, and includes a wire not connected to the first power management module.

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