KR20220117216A - Resin composition and resin sheet - Google Patents

Abstract

A resin composition containing (A) a thermosetting component and (B) a silane coupling agent, wherein the (A) thermosetting component contains (A1) maleimide resin, and the (B) silane coupling agent has the following general formula The resin composition which is a compound represented by (B1).
(R ²¹ O) _a (R ²² ) _3-a Si-L ²¹ -NH-L ²² -NH-R ²³ ... (B1)
(In the general formula (B1), R ²¹ is an alkyl group, R ²² and R ²³ are each independently a monovalent organic group, and L ²¹ and L ²² are each independently a divalent organic group, , a is 1, 2 or 3.)

Description

Resin composition and resin sheet

The present invention relates to a resin composition and a resin sheet.

As a sealing material, such as a power semiconductor element, the resin composition which has high heat resistance is used.

For example, Patent Document 1 contains a maleimide compound, a compound having at least any of an allyl group and an epoxy group, an amine compound, and a radical generator containing at least one of an acetophenone derivative and a tetraphenylethane derivative. A resin composition is disclosed.

Japanese Laid-Open Patent Publication No. 2015-147849

However, in the resin composition of patent document 1, especially when thermosetting temperature is low, there existed a problem that the peeling strength after thermosetting became low.

An object of this invention is to provide the resin composition and resin sheet which are excellent in heat resistance and can improve the peeling strength after thermosetting.

A resin composition according to an aspect of the present invention is a resin composition containing (A) a thermosetting component and (B) a silane coupling agent, wherein the (A) thermosetting component contains (A1) maleimide resin, (B) The silane coupling agent is a compound represented by the following general formula (B1), It is characterized by the above-mentioned.

(R ²¹ O) _a (R ²² ) _3-a Si-L ²¹ -NH-L ²² -NH-R ²³ ... (B1)

(In the general formula (B1), R ²¹ is an alkyl group, R ²² and R ²³ are each independently a monovalent organic group, and L ²¹ and L ²² are each independently a divalent organic group, , a is 1, 2 or 3.)

The resin composition which concerns on one aspect of this invention WHEREIN: It is preferable that content of the said (B) silane coupling agent is 0.01 mass % or more and 5 mass % or less on the basis of the total amount of solid content of the said resin composition.

In the resin composition according to one aspect of the present invention, it is preferable that the (E) adhesion-imparting agent is further contained, and the (E) adhesion-imparting agent is a compound having a triazine skeleton.

A resin sheet according to an aspect of the present invention is formed from the resin composition according to an aspect of the present invention.

In the resin sheet according to one aspect of the present invention, when the resin sheet is adhered to the copper foil and cured under the conditions of 2 hours at a temperature of 180° C., it is preferable that the peel strength after curing is 2.0 N/10 mm or more.

In the resin sheet according to one aspect of the present invention, when the resin sheet is adhered to a copper foil and cured at a temperature of 180° C. for 2 hours, the peel strength after curing is preferably 6.0 N/10 mm or more.

In the resin sheet which concerns on one aspect of this invention, it is preferable to be used for sealing a power semiconductor element, or interposing between the said power semiconductor element and another electronic component.

In the resin sheet according to an aspect of the present invention, a semiconductor element using any one or more of silicon carbide and gallium nitride is sealed, or a semiconductor element using any one or more of silicon carbide and gallium nitride is different from the semiconductor element It is preferable to be used for interposing between electronic components.

ADVANTAGE OF THE INVENTION According to one aspect|mode of this invention, it is excellent in heat resistance, and can provide the resin composition and resin sheet which can improve the peeling strength after thermosetting.

BRIEF DESCRIPTION OF THE DRAWINGS It is a cross-sectional schematic of the laminated body which concerns on one Embodiment.

[resin composition]

First, the resin composition which concerns on this embodiment is demonstrated.

The resin composition which concerns on this embodiment contains (A) a thermosetting component and (B) a silane coupling agent. (A) The thermosetting component which concerns on this embodiment contains (A1) maleimide resin.

((A) thermosetting component)

(A) The thermosetting component (hereinafter, simply referred to as "component (A)" may be referred to as "component (A)") has a property of forming a three-dimensional network when heated, thereby strongly adhering an adherend. As mentioned above, (A) thermosetting component in this embodiment contains (A1) maleimide resin (Hereinafter, it may simply call "(A1) component").

(A1) maleimide resin

(A1) Maleimide resin in this embodiment will not be specifically limited if it is maleimide resin containing 2 or more maleimide groups in 1 molecule.

(A1) Maleimide resin in this embodiment, from a heat resistant viewpoint, it is preferable that a benzene ring is included, for example, It is more preferable that the structure in which the maleimide group was connected to the benzene ring is included. Moreover, it is preferable that the maleimide compound is equipped with two or more structures in which the maleimide group was connected to the benzene ring.

The maleimide resin (A1) in the present embodiment is a maleimide resin containing two or more maleimide groups and one or more biphenyl skeletons in one molecule (hereinafter simply referred to as “biphenylmaleimide resin”) There is) preferably.

It is preferable that (A1) maleimide resin in this embodiment is represented by the following general formula (1) from a heat resistant and adhesive viewpoint.

[Formula 1]

In the general formula (1), k is an integer of 1 or more, and the average value of k is preferably 1 or more and 10 or less, more preferably 1 or more and 5 or less, and still more preferably 1 or more and 3 or less. m1 and m2 are each independently an integer of 1 or more and 6 or less, It is preferable that it is an integer of 1 or more and 3 or less, It is more preferable that it is 1. n1 and n2 are each independently an integer of 0 or more and 4 or less, It is preferable that it is an integer of 0 or more and 2 or less, It is more preferable that it is 0. R< ¹ > and R< ² > are each independently a C1-C6 alkyl group, It is preferable that it is a C1-C3 alkyl group, and it is more preferable that it is a methyl group. A plurality of R ¹ is the same as or different from each other. A plurality of R ² is the same as or different from each other.

Specific examples of the maleimide resin represented by the general formula (1) in the present embodiment include compounds represented by the following general formula (2) or the following general formula (3).

[Formula 2]

[Formula 3]

In the general formulas (2) and (3), k is the same as k in the general formula (1). In the general formula (2), n1, n2, R ¹ and R ² are the same as n1, n2, R ¹ and R ² in the general formula (1).

As a product of the maleimide resin represented by the said General formula (3), "MIR-3000-70MT" by Nippon Kayaku Co., Ltd. etc. is mentioned.

Moreover, it is also preferable that (A1) maleimide resin in this embodiment is maleimide resin containing 2 or more maleimide groups and 2 or more phenylene groups in 1 molecule. It is preferable to have a substituent on a phenylene group from a viewpoint of improving the solubility with respect to a solvent and improving sheet|seat formation property. Examples of the substituent include an alkyl group such as a methyl group and an ethyl group, and an alkylene group.

Moreover, as for (A1) maleimide resin in this embodiment, the maleimide resin which has an ether bond between a maleimide group and a phenylene group is preferable from a viewpoint of sheet|seat formation property.

The maleimide resin containing 2 or more maleimide groups and 2 or more phenylene groups in said 1 molecule is represented by following General formula (4), for example.

[Formula 4]

In the above general formula (4), R ³ to R ⁶ are each independently a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, L ¹ is an alkylene group having 1 to 3 carbon atoms, L ² and L ³ is each independently an alkylene group having 1 to 2 carbon atoms or an arylene group having 6 to 10 carbon atoms, and p and q are each independently 0 or 1. However, the total number of carbon atoms in L ¹ , L ² , and L ³ is 3 or less.

The maleimide resin represented by the said general formula (4) in this embodiment is specifically, represented by the following general formula (5) or the following general formula (6), for example.

[Formula 5]

[Formula 6]

In the general formulas (5) and (6), L ¹ is an alkylene group having 1 or more and 3 or less carbon atoms.

In the said General formula (5), R< ³ > to R< ⁶ > is each independently a hydrogen atom or a C1-C6 alkyl group.

Moreover, from a viewpoint of flexibility and heat resistance, (A1) maleimide resin in this embodiment has two or more maleimide groups in 1 molecule, The bonding group which connects at least one pair of two maleimide groups is a main chain It is preferable that it is a maleimide resin which has 4 or more methylene groups.

Here, the bonding group connecting the two maleimide groups preferably has 6 or more methylene groups in the main chain from the viewpoint of flexibility, more preferably 8 or more methylene groups in the main chain, and 10 or more methylene groups in the main chain It is particularly preferred to have a group. Moreover, it is more preferable that these methylene groups are connected and become a C4 or more alkylene group. In this alkylene group, at least one -CH ₂ - may be substituted with -CH ₂ -O- or -O-CH ₂ -.

Moreover, it is preferable that the bonding group which connects two maleimide groups has a 1 or more side chain from a softness|flexibility viewpoint. As this side chain, an alkyl group, an alkoxy group, etc. are mentioned. Moreover, when there are two or more side chains, side chains may couple|bond together and may form alicyclic structure.

Moreover, it is preferable that such (A1) maleimide resin is liquid maleimide resin in the temperature of 25 degreeC.

It is preferable that such (A1) maleimide resin is represented by the following general formula (7) from a viewpoint of a softness|flexibility and heat resistance.

[Formula 7]

In the said General formula (7), n is an integer of 0 or more, It is preferable that it is an integer of 1 or more and 10 or less, It is more preferable that it is an integer of 1 or more and 5 or less. Moreover, it is preferable that they are 0.5 or more and 5 or less, and, as for the average value of n, it is more preferable that they are 1 or more and 2 or less.

L ⁴ and L ⁵ are each independently a substituted or unsubstituted alkylene group having 4 or more carbon atoms, in this alkylene group, at least one -CH ₂ - is -CH ₂ -O- or -O-CH ₂ - may be substituted with From a viewpoint of a softness|flexibility, it is preferable that carbon number of this alkylene group is 6 or more, It is more preferable that it is 8 or more, It is especially preferable that it is 10 or more and 30 or less. Moreover, when hydrogen of the alkylene group is substituted, a substituent is a C1-C10 alkyl group, or a C1-C10 alkoxy group. Moreover, these substituents may couple|bond and may form the alicyclic structure.

X each independently has a substituted or unsubstituted alkylene group having 4 or more carbon atoms (including those in which at least one -CH ₂ - is substituted with -CH ₂ -O- or -O-CH ₂ -) It is preferably a divalent group having a phthalimide group. In addition, the group derived from a phthalimide is also included in a phthalimide group. Specific examples of X include groups represented by the following structural formula (7-1) or the following general formula (7-2).

[Formula 8]

In the said General formula (7-2), Y< ¹ > and Y< ² > are each independently hydrogen, a methyl group, or an ethyl group, and it is preferable that it is a methyl group.

Specific examples of the maleimide resin represented by the general formula (7) in the present embodiment include the following general formula (7-1-1) or the following general formula (7-2-1) The compound shown is mentioned.

[Formula 9]

In the above general formulas (7-1-1) and (7-2-1), n is an integer of 1 or more and 5 or less. Moreover, the average value of n is 1 or more and 2 or less.

As a product of the maleimide resin represented by the said general formula (7-1-1), Designer Molecules Inc.. "BMI-1500" by the company, "SLK1500" by the Shin-Etsu Chemical Industry, etc. are mentioned.

As a product of the maleimide resin represented by the said general formula (7-2-1), Designer Molecules Inc.. "BMI-1700" manufactured by the company, etc. are mentioned.

As maleimide resin (A1) in this embodiment, specifically, for example, the maleimide resin and bis represented by the said General formula (3) from a viewpoint of obtaining a hardened|cured material with high heat resistance with sheet formability. (3-ethyl-5-methyl-4-maleimidephenyl)methane, N,N'-1,3-phenylenedimalimide, 4-methyl-1,3-phenylenebismaleimide, polyphenylmethanemaleimide , or 2,2-bis[4-(4-maleimidephenoxy)phenyl]propane is preferable, and from the viewpoint of sheet formability, the maleimide resin represented by the general formula (3), or bis(3-ethyl- 5-methyl-4-maleimidephenyl)methane is more preferable, and from a viewpoint of making low the complex viscosity in high temperature before hardening of the resin sheet which concerns on this embodiment, the maleimide resin represented by the said General formula (3) more preferably.

Moreover, as (A1) maleimide resin in this embodiment, the maleimide resin specifically, represented by the said General formula (7) from a viewpoint of a softness|flexibility and heat resistance, for example is still more preferable. In addition, these maleimide resins can be used individually by 1 type or in combination of 2 or more type. And you may use together the maleimide resin represented by the said General formula (3), and the maleimide resin represented by the said General formula (7).

In the present embodiment, the content of the component (A1) in the component (A) is based on the total amount of the solid content of the component (A) (that is, the amount of the non-volatile component of the component (A) excluding the solvent is 100% by mass. ), it is preferably 60 mass % or more, more preferably 65 mass % or more, and particularly preferably 70 mass % or more. When content of (A1) component in (A) component exists in such a range, the heat resistance after hardening of the resin composition which concerns on this embodiment can be improved.

(A2) allyl resin

It is preferable that (A) thermosetting component which the resin composition in this embodiment contains contains (A2) allyl resin further. (A2) The allyl resin (hereinafter, simply referred to as "component (A2)" in some cases) is preferably liquid at room temperature. (A) When a thermosetting component contains allyl resin, it becomes easier to improve the peeling strength after hardening of a resin sheet, reducing the reaction temperature of the resin sheet which concerns on this embodiment.

In this embodiment, it is preferable that mass ratio (A1/A2) with respect to (A2) allyl resin of maleimide resin which is (A1) component is 1.5 or more, and it is more preferable that it is 3 or more.

When mass ratio (A1/A2) is the said range, there exists a tendency for storage elastic modulus E' in 250 degreeC of the hardened|cured material of a resin sheet to rise.

Moreover, the heat resistance of a resin sheet can be improved as mass ratio (A1/A2) is the said range.

Further, when the mass ratio (A1/A2) is within the above range, the complex viscosity η of the resin sheet is appropriately adjusted, and the fluidity of the resin sheet upon application to the adherend is ensured, and the heat resistance after curing of the resin sheet is further improved. come true Moreover, bleed-out of allyl resin from a resin sheet as mass ratio (A1/A2) is the said range is also suppressed. In addition, the upper limit in particular of mass ratio (A1/A2) is not restrict|limited. For example, mass ratio (A1/A2) should just be 50 or less, and it is preferable that it is 10 or less.

(A2) Allyl resin in this embodiment will not be specifically limited if it is resin which has an allyl group. It is preferable that (A2) allyl resin in this embodiment is an allyl resin which contains 2 or more allyl groups in 1 molecule, for example.

It is more preferable that the allyl resin in this embodiment is represented by the following general formula (8), the following general formula (9), or the following general formula (10).

[Formula 10]

[Formula 11]

[Formula 12]

In the formula (8), R ⁷ and R ⁸ are each independently an alkyl group, preferably an alkyl group having 1 to 10 carbon atoms, more preferably an alkyl group having 1 to 4 carbon atoms, more preferably a methyl group and an ethyl group It is more preferable that it is an alkyl group selected from the group which consists of

In the general formula (9), n3 is 1 or more and 4 or less, preferably 1 or more and 3 or less, and more preferably 1 or more and 2 or less. Moreover, in the allyl resin represented by the said General formula (9), it is preferable that the ratio of the component whose n3 is 1 is 90 mol% or more.

Specific examples of the (A2) allyl resin in the present embodiment include, for example, diallylbisphenol A (2,2-bis(3-allyl-4-hydroxyphenyl)propane), the general formula ( The allylphenol resin represented by 9) and the allylphenol resin represented by the said General formula (10), etc. are mentioned. These allyl resins can be used individually by 1 type or in combination of 2 or more type.

(A3) curing catalyst

In the resin sheet which concerns on this embodiment, when a resin composition contains a thermosetting resin, it is preferable to contain a curing catalyst further. Thereby, it becomes possible to advance the hardening reaction of a thermosetting resin effectively, and it becomes possible to harden|cure a resin sheet favorably. Examples of the curing catalyst include an imidazole curing catalyst, an amine curing catalyst, and a phosphorus curing catalyst.

Specific examples of the imidazole-based curing catalyst include 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 2-ethyl-4-methylimidazole, and 1-benzyl-2. -Methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1,2-dimethylimidazole, 1-cyanoethyl- 2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-phenylimidazole , 2-phenyl-4-methyl-5-hydroxymethylimidazole, 2-phenyl-4,5-di(hydroxymethyl)imidazole, etc. are mentioned, From a reactive viewpoint, 2-ethyl- Preference is given to using 4-methylimidazole. Moreover, when the imidazole compound which has a triazine skeleton is used as (E) adhesion-imparting agent mentioned later, it also acts also as a curing catalyst.

Specific examples of the amine-based curing catalyst include tertiary amine compounds such as 1,8-diazabicyclo[5,4,0]undecene-7 (DBU), triethylenediamine, benzyldimethylamine, and triethanolamine. can be heard

Moreover, a triphenylphosphine, a tributylphosphine, a tri(p-methylphenyl) phosphine, a tri(nonylphenyl) phosphine etc. are mentioned as a specific example of a phosphorus type curing catalyst.

(A) thermosetting component of this embodiment, unless the objective of this invention is impaired, thermosetting resin other than (A1) component, cured resin other than (A2) component, and curing catalyst other than (A3) component may contain.

(A1) As a thermosetting resin other than a component, what is necessary is just a thermosetting resin which has high heat resistance, For example, an epoxy resin, a benzoxazine resin, cyanate resin, a melamine resin, etc. are mentioned. These thermosetting resins can be used individually by 1 type or in combination of 2 or more type. However, from a viewpoint of high heat resistance, it is preferable that (A) thermosetting component does not contain an epoxy resin substantially.

Examples of the cured resin other than the component (A2) include resins such as phenol resins and resins having a C=C double bond other than component (A2), and resins containing acid anhydride and formaldehyde. can be heard These cured resins can be used individually by 1 type or in combination of 2 or more type.

(A3) As a curing catalyst other than a component, a triazole type compound, a thiazole type compound, etc. are mentioned, for example. These curing catalysts can be used individually by 1 type or in combination of 2 or more type.

When using a thermosetting resin other than component (A1), a cured resin other than component (A2), and a curing catalyst other than component (A3), their content is based on the total amount of solid content of component (A) (that is, When the quantity of the nonvolatile matter of (A) component except a solvent is 100 mass %), it is preferable that it is 10 mass % or less, and it is more preferable that it is 5 mass % or less.

In the present embodiment, the content of the thermosetting component (A) in the resin composition is based on the total amount of the solid content of the resin composition (that is, when the total amount of the nonvolatile matter of the resin composition excluding the solvent is 100% by mass), It is preferable that they are 2 mass % or more and 75 mass % or less, It is more preferable that they are 5 mass % or more and 60 mass % or less, It is especially preferable that they are 10 mass % or more and 40 mass % or less. (A) When content of a thermosetting component exists in the said range, the handling property of a resin sheet, sheet|seat shape retentivity, and the heat resistance of a resin composition improve.

((B) Silane coupling agent)

(B) A silane coupling agent (Hereinafter, it may simply call "(B) component") is a compound represented by the following general formula (B1). With this component (B), the peeling strength after hardening of a resin composition can be improved. In this component (B), a portion of -NH-L ²² -NH-R ²³ in the following general formula (B1) and a metal ion on the metal surface, or an organic functional group bonded to the metal surface, etc. are non-bonding mutual By acting, it is presumed that the adhesion with the metal surface is improved. Moreover, since this component (B) does not have a reactive functional group (vinyl group, an epoxy group, a mercapto group, and an isocyanate group) like a normal silane coupling agent, with respect to the resin composition, the adverse effect by reaction with other components It is presumed that it does not affect

(R ²¹ O) _a (R ²² ) _3-a Si-L ²¹ -NH-L ²² -NH-R ²³ ... (B1)

In the formula (B1), R ²¹ is an alkyl group, preferably an alkyl group having 1 to 6 carbon atoms, more preferably an alkyl group having 1 to 3 carbon atoms, and still more preferably a methyl group.

R ²² and R ²³ are each independently a monovalent organic group. Moreover, it is preferable that R<^22> is a C1-C6 alkyl group, It is more preferable that it is a C1-C3 alkyl group, It is more preferable that it is a methyl group. Moreover, it is preferable that it is an alkyl group, an aryl group, or a pyridyl group, and, as for ^R23 , it is more preferable that it is a C1-C8 alkyl group, a phenyl group, or a pyridyl group.

L ²¹ and L ²² are each independently a divalent organic group. Moreover, it is preferable that it is an ^alkylene group, It is more preferable that it is a C1-C6 alkylene group, It is more preferable that it is a C2-C4 alkylene group. In addition, L ²² is preferably a divalent organic group containing oxygen or sulfur, -C _b H _2b -C(=O)-C _b H _2b - or -C _b H _2b -C(=S)- C _b H _2b - is more preferable, and -C(=O)- or -C(=S)- is still more preferable. Here, b is 0, 1, 2 or 3.

a is 1, 2 or 3, it is preferable that it is 2 or 3, It is more preferable that it is 3.

Specific examples of the compound represented by the general formula (B1) in the present embodiment include compounds represented by the following structural formula (B1-1) or the following structural formula (B1-2).

[Formula 13]

In the present embodiment, the content of the (B) silane coupling agent in the resin composition is based on the total amount of the solid content of the resin composition (that is, when the total amount of the nonvolatile matter of the resin composition excluding the solvent is 100 mass%). , 0.01 mass% or more and 5 mass% or less, more preferably 0.05 mass% or more and 3 mass% or less, still more preferably 0.1 mass% or more and 2 mass% or less, and particularly preferably 0.2 mass% or more and 1 mass% or less do. By making content of the (B) silane coupling agent in a resin composition into the said range, the peeling strength after hardening of a resin composition can further be improved.

((C) binder component)

In this embodiment, it is preferable that the resin composition contains (C) binder component (Hereinafter, it may simply call "(C)component") other than (A) component and (B) component. When the resin composition of this embodiment contains the (C) binder component further, film-forming property can be provided and it can make it easy to shape|mold a resin composition into a sheet form.

(C) The binder component of this embodiment is a resin component other than (A) component, and has the function of bonding together (A) component or another component. (C) It is preferable that a binder component is a thermoplastic resin. (C) A component may have a functional group, as long as it has a function which joins (A) component or another component. As described above, when (C) the binder component has a functional group, even if the (C) binder component can participate in curing the resin sheet by heat, in the present invention, (C) the binder component is different from the (A) thermosetting component. distinguished

(C) The binder component can be widely selected regardless of whether it is an aliphatic compound or an aromatic compound. (C) The binder component is, for example, preferably at least any resin selected from the group consisting of phenoxy resins, acrylic resins, methacryl resins, polyester resins, urethane resins, and polyamideimide resins, and has heat resistance. It is more preferable that it is at least any resin selected from the group which consists of a phenoxy resin and polyamideimide resin from a viewpoint. Moreover, it is preferable that polyester resin is a wholly aromatic polyester resin. Moreover, as a polyamide-imide resin, a rubber-modified polyamide-imide resin is preferable from a viewpoint of improving the softness|flexibility of a resin sheet. (C) A binder component can be used individually by 1 type or in combination of 2 or more type.

As a phenoxy resin, a bisphenol A skeleton (Hereinafter, bisphenol A may be called "BisA"), a bisphenol F skeleton (Hereinafter, bisphenol F may be called "BisF"), a biphenyl skeleton, and naphthalene. It is preferable that it is a phenoxy resin which has 1 or more types of frame|skeleton chosen from the group which consists of a frame|skeleton, It is more preferable that it is a phenoxy resin which has a bisphenol A frame|skeleton and a bisphenol F frame|skeleton.

(C) The weight average molecular weight (Mw) of the binder component is preferably 10,000 or more and 1,000,000 or less, more preferably 30,000 or more and 800,000 or less, from the viewpoint of making it easy to adjust the complex viscosity of the resin sheet to a desired range. , more preferably 50,000 or more and 100,000 or less. The weight average molecular weight in this specification is a standard polystyrene conversion value measured by the Gel Permeation Chromatography (GPC) method.

In the present embodiment, the content of the binder component (C) in the resin composition is based on the total amount of the solid content of the resin composition (that is, when the total amount of the nonvolatile matter of the resin composition excluding the solvent is 100% by mass), It is preferable that they are 1.5 mass % or more and 50 mass % or less, It is more preferable that they are 2 mass % or more and 30 mass % or less, It is especially preferable that they are 2 mass % or more and 15 mass % or less. By making content of the (C) binder component in a resin composition into the said range, it becomes easy to adjust the complex viscosity of the resin sheet before hardening to a desired range, and the handling property of a resin sheet and sheet formability improve.

((D) inorganic filler)

In this embodiment, it is preferable that the resin composition contains (D) inorganic filler (Hereinafter, it may simply call "(D)component") other than (A) component - (C)component. With this (D)component, at least one of the thermal characteristic and mechanical characteristic of a resin composition can be improved.

(D) As an inorganic filler, a silica filler, an alumina filler, a boron nitride filler, etc. are mentioned. Among these, a silica filler is preferable.

As a silica filler, a fused silica, a spherical silica, etc. are mentioned, for example.

(D) An inorganic filler can be used individually by 1 type or in combination of 2 or more type. Moreover, (D) The inorganic filler may be surface-treated.

(D) The average particle diameter of an inorganic filler is not restrict|limited in particular. (D) It is preferable that they are 0.1 nm or more and 100 micrometers or less, and, as for the average particle diameter of an inorganic filler, it is more preferable that they are 10 nm or more and 10 micrometers or less by the value calculated|required from a general particle size distribution system. In the present specification, the average particle diameter of the (D) inorganic filler is a value measured by a dynamic light scattering method using a particle size distribution analyzer (manufactured by Nikkiso Corporation, product name “Nanotrac Wave-UT151”).

Content of the (D) inorganic filler in the resin composition is 10 mass % or more and 90 mass % based on the total amount of solid content of the resin composition (that is, when the total amount of the non-volatile matter of the resin composition excluding the solvent is 100 mass %). % or less, more preferably 20 mass% or more and 85 mass% or less, still more preferably 40 mass% or more and 80 mass% or less, and particularly preferably 60 mass% or more and 80 mass% or less. By making the content of the inorganic filler (D) in the resin composition within the above range, the coefficient of linear expansion of the resin composition can be made low, for example, the difference in the coefficient of linear expansion between the sealed object such as silicon carbide and the resin composition or the resin sheet. can be made small

((E) Adhesive imparting agent)

In this embodiment, it is preferable that the resin composition contains (E) adhesiveness imparting agent further in addition to (A) component - (D) component.

As an adhesive imparting agent, the compound etc. which have a triazine skeleton are mentioned. As a compound which has a triazine skeleton, it is preferable that it is an imidazole compound which has a triazine skeleton.

As an imidazole compound which has a triazine skeleton, the compound represented by the following general formula (11) is mentioned, for example.

[Formula 14]

In the general formula (11), R ¹¹ and R ¹² are each independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a hydroxymethyl group, or a phenyl group, and a hydrogen atom or an alkyl group having 1 to 10 carbon atoms. It is preferable that it is a hydrogen atom, or it is more preferable that it is a C1-C3 alkyl group. R ¹³ is a hydrogen atom, an alkyl group having 1 to 20 carbon atoms, a phenyl group, or an allyl group, preferably an alkyl group having 1 to 10 carbon atoms, and more preferably an alkyl group having 1 to 3 carbon atoms. L< ⁶ > is a C1-C5 alkylene group, It is preferable that it is a C2-C4 alkylene group, and it is more preferable that it is an ethylene group.

Specifically, as an imidazole compound having a triazine skeleton in the present embodiment, 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3 ,5-triazine, 2,4-diamino-6-[2-(2-ethyl-4-methyl-1-imidazolyl)ethyl]-1,3,5-triazine, and 2,4- and diamino-6-[2-(2-undecyl-1-imidazolyl)ethyl]-1,3,5-triazine. Among these compounds, 2,4-diamino-6-[2-(2-methyl-1-imidazolyl)ethyl]-1,3,5 from the viewpoint of the peel strength and reaction temperature of the resin composition and the resin sheet. -triazine, or 2,4-diamino-6-[2-(2-ethyl-4-methyl-1-imidazolyl)ethyl]-1,3,5-triazine is preferred.

In the present embodiment, the content of the (E) adhesion-imparting agent in the resin composition is based on the total amount of the solid content of the resin composition (that is, when the total amount of the nonvolatile matter in the resin composition excluding the solvent is 100% by mass). , It is preferable that they are 0.01 mass % or more and 5 mass % or less, and it is more preferable that they are 0.03 mass % or more and 3 mass % or less. The peeling strength after hardening of a resin composition can be improved further as content of an adhesive agent is in the said range.

As an example of the resin composition which concerns on this embodiment, the resin composition containing only (A) component, (B) component, and (C) component, (A) component, (B) component, (C) component, and (D) A resin composition containing only a component, and a resin composition containing only the component (A), component (B), component (C), component (D), and component (E) are mentioned.

Moreover, as another example of the resin composition which concerns on this embodiment, as follows, (A) component, (B) component, (C) component, (D) component and (E) component, and (A) component - (E) The resin composition containing components other than a component is mentioned.

(Other ingredients)

In this embodiment, the resin composition may contain the other component further. Other components include, for example, at least any component selected from the group consisting of a crosslinking agent, a pigment, a dye, an antifoaming agent, a leveling agent, an ultraviolet absorber, a foaming agent, an antioxidant, a flame retardant, an ion trapping agent, and an ion trapping agent. have.

For example, the resin composition may further contain the crosslinking agent in order to adjust the initial stage adhesiveness before hardening of a resin sheet, and cohesiveness.

As a crosslinking agent, an organic polyhydric isocyanate compound, an amino resin, etc. are mentioned, for example. A crosslinking agent can be used individually by 1 type or in combination of 2 or more type.

Examples of the organic polyvalent isocyanate compound include an aromatic polyvalent isocyanate compound, an aliphatic polyvalent isocyanate compound, an alicyclic polyvalent isocyanate compound, and a trimer of these polyvalent isocyanate compounds, and a terminal isocyanate obtained by reacting these polyvalent isocyanate compounds with a polyol compound. A urethane prepolymer etc. are mentioned.

More specific examples of the organic polyvalent isocyanate compound include, for example, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, 1,3-xylylene diisocyanate, 1,4-xylylene diisocyanate, diphenyl Methane-4,4'-diisocyanate, diphenylmethane-2,4'-diisocyanate, 3-methyldiphenylmethane diisocyanate, hexamethylene diisocyanate, isophorone diisocyanate, dicyclohexylmethane-4,4' -diisocyanate, dicyclohexylmethane-2,4'- diisocyanate, lysine isocyanate, etc. are mentioned. An organic polyhydric isocyanate compound can be used individually by 1 type or in combination of 2 or more type.

As an amino resin, a urea resin, a melamine resin, a guanamine resin, those co-condensation resin, etc. can be used.

The crosslinking agent as described above is usually blended in an amount of 0.01 parts by mass or more and 12 parts by mass or less, preferably 0.1 parts by mass or more and 10 parts by mass or less with respect to 100 parts by mass of the binder component (C).

In this embodiment, when a resin sheet is formed by coating, it is preferable that a resin composition contains a solvent. As the solvent, in addition to general solvents such as toluene, ethyl acetate, and methyl ethyl ketone, cyclohexanone (boiling point: 155.6°C), dimethylformamide (boiling point: 153°C), dimethyl sulfoxide (boiling point: 189.0°C), ethylene glycol and high boiling point solvents such as ethers (cellosolve) (boiling point: about 120 to 310°C) and ortho-xylene (boiling point: 144.4°C).

[Resin Sheet]

The resin sheet which concerns on this embodiment is formed from the resin composition which concerns on this embodiment mentioned above. In the resin sheet which concerns on this embodiment, flexibility can further be improved, maintaining heat resistance.

The resin sheet consists only of the resin composition according to the present embodiment from the viewpoint of conformability to unevenness of an adherend to be affixed when used for sealing a semiconductor element or sandwiching a semiconductor element and another electronic component. it is preferable That is, it is preferable that the resin sheet is not a composite material such as a combination of a resin composition and a fiber sheet, such as a prepreg.

It is preferable that the peeling strength after thermosetting of the resin sheet which concerns on this embodiment is 2.0 N/10 mm or more, It is more preferable that they are 3.0 N/10 mm or more and 50 N/10 mm or less, 4.0 N/10 mm or more and 50 N It is more preferable that they are /10 mm or less, and it is especially preferable that they are 6.0 N/10 mm or more and 40 N/10 mm or less.

When the resin sheet according to the present embodiment has a peel strength after thermosetting of 2.0 N/10 mm or more, when a resin sheet is used as a sealing material, it is possible to maintain high adhesiveness to an adherend.

The peel strength after thermosetting of the resin sheet according to the present embodiment, for example, selects a component to be used in the resin composition, and preferably blends at least one selected from allyl resin and adhesion imparting agent to the resin composition And it can adjust to the said range by adjusting the kind and compounding quantity.

In addition, the peeling strength after thermosetting of the resin sheet which concerns on this embodiment was calculated|required by performing the peeling test of 90 degrees peeling angle between the to-be-adhered resin sheet after thermosetting using the measuring method mentioned later. Specifically, the test piece was produced as follows and the peeling test was implemented.

(i) Method of manufacturing the test piece

·Adhesive body: copper foil (size 50 mm × 10 mm, thickness 150 μm, JIS H 3100 specification)

・Lamination device: “V-130” manufactured by Nikko Materials Co., Ltd.

Compression conditions: Lamination temperature 130 ° C, reach pressure 200 Pa, time 40 seconds

·Thermal curing conditions of the resin sheet: thermosetting temperature 180 ℃, thermosetting time 2 hours

(ii) Method of peel test

・Used device: Tensile tester (“Autograph AG-100NXplus” manufactured by Shimadzu Corporation)

· Peeling method: peeling the cured resin sheet from the adherend

·Peeling speed: 50 mm/min

·Peel angle: 90 degrees

·Measurement environment: 23 ℃ 50% relative humidity environment

In the resin sheet according to the present embodiment, when the resin composition is formed into a sheet,

Application to an adherend becomes simple, especially when an adherend has a large area, and sticking becomes simple.

Since the resin composition is previously formed in a shape suitable for the shape after a sealing process as it is a sheet form, it can supply as a sealing material which maintained uniformity to a certain extent just by application. Moreover, since there is no fluidity|liquidity as a resin composition is a sheet form, it is excellent in handleability.

From the viewpoint of improving the heat resistance of the cured product of the resin sheet, the storage elastic modulus E' at 250°C after thermosetting of the resin sheet according to the present embodiment is preferably 150 MPa or more, more preferably 300 MPa or more, and 500 It is more preferable that it is MPa or more. Storage elastic modulus E' at 250 degreeC after thermosetting of a resin sheet is the value measured about the test piece which hardened the resin sheet on 200 degreeC and conditions of 4 hours.

The method of forming a resin composition into a sheet can employ|adopt a conventionally well-known method of forming into a sheet, and is not specifically limited. When forming a resin sheet from a resin composition by application|coating of the resin composition containing a solvent, in the drying process after application|coating, you may volatilize a solvent completely, and you may make some solvent remain in a resin sheet. The resin sheet according to the present embodiment may be a band-like sheet or may be provided in a state wound in roll shape. The resin sheet which concerns on this embodiment wound up in roll shape can be used, unwinding from a roll and cutting|disconnecting to a desired size.

It is preferable that it is 10 micrometers or more, for example, and, as for the thickness of the resin sheet which concerns on this embodiment, it is more preferable that it is 20 micrometers or more. Moreover, it is preferable that the said thickness is 500 micrometers or less, It is more preferable that it is 400 micrometers or less, Furthermore, it is preferable that it is 300 micrometers or less.

It is preferable that the resin sheet which concerns on this embodiment is used for a semiconductor element. Specifically, it is preferable that the resin sheet which concerns on this embodiment is used for sealing a semiconductor element. Moreover, it is preferable that the resin sheet which concerns on this embodiment is used for interposing between a semiconductor element and another electronic component.

The semiconductor element is preferably a power semiconductor element.

Since the resin sheet according to the present embodiment has excellent heat resistance, it can be used to encapsulate a power semiconductor element that is expected to operate at a high temperature of 200°C or higher, or to sandwich a power semiconductor element and other electronic components.

Moreover, it is preferable that the resin sheet which concerns on this embodiment is collectively applied to a some semiconductor element. For example, if the resin composition is in the form of a sheet, a resin sheet is applied to a structure in which a semiconductor element is arranged for each gap of a frame in which a plurality of gaps are formed, and the frame and the semiconductor element are collectively encapsulated. can

Moreover, it is preferable that the resin sheet which concerns on this embodiment is used for sealing the semiconductor element using any 1 or more types of silicon carbide and gallium nitride. Or it is preferable that the resin sheet which concerns on this embodiment is used for interposing between the semiconductor element using any 1 or more types of silicon carbide and gallium nitride, and another electronic component. As another electronic component, a printed wiring board, a lead frame, etc. are mentioned, for example.

Since the upper limit of the operating temperature of the silicon semiconductor device is about 175°C, it is preferable to use a semiconductor device using at least one of silicon carbide and gallium nitride capable of high-temperature operation for the power semiconductor device.

Since the resin sheet according to the present embodiment is excellent in heat resistance, it encapsulates a semiconductor element using any one or more of silicon carbide and gallium nitride, which is assumed to be operated at a high temperature of 200°C or higher, or any of silicon carbide and gallium nitride. It can be used for interposing between the semiconductor element using 1 or more types, and another electronic component.

(thermal curing conditions)

The thermosetting conditions in the resin sheet which concerns on this embodiment WHEREIN: It is preferable that heating temperature is 50 degreeC or more and 300 degrees C or less, and it is preferable that they are 100 degrees C or more and 250 degrees C or less.

The thermosetting conditions in the resin sheet which concerns on this embodiment WHEREIN: It is preferable that they are 10 minutes or more and 10 hours or less, and, as for heating time, it is more preferable that they are 20 minutes or more and 7 hours or less.

When the thermosetting conditions in a resin sheet are the said range, thermosetting of a resin sheet is realizable.

[Laminate]

1, the cross-sectional schematic of the laminated body 1 which concerns on this embodiment is shown.

The laminated body 1 which concerns on this embodiment is resin formed between the 1st release material 2, the 2nd release material 4, and the 1st release material 2, and the 2nd release material 4 It has a sheet (3). The resin sheet 3 is a resin sheet according to the present embodiment.

The 1st peeling material 2 and the 2nd peeling material 4 have peelability, The peeling force with respect to the resin sheet 3 of the 1st peeling material 2, and resin of the 2nd peeling material 4 It is preferable that there is a difference in the peeling force to the sheet 3 . The material of the 1st peeling material 2 and the 2nd peeling material 4 is not specifically limited. The ratio (P2/P1) of the peel force P2 of the second release material 4 to the peel force P1 of the first release material 2 is 0.02 ≤ P2/P1 < 1 or 1 < P2/P1 ≤ 50 desirable.

The first release material 2 and the second release material 4 may be, for example, a member having peelability in the release material itself, a member subjected to a peeling treatment, or a member in which a release agent layer is laminated. do. When the peeling process is not given to the 1st peeling material 2 and the 2nd peeling material 4, As a material of the 1st peeling material 2 and the 2nd peeling material 4, for example, , an olefin resin, a fluororesin, etc. are mentioned.

The 1st peeling material 2 and the 2nd peeling material 4 can be set as the peeling material provided with the peeling base material and the release agent layer formed on the peeling base material. Handling becomes easy by setting it as a peeling material provided with a peeling base material and a releasing agent layer. Moreover, the 1st peeling material 2 and the 2nd peeling material 4 may be equipped with the release agent layer only on the single side|surface of the peeling base material, and may be equipped with the release agent layer on both surfaces of the peeling base material. Formation of a release agent can be performed by application|coating of a release agent, for example.

Examples of the release substrate include a paper substrate, a laminated paper obtained by laminating a thermoplastic resin such as polyethylene on the paper substrate, and a plastic film. Examples of the paper substrate include glassine paper, coated paper, and cast coated paper. As the plastic film, for example, polyester films (eg, polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate), and polyolefin films (eg, polypropylene, polyethylene, etc.), etc. can be heard Among these, a polyester film is preferable.

As a releasing agent, For example, the silicone type releasing agent comprised from a silicone resin; a long-chain alkyl group-containing compound-based release agent composed of a compound containing a long-chain alkyl group such as polyvinyl carbamate and an alkylurea derivative; an alkyd resin-based release agent composed of an alkyd resin (eg, invertible alkyd resin, invertible alkyd resin, etc.); olefin resins (eg, polyethylene (eg, high-density polyethylene, low-density polyethylene, and linear low-density polyethylene, etc.), propylene homopolymers having an isotactic structure, or a syndiotactic structure, and propylene-α-olefin olefin resin-based release agents composed of crystalline polypropylene resins such as copolymers; a rubber-based release agent composed of rubber such as natural rubber and synthetic rubber (eg, butadiene rubber, isoprene rubber, styrene-butadiene rubber, methyl methacrylate-butadiene rubber, and acrylonitrile-butadiene rubber); And various release agents, such as an acrylic resin type release agent comprised from acrylic resins, such as a (meth)acrylic acid ester type copolymer, are mentioned, These can be used individually by 1 type or in combination of 2 or more types. Among these, an alkyd resin type release agent is preferable. In particular, when a phenoxy resin or polyamideimide resin is used as the binder component (C) of the resin composition included in the resin sheet 3, if a general silicone-based release agent is employed, the release material is unintentionally formed in the resin sheet 3 Since there is a risk of peeling off before use, it is preferable to use an alkyd resin-based release agent.

The thickness of the 1st peeling material 2 and the 2nd peeling material 4 is not specifically limited. Usually, they are 1 micrometer or more and 500 micrometers or less, and it is preferable that they are 3 micrometers or more and 100 micrometers or less.

The thickness of the release agent layer is not particularly limited. When apply|coating the solution containing a release agent and forming a release agent layer, it is preferable that they are 0.01 micrometer or more and 3 micrometers or less, and, as for the thickness of a release agent layer, it is more preferable that they are 0.03 micrometer or more and 1 micrometer or less.

The manufacturing method of the laminated body 1 is not specifically limited. For example, the laminate 1 is manufactured through the following process. First, on the 1st peeling material 2, the resin composition containing a solvent is apply|coated, and a coating film is formed. Next, this coating film is dried and the resin sheet 3 is formed. Next, the laminated body 1 is obtained by bonding the resin sheet 3 and the 2nd peeling material 4 together at normal temperature. In addition, in this case, when the kind of the peeling material of the 1st peeling material 2 and the 2nd peeling material 4 is the same, the 2nd peeling material 4 with respect to the peeling force P1 of the 1st peeling material 2 The ratio (P2/P1) of the peeling force P2 is highly likely to be P2/P1 < 1, and even if the release materials of the first release material 2 and the second release material 4 are of different types, the resin composition is applied When it is the 1st peeling material 2 to do, there exists a tendency for the value of P2/P1 to become small.

[Effect of embodiment]

ADVANTAGE OF THE INVENTION According to the resin composition and resin sheet which concern on this embodiment, it is excellent in heat resistance, and the resin composition and resin sheet which can improve the peeling strength after thermosetting are obtained.

As mentioned above, the resin sheet which concerns on this embodiment can be used suitably for a power semiconductor element. In other words, in the semiconductor device according to the present embodiment, the semiconductor element is preferably a power semiconductor element. It is also assumed that the power semiconductor element operates at a high temperature of 200°C or higher. Therefore, heat resistance is calculated|required of the material used for the semiconductor device which has a power semiconductor element. Since the resin sheet according to the present embodiment is excellent in heat resistance, it is preferably used for covering a power semiconductor element in a semiconductor device or for interposing between the power semiconductor element and other components.

As above-mentioned, the resin sheet which concerns on this embodiment can be used suitably for the semiconductor element which used any 1 or more types of silicon carbide and gallium nitride. In other words, the semiconductor device according to the present embodiment WHEREIN: It is preferable that the semiconductor element is a semiconductor element using any 1 or more types of silicon carbide and gallium nitride. Since a semiconductor element using any one or more of silicon carbide and gallium nitride has different characteristics from a silicon semiconductor element, it is suitable for applications such as power semiconductor elements, high-output devices for base stations, sensors, detectors, and Schottky barrier diodes. is used sparingly In these uses, attention is also paid to the heat resistance of the semiconductor element using any one or more types of silicon carbide and gallium nitride, and since the resin sheet of this embodiment is excellent in heat resistance, any one or more types of silicon carbide and gallium nitride It is preferably used in combination with the used semiconductor element.

[Modification of embodiment]

The present invention is not limited to the above embodiments, and modifications or improvements within the scope capable of achieving the object of the present invention are included in the present invention.

Although the said embodiment demonstrated the laminated body which has a 1st release material, a 2nd release material, and the resin sheet formed between the 1st release material, and the 2nd release material, in addition, only one surface of the resin sheet The laminated body which has a peeling material may be sufficient.

Moreover, although the semiconductor encapsulation use was demonstrated in embodiment of the said semiconductor device, the resin sheet of this invention is other than that, insulation materials for circuit boards (for example, hard printed wiring board material, flexible wiring board material, and build) It can be used as an interlayer insulating material for up substrates, etc.), an adhesive film for build-up, and an adhesive agent, etc.

Example

Hereinafter, the present invention will be described in more detail by way of Examples. The present invention is not limited at all to these Examples.

[Preparation of resin composition]

The resin compositions according to Examples 1 to 5 and Comparative Examples 1 and 2 were prepared by dissolving or dispersing each component in a solvent at a compounding ratio (% by mass (ratio in terms of solid content)) shown in Tables 1 and 2).

The materials used for preparation of the resin composition are as follows.

(thermosetting component)

-Maleimide resin-1: Maleimide resin having a biphenyl group (maleimide resin represented by the above general formula (3), "MIR-3000-70MT" manufactured by Nippon Kayaku Co., Ltd.)

Maleimide resin-2: Long-chain alkyl maleimide resin (maleimide resin represented by the above general formula (7-2-1), "BMI-1700" manufactured by Designer Molecules Inc.)

·Maleimide resin-3: Long-chain alkyl maleimide resin (“SLK1500” manufactured by Shin-Etsu Chemical Co., Ltd.)

·Allyl resin: Diallylbisphenol A (DABPA, manufactured by Daiwa Chemical Industry Co., Ltd.)

Curing catalyst (adhesive imparting agent): 2,4-diamino-6-[2-(2-ethyl-4-methyl-1-imidazolyl)ethyl]-1,3,5-triazine (Shikoku Chemical Co., Ltd.) Manufactured by industrial company 「2E4MZ-A」)

(Silane coupling agent)

-Silane coupling agent-1: a silane coupling agent represented by the structural formula (B1-1) ("X-12-989MS" manufactured by Shin-Etsu Chemical Co., Ltd.)

-Silane coupling agent-2: a silane coupling agent represented by the structural formula (B1-2) ("X-12-1116" manufactured by Shin-Etsu Chemical Co., Ltd.)

·Silane coupling agent-3: 3-glycidoxypropyltriethoxysilane

(binder component)

Binder resin: BisA type phenoxy resin (“YX7200B35” manufactured by Mitsubishi Chemical)

(inorganic filler)

Silica filler: fused silica (epoxysilane formula, average particle size 0.5 μm, maximum particle size 2.0 μm)

<Evaluation of a resin composition and a resin sheet>

[Production of laminated body including resin sheet]

On the first release material (polyethylene terephthalate film having a release layer formed from an alkyd resin release agent, manufactured by Lintec Co., Ltd., PET38AL-5, thickness 38 µm), a resin varnish (cyclohexanone and methyl ethyl ketone) was applied with a knife coater. A coating solution in which each component of the resin composition was dissolved or dispersed, and a solid content concentration of 60 mass%.) was applied to the mixed solvent, dried at 90°C for 1 minute, and then dried at 115°C for 1 minute. The thickness of the resin composition after drying was 25 micrometers. Immediately after taking out from the drying furnace, the resin composition after drying and the second release material (polyethylene terephthalate film with a release layer formed from a silicone release agent, Lintech Co., Ltd. SP-PET382150, thickness 38 µm) are bonded at room temperature, The laminated body in which the 1st release material, the resin sheet which consists of a resin composition, and the 2nd release material were laminated|stacked in this order was produced.

[Measurement of Peel Strength]

One side of the resin sheet in the obtained laminate is bonded to a wafer piece (thickness 800 µm) obtained by cutting a 6-inch Si wafer into quarters in advance by pressure-bonding at a lamination temperature of 130°C (lamination apparatus: Nikko Materials). "V-130" manufactured by Zhuzo Corporation; Condition: reached pressure 100 Pa, time 60 seconds), then, on the other side of the resin sheet, a copper foil (size 50 mm × 10 mm, thickness 350 µm, JIS H 3100 specification), It bonded together by pressure-pressing-bonding on the conditions similar to the above. In addition, the 2nd peeling material and 1st peeling material of the resin sheet in a laminated body peeled before sticking to a Si wafer and a copper plate, respectively. Then, the resin composition was hardened on the thermosetting conditions for 2 hours at the temperature of 180 degreeC, and it was set as the sample. With respect to this sample, using a tensile testing machine ("Autograph AG-IS" manufactured by Shimadzu Corporation), the copper foil was peeled from the cured resin sheet under the conditions of a peeling rate of 50 mm/min and a peeling angle of 90 degrees, and the copper foil was cured. The peeling strength (unit: N/10mm) of the subsequent resin sheet was measured. The measurement was performed in the environment of 23 degreeC and 50% of relative humidity. About Examples 1-3 and Comparative Example 1, the obtained result is shown in Table 1. Moreover, the result obtained about Examples 4 and 5 and the comparative example 2 is shown in Table 2.

[Measurement of elastic modulus at 250°C]

The obtained resin composition was apply|coated on the release material, it dried at 90 degreeC for 1 minute and 110 degreeC for 1 minute, and the 25-micrometer-thick resin sheet was produced. Eight of these resin sheets were laminated to have a thickness of 200 µm, and thereafter, the resin sheet was peeled off from the release material to obtain a sample. The sample was hardened by thermosetting conditions for 4 hours at the temperature of 200 degreeC, and it was set as the sample for a measurement. For this measurement sample, using "DMAQ800" manufactured by TA Instruments, the storage modulus E' (unit: : MPa) was measured. Moreover, it is excellent in heat resistance, so that the storage elastic modulus in 250 degreeC is large. About Examples 1-3 and Comparative Example 1, the obtained result is shown in Table 1. Moreover, the result obtained about Examples 4 and 5 and the comparative example 2 is shown in Table 2.

It turned out that the resin composition which concerns on Examples 1-3 has favorable all evaluation of peeling strength and the elastic modulus in 250 degreeC. Moreover, although Comparative Example 1 differs from Example 1 etc. in the point which used silane coupling agents other than the compound represented by general formula (B1), compared with Example 1 etc., it turned out that the result of peeling strength is inferior. Therefore, it was confirmed that the resin composition which concerns on Examples 1-3 is excellent in heat resistance and can improve the peeling strength after thermosetting.

It turned out that the resin composition which concerns on Examples 4 and 5 had favorable all evaluation of peeling strength and the elastic modulus in 250 degreeC. Moreover, although Comparative Example 2 differs in Example 4 etc. in the point using silane coupling agents other than the compound represented by general formula (B1), compared with Example 4 etc., it turned out that the result of peeling strength is inferior. Therefore, it was confirmed that the resin composition concerning Examples 4 and 5 was excellent in heat resistance and could improve the peeling strength after thermosetting.

1: laminate
2: first release material
3: Resin sheet
4: 2nd peeling material.

Claims (8)

A resin composition comprising (A) a thermosetting component and (B) a silane coupling agent,
Said (A) thermosetting component contains (A1) maleimide resin,
The resin composition in which the said (B) silane coupling agent is a compound represented by the following general formula (B1).
(R ²¹ O) _a (R ²² ) _3-a Si-L ²¹ -NH-L ²² -NH-R ²³ ... (B1)
(In the general formula (B1), R ²¹ is an alkyl group, R ²² and R ²³ are each independently a monovalent organic group, and L ²¹ and L ²² are each independently a divalent organic group, , a is 1, 2 or 3.) The method of claim 1,
The resin composition in which content of the said (B) silane coupling agent is 0.01 mass % or more and 5 mass % or less on the basis of the whole amount of solid content of the said resin composition. 3. The method according to claim 1 or 2,
Further (E) containing an adhesive imparting agent,
The resin composition in which the said (E) adhesion-imparting agent is a compound which has a triazine skeleton. The resin sheet formed from the resin composition in any one of Claims 1-3. 5. The method of claim 4,
The resin sheet whose peeling strength after hardening is 2.0 N/10 mm or more, when the said resin sheet is adhere|attached with copper foil and hardened|cured at the temperature of 180 degreeC under the conditions of 2 hours. 5. The method of claim 4,
The resin sheet whose peeling strength after hardening is 6.0 N/10 mm or more when the said resin sheet is adhere|attached with copper foil and it hardened|cured at the temperature of 180 degreeC under the conditions of 2 hours. 7. The method according to any one of claims 4 to 6,
A resin sheet used for sealing a power semiconductor element or sandwiching the power semiconductor element with another electronic component. 7. The method according to any one of claims 4 to 6,
Resin used for sealing a semiconductor element using any one or more types of silicon carbide and gallium nitride, or sandwiching a semiconductor element using any one or more types of the silicon carbide and gallium nitride and other electronic components Sheet

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