KR20220115205A - Digitizer and image display device including the same - Google Patents

Abstract

A digitizer includes: a base layer; a lower conductive layer disposed on an upper surface of the base layer; an insulating layer formed on an upper surface of the base layer to cover the lower conductive layer; an upper conductive layer disposed on the insulating layer and having a thickness smaller than that of the lower conductive layer; and a contact passing through the insulating layer and electrically connecting the lower conductive layer and the upper conductive layer. Provided is a digitizer which has improved bending reliability and in which electrode cracking is prevented.

Description

Digitizer and image display device including same

The present invention relates to a digitizer and an image display device including the same. More particularly, it relates to a digitizer including a multilayer conductive structure and an image display device including the same.

Recently, various sensing functions and communication functions are combined in an image display device, and are implemented in the form of, for example, a smartphone. For example, electronic devices in which a touch panel or a touch sensor is attached to a display panel of the image display device to select a menu displayed on a window surface to implement an information input function are being developed.

In addition, as disclosed in Korean Patent No. 10-1750564, a digitizer that converts analog coordinate information into a digital signal by an electromagnetic method is disposed on the back side of the image display device.

Recently, a flexible display having flexibility that can be folded or bent is being developed, and accordingly, a sensor structure such as the digitizer needs to be developed to have appropriate physical properties, design, and structure to be applied to the flexible display.

For example, in the case of a digitizer applied to a thin display device, a crack of a conductive pattern or an electrode may easily occur in a bending portion. Therefore, there is a need to develop a digitizer capable of maintaining reliability even after repeated bending.

Korean Patent Publication No. 10-1750564

One object of the present invention is to provide a digitizer having improved mechanical and electrical reliability.

An object of the present invention is to provide an image display device including a digitizer having improved mechanical and electrical reliability.

1. base layer; a lower conductive layer disposed on the upper surface of the base layer; an insulating layer formed on the upper surface of the base layer and covering the lower conductive layer; an upper conductive layer disposed on the insulating layer and having a smaller thickness than the lower conductive layer; and a contact penetrating the insulating layer and electrically connecting the lower conductive layer and the upper conductive layer.

2. The digitizer according to 1 above, wherein the thickness of the lower conductive layer is 5 to 20 μm, and the thickness of the upper conductive layer is 6 μm or less.

3. The digitizer according to 1 above, wherein the thickness of the lower conductive layer is 10 to 20 μm, and the thickness of the upper conductive layer is 1 to 6 μm.

4. The method of 1 above, wherein the lower conductive layer includes a plurality of first lower conductive lines and a plurality of second lower conductive lines extending in a second direction parallel to the upper surface of the base layer,

The upper conductive layer is parallel to the upper surface of the base layer and includes a plurality of first upper conductive lines and a plurality of second upper conductive lines extending in a first direction perpendicular to the second direction, the digitizer.

5. In 4 above, the contact is

first contacts electrically connecting the first upper conductive lines and the second lower conductive lines to form a first conductive coil; and second contacts electrically connecting the first lower lines and the second upper conductive lines to form a second conductive coil.

6. The method of 5 above, wherein the first conductive coil extends in the first direction, a plurality of the first conductive coils are arranged along the second direction, and the second conductive coil extends in the second direction. and a plurality of the second conductive coils are arranged along the first direction.

7. The digitizer of 6 above, wherein the first conductive coils each include a plurality of first conductive loops, and the second conductive coils each include a plurality of second conductive loops.

8. The digitizer according to the above 7, wherein the first conductive loops have different sizes, and the second conductive loops have different sizes.

9. The digitizer according to the above 4, wherein the base layer includes a bending region in the central portion.

10. The digitizer according to 9 above, wherein a bending axis of the bending region intersects the first upper conductive line and is parallel to the first lower conductive line.

11. Display panel; and a digitizer disposed under the display panel and according to the above-described embodiments.

12. The image display device according to 11 above, further comprising a touch sensor disposed on the display panel.

13. The method of 12 above, further comprising a rear cover and a window substrate,

The touch sensor is disposed between the window substrate and the display panel, and the digitizer is disposed between the display panel and the rear cover.

According to embodiments of the present invention, a lower conductive layer and an upper conductive layer may be sequentially stacked on one surface of the base layer. Accordingly, it is possible to prevent cracks in the conductive layer by uniformizing the direction of stress during bending.

In example embodiments, the upper conductive layer may include an upper conductive line crossing a bending axis, and the lower conductive layer may include a lower conductive line parallel to the bending axis. Thickness of the upper conductive line may be formed smaller than the lower conductive line to suppress electrode cracks and improve bending characteristics.

The digitizer may include a plurality of first conductive coils and second conductive coils, and the first conductive coil and the second conductive coil may include a plurality of conductive loops. Accordingly, a digitizer that promotes the electromagnetic induction phenomenon and has high resolution and improved flexible characteristics can be provided.

1 is a schematic cross-sectional view showing a digitizer according to exemplary embodiments.
2 and 3 are schematic plan views illustrating conductive coils included in a digitizer according to example embodiments.
4 is a schematic plan view illustrating a digitizer according to exemplary embodiments.
5 is a schematic cross-sectional view illustrating a digitizer according to a comparative example.
6 is a schematic cross-sectional view illustrating an image display apparatus according to example embodiments.

SUMMARY Embodiments of the present invention provide a digitizer including conductive patterns having a multilayer structure and having improved bending reliability. Also provided is an image display device including a digitizer.

Hereinafter, with reference to the drawings, embodiments of the present invention will be described in more detail. However, the following drawings attached to the present specification illustrate preferred embodiments of the present invention, and serve to further understand the technical spirit of the present invention together with the above-described content of the present invention, so the present invention is described in such drawings It should not be construed as being limited only to the matters.

In the drawings below, two directions parallel to and intersecting with the upper surface of the digitizer 100 or the base layer 105 are defined as a first direction and a second direction. For example, the first direction and the second direction may cross each other perpendicularly.

The first direction may correspond to a width direction, a row direction, or an X-direction of the digitizer 100 . The second direction may correspond to a longitudinal direction, a column direction, or a Y-direction of the digitizer 100 .

1 is a schematic cross-sectional view showing a digitizer according to exemplary embodiments. 2 and 3 are schematic plan views illustrating conductive coils included in a digitizer according to example embodiments. For example, FIG. 1 is a cross-sectional view taken along the line I-I' shown in FIG. 2 in the thickness direction.

Referring to FIG. 1 , the digitizer 100 may include a lower conductive layer 110 and an upper conductive layer 130 formed on a base layer 100 . The lower conductive layer 110 and the upper conductive layer 130 may be separated in different layers with the interlayer insulating layer 120 interposed therebetween.

The substrate layer 100 is used to encompass a support layer or a film-type substrate for forming the conductive layers 110 and 130 and the interlayer insulating layer 120 . For example, the base layer 100 may include a polymer applicable to a flexible display. Examples of the polymer include cyclic olefin polymer (COP), polyethylene terephthalate (PET), polyacrylate (PAR), polyetherimide (PEI), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), poly Allylate (polyallylate), polyimide (PI), cellulose acetate propionate (CAP), polyethersulfone (PES), cellulose triacetate (TAC), polycarbonate (PC), cyclic olefin copolymer (COC), poly Methyl methacrylate (PMMA), etc. are mentioned.

Preferably, the base layer 105 may include polyimide to secure stable bending properties.

The lower conductive layer 110 and the upper conductive layer 130 may each include a low-resistance metal. For example, the lower conductive layer 110 and the upper conductive layer 130 are silver (Ag), gold (Au), copper (Cu), aluminum (Al), platinum (Pt), palladium (Pd), chromium ( Cr), titanium (Ti), tungsten (W), niobium (Nb), tantalum (Ta), vanadium (V), iron (Fe), manganese (Mn), cobalt (Co), nickel (Ni), zinc ( Zn), tin (Sn), molybdenum (Mo), calcium (Ca), or an alloy containing at least two of them.

Preferably, the lower conductive layer 110 and the upper conductive layer 130 may include copper or a copper alloy to realize low resistance.

The interlayer insulating layer 120 may be formed on the upper surface of the base layer 105 to cover the lower conductive layer 110 . The interlayer insulating layer 120 may include an organic insulating material such as an epoxy-based resin, an acrylic resin, a siloxane-based resin, or a polyimide-based resin, or an inorganic insulating material such as silicon oxide or silicon nitride. Preferably, the interlayer insulating layer 120 may be formed using an organic insulating material to improve flexible properties.

The upper conductive layer 130 may be formed on the interlayer insulating layer 120 . In some embodiments, the passivation layer 140 may be formed on the interlayer insulating layer 120 to cover the upper conductive layer 130 . The passivation layer 140 may include an organic insulating material such as an epoxy-based resin, an acrylic resin, a siloxane-based resin, or a polyimide-based resin, or an inorganic insulating material such as silicon oxide or silicon nitride. Preferably, the passivation layer 140 may be formed using an organic insulating material to improve flexible properties.

Each of the interlayer insulating layer 120 and the passivation layer 140 may have a thickness in the range of about 1.5 to 20 μm to improve bending properties.

2 and 3 , the digitizer 100 according to example embodiments may include a first conductive coil 50 and a second conductive coil 70 .

The first conductive coil 50 and the second conductive coil 70 may be defined by combining the lower conductive layer 110 and the upper conductive layer 130 by the contacts 135 and 137 .

The lower conductive layer 110 may include a first lower conductive line 112 (see FIG. 3 ) and a second lower conductive line 114 (see FIG. 2 ). The second conductive layer 130 may include a first upper conductive line 132 (see FIG. 2 ) and a second upper conductive line 134 (see FIG. 3 ).

The first lower conductive line 112 and the second lower conductive line 114 may extend in the second direction. The first upper conductive line 132 and the second upper conductive line 134 may extend in a first direction.

As shown in FIG. 2 , the first upper conductive line 132 of the upper conductive layer 130 and the second lower conductive line 114 of the lower conductive layer 110 are coupled to each other to form a first conductive coil 50 . can form.

The first upper conductive line 132 and the second lower conductive line 114 may together form a first conductive coil 50 to serve as a sensing line for an input pen through electromagnetic induction.

For example, the first upper conductive line 132 and the second lower conductive line 114 may be electrically connected to each other through the first contact 135 . A plurality of first upper conductive lines 132 and a plurality of second lower conductive lines 114 are electrically connected to each other through a plurality of first contacts 135 to form a single first conductive coil 50 . A plurality of conductive loops may be included. For example, four first conductive loops may be included in one first conductive coil 50 .

In some embodiments, the first conductive loops may have different sizes or areas in a planar direction. The first contact 135 may pass through the interlayer insulating layer 120 to be formed substantially integrally with the first upper conductive line 132 .

A first input line 113 and a first output line 115 may be connected to any one of the first conductive loops. For example, the first input line 113 may be connected to an innermost first conductive loop among the first conductive loops. The first output line 115 may be connected to an outermost first conductive loop among the first conductive loops.

The current input from the first input line 113 may alternately cycle through the lower conductive layer 110 and the upper conductive layer 130 through the first conductive loops, and may be discharged through the first output line 115 . have.

In some embodiments, the first input line 113 and the first output line 115 may be included in the lower conductive layer 110 .

In some embodiments, the lower conductive layer 110 may include a first internal connection line 114a. For example, adjacent first conductive loops may be connected by a first internal connection line 114a.

As shown in FIG. 3 , the first lower conductive line 112 of the lower conductive layer 110 and the second upper conductive line 134 of the upper conductive layer 130 are coupled to each other to form a second conductive coil 70 . can form.

The first lower conductive line 112 and the second upper conductive line 134 may be provided together as a sensing line for an input pen through electromagnetic induction by forming a second conductive coil 70 together.

For example, the first lower conductive line 112 and the second upper conductive line 134 may be electrically connected to each other through the second contact 137 . A plurality of first lower conductive lines 112 and a plurality of second upper conductive lines 134 are electrically connected to each other through a plurality of second contacts 137 to form a single second conductive coil 70 . A plurality of conductive loops may be included. For example, four second conductive loops may be included in one second conductive coil 70 .

In some embodiments, the second conductive loops may have different sizes or areas in a planar direction. The second contact 137 may be formed substantially integrally with the second upper conductive line 134 through the interlayer insulating layer 120 .

A second input line 117 and a second output line 119 may be connected to any one of the second conductive loops. For example, the second input line 117 may be connected to an innermost second conductive loop among the second conductive loops. The second output line 119 may be connected to an outermost second conductive loop among the second conductive loops.

The current input from the second input line 117 may alternately cycle through the lower conductive layer 110 and the upper conductive layer 130 through the second conductive loops, and may be discharged through the second output line 119 . have.

In some embodiments, the second input line 117 and the second output line 119 may be included in the lower conductive layer 110 .

In some embodiments, the upper conductive layer 130 may further include an external connection line 134a. For example, the second input line 117 and the second output line 119 may be connected through the second conductive loop and the second contact 137 by the external connection line 134a.

In an embodiment, the external connection line 134a may be connected to two different second conductive coils. For example, the output line 119 connected to one of the second conductive coils 70 may be connected to the input line 117 of the other second conductive coil 70 through an external connection line 134a.

In some embodiments, the upper conductive layer 130 may further include a second internal connection line 134b. For example, adjacent second conductive loops in the second conductive coil 70 may be connected to each other by the second internal connection line 134b.

Although it is illustrated that four conductive loops are included in one conductive coil in FIGS. 2 and 3 , the number of conductive loops in the conductive coil may be adjusted in consideration of the size and resolution of the image display device.

As described with reference to FIGS. 2 and 3 , the first conductive coil 50 and the second conductive coil 70 may each include a plurality of conductive loops having different sizes.

Accordingly, it is possible to sufficiently increase the magnetic field strength generated by the digitizer 100 , so that, for example, energy transfer to the input pen in contact with the window surface of the image display apparatus can be efficiently enhanced.

In addition, since the conductive loop is formed by connecting the lower conductive layer 110 and the upper conductive layer 130 through the contacts 135 and 137 , the number of loops of the conductive coil in a limited space is efficiently increased and electromagnetic induction efficiency is achieved. can improve

In example embodiments, both the lower conductive layer 110 and the upper conductive layer 130 may be disposed on the upper surface of the base layer 105 . Accordingly, when bending or folding through the base layer 105 , the stress direction for the lower conductive layer 110 and the upper conductive layer 130 may be adjusted in the same manner.

For example, when tensile stress is applied to the bottom surface of the base layer 105 , compressive stress may be applied to the lower conductive layer 110 and the upper conductive layer 130 . Accordingly, a neutral plane in which stress is canceled may be easily generated to be adjacent to the conductive layers 110 and 130 . Accordingly, stress applied to the conductive layers 110 and 130 may be relieved, thereby reducing or preventing electrode cracking due to bending.

In example embodiments, the thickness of the lower conductive layer 110 may be greater than the thickness of the upper conductive layer 130 . For example, the thickness of the first lower conductive line 112 may be greater than the thickness of the first upper conductive line 132 .

As will be described later with reference to FIG. 4 , the first upper conductive line 132 may extend in a first direction (eg, a row direction or a width direction) and intersect a bending axis. For example, the first upper conductive line 132 may be perpendicular to the bending axis. The first lower conductive line 112 may extend in a second direction (a column direction or a length direction) and may be substantially parallel to the bending axis.

According to example embodiments, by reducing the thickness of the first upper conductive line 132 to which bending stress is easily transmitted as it intersects the bending axis, prevention of cracks in the conductive line may be reduced or suppressed. Since the first lower conductive line 112, which is parallel to the bending axis and is relatively free from bending stress, is formed to have a large thickness, a sufficient electromagnetic induction effect may be realized by expanding a current path through the conductive coil.

In an embodiment, the second lower conductive line 114 may also have a greater thickness than the second upper conductive line 134 .

In some embodiments, the thickness of the lower conductive layer 110 (the first lower conductive line or the second lower conductive line) may be about 5 to 20 μm, preferably 10 to 20 μm. The thickness of the upper conductive layer 130 (the first upper conductive line or the second upper conductive line) may be 6 μm or less, preferably about 1 to 6 μm.

4 is a schematic plan view illustrating a digitizer according to exemplary embodiments. For convenience of description, the detailed structure/configuration of the conductive coil is omitted in FIG. 4 .

Referring to FIG. 4 , a plurality of first conductive coils 50 and second conductive coils 70 may be arranged on the upper surface of the base layer 105 .

The first conductive coil 50 may extend in the first direction or the row direction. The plurality of first conductive coils 50 may be arranged along the second direction or the column direction.

For example, n first conductive coils 50 - 1 to 50 - n may be sequentially arranged along the second direction (n is a natural number).

The second conductive coil 70 may extend in the second direction or the column direction. The plurality of second conductive coils 70 may be arranged along the first direction or the row direction.

For example, m second conductive coils 70 - 1 to 70 - m may be sequentially arranged in the first direction.

A bending area BA may be included in the central portion of the base layer 105 . A bending axis 80 extending in the second direction may be positioned in the bending area BA. The digitizer 100 according to example embodiments may be bent or folded around the bending axis 80 .

As described above, the thickness of the first upper conductive line 132 or the second upper conductive line 134 crossing the bending axis 80 may be relatively small. Accordingly, it is possible to prevent cracking of the upper conductive layer 130 to which bending stress is directly applied and to increase flexibility.

The thicknesses of the first lower conductive line 112 and the second lower conductive line 114 parallel to the bending axis 80 and having relatively small bending stress are increased to reduce resistance and improve the efficiency of generating a magnetic field through the conductive coil. can do it

5 is a schematic cross-sectional view illustrating a digitizer according to a comparative example.

Referring to FIG. 5 , the conductive layers 110 and 130 of the digitizer of the comparative example may be formed from a metal layer (eg, a copper layer) included in a flexible copper clad laminate (FCCL). Accordingly, for example, the upper conductive layer 130 and the lower conductive layer 110 may be formed on the upper and lower surfaces of the base layer 105 including polyimide, respectively.

When the digitizer of the comparative example is bent in the in-folding direction, compressive stress may be applied to the lower conductive layer 110 and tensile stress may be applied to the upper conductive layer 130 . Accordingly, the electrical connection between the lower conductive layer 110 and the upper conductive layer 130 may be damaged, and an electrode crack phenomenon may easily occur.

In addition, as the conductive layers are formed on both surfaces of the base layer 105 , the first insulating layer 122 and the first coverlay film 152 protecting the lower conductive layer 110 are formed, and the upper conductive layer ( A second insulating layer 124 and a second coverlay film 154 to protect the 130 may be formed. Accordingly, the overall thickness of the digitizer may be increased, and thus flexibility and bending characteristics may be deteriorated.

However, according to the above-described exemplary embodiments, since the lower conductive layer 110 and the upper conductive layer 130 are sequentially stacked on the upper surface of the base layer 105, the direction of stress generated during bending can be adjusted in the same way. have. Accordingly, as described above, the generation of the neutral plane is promoted, and thus electrode cracks and separation occurring during severe bending can be alleviated. In addition, conductive layers and an insulating layer are stacked on one surface of the base layer 105 to obtain a thin digitizer.

In some embodiments, the lower conductive layer 110 may be formed from a metal layer of FCCL, and the upper conductive layer 130 may be separately formed through a deposition process such as a sputtering process after forming the insulating layer 120 . .

Accordingly, the thickness of the upper conductive layer 130 may be selectively reduced, and a thin digitizer in which electrode cracks are suppressed may be obtained.

6 is a schematic cross-sectional view illustrating an image display apparatus according to example embodiments.

Referring to FIG. 6 , the image display apparatus may include the display panel 360 , the touch sensor 200 , and the digitizer 100 according to the above-described exemplary embodiments.

The digitizer 100 may be disposed under the display panel 360 . For example, the digitizer 100 may be disposed between the display panel 360 and the rear cover 380 .

The digitizer 100 includes relatively thick conductive lines for efficiency in generating a magnetic field using electromagnetic induction, and may include a plurality of conductive coils. Accordingly, the digitizer 100 may be disposed under the display panel 360 so as not to be recognized by a user of the image display apparatus.

The display panel 360 may include a pixel electrode 310 , a pixel defining layer 320 , a display layer 330 , a counter electrode 340 , and an encapsulation layer 350 disposed on the panel substrate 300 . can

A pixel circuit including a thin film transistor (TFT) may be formed on the panel substrate 300 , and an insulating layer covering the pixel circuit may be formed. The pixel electrode 310 may be electrically connected to, for example, a drain electrode of a TFT on the insulating layer.

The pixel defining layer 320 may be formed on the insulating layer to expose the pixel electrode 310 to define a pixel area. A display layer 330 is formed on the pixel electrode 310 , and the display layer 330 may include, for example, a liquid crystal layer or an organic light emitting layer.

A counter electrode 340 may be disposed on the pixel defining layer 320 and the display layer 330 . The opposing electrode 340 may be provided as a common electrode or a cathode of the image display device, for example. An encapsulation layer 350 for protecting the display panel 360 may be stacked on the opposite electrode 340 .

The touch sensor 200 may be stacked on the display panel 360 and disposed toward the window substrate 230 . The touch sensor 200 may generate capacitance by a user's touch input through the surface of the window substrate 230 . Accordingly, the touch sensor 200 may include a sensing electrode or sensing channels having a thickness smaller than that of the conductive layer included in the digitizer 100 so as not to be recognized by the user. For example, the thickness of the sensing electrode or the sensing channel may be less than 1 μm or less than 0.5 μm.

Each of the sensing electrodes or the sensing channels may be independently disposed in one single layer to interact with an adjacent sensing electrode or sensing channel to generate capacitance.

The touch sensor 200 may be coupled to the display panel 360 through the adhesive layer 260 .

The window substrate 230 includes, for example, a hard coating film and thin glass, and in an embodiment, a light blocking pattern 235 may be formed on a peripheral portion of one surface of the window substrate 230 . The light blocking pattern 235 may include, for example, a color printing pattern. A bezel part or a non-display area of the image display device may be defined by the light blocking pattern 235 .

A polarization layer 210 may be disposed between the window substrate 230 and the touch sensor 200 . The polarizing layer 210 may include a coated polarizer or a polarizing plate.

The polarization layer 210 may be directly bonded to the one surface of the window substrate 230 or may be attached through the first adhesive layer 220 . The touch sensor 200 may be coupled to the polarization layer 210 through the second adhesive layer 225 .

As shown in FIG. 6 , the window substrate 230 , the polarization layer 210 , and the touch sensor 200 may be sequentially disposed from the user's viewing side. In this case, since the sensing electrodes of the touch sensor 200 are disposed under the polarization layer 210 , it is possible to more effectively prevent the sensing electrode from being viewed.

In an embodiment, the touch sensor 200 may be directly transferred onto the window substrate 230 or the polarization layer 210 . In an embodiment, the window substrate 230 , the touch sensor 200 , and the polarization layer 210 may be disposed in the order from the user's viewing side.

50: first conductive coil 70: second conductive coil
100: digitizer 105: base layer
110: lower conductive layer 112: first lower conductive line
114: second lower conductive line 120: insulating layer
130: upper conductive layer 132: first upper conductive line
134: second upper conductive line 135: first contact
137: second contact 140: passivation layer

Claims (13)

base layer;
a lower conductive layer disposed on the upper surface of the base layer;
an insulating layer formed on the upper surface of the base layer and covering the lower conductive layer;
an upper conductive layer disposed on the insulating layer and having a smaller thickness than the lower conductive layer; and
and a contact penetrating the insulating layer and electrically connecting the lower conductive layer and the upper conductive layer. The digitizer according to claim 1, wherein the thickness of the lower conductive layer is 5 to 20 μm, and the thickness of the upper conductive layer is 6 μm or less. The digitizer of claim 1, wherein the thickness of the lower conductive layer is 10 to 20 μm, and the thickness of the upper conductive layer is 1 to 6 μm. The method according to claim 1, wherein the lower conductive layer comprises a plurality of first lower conductive lines and a plurality of second lower conductive lines extending in a second direction parallel to the upper surface of the base layer,
The upper conductive layer is parallel to the upper surface of the base layer and includes a plurality of first upper conductive lines and a plurality of second upper conductive lines extending in a first direction perpendicular to the second direction, the digitizer. The method according to claim 4, The contact,
first contacts electrically connecting the first upper conductive lines and the second lower conductive lines to form a first conductive coil; and
and second contacts electrically connecting the first lower conductive lines and the second upper conductive lines to form a second conductive coil. The method according to claim 5, wherein the first conductive coil extends in the first direction, a plurality of the first conductive coils are arranged along the second direction,
The second conductive coil extends in the second direction, and a plurality of the second conductive coils are arranged along the first direction. The digitizer of claim 6 , wherein the first conductive coils each include a plurality of first conductive loops, and the second conductive coils each include a plurality of second conductive loops. The digitizer of claim 7 , wherein the first conductive loops have different sizes and the second conductive loops have different sizes. The digitizer of claim 4, wherein the base layer includes a bending region in a central portion. The digitizer of claim 9 , wherein a bending axis of the bending region intersects the first upper conductive line and is parallel to the first lower conductive line. display panel; and
An image display apparatus comprising the digitizer according to claim 1 disposed below the display panel. The image display device of claim 11 , further comprising a touch sensor disposed on the display panel. The method according to claim 12, further comprising a rear cover and a window substrate,
The touch sensor is disposed between the window substrate and the display panel, and the digitizer is disposed between the display panel and the rear cover.

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