KR20220090719A - Image sensor assembly - Google Patents

Abstract

An image sensor assembly including an image sensor having a chip on board structure inside a housing is provided.
An image sensor assembly according to an embodiment of the present invention includes a housing, an image sensor unit provided inside the housing, a substrate at least a portion of which is provided inside the housing and electrically connected to the image sensor unit, and the It is coupled to the outer surface of the housing, characterized in that it comprises a glass portion for transmitting light into the housing.

Description

Image sensor assembly {IMAGE SENSOR ASSEMBLY}

The present invention relates to an image sensor assembly, and more particularly, to an image sensor assembly having an image sensor having a chip on board structure inside a housing.

The image sensor module used in the camera module can be divided into two types. Specifically, a type in which the image sensor is mounted on the upper part of the board through a chip on board (COB), that is, wire bonding. and flip-chip type.

Among them, in the case of a COB package, in the conventional COB package, a printed circuit board is exposed to the outside of the package, and there are many junctions between components. Therefore, since there are many sites using epoxy-bond at the joint, a decrease in sealing performance may occur depending on the level of the packaging process and assembly technology.

In addition, in the case of the conventional COB package, the difference in the coefficient of thermal expansion between the printed circuit board and the housing (eg, a metal plate) to be bonded is large. Accordingly, since the epoxy of the bonding surface of the printed circuit board bonded to the housing is cured and then cooled while bending occurs, the flatness of the image sensor may be impaired.

In addition, in the case of the conventional COB package, a board-board connector is used for connection with an external printed circuit board, and thermal expansion due to heat of the external printed circuit board is transmitted to the COB package through the connector. can Due to this, the COB package may be deformed and a problem of not focusing properly may occur.

Registered Utility Model Publication No. 20-0294446

It is an object of the present invention to provide an image sensor assembly that can minimize the transfer of stress to the housing by locating the substrate part into the housing of the image sensor assembly and reducing the contact area between the substrate part and the housing.

Another object of the present invention is to provide an image sensor assembly in which assembly between a substrate part and a housing is easy and a sealing structure is improved.

An image sensor assembly according to an embodiment of the present invention includes a housing, an image sensor unit provided inside the housing, a substrate at least a portion of which is provided inside the housing and electrically connected to the image sensor unit, and the It is coupled to the outer surface of the housing and includes a glass part for transmitting light into the housing, and the substrate part is attached to only a part of the housing.

Preferably, the housing includes a first housing in which the substrate part is disposed so as to surround the image sensor part and the image sensor part on a horizontal plane on a first surface, and a second housing coupled to the first surface of the first housing. characterized in that

Preferably, the first housing is formed on a first surface of the first housing, and includes a sensor arrangement part on which the image sensor part and a part of the substrate part are disposed; A second surface of the first housing that is formed to surround the upper surface of the first housing and is formed between a substrate arrangement part on which a part of the substrate part is disposed, and between the sensor arrangement part and the substrate arrangement part, and faces the first surface of the first housing It is characterized in that it includes a groove formed by being depressed in the direction.

Preferably, the second housing is formed to surround an opening formed on a second surface of the second housing opposite to a first surface of the second housing coupled to the first housing and the opening on a horizontal plane, and a glass attachment part coupling the glass part to the second surface of the second housing to seal the opening, and the image sensor part is formed in the housing at a position corresponding to the opening.

Preferably, the substrate unit is connected to the sensor arrangement unit and the substrate body disposed on the substrate arrangement unit and the substrate body so as to surround the image sensor unit on a horizontal plane, and is inserted in the direction of the first surface of the first housing and a cable exposed in the direction of the second surface of the first housing.

Preferably, the first housing is formed on the substrate arrangement part, and includes at least one substrate guide part inserted into at least one insertion hole formed in the substrate body, an outer edge portion of the sensor arrangement part, and the substrate arrangement. It is formed on the inner edge of the unit, and is formed on the outer edge of the substrate attaching part and the substrate attaching part for coupling the substrate body to the sensor arranging part and the substrate arranging part, and attaching the second housing to the second housing of the first housing. It is coupled to one surface, it characterized in that it further comprises a housing attachment portion formed to surround the substrate attachment portion on a horizontal plane.

Preferably, the substrate attachment part is formed at an outer edge of the sensor arrangement part to be spaced apart from the image sensor part, and a first board attachment part and the board arrangement for coupling the sensor arrangement part and the inner edge part of the substrate body and a second substrate attachment portion formed on an inner edge of the unit and coupling the substrate arrangement portion and an outer edge portion of the substrate body, wherein the housing attachment portion is formed to be spaced apart from the second substrate attachment portion on a horizontal plane. do it with

Preferably, the first housing is formed on the substrate arrangement portion, characterized in that it further comprises a cable insertion hole into which the cable is inserted.

Preferably, the first housing further includes a potting groove in which a potting part sealing a gap between the cable and the cable insertion hole is formed, the potting groove being connected to the cable insertion hole and connecting the second surface of the first housing It is characterized in that it is formed on the

According to the present invention, since the substrate portion is positioned in the housing of the image sensor assembly, and the substrate attachment portion is attached only to the inner edge portion and the outer edge portion of the substrate body among the substrate portion, the contact area between the substrate portion and the housing is reduced, thereby reducing the stress of the substrate portion to the housing. transmission can be minimized.

In addition, the arrangement of the substrate unit and the housing may be guided when the substrate unit is coupled to the housing through the structure of the substrate guide unit formed in the housing.

In addition, since the opening of the housing is sealed through the glass part and the gap between the cable and the cable insertion hole is sealed through the potting part, it is possible to prevent foreign substances or moisture from entering the space inside the housing.

In addition, since the cable is exposed to the outside of the housing and electrically connected to the external board, there is no need to mount a separate connector on the board, thereby improving space utilization of the image sensor assembly.

1 is a view showing an image sensor assembly according to an embodiment of the present invention.
2 is an exploded perspective view of an image sensor assembly according to an embodiment of the present invention.
3 is a cross-sectional side view of an image sensor assembly according to an embodiment of the present invention (section A-A' in FIG. 1 ).
4 is a view illustrating a state in which an image sensor unit is disposed in a first housing of the image sensor assembly.
5 is a view showing a state in which a substrate attaching unit is applied to the first housing.
6 is a view showing a state in which the first housing and the substrate unit are coupled.
7 is a view showing a state in which the image sensor unit and the substrate unit are wire-bonded after assembling the substrate unit.
8 is a view showing a state in which the housing attachment part is applied to the first housing.
9 is a view showing a state in which the first housing and the second housing are combined.
10 is a view showing a state in which the glass attachment part is applied to the second housing.
11 is a view showing a state in which the glass unit is coupled to the second housing.
12 is a view showing a process of forming a potting part in the first housing (cross section BB' in FIG. 1).
13 is a diagram illustrating a state in which an image sensor assembly is connected to an external substrate according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, it should be noted that in adding reference numerals to the components of each drawing, the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, preferred embodiments of the present invention will be described below, but the technical spirit of the present invention is not limited thereto or may be variously implemented by those skilled in the art without being limited thereto.

1 is a view showing an image sensor assembly 100 according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the image sensor assembly 100 according to an embodiment of the present invention.

1 and 2 , the image sensor assembly 100 according to an embodiment of the present invention includes a housing 10 , an image sensor unit 20 , a substrate unit 30 , and a glass unit 40 . do. Preferably, the housing 10 may be formed of a metal or ceramic material.

1 and 2 , an image sensor unit 20 may be provided inside the housing 10 .

At least a portion of the substrate unit 30 is provided inside the housing 10 and may be electrically connected to the image sensor unit 20 .

Preferably, the image sensor unit 20 may be mechanically and electrically connected to the substrate unit 30 by wire bonding through the bonding unit 50 , and the substrate unit 30 and the image sensor unit 20 . ) may be arranged to be spaced apart from each other by a predetermined interval.

In addition, the glass part 40 is coupled to the outer surface of the housing 10 (the second surface of the second housing 14 to be described later) and transmits light into the housing 10 through an opening 142 to be described later. can

The glass unit 40 may be disposed to be vertically spaced apart from the image sensor unit 20 by a predetermined distance, and may transmit light into the housing 10 so that the light is incident on the image sensor unit 20 .

In this case, the image sensor unit 20 may be formed in a position corresponding to the opening 142 to be described later in the housing 10 .

3 is a cross-sectional side view of an image sensor assembly according to an embodiment of the present invention (section A-A' in FIG. 1 ).

1 to 3 , the housing 10 includes a first housing 12 and a second surface that is vertically coupled to a first surface (upper surface of the first housing 12) of the first housing 12 . and a housing 14 .

In this case, in the first housing 12 , the image sensor unit 20 and the substrate unit 30 may be disposed on the first surface to surround the image sensor unit 20 on a horizontal plane.

More specifically, the first housing 12 has an image sensor unit 20 and a portion of the substrate unit 30 (inner edge portion of the substrate body 32 of the substrate unit 30) disposed on the first surface. The sensor arrangement unit 121 and the sensor arrangement unit 121 are spaced apart from each other and are formed to surround the sensor arrangement unit 121 on a horizontal plane, and a part of the substrate unit 30 (of the substrate body 32 of the substrate unit 30) The first housing 12 is formed between the substrate arrangement unit 122 and the sensor arrangement unit 121 and the substrate arrangement unit 122 on which the outer edge portion) is disposed, and faces the first surface of the first housing 12 . ) of the second surface (the lower surface of the first housing 12) in the direction of the recessed portion 123 is formed.

The substrate unit 30 is connected to and connected to the sensor arrangement unit 121 and the substrate body 32 and the substrate body 32 disposed on the substrate arrangement unit 122 so as to surround the image sensor unit 20 on a horizontal plane. and a cable 34 inserted in the direction of the first surface of the first housing 12 and exposed in the direction of the second surface of the first housing 12 . Preferably, the substrate 30 may be formed of a material having a low coefficient of thermal expansion (eg, polyimide or FR5).

As described above, an inner edge portion of the substrate body 32 may be disposed on the sensor arrangement unit 121 , and an outer edge portion of the substrate body 32 may be disposed on the substrate arrangement unit 122 . Preferably, the inner edge portion of the substrate body 32 may be formed in the form of a rectangular opening as shown in FIGS. 2 and 3 , for example, may be formed in a rectangular shape, a square shape, or the like. However, the shape is not limited to a rectangular shape.

In addition, the cable 34 is a type of a flexible board, and may be exposed to the outside of the housing 10 and electrically connected to the external board 200 to be described later.

Meanwhile, the substrate body 32 may be formed of a material that is relatively less rigid than the cable 34 . However, the present invention is not limited thereto, and the entire substrate 30 may be formed of a flexible substrate.

In the embodiment of the present invention, only the inner edge portion and the outer edge portion of the substrate body 32 are disposed in the first housing 12 due to the configuration of the groove portion 123 , so that the substrate portion 30 and the housing 10 are in contact By reducing the area, it is possible to minimize the transfer of the stress of the substrate part 30 to the housing 10 .

2 and 3 , the first housing 12 is formed on the substrate placement unit 122 , and at least one substrate guide is inserted into the at least one insertion hole 322 formed in the substrate body 32 . It further includes a portion 124 .

Preferably, the substrate guide part 124 may be press-fitted or screw-fastened to the first surface of the first housing 12 , and the insertion hole 322 is formed in the substrate body 32 in the substrate guide part 124 . ) may be formed at a position corresponding to the

The substrate guide part 124 may guide alignment between the substrate body 32 and the first housing 12 when the substrate body 32 is coupled to the first housing 12 .

The first housing 12 is formed on the substrate arrangement part 122 and further includes a cable insertion hole 125 into which the cable 34 is inserted.

As an example, the cable insertion hole 125 may be formed between the substrate body 32 and the position where the above-described second housing 14 is coupled to the first surface of the first housing 12 on the substrate placement unit 122 . can However, the present invention is not limited thereto, and the cable insertion hole 125 may be formed at any position on the substrate arrangement 122 where the cable 34 is easily inserted.

FIG. 4 is a view showing a state in which the image sensor unit 20 is disposed on the first housing 12 of the image sensor assembly 100 , and FIG. 5 is a view showing a state in which the substrate attachment unit 126 is applied to the first housing 12 . It is a diagram showing a state.

Referring to FIG. 4 , the image sensor unit 20 may be disposed on the sensor arrangement unit 121 of the first housing 12 . Preferably, the image sensor unit 20 may be coupled to the sensor arrangement unit 121 through an epoxy bonding method.

As shown in FIG. 4 , after the image sensor unit 20 is disposed on the sensor arrangement unit 121 , the outer edge portion of the sensor arrangement unit 121 and the substrate arrangement unit 122 as shown in FIG. 5 . ) may be formed on the inner edge portion of the substrate attachment portion 126 . Preferably, the substrate attachment part 126 may be a type of epoxy.

More specifically, as shown in FIG. 5 , the substrate attaching unit 126 is formed to be spaced apart from the image sensor unit 20 on a horizontal plane on the outer edge of the sensor arrangement unit 121 , and includes the sensor arrangement unit 121 and The first substrate attaching portion 126a for coupling the inner edge portion of the substrate body 32 and the inner edge portion of the substrate placing portion 122 are formed, and the outer edge of the substrate placing portion 122 and the substrate body 32 . and a second substrate attachment portion 126b for bonding the parts.

In the embodiment of the present invention, as shown in FIG. 5 , the first substrate attaching part 126a is formed only on the outer edge of the sensor arranging part 121 , and the second substrate attaching part 126a is formed only on the inner edge of the substrate arranging part 122 . Since the substrate attachment part 126b is formed, a contact area between the substrate part 30 and the housing 10 may be reduced.

6 is a view showing a state in which the first housing 12 and the substrate unit 30 are coupled. At this time, FIG. 6(a) of FIG. 6 is a view showing the state before the substrate part 30 is coupled to the first housing 12, and FIG. 6(b) is the substrate part 30 of the first housing ( 12) is a diagram showing the coupled state.

Referring to FIGS. 6A and 6B , the inner edge portion of the substrate body 32 is spaced apart from the image sensor unit 20 on a horizontal plane and the sensor is disposed through the first substrate attachment unit 126a. It may be coupled to an outer edge portion of the portion 121 .

The outer edge portion of the substrate body 32 may be coupled to the inner edge portion of the substrate placement unit 122 through the second substrate attachment portion 126b.

Meanwhile, the substrate guide part 124 may be inserted into the insertion hole 322 formed in the substrate body 32 .

In addition, the cable 34 connected to the substrate body 32 may be inserted into the cable insertion hole 125 formed on the substrate placement unit 122 .

7 is a diagram illustrating a state in which the image sensor unit 20 and the substrate unit 30 are wire-bonded after assembling the substrate unit 30 .

As shown in FIG. 6 , after the first housing 12 and the substrate unit 30 are coupled, the image sensor unit 20 and the substrate unit 30 may be connected as shown in FIG. 7 .

Preferably, the image sensor unit 20 may be mechanically and electrically connected by wire bonding to the substrate body 32 of the substrate unit 30 through the bonding unit 50 as described above.

FIG. 8 is a view showing a state in which the housing attachment part 127 is applied to the first housing 12 , and FIG. 9 is a view showing a state in which the first housing 12 and the second housing 14 are combined.

As shown in FIG. 7 , after connecting the image sensor unit 20 and the substrate unit 30 through the bonding unit 50 , as shown in FIG. 8 , the A housing attachment part 127 may be formed.

More specifically, as shown in FIGS. 5, 6 and 8, the housing attachment part 127 couples the second housing 14 to the first surface of the first housing 12, and the substrate attachment part ( 126) may be formed to surround it on a horizontal plane.

In this case, the housing attachment part 127 is formed to be spaced apart from the second board attachment part 126b on a horizontal plane, and for example, the cable insertion hole 125 is the second board attachment part 126b among the board attachment parts 126 . and the housing attachment part 127, but is not limited thereto.

As shown in FIG. 8 , after the housing attachment part 127 is applied to the first housing 12 , the first housing 12 and the second housing 12 are passed through the housing attachment part 127 as shown in FIG. 9 . The housing 14 may be coupled up and down.

FIG. 10 is a view showing a state in which the glass attachment part 144 is applied to the second housing 14 , and FIG. 11 is a view showing a state in which the glass part 40 is coupled to the second housing 14 .

10, the second housing 14 is a second housing (14) opposite to the first surface (lower surface of the second housing 14) of the second housing 14 coupled to the first housing 12 ( 14 ) and an opening 142 formed in the second surface (the upper surface of the second housing 14 ).

As described above, the image sensor unit 20 may be formed at a position corresponding to the opening 142 in the housing 10 .

After coupling the first housing 12 and the second housing 14 up and down as shown in FIG. 9 , as shown in FIG. 10 , a glass attachment part 144 on the second surface of the second housing 14 . can form. Preferably, the glass attachment part 144 may be a kind of epoxy.

More specifically, as shown in FIG. 10 , the glass attachment part 144 is formed to surround the opening 142 on a horizontal plane, and the glass part 40 is attached to the second housing 14 to seal the opening 142 . can be bonded to the second side of

As shown in FIG. 10, after the glass attachment part 144 is applied to the second housing 14, as shown in FIG. 11, the glass part 40 is attached to the second housing ( 14) can be coupled to the second surface of the opening 142 to seal.

As described above, the glass unit 40 is disposed to be vertically spaced apart from the image sensor unit 20 by a predetermined distance, and transmits light into the housing 10 so that the light is incident on the image sensor unit 20 . . In addition, since the glass part 40 seals the opening 142 , it is possible to prevent foreign substances or moisture from flowing into the space inside the housing 10 .

12 is a view illustrating a process of forming the potting part 60 in the first housing 12 (section B-B' in FIG. 1 ). At this time, FIG. 12 (a) of FIG. 12 is a view showing a state before the potting part 60 is formed in the potting groove 125-1, and FIG. 12(b) is a potting groove 125-1. It is a view showing a state in which the part 60 is formed.

Referring to FIG. 12 ( a ), the first housing 12 is connected to the aforementioned cable insertion hole 125 and a potting groove 125 - 1 formed in a longitudinal direction on the second surface of the first housing 12 . further includes

At this time, as shown in FIG. 12( a ), the aforementioned cable 34 is inserted in the direction of the first surface of the first housing 12 through the cable insertion hole 125 , and the second It may be exposed to the outside in the surface direction.

As described above, the cable 34 is a kind of flexible substrate, and since it is very flexible, it is possible to minimize transmission of thermal stress and deformation due to thermal expansion to the housing 10 .

Referring to FIG. 12B , a potting part 60 may be formed in the potting groove 125 - 1 to seal a gap between the cable 34 and the cable insertion hole 125 .

Preferably, the potting part 60 may be a kind of epoxy, but is not limited thereto, and thermosetting plastic or silicone rubber may be used.

The potting part 60 may be formed to fill the entire potting groove 125 - 1 as shown in FIG. 12B , and may be formed by a potting process. As an example, the potting process may refer to a process of filling an electronic component with a hard or elastic material to form resistance to shock and vibration and to prevent moisture and corrosion.

Since the potting part 60 seals the gap between the cable 34 and the cable insertion hole 125 , it is possible to prevent foreign substances or moisture from entering the space inside the housing 10 .

13 is a diagram illustrating a state in which the image sensor assembly 100 is connected to the external substrate 200 according to an embodiment of the present invention.

Referring to FIG. 13 , the image sensor assembly 100 may be electrically connected to the external substrate 200 through a cable 34 exposed to the outside in the direction of the second surface of the second housing 14 .

Preferably, the external substrate 200 may control the image sensor assembly 100 to sense the image by the image sensor unit 20 when capturing an image.

At this time, since the cable 34 is exposed to the outside in the direction of the second surface of the second housing 14 and is electrically connected to the external board 200 , there is no need to mount a separate connector on the board part 30 . Space utilization of the image sensor assembly 100 may be improved.

Also, although not shown, the external substrate 200 may be provided in a separate housing.

The above description is merely illustrative of the technical idea of the present invention, and those of ordinary skill in the art to which the present invention pertains may make various modifications, changes and substitutions within the scope without departing from the essential characteristics of the present invention. will be. Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are for explaining, not limiting, the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments and the accompanying drawings . The protection scope of the present invention should be construed by the following claims, and all technical ideas within the scope equivalent thereto should be construed as being included in the scope of the present invention.

100: image sensor assembly
10: housing
20: image sensor unit
30: substrate part
40: glass part
50: bonding unit
60: potting unit

Claims (9)

housing;
an image sensor unit provided inside the housing;
at least a portion of a substrate provided in the housing and electrically connected to the image sensor unit; and
and a glass part coupled to the outer surface of the housing and transmitting light into the housing;
The substrate part is an image sensor assembly, characterized in that attached to only a portion of the housing. The method of claim 1,
The housing is
a first housing in which the substrate part is disposed on a first surface to surround the image sensor part and the image sensor part on a horizontal plane;
and a second housing coupled to the first surface of the first housing. 3. The method of claim 2,
The first housing,
a sensor arrangement part formed on the first surface of the first housing and in which the image sensor part and a part of the substrate part are disposed;
a substrate arrangement spaced apart from the sensor arrangement part and formed to surround the sensor arrangement part on a horizontal plane, the substrate arrangement part on which a part of the board part is disposed;
and a groove formed between the sensor arrangement unit and the substrate arrangement unit and recessed in a direction of a second surface of the first housing opposite to the first surface of the first housing. . 3. The method of claim 2,
The second housing,
an opening formed in a second surface of the second housing opposite to the first surface of the second housing coupled to the first housing; and
a glass attachment part formed to surround the opening on a horizontal plane and coupling the glass part to the second surface of the second housing to seal the opening;
The image sensor assembly is characterized in that the image sensor unit is formed in a position corresponding to the opening in the housing. 4. The method of claim 3,
The substrate part,
a substrate body disposed on the sensor arrangement unit and the substrate arrangement unit so as to surround the image sensor unit on a horizontal plane; and
and a cable connected to the substrate body, inserted in a direction of a first surface of the first housing, and exposed in a direction of a second surface of the first housing. 6. The method of claim 5,
The first housing,
at least one substrate guide unit formed on the substrate arrangement unit and inserted into at least one insertion hole formed in the substrate body;
a substrate attaching part formed on an outer edge of the sensor arranging part and an inner edge of the substrate arranging part and coupling the substrate body to the sensor arranging part and the substrate arranging part;
The image sensor according to claim 1, further comprising: a housing attachment portion formed on an outer edge of the substrate placement portion, coupling the second housing to the first surface of the first housing, and surrounding the substrate attachment portion on a horizontal plane assembly. 7. The method of claim 6,
The substrate attachment part,
a first substrate attachment part formed on an outer edge of the sensor arrangement part to be spaced apart from the image sensor part, and coupling the sensor arrangement part to an inner edge part of the substrate body;
a second substrate attaching part formed on an inner edge of the substrate placing part and coupling the substrate placing part and an outer edge of the substrate body;
The image sensor assembly of claim 1, wherein the housing attachment part is spaced apart from the second substrate attachment part on a horizontal plane. 6. The method of claim 5,
The first housing is formed on the substrate arrangement part, the image sensor assembly characterized in that it further comprises a cable insertion hole into which the cable is inserted. 9. The method of claim 8,
The first housing,
Further comprising a potting groove in which a potting part sealing the gap between the cable and the cable insertion hole is formed,
The potting groove is connected to the cable insertion hole and is formed on the second surface of the first housing.

Images