KR102485123B1 - Image sensor assembly - Google Patents

Abstract

An image sensor assembly having an image sensor having a chip on board structure inside a housing is provided.
An image sensor assembly according to an embodiment of the present invention includes a housing, an image sensor unit provided inside the housing, a substrate unit at least partially provided inside the housing and electrically connected to the image sensor unit, and the It is characterized in that it includes a glass portion coupled to the outer surface of the housing and transmitting light into the housing.

Description

Image sensor assembly {IMAGE SENSOR ASSEMBLY}

The present invention relates to an image sensor assembly, and more particularly, to an image sensor assembly including an image sensor having a chip on board structure inside a housing.

The image sensor module used in the camera module can be largely classified into two types, specifically, a chip on board (COB), that is, a type in which the image sensor is mounted on the top of the board through wire bonding. and a flip-chip type.

Among them, in the case of a COB package, a conventional COB package exposes a printed circuit board to the outside of the package and has many junctions between component parts. Therefore, there are many areas where epoxy-bond is used for the junction, and sealing performance may be deteriorated depending on the level of the packaging process and assembly technology.

In addition, in the case of a conventional COB package, there is a large difference in coefficient of thermal expansion between a printed circuit board and a housing (eg, a metal plate) bonded thereto. Accordingly, since the curvature of the epoxy on the bonding surface of the printed circuit board bonded to the housing is cured and then cooled, flatness of the image sensor may be impaired.

In addition, in the case of a conventional COB package, a board-board connector is used for connection with an external printed circuit board, and thermal expansion due to heat generated by the external printed circuit board is transferred to the COB package through the connector. can As a result, the COB package may be deformed, and a problem of not focusing properly may occur.

Registered Utility Model Publication No. 20-0294446

An object of the present invention is to provide an image sensor assembly capable of minimizing transfer of stress from the board to the housing by locating the board within the housing of the image sensor assembly and reducing the contact area between the board and the housing.

In addition, an object of the present invention is to provide an image sensor assembly in which assembly between a substrate unit and a housing is easy and a sealing structure is improved.

An image sensor assembly according to an embodiment of the present invention includes a housing, an image sensor unit provided inside the housing, a substrate unit at least partially provided inside the housing and electrically connected to the image sensor unit, and the A glass portion coupled to an outer surface of the housing and transmitting light into the housing, and the substrate portion being attached to only a portion of the housing.

Preferably, the housing includes a first housing on a first surface on which the substrate unit is disposed so as to surround the image sensor unit and the image sensor unit on a horizontal surface, and a second housing coupled to the first surface of the first housing. characterized by

Preferably, the first housing is formed on a first surface of the first housing, and is spaced apart from a sensor disposition part on which the image sensor part and a part of the substrate part are disposed, and the sensor disposition part is spaced apart from the horizontal plane. a substrate arranging unit on which a part of the substrate unit is disposed and a second surface of the first housing formed between the sensor arranging unit and the substrate arranging unit and facing the first surface of the first housing; It is characterized in that it includes a groove portion formed by being indented in the direction.

Preferably, the second housing is formed to surround an opening formed on a second surface of the second housing opposite to the first surface of the second housing coupled to the first housing and the opening on a horizontal surface, and a glass attachment portion for coupling the glass portion to a second surface of the second housing to seal the opening, and the image sensor portion is formed inside the housing at a position corresponding to the opening.

Preferably, the substrate unit is connected to the sensor mounting unit and the substrate body disposed on the substrate mounting unit and the substrate body so as to surround the image sensor unit on a horizontal plane, and is inserted in the direction of the first surface of the first housing. It is characterized in that it includes a cable exposed in the direction of the second surface of the first housing.

Preferably, the first housing includes at least one substrate guide portion formed on the substrate placing portion and inserted into at least one insertion hole formed in the substrate body, an outer edge portion of the sensor placing portion, and the substrate disposing portion. formed on an inner edge portion of the substrate body, formed on a substrate attaching portion for coupling the substrate body to the sensor mounting portion and the substrate mounting portion, and formed on an outer edge portion of the substrate mounting portion, the second housing being disposed on the first housing. It is coupled to one surface and further includes a housing attachment portion formed to surround the substrate attachment portion on a horizontal surface.

Preferably, the substrate attachment part is formed at an outer edge of the sensor arrangement part and spaced apart from the image sensor part, and the first substrate attachment part and the substrate arrangement coupling the sensor arrangement part with an inner edge part of the substrate body. and a second substrate attachment portion formed at an inner edge portion of the portion and coupling the substrate mounting portion and an outer edge portion of the substrate body, wherein the housing attachment portion is formed spaced apart from the second substrate attachment portion on a horizontal surface. to be

Preferably, the first housing is formed on the substrate mounting portion and further includes a cable insertion hole into which the cable is inserted.

Preferably, the first housing further includes a potting groove in which a potting part is formed to seal a gap between the cable and the cable insertion hole, and the potting groove is connected to the cable insertion hole to form a second surface of the first housing. It is characterized by being formed on.

According to the present invention, since the substrate unit is positioned within the housing of the image sensor assembly, and the substrate attachment unit is attached only to the inner and outer edge portions of the substrate body among the substrate units, the contact area between the substrate unit and the housing is reduced so that the stress of the substrate unit is reduced to the housing. transmission can be minimized.

In addition, when the substrate unit is coupled to the housing through the structure of the substrate guide unit formed in the housing, alignment between the substrate unit and the housing may be guided.

In addition, since the opening of the housing is sealed through the glass portion and the gap between the cable and the cable insertion hole is sealed through the potting portion, it is possible to prevent foreign substances or moisture from entering into the space inside the housing.

In addition, since the cable is exposed to the outside of the housing and electrically connected to the external board, there is no need to mount a separate connector on the board, so space utilization of the image sensor assembly can be improved.

1 is a diagram illustrating an image sensor assembly according to an embodiment of the present invention.
2 is an exploded perspective view of an image sensor assembly according to an embodiment of the present invention.
3 is a side cross-sectional view of an image sensor assembly according to an embodiment of the present invention (A-A' cross-section in FIG. 1).
4 is a view illustrating a state in which an image sensor unit is disposed in a first housing of an image sensor assembly.
5 is a view showing a state in which the substrate attachment portion is applied to the first housing.
6 is a view showing a state in which the first housing and the substrate unit are coupled.
7 is a view showing a state in which the image sensor unit and the substrate unit are wire-bonded after assembling the substrate unit.
8 is a view showing a state in which the housing attaching portion is applied to the first housing.
9 is a view showing a state in which the first housing and the second housing are coupled.
10 is a view showing a state in which the glass attachment part is applied to the second housing.
11 is a view showing a state in which the glass part is coupled to the second housing.
FIG. 12 is a view showing a process of forming a potting part in the first housing (BB' cross section in FIG. 1).
13 is a diagram illustrating a state in which an image sensor assembly according to an embodiment of the present invention is connected to an external board.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First, in adding reference numerals to components of each drawing, it should be noted that the same components have the same numerals as much as possible even if they are displayed on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description will be omitted. In addition, although preferred embodiments of the present invention will be described below, the technical idea of the present invention is not limited or limited thereto and can be modified and implemented in various ways by those skilled in the art.

1 is a view showing an image sensor assembly 100 according to an embodiment of the present invention, and FIG. 2 is an exploded perspective view of the image sensor assembly 100 according to an embodiment of the present invention.

1 and 2, the image sensor assembly 100 according to an embodiment of the present invention includes a housing 10, an image sensor unit 20, a substrate unit 30 and a glass unit 40. do. Preferably, the housing 10 may be formed of a metal or ceramic material.

Referring to FIGS. 1 and 2 , an image sensor unit 20 may be provided inside the housing 10 .

At least a portion of the substrate unit 30 is provided inside the housing 10 and may be electrically connected to the image sensor unit 20 .

Preferably, the image sensor unit 20 may be mechanically and electrically connected to the substrate unit 30 through wire bonding through the bonding unit 50, and the substrate unit 30 and the image sensor unit 20 ) may be spaced apart from each other by a predetermined interval.

In addition, the glass part 40 is coupled to the outer surface of the housing 10 (a second surface of the second housing 14 described later) and transmits light into the housing 10 through an opening 142 described later. can

The glass unit 40 is disposed vertically and spaced apart from the image sensor unit 20 by a predetermined distance, and transmits light into the housing 10 to allow light to enter the image sensor unit 20 .

At this time, the image sensor unit 20 may be formed inside the housing 10 at a position corresponding to an opening 142 to be described later.

3 is a side cross-sectional view of an image sensor assembly according to an embodiment of the present invention (A-A' cross-section in FIG. 1).

Referring to FIGS. 1 to 3 , the housing 10 includes a first housing 12 and a second housing 12 coupled vertically to the first surface of the first housing 12 (upper surface of the first housing 12). housing 14.

At this time, the image sensor unit 20 and the substrate unit 30 may be disposed on the first surface of the first housing 12 to surround the image sensor unit 20 on a horizontal surface.

More specifically, the first housing 12 has an image sensor unit 20 and a part of the substrate unit 30 (the inner edge portion of the substrate body 32 of the substrate unit 30) disposed on the first surface. The sensor placement part 121 is spaced apart from the sensor placement part 121 and is formed to surround the sensor placement part 121 on a horizontal plane, and is part of the substrate part 30 (of the substrate main body 32 of the substrate part 30). The first housing 12 formed between the substrate placing portion 122 where the outer edge portion) is disposed and the sensor placing portion 121 and the substrate placing portion 122, and facing the first surface of the first housing 12 ) includes a groove 123 formed by being recessed in the direction of the second surface (lower surface of the first housing 12).

The substrate unit 30 is connected to the substrate body 32 and the substrate body 32 disposed on the sensor mounting unit 121 and the substrate mounting unit 122 so as to surround the image sensor unit 20 on a horizontal plane, and 1 includes a cable 34 inserted in the direction of the first surface of the housing 12 and exposed in the direction of the second surface of the first housing 12. Preferably, a material having a low coefficient of thermal expansion (eg, polyimide or FR5) may be used for the substrate part 30 .

As described above, an inner edge portion of the substrate body 32 may be disposed on the sensor placement unit 121 and an outer edge portion of the substrate body 32 may be disposed on the substrate disposition unit 122 . Preferably, the inner edge portion of the substrate body 32 may be formed in a rectangular opening shape as shown in FIGS. 2 and 3 , for example, may be formed in a rectangular or square shape. However, the shape is not limited to a rectangular shape.

In addition, the cable 34 is a kind of flexible board, and may be exposed to the outside of the housing 10 and electrically connected to an external board 200 to be described later.

On the other hand, the substrate body 32 may be formed of a relatively rigid material than the cable 34 . However, it is not limited thereto, and it is also possible to form the entire substrate part 30 as a flexible substrate.

In the embodiment of the present invention, only the inner and outer edges of the substrate body 32 are disposed on the first housing 12 due to the configuration of the groove portion 123, so that the substrate portion 30 and the housing 10 come into contact. By reducing the area, it is possible to minimize the transfer of stress of the substrate portion 30 to the housing 10 .

Referring to FIGS. 2 and 3 , the first housing 12 includes at least one substrate guide formed on the substrate placing unit 122 and inserted into at least one insertion hole 322 formed in the substrate body 32 . It further includes section 124.

Preferably, the board guide part 124 can be press-fitted or screwed to the first surface of the first housing 12, and the insertion hole 322 is formed in the board body 32 to the board guide part 124. ) may be formed at a position corresponding to

The substrate guide part 124 may guide alignment between the substrate body 32 and the first housing 12 when the substrate body 32 is coupled to the first housing 12 .

The first housing 12 is formed on the board mounting portion 122 and further includes a cable insertion hole 125 into which the cable 34 is inserted.

As an example, the cable insertion hole 125 may be formed between the substrate body 32 and the above-described second housing 14 on the substrate placing unit 122, and a position coupled to the first surface of the first housing 12. can However, it is not limited thereto, and the cable insertion hole 125 may be formed at an arbitrary position on the substrate placing part 122 where the cable 34 is easily inserted.

FIG. 4 is a view showing a state in which the image sensor unit 20 is disposed on the first housing 12 of the image sensor assembly 100, and FIG. 5 is a view showing a substrate attachment unit 126 applied to the first housing 12. It is a diagram showing a state.

Referring to FIG. 4 , the image sensor unit 20 may be disposed on the sensor disposing unit 121 of the first housing 12 . Preferably, the image sensor unit 20 may be coupled to the sensor disposing unit 121 through an epoxy bonding method.

As shown in FIG. 4, after the image sensor unit 20 is disposed on the sensor disposition unit 121, as shown in FIG. 5, the outer edge portion of the sensor disposition unit 121 and the substrate disposition unit 122 ) It is possible to form the substrate attachment portion 126 on the inner edge portion. Preferably, the substrate attachment part 126 may be a kind of epoxy.

More specifically, as shown in FIG. 5 , the board attaching portion 126 is formed at an outer edge of the sensor placing portion 121 and is spaced apart from the image sensor portion 20 on a horizontal plane, and the sensor placing portion 121 and The first substrate attaching portion 126a connecting the inner edge portion of the substrate body 32 and the inner edge portion of the substrate placing portion 122 are formed, and the outer edge portion of the substrate placing portion 122 and the substrate body 32 is formed. and a second substrate attaching portion 126b to couple the parts.

In the embodiment of the present invention, as shown in FIG. 5 , the first board attaching portion 126a is formed only on the outer edge of the sensor placement portion 121, and the second substrate attachment portion 126a is formed only on the inner edge of the substrate placement portion 122. Since the substrate attachment portion 126b is formed, a contact area between the substrate portion 30 and the housing 10 may be reduced.

6 is a view showing a state in which the first housing 12 and the substrate unit 30 are coupled. At this time, FIG. 6 (a) of FIG. 6 is a view showing a state before the substrate portion 30 is coupled to the first housing 12, and FIG. 6 (b) is a view showing the substrate portion 30 in the first housing ( 12) is a diagram showing the coupled state.

6(a) and 6(b), the inner edge of the substrate body 32 is spaced apart from the image sensor unit 20 on a horizontal plane, and the sensor is disposed through the first substrate attaching portion 126a. It may be coupled to the outer edge portion of the portion 121.

An outer edge portion of the substrate body 32 may be coupled to an inner edge portion of the substrate placing portion 122 through the second substrate attaching portion 126b.

Meanwhile, the substrate guide part 124 may be inserted into the insertion hole 322 formed in the substrate body 32 .

In addition, the cable 34 connected to the substrate body 32 may be inserted into the cable insertion hole 125 formed on the substrate placing unit 122 .

7 is a view showing a state in which the image sensor unit 20 and the substrate unit 30 are wire-bonded after assembly of the substrate unit 30 .

As shown in FIG. 6 , after the first housing 12 and the substrate unit 30 are coupled, as shown in FIG. 7 , the image sensor unit 20 and the substrate unit 30 may be connected.

Preferably, the image sensor unit 20 may be mechanically and electrically connected to the substrate body 32 of the substrate unit 30 through wire bonding through the bonding unit 50 as described above.

8 is a view showing a state in which the housing attachment part 127 is applied to the first housing 12, and FIG. 9 is a view showing a state in which the first housing 12 and the second housing 14 are coupled.

As shown in FIG. 7, after connecting the image sensor unit 20 and the substrate unit 30 through the bonding unit 50, as shown in FIG. A housing attachment portion 127 may be formed.

More specifically, as shown in FIGS. 5, 6 and 8, the housing attachment part 127 couples the second housing 14 to the first surface of the first housing 12, and the substrate attachment part ( 126) on a horizontal surface.

At this time, the housing attachment part 127 is formed spaced apart from the second board attachment part 126b on a horizontal plane, and illustratively, the cable insertion hole 125 is the second board attachment part 126b of the board attachment part 126. And may be located between the housing attachment portion 127, but is not limited thereto.

As shown in FIG. 8, after applying the housing attachment part 127 to the first housing 12, as shown in FIG. 9, the first housing 12 and the second The housing 14 can be coupled up and down.

FIG. 10 is a view showing a state in which the glass attachment part 144 is applied to the second housing 14, and FIG. 11 is a view showing a state in which the glass part 40 is coupled to the second housing 14.

Referring to FIG. 10, the second housing 14 is a second housing (lower surface of the second housing 14) opposite to the first surface of the second housing 14 coupled to the first housing 12 (lower surface of the second housing 14). 14) and an opening 142 formed on the second surface (upper surface of the second housing 14).

As described above, the image sensor unit 20 may be formed at a position corresponding to the opening 142 inside the housing 10 .

As shown in FIG. 9, after coupling the first housing 12 and the second housing 14 up and down, as shown in FIG. 10, the glass attachment part 144 on the second surface of the second housing 14 can form Preferably, the glass attachment part 144 may be a kind of epoxy.

More specifically, as shown in FIG. 10, the glass attachment part 144 is formed to surround the opening 142 on a horizontal surface, and the glass part 40 is attached to the second housing 14 to seal the opening 142. can be bonded to the second side of

As shown in FIG. 10, after applying the glass attachment part 144 to the second housing 14, as shown in FIG. 11, the glass part 40 is attached to the second housing ( The opening 142 may be coupled to the second surface of 14) so as to be sealed.

As described above, the glass unit 40 is disposed vertically and spaced apart from the image sensor unit 20 by a predetermined distance, and transmits light into the housing 10 so that the light is incident on the image sensor unit 20. . In addition, since the glass portion 40 seals the opening 142 , it is possible to prevent foreign substances or moisture from entering into the space inside the housing 10 .

FIG. 12 is a view showing a process of forming the potting part 60 in the first housing 12 (B-B' cross section in FIG. 1). At this time, FIG. 12 (a) of FIG. 12 is a view showing a state before the potting part 60 is formed in the potting groove 125-1, and FIG. 12 (b) is a view showing the potting part 60 in the potting groove 125-1. It is a drawing showing the state in which the part 60 is formed.

Referring to FIG. 12(a), the first housing 12 has a potting groove 125-1 connected to the aforementioned cable insertion hole 125 and formed on the second surface of the first housing 12 in a long direction. more includes

At this time, as shown in FIG. 12 (a), the above-described cable 34 is inserted through the cable insertion hole 125 toward the first surface of the first housing 12, and the second It can be exposed to the outside in the face direction.

As described above, the cable 34 is a kind of flexible board, and since it is very flexible, it is possible to minimize transfer of thermal stress and deformation due to thermal expansion to the housing 10 .

Referring to FIG. 12(b) , a potting part 60 may be formed in the potting groove 125-1 to seal a gap between the cable 34 and the cable insertion hole 125.

Preferably, the potting part 60 may be a type of epoxy, but is not limited thereto, and thermosetting plastic or silicone rubber may be used.

As shown in FIG. 12(b), the potting part 60 may be formed to fill the entire potting groove 125-1, and may be formed by a potting process. As an example, the potting process may refer to a process of filling an electronic component with a hard or flexible material to form shock and vibration resistance and to prevent moisture and corrosion.

Since the potting part 60 seals the gap between the cable 34 and the cable insertion hole 125, foreign substances or moisture from the outside can be prevented from entering the space inside the housing 10.

13 is a view showing a state in which the image sensor assembly 100 according to an embodiment of the present invention is connected to an external substrate 200.

Referring to FIG. 13 , the image sensor assembly 100 may be electrically connected to the external substrate 200 through a cable 34 exposed to the outside in the direction of the second surface of the second housing 14 .

Preferably, the external substrate 200 may control the image sensor assembly 100 to sense an image in the image sensor unit 20 when capturing an image.

At this time, since the cable 34 is exposed to the outside in the direction of the second surface of the second housing 14 and electrically connected to the external substrate 200, there is no need to mount a separate connector on the substrate 30. Space utilization of the image sensor assembly 100 may be improved.

Also, although not shown, the external substrate 200 may be provided in a separate housing.

The above description is merely an example of the technical idea of the present invention, and those skilled in the art can make various modifications, changes, and substitutions without departing from the essential characteristics of the present invention. will be. Therefore, the embodiments disclosed in the present invention and the accompanying drawings are not intended to limit the technical idea of the present invention, but to explain, and the scope of the technical idea of the present invention is not limited by these embodiments and the accompanying drawings. . The protection scope of the present invention should be construed according to the claims below, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: image sensor assembly
10: housing
20: image sensor unit
30: board part
40: glass part
50: bonding unit
60: potting part

Claims (9)

housing;
an image sensor unit provided inside the housing;
At least a part of the substrate part provided inside the housing and electrically connected to the image sensor part; and
A glass portion coupled to an outer surface of the housing and transmitting light into the housing;
The housing includes a first housing and a second housing coupled to the first housing,
The first housing includes a sensor disposition unit on which the image sensor unit is disposed, and a substrate disposition unit spaced apart from each other with the sensor disposition unit and the groove part interposed therebetween, on a first surface of the first housing;
An inner edge portion of the substrate body of the substrate unit is coupled to the sensor mounting portion outside the image sensor unit, an outer edge portion of the substrate body is coupled to the substrate mounting portion, and the substrate body is coupled to the first substrate body in the groove area. 1 Image sensor assembly, characterized in that it does not contact the housing. According to claim 1,
The image sensor assembly, characterized in that the substrate body is disposed to surround the image sensor unit on a horizontal surface. According to claim 2,
The substrate placing portion is formed to surround the sensor placing portion on a horizontal surface,
The image sensor assembly according to claim 1 , wherein the groove is formed by being recessed in a direction of a second surface of the first housing opposite to the first surface of the first housing. According to claim 2,
The second housing,
An opening formed in a second surface of the second housing opposite to the first surface of the second housing coupled to the first housing; and
a glass attachment portion formed to surround the opening on a horizontal surface and coupled to the glass portion to a second surface of the second housing to seal the opening;
The image sensor assembly, characterized in that formed in the image sensor portion inside the housing, at a position corresponding to the opening. According to claim 2,
The board part,
The board unit includes a cable connected to the board body, inserted in the direction of the first surface of the first housing, and exposed in the direction of the second surface of the first housing opposite to the first surface. sensor assembly. According to claim 5,
The first housing,
at least one substrate guide part formed on the substrate placing part and inserted into at least one insertion hole formed in the substrate body;
A substrate attaching portion formed on an outer edge of the sensor mounting unit and an inner edge of the substrate mounting unit and coupling the substrate body to the sensor mounting unit and the substrate mounting unit; and
The image sensor of claim 1 , further comprising a housing attachment portion formed at an outer edge of the substrate placement portion, coupled to the second housing to the first surface of the first housing, and formed to surround the substrate attachment portion on a horizontal surface. assembly. According to claim 6,
The substrate attachment part,
A first board attaching portion formed at an outer edge of the sensor placing portion and spaced apart from the image sensor portion and coupling the sensor placing portion to the inner edge portion of the substrate body; and
A second substrate attaching portion formed at an inner edge of the substrate placing portion and coupling the substrate placing portion to an outer edge portion of the substrate body;
The image sensor assembly, characterized in that the housing attachment portion is formed spaced apart from the second substrate attachment portion on a horizontal plane. According to claim 5,
The image sensor assembly of claim 1 , wherein the first housing further includes a cable insertion hole formed on the board mounting portion and into which the cable is inserted. According to claim 8,
The first housing,
Further comprising a potting groove in which a potting part is formed to seal a gap between the cable and the cable insertion hole,
The potting groove is connected to the cable insertion hole and is formed on the second surface of the first housing.

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