CN219759567U - Chip package assembly and electronic equipment - Google Patents

Abstract

The utility model provides a chip packaging assembly and electronic equipment, wherein the chip packaging assembly comprises a circuit board, a chip, a heat dissipation piece and a packaging piece, wherein the chip is arranged on the circuit board; the heat dissipation piece is arranged on the circuit board and used for conducting heat of the chip and the circuit board; the packaging piece is used for packaging the chip and the heat dissipation piece, and at least one part of the heat dissipation piece is exposed relative to one side, far away from the chip, of the packaging piece, and the heat dissipation piece is used for dividing the packaging piece.

Description

Chip package assembly and electronic equipment

Technical Field

The present utility model relates to the field of chip packaging technologies, and in particular, to a chip packaging assembly and an electronic device.

Background

In the chip packaging assembly, the packaging piece wraps the chip, a large amount of heat can be generated when the chip works, but the heat conduction capacity of the packaging piece is poor, the heat at the chip can not be dissipated timely, the temperature around the chip is easily caused to be too high, the normal working performance of the chip is further influenced, the service life of the chip is even attenuated, meanwhile, the packaging piece can generate shrinkage stress in the solidification process, the shrinkage stress can act on the chip, the chip is deflected after being stressed, and the yield is influenced.

Disclosure of Invention

The utility model aims to provide a chip packaging assembly and electronic equipment, which solve the problems that the heat dissipation of a chip is poor and offset is easy to occur in the packaging process.

In order to achieve the purpose of the utility model, the utility model provides the following technical scheme:

in a first aspect, the present utility model provides a chip package assembly comprising: a circuit board; the chip is arranged on the circuit board; the heat dissipation piece is arranged on the circuit board and used for conducting heat of the chip and the circuit board; the packaging piece is used for packaging the chip and the heat dissipation piece, at least one part of the heat dissipation piece is exposed relative to one side, far away from the chip, of the packaging piece, and the heat dissipation piece is used for dividing the packaging piece.

The chip, the radiating piece and the packaging piece are all arranged on the circuit board, the packaging piece is adopted to package the chip and the radiating piece, the radiating piece is located on at least one side of the chip, at least one part of the radiating piece is exposed relative to one side of the packaging piece, which is far away from the chip, so that the position of the radiating piece is adjacent to the chip, the radiating piece is conductive to heat at the chip, the heat radiating capacity of the packaging piece and the radiating piece for heat at the chip is improved, the radiating piece is exposed on one side of the packaging piece, which is far away from the chip, the radiating piece is partially exposed outside the packaging piece, and a temperature difference exists between one side of the radiating piece, which is close to the chip, and one side, which is far away from the chip, is conductive to further improving the heat conducting capacity of the radiating piece, and meanwhile, the radiating piece is divided into the packaging pieces, so that stress generated to the chip in the shrinking process of the packaging piece is reduced, and the chip is prevented from shifting.

In one embodiment, the heat sink includes a heat sink ring disposed around the chip, the heat sink ring being at least partially in contact with the chip or the heat sink ring being spaced apart from the chip.

The heat dissipation ring surrounds the chip, and the packaging parts surrounding the chip are divided by the heat dissipation ring, so that the uniformity of the division of the packaging parts is improved, the integrity of the packaging parts surrounding the chip is uniformly reduced, the shrinkage stress of the packaging parts is uniformly dispersed, the shrinkage stress acting on the chip is uniformly reduced, the chip is prevented from being offset after being subjected to the shrinkage stress, and the stability of the chip fixed on the circuit board is improved.

In one embodiment, the heat dissipation ring includes a first extension portion, the first extension portion is located on a side, away from the chip, of the heat dissipation ring, the first extension portion is clung to the circuit board, the package includes an outer side surface connected to the circuit board, the outer side surface is located on a side, away from the chip, of the package, and the first extension portion extends from the outer side surface.

The part of the first extension part in the heat dissipation ring is exposed outside the packaging piece, so that a temperature difference is formed between the first extension part and the part of the heat dissipation ring, which is buried in the packaging piece, and the heat conduction efficiency of the heat dissipation ring is improved, so that heat is conducted to the first extension part by the part of the heat dissipation ring, which is close to the chip, and the heat dissipation capacity of the heat dissipation piece to the chip is improved, and the heat dissipation to the chip is realized.

In one embodiment, the heat dissipation ring further includes a second extension portion, the second extension portion is connected with one end of the first extension portion away from the chip, the second extension portion is located outside the package, the second extension portion and the first extension portion are disposed at an included angle, the second extension portion extends towards a side away from the circuit board, or the first extension portion extends to an edge of the circuit board and is clung to a side face of the circuit board.

The heat dissipation ring still includes the second extension, the second extension is connected with the one end that the chip was kept away from to first extension, the second extension is located the outside of encapsulation, and be the contained angle setting with first extension, the area that the heat dissipation ring exposed in the encapsulation outside has been increased, the heat dissipation area of heat dissipation ring has been increased promptly, make first extension and second extension and the part that the heat dissipation ring buried in the encapsulation between form the temperature difference, be favorable to promoting the heat conduction efficiency of heat dissipation ring, make the heat conduct to first extension by the part that the heat dissipation ring is close to the chip, and then promote the heat-sinking capability of heat dissipation piece to chip department, realize the heat dissipation to chip department.

In one embodiment, the heat dissipation ring further includes a connection portion, the connection portion is buried in the package, one end of the connection portion is connected with one end of the first extension portion, which is close to the chip, and the connection portion is provided with a through hole, and the through hole is used for penetrating through a component on the circuit board.

Make the heat dissipation ring still include connecting portion, the connecting portion buries the inside of covering at the encapsulation piece, the one end of connecting portion is connected near the one end of chip with first extension, the through-hole has been seted up to the connecting portion, the through-hole is used for passing components and parts on the circuit board, be favorable to the structure of connecting portion to avoid with components and parts on the circuit board, guarantee the stability that chip package assembly structure set up, simultaneously, the connecting portion buries the inside at the encapsulation piece for the connecting portion cuts apart the encapsulation piece, reduced the wholeness of encapsulation piece, be favorable to dispersing the shrink stress of encapsulation piece, and then reduce the shrink stress that acts on the chip, avoided the chip to receive the shrink stress after take place the skew, promoted the stability that the chip was fixed on the circuit board.

In one embodiment, the heat dissipation ring further includes a bending portion, the bending portion is buried in the package, one end of the bending portion is connected with one end of the first extending portion, which is close to the chip, and the bending portion forms a groove, and the groove is used for accommodating components on the circuit board.

Make the heat dissipation ring still include the flexion, the flexion buries the inside at the encapsulation, the one end of flexion is connected near the one end of chip with first extension, form the recess between the flexion both ends, the diapire of recess has the interval distance with the circuit board, so that the components and parts that protrude in circuit board surface are avoided by the holding at the recess inside, be favorable to the structure of flexion and components and parts on the circuit board, guarantee the stability that the chip package subassembly structure set up, simultaneously, the flexion buries the inside at the encapsulation, make the flexion cut apart the encapsulation, the wholeness of encapsulation has been reduced, be favorable to dispersing the shrink stress of encapsulation, and then reduce the shrink stress that acts on the chip, the skew takes place after having avoided the chip to receive the shrink stress, the stability of chip fixed on the circuit board has been promoted.

In one embodiment, the heat dissipation ring is rectangular, and the bending parts are arranged on two opposite sides of the heat dissipation ring.

Make the heat dissipation ring be the rectangle, the heat dissipation ring relative both sides are equipped with the bending part, are favorable to the heat dissipation ring to avoid setting up the components and parts on the circuit board, and the arch structure that the bending part formed is favorable to not only saving partly encapsulation body, still is favorable to the heat dissipation piece to cut apart the encapsulation body, destroys the wholeness of encapsulation body, and then reduces the shrink stress of acting on the chip, has avoided the chip to take place the skew after receiving the shrink stress, has promoted the stability that the chip was fixed on the circuit board.

In one embodiment, the heat dissipation member further includes a heat dissipation plate, the heat dissipation plate is disposed on the circuit board, the chip is connected with a side of the heat dissipation plate away from the circuit board, and the heat dissipation plate is connected with the heat dissipation ring, or the heat dissipation plate and the heat dissipation ring have a separation distance.

Make the radiating member still include the heating panel, the heating panel sets up on the circuit board, and the chip is connected with one side that the circuit board was kept away from to the heating panel, and the heating panel is connected with the heat dissipation ring, or the heating panel has the interval distance with the heat dissipation ring, is favorable to the heat conduction of heating panel to the circuit board department near chip and the chip, avoids the area heat of chip and circuit board contact too high, influences the normal use of chip.

In one embodiment, the height of the heat sink relative to the circuit board is smaller than the height of the package relative to the circuit board.

The height of the heat dissipation part relative to the circuit board is smaller than that of the packaging part relative to the circuit board, so that most of the whole heat dissipation part is packaged by the packaging part, the packaging part protects the heat dissipation part, meanwhile, the heat dissipation part is also favorable for uniformly dividing the packaging part, the integrity of the packaging part is reduced, the shrinkage stress of the packaging part is favorably dispersed, the shrinkage stress acting on the chip is further reduced, the chip is prevented from shifting after being subjected to the shrinkage stress, and the stability of fixing the chip on the circuit board is improved.

In a second aspect, the present utility model further provides an image capturing module, including the chip package assembly according to any one of the embodiments of the first aspect.

The camera shooting module comprises a chip packaging assembly, wherein a chip, a heat radiating piece and a packaging piece are arranged on a circuit board, the packaging piece is used for packaging the chip and the heat radiating piece, the heat radiating piece is located on at least one side of the chip, at least one part of the heat radiating piece is exposed relative to one side of the packaging piece, which is far away from the chip, so that the heat radiating piece is adjacent to the chip, the heat radiating piece is conductive to heat at the chip, the heat radiating capacity of the packaging piece and the heat radiating piece to heat at the chip is improved, the heat radiating piece is exposed on one side, which is far away from the chip, of the packaging piece, the heat radiating piece is partially exposed outside the packaging piece, a temperature difference exists between one side, which is close to the chip, of the heat radiating piece and one side, which is far away from the chip, the heat conducting capacity of the heat radiating piece is further improved, the heat radiating piece is cooled, and meanwhile, the heat radiating piece is divided into the packaging piece is favorable for reducing stress generated to the chip in the shrinking process, and the chip is prevented from shifting.

In a third aspect, the present utility model further provides an electronic device, including the camera module set in the second aspect.

The electronic equipment comprises a chip packaging component, wherein a chip, a heat radiating piece and a packaging piece are arranged on a circuit board, the packaging piece is used for packaging the chip and the heat radiating piece, the heat radiating piece is located on at least one side of the chip, at least one part of the heat radiating piece is exposed relative to one side of the packaging piece, which is far away from the chip, so that the heat radiating piece is adjacent to the chip, the heat radiating piece is conductive to heat at the chip, the heat radiating capacity of the packaging piece and the heat radiating piece to heat at the chip is improved, the heat radiating piece is exposed on one side, which is far away from the chip, of the packaging piece, the heat radiating piece is partially exposed outside the packaging piece, a temperature difference exists between one side, which is close to the chip, of the heat radiating piece and one side, which is far away from the chip, of the heat radiating piece is further improved, the heat radiating of the chip is realized, and meanwhile, the heat radiating piece is divided into the packaging piece, the stress generated to the chip in the process of shrinkage of the packaging piece is facilitated, and the chip is prevented from shifting.

Drawings

In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained from these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of a chip package assembly of an embodiment;

FIG. 2 is a schematic diagram of a circuit board, a chip, and a heat sink according to one embodiment;

FIG. 3 is a cross-sectional view of the chip package assembly of FIG. 1 taken along the A-A plane of the first embodiment;

FIG. 4 is a cross-sectional view of the chip package assembly of FIG. 1 taken along the A-A plane in accordance with a second embodiment;

FIG. 5 is a cross-sectional view of the chip package assembly of FIG. 1 taken along the A-A plane in accordance with a third embodiment;

FIG. 6 is a cross-sectional view of the chip package assembly of FIG. 1 taken along the A-A plane in accordance with a fourth embodiment;

FIG. 7 is a cross-sectional view of the chip package assembly of FIG. 1 taken along the A-A plane in a fifth embodiment;

fig. 8 is a cross-sectional view of the chip package assembly of fig. 1 along the A-A plane in a sixth embodiment.

Reference numerals illustrate:

10-heat dissipation parts, 20-circuit boards, 30-chips, 40-packaging parts and 50-optical filters;

11-heat dissipation rings and 12-heat dissipation plates;

21-bonding wires, 22-components and 23-glass sheet bonding glue;

31-photosensitive area, 32-non-photosensitive area, 41-outer side;

111-first extension, 112-second extension, 113-connection, 114-bend.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, are intended to fall within the scope of the present utility model.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When a component is considered to be "connected" to another component, it can be directly connected to the other component or intervening components may also be present.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

Some embodiments of the present utility model are described in detail below with reference to the accompanying drawings. The following embodiments and features of the embodiments may be combined with each other without conflict.

Referring to fig. 1, 2 and 3, the chip package assembly includes a circuit board 20, a chip 30, a heat sink 10 and a package 40, wherein the chip 30, the heat sink 10 and the package 40 are all disposed on the circuit board 20, and the chip 30, the heat sink 10 and the package 40 are located on the same side of the circuit board 20, and the package 40 encapsulates the chip 30 and the heat sink 10 for protecting the chip 30 and the heat sink 10, and simultaneously, the positions of the chip 30 and the heat sink 10 relative to the circuit board 20 are more stable.

The circuit board 20 may be an organic substrate, a ceramic substrate, a silicon substrate, or a metal carrier, and the circuit board 20 may be a single-layer or multi-layer wiring substrate.

The chip 30 is located in the central area of the circuit board 20, the chip 30 is electrically connected with the circuit board 20 through at least one bonding wire 21, the bonding wire 21 can be gold wire or copper wire, the packaging member 40 packages the bonding wire 21, one side of the chip 30 away from the circuit board 20 comprises a photosensitive area 31 and a non-photosensitive area 32, the photosensitive area 31 is located in the central area of the chip 30, the non-photosensitive area 32 is arranged around the photosensitive area 31, and the packaging member 40 packages the non-photosensitive area 32 of the chip 30.

Optionally, the chip package assembly further includes an optical filter 50, where the optical filter 50 may be an infrared cut filter glass sheet, and the optical filter 50 is located on a side of the chip 30 away from the circuit board 20 and corresponds to the photosensitive area 31 of the chip 30, and the non-photosensitive area 32 of the chip 30 is coated with a glass sheet adhesive glue 23, so that the optical filter 50 is connected and fixed with the chip 30 through the glass sheet adhesive glue 23, and the package 40 encapsulates an area of the optical filter 50 corresponding to the non-photosensitive area 32 of the chip 30.

The encapsulation 40 may include phenolic-based resin, epoxy-based resin, silicon-based resin, or other suitable encapsulant, and the encapsulation 40 may also include a suitable filler, such as powdered silicon dioxide, and may be formed by compression molding, injection molding, or transfer molding, among other encapsulation techniques.

The heat dissipation element 10 can be a metal sheet with stronger heat conduction performance such as copper sheet, aluminum sheet and the like, the heat dissipation element 10 is positioned on at least one side around the chip 30 and is used for conducting heat of the chip 30 and the circuit board 20, when the chip 30 works to generate heat, the heat is conducted to one side, close to the chip 30, of the package element 40 by the chip 30 and the circuit board 20 contacted with the chip 30, the heat at the package element 40 is conducted to the heat dissipation element 10, and the heat dissipation element 10 and the package element 40 jointly conduct out the heat.

After the package 40 encapsulates the heat dissipation element 10, at least part of the heat dissipation element 10 is exposed relative to the package 40, and one side of the heat dissipation element 10 away from the chip 30 is exposed, the package 40 comprises an outer side surface 41 connected with the circuit board 20, the outer side surface 41 is located at one side of the package 40 away from the chip 30, the package 40 further comprises a top surface opposite to the circuit board 20, the heat dissipation element 10 can be exposed relative to the outer side surface 41 or can be exposed relative to the top surface, the exposed part of the heat dissipation element 10 can be directly exposed to air or can be connected with an external heat sink, a temperature difference is formed between the exposed part of the heat dissipation element 10 and the part of the heat dissipation element 10 buried in the package 40, and therefore the heat conduction efficiency of the heat dissipation element 10 to the heat dissipation of the chip 30 is improved.

Meanwhile, when the package 40 is packaged under a high temperature condition, the package 40 needs to be cooled to normal temperature for shaping, shrinkage of the package 40 can occur in the process of cooling, shrinkage stress is generated, the shrinkage stress can act on the chip 30, the heat sink 10 and the circuit board 20 which are connected with the package 40, and the package 40 packages the heat sink 10, so that the heat sink 10 partitions the package 40, the integrity of the package 40 is reduced, the shrinkage stress of the package 40 is favorably dispersed, the shrinkage stress acting on the chip 30 is further reduced, the chip 30 is prevented from being deviated after being subjected to the shrinkage stress, and the stability of fixing the chip 30 on the circuit board 20 is improved.

The heat spreader 10 should extend for a certain length to realize the integral separation of the package 40, and the heat spreader 10 may be continuous or intermittent during the extending process, and optionally, the extending length of the heat spreader 10 is greater than or equal to the length of the chip 30, so as to disperse the shrinkage stress of the package 40 acting on the chip 30.

Optionally, a side of the chip 30 facing the circuit board 20 is coated with a chip bonding glue, the chip 30 is directly connected and fixed with the circuit board 20 by the chip bonding glue, the package 40 is disposed around the chip 30, and the package 40 at least partially covers the non-photosensitive area 32 of the chip 30.

Through making chip 30, radiator 10 and package 40 all set up on circuit board 20, adopt package 40 encapsulation chip 30 and radiator 10, radiator 10 is located at least one side around the chip 30, make radiator 10's position and chip 30 be adjacent, be favorable to radiator 10 to conducting the heat of chip 30 department, promote the radiating capacity of package 40 and radiator 10 to chip 30 department heat, radiator 10 exposes in the side that package 40 kept away from chip 30, make radiator 10 part expose in the outside of package 40, there is the temperature difference between the side that radiator 10 is close to chip 30 and the side that keeps away from chip 30, be favorable to further promoting radiator 10's heat conduction ability, realize the heat dissipation to chip 30 department, simultaneously, the radiator cuts apart the package, be favorable to reducing the in-process of package shrink to the stress that the chip produced, avoid the chip to take place the skew.

In one embodiment, referring to fig. 2 and 6, the heat dissipation element 10 includes a heat dissipation ring 11, the heat dissipation ring 11 is disposed around the chip 30, and the heat dissipation ring 11 is at least partially in contact with the chip 30, or the heat dissipation ring 11 is spaced apart from the chip 30. The package 40 is disposed around the chip 30, and the package 40 around the chip 30 is divided by the heat dissipation ring 11, which is beneficial to improving the uniformity of the division of the package 40, so that the integrity of the package 40 around the chip 30 is uniformly reduced, and the shrinkage stress of the package 40 is uniformly dispersed, thereby uniformly reducing the shrinkage stress acting on the chip 30.

Optionally, a plurality of bonding wires 21 are arranged on two opposite sides of the chip 30, and the heat dissipation ring 11 is in contact with the area of the chip 30, where the bonding wires 21 are not arranged, so that the heat dissipation ring 11 is directly in contact with the chip 30, the distance from the heat at the chip 30 to the heat dissipation ring 11 is shortened, the heat conduction efficiency at the chip 30 is enhanced, and the heat dissipation of the chip 30 is facilitated.

Optionally, the heat dissipation ring 11 is connected with the circuit board 20, and the heat dissipation ring 11 is fixed with the circuit board 20 through glue, so that the stability of the position of the heat dissipation part 10 on the circuit board 20 is improved, and the heat dissipation part 10 is prevented from being deviated due to shrinkage stress generated in the cooling process of the packaging part 40, so that the whole packaging process of the chip packaging assembly is influenced; or the heat dissipation ring 11 has a spacing distance with the circuit board 20, which is favorable for the heat dissipation ring 11 to avoid other structures on the circuit board 20, and simultaneously, the heat dissipation ring 11 has a spacing distance with the circuit board 20 and one side of the packaging piece 40 away from the circuit board 20, which is favorable for the heat dissipation ring 11 to divide the packaging piece 40 more uniformly, so that the integrity of the packaging piece 40 is reduced uniformly, the shrinkage stress of the packaging piece 40 is dispersed uniformly, and the shrinkage stress acting on the chip 30 is further reduced uniformly.

Alternatively, the heat dissipation ring 11 and the chip 30 have the same shape, e.g., the heat dissipation ring 11 and the chip 30 are rectangular, or the heat dissipation ring 11 and the chip 30 have different shapes.

Through making radiator 10 include radiator ring 11, radiator ring 11 encircles the chip 30 setting, radiator ring 11 at least partly and chip 30 contact, perhaps radiator ring 11 and chip 30 have the interval distance, the encapsulation piece 40 around chip 30 all is cut apart by radiator ring 11, be favorable to promoting encapsulation piece 40 by the homogeneity of cutting apart for encapsulation piece 40 around the chip 30's wholeness evenly reduces, be favorable to evenly dispersing encapsulation piece 40's shrinkage stress, and then evenly reduce the shrinkage stress that acts on chip 30, avoid chip 30 to receive the shrinkage stress after take place the skew, promoted the stability of chip 30 fixed on circuit board 20.

In one embodiment, referring to fig. 2, 6, 7 and 8, the heat dissipation ring 11 includes a first extension portion 111, the first extension portion 111 is located at a side of the heat dissipation ring 11 away from the chip 30, the first extension portion 111 is closely attached to the circuit board 20, the package 40 includes an outer side surface 41 connected to the circuit board 20, the outer side surface 41 is located at a side of the package 40 away from the chip 30, and the first extension portion 111 extends from the outer side surface 41, and heat generated at the chip 30 is firstly conducted to an area of the heat dissipation ring 11 buried by the package 40, and then conducted to the first extension portion 111 outside the package 40, and heat dissipation is achieved at the first extension portion 111.

Optionally, the exposed length of the first extension portion 111 opposite to the side of the package 40 away from the chip 30 does not exceed the edge of the circuit board 20, so as to ensure that the whole first extension portion 111 is located on the circuit board 20, and the first extension portion 111 has a certain area, which is beneficial to ensuring that the first extension portion 111 has a certain heat dissipation area, thereby improving the heat dissipation capability of the heat dissipation ring 11.

Alternatively, the first extension 111 may be directly exposed to air such that heat reaching the first extension 111 is dissipated in the air; the first extension 111 may also be connected to an external heat sink such that heat at the first extension 111 is conducted to the heat sink for dissipation.

By making the heat dissipation ring 11 include the first extension portion 111, the first extension portion 111 is closely attached to the circuit board 20, the package 40 includes the outer side surface 41 connected to the circuit board 20, the outer side surface 41 is located at a side of the package 40 away from the chip 30, the first extension portion 111 extends out from the outer side surface 41, that is, a portion of the heat dissipation ring 11 where the first extension portion 111 is exposed at the outer side of the package 40, so that a temperature difference is formed between the first extension portion 111 and a portion of the heat dissipation ring 11 buried in the package 40, which is favorable for improving the heat conduction efficiency of the heat dissipation ring 11, so that heat is conducted from a portion of the heat dissipation ring 11 close to the chip 30 to the first extension portion 111, thereby improving the heat dissipation capacity of the heat dissipation member 10 to the heat at the chip 30, and realizing heat dissipation to the chip 30.

In one embodiment, referring to fig. 4, 5, 7 and 8, the heat dissipation ring 11 further includes a second extension portion 112, the second extension portion 112 is connected to one end of the first extension portion 111 away from the chip 30, the second extension portion 112 is located outside the package 40, the heat generated at the chip 30 is firstly conducted to the area of the heat dissipation ring 11 buried by the package 40, and then conducted to the first extension portion 111 outside the package 40, the heat at the first extension portion 111 is conducted to the second extension portion 112, and the heat is dissipated at the first extension portion 111 and the second extension portion 112.

Optionally, the second extension 112 and the first extension 111 have the same length.

Optionally, the second extension portion 112 is disposed at an angle with respect to the first extension portion 111, and the second extension portion 112 extends toward a side far away from the circuit board 20, i.e. the second extension portion 112 is integrally located on a side of the circuit board 20 where the chip 30 is disposed; or the first extension part 111 extends to the edge of the circuit board 20, the second extension part 112 is closely attached to the side surface of the circuit board 20, and the second extension part 112 extends towards the opposite side of the circuit board 20 to the chip 30, i.e. the whole second extension part 112 is located around the circuit board 20. The extension length of the second extension portion 112 can be set according to practical requirements.

Optionally, the second extension 112 is disposed perpendicular to the circuit board 20.

Optionally, the heat dissipation ring 11 includes a plurality of extension portions, the extension portions are connected in sequence, the heat generated at the chip 30 is conducted in sequence at the extension portions, the extension portions jointly realize heat dissipation, and the extension directions and the extension lengths of the extension portions can be set according to actual requirements.

Through making radiating ring 11 still include second extension 112, second extension 112 and first extension 111 keep away from the one end of chip 30 and are connected, second extension 112 is located the outside of encapsulation 40, second extension 112 is the contained angle setting with first extension 111, second extension 112 extends to the one side of keeping away from circuit board 20, or first extension 111 extends to the border of circuit board 20, second extension 112 is hugged closely with the side of circuit board 20, be favorable to increasing radiating ring 11 and expose the area in the outside of encapsulation 40, the radiating area of radiating ring 11 has been increased, make first extension 111 and second extension 112 and the part that radiating ring 11 buries in encapsulation 40 form the temperature difference, be favorable to promoting radiating ring 11's heat conduction efficiency, make the heat be close to the part conduction of chip 30 to first extension 111 by radiating ring 11, and then promote the radiating member 10 to the radiating capacity of chip 30 department heat, realize radiating to the chip 30 department.

In one embodiment, referring to fig. 3, 4 and 5, the circuit board 20 is provided with a component 22 on a side of the chip 30 and a side of the circuit board away from the chip 30, the component 22 includes, but is not limited to, a resistor, a capacitor, a driving IC, and the like, the component 22 is located around the chip 30 and has a distance from the chip 30, and optionally, the component 22 is disposed on a side of the bonding wire 21 connected to the chip 30 away from the chip 30.

The heat dissipation ring 11 further includes a connection portion 113, the connection portion 113 is buried in the package 40, one end of the connection portion 113 is connected with one end of the first extension portion 111 close to the chip 30, one end of the connection portion 113 away from the first extension portion 111 is in contact with the chip 30, or one end of the connection portion 113 away from the first extension portion 111 has a spacing distance from the chip 30, heat generated at the chip 30 is firstly conducted to the connection portion 113, then is conducted to the first extension portion 111 outside the package 40 by the connection portion 113, and heat dissipation is achieved at the first extension portion 111. The connection portion 113 is buried inside the package 40, and the connection portion 113 is provided with a through hole for passing through the component 22 on the circuit board 20, so that the structure of the heat dissipation ring 11 is avoided from the component 22 on the circuit board 20.

Optionally, the connecting portion 113 is attached to the circuit board 20, and the connecting portion 113 is connected and fixed to the circuit board 20 through glue; or the connection portion 113 is spaced apart from the circuit board 20.

Optionally, the lengths of the connection portion 113, the first extension portion 111, and the second extension portion 112 are the same.

Through making radiating ring 11 still include connecting portion 113, connecting portion 113 buries the inside at encapsulation piece 40, connecting portion 113's one end is connected near the one end of chip 30 with first extension 111, the through-hole has been seted up to connecting portion 113, the through-hole is used for passing components and parts 22 on circuit board 20, be favorable to the structure of connecting portion 113 and components and parts 22 on circuit board 20 to avoid, guarantee the stability that the chip package assembly structure set up, simultaneously, connecting portion 113 buries the inside at encapsulation piece 40 for connecting portion 113 cuts apart encapsulation piece 40, reduced encapsulation piece 40's wholeness, be favorable to dispersing encapsulation piece 40's shrinkage stress, and then reduce the shrinkage stress that acts on chip 30, avoid chip 30 to receive the shrinkage stress back and take place the skew, promoted the stability that chip 30 was fixed on circuit board 20.

In an embodiment, referring to fig. 6, 7 and 8, the heat dissipation ring 11 further includes a bending portion 114, the bending portion 114 is buried in the package 40, one end of the bending portion 114 is connected to one end of the first extension portion 111 near the chip 30, one end of the bending portion 114 far from the first extension portion 111 is contacted with the chip 30, or one end of the bending portion 114 far from the first extension portion 111 has a distance from the chip 30, heat generated at the chip 30 is firstly conducted to the bending portion 114, then is conducted from the bending portion 114 to the first extension portion 111 outside the package 40, and heat dissipation is achieved at the first extension portion 111.

A groove is formed between two ends of the bending part 114, an opening of the groove faces the circuit board 20, a bottom wall of the groove has a spacing distance with the circuit board 20, and the component 22 on the circuit board 20 is accommodated in the groove, namely, the component 22 is accommodated between the bending part 114 and the circuit board 20, so that the bending part 114 is avoided from the component 22 on the circuit board 20.

Through making the heat dissipation ring 11 still include the bending part 114, the bending part 114 buries the inside at the encapsulation piece 40, the one end of bending part 114 is connected with the one end that first extension 111 is close to chip 30, the bending part 114 forms the recess, the diapire of recess has the interval distance with circuit board 20, so that the components 22 that protrude outside the surface of circuit board 20 are held in the recess inside, be favorable to the structure of bending part 114 to avoid with components 22 on the circuit board 20, guarantee the stability that the chip package assembly structure set up, simultaneously, the bending part 114 buries the inside at encapsulation piece 40, make the bending part 114 cut apart encapsulation piece 40, the wholeness of encapsulation piece 40 has been reduced, be favorable to dispersing the shrinkage stress of encapsulation piece 40, and then reduce the shrinkage stress that acts on chip 30, avoid chip 30 to receive the shrinkage stress after take place the skew, the stability that chip 30 was fixed on circuit board 20 has been promoted.

In one embodiment, referring to fig. 2 and 6, the heat dissipation ring 11 is rectangular, the heat dissipation ring 11 encloses the chip 30, two opposite sides of the heat dissipation ring 11 are provided with bending portions 114, the bending portions 114 avoid the components 22 on the circuit board 20, and when the package 40 is used for packaging the bending portions 114, the package 40 can not completely fill the space between the bending portions 114 and the circuit board 20, which is beneficial to saving a part of the package 40 and also beneficial to dividing the package 40 by the heat dissipation member 10; the two sides of the heat dissipation ring 11, where the bending portion 114 is not disposed, are enclosed on two sides of the chip 30, which is beneficial to reducing shrinkage stress of the package body 40 on the chip 30.

Optionally, the heat dissipation ring 11 is polygonal, and the number and shape of the polygons can be set according to actual requirements.

Through making heat dissipation ring 11 rectangular, the both sides that heat dissipation ring 11 is relative are equipped with bending portion 114, are favorable to heat dissipation ring 11 to avoid setting up components and parts 22 on circuit board 20, and the arch structure that bending portion 114 formed is favorable to not only saving partly encapsulation body 40, still is favorable to heat dissipation piece 10 to cut apart encapsulation body 40, destroys encapsulation body 40's wholeness, and then reduces the shrink stress that acts on chip 30, has avoided chip 30 to take place the skew after receiving shrink stress, has promoted the stability that chip 30 was fixed on circuit board 20.

In an embodiment, referring to fig. 3, 4 and 5, the heat dissipation member 10 further includes a heat dissipation plate 12, the heat dissipation plate 12 is disposed on the circuit board 20, the chip 30 is connected to a side of the heat dissipation plate 12 away from the circuit board 20, the heat dissipation plate 12 is connected to the heat dissipation ring 11, or the heat dissipation plate 12 has a distance from the heat dissipation ring 11, the heat generated at the chip 30 is firstly conducted to the heat dissipation plate 12, then is conducted from the heat dissipation plate 12 to the heat dissipation ring 11, and heat dissipation is achieved at the heat dissipation ring 11.

Optionally, the heat dissipation plate 12 is fixedly connected to the circuit board 20, a chip 30 adhesive glue is coated on a side, away from the circuit board 20, of the heat dissipation plate 12, and the chip 30 is fixedly connected to the heat dissipation plate 12 through the chip 30 adhesive glue.

Optionally, the size of the heat dissipation plate 12 is equal to the size of the chip 30, or the size of the heat dissipation plate 12 is slightly larger than the size of the chip 30, so that the heat dissipation plate 12 has a good heat conduction effect on the chip 30 and the circuit board 20 at the chip 30, and the heat dissipation plate 12 should avoid the arrangement area of the bonding wires 21, so that the heat dissipation plate 12 is prevented from blocking the connection of the bonding wires 21 and the circuit board 20.

Through making radiating member 10 still include heating panel 12, heating panel 12 sets up on circuit board 20, and chip 30 is connected with the one side that circuit board 20 was kept away from to heating panel 12, and heating panel 12 is connected with heat dissipation ring 11, or heating panel 12 and heat dissipation ring 11 have the interval distance, are favorable to heating panel 12 to conducting the heat of chip 30 and the circuit board 20 department near chip 30, avoid the area heat of chip 30 and circuit board 20 contact too high, influence the normal use of chip 30.

In an embodiment, referring to fig. 3 and 6, the height of the heat sink 10 relative to the circuit board 20 is smaller than the height of the package 40 relative to the circuit board 20, i.e. the side of the heat sink 10 opposite to the circuit board 20 does not protrude from the package 40.

The height of the heat dissipation part 10 relative to the circuit board 20 is smaller than that of the packaging part 40 relative to the circuit board 20, so that most of the whole heat dissipation part 10 is packaged by the packaging part 40, the packaging part 40 protects the heat dissipation part 10, meanwhile, the heat dissipation part 10 is also beneficial to uniformly dividing the packaging part 40, the integrity of the packaging part 40 is reduced, the shrinkage stress of the packaging part 40 is favorably dispersed, the shrinkage stress acting on the chip 30 is further reduced, the chip 30 is prevented from being offset after being subjected to the shrinkage stress, and the stability of fixing the chip 30 on the circuit board 20 is improved.

The utility model also provides a camera module, referring to fig. 1 and 2, comprising the chip packaging assembly according to any of the embodiments.

It can be understood that the camera module in this embodiment has the chip package assembly in the above embodiment, so the camera module in this embodiment has all the technical effects of the chip package assembly in the above embodiment, and since the technical effects of the chip package assembly have been fully described in the above embodiment, the description thereof will not be repeated here.

The utility model also provides an electronic device, referring to fig. 1 and 2, comprising the camera module.

It can be understood that the electronic device in this embodiment has the camera module in the foregoing embodiment, so the electronic device in this embodiment has all the technical effects of the camera module in the foregoing embodiment, and since the technical effects of the camera module in the foregoing embodiment have been fully described, the description is omitted herein.

In the description of the embodiments of the present utility model, it should be noted that, the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," "outer," and the like refer to the orientation or positional relationship based on the drawings, which are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

The above disclosure is only a preferred embodiment of the present utility model, and it should be understood that the scope of the utility model is not limited thereto, but all or part of the procedures for implementing the above embodiments can be modified by one skilled in the art according to the scope of the appended claims.

Claims (11)

1. A chip package assembly, comprising:

a circuit board;

the chip is arranged on the circuit board;

the heat dissipation piece is arranged on the circuit board and used for conducting heat of the chip and the circuit board;

the packaging piece is used for packaging the chip and the heat dissipation piece, at least one part of the heat dissipation piece is exposed relative to one side, far away from the chip, of the packaging piece, and the heat dissipation piece is used for dividing the packaging piece.

2. The chip package assembly of claim 1, wherein the heat spreader comprises a heat spreader ring disposed around the chip, the heat spreader ring being at least partially in contact with the chip or the heat spreader ring being spaced apart from the chip.

3. The chip package assembly of claim 2, wherein the heat dissipation ring includes a first extension portion, the first extension portion being located on a side of the heat dissipation ring away from the chip, the first extension portion being in close contact with the circuit board, the package including an outer side connected to the circuit board, the outer side being located on a side of the package away from the chip, the first extension portion extending from the outer side.

4. The chip package assembly of claim 3, wherein the heat dissipation ring further comprises a second extension portion, the second extension portion is connected with one end of the first extension portion away from the chip, the second extension portion is located outside the package, the second extension portion and the first extension portion are disposed at an included angle, and the second extension portion extends towards a side away from the circuit board, or the first extension portion extends to an edge of the circuit board and is in close contact with a side surface of the circuit board.

5. The chip package assembly according to claim 3 or 4, wherein the heat dissipation ring further comprises a connection portion buried inside the package, one end of the connection portion is connected to one end of the first extension portion, which is close to the chip, and the connection portion is provided with a through hole for passing through a component on the circuit board.

6. The chip package assembly of claim 3 or 4, wherein the heat dissipation ring further comprises a bending portion, the bending portion is buried inside the package, one end of the bending portion is connected with one end of the first extending portion, which is close to the chip, and the bending portion forms a groove for accommodating components on the circuit board.

7. The chip package assembly of claim 6, wherein the heat dissipation ring is rectangular, and the curved portions are provided on opposite sides of the heat dissipation ring.

8. The chip package assembly of claim 2, wherein the heat sink further comprises a heat sink disposed on the circuit board, the chip being connected to a side of the heat sink remote from the circuit board, the heat sink being connected to the heat sink ring, or the heat sink being spaced apart from the heat sink ring.

9. The chip package assembly of claim 1, wherein a height of the heat spreader relative to the circuit board is less than a height of the package relative to the circuit board.

10. A camera module comprising the chip package assembly of any one of claims 1 to 9.

11. An electronic device comprising the camera module of claim 10.