KR102444815B1 - Image sensor assembly - Google Patents

Abstract

An image sensor assembly capable of preventing bending of an image sensor unit and efficiently dissipating heat generated when the image sensor unit is operated to the outside is provided.
An image sensor assembly according to an embodiment of the present invention includes a first cover part having an opening formed thereon, an image sensor part disposed inside the first cover part, and a lower part of the first cover part, It characterized in that it comprises a reinforcing part fixed to the image sensor part to support the image sensor part, and a second cover part disposed under the reinforcement part and coupled to the first cover part.

Description

Image sensor assembly {IMAGE SENSOR ASSEMBLY}

The present invention relates to an image sensor assembly, and more particularly, to an image sensor assembly capable of preventing bending of an image sensor unit.

The image sensor module used in the camera module can be divided into two types. Specifically, a type in which the image sensor is mounted on the upper part of the board through a chip on board (COB), that is, wire bonding. and flip-chip type.

In the case of the image sensor package (image sensor unit) included in the above-described image sensor module, warpage may occur due to a difference in coefficient of thermal expansion of each component included in the image sensor package.

In the case of a conventional image sensor module, only heat dissipation and fixation of the image sensor package are possible without a structure for compensating for warpage of the image sensor package, and the image sensor package can be fastened forward or fixed only in position, and the image sensor package It is not configured to apply a force to

As such, if the image sensor package is warped, a problem may occur in image capturing because the central portion and the outer portion are out of focus in an optical system with a low depth of field.

Registered Patent Publication No. 10-1387295

An object of the present invention is to provide an image sensor assembly capable of preventing bending of an image sensor unit and efficiently dissipating heat generated when the image sensor unit is operated to the outside.

An image sensor assembly according to an embodiment of the present invention includes a first cover portion having an opening formed on one surface thereof, an image sensor portion disposed inside the first cover portion, and the first cover portion opposite to one surface of the first cover portion. 1 is disposed on the other surface of the cover part, one surface is fixed to the image sensor part to support the image sensor part, and the reinforcement part is disposed on the other surface of the reinforcement part opposite to one surface of the reinforcement part, and is combined with the first cover part It is characterized in that it comprises a second cover part.

Preferably, the image sensor unit includes an image sensor, a first substrate part electrically connected to the image sensor, a base part disposed on one surface of the first substrate part and fixing the reinforcement part, and the first substrate A glass support portion disposed on the other surface of the first substrate portion opposite to one surface of the portion, and a glass portion disposed on the glass support portion and transmitting light introduced through the opening to the image sensor, wherein the glass portion It is characterized in that it is disposed vertically spaced apart from the image sensor.

Preferably, the reinforcing part includes a body part fixed to one surface of the base part and disposed on one surface of the second cover part, and a groove part formed in the body part and into which a part of the first substrate part is inserted, the body One surface of the part is characterized in that it is fixed to the base part through a first coupling member.

Preferably, the first substrate part is disposed on one surface of the first substrate part to be spaced apart from the base part, and comprises a first terminal part inserted into the groove part.

Preferably, the second substrate portion disposed inside the second cover portion, the second substrate portion fixed to the other surface of the body portion opposite to one surface of the body portion through a support member, and disposed inside the second cover portion, the support It is fixed to the second substrate portion through a second coupling member coupled to the lower portion of the member, characterized in that it further comprises a third substrate portion electrically connected to the second substrate portion.

Preferably, the second board part includes a second terminal part inserted into the groove part in the direction of the other surface of the body part, and the second terminal part is in contact with the first terminal part in an up and down direction and is electrically connected. .

Preferably, the body portion further comprises a first coupling member insertion hole into which the first coupling member is inserted and a support member insertion hole into which the support member is inserted.

Preferably, the third substrate part comprises a second coupling member insertion hole into which the second coupling member is inserted.

Preferably, the second cover portion is inserted in the direction of the other surface of the second cover portion opposite to one surface of the second cover portion and is coupled to the first cover portion by a third coupling member penetrating the body portion. do it with

Preferably, it characterized in that it further comprises an opening closing portion disposed between the inner surface of the first cover portion and the edge portion of the glass portion.

According to the present invention, since the reinforcing unit is coupled to the image sensor unit through a coupling member, the reinforcing unit supports the image sensor unit and reinforces the structural rigidity of the image sensor unit, so that warpage caused by the difference in thermal expansion coefficient of each configuration of the image sensor unit can prevent Accordingly, the quality of the image sensed by the image sensor may be improved by minimizing the focus difference between the central portion and the outer portion of the image generated due to the bending of the image sensor portion.

In addition, the heat generated during operation of the image sensor can be efficiently radiated to the outside by fixing a reinforcing unit having excellent thermal conductivity to the lower portion of the image sensor unit and arranging the reinforcing unit between the first cover unit and the second cover unit. .

1 is a view showing an image sensor assembly according to an embodiment of the present invention.
2 is a view illustrating a cross-section of an image sensor assembly according to an embodiment of the present invention (section AA′ in FIG. 1 ).
3 is a view illustrating a cross-section of an image sensor assembly according to an embodiment of the present invention (cross-section BB′ of FIG. 1 ).
4 is an exploded perspective view of an image sensor assembly according to an embodiment of the present invention.
5 is a view illustrating an image sensor unit provided in an image sensor assembly according to an embodiment of the present invention.
6 is a diagram illustrating a heat transfer flow in an image sensor assembly according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. First of all, it should be noted that in adding reference numerals to the components of each drawing, the same components are given the same reference numerals as much as possible even though they are indicated on different drawings. In addition, in describing the present invention, if it is determined that a detailed description of a related known configuration or function may obscure the gist of the present invention, the detailed description thereof will be omitted. In addition, preferred embodiments of the present invention will be described below, but the technical spirit of the present invention is not limited thereto or may be variously implemented by those skilled in the art without being limited thereto.

1 is a view showing an image sensor assembly 100 according to an embodiment of the present invention, and FIG. 2 is a view showing a cross-section of the image sensor assembly 100 according to an embodiment of the present invention (A-A in FIG. 1 ) 'Cross-section), FIG. 3 is a view showing a cross-section of the image sensor assembly 100 according to an embodiment of the present invention (cross-section B-B' in FIG. 1), and FIG. 4 is an image sensor assembly according to an embodiment of the present invention. 100 is an exploded perspective view, and FIG. 5 is a view showing the image sensor unit 20 provided in the image sensor assembly 100 according to an embodiment of the present invention.

In this case, FIG. 1 (a) of FIG. 1 is a view obliquely looking at the image sensor assembly 100 from the upper side, and FIG. 1(b) is a view obliquely looking at the image sensor assembly 100 from the lower side. In addition, the illustration of the opening sealing part 70 and the connector part 80, which will be described later in FIG. 4, will be omitted, and the second board part 50 and the third board part 60 will be briefly shown.

1 to 5 , the image sensor assembly 100 according to an embodiment of the present invention includes a first cover part 10 , an image sensor part 20 , a reinforcement part 30 , and a second cover part. 40 , a second substrate unit 50 , a third substrate unit 60 , an opening sealing unit 70 , and a connector unit 80 . Preferably, the first cover part 10 and the second cover part 40 may be formed of a metal or ceramic material, and may be formed of a material having excellent thermal conductivity.

1 to 5 , an opening 12 may be formed on one surface of the first cover part 10 (the upper surface of the first cover part 10 ).

The image sensor unit 20 may be disposed inside the first cover unit 10 .

More specifically, the image sensor unit 20 includes an image sensor 21 , a first substrate unit 22 , a bonding unit 23 , a base unit 24 , a glass support unit 25 , and a glass unit ( 26).

In this case, the thermal expansion coefficients of the image sensor 21 , the first substrate part 22 , the bonding part 23 , the base part 24 , the glass support part 25 , and the glass part 26 may be different, respectively.

The image sensor 21 may sense an image by receiving light introduced into the first cover part 10 through the opening 12 and converting it into an electrical signal. Preferably, the image sensor 21 may be formed at a position corresponding to the opening 12 .

The first substrate part 22 may be electrically connected to the image sensor 21 . For example, the first substrate part 22 is formed to surround the image sensor 21 on a horizontal plane as shown in FIGS. 21) can be electrically connected to. However, the first substrate part 22 is not limited to the embodiment shown in FIGS. 2 to 5 and may be formed in a shape other than a hollow shape, and the image sensor 21 is the first substrate part 22 . It may be disposed on one surface (the lower surface of the first substrate part 22) or the other surface (the upper surface of the first substrate part 22).

As shown in FIGS. 2 to 5 , the base part 24 includes one surface of the image sensor 21 (a lower surface of the image sensor 21 ) and one surface of the first substrate part 22 (the first substrate part 22 ). ) on the lower surface), and the reinforcing part 30 can be fixed.

Preferably, the base portion 24 is formed by bonding such as epoxy. The material may be bonded to one surface of the image sensor 21 and one surface of the first substrate unit 22 . In addition, the base part 24 may be formed of a metal material having excellent thermal conductivity.

The glass support part 25 may be disposed on one surface of the first substrate part 22 and the other surface (the upper surface of the first substrate part 22 ) of the first substrate part 22 . Preferably, the glass support 25 is hollow and may have a rectangular cross-section on a horizontal plane, but is not limited thereto.

The glass part 26 is disposed on the glass support part 25 , and transmits the light introduced through the opening 12 to the image sensor 21 . In this case, the glass part 26 may be disposed to be vertically spaced apart from the image sensor 21 .

Preferably, the glass support 25 may be bonded to the other surface of the first substrate 22 through a bonding material such as epoxy. In addition, the glass part 26 may be bonded to the glass support part 25 through a bonding material such as epoxy.

The image sensor assembly 100 according to the embodiment of the present invention seals the image sensor 21 by the configuration of the first substrate part 22 , the base part 24 , the glass support part 25 , and the glass part 26 . Since it can be located in the space, it is possible to prevent foreign substances or moisture from flowing into the image sensor 21 .

In addition, the above-described opening sealing part 70 is disposed between the inner surface of the first cover part 10 and the edge of the glass part 26 , and the inner surface of the glass part 26 and the first cover part 10 . By sealing the gap therebetween, it is possible to prevent foreign substances or moisture from entering into the first cover part 10 .

The reinforcing part 30 is disposed on the other surface (the lower surface of the first cover part 10) of the first cover part 10 opposite to one surface of the first cover part 10, and one surface (reinforcing part 30) ) may be fixed to the image sensor unit 20 to support the image sensor unit 20 .

More specifically, the reinforcing part 30, including the body part 32 and the groove part 34, may be formed of a material having a high elastic modulus and strong resistance to external force and temperature. As an example, the reinforcing part 30 may be formed of a metal plate made of stainless steel, aluminum copper, or the like, and may be formed of a material having excellent thermal conductivity.

The body part 32 is fixed to one surface of the base part 24 (the lower surface of the base part 24) and disposed on one surface of the second cover part 40 (the upper surface of the second cover part 40). can be..

The groove portion 34 is formed in the body portion 32 , and a portion of the first substrate portion 22 may be inserted into the groove portion 34 . In this case, the first substrate part 22 includes a first terminal part 222 disposed on one surface of the first substrate part 22 to be spaced apart from the base part 24 and inserted into the groove part 34 . As shown in FIGS. 3 and 4 , the first terminal part 222 may be disposed spaced apart from the base part 24 on both sides of the base part 24 , but is not limited thereto and is disposed only on one side of the base part 24 . it might be

As shown in FIG. 4 , one surface of the body part 32 (the upper surface of the body part 32 ) may be fixed to the base part 24 through the first coupling member (a). Preferably, the first coupling member (a) may be a bolt, but is not limited thereto.

At this time, the body part 32 further includes a first coupling member insertion hole 322 into which the first coupling member (a) is inserted, and the first coupling member insertion hole 322 is the first coupling member insertion hole 322 on the body part 32 . 1 The coupling member (a) may be formed at a position corresponding to the portion to be inserted into the base portion (24).

According to the image sensor assembly 100 of the present invention, the body part 32 of the reinforcement part 30 is coupled to the base part 24 of the image sensor part 20 through the first coupling member (a), so that the reinforcement part 30 supports the image sensor unit 20 to reinforce the structural rigidity of the image sensor unit 20 to prevent warpage caused by the difference in coefficients of thermal expansion of each configuration of the image sensor unit 20 . can

As such, by the configuration of the reinforcing unit 30 , the quality of the image sensed by the image sensor 21 may be improved by minimizing the focus difference between the central portion and the outer portion of the image generated due to the bending of the image sensor unit 20 .

2 to 4 , the second substrate part 50 is disposed inside the second cover part 40 , and the other surface (body) of the body part 32 is opposite to one surface of the body part 32 . It may be fixed to the lower surface of the portion 32) through a support member (S). Preferably, the support member S may support the second substrate part 50 fixed to the body part 32 .

At this time, the body part 32 further includes a support member insertion hole 324 into which the support member S is inserted, and the support member insertion hole 324 is a support member S on the body part 32 . It may be formed at a position corresponding to a portion inserted into the second substrate unit 50 .

In addition, the second board part 50 includes a second terminal part 52 inserted into the groove part 34 in the direction of the other surface of the body part 32 , and the second terminal part 52 includes the first terminal part 222 . and may be vertically contacted to be electrically connected. Accordingly, an electrical connection may be made between the first substrate part 22 and the second substrate part 50 .

The third substrate unit 60 is It is disposed inside the second cover unit 40 and may be fixed to the second substrate unit 50 through a second coupling member b coupled to a lower portion of the support member S. Preferably, the second coupling member (b) may be a bolt, but is not limited thereto. Also, the third substrate unit 60 may be integrally formed with the second substrate unit 50 .

The third substrate unit 60 may be electrically connected to the second substrate unit 50 . At this time, the electrical connection between the second substrate unit 50 and the third substrate unit 60 is made through direct contact between the second substrate unit 50 and the third substrate unit 60, or a separate connection means ( not shown) can be achieved.

At this time, the third substrate unit 60 includes a second coupling member insertion hole 62 into which the second coupling member (b) is inserted.

1 to 4 , the second cover part 40 is disposed on the other surface (the lower surface of the reinforcement part 30) of the reinforcement part 30 opposite to the one surface of the reinforcement part 30 described above. , may be combined with the first cover unit 10 .

In detail, the second cover part 40 is inserted in the direction of the other surface (lower surface of the second cover part 40) of the second cover part 40 opposite to one surface of the second cover part 40. It may be coupled to the first cover portion 10 by a third coupling member (c) penetrating the third coupling member through hole (H) of the body portion (32). Preferably, the third coupling member (c) may be a bolt, but is not limited thereto.

1 to 3 , the connector part 80 may pass through the other surface of the second cover part 40 to be coupled to the above-described third substrate part 60 . Alternatively, the connector part 80 may be integrally formed with the third board part 60 .

The connector part 80 may be electrically connected to an external control device (not shown), and the first board part 22 electrically connected to the image sensor 21 and the image sensed by the image sensor 21 described above; It may be transmitted through the second substrate unit 50 electrically connected to the first substrate unit 22 and the third substrate unit 60 electrically connected to the second substrate unit 50 and transmitted to the external control device.

6 is a diagram illustrating a heat transfer flow in the image sensor assembly 100 according to an embodiment of the present invention.

Referring to FIG. 6 , in the image sensor assembly 100 , heat may be transferred from the image sensor 21 to the base part 24 according to the operation of the image sensor 21 .

As such, the heat transferred from the image sensor 21 to the base part 24 may be transferred to the reinforcement part 30 .

At this time, a portion of the heat transferred from the base part 24 to the reinforcement part 30 may be discharged to the outside of the first cover part 10 as shown in FIG. 6 .

In addition, a portion of the heat transferred from the base part 24 to the reinforcement part 30 may be transferred to the second cover part 40 , and may be discharged to the outside of the second cover part 40 .

According to the image sensor assembly 100 of the present invention, the configuration of the reinforcing unit 30 having excellent thermal conductivity is fixed to the lower portion of the image sensor unit 20 , and the reinforcing unit 30 is connected to the first cover unit 10 and the second cover unit 10 . By disposing between the two cover parts 40 , heat generated when the image sensor 21 is operated can be efficiently discharged to the outside.

The above description is merely illustrative of the technical idea of the present invention, and various modifications, changes and substitutions are possible within the scope that does not depart from the essential characteristics of the present invention by those of ordinary skill in the art to which the present invention pertains. will be. Accordingly, the embodiments disclosed in the present invention and the accompanying drawings are for explaining, not limiting, the technical spirit of the present invention, and the scope of the technical spirit of the present invention is not limited by these embodiments and the accompanying drawings. . The protection scope of the present invention should be construed by the following claims, and all technical ideas within the equivalent range should be construed as being included in the scope of the present invention.

100: image sensor assembly
10: first cover part
20: image sensor unit
30: reinforcement part
40: second cover part
50: second substrate part
60: third substrate part
70: opening sealing part
80: connector part

Claims (10)

a first cover part having an opening formed on one surface;
an image sensor unit disposed inside the first cover unit;
a reinforcement part disposed on the other surface of the first cover part opposite to one surface of the first cover part and having one surface fixed to the image sensor part to support the image sensor part; and
and a second cover part disposed on the other surface of the reinforcement part opposite to one surface of the reinforcement part and coupled to the first cover part;
The image sensor unit includes an image sensor, a first substrate part electrically connected to the image sensor, and a base part disposed on one surface of the first substrate part and fixing the reinforcement part,
The reinforcing part may include a body part fixed to one surface of the base part and disposed on one surface of the second cover part, and a groove part formed in the body part and into which a part of the first substrate part is inserted. . The method of claim 1,
The image sensor unit,
a glass support portion disposed on the other surface of the first substrate portion opposite to one surface of the first substrate portion; and
It is disposed on the glass support, and transmits the light introduced through the opening, further comprising a glass portion for transmitting to the image sensor,
The image sensor assembly, characterized in that the glass portion is vertically spaced apart from the image sensor. The method of claim 1,
An image sensor assembly, characterized in that one surface of the body portion is fixed to the base portion through a first coupling member. 4. The method of claim 3,
The first substrate unit,
and a first terminal part disposed on one surface of the first substrate part to be spaced apart from the base part and inserted into the groove part. 5. The method of claim 4,
a second substrate portion disposed inside the second cover portion and fixed to the other surface of the body portion opposite to one surface of the body portion through a support member;
It is disposed inside the second cover portion, is fixed to the second substrate portion through a second coupling member coupled to the lower portion of the support member, further comprising a third substrate portion electrically connected to the second substrate portion Image sensor assembly, characterized in that. 6. The method of claim 5,
The second substrate part includes a second terminal part inserted into the groove part in the direction of the other surface of the body part,
The image sensor assembly of claim 1, wherein the second terminal part is electrically connected to the first terminal part by vertically contacting the first terminal part. 6. The method of claim 5,
The body part,
a first coupling member insertion hole into which the first coupling member is inserted; and
The image sensor assembly further comprising a support member insertion hole into which the support member is inserted. 6. The method of claim 5,
The third substrate unit,
and a second coupling member insertion hole into which the second coupling member is inserted. 4. The method of claim 3,
The second cover part,
The image sensor assembly according to claim 1, wherein the third coupling member is inserted in the direction of the other surface of the second cover portion opposite to one surface of the second cover portion and is coupled to the first cover portion by a third coupling member penetrating the body portion. 3. The method of claim 2,
The image sensor assembly according to claim 1, further comprising an opening closing part disposed between an inner surface of the first cover part and an edge part of the glass part.

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